TW202118985A - 均溫板及其毛細薄片 - Google Patents
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Abstract
一種均溫板及其毛細薄片,用以解決習知均溫板因毛細結構易碎裂而難以薄型化的問題。本發明的均溫板係包含:一外殼,具有相對設置的一吸熱片及一放熱片,該外殼內部具有一密閉空間;一工作流體,填充於該密閉空間中;及一毛細薄片,位於該密閉空間中並接觸該工作流體,該毛細薄片係由一混合材燒結而成,該混合材包含至少二種長度不同的導熱顆粒。
Description
本發明係關於一種可幫助電子產品散熱的物品,尤其是一種均溫板及其毛細薄片。
隨著科技產業的進步,現今筆電或手機等電子產品不僅效能優異,更一直往輕薄化的趨勢前進;然而,輕薄又高效能的電子產品運作時,容易產生大量的廢熱,導致電子產品的溫度升高,增加了電子產品的熱故障率及耗損率。
為此,目前已有一種習知的均溫板,可以安裝在電子產品的發熱源處,幫助排除電子產品運作時所產生的廢熱。詳言之,該習知的均溫板具有沖壓成型的一金屬殼,該金屬殼內部具有一毛細結構並填充有工作流體,該金屬殼可以從該發熱源吸取熱能,以加熱該工作流體並使該工作流體汽化,氣態的工作流體則續流至該金屬殼較遠離該發熱源的一側,從而冷凝回液態,藉此可以帶離該發熱源的熱能以達到散熱的目的。
其中,該毛細結構大多是由粒徑大小相同的金屬顆粒燒結而成。亦即,在該毛細結構具有足夠厚度的前提之下,該毛細結構的強度尚且良好,不至於會在組裝過程中發生碎裂的情況;但隨著將均溫板更再薄型化的發展需求,該毛細結構的厚度也需要更進一步地減縮,因而面臨了該毛細結構強度不足而易碎裂的問題,故實有加以改善之必要。
為解決上述問題,本發明的目的是提供一種均溫板及其毛細薄片,即使厚度減縮,該毛細薄片仍具有良好的結構強度而不易碎裂。
本發明的次一目的是提供一種均溫板及其毛細薄片,可以提升該毛細薄片的導熱效果。
本發明的又一目的是提供一種均溫板及其毛細薄片,可以提升整體均溫板的散熱效率。
本發明的再一目的是提供一種均溫板,可以提升組裝效率。
本發明全文所述方向性或其近似用語,例如「前」、「後」、「左」、「右」、「上(頂)」、「下(底)」、「內」、「外」、「側面」等,主要係參考附加圖式的方向,各方向性或其近似用語僅用以輔助說明及理解本發明的各實施例,非用以限制本發明。
本發明全文所記載的元件及構件使用「一」或「一個」之量詞,僅是為了方便使用且提供本發明範圍的通常意義;於本發明中應被解讀為包括一個或至少一個,且單一的概念也包括複數的情況,除非其明顯意指其他意思。
本發明全文所述「結合」、「組合」或「組裝」等近似用語,主要包含連接後仍可不破壞構件地分離,或是連接後使構件不可分離等型態,係本領域中具有通常知識者可以依據欲相連之構件材質或組裝需求予以選擇者。
本發明的毛細薄片,係由一混合材燒結而成,該混合材包含至少二種長度不同的導熱顆粒。
本發明的均溫板,包含:一外殼,具有相對設置的一吸熱片及一放熱片,該外殼內部具有一密閉空間;一工作流體,填充於該密閉空間中;及一前述之毛細薄片,位於該密閉空間中並接觸該工作流體。
據此,本發明的均溫板及其毛細薄片,可藉由採用至少二種長度不同的導熱顆粒燒結成該毛細薄片,使較長的導熱顆粒在燒結後可以類似纖維般相互牽引,以提升導熱顆粒間的結合強度,故該毛細薄片即使厚度極薄,仍可以具有良好的結構強度而不易碎裂,對於均溫板薄型化的發展極具幫助。
其中,較長的導熱顆粒的長度約為較短的導熱顆粒的長度的5~25倍;較佳約為10~20倍。如此,具有提升導熱顆粒間的結合強度的功效。
其中,該混合材主要包含選自銅、銅合金、鋁或鋁合金的至少一種材質的導熱顆粒。如此,具有提升該毛細薄片的導熱效果的功效。
其中,該混合材可以包含有金屬及石墨材質的導熱顆粒。如此,具有提升該毛細薄片的導熱效果的功效。
其中,較長的導熱顆粒與較短的導熱顆粒可以為不同材質。如此,可依所需選用不同成本的導熱顆粒,具有降低該毛細薄片成本的功效。
其中,該毛細薄片的厚度約為0.05~0.5 mm;較佳約為0.2~0.4 mm。如此,具有減縮該毛細薄片厚度的功效。
其中,該毛細薄片可以具有一第一層及一第二層,該第二層位於該第一層上方,構成該第一層的導熱顆粒中,較短的導熱顆粒可以多於較長的導熱顆粒,構成該第二層的導熱顆粒中,較長的導熱顆粒可以多於較短的導熱顆粒,使該第一層的密度可以大於該第二層的密度。如此,具有更進一步地提升整體均溫板的散熱效率的功效。
其中,該外殼可以具有至少一支撐柱位於該密閉空間中,該毛細薄片可以具有至少一貫穿孔,該支撐柱貫穿該貫穿孔,且該支撐柱的二端可以分別連接該吸熱片與該放熱片。如此,可以減少該外殼發生變形的狀況,具有提升該外殼的結構強度及穩固性等功效。
其中,該支撐柱可以一體成型或組裝結合於該放熱片,至少一定位柱可以一體成型或組裝結合於該吸熱片,該定位柱中可以具有一孔洞,該毛細薄片可以由該貫穿孔套合在該定位柱的外周,該支撐柱可以穿入該孔洞。如此,該吸熱片與該放熱片相對結合時可便於準確對位,具有提升組裝效率的功效。
其中,該定位柱的外周可以呈非圓形。如此,可防止該毛細薄片在組裝過程中相對於該外殼旋轉,具有提升組裝效率及準確性等功效。
其中,該吸熱片及該放熱片可分別以蝕刻製程形成一凹槽,各該凹槽的外周可以具有一環牆,該吸熱片及該放熱片相接,並可以雷射銲接結合該二環牆相接合的周緣。如此,具有降低該外殼的厚度及提升結合穩固性等功效。
為讓本發明之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本發明之較佳實施例,並配合所附圖式,作詳細說明如下:
請參照第1、2圖所示,其係本發明均溫板的一較佳實施例,係包含一外殼1及一毛細薄片2,該毛細薄片2位於該外殼1中。
該外殼1具有相對設置的一吸熱片1a及一放熱片1b,且該外殼1內部具有一密閉空間S,該密閉空間S中填充有工作流體(圖未示)且容置有該毛細薄片2。該密閉空間S較佳呈真空狀態,該工作流體可例如為純水或乙醇等,該工作流體呈液態時並不會填滿該密閉空間S。
更詳言之,該吸熱片1a及該放熱片1b可採用銅、鋁或其他具有高導熱係數的材料製成。該吸熱片1a及該放熱片1b中的至少一者可以形成一凹槽11,以於該吸熱片1a與該放熱片1b相對結合後,在該吸熱片1a與該放熱片1b之間形成前述的密閉空間S。例如但不限制地,本實施例可選擇以蝕刻製程在該吸熱片1a及該放熱片1b相對的表面分別形成一凹槽11,且各該凹槽11的外周具有一環牆12,使該放熱片1b可以置入該吸熱片1a的凹槽11中,並可以雷射銲接結合該二環牆12相接合的周緣,使該放熱片1b的凹槽11可以形成該密閉空間S。其中,雷射銲接的角度θ(與水平面的夾角)較佳採用30~75度,以提升銲接時的操作便利性。在其他實施例中,也可與前述相反設置,使該吸熱片1a置入該放熱片1b的凹槽11中,由該吸熱片1a的凹槽11形成該密閉空間S;或是使該吸熱片1a的環牆12與該放熱片1b的環牆12相對疊設,以由該二凹槽11共同形成該密閉空間S,或其他等效結構,故該外殼1不以本實施例圖式所揭露之結構為限。
此外,本實施例的外殼1可以具有至少一支撐柱13,該支撐柱13位於該密閉空間S中,該支撐柱13的二端分別連接該吸熱片1a與該放熱片1b,使該支撐柱13可以支撐該吸熱片1a及該放熱片1b在該環牆12內的區段,減少該外殼1發生變形的狀況。在本實施例中,該支撐柱13可以一體成型或組裝結合於該放熱片1b,該外殼1另可以具有至少一定位柱14,該定位柱14可以一體成型或組裝結合於該吸熱片1a,且該定位柱14中具有一孔洞15以供該支撐柱13穿設結合,該定位柱14的外周較佳可以呈非圓形的形態。
請參照第2、3圖所示,該毛細薄片2位於該密閉空間S中並接觸該工作流體。該毛細薄片2係由一混合材燒結而成的多孔性片體,該毛細薄片2的厚度極薄,僅約0.05~0.5 mm,較佳約為0.2~0.4 mm。舉例而言,該混合材可以先進行粉末冶金燒結,亦可將燒結後的粉末進行加壓及整平等程序以加工形成所需厚度、形狀或適當尺寸的該毛細薄片2,且加壓及整平的過程中,還可以同時於該毛細薄片2上形成溝槽,以提升該毛細薄片2的導流能力。
其中,該混合材包含至少二種長度不同的導熱顆粒,使燒結成型的多孔性片體能具有較佳的結構強度而較不易碎裂。舉例而言,其中一種導熱顆粒(較長的導熱顆粒)的長度約可以為另一種導熱顆粒(較短的導熱顆粒)的長度的5~25倍,較佳約為10~20倍,使較長的導熱顆粒在燒結後可以類似纖維般相互牽引,以提升導熱顆粒間的結合強度。又,較短的導熱顆粒可概呈球狀,其直徑約為1~25μm,而長度不同的導熱顆粒的形狀可以相同或不同(對較長的導熱顆粒而言,係指其短方向的截面形狀),本發明不加以限制。
該混合材主要可包含選自銅、銅合金、鋁或鋁合金的至少一種材質的導熱顆粒,使該毛細薄片2還能兼具有良好的導熱效果。亦即,上述較長的導熱顆粒與較短的導熱顆粒可以是相同或不同材質,本發明均不加以限制;例如,在散熱需求沒那個高的使用例中,可以混摻成本較低的導熱顆粒,有助降低該毛細薄片2的材料成本。此外,該混合材不盡然全要使用金屬材質的導熱顆粒,還可以另包含有非金屬材質的導熱顆粒,例如石墨材質的導熱顆粒,以提升燒結而成的該毛細薄片2的導熱效果。
又,在該外殼1具有前述支撐柱13及定位柱14的實施例中,該毛細薄片2可以設有至少一貫穿孔21,該毛細薄片2可以由該貫穿孔21套合在對應的定位柱14外周,並防止該毛細薄片2相對於該吸熱片1a旋轉,再將該吸熱片1a與該放熱片1b相對接,使該支撐柱13得以穿入對應的定位柱14中的孔洞15,令該吸熱片1a與該放熱片1b能夠準確對位,再以點銲的方式使該支撐柱13能銲接結合該吸熱片1a。
請再參照第1、2圖所示,據由前述結構,本發明的均溫板可有效地薄型化,且使用該均溫板時,可由該外殼1的吸熱片1a接觸發熱源以吸收熱能,並由該熱能加熱該密閉空間S中的液態工作流體,使液態的工作流體吸收熱能以蒸發成氣態,而氣態的工作流體可以在接觸到相對低溫的該放熱片1b時再度凝結回液態;如此,該工作流體藉由該毛細薄片2產生毛細現象而不斷進行氣液相變化的循環,從而帶離該發熱源的熱能,達到使該發熱源有效散熱的效果。
值得一提的是,請參照第4圖所示,該毛細薄片2還可以具有一第一層2a及一第二層2b,該第二層2b位於該第一層2a上方,使該第一層2a較該第二層2b更鄰近該吸熱片1a;其中,該第一層2a與該第二層2b的密度可以不同,較佳使該第一層2a的密度大於該第二層2b的密度。例如但不限制地,構成該第一層2a的導熱顆粒中,可以選擇使較短的導熱顆粒多於較長的導熱顆粒,而構成該第二層2b的導熱顆粒中,則可以選擇使較長的導熱顆粒多於較短的導熱顆粒,使該第一層2a的密度大於該第二層2b的密度。如此,該第一層2a可以對液態工作流體提供更佳的毛細作用,幫助吸引液態工作流體向上流動及蒸發,而該第二層2b則具有更多的間隙以提升氣態工作流體的流動性,有助其順暢凝結回液態,故可更進一步地提升整體均溫板的散熱效率。
綜上所述,本發明的均溫板及其毛細薄片,可藉由採用至少二種長度不同的導熱顆粒燒結成該毛細薄片,使較長的導熱顆粒在燒結後可以類似纖維般相互牽引,以提升導熱顆粒間的結合強度,故該毛細薄片即使厚度減縮至0.5 mm以下的極薄狀態,仍可以具有良好的結構強度而不易碎裂,對於均溫板薄型化的發展極具幫助。
雖然本發明已利用上述較佳實施例揭示,然其並非用以限定本發明,任何熟習此技藝者在不脫離本發明之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
1:外殼
1a:吸熱片
1b:放熱片
11:凹槽
12:環牆
13:支撐柱
14:定位柱
15:孔洞
2:毛細薄片
2a:第一層
2b:第二層
21:貫穿孔
S:密閉空間
[第1圖] 本發明一較佳實施例的分解立體圖。
[第2圖] 本發明一較佳實施例的局部組合剖視圖。
[第3圖] 本發明一較佳實施例的毛細薄片的立體圖。
[第4圖] 本發明另一較佳實施例的毛細薄片的剖視圖。
1:外殼
1a:吸熱片
1b:放熱片
11:凹槽
12:環牆
13:支撐柱
14:定位柱
15:孔洞
2:毛細薄片
21:貫穿孔
Claims (14)
- 一種毛細薄片,係由一混合材燒結而成,該混合材包含至少二種長度不同的導熱顆粒。
- 如申請專利範圍第1項所述之毛細薄片,其中,較長的導熱顆粒的長度為較短的導熱顆粒的長度的5~25倍。
- 如申請專利範圍第1項所述之毛細薄片,其中,較長的導熱顆粒的長度為較短的導熱顆粒的長度的10~20倍。
- 如申請專利範圍第1項所述之毛細薄片,其中,該混合材主要包含選自銅、銅合金、鋁或鋁合金的至少一種材質的導熱顆粒。
- 如申請專利範圍第1項所述之毛細薄片,其中,該混合材包含有金屬及石墨材質的導熱顆粒。
- 如申請專利範圍第1項所述之毛細薄片,其中,較長的導熱顆粒與較短的導熱顆粒為不同材質。
- 如申請專利範圍第1項所述之毛細薄片,其中,該毛細薄片的厚度為0.05~0.5 mm。
- 如申請專利範圍第7項所述之毛細薄片,其中,該毛細薄片的厚度為0.2~0.4 mm。
- 如申請專利範圍第1至8項中任一項所述之毛細薄片,其中,該毛細薄片具有一第一層及一第二層,該第二層位於該第一層上方,構成該第一層的導熱顆粒中,較短的導熱顆粒多於較長的導熱顆粒,構成該第二層的導熱顆粒中,較長的導熱顆粒多於較短的導熱顆粒,使該第一層的密度大於該第二層的密度。
- 一種均溫板,包含: 一外殼,具有相對設置的一吸熱片及一放熱片,該外殼內部具有一密閉空間; 一工作流體,填充於該密閉空間中;及 一如申請專利範圍第1至9項中任一項所述之毛細薄片,位於該密閉空間中並接觸該工作流體。
- 如申請專利範圍第10項所述之均溫板,其中,該外殼具有至少一支撐柱位於該密閉空間中,該毛細薄片具有至少一貫穿孔,該支撐柱貫穿該貫穿孔,且該支撐柱的二端分別連接該吸熱片與該放熱片。
- 如申請專利範圍第11項所述之均溫板,其中,該支撐柱一體成型或組裝結合於該放熱片,至少一定位柱一體成型或組裝結合於該吸熱片,該定位柱中具有一孔洞,該毛細薄片由該貫穿孔套合在該定位柱的外周,該支撐柱穿入該孔洞。
- 如申請專利範圍第12項所述之均溫板,其中,該定位柱的外周呈非圓形。
- 如申請專利範圍第10項所述之均溫板,其中,該吸熱片及該放熱片分別以蝕刻製程形成一凹槽,各該凹槽的外周具有一環牆,該吸熱片及該放熱片相接,並雷射銲接結合該二環牆相接合的周緣。
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CN201911089016.3A CN112747618A (zh) | 2019-10-31 | 2019-11-08 | 均温板及其毛细薄片 |
CN201921926941.2U CN211373312U (zh) | 2019-10-31 | 2019-11-08 | 均温板及其毛细薄片 |
US17/021,164 US20210131754A1 (en) | 2019-10-31 | 2020-09-15 | Vapor Chamber and Capillary Film Thereof |
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TWI837370B (zh) * | 2020-05-21 | 2024-04-01 | 宏碁股份有限公司 | 均溫板結構 |
KR20220029909A (ko) * | 2020-09-02 | 2022-03-10 | 삼성전자주식회사 | 방열 구조물 및 그를 포함하는 전자 장치 |
CN114812241B (zh) * | 2021-01-28 | 2024-06-25 | 广州力及热管理科技有限公司 | 应用于薄型均温板的复合式毛细结构 |
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US7447029B2 (en) * | 2006-03-14 | 2008-11-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber for dissipation heat generated by electronic component |
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TW201350781A (zh) * | 2012-06-14 | 2013-12-16 | Microloops Corp | 高效均溫板 |
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