TW202121557A - Carrier thermocompression mold-sealing apparatus and method thereof - Google Patents
Carrier thermocompression mold-sealing apparatus and method thereof Download PDFInfo
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本發明有關於一種載板熱壓模封設備及其方法,尤指一種全自動化執行載板半成品熱壓模封製程,提升載板成品生產率及良率之載板熱壓模封設備及其方法。The present invention relates to a carrier board hot-compression mold sealing device and method, in particular to a carrier board hot-compression mold sealing device and method that fully automatically executes the carrier board semi-finished product hot-compression mold sealing process and improves the productivity and yield of the carrier board product .
就載板模封技術而言,尤其針對大尺寸載板,主要是於已焊接有複數積體電路的大尺寸載板表面以樹脂材料覆蓋封裝,而後再將已完成模封之載板進行切割,使形成一個一個模封的積體電路。As far as the carrier board molding technology is concerned, especially for large-size carrier boards, it is mainly used to cover the surface of the large-size carrier board with multiple integrated circuits soldered with resin material, and then cut the completed carrier board. , So that a molded integrated circuit is formed.
習知載板模封利用人工移放載板,然由於載板的尺寸大且非常輕薄,因此在模封製程中的移動、對位非常困難,必須耗費大量時間。The conventional mold sealing of the carrier plate uses the manual transfer of the carrier plate. However, since the size of the carrier plate is large and very thin, it is very difficult to move and align during the molding process, and it takes a lot of time.
此外,封裝之樹脂為熱固性材料,受熱後即產生特性反應,因此必須在特定時間內完成填裝製程,而現有的佈膠技術存在至少兩個缺點。一為將樹脂直接塗佈在載板上,再將載板與樹脂一同加熱並封裝,樹脂會因受熱時間過長且不均,產品品質不佳。二為將樹脂直接塗佈至模穴內,因佈膠面積大因而所需時間長,樹脂受熱時間不均,影響其流動性與封裝品質。In addition, the encapsulated resin is a thermosetting material, which produces a characteristic reaction after being heated. Therefore, the filling process must be completed within a specific time. However, the existing adhesive cloth technology has at least two shortcomings. One is to directly coat the resin on the carrier board, and then heat the carrier board and the resin together and encapsulate it. The resin will be heated for too long and unevenly, resulting in poor product quality. The second is to apply the resin directly into the mold cavity, which requires a long time due to the large area of the glue, and the uneven heating time of the resin affects its fluidity and packaging quality.
據此,如何能有一種全自動化執行載板熱壓模封製程,提升載板成品生產率及良率之『載板熱壓模封設備及其方法』,是相關技術領域人士亟待解決之課題。According to this, how to have a fully automated carrier board hot press molding process to improve the productivity and yield of the carrier board is a "carrier board hot press molding device and method" that needs to be solved urgently by those in the relevant technical fields.
於一實施例中,本發明提出一種載板熱壓模封設備,包含: 一熱壓模封裝置,其包括: 一上模,用以承接欲進行熱壓模封之載板半成品; 一下模,用以承接膠材,下模與上模相對運動,使載板半成品與膠材相互貼合以形成載板成品; 一膠材供給裝置,用以將膠材設置於下模;以及 一載板輸送裝置,用以將載板半成品及載板成品在熱壓模封裝置往復移送。In one embodiment, the present invention provides a carrier board hot-compression molding equipment, including: A hot press molding sealing device, which includes: An upper mold to accept the semi-finished products of the carrier plate to be hot-molded; The lower mold is used to accept the glue material, and the lower mold and the upper mold move relative to each other, so that the semi-finished product of the carrier board and the glue material are attached to each other to form the finished product of the carrier board; A glue supply device for setting glue on the lower mold; and A carrier board conveying device is used to reciprocate the carrier board semi-finished product and the carrier board finished product in the hot press mold sealing device.
於另一實施例中,本發明提出一種載板熱壓模封方法,其步驟包含有: 利用一熱壓模封裝置之上模承接欲進行熱壓模封之載板半成品; 利用一膠材供給裝置將膠材設置於該熱壓模封裝置之下模; 該下模與該上模相對運動,使該載板半成品與該膠材相互貼合以形成載板成品;以及 利用一載板輸送裝置將該載板半成品及該載板成品在該熱壓模封裝置往復移送。In another embodiment, the present invention provides a method for hot compression molding of a carrier board, the steps of which include: Utilize the upper mold of a hot-compression molding device to accept the semi-finished products of the carrier plate to be hot-molded; Use a glue material supply device to set the glue material on the lower mold of the hot-press molding sealing device; The lower mold and the upper mold move relative to each other so that the semi-finished product of the carrier board and the adhesive material are attached to each other to form a finished carrier board; and A carrier board conveying device is used to reciprocate the carrier board semi-finished product and the carrier board finished product in the hot press molding sealing device.
請參閱圖1所示,本發明所提供之一種載板熱壓模封設備1,包含一熱壓模封裝置10、一膠材供給裝置20及一載板輸送裝置30。膠材供給裝置20用以將膠材設置於熱壓模封裝置10中,載板輸送裝置30用以將載板半成品移送至熱壓模封裝置10中,再由熱壓模封裝置10將載板半成品與膠材相互熱壓結合以形成載板成品。Please refer to FIG. 1, a carrier board thermal
關於熱壓模封裝置10、膠材供給裝置20及載板輸送裝置30的具體結構及作動方式,請參閱以下說明。Please refer to the following description for the specific structure and operation mode of the hot press
請參閱圖2所示,本發明之載板輸送裝置30包括一第一承載模組31、一第二承載模組32及一支撐平台33。第一承載模組31可水平移動地設置於支撐平台33。第二承載模組32可垂直移動地設置於支撐平台33之下方。Please refer to FIG. 2, the carrier
第一承載模組31包括一第一基座311與複數第一承載單元312。第一基座311具有垂直貫穿第一基座311之複數孔洞314。複數第一承載單元312設置於第一基座311上。每一第一承載單元312之頂部設有一第一吸附單元313,複數第一吸附單元313之頂部位於一第一高度H1。第一承載單元312與孔洞314錯位設置。於支撐平台33設有滑軌331,以支撐第一承載模組31的水平移動。The first supporting
第二承載模組32包括一第二基座321與複數第二承載單元322。每一第二承載單元322係相對應於每一孔洞314之位置設置於第二基座321上,每一第二承載單元322之頂部設有一第二吸附單元323。由於第一承載單元312與孔洞314錯位設置,亦即,第二承載單元322與第一承載單元312錯位設置。The
第一吸附單元313與第二吸附單元323所提供的吸附力可包括,但不限於此,例如,真空吸附、氣流負壓吸附、擠壓排氣負壓吸附等等,依實際所需而設計,不限於此。The adsorption force provided by the
請參閱圖3所示,控制第二承載模組32上升並使複數第二承載單元322由第一基座311之下方向上穿設過相對應之複數孔洞314,使複數第二吸附單元323之頂部位於支撐平台33之上方且位於一第二高度H2以承接並吸附載板半成品P1。第二高度H2高於第一高度H1。Referring to FIG. 3, the second supporting
請參閱圖4及圖5所示,第二承載模組32承接並吸附載板半成品P1之後下降,使複數第二吸附單元323之頂部之高度等於第一高度H1,將第二吸附單元323的吸附力解除,將載板半成品P1轉移由複數第一吸附單元313承接並吸附,再控制第二承載模組32下降。Please refer to Figures 4 and 5, the
請參閱圖6所示,熱壓模封裝置10包括一上模11與一下模12。上模11朝向下模12之面具有吸附力,可用以吸附載板半成品P1。上模11內設有加熱模組111,可用以對所承接的載板半成品P1加熱。Please refer to FIG. 6, the hot pressing
上模11所提供的吸附力可包括,但不限於此,例如,真空吸附、氣流負壓吸附、擠壓排氣負壓吸附等等,依實際所需而設計,不限於此。The adsorption force provided by the
下模12用以承接膠材(圖中未示出),熱壓模封裝置10包括一隔離膜輸送模組13,用以提供隔離膜131覆蓋於下模12朝向上模11之面,膠材設置於隔離膜131朝向上模11之面。The
第一吸附單元313承接載板半成品P1後,控制第一承載模組31水平移動由載板輸送裝置30伸出,以將載板半成品P1置入熱壓模封裝置10的上模11與下模12間,之後,控制第一吸附單元313上升,使載板半成品P1與上模11的底面貼合,由於上模11的底面具有吸附力,因此可使載板半成品P1吸附於上模11的底面,且由加熱模組111對所承接的載板半成品P1加熱。After the
請參閱圖7所示,載板半成品P1被吸附於上模11的底面之後,控制第一承載模組31水平移動收回載板輸送裝置30中。載板輸送裝置30回復到圖2所示狀態。Please refer to FIG. 7, after the carrier board semi-finished product P1 is adsorbed on the bottom surface of the
請參閱圖8所示,膠材供給裝置20用以將膠材設置於下模12。膠材供給裝置20主要包括一供膠單元21及一載膠單元22。供膠單元21內盛裝有膠材,用以撒佈於載膠單元22上,而後控制載膠單元22移動至熱壓模封裝置10之上模11與下模12之間,再控制載膠單元22將膠材撒佈於隔離膜131朝向上模11之面。於進行上述佈膠之過程時,可由加熱模組111持續對所承接的載板半成品P1加熱。Please refer to FIG. 8, the glue
關於本發明之膠材供給裝置20之詳細結構,可參閱申請人於中華民國106年12月19日提出中華民國發明專利申請,申請案號為106144643,發明名稱為「佈膠裝置及其方法」,後於中華民國108年08月11日獲准公告,公告號碼為I668770。For the detailed structure of the
請參閱圖8至圖10所示,當完成佈膠後,控制載膠單元22退出上模11與下模12之間,而後,控制下模12與上模11相對運動相互靠合,使載板半成品P1與膠材相互熱壓結合以形成載板成品P2。再控制下模12與上模11相對運動相互分離,如圖10所示,載板成品P2吸附於上模11底面。Please refer to Figures 8 to 10, when the glue is finished, the glue-carrying
請參閱圖11所示,控制第一承載模組31由載板輸送裝置30水平移動至熱壓模封裝置10內,控制第一吸附單元313上升接觸並吸附載板成品P2。再控制上模11的吸附力解除,使載板成品P2與上模11分離,第一吸附單元313吸附載板成品P2並下降,第一承載模組31再水平移動返回載板輸送裝置30。而後反向執行前述承接載板半成品之動作(圖3至圖5所示),將載板成品P2擺放至如圖3所示原擺放載板半成品P1之位置,即可再利用機械手臂或其他物件承接載板成品P2並移送到可儲存載板成品P2的區域。Referring to FIG. 11, the
請參閱圖12所示,本實施例之載板熱壓模封設備1A包含一熱壓模封裝置10、一膠材供給裝置20及一載板輸送裝置30之外,更搭配有機械手臂40、載板供應裝置50、光學檢測裝置60、不良載板儲存裝置70及成品存放裝置80。Please refer to FIG. 12, the carrier board thermal compression molding sealing device 1A of this embodiment includes a thermal compression
載板供應裝置50用以存放載板半成品,由機械手臂40將載板半成品由載板供應裝置50取出並移送至載板輸送裝置30,而後即可進行圖2至圖10所示熱壓模封的製程,並形成圖11所示之載板成品P2,而後利用機械手臂40將載板成品P2移送至成品存放裝置80內。The carrier
關於本發明之載板供應裝置50,其詳細結構可參閱申請人於中華民國107年06月29日提出中華民國發明專利申請,申請案號為107122535,發明名稱為「具有對準功效之儲存盒」,後於中華民國108年02月21日獲准公告,公告號碼為I651253。For the detailed structure of the carrier
光學檢測裝置60設置於載板半成品被移送至載板輸送裝置30之路徑中。機械手臂40將載板半成品由載板供應裝置50取出後,先由光學檢測裝置60對載板半成品進行檢測,檢測為良品的載板半成品送入載板輸送裝置30,檢測具有瑕疵的載板半成品則送至不良載板儲存裝置70存放。The
關於機械手臂40,更可採用一種具有雙取手的機械手臂(例如設置有上下兩層取手之機械手臂),當其中之一取手將已於熱壓模封裝置10完成熱壓模封之載板成品自載板輸送裝置30取出後,另一取手可接續將載板半成品放入載板輸送裝置30中,並將完成熱壓模封之載板成品放入成品存放裝置80中,以提高生產效益。Regarding the
光學檢測裝置60亦可設置於載板成品被移送至成品存放裝置80之路徑中,機械手臂40將載板成品由載板輸送裝置30取出後,先由光學檢測裝置60對載板成品進行檢測,檢測為良品的載板成品送入成品存放裝置80內,檢測具有瑕疵的載板成品則送至不良載板儲存裝置70存放。The
請參閱圖13所示,本實施例之載板熱壓模封設備1B包含熱壓模封裝置10、膠材供給裝置20、載板輸送裝置30、機械手臂40、載板供應裝置50、光學檢測裝置60、不良載板儲存裝置70、成品存放裝置80及載板翻面裝置90。Please refer to FIG. 13, the carrier board thermal compression
熱壓模封裝置10、膠材供給裝置20、載板輸送裝置30、機械手臂40、載板供應裝置50、光學檢測裝置60、不良載板儲存裝置70、成品存放裝置80的作用與圖12實施例相同。載板翻面裝置90的作用則是在於將載板半成品或載板成品翻面,以供光學檢測裝置60檢測載板半成品或載板成品的兩面或供熱壓模封裝置10進行熱壓模封。The functions of the hot-press
請參閱圖14所示,本實施例之載板熱壓模封設備1C包含二熱壓模封裝置10A、10B、一膠材供給裝置20、二載板輸送裝置30A、30B、一機械手臂40、一載板供應裝置50、一光學檢測裝置60、一不良載板儲存裝置70、一成品存放裝置80及一載板翻面裝置90。Please refer to FIG. 14, the carrier board thermal
本實施例與圖13實施例之差異在於本實施例具有二熱壓模封裝置10A、10B及二載板輸送裝置30A、30B,機械手臂40將載板半成品分別送入載板輸送裝置30A、30B之後,每一載板輸送裝置30A、30B再將載板半成品移送至相對應之熱壓模封裝置10A、10B,藉此提高產能。The difference between this embodiment and the embodiment in FIG. 13 is that this embodiment has two hot-compression
機械手臂40將載板半成品由載板供應裝置50取出後,先由光學檢測裝置60對載板半成品進行檢測,檢測為良品的載板半成品送入載板輸送裝置30A、30B,檢測具有瑕疵的載板半成品則送至不良載板儲存裝置70存放。After the
關於機械手臂40,更可採用一種具有雙取手的機械手臂,當其中之一取手將已於熱壓模封裝置10完成熱壓模封之載板成品自載板輸送裝置30取出後,另一取手可接續將載板半成品放入載板輸送裝置30中,並將完成熱壓模封之載板成品放入成品存放裝置80中,以提高生產效益。Regarding the
光學檢測裝置60亦可設置於載板成品被移送至成品存放裝置80之路徑中,機械手臂40將載板成品由載板輸送裝置30A、30B取出後,先由光學檢測裝置60對載板成品進行檢測,檢測為良品的載板成品送入成品存放裝置80內,檢測具有瑕疵的載板成品則送至不良載板儲存裝置70存放。The
於本實施例中僅設置一膠材供給裝置20,於載板輸送裝置30A、30B將載板半成品移送至相對應之熱壓模封裝置10A、10B的過程中,可由膠材供給裝置20將膠材一一撒佈於熱壓模封裝置10的下模。而後,熱壓模封裝置10A、10B可同時或分別對載板半成品進行熱壓模封。最後再由機械手臂40將完成熱壓模封之載板成品一一放入成品存放裝置80中。In this embodiment, only one
以圖14實施例架構為依據,可依所需增加載板輸送裝置與熱壓模封裝置的數量,或增加膠材供給裝置的數量,不限於圖示架構。Based on the structure of the embodiment in FIG. 14, the number of carrier conveying devices and hot-press molding sealing devices can be increased as needed, or the number of glue supply devices can be increased, and it is not limited to the structure shown in the figure.
必須說明的是,於圖13及圖14兩實施例架構中,光學檢測裝置60與載板翻面裝置90分別設置於機械手臂40之移動路徑之相對兩側,然除此之外,亦可將光學檢測裝置60與載板翻面裝置90設置於機械手臂40之移動路徑之同一側。換言之,光學檢測裝置60與載板翻面裝置90的設置位置沒有一定限制,視實際所需與實際環境空間而定。It must be noted that in the two embodiments of FIG. 13 and FIG. 14, the
請參閱圖15所示,本發明所提供之一種載板熱壓模封方法之流程100,其步驟包含有:
步驟102:利用一熱壓模封裝置10之上模11承接欲進行熱壓模封之載板半成品P1(其態樣請參閱圖7所示);
步驟104:利用一膠材供給裝置20將膠材設置於熱壓模封裝置10之下模12(其態樣請參閱圖8所示);
步驟106:下模12與上模11相對運動,使載板半成品P1與膠材相互貼合以形成載板成品P2(其態樣請參閱圖9~10所示);以及
步驟108:利用一載板輸送裝置30將載板半成品P1及載板成品P2在熱壓模封裝置10往復移送(其態樣請參閱圖1、圖6及圖11所示)。Please refer to FIG. 15, the
綜上所述,本發明所提供之載板熱壓模封設備及其方法,藉由載板輸送裝置將載板半成品自動送入熱壓模封裝置之上模,並藉由膠材供給裝置將膠材自動撒佈於熱壓模封裝置之下模,因此可達成全自動化執行載板熱壓模封製程之目的,大幅縮短製造時間。若再輔以機械手臂將載板由具有對準功效之儲存盒中取出並自動置入載板輸送裝置,由機械手臂將完成熱壓模封之載板成品自動移送至成品置放區,再者,或若該機械手臂具有雙層取手,則其中之一取手可用以取放載板半成品,而另一取手可於同時取放載板成品,更可大幅提高生產效益;以及,由光學檢測裝置自動檢測載板半成品,可避免錯置載板半成品及計算其所需膠量,如此更能加快製程、提高產能,且能提升載板成品良率。In summary, the carrier board hot-compression molding sealing equipment and method provided by the present invention automatically send the carrier board semi-finished product into the upper mold of the hot-compression molding-sealing device by the carrier conveying device, and use the glue supply device The glue material is automatically spread on the lower mold of the hot compression molding device, so it can achieve the purpose of fully automatic execution of the carrier board hot compression molding process, and greatly shorten the manufacturing time. If it is supplemented by a robotic arm to take out the carrier board from the storage box with the alignment function and automatically place it into the carrier conveying device, the robotic arm will automatically transfer the finished carrier board to the finished product storage area. Or, if the robotic arm has a double-layer pick, one of the picks can be used to pick and place the semi-finished product of the carrier board, and the other pick can pick and place the finished product of the carrier at the same time, which can greatly improve the production efficiency; and, by optical inspection The device automatically detects the semi-finished products of the carrier, which can avoid misplacement of the semi-finished products of the carrier and calculate the amount of glue required, which can speed up the manufacturing process, increase the production capacity, and improve the yield of the finished product of the carrier.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be subject to those defined by the attached patent application scope.
1、1A、1B、1C:載板熱壓模封設備
10、10A、10B:熱壓模封裝置
11:上模
111:加熱模組
12:下模
13:隔離膜輸送模組
131:隔離膜
20:膠材供給裝置
21:供膠單元
22:載膠單元
30、30A、30B:載板輸送裝置
31:第一承載模組
311:第一基座
312:第一承載單元
313:第一吸附單元
314:孔洞
32:第二承載模組
321:第二基座
322:第二承載單元
323:第二吸附單元
33:支撐平台
331:滑軌
40:機械手臂
50:載板供應裝置
60:光學檢測裝置
70:不良載板儲存裝置
80:成品存放裝置
90:載板翻面裝置
100:載板熱壓模封方法之流程
102~108:載板熱壓模封方法之流程之步驟
H1:第一高度
H2:第二高度
P1:載板半成品
P2:載板成品1. 1A, 1B, 1C: Carrier board hot press
圖1為本發明之載板熱壓模封設備之一實施例之架構示意圖。 圖2為本發明之載板輸送裝置之結構示意圖。 圖3至圖7為本發明之載板輸送裝置承接載板半成品並將載板半成品移送至熱壓模封裝置之連續動作示意圖。 圖8為本發明之膠材供給裝置將膠材撒佈於熱壓模封裝置之下模之隔離膜上之結構示意圖。 圖9至圖10為本發明之熱壓模封裝置對載板半成品進行熱壓模封並形成載板成品之連續動作示意圖。 圖11為控制第一承載模組水平移動至熱壓模封裝置內承接載板成品之架構示意圖。 圖12為圖1實施例搭配機械手臂、載板供應裝置、光學檢測裝置、不良載板儲存裝置之架構示意圖。 圖13為圖12實施例搭配載板翻面裝置之架構示意圖。 圖14為圖13實施例具有二熱壓模封裝置與二載板輸送裝置之架構示意圖。 圖15為本發明所提供之載板熱壓模封方法之流程圖。FIG. 1 is a schematic diagram of the structure of an embodiment of the carrier board thermal compression molding equipment of the present invention. Fig. 2 is a schematic diagram of the structure of the carrier conveying device of the present invention. 3 to 7 are schematic diagrams of the continuous action of the carrier board conveying device of the present invention that receives the carrier board semi-finished product and transfers the carrier board semi-finished product to the hot-press mold sealing device. FIG. 8 is a schematic diagram of the structure of the glue supply device of the present invention spreading glue on the isolation film of the lower mold of the hot-compression mold sealing device. 9 to 10 are schematic diagrams of the continuous action of the hot-compression molding-sealing device of the present invention for hot-compression-molding the semi-finished product of the carrier board and forming the finished product of the carrier board. FIG. 11 is a schematic diagram of the structure of controlling the horizontal movement of the first carrier module to receive the finished carrier board in the hot compression molding device. 12 is a schematic diagram of the structure of the embodiment of FIG. 1 with a robotic arm, a carrier supply device, an optical detection device, and a defective carrier storage device. FIG. 13 is a schematic diagram of the structure of the embodiment of FIG. 12 with the carrier flipping device. 14 is a schematic diagram of the structure of the embodiment of FIG. 13 with two hot-press molding sealing devices and two carrier conveying devices. Fig. 15 is a flow chart of the method for thermal compression molding of the carrier board provided by the present invention.
無no
1:載板熱壓模封設備1: Carrier board hot compression molding equipment
10:熱壓模封裝置10: Hot pressing mold sealing device
20:膠材供給裝置20: Adhesive material supply device
30:載板輸送裝置30: Carrier board conveying device
Claims (14)
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US7166796B2 (en) * | 2001-09-06 | 2007-01-23 | Nicolaou Michael C | Method for producing a device for direct thermoelectric energy conversion |
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US9040349B2 (en) * | 2012-11-15 | 2015-05-26 | Amkor Technology, Inc. | Method and system for a semiconductor device package with a die to interposer wafer first bond |
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