TW202107602A - Wafer transfer apparatus - Google Patents

Wafer transfer apparatus Download PDF

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TW202107602A
TW202107602A TW109127033A TW109127033A TW202107602A TW 202107602 A TW202107602 A TW 202107602A TW 109127033 A TW109127033 A TW 109127033A TW 109127033 A TW109127033 A TW 109127033A TW 202107602 A TW202107602 A TW 202107602A
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wafer
holding
rotation
roller
holding plate
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TW109127033A
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TWI838565B (en
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柿沼良典
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0004—Gripping heads and other end effectors with provision for adjusting the gripped object in the hand
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
    • B65G47/244—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning them about an axis substantially perpendicular to the conveying plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

A wafer transfer apparatus includes a holding plate having a holding surface adapted to be opposed to one side of a wafer, a suction holding portion provided so as to be exposed to the holding surface for holding the wafer under suction in a noncontact fashion, three or more restricting members for restricting the movement of the wafer in a direction parallel to the one side of the wafer, each restricting member having a roller portion rotatable about its axis, the roller portion being adapted to come into contacted with the peripheral edge of the wafer held under suction by the suction holding portion, and a moving unit connected to the holding plate for moving the holding plate to thereby transfer the wafer. At least one of the restricting members functions as a rotational drive portion for rotating the roller portion about its axis to thereby rotate the wafer.

Description

晶圓搬送裝置Wafer transfer device

本發明係關於一種搬送晶圓的晶圓搬送裝置。The present invention relates to a wafer transport device for transporting wafers.

對於在主要由矽、砷化鎵、碳化矽、藍寶石等所形成之晶圓上形成有多個元件的元件晶圓，藉由實施研削、研磨、切割等的加工，元件晶圓被分割成多個元件晶片。進行分割之前的多個元件晶圓，將其在容納於卡匣的狀態下搬送至加工裝置，並藉由加工裝置進行加工。For a device wafer with multiple devices formed on a wafer mainly made of silicon, gallium arsenide, silicon carbide, sapphire, etc., the device wafer is divided into multiple devices by performing processing such as grinding, grinding, and cutting. A component wafer. The plurality of element wafers before being divided are transported to a processing device in a state of being accommodated in a cassette, and processed by the processing device.

加工裝置例如為膠膜黏貼機。膠膜黏貼機中，將元件晶圓逐個地從卡匣取出，並將與元件晶圓大致相同直徑的樹脂製保護片貼附於元件晶圓的正面側。貼附有保護片之各元件晶圓，例如，將其再次容納於卡匣後，搬送至其他加工裝置。The processing device is, for example, an adhesive film sticking machine. In the adhesive film bonding machine, the component wafers are taken out from the cassette one by one, and a resin protective sheet with approximately the same diameter as the component wafer is attached to the front side of the component wafer. Each component wafer with a protective sheet attached, for example, is placed in a cassette again, and then transported to other processing equipment.

其他加工裝置例如為研削裝置。研削裝置通常具備對位裝置，用以將附保護片之元件晶圓定位於預定位置（例如參閱專利文獻1）。此對位裝置具備暫置元件晶圓的暫置台。在暫置台的頂部設有圓盤狀的平台。進一步，在此平台的外周設有可於平台的徑向上移動的多個銷。Other processing devices are, for example, grinding devices. Grinding equipment usually has an alignment device for positioning the device wafer with a protective sheet at a predetermined position (for example, refer to Patent Document 1). The aligning device is provided with a temporary stage for temporarily placing component wafers. A disc-shaped platform is provided on the top of the temporary platform. Furthermore, a plurality of pins movable in the radial direction of the platform are provided on the outer periphery of the platform.

將元件晶圓定位於平台的大致中心時，首先，將元件晶圓載置於平台上。接著，維持與平台中心互相等距離的狀態之同時，使多個銷移動至平台的中心側。藉由使各銷與元件晶圓的外周部接觸，將元件晶圓定位於平台的大致中心。When positioning the component wafer at the approximate center of the platform, first, the component wafer is placed on the platform. Next, while maintaining the equidistant state from the center of the platform, the plurality of pins are moved to the center side of the platform. By bringing each pin into contact with the outer periphery of the element wafer, the element wafer is positioned at the approximate center of the platform.

之後，藉由裝載臂等的晶圓搬送裝置，將元件晶圓搬送至設於研削裝置的卡盤台之大致中央。然後，以卡盤台吸引保持元件晶圓的正面側，並藉由研削單元研削元件晶圓的背面側。After that, the component wafer is transferred to the approximate center of the chuck table provided in the grinding device by a wafer transfer device such as a loading arm. Then, the front side of the component wafer is sucked and held by the chuck table, and the back side of the component wafer is ground by the grinding unit.

但是，作為對位裝置之另一例，亦存在基於拍攝所取得之影像來檢測元件晶圓之中心位置的裝置（例如參閱專利文獻2）。該裝置具備：暫置台，載置元件晶圓；攝像手段，拍攝載置於暫置台的元件晶圓之外周部；以及晶圓搬送機構，將元件晶圓從暫置台搬送至設於研削裝置之卡盤台。However, as another example of the alignment device, there is also a device that detects the center position of the element wafer based on the image obtained by shooting (for example, refer to Patent Document 2). The device is equipped with: a temporary stage for placing component wafers; an imaging means to photograph the outer periphery of the component wafer placed on the temporary stage; and a wafer transfer mechanism to transport the component wafer from the temporary stage to the grinding device. Chuck table.

將元件晶圓搬送至卡盤台的大致中央時，首先，以攝像手段拍攝載置於暫置台的元件晶圓之外周部，從所得之影像計算元件晶圓的中心位置。When transporting the component wafer to the approximate center of the chuck table, first, the outer periphery of the component wafer placed on the temporary stage is photographed by imaging means, and the center position of the component wafer is calculated from the obtained image.

然後，以使該計算出之中心位置位於以預定的旋轉軸為中心而呈圓弧狀旋轉的晶圓搬送機構之圓弧狀軌道的方式，使暫置台僅以預定角度進行旋轉。接著，在以晶圓搬送機構的吸附墊片吸附元件晶圓的狀態下使晶圓搬送機構旋轉，以將元件晶圓搬送至卡盤台的大致中央。 [習知技術文獻] [專利文獻]Then, the temporary placement table is rotated only at a predetermined angle so that the calculated center position is located on the arc-shaped track of the wafer transport mechanism that rotates in an arc shape with the predetermined rotation axis as the center. Next, the wafer transport mechanism is rotated in a state where the component wafer is adsorbed by the suction pad of the wafer transport mechanism to transport the component wafer to the approximate center of the chuck table. [Literature Technical Literature] [Patent Literature]

[專利文獻1]日本特開平7-211766號公報 [專利文獻2]日本特開2011-210827號公報[Patent Document 1] Japanese Patent Laid-Open No. 7-211766 [Patent Document 2] JP 2011-210827 A

[發明所欲解決的課題] 如此，在以晶圓搬送裝置將晶圓搬送至卡盤台之前，必須另外使用具有暫置台、多個銷等的對位裝置進行中心對位（亦即，中心校正）。[The problem to be solved by the invention] In this way, before the wafer is transferred to the chuck table by the wafer transfer device, an alignment device having a temporary stage, a plurality of pins, etc. must be separately used for center alignment (that is, center correction).

本發明係鑒於所述問題點而完成，其目的在於提供一種晶圓搬送裝置，可在以晶圓搬送裝置保持晶圓的狀態下進行晶圓的定位。The present invention was completed in view of the above-mentioned problems, and its object is to provide a wafer transfer device that can position the wafer while holding the wafer by the wafer transfer device.

[發明所欲解決的課題] 根據本發明之一態樣，可提供一種晶圓搬送裝置，其具備：保持板，其具有面對晶圓之一面的保持面；吸引保持部，其設置成在該保持面露出，以非接觸方式吸引保持面對該保持面的該晶圓；3個以上的限制構件，各自具有可自轉的滾輪部，藉由該滾輪部與以該吸引保持部吸引保持的該晶圓之外周緣接觸，來限制該晶圓在與該晶圓之該一面平行的方向上相對於該保持板的移動；以及移動單元，其與該保持板連接，藉由使該保持板移動來搬送該晶圓；該3個以上的限制構件之中至少1個限制構件為旋轉驅動部，其係在該滾輪部與該晶圓的外周緣接觸的狀態下，藉由使該滾輪部自轉而使該晶圓旋轉。[The problem to be solved by the invention] According to an aspect of the present invention, there can be provided a wafer transfer device, which includes: a holding plate having a holding surface facing one surface of the wafer; The method attracts and holds the wafer facing the holding surface; three or more restricting members each have a roller portion that can rotate, and the roller portion contacts the outer periphery of the wafer attracted and held by the suction and holding portion, To restrict the movement of the wafer relative to the holding plate in a direction parallel to the one surface of the wafer; and a moving unit connected to the holding plate to transport the wafer by moving the holding plate; the At least one of the three or more restricting members is a rotation drive portion that rotates the wafer by rotating the roller portion while the roller portion is in contact with the outer periphery of the wafer.

較佳係進一步具備缺口嵌合部，其在朝向吸引保持於該保持板的該晶圓之內側而被賦與勢能的狀態下與該晶圓的外周緣接觸，並可與設於該晶圓之外周部的缺口嵌合；以該缺口嵌合部與該缺口嵌合時該旋轉驅動部即停止旋轉的方式控制該旋轉驅動部的運作。Preferably, it is further provided with a notch fitting portion which contacts the outer periphery of the wafer in a state of being applied with potential energy toward the inside of the wafer held by the holding plate, and is capable of contacting the outer periphery of the wafer. The notch fitting of the outer peripheral part; the operation of the rotation driving part is controlled in such a way that the rotation driving part stops rotating when the notch fitting part is fitted into the notch.

又，較佳係進一步具備攝影機單元，其在該晶圓被吸引保持於該保持板的狀態下拍攝該晶圓的外周緣；依據以該攝影機單元檢測出的該晶圓之方向來控制該旋轉驅動部的運作。Moreover, it is preferable to further include a camera unit that photographs the outer periphery of the wafer in a state where the wafer is attracted and held by the holding plate; and controls the rotation according to the direction of the wafer detected by the camera unit The operation of the drive unit.

又，較佳係該旋轉驅動部具有與該旋轉驅動部的旋轉軸連結的旋轉驅動源，藉由該旋轉驅動源進行旋轉而使該旋轉軸自轉。Furthermore, it is preferable that the rotation driving part has a rotation driving source connected to the rotation shaft of the rotation driving part, and the rotation driving source rotates to rotate the rotation shaft.

又，較佳係該晶圓搬送裝置進一步具備外部旋轉驅動部，其在與該旋轉驅動部的滾輪部之側面接觸的狀態下使該旋轉驅動部的滾輪部自轉。Moreover, it is preferable that the wafer transfer apparatus further includes an external rotation drive unit that rotates the roller portion of the rotation drive unit while being in contact with the side surface of the roller portion of the rotation drive unit.

[發明功效] 在本發明之一態樣的晶圓搬送裝置之保持板上設有以非接觸方式吸引保持晶圓的吸引保持部。又，在晶圓搬送裝置上設有3個以上的限制構件，各自具有可自轉的滾輪部。藉由滾輪部與以吸引保持部吸引保持的晶圓之外周緣接觸，來限制晶圓在與晶圓之一面平行的方向上相對於保持板的移動。因此，可在以晶圓搬送裝置吸引保持晶圓的狀態下，將晶圓定位於保持板的預定位置。[Efficacy of invention] The holding plate of the wafer transfer apparatus of one aspect of the present invention is provided with a suction and holding portion that sucks and holds the wafer in a non-contact manner. In addition, three or more restricting members are provided on the wafer transfer device, and each has a roller portion capable of rotating. The roller part contacts the outer periphery of the wafer sucked and held by the suction holding part to restrict the movement of the wafer relative to the holding plate in a direction parallel to one surface of the wafer. Therefore, the wafer can be positioned at a predetermined position on the holding plate in a state where the wafer is sucked and held by the wafer transfer device.

此外，至少1個限制構件為旋轉驅動部，其係在滾輪部與晶圓的外周緣接觸的狀態下，藉由使滾輪部自轉而使晶圓旋轉。因此，可在以晶圓搬送裝置吸引保持晶圓的狀態下，使用旋轉驅動部使晶圓往預定方向旋轉。從而，可省略與晶圓搬送裝置分開設置的對位裝置以及使用此對位裝置的中心對位步驟。In addition, at least one restricting member is a rotation drive part that rotates the wafer by rotating the roller part while the roller part is in contact with the outer periphery of the wafer. Therefore, it is possible to rotate the wafer in a predetermined direction by using the rotation drive unit while sucking and holding the wafer by the wafer transfer device. Therefore, the alignment device provided separately from the wafer transfer device and the center alignment step using the alignment device can be omitted.

參閱附圖說明本發明之一態樣的實施方式。圖1係第1實施方式之晶圓搬送裝置10的立體圖。此外，以下說明中使用的第1方向A、第2方向B及第3方向C互相垂直。第3方向C為晶圓搬送裝置10的高度方向。The embodiments of one aspect of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a wafer transfer apparatus 10 according to the first embodiment. In addition, the first direction A, the second direction B, and the third direction C used in the following description are perpendicular to each other. The third direction C is the height direction of the wafer transfer device 10.

晶圓搬送裝置10設於例如切割裝置、研削裝置、研磨裝置、研削／研磨裝置、雷射加工裝置（未圖示）等。又，晶圓搬送裝置10亦可設於在晶圓上貼附樹脂製保護片等的膠膜黏貼機（未圖示）上。The wafer transfer device 10 is provided in, for example, a dicing device, a grinding device, a polishing device, a grinding/polishing device, a laser processing device (not shown), and the like. In addition, the wafer transfer device 10 may be installed on an adhesive film bonding machine (not shown) that attaches a resin protective sheet or the like to a wafer.

晶圓搬送裝置10係所謂的多關節型機械手臂。晶圓搬送裝置10具備開迴路（open loop）結構之多節連桿的移動單元12。移動單元12具有圓筒狀的第1支撐旋轉部14。The wafer transfer device 10 is a so-called multi-joint robot arm. The wafer transfer apparatus 10 includes a moving unit 12 of a multi-link link having an open loop structure. The moving unit 12 has a cylindrical first support rotating part 14.

第1支撐旋轉部14具有圓筒狀的殼體。可於第3方向C（高度方向）上下移動的移動機構（未圖示）連結於殼體的底部，第1支撐旋轉部14可藉由此移動機構而沿著第3方向C移動。The first supporting and rotating portion 14 has a cylindrical housing. A moving mechanism (not shown) that can move up and down in the third direction C (height direction) is connected to the bottom of the housing, and the first support rotating part 14 can be moved along the third direction C by this moving mechanism.

第1支撐旋轉部14的殼體內部容納有與第3方向C大致平行的第1旋轉軸（未圖示）。馬達等的第1驅動源（未圖示）連結於第1旋轉軸的底部，位於第1連桿16之一端側的第1連桿16之底部側連結於第1旋轉軸的上部。A first rotating shaft (not shown) that is substantially parallel to the third direction C is housed inside the housing of the first supporting rotating part 14. A first drive source (not shown) such as a motor is connected to the bottom of the first rotating shaft, and the bottom side of the first link 16 located on the one end side of the first link 16 is connected to the upper part of the first rotating shaft.

藉由使第1驅動源運作，第1連桿16以位於第1連桿16之一端側的第1旋轉軸為支點，而在與第1方向A及第2方向B所規定的平面（以下稱為AB平面）平行的平面內旋轉。By operating the first drive source, the first link 16 uses the first rotation axis located at one end of the first link 16 as a fulcrum, and is in a plane defined by the first direction A and the second direction B (below It is called AB plane) and rotates in a parallel plane.

在第1連桿16之一端側設有第1帶輪（未圖示）。又，在第1連桿16之另一端側設有透過皮帶（未圖示）與第1帶輪連接的第2帶輪（未圖示）。第1帶輪、皮帶及第2帶輪容納於第1連桿16的殼體內部。A first pulley (not shown) is provided on one end side of the first link 16. In addition, a second pulley (not shown) connected to the first pulley through a belt (not shown) is provided on the other end side of the first link 16. The first pulley, the belt, and the second pulley are housed in the housing of the first link 16.

與第3方向C大致平行地設置的第2旋轉軸（未圖示）連結於第2帶輪。位於第2連桿18之一端側的第2連桿18之底部側連結於第2旋轉軸的上部。因此，若使第1帶輪旋轉，則第2帶輪及第2連桿18會透過皮帶進行旋轉，且第2連桿18在與AB平面平行的平面內旋轉。A second rotating shaft (not shown) provided substantially parallel to the third direction C is connected to the second pulley. The bottom side of the second link 18 located on the one end side of the second link 18 is connected to the upper part of the second rotating shaft. Therefore, if the first pulley is rotated, the second pulley and the second link 18 rotate through the belt, and the second link 18 rotates in a plane parallel to the AB plane.

在位於第2連桿18之另一端側的第2連桿18之上部側，連結有與第3方向C大致平行地設置的第3旋轉軸（未圖示）。第3旋轉軸容納於圓筒殼體20的內部。馬達等的第2驅動源（未圖示）連結於第3旋轉軸的底部。On the upper side of the second link 18 located on the other end side of the second link 18, a third rotation shaft (not shown) provided substantially parallel to the third direction C is connected. The third rotating shaft is housed in the inside of the cylindrical housing 20. A second drive source (not shown) such as a motor is connected to the bottom of the third rotating shaft.

又，第3連桿22的底部側連結於第3旋轉軸的上部。藉由使第2驅動源運作，第3連桿22以第3旋轉軸為支點而在與AB平面平行的平面內旋轉。在第3連桿22的側部設有沿著與AB平面平行之直線的臂部旋轉軸24。In addition, the bottom side of the third link 22 is connected to the upper part of the third rotating shaft. By operating the second drive source, the third link 22 rotates in a plane parallel to the AB plane with the third rotation axis as a fulcrum. On the side of the third link 22, an arm rotating shaft 24 is provided along a straight line parallel to the AB plane.

設於第3連桿22之殼體內的馬達等的第3驅動源（未圖示）連結於臂部旋轉軸24之一端側。藉由使第3驅動源運作，臂部旋轉軸24以與AB平面平行之直線為旋轉軸進行旋轉。A third drive source (not shown) such as a motor provided in the housing of the third link 22 is connected to one end side of the arm rotating shaft 24. By operating the third drive source, the arm rotation shaft 24 rotates with a straight line parallel to the AB plane as the rotation axis.

長方體狀的臂部26之一端側固定於臂部旋轉軸24之另一端側。作為端接器的手部28連接於臂部26之另一端側。手部28具有由金屬、陶瓷等所形成的保持板30。One end of the rectangular parallelepiped arm 26 is fixed to the other end of the arm rotating shaft 24. The hand 28 as a terminator is connected to the other end side of the arm 26. The hand 28 has a holding plate 30 formed of metal, ceramic, or the like.

保持板30具有位於手部28之一端側（亦即，臂部26側）的矩形狀的腕部30a。又，在相對於腕部30a而與臂部26為相反側，設有比腕部30a更寬的連接部30b。The holding plate 30 has a rectangular wrist portion 30 a located on one end side of the hand 28 (that is, on the arm portion 26 side). In addition, on the side opposite to the arm portion 26 with respect to the arm portion 30a, a connecting portion 30b that is wider than the arm portion 30a is provided.

在相對於連接部30b而與腕部30a為相反側，以相對於連接部30b在寬度方向的中心左右對稱的態樣設有2個指部30c。各指部30c沿著與臂部旋轉軸24的軸向大致平行的方向（亦即，保持板30的長度方向）延伸。又，2個指部30c在與保持板30之長度方向正交的保持板30之寬度方向中互相分離。On the side opposite to the arm portion 30a with respect to the connecting portion 30b, two finger portions 30c are provided so as to be bilaterally symmetrical with respect to the center of the connecting portion 30b in the width direction. Each finger 30c extends in a direction substantially parallel to the axial direction of the arm rotating shaft 24 (that is, the longitudinal direction of the holding plate 30). In addition, the two fingers 30c are separated from each other in the width direction of the holding plate 30 orthogonal to the longitudinal direction of the holding plate 30.

在保持板30的正面（亦即，保持面30d）側，以從保持面30d露出的態樣設有多個墊片32。各墊片32構成用以吸引晶圓11（詳述如下）的吸引保持部。On the front side of the holding plate 30 (that is, the holding surface 30d), a plurality of spacers 32 are provided in a state of being exposed from the holding surface 30d. Each pad 32 constitutes a suction holding portion for sucking the wafer 11 (described in detail below).

在連接部30b上設有2個墊片32，此2個墊片32以在保持板30的寬度方向上互相分開的態樣配置。又，在各指部30c上設有2個墊片32，此2個墊片32配置成沿著保持板30的長度方向互相分開。但是，墊片32的數量、配置等並不限定於上述例子。Two spacers 32 are provided on the connecting portion 30b, and the two spacers 32 are arranged in a state of being separated from each other in the width direction of the holding plate 30. In addition, two shims 32 are provided on each finger 30c, and the two shims 32 are arranged to be separated from each other along the longitudinal direction of the holding plate 30. However, the number, arrangement, etc. of the spacers 32 are not limited to the above-mentioned examples.

各墊片32為大致圓盤狀，在各墊片32的露出面側設有環狀凹部。於此環狀凹部的內周側之側部，沿著凹部的圓周方向分散地設有用以噴射空氣等流體的多個噴嘴（未圖示）。例如，沿著凹部的圓周方向，以等距離分散的方式設有4個噴嘴。Each gasket 32 has a substantially disc shape, and an annular recessed portion is provided on the exposed surface side of each gasket 32. A plurality of nozzles (not shown) for injecting fluids such as air are provided on the side portion on the inner peripheral side of the ring-shaped recessed portion. For example, along the circumferential direction of the recessed portion, four nozzles are provided in an equidistant manner.

從空氣供給源（未圖示）對各噴嘴供給空氣。若在從各墊片32的露出面側噴射空氣的狀態下，以面對各墊片32的方式將晶圓11之一面（例如，背面11b）（參閱圖2（A）至圖2（C））定位，則空氣在晶圓11之一面與墊片32之間隙流動。Air is supplied to each nozzle from an air supply source (not shown). If air is sprayed from the exposed side of each pad 32, one side (for example, back side 11b) of the wafer 11 facing each pad 32 (see FIG. 2(A) to FIG. 2(C) )) Positioning, the air flows in the gap between one surface of the wafer 11 and the spacer 32.

若在間隙流動的空氣流速提高，則間隙的壓力根據白努利（Bernoulli）定理而降低。藉此，在墊片32的露出面側產生比大氣壓低預定壓力的負壓。藉由此負壓，晶圓11不會接觸保持面30d及墊片32，而以非接觸方式被吸引保持於保持面30d。If the flow rate of the air flowing in the gap increases, the pressure of the gap decreases according to Bernoulli's theorem. Thereby, a negative pressure lower than the atmospheric pressure by a predetermined pressure is generated on the exposed surface side of the gasket 32. Due to this negative pressure, the wafer 11 does not contact the holding surface 30d and the spacer 32, but is attracted and held on the holding surface 30d in a non-contact manner.

從墊片32的露出面側噴射的空氣，例如噴射成氣旋（cyclone）狀，但亦可噴射成放射狀。此外，適當調整空氣的噴射方向、流量等，以使晶圓11不會因噴射之空氣而在與晶圓11之一面平行的平面內旋轉。The air jetted from the exposed surface side of the gasket 32 is jetted in a cyclone shape, for example, but it may also be jetted in a radial shape. In addition, the spray direction and flow rate of the air are appropriately adjusted so that the wafer 11 does not rotate in a plane parallel to one surface of the wafer 11 due to the sprayed air.

此處，使用圖2（A）至圖2（C）說明以保持板30保持的晶圓11。圖2（A）係晶圓11之上表面側的立體圖，圖2（B）係晶圓11之下表面側的立體圖。Here, the wafer 11 held by the holding plate 30 will be described using FIGS. 2(A) to 2(C). FIG. 2(A) is a perspective view of the upper surface side of the wafer 11, and FIG. 2(B) is a perspective view of the lower surface side of the wafer 11.

晶圓11具有例如直徑300mm的圓盤狀基板。晶圓11的正面11a側被互相交叉的多條分割預定線（切割道）13劃分成多個區域，在各區域上形成有IC（Integrated Circuit，積體電路）等的元件15。The wafer 11 has, for example, a disk-shaped substrate with a diameter of 300 mm. The front surface 11 a side of the wafer 11 is divided into a plurality of regions by a plurality of planned dividing lines (dicing lanes) 13 crossing each other, and elements 15 such as IC (Integrated Circuit) are formed in each region.

本實施方式之基板係使用矽（Si）等的半導體材料所形成，但基板的材質、形狀、結構、大小等並無限制。基板亦可由其他半導體、陶瓷、樹脂等的材料所形成。又，元件15的種類、數量、形狀、結構、大小、配置等亦無限制。正面11a側亦可不形成元件15。The substrate of this embodiment is formed using a semiconductor material such as silicon (Si), but the material, shape, structure, size, etc. of the substrate are not limited. The substrate may also be formed of other materials such as semiconductors, ceramics, and resins. In addition, there are no restrictions on the type, number, shape, structure, size, arrangement, etc. of the elements 15. The element 15 may not be formed on the front side 11a.

在正面11a及外周緣11c之間、背面11b及外周緣11c之間形成有斜角部。又，在晶圓11的外周部形成有表示晶圓11之基板晶體方向的缺口17。Beveled corners are formed between the front surface 11a and the outer peripheral edge 11c, and between the back surface 11b and the outer peripheral edge 11c. In addition, a notch 17 indicating the crystal direction of the substrate of the wafer 11 is formed in the outer peripheral portion of the wafer 11.

此外，晶圓11並不限定於圖2（A）及圖2（B）所示的例子。晶圓11亦可為在正面11a側設有金屬製的多個凸塊（未圖示）的所謂附凸塊之晶圓。In addition, the wafer 11 is not limited to the example shown in FIG. 2(A) and FIG. 2(B). The wafer 11 may be a so-called bumped wafer in which a plurality of metal bumps (not shown) are provided on the front surface 11a side.

圖2（C）係另一例的晶圓11之下表面側的立體圖。如圖2（C）所示，亦可於晶圓11上，藉由將背面11b側的內周部研削去除，而形成圓形的凹部19a。藉由在晶圓11的外周部殘留外周環19b，相較於未形成凹部19a的情況，可減少晶圓11的翹曲，再者，可提高晶圓11的強度。FIG. 2(C) is a perspective view of the lower surface side of the wafer 11 of another example. As shown in FIG. 2(C), it is also possible to form a circular recess 19a on the wafer 11 by grinding and removing the inner peripheral portion on the side of the back surface 11b. By leaving the outer peripheral ring 19b on the outer peripheral portion of the wafer 11, the warpage of the wafer 11 can be reduced compared with the case where the recessed portion 19a is not formed, and further, the strength of the wafer 11 can be improved.

接著，參閱圖1、圖3及圖4說明晶圓搬送裝置10之其他構成要件的滾輪夾34。圖3係手部28等的俯視圖。圖4係手部28等的局部剖面側視圖。Next, referring to FIGS. 1, 3, and 4, the roller clamp 34, which is another component of the wafer transfer device 10, will be described. FIG. 3 is a plan view of the hand 28 and the like. Fig. 4 is a partial cross-sectional side view of the hand 28 and the like.

在手部28上設有3個以上之滾輪夾（限制構件）34，其限制晶圓11在與以多個墊片32吸引保持的晶圓11之一面（例如，背面11b）平行的方向上移動。Three or more roller clamps (restriction members) 34 are provided on the hand 28, which restrict the wafer 11 in a direction parallel to one surface (for example, the back surface 11b) of the wafer 11 held by the plurality of spacers 32. mobile.

此外，晶圓11在與晶圓11之一面平行的方向上的移動，係指第1方向A、第2方向B等的直線方向，而並非指以預定軸為中心的晶圓11之旋轉。In addition, the movement of the wafer 11 in a direction parallel to one surface of the wafer 11 refers to the linear directions such as the first direction A and the second direction B, and does not refer to the rotation of the wafer 11 centered on a predetermined axis.

滾輪夾34在各指部30c的前端部設有1個。再者，在腕部30a的側邊設有1對滾輪夾34。亦即，在晶圓搬送裝置10上設有共計4個滾輪夾34。One roller clamp 34 is provided at the tip of each finger 30c. Furthermore, a pair of roller clips 34 are provided on the side of the wrist 30a. That is, a total of four roller clamps 34 are provided on the wafer transfer device 10.

設於腕部30a之側邊的1對滾輪夾34與位於腕部30a之下方的移動板36連結。此外，圖1中省略移動板36。A pair of roller clips 34 provided on the side of the wrist 30a are connected to the moving plate 36 located below the wrist 30a. In addition, the moving plate 36 is omitted in FIG. 1.

移動板36可藉由未圖示的致動器而沿著保持板30的長度方向進退。移動板36具有連結於臂部26之另一端側的第1區域36a。在相對於第1區域36a而與臂部26為相反側則設有棒狀的第2區域36b，該第2區域36b具有大於腕部30a的寬度之長度。The moving plate 36 can advance and retreat along the length direction of the holding plate 30 by an actuator not shown. The moving plate 36 has a first region 36 a connected to the other end side of the arm portion 26. A rod-shaped second area 36b is provided on the side opposite to the arm portion 26 with respect to the first area 36a, and the second area 36b has a length greater than the width of the arm portion 30a.

第2區域36b具有相對於預定中心線左右對稱的形狀，其配置成相對於腕部30a在寬度方向的中心左右對稱的態樣。在第2區域36b的兩端設有上述1對滾輪夾34。The second region 36b has a shape that is bilaterally symmetrical with respect to a predetermined center line, and is arranged to be bilaterally symmetrical with respect to the center of the width direction of the wrist 30a. The aforementioned pair of roller clamps 34 are provided at both ends of the second area 36b.

此處，說明滾輪夾34的結構。滾輪夾34具有分別固定於指部30c之前端部及第2區域36b之兩端部的圓筒狀的支撐旋轉部34a。在支撐旋轉部34a上設有沿著第3方向C的旋轉軸（未圖示）。Here, the structure of the roller clamp 34 will be described. The roller clamp 34 has cylindrical supporting and rotating parts 34a fixed to the front end of the finger 30c and the two ends of the second region 36b, respectively. A rotating shaft (not shown) along the third direction C is provided on the supporting rotating portion 34a.

在旋轉軸的上部設有圓盤狀的滾輪部34b，該滾輪部34b的直徑大於支撐旋轉部34a的直徑。滾輪部34b係由例如具有不會損傷晶圓11之硬度程度的樹脂發泡體所形成。滾輪部34b具有與晶圓11的外周緣11c接觸也不會滑動之程度的摩擦係數。A disc-shaped roller part 34b is provided on the upper part of the rotating shaft, and the diameter of the roller part 34b is larger than the diameter of the supporting rotating part 34a. The roller portion 34b is formed of, for example, a resin foam having a degree of hardness that does not damage the wafer 11. The roller portion 34b has a coefficient of friction to the extent that it does not slip even if it contacts the outer peripheral edge 11c of the wafer 11.

各滾輪夾34的滾輪部34b可在與外周緣11c接觸的狀態下自轉。在多個滾輪夾34之中至少1個滾輪夾34之旋轉軸（未圖示）的底部連結有馬達、致動器等的第1旋轉驅動源34c。The roller portion 34b of each roller clamp 34 can rotate while being in contact with the outer peripheral edge 11c. A first rotation drive source 34c such as a motor and an actuator is connected to the bottom of a rotating shaft (not shown) of at least one of the roller clamps 34 among the plurality of roller clamps 34.

連結有第1旋轉驅動源34c之滾輪夾34發揮作為使晶圓11旋轉（自轉）之旋轉驅動部的功能。圖3及圖4所示的例中，位於指部30c之前端且於第2方向B之一側的1個滾輪夾34具有第1旋轉驅動源34c，其發揮作為旋轉驅動部的功能。The roller clamp 34 to which the first rotation drive source 34 c is connected functions as a rotation drive unit that rotates (rotates) the wafer 11. In the example shown in FIGS. 3 and 4, one roller clip 34 located at the front end of the finger 30c and on one side of the second direction B has a first rotation drive source 34c, which functions as a rotation drive unit.

本實施方式中，藉由在以滾輪部34b夾住外周緣11c不同四處的狀態下使第1旋轉驅動源34c運作，以使旋轉驅動部的旋轉軸及滾輪部34b自轉。藉此，可在限制晶圓11在與晶圓11之一面平行的方向上移動的狀態下使晶圓11旋轉（自轉）。In this embodiment, the first rotation drive source 34c is operated in a state where the outer peripheral edge 11c is sandwiched by the roller portion 34b at four different locations, so that the rotation shaft of the rotation drive portion and the roller portion 34b are rotated. Thereby, the wafer 11 can be rotated (rotated) while restricting the movement of the wafer 11 in the direction parallel to the one surface of the wafer 11.

例如，在圖3所示的俯視視角下，只要使滾輪部34b順時針自轉，則可使晶圓11逆時針旋轉，同樣地，只要使滾輪部34b逆時針自轉，則可使晶圓11順時針旋轉。For example, in the top view angle shown in FIG. 3, as long as the roller portion 34b is rotated clockwise, the wafer 11 can be rotated counterclockwise, and similarly, as long as the roller portion 34b is rotated counterclockwise, the wafer 11 can be rotated clockwise. The hour hand rotates.

此外，發揮作為旋轉驅動部之功能的滾輪夾34，並不限定位於指部30c之前端且於第2方向B之一側的滾輪夾34，亦可為任意位置的滾輪夾34。又，發揮作為旋轉驅動部之功能的滾輪夾34，其數量並不限定於1個，亦可為2個以上。In addition, the roller clamp 34 that functions as a rotation driving portion is not limited to the roller clamp 34 located at the front end of the finger 30c and on one side of the second direction B, and may be a roller clamp 34 at any position. In addition, the number of the roller clamps 34 that function as a rotation drive unit is not limited to one, and may be two or more.

晶圓搬送裝置10之一零件的攝影機單元38以與保持面30d對向的方式設於晶圓搬送裝置10的附近。攝影機單元38包含CMOS（Complementary Metal Oxide Semiconductor，互補式金屬氧化物半導體）影像感測器或CCD（Charge Coupled Device，電荷耦合元件）影像感測器等。攝影機單元38從上方拍攝以保持面30d保持的晶圓11之外周緣11c，並將所拍攝之影像傳送至下述控制部。The camera unit 38, which is a part of the wafer transfer device 10, is provided in the vicinity of the wafer transfer device 10 so as to face the holding surface 30d. The camera unit 38 includes a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor, etc. The camera unit 38 photographs the outer periphery 11c of the wafer 11 held by the holding surface 30d from above, and transmits the photographed image to the following control unit.

本實施方式之攝影機單元38係從保持板30分離，而固定於預定位置。然而，攝影機單元38只要係不會妨礙進入容納有晶圓11之卡匣程度的小型攝影機單元38，則亦能夠以位於保持板30之側邊的方式固定於保持板30。固定於保持板30之攝影機單元38，例如，可從上方拍攝晶圓11的外周部，亦可從下方拍攝。The camera unit 38 of this embodiment is separated from the holding plate 30 and fixed at a predetermined position. However, as long as the camera unit 38 is a small camera unit 38 that does not hinder access to the cassette containing the wafer 11, it can also be fixed to the holding plate 30 so as to be located on the side of the holding plate 30. The camera unit 38 fixed to the holding plate 30, for example, can photograph the outer periphery of the wafer 11 from above, or from below.

晶圓搬送裝置10係加工裝置（未圖示）的一部分，晶圓搬送裝置10、攝影機單元38等的運作係由控制加工裝置之運作的控制部（未圖示）所控制。控制部係由包含CPU（Central Processing Unit，中央處理單元）等處理裝置及快閃記憶體等記憶裝置的電腦所構成。The wafer transfer device 10 is a part of a processing device (not shown), and the operations of the wafer transfer device 10, the camera unit 38, and the like are controlled by a control unit (not shown) that controls the operation of the processing device. The control unit is composed of a computer including a CPU (Central Processing Unit, central processing unit) and other processing devices and flash memory and other memory devices.

藉由依照記憶於記憶裝置之程式等的軟體使處理裝置運作，控制部發揮作為軟體與處理裝置（硬體資源）協作之具體手段的功能。By operating the processing device in accordance with software such as programs stored in the memory device, the control unit functions as a specific means of cooperation between the software and the processing device (hardware resources).

控制部包含影像處理部（未圖示），其藉由處理以攝影機單元38拍攝之影像，來檢測晶圓11的缺口17等。影像處理部係藉由例如記憶於記憶裝置之軟體來實現，但並不限定於軟體，亦可為針對特定用途之積體電路（ASIC）等的硬體。The control unit includes an image processing unit (not shown), which detects the notch 17 of the wafer 11 and the like by processing the image taken by the camera unit 38. The image processing unit is realized by, for example, software stored in a memory device, but it is not limited to software, and can also be hardware such as integrated circuits (ASIC) for specific purposes.

接著，使用第1實施方式所示之晶圓搬送裝置10說明搬送晶圓11的方法。此外，容納有多個晶圓11之卡匣（未圖示）載置於加工裝置的卡匣載置台（未圖示）上。Next, a method of transporting the wafer 11 will be described using the wafer transport device 10 shown in the first embodiment. In addition, a cassette (not shown) accommodating a plurality of wafers 11 is placed on a cassette mounting table (not shown) of the processing apparatus.

首先，使移動單元12運作，將手部28插入卡匣內（插入步驟（S10））。然後，藉由從多個墊片32噴射流體，吸引並保持例如晶圓11的背面11b側（吸引保持步驟（S20））。First, the moving unit 12 is operated, and the hand 28 is inserted into the cassette (insertion step (S10)). Then, the fluid is ejected from the plurality of spacers 32 to suck and hold, for example, the back surface 11b side of the wafer 11 (suction and hold step (S20)).

接著，使移動板36從臂部26側移動至連接部30b側，直到晶圓11的外周緣11c接觸各滾輪夾34的滾輪部34b（接觸步驟（S30））。藉此，晶圓11在與晶圓11之背面11b平行的方向上的移動被4個滾輪夾34所限制。Next, the moving plate 36 is moved from the arm part 26 side to the connecting part 30b side until the outer peripheral edge 11c of the wafer 11 contacts the roller part 34b of each roller clamp 34 (contact step (S30)). In this way, the movement of the wafer 11 in a direction parallel to the back surface 11 b of the wafer 11 is restricted by the four roller clamps 34.

在接觸步驟（S30）中將晶圓11對位後，使移動單元12運作，將手部28取出卡匣外，並將晶圓11的外周部定位於攝影機單元38的下方。然後，一邊以旋轉驅動部使晶圓11旋轉，一邊以攝影機單元38拍攝晶圓11的外周部（攝像步驟（S40））。After the wafer 11 is aligned in the contact step (S30), the moving unit 12 is operated, the hand 28 is taken out of the cassette, and the outer periphery of the wafer 11 is positioned below the camera unit 38. Then, while the wafer 11 is rotated by the rotation drive unit, the outer peripheral portion of the wafer 11 is imaged by the camera unit 38 (imaging step (S40)).

此時，影像處理部在影像內檢測缺口17。若影像內檢測出缺口17，則停止晶圓11的旋轉。接著，控制部計算晶圓11的方向（亦即，缺口17的位置）從預定的方向偏離了何種程度（亦即，多大角度）。At this time, the image processing unit detects the gap 17 in the image. If the notch 17 is detected in the image, the rotation of the wafer 11 is stopped. Next, the control unit calculates how far the direction of the wafer 11 (that is, the position of the notch 17) has deviated from the predetermined direction (that is, by what angle).

控制部使第1旋轉驅動源34c運作，以使晶圓11依據缺口17之方向僅旋轉必要的角度（晶圓旋轉步驟（S50））。此外，晶圓11在與晶圓11之背面11b平行的方向上被4個滾輪夾34限制移動，但在晶圓11之圓周方向上的移動不受限制。The control unit operates the first rotation driving source 34c so that the wafer 11 is rotated by only a necessary angle in accordance with the direction of the notch 17 (wafer rotation step (S50)). In addition, the movement of the wafer 11 in the direction parallel to the back surface 11b of the wafer 11 is restricted by the four roller clamps 34, but the movement in the circumferential direction of the wafer 11 is not restricted.

藉由使旋轉驅動部的滾輪部34b自轉，可使晶圓11以預定軸為中心進行旋轉（自轉），而將缺口17相對於手部28定位於預定位置。亦即，可調整晶圓11的方向。By rotating the roller portion 34 b of the rotation driving portion, the wafer 11 can be rotated (rotated) around a predetermined axis, and the notch 17 can be positioned at a predetermined position with respect to the hand 28. That is, the direction of the wafer 11 can be adjusted.

如此，本實施方式中，可在以手部28保持晶圓11的狀態下調整晶圓11的定位及方向。因此，可省略與晶圓搬送裝置10分開設置的對位裝置及使用此對位裝置的中心對位步驟。In this way, in this embodiment, the positioning and direction of the wafer 11 can be adjusted while the hand 28 holds the wafer 11. Therefore, the alignment device provided separately from the wafer transfer device 10 and the center alignment step using the alignment device can be omitted.

晶圓旋轉步驟（S50）之後，使移動單元12運作，將以手部28吸引保持之晶圓11搬送至設於加工區域之卡盤台（未圖示）（搬送步驟（S60））。After the wafer rotation step (S50), the moving unit 12 is operated, and the wafer 11 sucked and held by the hand 28 is transported to a chuck table (not shown) provided in the processing area (transport step (S60)).

此時，使第3驅動源運作以使臂部旋轉軸24旋轉180度，藉此使晶圓11反轉。此外，晶圓11係由保持面30d吸引保持，因此即便使保持面30d反轉亦不會從保持面30d落下。At this time, the third driving source is operated to rotate the arm rotating shaft 24 by 180 degrees, thereby inverting the wafer 11. In addition, the wafer 11 is sucked and held by the holding surface 30d, so even if the holding surface 30d is reversed, it does not fall from the holding surface 30d.

例如，以晶圓11之背面11b側露出、正面11a側面對卡盤台的方式，將晶圓11載置於卡盤台上。此外，本實施方式中雖然說明以保持面30d保持晶圓11之背面11b側的例子，但亦能夠以保持面30d保持晶圓11之正面11a側。For example, the wafer 11 is placed on the chuck table so that the back surface 11b side of the wafer 11 is exposed and the front side 11a side faces the chuck table. In addition, although the example in which the back surface 11b side of the wafer 11 is held by the holding surface 30d in this embodiment is demonstrated, it is also possible to hold the front surface 11a side of the wafer 11 by the holding surface 30d.

接著，說明晶圓搬送裝置10的第2實施方式。圖5係第2實施方式之手部28等的俯視圖。第2實施方式之手部28具備缺口嵌合部40代替攝影機單元38。Next, a second embodiment of the wafer transfer apparatus 10 will be described. FIG. 5 is a plan view of the hand 28 and the like in the second embodiment. The hand 28 of the second embodiment includes a notch fitting portion 40 instead of the camera unit 38.

缺口嵌合部40係在俯視視角下具有大致L形的棒狀構件。缺口嵌合部40之一端40a可旋轉地連結於移動板36的第2區域36b之一端側。又，在缺口嵌合部40之一端40a側連結有彈簧等的賦能構件（未圖示），缺口嵌合部40在俯視視角下往順時針方向而被賦與勢能。The notch fitting portion 40 is a rod-shaped member having a substantially L-shape in a plan view. One end 40 a of the notch fitting portion 40 is rotatably connected to one end side of the second region 36 b of the moving plate 36. In addition, an energizing member (not shown) such as a spring is connected to one end 40a of the notch fitting portion 40, and the notch fitting portion 40 is given potential energy in a clockwise direction in a plan view.

缺口嵌合部40之另一端40b側具有可嵌合於缺口17的凸狀。缺口嵌合部40之另一端40b配置成朝向連接部30b及指部30c側而非朝向臂部26側。The other end 40b side of the notch fitting portion 40 has a convex shape that can be fitted into the notch 17. The other end 40b of the notch fitting portion 40 is arranged to face the connecting portion 30b and the finger portion 30c instead of the arm portion 26 side.

接著，說明第2實施方式之搬送晶圓11的方法。第2實施方式中亦進行插入步驟（S10）及吸引保持步驟（S20）。接觸步驟（S30）中，在以保持面30d吸引保持晶圓11的狀態下，使移動板36移動，以使各滾輪夾34接觸外周緣11c。此時，缺口嵌合部40之另一端40b亦因朝向晶圓11內側的賦能力而接觸外周緣11c。Next, the method of transporting the wafer 11 of the second embodiment will be described. In the second embodiment, the insertion step (S10) and the suction holding step (S20) are also performed. In the contact step (S30), while the wafer 11 is sucked and held by the holding surface 30d, the moving plate 36 is moved so that the roller clamps 34 contact the outer peripheral edge 11c. At this time, the other end 40b of the notch fitting portion 40 also contacts the outer peripheral edge 11c due to the energizing force toward the inside of the wafer 11.

第2實施方式中，省略攝像步驟（S40），而進行晶圓旋轉步驟（S50）。第2實施方式之晶圓旋轉步驟（S50）中，控制部以下述方式控制該滾輪夾34的運作：若缺口嵌合部40之另一端40b嵌合於缺口17，則旋轉驅動部的滾輪夾34停止旋轉。以此方式使晶圓11旋轉而將缺口17相對於手部28定位於預定位置。之後，與第1實施方式相同地進行搬送步驟（S60）。In the second embodiment, the imaging step (S40) is omitted, and the wafer rotation step (S50) is performed. In the wafer rotation step (S50) of the second embodiment, the control unit controls the operation of the roller clamp 34 in the following manner: if the other end 40b of the notch fitting part 40 is fitted into the notch 17, the roller clamp of the driving part is rotated 34 stops rotating. In this way, the wafer 11 is rotated to position the notch 17 at a predetermined position relative to the hand 28. After that, the transport step (S60) is performed in the same manner as in the first embodiment.

第2實施方式中，亦可在以手部28保持晶圓11的狀態下調整晶圓11的定位及方向。因此，可省略與晶圓搬送裝置10分開設置的對位裝置及使用此對位裝置的中心對位步驟。In the second embodiment, the positioning and direction of the wafer 11 may be adjusted while the hand 28 is holding the wafer 11. Therefore, the alignment device provided separately from the wafer transfer device 10 and the center alignment step using the alignment device can be omitted.

接著，說明晶圓搬送裝置10之第3實施方式。圖6（A）係第3實施方式之手部28等的俯視圖。在第3實施方式中，在發揮作為旋轉驅動部之功能的滾輪夾34上未設置第1旋轉驅動源34c。Next, a third embodiment of the wafer transfer apparatus 10 will be described. FIG. 6(A) is a plan view of the hand 28 and the like in the third embodiment. In the third embodiment, the first rotation drive source 34c is not provided on the roller clamp 34 that functions as a rotation drive unit.

取而代之，晶圓搬送裝置10之一零件的外部旋轉驅動部42從保持板30分離，而固定於預定位置。圖6（B）係外部旋轉驅動部42的立體圖。外部旋轉驅動部42具有馬達、致動器等的第2旋轉驅動源42a。Instead, the external rotation driving part 42 of a component of the wafer transfer apparatus 10 is separated from the holding plate 30 and fixed at a predetermined position. FIG. 6(B) is a perspective view of the external rotation driving unit 42. The external rotation drive unit 42 has a second rotation drive source 42a such as a motor and an actuator.

第2旋轉驅動源42a容納於大致矩形的殼體42b內。在第2旋轉驅動源42a上連結有旋轉軸42c。在旋轉軸42c上與第2旋轉驅動源42a為相反側之端部固定有圓盤狀的滾輪部42d，該滾輪部42d的直徑大於旋轉軸42c的直徑。The second rotation drive source 42a is housed in a substantially rectangular housing 42b. A rotating shaft 42c is connected to the second rotating drive source 42a. A disk-shaped roller portion 42d is fixed to the end of the rotating shaft 42c on the opposite side to the second rotating drive source 42a, and the diameter of the roller portion 42d is larger than the diameter of the rotating shaft 42c.

滾輪部42d，例如與滾輪部34b相同地，係由樹脂發泡體所形成，但只要具有與滾輪部34b接觸也不會滑動之程度的摩擦係數，則滾輪部42d的材料並無特別限定。The roller portion 42d is formed of a resin foam similar to the roller portion 34b, for example, but the material of the roller portion 42d is not particularly limited as long as it has a friction coefficient such that it does not slide in contact with the roller portion 34b.

外部旋轉驅動部42的滾輪部42d，在與發揮作為旋轉驅動部之功能的滾輪夾34之滾輪部34b側面接觸的狀態下使滾輪部34b自轉，藉此可使接觸滾輪部34b側面的晶圓11旋轉。The roller portion 42d of the external rotation drive portion 42 rotates the roller portion 34b while being in contact with the side surface of the roller portion 34b of the roller clamp 34 functioning as a rotation drive portion, thereby making it possible to contact the wafer on the side surface of the roller portion 34b 11 rotation.

第3實施方式之搬送晶圓11的方法中，晶圓旋轉步驟（S50）中使晶圓11旋轉的驅動源並非第1旋轉驅動源34c而是第2旋轉驅動源42a，此點與第1實施方式不同。其他則與第1實施方式相同。第3實施方式中，手部28上未設置第1旋轉驅動源34c，因此相較於第1實施方式，可簡化手部28的結構。In the method of transporting the wafer 11 of the third embodiment, the driving source for rotating the wafer 11 in the wafer rotation step (S50) is not the first rotation driving source 34c but the second rotation driving source 42a, which is the same as the first The implementation is different. Others are the same as the first embodiment. In the third embodiment, the first rotation drive source 34c is not provided on the hand 28, so the structure of the hand 28 can be simplified compared to the first embodiment.

又，第3實施方式中，亦可在以手部28保持晶圓11的狀態下調整晶圓11的定位及方向。因此，可省略與晶圓搬送裝置10分開設置的對位裝置及使用此對位裝置的中心對位步驟。In addition, in the third embodiment, the positioning and direction of the wafer 11 may be adjusted while the hand 28 is holding the wafer 11. Therefore, the alignment device provided separately from the wafer transfer device 10 and the center alignment step using the alignment device can be omitted.

此外，本實施方式之外部旋轉驅動部42係從保持板30分離，但只要係不會妨礙進入卡匣程度的小型外部旋轉驅動部42，則外部旋轉驅動部42亦能夠以位於保持板30之側邊的方式固定於保持板30。In addition, the external rotation drive portion 42 of this embodiment is separated from the holding plate 30, but as long as it is a small external rotation drive portion 42 that does not hinder entry into the cassette, the external rotation drive portion 42 can also be located on the holding plate 30. The side is fixed to the holding plate 30.

此外，上述實施方式之結構、方法等，只要在不脫離本發明之目的的範圍內，可適當變更而實施。若列舉一例，亦能夠以使多個墊片32中從墊片32噴射的空氣方向為不同方向的方式，變更多個墊片32的結構、供給至多個墊片32的空氣流量、空氣的供給路徑等。In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed and implemented as long as it does not deviate from the purpose of the present invention. To give an example, it is also possible to change the structure of the plurality of pads 32, the flow rate of air supplied to the plurality of pads 32, and the amount of air to be different from the direction of the air jetted from the pads 32 among the pads 32 Supply path, etc.

更具體而言，在俯視手部28的保持面30d時，從設於一側指部30c的至少1個墊片32噴射順時針旋轉的氣旋狀空氣。再者，從設於另一側指部30c的至少1個墊片32噴射逆時針旋轉的氣旋狀空氣。More specifically, when the holding surface 30d of the hand 28 is viewed from above, at least one pad 32 provided on one finger 30c is sprayed with clockwise cyclonic air. Furthermore, from at least one spacer 32 provided on the other side finger 30c, cyclonic air rotating counterclockwise is sprayed.

此情況下，藉由調節空氣的流量，可使用從墊片32噴射之空氣，來輔助旋轉驅動部驅動晶圓11自轉。例如，使順時針旋轉的空氣流量大於逆時針旋轉的空氣流量。藉此，能夠以非接觸方式吸引保持晶圓11之同時，藉由以相對較大的流量順時針旋轉的空氣來輔助晶圓11的順時針自轉。In this case, by adjusting the flow rate of air, the air jetted from the spacer 32 can be used to assist the rotation driving section to drive the wafer 11 to rotate. For example, the air flow rate rotating clockwise is greater than the air flow rate rotating counterclockwise. As a result, the wafer 11 can be sucked and held in a non-contact manner, and the clockwise rotation of the wafer 11 can be assisted by air rotating clockwise at a relatively large flow rate.

同樣地，若使逆時針旋轉的空氣流量大於順時針旋轉的空氣流量，則能夠以非接觸方式吸引保持晶圓11之同時，藉由以相對較大的流量逆時針旋轉的空氣來輔助晶圓11的逆時針自轉。Similarly, if the air flow rate rotating counterclockwise is greater than the air flow rate rotating clockwise, the wafer 11 can be attracted and held in a non-contact manner, and the wafer 11 can be assisted by the air rotating counterclockwise at a relatively large flow rate. 11's counterclockwise rotation.

11:晶圓 11a:正面 11b:背面（一面） 11c:外周緣 13:分割預定線 15:元件 17:缺口 19a:凹部 19b:外周環 10:晶圓搬送裝置 12:移動單元 14:第1支撐旋轉部 16:第1連桿 18:第2連桿 20:圓筒殼體 22:第3連桿 24:臂部旋轉軸 26:臂部 28:手部 30:保持板 30a:腕部 30b:連接部 30c:指部 30d:保持面 32:墊片（吸引保持部） 34:滾輪夾（限制構件） 34a:支撐旋轉部 34b:滾輪部 34c:第1旋轉驅動源 36:移動板 36a:第1區域 36b:第2區域 38:攝影機單元 40:缺口嵌合部 40a:一端 40b:另一端 42:外部旋轉驅動部 42a:第2旋轉驅動源 42b:殼體 42c:旋轉軸 42d:滾輪部 A:第1方向 B:第2方向 C:第3方向（高度方向）11: Wafer 11a: front 11b: Back (one side) 11c: outer periphery 13: Divide the planned line 15: Components 17: gap 19a: recess 19b: Outer ring 10: Wafer transfer device 12: mobile unit 14: The first supporting rotating part 16: first link 18: 2nd link 20: Cylinder shell 22: 3rd link 24: arm rotation axis 26: Arm 28: Hands 30: hold the board 30a: wrist 30b: Connection part 30c: Fingers 30d: keep the surface 32: Gasket (suction holding part) 34: Roller clamp (restriction member) 34a: Support rotating part 34b: Roller part 34c: The first rotation drive source 36: mobile board 36a: Zone 1 36b: Zone 2 38: Camera unit 40: Notch fitting part 40a: one end 40b: the other end 42: External rotation drive 42a: 2nd rotation drive source 42b: shell 42c: Rotation axis 42d: Roller part A: 1st direction B: 2nd direction C: The third direction (height direction)

圖1係第1實施方式之晶圓搬送裝置的立體圖。 圖2（A）係晶圓之上表面側的立體圖，圖2（B）係晶圓之下表面側的立體圖，圖2（C）係另一例的晶圓之下表面側的立體圖。 圖3係手部等的俯視圖。 圖4係手部等的局部剖面側視圖。 圖5係第2實施方式之手部等的俯視圖。 圖6（A）係第3實施方式之手部等的俯視圖，圖6（B）係外部旋轉驅動部的立體圖。FIG. 1 is a perspective view of the wafer transfer apparatus of the first embodiment. 2(A) is a perspective view of the upper surface side of the wafer, FIG. 2(B) is a perspective view of the lower surface side of the wafer, and FIG. 2(C) is a perspective view of another example of the lower surface side of the wafer. Fig. 3 is a plan view of a hand and the like. Fig. 4 is a partial cross-sectional side view of the hand and the like. Fig. 5 is a plan view of a hand and the like in the second embodiment. Fig. 6(A) is a plan view of a hand and the like in the third embodiment, and Fig. 6(B) is a perspective view of an external rotation drive unit.

10:晶圓搬送裝置 10: Wafer transfer device

12:移動單元 12: mobile unit

14:第1支撐旋轉部 14: The first supporting rotating part

16:第1連桿 16: first link

18:第2連桿 18: 2nd link

20:圓筒殼體 20: Cylinder shell

22:第3連桿 22: 3rd link

24:臂部旋轉軸 24: arm rotation axis

26:臂部 26: Arm

28:手部 28: Hands

30:保持板 30: hold the board

30a:腕部 30a: wrist

30b:連接部 30b: Connection part

30c:指部 30c: Fingers

30d:保持面 30d: keep the surface

32:墊片(吸引保持部) 32: Gasket (suction holding part)

34:滾輪夾(限制構件) 34: Roller clamp (limiting member)

38:攝影機單元 38: Camera unit

A:第1方向 A: 1st direction

B:第2方向 B: 2nd direction

C:第3方向(高度方向) C: 3rd direction (height direction)

Claims (5)

一種晶圓搬送裝置，其特徵為具備： 保持板，其具有面對晶圓之一面的保持面； 吸引保持部，其設置成在該保持面露出，以非接觸方式吸引保持面對該保持面的該晶圓； 3個以上的限制構件，各自具有可自轉的滾輪部，藉由該滾輪部與以該吸引保持部吸引保持的該晶圓之外周緣接觸，來限制該晶圓在與該晶圓之該一面平行的方向上相對於該保持板的移動；以及 移動單元，其與該保持板連接，藉由使該保持板移動來搬送該晶圓； 該3個以上的限制構件之中至少1個限制構件為旋轉驅動部，其係在該滾輪部與該晶圓的外周緣接觸的狀態下，藉由使該滾輪部自轉而使該晶圓旋轉。A wafer conveying device, which is characterized by having: A holding plate, which has a holding surface facing one side of the wafer; A suction and holding portion, which is arranged to be exposed on the holding surface, and attracts and holds the wafer facing the holding surface in a non-contact manner; Three or more restricting members, each having a roller portion that can rotate, and by contacting the roller portion with the outer periphery of the wafer attracted and held by the attracting and holding portion, the wafer is restricted from being on the side of the wafer. The movement relative to the holding plate in a parallel direction; and The moving unit is connected with the holding plate and transports the wafer by moving the holding plate; At least one of the three or more restricting members is a rotation drive portion, which rotates the wafer by rotating the roller portion while the roller portion is in contact with the outer periphery of the wafer . 如請求項1所述之晶圓搬送裝置，其進一步具備缺口嵌合部，該缺口嵌合部在朝向吸引保持於該保持板的該晶圓之內側而被賦與勢能的狀態下與該晶圓的外周緣接觸，並可與設於該晶圓之外周部的缺口嵌合； 以該缺口嵌合部與該缺口嵌合時該旋轉驅動部即停止旋轉的方式控制該旋轉驅動部的運作。The wafer transfer device according to claim 1, further comprising a notch fitting portion that is provided with potential energy toward the inside of the wafer held by the holding plate while being attracted to the wafer. The outer periphery of the circle is in contact with and can fit into the notch provided on the outer periphery of the wafer; The operation of the rotation driving part is controlled in such a way that the rotation driving part stops rotating when the notch fitting part is fitted into the notch. 如請求項1所述之晶圓搬送裝置，其進一步具備攝影機單元，該攝影機單元在該晶圓被吸引保持於該保持板的狀態下拍攝該晶圓的外周緣； 依據以該攝影機單元檢測出的該晶圓之方向來控制該旋轉驅動部的運作。The wafer transfer device according to claim 1, further comprising a camera unit that photographs the outer periphery of the wafer in a state where the wafer is attracted and held by the holding plate; The operation of the rotation driving part is controlled according to the direction of the wafer detected by the camera unit. 如請求項1至3中任一項所述之晶圓搬送裝置，其中，該旋轉驅動部具有與該旋轉驅動部的旋轉軸連結的旋轉驅動源，藉由該旋轉驅動源進行旋轉而使該旋轉軸自轉。The wafer transfer device according to any one of claims 1 to 3, wherein the rotation drive unit has a rotation drive source connected to a rotation shaft of the rotation drive unit, and the rotation drive source rotates to make the The axis of rotation rotates. 如請求項1至3中任一項所述之晶圓搬送裝置，其進一步具備外部旋轉驅動部，該外部旋轉驅動部在與該旋轉驅動部的滾輪部之側面接觸的狀態下使該旋轉驅動部的滾輪部自轉。The wafer transfer device according to any one of claims 1 to 3, further comprising an external rotation drive unit that drives the rotation while in contact with the side surface of the roller portion of the rotation drive unit The roller part of the part rotates.
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