JP2021004794A5 - - Google Patents
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- JP2021004794A5 JP2021004794A5 JP2019118686A JP2019118686A JP2021004794A5 JP 2021004794 A5 JP2021004794 A5 JP 2021004794A5 JP 2019118686 A JP2019118686 A JP 2019118686A JP 2019118686 A JP2019118686 A JP 2019118686A JP 2021004794 A5 JP2021004794 A5 JP 2021004794A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- refractive index
- predetermined position
- thickness
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004065 semiconductor Substances 0.000 claims description 44
- 230000003287 optical effect Effects 0.000 claims description 17
- 238000005259 measurement Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 230000003595 spectral effect Effects 0.000 claims description 6
- 238000001228 spectrum Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019118686A JP2021004794A (ja) | 2019-06-26 | 2019-06-26 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
| TW109113581A TW202100946A (zh) | 2019-06-26 | 2020-04-23 | 半導體晶圓的厚度測定方法及半導體晶圓的厚度測定系統 |
| PCT/JP2020/017836 WO2020261745A1 (ja) | 2019-06-26 | 2020-04-24 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019118686A JP2021004794A (ja) | 2019-06-26 | 2019-06-26 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2021004794A JP2021004794A (ja) | 2021-01-14 |
| JP2021004794A5 true JP2021004794A5 (enrdf_load_stackoverflow) | 2021-08-12 |
Family
ID=74061551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019118686A Pending JP2021004794A (ja) | 2019-06-26 | 2019-06-26 | 半導体ウェーハの厚み測定方法及び半導体ウェーハの厚み測定システム |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2021004794A (enrdf_load_stackoverflow) |
| TW (1) | TW202100946A (enrdf_load_stackoverflow) |
| WO (1) | WO2020261745A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7577342B2 (ja) * | 2022-03-31 | 2024-11-05 | ｓａｎｔｅｃ Ｈｏｌｄｉｎｇｓ株式会社 | 半導体ウエハの厚さ計測装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11274259A (ja) * | 1998-03-26 | 1999-10-08 | Hitachi Ltd | 厚さ測定装置および厚さ制御装置 |
| JP2002277217A (ja) * | 2001-03-16 | 2002-09-25 | Toray Ind Inc | ウェブの厚さ測定装置及び該ウェブの製造方法 |
| JP2011180113A (ja) * | 2010-03-03 | 2011-09-15 | Opto-Electronics Laboratory Inc | ダイアモンド状カーボン薄膜の膜厚と屈折率の計測 |
| JP6487767B2 (ja) * | 2015-05-08 | 2019-03-20 | 株式会社ディスコ | 乾式研磨装置 |
-
2019
- 2019-06-26 JP JP2019118686A patent/JP2021004794A/ja active Pending
-
2020
- 2020-04-23 TW TW109113581A patent/TW202100946A/zh unknown
- 2020-04-24 WO PCT/JP2020/017836 patent/WO2020261745A1/ja active Application Filing
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