TW202118988A - Remote heat exchanging module and composite thin-layered heat conduction structure - Google Patents

Remote heat exchanging module and composite thin-layered heat conduction structure Download PDF

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TW202118988A
TW202118988A TW108139792A TW108139792A TW202118988A TW 202118988 A TW202118988 A TW 202118988A TW 108139792 A TW108139792 A TW 108139792A TW 108139792 A TW108139792 A TW 108139792A TW 202118988 A TW202118988 A TW 202118988A
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heat
metal layer
exchange module
layer
conducting element
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TW108139792A
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TWI745774B (en
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林光華
廖文能
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宏碁股份有限公司
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Priority to CN202010102919.7A priority patent/CN112788916B/en
Priority to US17/082,040 priority patent/US20210136949A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
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    • B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
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    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
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    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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    • B32B7/08—Interconnection of layers by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
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    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
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    • B32—LAYERED PRODUCTS
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    • B32B2457/00—Electrical equipment

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
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Abstract

A remote heat exchanging module used for heat dissipation of a heat source is provided. The remote heat exchanging module includes a first heat transferring member, a second heat transferring member, and a heat dissipation member. The first heat transferring member includes a first metallic layer, a second metallic layer, and a graphene layer located therebetween, wherein the first metallic layer is in thermal contact with the heat source. The second metallic layer has a first end and a second end opposite to each other, the first end is in thermal contact with the second metallic layer, and the second end is in thermal contact with the heat dissipation member. A heat generated by the heat source is transferred to the second end via the first heat transfer member and the first end sequentially, and is dissipated by the heat dissipation member. A composite thin-layered heat conduction structure is also provided.

Description

分離式熱交換模組與複合式薄層導熱結構Separate heat exchange module and composite thin-layer heat conduction structure

本發明是有關於一種散熱模組與導熱結構，且特別是有關於一種分離式熱交換模組與複合式薄層導熱結構。The invention relates to a heat dissipation module and a heat conduction structure, and more particularly to a separate heat exchange module and a composite thin-layer heat conduction structure.

目前各種電子裝置例如可攜式電腦、平板電腦、智慧手機、導航器等設備功能越來越強大，運算速度越來越快，尺寸越來越小，造成電子設備的發熱量越來越大或發熱點越來越集中。因此，為了讓電子裝置維持良好的運作效能，對其進行散熱設計更顯重要。At present, various electronic devices such as portable computers, tablet computers, smart phones, navigators and other devices are becoming more and more powerful, computing speeds are getting faster, and their sizes are getting smaller and smaller, causing electronic devices to generate more heat or The hot spots are becoming more and more concentrated. Therefore, in order for the electronic device to maintain good operating performance, it is more important to conduct a heat dissipation design.

一般而言，各種散熱材料被廣泛使用於這些電子裝置中，而不同類型的散熱材料會有不同的性能。例如金屬材料如銅、鋁、銀等由於導熱性良好普遍被應用，且被製成相關散熱元件。此外，還能利用石墨烯材料作為導熱介質，然而受限於石墨烯材料的機械性質，其結構較脆且不具延展性，因而難以對其進行後加工，也不易與電子裝置內常見的散熱元件進行結合。Generally speaking, various heat dissipation materials are widely used in these electronic devices, and different types of heat dissipation materials have different performances. For example, metal materials such as copper, aluminum, and silver are widely used due to their good thermal conductivity and are made into related heat dissipation elements. In addition, graphene materials can also be used as a heat transfer medium. However, due to the mechanical properties of graphene materials, its structure is relatively brittle and not malleable, so it is difficult to post-process it, and it is not easy to interact with common heat dissipation components in electronic devices. Combine.

據此，如何提供能讓石墨烯材料與其他散熱元件順利結合的機制，便成為本領域的相關技術人員所需思考解決的課題。Accordingly, how to provide a mechanism that allows the graphene material to be smoothly combined with other heat dissipation elements has become a problem for those skilled in the art to think about and solve.

本發明提供一種分離式熱交換模組與複合式薄層導熱結構，其中以金屬層包覆石墨烯層而形成的導熱件或薄層導熱結構，兼具提高散熱效率以及適於加工、結合的機構特性。The present invention provides a separate heat exchange module and a composite thin-layer heat-conducting structure, in which a heat-conducting piece or a thin-layer heat-conducting structure formed by covering a graphene layer with a metal layer has the advantages of improving heat dissipation efficiency and being suitable for processing and combining Institutional characteristics.

本發明的分離式熱交換模組，用以對熱源散熱。分離式熱交換模組包括第一導熱件、第二導熱件以及散熱件。第一導熱件包括第一金屬層、第二金屬層與石墨烯層，其中石墨烯層位於第一金屬層與第二金屬層之間，第一金屬層熱接觸於熱源。第二導熱件具有相對的第一端與第二端，第一端熱接觸第二金屬層。散熱件熱接觸於第二端。熱源所產生的熱，依序經由第一導熱件與第二導熱件的第一端而被傳送至第二端，且藉由散熱件而散逸出分離式熱交換模組。The separated heat exchange module of the present invention is used to dissipate heat from the heat source. The separate heat exchange module includes a first heat-conducting element, a second heat-conducting element, and a heat-dissipating element. The first heat conducting member includes a first metal layer, a second metal layer, and a graphene layer, wherein the graphene layer is located between the first metal layer and the second metal layer, and the first metal layer is in thermal contact with the heat source. The second heat conducting member has a first end and a second end opposite to each other, and the first end is in thermal contact with the second metal layer. The heat sink is in thermal contact with the second end. The heat generated by the heat source is transferred to the second end through the first end of the first heat-conducting element and the second heat-conducting element in sequence, and is dissipated out of the separate heat exchange module by the heat dissipation element.

本發明的複合式薄層導熱結構，包括彼此無縫依附的第一金屬層、石墨烯層以及第二金屬層，其中石墨烯層被包覆於第一金屬層與第二金屬層之間。熱源適於熱接觸第一金屬層，以使熱源所產生的熱量依序經由第一金屬層、石墨烯層而傳送至第二金屬層。The composite thin-layer heat-conducting structure of the present invention includes a first metal layer, a graphene layer, and a second metal layer that are seamlessly attached to each other, wherein the graphene layer is coated between the first metal layer and the second metal layer. The heat source is suitable for thermally contacting the first metal layer, so that the heat generated by the heat source is sequentially transferred to the second metal layer through the first metal layer and the graphene layer.

基於上述，複合式薄層導熱結構與具備其的分離式熱交換模組除適用於輕薄短小的可攜式電子裝置中，其更藉由第一導熱件是由第一金屬層、石墨烯層與第二金屬層所構成的複合式薄層導熱結構，而在利用石墨烯層的高導熱特性之外，尚以披覆在外的金屬層提供保護效果，同時藉由金屬層的延展特性，而讓第一導熱件能輕易地接受後加工與組裝製程，且避免石墨烯層因受外力而容易損毀的可能性。Based on the above, the composite thin-layer heat-conducting structure and the separate heat-exchange module provided with it are not only suitable for light, thin, short and small portable electronic devices, but also because the first heat-conducting member is made of a first metal layer and a graphene layer The composite thin-layer heat-conducting structure formed with the second metal layer. In addition to using the high thermal conductivity of the graphene layer, the metal layer coated on the outside provides a protective effect. At the same time, due to the ductility of the metal layer, The first heat-conducting member can easily accept post-processing and assembly processes, and avoid the possibility that the graphene layer is easily damaged due to external forces.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

圖1是依據本發明一實施例的分離式熱交換模組的示意圖，其以側視視角提供本實施例相關構件的簡單示意。請參考圖1，在本實施例中，分離式熱交換模組100用以對熱源200進行散熱。分離式熱交換模組100包括第一導熱件110、第二導熱件120以及散熱件130，其中第一導熱件110熱接觸熱源200，第二導熱件120熱接觸於第一導熱件110與散熱件130之間。熱源200所產生的熱依序傳送至第一導熱件110與第二導熱件120後，藉由散熱件130對其進行散逸，而得以從分離式熱交換模組100被排出。正因受限於可攜式電子裝置的有限內部空間，因此需藉由熱交換的方式來解決系統散熱問題，同時也能讓可攜式電子裝置因應用所述分離式熱交換模組100而得以具備輕薄短小的外觀特性。FIG. 1 is a schematic diagram of a separate heat exchange module according to an embodiment of the present invention, which provides a simple illustration of related components of this embodiment from a side view. Please refer to FIG. 1, in this embodiment, the separated heat exchange module 100 is used to dissipate heat from the heat source 200. The separate heat exchange module 100 includes a first heat-conducting element 110, a second heat-conducting element 120, and a heat-dissipating element 130. The first heat-conducting element 110 is in thermal contact with the heat source 200, and the second heat-conducting element 120 is in thermal contact with the first heat-conducting element 110 and dissipates heat. Between pieces of 130. After the heat generated by the heat source 200 is sequentially transferred to the first heat-conducting member 110 and the second heat-conducting member 120, the heat is dissipated by the heat dissipation member 130, and is then discharged from the separate heat exchange module 100. Due to the limited internal space of the portable electronic device, it is necessary to use heat exchange to solve the heat dissipation problem of the system. At the same time, the portable electronic device can also be used with the separate heat exchange module 100. It can have the appearance characteristics of light, thin and short.

圖2是圖1的第一導熱件的爆炸圖。請同時參考圖1與圖2，詳細來說，本實施例的熱源200包括封裝於電路板220上的電子晶片210，其中電子晶片210例如是中央處理晶片（CPU）或顯示晶片（GPU）。本實施例的第一導熱件110包括第一金屬層113、第二金屬層112與石墨烯層111，其中石墨烯層111位於第一金屬層113與第二金屬層112之間。在此，第一金屬層113具有容置空間，以作為收容石墨烯層111之用，且也用以與第二金屬層112相互結合，而達到讓第一金屬層113、第二金屬層112與其中的石墨烯層111彼此無縫依附的狀態。在本實施例中，上述三者可藉由黏著方式完成結合，但不因此限制結合手段。Fig. 2 is an exploded view of the first heat conducting member of Fig. 1. Please refer to FIGS. 1 and 2 at the same time. In detail, the heat source 200 of this embodiment includes an electronic chip 210 packaged on a circuit board 220, where the electronic chip 210 is, for example, a central processing chip (CPU) or a display chip (GPU). The first heat conducting member 110 of this embodiment includes a first metal layer 113, a second metal layer 112, and a graphene layer 111, where the graphene layer 111 is located between the first metal layer 113 and the second metal layer 112. Here, the first metal layer 113 has an accommodating space for accommodating the graphene layer 111, and is also used to combine with the second metal layer 112 to allow the first metal layer 113 and the second metal layer 112 to be combined with each other. And the graphene layer 111 seamlessly attached to each other. In this embodiment, the above three can be combined by adhesion, but the bonding method is not limited thereby.

如此一來，第一金屬層113熱接觸於熱源200。第二導熱件120具有相對的第一端E1與第二端E2，其中第一端E1熱接觸第二金屬層112。散熱件130，例如是散熱鰭片，其熱接觸於第二端E2。據此，熱源200所產生的熱，將依序經由第一導熱件110與第二導熱件120的第一端E1而被傳送至第二端E2，且藉由散熱件130的熱對流效應而散逸出分離式熱交換模組100。In this way, the first metal layer 113 is in thermal contact with the heat source 200. The second heat conducting member 120 has a first end E1 and a second end E2 opposite to each other, wherein the first end E1 is in thermal contact with the second metal layer 112. The heat dissipation element 130 is, for example, a heat dissipation fin, which is in thermal contact with the second end E2. Accordingly, the heat generated by the heat source 200 will be transferred to the second end E2 through the first end E1 of the first heat conducting member 110 and the second heat conducting member 120 in sequence, and is caused by the thermal convection effect of the heat sink 130 The separated heat exchange module 100 escapes.

還需說明的是，經上述手段結合完成的第一導熱件110，其同時具備高導熱率的石墨烯層111（熱導率大於1000W/mK），也能因披覆在外的第一金屬層113、第二金屬層112而使其容易被加工。也就是說，為提高第一導熱件110與熱源200的熱接觸（及傳導）效率，本實施例的分離式熱交換模組100還包括銲接材150（soldering material）與導熱材140（熱介面材料，thermal interface material），以讓第一導熱件110能與熱源200、第二導熱件120順利結合而不因此降低其熱傳送效率。It should also be noted that the first thermal conductive member 110 completed by the above-mentioned means has a high thermal conductivity graphene layer 111 (thermal conductivity greater than 1000W/mK), which can also be covered by the first metal layer 113. The second metal layer 112 makes it easy to process. That is to say, in order to improve the thermal contact (and conduction) efficiency between the first heat conducting element 110 and the heat source 200, the separated heat exchange module 100 of this embodiment further includes a soldering material 150 (soldering material) and a heat conducting material 140 (thermal interface). Material, thermal interface material), so that the first heat-conducting member 110 can be smoothly combined with the heat source 200 and the second heat-conducting member 120 without reducing the heat transfer efficiency thereof.

在本實施例中，導熱材140，例如是散熱膏（thermal grease）、導熱膠（thermal conductive adhesive）、熱填隙材料（thermal gap filler）、導熱墊（thermally conductive pad）、導熱膠帶（thermal tap）或相變化材料（phase change material）、相變化合金（phase change metal alloy）等，其配置在熱源200的電子晶片210與第一金屬層113之間，用以降低構件間的接觸熱阻。再者，凡是構件的表面都會存在粗糙度，所以當兩個構件的表面接觸在一起的時候，不可能完全接觸在一起，總會有一些空氣隙夾雜在其中，而空氣的導熱係數非常小，因此就造成在熱源200的電子晶片210與第一金屬層113之間形成較大的接觸熱阻。因此，導熱材140的使用就可以填充所述空氣隙，以降低接觸熱阻並提高散熱性能。In this embodiment, the thermal conductive material 140 is, for example, thermal grease, thermal conductive adhesive, thermal gap filler, thermally conductive pad, and thermal tap ) Or phase change material (phase change material), phase change metal alloy (phase change metal alloy), etc., which are arranged between the electronic chip 210 of the heat source 200 and the first metal layer 113 to reduce the contact thermal resistance between the components. Moreover, the surface of all components will have roughness, so when the surfaces of two components are in contact with each other, it is impossible to completely touch each other. There will always be some air gaps in it, and the thermal conductivity of air is very small. Therefore, a relatively large contact thermal resistance is formed between the electronic chip 210 of the heat source 200 and the first metal layer 113. Therefore, the use of the thermal conductive material 140 can fill the air gap, so as to reduce the contact thermal resistance and improve the heat dissipation performance.

此外，正由於第二金屬層112已披覆在石墨烯層111之外，因此第二導熱件120的第一端E1便能輕易地與第二金屬層112以銲接材150（藉由銲接手段）而完成結合，同時也因銲接材150具有較佳熱導特性，且能無縫地配置在第二金屬層112與第二導熱件120之間，故仍能維持第二導熱件120與第二金屬層112之間的低接觸熱阻狀態。In addition, just because the second metal layer 112 has been coated on the outside of the graphene layer 111, the first end E1 of the second heat-conducting member 120 can easily be welded to the second metal layer 112 with the welding material 150 (by welding means ) To complete the combination. At the same time, because the welding material 150 has better thermal conductivity and can be seamlessly arranged between the second metal layer 112 and the second heat-conducting element 120, the second heat-conducting element 120 and the second heat-conducting element 120 can still be maintained The low contact thermal resistance state between the two metal layers 112.

還需提及的是，本實施例的第一導熱件110中，由於石墨烯層111的密度為2.2g/cm3 ，因此相較於現有技術以金屬製作的散熱元件，石墨烯層111實質上輕於金屬，故而有助於降低第一導熱件110的整體重量，而使本實施例的分離式熱交換模組100更適於應用在輕薄短小的可攜式電子裝置中。It should also be mentioned that in the first heat conducting member 110 of this embodiment, since the density of the graphene layer 111 is 2.2 g/cm 3 , compared with the heat dissipation element made of metal in the prior art, the graphene layer 111 is substantially The top is lighter than metal, so it helps to reduce the overall weight of the first heat-conducting element 110, so that the separated heat exchange module 100 of this embodiment is more suitable for being used in light, thin, short and small portable electronic devices.

圖3繪示另一實施例的分離式熱交換模組的局部剖視圖。請參考圖3，在本實施例中，與前述實施例相同的構件皆已相同標號示之，而不同的是，分離式熱交換模組300還包括載具310、鎖附件320以及風扇330，其中第一導熱件110與第二導熱件120的第一端E1組裝於載具310，且載具310組裝至電路板220，以使第一導熱件110抵壓在載具310與熱源200的電子晶片210之間。類似地，熱源200所產生的熱會依序經由導熱材140、第一導熱件110、銲接材150、第二導熱件120的第一端E1、第二端E2而傳送至散熱件130（散熱鰭片），此時再藉由風扇330提供氣流而強制散熱件130進行熱交換，以將熱排出分離式熱交換模組300。由上述圖1與圖3所示實施例能得知，分離式熱交換模組100、300適用於自然對流與強制對流的散熱機制。FIG. 3 shows a partial cross-sectional view of a separate heat exchange module according to another embodiment. Please refer to FIG. 3, in this embodiment, the same components as the previous embodiment have the same reference numerals, but the difference is that the separate heat exchange module 300 also includes a carrier 310, a lock attachment 320, and a fan 330. The first end E1 of the first heat-conducting element 110 and the second heat-conducting element 120 is assembled on the carrier 310, and the carrier 310 is assembled to the circuit board 220, so that the first heat-conducting element 110 is pressed against the carrier 310 and the heat source 200. Between electronic wafers 210. Similarly, the heat generated by the heat source 200 will be transferred to the heat sink 130 through the first end E1 and the second end E2 of the heat conducting material 140, the first heat conducting element 110, the welding material 150, and the second heat conducting element 120 in sequence (heat dissipation Fins), at this time, the fan 330 provides air flow to force the heat sink 130 to perform heat exchange, so as to discharge the heat from the separated heat exchange module 300. It can be seen from the above embodiments shown in FIG. 1 and FIG. 3 that the separate heat exchange modules 100 and 300 are suitable for natural convection and forced convection heat dissipation mechanisms.

進一步地說，本實施例的載具310是散熱座（heat sink），其具有鏤空部以供第一導熱件110與第二導熱件120組裝其上時，能經由鏤空部而相互熱接觸。當然，與前述實施例相同的是，第一導熱件110的第二金屬層112與第二導熱件120的第一端E1通過銲接材150而在所述鏤空部處相互結合。再者，由於載具310是藉由鎖附件320而組裝至電路板220，同時也因第一導熱件110是以第一金屬層113、第二金屬層112披覆在石墨烯層111之外，因此在組裝時，也更能順利地將載具310抵壓在第一導熱件110上，藉由將石墨烯層111夾持在具有延展性的第一金屬層113與第二金屬層112之間，而不用擔心組裝外力對石墨烯層111造成毀損。Furthermore, the carrier 310 of this embodiment is a heat sink, which has a hollow portion for the first heat conducting member 110 and the second heat conducting member 120 to be in thermal contact with each other through the hollow portion when assembled thereon. Of course, the same as the foregoing embodiment is that the second metal layer 112 of the first heat-conducting member 110 and the first end E1 of the second heat-conducting member 120 are joined to each other at the hollow portion by the welding material 150. Furthermore, since the carrier 310 is assembled to the circuit board 220 by the lock attachment 320, and also because the first heat conducting element 110 is covered with the first metal layer 113 and the second metal layer 112 on the outside of the graphene layer 111 Therefore, during assembly, the carrier 310 can be pressed against the first heat conducting member 110 more smoothly, by clamping the graphene layer 111 on the first metal layer 113 and the second metal layer 112 with ductility. In the meantime, there is no need to worry about damage to the graphene layer 111 caused by the external force of the assembly.

圖4是分離式熱交換模組的散熱效益曲線圖，其將上述分離式熱交換模組100或300（繪示為曲線T1）與現有技術中的銅散熱板（繪示為曲線T2）、熱導板（vapor chamber，繪示為曲線T3）分別對高功率（100W）的熱源進行散熱，並據以量測熱源溫度以取得各技術的散熱效益的比較。請參考圖4，從中可清楚得知，分離式熱交換模組100或300，由於其第一導熱件110配置有石墨烯層111，因此可使熱源溫度相較另外兩者更降低約10℃，由此推算其散熱能力可提高達15%。也就是說，相較於僅採用銅散熱板或熱導板的散熱技術，本發明藉由石墨烯層的高熱導性，而能有效地降低傳熱構件之間的接觸熱阻，避免在分離式熱交換模組100或300的傳熱路徑上造成熱阻塞而使構件溫度瞬間飆升，可以迅速的將熱集中點分散，得到良好的熱擴散效果，緩解局部過熱現象，進而也能提高相關構件的使用壽命。4 is a graph showing the heat dissipation benefit of a separate heat exchange module, which compares the above-mentioned separate heat exchange module 100 or 300 (shown as a curve T1) with a copper heat sink in the prior art (shown as a curve T2), The vapor chamber (shown as curve T3) dissipates heat from high-power (100W) heat sources, and measures the temperature of the heat source to compare the heat dissipation benefits of each technology. Please refer to FIG. 4, it can be clearly seen that, since the first heat-conducting member 110 of the separated heat exchange module 100 or 300 is configured with the graphene layer 111, the temperature of the heat source can be reduced by about 10°C compared with the other two. , It is estimated that its heat dissipation capacity can be increased by 15%. That is to say, compared to the heat dissipation technology that only uses copper heat sink or thermal conductive plate, the present invention can effectively reduce the contact thermal resistance between the heat transfer components by virtue of the high thermal conductivity of the graphene layer, and avoid the separation The heat transfer path of the integrated heat exchange module 100 or 300 causes thermal blockage, which causes the component temperature to soar instantly, which can quickly disperse the heat concentration points, obtain a good thermal diffusion effect, alleviate local overheating, and improve related components. Service life.

綜上所述，在本發明的上述實施例中，分離式熱交換模組除適用於輕薄短小的可攜式電子裝置中，其更藉由第一導熱件是由第一金屬層、石墨烯層與第二金屬層所構成的複合式薄層導熱結構，而在利用石墨烯層的高導熱特性之外，尚以披覆在外的金屬層提供保護效果，同時藉由金屬層的延展特性，而讓第一導熱件能輕易地接受後加工與組裝製程，且能避免石墨烯層受外力而損毀的情形。換句話說，第一導熱件將因此而順利地以銲接手段結合至第二導熱件，也能因此通過導熱材而與熱源進行熱接觸。更重要的是，在機構組裝上也能進一步地利用載具與電路板之間的鎖附，而使第一導熱件被抵壓在載具與熱源之間，如此兼具組裝便利性與高導熱性，而在維持石墨烯層完整的同時，也降低進行構件連結與組裝的困難度，並因此提高散熱效率與使用壽命。To sum up, in the above-mentioned embodiments of the present invention, the separate heat exchange module is not only suitable for light, thin, short and small portable electronic devices, but also uses the first metal layer and graphene as the first heat-conducting member. The composite thin-layer thermal conductivity structure formed by the second metal layer and the second metal layer. In addition to the high thermal conductivity of the graphene layer, the metal layer coated on the outside provides a protective effect. At the same time, due to the ductility of the metal layer, This allows the first heat-conducting member to easily accept post-processing and assembly processes, and can prevent the graphene layer from being damaged by external forces. In other words, the first heat-conducting member will be smoothly joined to the second heat-conducting member by welding, and can also be in thermal contact with the heat source through the heat-conducting material. More importantly, the locking between the carrier and the circuit board can be further utilized in the assembly of the mechanism, so that the first heat-conducting member is pressed between the carrier and the heat source, which has both assembly convenience and high efficiency. Thermal conductivity, while maintaining the integrity of the graphene layer, it also reduces the difficulty of connecting and assembling components, thereby improving heat dissipation efficiency and service life.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be subject to those defined by the attached patent application scope.

100、300:分離式熱交換模組 110:第一導熱件 111:石墨烯層 112:第二金屬層 113:第一金屬層 120:第二導熱件 130:散熱件 140:導熱材 150:銲接材 200:熱源 210:電子晶片 220:電路板 310:載具 320:鎖附件 330:風扇 E1:第一端 E2:第二端 T1、T2、T3:曲線100, 300: Separate heat exchange module 110: The first heat conduction piece 111: Graphene layer 112: second metal layer 113: The first metal layer 120: The second heat conduction piece 130: heat sink 140: Thermal Conductive Material 150: welding material 200: heat source 210: electronic chip 220: circuit board 310: Vehicle 320: lock accessory 330: Fan E1: first end E2: second end T1, T2, T3: curve

圖1是依據本發明一實施例的分離式熱交換模組的示意圖。 圖2是圖1的第一導熱件的爆炸圖。 圖3繪示另一實施例的分離式熱交換模組的局部剖視圖。 圖4是分離式熱交換模組的散熱效益曲線圖。FIG. 1 is a schematic diagram of a separate heat exchange module according to an embodiment of the present invention. Fig. 2 is an exploded view of the first heat conducting member of Fig. 1. FIG. 3 shows a partial cross-sectional view of a separate heat exchange module according to another embodiment. Figure 4 is a graph of the heat dissipation benefit of the separated heat exchange module.

100:分離式熱交換模組100: Separate heat exchange module

110:第一導熱件110: The first heat conduction piece

120:第二導熱件120: The second heat conduction piece

130:散熱件130: heat sink

140:導熱材140: Thermal Conductive Material

150:銲接材150: welding material

200:熱源200: heat source

210:電子晶片210: electronic chip

220:電路板220: circuit board

E1:第一端E1: first end

E2:第二端E2: second end

Claims (10)

一種分離式熱交換模組，用以對一熱源散熱，該分離式熱交換模組包括： 一第一導熱件，包括一第一金屬層、一第二金屬層與一石墨烯層，其中該石墨烯層位於該第一金屬層與該第二金屬層之間，該第一金屬層熱接觸於該熱源； 一第二導熱件，具有相對的一第一端與一第二端，該第一端熱接觸該第二金屬層；以及 一散熱件，熱接觸於該第二端，其中該熱源所產生的熱，依序經由該第一導熱件與該第二導熱件的該第一端，而被傳送至該第二導熱件的該第二端，且藉由該散熱件而散逸出該分離式熱交換模組。A separate heat exchange module is used to dissipate heat from a heat source. The separate heat exchange module includes: A first heat-conducting element includes a first metal layer, a second metal layer, and a graphene layer, wherein the graphene layer is located between the first metal layer and the second metal layer, and the first metal layer is thermally Contact the heat source; A second heat conducting element having a first end and a second end opposite to each other, the first end thermally contacting the second metal layer; and A heat dissipating element in thermal contact with the second end, wherein the heat generated by the heat source is transferred to the second end of the second heat conducting element through the first heat conducting element and the first end of the second heat conducting element in sequence The second end escapes the separated heat exchange module through the heat sink. 如申請專利範圍第1項所述的分離式熱交換模組，其中該熱源包括封裝於一電路板上的一電子晶片，該分離式熱交換模組還包括一載具，該第一導熱件與該第二導熱件的該第一端組裝於該載具，且該載具組裝至該電路板，以使該第一導熱件抵壓在該載具與該熱源之間。The separate heat exchange module according to claim 1, wherein the heat source includes an electronic chip packaged on a circuit board, the separate heat exchange module further includes a carrier, and the first heat conducting element The carrier is assembled with the first end of the second heat-conducting element, and the carrier is assembled to the circuit board, so that the first heat-conducting element is pressed between the carrier and the heat source. 如申請專利範圍第2項所述的分離式熱交換模組，其中該載具是一散熱座（heat sink）。The separate heat exchange module described in item 2 of the scope of patent application, wherein the carrier is a heat sink. 如申請專利範圍第1項所述的分離式熱交換模組，還包括一銲接材，該第二導熱件的該第一端與該第二金屬層藉由該銲接材而相互結合。The separate heat exchange module described in the first item of the scope of patent application further includes a welding material, and the first end of the second heat conducting member and the second metal layer are joined to each other by the welding material. 如申請專利範圍第1項所述的分離式熱交換模組，還包括一導熱材，填充於該第一金屬層與該熱源之間。The separate heat exchange module described in the first item of the scope of patent application further includes a heat conducting material filled between the first metal layer and the heat source. 如申請專利範圍第1項所述的分離式熱交換模組，其中該第一導熱件是厚度0.05mm～0.1mm的複合式薄層導熱結構，該石墨烯層的熱導率大於1000W/mK，且該石墨烯層的密度為2.2g/cm3 。The separate heat exchange module described in the first item of the scope of patent application, wherein the first heat conducting element is a composite thin-layer heat conducting structure with a thickness of 0.05mm to 0.1mm, and the thermal conductivity of the graphene layer is greater than 1000W/mK , And the density of the graphene layer is 2.2 g/cm 3 . 如申請專利範圍第1項所述的分離式熱交換模組，其中該第二導熱件是一熱管（heat pipe）或一熱導板（vapor chamber）。As described in the first item of the scope of patent application, the separate heat exchange module, wherein the second heat-conducting element is a heat pipe or a vapor chamber. 如申請專利範圍第1項所述的分離式熱交換模組，還包括一風扇，配置在該第二導熱件旁，以散逸被傳送至該第二端的熱。The separate heat exchange module described in the first item of the scope of patent application further includes a fan arranged beside the second heat conducting member to dissipate the heat transferred to the second end. 一種複合式薄層導熱結構，包括彼此無縫依附的一第一金屬層、一石墨烯層以及一第二金屬層，其中該石墨烯層被包覆於該第一金屬層與該第二金屬層之間，一熱源適於熱接觸該第一金屬層，以使該熱源所產生的熱量依序經由該第一金屬層、該石墨烯層而傳送至該第二金屬層。A composite thin-layer heat conduction structure includes a first metal layer, a graphene layer, and a second metal layer that are seamlessly attached to each other, wherein the graphene layer is coated on the first metal layer and the second metal layer Between the layers, a heat source is suitable for thermally contacting the first metal layer, so that the heat generated by the heat source is sequentially transferred to the second metal layer through the first metal layer and the graphene layer. 如申請專利範圍第9項所述的複合式薄層導熱結構，其厚度是0.05mm～0.1mm，該石墨烯層的熱導率大於1000W/mK，且該石墨烯層的密度為2.2g/cm3 。As described in item 9 of the scope of patent application, the thickness of the composite thin-layer thermal conductive structure is 0.05mm～0.1mm, the thermal conductivity of the graphene layer is greater than 1000W/mK, and the density of the graphene layer is 2.2g/ cm 3 .
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