The content of the invention
The technical problems to be solved by the invention are to provide a kind of suction film and hot-melting mechanism, and burst feeding is carried out to dielectric film
And hot melt, additionally provide a kind of dielectric film feeding, hot melt and transfer device, it is to avoid repeatedly crawl dielectric film is shifted.
The present invention solves the technical scheme that is used of above-mentioned technical problem:
Film and hot-melting mechanism are inhaled there is provided one kind, for carrying out feeding to dielectric film and heating station by dielectric film and support
Piece is heated, and it includes comprehensive module, and the comprehensive module is moved between dielectric film stockpile and hot melt station, the synthesis
Module includes film adsorption mechanism and hot-melting mechanism, and the film adsorption mechanism includes material fetching mechanism, the burst feeding for dielectric film.
As the improvement of above-mentioned technical proposal, the comprehensive module also includes elevating mechanism, and the elevating mechanism includes watching
Motor and lifting module are taken, the lifting module is used to lift the film adsorption mechanism and hot-melting mechanism.
As the further improvement of above-mentioned technical proposal, the film adsorption mechanism also includes on loading plate, the material fetching mechanism
Feeding sucker group mechanism is provided with, the feeding sucker group mechanism includes some resilient suction cups, and the resilient suction cups are arranged and consolidated
It is scheduled on the loading plate, the loading plate is fixed on the lifting module.
As the further improvement of above-mentioned technical proposal, the film adsorption mechanism also includes probe groups, and the probe groups include
Some probes arranged and be fixed on the loading plate.
As the further improvement of above-mentioned technical proposal, the hot-melting mechanism includes hot melt cylinder, heat melting device and heat melting device
Heat melting device support plate is stretched out or withdrawn by support plate, the hot melt cylinder, and the heat melting device is fixedly installed on the heat melting device support plate.
As the further improvement of above-mentioned technical proposal, the heat melting device includes hot melt head and compression spring, the compression
Both ends of the spring bears against heat melting device support plate and hot melt head.
Film platform, institute are put as the further improvement of above-mentioned technical proposal, in addition to for place dielectric film to be heated
State and put film platform and include being used for placing the film surface of putting of dielectric film, it is described to put arrangement on film surface and be provided with some vacuum holes, it is described true
Emptying aperture is connected with vacuum source.
As the further improvement of above-mentioned technical proposal, described put is additionally provided with reverse mould mechanism on film platform, the reverse mould
Mechanism includes reverse mould block and reverse mould cylinder, and reverse mould block is stretched out or withdrawn by the reverse mould cylinder.
As the further improvement of above-mentioned technical proposal, described put is provided with supporting spring plummer on film platform, set thereon
There is the location structure for positioning supporting spring.
A kind of dielectric film feeding, hot melt and transfer device are additionally provided, it includes supporting spring feed mechanism, the first moving machine
Structure, hot melt microscope carrier, hot melt microscope carrier transfer mechanism, the second travel mechanism and above-mentioned suction film and hot-melting mechanism, the supporting spring feeding
Mechanism is moved by first travel mechanism, and the hot melt microscope carrier is moved by the hot melt microscope carrier transfer mechanism
Dynamic, second travel mechanism is used to move the suction film and hot-melting mechanism.
The beneficial effects of the invention are as follows:
A kind of film and hot-melting mechanism inhaled of the invention is used to be heated dielectric film and supporting spring, and it includes comprehensive module, institute
State comprehensive module and moved between dielectric film stockpile and hot melt station, the comprehensive module includes the suction film for being used to draw dielectric film
Mechanism and the hot-melting mechanism for dielectric film and supporting spring to be heated so that comprehensive module completes dielectric film in one-off
Burst feeding and hot melt, simplify the flow process of dielectric film, film adsorption mechanism is to dielectric film burst feeding, it is to avoid once take
Multiple the problem of;A kind of dielectric film feeding of the present invention, hot melt and transfer device, including supporting spring feed mechanism, the first travel mechanism,
Microscope carrier transfer mechanism, the second travel mechanism, and above-mentioned suction film and hot-melting mechanism are heated, for the feeding of supporting spring and transfer, insulation
The feeding and hot melt of film, the transfer of supporting spring and dielectric film, are heated by putting film platform bearer, it is to avoid repeatedly crawl causes dielectric film
Breakage, wrinkle or turnover, be conducive to being smoothed out for subsequent handling.
Embodiment
The technique effect of the design of the present invention, concrete structure and generation is carried out below with reference to embodiment and accompanying drawing clear
Chu, it is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this hair
Bright a part of embodiment, rather than whole embodiments, based on embodiments of the invention, those skilled in the art is not paying
The other embodiment obtained on the premise of creative work, belongs to the scope of protection of the invention.In addition, being related in patent
All connection/annexations, not singly refer to component and directly connect, and refer to can according to specific implementation situation, by addition or
Couple auxiliary is reduced, to constitute more excellent draw bail.The description of the orientation such as involved upper and lower, left and right is only in the present invention
For the mutual alignment relation of each part of the invention in accompanying drawing.Each technical characteristic in the present invention, not
Can be with combination of interactions on the premise of conflicting conflict.
Fig. 1 inhales film and the structural representation of hot-melting mechanism one embodiment for the present invention, and Fig. 2 inhales film and hot melt for the present invention
The structural representation of embodiment part described in mechanism map 1, please also refer to Fig. 1 and Fig. 2, suction film and hot-melting mechanism are used for will
Dielectric film and supporting spring are heated, and it includes comprehensive module 10 and puts film platform 20, and comprehensive module 10 is in dielectric film stockpile and puts
Moved between film platform 20, the comprehensive module includes film adsorption mechanism 11, hot-melting mechanism 12 and elevating mechanism 13.
Film adsorption mechanism 11 includes being provided with feeding sucker on material fetching mechanism, load carrier and sensors in place, material fetching mechanism
Group mechanism 111 and probe groups 112, load carrier are specially loading plate 113, and loading plate 113 includes obverse and reverse, feeding sucker
Group mechanism 111 includes some resilient suction cups 1110, and probe groups 112 include some probes 1120, resilient suction cups 1110 and probe
1120 in the arrangement of the front of loading plate 113, and is fixedly connected on loading plate, and the loading plate is fixed on elevating mechanism 30.Should
The resilient suction cups are arranged in loading plate front in multiple row, and the probe is arranged in loading plate front in row, and is arranged in suction cup array team
Between.Resilient suction cups include sucker face 1130 and vacuum hole 1140, and resilient suction cups are connected by vacuum hole with vacuum source, inhale
During film, comprehensive module reaches feeding station, drops near above dielectric film stockpile, and the comprehensive module of sensors in place detection declines
When in place, stop declining, the sucker face of sucker group and insulating film surface are reclined and vacuum is opened, now the sucker of resilient suction cups
Face adsorb insulating film surface, the resilient suction cups are made up of elastomeric material, with certain dilatation ability so that sucker face with
When insulating film surface reclines, laminating adjustment is carried out by the flexible change of its own, preferably can be fitted with insulating film surface and not
Damage to insulation film, probe is intervally arranged with sucker, contributes to supports insulative film, it is to avoid the suction of dielectric film vacuum in resilient suction cups
Deflection is excessive and produce the defects such as wrinkle under attached effect, while so that forming similar waveform when dielectric film is drawn so that
Air is got enter between two panels dielectric film, so that smoothly burst, it is to avoid once take the situation of multiple, probe front parcel is soft
Material, prevents Damage to insulation film.
Hot-melting mechanism 12 includes hot melt cylinder 121, heat melting device 122 and heat melting device support plate 123, and hot melt cylinder 121 will be heated
Device support plate 123 is stretched out or withdrawn, and heat melting device 122 is fixedly installed on heat melting device support plate 123.Heat melting device 122 includes hot melt head
1221 and compression spring 1222, compression spring two ends bear against heat melting device support plate 123 and hot melt first 1221.
During hot melt, hot melt cylinder 121 stretches out heat melting device, and the hot melt head of heat melting device is contacted with the corresponding position of dielectric film,
Cylinder is heated after the predetermined time to withdraw, and heat melting device is heated into head and insulation UF membrane, hot melt is completed.
Elevating mechanism 13 includes servomotor 131 and lifting module 132, and lifting module 132 is along perpendicular to putting film platform 20
Direction lifted.Film adsorption mechanism 11 and hot-melting mechanism 12 are installed on lifting module, and lifting module drives film adsorption mechanism
Carry out being also associated with pressing plate 133 on elevating movement, lifting module with hot-melting mechanism, pressing plate 133 passes through elastic device 134 and lifting
Module is attached.
Fig. 3 inhales the structural representation that film platform one embodiment is put in film and hot-melting mechanism for the present invention, with reference to Fig. 3, puts
Film platform 20 includes platform base 24, a pair of plates 21 and a supporting spring plummer 22, and this pair of flat board is positioned on same plane
And it is located at the supporting spring plummer both sides respectively, the upper surface of flat board 21 is used to place dielectric film, if arrangement is provided with dry vacuum thereon
Hole 211, vacuum hole is connected with vacuum source, for being adsorbed dielectric film on the coating platform and preserving tiling, is prevented absolutely
There is the problems such as displacement, turnover in velum.The upper surface of flat board 21 is provided with multiple grooves 212, and groove 212 is arranged in coating in strip
On platform, groove bearing of trend is parallel with the length direction of supporting spring plummer, and vacuum hole 211 is evenly spaced in the groove 212.
It is provided with supporting spring plummer 22 on the locating piece 221 for positioning dielectric film, supporting spring and is correspondingly arranged on positioning knot
The locating piece on location structure and the supporting spring plummer on structure, dielectric film coordinates, can be to being positioned over the insulation put on film platform
Film is positioned.
Reverse mould mechanism 23 is additionally provided with supporting spring plummer 22, it includes reverse mould block 231 and reverse mould cylinder 232, reverse mould vapour
Reverse mould block is stretched out or withdrawn by cylinder.When supporting spring is placed on supporting spring plummer, reverse mould cylinder stretches out reverse mould block, to supporting spring side
It is adjusted along position, so as to carry out secondary positioning to supporting spring.
Fig. 4 is the structural representation of dielectric film feeding of the present invention, hot melt and transfer device one embodiment, and Fig. 5 is this hair
The top view of embodiment described in bright Fig. 4, please also refer to Fig. 4 and Fig. 5, and dielectric film feeding, hot melt and transfer device include:Supporting spring
Feed mechanism 100, the first travel mechanism 200, hot melt microscope carrier and hot melt microscope carrier transfer mechanism 300, the second travel mechanism 400 and suction
Film and hot-melting mechanism 500.In the present embodiment, hot melt microscope carrier be specially to put film platform 20 shown in Fig. 3, for place dielectric film and
Supporting spring, and dielectric film and supporting spring are heated thereon by inhaling film and hot-melting mechanism.
Supporting spring feed mechanism 100 is specially supporting spring feeding manipulator, and the first travel mechanism 200 is used for it by supporting spring feeder
Structure 100 is moved along the first track 001, and supporting spring feed mechanism captures supporting spring and being positioned over from supporting spring stockpile 004 to be put film and put down
On supporting spring plummer 22 on platform 20.Heating microscope carrier transfer mechanism 300 is used to carry hot melt microscope carrier (putting film platform 20) and band
Move it to move along transfer track 003, the second travel mechanism 400 is used to drive the synthesis module 10 inhaled on film and hot-melting mechanism
Moved along the second track 002, after comprehensive module 10 draws dielectric film at dielectric film stockpile 005, the second travel mechanism 400 drives
Comprehensive module is moved to hot melt station along the second track 002.In the present embodiment, transfer track is fixed on mounting platform 006, the
One track 001 is parallel to each other with the second track 002, is placed in transfer track overhead.
Supporting spring feed mechanism 100 includes material taking piece 101, rotating device 102 and lift cylinder 103, during feeding, rotating device
102 can drive material taking piece 101 to rotate, and supporting spring feed mechanism 100 is moved to support by the first travel mechanism 200 along the first track 001
The overhead of piece stockpile 004, lift cylinder declines, and material taking piece 101 is reclined to supporting spring, and material taking piece is drawn after supporting spring, on lift cylinder
Rise, supporting spring feed mechanism 100 is moved to the supporting spring plummer put on film platform by the first travel mechanism 200 along the first track 001
22 overhead, rotating device 102 drives material taking piece 101 to rotate so that the position of supporting spring correspondence supporting spring plummer 22, then lifts vapour
Cylinder 103 declines, material taking piece release supporting spring, cylinder return.
The course of work of dielectric film feeding, hot melt and transfer device:
Supporting spring feeding station:Hot melt microscope carrier transfer mechanism 300 will put film platform 20 and will be moved to along transfer track 003 on supporting spring
Expect station;
Supporting spring feeding:Supporting spring feed mechanism 100 includes material taking piece 101, rotating device 102 and lift cylinder 103, feeding
When, rotating device 102 can drive material taking piece 101 to rotate, and the first travel mechanism 200 is by supporting spring feed mechanism 100 along the first track
001 is moved to the overhead of supporting spring stockpile 004, and lift cylinder declines, material taking piece 101 is reclined to supporting spring, and material taking piece is drawn after supporting spring,
Lift cylinder rises, and supporting spring feed mechanism 100 is moved to and put on film platform by the first travel mechanism 200 along the first track 001
The overhead of supporting spring plummer 22, rotating device 102 drives material taking piece 101 to rotate so that the position of supporting spring correspondence supporting spring plummer 22,
Then lift cylinder 103 declines, material taking piece release supporting spring, cylinder return.
Heat station:The film platform 20 of putting that hot melt microscope carrier transfer mechanism 300 is loaded with supporting spring is moved by supporting spring feeding station along it
Carrier rail road 003 is moved to hot melt station;
Dielectric film feeding:Comprehensive module 10 is moved on dielectric film stockpile 005 by the second travel mechanism 400 along ground hot orbit
Feeding sucker group 11 is declined and make it that resilient suction cups recline with dielectric film by the elevating mechanism 13 on sky, comprehensive module, unlatching bullet
Property the vacuum source that is connected of sucker so that feeding sucker module draws dielectric film burst, the drop feeding sucker of elevating mechanism 13
Module rises, and comprehensive module 10 is moved to hot melt station by the second travel mechanism along the second track 002, and lift cylinder 13 will be comprehensive
The decline of module 10 is put dielectric film and reclined with putting the flat board on film platform 20, now discharges the vacuum of resilient suction cups, and reverse mould cylinder will
Reverse mould block is risen, and adjusts dielectric film edge placement, completes the secondary positioning of dielectric film, and the vacuum that film platform is connected is put in unlatching
Source, then reverse mould cylinder return so that dielectric film is attracted on the flat board for putting film platform.
Dielectric film is heated with supporting spring:After the completion of dielectric film feeding, elevating mechanism is motionless, and hot melt cylinder stretches out heat melting device,
So that hot melt head is fitted with dielectric film so as to which it be heated with supporting spring, after the completion of hot melt, hot melt cylinder rises, on elevating mechanism 13
Rise.
Put film platform return:Feeding robot will heat the dielectric film completed with supporting spring and be taken out from hot melt station, under inflow
Station, hot melt microscope carrier transfer mechanism 300 will put film platform 20 and be moved to supporting spring feeding station along transfer track 003, repeat above-mentioned
Process.
The present embodiment sets two to be nested with film platform transplanting mechanism, and the two be arranged in parallel, the first track and the second track crossings
Two are nested with the transfer track overhead of film platform transplanting mechanism, are not nested with carrying one on film platform transplanting mechanism and are nested with film platform, from
And two supporting spring feeding stations and two hot melt stations are formed, the two alternately operating improves production efficiency.
Presently preferred embodiments of the present invention is above are only, but the present invention is not restricted to the embodiment, is familiar with this area
Technical staff can also make a variety of equivalent variations or replacement on the premise of without prejudice to spirit of the invention, these equivalent deformations
Or replacement is all contained in the application claim limited range.