TW202101008A - Apparatus of testing a semiconductor device and method of testing a semiconductor device - Google Patents

Abstract

Disclosed is an apparatus for testing semiconductor devices, which includes a test chamber; a card holder arranged at the upper part of the test chamber and configured to hold a probe card, wherein the probe card transmits electrical signals to a semiconductor device formed on the wafer; a chuck located in the test chamber, wherein the chuck is set to support the wafer in the test chamber and faces the chuck; a chuck driving unit configured to drive the chuck to allow the semiconductor device to be in contact with the probe card; and a magnetic force generating unit configured to generate electromagnetic force between the card holder and the chuck to increase the load applied between the probe card and the wafer. Therefore, the probe card and the wafer can be firmly connected to each other.

Description

Equipment for testing semiconductor device and method for testing semiconductor device

The present disclosure relates to a device for testing semiconductor devices and a method for testing semiconductor devices. More particularly, the present disclosure relates to an apparatus for testing a semiconductor device and a method of testing the semiconductor device by applying an electrical signal to the semiconductor device using a probe card.

Generally speaking, semiconductor devices such as integrated circuit devices can be manufactured by repeatedly performing a series of semiconductor manufacturing processes on a semiconductor wafer. For example, a semiconductor device can be manufactured by repeating the following procedures on a wafer: a deposition process for forming a thin film on a wafer, an etching process for converting a thin film into a pattern with electrical characteristics, and an etching process for implanting impurities or The ion implantation process or diffusion process that diffuses into the pattern is a cleaning process and a rinsing process used to remove residue from a patterned wafer.

After the semiconductor device is manufactured through a series of semiconductor manufacturing procedures, a test procedure for testing the electrical characteristics of the semiconductor device can be performed. The probe station can execute the test procedure by using both a probe card and a tester, where a probe card with multiple pins will be loaded into the probe station, and the tester is connected to the probe card to provide semiconductor devices electric signal.

For the test procedure, the probe card can be set in the top part of the test chamber, and the wafer can be set on the chuck and opposite to the probe card under the probe card. The chuck driving unit may drive a chuck configured to support the wafer to align the wafer with the probe card. In this way, the semiconductor device formed on the wafer and the needle formed on the probe card are connected to each other, so that the tester can provide electrical signals to the semiconductor device through the probe card to check the electrical performance of the semiconductor device.

On the other hand, as the number of pins formed on the probe card increases, it may be necessary to increase the rigidity and capacity of the chuck drive unit. Recently, there is a trend to increase the size of motors, LM guides, ball screws, etc. included in the chuck drive unit.

In particular, as the total load that needs to be applied to the needle increases to 1000 kg or more, the size of the chuck drive unit increases, thereby increasing the size of the entire probe station.

Embodiments of the present invention provide an apparatus for testing semiconductor devices, which can cope with an increase in load required for a wafer to firmly contact a probe card.

The embodiment of the present invention provides a method for testing a semiconductor device, which can cope with an increase in load required for a wafer to firmly contact a probe card.

According to an exemplary embodiment of the present invention, an apparatus for testing a semiconductor device is disclosed. The apparatus includes a test chamber; a card holder arranged at the upper part of the test chamber and configured to hold a probe card, and the probe card transmits electrical signals. Transfer to the semiconductor device formed on the wafer; a chuck located in the test chamber, the chuck is set to support the wafer in the test chamber and face the chuck; the chuck configured to drive the chuck so that the semiconductor device contacts the probe card A drive unit; and a magnetic force generating unit configured to generate electromagnetic force between the card holder and the chuck to increase the load applied between the probe card and the wafer.

In an exemplary embodiment, the magnetic force generating unit may include an electromagnet member disposed to surround the outer circumference of the chuck, and the electromagnet member generates a magnetic field using electric power.

Here, the magnetic force generating unit may further include a magnetic member disposed adjacent to the holder to face the electromagnet member, and the magnetic member is disposed to increase the electromagnetic field.

Moreover, the magnetic force generating unit may further include a power source and a power source controller, the power source is used to provide power to the electromagnet member, and the power source controller is used to adjust the size of the power.

In an exemplary embodiment, a buffer member may be further provided between the magnetic force generating unit and the card holder, and the buffer member is configured to relieve an impact occurring between the needle of the probe card and the pad of the semiconductor device.

In an exemplary embodiment, the buffer member may include at least one of a damper, a spring, and an elastic plate.

Here, the buffer member may be provided on the magnetic force generating unit.

In an exemplary embodiment, the test chamber may include a receiving groove formed on an upper wall thereof for receiving the probe card.

In an exemplary embodiment, the electromagnetic wave shield member may be further disposed adjacent to the receiving groove.

Here, the electromagnetic wave shielding member may be provided along the inner side wall of the receiving groove.

Also, the electromagnetic wave shield member may include a metal thin film.

According to an exemplary embodiment of the present invention, a method for testing a semiconductor device is disclosed. The method includes: installing a probe card configured to transmit electrical signals to a semiconductor device formed on a wafer in a holder; The wafer is mounted on a chuck set to face the chuck; the drive chuck first makes the semiconductor device contact the probe card and uses electromagnetic force to increase the load applied between the probe card and the wafer.

In an exemplary embodiment, driving the chuck may further include aligning the semiconductor device with the probe card.

In an exemplary embodiment, increasing the load between the probe card and the wafer may include adjusting the value of electric power applied to an electromagnet member disposed adjacent to the chuck.

Moreover, increasing the load between the probe card and the wafer may further include using a magnetic member disposed adjacent to the card holder to face the electromagnet member.

In an exemplary embodiment, increasing the load between the probe card and the wafer may include mitigating the impact that occurs between the pins of the probe card and the pads of the semiconductor device.

In an exemplary embodiment, installing the probe card in the holder may include positioning the probe card in a receiving groove formed on the upper wall of the test chamber.

In an exemplary embodiment, the electrical signal may be applied from the tester to the semiconductor device by a probe card.

Here, applying the electrical signal to the semiconductor device may include shielding the electromagnetic wave with the tester.

According to an exemplary embodiment of the present invention, an apparatus for testing a semiconductor device is disclosed. The apparatus includes a test chamber; a card holder arranged in the upper part of the test chamber and configured to hold a probe card, and the probe card transmits electrical signals. To the semiconductor device formed on the wafer; the chuck located in the test chamber, the chuck is set to support the wafer in the test chamber and face the chuck; the chuck drive unit configured to drive the chuck so that the semiconductor device contacts the probe card And a magnetic force generating unit configured to generate electromagnetic force between the holder and the chuck to increase the load applied between the probe card and the wafer, wherein the magnetic force generating unit includes an electromagnet member arranged to surround the periphery of the chuck The electromagnet member uses electric power to generate a magnetic field, and is disposed adjacent to the holder to face the magnetic member of the electromagnet member, and the magnetic member is arranged to increase the electromagnetic field.

According to the exemplary embodiment of the present disclosure described above, the apparatus for testing a semiconductor device includes an electromagnetic force generating unit for generating an electromagnetic force applied between the chuck and the chuck. Therefore, when the required load between the probe card and the wafer increases as the number of pins formed in the probe card increases, the electromagnetic force generating unit can increase the load to cope with the required load. In addition, the electromagnetic force generation unit can partially reduce the vertical drive module by partially sharing the load of the vertical drive module.

The above summary of the present disclosure is not intended to describe each illustrated embodiment or every implementation of the present disclosure. More specifically, the following detailed description and patent application exemplify these embodiments.

Although various modifications and alternative forms can be made to the various embodiments, the specific details thereof have been shown by way of example in the drawings and will be described in detail. However, it should be understood that the present invention does not limit the claimed invention to the specific embodiments described. On the contrary, the present invention covers all modifications, equivalents and alternatives falling within the spirit and scope of the subject matter of the present invention as defined by the scope of the patent application.

Hereinafter, specific embodiments of the raceway unit and the OHT with the raceway unit will be described in detail with reference to the drawings. However, the present invention may be embodied in different forms and should not be construed as being limited to the embodiments described herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. The same drawing symbols refer to the same elements throughout the text. In the figure, for clarity of description, the sizes of layers and regions are exaggerated.

Terms such as first, second, etc. can be used to describe various elements, but the above elements described by the above terms should not be limited. The above terms are only used to distinguish one element from another. For example, in the present invention, without departing from the scope, the first element may be similarly named as the second element, and the second element may also be similarly named as the first element.

The terminology used herein is only for the purpose of describing specific exemplary embodiments and is not intended to limit the concept of the present invention. As used herein, the singular forms "a" and "the" are also intended to include the plural form, unless the context clearly indicates otherwise. It should also be understood that when the term "comprises" is used in this specification, it indicates the existence of the features, integers, steps, operations, elements, and/or elements, but does not exclude one or more other features, integers, steps, The presence or addition of operations, elements, elements and/or combinations thereof.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the inventive concept belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their context in the relevant field, and should not be interpreted in an idealized or over-formalized manner unless explicitly defined herein.

FIG. 1 is a cross-sectional view of an apparatus for testing a semiconductor device according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of the chuck and the chuck drive unit in Fig. 1. Fig. 3 is a cross-sectional view of the card holder in Fig. 1.

1 to 3, the apparatus 100 for testing a semiconductor device according to an embodiment of the present invention can use the probe card 20 to perform electrical characteristics inspection on the semiconductor device formed on the wafer 10.

The device 100 includes a test chamber 105, a chuck 130, a chuck drive unit 120, a chuck 110, and an electromagnetic force generating unit 150.

The test chamber 105 may provide a processing space for performing electrical performance inspection on the semiconductor device formed on the wafer 10.

The chuck 130 is disposed in the processing space. The chuck 130 can support the wafer 10. The chuck 130 can fix the wafer 10 on its upper surface by using electrostatic force or vacuum force.

The chuck drive unit 120 is provided under the chuck 130. The chuck driving unit 120 drives the chuck 130 to move the wafer 10 so that the semiconductor device contacts the probe card 20 so that the pad of the semiconductor contacts the needle of the probe card 20.

More specifically, the chuck drive unit 120 includes a rotation module 121, a vertical drive module 123, a first horizontal drive module 124 and a second horizontal drive module 125.

The rotating module 121 rotates the chuck 130. Therefore, the wafer 10 is rotated to be aligned with the probe card 20 in the R direction.

The vertical driving module 123 adjusts the vertical position of the chuck 130. Therefore, the wafer 10 positioned on the chuck 130 may be in contact with the probe card 20 or may be separated from the probe card 20.

At the same time, the first and second horizontal driving modules 124 and 125 can move the chuck 130 in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction. Therefore, the first and second horizontal driving modules 124 and 125 adjust the horizontal position of the chuck 130.

The card holder 110 is arranged at the upper part of the test chamber 105. The holder 110 may be configured to hold the probe card 20. The holder 110 can hold the probe card 20 in a clamping manner or a clamping manner.

The electromagnetic force generating unit 150 generates electromagnetic force between the chuck 110 and the chuck 130. Therefore, the load applied between the probe card 20 held on the holder 110 and the wafer 10 supported on the chuck 130 can be increased.

Therefore, when the load required between the probe card 20 and the wafer 10 increases as the number of pins 22 formed on the probe card 20 increases, the electromagnetic force generating unit 150 can cope with the increase in the required load.

On the other hand, the electromagnetic force generating unit 150 can share the increased required load with the vertical driving module 123, so that the size of the vertical driving module 123 can be miniaturized.

In an embodiment of the present invention, the magnetic force generating unit 150 is arranged to surround the outer circumference of the chuck 130. The magnetic force generating unit 150 may include an electromagnet member 151 capable of generating a magnetic field using electric power.

The electromagnet member 151 includes a magnet (not shown) and a coil (not shown) surrounding the magnet, and current flows through the coil. In this case, the electromagnet member 151 can control the magnitude of the electromagnetic force by adjusting the magnitude of the current flowing through the coil. Accordingly, the overdrive value required for firm contact between the wafer 10 and the probe card 20 can be adjusted. Here, the over-driving value can correspond to the contact force by lifting the chuck 130 supporting the wafer 10 to a vertical position higher than the reference position, so the probe card 20 and the wafer 10 can be The connection is firmer to make the electrical connection to the semiconductor device firm.

Therefore, various overdrive values required for various types of semiconductor devices can be easily controlled.

In addition, by controlling the on/off of the current, the electromagnetic force between the wafer 10 and the probe card 20 can be easily turned on or off.

On the other hand, the electromagnet member 151 is provided on the outer circumference of the chuck 130, which is relatively long apart from the tester 30. Therefore, the electromagnetic wave generated by the electromagnet member 151 can be suppressed from interfering with the test procedure of the tester 30.

In an embodiment of the present invention, the magnetic force generating unit 150 may further include a magnetic member 155. The magnetic member 155 is disposed adjacent to the holder 110 to face the electromagnet member 151. The magnetic member 155 is provided to further increase the electromagnetic field. Therefore, the electromagnet member 151 and the magnetic member 155 can increase the electromagnetic force.

In an exemplary embodiment of the present invention, the magnetic force generating unit 150 may further include a power source 153 and a power source controller 154. The power supply 153 supplies power to the coil included in the electromagnet member 151. The power supply controller 154 adjusts the amount of power provided by the power supply 153. Therefore, since the magnitude of the current flowing through the electromagnet member 151 is controlled, the magnitude of the electromagnetic force generated by the electromagnet member 151 can be adjusted.

In an embodiment of the present invention, the device 100 may further include a buffer member 170.

The buffer member 170 is disposed between the magnetic force generating unit 150 and the holder 110. For example, the buffer member 170 may be inserted between the electromagnet member 151 and the magnetic member 155. Therefore, when the probe card 20 and the wafer 10 are in contact with each other under a high load by electromagnetic force, the impact to the needle 22 included in the probe card 20 can be reduced to prevent the probe card 20 from being damaged.

The buffer member 170 may include at least one of a damper, a spring, an elastic plate, and the like. Alternatively, when the probe card 20 and the wafer 10 are in contact, the buffer member 170 may include other members that reduce the impact on the needle 22 included in the probe card 20.

In an exemplary embodiment of the present invention, the upper wall of the test chamber 105 is provided with a receiving groove 105 a for receiving the probe card 20. An electromagnetic wave shield member 180 may be additionally provided adjacent to the receiving slot 105a.

Here, the electromagnetic wave shield member 180 may be provided along the inner wall of the receiving groove 105a. That is, the electromagnetic wave shield member 180 can suppress the electromagnetic wave generated when the magnetic force generating unit 150 is driven from propagating through the receiving groove 105 a into the tester 30. Therefore, when performing the inspection process on the semiconductor device, the electromagnetic wave shield member 180 can prevent the tester 30 from making an error during the inspection process by blocking the electromagnetic wave generated by the magnetic force generating unit 150.

Here, the electromagnetic wave shield member 180 may include a metal thin film. The electromagnetic wave shield member 180 may be formed by a sputtering process and a spraying process.

FIG. 4 is a flowchart of a method for testing a semiconductor device according to an exemplary embodiment of the present invention.

1 and 4, a method for testing a semiconductor device according to an exemplary embodiment of the present invention is disclosed. The probe card 20 for transmitting electrical signals to the semiconductor device formed on the wafer is mounted on the holder 110 (step S110). At the same time, the wafer is mounted on the chuck 130 facing the chuck (step S130).

After the wafer 10 is aligned with the probe card 20, the chuck 130 is driven to bring the semiconductor device 10 into contact with the probe card 20 (step S150).

The load between the probe card 20 and the semiconductor device is increased by using electromagnetic force (step S170). Therefore, the pins 22 formed on the probe card 20 can be more reliably connected to the pads of the semiconductor device.

Here, while the load between the probe card 20 and the wafer 10 is increased by the electromagnetic force, the value of the electric power applied to the electromagnet member 151 provided adjacent to the chuck 130 can be adjusted. Therefore, since the magnitude of the current flowing through the electromagnet member 151 is controlled, the magnitude of the electromagnetic force generated by the electromagnet member 151 can be adjusted.

After that, the probe card 20 applies a test signal to the semiconductor device formed on the wafer 10. Here, the equipment 100 for testing the semiconductor device may be connected to the tester 30 to check the electrical performance of the semiconductor device 10. The tester 30 applies a test signal to the semiconductor device formed on the wafer 10 through the probe card 20 to use the signal output from the semiconductor device to check the electrical performance of the wafer 10.

Although the wireless power transmission device and the wireless power transmission method have been described with reference to specific embodiments, they are not limited thereto. Therefore, those skilled in the art should easily understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the present invention defined by the scope of the appended patent application.

10: Wafer 20: Probe card 22: Needle 30: Tester 100: Equipment for testing semiconductor devices 105: test room 105a: receiving slot 110: deck 120: chuck drive unit 121: Rotation module 123: Vertical drive module 124: The first horizontal drive module 125: second horizontal drive module 130: Chuck 150: Magnetic force generating unit 151: Electromagnet component 153: Power 154: Power Controller 155: Magnetic component 170: Cushion member 180: Electromagnetic wave shield component S110, S130, S150, S170: steps

With reference to the drawings, the exemplary embodiments can be understood in more detail based on the following description. among them:

1 is a cross-sectional view of an apparatus for testing semiconductor devices according to an embodiment of the present invention;

Figure 2 is a cross-sectional view of the chuck and the chuck drive unit in Figure 1;

Figure 3 is a cross-sectional view of the card holder in Figure 1; and

FIG. 4 is a flowchart of a method for testing a semiconductor device according to an exemplary embodiment of the present invention.

10: Wafer

20: Probe card

22: Needle

30: Tester

100: Equipment for testing semiconductor devices

105: test room

110: deck

120: chuck drive unit

121: Rotation module

123: Vertical drive module

124: The first horizontal drive module

125: second horizontal drive module

130: Chuck

150: Magnetic force generating unit

151: Electromagnet component

155: Magnetic component

Claims (20)

A device for testing semiconductor devices, characterized in that the device includes: Test room A card holder provided at the upper part of the test chamber, the card holder being configured to hold a probe card, and the probe card transmits electrical signals to a semiconductor device formed on a wafer; A chuck located in the test chamber, the chuck is arranged to support the wafer in the test chamber and face the chuck; A chuck drive unit configured to drive the chuck so that the semiconductor device contacts the probe card; and A magnetic force generating unit configured to generate electromagnetic force between the card holder and the chuck to increase the load applied between the probe card and the wafer. The device according to claim 1, wherein the magnetic force generating unit includes an electromagnet member arranged to surround the outer circumference of the chuck, and the electromagnet member generates a magnetic field by using electric power. The device according to claim 2, wherein the magnetic force generating unit further includes a magnetic member disposed adjacent to the holder to face the electromagnet member, and the magnetic member is configured to increase the electromagnetic field. The device according to claim 2, wherein the magnetic force generating unit further includes a power source for supplying power to the electromagnet member, and a power source controller for adjusting the magnitude of the power. The device as recited in claim 1, further comprising a buffer member provided between the magnetic force generating unit and the card holder, and the buffer member is configured to relieve the occurrence between the needle of the probe card and the pad of the semiconductor device. The impact. The device according to claim 1, wherein the buffer member includes at least one of a damper, a spring, and an elastic plate. The device according to claim 5, wherein the buffer member is disposed on the magnetic force generating unit. The device according to claim 1, wherein the test chamber includes a receiving slot formed on the upper wall of the test chamber for accommodating the probe card. The device as recited in claim 1, further comprising an electromagnetic wave shield member arranged adjacent to the receiving slot. The device according to claim 9, wherein the electromagnetic wave shielding member is arranged along the inner side wall of the receiving groove. The device according to claim 9, wherein the electromagnetic wave shielding member includes a metal thin film. A method for testing a semiconductor device, the method comprising: Mounting a probe card configured to transmit electrical signals to the semiconductor device formed on the wafer in the holder; Mount the wafer on the chuck set to face the card seat; Driving the chuck to first make the semiconductor device contact the probe card; and The electromagnetic force is used to increase the load applied between the probe card and the wafer. The method according to claim 12, wherein driving the chuck further includes aligning the semiconductor device with the probe card. The method of claim 12, wherein increasing the load between the probe card and the wafer includes adjusting the value of electric power applied to an electromagnet member disposed adjacent to the chuck. The method according to claim 14, wherein increasing the load between the probe card and the wafer further includes using a magnetic member disposed adjacent to the card socket to face the electromagnet member. The method according to claim 12, wherein increasing the load between the probe card and the wafer includes alleviating an impact occurring between the needle of the probe card and the pad of the semiconductor device. The method according to claim 12, wherein installing the probe card in the holder includes positioning the probe card in a receiving groove formed on an upper wall of the test chamber. The method according to claim 12, further comprising applying an electrical signal from the tester to the semiconductor device through the probe card. The method according to claim 18, wherein applying the electrical signal to the semiconductor device includes shielding an electromagnetic wave with the tester. A device for testing semiconductor devices, the device comprising: Test room A card holder provided at the upper part of the test chamber, the card holder being configured to hold a probe card, the probe card transmitting electrical signals to a semiconductor device formed on a wafer; A chuck located in the test chamber, the chuck is arranged to support the wafer in the test chamber and face the chuck; A chuck drive unit configured to drive the chuck so that the semiconductor device contacts the probe card; and A magnetic force generating unit configured to generate electromagnetic force between the card holder and the chuck to increase the load applied between the probe card and the wafer, Wherein, the magnetic force generating unit includes an electromagnet member arranged to surround the outer circumference of the chuck, the electromagnet member generates a magnetic field using electric power, and a magnetic member disposed adjacent to the holder to face the electromagnet member, and the magnetic member is arranged as Increase the electromagnetic field.

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