TW202046496A - Display apparatus and manufacturing method thereof - Google Patents

Abstract

A display apparatus includes a driving substrate and a first light emitting diode element. The driving substrate has driving structures. Each of the driving structures includes a first pad, a second pad, a third pad and a fourth pad. The driving structures includes a first driving structure. The first light emitting diode element is electrically connected to a first pad and a second pad of the first driving structure, and the first light emitting diode element crosses a line connecting a third pad and a fourth pad of the first driving structure. A manufacturing method of the display apparatus is also provided.

Description

Display device and manufacturing method thereof

The present invention relates to a light emitting device and a manufacturing method thereof, and more particularly to a display device and a manufacturing method thereof.

The light emitting diode display device includes a driving substrate and a plurality of micro-light emitting diodes (mirco-LEDs) transferred on the driving substrate. Inheriting the characteristics of light-emitting diodes, light-emitting diode display devices have the advantages of power saving, high efficiency, high brightness and fast response time. In addition, compared with organic light-emitting diode display devices, light-emitting diode display devices also have the advantages of easy color adjustment, long light-emitting life, and no image burn-in. Therefore, light-emitting diode display devices are regarded as the next generation of display technology.

However, the preliminarily completed LED display devices often have defects. How to repair the LED display devices quickly and die saving without relying on redundancy is the current development of LED display devices A major issue encountered.

The invention provides a display device which is easy to repair.

The invention provides a method for manufacturing a display device, which can manufacture a display device that is easy to repair.

A display device of the present invention includes a driving substrate and a first light emitting diode element. The driving substrate has a plurality of driving structures. Each of the plurality of driving structures includes a first pad, a second pad, a third pad, and a fourth pad. The plurality of driving structures includes a first driving structure. The first light emitting diode element is electrically connected to the first pad and the second pad of the first driving structure, and the first light emitting diode element straddles the third pad and the fourth pad of the first driving structure One connection.

In an embodiment of the present invention, the above-mentioned first pad and the third pad have the same first potential, and the second pad and the fourth pad have the same second potential.

In an embodiment of the present invention, the above-mentioned first pad, second pad, third pad and fourth pad are separated in structure.

In an embodiment of the present invention, the aforementioned first pad and third pad are connected.

In an embodiment of the present invention, the above-mentioned second pad and the fourth pad are connected.

In an embodiment of the present invention, the above-mentioned display device further includes a second light emitting diode element. The plurality of driving structures further includes a second driving structure. The second light emitting diode device is electrically connected to the third pad and the fourth pad of the second driving structure. The first pad of the first drive structure and the second pad of the first drive structure are arranged in the first direction, and the third pad of the second drive structure and the fourth pad of the second drive structure are arranged in the second direction Arranged, and the first direction crosses the second direction.

In an embodiment of the present invention, the above-mentioned first light emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer disposed between the first type semiconductor layer and the second type semiconductor layer, The first electrode electrically connected to the first type semiconductor layer and the second electrode electrically connected to the second type semiconductor layer, wherein the first electrode is disposed between the first semiconductor layer and the first pad, and the second electrode It is arranged between the second semiconductor layer and the second pad.

In an embodiment of the present invention, the above-mentioned first light emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer disposed between the first type semiconductor layer and the second type semiconductor layer, The first electrode electrically connected to the first type semiconductor layer and the second electrode electrically connected to the second type semiconductor layer, wherein the first semiconductor layer is disposed between the first electrode and the first pad, and the second semiconductor layer The layer is disposed between the second electrode and the second pad.

In an embodiment of the present invention, the above-mentioned first light emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer disposed between the first type semiconductor layer and the second type semiconductor layer, The first electrode electrically connected to the first type semiconductor layer and the second electrode electrically connected to the second type semiconductor layer, wherein the first semiconductor layer is disposed between the first electrode and the first pad, and the second electrode It is arranged between the second semiconductor layer and the second pad.

A method of manufacturing a display device includes the following steps: providing a driving substrate with a plurality of driving structures, wherein each driving structure includes a first pad, a second pad, a third pad, and a fourth pad. The pads and the second pads are arranged in the first direction, the third pads and the fourth pads are arranged in the second direction, and the first direction and the second direction cross; and transpose a plurality of first light-emitting diodes The device is connected to the driving substrate, wherein the plurality of first light emitting diode devices are electrically connected to the plurality of first pads and the plurality of second pads of the plurality of first driving structures of the plurality of driving structures.

In an embodiment of the present invention, the above-mentioned plurality of driving structures further includes a second driving structure, and the manufacturing method of the display device further includes: after the plurality of first light-emitting diode elements have been transferred to the driving substrate, The plurality of second light-emitting diode elements are moved to the driving substrate, so that a second light-emitting diode element of the plurality of second light-emitting diode elements is transferred to the second driving structure, wherein the plurality of second light-emitting diode elements The other second light emitting diode element of the diode element is blocked by a first light emitting diode element of the plurality of first light emitting diode elements.

In an embodiment of the present invention, the manufacturing method of the above-mentioned display device further includes: electrically connecting the second light emitting diode element to the third pad and the fourth pad of the second driving structure.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

Reference will now be made in detail to the exemplary embodiments of the present invention, and examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same component symbols are used in the drawings and descriptions to indicate the same or similar parts.

It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that there are other elements between two elements.

As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the measurement in question and the The specific amount of measurement-related error (ie, the limitation of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the "about", "approximately" or "substantially" used herein can select a more acceptable range of deviation or standard deviation based on optical properties, etching properties, or other properties, instead of using one standard deviation for all properties .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

1A to 1D are schematic top views of the manufacturing process of the display device according to the first embodiment of the invention.

2A to 2D are schematic cross-sectional views of the manufacturing process of the display device according to the first embodiment of the invention. Figures 2A to 2D respectively correspond to the section line Ι-Ι', the section line П-П' and the section line Ш-Ш' of FIGS. 1A to 1D.

The manufacturing process and structure of the display device 10, 10' (labeled in FIG. 1B and FIG. 1D) according to the first embodiment of the present invention will be described below with reference to FIGS. 1A to 1D and FIGS. 2A to 2D.

Please refer to FIGS. 1A and 2A. First, a driving substrate SUB is provided. The driving substrate SUB may also be called a backplane. In this embodiment, the driving substrate SUB may include a base 110 and a driving circuit layer 120 disposed on the base 110. The driving circuit layer 120 has a plurality of driving structures DS.

For example, in this embodiment, a driving structure DS may include a first transistor T1, a second transistor T2, a capacitor C, a data line DL, a scan line GL, a power line VDD, and a The common line VSS, a first pad 121, a second pad 122, a third pad 123, and a fourth pad 124.

The first transistor T1 has a first terminal T1a, a second terminal T1b, and a control terminal T1c. The second transistor T2 has a first terminal T2a, a second terminal T2b, and a control terminal T2c. The first terminal T1a of the first transistor T1 is electrically connected to the data line DL. The control terminal T1c of the first transistor T1 is electrically connected to the scan line GL. The second terminal T1b of the first transistor T1 is electrically connected to the control terminal T2c of the second transistor T2. The first terminal T2a of the second transistor T2 is electrically connected to the power line VDD. The capacitor C is electrically connected to the first terminal T2a of the second transistor T2 and the control terminal T2c of the second transistor T2.

The first pad 121 and the third pad 123 have the same first potential. The second pad 122 and the fourth pad 124 have the same second potential. The first potential and the second potential may have a potential difference, and the potential difference is used to drive the light-emitting diode element 130 (marked in FIG. 1D), so that the light-emitting diode element 130 has a corresponding brightness and then displays a picture.

For example, in this embodiment, the first pad 121 and the third pad 123 can both be electrically connected to the second terminal T2b of the second transistor T2, and the second pad 122 and the fourth pad 124 Both can be electrically connected to the common line VSS, but the invention is not limited to this.

The first pad 121 with the first potential, the second pad 122 with the second potential, and the fourth pad 124 with the second potential are structurally separated, and the third pad 123 with the first potential is separated from the third pad 123 with the The second pad 122 of the second potential and the fourth pad 124 of the second potential are structurally separated.

For example, in this embodiment, the first pad 121, the second pad 122, the third pad 123, and the fourth pad 124 can be selectively separated from each other in structure, but the present invention does not take this as limit.

A first pad 121 and a second pad 122 of a driving structure DS can be regarded as a first pad group for electrically connecting with a light emitting diode device 130 (marked in FIG. 1D). A third pad 123 and a fourth pad 124 of a driving device DS can be regarded as a second pad group for electrically connecting with another light emitting diode device 130.

The first pad 121 and the second pad 122 of the first pad group are arranged in the first direction d1. The third pad 123 and the fourth pad 124 of the second pad group are arranged in the second direction d2, and the first direction d1 and the second direction d2 cross. That is, the first direction d1 and the second direction d2 have an included angle α, and 0 ^o <α<180 ^o . For example, in the present embodiment, the first direction and the second direction d2 d1 angle α may be 90 ^o, but the present invention is not limited thereto.

Please refer to FIGS. 1B and 2B. Then, an extraction element (not shown) is used to transfer a plurality of light-emitting diode elements 130 to the driving substrate SUB, and the plurality of light-emitting diode elements 130 are electrically connected to a plurality of driving devices. The plurality of first pads 121 and the plurality of second pads 122 of the structure DS.

1B and 2B show an example of a light emitting diode device 130 being transferred to a first pad 121 and a second pad 122 of a driving structure DS. Those with ordinary knowledge in the art can refer to FIGS. 1B and 2B It should be understood how the plurality of light-emitting diode elements 130 are transferred to the plurality of first pads 121 and the plurality of second pads 122 of the plurality of driving structures DS, and the illustration will not be repeated here.

2B, the light emitting diode device 130 includes a first type semiconductor layer 131, a second type semiconductor layer 132, an active layer 133, a first electrode 134, and a second electrode 135. The active layer 133 is disposed between the first type semiconductor layer 131 and the second type semiconductor layer 132. The first electrode 134 is electrically connected to the first type semiconductor layer 131. The second electrode 135 is electrically connected to the second type semiconductor layer 132.

In this embodiment, when the light emitting diode element 130 is transposed to the driving substrate SUB, the light emitting diode element 130 can be electrically connected to the driving structure DS at the same time. Specifically, in this embodiment, when the light emitting diode element 130-1 is transposed, the first electrode 134 and the second electrode 135 of the light emitting diode element 130-1 can selectively face the driving substrate SUB, Moreover, the first electrode 134 and the second electrode 135 of the light-emitting diode element 130-1 may be respectively provided with conductive objects 136 and 137 (for example, but not limited to: tin balls, silver glue, anisotropic conductive glue, etc.). When the light-emitting diode element 130-1 on the extraction element is close to the driving substrate SUB, the conductive objects 136 and 137 on the first electrode 134 and the second electrode 135 of the light-emitting diode element 130-1 can be connected to the driving substrate SUB, respectively. The first pad 121 and the second pad 122 are connected, and the first electrode 134 and the second electrode 135 of the light emitting diode device 130-1 are electrically connected to the first pad 121 and the second pad 121 of the driving substrate SUB, respectively. Two junction pad 122.

After the light-emitting diode element 130-1 is formed on the driving substrate SUB by the above-mentioned flip chip method, the first electrode 134 of the light-emitting diode element 130-1 is disposed on the first electrode 134 of the light-emitting diode element 130-1. Between a semiconductor layer 131 and the first pad 121, and the second electrode 135 of the light emitting diode element 130-1 is disposed between the second semiconductor layer 132 and the second pad 122 of the light emitting diode element 130-1 between.

1B, it is worth noting that after the plurality of light-emitting diode elements 130-1 are electrically connected to the plurality of first pads 121 and the plurality of second pads 122 of the plurality of driving structures DS, and a driving A light emitting diode element 130-1 electrically connected to a first pad 121 and a second pad 122 of the structure DS spans a line L between a third pad 123 and a fourth pad 124. At this point, the display device 10 is initially completed.

Next, the display device 10 is checked. After inspection, if it is found that no light emitting diode element 130 is provided on at least one driving structure DS2, the subsequent repair operations shown in FIGS. 1C, 1D, 2C, and 2D can be performed; or, at least one driving structure DS2 is found At least one of the light-emitting diode elements 130 is abnormal, after removing the abnormal light-emitting diode element 130, the subsequent repair operations shown in FIGS. 1C, 1D, 2C, and 2D can be performed; the following is in conjunction with FIGS. 1C, Figure 1D, Figure 2C and Figure 2D illustrate.

Please refer to FIG. 1C, FIG. 1D, FIG. 2C, and FIG. 2D. After the multiple light-emitting diode elements 130-1 have been transferred to the driving substrate SUB, the extraction element (not shown) extracts the multiple light-emitting diode elements 130-2 and rotate an angle. Then, the extraction element is moved to the driving substrate SUB, so that the light-emitting diode element 130-2 is transferred to the driving structure DS2, wherein the light-emitting diode element 130-2 is electrically connected to the third pad of the driving structure DS2 123 and the fourth pad 124.

In this embodiment, when the light emitting diode element 130-2 is transposed to the driving substrate SUB, the light emitting diode element 130-2 can be electrically connected to the driving structure DS at the same time. Specifically, in this embodiment, when the light emitting diode element 130-2 is transposed, the first electrode 134 and the second electrode 135 of the light emitting diode element 130-2 can selectively face the driving substrate SUB, In addition, the first electrode 134 and the second electrode 135 of the light-emitting diode element 130-2 may be respectively provided with conductive objects 136, 137 (for example, but not limited to: tin balls, silver glue, anisotropic conductive glue, etc.). When the light-emitting diode element 130-2 on the extraction element is close to the driving substrate SUB, the conductive objects 136, 137 on the first electrode 134 and the second electrode 135 of the light-emitting diode element 130-2 can be connected to the driving substrate SUB, respectively. The third pad 123 and the fourth pad 124 are connected, so that the first electrode 134 and the second electrode 135 of the light emitting diode element 130-2 are electrically connected to the third pad 123 and the second pad 123 of the driving substrate SUB, respectively Four pad 124.

After the light-emitting diode element 130-2 is formed on the driving substrate SUB by the above-mentioned flip chip method, the first electrode 134 of the light-emitting diode element 130-2 is disposed on the first electrode 134 of the light-emitting diode element 130-2. Between a semiconductor layer 131 and the third pad 123, and the second electrode 135 of the light emitting diode element 130-2 is disposed between the second semiconductor layer 132 and the fourth pad 124 of the light emitting diode element 130-2 between. At this point, the repaired display device 10' is completed.

Please refer to FIGS. 1C and 2C. It is worth noting that in the process of transferring a light-emitting diode element 130-2 to a driving structure DS2, another light-emitting diode element 130-2 (for example, The light-emitting diode element 130-2 on the left side of FIG. 1C is blocked by a light-emitting diode element 130-1 that has been disposed on the driving substrate SUB. 1C, 1D, 2C and 2D, when the light-emitting diode element 130-2 is not blocked by the light-emitting diode element 130-1 (for example, the light-emitting diode element 130-2 on the right side of FIG. 1C) ) When the extraction element has been transferred to the driving structure DS2 and the extraction element leaves the driving substrate SUB, the light-emitting diode element 130-2 that was previously blocked by the light-emitting diode element 130-1 will be taken away by the extraction element and can be used again ( For example: in the next repair action, set on another drive structure DS2).

Thereby, it is not necessary to arrange multiple light-emitting diode elements 130 on one driving structure DS at the beginning of manufacturing the display device 10, which can reduce the number of light-emitting diode elements 130 used and reduce the manufacturing cost of the display device 10. Moreover, the display device 10 can be quickly repaired through the above-mentioned repair method. In addition, during the repair process, the light-emitting diode element 130-2 blocked by the light-emitting diode element 130-1 formed on the driving substrate SUB can be recycled and reused, thereby reducing the repair cost.

Although the above repair method can only be used with the driving structure DS having the first pad 121, the second pad 122, the third pad 123, and the fourth pad 124, the first pad 121 and the second pad 124 The pads 122 are arranged in the first direction d1, the third pads 123 and the fourth pads 124 are arranged in the second direction d2, and the first direction d1 and the second direction d2 cross (that is, the first pad 121, The second pad 122, the third pad 123, and the fourth pad 124 are closely arranged). Therefore, the first pad 121, the second pad 122, the third pad 123 and the fourth pad 124 are arranged in parallel It does not excessively affect the resolution of the display devices 10, 10', and because the first pad 121, the second pad 122, the third pad 123, and the fourth pad 124 are closely arranged, compared to the general configuration of backup drivers The structure of the method, an embodiment of the present invention can save a little space.

The following embodiments use the element numbers and part of the content of the previous embodiments, wherein the same numbers are used to represent the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

3A to 3E are schematic top views of the manufacturing process of the display device according to the second embodiment of the invention.

4A to 4E are schematic cross-sectional views of the manufacturing process of the display device according to the second embodiment of the invention. 4A to 4E respectively correspond to the section line Ι-Ι', the section line П-П' and the section line Ш-Ш' of FIGS. 3A to 3E. FIGS. 3A to 3E omit the fixing layer 140 of FIGS. 4A to 4E.

The display devices 10A, 10A' and their manufacturing methods of the second embodiment are similar to the display devices 10, 10' and their manufacturing methods of the first embodiment. The difference between the two is: in the second embodiment, the light-emitting diode The element 130 is lateral, and the way that the lateral light-emitting diode element 130 is electrically connected to the driving substrate SUB is slightly different from the foregoing embodiment. The following is described in conjunction with FIGS. 3A to 3E and 4A to 4E. .

Please refer to FIGS. 3A and 4A. First, a driving substrate SUB is provided. The driving substrate SUB has a plurality of driving structures DS. The difference from the first embodiment is that a fixed layer 140 is further provided on the plurality of driving structures DS of the driving substrate SUB.

Please refer to FIGS. 3B and 4B. Then, an extraction element (not shown) is used to transfer a plurality of light-emitting diode elements 130 to the driving substrate SUB, and the plurality of light-emitting diode elements 130 are electrically connected to a plurality of driving devices. The plurality of first pads 121 and the plurality of second pads 122 of the structure DS.

Specifically, in this embodiment, when the light-emitting diode element 130 is transposed, the first electrode 134 and the second electrode 135 of the light-emitting diode element 130 can selectively face away from the driving substrate SUB, and the light-emitting diode The second semiconductor layer 132 of the body element 130 can be fixed on the fixing layer 140; then, a first connection element is formed on the first electrode 134 of the light emitting diode element 130 and the second electrode 135 of the light emitting diode element 130, respectively 151 and the second connecting element 152, wherein the first electrode 134 of the light emitting diode element 130-1 is electrically connected to the first pad 121 of the driving structure DS through the first connecting element 151, and the light emitting diode element 130- The second electrode 135 of 1 is electrically connected to the second pad 122 of the driving structure DS through the second connecting element 152.

After the plurality of light emitting diode elements 130 are electrically connected to the plurality of first pads 121 and the plurality of second pads 122 of the driving substrate SUB, the first pad 121 and the second pad 121 of a driving structure DS1 are connected together. A light emitting diode device 130-1 electrically connected to the pad 122 crosses the line L between a third pad 123 and a fourth pad 124 of the driving structure DS1. At this point, the display device 10A is initially completed.

Next, the display device 10A is checked. After inspection, if at least one driving structure DS2 is not provided with a light emitting diode element 130, the subsequent repair operations shown in FIGS. 3C to 3E and 4C to 4E can be performed; or, if at least one driving structure DS2 is found At least one of the light-emitting diode elements 130 is abnormal, then after the abnormal light-emitting diode element 130 is removed, the subsequent repair operations shown in FIGS. 3C to 3E and 4C to 4E can be performed; the following is in conjunction with FIGS. 3C to Figure 3E, Figure 4C to Figure 4E illustrate.

3C, FIG. 3D, FIG. 4C and FIG. 4D, after the multiple light-emitting diode elements 130-1 have been transferred to the driving substrate SUB, the extraction element (not shown) extracts multiple light-emitting diode elements 130-2 and rotate an angle. Then, the extraction element is moved to the driving substrate SUB, so that the light-emitting diode element 130-2 is transferred to the driving structure DS2.

Referring to FIGS. 3C and 4C, similarly, in the process of transferring a light-emitting diode element 130-2 to the driving structure DS2, another light-emitting diode element 130-2 on the extraction element is already placed on A light emitting diode element 130-1 on the driving substrate SUB is blocked. 3C, 3D, 4C and 4D, when the light-emitting diode element 130-2 that is not blocked by the light-emitting diode element 130-1 has been transferred to the driving structure DS2 and the extraction element leaves the driving substrate SUB At this time, the light-emitting diode element 130-2 previously blocked by the light-emitting diode element 130-1 will be taken away by the extraction element and can be used again (for example: in the next repair operation, set in another driving structure DS2 on).

Please refer to FIGS. 3E and 4E. Next, a first connection element 151 and a second connection are formed on the first electrode 134 of the light-emitting diode element 130-2 and the second electrode 135 of the light-emitting diode element 130-2, respectively Element 152, in which the first electrode 134 of the light-emitting diode element 130-2 is electrically connected to the third pad 123 of the driving structure DS2 through the first connecting element 151, and the second electrode of the light-emitting diode element 130-2 135 is electrically connected to the fourth pad 124 of the driving structure DS2 through the second connecting element 152. At this point, the repaired display device 10A' is completed.

The display device 10A' of this embodiment is similar to the aforementioned display device 10'. The difference between the two is: in this embodiment, the first semiconductor layer 131 of the light-emitting diode element 130-1 is disposed on the light-emitting diode element. Between the first electrode 134 of 130-1 and the first pad 121, and the second semiconductor layer 132 of the light emitting diode element 130-1 is disposed on the second electrode 135 and the second electrode 135 of the light emitting diode element 130-1. Between the pads 122; the first semiconductor layer 131 of the light-emitting diode element 130-2 is disposed between the first electrode 134 and the third pad 123 of the light-emitting diode element 130-2, the light-emitting diode element 130 The second semiconductor layer 132 of -2 is disposed between the second electrode 135 and the fourth pad 124 of the light emitting diode element 130-2.

5A to 5E are schematic top views of the manufacturing process of the display device according to the third embodiment of the invention.

6A to 6E are schematic cross-sectional views of the manufacturing process of the display device according to the third embodiment of the invention. 6A to 6E correspond to the section line Ι-Ι', the section line П-П' and the section line Ш-Ш' of FIGS. 5A to 5E.

The display devices 10B, 10B' and their manufacturing methods of the third embodiment are similar to the display devices 10, 10' and their manufacturing methods of the first embodiment. The difference between the two is: in the second embodiment, the light-emitting diode The element 130 is vertical, and the manner in which the vertical light-emitting diode element 130 is electrically connected to the driving substrate SUB is slightly different from the foregoing embodiment. The following is described in conjunction with FIGS. 5A to 5E and FIGS. 6A to 6E .

Please refer to FIG. 5A and FIG. 6A. First, a driving substrate SUB is provided. The driving substrate SUB has a plurality of driving structures DS.

Please refer to FIGS. 5B and 6B. Then, an extraction element (not shown) is used to transfer a plurality of light-emitting diode elements 130 to the driving substrate SUB, and the plurality of light-emitting diode elements 130 are electrically connected to a plurality of driving devices. The plurality of first pads 121 and the plurality of second pads 122 of the structure DS.

Specifically, in this embodiment, when the light-emitting diode element 130 is transposed, an electrode (such as but not limited to: the second electrode 135) of the light-emitting diode element 130 may be provided with a conductive object 138 (such as But not limited to: solder balls, silver glue, anisotropic conductive glue... etc.). When the light-emitting diode element 130-1 on the extraction element is close to the driving substrate SUB, the conductive object 138 on one of the electrodes of the light-emitting diode element 130-1 (for example, but not limited to: the second electrode 135) can interact with the driving substrate SUB. A pad (such as but not limited to: the second pad 122) of the first pad group is connected, so that the light emitting diode element 130-1 is electrically connected to the driving substrate SUB.

Next, a connecting element 153 is formed on the other electrode of the light emitting diode element 130 (for example, but not limited to: the first electrode 134), wherein the other electrode of the light emitting diode element 130 (for example, but not limited to: the first electrode 134) The connection element 153 is electrically connected to another pad of the first pad group of the driving substrate SUB (for example, but not limited to: the first pad 121). At this point, the display device 10B is initially completed.

Next, the display device 10B is checked. After inspection, if it is found that no light emitting diode element 130 is provided on at least one driving structure DS2, the subsequent repair operations shown in FIGS. 5C to 5E and 6C to 6E can be performed; or, if at least one driving structure DS2 is found At least one light-emitting diode element 130 above is abnormal. After removing the abnormal light-emitting diode element 130, the subsequent repair operations shown in FIGS. 5C to 5E and 6C to 6E can be performed; the following is in conjunction with FIG. 5C To Figure 5E, Figure 6C to Figure 6E to illustrate.

Referring to FIGS. 5C, 5D, 6C and 6D, after the multiple light-emitting diode elements 130-1 have been transferred to the driving substrate SUB, the extraction element (not shown) extracts the multiple light-emitting diode elements 130-2 and rotate an angle. Then, the extraction element is moved to the driving substrate SUB, so that the light-emitting diode element 130-2 is transferred to the driving structure DS2.

In this embodiment, when multiple light-emitting diode elements 130-2 are transposed, at least one light-emitting diode element 130-2 can be electrically connected to the driving structure DS2.

Specifically, in this embodiment, when the light-emitting diode element 130-2 is transposed, an electrode (for example, but not limited to: the second electrode 135) of the light-emitting diode element 130-2 may be provided with conductive 138 (such as but not limited to: tin balls, silver glue, anisotropic conductive glue... etc.). When the light-emitting diode element 130-2 on the extraction element is close to the driving substrate SUB, the conductive object 138 on one of the electrodes of the light-emitting diode element 130-2 (for example, but not limited to: the second electrode 135) can interact with the driving substrate SUB. A pad (for example, but not limited to: the fourth pad 124) of the second pad group is connected, so that the light emitting diode element 130-2 is electrically connected to the driving substrate SUB.

Please refer to FIG. 5C and FIG. 6C. Similarly, in the process of transferring a light-emitting diode element 130-2 to the driving structure DS2, another light-emitting diode element 130-2 on the extraction element is already placed on A light emitting diode element 130-1 on the driving substrate SUB is blocked. Referring to FIG. 5C, FIG. 5D, FIG. 6C and FIG. 6D, when the light-emitting diode element 130-2 that is not blocked by the light-emitting diode element 130-1 has been transferred to the driving structure DS2 and the extraction element leaves the driving substrate SUB At this time, the light-emitting diode element 130-2 previously blocked by the light-emitting diode element 130-1 will be taken away by the extraction element and can be used again (for example: in the next repair operation, set in another driving structure DS2 on).

Please refer to FIGS. 5E and 6E. Next, a connecting element 153 is formed on another electrode of the light-emitting diode element 130-2 (for example, but not limited to: the first electrode 134), wherein the light-emitting diode element 130-2 The other electrode (for example, but not limited to: the first electrode 134) is electrically connected to another pad (for example, but not limited to: the third pad 123) of the second pad group of the driving structure DS2 through the connecting element 153. At this point, the repaired display device 10B' is completed.

The display device 10B' of this embodiment is similar to the aforementioned display device 10'. The difference between the two is: in this embodiment, the first semiconductor layer 131 of the light-emitting diode element 130-1 is disposed on the light-emitting diode element. Between the first electrode 134 of 130-1 and the first pad 121, and the second electrode 135 of the light emitting diode element 130-1 is disposed on the second semiconductor layer 132 and the second semiconductor layer 132 of the light emitting diode element 130-1 Between the pads 122; the first semiconductor layer 131 of the light-emitting diode element 130-2 is disposed between the first electrode 134 and the third pad 123 of the light-emitting diode element 130-2, and the light-emitting diode element The second electrode 135 of 130-2 is disposed between the second semiconductor layer 132 and the fourth pad 124 of the light emitting diode device 130-2.

7A to 7D are schematic top views of the manufacturing process of the display device according to the fourth embodiment of the present invention. 8A to 8D are schematic cross-sectional views of the manufacturing process of the display device according to the fourth embodiment of the present invention. 8A to 8D respectively correspond to the section line Ι-Ι', the section line П-П' and the section line Ш-Ш' of FIGS. 7A to 7D.

The display devices 10C, 10C' and their manufacturing methods of the fourth embodiment are similar to the display devices 10, 10' and their manufacturing methods of the first embodiment. The difference between the two is: in this embodiment, they have the same first The first pad 121 and the third pad 123 of potential are connected, and/or the second pad 122 and the fourth pad 124 having the same second potential are connected. That is, in this embodiment, the first pad 121 and the third pad 123 may be two parts of the same first conductive pattern, and/or the second pad 122 and the fourth pad 124 may be the same Two parts of the conductive pattern.

The manufacturing method of the display devices 10C, 10C' of the fourth embodiment is similar to the manufacturing method of the display devices 10, 10' of the first embodiment. Those with ordinary knowledge in the art can use the foregoing description, FIGS. 7A to 7D and FIGS. 8A to FIG. 8D should be able to realize the display devices 10C and 10C', which will not be repeated here.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

10, 10’, 10A, 10A’, 10B, 10B’, 10C, 10C’: display device 110: Base 120: drive circuit layer 121: first pad 122: second pad 123: third pad 124: fourth pad 130, 130-1, 130-2: light-emitting diode components 131: First type semiconductor layer 132: Type II semiconductor layer 133: active layer 134: first electrode 135: second electrode 136, 137, 138: conductive objects 140: fixed layer 151: The first connecting element 152: second connecting element 153: Connection element C: Capacitance DS, DS1, DS2: drive structure DL: Data line d1: first direction d2: second direction GL: scan line L: Connect SUB: Drive substrate T1: first transistor T1a, T2a: first end T1b, T2b: second end T1c, T2c: control terminal T2: second transistor VDD: power line VSS: common line Ι-Ι’, П-П’, Ш-Ш’: cut line α: included angle

1A to 1D are schematic top views of the manufacturing process of the display device according to the first embodiment of the invention. 2A to 2D are schematic cross-sectional views of the manufacturing process of the display device according to the first embodiment of the invention. 3A to 3E are schematic top views of the manufacturing process of the display device according to the second embodiment of the invention. 4A to 4E are schematic cross-sectional views of the manufacturing process of the display device according to the second embodiment of the invention. 5A to 5E are schematic top views of the manufacturing process of the display device according to the third embodiment of the invention. 6A to 6E are schematic cross-sectional views of the manufacturing process of the display device according to the third embodiment of the invention. 7A to 7D are schematic top views of the manufacturing process of the display device according to the fourth embodiment of the present invention. 8A to 8D are schematic cross-sectional views of the manufacturing process of the display device according to the fourth embodiment of the present invention.

10’: Display device

110: Base

121: first pad

122: second pad

123: third pad

124: fourth pad

130, 130-1, 130-2: light-emitting diode components

C: Capacitance

DS, DS1, DS2: drive structure

DL: Data line

d1: first direction

d2: second direction

GL: scan line

L: Connect

T1: first transistor

T1a, T2a: first end

T1b, T2b: second end

T1c, T2c: control terminal

T2: second transistor

VDD: power line

VSS: common line

I-I’, Π-Π’, III-III’: Sectional line

α: included angle

Claims (12)

A display device includes: A driving substrate having a plurality of driving structures, wherein each of the driving structures includes a first pad, a second pad, a third pad, and a fourth pad; and A first light emitting diode device, wherein the driving structures include a first driving structure, and the first light emitting diode device is electrically connected to the first pad and the second pad of the first driving structure And the first light emitting diode element crosses a connection line between the third pad and the fourth pad of the first driving structure. As for the display device described in claim 1, wherein the first pad and the third pad have the same first potential, and the second pad and the fourth pad have the same first potential Two potential. As for the display device described in item 1 of the scope of patent application, the first pad, the second pad, the third pad and the fourth pad are separated in structure. In the display device described in item 1 of the scope of patent application, the first pad and the third pad are structurally connected. As for the display device described in item 1 of the scope of patent application, the second pad and the fourth pad are structurally connected. The display device described in item 1 of the scope of patent application further includes: A second light emitting diode element, wherein the driving structures further include a second driving structure, and the second light emitting diode element is electrically connected to the third pad and the fourth pad of the second driving structure Pad, the first pad of the first drive structure and the second pad of the first drive structure are arranged in a first direction, the third pad of the second drive structure and the second drive structure The fourth pads are arranged in a second direction, and the first direction crosses the second direction. According to the display device described in item 1 of the scope of patent application, the first light emitting diode element includes: A first type semiconductor layer; A second type semiconductor layer; An active layer disposed between the first type semiconductor layer and the second type semiconductor layer; A first electrode electrically connected to the first type semiconductor layer; and A second electrode electrically connected to the second type semiconductor layer, wherein the first electrode is disposed between the first semiconductor layer and the first pad, and the second electrode is disposed between the second semiconductor layer and Between the second pad. According to the display device described in item 1 of the scope of patent application, the first light emitting diode element includes: A first type semiconductor layer; A second type semiconductor layer; An active layer disposed between the first type semiconductor layer and the second type semiconductor layer; A first electrode electrically connected to the first type semiconductor layer; and A second electrode electrically connected to the second type semiconductor layer, wherein the first semiconductor layer is disposed between the first electrode and the first pad, and the second semiconductor layer is disposed between the second electrode and Between the second pad. According to the display device described in item 1 of the scope of patent application, the first light emitting diode element includes: A first type semiconductor layer; A second type semiconductor layer; An active layer disposed between the first type semiconductor layer and the second type semiconductor layer; A first electrode electrically connected to the first type semiconductor layer; and A second electrode is electrically connected to the second type semiconductor layer, wherein the first semiconductor layer is disposed between the first electrode and the first pad, and the second electrode is disposed between the second semiconductor layer and Between the second pad. A method for manufacturing a display device includes: A driving substrate is provided with a plurality of driving structures, wherein each of the driving structures includes a first pad, a second pad, a third pad and a fourth pad, the first pad and The second pads are arranged in a first direction, the third pads and the fourth pads are arranged in a second direction, and the first direction crosses the second direction; and Transpose a plurality of first light-emitting diode elements to the driving substrate, wherein the first light-emitting diode elements are electrically connected to the plurality of first pads and the plurality of first driving structures of the driving structures A second pad. According to the manufacturing method of the display device as described in claim 10, the driving structures further include a second driving structure, and the manufacturing method of the display device further includes: After the first light-emitting diode elements have been transferred to the driving substrate, a plurality of second light-emitting diode elements are moved to the driving substrate, so that a second light-emitting diode element of the second light-emitting diode elements The light-emitting diode element is transferred to the second driving structure, wherein another second light-emitting diode element of the second light-emitting diode elements is emitted by a first light-emitting diode element of the first light-emitting diode elements Diode element blocking. The manufacturing method of the display device as described in item 11 of the scope of patent application further includes: The second light emitting diode device is electrically connected to the third pad and the fourth pad of the second driving structure.

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