TW202033311A - Grinding machine - Google Patents
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- TW202033311A TW202033311A TW108107777A TW108107777A TW202033311A TW 202033311 A TW202033311 A TW 202033311A TW 108107777 A TW108107777 A TW 108107777A TW 108107777 A TW108107777 A TW 108107777A TW 202033311 A TW202033311 A TW 202033311A
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一種研磨機,尤指一種能夠同時進行粗研磨與細研磨,藉以提升效率與縮短時間成本之研磨機。A grinding machine, especially a grinding machine that can perform rough grinding and fine grinding at the same time, thereby improving efficiency and reducing time and cost.
現有半導體製程中,研磨半導體是無法避免的製程之一。然隨著電子產品的研發趨勢,半導體係朝向薄的方向發展,所以半導體的研磨製成更顯其重要性。In the existing semiconductor manufacturing process, polishing semiconductor is one of the unavoidable processes. However, with the development of electronic products, the semiconductor system is developing in a thinner direction, so the polishing of semiconductors is more important.
現有的半導體研磨裝置係採用雙系統設計,一為粗研磨系統,另一為細研磨系統。將欲研磨的工件,如條狀半導體,送入粗研磨系統中研磨,此為粗研磨製程。待粗研磨完成後,再將經過粗研磨的工件送入細研磨系統中,以進行工件的細研磨。The existing semiconductor polishing device adopts a dual system design, one is a rough polishing system and the other is a fine polishing system. The workpiece to be ground, such as a strip of semiconductor, is sent to the rough grinding system for grinding, which is the rough grinding process. After the rough grinding is completed, the rough ground workpiece is sent to the fine grinding system for fine grinding of the workpiece.
粗研磨系統與細研磨系統分別為兩套不同的系統,所以半導體廠商會將會將經過粗研磨的工件收集至一定數量後,再送至細研磨系統進行細研磨的製程。因此無形中增加研磨製程中的時間成本,以及成效不佳的問題。The rough grinding system and the fine grinding system are two different systems. Therefore, semiconductor manufacturers will collect the rough grinding workpieces to a certain amount, and then send them to the fine grinding system for the fine grinding process. Therefore, the time cost in the grinding process and the problem of poor results are virtually increased.
有鑑於前述現有技術所存在的問題,本發明的創作目的在於提供研磨機,其係能夠降低研磨製程中的時間成本,以及提升效率。In view of the aforementioned problems in the prior art, the creative purpose of the present invention is to provide a grinding machine, which can reduce the time cost in the grinding process and improve the efficiency.
為了達到上述的創作目的,本發明提出的一種研磨機,其包含有: 一基座; 一第一研磨單元,其係設於該基座; 一第二研磨單元,其係設於該基座,且相鄰於該第一研磨單元; 一第一載台單元,其係設於該基座,且於該第一研磨單元的下方;以及 一第二載台單元,其係設於該基座,並且於該第二研磨單元的下方,而且相鄰於該第一載台單元。In order to achieve the above creative purpose, the present invention proposes a grinder, which includes: A base A first grinding unit, which is arranged on the base; A second grinding unit, which is arranged on the base and adjacent to the first grinding unit; A first stage unit, which is arranged on the base and below the first grinding unit; and A second stage unit is arranged on the base, below the second grinding unit and adjacent to the first stage unit.
於一實施例,該基座更具有一龍門;該第一研磨單元具有一第一位移模組,該第一位移模組係設於該龍門的一側;該第二研磨單元具有一第二位移模組,該第二位移模組係設於該龍門的另一側。In one embodiment, the base further has a gantry; the first grinding unit has a first displacement module, and the first displacement module is disposed on one side of the gantry; the second grinding unit has a second The displacement module, the second displacement module is arranged on the other side of the gantry.
於一實施例,該第一研磨單元更具有一第一砂輪整修模組、一第一細磨模組與一第一厚度量測模組,該第一砂輪整修模組與、該第一細磨模組與該第一厚度量測模組係設於該第一位移模組;該第二研磨單元更具有一第二砂輪整修模組、一第二粗磨模組與一第二厚度量測模組,該第二砂輪整修模組、該第二粗磨模組與該第二厚度量測模組係設於該第二位移模組。In one embodiment, the first grinding unit further has a first grinding wheel dressing module, a first fine grinding module and a first thickness measuring module, the first grinding wheel dressing module and the first fine grinding module The grinding module and the first thickness measurement module are arranged in the first displacement module; the second grinding unit further has a second grinding wheel dressing module, a second rough grinding module and a second thickness measurement The measuring module, the second grinding wheel dressing module, the second rough grinding module and the second thickness measuring module are arranged in the second displacement module.
於一實施例,該第一載台單元具有一第一滑軌與一第一載台,該第一滑軌係設於該基座,該第一載台係設於該第一滑軌;該第二載台單元具有一第二滑軌與一第二載台,該第二滑軌係設於該基座,該第二載台係設於該第二滑軌。In one embodiment, the first platform unit has a first slide rail and a first platform, the first slide rail is attached to the base, and the first platform is attached to the first slide rail; The second platform unit has a second slide rail and a second platform, the second slide rail is attached to the base, and the second platform is attached to the second slide rail.
於一實施例,一上載單元係設於該基座,並相鄰於該第一研磨單元;一下載單元係設於該基座,並相鄰於該上載單元;一取料單元設於該基座,並相鄰該下載單元;一送料單元係設於該基座,並相鄰於該取料單元;一乾燥單元係設於該基座,並位於該取料單元與該下載單元之間;一進料單元係設於該基台;一載台清潔模組係設於該進料單元。In one embodiment, an uploading unit is provided on the base and adjacent to the first grinding unit; a downloading unit is provided on the base and adjacent to the uploading unit; and a reclaiming unit is provided on the The base is adjacent to the download unit; a feeding unit is located on the base and adjacent to the reclaiming unit; a drying unit is located on the base and located between the reclaiming unit and the download unit A feeding unit is installed on the base; a carrier cleaning module is installed on the feeding unit.
綜合上述,本發明之研磨機,其係於同一基座中設置有第一研磨單元與第二研磨單元。第一研磨單元可進行細研磨,第二研磨單元可進行粗研磨。因此本發明可同時進行粗研磨與細研磨,將此降低研磨製程中的時間成本,以及提升效率。In summary, the grinding machine of the present invention is provided with a first grinding unit and a second grinding unit in the same base. The first grinding unit can perform fine grinding, and the second grinding unit can perform rough grinding. Therefore, the present invention can perform rough grinding and fine grinding at the same time, which reduces the time cost in the grinding process and improves efficiency.
請配合參考第1圖所示,本發明係一種研磨機,其包含有一基座1、一第一研磨單元2、一第一載台單元3、一第二研磨單元4與一第二載台單元5。Please refer to Fig. 1. The present invention is a grinder, which includes a
基座1具有一上載單元10、一下載單元11、一載台清潔模組12、一進料單元13、一乾燥單元14、一送料單元15、一取料單元16與一龍門17。The
上載單元10係位於基座1的一側,上載單元10係供待研磨之工件的收納匣或收納盒設置之用。舉例而言,工件可為條狀半導體。The
下載單元11係位於基座1的一側,並且相鄰於上載單元10。下載單元11係供收納已研磨之工件的收納匣或收納盒設置之用。The
進料單元13係位於基座1的一端。進料單元13可為機械手臂、取物叉與線性滑軌之組合、真空吸附裝置。進料單元13之吸附技術為業界常用之取放工件的技術手段,故不予此多做贅述。The
請配合參考第2圖與第1圖所示,於一實施例,進料單元13具有一長軌134、一側移動模組130、一設置架131、至少一縱移模組132、至少一取放模組133。側移動模組130係可移動地設於長軌134。設置架131係設於設於側移動模組130。縱移模組132係可移動地設於設置架131。取放模組133係設於縱移模組132。Please refer to FIG. 2 and FIG. 1. In one embodiment, the
載台清潔模組12為一清潔滾筒。載台清潔模組12係設於上述之縱移模組132或取放模組133。側移動模組130與縱移模組132係調整載台清潔模組12相對於下述之第一載台31或第二載台51的位置,而使載台清潔模組12能夠清潔下述之第一載台31或第二載台51的位置,或者位於第一載台31或第二載台51的工件,以避免加工留下來的研磨屑,影響工件的吸附/取放。The
以第2圖為例,載台清潔模組12係設於縱移模組132上,且載台清潔模組12係位於該取放模組133之側邊,在該取放模組133要將待研磨工件放置於第二載台51之前,該縱移模組132調整該載台清潔模組12相對該第二載台51之位置並對其進行清潔;再者當待研磨工件放置於第二載台51之後,亦可控制該載台清潔模組12對第二載台51上之待研磨工件進行清潔。Taking Figure 2 as an example, the
乾燥單元14係位於基座1,並且相鄰於下載單元11。乾燥單元14係用於乾燥經過研磨之工件。The
送料單元15係位於基座1,並且位於乾燥單元14與下載單元11之間。The
取料單元16係位於基座1的另一端,並且相鄰於送料單元15。送料單元15與取料單元16可為機械手臂、取物叉與線性滑軌之組合、真空吸附裝置。送料單元15與取料單元16之推送或吸附技術為業界常用之取放工件的技術手段,故不予此多做贅述。龍門17係位於基座1。The reclaiming
第一載台單元3係位於基座1,並位於龍門17的下方。第一載台單元3具有第一滑軌30與第一載台31。第一滑軌30係位於基座1。第一載台31係設於第一滑軌30,並且第一載台31係於第一滑軌30往復移動。The
第一研磨單元2具有一第一位移模組20、第一細研磨組21、一第一厚度量測模組22與一第一砂輪整修模組23。The
第一位移模組20係設於龍門17的一側。第一細研磨組21與第一厚度量測模組22係設於第一位移模組20。第一砂輪整修模組23係設於第一載台31。The
第二載台單元5係設於基座1,並位於龍門17的下方,而且相鄰於第一載台單元3。第二載台單元5具有一第二滑軌50與一第二載台51。第二滑軌50係位於基座1,並相鄰於第一滑軌30。第二載台51係設於第一滑軌50,並且第二載台51係於第二滑軌50往復移動。The
第二研磨單元4具有一第二位移模組40、一第二粗研磨模組41、一第二厚度量測模組42與一第二砂輪整修模組43。The
第二位移模組40係設於龍門17的另一側。第二粗研磨模組41與第二厚度量測模組42係設於第二位移模組40。第二砂輪整修模組43係設於第二載台51。The
請再配合參考第1圖所示,上載單元10設有一出料桿100,出料桿100可自上載單元10之收納匣或收納盒中移出待研磨之工件,再由進料單元13將工件放置於第二載台51。第二粗研磨模組41係對工件進行粗研磨。第二位移模組40係相對於龍門17移動第二粗研磨模組41相對於工件之位置,以使工件能夠被均勻研磨。若收納匣或收納盒中之工件已減少至一設定數量或已無任何工件,則可將具有工件之收納匣或收納盒替換原有之收納匣或收納盒。Please refer to Figure 1 again. The
若更進一步論述,出料桿100自上載單元10之收納匣或收納盒中移出待研磨之工件,側移動模組130係相對於長軌134移動,縱移模組132係相對於設置架131移動,以調整取放模組133相對於位於出料桿100之工件的位置,而使取放模組133可由出料桿100取下工件。側移動模組130與縱移模組132係調整位於取放模組133之工件相對於第二載台51的位置,而使取放模組133能夠將工件放置於第二載台51。If discussed further, the discharging
上述之進料單元13將工件放置於第二載台51。若進一步論述,第二載台51係朝向進料單元13移動,以使進料單元13能將工件放置於第二載台51。待工件放置於第二載台51後,第二載台51係朝向第二研磨單元4方向移動,以使工件進行粗研磨。The
於粗研磨過程中或粗研磨完畢後,第二厚度量測模組42係量測工件的厚度。第二厚度量測模組42係將所量測之厚度上傳給一控制系統。During or after rough grinding, the second
若於粗研磨過程中、粗研磨前或粗研磨後,第二粗研磨模組41之砂輪可藉由第二砂輪整修模組43或第一砂輪整修模組23進行調整或修正。If during the rough grinding process, before or after rough grinding, the grinding wheel of the second rough grinding
待工件完成粗研磨後,第二載台51移載該經粗研磨後之工作至該龍門17之另一側(依第1圖而言為龍門17之左側),且該第一位移模組20移載該第一細研磨組21至該第二載台51之上方,而可對已經粗研磨後之工作進行細研磨作業。而空載之第一載台31係移至該龍門17之一側(依第1圖而言為龍門17之右側)。。After the rough grinding of the workpiece is completed, the
進料單元13將待研磨之工件移至第一載台31的上方,並將工件放置於第一載台31,且第二位移模組40移載第二研磨單元4至第一載台31之上方,以進行粗研磨作業。第一位移模組20移載第一細研磨模組21至第二載台51之上方,以進行細研磨作業。The
位於第二載台51之工件,第一細研磨模組21係對工件進行係研磨。第一位移模組20係相對於龍門17移動相對於工件之位置,以使工件能夠被均勻研磨。For the workpiece located on the
若於細研磨過程中、細研磨前或細研磨後,第一細研磨模組21之砂輪可藉由第一砂輪整修模組23或第二砂輪整修模組43進行調整或修正。If during the fine grinding process, before or after the fine grinding, the grinding wheel of the first
於細研磨過程中或細研磨完畢後,第一厚度量測模組22係量測工件的厚度。第一厚度量測模組22係將所量測之厚度上傳給控制系統。During or after the fine grinding, the first
待工件完成細研磨後,取料單元16係將工件由第二載台51中取出,並送至一清洗單元60清洗。待清洗單元將工件洗滌完成後,取料單元16續將工件輸送至送料單元15。當然,該取料單元16設置有功能雷同前述之縱移模組132及取放模組133之機構,而可將工件取離第二載台51或第一載台31。After the workpiece is finely ground, the reclaiming
送料單元15係將工件輸送至乾燥單元14,以使乾燥單元14對工件進行乾燥。待工件乾燥後,送料單元15續將工件輸送至位於下載單元11之收納匣或收納盒中。待收納匣或收納盒之工件已達一設定數量後,則可將收納匣或收納盒由下載單元11中取出,並送至下一製程。The
綜合上述,本發明之研磨機,其係於同一基座1中設置有第一研磨單元2與第二研磨單元4。第一研磨單元2可進行細研磨,第二研磨單元4可進行粗研磨,亦即,將第一研磨單元2與第二研磨單元4分別設置於該龍門17之二側,而第一載台單元3及第二載台單元5係可分別相對移動於該龍門17之二側,而可控制第一載台單元3及第二載台單元5分別於該龍門17之二側進行研磨作業。亦即,該第二載台51承載工件先於龍門17右側,由該第二研磨單元4進行粗研磨,之後該第二載台51移動至龍門17之左側,轉由該第一研磨單元2進行細研磨。當第二載台51上之工件於龍門17之右側,由該第二研磨單元4完成粗研磨後,該第二載台51移載至龍門17的左側,轉由該第一研磨單元2對第二載台51上之工件進行細研磨作業;又,當第一研磨單元2對第二載台51上之工件進行細研磨作業時,空載之該第一載台31則移動至該龍門17之右側,待由該進料單元13將另一待研磨之工件放置於該第一載台31後,再由該第二研磨單元4對該第一載台31上之另一待研磨工件進行粗研磨。In summary, the grinding machine of the present invention is provided with a
因此本發明可控制該進料單元13向第一載台31及第二載台51輪流放置待研磨工件,再透過第一研磨單元2與第二研磨單元4分別對第一載台31及第二載台51上之工件進行研磨,而可令本發明之研磨機同時進行粗研磨與細研磨,將此降低研磨製程中的時間成本,以及提升效率。Therefore, the present invention can control the
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make slight changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to those defined by the attached patent scope.
1:基座 10:上載單元 100:出料桿 11:下載單元 12:載台清潔模組 13:進料單元 130:側移動模組 131:設置架 132:縱移模組 133:取放模組 134:長軌 14:乾燥單元 15:送料單元 16:取料單元 17:龍門 2:第一研磨單元 20:第一位移模組 21:第一細研磨組 22:第一厚度量測模組 23:第一砂輪整修模組 3:第一載台單元 30:第一滑軌與 31:第一載台 4:第二研磨單元 40:第二位移模組 41:第二粗研磨模組 42:第二厚度量測模組 43:第二砂輪整修模組 5:第二載台單元 50:第二滑軌 51:第二載台 60:清洗單元1: base 10: upload unit 100: discharge rod 11: Download unit 12: Stage cleaning module 13: Feeding unit 130: Side movement module 131: set rack 132: Vertical movement module 133: Pick and Place Module 134: Long Track 14: Drying unit 15: feeding unit 16: Reclaiming unit 17: Dragon Gate 2: The first grinding unit 20: The first displacement module 21: The first fine grinding group 22: The first thickness measurement module 23: The first grinding wheel refurbishment module 3: The first stage unit 30: The first slide and 31: First stage 4: The second grinding unit 40: The second displacement module 41: The second rough grinding module 42: The second thickness measurement module 43: The second grinding wheel repair module 5: The second stage unit 50: second slide 51: Second stage 60: Cleaning unit
第1圖係本發明之一種研磨機之示意圖。 第2圖為一載台清潔模組之示意圖。Figure 1 is a schematic diagram of a grinding machine of the present invention. Figure 2 is a schematic diagram of a stage cleaning module.
1:基座 1: base
10:上載單元 10: upload unit
100:出料桿 100: discharge rod
11:下載單元 11: Download unit
12:載台清潔模組 12: Stage cleaning module
13:進料單元 13: Feeding unit
130:側移動模組 130: Side movement module
131:設置架 131: set rack
132:縱移模組 132: Vertical movement module
134:長軌 134: Long Track
14:乾燥單元 14: Drying unit
15:送料單元 15: feeding unit
16:取料單元 16: Reclaiming unit
17:龍門 17: Dragon Gate
2:第一研磨單元 2: The first grinding unit
20:第一位移模組 20: The first displacement module
21:第一細研磨組 21: The first fine grinding group
22:第一厚度量測模組 22: The first thickness measurement module
23:第一砂輪整修模組 23: The first grinding wheel refurbishment module
3:第一載台單元 3: The first stage unit
30:第一滑軌與 30: The first slide and
31:第一載台 31: First stage
4:第二研磨單元 4: The second grinding unit
40:第二位移模組 40: The second displacement module
41:第二粗研磨模組 41: The second rough grinding module
42:第二厚度量測模組 42: The second thickness measurement module
43:第二砂輪整修模組 43: The second grinding wheel repair module
5:第二載台單元 5: The second stage unit
50:第二滑軌 50: second slide
51:第二載台 51: Second stage
60:清洗單元 60: Cleaning unit
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW108107777A TW202033311A (en) | 2019-03-08 | 2019-03-08 | Grinding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108107777A TW202033311A (en) | 2019-03-08 | 2019-03-08 | Grinding machine |
Publications (1)
Publication Number | Publication Date |
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TW202033311A true TW202033311A (en) | 2020-09-16 |
Family
ID=73643505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW108107777A TW202033311A (en) | 2019-03-08 | 2019-03-08 | Grinding machine |
Country Status (1)
Country | Link |
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TW (1) | TW202033311A (en) |
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2019
- 2019-03-08 TW TW108107777A patent/TW202033311A/en unknown
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