TW202113294A - Heat transfer member reinforcement structure - Google Patents
Heat transfer member reinforcement structure Download PDFInfo
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- TW202113294A TW202113294A TW108134265A TW108134265A TW202113294A TW 202113294 A TW202113294 A TW 202113294A TW 108134265 A TW108134265 A TW 108134265A TW 108134265 A TW108134265 A TW 108134265A TW 202113294 A TW202113294 A TW 202113294A
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一種熱傳構件補強結構,尤指一種透過組合一補強件藉以提升熱傳構件結構強度的熱傳構件補強結構。A reinforcing structure for a heat transfer member, in particular, refers to a reinforcement structure for a heat transfer member that enhances the structural strength of the heat transfer member by combining a reinforcing member.
一般電子設備中具有複數電子元件,諸如中央處理器等電子元件在運行的過程中將會產生大量的熱,若沒有及時排除其產生之熱量,將導致電子元件之工作環境的溫度升高,而嚴重影響電子元件之正常運作,因此通常於該等發熱電子元件表面固定置設一散熱元件如散熱器或散熱鰭片等或導熱單元如導熱基座或均溫板或平板式熱管等,藉以達到散熱及熱傳導之功效。 一般而言,散熱元件或導熱單元之定位方式係直接藉由一彈性簧片或扣具扣合在主機板上電子元件(CPU)周緣之適當部位,另散熱元件或導熱單元對電子元件產生一相對壓抵的力量。 但是主機板在結構設計上並不能提供強大的承受力而設計,此種固定方式將使散熱元件或導熱單元之重量對主機板產生不當施力,進而容易對主機板造成損傷,因此便設置一種習知之散熱元件及導熱單元的固定結構,利用一板體置放於主機板之下方,藉由複數固定元件貫穿位於主機板上之孔位而將該板體與位於主機板上方之散熱元件或導熱單元固定,如此主機板便不會受到不當施力而損壞,如此僅增加主機板之強度,當對該散熱元件或導熱單元設置更大的向下壓制力時,則該散熱元件會造成彎曲或斷裂等破壞情形。 則如何增加散熱元件或導熱基座之結構強度,則為該項技藝之人士首重之目標。Generally, electronic devices have multiple electronic components. Electronic components such as central processing units will generate a lot of heat during operation. If the heat generated is not removed in time, the temperature of the working environment of the electronic components will increase. It seriously affects the normal operation of electronic components. Therefore, a heat-dissipating component such as a heat sink or fins or a heat-conducting unit such as a heat-conducting base, a temperature equalizing plate or a flat heat pipe is usually fixed on the surface of the heat-generating electronic components to achieve The effect of heat dissipation and heat conduction. Generally speaking, the positioning method of the heat-dissipating element or the heat-conducting unit is directly fastened to the appropriate part of the periphery of the electronic element (CPU) on the motherboard by an elastic reed or a fastener, and the heat-dissipating element or the heat-conducting unit generates an impact on the electronic element. Relatively depressing force. However, the structural design of the motherboard is not designed to provide strong bearing capacity. This fixing method will cause the weight of the heat dissipation element or the heat conduction unit to improperly force the motherboard, which will easily cause damage to the motherboard. Therefore, a kind of The conventional fixing structure of the heat dissipating element and the heat conducting unit utilizes a board to be placed under the main board, and a plurality of fixing elements penetrate through the holes on the main board to connect the board to the heat dissipating element located above the main board. The heat-conducting unit is fixed so that the motherboard will not be damaged by improper force. This only increases the strength of the motherboard. When a greater downward pressing force is applied to the heat-dissipating element or the heat-conducting unit, the heat-dissipating element will bend Or breakage and other damage. How to increase the structural strength of the heat-dissipating element or the heat-conducting base is the most important goal of those skilled in the art.
爰此,為有效解決上述之問題,本發明之主要目的,係提供一種可增加熱傳構件強度的熱傳構件補強結構。 為達上述之目的,本發明係提供一種熱傳構件補強結構,係包含:一本體; 所述本體具有一第一側及一第二側及一補強件,所述補強件選擇設於該第一、二側之間或卡(嵌)接於該本體側邊或第二側,藉由該補強件與該本體結合增加該本體結構之強度。 本發明提供一種增加熱傳構件之結構強度,令熱傳構件具有較佳的強度得固定時可受到較大之向下或向上之壓力或張力時不產生變形破壞者。Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a heat transfer member reinforcement structure that can increase the strength of the heat transfer member. In order to achieve the above objective, the present invention provides a heat transfer member reinforcement structure, which includes: a body; The main body has a first side, a second side, and a reinforcing member. The reinforcing member is selected to be arranged between the first and second sides or is clamped (embedded) on the side or the second side of the main body. The strength of the structure of the main body is increased by the combination of the reinforcing member and the main body. The present invention provides a structure that increases the structural strength of the heat transfer member, so that the heat transfer member has better strength so that when it is fixed, it can be subjected to greater downward or upward pressure or tension without deformation and destruction.
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。
請參閱第1、2圖,係為本發明之熱傳構件補強結構之第一實施例之立體及組合剖視圖,如圖所示,本發明熱傳構件補強結構,係包含:一本體1;
所述本體1具有一第一側11及一第二側12及一補強件2,該第一、二側11、12分設於該本體1之上、下兩側,所述補強件2設於該第一、二側11、12之間。
所述本體1及該補強件2係為金屬或非金屬材質,所述金屬材質係為金或銀或銅或鋁或鐵或不銹鋼或鈦或鋁合金或銅合金或鈦合金或合金,非金屬材質係為陶瓷或塑膠或石材等,所述本體1與該補強件2可選擇係為相同或相異材質搭配組合,所述補強件2呈一長條狀或一長型圓柱狀或長型扁平狀或X型或口字型或其他幾何形狀。
本實施例之所述補強件2透過與該本體1一體包射完整嵌埋於該本體1中,本實施例之本體1係為一導熱基座或散熱器,所述本體1與該補強件透過包射完整埋設或壓鑄或灌鑄之方式結合一體,所述本體1具有一對第一側邊13及一對第二側邊14,該補強件2可選擇性對應設置相鄰該第一側邊13或第二側邊14處或設置於該本體1之四隅處或是本體上任一需要補強結構強度之處,位置並不限制,並該補強件2係可單一或兩兩對應設置。
請參閱第3圖,係為本發明之熱傳構件補強結構第二實施例之立體剖視圖,如圖所示,本實施例係部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,所述本體1係為一導熱元件,所述導熱元件係為均溫板,故該本體1之第一、二側11、12之間具有一氣密腔室15,該補強件2設置於該本體1氣密腔室15外側部位如該本體1第一側或第二側其中任一位置上或設置於該氣密腔室15與本體1之第一、二側11、12之間處,該氣密腔室15內具有一毛細結構151及一工作液體152。
請參閱第4、5a、5b、5c圖,係為本發明之熱傳構件補強結構第三實施例之立體及組合剖視圖,如圖所示,本實施例係部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,本實施例之本體1係為一導熱基座,並該本體1之第一側11凹設一凹槽16,所述補強件2透過壓鑄或沖壓或焊接或卡接之方式設於該凹槽16內,該補強件2係選擇低於(第5a圖所示)或切(平)齊(第5b圖所示)或凸出(第5c圖所示)該第一側11。
請參閱第6圖,係為本發明之熱傳構件補強結構第四實施例之立體分解圖,如圖所示,本實施例係部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,所述本體1係為一導熱基座或散熱器,所述本體1中央處開設一穿孔17,並該穿孔17嵌(鑲)埋一導熱塊3,該本體1之第一側11對接一散熱單元4,該散熱單元4係為散熱器或散熱鳍片組;複數熱管5與該導熱塊3及該散熱單元4相互連接。
請參閱第7圖,係為本發明之熱傳構件補強結構第五實施例之立體分解圖,如圖所示,本實施例係部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,該補強件2對應設置於該第一側邊13及該第二側邊14交接之四隅處或由四隅相互交錯延伸設置。
請參閱第8圖,係為本發明之熱傳構件補強結構第六實施例之立體局部剖視圖,如圖所示,本實施例係部分結構與前述第一實施例相同,故在此將不再贅述,惟本實施例與前述第一實施例之不同處在於,所述補強件2具有一第一部分23及一第二部分24,所述第一部分23與第二部分24相互連接,並該第一、二部分23、24相互呈垂直,所述第一部分23一端具有一勾端231勾扣於該本體1第一側11之長邊13凸伸之一邊條133外部,所述第二部分24具有一延伸部241,所述第二部分24平貼於該本體1之第二側12,並該延伸部241與該本體1一體包射成型設於該第一、二側11、12之間。
本發明熱傳構件主要可係為導熱元件、導熱基座、散熱器、均溫板或熱傳單元等元件,並當該等元件進行固定時受到壓力或撓曲力之抵抗力,透過該補強件之設(配)置則可大幅提升該導熱元件、導熱基座、散熱器、均溫板或熱傳單元等元件之結構強度,避免組裝時壓力或撓曲力對該等元件造成之變形或破壞者。The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.
Please refer to Figures 1 and 2, which are three-dimensional and combined cross-sectional views of the first embodiment of the heat transfer member reinforcement structure of the present invention. As shown in the figure, the heat transfer member reinforcement structure of the present invention includes: a
1:本體 11:第一側 12:第二側 13:第一側邊 14:第二側邊 15:氣密腔室 151:毛細結構 152:工作液體 16:凹槽 17:穿孔 18:卡接槽 2:補強件 3:導熱塊 4:散熱單元 5:熱管1: body 11: First side 12: second side 13: First side 14: second side 15: Airtight chamber 151: Capillary structure 152: working fluid 16: groove 17: Piercing 18: card slot 2: Reinforcement 3: Thermal block 4: Cooling unit 5: Heat pipe
第1圖係為本發明之熱傳構件補強結構之第一實施例之立體圖; 第2圖係為本發明之熱傳構件補強結構之第一實施例之剖視圖; 第3圖係為本發明之熱傳構件補強結構之第二實施例之立體剖視圖; 第4圖係為本發明之熱傳構件補強結構之第三實施例之立體圖; 第5a圖係為本發明之熱傳構件補強結構之第三實施例之剖視圖; 第5b圖係為本發明之熱傳構件補強結構之第三實施例之剖視圖; 第5c圖係為本發明之熱傳構件補強結構之第三實施例之剖視圖; 第6圖係為本發明之熱傳構件補強結構之第四實施例之立體圖; 第7圖係為本發明之熱傳構件補強結構之第五實施例之剖視圖; 第8圖係為本發明之熱傳構件補強結構之第六實施例之立體局部剖視圖。Figure 1 is a perspective view of the first embodiment of the heat transfer member reinforcement structure of the present invention; Figure 2 is a cross-sectional view of the first embodiment of the heat transfer member reinforcement structure of the present invention; Figure 3 is a perspective cross-sectional view of the second embodiment of the heat transfer member reinforcement structure of the present invention; Figure 4 is a perspective view of the third embodiment of the heat transfer member reinforcement structure of the present invention; Figure 5a is a cross-sectional view of the third embodiment of the heat transfer member reinforcement structure of the present invention; Figure 5b is a cross-sectional view of the third embodiment of the heat transfer member reinforcement structure of the present invention; Figure 5c is a cross-sectional view of the third embodiment of the heat transfer member reinforcement structure of the present invention; Figure 6 is a perspective view of the fourth embodiment of the heat transfer member reinforcement structure of the present invention; Figure 7 is a cross-sectional view of the fifth embodiment of the heat transfer member reinforcement structure of the present invention; Figure 8 is a three-dimensional partial cross-sectional view of the sixth embodiment of the heat transfer member reinforcement structure of the present invention.
1:本體1: body
11:第一側11: First side
12:第二側12: second side
2:補強件2: Reinforcement
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