TW202030805A - Parallelism adjusting device, pickup device, mounting device, parallelism adjust method, pickup method, and mounting method - Google Patents

Parallelism adjusting device, pickup device, mounting device, parallelism adjust method, pickup method, and mounting method Download PDF

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TW202030805A
TW202030805A TW108138789A TW108138789A TW202030805A TW 202030805 A TW202030805 A TW 202030805A TW 108138789 A TW108138789 A TW 108138789A TW 108138789 A TW108138789 A TW 108138789A TW 202030805 A TW202030805 A TW 202030805A
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light
receiving
linear
emitting
linear laser
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寺田勝美
晴孝志
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日商東麗工程股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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Abstract

The present invention addresses the problem of performing parallelism adjustment accurately and easily. Specifically, this parallelism adjusting device is provided with: a first light emitting unit and a second light emitting unit which are disposed at an interval in a first direction and capable of emitting linear laser light toward an opposing second direction; a first light-receiving unit and a second light-receiving unit which are disposed at an interval in the second direction and which are respectively capable of receiving the linear laser light emitted from the first light emitting unit and the linear laser light emitted from the second light emitting unit; a drive unit which drives a second target unit to adjust the parallelism between the first target unit and the second target unit; and a control unit which controls the drive unit on the basis of a light-receiving length in the linear direction of the linear laser light received by the first light-receiving unit and the second light-receiving unit. The first light emitting unit and the second light emitting unit, in an approximately opposed state in which the first target unit and the second target unit are approximately opposed to each other, are configured to emit linear laser light toward the first light-receiving unit and the second light-receiving unit in a direction perpendicular to an approximately opposed direction.

Description

平行度調整裝置、拾取裝置、安裝裝置、平行度調整方法、拾取方法、及安裝方法Parallelism adjustment device, pick-up device, installation device, parallelism adjustment method, pickup method, and installation method

本發明係關於一種對同時拾取或安裝複數個微LED(Light Emitting Diode，發光二極體)等微小零件時之平行度進行調整之平行度調整裝置、及平行度調整方法，又，本發明係關於使用有其之拾取裝置及安裝裝置、以及拾取方法及安裝方法。The present invention relates to a parallelism adjusting device and a method for adjusting parallelism when picking up or installing a plurality of micro LEDs (Light Emitting Diode, light emitting diode) and other small parts at the same time. In addition, the present invention is Regarding the use of its own picking device and mounting device, and picking method and mounting method.

半導體晶片為降低成本而推進小型化，進行用以高速、高精度安裝之配套。尤其用於顯示器之LED要求將被稱為微LED之50 μm×50 μm以下之LED晶片以數μm之精度高速安裝。複數個微LED於載體基板上排列成矩陣，同時拾取其至少一部分，且同時安裝於電路基板上。此時，就確保安裝精度及微LED之轉印之成功率而言，準確地調整複數個微LED與拾取之頭面、或頭所保持之複數個微LED與安裝對象之電路基板之平行度極為重要。Semiconductor chips are miniaturized in order to reduce costs, and are used for high-speed and high-precision mounting. In particular, LEDs used in displays require high-speed mounting of LED chips of 50 μm×50 μm or less called micro LEDs with a precision of several μm. A plurality of micro LEDs are arranged in a matrix on the carrier substrate, and at least a part of them is picked up at the same time and installed on the circuit substrate at the same time. At this time, in terms of ensuring the mounting accuracy and the success rate of the micro LED transfer, accurately adjust the parallelism between the micro LEDs and the pickup head surface, or the micro LEDs held by the head and the circuit board of the mounting object Extremely important.

專利文獻1中，記載有如下構成，即，預先由治具調整頭本身之平行度之後，自搭載於頭端部之3個雷射移位計對安裝對象之電路基板照射雷射光並測定距離，調整頭與電路基板之平行度。 先前技術文獻 專利文獻Patent Document 1 describes a configuration in which, after adjusting the parallelism of the head itself with a jig, three laser shift meters mounted on the end of the head irradiate the circuit board to be mounted with laser light and measure the distance , Adjust the parallelism between the head and the circuit board. Prior art literature Patent literature

專利文獻1：日本專利特開2018-32740號公報Patent Document 1: Japanese Patent Laid-Open No. 2018-32740

[發明所欲解決之問題][The problem to be solved by the invention]

然而，專利文獻1之記載中，存在如下問題，即，需要預先由治具調整頭本身之平行度而費工夫，並且若測定距離之對象物為透明體，則難以準確地測定，從而無法準確地進行平行度調整。However, the description of Patent Document 1 has the following problems: it is necessary to adjust the parallelism of the head itself by the jig in advance, which takes time, and if the object for measuring the distance is a transparent object, it is difficult to accurately measure it, and thus it cannot be accurately measured. Parallelism adjustment is carried out.

本發明之課題在於解決上述問題點，不費工夫而準確地進行平行度調整。 [解決問題之技術手段]The problem of the present invention is to solve the above-mentioned problems and to adjust the parallelism accurately without any effort. [Technical means to solve the problem]

為解決上述課題，本發明提供一種平行度調整裝置，其特徵在於，其係調整第1對象部與第2對象部之平行度者，具備： 第1發光部及第2發光部，其等在第1方向上隔開間隔而配置，且能夠以線狀朝對向之第2方向發出線狀雷射光； 第1受光部及第2受光部，其等在上述第2方向上隔開間隔而配置，第1受光部能夠接收自上述第1發光部發出之線狀雷射光，第2受光部能夠接收自上述第2發光部發出之線狀雷射光； 驅動部，其驅動上述第1對象部或上述第2對象部而調整上述第1對象部與上述第2對象部之平行度；及 控制部，其基於上述第1受光部及上述第2受光部所接收之線狀雷射光之線狀方向之受光長度而控制上述驅動部；且 上述第1發光部及上述第2發光部於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光朝上述第1受光部及上述第2受光部發光。To solve the above-mentioned problems, the present invention provides a parallelism adjusting device, which is characterized in that it adjusts the parallelism between the first target portion and the second target portion, and includes: The first light-emitting portion and the second light-emitting portion are arranged at intervals in the first direction, and can emit linear laser light in a linear shape toward a second opposing direction; The first light-receiving part and the second light-receiving part are arranged at intervals in the second direction, the first light-receiving part can receive the linear laser light emitted from the first light-emitting part, and the second light-receiving part can receive The linear laser light emitted by the second light-emitting part; A driving portion that drives the first object portion or the second object portion to adjust the parallelism between the first object portion and the second object portion; and A control unit that controls the drive unit based on the light receiving length of the linear laser light received by the first light receiving unit and the second light receiving unit in the linear direction; and The first light-emitting portion and the second light-emitting portion are in a substantially opposed state in which the first object portion and the second object portion are substantially opposed, and linear laser light in a direction intersecting the substantially opposed direction is directed toward The first light receiving unit and the second light receiving unit emit light.

藉由該構成，可不費工夫而準確地進行平行度調整。With this configuration, the parallelism can be adjusted accurately and without much effort.

亦可設為如下構成，即，具備：第3發光部及第4發光部，其等在與上述第1方向及上述第2方向交叉之第3方向上隔開間隔而配置，且能夠朝對向之第4方向以線狀發出線狀雷射光；以及第3受光部及第4受光部，其等在上述第4方向上隔開間隔而配置，第3受光部能夠接收自上述第3發光部發出之線狀雷射光，第4受光部能夠接收自上述第4發光部發出之線狀雷射光；且上述第3發光部及上述第4發光部於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光朝上述第3受光部及上述第4受光部發光，並且上述控制部進而基於上述第3受光部及上述第4受光部所接收之線狀雷射光之線狀方向之受光長度而控制上述驅動部。It may also be configured as follows: a third light-emitting portion and a fourth light-emitting portion, which are arranged at intervals in a third direction intersecting the first direction and the second direction, and can face each other A linear laser light is emitted in a linear shape in the fourth direction; and a third light receiving section and a fourth light receiving section are arranged at intervals in the fourth direction, and the third light receiving section can receive from the third light emission The fourth light-receiving section can receive the linear laser light emitted from the fourth light-emitting section; and the third light-emitting section and the fourth light-emitting section are connected between the first target section and the second In a substantially opposed state where the object portion is substantially opposed to each other, linear laser light in a direction intersecting the substantially opposed direction is caused to emit light toward the third light receiving portion and the fourth light receiving portion, and the control portion is further based on the third The light receiving section and the light receiving length of the linear laser light received by the fourth light receiving section control the driving section.

藉由該構成，可於第1、第2方向及第3、第4方向之兩方向上準確地進行平行度調整。With this configuration, it is possible to accurately adjust the parallelism in both the first and second directions and the third and fourth directions.

亦可設為如下構成，即，上述控制部以於上述大致對向狀態下，上述第1受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度、與上述第2受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度之差成為特定值以下的方式，控制上述驅動部，並且 以於上述大致對向狀態下，上述第3受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度、與上述第4受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度之差成為特定值以下的方式，控制上述驅動部。It may also be configured as follows, that is, in the substantially facing state, the control section has the light-receiving length in the linear direction of the linear laser light received by the first light receiving section in the direction intersecting the substantially opposing direction , Control the drive section so that the difference in the light-receiving length of the linear laser beam in the direction intersecting the substantially opposite direction received by the second light-receiving section becomes a specific value or less, and In the above-mentioned substantially facing state, the light-receiving length in the linear direction of the linear laser light in the direction intersecting the substantially opposite direction received by the third light-receiving unit is compared with the light-receiving length of the linear laser light received by the fourth light-receiving unit The driving section is controlled so that the difference in the light-receiving length of the linear laser beam in the linear direction in the direction intersecting approximately the opposite direction becomes less than a specific value.

藉由該構成，可實現不費工夫之平行度調整。With this structure, it is possible to adjust the parallelism without much effort.

亦可實現一種拾取裝置，其係使用有上述平行度調整裝置者，上述第1對象部係以複數個載置於基板上之微小零件群，上述第2對象部係由拾取面能夠同時拾取上述微小零件群之至少一部分之頭部。It is also possible to realize a pick-up device using the aforementioned parallelism adjusting device, the first object portion is a group of a plurality of small parts placed on a substrate, and the second object portion is capable of simultaneously picking up the aforementioned The head of at least a part of the group of tiny parts.

藉由該構成，可實現一種能夠準確地調整微小零件群與頭部之平行度之拾取裝置。With this structure, it is possible to realize a pick-up device capable of accurately adjusting the parallelism between a group of small parts and the head.

亦可實現一種安裝裝置，其係使用有上述平行度調整裝置者，上述第1對象部係能夠載置包含複數個微小零件之微小零件群之電路基板，上述第2對象部係由頭部之拾取面拾取之上述微小零件群。It is also possible to realize a mounting device that uses the aforementioned parallelism adjustment device, the first object portion is a circuit board capable of mounting a small part group including a plurality of minute parts, and the second object portion is formed by the head The above-mentioned small parts group picked up by the picking surface.

藉由該構成，可實現一種能夠準確地調整電路基板與微小零件群之平行度之安裝裝置。With this configuration, it is possible to realize a mounting device capable of accurately adjusting the parallelism between the circuit board and the group of minute parts.

又，為解決上述課題，本發明提供一種平行度調整方法，其特徵在於，其係調整第1對象部與第2對象部之平行度者，具備：第1第2發光步驟，其係自於第1方向上隔開間隔而配置之第1發光部及第2發光部朝對向之第2方向以線狀發出線狀雷射光；第1第2受光步驟，其係於上述第2方向上隔開間隔而配置之第1受光部及第2受光部中，由第1受光部接收自上述第1發光部發出之線狀之線狀雷射光，由第2受光部接收自上述第2發光部發出之線狀之線狀雷射光；及調整步驟，其係基於上述第1受光部及上述第2受光部所接收之線狀雷射光之線狀方向之受光長度，驅動上述第1對象部或上述第2對象部而調整上述第1對象部與上述第2對象部之平行度；且上述第1第2發光步驟中，於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光自上述第1發光部及上述第2發光部朝上述第1受光部及上述第2受光部發光。In addition, in order to solve the above-mentioned problems, the present invention provides a parallelism adjustment method, characterized in that it adjusts the parallelism between the first target portion and the second target portion, and includes: a first and a second light-emitting step, which is derived from The first light-emitting part and the second light-emitting part arranged at intervals in the first direction emit linear laser light in a line in the second direction facing each other; the first and second light receiving steps are in the second direction Among the first and second light-receiving parts arranged at intervals, the first light-receiving part receives linear laser light emitted from the first light-emitting part, and the second light-receiving part receives the second light-emitting light The linear linear laser light emitted by the part; and the adjustment step, which drives the first target part based on the light-receiving length of the linear laser light received by the first light-receiving part and the second light-receiving part Or the second object portion to adjust the parallelism between the first object portion and the second object portion; and in the first and second light emission step, the first object portion and the second object portion are substantially opposed to each other In the substantially facing state, linear laser light in a direction intersecting the substantially facing direction is emitted from the first light emitting section and the second light emitting section toward the first light receiving section and the second light receiving section.

藉由該構成，可不費工夫而準確地進行平行度調整。With this configuration, the parallelism can be adjusted accurately and without much effort.

亦可設為如下構成，即，具備：第3第4發光步驟，其係於與上述第1方向及上述第2方向交叉之第3方向上隔開間隔而配置，朝對向之第4方向以線狀發出線狀雷射光；及第3第4受光步驟，其係於上述第4方向上隔開間隔而配置之第3受光部及第4受光部，由第3受光部接收自上述第3發光部發出之線狀雷射光，由第4受光部接收自上述第4發光部發出之線狀雷射光；且於上述第3第4發光步驟中，於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光自上述第3發光部及上述第4發光部朝上述第3受光部及上述第4受光部發光，並且於上述調整步驟中，進而於上述第3第4受光步驟中，基於第3受光部及上述第4受光部所接收之雷射光之線狀方向之受光長度，使上述第1對象部或上述第2對象部驅動而調整上述第1對象部與上述第2對象部之平行度。It can also be configured as follows, that is, with: a third and fourth light emitting step, which is arranged at intervals in the third direction intersecting the first direction and the second direction, and faces the opposing fourth direction The linear laser light is emitted in a linear shape; and the third and fourth light receiving steps are the third and fourth light receiving portions arranged at intervals in the fourth direction, and the third light receiving portion receives from the first 3 The linear laser light emitted by the light-emitting part is received by the fourth light-receiving part from the linear laser light emitted from the fourth light-emitting part; and in the third and fourth light-emitting steps, the first target part and the first 2 In the substantially opposite state where the object parts are substantially opposite, the linear laser light in the direction intersecting the substantially opposite direction is directed from the third light-emitting part and the fourth light-emitting part to the third light-receiving part and the fourth light-receiving part. The light-receiving part emits light, and in the above-mentioned adjustment step, and further in the above-mentioned third and fourth light-receiving steps, based on the light-receiving length in the linear direction of the laser light received by the third light-receiving part and the fourth light-receiving part, the first The target portion or the second target portion is driven to adjust the parallelism between the first target portion and the second target portion.

藉由該構成，可於第1、第2方向及第3、第4方向之兩方向上準確地進行平行度調整。With this configuration, it is possible to accurately adjust the parallelism in both the first and second directions and the third and fourth directions.

亦可設為如下構成，即，於上述調整步驟中，以於上述大致對向狀態下，上述第1受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度、與上述第2受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度之差成為特定值以下的方式，驅動上述第1對象部或上述第2對象部，並且以於上述大致對向狀態下，上述第3受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度、與上述第4受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度之差成為特定值以下的方式，驅動上述第1對象部或上述第2對象部。It may also be configured as follows, that is, in the above-mentioned adjustment step, in the above-mentioned substantially facing state, the linear direction of the linear laser light in the direction intersecting the above-mentioned substantially facing direction received by the first light receiving unit The difference between the light-receiving length and the light-receiving length of the linear laser light in the direction intersecting the substantially opposing direction received by the second light-receiving section becomes a specific value or less, the first target section or The second target portion, and in the substantially opposed state, the light receiving length of the linear laser light in the direction intersecting the substantially opposed direction received by the third light receiving portion is the same as the fourth The first target part or the second target part is driven so that the difference in the received light length in the linear direction of the linear laser light in a direction intersecting the substantially opposite direction received by the light receiving part becomes a specific value or less.

藉由該構成，可實現不費工夫之平行度調整。With this structure, it is possible to adjust the parallelism without much effort.

亦可實現一種拾取方法，其係使用有上述平行度調整方法者，上述第1對象部係以複數個載置於基板上之微小零件群，上述第2對象部係由拾取面能夠同時拾取上述微小零件群之至少一部分之頭部。It is also possible to realize a picking method that uses the parallelism adjustment method described above, the first object part is a group of micro-parts placed on a substrate, and the second object part is capable of simultaneously picking up the above The head of at least a part of the group of tiny parts.

藉由該構成，可實現能夠準確地調整微小零件群與頭部之平行度之拾取方法。With this configuration, a picking method that can accurately adjust the parallelism between the group of small parts and the head can be realized.

亦可實現一種安裝方法，其係使用有上述平行度調整方法者，上述第1對象部係能夠載置包含複數個微小零件之微小零件群之電路基板，上述第2對象部係由頭部之拾取面拾取之上述微小零件群。It is also possible to realize a mounting method that uses the parallelism adjustment method described above, the first object part is a circuit board that can mount a small part group including a plurality of small parts, and the second object part is formed by the head The above-mentioned small parts group picked up by the picking surface.

藉由該構成，可實現能夠準確地調整電路基板與微小零件群之平行度之安裝方法。 [發明之效果]With this configuration, it is possible to realize a mounting method capable of accurately adjusting the parallelism between the circuit board and the group of minute parts. [Effects of Invention]

藉由本發明之平行度調整裝置、拾取裝置、安裝裝置、平行度調整方法、拾取方法、及安裝方法，可不費工夫而準確地進行平行度調整。With the parallelism adjustment device, pick-up device, installation device, parallelism adjustment method, pick-up method, and installation method of the present invention, parallelism adjustment can be performed accurately and without much effort.

實施例1Example 1

參照圖1～圖4對本發明之實施例1進行說明。圖1係說明本發明之實施例1之拾取方法之圖。圖2係說明本發明之實施例1之平行度調整方法之圖，(a)表示平行度調整後之狀態，(b)表示平行度未調整之狀態。圖3係說明本發明之實施例1之平行度調整裝置之側視圖。圖4係說明本發明之實施例1之平行度調整裝置之俯視圖。The first embodiment of the present invention will be described with reference to FIGS. 1 to 4. Fig. 1 is a diagram illustrating the picking method of embodiment 1 of the present invention. Fig. 2 is a diagram illustrating the parallelism adjustment method of Embodiment 1 of the present invention, (a) shows the state after the parallelism is adjusted, and (b) shows the state without the parallelism. Fig. 3 is a side view illustrating the parallelism adjusting device of embodiment 1 of the present invention. Fig. 4 is a top view illustrating the parallelism adjusting device of embodiment 1 of the present invention.

於實施例1中，對由將以矩陣狀載置於載體基板2之複數個微LED1(亦載置於圖1之深度方向)設置於頭11之複數個噴嘴12(亦設置於圖1之深度方向)拾取之情形時之平行度調整方法及平行度調整裝置進行說明。即，於實施例1中，將複數個微LED1設為微小零件群。In the first embodiment, a plurality of micro LEDs 1 (also placed in the depth direction of FIG. 1) placed on the carrier substrate 2 in a matrix are arranged on the multiple nozzles 12 of the head 11 (also placed in the FIG. 1 Depth direction) The parallelism adjustment method and parallelism adjustment device in the case of picking are described. That is, in Example 1, a plurality of micro LEDs 1 are used as a micro component group.

設置於頭11之各噴嘴係由聚合物系樹脂構成，具有黏著性，且設置成能夠於微LED1之XY方向以排列間距之N倍之間距以陣列狀拾取。此處，於微LED1之XY方向以排列間距之N倍之間距進行拾取，其原因在於，於將微LED1安裝於安裝對象之電路基板之情形時能夠將電路基板排列成顯示器之像素間距。亦即，若自載體基板2拾取N次微LED1，則藉由使排列間距之N倍＝像素間距而可無間距變更地於特定之部位無浪費地安裝於電路基板。同樣地可將R、G、B之各色作為1像素，自各者之載體基板安裝於電路基板。The nozzles arranged in the head 11 are made of polymer resin, have adhesiveness, and are arranged to be able to be picked up in an array in the XY direction of the micro LED 1 at a distance N times the arrangement pitch. Here, the reason for picking up in the XY direction of the micro LED 1 at a pitch of N times the arrangement pitch is that the circuit board can be arranged to the pixel pitch of the display when the micro LED 1 is mounted on the circuit board of the mounting object. That is, if the micro LEDs 1 are picked up N times from the carrier substrate 2, the arrangement pitch is N times the pixel pitch, so that it can be mounted on the circuit board at a specific location without changing the pitch without waste. Similarly, each color of R, G, and B can be used as one pixel, and the carrier substrate of each can be mounted on the circuit board.

由該具有黏著性之各噴嘴12拾取載置於載體基板2上之微LED1。亦即，如圖1(a)所示，噴嘴12以位於微LED1之正上方之方式使頭11移動而定位之後，朝作為微小零件群之微LED1下降。如圖1(b)所示，若噴嘴12之前端接觸到微LED1之上部則使頭之下降停止。載體基板2與微LED1係由具有黏著性之構件而黏著，但噴嘴12之前端面之黏著度大於載體基板2之黏著度，故藉由使噴嘴12接觸到微LED1且上升而可拾取微LED1(圖1(c))。The micro LEDs 1 placed on the carrier substrate 2 are picked up by the nozzles 12 with adhesive properties. That is, as shown in FIG. 1(a), the nozzle 12 moves and positions the head 11 so as to be located directly above the micro LED 1, and then descends toward the micro LED 1 which is a group of minute parts. As shown in Fig. 1(b), if the front end of the nozzle 12 touches the upper part of the micro LED 1, the lowering of the head is stopped. The carrier substrate 2 and the micro LED 1 are adhered by an adhesive member, but the adhesion of the front end surface of the nozzle 12 is greater than that of the carrier substrate 2, so the micro LED 1 can be picked up by making the nozzle 12 contact the micro LED 1 and lift it up ( Figure 1(c)).

於該拾取時，考慮如下情形：例如，若頭11或載體基板2傾斜，則與頭11之任一端部靠近之噴嘴12與微LED1無法接觸、或位置偏移，從而無法拾取。因此，於實施例1中，構成為調整頭11之噴嘴12與載體基板2上之微LED1之平行度而進行拾取。又，如下所述，將由頭11之噴嘴12拾取之微LED1安裝於電路基板3之情形時亦然，重要的是調整為同樣之平行度而進行安裝。此處，頭11吸附於未圖示之頭支架或由其他保持手段以能夠裝卸之方式保持，載體基板2及電路基板3吸附於未圖示之載置台或由其他保持手段以能夠裝卸之方式保持。而且，於平行度調整中，只要可保證頭11、載體基板2、電路基板3之各者之平坦度，則亦可為調整頭支架與載置台之間之平行度之方法。When picking up, consider the following situation: for example, if the head 11 or the carrier substrate 2 is tilted, the nozzle 12 close to either end of the head 11 cannot contact with the micro LED 1 or the position is shifted, and thus cannot be picked up. Therefore, in the first embodiment, it is configured to adjust the parallelism between the nozzle 12 of the head 11 and the micro LED 1 on the carrier substrate 2 for picking. In addition, as described below, when the micro LED 1 picked up by the nozzle 12 of the head 11 is mounted on the circuit board 3, it is important to adjust and mount the same parallelism. Here, the head 11 is adsorbed on a head holder (not shown) or held in a removable manner by other holding means, and the carrier substrate 2 and the circuit board 3 are adsorbed on a mounting table (not shown) or other holding means in a removable manner. maintain. Moreover, in the adjustment of parallelism, as long as the flatness of each of the head 11, the carrier substrate 2 and the circuit substrate 3 can be ensured, it can also be a method of adjusting the parallelism between the head holder and the mounting table.

參照圖2，對本發明之平行度調整方法進行說明。圖2(a)表示頭11之噴嘴12(第2對象部)與作為微小零件群之複數個微LED1(第1對象部)具有間隙且大致對向，噴嘴12之前端與複數個微LED1之平行度調整後之狀態。LB21及LB22表示由圖2之深度方向朝近前方向自第1發光部21及第2發光部22發出之(第1第2發光步驟)線狀雷射光，自噴嘴12之前端透過至微LED1之前端，但照射至噴嘴12及微LED1之線狀雷射光不透過。而且，第1受光部31及第2受光部32接收所透過之線狀雷射光LB21及線狀雷射光LB22(第1第2受光步驟)。圖2(a)中，線狀雷射光LB21及線狀雷射光LB22之線狀方向(Z方向)之長度相同，為L0，其長度之差為零。2, the parallelism adjustment method of the present invention will be described. Figure 2 (a) shows that the nozzle 12 of the head 11 (the second object part) and the micro LED1 (the first object part) as a group of minute parts have a gap and are substantially opposed to each other, and the front end of the nozzle 12 and the plurality of micro LED1 The state after adjusting the parallelism. LB21 and LB22 represent the linear laser light emitted from the first light-emitting part 21 and the second light-emitting part 22 from the depth direction of FIG. 2 toward the front direction (the first and second light-emitting steps), and pass from the front end of the nozzle 12 to the micro LED 1 The front end, but the linear laser light irradiated to the nozzle 12 and the micro LED 1 does not pass through. Then, the first light receiving unit 31 and the second light receiving unit 32 receive the transmitted linear laser light LB21 and the linear laser light LB22 (first and second light receiving steps). In Fig. 2(a), the linear direction (Z direction) length of the linear laser light LB21 and the linear laser light LB22 is the same, which is L0, and the difference in length is zero.

圖2(b)表示頭11之噴嘴12之前端與作為微小零件群之複數個微LED1具有間隙且大致對向，噴嘴12之前端與複數個微LED1之平行度未調整而是傾斜θ之狀態。線狀雷射光LB21及線狀雷射光LB22表示由圖2之深度方向朝近前方向於第1第2發光步驟中發出之線狀雷射光，自噴嘴12之前端透過至微LED1之前端。線狀雷射光LB21及線狀雷射光LB22於第1第2受光步驟中由第1受光部31及第2受光部32受光。圖2(b)中，線狀雷射光LB21之線狀方向(Z方向)之長度L2較線狀雷射光LB22之線狀方向(Z方向)之長度L1長，其長度之差為L2－L1。Figure 2(b) shows a state where the front end of the nozzle 12 of the head 11 has a gap and is substantially opposed to a plurality of micro LEDs 1 as a group of minute parts, and the parallelism between the front end of the nozzle 12 and the plurality of micro LEDs 1 is not adjusted but is inclined θ . The linear laser light LB21 and the linear laser light LB22 represent the linear laser light emitted in the first and second light emission steps from the depth direction of FIG. 2 toward the front direction, and pass from the front end of the nozzle 12 to the front end of the micro LED 1. The linear laser light LB21 and the linear laser light LB22 are received by the first light receiving unit 31 and the second light receiving unit 32 in the first and second light receiving steps. In Figure 2(b), the length L2 in the linear direction (Z direction) of the linear laser light LB21 is longer than the length L1 in the linear direction (Z direction) of the linear laser light LB22, and the difference in length is L2-L1 .

即，實施例1中，構成為可根據線狀雷射光LB21之線狀方向之受光長度L2與線狀雷射光LB22之線狀方向之受光長度L1之差而知曉平行度是否調整，且基於該差而調整複數個微小零件載置於作為第1對象部之載體基板2上之微小零件群(微LED1)、與作為第2對象部之頭部(頭11之噴嘴12)之平行度。亦即，實施以線狀雷射光LB21之線狀方向之受光長度L2與線狀雷射光LB22之線狀方向之受光長度L1之差成為特定值以下的方式驅動頭11而調整平行度之調整步驟。That is, in the first embodiment, it is configured to know whether the parallelism is adjusted based on the difference between the light-receiving length L2 in the linear direction of the linear laser light LB21 and the light-receiving length L1 in the linear direction of the linear laser light LB22. It adjusts the parallelism between the micro-component group (micro LED1) placed on the carrier substrate 2 as the first target part and the head (nozzle 12 of the head 11) as the second target part. That is, an adjustment step of adjusting the parallelism by driving the head 11 so that the difference between the light-receiving length L2 in the linear direction of the linear laser light LB21 and the light-receiving length L1 of the linear laser light LB22 becomes less than a specific value is performed. .

再者，實施例1中，構成為驅動第2對象部而調整平行度，但未必限定於此，能夠適當變更。例如，亦可構成為驅動第1對象部而調整平行度，還可構成為驅動第1對象部及第2對象部之兩者而調整平行度。In addition, in Example 1, the structure is configured to drive the second target portion to adjust the degree of parallelism, but it is not necessarily limited to this, and can be changed appropriately. For example, it may be configured to drive the first target portion to adjust the parallelism, or it may be configured to drive both the first target portion and the second target portion to adjust the parallelism.

其次，參照圖3、圖4，對實施例1之平行度調整裝置進行說明。圖3係說明本發明之實施例1之平行度調整裝置之側視圖。圖4係說明本發明之實施例1之平行度調整裝置之俯視圖。Next, referring to Figs. 3 and 4, the parallelism adjusting device of the first embodiment will be described. Fig. 3 is a side view illustrating the parallelism adjusting device of embodiment 1 of the present invention. Fig. 4 is a top view illustrating the parallelism adjusting device of embodiment 1 of the present invention.

如圖3、圖4所示，設置有於+X方向(第1方向)上隔開間隔而配置，且能夠朝對向之-X方向(第2方向)以線狀發出線狀雷射光LB21之第1發光部21及發出線狀雷射光LB21之第2發光部。又，設置有於-X方向(第2方向)上隔開間隔而配置，且能夠接收自第1發光部21發出之線狀雷射光LB21之第1受光部31、及能夠接收自第2發光部22發出之線狀雷射光LB22之第2受光部32。As shown in Figs. 3 and 4, they are arranged at intervals in the +X direction (first direction), and can emit linear laser light LB21 in the opposite -X direction (second direction). The first light-emitting part 21 and the second light-emitting part that emits linear laser light LB21. In addition, a first light-receiving portion 31 that is arranged at intervals in the -X direction (second direction) and that can receive the linear laser light LB21 emitted from the first light-emitting portion 21, and can receive the second light-emitting portion The second light receiving part 32 of the linear laser light LB22 emitted from the part 22.

又，設置有於與第1方向及第2方向正交之+Y方向(第3方向)上隔開間隔而配置，且能夠朝對向之-Y方向(第4方向)以線狀發出線狀雷射光LB23之第3發光部23及發出線狀雷射光LB24之第4發光部24。又，設置有於-Y方向(第4方向)上隔開間隔而配置，且能夠接收自第3發光部23發出之線狀雷射光LB23之第3受光部33、及能夠接收自第4發光部24發出之線狀雷射光LB24之第4受光部34。In addition, they are arranged at intervals in the +Y direction (third direction) orthogonal to the first direction and the second direction, and can emit lines in a linear fashion in the -Y direction (fourth direction) facing each other The third light-emitting part 23 of the laser beam LB23 and the fourth light-emitting part 24 of the linear laser light LB24. In addition, a third light-receiving section 33 which is arranged at intervals in the -Y direction (fourth direction) and which can receive the linear laser light LB23 emitted from the third light-emitting section 23, and which can be received from the fourth light-emitting section The fourth light receiving part 34 of the linear laser light LB24 emitted from the part 24.

第1發光部21、第2發光部22、第3發光部23、及第4發光部24均具有相同構成，將半導體雷射源排列成線狀而構成。又，第1受光部31、第2受光部32、第3受光部33、及第4受光部34均具有相同構成，包含排列成線狀之CCD(Charge Coupled Device，電荷耦合元件)感測器。The first light-emitting portion 21, the second light-emitting portion 22, the third light-emitting portion 23, and the fourth light-emitting portion 24 all have the same configuration, and are configured by arranging semiconductor laser sources in a line. In addition, the first light receiving section 31, the second light receiving section 32, the third light receiving section 33, and the fourth light receiving section 34 all have the same configuration, and include CCD (Charge Coupled Device) sensors arranged in a line. .

此處，第1發光部21與第2發光部之間隔、及第3發光部與第4發光部之間隔較佳為儘可能分開。最佳為頭11之兩端部之噴嘴12附近。圖2中，對存在微LED1之部位照射線狀雷射光LB21及線狀雷射光LB22，但亦可為不存在微LED1之部位。Here, the interval between the first light-emitting portion 21 and the second light-emitting portion, and the interval between the third light-emitting portion and the fourth light-emitting portion are preferably separated as much as possible. It is best to be near the nozzle 12 at both ends of the head 11. In FIG. 2, the linear laser light LB21 and the linear laser light LB22 are irradiated to the part where the micro LED 1 is present, but it may be a part where the micro LED 1 is not present.

又，第1發光部21與第1受光部31、第2發光部22與第2受光部32、第3發光部23與第3受光部33、及第4發光部24與第4受光部34分別與X軸或Y軸方向平行地配置且對向，在相對於第1發光部21與第1受光部31、及第2發光部22與第2受光部32正交之方向配置有第3發光部23與第3受光部33、及第4發光部24與第4受光部34，但未必限定於此，能夠進行適當變更。例如，亦可使第1發光部21與第1受光部31及第2發光部22與第2受光部32、或第3發光部23與第3受光部33、及第4發光部24與第4受光部34以相對於X軸或Y軸具有角度之狀態而對向，亦可僅使第1發光部21與第1受光部31、及第2發光部22與第2受光部32以與X軸或Y軸具有角度之狀態而對向。只要於至少相對於第1發光部21與第1受光部31及第2發光部22與第2受光部32交叉之方向上配置第3發光部23與第3受光部33及第4發光部24與第4受光部34即可。In addition, the first light-emitting portion 21 and the first light-receiving portion 31, the second light-emitting portion 22 and the second light-receiving portion 32, the third light-emitting portion 23 and the third light-receiving portion 33, and the fourth light-emitting portion 24 and the fourth light-receiving portion 34 They are arranged in parallel to and opposed to the X-axis or Y-axis directions, respectively, and the third is arranged in a direction orthogonal to the first light-emitting portion 21 and the first light-receiving portion 31, and the second light-emitting portion 22 and the second light-receiving portion 32. The light-emitting unit 23 and the third light-receiving unit 33, and the fourth light-emitting unit 24 and the fourth light-receiving unit 34 are not necessarily limited to these, and can be appropriately changed. For example, the first light-emitting portion 21 and the first light-receiving portion 31, the second light-emitting portion 22 and the second light-receiving portion 32, or the third light-emitting portion 23 and the third light-receiving portion 33, and the fourth light-emitting portion 24 and the second light-emitting portion 4 The light-receiving portion 34 is opposed to the X-axis or Y-axis at an angle, and only the first light-emitting portion 21 and the first light-receiving portion 31, and the second light-emitting portion 22 and the second light-receiving portion 32 may be aligned with each other. The X-axis or Y-axis has an angle and opposes each other. As long as the third light-emitting portion 23, the third light-receiving portion 33, and the fourth light-emitting portion 24 are arranged at least in the direction crossing the first light-emitting portion 21 and the first light-receiving portion 31, and the second light-emitting portion 22 and the second light-receiving portion 32 And the fourth light receiving part 34.

自第1發光部21、第2發光部22、第3發光部23、及第4發光部24將與頭11之噴嘴12(第2對象部)和複數個微LED1(第1對象部)具有間隙且大致對向之大致對向方向正交之方向(Z方向)之線狀雷射光分別朝第1受光部31、第2受光部32、第3受光部33、及第4受光部34以線狀發光。發光之線狀雷射光筆直前進，如圖3所示之LB21般，被噴嘴12及微LED1等障礙物阻斷，僅通過無障礙物之空間而到達分別對應之受光部。From the first light-emitting part 21, the second light-emitting part 22, the third light-emitting part 23, and the fourth light-emitting part 24, the nozzle 12 (the second target part) of the head 11 and the plurality of micro LED1 (the first target part) have The linear laser light in the direction perpendicular to the substantially opposite direction (Z direction) with a gap and substantially opposes each other toward the first light receiving section 31, the second light receiving section 32, the third light receiving section 33, and the fourth light receiving section 34. Linear light. The luminous linear laser light travels straight, like the LB21 shown in Fig. 3, blocked by obstacles such as the nozzle 12 and the micro LED 1, and reaches the corresponding light-receiving parts only through the obstacle-free space.

而且，如圖2(a)所示若為平行度調整後之狀態，則例如第1第2受光步驟中第1受光部31接收第1第2發光步驟中所發光之線狀雷射光後之線狀雷射光LB21之線狀方向(Z方向)之受光長度L0、與第2受光部32接收第1第2發光步驟中所發光之線狀雷射光後之線狀雷射光LB22之線狀方向(Z方向)之受光長度L0成為相同長度，其差為零。Furthermore, if the parallelism is adjusted as shown in Figure 2(a), for example, in the first and second light receiving steps, the first light receiving section 31 receives the linear laser light emitted in the first and second light emitting steps. The light receiving length L0 in the linear direction (Z direction) of the linear laser light LB21 and the linear direction of the linear laser light LB22 after the second light receiving section 32 receives the linear laser light emitted in the first and second light emitting steps The received light length L0 (Z direction) becomes the same length, and the difference is zero.

又，如圖2(b)所示若為平行度未調整之狀態，則例如第1第2受光步驟中第1受光部31接收第1第2發光步驟中所發光之線狀雷射光後之線狀雷射光LB21之線狀方向(Z方向)之受光長度L2、與第2受光部32接收第1第2發光步驟中所發光之線狀雷射光後之線狀雷射光LB22之線狀方向(Z方向)之受光長度L1未成為相同長度，其差為L2－L1而非零。Also, if the parallelism is not adjusted as shown in FIG. 2(b), for example, in the first and second light-receiving steps, the first light-receiving section 31 receives the linear laser light emitted in the first and second light-emitting steps. The light receiving length L2 of the linear direction (Z direction) of the linear laser light LB21 and the linear direction of the linear laser light LB22 after the second light receiving portion 32 receives the linear laser light emitted in the first and second light emitting steps (Z direction) the received light length L1 does not become the same length, and the difference is L2-L1 instead of zero.

圖2中，顯示第1第2發光步驟及第1第2受光步驟中之平行度調整方法，但對於第3發光部23及第4發光部24發出線狀雷射光之第3第4發光步驟、及第3受光部33及第4受光部34接收線狀雷射光之第3第4發光步驟亦相同。In FIG. 2, the parallelism adjustment method in the first and second light-emitting steps and the first and second light-receiving steps is shown, but the third and fourth light-emitting steps in which the third light-emitting portion 23 and the fourth light-emitting portion 24 emit linear laser light , And the third and fourth light-emitting steps in which the third light-receiving portion 33 and the fourth light-receiving portion 34 receive linear laser light are also the same.

實施例1之平行度調整裝置具備：驅動部，其驅動作為第2對象部之頭部(頭11之噴嘴12)而調整其與複數個微小零件載置於作為第1對象部之載體基板2上之微小零件群(微LED1)之平行度；及控制部，其基於線狀雷射光之線狀方向之受光長度L1及L2而控制驅動部。The parallelism adjusting device of the first embodiment includes a driving unit that drives the head (nozzle 12 of the head 11) as the second target part to adjust it and a plurality of micro parts to be placed on the carrier substrate 2 as the first target part The parallelism of the group of tiny parts (micro LED1) above; and the control part, which controls the driving part based on the light receiving lengths L1 and L2 of the linear direction of the linear laser light.

控制部執行以上述各個受光長度之差即L2－L1成為特定值以下之方式使驅動部驅動而調整平行度之調整步驟。驅動部可設置分別變更X方向及Y方向之斜度之機構，亦可設置同時變更X方向及Y方向之斜度之機構。The control unit executes an adjustment step of driving the driving unit to adjust the parallelism such that the difference between the light-receiving lengths, that is, L2-L1 becomes a specific value or less. The drive unit can be equipped with a mechanism to change the inclination of the X direction and the Y direction respectively, or a mechanism to change the inclination of the X direction and the Y direction at the same time.

此處，所謂特定值以下，只要為複數個微LED1全部能夠由頭11之複數個噴嘴12拾取之值即可，較佳為1 μm以下即可，最佳為0.5 μm以下較為理想。又，基於第1第2受光步驟中所接收之線狀雷射光之受光長度之差而進行平行度調整時之特定值、與基於第3第4受光步驟中所接收之線狀雷射光之受光長度之差而進行平行度調整時之特定值可為相同值，亦可為不同值。Here, the so-called specific value or less may be a value capable of being picked up by the plurality of nozzles 12 of the head 11 by all of the plurality of micro LEDs 1, preferably 1 μm or less, and most preferably 0.5 μm or less. In addition, the specific value when adjusting the parallelism based on the difference in the light receiving length of the linear laser light received in the first and second light receiving steps, and the light receiving based on the linear laser light received in the third and fourth light receiving steps The specific value when adjusting the parallelism for the difference in length can be the same value or different values.

再者，實施例1中，構成為於第1方向、第2方向(X方向)設置第1發光部21、及第2發光部22，於第3方向、第4方向(Y方向)設置第3發光部23、及第4發光部24，且設置分別對向之第1受光部31、第2受光部32、第3受光部33、及第4受光部34，但未必限定於此，能夠進行適當變更。例如，若只要第1方向、第2方向(X方向)進行平行度調整，則於第3方向、第4方向(Y方向)之平行度滿足之情形時，可僅於第1方向、第2方向(X方向)設置第1發光部21、及第2發光部22並且設置對向之第1受光部31、第2受光部32。Furthermore, in Example 1, the configuration is such that the first light-emitting portion 21 and the second light-emitting portion 22 are provided in the first direction and the second direction (X direction), and the second light-emitting portion 22 is provided in the third direction and the fourth direction (Y direction). The 3 light-emitting portion 23 and the fourth light-emitting portion 24 are provided with the first light-receiving portion 31, the second light-receiving portion 32, the third light-receiving portion 33, and the fourth light-receiving portion 34 facing each other, but they are not necessarily limited to these. Make appropriate changes. For example, if only the first direction and the second direction (X direction) are adjusted for parallelism, when the parallelism in the third direction and the fourth direction (Y direction) is satisfied, only the first and second directions can be adjusted. In the direction (X direction), the first light-emitting portion 21 and the second light-emitting portion 22 are provided, and the first light-receiving portion 31 and the second light-receiving portion 32 facing each other are provided.

再者，實施例1中，使頭11之噴嘴12(第2對象部)與複數個微LED1(第1對象部)具有間隙且大致對向而執行第1第2發光步驟、第3第4發光步驟、第1第2受光步驟、及第3第4受光步驟，但未必限定於此，能夠適當變更。例如，亦可不具有間隙且大致對向而執行第1第2發光步驟、第3第4發光步驟、第1第2受光步驟、及第3第4受光步驟。該情形時亦然，只要以L2－L1成為特定值以下的方式調整平行度即可。Furthermore, in Example 1, the nozzle 12 (the second target portion) of the head 11 and the plurality of micro LEDs 1 (the first target portion) are substantially opposed to each other with a gap, and the first and second light emitting steps, the third and fourth light emitting steps are performed. The light-emitting step, the first and second light-receiving steps, and the third and fourth light-receiving steps are not necessarily limited to these steps, and can be appropriately changed. For example, the first and second light-emitting steps, the third and fourth light-emitting steps, the first and second light-receiving steps, and the third and fourth light-receiving steps may be executed substantially facing each other without a gap. In this case, too, it is sufficient to adjust the parallelism so that L2-L1 becomes less than or equal to the specific value.

構成為自第1發光部21、第2發光部22、第3發光部23、及第4發光部24將與使第2對象部與第1對象部大致對向之大致對向方向正交之方向(Z方向)之線狀雷射光以線狀發光，但未必限定於此，能夠適當變更。例如，亦可構成為使線狀雷射光朝與大致對向方向具有特定之角度而非正交之方向以線狀發光。只要構成為使線狀雷射光朝至少與大致對向方向交叉之方向以線狀發光即可。The configuration is such that the first light-emitting portion 21, the second light-emitting portion 22, the third light-emitting portion 23, and the fourth light-emitting portion 24 will be orthogonal to the substantially opposing direction that substantially opposes the second object portion and the first object portion. The linear laser light in the direction (Z direction) emits linearly, but it is not necessarily limited to this and can be changed appropriately. For example, the linear laser light may be configured to emit light linearly in a direction that has a specific angle to the substantially opposite direction instead of being orthogonal. What is necessary is just to structure so that the linear laser beam emits linearly in the direction which cross|intersects at least substantially the opposite direction.

如此，於實施例1中，藉由一種平行度調整裝置，可不費工夫而準確地進行平行度調整，該平行度調整裝置之特徵在於，其係調整第1對象部與第2對象部之平行度者，具備： 第1發光部及第2發光部，其等在第1方向上隔開間隔而配置，且能夠朝對向之第2方向以線狀發出線狀雷射光； 第1受光部及第2受光部，其等在上述第2方向上隔開間隔而配置，第1受光部能夠接收自上述第1發光部發出之線狀雷射光，第2受光部能夠接收自上述第2發光部發出之線狀雷射光； 驅動部，其驅動上述第1對象部或上述第2對象部而調整上述第1對象部與上述第2對象部之平行度；及 控制部，其基於上述第1受光部及上述第2受光部所接收之線狀雷射光之線狀方向之受光長度而控制上述驅動部；且 上述第1發光部及上述第2發光部於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光朝上述第1受光部及上述第2受光部發光。In this way, in the first embodiment, the parallelism can be adjusted accurately and without time and effort by a parallelism adjusting device. The feature of the parallelism adjusting device is that it adjusts the parallelism between the first object part and the second object part. Those who have degrees have: The first light-emitting portion and the second light-emitting portion are arranged at intervals in the first direction, and can emit linear laser light in a linear shape toward the second direction opposite; The first light-receiving part and the second light-receiving part are arranged at intervals in the second direction, the first light-receiving part can receive the linear laser light emitted from the first light-emitting part, and the second light-receiving part can receive The linear laser light emitted by the second light-emitting part; A driving portion that drives the first object portion or the second object portion to adjust the parallelism between the first object portion and the second object portion; and A control unit that controls the drive unit based on the light receiving length of the linear laser light received by the first light receiving unit and the second light receiving unit in the linear direction; and The first light-emitting portion and the second light-emitting portion are in a substantially opposed state in which the first object portion and the second object portion are substantially opposed, and linear laser light in a direction intersecting the substantially opposed direction is directed toward The first light receiving unit and the second light receiving unit emit light.

又，藉由一種平行度調整方法，可不費工夫而準確地進行平行度調整，該平行度調整方法之特徵在於，其係調整第1對象部與第2對象部之平行度者，具備： 第1第2發光步驟，其係自於第1方向上隔開間隔而配置之第1發光部及第2發光部朝對向之第2方向以線狀發出線狀雷射光； 第1第2受光步驟，其係於上述第2方向上隔開間隔而配置之第1受光部及第2受光部中，由第1受光部接收自上述第1發光部發出之線狀之線狀雷射光，由第2受光部接收自上述第2發光部發出之線狀之線狀雷射光；及 調整步驟，其係基於上述第1受光部及上述第2受光部所接收之線狀雷射光之線狀方向之受光長度，驅動上述第1對象部或上述第2對象部而調整上述第1對象部與上述第2對象部之平行度；且 上述第1第2發光步驟中，於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光自上述第1發光部及上述第2發光部朝上述第1受光部及上述第2受光部發光。In addition, a parallelism adjustment method can be used to adjust the parallelism accurately without any effort. The parallelism adjustment method is characterized in that it adjusts the parallelism between the first object portion and the second object portion, and includes: The first and second light-emitting steps are to emit linear laser light in a linear shape from the first light-emitting part and the second light-emitting part arranged at intervals in the first direction in a second direction facing each other; The first and second light-receiving steps include the first light-receiving part and the second light-receiving part arranged at intervals in the second direction, and the first light-receiving part receives the linear line emitted from the first light-emitting part Shaped laser light, the linear linear laser light emitted from the second light emitting part is received by the second light receiving part; and An adjustment step of adjusting the first object by driving the first object portion or the second object portion based on the light-receiving length in the linear direction of the linear laser light received by the first light-receiving portion and the second light-receiving portion The parallelism between the part and the above-mentioned second object part; and In the first and second light emission steps, in a substantially opposed state in which the first target portion and the second target portion are substantially opposed, linear laser light in a direction intersecting the substantially opposed direction is caused to come from the first A light-emitting unit and the second light-emitting unit emit light toward the first light-receiving unit and the second light-receiving unit.

進而，藉由將上述平行度調整裝置應用於拾取裝置並執行平行度調整方法而可實現精度較高且確實之拾取方法。 實施例2Furthermore, by applying the aforementioned parallelism adjusting device to a pickup device and executing the parallelism adjusting method, a highly accurate and reliable pickup method can be realized. Example 2

本發明之實施例2中，與實施例1之不同點在於，將平行度調整裝置應用於安裝裝置，且將平行度調整方法應用於安裝方法。參照圖5對實施例2進行說明。圖5係說明本發明之實施例2之安裝方法之圖。In the second embodiment of the present invention, the difference from the first embodiment is that the parallelism adjustment device is applied to the installation device, and the parallelism adjustment method is applied to the installation method. Example 2 will be described with reference to FIG. 5. Figure 5 is a diagram illustrating the installation method of the second embodiment of the present invention.

如圖5(a)所示，於頭11之複數個噴嘴12，分別拾取有微LED1。而且，將該等微LED1定位於作為安裝對象之電路基板3之特定位置上方之後，使其朝電路基板3下降。此時，若所拾取之複數個微LED1(微小零件群)與電路基板3之平行度未得以調整，則任一微LED1均無法安裝於電路基板3上之特定位置，引起位置偏移，或因間隙而無法安裝，或因安裝之衝擊而破壞微LED1。As shown in Fig. 5(a), a plurality of nozzles 12 of the head 11 pick up the micro LED 1 respectively. Then, after positioning the micro LED 1 above a specific position of the circuit board 3 to be mounted, it is lowered toward the circuit board 3. At this time, if the parallelism between the picked-up micro-LED1 (micro-component group) and the circuit board 3 is not adjusted, any micro-LED1 cannot be mounted on a specific position on the circuit board 3, causing position shift, or Unable to install due to gap, or damage to micro-LED1 due to impact of installation.

因此，使用上述平行度調整裝置執行平行度調整方法。實施例2中，第1對象部係能夠載置包含複數個微LED1(微小零件)之微小零件群之電路基板3，第2對象部係由頭部(頭11之噴嘴12)之拾取面拾取之包含複數個微LED1(微小零件)之微小零件群。Therefore, the parallelism adjustment method is performed using the aforementioned parallelism adjustment device. In the second embodiment, the first object part is capable of mounting the circuit board 3 of a small part group including a plurality of micro LED1 (micro parts), and the second object part is picked up by the pickup surface of the head (nozzle 12 of the head 11) It includes a group of micro-parts including a plurality of micro-LED1 (micro-parts).

完成平行度調整之後，頭11下降，由複數個噴嘴12拾取之複數個微LED1之安裝面全部接觸到電路基板3後，停止下降(圖5(b))。其次，使頭11上升後，微LED1全部保持於電路基板3上。其原因在於，於電路基板3之安裝位置亦設置有未圖示之黏著層，且構成為該黏著層之黏著度大於噴嘴12之黏著度。亦即，具有如下關係：載體基板2之黏著度＜噴嘴12之黏著度＜電路基板之黏著度。After the parallelism is adjusted, the head 11 is lowered, and after the mounting surfaces of the plurality of micro LEDs 1 picked up by the plurality of nozzles 12 all contact the circuit board 3, the lowering stops (Figure 5(b)). Next, after the head 11 is raised, all the micro LEDs 1 are held on the circuit board 3. The reason is that an adhesive layer (not shown) is also provided at the mounting position of the circuit substrate 3, and the adhesive layer is configured such that the adhesiveness of the adhesive layer is greater than the adhesiveness of the nozzle 12. That is, it has the following relationship: the adhesion of the carrier substrate 2<the adhesion of the nozzle 12<the adhesion of the circuit board.

如此，實施例2中，藉由將平行度調整裝置應用於安裝裝置並執行平行度調整方法而可實現無轉印失誤之較高成功率及較高精度之安裝。 [產業上之可利用性]In this way, in Embodiment 2, by applying the parallelism adjusting device to the mounting device and executing the parallelism adjusting method, a higher success rate and higher precision installation without transfer errors can be achieved. [Industrial availability]

本發明之平行度調整裝置、拾取裝置、安裝裝置、平行度調整方法、拾取方法、及安裝方法可廣泛應用於高速、高精度地確實安裝不限於微LED之晶片電容器等微小零件之領域。The parallelism adjusting device, picking device, mounting device, parallelism adjusting method, picking method, and mounting method of the present invention can be widely used in high-speed, high-precision and reliable mounting of small parts such as chip capacitors not limited to micro LEDs.

1:微LED 2:載體基板 3:電路基板 11:頭 12:噴嘴 21:第1發光部 22:第2發光部 23:第3發光部 24:第4發光部 31:第1受光部 32:第2受光部 33:第3受光部 34:第4受光部 L0:受光長度 L1:受光長度 L2:受光長度 LB21:線狀雷射光 LB22:線狀雷射光 LB23:線狀雷射光 LB24:線狀雷射光 θ:角度1: Micro LED 2: carrier substrate 3: Circuit board 11: head 12: Nozzle 21: The first light-emitting part 22: The second light-emitting part 23: 3rd light emitting part 24: 4th light emitting part 31: The first light receiving part 32: The second light receiving part 33: The third light receiving part 34: The fourth light receiving part L0: Light length L1: Light length L2: Light length LB21: Linear laser light LB22: Linear laser LB23: Linear laser LB24: Linear laser θ: Angle

圖1(a)～(c)係說明本發明之實施例1之拾取方法之圖。 圖2係說明本發明之實施例1之平行度調整方法之圖，(a)表示平行度調整後之狀態，(b)表示平行度未調整之狀態。 圖3係說明本發明之實施例1之平行度調整裝置之側視圖。 圖4係說明本發明之實施例1之平行度調整裝置之俯視圖。 圖5(a)～(c)係說明本發明之實施例2之安裝方法之圖。Figures 1(a) to (c) are diagrams illustrating the pick-up method of Embodiment 1 of the present invention. Fig. 2 is a diagram illustrating the parallelism adjustment method of Embodiment 1 of the present invention, (a) shows the state after the parallelism is adjusted, and (b) shows the state without the parallelism. Fig. 3 is a side view illustrating the parallelism adjusting device of embodiment 1 of the present invention. Fig. 4 is a top view illustrating the parallelism adjusting device of embodiment 1 of the present invention. Figures 5 (a) to (c) are diagrams illustrating the installation method of Embodiment 2 of the present invention.

1:微LED 1: Micro LED

2:載體基板 2: carrier substrate

11:頭 11: head

12:噴嘴 12: Nozzle

L0:受光長度 L0: Light length

L1:受光長度 L1: Light length

L2:受光長度 L2: Light length

LB21:線狀雷射光 LB21: Linear laser light

LB22:線狀雷射光 LB22: Linear laser

θ:角度 θ: Angle

Claims (10)

一種平行度調整裝置，其特徵在於，其係調整第1對象部與第2對象部之平行度者，具備： 第1發光部及第2發光部，其等在第1方向上隔開間隔而配置，且能夠朝對向之第2方向以線狀發出線狀雷射光； 第1受光部及第2受光部，其等在上述第2方向上隔開間隔而配置，第1受光部能夠接收自上述第1發光部發出之線狀雷射光，第2受光部能夠接收自上述第2發光部發出之線狀雷射光； 驅動部，其驅動上述第1對象部或上述第2對象部而調整上述第1對象部與上述第2對象部之平行度；及 控制部，其基於上述第1受光部及上述第2受光部所接收之線狀雷射光之線狀方向之受光長度而控制上述驅動部；且 上述第1發光部及上述第2發光部於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光朝上述第1受光部及上述第2受光部發光。A parallelism adjusting device, characterized in that it adjusts the parallelism between a first object portion and a second object portion, and includes: The first light-emitting portion and the second light-emitting portion are arranged at intervals in the first direction, and can emit linear laser light in a linear shape toward the second direction opposite; The first light-receiving part and the second light-receiving part are arranged at intervals in the second direction, the first light-receiving part can receive the linear laser light emitted from the first light-emitting part, and the second light-receiving part can receive The linear laser light emitted by the second light-emitting part; A driving portion that drives the first object portion or the second object portion to adjust the parallelism between the first object portion and the second object portion; and A control unit that controls the drive unit based on the light receiving length of the linear laser light received by the first light receiving unit and the second light receiving unit in the linear direction; and The first light-emitting portion and the second light-emitting portion are in a substantially opposed state in which the first object portion and the second object portion are substantially opposed, and linear laser light in a direction intersecting the substantially opposed direction is directed toward The first light receiving unit and the second light receiving unit emit light. 如請求項1之平行度調整裝置，其具備： 第3發光部及第4發光部，其等在與上述第1方向及上述第2方向交叉之第3方向上隔開間隔而配置，且能夠朝對向之第4方向以線狀發出線狀雷射光；以及 第3受光部及第4受光部，其等在上述第4方向上隔開間隔而配置，第3受光部能夠接收自上述第3發光部發出之線狀雷射光，第4受光部能夠接收自上述第4發光部發出之線狀雷射光；且 上述第3發光部及上述第4發光部於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光朝上述第3受光部及上述第4受光部發光，並且 上述控制部進而基於上述第3受光部及上述第4受光部所接收之線狀雷射光之線狀方向之受光長度而控制上述驅動部。Such as the parallelism adjustment device of claim 1, which has: The third light-emitting portion and the fourth light-emitting portion are arranged at intervals in a third direction intersecting the above-mentioned first direction and the above-mentioned second direction, and can emit linearly in the fourth direction facing each other. Laser light; and The third light-receiving part and the fourth light-receiving part are arranged at intervals in the fourth direction, the third light-receiving part can receive the linear laser light emitted from the third light-emitting part, and the fourth light-receiving part can receive from The linear laser light emitted by the fourth light-emitting part; and The third light-emitting portion and the fourth light-emitting portion are in a substantially opposed state in which the first object portion and the second object portion are substantially opposed, and linear laser light in a direction intersecting the substantially opposed direction is directed toward The third light receiving portion and the fourth light receiving portion emit light, and The control unit further controls the driving unit based on the light receiving length of the linear laser light received by the third light receiving unit and the fourth light receiving unit in the linear direction. 如請求項2之平行度調整裝置，其中上述控制部以於上述大致對向狀態下，上述第1受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度、與上述第2受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度之差成為特定值以下的方式，控制上述驅動部，並且 以於上述大致對向狀態下，上述第3受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度、與上述第4受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度之差成為特定值以下的方式，控制上述驅動部。The parallelism adjustment device of claim 2, wherein the control section is in the substantially opposed state, and the linear laser light received by the first light-receiving section intersects the substantially opposed direction in a linear direction The driving unit is controlled so that the difference between the light-receiving length and the light-receiving length of the linear laser beam in the direction intersecting the substantially opposite direction received by the second light-receiving unit becomes a specific value or less, and In the above-mentioned substantially facing state, the light-receiving length in the linear direction of the linear laser light in the direction intersecting the substantially opposite direction received by the third light-receiving unit is compared with the light-receiving length of the linear laser light received by the fourth light-receiving unit The driving section is controlled so that the difference in the light-receiving length of the linear laser beam in the linear direction in the direction intersecting approximately the opposite direction becomes less than a specific value. 一種拾取裝置，其係使用有如請求項1至3中任一項之平行度調整裝置者，其特徵在於： 上述第1對象部係以複數個載置於基板上之微小零件群，上述第2對象部係由拾取面能夠同時拾取上述微小零件群之至少一部分之頭部。A pick-up device which uses the parallelism adjustment device of any one of claims 1 to 3, characterized in that: The first target portion is a plurality of micro-component groups placed on a substrate, and the second target portion is a head capable of simultaneously picking up at least a part of the micro-component group by a pickup surface. 一種安裝裝置，其係使用有如請求項1至3中任一項之平行度調整裝置者，其特徵在於： 上述第1對象部係能夠載置包含複數個微小零件之微小零件群之電路基板，上述第2對象部係由頭部之拾取面拾取之上述微小零件群。An installation device that uses the parallelism adjustment device of any one of claims 1 to 3, characterized in that: The first target portion is a circuit board that can mount a small component group including a plurality of small components, and the second target portion is the small component group picked up by the pickup surface of the head. 一種平行度調整方法，其特徵在於，其係調整第1對象部與第2對象部之平行度者，具備： 第1第2發光步驟，其係自於第1方向上隔開間隔而配置之第1發光部及第2發光部朝對向之第2方向以線狀發出線狀雷射光； 第1第2受光步驟，其係於上述第2方向上隔開間隔而配置之第1受光部及第2受光部中，由第1受光部接收自上述第1發光部發出之線狀之線狀雷射光，由第2受光部接收自上述第2發光部發出之線狀之線狀雷射光；及 調整步驟，其係基於上述第1受光部及上述第2受光部所接收之線狀雷射光之線狀方向之受光長度，驅動上述第1對象部或上述第2對象部而調整上述第1對象部與上述第2對象部之平行度；且 上述第1第2發光步驟中，於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光自上述第1發光部及上述第2發光部朝上述第1受光部及上述第2受光部發光。A method for adjusting parallelism, characterized in that it adjusts the parallelism between a first object portion and a second object portion, and includes: The first and second light-emitting steps are to emit linear laser light in a linear shape from the first light-emitting part and the second light-emitting part arranged at intervals in the first direction in a second direction facing each other; The first and second light-receiving steps include the first light-receiving part and the second light-receiving part arranged at intervals in the second direction, and the first light-receiving part receives the linear line emitted from the first light-emitting part Shaped laser light, the linear linear laser light emitted from the second light emitting part is received by the second light receiving part; and An adjustment step of adjusting the first object by driving the first object portion or the second object portion based on the light-receiving length in the linear direction of the linear laser light received by the first light-receiving portion and the second light-receiving portion The parallelism between the part and the above-mentioned second object part; and In the first and second light emission steps, in a substantially opposed state in which the first target portion and the second target portion are substantially opposed, linear laser light in a direction intersecting the substantially opposed direction is caused to come from the first A light-emitting unit and the second light-emitting unit emit light toward the first light-receiving unit and the second light-receiving unit. 如請求項6之平行度調整方法，其具備： 第3第4發光步驟，其係於與上述第1方向及上述第2方向交叉之第3方向上隔開間隔而配置，朝對向之第4方向以線狀發出線狀雷射光；及 第3第4受光步驟，其係於上述第4方向上隔開間隔而配置之第3受光部及第4受光部，由第3受光部接收自上述第3發光部發出之線狀雷射光，由第4受光部接收自上述第4發光部發出之線狀雷射光；且 於上述第3第4發光步驟中，於使上述第1對象部與上述第2對象部大致對向之大致對向狀態下，使與上述大致對向方向交叉之方向之線狀雷射光自上述第3發光部及上述第4發光部朝上述第3受光部及上述第4受光部發光，並且 於上述調整步驟中，進而於上述第3第4受光步驟中，基於第3受光部及上述第4受光部所接收之雷射光之線狀方向之受光長度，驅動上述第1對象部或上述第2對象部而調整上述第1對象部與上述第2對象部之平行度。Such as the parallelism adjustment method of claim 6, which has: The third and fourth light emitting steps are arranged at intervals in a third direction intersecting the first direction and the second direction, and emit linear laser light in a linear shape toward the opposing fourth direction; and The third and fourth light receiving steps include the third light receiving section and the fourth light receiving section arranged at intervals in the fourth direction, and the third light receiving section receives the linear laser light emitted from the third light emitting section. The linear laser light emitted from the fourth light-emitting part is received by the fourth light-receiving part; and In the third and fourth light emitting steps, in a substantially opposed state in which the first target portion and the second target portion are substantially opposed, linear laser light in a direction intersecting the substantially opposed direction is caused to come from the The third light emitting portion and the fourth light emitting portion emit light toward the third light receiving portion and the fourth light receiving portion, and In the above adjustment step, and further in the third and fourth light receiving steps, the first object portion or the first object portion or the first object portion is driven based on the light receiving length in the linear direction of the laser light received by the third light receiving portion and the fourth light receiving portion 2 target parts to adjust the parallelism between the first target part and the second target part. 如請求項7之平行度調整方法，其中於上述調整步驟中，以於上述大致對向狀態下，上述第1受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度、與上述第2受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度之差成為特定值以下的方式，驅動上述第1對象部或上述第2對象部，並且 以於上述大致對向狀態下，上述第3受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度、與上述第4受光部所接收之與上述大致對向方向交叉之方向之線狀雷射光之線狀方向之受光長度之差成為特定值以下的方式，驅動上述第1對象部或上述第2對象部。The parallelism adjustment method of claim 7, wherein in the adjustment step, in the substantially facing state, the line of the linear laser light in the direction intersecting the substantially facing direction received by the first light receiving unit The first object is driven so that the difference between the light-receiving length in the linear direction and the light-receiving length in the linear direction of the linear laser light in the direction intersecting the substantially opposite direction received by the second light-receiving section becomes a specific value or less Part or the above-mentioned second object part, and In the above-mentioned substantially facing state, the light-receiving length in the linear direction of the linear laser light in the direction intersecting the substantially opposite direction received by the third light-receiving unit is compared with the light-receiving length of the linear laser light received by the fourth light-receiving unit The first target portion or the second target portion is driven so that the difference in the received light length in the linear direction of the linear laser beam in the direction intersecting substantially in the opposite direction becomes a specific value or less. 一種拾取方法，其係使用有如請求項6至8中任一項之平行度調整方法者，其特徵在於： 上述第1對象部係以複數個載置於基板上之微小零件群，上述第2對象部係由拾取面能夠同時拾取上述微小零件群之至少一部分之頭部。A picking method that uses the parallelism adjustment method as in any one of Claims 6 to 8, characterized by: The first target portion is a plurality of micro-component groups placed on a substrate, and the second target portion is a head capable of simultaneously picking up at least a part of the micro-component group by a pickup surface. 一種安裝方法，其係使用有如請求項6至8中任一項之平行度調整方法者，其特徵在於： 上述第1對象部係能夠載置包含複數個微小零件之微小零件群之電路基板，上述第2對象部係由頭部之拾取面拾取之上述微小零件群。An installation method that uses the parallelism adjustment method as in any one of Claims 6 to 8, characterized by: The first target portion is a circuit board that can mount a small component group including a plurality of small components, and the second target portion is the small component group picked up by the pickup surface of the head.
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KR20210080528A (en) 2021-06-30
CN112868092B (en) 2023-12-15

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