TW202100946A - 半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統 - Google Patents

半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統 Download PDF

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Publication number
TW202100946A
TW202100946A TW109113581A TW109113581A TW202100946A TW 202100946 A TW202100946 A TW 202100946A TW 109113581 A TW109113581 A TW 109113581A TW 109113581 A TW109113581 A TW 109113581A TW 202100946 A TW202100946 A TW 202100946A
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Taiwan
Prior art keywords
semiconductor wafer
thickness
refractive index
predetermined position
optical path
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TW109113581A
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English (en)
Chinese (zh)
Inventor
宮崎裕司
木原誉之
高梨啓一
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日商Ｓｕｍｃｏ股份有限公司
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Publication of TW202100946A publication Critical patent/TW202100946A/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109113581A 2019-06-26 2020-04-23 半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統 TW202100946A (zh)

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Application Number Priority Date Filing Date Title
JP2019-118686 2019-06-26
JP2019118686A JP2021004794A (ja) 2019-06-26 2019-06-26 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム

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TW202100946A true TW202100946A (zh) 2021-01-01

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TW109113581A TW202100946A (zh) 2019-06-26 2020-04-23 半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統

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JP (1) JP2021004794A (enrdf_load_stackoverflow)
TW (1) TW202100946A (enrdf_load_stackoverflow)
WO (1) WO2020261745A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI856587B (zh) * 2022-03-31 2024-09-21 日商聖德科控股股份有限公司 半導體晶圓的厚度的測量方法及測量裝置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274259A (ja) * 1998-03-26 1999-10-08 Hitachi Ltd 厚さ測定装置および厚さ制御装置
JP2002277217A (ja) * 2001-03-16 2002-09-25 Toray Ind Inc ウェブの厚さ測定装置及び該ウェブの製造方法
JP2011180113A (ja) * 2010-03-03 2011-09-15 Opto-Electronics Laboratory Inc ダイアモンド状カーボン薄膜の膜厚と屈折率の計測
JP6487767B2 (ja) * 2015-05-08 2019-03-20 株式会社ディスコ 乾式研磨装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI856587B (zh) * 2022-03-31 2024-09-21 日商聖德科控股股份有限公司 半導體晶圓的厚度的測量方法及測量裝置

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WO2020261745A1 (ja) 2020-12-30
JP2021004794A (ja) 2021-01-14

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