TWM591700U - Carrier thermocompression mold-sealing apparatus - Google Patents

Abstract

A carrier thermocompression mold-sealing apparatus is disclosed. The carrier thermocompression mold-sealing apparatus includes a thermocompression mold-sealing device, a glue material providing device and a carrier transferring device. Thermocompression mold-sealing device has an upper mold which for carrying a carrier semi-finished product that is provided by the carrier transferring device, and a lower mold which for setting glue material that is provided by the glue material providing device. The upper mold and the lower mold moves relatively for thermocompression bonding the carrier and the glue material to perform a carrier finished product.

Description

Carrier hot-press molding equipment

This creation relates to a carrier board hot press molding equipment, especially a fully automated carrier board hot press molding equipment that executes the carrier board semi-finished product hot press mold sealing process to improve the carrier board finished product productivity and yield.

In terms of carrier board molding technology, especially for large-sized carrier boards, the surface of the large-sized carrier board to which a plurality of integrated circuits have been soldered is covered with resin material, and then the molded carrier board is cut. , So as to form a molded integrated circuit.

Conventional carrier board mold sealing uses manual removal and placement of the carrier board. However, because the carrier board is large in size and very thin and light, it is very difficult to move and align in the mold sealing process, and it takes a lot of time.

In addition, the encapsulated resin is a thermosetting material, which generates a characteristic reaction after being heated. Therefore, the filling process must be completed within a specific time, and the existing cloth adhesive technology has at least two disadvantages. Firstly, the resin is directly coated on the carrier board, and then the carrier board and the resin are heated and encapsulated together. The resin will be heated for too long and uneven, resulting in poor product quality. Secondly, the resin is directly coated into the cavity, because the area of the cloth is large, it takes a long time, and the heating time of the resin is uneven, which affects its fluidity and packaging quality.

According to this, how to have a fully automated "carrier-board hot-pressing and sealing equipment" for carrying out the carrier-board hot-pressing and sealing process to improve the productivity and yield of carrier-board finished products is a subject urgently needed to be solved by those in the relevant technical fields.

In an embodiment, the author proposes a carrier board hot compression molding equipment, including: A hot compression molding sealing device, including: An upper mold for receiving semi-finished products of carrier board to be hot-pressed; The lower mold is used to receive the plastic material, and the lower mold and the upper mold move relative to each other, so that the semi-finished product of the carrier board and the plastic material are bonded to each other to form the finished product of the carrier board; A glue material supply device for setting the glue material in the lower mold; and A carrier board conveying device is used to reciprocally transfer the semi-finished carrier board and the finished carrier board in the hot press mold sealing device.

Please refer to FIG. 1, a carrier plate hot press molding apparatus 1 provided by the author includes a hot press mold sealing device 10, a glue supply device 20 and a carrier plate conveying device 30. The glue material supply device 20 is used to set the glue material in the hot compression molding and sealing device 10, and the carrier board conveying device 30 is used to transfer the semi-finished product of the carrier plate to the hot compression molding and sealing device 10, and then the hot compression molding and sealing device 10 The semi-finished product of the carrier board and the glue material are combined with each other by hot pressing to form the finished product of the carrier board.

For the specific structure and operation method of the hot press mold sealing device 10, the glue material supply device 20, and the carrier board conveying device 30, please refer to the following description.

Please refer to FIG. 2, the carrier board conveying device 30 of the present invention includes a first bearing module 31, a second bearing module 32 and a supporting platform 33. The first bearing module 31 is horizontally movable on the support platform 33. The second bearing module 32 is vertically movable under the supporting platform 33.

The first bearing module 31 includes a first base 311 and a plurality of first bearing units 312. The first base 311 has a plurality of holes 314 vertically penetrating the first base 311. The plurality of first bearing units 312 are disposed on the first base 311. A first adsorption unit 313 is provided on the top of each first carrying unit 312, and the top of the plurality of first adsorption units 313 is located at a first height H1. The first bearing unit 312 and the hole 314 are offset. A slide rail 331 is provided on the support platform 33 to support the horizontal movement of the first bearing module 31.

The second bearing module 32 includes a second base 321 and a plurality of second bearing units 322. Each second carrying unit 322 is disposed on the second base 321 corresponding to the position of each hole 314, and a second adsorption unit 323 is provided on top of each second carrying unit 322. Because the first bearing unit 312 and the hole 314 are misaligned, that is, the second bearing unit 322 and the first bearing unit 312 are misaligned.

The adsorption force provided by the first adsorption unit 313 and the second adsorption unit 323 may include, but is not limited to, for example, vacuum adsorption, airflow negative pressure adsorption, squeeze exhaust negative pressure adsorption, etc., designed according to actual needs , Not limited to this.

As shown in FIG. 3, the second carrier module 32 is controlled to rise and allow the plurality of second carrier units 322 to pass through the corresponding plurality of holes 314 from below the first base 311, so that the plurality of second adsorption units 323 The top is located above the support platform 33 and at a second height H2 to receive and absorb the carrier board semi-finished product P1. The second height H2 is higher than the first height H1.

Referring to FIGS. 4 and 5, the second carrier module 32 receives and adsorbs the semi-finished product P1 of the carrier board and then descends, so that the height of the top of the plurality of second adsorption units 323 is equal to the first height H1, and the The suction force is released, and the semi-finished product P1 of the carrier board is transferred to be received and adsorbed by the plurality of first adsorption units 313, and then the second carrier module 32 is controlled to descend.

Please refer to FIG. 6, the hot press mold sealing device 10 includes an upper mold 11 and a lower mold 12. The surface of the upper mold 11 facing the lower mold 12 has an adsorption force and can be used to adsorb the semi-finished product P1 of the carrier board. The upper mold 11 is provided with a heating module 111, which can be used to heat the received semi-finished product P1 of the carrier board.

The adsorption force provided by the upper mold 11 may include, but is not limited to, for example, vacuum adsorption, airflow negative pressure adsorption, squeeze exhaust negative pressure adsorption, etc., which is designed according to actual needs and is not limited thereto.

The lower mold 12 is used to receive the adhesive material (not shown in the figure). The hot-press mold sealing device 10 includes an isolation film conveying module 13 to provide the isolation film 131 to cover the surface of the lower mold 12 facing the upper mold 11. The material is provided on the surface of the separation film 131 facing the upper mold 11.

After receiving the semi-finished product P1 of the carrier board, the first adsorption unit 313 controls the horizontal movement of the first carrier module 31 to be extended by the carrier board conveying device 30 to place the semi-finished product P1 of the carrier board into the upper mold 11 and the lower part of the hot-press mold sealing device 10 Between the dies 12, the first suction unit 313 is then raised to make the carrier plate semi-finished product P1 and the bottom surface of the upper mold 11 stick together. Since the bottom surface of the upper mold 11 has a suction force, the carrier plate semi-finished product P1 can be adsorbed on the upper mold 11 The heating module 111 heats the received semi-finished product P1 of the carrier board.

Referring to FIG. 7, after the semi-finished product P1 of the carrier board is adsorbed on the bottom surface of the upper mold 11, the first carrier module 31 is controlled to move horizontally and retract into the carrier board conveying device 30. The carrier board conveying device 30 returns to the state shown in FIG. 2.

Please refer to FIG. 8, the glue material supply device 20 is used to set the glue material on the lower mold 12. The glue material supply device 20 mainly includes a glue supply unit 21 and a glue carrier unit 22. The glue supply unit 21 contains glue material for spreading on the glue carrier unit 22, and then controls the glue carrier unit 22 to move between the upper mold 11 and the lower mold 12 of the hot press mold sealing device 10, and then controls the glue carrier The unit 22 spreads the glue material on the surface of the isolation film 131 facing the upper mold 11. During the above-mentioned glue spreading process, the heating module 111 can continue to heat the received carrier board semi-finished product P1.

For the detailed structure of the rubber material supply device 20 of this creation, please refer to the applicant's application for a patent for inventions of the Republic of China on December 19, 106, the application number is 106144643, and the name of the invention is "cloth glue device and method" , And was approved for announcement on August 11, 108, Republic of China. The announcement number is I668770.

Please refer to FIG. 8 to FIG. 10, when the glue application is completed, the glue carrier unit 22 is controlled to exit between the upper mold 11 and the lower mold 12, and then, the relative movement of the lower mold 12 and the upper mold 11 is controlled to be close to each other to make the load The board semi-finished product P1 and the glue material are combined with each other by heat and pressure to form a carrier board finished product P2. Then, the relative movement of the lower mold 12 and the upper mold 11 is controlled to be separated from each other. As shown in FIG. 10, the finished carrier board P2 is adsorbed on the bottom surface of the upper mold 11.

As shown in FIG. 11, the first carrier module 31 is controlled to move horizontally from the carrier board conveying device 30 into the hot-press mold sealing device 10, and the first suction unit 313 is controlled to move up and contact and adsorb the finished carrier board P2. Then, the suction force of the upper mold 11 is controlled to be released, so that the finished carrier board P2 is separated from the upper mold 11, the first suction unit 313 sucks the finished carrier board P2 and descends, and the first carrier module 31 moves horizontally back to the carrier board conveying device 30. Then reverse the previous action of accepting the semi-finished carrier board (shown in Figures 3 to 5), and place the finished carrier board P2 to the position where the semi-finished carrier board P1 was originally placed as shown in Figure 3, then you can use the robotic arm Or other objects accept the finished carrier board P2 and move it to the area where the finished carrier board P2 can be stored.

Please refer to FIG. 12, the carrier board hot compression molding and sealing device 1A of this embodiment includes a hot compression molding and sealing device 10, a glue supply device 20 and a carrier board conveying device 30, and is further equipped with a robot arm 40 , Carrier board supply device 50, optical detection device 60, defective carrier board storage device 70 and finished product storage device 80.

The carrier board supply device 50 is used to store the carrier board semi-finished products, and the robot board 40 takes out the carrier board semi-finished products from the carrier board supply device 50 and transfers them to the carrier board conveying device 30, and then the hot press mold shown in FIGS. 2 to 10 can be performed After the sealing process, the finished product P2 of the carrier board shown in FIG. 11 is formed, and then the finished product P2 of the carrier board is transferred to the finished product storage device 80 by the robot arm 40.

For the detailed structure of the carrier board supply device 50 of this creation, please refer to the applicant’s application for a patent for inventions of the Republic of China on June 29, 107, the application number is 107122535, and the name of the invention is "storage box with alignment effect" "The announcement was approved on February 21, 108, Republic of China. The announcement number was I651253.

The optical detection device 60 is provided in the path where the carrier board semi-finished product is transferred to the carrier board conveying device 30. After the robotic arm 40 takes out the semi-finished product of the carrier board from the carrier board supply device 50, the semi-finished product of the carrier board is first detected by the optical detection device 60, and the semi-finished product of the carrier board detected as good is sent to the carrier board conveying device 30 to detect the defective carrier board The semi-finished products are sent to the defective carrier storage device 70 for storage.

Regarding the mechanical arm 40, a mechanical arm with double grippers (for example, a mechanical arm provided with two upper and lower grippers) can be used. After the finished product is taken out from the carrier board conveying device 30, another hand can continue to put the carrier board semi-finished product into the carrier board conveying device 30, and put the finished hot-pressed carrier board product into the finished product storage device 80 to improve production benefit.

The optical detection device 60 can also be disposed in the path where the finished product of the carrier board is transferred to the finished product storage device 80. After the robot arm 40 takes out the finished product of the carrier board from the carrier board conveying device 30, the finished product of the carrier board is first detected by the optical detection device 60 The finished product of the carrier board detected as good is sent into the finished product storage device 80, and the finished product of the carrier board detected as defective is sent to the defective carrier board storage device 70 for storage.

Please refer to FIG. 13, the carrier board hot press molding equipment 1B of this embodiment includes a hot press mold sealing device 10, a glue supply device 20, a carrier board conveying device 30, a robot arm 40, a carrier board supply device 50, an optical The detection device 60, the defective carrier storage device 70, the finished product storage device 80, and the carrier flip device 90.

The functions of the hot press mold sealing device 10, the glue supply device 20, the carrier board conveying device 30, the robot arm 40, the carrier board supply device 50, the optical detection device 60, the defective carrier board storage device 70, and the finished product storage device 80 are shown in FIG. 12 The embodiment is the same. The function of the carrier board turning device 90 is to invert the carrier board semi-finished product or the carrier board finished product for the optical inspection device 60 to detect both sides of the carrier board semi-finished product or the carrier board finished product or for the hot compression molding sealing device 10 to perform hot compression molding seal.

Please refer to FIG. 14, the carrier plate hot press molding equipment 1C of this embodiment includes two hot press mold sealing devices 10A, 10B, a glue supply device 20, two carrier plate conveying devices 30A, 30B, and a robot arm 40 1. A carrier board supply device 50, an optical detection device 60, a defective carrier board storage device 70, a finished product storage device 80, and a carrier board turning device 90.

The difference between this embodiment and the embodiment of FIG. 13 is that this embodiment has two hot-press molding devices 10A, 10B and two carrier board conveying devices 30A, 30B. The robot arm 40 sends the semi-finished carrier board to the carrier board conveying device 30A, After 30B, each carrier board conveying device 30A, 30B then transfers the carrier board semi-finished product to the corresponding hot press mold sealing device 10A, 10B, thereby increasing productivity.

After the robotic arm 40 takes out the semi-finished product of the carrier board from the carrier board supply device 50, the semi-finished product of the carrier board is first detected by the optical detection device 60, and the semi-finished product of the carrier board detected as a good product is sent to the carrier board conveying devices 30A, 30B to detect the defective The semi-finished carrier board is sent to the defective carrier board storage device 70 for storage.

Regarding the mechanical arm 40, a mechanical arm with dual grippers may be used. When one of the grippers takes out the finished product of the carrier board that has been hot-pressed and sealed in the hot-pressing and sealing device 10 from the carrier-board conveying device 30, the other It is possible to put the semi-finished product of the carrier board into the carrier board conveying device 30, and put the finished product of the hot-press molding into the finished product storage device 80 to improve the production efficiency.

The optical detection device 60 may also be disposed in the path where the finished product of the carrier board is transferred to the finished product storage device 80. After the robot arm 40 takes out the finished product of the carrier board from the carrier board conveying devices 30A, 30B, the finished product of the carrier board is first detected by the optical detection device 60 The inspection is carried out, and the finished product of the carrier board detected as good is sent to the finished product storage device 80, and the finished product of the carrier board detected with defects is sent to the defective carrier board storage device 70 for storage.

In this embodiment, only one glue material supply device 20 is provided, and in the process of transferring the carrier board semi-finished products to the corresponding hot compression molding devices 10A, 10B in the carrier board conveying devices 30A, 30B, the glue material supply device 20 The glue material is spread on the lower mold of the hot-press mold sealing device 10 one by one. Then, the hot press mold sealing devices 10A and 10B can perform hot press mold sealing on the semi-finished product of the carrier board simultaneously or separately. Finally, the mechanical arm 40 puts the finished products of the hot-pressed molding into the finished product storage device 80 one by one.

Based on the architecture of the embodiment shown in FIG. 14, the number of carrier board conveying devices and hot compression molding sealing devices, or the number of glue supply devices can be increased as needed, not limited to the illustrated architecture.

It must be noted that, in the architecture of the two embodiments shown in FIGS. 13 and 14, the optical detection device 60 and the carrier flip device 90 are respectively disposed on opposite sides of the movement path of the robot arm 40, but in addition, The optical detection device 60 and the carrier turning device 90 are disposed on the same side of the movement path of the robot arm 40. In other words, the installation positions of the optical detection device 60 and the carrier flip device 90 are not limited, depending on the actual requirements and the actual environmental space.

Referring to FIG. 15, according to the process flow 100 of the method for hot-pressing and sealing of a carrier-board hot-pressing and sealing device provided by this creation, the steps include: Step 102: Use a hot press mold sealing device 10 to carry the upper mold 11 to receive the semi-finished product P1 of the carrier board to be hot press molded (see Figure 7 for its appearance); Step 104: Use an adhesive material supply device 20 to set the adhesive material under the mold 12 of the hot-press mold sealing device 10 (see FIG. 8 for its appearance); Step 106: The lower mold 12 and the upper mold 11 move relative to each other, so that the carrier board semi-finished product P1 and the adhesive material are bonded to each other to form the carrier board finished product P2 (for the appearance, please refer to FIGS. 9-10); and Step 108: A carrier board conveying device 30 is used to reciprocate the carrier board semi-finished product P1 and the carrier board finished product P2 in the hot press mold sealing device 10 (see Figure 1, Figure 6, and Figure 11 for their appearance).

In summary, the carrier plate hot compression molding sealing equipment provided by this creation automatically feeds the semi-finished carrier plate into the upper mold of the hot compression molding sealing device by the carrier conveying device, and the adhesive material is supplied by the adhesive material supply device Automatically spread the mold under the hot press mold sealing device, so it can achieve the purpose of fully automated execution of the hot press mold sealing process of the carrier board, greatly reducing the manufacturing time. If it is supplemented by a mechanical arm, the carrier board is taken out of the storage box with the alignment function and automatically placed into the carrier board conveying device, and the robot arm automatically transfers the finished product of the hot-pressed sealing carrier board to the finished product placement area. Or, if the robotic arm has a double-layer pick, one of the picks can be used to pick and place the semi-finished product of the carrier board, and the other pick can pick and place the finished product of the carrier board at the same time, which can greatly improve the production efficiency; and, by optical inspection The device automatically detects the semi-finished product of the carrier board, which can avoid the misplacement of the semi-finished product of the carrier board and calculate the required amount of glue, which can speed up the manufacturing process, increase the production capacity, and improve the yield rate of the finished product of the carrier board.

Although this creation has been disclosed above with examples, it is not intended to limit this creation. Anyone who has ordinary knowledge in the technical field of the subject can make some changes and retouching without departing from the spirit and scope of this creation. The scope of protection of this creation shall be subject to the scope defined in the appended patent application.

1. 1A, 1B, 1C: Carrier board hot compression molding equipment 10, 10A, 10B: hot compression molding sealing device 11: Upper die 111: heating module 12: Lower die 13: isolation film delivery module 131: Isolation membrane 20: glue material supply device 21: glue supply unit 22: Glue unit 30, 30A, 30B: Carrier conveyor 31: The first bearing module 311: The first pedestal 312: The first bearing unit 313: The first adsorption unit 314: Hole 32: The second bearing module 321: Second base 322: second bearing unit 323: Second adsorption unit 33: Support platform 331: Slide rail 40: Robotic arm 50: Carrier supply device 60: Optical detection device 70: bad carrier storage device 80: Finished product storage device 90: Carrier turning device 100: Process of hot-press molding method of carrier board 102~108: Steps of the process of hot-press molding method of carrier board H1: first height H2: second height P1: Carrier board semi-finished product P2: Carrier board finished

FIG. 1 is a schematic structural diagram of an embodiment of a creative hot-press molding equipment for a carrier board. Figure 2 is a schematic diagram of the structure of the creative board conveying device. Figures 3 to 7 are schematic diagrams of the continuous operation of the carrier board conveying device of the creation to take the carrier board semi-finished product and transfer the carrier board semi-finished product to the hot compression molding sealing device. FIG. 8 is a schematic structural view of the adhesive material supply device created by the invention in which the adhesive material is spread on the isolating film of the lower mold of the hot compression molding device. 9 to 10 are schematic diagrams of the continuous action of the thermal compression molding device of the present invention for thermal compression molding of the semi-finished carrier board and forming the finished carrier board. FIG. 11 is a schematic diagram of the structure for controlling the horizontal movement of the first carrier module into the hot-press molding device to receive the finished carrier board. FIG. 12 is a schematic structural diagram of the embodiment of FIG. 1 with a robot arm, a carrier supply device, an optical detection device, and a defective carrier storage device. FIG. 13 is a schematic diagram of the structure of the embodiment of FIG. 12 with a carrier flip device. FIG. 14 is a schematic diagram of the structure of the embodiment of FIG. 13 with two hot compression molding sealing devices and two carrier board conveying devices. 15 is a flowchart of a method for hot-pressing and molding a carrier-board hot-pressing and sealing device provided by the author.

1: Carrier board hot press molding equipment

10: Hot press mold sealing device

20: glue material supply device

30: Carrier conveyor

Claims (13)

A carrier board hot press molding sealing equipment, including: A hot compression molding sealing device, including: An upper mold for receiving semi-finished products of carrier board to be hot-pressed; The lower mold is used to receive the plastic material, the lower mold and the upper mold move relative to each other, so that the semi-finished product of the carrier board and the plastic material are combined with each other by hot pressing to form the finished product of the carrier board; A glue material supply device for setting the glue material on the lower mold; and A carrier board conveying device is used to reciprocally transfer the semi-finished product of the carrier board and the finished product of the carrier board in the hot compression molding sealing device. The carrier plate hot compression molding sealing device as described in item 1 of the patent application scope, wherein the carrier plate conveying device includes: A supporting platform; A first bearing module is horizontally movable on the supporting platform. The first bearing module includes: A first base having a plurality of holes vertically penetrating the first base; A plurality of first bearing units are disposed on the first base, a first adsorption unit is provided on the top of each first bearing unit, the top of the plurality of first adsorption units is located at a first height, and the plurality of first bearing units The unit and the plural holes are misaligned; A second bearing module is vertically movable under the supporting platform. The second bearing module includes: A second base; A plurality of second bearing units are arranged on the second base, and a second adsorption unit is arranged on the top of each second bearing unit; Controlling the second carrier module to rise, so that the plurality of second adsorption units are located above the support platform and at a second height to receive and adsorb the semi-finished product of the carrier board, the second height is higher than the first height; controlling the The second carrier module is lowered so that the height of the plurality of second adsorption units is equal to the first height, and the semi-finished product of the carrier board is transferred to be accepted and adsorbed by the plurality of first adsorption units, and then the second carrier module is controlled to descend and then The horizontal movement of the first carrier module is controlled to transfer the semi-finished product of the carrier board to the hot press mold sealing device. The hot press molding equipment for carrier board as described in item 2 of the patent application scope, wherein the first base has a plurality of holes vertically penetrating the first base, and each of the second bearing units corresponds to each of the holes The position is set on the second base; the second carrier module is controlled to rise and the plurality of second carrier units are penetrated through the corresponding plurality of holes from the direction below the first base, so that the plurality of second The adsorption unit is located above the support platform and at the second height to receive the carrier board semi-finished product. The carrier hot-press molding equipment as described in item 1 of the patent application scope, wherein the hot-press molding equipment further includes an isolation film conveying module for providing an isolation film covering the surface of the lower mold facing the upper mold The glue material is disposed on the surface of the isolation film facing the upper mold. The carrier plate hot press mold sealing device as described in item 1 of the patent application scope, wherein the upper mold is provided with a heating module for heating the carrier plate semi-finished product. The hot-plate molding equipment for carrier plates as described in item 1 of the patent application scope further includes a mechanical arm for transferring the semi-finished products of the hot-plate molding plates to the carrier plate conveying device, and The carrier board finished product is transferred to a carrier board finished product storage device. As described in item 6 of the patent application scope, the carrier board hot-press molding equipment further includes a carrier board supply device for storing the carrier board semi-finished product, and the robot arm uses the carrier board semi-finished product from the carrier board supply device Take out and transfer to the carrier conveyor. The hot-press molding equipment for carrier board as described in item 6 of the patent application scope further includes an optical detection device which is disposed on the carrier board semi-finished product is transferred to the carrier board conveying device or the carrier board finished product is transferred to the In the path of the carrier board finished product storage device, it is used to inspect the carrier board semi-finished product or the carrier board finished product. The hot-press molding equipment for carrier board as described in item 8 of the patent application scope further includes a defective carrier board storage device for storing the semi-finished carrier board product or the finished carrier board product with defects after being detected by the optical inspection device . As described in item 8 of the patent application scope, the carrier board hot compression molding sealing device further includes a carrier board turning device for turning the carrier board semi-finished product or the carrier board finished product for inspection by the optical inspection device The semi-finished product of the carrier board or the two sides of the finished product of the carrier board may be used for hot-press molding by the hot-press molding device. As described in item 6 of the patent application scope, the carrier board hot compression molding sealing device, wherein the robot arm is a robot arm with a double-layer pick. The carrier plate hot compression molding sealing device as described in item 1 of the patent application scope, wherein the surface of the upper mold facing the lower mold has an adsorption force for adsorbing the semi-finished product of the carrier plate. The hot press molding equipment for carrier plates as described in item 1 of the patent application scope further includes at least one more hot press molding device and another at least one carrier plate conveying device, each of the carrier plate conveying devices The semi-finished product of the board and the finished product of the carrier board are reciprocally transferred in the corresponding hot compression molding sealing device.

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