TW202100946A - 半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統 - Google Patents
半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統 Download PDFInfo
- Publication number
- TW202100946A TW202100946A TW109113581A TW109113581A TW202100946A TW 202100946 A TW202100946 A TW 202100946A TW 109113581 A TW109113581 A TW 109113581A TW 109113581 A TW109113581 A TW 109113581A TW 202100946 A TW202100946 A TW 202100946A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor wafer
- thickness
- refractive index
- predetermined position
- optical path
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 101
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000003287 optical effect Effects 0.000 claims abstract description 63
- 235000012431 wafers Nutrition 0.000 claims description 203
- 238000005259 measurement Methods 0.000 claims description 128
- 238000001228 spectrum Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 230000003595 spectral effect Effects 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 description 97
- 239000010703 silicon Substances 0.000 description 97
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 96
- 238000000691 measurement method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 3
- 210000000707 wrist Anatomy 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019118686A JP2021004794A (ja) | 2019-06-26 | 2019-06-26 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
| JP2019-118686 | 2019-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202100946A true TW202100946A (zh) | 2021-01-01 |
Family
ID=74061551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109113581A TW202100946A (zh) | 2019-06-26 | 2020-04-23 | 半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2021004794A (https=) |
| TW (1) | TW202100946A (https=) |
| WO (1) | WO2020261745A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI856587B (zh) * | 2022-03-31 | 2024-09-21 | 日商聖德科控股股份有限公司 | 半導體晶圓的厚度的測量方法及測量裝置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274259A (ja) * | 1998-03-26 | 1999-10-08 | Hitachi Ltd | 厚さ測定装置および厚さ制御装置 |
| JP2002277217A (ja) * | 2001-03-16 | 2002-09-25 | Toray Ind Inc | ウェブの厚さ測定装置及び該ウェブの製造方法 |
| JP2011180113A (ja) * | 2010-03-03 | 2011-09-15 | Opto-Electronics Laboratory Inc | ダイアモンド状カーボン薄膜の膜厚と屈折率の計測 |
| JP6487767B2 (ja) * | 2015-05-08 | 2019-03-20 | 株式会社ディスコ | 乾式研磨装置 |
-
2019
- 2019-06-26 JP JP2019118686A patent/JP2021004794A/ja active Pending
-
2020
- 2020-04-23 TW TW109113581A patent/TW202100946A/zh unknown
- 2020-04-24 WO PCT/JP2020/017836 patent/WO2020261745A1/ja not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI856587B (zh) * | 2022-03-31 | 2024-09-21 | 日商聖德科控股股份有限公司 | 半導體晶圓的厚度的測量方法及測量裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021004794A (ja) | 2021-01-14 |
| WO2020261745A1 (ja) | 2020-12-30 |
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