TW202115746A - 樹脂粒子、導電性粒子、導電材料及連接構造體 - Google Patents

樹脂粒子、導電性粒子、導電材料及連接構造體 Download PDF

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Publication number
TW202115746A
TW202115746A TW109126922A TW109126922A TW202115746A TW 202115746 A TW202115746 A TW 202115746A TW 109126922 A TW109126922 A TW 109126922A TW 109126922 A TW109126922 A TW 109126922A TW 202115746 A TW202115746 A TW 202115746A
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TW
Taiwan
Prior art keywords
conductive
resin
particles
resin particles
particle
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Application number
TW109126922A
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English (en)
Chinese (zh)
Inventor
森田弘幸
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日商積水化學工業股份有限公司
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Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202115746A publication Critical patent/TW202115746A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Liquid Crystal (AREA)
  • Conductive Materials (AREA)
TW109126922A 2019-08-08 2020-08-07 樹脂粒子、導電性粒子、導電材料及連接構造體 TW202115746A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019146769 2019-08-08
JP2019-146769 2019-08-08
JP2019-224685 2019-12-12
JP2019224685 2019-12-12

Publications (1)

Publication Number Publication Date
TW202115746A true TW202115746A (zh) 2021-04-16

Family

ID=74502799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109126922A TW202115746A (zh) 2019-08-08 2020-08-07 樹脂粒子、導電性粒子、導電材料及連接構造體

Country Status (3)

Country Link
JP (1) JPWO2021025113A1 (ja)
TW (1) TW202115746A (ja)
WO (1) WO2021025113A1 (ja)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003043495A (ja) * 2001-08-03 2003-02-13 Soken Chem & Eng Co Ltd ２次変形異方接着性スペーサー粒子、その製造方法及びその粒子を用いる表示デバイス。
EP3335789A4 (en) * 2015-08-10 2018-07-18 Mitsubishi Chemical Corporation Separating agent and liquid-chromatography column
CN110603272A (zh) * 2017-06-12 2019-12-20 积水化学工业株式会社 树脂粒子、导电性粒子、导电材料、粘接剂、连接结构体以及液晶显示元件
JP7335687B2 (ja) * 2017-09-06 2023-08-30 積水化学工業株式会社 基材粒子、導電性粒子、導電材料及び接続構造体

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Publication number Publication date
WO2021025113A1 (ja) 2021-02-11
JPWO2021025113A1 (ja) 2021-02-11

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