TWI797790B - Electronic apparatus - Google Patents

Abstract

An electronic apparatus includes a fist substrate, a first conductor, a second substrate and a driving circuit layer. The first conductor is disposed in a through hole of the first substrate and has a protruding portion protruding from the first substrate. The second substrate has a first surface, a second surface and a through hole, wherein the first surface and the second surface are opposite, and the through hole of the second substrate penetrates the first surface and the second surface of the second substrate. The first substrate and the driving circuit layer are disposed on the first surface and the second surface of the second substrate, respectively. The driving circuit layer has a through hole overlapped with the through hole of the second substrate. The protruding portion of the first conductor extends into the through hole of the second substrate and the through hole of the driving circuit layer, and the protruding portion of the first conductor is electrically connected to the driving circuit layer.

Description

electronic device

The invention relates to an electronic device.

The light emitting diode display panel includes a driving circuit substrate and a plurality of light emitting diodes transposed on the driving circuit substrate. Inheriting the characteristics of light-emitting diodes, light-emitting diode display panels have the advantages of power saving, high efficiency, high brightness, and fast response time. In addition, compared with organic light-emitting diode display panels, light-emitting diode display panels also have advantages such as easy color adjustment, long luminous life, and no image burn-in. Therefore, LED display panels are regarded as the next generation display technology.

In order to reduce the frame of the light-emitting diode display panel, or even achieve no frame, the driving circuit layer disposed on the front side of the substrate of the driving circuit substrate can be electrically connected to the layer disposed on the driving circuit substrate by using a side wiring process. The driving element on the backside of the substrate may be electrically connected to the driving element disposed on the sidewall of the substrate of the driving circuit substrate by using a side bonding process. However, side wiring and side bonding have different difficulties in the manufacturing process. Use side wiring and/or side bonding to make light-emitting diodes The yield rate of bulk display panels is not high.

The invention provides an electronic device which is easy to manufacture.

The electronic device of the present invention includes a first base, a first conductor, a second base and a driving circuit layer. The first base has through holes. The first conductive object is disposed in the through hole of the first base, and has a protruding portion protruding from the first base. The second base has a first surface, a second surface and a through hole, wherein the first surface is opposite to the second surface, and the through hole of the second base runs through the first surface and the second surface of the second base. The first base and the driving circuit layer are respectively disposed on the first surface and the second surface of the second base. The driving circuit layer has through holes overlapping with the through holes of the second substrate. The protruding portion of the first conductive object extends into the through hole of the second base and the through hole of the driving circuit layer and is electrically connected to the driving circuit layer.

In an embodiment of the present invention, the height of the protruding portion of the first conductive material is greater than the thickness of the second base.

In an embodiment of the present invention, the above-mentioned first conductive object further has a filling portion disposed in the through hole of the first substrate, electrically connected to the protruding portion of the first conductive object, and overlapped with the first conductive object of the bulge.

In an embodiment of the present invention, the above-mentioned filling portion of the first conductive object is directly connected to the protruding portion of the first conductive object and has an interface.

In an embodiment of the present invention, the above-mentioned first conductive object has a filling portion. The filled portion of the first conductive material is disposed in the through hole of the first base. The protruding portion of the first conductive object includes an insulating protrusion and a conductive film. The insulating protrusion is disposed on the first base and staggered from the filling part. The conductive film covers the insulating protrusion and is electrically connected to the filling part.

In an embodiment of the present invention, the above-mentioned second base has an inner sidewall defining a through hole of the second base, and a first gap exists between the protruding portion of the first conductive material and the inner sidewall of the second base. The electronic device further includes an encapsulation material disposed in the first gap.

In an embodiment of the present invention, the above-mentioned driving circuit layer has an inner sidewall defining a through hole of the driving circuit layer, and there is a second gap between the protruding portion of the first conductor and the inner sidewall of the driving circuit layer. The electronic device further includes an encapsulation material disposed in the second gap.

In an embodiment of the present invention, the above-mentioned electronic device further includes a contact pad disposed on the protruding portion of the first conductive object and the driving circuit layer, and electrically connected to the protruding portion of the first conductive object and the driving circuit layer layer.

In an embodiment of the present invention, the above-mentioned protruding portion of the first conductive object protrudes from a surface of the first base. The electronic device further includes an adhesive layer disposed between the surface of the first substrate and the first surface of the second substrate.

In an embodiment of the present invention, the above-mentioned electronic device further includes a third substrate, a second conductive object, a connection circuit layer, and a light emitting element. The third base has a through hole, wherein the first base is disposed between the third base and the second base. The second conductive object is disposed in the through hole of the third substrate, and is electrically connected to the first conductive object. The connection circuit layer is disposed on the third substrate and is electrically connected to the second conductive object, wherein the third substrate is disposed between the connection circuit layer and the first substrate. The light emitting element is disposed on the connection circuit layer and is electrically connected to the connection circuit layer, wherein the connection circuit layer is disposed between the light emitting device and the third base.

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that other elements exist between two elements.

As used herein, "about," "approximately," or "substantially" includes stated values and averages within acceptable deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the relative A specific amount of measurement-related error (ie, the limit of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Moreover, "about", "approximately" or "substantially" used herein may select a more acceptable deviation range or standard deviation according to optical properties, etching properties or other properties, and may not use one standard deviation to apply to all properties .

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art and the present invention, and will not be interpreted as idealized or excessive formal meaning, unless expressly so defined herein.

1A to 1F are schematic cross-sectional views of the manufacturing process of an electronic device 10 according to an embodiment of the present invention.

Please refer to FIG. 1A to FIG. 1C. First, a transfer board (Transfer Board) 100 (marked in FIG. 1C ) is provided, wherein the transfer board 100 includes a first base 110 and a first conductor C1, and the first base 110 has a through hole. 112 , the first conductive object C1 is disposed in the through hole 112 of the first substrate 110 and has a protruding portion 130 protruding from the first substrate 110 .

Please refer to FIG. 1A , for example, in this embodiment, a first substrate 110 having a through hole 112 may be provided first; please refer to FIG. 1B , and then, a conductive filling portion 120 may be formed in the through hole 112 ; then, A conductive layer 130' is formed on the first substrate 110 and the filling portion 120; please refer to FIG. 1B and FIG. It is electrically connected with the protruding portion 130 to form a first conductor C1. In this embodiment, the filling portion 120 and the protruding portion 130 of the first conductive object C1 are directly connected to have an interface I, but the present invention is not limited thereto.

In this embodiment, the through hole 112 of the first substrate 110 can be selectively formed by a laser drilling process; the first substrate 110 is, for example, a flexible printed circuit board or a glass substrate; limit. In this embodiment, an electroplating process or a low temperature co-fired ceramics (Low Tempertuure Cofired Ceramics; LTCC) process can be optionally used to form the filling portion 120 in the through hole 112; the material of the filling portion 120 is, for example, copper or silver; but this The invention is not limited thereto. In this embodiment, the conductive layer 130' can be optionally formed by a pressing process first, and then the conductive layer 130' is patterned to form the protruding portion 130; the conductive layer 130' is, for example, copper foil; but the present invention does not limit.

Referring to FIG. 1D , next, a driving circuit substrate 200 is provided. The driving circuit substrate 200 includes a second base 210 and a driving circuit layer 220 . The second substrate 210 has a first surface 210 a , a second surface 210 b and a through hole 212 . The first surface 210a is opposite to the second surface 210b. The through hole 212 of the second substrate 210 runs through the first surface 210 a and the second surface 210 b of the second substrate 210 . The driving circuit layer 220 is disposed on the second surface 210 b of the second substrate 210 and has a through hole 222 overlapping with the through hole 212 of the second substrate 210 .

For example, in this embodiment, the driving circuit layer 220 may include active elements (such as thin film transistors, etc.) and/or passive elements (such as: data lines, scan lines, power lines, common lines, capacitors, etc.), The active element and/or the passive element can be formed by a plurality of conductive layers 224, 226, and the inner sidewall 220s of the through hole 222 defining the driving circuit layer 220 can be formed by at least one of the conductive layers 224, 226. The sidewall of a dielectric layer 228 is formed, but the invention is not limited thereto.

Referring to FIG. 1D , next, the interposer substrate 100 and the driving circuit substrate 200 are assembled. That is, the protrusions 130 of the interposer substrate 100 are inserted into the through holes 212 and 222 of the driving circuit substrate 200 , and the interposer substrate 100 and the driving circuit substrate 200 are fixedly connected.

For example, in this embodiment, the protruding portion 130 of the interposer substrate 100 protrudes from the surface 110b of the first base 110 , and can be between the surface 110b of the first base 110 of the interposer substrate 100 or the driving circuit substrate 200 The first surface 210a of the second substrate 210 is disposed on the adhesive layer 300; then, in a vacuum or near vacuum environment, the interposer substrate 100 and the driving circuit substrate 200 are assembled so that the first substrate 110 of the interposer substrate 100 Set on the first surface 210a of the second base 210 of the drive circuit substrate 200, the protrusion 130 of the interposer substrate 100 protrudes into the through holes 212, 222 of the drive circuit substrate 200, and the first base 110 of the interposer substrate 100 The surface 110b of the driving circuit substrate 200 and the first surface 210a of the second base 210 of the driving circuit substrate 200 are fixed to each other through the adhesive layer 300; but the present invention is not limited thereto. The adhesive layer 300 is disposed between the surface 110 b of the first substrate 110 and the first surface 210 a of the second substrate 210 . In this embodiment, the adhesive layer 300 is, for example, water glue, but the invention is not limited thereto.

Referring to FIG. 1D , in this embodiment, the height H of the protruding portion 130 of the first conductive object C1 of the interposer substrate 100 is greater than the thickness T of the second base 210 of the driving circuit substrate 200 . That is to say, after the interposer substrate 100 and the driving circuit substrate 200 are assembled, the protruding portion 130 of the first conductive material C1 of the intermediary substrate 100 will exceed or approach the second portion of the second base 210 of the driving circuit substrate 200 . Surface 210b. In this embodiment, the thickness T of the second base 210 of the driving circuit substrate 200 is, for example, in the range of 0.3 mm˜0.5 mm, but the present invention is not limited thereto.

In addition, in this embodiment, after the protruding portion 130 of the interposer substrate 100 is inserted into the through holes 212 and 222 of the driving circuit substrate 200, the inner wall 210s of the second substrate 210 defining the through hole 212 and the first conductor C1 There may be a first gap g1 between the protrusions 130, and a second gap g2 may exist between the inner wall 220s of the driving circuit layer 220 defining the through hole 222 and the protrusion 130 of the first conductor C1, but the present invention does not This is the limit.

Referring to FIG. 1E , next, electrically connect the protruding portion 130 of the first conductor C1 of the interposer substrate 100 and the driving circuit layer 220 of the driving circuit substrate 200 .

For example, in this embodiment, the packaging material 400 can be provided on the first gap g1, the second gap g2, the driving circuit layer 220 of the driving circuit substrate 200, and the protruding portion 130 of the first conductor C1, wherein the packaging The material 400 may have a first contact window 402 and a second contact window 404 respectively overlapping the protruding portion 130 and the driving circuit layer 220; then, a pad 500 is formed on the packaging material 400, wherein the pad 500 is disposed on the first conductive The protruding portion 130 of the object C1 and the driving circuit layer 220 are electrically connected to the driving circuit layer 220 and the protruding portion 130 of the first conductive object C1 through the first contact window 402 and the second contact window 404 of the packaging material 400 . Thereby, the first conductive object C1 of the interposer substrate 100 can be electrically connected with the driving circuit layer 220 of the driving circuit substrate 200 . In this embodiment, the second base 210 of the driving circuit substrate 200 can be located between the first base 110 of the interposer 100 and the pad 500; Chip On Film; COF), wafers or other types of electronic components, bonded.

However, the present invention is not limited thereto. In other embodiments, the first conductive object C1 of the interposer substrate 100 may also be electrically connected to the driving circuit layer 220 of the driving circuit substrate 200 through other methods. For example, in another embodiment, the protruding portion 130 of the first conductive object C1 itself can be used as a part of the pad, and the driving element, such as: Chip On Film (COF), chip or other types of electronic components can be directly bonded to the protruding portion 130 of the first conductor C1 of the interposer substrate 100 and the driving circuit layer 220 of the driving circuit substrate 200 .

Please refer to FIG. 1F, and then, provide a light-emitting element substrate 600, wherein the light-emitting element substrate 600 includes a third base 610, a second conductive material 620, a connection circuit layer 630, and a light-emitting element 640. The third base 610 has a through hole 612, and the second The conductive object 620 is disposed in the through hole 612 of the third substrate 610, the connection circuit layer 630 is disposed on the third substrate 610 and electrically connected to the second conductive object 620, and the light emitting element 640 is disposed on the connection circuit layer 630 and electrically connected to the second conductive object 620. Connect to wiring layer 630 . In this embodiment, the connection circuit layer 630 may include a pad for bonding with the light emitting element 640 and a bridging circuit for electrically connecting the pad and the second conductive object 620 . In this embodiment, the light emitting element 640 is, for example, a micro light emitting diode (μLED) transposed onto the third substrate 610 , but the invention is not limited thereto. In addition, in this embodiment, the light-emitting element substrate 600 may further include a protective layer 650 covering the light-emitting element 640 .

Please refer to FIG. 1F , and then, the light-emitting element substrate 600 is disposed on the assembled interposer substrate 100 and the driving circuit substrate 200 , and the second conductor 620 of the light-emitting element substrate 600 is connected to the first conductor of the interposer substrate 100 . The objects C1 are electrically connected to form the electronic device 10 . In this embodiment, the electronic device 10 can be a miniature LED display device, but the invention is not limited thereto.

Please refer to FIG. 1F. In this embodiment, the connection circuit layer 630 of the light emitting element substrate 600 is disposed between the light emitting element 640 and the third base 610 of the light emitting element substrate 600, and the third base 610 of the light emitting element substrate 600 is disposed on the connection between the wiring layer 630 and the first base 110 of the transfer substrate 100 , the first base 110 of the transfer substrate 100 is disposed between the third base 610 of the light emitting element substrate 600 and the second base 210 of the driving circuit substrate 200 , and The second substrate 210 of the driving circuit substrate 200 is disposed between the first substrate 110 of the interposer substrate 100 and the driving circuit layer 200 of the driving circuit substrate 200 .

In this embodiment, the through hole 612 of the third base 610 of the light-emitting element substrate 600 can selectively overlap the through hole 112 of the first base 110 of the interposer substrate 100 , and the through hole 612 of the third base 610 The second conductive object 620 and the first conductive object C1 disposed in the through hole 112 of the first substrate 110 can be selectively directly contacted to be electrically connected to each other. However, the present invention is not limited thereto. In other embodiments, the first conductive object C1 and the second conductive object 620 may also be electrically connected through a conductor (not shown) disposed therebetween.

It is worth mentioning that, through the second conductor 620 disposed in the through hole 612 of the light emitting element substrate 600 and the first conductor C1 of the interposer substrate 100 extending into the through hole 212 of the driving circuit substrate 200, the light emitting element 640 It can be electrically connected to the driving element (such as: thin film chip package, chip or other types of electronic components) without going through the difficult side wiring or side bonding process, and then driven . Therefore, the yield rate of the electronic device 10 can be improved.

In addition, the interposer substrate 100 , the driving circuit substrate 200 and the light-emitting element substrate 600 are completed separately and then assembled with each other, and then the electronic device 10 is completed. Therefore, before being assembled with each other, the interposer substrate 100 , the driving circuit substrate 200 and the light emitting element substrate 600 can be inspected and/or repaired respectively, and the electronic device 10 can be assembled after the inspection is normal and/or the repair is completed. Therefore, the material cost of the electronic device 10 can be reduced, and the yield rate can be further improved.

Furthermore, the driving element (for example: a thin film chip-on-chip package) can be disposed on the back of the electronic device 10 (ie, on the second surface 210b of the second substrate 210) and located on the protruding portion 130 of the first conductor C1, and It does not need to be bent from the side wall of the electronic device to the back of the electronic device to occupy the back of the electronic device like the drive element (such as: thin film chip-on-chip package) arranged on the side wall of the electronic device by using the side bonding process A distance (for example: 0.5mm). Therefore, the width of the frame of the electronic device 10 in this embodiment can be further reduced, and even achieve no frame.

It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the aforementioned embodiments, and the following embodiments will not be repeated.

2A to 2F are schematic cross-sectional views of the manufacturing process of an electronic device 10A according to another embodiment of the present invention.

The electronic device 10A of FIG. 2A to FIG. 2F and its manufacturing process are similar to the electronic device 10A of FIG. 1A to FIG. 1F and its manufacturing process. The protrusion 130 of 10 and its manufacturing process are different.

Please refer to FIG. 2B and FIG. 2C. Specifically, in this embodiment, an insulating protrusion 132 that is offset from the filling portion 120 is formed on the first base 110; then, on the insulating protrusion 132 and the first base 110 A conductive film 134 is formed, wherein the conductive film 134 conformally covers the insulating protrusion 132 and is electrically connected to the filling portion 120 . In this embodiment, the protruding portion 130A of the first conductive object C1 is composed of an insulating protruding portion 132 and a conductive film 134 .

10, 10A: electronic device

100:Transfer substrate

110: First base

110b: surface

112, 212, 222, 612: through hole

120: filling part

130, 130A: protruding part

130', 224, 226: conductive layer

132: Insulation bump

134: Conductive film

200: Drive circuit substrate

210:Second Base

210a: first surface

210b: second surface

210s, 220s: inner wall

220: Drive circuit layer

228: dielectric layer

300: Adhesive layer

400: Encapsulation material

402: first contact window

404: second contact window

500: Pad

600: Light-emitting element substrate

610: third base

620: Second Conductor

630: Connect the line layer

640: light emitting element

650: protective layer

C1: the first conductor

g1: first gap

g2: second gap

H: height

I: interface

T: Thickness

1A to 1F are schematic cross-sectional views of the manufacturing process of an electronic device 10 according to an embodiment of the present invention. 2A to 2F are schematic cross-sectional views of the manufacturing process of an electronic device 10A according to another embodiment of the present invention.

10: Electronic device

100:Transfer substrate

110: First base

110b: surface

112, 212, 222, 612: through hole

120: filling part

130: protruding part

200: Drive circuit substrate

210:Second Base

210a: first surface

210b: second surface

210s, 220s: inner wall

220: Drive circuit layer

224, 226: conductive layer

228: dielectric layer

300: Adhesive layer

400: Encapsulation material

402: first contact window

404: second contact window

500: Pad

600: Light-emitting element substrate

610: third base

620: Second Conductor

630: Connect the line layer

640: light emitting element

650: protective layer

C1: the first conductor

g1: first gap

g2: second gap

H: height

I: interface

T: Thickness

Claims (9)

An electronic device, comprising: a first substrate having a through hole; a first conductive object disposed in the through hole of the first substrate and having a protruding portion protruding from the first substrate; a first Two substrates, having a first surface, a second surface and a through hole, wherein the first surface is opposite to the second surface, and the through hole of the second substrate passes through the first surface and the first surface of the second substrate two surfaces, the second base has an inner sidewall defining the through hole of the second base, and there is a first gap between the protrusion of the first conductor and the inner sidewall of the second base; A driving circuit layer, wherein the first substrate and the driving circuit layer are respectively arranged on the first surface and the second surface of the second substrate, and the driving circuit layer has a hole overlapping with the through hole of the second substrate a through hole, the protruding part of the first conductive material extends into the through hole of the second substrate and the through hole of the driving circuit layer and is electrically connected to the driving circuit layer; and a packaging material is disposed on the First gap. The electronic device as claimed in claim 1, wherein a height of the protruding portion of the first conductive object is greater than a thickness of the second substrate. The electronic device as claimed in claim 1, wherein the first conductive object further has a filling portion disposed in the through hole of the first substrate, electrically connected to the protrusion of the first conductive object, and The protruding portion overlapping the first conductive object. The electronic device as claimed in claim 3, wherein the filling portion of the first conductive object is directly connected to the protruding portion of the first conductive object and has an interface. The electronic device as claimed in claim 1, wherein the first conductive object further has a filling portion, the filling portion of the first conductive object is disposed in the through hole of the first substrate, and the first conductive object The protruding portion includes: an insulating protrusion disposed on the first base and staggered from the filling portion; and a conductive film conformally covering the insulating protrusion and electrically connected to the filling portion. The electronic device as claimed in claim 1, wherein the driving circuit layer has an inner sidewall defining the through hole of the driving circuit layer, the protrusion of the first conductive material is connected to the inner sidewall of the driving circuit layer There is a second gap between them, and the encapsulation material is disposed in the second gap. The electronic device as claimed in claim 1, further comprising: a contact pad disposed on the protrusion of the first conductive object and the driving circuit layer, and electrically connected to the protrusion of the first conductive object Department and the drive line layer. The electronic device as claimed in claim 1, wherein the protruding portion of the first conductive material protrudes from a surface of the first substrate, and the electronic device further includes: an adhesive layer disposed on the first substrate between the surface and the first surface of the second substrate. An electronic device, comprising: a first substrate having a through hole; A first conductive object is arranged in the through hole of the first base and has a protrusion protruding from the first base; a second base has a first surface, a second surface and a consistent a hole, wherein the first surface is opposite to the second surface, the through hole of the second substrate penetrates the first surface and the second surface of the second substrate; a driving circuit layer, wherein the first substrate and the The driving circuit layer is respectively arranged on the first surface and the second surface of the second substrate, the driving circuit layer has a through hole overlapping with the through hole of the second substrate, and the protrusion of the first conductive object A portion extends into the through hole of the second substrate and the through hole of the driving circuit layer and is electrically connected to the driving circuit layer; a third substrate has a through hole, wherein the first substrate is disposed on the third substrate Between the second substrate; a second conductive object disposed in the through hole of the third substrate and electrically connected to the first conductive object; a connection circuit layer disposed on the third substrate, and electrically connected to the second conductive object, wherein the third substrate is disposed between the connection circuit layer and the first substrate; and a light emitting element is disposed on the connection circuit layer and electrically connected to the connection circuit layer A circuit layer, wherein the connection circuit layer is disposed between the light-emitting element and the third base.

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