TW202312485A - Pixel structure and manufacturing method thereof - Google Patents

Abstract

A pixel structure includes a driving backplane, at least one light emitting device, a hydrophobic layer and at least one convex structure. The at least one light emitting device is disposed on and electrically connected to the driving backplane. The hydrophobic layer is disposed on the at least one light emitting device. The at least one convex structure is disposed on the hydrophobic layer. The hydrophobic layer is disposed between the at least one convex structure and the at least one light emitting device. Moreover, a manufacturing method of the pixel structure is also provided.

Description

Pixel structure and manufacturing method thereof

The invention relates to a pixel structure and a manufacturing method thereof.

The light emitting diode display device includes a driving backplane and a plurality of light emitting diode elements transposed on the driving backplane. Inheriting the characteristics of light-emitting diodes, light-emitting diode display devices have the advantages of power saving, high efficiency, high brightness, and fast response time. In addition, compared with organic light emitting diode display devices, light emitting diode display devices have more advantages such as easy color adjustment, long luminous life, and no image burn-in. Therefore, light emitting diode display devices are regarded as the next generation display technology.

In order to improve the resolution of the light emitting diode display device, the size of the light emitting diode used in the light emitting diode display device is getting smaller and smaller. However, when the size of the light-emitting diode becomes smaller and smaller, the external quantum efficiency of the light-emitting diode also decreases, which affects the brightness of the light-emitting diode display device. Therefore, how to improve the light-emitting efficiency of the light-emitting diodes of the light-emitting diode display device to increase the brightness of the light-emitting diode display device is a major issue for researchers.

The invention provides a pixel structure with high light extraction efficiency.

The pixel structure of the present invention includes a driving backplane, at least one light-emitting element, a hydrophobic layer and at least one protruding structure. At least one light-emitting element is disposed on the driving backplane and is electrically connected to the driving backplane. The hydrophobic layer is disposed on at least one light emitting element. At least one protruding structure is disposed on the hydrophobic layer. The hydrophobic layer is located between at least one protruding structure and at least one light emitting element.

The manufacturing method of the pixel structure of the present invention includes the following steps: providing a driving backplane; transposing a plurality of light-emitting elements on the driving backplane, and electrically connecting the plurality of light-emitting elements to the driving backplane; forming a layer of hydrophobic material to cover a plurality of light-emitting elements; forming a plurality of protruding structures on the layer of hydrophobic material, wherein the plurality of protruding structures respectively overlap a plurality of light-emitting elements; removing the hydrophobic material between the plurality of protruding structures A part of the layer to form a hydrophobic layer, wherein the hydrophobic layer has a plurality of hydrophobic patterns overlapping the plurality of protruding structures respectively.

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that other elements exist between two elements.

As used herein, "about," "approximately," or "substantially" includes stated values and averages within acceptable deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the relative A specific amount of measurement-related error (ie, the limit of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Moreover, "about", "approximately" or "substantially" used herein may select a more acceptable deviation range or standard deviation according to optical properties, etching properties or other properties, and may not use one standard deviation to apply to all properties .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art and the present invention, and will not be interpreted as idealized or excessive formal meaning, unless expressly so defined herein.

1A to 1F are schematic cross-sectional views of the manufacturing process of the pixel structure 10 according to an embodiment of the present invention.

Please refer to FIG. 1A , firstly, a driving backplane 110 is provided. In this embodiment, the driving backplane 110 includes a substrate (not shown), a plurality of pixel driving circuits (not shown) disposed on the substrate, and a plurality of pad groups electrically connected to the plurality of pixel driving circuits 112. Each pad group 112 includes a first pad 112a and a second pad 112b. For example, in this embodiment, each sub-pixel driving circuit may include a data line (not shown), a scan line (not shown), a power line (not shown), a common line ( not shown), a first transistor (not shown), a second transistor (not shown) and a capacitor (not shown), the first end of the first transistor is electrically connected to the data line, The control end of the first transistor is electrically connected to the scan line, the second end of the first transistor is electrically connected to the control end of the second transistor, the first end of the second transistor is electrically connected to the power line, and the capacitor Electrically connected to the second end of the first transistor and the first end of the second transistor, the second end of the second transistor is electrically connected to the first pad 112a of the corresponding pad group 112, common line are connected to the second pads 112b of the corresponding pad group 112, but the invention is not limited thereto.

Then, the plurality of light emitting elements 120 are transposed on the driving backplane 110 , and the plurality of light emitting elements 120 are electrically connected to the driving backplane 110 . In detail, in this embodiment, each light-emitting element 120 has a first electrode (not shown) and a second electrode (not shown), and the first electrode and the second electrode of each light-emitting element 120 are respectively electrically Connect to the first pad 112 a and the second pad 112 b of the corresponding pad set 112 .

Please refer to FIG. 1B. Next, in this embodiment, a light-shielding layer (or anti-reflection layer/light-absorbing layer) 130 can be selectively formed on the driving backplane 110, wherein the light-shielding layer 130 includes a solid part 132 and a plurality of The opening 134, the solid part 132 of the light-shielding layer 130 shields at least a part of the side wall 120s of the light-shielding element 120, and the plurality of light-emitting elements 120 are respectively overlapped with the plurality of openings 134 of the light-shielding layer 130, and the opening 134 of the light-shielding layer 130 exposes the light-emitting element 120 top surface 120a. However, the present invention is not limited thereto, and in other embodiments, the disposition of the light shielding layer 130 may also be omitted.

Referring to FIG. 1C , next, a hydrophobic material layer 140 is formed on the driving backplane 110 to cover the plurality of light emitting elements 120 . The hydrophobic material layer 140 at least covers the top surface 120 a of the light emitting element 120 . In this embodiment, the hydrophobic material layer 140 further covers a part of the sidewall 120s of the light emitting element 120 and the solid portion 132 of the light shielding layer 130 , but the invention is not limited thereto. In this embodiment, the hydrophobic material layer 140 may be formed by spraying, but the invention is not limited thereto. In this embodiment, the hydrophobic material layer 140 is, for example, a fluorine layer, but the invention is not limited thereto.

Referring to FIG. 1D , next, a plurality of protruding structures 150 are formed on the hydrophobic material layer 140 , wherein the plurality of protruding structures 150 are respectively overlapped on the plurality of light emitting elements 120 . In this embodiment, the protruding structure 150 can cover a part of the top surface 120 a and the sidewall 120 s of the light emitting element 120 , but the invention is not limited thereto. In this embodiment, a high refractive index material can be dropped on the plurality of light emitting elements 120 to form the convex structure 150 . It is worth mentioning that due to the material properties of the hydrophobic material layer 140 , the high refractive index material and the hydrophobic material layer 140 can form a large contact angle and converge on the light-emitting element 120 , thereby forming a good convex structure 150 . The good convex structure 150 can effectively concentrate the light emitted by the light emitting element 120 in the direction of the front view, thereby improving the light extraction efficiency.

Referring to FIG. 1D and FIG. 1E , then, a part of the hydrophobic material layer 140 between the plurality of protruding structures 150 is removed to form a hydrophobic layer 142 . The hydrophobic layer 142 has a plurality of hydrophobic patterns 142 - 1 respectively overlapping the plurality of protruding structures 150 . The plurality of hydrophobic patterns 142 - 1 are located between the plurality of protruding structures 150 and the plurality of light emitting elements 120 .

In detail, in this embodiment, the part of the hydrophobic material layer 140 not covered by the protruding structure 150 can be removed to form the hydrophobic layer 142; since the part of the hydrophobic material layer 140 not covered by the protruding structure 150 has been is removed, therefore, another part of the hydrophobic material layer 140 (that is, the plurality of hydrophobic patterns 142-1) will be aligned with the plurality of protruding structures 150; that is, the plurality of hydrophobic patterns 142-1 in The plurality of vertical projections on the driving backplane 110 and the plurality of vertical projections of the plurality of protruding structures 150 on the driving backplane 110 substantially coincide respectively; however, the present invention is not limited thereto. For example, in this embodiment, the portion of the hydrophobic material layer 140 not covered by the protruding structure 150 can be removed by using low pressure plasma to form the hydrophobic layer 142 , but the invention is not limited thereto.

Please refer to FIG. 1F, and then, form an adhesive layer on the drive backplane 110 ( molding layer) 160 to cover the plurality of protruding structures 150 , wherein the plurality of protruding structures 150 are separated from each other, and a part 162 of the sealing layer 160 fills the gap G150 between the plurality of protruding structures 150 . In this embodiment, the plurality of hydrophobic patterns 142-1 are separated from each other, and a part 162 of the sealant layer 160 further fills the gap G142 between the plurality of hydrophobic patterns 142-1. In this embodiment, the solid part 132 of the light-shielding layer 130 overlaps the gap G150 between the plurality of protruding structures 150 and the gap G142 between the plurality of hydrophobic patterns 142-1, and fills the gap between the gap G150 and the gap G142. A portion 162 of the adhesive layer 160 is in contact with the solid portion 132 of the light shielding layer 130 . Here, the pixel structure 10 of this embodiment is completed.

2 shows the state of water and the high refractive index material 150' used to form the convex structure 150 according to an embodiment of the present invention on the driving backplane 110 and the hydrophobic material layer 140. It can be seen from FIG. 2 that the contact angle between the high refractive index material 150' and the hydrophobic material layer 140 is significantly larger than the contact angle between the high refractive index material 150' and the driving backplane 110, which helps to form a good convex structure 150 (drawn in Figure 1F).

10: Pixel structure 110: Drive backplane 112: Pad set 112a: first pad 112b: second pad 120: Light emitting element 120a: top surface 120s: side wall 130: shading layer 132: Entity Department 134: opening 140: Hydrophobic material layer 142: Hydrophobic layer 142-1: Hydrophobic pattern 150: convex structure 150': high refractive index material 160: sealing layer 162: part G120, G142, G150: Clearance W: water

1A to 1F are schematic cross-sectional views of the manufacturing process of the pixel structure 10 according to an embodiment of the present invention. 2 shows the state of water and the high refractive index material 150' used to form the convex structure 150 according to an embodiment of the present invention on the driving backplane 110 and the hydrophobic material layer 140.

10: Pixel structure

110: Drive backplane

112: Pad set

112a: first pad

112b: second pad

120: Light emitting element

120a: top surface

120s: side wall

130: shading layer

132: Entity Department

134: opening

142: Hydrophobic layer

142-1: Hydrophobic pattern

150: convex structure

160: sealing layer

162: part

G120, G142, G150: Clearance

Claims (12)

A pixel structure, including: a drive backplane; At least one light-emitting element is arranged on the driving backplane and is electrically connected to the driving backplane; a hydrophobic layer disposed on the at least one light emitting element; and At least one protruding structure is disposed on the hydrophobic layer, wherein the hydrophobic layer is located between the at least one protruding structure and the at least one light emitting element. The pixel structure according to claim 1, wherein the at least one light-emitting element is a plurality of light-emitting elements; the hydrophobic layer has a plurality of hydrophobic patterns, which are respectively arranged on the light-emitting elements; the at least one convex structure is a plurality of The protruding structures are respectively arranged on the hydrophobic patterns; the hydrophobic patterns are located between the protruding structures and the light emitting elements. The pixel structure as described in claim item 2 further includes: The sealant layer is disposed on the protruding structures, wherein the protruding structures are separated from each other, and a part of the sealant layer fills a gap between the protruding structures. The pixel structure according to claim 3, wherein the hydrophobic patterns are separated from each other, and the part of the sealing layer further fills a gap between the hydrophobic patterns. The pixel structure as described in claim item 3 further includes: A light-shielding layer, disposed on the driving backplane, wherein the light-shielding layer includes a solid portion and a plurality of openings, the solid portion of the light-shielding layer overlaps the gap between the protruding structures, and the light-emitting elements The portion of the sealant layer that overlaps the openings of the light-shielding layer and fills the gap is in contact with the solid portion of the light-shielding layer. The pixel structure according to claim 2, wherein the vertical projections of the hydrophobic patterns on the driving backplane and the vertical projections of the protruding structures on the driving backplane substantially overlap respectively. A method for manufacturing a pixel structure, comprising: providing a drive backplane; Transposing a plurality of light-emitting elements on the driving backplane, and electrically connecting the light-emitting elements to the driving backplane; forming a hydrophobic material layer on the driving backplane to cover the light emitting elements; forming a plurality of protruding structures on the hydrophobic material layer, wherein the protruding structures respectively overlap the light-emitting elements; and A part of the hydrophobic material layer between the protruding structures is removed to form a hydrophobic layer, wherein the hydrophobic layer has a plurality of hydrophobic patterns overlapping the protruding structures respectively. The manufacturing method of the pixel structure according to claim 7, wherein the hydrophobic patterns are located between the protruding structures and the light emitting elements. The manufacturing method of the pixel structure as described in claim item 7, further comprising: A sealant layer is formed on the driving backplane to cover the protruding structures, wherein the protruding structures are separated from each other, and a part of the sealant layer fills a gap between the protruding structures. The manufacturing method of the pixel structure according to claim 9, wherein the hydrophobic patterns are separated from each other, and the part of the sealant layer further fills a gap between the hydrophobic patterns. The manufacturing method of the pixel structure as described in claim item 9, further comprising: After transposing the light-emitting elements on the driving backplane and electrically connecting the light-emitting elements to the driving backplane and before forming the hydrophobic material layer on the driving backplane, forming a A light-shielding layer, wherein the light-shielding layer includes a solid portion and a plurality of openings, the solid portion of the light-shielding layer overlaps the gap between the protruding structures, and the light-emitting elements overlap the light-shielding elements respectively the opening, and the part of the sealant layer filling the gap is in contact with the solid part of the light shielding layer. The manufacturing method of the pixel structure as claimed in item 7, wherein the plurality of vertical projections of the hydrophobic patterns on the driving backplane are substantially different from the plurality of vertical projections of the convex structures on the driving backplane coincide.

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