JP2021004794A - 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム - Google Patents
半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム Download PDFInfo
- Publication number
- JP2021004794A JP2021004794A JP2019118686A JP2019118686A JP2021004794A JP 2021004794 A JP2021004794 A JP 2021004794A JP 2019118686 A JP2019118686 A JP 2019118686A JP 2019118686 A JP2019118686 A JP 2019118686A JP 2021004794 A JP2021004794 A JP 2021004794A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- thickness
- refractive index
- predetermined position
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 48
- 235000012431 wafers Nutrition 0.000 title description 168
- 238000005259 measurement Methods 0.000 claims abstract description 98
- 230000003287 optical effect Effects 0.000 claims abstract description 62
- 230000003595 spectral effect Effects 0.000 claims abstract description 28
- 238000001228 spectrum Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 238000000691 measurement method Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 100
- 229910052710 silicon Inorganic materials 0.000 description 100
- 239000010703 silicon Substances 0.000 description 100
- 230000000052 comparative effect Effects 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019118686A JP2021004794A (ja) | 2019-06-26 | 2019-06-26 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
| TW109113581A TW202100946A (zh) | 2019-06-26 | 2020-04-23 | 半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統 |
| PCT/JP2020/017836 WO2020261745A1 (ja) | 2019-06-26 | 2020-04-24 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019118686A JP2021004794A (ja) | 2019-06-26 | 2019-06-26 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021004794A true JP2021004794A (ja) | 2021-01-14 |
| JP2021004794A5 JP2021004794A5 (enrdf_load_stackoverflow) | 2021-08-12 |
Family
ID=74061551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019118686A Pending JP2021004794A (ja) | 2019-06-26 | 2019-06-26 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2021004794A (enrdf_load_stackoverflow) |
| TW (1) | TW202100946A (enrdf_load_stackoverflow) |
| WO (1) | WO2020261745A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7577342B2 (ja) * | 2022-03-31 | 2024-11-05 | ｓａｎｔｅｃ Ｈｏｌｄｉｎｇｓ株式会社 | 半導体ウエハの厚さ計測装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274259A (ja) * | 1998-03-26 | 1999-10-08 | Hitachi Ltd | 厚さ測定装置および厚さ制御装置 |
| JP2002277217A (ja) * | 2001-03-16 | 2002-09-25 | Toray Ind Inc | ウェブの厚さ測定装置及び該ウェブの製造方法 |
| JP2011180113A (ja) * | 2010-03-03 | 2011-09-15 | Opto-Electronics Laboratory Inc | ダイアモンド状カーボン薄膜の膜厚と屈折率の計測 |
| JP2016209951A (ja) * | 2015-05-08 | 2016-12-15 | 株式会社ディスコ | 乾式研磨装置 |
-
2019
- 2019-06-26 JP JP2019118686A patent/JP2021004794A/ja active Pending
-
2020
- 2020-04-23 TW TW109113581A patent/TW202100946A/zh unknown
- 2020-04-24 WO PCT/JP2020/017836 patent/WO2020261745A1/ja active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274259A (ja) * | 1998-03-26 | 1999-10-08 | Hitachi Ltd | 厚さ測定装置および厚さ制御装置 |
| JP2002277217A (ja) * | 2001-03-16 | 2002-09-25 | Toray Ind Inc | ウェブの厚さ測定装置及び該ウェブの製造方法 |
| JP2011180113A (ja) * | 2010-03-03 | 2011-09-15 | Opto-Electronics Laboratory Inc | ダイアモンド状カーボン薄膜の膜厚と屈折率の計測 |
| JP2016209951A (ja) * | 2015-05-08 | 2016-12-15 | 株式会社ディスコ | 乾式研磨装置 |
Non-Patent Citations (1)
| Title |
|---|
| 田原 和彦 外３名: "シリコンウェーハ用サブナノ精度サイトフラットネス計", 神戸製鋼技報, vol. 65, no. 2, JPN6022051912, September 2015 (2015-09-01), pages 87 - 91, ISSN: 0005070045 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202100946A (zh) | 2021-01-01 |
| WO2020261745A1 (ja) | 2020-12-30 |
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