TW202122607A - Vapor deposition mask intermediate, vapor deposition mask, and method for manufacturing vapor deposition mask - Google Patents

Abstract

A vapor deposition mask intermediate is provided with a belt-like part and a frame-like part surrounding the belt-like part. The belt-like part is provided with a mask part having a plurality of mask pores formed therein and a peripheral part surrounding the mask part. Each of the peripheral part and the frame-like part has a first thickness. The edge of the belt-like part includes a first edge and a second edge. The first edge includes a portion which faces the mask part in the direction of the width of the belt-like part. Between the first edge and the frame-like part, a separation part for separating the first edge from the frame-like part is positioned. Between the second edge and the frame-like part, a linear half-etching part having a second thickness that is thinner than the first thickness is positioned.

Description

Vapor deposition mask intermediate, vapor deposition mask, and manufacturing method of vapor deposition mask

The present invention relates to a vapor deposition mask intermediate, a vapor deposition mask, and a manufacturing method of the vapor deposition mask.

In the manufacture of a vapor deposition mask using a roll-to-roll method, various treatments such as etching are performed on the metal sheet while the metal sheet is conveyed from the unwinding roll to the winding roll. In the manufacturing process of the vapor deposition mask, the vapor deposition mask intermediate body is formed from the metal sheet. The vapor deposition mask intermediate system includes, for example, a belt-shaped part for forming the vapor deposition mask and a frame-shaped part surrounding the belt-shaped part. The edge of the belt-shaped portion includes a long side extending along the conveying direction of the metal sheet, and a short side extending along the width direction of the metal sheet. The long side is cut off, that is, separated from the frame-shaped portion, on the other hand, the short side is connected to the frame-shaped portion by a perforated wire. The strip-shaped portion is cut from the frame-shaped portion by cutting the perforated line, thereby forming a vapor deposition mask from the strip-shaped portion (for example, refer to Patent Document 1). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2015-55007 A

[The problem to be solved by the invention]

In the step of cutting the band-shaped portion from the frame-shaped portion, the vapor deposition mask intermediate body is tied to the boundary between the band-shaped portion and the frame-shaped portion, and an external force for cutting is applied. From the viewpoint of suppressing deformation of the band-shaped portion, it is preferable that the force applied to the boundary between the band-shaped portion and the frame-shaped portion be sufficiently small. On the other hand, if the external force required to cut the frame-shaped portion from the ribbon-shaped portion is too small, the external force acting on the ribbon-shaped portion during the transportation of the vapor deposition mask intermediate body will cause the ribbon-shaped portion to separate from the frame. The shape is cut off. Therefore, in the vapor deposition mask intermediate body, when the vapor deposition mask intermediate body is transported, it is desirable to ensure the connection between the strip portion and the frame portion and obtain the vapor deposition mask from the strip portion. It is easy to cut, that is, to cut away the band-shaped portion from the frame-shaped portion.

The object of the present invention is to provide a method that can ensure the connection between the belt-shaped part and the frame-shaped part during the transportation of the vapor deposition mask intermediate body, and can easily cut the belt-shaped part when the vapor deposition mask is manufactured. Broken vapor deposition mask intermediate, vapor deposition mask and manufacturing method of vapor deposition mask. [Means to solve the problem]

The vapor deposition mask intermediate body for solving the above-mentioned problems includes: a band-shaped part; and a frame-shaped part surrounding the band-shaped part. The belt-shaped portion includes: a mask portion in which a plurality of mask holes are formed; and a peripheral portion surrounding the mask portion. The peripheral portion and the frame-shaped portion have a first plate thickness. The edge of the band-shaped portion includes a first edge and a second edge, and the first edge includes a portion facing the mask portion in the width direction of the band-shaped portion; between the first edge and the frame-shaped portion There is a separating portion separating the first edge from the frame-shaped portion, and between the second edge and the frame-shaped portion, there is a linear half having a second plate thickness that is thinner than the first plate thickness. Etching department.

The vapor deposition mask for solving the above-mentioned problems includes: a mask portion formed with a plurality of mask holes; a peripheral portion surrounding the mask portion; and a band-shaped edge. The edge includes a first edge and a second edge, and the first edge includes a portion facing the mask portion in the width direction of the vapor deposition mask. The vapor deposition mask is further provided with cut marks existing on the second edge.

A method of manufacturing a vapor deposition mask to solve the above-mentioned problems includes: forming a band-shaped portion and a frame-shaped portion on a mask base material including a metal sheet; and cutting the band-shaped portion from the frame-shaped portion, and then The belt-shaped part forms a vapor deposition mask. The strip-shaped portion and the frame-shaped portion are formed in the following manner: the strip-shaped portion is provided with a frame-shaped portion surrounding the strip-shaped portion; the strip-shaped portion is provided with a mask portion in which a plurality of mask holes are formed; and The peripheral portion surrounding the mask portion; the peripheral portion and the frame-shaped portion have a first plate thickness, the edge of the band-shaped portion includes a first edge and a second edge, and the first edge is included in the band-shaped portion The portion facing the mask portion in the width direction; between the first edge and the frame-shaped portion, there is a separating portion that separates the first edge from the frame-shaped portion; and the second edge is connected to the frame-shaped portion. Between the portions, there is a linear half-etched portion having a second plate thickness thinner than the aforementioned first plate thickness.

According to the aforementioned vapor deposition mask intermediate, vapor deposition mask, and vapor deposition mask manufacturing method, compared with the case where the strip portion is connected to the frame portion through a perforation line, the gap between the strip portion and the frame portion The entire connection part can be made thinner. Therefore, it is possible to cut the connecting portion of the band-shaped portion and the frame-shaped portion with a smaller force than in the case of cutting between the penetrating portions of the perforated line. Therefore, when manufacturing the vapor deposition mask, it is easy to cut off the band-shaped portion from the frame-shaped portion. On the other hand, when the vapor deposition mask intermediate is transported, the connection between the strip-shaped portion and the frame-shaped portion is ensured by the linear half-etched portion that cuts the edge of the strip-shaped portion. The second edge is distinguished from the frame-shaped part.

In the vapor deposition mask intermediate body, the linear half-etched portion may have one or more through portions arranged along the direction in which the linear half-etched portion extends, and the through portion is in the vapor deposition mask intermediate body. The thickness direction of φ penetrates through the aforementioned vapor deposition mask intermediate body. According to this vapor deposition mask intermediate body, the linear half-etched portion has a penetrating portion so that the half-etched portion can be easily cut along the direction in which the linear half-etched portion extends.

In the above-mentioned vapor deposition mask intermediate body, the edge of the band-shaped portion may include a pair of short sides extending along the width direction of the band-shaped portion, and each short side has a depression toward the other short side. The notch; in the edge of the band-shaped portion, at least a part of the first edge and the portion other than the notch is the second edge; the half-etched line has a shape along the second edge, and the notch is by It is separated from the frame-shaped portion by the separation portion.

The vapor deposition mask formed by the belt-shaped portion by cutting the belt-shaped portion from the frame-shaped portion is attached to a frame supporting the vapor deposition mask when the vapor deposition mask is used. At this time, in order to suppress the occurrence of wrinkles in the vapor deposition mask, the vapor deposition mask is attached to the frame while pulling one of the short sides of the vapor deposition mask in a direction separating from the other short side. . When there are cut marks of the half-etched portion in the notch on the short side of the edge of the band-shaped portion, wrinkles formed by the cut marks may be generated in the vapor deposition mask. In this regard, according to the above-mentioned vapor deposition mask intermediate body, since the cut marks of the half-etched portion do not exist in the notches, when the vapor deposition mask is used, it is possible to suppress the generation of wrinkles in the vapor deposition mask.

In the vapor deposition mask intermediate body, the edge of the band-shaped portion may have a rectangle divided by the pair of short sides and a pair of long sides, and the second edge may include As for the corner formed by the long side, the linear half-etched portion includes an L-shaped portion along the corner.

According to the vapor deposition mask intermediate body described above, since the corners included in the edge of the band-shaped portion are connected to the frame-shaped portion by the half-etched portion, when the vapor deposition mask intermediate body is transported, the band-shaped portion can be suppressed The corners of the edge float more from the frame-shaped part than the other parts of the band-shaped part. Thereby, when the vapor deposition mask intermediate body is transported, it is possible to prevent the corners from catching on equipment or the like provided around the vapor deposition mask intermediate body, and it is possible to suppress the deformation of the belt-shaped portion.

In the above-mentioned vapor deposition mask intermediate body, the frame-shaped portion may be provided with a linear fragile portion extending from the separation portion toward the outer edge; the mechanical strength of the fragile portion is lower than that of the frame-shaped portion The mechanical strength of parts other than the aforementioned fragile part.

According to the aforementioned vapor deposition mask intermediate body, the mechanical strength of the fragile portion is lower than the mechanical strength of the portion other than the fragile portion in the frame-shaped portion, so the frame-shaped portion is easily cut along the fragile portion. Furthermore, since one end of the fragile portion is connected to the separation portion, the loop formed by the frame portion can be cut when the strip portion is removed from the frame portion. This makes it easier to cut the half-etched part. [Effects of Invention]

According to the present invention, when the vapor deposition mask intermediate body is transported, the connection between the strip-shaped portion and the frame-shaped portion is ensured, and the strip-shaped portion can be easily cut when the vapor deposition mask is manufactured.

[Form to implement the invention]

1 to 11, an embodiment of a method for manufacturing a vapor deposition mask intermediate body, a vapor deposition mask, and a vapor deposition mask will be described. Hereinafter, the manufacturing method of the vapor deposition mask intermediate body, the vapor deposition mask, and the vapor deposition mask will be described in order.

[Intermediate of Evaporation Mask] 1 to FIG. 7, the vapor deposition mask intermediate body will be described. Figure 1 shows a part of the planar structure of the vapor deposition mask intermediate. In FIG. 1, for the convenience of illustration, the cut line is shown by thick lines, and the half-etched line is shown by dots (dots).

As shown in FIG. 1, the vapor deposition mask intermediate body 10 includes a band-shaped part 11 and a frame-shaped part 12 surrounding the band-shaped part 11. The band portion 11 is provided with a mask portion 11a in which a plurality of mask holes 11H are formed, and a peripheral portion 11b surrounding the mask portion 11a. The peripheral portion 11b and the frame-shaped portion 12 have a first plate thickness. The edge 11E of the band 11 is composed of a first edge 11E1 and a second edge 11E2. The first edge 11E1 includes a portion located in the width direction DW of the band portion 11 with respect to the mask portion 11a. That is, the first edge 11E1 includes a portion facing the mask portion 11a in the width direction DW of the band-shaped portion 11. The first edge 11E1 and the frame-shaped portion 12 are separated by a cutting line 13. The cutting line 13 is an example of a separation part. The cutting line 13 penetrates the vapor deposition mask intermediate body 10 in the thickness direction of the vapor deposition mask intermediate body 10. The first edge 11E1 and the frame-shaped portion 12 are discontinuous with each other by interposing the cutting line 13. The second edge 11E2 and the frame-shaped portion 12 are distinguished by a linear half-etched portion (hereinafter, a half-etched line 14) having a second plate thickness thinner than the first plate thickness. The half-etched line 14 connects the second edge 11E2 of the band-shaped portion 11 to a part of the frame-shaped portion 12.

In addition, the half-etched line 14 includes a portion formed by a half-etching process, that is, a process by which the metal sheet used to form the vapor deposition mask intermediate 10 is etched from the surface of the metal sheet to halfway toward the back. The formed part. That is, the half-etched line 14 includes a portion having the second plate thickness, and is formed only by a portion having a thickness equal to or less than the second plate thickness. In addition, the half-etched line 14 is as described below, and may include one or more through portions located on the half-etched line 14 in the extending direction of the half-etched line 14. The penetration portion penetrates the vapor deposition mask intermediate body 10 in the thickness direction of the vapor deposition mask intermediate body 10.

On the other hand, the cutting line 13 has a linear cutting part. The cutting line 13 penetrates the vapor deposition mask intermediate body 10 in the thickness direction of the vapor deposition mask intermediate body 10. The above-mentioned half-etched line 14 includes a portion that connects the strip portion 11 and the frame portion 12 to each other. On the other hand, the cutting line 13 does not include a portion that connects the strip portion 11 and the frame portion 12 to each other.

Compared with the case where the belt-shaped portion 11 is connected to the frame-shaped portion 12 by a perforated wire, the thickness of the connection portion can be reduced in the entire connection portion of the belt-shaped portion 11 and the frame-shaped portion 12. Therefore, compared to the case where the through portions of the perforated line are cut, the connecting portion of the band-shaped portion 11 and the frame-shaped portion 12 can be cut with a smaller force. Therefore, during the manufacture of the vapor deposition mask, the strip-shaped portion 11 can be easily cut away from the frame-shaped portion 12. On the other hand, when the vapor deposition mask intermediate body 10 is transported, the connection of the frame-shaped portion 12 to the strip-shaped portion 11 can be achieved by removing the second edge 11E2 of the edge 11E of the strip-shaped portion 11 from the frame shape. Part 12 is divided by half-etched lines 14 to ensure. In addition, the perforation line has a structure in which portions having the first plate thickness and through holes are alternately arranged.

In addition, there is no half-etched line 14 between the first edge 11E1 of the edge 11E of the band-shaped portion 11 and the frame-shaped portion 12. Therefore, compared with the case where the half-etched line 14 connects the first edge 11E1 to the frame-shaped portion 12, the shortest distance between the half-etched line 14 and the mask portion 11a can be increased. Therefore, when the half-etched line 14 is cut, the external force applied to the half-etched line 14 is not easily spread to the mask portion 11a. Thereby, the deformation of the mask portion 11a due to the cutting of the half-etched line 14 can be suppressed, and the deformation of the mask hole 11H formed in the mask portion 11a can be suppressed.

The width of the cutting line 13 may be, for example, 1 mm or more and 2 mm or less, or about 1.5 mm. The vapor deposition mask is manufactured using a roll-to-roll method. Therefore, when the width of the cutting line 13 is 2 mm or less, when the vapor deposition mask intermediate body 10 is transported, it is possible to prevent the frame-shaped portion 12 from being separated from the belt-shaped portion 11 beyond the width of the cutting line 13. Moreover, since the width of the cut line 13 is 1 mm or more, when the cut line 13 is formed by wet etching, the etching liquid is easily supplied to the through portion formed in the resist mask. Thereby, the cutting line 13 penetrating the vapor deposition mask intermediate body 10 can be easily formed.

The direction orthogonal to the width direction DW of the band-shaped portion 11 is the longitudinal direction DL of the band-shaped portion 11. In the example shown in FIG. 1, the belt-shaped part 11 is equipped with three mask parts 11a. The three mask parts 11a are arranged at intervals along the longitudinal direction DL. The three mask parts 11a form one mask part group. In addition, the peripheral portion 11b has a ladder shape surrounding the three shield portions 11a. In the longitudinal direction DL, a part of the peripheral portion 11b is located between the two shield portions 11a. In addition, the belt-shaped portion 11 may include two or less mask portions 11a, or may include four or more mask portions 11a.

The edge 11E of the band portion 11 has a rectangle divided by a pair of short sides 11ES and a pair of long sides 11EL. The edge 11E of the band 11 includes a pair of short sides 11ES extending along the width direction DW of the band 11. Each short side 11ES has a notch 11EC recessed toward the other short side 11ES. At the edge 11E of the band-shaped portion 11, each long side 11EL extends along the longitudinal direction DL.

The metal sheet used to form the vapor deposition mask is etched to form the vapor deposition mask intermediate body 10 including the strip portion 11, the frame portion 12, the cut line 13, and the half-etched line 14. The metal piece is made of, for example, an iron-nickel alloy. The iron-nickel alloy forming the metal sheet may also be, for example, invar.

FIG. 2 shows a first example of the shape of the notch 11EC, and FIG. 3 shows a second example of the shape of the notch 11EC. In addition, in FIGS. 2 and 3, as in FIG. 1, the cut line 13 is shown by a thick line, and the half-etched line 14 is shown by a dot.

As shown in FIG. 2, in the first example of the notch 11EC, the notch 11EC is formed by a curved portion EC1 and a pair of straight portions EC2 extending from the curved portion EC1 in the longitudinal direction DL. The pair of straight portions EC2 are arranged at intervals in the width direction DW. A pair of straight portions EC2 are connected to each end of the bent portion EC1. The curved portion EC1 has an arc shape that is concave in the direction from the notch 11EC including the curved portion EC1 to the other notch 11EC.

The first edge 11E1 of the band 11 includes a notch 11EC. In this example, in the longitudinal direction DL, in each long side 11EL, the part from the part separated from each end of the mask part group to the end of the long side 11EL is included in the 2nd edge 11E2. Moreover, in each short side 11ES, the part except the notch 11EC is included in the 2nd edge 11E2. The half-etched line 14 has a shape along the second edge 11E2.

That is, in this example, the second edge 11E2 includes the corner ECN formed by the short side 11ES and the long side 11EL. The half-etched line 14 includes a portion having an L shape along the corner ECN. One half-etched line 14 is provided at a position corresponding to each corner ECN.

As shown in FIG. 3, the second example of the notch 11EC has a substantially parabolic shape. The second example of the notch 11EC is formed by a pair of curved portions EC3. The pair of curved portions EC3 has a bottom that passes through the notch 11EC, and has a shape symmetrical to each other with respect to a straight line extending in the longitudinal direction DL. Each curved portion EC3 extends in a direction intersecting the longitudinal direction DL. In the second example of the notch 11EC, the entire notch 11EC is a curved portion.

The first edge 11E1 of the band 11 includes a notch 11EC. In this example, as in the first example, in the longitudinal direction DL, in each long side 11EL, the portion from the portion separated from each end of the mask portion group to the end of the long side 11EL is included in the first 2 Edge 11E2. The half-etched line 14 has a shape along the second edge 11E2. In addition, the notch 11EC is separated from the frame portion 12 by the cutting line 13.

That is, in this example, the second edge 11E2 includes the corner ECN formed by the short side 11ES and the long side 11EL. The half-etched line 14 includes an L-shaped portion along the corner ECN. One half-etched line 14 is provided at a position corresponding to each corner ECN.

The vapor deposition mask formed by the strip portion 11 by cutting the strip portion 11 from the frame portion 12 is attached to a frame supporting the vapor deposition mask when the vapor deposition mask is used. . At this time, in order to suppress the generation of wrinkles in the vapor deposition mask, the vapor deposition mask is attached to the frame while pulling each short side of the edge of the vapor deposition mask in a direction away from the other short side. In the notch 11EC of the short side 11ES of the edge 11E of the band-shaped portion 11, there may be cut marks of the half-etched line 14, and wrinkles due to the cut marks are likely to be generated in the vapor deposition mask. In this regard, according to the vapor deposition mask intermediate body 10 described above, since the cut marks of the half-etched line 14 do not exist in the notches 11EC, when the vapor deposition mask is used, it is possible to suppress the generation of wrinkles in the vapor deposition mask.

In addition, since the corner ECN included in the edge 11E of the band 11 is connected to the frame 12 by the half-etched line 14, the band 11 can be suppressed when the vapor deposition mask intermediate body 10 is transported. The corner portion ECN in the edge 11E of the rim portion floats from the frame-shaped portion 12 more than the other portions of the band-shaped portion 11. As a result, it is possible to prevent the corner ECN from catching with the parts provided in the equipment provided around the vapor deposition mask intermediate body 10 when the vapor deposition mask intermediate body 10 is transported. As a result, the deformation of the belt-shaped portion 11 can be suppressed.

Fig. 4 shows the cross-sectional structure along the line IV-IV in Fig. 1, and Fig. 5 shows the cross-sectional structure along the line V-V in Fig. 1. That is, FIG. 4 and FIG. 5 show the cross-sectional structure of the vapor deposition mask intermediate body 10 perpendicular to the expanded plane of the vapor deposition mask intermediate body 10 and along the width direction DW. In addition, FIG. 4 shows the cross-sectional structure of the half-etching line 14 when the half-etching process is continuously performed. The half-etched line 14 continuously subjected to the half-etched process is the first example of the half-etched line 14.

As shown in FIG. 4, the half-etched line 14 connects a part of the frame-shaped portion 12 and a part of the peripheral portion 11b of the belt-shaped portion 11 to each other. The frame-shaped portion 12 and the band-shaped portion 11 have a first plate thickness T1. On the other hand, the half-etched line 14 has a second plate thickness T2, and the second plate thickness T2 is thinner than the first plate thickness T1. The first plate thickness T1 is, for example, 10 μm or more and 30 μm or less. The second plate thickness T2 is, for example, 3 μm or more and 20 μm or less.

In the half-etched line 14, the direction orthogonal to the direction in which the half-etched line 14 extends is the width direction of the half-etched line 14 when viewed from a direction opposite to the plane where the vapor deposition mask intermediate body 10 spreads. The width W of the half-etched line 14 is, for example, 40 μm or more and 120 μm or less. The cross section of the half-etched line 14 has a rectangular shape. In the direction in which the half-etched line 14 extends, the rectangular cross-sections are connected.

The half-etched line 14 may also have one or more through portions arranged along the direction in which the half-etched line 14 extends. The penetration portion penetrates the vapor deposition mask intermediate body 10 in the thickness direction of the vapor deposition mask intermediate body 10. In this case, to the extent that the half-etched line 14 has a penetrating portion, the half-etched line 14 becomes easy to be cut along the direction in which the half-etched line 14 extends.

The half-etched line 14 having a plurality of through portions is the second example of the half-etched line 14. FIG. 5 shows the cross-sectional structure when the half-etched line 14 has a plurality of through portions.

As shown in FIG. 5, the half-etched line 14 has a plurality of through portions 14H located in the half-etched line 14. Along the direction in which the half-etched line 14 extends, a plurality of through portions 14H are arranged at intervals. The plurality of penetrating portions 14H may be arranged at equal intervals, and the interval between the penetrating portions 14H may include a plurality of lengths.

In addition, the edge of the penetration portion 14H may be round when viewed from the direction opposite to the expanded plane of the vapor deposition mask intermediate body 10. In this case, the diameter of the penetration portion 14H may be, for example, 20 μm or more and 60 μm or less. In addition, when a plurality of through portions 14H are arranged at equal intervals, the interval between the through portions 14H may be, for example, 200 μm or more and 500 μm or less.

6 and 7 show the cross-sectional structure of the mask portion 11a on a plane orthogonal to the expansion plane of the vapor deposition mask intermediate body 10 and along a plane extending along the longitudinal direction DL. Fig. 6 shows a cross-sectional structure of the first example of the mask portion 11a. On the other hand, FIG. 7 shows a cross-sectional structure of the second example of the mask portion 11a.

As shown in FIG. 6, the vapor deposition mask intermediate body 10 is equipped with the surface 10F and the surface on the opposite side to the surface 10F, that is, the back surface 10R. The surface 10F faces the vapor deposition source of the vapor deposition device in a state where the vapor deposition mask is attached to the vapor deposition device. The back surface 10R faces a vapor deposition target such as a glass substrate in a state where the vapor deposition mask is attached to the vapor deposition device. The mask portion 11a has a plurality of mask holes 11H penetrating the vapor deposition mask intermediate body 10. The wall surface of the mask hole 11H is inclined with respect to the thickness direction of the vapor deposition mask intermediate body 10 when viewed in cross section. The shape of the wall surface of the mask hole 11H is a semicircular arc protruding toward the outside of the mask hole 11H in a cross-sectional view. In other words, when viewed in cross section, the mask hole 11H has a semicircular arc shape protruding from the surface 10F toward the back surface 10R. In addition, the shape of the wall surface of the mask hole 11H may also be a complicated curve with a plurality of bending points when viewed in cross section.

The thickness of the mask portion 11a may be, for example, 10 μm or less. With such a thin mask portion 11a, the area of the wall surface of the mask hole 11H can be reduced. In addition, since the thickness of the vapor deposition mask intermediate body 10 is thin, the vapor deposition material is deposited in the mask hole 11a. The splash distance within 11H is short. Thereby, the amount of vapor deposition substance adhering to the wall surface of the mask hole 11H can be reduced. Moreover, in the vapor deposition mask intermediate body 10, the thickness of the part other than the mask part 11a is 25 micrometers or less, for example. In the vapor deposition mask intermediate body 10, the thickness of the portion other than the mask portion 11a is the same as that of the metal sheet before processing, that is, the strip portion 11, the frame portion 12, the cut line 13, and the half-etched line 14. The thickness of the metal sheet before formation is equal.

The surface 10F includes a first opening H1 that belongs to the opening of the mask hole 11H. The back surface 10R includes a second opening H2 that belongs to the opening of the mask hole 11H. In a plan view facing the surface 10F, the first opening H1 is larger than the second opening H2. Each mask hole 11H is a passage through which the vapor deposition substance sublimated from the vapor deposition source passes. The vapor deposition material sublimated from the vapor deposition source advances from the first opening H1 to the second opening H2. In the mask hole 11H, since the first opening H1 is larger than the second opening H2, the amount of vapor deposition substance entering the mask hole 11H from the first opening H1 can be increased. In addition, the area of the mask hole 11H in the cross section along the surface 10F may increase monotonously from the second opening H2 to the first opening H1 from the second opening H2 to the first opening H1, or it may increase from the second opening H2 to the first opening H1. The second opening H2 to the first opening H1 has a substantially constant portion in the middle.

As shown in FIG. 7, the mask hole 11H is formed by a large hole 11LH having a first opening H1, and a small hole 11SH having a second opening H2. In a plan view facing the surface 10F, the first opening H1 is larger than the second opening H2. The cross-sectional area of the large hole 11LH monotonously decreases from the first opening H1 toward the back surface 10R. The cross-sectional area of the small hole 11SH monotonously decreases from the second opening H2 toward the surface 10F. In the cross-sectional view, the wall surface of the mask hole 11H has a portion where the large hole 11LH is connected to the small hole 11SH, that is, in the middle of the thickness direction of the vapor deposition mask intermediate body 10, there is a portion protruding toward the inner side of the mask hole 11H shape. The distance between the protruding part of the wall surface of the mask hole 11H and the back surface 10R is a step height SH.

In addition, in the first example of the mask portion 11a, the step height SH is zero. From the viewpoint of ensuring the amount of vapor deposition material reaching the second opening H2, the step height SH is preferably zero. In the case of the first example in which the belt-shaped portion 11 includes the mask portion 11a, the thickness of the metal sheet before processing is so small that the mask hole 11H is formed by wet etching the metal sheet from one side. The thickness of the metal sheet before processing is, for example, 25 μm or less as described above. In addition, in the case of the second example in which the belt-shaped portion 11 includes the mask portion 11a, the thickness of the mask portion 11a is, for example, 25 μm or less. In this case, the thickness of the metal sheet before processing is, for example, 50 μm or less.

[The composition of the vapor deposition mask] 8 to 10, the structure of the vapor deposition mask will be described. As shown in FIG. 8, the mask device 20 includes a frame 21 and a plurality of vapor deposition masks 31. In the example shown in FIG. 8, the mask device 20 is provided with two vapor deposition masks 31, but the mask device 20 may also be provided with one vapor deposition mask 31, or may be provided with more than three vapor deposition masks 31. . The frame 21 has a rectangular frame shape that can support a plurality of vapor deposition masks 31. The frame 21 is installed in a vapor deposition device for vapor deposition. The frame 21 covers substantially the entire area where each vapor deposition mask 31 is located, and has a frame hole 21H penetrating the frame 21.

Each vapor deposition mask 31 includes a mask portion 31a, a peripheral portion 31b, and an edge 31E. A plurality of mask holes 31H are formed in the mask portion 31a. The peripheral portion 31b surrounds the shield portion 31a. The edge 31E has a rectangle. In this embodiment, the vapor deposition mask 31 is provided with three mask parts 31a. The three mask portions 31 a are arranged at intervals in the longitudinal direction of the vapor deposition mask 31. The vapor deposition mask 31 may include two or less mask portions 31a, or may include four or more mask portions 31a. In the vapor deposition mask 31, the mask portion 31a corresponds to the mask portion 11a of the strip portion 11, the peripheral portion 31b corresponds to the peripheral portion 11b of the strip portion 11, and the edge 31E corresponds to the strip The edge 11E of the portion 11 corresponds. The mask hole 31H provided in the mask portion 31a corresponds to the mask hole 11H provided in the mask portion 11a.

The edge 31E of the vapor deposition mask 31 is composed of a first edge 31E1 and a second edge 31E2. The first edge 31E1 includes a portion positioned in the width direction of the vapor deposition mask 31 with respect to the mask portion 31a. The vapor deposition mask 31 further includes a cut mark existing in the second edge 31E2. The first edge 31E1 of the edge 31E corresponds to the first edge 11E1 of the edge 11E of the band 11, and the second edge 31E2 of the edge 31E corresponds to the second edge 11E2 of the edge 11E of the band 11.

Each vapor deposition mask 31 has a strip shape extending in one direction. In the peripheral portion 31b of each vapor deposition mask 31, a pair of portions sandwiching a plurality of mask portions 31a in the direction in which the vapor deposition mask 31 extends is fixed to the frame 21, respectively. The vapor deposition mask 31 is fixed to the frame 21 by bonding or welding.

9 and 10 are enlarged and displayed area A shown in FIG. 8. In the area A, a part of the cut trace provided in the vapor deposition mask 31 is included. In addition, FIG. 9 shows a cut mark in the case where the vapor deposition mask intermediate body 10 has the first example of the half-etched line 14. On the other hand, FIG. 10 shows a cut mark in the second example in which the vapor deposition mask intermediate body 10 has the half-etched line 14.

As shown in FIG. 9, a cutting mark E21 is present on the second edge 31E2 of the edge 31E of the vapor deposition mask 31. The cut mark E21 corresponds to the half-etched line 14 described above. The cut trace E21 is a bent portion where a part of the half-etched line 14 is bent toward the surface of the vapor deposition mask 31. The bent portion is formed by rolling up the half-etched line 14 toward the surface of the belt 11 when the belt 11 is cut from the frame 12.

As shown in FIG. 10, in the second example in which the vapor deposition mask intermediate body 10 has the half-etched line 14, there is a cut mark E22 at the second edge 31E2 of the edge 31E of the vapor deposition mask 31. The cutting mark E22 is formed by having a plurality of arc-shaped recesses E22a and a plurality of curved portions E22b. In each cutting mark E22, the recessed part E22a and the curved part E22b are arranged alternately. The bent portion E22b is a portion where the portion other than the through portion 14H in the half-etched line 14 is bent toward the surface of the vapor deposition mask 31. The bent portion E22b is formed by winding a part of the half-etched line 14 toward the surface of the belt-like portion 11 when the belt-like portion 11 is cut from the frame-like portion 12. The recess E22a included in the cut mark E22 corresponds to the through portion 14H of the half-etched line 14. On the other hand, the bent portion E22b included in the cut mark E22 corresponds to a portion other than the through portion 14H in the half-etched line 14.

In addition, as shown in the above-mentioned cut marks E21 and E22, when the cut marks E21 and E22 have curved portions, it is preferable that the curved portions bend in the vapor deposition mask 31 toward the surface including the first opening H1. Thereby, even if the cut marks E21 and E22 have curved portions, it is possible to prevent the vapor deposition mask 31 from floating from the frame 21 depending on the degree of the curved portion.

[Manufacturing method of vapor deposition mask] Referring to Fig. 11, a method of manufacturing the vapor deposition mask will be described. The method of manufacturing the vapor deposition mask 31 includes: forming the strip portion 11 and the frame portion 12 on a metal sheet; and cutting the strip portion 11 from the frame portion 12 to form the vapor deposition mask 31 from the strip portion 11. Hereinafter, with reference to FIG. 11, the manufacturing method of the vapor deposition mask 31 is demonstrated in more detail. In addition, below, the manufacturing method of the vapor deposition mask 31 in the case where the band-shaped part 11 is equipped with the mask part 11a of the 1st example is demonstrated as an example of the manufacturing method of the vapor deposition mask 31.

As shown in FIG. 11, in the manufacturing method of the vapor deposition mask 31, first, a metal piece is prepared (step S11). In the process of preparing the metal sheet, electrolysis may be used to prepare the metal sheet, and rolling and polishing may also be used to prepare the metal sheet. In addition, the metal sheet prepared in the step of preparing the metal sheet has a roll shape in which a metal sheet having a strip shape is wound up. Next, a resist layer is formed on one of the target surfaces of the metal sheet (step S12). Then, the resist layer is exposed and developed (step S13). Thereby, a resist mask is formed on the target surface of the metal sheet.

Next, a plurality of mask holes 11H are formed in the metal sheet by wet etching on the target surface masked with a resist (step S14). At this time, simultaneously with the formation of a plurality of mask holes 11H, the strip portion 11, the frame portion 12, the cut line 13, and the half-etched line 14 are also formed. In the vapor deposition mask intermediate body 10, a plurality of belt-shaped portions 11 are formed in a manner of being arranged at intervals.

Next, by removing the resist mask from the target surface, the above-mentioned mask portion 11a is formed (step S15). Next, the rolled vapor deposition mask intermediate body 10 is cut along the width direction DW. Thereby, an intermediate sheet having a plurality of belt-shaped portions 11 is obtained (step S16). In addition, by cutting the half-etched line 14 and cutting the strip-shaped portion 11 from the frame-shaped portion 12, the vapor deposition mask 31 can be obtained (step S17).

In addition, in the case of the second example in which the belt-shaped portion 11 includes the mask portion 11a, the steps from step S12 to step S15 described above are performed on the back surface 10R, thereby forming the small hole 11SH. Next, a protective layer for protecting the small holes 11SH is filled in the small holes 11SH. Next, the steps from step S12 to step S15 described above are performed on the surface 10F, thereby forming a large hole 11LH. Thereby, the second example of the mask portion 11a can be obtained. In addition, the resist mask used to form the small holes 11SH and the protective layer used to protect the small holes 11SH can also be removed at the same time as the resist mask used to form the large holes 11LH.

In addition, in the case of the second example in which the strip portion 11 includes the mask portion 11a and the first example in which the half-etched line 14 is provided, the half-etched line 14 may also be used when the steps from step S12 to step S15 are performed on the back surface 10R. form. Alternatively, the half-etched line 14 may be formed when the steps from step S12 to step S15 are performed on the surface 10F.

In addition, in the case of the second example in which the strip portion 11 is provided with the mask portion 11a and the second example in which the half-etched line 14 is provided, the through portion 14H provided in the half-etched line 14 is implemented by performing step S12 on the back surface 10R. The process up to step S15 is formed by performing the process up to step S12 to step S15 on the surface 10F. On the other hand, the part other than the through portion 14H in the half-etched line 14 may be formed when the steps from step S12 to step S15 are performed on the back surface 10R, or when the steps from step S12 to step S15 are performed on the surface 10F. .

As described above, according to one embodiment of the vapor deposition mask intermediate body, the vapor deposition mask, and the method of manufacturing the vapor deposition mask, the effects described below can be obtained. (1) Since the connecting portion of the frame-shaped portion 12 to the band-shaped portion 11 can be cut with a smaller force, when the vapor deposition mask 31 is manufactured, the band-shaped portion 11 can be easily removed from the frame-shaped portion 12 Cut away. On the other hand, when the vapor deposition mask intermediate body 10 is transported, the belt-shaped portion 11 and the frame-shaped portion 12 are connected by removing the second edge 11E2 of the edge 11E of the belt-shaped portion 11 from the frame-shaped portion. The 12-division half-etched line 14 is secured.

(2) When the half-etched line 14 has the through portion 14H, the half-etched line 14 is easily cut along the direction in which the half-etched line 14 extends.

(3) The cut marks E21 and E22 of the half-etched line 14 are not present in the notch 11EC, so that when the vapor deposition mask 31 is used, it is possible to suppress the occurrence of wrinkles in the vapor deposition mask 31.

(4) It is possible to prevent the corner ECN in the edge 11E of the band 11 from floating from the frame 12 more than the other parts of the band 11. With this, it is possible to prevent the corner ECN from catching on parts provided in equipment and the like provided around the vapor deposition mask intermediate body 10 when the vapor deposition mask intermediate body 10 is transported. As a result, the deformation of the belt-shaped portion 11 can be suppressed.

In addition, the above-mentioned embodiment can be modified and implemented as follows. [Linear fragile part] ・Referring to Figs. 12 to 16, the frame-shaped portion 12 may also be provided with a linear fragile portion described below.

As shown in FIG. 12, the frame-shaped portion 12 may include a linear fragile portion 12A extending in a direction from the cutting line 13 to the outer edge 12D of the frame-shaped portion 12. In the example shown in FIG. 12, the linear fragile portion 12A extends in a direction intersecting the longitudinal direction DL. In addition, one end of the linear fragile portion 12A is located on the cutting line 13, and the other end of the linear fragile portion 12A is located inside the frame portion 12.

The vapor deposition mask intermediate body 10 includes a plurality of linear fragile portions 12A. In the conveying direction of the vapor deposition mask intermediate body 10, the plurality of linear fragile portions 12A include: an upstream fragile portion 12AU located upstream of the mask portion 11a; and a downstream fragile portion located downstream of the mask portion 11a Side fragile part 12AD. In addition, the upstream of the mask part 11a means that the conveyance direction of the vapor deposition mask intermediate body 10 is ahead of the mask part 11a. Moreover, the downstream of the mask part 11a means that the conveyance direction of the vapor deposition mask intermediate body 10 is behind the mask part 11a.

In the upstream fragile portion 12AU, one end of the upstream fragile portion 12AU is connected to a portion located upstream of the mask portion group in the cutting line 13. On the other hand, in the downstream fragile portion 12AD, one end of the downstream fragile portion 12AD is connected to a part of the cutting line 13 which is located downstream of the mask portion group.

The vapor deposition mask intermediate body 10 is located between the two belt-shaped parts 11 in the width direction DW, and has two upstream fragile parts 12AU and two downstream fragile parts 12AD. The two upstream fragile portions 12AU are arranged in the width direction DW, and extend from the frame-shaped portion 12 toward the portion along the cutting line 13 of the band-shaped portion 11 that are different from each other. The two downstream fragile portions 12AD are arranged in the width direction DW, and extend from the frame-shaped portion 12 toward the portion along the cutting line 13 of the band-shaped portion 11 that are different from each other.

In addition, the vapor deposition mask intermediate body 10 has: a pair of upstream fragile portions 12AU sandwiching one of the two belt-shaped portions 11 in the width direction DW; and a pair of downstream side fragile portions 12AU sandwiching the two belt-shaped portions 11 in the width direction DW Fragile part 12AD. In addition, the vapor deposition mask intermediate body 10 may be provided with at least one of these linear fragile portions 12A.

The mechanical strength of the linear fragile portion 12A is lower than the mechanical strength of parts other than the linear fragile portion 12A of the frame-shaped portion 12. Therefore, the frame-shaped portion 12 is easily cut along the linear fragile portion 12A. Furthermore, since one end of the linear fragile portion 12A is located at the cutting line 13, when the strip portion 11 is removed from the frame portion 12, the loop formed by the frame portion 12 can be cut. This makes it easier to cut the half-etched line 14.

When forming the vapor deposition mask by the band-shaped portion 11, first, the vapor deposition mask intermediate body 10 is cut along the width direction DW at a predetermined position in the longitudinal direction DL. Thereby, the vapor deposition mask intermediate body 10 having only the two belt-shaped portions 11 arranged along the width direction DW is obtained. Next, by cutting the frame-shaped portion 12 along the linear fragile portion 12A, the ring surrounding the frame-shaped portion 12 of the band-shaped portion 11 is cut. Then, by cutting the half-etched line 14, the strip portion 11 is cut from the frame portion 12. Thereby, a vapor deposition mask can be formed from the belt-shaped portion 11.

FIG. 13 is an enlarged display of the area B shown in FIG. 12, and FIG. 14 is an enlarged display of the area C shown in FIG. 12. In addition, the area B includes the upstream end of the two upstream fragile portions 12AU, and the area C includes the downstream end of the two downstream fragile portions 12AD. 15 and 16 are enlarged and displayed area D shown in FIG. 12.

As shown in FIG. 13, the upstream end of each upstream fragile portion 12AU is connected to the upstream penetrating portion 12BU that penetrates the frame-shaped portion 12. The two upstream penetrating portions 12BU are arranged at a predetermined interval in the width direction DW. When the vapor deposition mask 31 is formed from the belt-shaped portion 11, for example, a device that can cut the frame-shaped portion 12 is used to sandwich the frame-shaped portion 12 in the width direction DW by the two upstream through-through portions 12BU. Partially cut, thereby forming a cut piece. Next, by pulling up the cutting piece in a direction intersecting the plane where the vapor deposition mask intermediate body 10 expands, the force for cutting the two upstream fragile portions 12AU can be simultaneously applied to the two upstream fragile portions 12AU.

In addition, in each of the pair of upstream fragile portions 12AU sandwiching the two band-shaped portions 11 in the width direction DW, the upstream end portion is connected to the upstream penetration portion 12BU. In addition, another upstream side penetration portion 12BU paired with the upstream side penetration portion 12BU is formed.

As shown in FIG. 14, the frame-shaped part 12 is equipped with: the downstream end part of two downstream fragile parts 12AD is connected with the piece 12C to be grasped, and the downstream side penetration part 12BD which surrounds the piece 12C to be grasped. Thereby, since the grasped piece 12C connected to the downstream end of the downstream fragile portion 12AD can be grasped by an instrument, or by a human finger, the force that cuts the downstream fragile portion 12AD can be easily applied to the downstream Side fragile part 12AD. By pulling up the gripped piece 12C in a direction intersecting the plane in which the vapor deposition mask intermediate body 10 expands, the force for cutting the two downstream fragile portions 12AD can be simultaneously applied to the two downstream fragile portions 12AD.

In addition, each of the pair of downstream fragile portions 12AD sandwiching the two band-shaped portions 11 in the width direction DW also has the downstream end connected to the grasped piece 12C, and the grasped piece 12C is formed by the downstream penetrating portion 12BD Surrounded by. The downstream end of the downstream fragile portion 12AD is connected to the grasped piece 12C.

In addition, as shown in FIG. 15, when viewed from a direction facing the surface 10F of the vapor deposition mask intermediate body 10, the cutting line 13 may also be provided with a protrusion 13A that is away from the belt portion 11 The belt-shaped portion 11 is separated from the frame-shaped portion 12 by the cutting line 13. When viewed from a direction facing the surface 10F of the vapor deposition mask intermediate body 10, the protrusion 13A has a rectangular shape. The protrusion 13A is located on the upstream side of the boundary between the cut line 13 and the half-etched line 14 in the longitudinal direction DL. The upstream end of the downstream fragile portion 12AD is connected to the protruding portion 13A in the cutting line 13. In addition, the upstream end of the downstream fragile portion 12AD, also in the protruding portion 13A, can be connected halfway from one end to the other end of the side located on the most downstream side. In addition, the upstream end of the downstream fragile portion 12AD may be connected to the end having the largest distance from the band-shaped portion 11 among the edges located on the most downstream side in the protruding portion 13A.

Since the cutting line 13 has the protrusion 13A, and the downstream fragile part 12AD is connected to the protrusion 13A, when the frame part 12 is cut along the downstream fragile part 12AD, it is possible to suppress the use of cutting the frame part 12 An external force acts on the belt portion 11. Thereby, it is possible to suppress the external force from acting on the mask portion 11a of the belt-shaped portion 11. In addition, since the upstream end portion is a portion other than one end and the other end of the side existing on the most downstream side in the protrusion 13A, the downstream fragile portion 12AD is easily cut.

In addition, the cut line 13 is not limited to having a protrusion 13A where each downstream fragile portion 12AD is connected, and may also have a protrusion 13A where each upstream fragile portion 12AU is connected. The effect of the effect produced by the above-mentioned protrusion 13A.

In addition, as shown in FIG. 16, when viewed from a direction facing the surface 10F of the vapor deposition mask intermediate body 10, the protrusion 13A may also be separated from the boundary between the cut line 13 and the half-etched line 14 toward the strip portion 11 The belt-shaped portion 11 is separated from the frame-shaped portion 12 by the cutting line 13. Even in this case, the upstream end of the downstream fragile portion 12AD can be connected halfway from one end to the other end of the side located on the most downstream side in the protruding portion 13A. In addition, the upstream end of the downstream fragile portion 12AD may be connected to the end having the greatest distance from the band-shaped portion 11 among the edges existing on the most downstream side in the protruding portion 13A. Therefore, according to the protrusion 13A, the effect based on the protrusion 13A described above with reference to FIG. 15 can be obtained.

In addition, the cut line 13 is not limited to the protruding portion 13A where each downstream fragile portion 12AD is connected, and the protruding portion 13A may also be provided at the location where each upstream fragile portion 12AU is connected. The effect based on the effect produced by the protrusion 13A described above with reference to FIG. 15 is obtained.

In the example shown in FIGS. 13 to 16, the linear fragile portion 12A has a plurality of penetrating portions 12A1 arranged at intervals. The penetration portion 12A1 penetrates the vapor deposition mask intermediate body 10 in the thickness direction of the vapor deposition mask intermediate body 10. Instead, the linear fragile portion 12A may be formed by one half-etched portion having a linear shape, or may have a plurality of half-etched portions arranged at intervals in the direction in which the linear fragile portion 12A extends. Alternatively, in the linear fragile portion 12A, the linear half-etched portion may have a plurality of through portions arranged at intervals in the direction in which the half-etched portion extends.

In addition, the upstream through portion 12BU that connects the upstream end of the upstream fragile portion 12AU may be changed to the grasped piece 12C that connects the downstream fragile portion 12AD and the downstream through portion 12BD that surrounds the grasped piece 12C. Alternatively, the grasped piece 12C connecting the downstream end of the downstream fragile portion 12AD and the downstream penetrating portion 12BD surrounding the grasped piece 12C may be changed to an upstream penetrating connecting the upstream end of the upstream fragile portion 12AU部12BU.

According to the vapor deposition mask intermediate body 10 provided with the linear fragile portion 12A, the effects described below can be obtained. (5) Since one end of the linear fragile portion 12A is connected to the cutting line 13, when the strip portion 11 is removed from the frame portion 12, the ring formed by the frame portion 12 can be cut, thereby changing It is easy to cut the half-etched line 14.

[Cut the line] ・As shown in FIG. 17, when viewed from the direction facing the surface 10F of the vapor deposition mask intermediate body 10, the outer shape of the protrusion 13A may have a trapezoidal shape. The upstream end of the downstream fragile portion 12AD is connected to the end with the largest distance from the band-shaped portion 11 in the protruding portion 13A on the side located on the most downstream side.

[Half-etched line] ・The half-etched line 14 may not include an L-shaped portion along the corner ECN of the edge 11E of the band portion 11. The half-etched line 14 may have a linear shape extending in the width direction DW, or may have a linear shape extending in the longitudinal direction DL, for example. In addition, the half-etched line 14 may include both a linear portion extending in the width direction DW and a linear portion extending in the longitudinal direction DL. Even in this case, by dividing the second edge 11E2 of the edge 11E of the band-shaped portion 11 from the frame-shaped portion 12 through the half-etched line 14, the effect based on the above (1) can be obtained.

・The half-etched line 14 may also exist between the notch 11EC of the edge 11E of the band 11 and the frame 12. That is, in the edge 11E of the band 11, the notch 11EC may be included in the second edge 11E2. Even in this case, by separating the second edge 11E2 of the edges 11E of the band-shaped portion 11 from the frame-shaped portion 12 through the half-etched line 14, the effect based on the above (1) can be obtained.

・In the half-etched line 14, a plurality of half-etched portions having the second thickness may be arranged at intervals along the direction in which the half-etched line 14 extends. In this case, there is a non-etched portion having the first plate thickness between the two half-etched portions adjacent to each other.

[Ribbon] ・As shown in FIG. 18, in the vapor deposition mask intermediate body 10, the region surrounded by the notch 11EC provided in the band-shaped portion 11 may be the penetration portion 13H. In this case, the first edge 11E1 among the edges 11E of the frame-shaped portion 12 is separated from the frame-shaped portion 12 by the cutting line 13 and the penetrating portion 13H. In this modified example, the cutting line 13 and the penetrating portion 13H are separated portions separated from the first edge 11E1 and the frame-shaped portion 12.

・The short side 11ES in the edge 11E of the band 11 may not have the notch 11EC. In this case, the half-etched line 14 may exist in any position between the short side 11ES and the frame-shaped portion 12. Also, even in this case, by dividing the second edge 11E2 of the edge 11E of the band-shaped portion 11 from the frame-shaped portion 12 through the half-etched line 14, the effect based on the above (1) can be obtained.

[Intermediate of Evaporation Mask] ・The vapor deposition mask intermediate body can also be formed of a mask substrate with a metal sheet and a resin layer laminated on the metal sheet. In this case, the vapor deposition mask formed of the vapor deposition mask intermediate is also formed of a metal sheet and a resin layer. Alternatively, the vapor deposition mask intermediate body may be formed of a mask base material including two metal sheets and a resin layer sandwiched by the two metal sheets in the thickness direction of the vapor deposition mask intermediate body. In this case, the vapor deposition mask formed by the vapor deposition mask intermediate is also formed by two metal sheets and a resin layer sandwiched by the two metal sheets. In any of these cases, the synthetic resin forming the resin layer may be, for example, polyimide resin. In addition, by irradiating the resin layer with laser light, the through part and the half-etched part of the intermediate vapor deposition mask can be formed.

The technical ideas derived from the above-mentioned embodiments and modified examples are appended below. [Supplement 1] A kind of vapor deposition mask intermediate, with: Band; and A frame-shaped portion surrounding the aforementioned band-shaped portion; The aforementioned band has: Forming a mask portion with a plurality of mask holes; and Surrounding the periphery of the aforementioned mask, The peripheral portion and the frame-shaped portion have a first plate thickness, The aforementioned first plate thickness is 10 μm or more and 30 μm or less, The edges of the aforementioned band-shaped portion include a first edge and a second edge, The first edge includes a portion facing the mask portion in the width direction of the band-shaped portion, The first edge and the frame-shaped part are separated by a separating part, The second edge and the frame-shaped portion are distinguished by linear half-etched portions arranged at intervals with a plurality of half-etched elements having a second thickness. In the linear half-etched portion, two adjacent to each other There is a non-etched part having the first plate thickness between the half-etched elements.

According to the above note, since the first plate thickness of the peripheral portion and the frame-shaped portion connected to each other by the linear half-etched portion is 10 μm or more and 30 μm or less, the linear half-etched portion is arranged with a plurality of half-etched at intervals. Element, can fully improve the cutting performance of the belt-shaped part. In addition, since the peripheral part and the frame-shaped part are connected by the half-etched part and the non-etched part, even if the peripheral part and the frame-shaped part are very thin, it is possible to secure the peripheral part when transporting the vapor deposition mask intermediate body. The connection with the frame.

10: Evaporation mask intermediate 11: Ribbon 12: Frame 13: Cut the line 14: Half etching line 20: Masking device 21: Frame 31: Evaporation mask

Fig. 1 is a plan view showing the structure of a vapor deposition mask intermediate body in an embodiment. Fig. 2 is a partial plan view showing a first example of the structure of the vapor deposition mask intermediate body shown in Fig. 1. Fig. 3 is a partial plan view showing a second example of the structure of the vapor deposition mask intermediate body shown in Fig. 1. Fig. 4 is a cross-sectional view showing the structure along the IV-IV line of Fig. 1. Fig. 5 is a cross-sectional view showing the structure along the line V-V in Fig. 1. Fig. 6 is a cross-sectional view showing a first example of the structure of the mask hole provided in the band-shaped portion shown in Fig. 1. Fig. 7 is a cross-sectional view showing a second example of the structure of the mask hole provided in the belt-shaped portion shown in Fig. 1. FIG. 8 is a plan view showing the structure of a mask device provided with a vapor deposition mask formed from the vapor deposition mask intermediate body shown in FIG. 1. Fig. 9 is a plan view showing the first example of the structure in the area A of Fig. 8. Fig. 10 is a plan view showing a second example of the structure in the area A of Fig. 8. FIG. 11 is a flowchart for explaining the manufacturing method of the vapor deposition mask shown in FIG. 8. Fig. 12 is a plan view showing the structure of the first modified example of the vapor deposition mask intermediate body. Fig. 13 is a plan view showing an enlarged view of the structure of the upstream end of the upstream fragile portion. Fig. 14 is a plan view showing the structure of the downstream end of the downstream fragile portion in an enlarged manner. Fig. 15 is a plan view in which a part of the first example of the cutting line shown in Fig. 12 is enlarged and displayed. Fig. 16 is a plan view showing an enlarged part of the second example of the cutting line shown in Fig. 12. Fig. 17 is an enlarged plan view showing a part of the third example of the cutting line shown in Fig. 12; Fig. 18 is a plan view showing the structure in the second modification of the vapor deposition mask intermediate body.

10: Evaporation mask intermediate

11: Ribbon

11a: Mask

11b: Peripheral part

11E: Edge

11E1: 1st edge

11E2: 2nd edge

11EL: Long side

11H: Mask hole

11ES: Short side

11EC: gap

12: Frame

13: Cut the line

14: Half etching line

DL: length direction

DW: width direction

Claims (7)

A kind of vapor deposition mask intermediate, with: Band; and The frame-shaped portion surrounding the aforementioned band-shaped portion, The aforementioned band has: Forming a mask portion with a plurality of mask holes; and Surrounding the periphery of the aforementioned mask, The peripheral portion and the frame-shaped portion have a first plate thickness, The edges of the aforementioned band-shaped portion include a first edge and a second edge, The first edge includes a portion facing the mask portion in the width direction of the band-shaped portion, There is a separating portion separating the first edge from the frame-shaped portion between the first edge and the frame-shaped portion, Between the second edge and the frame-shaped portion, there is a linear half-etched portion having a second plate thickness that is thinner than the first plate thickness. Such as the evaporation mask intermediate of claim 1, where The linear half-etched portion has one or more penetrating portions arranged along the direction in which the linear half-etched portion extends, and the penetrating portion penetrates the vapor deposition mask intermediate body in the thickness direction of the vapor deposition mask intermediate body . Such as the evaporation mask intermediate of claim 1, where The edge of the strip-shaped portion includes a pair of short sides extending along the width direction of the strip-shaped portion, each short side having a notch recessed toward the other short side, The first edge of the band-shaped portion includes the notch. Such as the evaporation mask intermediate of claim 3, where The edge of the band-shaped portion has a rectangle divided by the pair of short sides and the pair of long sides, The second edge includes a corner formed by the short side and the long side, The linear half-etched portion includes an L-shaped portion along the corner portion. Such as the vapor deposition mask intermediate of any one of claims 1 to 4, wherein The frame-shaped portion includes: an outer edge; and a fragile portion having a linear shape extending from the separation portion toward the outer edge; The mechanical strength of the fragile portion is lower than the mechanical strength of parts other than the fragile portion in the frame-shaped portion. An evaporation mask with: A mask portion with a plurality of mask holes is formed; Surrounding the peripheral portion of the aforementioned mask portion; and With banded edges, The aforementioned edge includes the first edge and the second edge, The first edge includes a portion facing the mask portion in the width direction of the vapor deposition mask, and The vapor deposition mask is further provided with cut marks existing on the second edge. A method for manufacturing an evaporation mask, including: Forming a band-shaped portion and a frame-shaped portion on a mask base material containing a metal sheet; and The strip-shaped portion is cut from the frame-shaped portion, and a vapor deposition mask is formed from the strip-shaped portion, The aforementioned belt-shaped portion and the aforementioned frame-shaped portion are formed in the following manner: It is provided with the band-shaped portion and a frame-shaped portion surrounding the band-shaped portion, The belt-shaped portion includes: a mask portion formed with a plurality of mask holes; and a peripheral portion surrounding the mask portion, The peripheral portion and the frame-shaped portion have a first plate thickness, The edges of the aforementioned band-shaped portion include a first edge and a second edge, The first edge includes a portion facing the mask portion in the width direction of the band-shaped portion, There is a separating portion separating the first edge from the frame-shaped portion between the first edge and the frame-shaped portion, Between the second edge and the frame-shaped portion, there is a linear half-etched portion having a second plate thickness thinner than the first plate thickness.

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