TW202024140A - Manufactuaring method of film and printed wiring board - Google Patents

Abstract

The purpose of the present invention is to provide a method for producing a film by exposing a coating film of a photosensitive resin composition to light and then developing the exposed coating film, whereby the pattern of the film can have high resolution. The method for producing a film comprises forming a coating film from a photosensitive resin composition, then exposing the coating film to light by irradiating the coating film with light emitted from a light source, and then developing the exposed coating film with an alkaline solution. The photosensitive resin composition comprises (A) a resin containing a carboxyl group, (B) an unsaturated compound, (C) a photopolymerization initiator and (D) an epoxy resin. The light to be emitted to the coating film includes light having a specific wavelength.

Description

Manufacturing method of film and printed circuit board

The present invention relates to a method for manufacturing a coating film and a printed wiring board. In more detail, the present invention relates to the following technology: a method for manufacturing a coating film by exposing a coating film containing a photosensitive resin composition to produce a coating film ; And, a printed circuit board provided with the coating film.

Conventionally, various curable resin compositions have been used to form an electrical insulating layer of a printed wiring board. The electrical insulating layer is a solder resist layer, a plating resist layer, a resist layer, an interlayer insulating layer, and the like. Regarding the photosensitive resin composition, the photosensitive resin composition is cured by irradiating light such as ultraviolet rays, and the electrically insulating layer can be formed by heating as needed.

The object of the present invention is to provide a method for manufacturing a coating film, which can have high resolution in the shape of the coating film when the coating film of the photosensitive resin composition is exposed and then developed to manufacture the coating film.

Moreover, another object of the present invention is to provide a printed wiring board provided with a coating film produced by the above-mentioned manufacturing method.

The method of manufacturing a coating film in one aspect of the present invention includes: arranging a photosensitive resin composition on a substrate, thereby forming a coating film on the substrate; and irradiating light emitted from a light source on The step of exposing the aforementioned coating film; and the step of developing the aforementioned coating film after the aforementioned exposure with an alkaline solution. The aforementioned photosensitive resin composition contains a carboxyl group-containing resin (A), an unsaturated compound (B) having at least one ethylenically unsaturated bond in one molecule, a photopolymerization initiator (C), and an epoxy resin (D) ). The absorption spectrum of the aforementioned photopolymerization initiator (C) has a first absorption band in a wavelength range of 350 nm or more and 370 nm or less, and a second absorption band in a wavelength range longer than 370 nm and 415 nm or less. The light irradiated on the coating film in the aforementioned exposure step includes the first light, the second light, and the third light. The wavelength range of the first light is within the wavelength range of the first absorption band. The wavelength range of the second light is within the wavelength range of the second absorption band. The wavelength region of the aforementioned third light is within the wavelength range of 305 nm or more and 325 nm or less. In the spectrum of the light irradiated on the coating film, the area under the curve in the wavelength range from 200nm to 500nm is shorter than 280nm and to 200nm and the area under the curve is longer than 415nm to 500nm. The percentage of the total area under the curve of the wavelength range is 5% or less.

The printed wiring board in one aspect of the present invention includes: a conductive layer; and an insulating layer which overlaps the aforementioned conductive layer. The aforementioned insulating layer includes the coating film produced by the aforementioned coating film manufacturing method.

First, the process of completing the present invention will be described.

When an electrically insulating layer is made from a photosensitive resin composition, for example, Patent Document 1 (Japanese Patent Laid-Open No. 2008-146044) proposes a photosensitive resin composition that can be directly drawn by using ultraviolet rays A method (direct drawing method) is used to form a latent image of a pattern, and the latent image of the pattern is developed using an alkaline aqueous solution. When the dry coating film of the photosensitive resin composition is irradiated with light in the wavelength range of 355 to 375 nm and light with a wavelength of 405 nm, the photosensitive resin composition is highly sensitive to the above-mentioned wavelength range and wavelength. Exposure by the tracing method can also be a thick electrical insulating layer.

In Patent Document 1, the layer formed of the photosensitive resin composition is excellent in the properties required for the insulating layer, and the properties are insulation, acid resistance, alkali resistance, and plating resistance.

However, when a coating film of such a photosensitive resin composition is exposed and then developed to produce a coating film, it is difficult to make the shape of the coating film have high resolution. Therefore, for example, when a film having holes is produced, there is a problem that it is difficult to clearly form the shape of the holes.

In view of the above points, the inventors have made diligent research results and completed the present invention, which is a method of manufacturing a coating film and a printed wiring board provided with the coating film. When the coating film of the photosensitive resin composition is exposed and then developed, the coating is produced When filming, its film shape has high resolution.

Hereinafter, the photosensitive resin composition in this embodiment will be described.

The photosensitive resin composition of this embodiment contains a carboxyl group-containing resin (A), an unsaturated compound (B) having at least one ethylenically unsaturated bond in one molecule, a photopolymerization initiator (C), and epoxy Resin (D). In addition, the details of each component of the photosensitive resin composition will be described later.

In this embodiment, the absorption spectrum of the photopolymerization initiator (C) has a first absorption band in a wavelength range of 350 nm or more and 370 nm or less, and a second absorption band in a wavelength range longer than 370 nm and 415 nm or less. band. The first absorption band may be in the entire wavelength range of 350 nm or more and 370 nm or less, or in a partial wavelength range of 350 nm or more and 370 nm or less. In addition, the first absorption band may be continuous with other absorption bands with a wavelength less than 350 nm, or may be continuous with other absorption bands with a wavelength exceeding 370 nm. The same applies to the second absorption band (the absorption band in the wavelength range longer than 370 nm and 415 nm or less) and the third absorption band (the absorption band in the wavelength range from 305 nm to 325 nm) described later.

In this embodiment, the coating film is formed by the following method: a photosensitive resin composition is arranged on a substrate, thereby forming a coating film on the substrate, and exposure is performed by irradiating light on the coating film , And then use alkaline solution to develop the exposed coating film. Specifically, the method of manufacturing a coating film containing a photosensitive resin composition includes: arranging the photosensitive resin composition on a substrate, thereby forming a coating film on the substrate; A step of irradiating the coating film to perform exposure; and a step of developing the coating film after exposure with an alkaline solution. The spectrum of the light irradiated on the coating film in the exposure step has a first intensity distribution, a second intensity distribution, and a third intensity distribution. The first intensity distribution is in the wavelength range of 350nm or more and 370nm and is in line with the first The absorption band is repeated, and the second intensity distribution is in a wavelength range longer than 370 nm and below 415 nm and repeats with the second absorption band, and the third intensity distribution is in a wavelength range above 305 nm and below 325 nm. Furthermore, the so-called intensity here means an intensity with an index value greater than 0. That is, the light irradiated on the coating film in the exposure step includes the first light, the second light, and the third light, and the wavelength region of the first light is within the wavelength range of the first absorption band, and the second light The wavelength region of the light is within the wavelength range of the second absorption band, and the wavelength region of the third light is within the wavelength range of 305 nm or more and 325 nm or less. Furthermore, in the light spectrum, the area under the curve of the wavelength range shorter than 280 nm and the wavelength range up to 200 nm with respect to the area under the curve in the wavelength range of 200 nm or more and 500 nm or less and the area under the curve of the wavelength range longer than 415 nm and up to 500 nm The percentage of the total area under the curve is less than 5%. Therefore, when a coating film formed of a photosensitive resin composition is exposed to light and then developed to produce a coating film, the shape of the coating film has high resolution. When the coating film has holes, the shape of the holes of the coating film can be clearly formed. Furthermore, the "wavelength range" in the first light, the second light, and the third light also includes the case of a single wavelength such as a laser composed of monochromatic light.

When the coating film of the photosensitive resin composition is exposed to light and then developed to produce a coating film, the reason why the shape of the coating film has high resolution is presumed to be based on the following reasons.

As described above, in this embodiment, the absorption spectrum of the photopolymerization initiator (C) has a first absorption band in the wavelength range of 350 nm or more and 370 nm or less, and the light irradiated on the coating film includes the first light, The wavelength region of the first light is within the wavelength range of the first absorption band. The first light includes a wavelength that is in the wavelength range of 350 nm or more and 370 nm or less and that overlaps the wavelength of the first absorption band. Therefore, the photopolymerization initiator (C) absorbs light in the wavelength range of 350 nm or more and 370 nm or less in the coating film, and can start the photopolymerization reaction. Thereby, the photopolymerization initiator (C) is effectively activated by the light irradiated on the coating film, and it becomes easy to promote the reaction of the entire photosensitive resin composition. Therefore, it is considered that light having a wavelength of 350 nm or more and 370 nm or less contributes to the reactivity of the entire photosensitive resin composition and can improve the reactivity of the photosensitive resin composition. In one aspect of this embodiment, the light irradiated on the coating film includes i-rays with a wavelength of 365 nm, and the first intensity distribution has an intensity at a wavelength of 365 nm. That is, the first light may include light having a wavelength of 365 nm.

Also, as described above, the absorption spectrum of the photopolymerization initiator (C) has a second absorption band in a wavelength range longer than 370 nm and 415 nm or less, and the light irradiated on the coating film includes the second light, and The wavelength region of the second light is within the wavelength range of the second absorption band. The second light includes a wavelength that is in a wavelength range longer than 370 nm and 415 nm or less and overlaps the wavelength of the second absorption band. Therefore, the photopolymerization initiator (C) absorbs light in a wavelength range longer than 370 nm and 415 nm or less in the coating film, and can start the photopolymerization reaction. Therefore, it is considered that good curability can be achieved particularly in the deep part of the coating film of the photosensitive resin composition. In addition, the photopolymerization initiator (C) absorbs light having a wavelength of 350 nm or more and 370 nm or less as described above, thereby exhibiting a photobleaching effect. That is, it can also act in a way to improve the penetration of light of a wavelength that can effectively act on deep curing. In addition, it is considered that the deep curability of the coating film of the photosensitive resin composition can be improved by this.

In particular, it is preferable that the second absorption band includes at least an absorption band in a wavelength range longer than 400 nm and 415 nm or less, and the second light includes at least light in a wavelength range longer than 400 nm and 415 nm or less. At this time, the photopolymerization initiator (C) absorbs light in the wavelength range longer than 400 nm and 415 nm or less in the coating film, and can start the photopolymerization reaction. Thereby, it is possible to achieve better curability in the deep part of the coating film of the photosensitive resin composition.

Furthermore, the light irradiated on the coating film of the photosensitive resin composition has a third intensity distribution in the wavelength range of 305 nm or more and 325 nm or less. That is, the light irradiated on the coating film of the photosensitive resin composition includes the third light, and the wavelength region of the third light is within the wavelength range of 305 nm or more and 325 nm or less. Therefore, it is considered that the surface curability of the coating film of the photosensitive resin composition can be improved. This is considered to be because the carboxyl group-containing resin (A) in the photosensitive resin composition absorbs light in the wavelength range of 305 nm or more and 325 nm or less, so that the photopolymerization reaction can be initiated by photosensitization or the like. In addition, light with a wavelength of 305 nm or more and 325 nm or less is originally easily scattered in the coating film. However, as mentioned above, the carboxyl group-containing resin (A) absorbs this light, so it is difficult to cause light scattering in the coating film. Therefore, it is considered that the resolution can be made less likely to decrease.

In particular, when the absorption spectrum of the photopolymerization initiator (C) further has a third absorption band in a wavelength range of 305 nm or more and 325 nm or less, and the third light includes at least light in a wavelength range of 305 nm or more and 325 nm or less. In other words, when the wavelength region of the third light is within the wavelength range of the third absorption band, the photopolymerization initiator (C) can start the photopolymerization reaction by absorbing light with a wavelength of 305nm or more and 325nm or less. . Therefore, it is particularly easy to improve the surface hardenability of the coating film. Furthermore, since scattering of light with a wavelength of 305 nm or more and 325 nm or less in the coating film is less likely to occur, it is less likely to cause a decrease in the resolution of the photopolymerization initiator (C).

Furthermore, as described above, in the spectrum of the light irradiated on the coating film, the area under the curve in the wavelength range from 200 nm to 500 nm is shorter than 280 nm and the area under the curve in the wavelength range up to 200 nm is shorter than 415 nm. The total percentage of the area under the curve in the long wavelength range up to 500 nm is 5% or less. Therefore, it is possible to suppress the light in the wavelength range from being scattered in the coating film of the photosensitive resin composition. With this, in the coating film of the photosensitive resin composition, it is possible to make it difficult to reduce the resolution due to light scattering. Therefore, when, for example, a photolithography method is used to produce a film having holes from a photosensitive resin composition, it is difficult to adversely affect the shape of the holes.

Thus, in this embodiment, when the coating film of the photosensitive resin composition is exposed to light, it is irradiated with light of a specific wavelength. Therefore, it becomes difficult to be irradiated with light of unnecessary wavelengths during reaction or curing. Therefore, the photosensitive resin The shape of the coating film of the composition can have high resolution.

Each component constituting the photosensitive resin composition in this embodiment will be described in detail. In addition, in the following description, "(meth)acrylic acid" means at least one of "acrylic acid" and "methacrylic acid". For example, (meth)acrylate means at least one of acrylate and methacrylate.

The carboxyl group-containing resin (A) preferably contains a carboxyl group-containing resin having an ethylenically unsaturated group. At this time, the carboxyl group-containing resin (A) has photoreactivity. Therefore, the carboxyl group-containing resin (A) and the unsaturated compound (B) can impart photosensitivity to the photosensitive resin composition together, and specifically, can impart ultraviolet curability.

The carboxyl group-containing resin (A) preferably contains a carboxyl group-containing resin having an aromatic ring. In this case, it is possible to impart high heat resistance and high insulation reliability to the cured product of the photosensitive resin composition. In addition, because it has an aromatic ring, the absorption spectrum of the carboxyl group-containing resin (A) absorbs in the wavelength range of 305nm or more and 325nm or less. Therefore, it is particularly difficult to cause light scattering in the coating film during exposure. Improve resolution.

The carboxyl group-containing resin (A) more preferably includes a carboxyl group-containing resin having a polycyclic aromatic ring which is any one of a biphenyl skeleton, a naphthalene skeleton, a stilbene skeleton, and an anthracene skeleton. Since the carboxyl group-containing resin (A) contains any one of a biphenyl skeleton, a naphthalene skeleton, a stilbene skeleton, and an anthracene skeleton, a polycyclic aromatic ring can impart higher heat resistance and reliable insulation to the cured product of the photosensitive resin composition Sex. In addition, at this time, since the absorption spectrum of the carboxyl group-containing resin (A) has a particularly large absorption in the wavelength range of 305 nm or more and 325 nm or less, it is less likely to cause light scattering in the coating film during exposure. In particular, the resolution can be improved. The carboxyl group-containing resin (A) further preferably contains a carboxyl group-containing resin (A1) having a bisphenol sulfide skeleton. At this time, because of the bisphenol sulfide skeleton, the absorption spectrum of the carboxyl group-containing resin (A1) can have a particularly large absorption in the wavelength range of 305nm or more and 325nm or less, so it can be particularly difficult to cause light scattering during exposure. It can further make the degradation of resolution less likely to occur. Thereby, when the coating film of the photosensitive resin composition is exposed to light and then developed to produce a coating film, the shape of the coating film has higher resolution. Therefore, for example, when a photolithography method is used to produce a film having holes from a photosensitive resin composition, it is difficult to adversely affect the shape of the holes. In addition, in this case, it is possible to impart higher heat resistance and insulation reliability to the cured product of the photosensitive resin composition.

A carboxyl group-containing resin (A1) having a bisphenol sulfide skeleton, for example, a reactant containing an intermediate and an acid anhydride (a3), the intermediate being a reactant of an epoxy compound (a1) and a carboxylic acid (a2), the epoxy compound (a1) It has a bisphenol phenol skeleton represented by the following formula (1), and the carboxylic acid (a2) contains an unsaturated group-containing carboxylic acid (a2-1). In the formula (1), R ₁ to R ₈ are each independently hydrogen, an alkyl group having 1 to 5 carbon atoms, or halogen. The carboxyl group-containing resin (A1) is synthesized by the following method: an epoxy compound (a1) having a bisphenol phenol skeleton (S1) represented by the following formula (1) and an epoxy compound (a1) containing an unsaturated group-containing carboxylic acid It is obtained by reacting the carboxylic acid (a2) of (a2-1), and reacting the intermediate obtained thereby with the acid anhydride (a3).

Each of R ₁ to R ₈ in formula (1) may be hydrogen, or may be an alkyl group having 1 to 5 carbon atoms or halogen. This is due to the following reasons: even if the hydrogen in the aromatic ring is substituted by a low molecular weight alkyl or halogen, it will not adversely affect the physical properties of the carboxyl group-containing resin (A1), and sometimes it may be improved. The heat resistance or flame retardancy of the cured product of the photosensitive resin composition of the carboxyl group-containing resin (A1).

If the carboxyl group-containing resin (A1) has a bisphenol skeleton derived from the epoxy compound (a1), it can impart high heat resistance and high insulation reliability to the cured product of the photosensitive resin composition containing the carboxyl group-containing resin (A1) .

The carboxyl group-containing resin (A1) will be explained more specifically. In order to synthesize the carboxyl group-containing resin (A1), first, at least a part of the epoxy group in the epoxy compound (a1) having a bisphenol sulfide skeleton represented by the formula (1) is combined with an unsaturated group-containing carboxylic acid The carboxylic acid (a2) of (a2-1) reacts to synthesize an intermediate. The synthesis of intermediates is defined as the first reaction. The intermediate has a secondary hydroxyl group, which is generated by the ring-opening addition reaction of an epoxy group and a carboxylic acid (a2) containing an unsaturated group-containing carboxylic acid (a2-1). Then, the secondary hydroxyl group in the intermediate is reacted with acid anhydride (a3). Thereby, the carboxyl group-containing resin (A1) can be synthesized. The reaction of the intermediate and acid anhydride (a3) is defined as the second reaction. The acid anhydride (a3) may include acid monoanhydride or acid dianhydride. The so-called acid-anhydride is a compound with one acid anhydride group, which is formed by dehydration and condensation of two carboxyl groups in one molecule. The so-called acid dianhydride is a compound with two acid anhydride groups, which is formed by dehydration and condensation of 4 carboxyl groups in one molecule.

The carboxyl group-containing resin (A1) may contain unreacted components in the intermediate. Moreover, when the acid anhydride (a3) contains acid monoanhydride and acid dianhydride, the carboxyl group-containing resin (A1), in addition to the components in the intermediate, the components in the acid mono anhydride, and the reactant of the components in the acid dianhydride, also It may contain any one or two of the following reactants: the reactant of the component in the intermediate and the component in the acid monoanhydride, and the reactant of the component in the intermediate and the component in the acid dianhydride. That is, the carboxyl group-containing resin (A1) may be a mixture containing a plurality of compounds with different structures.

The carboxyl group-containing resin (A1) has photoreactivity by having an ethylenically unsaturated group derived from an unsaturated group-containing carboxylic acid (a2-1). Therefore, the carboxyl group-containing resin (A1) can impart photosensitivity to the photosensitive resin composition, specifically, can impart ultraviolet curability. Furthermore, because the carboxyl group-containing resin (A1) has a carboxyl group derived from the acid anhydride (a3), it can impart developability to the photosensitive resin composition by an alkaline aqueous solution containing an alkali metal salt and an alkali metal hydrogen. At least one of oxides.

The weight average molecular weight of the carboxyl group-containing resin (A1) is preferably in the range of 700 or more and 10,000 or less. If the weight average molecular weight is 700 or more, the insulation of the cured product of the photosensitive resin composition can be improved, and the dielectric tangent loss can be reduced. In addition, if the weight average molecular weight is 10,000 or less, the developability of the photosensitive resin composition by the alkaline aqueous solution can be particularly improved. The weight average molecular weight is more preferably 900 or more, particularly preferably 1,000 or more. In addition, the weight average molecular weight is more preferably in the range of 8,000 or less, and particularly preferably in the range of 5,000 or less.

The polydispersity of the carboxyl group-containing resin (A1) is preferably in the range of 1.0 or more and 4.8 or less. In this case, it is possible to impart excellent developability to the photosensitive resin composition while ensuring good insulation reliability of the cured product formed of the photosensitive resin composition. The polydispersity of the carboxyl group-containing resin (A1) is more preferably 1.1 or more and 4.0 or less, and still more preferably 1.2 or more and 2.8 or less.

The number average molecular weight and molecular weight distribution of the above-mentioned carboxyl-containing resin (A1) can be achieved by the carboxyl-containing resin (A1) being a mixture of appropriately containing multiple components, which are: unreacted components in the intermediate; The reactant of the component in the intermediate, the component in the acid monoanhydride, and the component in the acid dianhydride; the reactant of the component in the intermediate and the component in the acid monoanhydride; and, the component in the intermediate and the acid dianhydride The reactant of the ingredients in. More specifically, it can be achieved by controlling parameters such as: the average molecular weight of the epoxy compound (a1), the amount of acid monoanhydride relative to the epoxy compound (a1), and acid dianhydride relative to the epoxy compound (a1). The amount of compound (a2).

Furthermore, the polydispersity is the ratio (Mw/Mn) of the weight average molecular weight (Mw) of the carboxyl group-containing resin (A1) to the number average molecular weight (Mn).

The solid acid value of the carboxyl group-containing resin (A1) is preferably in the range of 60 mg KOH/g or more and 140 mg KOH/g or less. In this case, especially the developability of the photosensitive resin composition can be improved. The solid content acid value is more preferably within a range of 80 mg KOH/g or more and 135 mg KOH/g or less, and still more preferably within a range of 90 mg KOH/g or more and 130 mg KOH/g or less.

The molecular weight of the carboxyl group-containing resin (A1) can be adjusted by crosslinking with acid dianhydride. At this time, a carboxyl group-containing resin (A1) with adjusted acid value and molecular weight can be obtained. That is, by controlling the amount of acid dianhydride contained in the acid anhydride (a3), the molecular weight and acid value of the carboxyl group-containing resin (A1) can be easily adjusted. In addition, the molecular weight of the carboxyl group-containing resin (A1) can be calculated from the results of molecular weight measurement by Gel Permeation Chromatography (GPC) under the following conditions. GPC device: SHODEX SYSTEM 11 manufactured by Showa Denko Corporation; Column: Four series of SHODEX KF-800P, KF-005, KF-003, KF-001; Mobile phase: tetrahydrofuran (THF); Flow rate: 1mL/min; Column temperature: 45℃; Detector: refractive index (RI); Conversion: Polystyrene.

The raw materials of the carboxyl group-containing resin (A1) and the reaction conditions when synthesizing the carboxyl group-containing resin (A1) are explained in detail.

The epoxy compound (a1) has a structure represented by the following formula (2), for example. N in the formula (2) is, for example, an integer in the range of 0-20. In order to make the molecular weight of the carboxyl group-containing resin (A1) an appropriate value, the average of n is particularly preferably in the range of 0 to 1. As long as the average of n is in the range of 0 to 1, especially when the acid anhydride (a3) contains acid dianhydride, it still becomes possible to easily control an excessive increase in molecular weight.

The carboxylic acid (a2) includes an unsaturated group-containing carboxylic acid (a2-1). The carboxylic acid (a2) may contain only the unsaturated group-containing carboxylic acid (a2-1). Alternatively, the carboxylic acid (a2) may include an unsaturated group-containing carboxylic acid (a2-1) and a carboxylic acid other than the unsaturated group-containing carboxylic acid (a2-1).

The unsaturated group-containing carboxylic acid (a2-1) can contain, for example, a compound having only one ethylenically unsaturated group. More specifically, the unsaturated group-containing carboxylic acid (a2-1), for example, can contain one or more selected from the group consisting of acrylic acid, methacrylic acid, and ω-carboxy-polycaprolactone ( n≒2) Monoacrylate, crotonic acid, cinnamic acid, 2-propenoxyethyl succinate, 2-methacryloxyethyl succinate, 2-propenoxyethyl phthalate , 2-methacryloxyethyl phthalate, 2-propenoxypropyl phthalate, 2-methacryloxypropyl phthalate, 2-propylene maleate Acetyloxyethyl, 2-methacryloxyethyl maleate, β-carboxyethyl acrylate, 2-propenoxyethyl tetrahydrophthalate, 2- tetrahydrophthalate Methacryloxyethyl, hexahydrophthalic acid 2-methacryloxyethyl, and hexahydrophthalic acid 2-methacryloxyethyl. Preferably, the unsaturated group-containing carboxylic acid (a2-1) contains acrylic acid.

The carboxylic acid (a2) may include a polybasic acid (a2-2). The polybasic acid (a2-2) is an acid in which two or more hydrogen atoms in one molecule can be replaced by metal atoms. The polybasic acid (a2-2) preferably has two or more carboxyl groups. At this time, the epoxy compound (a1) reacts with both the unsaturated group-containing carboxylic acid (a2-1) and the polybasic acid (a2-2). The polybasic acid (a2-2) can crosslink the epoxy groups present in the molecules of the two epoxy compounds (a1), thereby obtaining an increase in molecular weight. Thereby, the insulation of the cured product can be improved, and the dielectric tangent loss can be reduced.

The polybasic acid (a2-2) preferably contains a dicarboxylic acid. The polybasic acid (a2-2) can contain, for example, one or more selected from the group consisting of the following compounds: 4-cyclohexene-1,2-dicarboxylic acid, oxalic acid, malonic acid, succinic acid, and glutaric acid , Adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, terephthalic acid. Preferably, the polybasic acid (a2-2) contains 4-cyclohexene-1,2-dicarboxylic acid.

When reacting the epoxy compound (a1) with the carboxylic acid (a2), an appropriate method can be adopted. For example, the carboxylic acid (a2) is added to the solvent solution of the epoxy compound (a1), and the thermal polymerization inhibitor and the catalyst are further added as necessary and stirred and mixed to obtain a reactive solution. The reaction of the reactive solution at a temperature of preferably 60°C or higher and 150°C or lower, and particularly preferably 80°C or higher and 120°C or lower, can be used to obtain an intermediate. The solvent may contain, for example, at least one selected from the group consisting of the following components: ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene and xylene; ethyl acetate, acetic acid Butyl ester, cellulose acetate, butyl cellulose acetate, carbitol acetate, butyl carbitol acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl Acetate esters such as base ether acetate; and dialkyl glycol ethers. The thermal polymerization inhibitor contains, for example, at least one of hydroquinone and hydroquinone monomethyl ether. The catalyst can contain, for example, at least one selected from the group consisting of the following components: tertiary amines such as benzyldimethylamine and triethylamine; trimethylbenzylammonium chloride, methyl chloride Quaternary ammonium salts such as triethylammonium; triphenylphosphine; and, triphenylphosphine.

The catalyst particularly preferably contains triphenylphosphine. That is, it is preferable to react the epoxy compound (a1) and the carboxylic acid (a2) in the presence of triphenylphosphine. In this case, the ring-opening addition reaction of the epoxy group in the epoxy compound (a1) and the carboxylic acid (a2) can be promoted, and a reaction rate of 95% or more, 97% or more, or approximately 100% can be achieved ( Conversion rates). In addition, the occurrence of ion migration can be suppressed in the layer containing the cured product of the photosensitive resin composition, and the insulation of the layer containing the cured product can be improved.

When the epoxy compound (a1) and the carboxylic acid (a2) are reacted, the amount of the carboxylic acid (a2) is preferably 0.5 mol or more with respect to 1 mol of epoxy group of the epoxy compound (a1) Within the range of 1.2 mol or less. In this case, the excellent photosensitivity and stability of the photosensitive resin composition can be obtained. From the same viewpoint, the amount of the unsaturated group-containing carboxylic acid (a2-1) is preferably 0.5 mol or more and 1.2 mol or less relative to 1 mol of epoxy group of the epoxy compound (a1) In the range. Alternatively, when the carboxylic acid (a2) contains a carboxylic acid other than the unsaturated group-containing carboxylic acid (a2-1), the unsaturated group-containing carboxylic acid ( The amount of a2-1) may be in the range of 0.5 mol or more and 0.95 mol or less. In addition, when the carboxylic acid (a2) contains the polybasic acid (a2-2), the amount of the polybasic acid (a2-2) is preferably 0.025 mol relative to 1 mol of epoxy group of the epoxy compound (a1). In the range of more than ear and 0.25 mol or less. In this case, excellent photosensitivity and stability of the photosensitive resin composition can be obtained.

It is preferable to react the epoxy compound (a1) and the carboxylic acid (a2) under air bubbling. In this case, the addition polymerization reaction of the unsaturated group can be suppressed, and the increase in the molecular weight of the intermediate and the gelation of the intermediate solution can be suppressed. In addition, it is possible to suppress excessive coloration of the final product, which is the carboxyl group-containing resin (A1).

The intermediate obtained in this way has a hydroxyl group, which is produced by reacting the epoxy group in the epoxy compound (a1) with the carboxyl group in the carboxylic acid (a2).

The acid anhydride (a3) preferably contains acid monoanhydride (a3-1). Acid monoanhydride (a3-1) is a compound having one acid anhydride group.

The acid monoanhydride can contain an anhydride of a dicarboxylic acid. The acid monoanhydride can contain, for example, one or more selected from the group consisting of the following compounds: 1,2,3,6-tetrahydrophthalic anhydride, phthalic anhydride, succinic anhydride, methyl succinic anhydride , Maleic anhydride, citraconic anhydride, glutaric anhydride, itaconic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, hexahydrophthalic anhydride, cyclohexane-1,2,4 -Tricarboxylic acid-1,2-anhydride and methylhexahydrophthalic anhydride. In particular, the acid monoanhydride preferably contains 1,2,3,6-tetrahydrophthalic anhydride. In this case, it is possible to improve the insulation properties of the cured photosensitive resin composition while ensuring good developability of the photosensitive resin composition. Relative to the whole acid monoanhydride, 1,2,3,6-tetrahydrophthalic anhydride is preferably in the range of 20 mol% or more and 100 mol% or less, more preferably 40 mol% or more It is within the range of 100 mol% or less, but it is not limited to this.

The acid anhydride (a3) preferably contains acid dianhydride. Acid dianhydride is a compound having two acid anhydride groups. The acid dianhydride can contain the anhydride of tetracarboxylic acid. The acid dianhydride can contain, for example, at least one selected from the group consisting of the following compounds: 1,2,4,5-benzenetetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, methyl ring Hexenetetracarboxylic dianhydride, tetracarboxylic dianhydride, naphthalene-1,4,5,8-tetracarboxylic dianhydride, ethylenetetracarboxylic dianhydride, 9,9'-bis(3,4- Dicarboxybenzene) dianhydride, glycerine bisanhydrotrimellitate monoacetate, ethylene glycol bistrimellitic anhydride, 3,3',4,4'-diphenyl tetracarboxylic dianhydride, 1,3 ,3a,4,5,9b-hexahydro-5(tetrahydro-2,5-dioxo-3-yl)naphtho-[1,2-c]furan-1,3-dione, 1, 2,3,4-butanetetracarboxylic dianhydride and 3,3',4,4'-biphenyltetracarboxylic dianhydride. The acid dianhydride preferably contains an acid dianhydride having an aromatic ring. In particular, the acid dianhydride preferably contains 3,3',4,4'-biphenyltetracarboxylic dianhydride. In this case, while ensuring good developability of the photosensitive resin composition, the insulation of the cured product of the photosensitive resin composition can be improved. In addition, the transparency of the photosensitive resin composition can be improved, and the resolution accompanying the transparency can be improved. The amount of 3,3',4,4'-biphenyltetracarboxylic dianhydride relative to the entire acid dianhydride (a3-2) is preferably in the range of 20 mol% or more and 100 mol% or less, More preferably, it is in the range of 40 mol% or more and 100 mol% or less, but it is not limited to this.

In order to react the intermediate and acid anhydride (a3), an appropriate method can be adopted. For example, the acid anhydride (a3) is added to the solvent solution of the intermediate, and the thermal polymerization inhibitor and the catalyst are further added as necessary, and stirred and mixed, thereby obtaining a reactive solution. According to a general method, the reactive solution is reacted at a temperature of more preferably 60°C or higher and 150°C or lower, and particularly preferably 80°C or higher and 120°C or lower, thereby obtaining the carboxyl group-containing resin (A1). As the solvent, catalyst, and polymerization inhibitor, appropriate components can be used, and the solvent, catalyst, and polymerization inhibitor used in the synthesis of the intermediate can be directly used.

The catalyst particularly preferably contains triphenylphosphine. That is, it is preferable to react the intermediate and acid anhydride (a3) in the presence of triphenylphosphine. In this case, the reaction between the secondary hydroxyl group in the intermediate and the acid anhydride (a3) can be particularly promoted, and a reaction rate (conversion rate) of 90% or more, 95% or more, 97% or more, or approximately 100% can be achieved. In addition, ion migration can be suppressed in the layer containing the cured product of the photosensitive resin composition, and the insulation of the layer containing the cured product can be further improved.

It is preferable to react the intermediate and acid anhydride (a3) under air bubbling. In this case, it is possible to prevent the molecular weight of the carboxyl group-containing resin (A1) produced from becoming excessively large, and thereby it is possible to particularly improve the developability of the photosensitive resin composition by the alkaline aqueous solution.

The carboxyl group-containing resin (A) may include a carboxyl group-containing resin having an aromatic ring and not having photopolymerization properties. The carboxyl group-containing resin which has an aromatic ring and does not have photopolymerization properties, for example, contains a polymer of an ethylenically unsaturated monomer containing an ethylenically unsaturated compound having a carboxyl group. The ethylenically unsaturated compound with carboxyl group can contain, for example, acrylic acid, methacrylic acid, ω-carboxy-polycaprolactone (n≒2) monoacrylate, phthalic acid 2-(meth)acryloyloxy group Compounds such as ethyl ester, 2-(meth)acryloyloxyethyl 2-hydroxyethyl phthalate. The ethylenically unsaturated compound having a carboxyl group can also contain reactants of pentaerythritol triacrylate, pentaerythritol trimethacrylate, etc. and dibasic acid anhydride. The ethylenically unsaturated monomer may further contain, for example, linear or branched aliphatic or alicyclic (wherein, a part of the ring may have an unsaturated bond) (meth)acrylate and other ethylenic monomers that do not have a carboxyl group. Saturated compound.

The carboxyl group-containing resin (A) may contain a carboxyl group-containing resin other than the carboxyl group-containing resin (A1), that is, it may contain a carboxyl group-containing resin that does not have a bisphenol skeleton (hereinafter, also referred to as carboxyl group-containing resin (A2)).

The carboxyl group-containing resin (A2) can contain, for example, a compound having a carboxyl group but not having photopolymerization properties (hereinafter, also referred to as (A2-1) component). The component (A2-1) is, for example, a polymer containing an ethylenically unsaturated monomer, and the ethylenically unsaturated monomer contains an ethylenically unsaturated compound having a carboxyl group. The ethylenically unsaturated compound having a carboxyl group can contain compounds such as acrylic acid, methacrylic acid, and ω-carboxy-polycaprolactone (n≒2) monoacrylate. The ethylenically unsaturated compound having a carboxyl group can also contain reactants of pentaerythritol triacrylate, pentaerythritol trimethacrylate, etc. and dibasic acid anhydride. The ethylenically unsaturated monomer may further include an ethylenically unsaturated monomer that does not have a carboxyl group. The ethylenically unsaturated monomer that does not have a carboxyl group is 2-(meth)acryloyloxyethyl phthalate, 2-(meth)propenyloxyethyl-2-hydroxyethyl phthalate, linear or branched aliphatic or cycloaliphatic (wherein the ring may partially have unsaturated bonds) (former Base) acrylate and the like.

The carboxyl group-containing resin (A2) may also contain a compound having a carboxyl group and an ethylenically unsaturated group (hereinafter, also referred to as (A2-2) component). In addition, the carboxyl group-containing resin (A2) may contain only the component (A2-2). The component (A2-2) contains, for example, a resin (called the first resin (x)) which is an intermediate and reacts with at least one compound (x3) selected from the group of polycarboxylic acids and anhydrides thereof The intermediate is a reaction product of an epoxy compound (x1) and an ethylenically unsaturated compound (x2), and the epoxy compound (x1) has two or more epoxy groups in one molecule. The first resin (x) can be obtained, for example, by adding compound (x3) to an intermediate, which is obtained by combining the epoxy group in the epoxy compound (x1) and the carboxyl group in the ethylenically unsaturated compound (x2) Obtained by reaction. The epoxy compound (x1) can contain an appropriate epoxy compound such as a cresol novolak type epoxy resin, a phenol novolak type epoxy resin, and a biphenol novolak type epoxy resin. In particular, the epoxy compound (x1) preferably contains at least one compound selected from the group of a biphenol novolak type epoxy resin compound and a cresol novolak type epoxy compound. The epoxy compound (x1) may contain only a biphenol novolak type compound, or may contain only a cresol novolak type epoxy compound. At this time, because the epoxy compound (x1) contains an aromatic ring in the main chain, the cured product of the photosensitive resin composition, for example, can reduce the degree of significant corrosion caused by oxidizing agents such as potassium permanganate. . The epoxy compound (x1) may contain a polymer of the ethylenically unsaturated compound (z). The ethylenically unsaturated compound (z) contains, for example, a compound (z1) having an epoxy group such as glycidyl (meth)acrylate, or further contains 2-(meth)acryloyloxyethyl phthalate, etc. Compound without epoxy group (z2). The ethylenically unsaturated compound (x2) preferably contains at least one of acrylic acid and methacrylic acid. The compound (x3) contains, for example, one or more compounds selected from the group consisting of polycarboxylic acids and acid anhydrides of these polycarboxylic acids, and the polycarboxylic acids are phthalic acid, tetrahydrophthalic acid, methane Tetrahydrophthalic acid and so on. In particular, the compound (x3) preferably contains at least one polycarboxylic acid selected from the group of phthalic acid, tetrahydrophthalic acid, and methyltetrahydrophthalic acid.

The component (A2-2) may also contain a resin (called the second resin (y)) which is a reaction product of a polymer of an ethylenically unsaturated monomer and an ethylenically unsaturated compound having an epoxy group. The ethylenically unsaturated monomer contains an ethylenically unsaturated compound having a carboxyl group. The ethylenically unsaturated monomer may further contain an ethylenically unsaturated compound that does not have a carboxyl group. The second resin (y) is obtained by reacting a part of the carboxyl group in the polymer with an ethylenically unsaturated compound having an epoxy group. The ethylenically unsaturated monomer may further contain an ethylenically unsaturated compound that does not have a carboxyl group. The ethylenically unsaturated compound having a carboxyl group includes compounds such as acrylic acid, methacrylic acid, ω-carboxy-polycaprolactone (n≒2) monoacrylate, pentaerythritol triacrylate, and pentaerythritol trimethacrylate. An ethylenically unsaturated compound that does not have a carboxyl group, such as 2-(meth)acryloyloxyethyl phthalate, 2-(meth)acryloyloxyethyl-2-hydroxyethyl phthalate Compounds such as esters, linear or branched aliphatic or cycloaliphatic (wherein the ring may partially have unsaturated bonds) (meth)acrylates. The ethylenically unsaturated compound having an epoxy group preferably contains glycidyl (meth)acrylate.

The carboxyl group-containing resin (A) may contain only the carboxyl group-containing resin (A1), may contain only the carboxyl group-containing resin (A2), or may contain the carboxyl group-containing resin (A1) and the carboxyl group-containing resin (A2). In order to obtain high transparency of the photosensitive resin composition and to reduce the dielectric tangent loss of the cured product of the photosensitive resin composition, the carboxyl group-containing resin (A) preferably contains 30% by mass or more of the carboxyl group-containing resin (A1), It is more preferably 60% by mass or more, and still more preferably 100% by mass.

The content of the carboxyl group-containing resin (A) relative to the solid content of the photosensitive resin composition is preferably in the range of 5 mass% to 85% by mass, more preferably 10 mass% to 75 mass% It is more preferably within the range of 26% by mass or more and 60% by mass or less, and particularly preferably within the range of 30% by mass or more and 45% by mass or less. In addition, the solid content is the total amount of total components obtained by removing volatile components such as solvents from the photosensitive resin composition.

The solid acid value of the carboxyl group-containing resin (A) is preferably in the range of 40 mg KOH/g or more and 160 mg KOH/g or less. In this case, especially the stability of the photosensitive resin composition can be improved. The acid value of the solid component is more preferably in the range of 60 mg KOH/g or more and 140 mg KOH/g or less, more preferably in the range of 80 mg KOH/g or more and 135 mg KOH/g or less, and particularly preferably 90 mg KOH /g or more and 130mg KOH/g or less.

The unsaturated compound (B) has at least one ethylenically unsaturated bond in one molecule. The unsaturated compound (B) can impart photocurability to the photosensitive resin composition. The unsaturated compound (B) can contain, for example, at least one compound selected from the group consisting of monofunctional (meth)acrylate and polyfunctional (meth)acrylate, and the monofunctional (meth)acrylate is ( 2-hydroxyethyl meth)acrylate, etc. The multifunctional (meth)acrylate is diethylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, trimethylol Propane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ε-hexane Lactone is used to modify dipentaerythritol hexaacrylate, tricyclodecane dimethanol di(meth)acrylate, etc.

In particular, the unsaturated compound (B) preferably contains a trifunctional compound, that is, a compound having 3 unsaturated bonds in one molecule. In this case, the resolution at the time of exposing and developing the coating film formed of the photosensitive resin composition can be improved, and in particular, the developability of the photosensitive resin composition by the alkaline aqueous solution can be improved. The trifunctional compound can contain, for example, at least one selected from the group consisting of the following compounds: trimethylolpropane tri(meth)acrylate, EO modified trimethylolpropane tri(meth)acrylate , Pentaerythritol tri(meth)acrylate, ethoxylated isocyanurate tri(meth)acrylate and ε-caprolactone modified ginseng-(2-propenoxyethyl) trimeric isocyanate and Base) ethoxylated glycidyl acrylate.

The unsaturated compound (B) preferably contains a phosphorus-containing compound (a phosphorus-containing unsaturated compound). In this case, the flame retardancy of the cured product of the photosensitive resin composition can be improved. The phosphorus-containing unsaturated compound can contain, for example, at least one selected from the group consisting of the following compounds: 2-methacryloxyethyl acid phosphate (a specific example is a model manufactured by Kyoeisha Chemical Co., Ltd. LIGHT ESTER P-1M, and LIGHT ESTER P-2M), 2-propenoxyethyl acid phosphate (as a specific example, LIGHT ACRYLATE P-1A manufactured by Kyoeisha Chemical Co., Ltd.), diphenyl phosphate 2-methacryloyloxyethyl (as a specific example, the model MR-260 manufactured by Dahachi Industry Co., Ltd.), and the HFA series manufactured by Showa Polymer Co., Ltd. (as a specific example, dipentaerythritol six The addition reactants of acrylate and HCA (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide), namely models HFA-6003 and HFA-6007; two modified caprolactone The addition reactants of pentaerythritol hexaacrylate and HCA (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) are models HFA-3003 and HFA-6127, etc.).

The unsaturated compound (B) may also contain a prepolymer. The prepolymer can contain, for example: a prepolymer obtained by polymerizing a monomer having an ethylenically unsaturated bond and then adding an ethylenically unsaturated group; and, prepolymerized from an oligomeric (meth)acrylate At least one compound in the group consisting of species. The oligo(meth)acrylate prepolymers can contain, for example, at least one selected from the group consisting of the following components: epoxy (meth)acrylate, polyester (meth)acrylate, amine Urethane (meth)acrylate, alkyd resin (meth)acrylate, silicone resin (meth)acrylate, and spirane resin (meth)acrylate.

The unsaturated compound (B) may contain an unsaturated compound (B1) having a bisphenol phenol skeleton. The unsaturated compound (B1), for example, can be selected from the group consisting of bisphenoxyethanol pyrene, bisphenoxy pyridinium dimethacrylate and 9,9-bis[4-(2-propenyloxyethoxy)benzene At least one ingredient in the group consisting of 基]茀. Specific product examples of unsaturated compounds (B1) are: product name A-BPEF manufactured by Shinnakamura Chemical Industry Co., Ltd., product name TBIS-G and TBIS-MPN manufactured by Taoka Chemical Industry Co., Ltd., and Osaka Gas Chemical Co., Ltd. The company's product names are EA-200 and EA-1000.

The absorption spectrum of the photopolymerization initiator (C), as described above, has a first absorption band in a wavelength range of 350 nm or more and 370 nm or less, and a second absorption band in a wavelength range longer than 370 nm and 415 nm or less. Therefore, when the coating film of the photosensitive resin composition is exposed to produce a coating film, the photopolymerization initiator (C) can contribute to improving the deep part curability of the coating film. In particular, it is preferable that the second absorption band includes at least an absorption band in a wavelength range of 400 nm or more and 415 nm or less. At this time, when the coating film of the photosensitive resin composition is exposed to produce a coating film, it can contribute to the improvement of the deep part curability of the coating film. In addition, in this embodiment, the so-called absorption spectrum of the photopolymerization initiator (C) "has an absorption band" in a specific wavelength range means that in the absorption spectrum of the photopolymerization initiator (C), " The area under the curve in the specific wavelength range is 2% or more with respect to the area under the curve in the wavelength range of 350 nm or more and 370 nm or less of the photopolymerization initiator (C)." For example, the absorption spectrum of the photopolymerization initiator (C) "has an absorption band in the wavelength range greater than 370nm and 415nm", which means: the photopolymerization initiator (C) "will absorb more than 370nm and 415nm Light in the following wavelength range", and in the absorption spectrum of the photopolymerization initiator (C), "the area under the curve in the wavelength range from 350nm to 370nm to the photopolymerization initiator (C) is greater than 370nm The area under the curve for the wavelength range above and below 415 nm is 2% or more.” Hereinafter, the definition is the same in each wavelength range in the absorption spectrum of the photopolymerization initiator (C).

The photopolymerization initiator (C) further preferably has a characteristic of absorbing light having a wavelength of 305 nm or more and 325 nm or less. That is, the light absorption spectrum of the photopolymerization initiator (C) preferably further has a third absorption band in the wavelength range of 305 nm or more and 325 nm or less. At this time, when the coating film of the photosensitive resin composition is exposed to form a coating film, the curability of the coating film surface can be further improved. Of course, the absorption spectrum of the photopolymerization initiator (C) may further have absorption bands other than the first absorption band, the second absorption band, and the third absorption band. That is, the absorption spectrum of the photopolymerization initiator (C) may have an absorption band at a wavelength less than 305 nm, or may have an absorption band at a wavelength longer than 415 nm.

The photopolymerization initiator (C) can contain an appropriate compound. In particular, the photopolymerization initiator (C) preferably contains a photopolymerization initiator (C1) selected from the group consisting of phosphine oxide-based photopolymerization initiators (C1), α-aminoalkylphenylketone photopolymerization initiators (C2), and oxime esters. It is at least one of the group consisting of photopolymerization initiator (C3). At this time, when the coating film of the photosensitive resin composition is exposed to produce a coating film, the deep curability of the coating film can be further improved. In addition, at this time, when the photosensitive resin composition is exposed with ultraviolet rays, high photosensitivity can be imparted to the photosensitive resin composition. In addition, the occurrence of ion migration can be suppressed in the layer containing the cured product of the photosensitive resin composition, and the insulation reliability of the layer can be further improved. In particular, the phosphine oxide-based photopolymerization initiator (C1) has a high photobleaching effect and a high deep curability, and can suppress the discoloration of the coating film of the photosensitive resin composition. In addition, the phosphine oxide-based photopolymerization initiator (C1) is unlikely to hinder the electrical insulation of the cured product of the photosensitive resin composition. Therefore, by exposing and curing the photosensitive resin composition, a cured product with excellent electrical insulation can be obtained, and the cured product is suitable for forming, for example, a solder resist layer, a plating resist layer, a resist layer, and an interlayer insulating layer .

The phosphine oxide-based photopolymerization initiator (C1) can contain, for example, at least one selected from the group consisting of the following components: 2,4,6-trimethylbenzyldiphenylphosphine oxide , 2,4,6-trimethylbenzylethylphenylphosphinate and other monophosphine oxide-based photopolymerization initiators; and, bis(2,6-dichlorobenzyl) Phenyl phosphine oxide, bis(2,6-dichlorobenzyl)-2,5-dimethylphenyl phosphine oxide, bis(2,6-dichlorobenzyl)-4-propylbenzene Phosphine oxide, bis(2,6-dichlorobenzyl)-1-naphthylphosphine oxide, bis(2,6-dimethoxybenzyl)phenyl phosphine oxide, bis(2,6 -Dimethoxybenzyl)-2,4,4-trimethylpentylphosphine oxide, bis(2,6-dimethoxybenzyl)-2,5-dimethylphenyl Phosphine oxide, bis(2,4,6-trimethylbenzyl)phenyl phosphine oxide, (2,5,6-trimethylbenzyl)-2,4,4-trimethylpentyl Bisacetoxyphosphine oxide-based photopolymerization initiators such as phosphine oxide. In particular, it is preferred that the acyl phosphine oxide-based photopolymerization initiator (C1) contains 2,4,6-trimethylbenzyl diphenyl phosphine oxide, and that the acyl phosphine oxide-based photopolymerization initiator ( C1) preferably contains only 2,4,6-trimethylbenzyldiphenylphosphine oxide. In this case, the coating film formed of the photosensitive resin composition can be imparted with higher deep curability.

α-Aminoalkylphenylketone-based photopolymerization initiator (C2), for example, contains at least one selected from the group consisting of the following components: 2-methyl-1-(4-methylthiophenyl) )-2-morpholinylpropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butan-1-one and 2-(dimethylamino) )-2-[(4-Tolyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone. The α-aminoalkylphenylketone-based photopolymerization initiator (C2) can impart higher deep curability to the coating film formed of the photosensitive resin composition.

The oxime ester-based photopolymerization initiator (C3) can contain, for example, at least one selected from the group consisting of the following components: 1,2-octanedione, 1-[4-(phenylthio)-, 2-(O-benzyl oxime)] and ethyl ketone, 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazol-3-yl]-,1-( O-acetoxime). The components that can be included in the oxime ester-based photopolymerization initiator (C3), as more specific product examples, include: Models Irgacure OXE 01 and Irgacure OXE 02 manufactured by BASF Co., Ltd. and ADEKA Optomer N-1919 manufactured by ADEKA Corporation , ADEKA ARKLS NCI-831 and ADEKA ARKLS NCI-930.

The absorption spectrum of the oxime ester-based photopolymerization initiator (C3) preferably has absorption in a wavelength range longer than 350 nm. In this case, since the deep part curability of the coating film formed of the photosensitive resin composition can be improved, the sensitivity of the coating film can be increased. Therefore, the photosensitive resin composition is particularly suitable for applications such as a solder resist layer, a plating resist layer, a resist layer, and an interlayer insulating layer.

The photopolymerization initiator (C) preferably contains a dehydrogenation type photopolymerization initiator (C4). At this time, when the coating film of the photosensitive resin composition is exposed to light and then developed to produce a coating film, the shape of the coating film will further have high resolution. At this time, when exposure and then development are performed to produce a film with holes, the shape of the holes can be made clearer.

The dehydrogenation type photopolymerization initiator (C4) includes, for example, a bis(dialkylamino) benzophenone-based photopolymerization initiator (C41) and a thioxanthone-based photopolymerization initiator ( C42) At least one component in the group consisting of.

Bis(dialkylamino)diphenylketone photopolymerization initiator (C41), containing, for example, 4,4'-bis(diethylamine)diphenylketone (EAB) and 4,4'-bis (Dimethylamine) at least one component in the group consisting of benzophenone. In particular, the bis(dialkylamino)benzophenone-based photopolymerization initiator (C41) preferably contains 4,4'-bis(diethylamine)benzophenone. At this time, when the coating film formed of the photosensitive resin composition is exposed to light and then developed for partial development, the resolution becomes particularly high. Therefore, a very fine pattern can be formed on the cured product of the photosensitive resin composition. In particular, when the interlayer insulating layer of a multilayer printed wiring board formed of a photosensitive resin composition is produced, and the interlayer insulating layer is provided with small-diameter holes for through holes by photolithography, precision And easy to form small pores.

The thioxanthone-based photopolymerization initiator (C42) may contain, for example, selected from 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone and 2,4 -At least one component of the group consisting of thioxanthones such as diisopropylthioxanthone.

The photopolymerization initiator (C) may contain a hydroxyketone-based photopolymerization initiator. The hydroxyketone-based photopolymerization initiator contains, for example, at least one selected from the group consisting of the following compounds: 1-hydroxycyclohexyl phenyl ketone, methyl phenylglyoxylate, 1-[4-(2- Hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropanyl ) Benzyl]phenyl}-2-methylpropan-1-one, and 2-hydroxy-2-methyl-1-phenylpropan-1-one.

The photopolymerization initiator (C) may contain only one component among the components that can be contained in the photopolymerization initiator (C) described above, or two or more components. When the photopolymerization initiator (C) contains two or more components, the light absorption characteristics of the photopolymerization initiator (C) in this embodiment can be achieved by a combination of two or more components. .

The amount of the phosphine oxide-based photopolymerization initiator (C1) relative to the total amount of the photopolymerization initiator (C) is preferably 20% by mass or more and 100% by mass or less, more preferably 50% by mass or more and 95% by mass or less. The amount of the α-aminoalkyl phenyl ketone photopolymerization initiator (C2) relative to the total amount of the photopolymerization initiator (C) is preferably 20% by mass or more and 100% by mass or less, more preferably 50 Mass% or more and 95 mass% or less. The amount of the oxime ester-based photopolymerization initiator (C3) relative to the total amount of the photopolymerization initiator (C) is preferably 1% by mass or more and 100% by mass or less, more preferably 5% by mass or more and 40% by mass %the following. In addition, the amount of the dehydrogenation type photopolymerization initiator (C4) relative to the total amount of the photopolymerization initiator (C) is preferably 1% by mass or more and 60% by mass or less, more preferably 1% by mass or more and 30% by mass or less, more preferably 1% by mass or more and 5% by mass or less.

The photosensitive resin composition may further contain a photopolymerization accelerator, a sensitizer, etc., within a range that does not deviate from the gist of the present invention. For example, the photosensitive resin composition can contain at least one selected from the group consisting of the following components: benzoin and its alkyl ethers; acetophenones such as acetophenone and benzyl dimethyl ketal ; Anthraquinones such as 2-methylanthraquinone; Diphenyl ketones such as diphenyl ketone and 4-benzyl-4'-methyl diphenyl sulfide; and, 2,4-bis Xanthones such as isopropyl xanthone. The photosensitive resin composition may contain, in addition to the photopolymerization initiator (C), a photopolymerization accelerator, a sensitizer, etc., such as a tertiary amine-based photopolymerization accelerator, and the tertiary amine-based photopolymerization accelerator is p-dimethyl Ethyl benzoate, isoamyl p-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, etc.

The epoxy compound (D) can impart thermosetting properties to the photosensitive resin composition. The epoxy compound (D) preferably contains a crystalline epoxy resin (D1). In this case, the developability of the photosensitive resin composition can be improved. Furthermore, since the organic filler (E1) contains a carboxyl group, the compatibility of the crystalline epoxy resin (D1) in the organic filler (E1) can be improved, and the crystalline epoxy resin (D1) in the photosensitive resin composition can be prevented. D1) recrystallization. In addition, the epoxy resin (D) may further contain an amorphous epoxy resin (D2). Here, "crystalline epoxy resin" is an epoxy resin having a melting point, and "amorphous epoxy resin" is an epoxy resin having no melting point.

The crystalline epoxy resin (D1) preferably contains, for example, one or more selected from the group consisting of the following components: 1,3,5-gin(2,3-epoxypropyl)-1 ,3,5-Triazabenzene-2,4,6(1H,3H,5H)-trione, hydroquinone type crystalline epoxy resin (a specific example is a product manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Name YDC-1312), biphenyl type crystalline epoxy resin (as a specific example is the trade name YX-4000 manufactured by Mitsubishi Chemical Co., Ltd.), diphenyl ether type crystalline epoxy resin (as a specific example is New Japan Model YSLV-80DE manufactured by Iron & Sumikin Chemical Co., Ltd.), bisphenol-type crystalline epoxy resin (as a specific example, it is the trade name YSLV-80XY manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), and phenol ethane crystal Epoxy resin (model GTR-1800 manufactured by Nippon Kayaku Co., Ltd. as a specific example), bisphenol phenolic crystalline epoxy resin.

The crystalline epoxy resin (D1) preferably has two epoxy groups in one molecule. In this case, the cured product can be made less likely to crack due to repeated temperature changes.

The crystalline epoxy resin (D1) preferably has an epoxy equivalent of 150 g/eq or more and 300 g/eq or less. The epoxy equivalent is the gram weight of the crystalline epoxy resin (D1) containing 1 g equivalent (gram equivalent) of epoxy groups. The crystalline epoxy resin (D1) has a melting point. As the melting point of the crystalline epoxy resin (D1), for example, 70°C or more and 180°C or less can be cited.

In particular, the epoxy resin (D) preferably contains a crystalline epoxy resin (D1-1) having a melting point of 110°C or less. In this case, especially the developability of the photosensitive resin composition by the alkaline aqueous solution can be improved. The crystalline epoxy resin (D1-1) having a melting point of 110°C or less can contain, for example, at least one selected from the group consisting of the following components: biphenyl type epoxy resin (as a specific example, Mitsubishi Chemical Co., Ltd. Manufactured model YX-4000), diphenyl ether type epoxy resin (as a specific example, Nippon Steel & Sumitomo Metal Chemical Co., Ltd. model YSLV-80DE), and bisphenol type epoxy resin (as a specific example, Nippon Steel) Model YSLV-80XY manufactured by Iron & Steel Chemical Co., Ltd., bisphenol pyridine type crystalline epoxy resin.

The amorphous epoxy resin (D2) preferably contains, for example, at least one selected from the group consisting of the following components: phenol novolac type epoxy resin (as a specific example, the model EPICLON manufactured by DIC Co., Ltd.) N-775), cresol novolac type epoxy resin (as a specific example, model EPICLON N-695 manufactured by DIC Co., Ltd.), bisphenol A novolak type epoxy resin (as a specific example, DIC Co., Ltd. product Model EPICLON N-865), bisphenol A type epoxy resin (as a specific example, model jER1001 manufactured by Mitsubishi Chemical Co., Ltd.), and bisphenol F type epoxy resin (as a specific example, manufactured by Mitsubishi Chemical Co., Ltd. Model jER4004P), Bisphenol S type epoxy resin (as a specific example is the model EPICLON EXA-1514 manufactured by DIC Co., Ltd.), bisphenol AD type epoxy resin, and biphenol novolac type epoxy resin (as a specific example is Model NC-3000 manufactured by Nippon Kayaku Co., Ltd., hydrogenated bisphenol A epoxy resin (as a specific example, model ST-4000D manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), naphthalene epoxy resin (as Specific examples are model EPICLON HP-4032, EPICLON HP-4700, EPICLON HP-4770 manufactured by DIC Co., Ltd., and tertiary butylcatechol type epoxy resin (as a specific example, model EPICLON manufactured by DIC Co., Ltd. HP-820), dicyclopentadiene type epoxy resin (as a specific example, the model EPICLON HP-7200 manufactured by DIC Co., Ltd.), adamantane type epoxy resin (as a specific example, manufactured by Idemitsu Kosan Co., Ltd. Model ADAMANTATE XE-201), special bifunctional epoxy resin (as specific examples are models YL7175-500 and YL7175-1000 manufactured by Mitsubishi Chemical Co., Ltd.; models EPICLON TSR-960 and EPICLON TER- manufactured by DIC Co., Ltd.) 601, EPICLON TSR-250-80BX, EPICLON 1650-75MPX, EPICLON EXA-4850, EPICLON EXA-4816, EPICLON EXA-4822, and EPICLON EXA-9726; model YSLV-120TE manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) , Rubber-like core-shell polymer modified bisphenol A epoxy resin (as a specific example, model MX-156 manufactured by KANEKA Co., Ltd.), rubber-like core-shell polymer modified bisphenol F epoxy resin (as Specific examples are model MX-136 manufactured by KANEKA Co., Ltd. and bisphenol F type epoxy resin containing rubber particles (as a specific example, KANEKA Co., Ltd. The manufactured model MX-130).

The epoxy resin (D) may contain a phosphorus-containing epoxy resin. At this time, the flame retardancy of the cured product of the photosensitive resin composition is improved. The phosphorus-containing epoxy resin may be contained in the crystalline epoxy resin (D1), or may be contained in the amorphous epoxy resin (D2). Examples of phosphorus-containing epoxy resins include: phosphoric acid-modified bisphenol F epoxy resin (specific examples are EPICLON EXA-9726 and EPICLON EXA-9710 manufactured by DIC Co., Ltd.), Nippon Steel & Sumikin Chemical Co., Ltd. The company's model Epotohto FX-305, etc.

The epoxy resin (D) may contain an epoxy compound (D3) having a bisphenol phenol skeleton. The epoxy compound (D3) includes, for example, the epoxy compound (a1), which has the bisphenol phenol skeleton (S1) represented by the formula (1) described above.

The photosensitive resin composition preferably contains a colorant (E). At this time, when a coating film is produced from the photosensitive resin composition and the coating film of the photosensitive resin composition is exposed, scattering in the coating film can be suppressed. Therefore, the reduction in resolution due to light scattering can hardly occur. Thereby, when the coating film formed of the photosensitive resin composition is exposed to light and then developed to produce a coating film, the shape of the coating film can have higher resolution. At this time, when a film with holes is produced, the shape of the holes can become clearer.

The coloring agent (E) is, for example, a substance that can color a coating film formed of a photosensitive resin composition. The colorant may contain any of pigments and dyes. When the photosensitive resin composition contains a colorant, the colorant may contain any one of a pigment, a dye, and a pigment. The colorant (E) can include, for example, one or more materials selected from the group consisting of black colorants, blue colorants, and yellow colorants.

Examples of black colorants include carbon black, naphthol black, titanium black, lactam black, and perylene black.

Examples of blue colorants include phthalocyanine-based compounds and anthraquinone-based compounds.

Examples of yellow colorants include monoazo compounds, bisazo compounds, condensed azo compounds, benzimidazolone compounds, isoindolinone compounds, and anthraquinone compounds.

The coloring agent (E) may be a coloring agent of a color other than the above. Examples of coloring agents for colors other than the above include at least one component selected from the group consisting of red colorants, green colorants, purple colorants, orange colorants, and brown colorants.

Examples of red colorants include: monoazo compounds, bisazo compounds, azo lake compounds, benzimidazolone compounds, perylene compounds, diketopyrrolopyrrole compounds, condensation couplings Nitrogen compounds, anthraquinone compounds, and acridone compounds.

Examples of green colorants include phthalocyanine-based compounds, anthraquinone-based compounds, and perylene-based compounds.

The photosensitive resin composition preferably contains a component having a bisphenol sulfonate skeleton. At this time, the component having the bisphenol sulfide skeleton has the bisphenol sulfide skeleton, and therefore can absorb light in the wavelength range of 305 nm or more and 325 nm or less. Therefore, especially during exposure, light scattering can be less likely to occur, and a decrease in resolution can be made less likely to occur. The component having a bisphenol phenol skeleton contains, for example, at least one selected from the group consisting of the following compounds: the above-mentioned carboxyl group-containing resin (A1) having a bisphenol phenol skeleton, and an unsaturated compound having a bisphenol phenol skeleton ( B1) and epoxy compound (D3) with a bisphenol phenol skeleton.

The amount of the components in the photosensitive resin composition can be appropriately adjusted so that the photosensitive compound has photocuring properties and can be developed with an alkaline solution.

The amount of the carboxyl group-containing resin (A) relative to the solid content of the photosensitive resin composition is preferably 5% by mass or more and 85% by mass or less, more preferably 10% by mass or more and 75% by mass or less, and still more preferably 20% by mass or more and 60% by mass or less.

The amount of the unsaturated compound (B) relative to the carboxyl group-containing resin (A) is preferably 1% by mass or more and 50% by mass or less, more preferably 10% by mass or more and 45% by mass or less, and still more preferably 15% by mass Above and 40% by mass or less.

The amount of the photopolymerization initiator (C) relative to the carboxyl group-containing resin (A) is preferably 0.1% by mass or more and 30% by mass or less, more preferably 1% by mass or more and 25% by mass or less, and still more preferably 3 Mass% or more and 20 mass% or less.

Regarding the amount of the epoxy resin (D), the total equivalent of epoxy groups contained in the epoxy resin (D) is preferably 0.7 or more and 2.5 or less with respect to 1 equivalent of the carboxyl groups contained in the carboxyl group-containing resin (A). It is more preferably 0.7 or more and 2.3 or less, and still more preferably 0.7 or more and 2.0 or less.

When the photosensitive resin composition contains a colorant (E), the amount of the colorant (E) is preferably 0.1% by mass or more and 15% by mass or less, more preferably 0.5% by mass or more, relative to the carboxyl group-containing resin (A) And 10% by mass or less.

When the photosensitive resin composition contains a component having a bisphenol phenol skeleton, the amount of the component having a bisphenol phenol skeleton relative to the solid content of the photosensitive resin composition is preferably 10% by mass or more and 70% by mass or less, More preferably, it is 20% by mass or more and 60% by mass or less.

When the photosensitive resin composition contains an organic solvent, the amount of the organic solvent is preferably such that the organic solvent can quickly volatilize when the coating film formed by the photosensitive resin composition is dried, that is, the organic solvent does not remain Adjust the way in the dry film. In particular, with respect to the entire photosensitive resin composition, the organic solvent is preferably greater than 0% by mass and 99.5% by mass or less, and more preferably 15% by mass or more and 60% by mass or less. Furthermore, the appropriate ratio of the organic solvent varies depending on the coating method and the like, so it is preferable to adjust the ratio appropriately according to the coating method.

In addition, the amount of solid content is the total amount of total components obtained by removing volatile components such as solvents from the photosensitive resin composition.

The photosensitive resin composition may further contain components other than the above-mentioned components within a range that does not deviate from the gist of the present invention.

For example, the photosensitive resin composition may contain an inorganic filler. At this time, when the coating film formed of the photosensitive resin composition is cured, the curing shrinkage at this time can be reduced. The inorganic filler material can contain, for example, at least one selected from the group consisting of barium sulfate, crystalline silica, nanosilica, carbon nanotubes, talc, bentonite, hydrotalcite, aluminum hydroxide , Magnesium hydroxide, zinc oxide and titanium oxide. The proportion of the inorganic filler in the photosensitive resin composition can be appropriately set, and it is preferably 0% by mass or more and 200% by mass or less, more preferably 0% by mass or more and 100% by mass relative to the carboxyl group-containing resin (A) Below, it is more preferably 0% by mass or more and 50% by mass or less.

The photosensitive resin composition may contain at least one selected from the group consisting of the following resins: toluene diisocyanate, morpholine diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate, etc. Blocked isocyanates, which are blocked with caprolactam, oxime, malonate, etc.; melamine resin, n-butylated melamine resin, isobutylated melamine resin, butyl Amine resins such as urea resin, butylated melamine-urea co-condensation resin, benzoguanamine co-condensation resin; various thermosetting resins other than the foregoing; ultraviolet-curable epoxy (meth)acrylate; Base) acrylic acid is added to bisphenol A type, phenol novolak type, cresol novolak type, alicyclic type and other epoxy resins; and, diallyl phthalate resin, phenoxy Polymer compounds such as resins, urethane resins, and fluororesins.

The photosensitive resin composition may contain a curing agent for curing the epoxy resin (D). The hardener can contain, for example, at least one selected from the group consisting of imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole , 4-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazole and other imidazole derivatives; dicyandiamine, Benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N , N-dimethylbenzylamine and other amine compounds; hydrazine compounds such as hexadihydrazine and sebacadiazide; phosphorus compounds such as triphenylphosphine; acid anhydrides; phenols; mercaptans; Lewis acid amine complexes ; And, onium salt. Examples of commercially available products of these components include: 2MZ-A, 2MZ-OK, 2PHZ, 2P4BHZ, and 2P4MHZ manufactured by Shikoku Chemical Co., Ltd. (all are the trade names of imidazole compounds); San-Apro shares U-CAT3503N, U-CAT3502T (both are trade names of blocked isocyanate compounds of dimethylamine) manufactured by Co., Ltd.; DBU, DBN, U-CATSA102, U-CAT5002 (all are bicyclic amidine compounds and Its salt).

The photosensitive resin composition may contain an adhesiveness imparting agent. Examples of the adhesion imparting agent include: melamine; guanamine; betaguanazine; benzoguanazine; and 2,4-diamino-6-methacryloxyethyl-s-triazabenzene , 2-vinyl-4,6-diamino-s-triazine, 2-vinyl-4,6-diamino-s-triazabenzene, isocyanuric acid adduct, 2 , 4-Diamino-6-methacryloyloxyethyl-s-triazabenzene, isocyanuric acid adduct and other s-triazabenzene derivatives.

The photosensitive resin composition may contain at least one selected from the group consisting of the following components: a hardening accelerator; a copolymer of silicone, acrylate, etc.; an adhesion imparting agent such as a leveling agent; Thixotropic agent; polymerization inhibitor; anti-halation agent; flame retardant; defoamer; antioxidant; surfactant; pigment; and, polymer dispersant.

The content of the amine compound in the photosensitive resin composition is preferably as small as possible. In this case, it is difficult to hinder the electrical insulation of the layer composed of the cured product of the photosensitive resin composition. In particular, the amine compound is preferably 6% by mass or less, and more preferably 4% by mass or less with respect to the carboxyl group-containing resin (A).

The raw materials of the above-mentioned photosensitive resin composition are mixed and kneaded by a conventional kneading method using, for example, a three-roll mill, a ball mill, a sand mill, etc., the photosensitive resin composition can be prepared. When the raw material of the photosensitive resin composition contains liquid components, low-viscosity components, etc., the photosensitive resin composition can be prepared by the following method: except for the liquid components and low-viscosity components in the raw materials After kneading the parts to prepare a mixture, add liquid components and low-viscosity components to the obtained mixture and mix them.

In consideration of storage stability, etc., the first agent can be prepared by mixing part of the photosensitive resin composition components, and the second agent can be prepared by mixing the remaining components. That is, the photosensitive resin composition may include a first agent and a second agent. In this case, for example, among the components of the photosensitive resin composition, the first agent can be prepared by mixing and dispersing the unsaturated compound (B), part of the organic solvent and the thermosetting component in advance, and by making the photosensitive resin The rest of the components of the composition are mixed and dispersed to prepare the second agent. At this time, the required amount of the first agent and the second agent are mixed in a timely manner to prepare a mixed liquid, and the mixed liquid is hardened to obtain a hardened product.

The photosensitive resin composition in this embodiment is suitable for making an electrical insulating material for printed wiring boards. The photosensitive resin composition is particularly suitable as a material for forming an electrically insulating layer, such as a solder resist layer, a plating resist layer, a resist layer, an interlayer insulating layer, and the like.

When the photosensitive resin composition is molded into a film having a thickness of 25 μm, it is preferable that the film can be developed with an aqueous sodium carbonate solution. At this time, since the photolithography method can be used to form a sufficiently thick electrically insulating layer from the photosensitive resin composition, the photosensitive resin composition can be widely used to produce interlayer insulation in printed wiring boards. Layer, solder resist layer, etc. Of course, it is also possible to produce an electrically insulating layer with a thickness of less than 25 μm from the photosensitive resin composition.

Whether the film can be developed with a sodium carbonate aqueous solution can be confirmed by the following method. The photosensitive resin composition is coated on an appropriate substrate to form a wet coating film, and the wet coating film is heated at 80° C. for 40 minutes to form a coating film with a thickness of 25 μm. The negative mask is directly attached to the coating film, and ultraviolet rays are irradiated to the coating film under the condition of 500mJ/cm ² through the coating film. The negative mask has a UV-permeable exposure part and a The non-exposed part that shields ultraviolet rays. After the exposure, a 30°C 1% Na ₂ CO ₃ aqueous solution was sprayed on the film at a spray pressure of 0.2 MPa for 90 seconds, and then pure water was sprayed for 90 seconds at a spray pressure of 0.2 MPa. As a result of observing the coating film after this treatment, when it is confirmed that the portion corresponding to the non-exposed portion in the coating film is removed and the residue cannot be recognized, it is determined that development can be performed with the sodium carbonate aqueous solution.

The manufacturing method of the coating film in this embodiment, as described above, includes: arranging the coating film of the photosensitive resin composition on the substrate, thereby forming the coating film on the substrate; and irradiating light to the coating film A step of exposing is performed above; and a step of developing the aforementioned coating film after exposure with an alkaline solution. Hereinafter, with reference to FIGS. 3A to 3E, the method of manufacturing a coating film formed from the photosensitive resin composition of the present embodiment and a method of manufacturing a printed wiring board provided with the coating film will be described in detail.

In order to form the coating film of the photosensitive resin composition on the substrate, first, the core material 1 shown in FIG. 3A is prepared as the substrate. The core material 1 includes, for example, at least one insulating layer 2 and at least one conductive layer 3. The conductive layer 3 may be a conductive line. Hereinafter, the conductive layer 3 provided on one surface of the core material 1 is referred to as a first conductor line 31. As shown in FIG. 3B, a coating film 4 made of a photosensitive resin composition is formed on the surface of the core material 1 where the first conductor line 31 is provided. In order to form the coating film 4 from the photosensitive resin composition, for example, it can be formed by methods such as a coating method and a dry film method.

In the coating method, for example, the photosensitive resin composition is coated on a substrate such as the core material 1 to form a wet coating film. The coating method of the photosensitive resin composition can be selected, for example, from the group consisting of the following methods: dipping method, spray method, spin coating method, roll coating method, curtain coating method, and screen printing method. Then, in order to volatilize the organic solvent in the photosensitive resin composition, the wet coating film can be dried at a temperature in the range of, for example, 60 to 120°C, thereby obtaining coating film 4 (dry coating film).

In the dry film method, a photosensitive resin composition is first coated on an appropriate support made of polyester or the like and then dried to form a dry film containing the photosensitive resin composition on the support. Thereby, a dry film with a support body is obtained, which has: a dry film; and, a support body for supporting the dry film. After overlapping the dry film in the dry film with the support on the core material 1, pressure is applied to the dry film and the core material 1, and then the support is peeled off from the dry film, thereby transferring the dry film from the support To the core material 1. Thereby, a coating film 4 composed of a dry film is provided on the core material 1.

In this way, the coating film 4 of the photosensitive resin composition can be arranged on a substrate such as the core material 1, and the coating film 4 can be formed on the substrate.

Preferably, in the absorption spectrum of the coating film 4 of this embodiment, the maximum absorbance in the wavelength range from 305 nm to 325 nm is 3 times or more relative to the maximum absorbance in the wavelength range from 350 nm to 370 nm. At this time, when the coating film formed of the photosensitive resin composition is exposed, scattering of light in the coating film can be suppressed. Therefore, it is possible to make it difficult to reduce the resolution due to light scattering. Thereby, when the coating film formed of the photosensitive resin composition is exposed to light and then developed to produce a coating film, the shape of the coating film has higher resolution. In this case, for example, when a film having holes is produced from a photosensitive resin composition by photolithography, the shape of the holes can be made clearer. In addition, the absorption spectrum of the coating film can be measured by a spectroscopic analyzer such as a spectrophotometer. The specific measurement method can be measured in the same manner as the evaluation test (4-1) of the examples described later.

Then, the coating film 4 formed on the core material 1 is irradiated with light in the above-described manner to expose the coating film 4. In order to expose the coating film 4, for example, the coating film 4 can be irradiated with light emitted from a light source. In this embodiment, the spectrum of the light irradiated on the coating film in the exposure step has the first intensity distribution, the second intensity distribution, and the third intensity distribution as described above. The first intensity distribution is above 350 nm and below 370 nm The wavelength range of is repeated with the first absorption band, the second intensity distribution is repeated with the second absorption band in a wavelength range greater than 370 nm and less than 415 nm, and the third intensity distribution is located in a wavelength range greater than 305 nm and less than 325 nm. That is, the light irradiated on the coating film in the exposure step includes the first light, the second light, and the third light. The wavelength region of the first light lies within the wavelength range of the first absorption band, the wavelength region of the second light lies within the wavelength range of the second absorption band, and the wavelength region of the third light lies within the wavelength range above 305nm and below 325nm. Inside. Furthermore, in this spectrum, the sum of the area under the curve in the wavelength range from less than 280 nm to 200 nm and the area under the curve in the wavelength range from more than 415 nm to 500 nm relative to the area under the curve in the wavelength range from 200 nm to 500 nm The percentage is less than 5%.

The light source is preferably at least one selected from the group consisting of metal halide lamps, high-pressure mercury lamps and ultra-high-pressure mercury lamps. In this case, a high-resolution image can be formed in a short exposure time.

In this embodiment, in the exposure step, it is preferable to irradiate the coating film with light emitted from the light source after passing through a filter, which can block light in a wavelength range shorter than 280 nm and 200 nm or more. And light in the wavelength range longer than 415nm and less than 500nm. At this time, in the spectrum of the light irradiated on the coating film, the area under the curve in the wavelength range from 200 nm to 500 nm is less than 280 nm and the area under the curve in the wavelength range to 200 nm is greater than 415 nm to 500 nm. The percentage of the total area under the curve in the wavelength range up to now can be 5% or less.

The coating film can be irradiated with light from a light source other than a metal halide lamp, a high-pressure mercury lamp, and an ultra-high-pressure mercury lamp without departing from the spirit of the present invention.

The filter can adopt an appropriate filter, which can block light in a specific wavelength range. Examples of the filter include, for example, a band pass filter, which transmits only light in a specific wavelength range and can block light on the short wavelength side and long wavelength side outside the specific wavelength range. Furthermore, as long as the filter has the above-mentioned functions, it can be constituted by the following methods: a long pass filter and a short pass filter, or two types The above-mentioned optical filters transmit only light in a specific wavelength range (for example, light other than light having a wavelength shorter than 280 nm and light having a wavelength longer than 415 nm). In addition, the size, shape, and arrangement method of the filter are not particularly limited. For example, the filter only needs to be provided at a position between the coating film 4 and the light source.

As shown in FIG. 3C, by exposing the coating film 4, the coating film 4 can be partially photocured. For example, after the negative mask is directly attached to the coating film 4, the coating film 4 is irradiated with light through the negative mask. The negative mask is provided with an exposure part through which light can penetrate and a non-exposure part which can shield light, and the non-exposure part is provided at a position corresponding to the position of the through hole 10. The negative mask is, for example, a photo tool such as a mask film and a dry plate.

In addition, when performing exposure, a method other than the method using the above-mentioned negative mask can be used. For example, the coating film 4 is exposed by a direct drawing method which irradiates light emitted from a light source to only the portion to be exposed on the coating film 4. The light source suitable for the direct drawing method can be selected from the group consisting of laser, LED (Light Emitting Diode), high pressure mercury lamp, ultra high pressure mercury lamp and metal halide lamp, for example.

In the dry film method, the dry film of the dry film with the support can be superimposed on the core material 1, and the coating film 4 composed of the dry film can be applied through the support without peeling off the support. The coating film 4 is exposed by irradiating ultraviolet rays, and then the support is peeled from the exposed coating film 4 before the development process.

Then, the unexposed part (non-exposed part) 5 of the coating film 4 shown in FIG. 3C is removed by performing a development process on the coating film 4 after exposure. Thereby, the hole 6 is provided in the position where the through hole 10 is to be formed in the coating film 40 as shown in FIG. 3D.

In the development process, an appropriate developer can be used depending on the composition of the photosensitive resin composition. The developer is, for example, an alkaline aqueous solution containing at least one of an alkali metal salt and an alkali metal hydroxide, or an organic amine. More specifically, the alkaline aqueous solution contains, for example, at least one selected from the group consisting of sodium carbonate, potassium carbonate, ammonium carbonate, sodium bicarbonate, potassium bicarbonate, ammonium bicarbonate, sodium hydroxide, hydrogen Potassium oxide, ammonium hydroxide, tetramethylammonium hydroxide, and lithium hydroxide. The solvent in the alkaline aqueous solution may be only water or a mixture of water and a hydrophilic organic solvent such as a lower alcohol. The organic amine contains, for example, at least one selected from the group consisting of monoethanolamine, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, and triisopropanolamine.

The developer is preferably an alkaline aqueous solution containing at least one of an alkali metal salt and an alkali metal hydroxide, and particularly preferably an aqueous sodium carbonate solution. At this time, it is possible to improve the operating environment and reduce the burden of waste disposal.

Thereby, the coating film 40 containing the photosensitive resin composition can be produced on the base material. The shape of the coating film 40 containing the photosensitive resin composition produced by the above operations can have high resolution. In addition, at this time, the shape of the hole formed in the coating film 40 can be made clearer.

The coating film 40 produced in the above manner can be further subjected to the following treatments.

For example, the coating film 40 is heated to harden it. The heating conditions are, for example, the heating temperature is in the range of 120 to 200°C, and the heating time is in the range of 30 to 120 minutes. In this case, the performance of the strength, hardness, chemical resistance, and the like of the interlayer insulating layer 7 formed by the coating film 40 can be improved. According to needs, the coating film 40 may be further irradiated with ultraviolet rays either or both before and after heating. At this time, the photocuring of the coating film 40 can be further advanced.

Thereby, for example, an interlayer insulating layer 7 including a coating film 40 of a photosensitive resin composition (also referred to as a cured product of the photosensitive resin composition) can be provided on a base material such as the core material 1 and the like.

Furthermore, the coating film 40 (interlayer insulating layer 7) may be plated. A suitable method can be used for the plating treatment. For example, an additive process or the like can be used to provide the second conductor line 8 and the hole plating 9 on the interlayer insulating layer 7. Thereby, a printed wiring board 11 is obtained as shown in FIG. 3E. The printed wiring board 11 includes: a first conductor line 31; a second conductor line 8; and an interlayer insulating layer 7, which is interposed between the first conductor line 31 and Between the second conductor lines 8; and, the through hole 10, which is used to electrically connect the first conductor line 31 and the second conductor line 8. Furthermore, in FIG. 3E, the hole plating 9 has a cylindrical shape covering the inner surface of the hole 6, but the hole plating 9 may be filled in the entire inner side of the hole 6. In order to provide the hole plating 9, an electroless metal plating process can be performed on the outer surface of the roughened part described later and the surface inside the hole 6 to form an initial line. After that, the electrolytic metal plating process is used to precipitate the metal in the electrolyte plating solution on the initial circuit, thereby forming the hole plating 9.

In addition, before performing the above-mentioned plating treatment, the surface of the coating film 40 may be roughened by performing a roughening treatment on the coating film 40. For example, in order to roughen the entire outer surface of the part of the interlayer insulating layer 7 and the inner surface of the hole 6, the same procedure as the general desmear treatment using an oxidizing agent can be performed. For example, an oxidizing agent is brought into contact with the outer surface of the interlayer insulating layer 7 to give a rough surface to the interlayer insulating layer 7. However, it is not limited to this method, and a method of imparting a rough surface to the hardened product such as plasma treatment, UV treatment, or ozone treatment can also be suitably adopted. The oxidizing agent may be an oxidizing agent that can be purchased as a scum removal liquid. For example, the oxidizing agent can be constituted by a commercially available swelling liquid for desmearing and a desmearing liquid. Such an oxidizing agent can contain, for example, at least one permanganate selected from the group consisting of sodium permanganate and potassium permanganate.

An example of the method of manufacturing the printed wiring board in this embodiment, which is provided with the solder resist layer formed of the photosensitive resin composition of this embodiment, is demonstrated.

First, the core material constituting the base material is prepared. The core material includes, for example, at least one insulating layer and at least one conductor line (conductive layer). On the surface of the core material on which the conductor lines are provided, a coating film is formed from the photosensitive resin composition. As a method of forming a coating film, a coating method and a dry film method can be cited. As the coating method and the dry film method, the same method as when forming a coating film on the above-mentioned substrate can be adopted. The coating film can be partially photocured by exposing it to light. The exposure method can also be the same method as when forming the interlayer insulating layer described above. Then, by performing development processing on the coating film, the unexposed part of the coating film is removed, thereby leaving the exposed part of the coating film on the core material. Then, heat curing is performed by heating the coating film formed on the core material. The developing method and the heating method can also be the same methods as when forming the interlayer insulating layer described above. According to needs, the coating film can be further irradiated with ultraviolet rays either or both before and after heating. At this time, the photocuring of the coating film can be further advanced.

Through the above operations, a solder resist layer composed of a hardened photosensitive resin composition can be provided on the core material. Thereby, a printed wiring board can be obtained, which is provided with: a core material having an insulating layer and a conductor line (conductive layer) on the insulating layer; and a solder resist layer which partially covers the core material provided with The surface of the conductor line. [Example]

Hereinafter, specific embodiments of the present invention are mentioned. However, the present invention is not limited to these embodiments.

(1) Synthesis of carboxyl-containing resin (1-1) Synthesis Example A-1 and Synthesis Example B-1 In a four-necked flask equipped with a reflux cooler, a thermometer, an air blowing tube, and a stirrer, add the ingredients shown in the "first reaction" column in Table 1, and stir these ingredients under air bubbling to prepare a mixture . The mixture was stirred in the flask while air bubbled, and heated under the conditions of the reaction temperature and reaction time shown in the "Reaction Conditions" column. In this way, a solution of the intermediate is prepared. Then, pour the components shown in the "Second Reaction" column of Table 1 into the solution of the intermediate in the flask, and while stirring under air bubbling, use the reaction temperature shown in the "Reaction Conditions (1)" column. And the reaction time. Next, for Synthesis Example A-1, while stirring under air bubbling, heating was performed under the conditions of the reaction temperature and reaction time shown in the "Reaction Conditions (2)" column. Thereby, a 65% by mass solution of the carboxyl group-containing resin was obtained. The polydispersity of the carboxyl-containing resin (excluding the carboxyl-containing resin of Synthesis Example B-1), weight average molecular weight, and acid value are as shown in Table 1. The molar ratio between the components is also shown in Table 1.

In addition, the details of the components shown in the column (a1) in Table (1) are as follows. ‧Epoxy compound 1: A bisphenol phenolic epoxy compound, which is represented by formula (7), and R ₁ to R ₈ in formula (7) are all hydrogen atoms. The bisphenol phenolic epoxy compound The epoxy equivalent is 250 g/eq.

In addition, the details of the components shown in the column (g1) in Table 1 are as follows. ‧Epoxy compound 2: Formaldehyde novolac epoxy resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., model YDC-700-5, epoxy equivalent 203 g/eq).

[Table 1] Synthesis example A-1 B-1 first reaction Ingredients (parts by weight) (5j/4xu; 4zp4 parts by weight) (a1) Epoxy compound 1 (epoxy equivalent 250 g/eq) 250 - (g1) Epoxy compound 2 (epoxy equivalent 203 g/eq) - 203 (a2) or (g2) acrylic acid 72 43.2 ω-carboxy-polycaprolactone (n≒2) monoacrylate - - catalyst Triphenylphosphine 1.5 3 Solvent Propylene glycol monomethyl ether acetate 60 - Diethylene glycol monoethyl ether acetate 140 105 - Methyl hydroquinone 0.2 0.2 Reaction conditions Reaction temperature (℃) 115 100 Reaction time (hours) 12 3 Second reaction Ingredients (parts by weight) (a3-1) 1,2,3,6-Tetrahydrophthalic anhydride 60.8 - (a3-2) 3,3',4,4'-biphenyltetracarboxylic dianhydride 58.8 - 3,3',4,4'-Diphenyl ketone tetracarboxylic dianhydride - - (g3) 1,2,3,6-Tetrahydrophthalic anhydride - - Tetrahydrophthalic acid - 68 Cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride - - Solvent Propylene glycol monomethyl ether acetate 38.7 - Diethylene glycol monoethyl ether acetate - 65 - Methyl hydroquinone - 0.3 Reaction conditions (1) Reaction temperature (℃) 115 105 Reaction time (hours) 6 7 Reaction conditions (2) Reaction temperature (℃) 80 - Reaction time (hours) 1 - (a2) The molar ratio relative to the epoxy group in (a1) 1.0 - (a3-1) The molar ratio relative to the epoxy group in (a1) 0.4 - (a3-2) The molar ratio relative to the epoxy group in (a1) 0.2 - Physical properties Polydispersity (Mw/Mn) 2.15 - Weight average molecular weight (Mw) 3096 7582 Acid value (mg KOH/g) 105 74

(2) Preparation of photosensitive resin composition (Examples 1-9) After kneading a part of the components shown in the below-mentioned table with a three-roll mill, all the components shown in the below-mentioned table are put into a flask, and a photosensitive resin composition is obtained by stirring and mixing. In addition, the details of the components shown in the table are as follows. In addition, in the following photopolymerization initiators, the phrase "does not absorb light" for a specific wavelength means: in the absorption spectrum of the photopolymerization initiator, "with respect to the photopolymerization initiator at 350nm or more and 370nm The area under the curve for the following wavelength ranges, the area under the curve for each wavelength range is less than 2%." For example, the so-called photopolymerization initiator B "will not absorb light with a wavelength of 400nm or more and 415nm or less" means: in the absorption spectrum of the photopolymerization initiator B, "with respect to the photopolymerization initiator at 350nm or more And the area under the curve in the wavelength range of 370 nm or less, and the area under the curve in the wavelength range of 400 nm or more and 415 nm or less is less than 2%". ‧Unsaturated compound A: Trimethylolpropane triacrylate. ‧Unsaturated compound B: a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd., model KAYARAD DPHA). ‧Photopolymerization initiator A: 2,4,6-trimethylbenzyl diphenyl phosphine oxide (manufactured by BASF, model Irgacure TPO); phosphonium oxide-based photopolymerization initiator; with absorbable The following light characteristics: light with a wavelength of 305 nm or more and 325 nm or less, light with a wavelength of 350 nm or more and 370 nm or less, light with a wavelength longer than 370 nm and less than 400 nm, and light with a wavelength of 400 nm or more and 415 nm or less. ‧Photopolymerization initiator B: 2-methyl-1-(4-methylthiophenyl)-2-morpholinylpropan-1-one (manufactured by BASF, model Irgacure 907); α-aminoalkyl Phenyl ketone-based photopolymerization initiator; has the characteristics of absorbing the following light: light with a wavelength of 305nm or more and 325nm or less, light with a wavelength of 350nm or more and 370nm or less, and light with a wavelength longer than 370nm and less than 400nm, And it cannot absorb light with a wavelength of 400nm or more and 415nm or less. ‧Photopolymerization initiator C: ethyl ketone, 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazol-3-yl]-,1-(O-acetyl) Oxime) (manufactured by BASF, model Irgacure OXE 02); oxime ester-based photopolymerization initiator; has the characteristic of absorbing the following light: light with a wavelength above 305nm and below 325nm, light with a wavelength above 350nm and below 370nm And light with a wavelength longer than 370nm and less than 400nm, and cannot absorb light with a wavelength of 400nm to 415nm. ‧Photopolymerization initiator D: 1-hydroxycyclohexyl phenyl ketone (manufactured by BASF Corporation, model Irgacure 184); α-hydroxyalkylphenol-based photopolymerization initiator; has the characteristic of absorbing the following light: 305nm or more In addition, light having a wavelength of 325 nm or less, light having a wavelength of 350 nm or more and 370 nm or less, and light having a wavelength longer than 370 nm and less than 400 nm cannot absorb light having a wavelength of 400 nm or more and 415 nm or less. ‧Photopolymerization initiator E: 2,4-Diethylthioxanthone (manufactured by Nippon Kayaku Co., Ltd., model KAYACURE-DETX-S); dehydrogenation type photopolymerization initiator; has the ability to absorb the following light Its characteristics: light with a wavelength above 305nm and below 325nm, light with a wavelength above 350nm and below 370nm, light with a wavelength longer than 370nm but below 400nm, and light with a wavelength above 400nm and below 415nm. ‧Photopolymerization initiator F: 4,4'-bis(diethylamine) diphenyl ketone; dehydrogenation type photopolymerization initiator; having the characteristic of absorbing the following light: wavelengths above 305nm and below 325nm Light, light with a wavelength above 350nm and below 370nm, light with a wavelength longer than 370nm but below 400nm, and light with a wavelength above 400nm and below 415nm ‧Epoxy resin A: Biphenyl type crystalline epoxy resin (product name YX-4000 manufactured by Mitsubishi Chemical Co., Ltd., melting point 105°C, epoxy equivalent 187 g/eq). ‧Epoxy resin B dispersion liquid: Make a long-chain carbon chain bisphenol A epoxy resin (manufactured by DIC Co., Ltd., model EPICLON EXA-4816, liquid resin, ring Oxygen equivalent (410 g/eq) is a solution dispersed in diethylene glycol monoethyl ether acetate (the epoxy equivalent converted to 90% of solid content is 455.56 g/eq). ‧Epoxy resin C dispersion liquid: Make the cresol novolac type epoxy resin (product name YDCN-704 manufactured by Nippon Steel & Sumikin Co., Ltd., softening point 87-97°C) with a solid content of 70%. Epoxy equivalent 208g/eq) is dispersed in diethylene glycol monoethyl ether acetate solution (epoxy equivalent converted to 70% of solid content is 297.14 g/eq). ‧Black colorant: carbon black dispersion, average particle size 100~300nm, pigment content 20%, solid content 25%, and the dispersion solvent is propylene glycol monomethyl ether acetate. ‧Blue colorant: Phthalocyanine blue dispersion, average particle size 100-300nm, pigment content 20%, solid content 25%, and the dispersion solvent is propylene glycol monomethyl ether acetate. ‧Yellow colorant: Nickel complex pigment dispersion, average particle size 100～300nm, pigment content 20%, solid content 25%, dispersion solvent is propylene glycol monomethyl ether acetate. ‧Melamine: manufactured by Nissan Chemical Co., Ltd., finely powdered melamine, dispersed in the photosensitive resin composition with an average particle size of 8μm. ‧Antioxidant: hindered phenolic antioxidant (manufactured by BASF, model IRGANOX 1010). ‧Barium sulfate: manufactured by Sakai Chemical Industry Co., Ltd., model BARIACE B30. ‧Bentonite: manufactured by Leox, model BENTONE SD-2. ‧Organic filler dispersion: The carboxyl group-containing cross-linked rubber (NBR, manufactured by JSR Co., Ltd., model XER-91-MEK) with an average primary particle size of 0.07μm in a way that the content of cross-linked rubber is 15% by weight ) A dispersion liquid dispersed in methyl ethyl ketone with an acid value of 10.0 mg KOH/g. ‧Coupling agent: 3-glycidoxypropyltrimethoxysilane. ‧Defoamer: manufactured by Shin-Etsu Chemical Industry Co., Ltd., model KS-66. ‧ Surfactant: manufactured by DIC Co., Ltd., model MEGAFAC F-477. ‧Solvent: Methyl ethyl ketone.

(3) Production of test sample (coating film) Using the photosensitive resin composition prepared by the above (2), a test sample (coating film) was produced according to the following operation. After the photosensitive resin composition is coated on a polyethylene terephthalate film with a coater, it is dried by heating at 95°C for 25 minutes, thereby forming a dry film with a thickness of 25 μm on the film Coating (dry film). Prepare a glass epoxy-based copper-clad laminate (FR-4 type) with a copper foil with a thickness of 17.5 μm. Using a subtractive method, comb-shaped electrodes with a wire width/spacing of 100 μm/100 μm were formed on the glass epoxy-based copper-clad laminate as conductor lines, thereby obtaining a core material. An etchant (organic acid micro-etchant manufactured by MEC Co., Ltd., model CZ-8101) is used to dissolve and remove the surface layer of the conductor line of the core material with a thickness of about 1 μm, thereby roughening the conductor line. The dry film is heated and laminated on the entire surface of one side of the core material by using a vacuum laminator. The conditions for heating the lamination were 0.5 MPa, 80°C, and 1 minute. Thereby, a coating film composed of a dry film and having a film thickness of 25 μm was formed on the core material. The coating film obtained by this operation was made into the test piece sample of the following (4-2) evaluation test, and it evaluated.

(4) Evaluation test (4-1) Absorbance characteristics After coating the photosensitive resin composition of each example on a polyethylene terephthalate film using a coater, it was dried by heating at 95°C for 25 minutes to form on the film A dry coating film with a thickness of 10μm. The dry coating film of each example formed on a polyethylene terephthalate film was installed on an ultraviolet/visible light spectrometer (Model UV-3100PC manufactured by Shimadzu Corporation) to measure the dry coating film Absorption spectrum at 300～800nm. The standard product uses a film made of polyethylene terephthalate as the base material. Based on the obtained absorption spectrum, the value of [Maximum Absorbance in Wavelength 305nm-325nm]/[Maximum Absorbance in Wavelength 350nm-370nm] (that is, relative to the wavelength of 350nm to 370nm The maximum absorbance of light in the range, the ratio of the maximum absorbance of light in the wavelength range from 305 nm to 325 nm), was evaluated based on the following criteria. ○: The value of [the maximum value of absorbance in a wavelength of 305 nm to 325 nm]/[the maximum value of absorbance in a wavelength of 350 nm to 370 nm] is 3 or more. ×: The value of [the maximum value of absorbance at a wavelength of 305 nm to 325 nm]/[the maximum value of absorbance at a wavelength of 350 nm to 370 nm] is less than 3.

(4-2) Evaluation of the shape of the hole The shape of the hole formed in the coating film is formed by exposing the test samples (coating films) of the respective examples prepared in (3) above and developing them. Specifically, the negative mask of quartz glass is directly attached to the test sample (coating film) of each example, and the filter and the negative mask are made from polyethylene terephthalate. irradiating light to the coating film condition 400mJ / cm ² on the film, the negative mask having circular and non-exposed 60μm diameter. The light source used to illuminate the coating film is an ultra-high pressure mercury lamp. The emission spectrum of the light emitted by the ultra-high pressure mercury lamp, as shown in Figure 1, the horizontal axis is set to the wavelength (unit nm) and the vertical axis is set to the relative intensity (unit%), the wavelength and relative intensity are the same As shown in Figure 1. The light is irradiated under the following exposure conditions (conditions A to F). In addition, after exposure and before development, the polyethylene terephthalate film was peeled off from the coating film.

In the step of exposure, an ultra-high pressure mercury lamp is used as a light source, and a filter is used to block light of a specific wavelength, and then the light emitted by the ultra-high pressure mercury lamp is irradiated to the coating film. The wavelength of light irradiated to the coating film and the filter used are shown below. Furthermore, no filter is used in condition C.

Condition A After passing the light emitted from the light source through a filter that only transmits light in the wavelength range of 280 nm to 415 nm, the light is irradiated to the coating film.

Condition B After passing the light emitted from the light source through a filter that only transmits light in the wavelength range of 280 nm to 370 nm, the light is irradiated to the coating film.

Condition C The light emitted from the light source does not pass through the filter, and the light is irradiated to the film.

Condition D After passing the light emitted from the light source through a filter that only transmits light in the wavelength range of 350 nm to 370 nm, the light is irradiated to the coating film.

Condition E After passing the light emitted from the light source through a filter that only transmits light in the wavelength range of 350 nm to 415 nm, the light is irradiated to the coating film.

Condition F After passing the light emitted from the light source through a filter that only transmits light in the wavelength range of 280 nm or more and 325 nm or less, the coating film is irradiated with the light.

The coating film (film) after exposure is developed. When performing the development process, a 30° C. 1% Na ₂ CO ₃ aqueous solution was sprayed on the coating film at a spray pressure of 0.2 MPa for 90 seconds. Then, the coating film was sprayed with pure water for 90 seconds at a spray pressure of 0.2 MPa to wash it. In this way, the unexposed part of the film is removed, and holes are formed in the film. Then, the coating film was heated at 160°C for 60 minutes. Thereby, a layer composed of a cured product of the photosensitive resin composition (also referred to as a cured product of a dry film) is formed on the core material. Thus, a test piece was obtained.

The inner diameter of one end and the inner diameter of the other end of the hole in the test piece were measured, and the shape of the hole was evaluated according to the following criteria based on the difference between the two inner diameters. A: The difference in inner diameter is less than 4 μm. B: The difference in inner diameter is 4 μm or more and less than 6 μm. C: The difference in inner diameter is 6 μm or more and less than 8 μm. D: The difference in inner diameter is 8 μm or more and less than 10 μm. E: The difference in inner diameter is 10 μm or more. F: Since the coating film cannot be sufficiently photocured, holes cannot be formed.

As shown in FIG. 2A, in Example 2, if the coating film of the photosensitive resin composition is exposed to light under condition A and then developed, the difference in the inner diameter of the hole is small. That is, the resolution of the shape of the coating film formed of the photosensitive resin composition is high, and the shape of the hole formed in the coating film is clear. In Examples other than Example 2, the same results were obtained when exposure and development were performed under Condition A.

On the other hand, as shown in Figure 2B and Figure 2C, in Example 2, if conditions C and D are used to expose and develop the coating film of the photosensitive resin composition, the inner diameter of the hole The difference will become larger. That is, the resolution of the shape of the coating film formed of the photosensitive resin composition is reduced, and the shape of the hole formed in the coating film looks messy. In Examples other than Example 2, the same results were obtained when the conditions C and D were used for exposure and development.

Regarding the examples, the following evaluations (4-3) to (4-7) were performed on the test pieces obtained under conditions A and B.

(4-3) Insulation: While applying a DC12V bias to the conductor line (comb electrode) in the test piece, the test piece was exposed to a test environment of 130°C and 85%RH (relative humidity) for 100 hours. In this test environment, the resistance value between comb-shaped electrodes of the layer composed of the cured product was measured over time, and the result was evaluated based on the following evaluation criteria. A: From the beginning of the test until 100 hours have passed, the resistance value is maintained at 10 ⁶ Ω or more. B: The resistance value was maintained at 10 ⁶ Ω or more from the start of the test to the lapse of 70 hours, but the resistance value became less than 10 ⁶ Ω from the start of the test to 100 hours before the lapse. C: The resistance value became less than 10 ⁶ Ω from the time the test was started to before 70 hours passed.

(4-4) Acid resistance After the test piece was immersed in a 10% sulfuric acid aqueous solution at room temperature for 30 minutes, the appearance of the layer composed of the cured product was observed. The results were evaluated in the following manner. A: No abnormalities such as swelling, peeling, discoloration, etc., are confirmed on the layer composed of the cured product. B: Slight swelling, peeling, discoloration, and other abnormalities are confirmed on the layer composed of the cured product. C: Remarkable abnormalities such as swelling, peeling, and discoloration are confirmed on the layer composed of the cured product.

(4-5) Alkali resistance After the test piece was immersed in a sodium hydroxide aqueous solution with a concentration of 10% by mass at room temperature for 1 hour, the appearance of the layer composed of the cured product was observed. The results were evaluated in the following manner. A: No abnormalities such as swelling, peeling, discoloration, etc., are confirmed on the layer composed of the cured product. B: Slight swelling, peeling, discoloration, and other abnormalities are confirmed on the layer composed of the cured product. C: Remarkable abnormalities such as swelling, peeling, and discoloration are confirmed on the layer composed of the cured product.

(4-6) Soldering heat resistance Coat the water-soluble flux (manufactured by London Chemical Company, model LONCO 3355-11) on the hardened layer of the test piece, and then immerse the hardened layer in a 260°C molten solder bath (solder bath) After 10 seconds in the middle, rinse with water. After repeating this treatment three times, the appearance of the layer composed of the hardened material was observed, and the results were evaluated in the manner shown below. A: No abnormalities such as swelling, peeling, discoloration, etc., are confirmed on the layer composed of the cured product. B: Slight swelling, peeling, discoloration, and other abnormalities are confirmed on the layer composed of the cured product. C: Remarkable abnormalities such as swelling, peeling, and discoloration are confirmed on the layer composed of the cured product.

(4-7) Plating resistance Using a commercially available plating solution, electroless nickel plating and electroless gold plating were performed on the test piece in sequence, and then the state of the plating layer and the hardened layer was confirmed. Then, the cellophane adhesive tape peeling test was performed on the layer composed of the hardened substance to confirm the adhesion state of the layer composed of the hardened substance after plating. Evaluate the results in the following way. A: Before and after the plating layer is formed, the appearance of the hardened layer is not confirmed, the penetration of the plating layer is not confirmed, and the hardened material is not confirmed in the cellophane adhesive tape peel test The peeling of the layers. B: No change in the appearance of the layer composed of the cured product was confirmed before and after the plating layer was formed, but it was confirmed that the layer composed of the cured product was partially peeled off in the cellophane adhesive tape peel test. C: The protrusions of the layer composed of the cured product were confirmed before and after the plating layer was formed, and the peeling of the layer composed of the cured product was confirmed in the cellophane adhesive tape peeling test.

[Table 2] Composition (parts by mass) Example 1 Example 2 Example 3 Example 4 Example 5 Example 7 Example 8 Example 9 (A) 65% by mass solution of carboxyl-containing resin A-1 154 154 154 154 154 - - 154 65% by mass solution of carboxyl group-containing resin B-1 - - - - - 154 154 - (B) Unsaturated compound A 25 25 25 25 25 - - 25 Unsaturated compound B - - - - - 18 18 - (C) Photopolymerization initiator A 6 6 - 3 6 15 15 - Photopolymerization initiator B - - 6 - - - - 6 Photopolymerization initiator C - - - 0.5 - - - - Photopolymerization initiator D 1 1 - - 1 1 1 - Photopolymerization initiator E - - 1 - - 0.5 0.5 - Photopolymerization initiator F - 0.25 0.25 0.1 0.25 - - - (With or without dehydrogenation type photopolymerization initiator) no Have Have Have Have Have Have no (D) Epoxy A 20 20 20 20 20 20 20 20 Solution of epoxy resin B 35 35 35 35 35 - - 35 Solution of epoxy resin C - - - - - 30 30 - (E) Black colorant - - - - - 5 - 0.5 Blue colorant 3 3 3 3 - - 4 3 Yellow colorant 3 3 3 3 - - 4 3 - Melamine 1.5 1.5 1.5 1.5 1.5 3 3 1.5 Antioxidants 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Barium sulfate - - - - - 50 50 - Bentonite - - - - - 5 5 - Organic filler dispersion - - - - 80 - - - Coupling agent - - - - 0.12 - - - Defoamer - - - - - 6 6 - Surfactant 0.2 0.2 0.2 0.2 0.2 - - 0.2 Solvent 45 45 45 45 - 45 45 45 Evaluation Absorbance characteristics (Maximum absorbance at 305nm~325nm)/(Maximum absorbance at 350~370nm)>3 ○ (5.41) ○ (5.34) ○ (5.28) ○ (5.15) ○ (3.15) ○ (3.52) × (2.19) ○ (5.40) The shape of the hole Exposure conditions Condition A: Ultra-high pressure mercury lamp [280-415nm] B A A A B B C C Condition B: Ultra-high pressure mercury lamp [280-370nm] C B B B C C D C Condition C: Ultra-high pressure mercury lamp [full wavelength] E E E E E E E E Condition D: Ultra-high pressure mercury lamp [350-370nm] E E E E E E E E Condition E: Ultra-high pressure mercury lamp [350-415nm] E E E E E E E E Condition F: Ultra-high pressure mercury lamp [280-325nm] F F F F F F F F Insulation (condition A/condition B) A／A A／A A／A A／A A／A A／A A／A A／A Acid resistance (condition A/condition B) A／A A／A A／A A／A A／A A／A A／A A／A Alkali resistance (condition A/condition B) A／A A／A A／A A／A A／A A／A A／A A／A Soldering heat resistance (condition A/condition B) A／A A／A A／A A／A A／A A／A A／A A／A Plating resistance (condition A/condition B) A／A A／A A／A A／A A／A A／A A／A A／A (to sum up)

As can be seen from the above, the method of manufacturing the coating film of the first aspect of the present invention includes: disposing a photosensitive resin composition on a substrate, thereby forming a coating film on the substrate; and emitting a light source The step of irradiating the coating film with light of, and exposing; and, the step of developing the exposed coating film with an alkaline solution. A photosensitive resin composition containing a carboxyl group-containing resin (A), an unsaturated compound (B) having at least one ethylenically unsaturated bond in one molecule, a photopolymerization initiator (C), and an epoxy resin (D) . The light absorption spectrum of the photopolymerization initiator (C) has a first absorption band in a wavelength range of 350 nm or more and 370 nm or less, and a second absorption band in a wavelength range longer than 370 nm and 415 nm or less. The light irradiated on the coating film in the exposure step includes first light, second light, and third light. The wavelength region of the first light lies within the wavelength range of the first absorption band. The wavelength region of the second light is within the wavelength range of the second absorption band. The wavelength region of the third light is within the wavelength range of 305 nm or more and 325 nm or less. In the spectrum of the light irradiated on the coating film, the area under the curve in the wavelength range from 200nm to 500nm, which is shorter than 280nm and up to 200nm, and the area under the curve, which is longer than 415nm and up to 500nm, The total percentage of the area under the curve of the wavelength range is 5% or less.

According to the first aspect, when the coating film formed by the photosensitive resin composition is exposed to light and then developed to produce a coating film, the shape of the coating film has high resolution. In addition, when the coating has holes, the shape of the holes of the coating can be clearly formed.

The manufacturing method of the coating film of the second aspect is for the first aspect, wherein the second absorption band includes at least an absorption band in a wavelength range longer than 400 nm and less than 415 nm. The second light includes at least light in a wavelength region longer than 400 nm and 415 nm or less.

According to the second aspect, the photopolymerization initiator (C) in the coating film absorbs light in a wavelength range longer than 400 nm and 415 nm or less, and can start the photopolymerization reaction. With this, it is possible to achieve further good curability for the deep part of the coating film of the photosensitive resin composition.

The manufacturing method of the coating film of the third aspect is directed to the first or second aspect, wherein the absorption spectrum of the photopolymerization initiator (C) further has a third wavelength in the wavelength range from 305 nm to 325 nm. Absorption band. The wavelength region of the third light is within the wavelength range of the third absorption band.

According to the third aspect, the surface hardenability of the coating film is particularly easily improved. Furthermore, since scattering of light having a wavelength of 305 nm or more and 325 nm or less is less likely to occur in the coating film, it is more difficult to cause a decrease in the resolution due to the photopolymerization initiator (C).

The manufacturing method of the fourth aspect of the coating film is directed to any one of the first to third aspects, wherein, in the absorption spectrum of the coating film, relative to the maximum absorbance in the wavelength range from 350 nm to 370 nm , The maximum absorbance in the wavelength range from 305nm to 325nm is 3 times or more.

According to the fourth aspect, when the coating film formed of the photosensitive resin composition is exposed, the scattering of light in the coating film can be suppressed. Therefore, it is possible to make the decrease in resolution due to light scattering more difficult to occur. Thereby, when the coating film formed by the photosensitive resin composition is exposed and then developed to produce a coating film, the shape of the coating film will have high resolution. In addition, when the photolithography method is used to produce a film with holes from the photosensitive resin composition, the shape of the holes can be made clearer.

The manufacturing method of the fifth aspect of the film is for any one of the first to fourth aspects, wherein the light source is selected from the group consisting of metal halide lamps, high pressure mercury lamps and ultra-high pressure mercury lamps At least one of them.

According to the fifth aspect, a high-resolution image can be formed in a short exposure time.

The sixth aspect of the manufacturing method of the coating film is directed to any one of the first to fifth aspects, wherein, in the exposure step, the light emitted by the light source is passed through the filter and then irradiated on the coating film. This filter can block light in a wavelength range shorter than 280 nm and 200 nm or more, and light in a wavelength range longer than 415 nm and 500 nm or less.

According to the sixth aspect, the following percentage in the spectrum of the light irradiated on the coating film can be easily adjusted to 5% or less. The percentage is the area under the curve relative to the wavelength range from 200nm to 500nm, and is less than 280nm And the percentage of the total of the area under the curve in the wavelength range up to 200 nm and the area under the curve in the wavelength range up to 500 nm greater than 415 nm.

The manufacturing method of the coating film of the seventh aspect is for any one of the first to sixth aspects, wherein the photopolymerization initiator (C) contains a photopolymerization initiator selected from the group consisting of phosphine oxide-based photopolymerization initiators ( At least one of C1), α-aminoalkylphenyl ketone-based photopolymerization initiator (C2) and oxime ester-based photopolymerization initiator (C3).

According to the seventh aspect, when the coating film of the photosensitive resin composition is exposed to light to form a coating film, the deep curability of the coating film can be further improved. In addition, at this time, when the photosensitive resin composition is exposed with ultraviolet rays, high photosensitivity can be imparted to the photosensitive resin composition.

The manufacturing method of the coating film of the eighth aspect is directed to any one of the first to seventh aspects, wherein the photopolymerization initiator (C) includes a dehydrogenation type photopolymerization initiator (C4).

According to the eighth aspect, when the coating film formed of the photosensitive resin composition is exposed to light and then developed to produce the coating film, the shape of the coating film has higher resolution. In addition, when exposure and then development are performed to produce a film with holes, the shape of the holes can be made clearer.

The manufacturing method of the coating film of the ninth aspect is directed to any one of the first to eighth aspects, wherein the carboxyl group-containing resin (A) includes a carboxyl group-containing resin having an ethylenically unsaturated group.

According to the ninth aspect, the carboxyl group-containing resin (A) together with the unsaturated compound (B) impart photosensitivity and ultraviolet curability to the photosensitive resin composition.

The manufacturing method of the coating film of the tenth aspect is directed to any one of the first to ninth aspects, wherein the photosensitive resin composition contains a component having a bisphenol phenol skeleton.

According to the tenth aspect, the scattering of light during exposure is less likely to occur, and the reduction in resolution can be made less likely to occur. Thereby, when the coating film of the photosensitive resin composition is exposed to light and then developed to produce a coating film, the shape of the coating film will have higher resolution. Therefore, for example, when a photolithography method is used to produce a film with holes from a photosensitive resin composition, it is difficult to adversely affect the shape of the holes.

The manufacturing method of the coating film of the eleventh aspect is directed to any one of the first to tenth aspects, wherein the photosensitive resin composition further has a colorant (E).

According to the eleventh aspect, when the coating film of the photosensitive resin composition is exposed, scattering in the coating film can be suppressed. Therefore, the decrease in developability due to light scattering can hardly occur. Thereby, when the coating film formed of the photosensitive resin composition is exposed to light and then developed to produce the coating film, the shape of the coating film has higher resolution. At this time, when making a film with holes, the shape of the holes can be made clearer.

The printed wiring board of the twelfth aspect includes: a conductive layer; and, an insulating layer overlapping the conductive layer. The insulating layer includes a coating film, which is made by the method of manufacturing the coating film described in any one of the first to eleventh aspects.

According to the twelfth aspect, the insulating layer has high resolution, so the shape of the hole in the insulating layer can be clearly formed, and thereby the printed wiring board has excellent insulation reliability.

1: core material 2: insulation layer 3: conductive layer 31: The first conductor line 4: Coating 5: Non-exposure part 6: Hole 7: Interlayer insulation 8: second conductor line 9: Hole plating 10: Through hole 11: Printed circuit board 40: Laminating

Fig. 1 is a diagram showing the spectrum of light emitted by the ultra-high pressure mercury lamp as the light source in the embodiment. 2A is a diagram showing an example of the shape of the coating film when the exposure conditions are set to the condition A in the example. 2B is a diagram showing an example of the shape of the coating film when the exposure conditions are set to the condition C in the example. FIG. 2C is a diagram showing an example of the film shape when the exposure conditions are set to the condition D in the example. Fig. 3A is a cross-sectional view showing a step of manufacturing a multilayer printed wiring board in an embodiment of the present invention. Fig. 3B is a cross-sectional view showing a step of manufacturing a multilayer printed wiring board in an embodiment of the present invention. Fig. 3C is a cross-sectional view showing a step of manufacturing a multilayer printed wiring board in an embodiment of the present invention. FIG. 3D is a cross-sectional view showing a step of manufacturing a multilayer printed wiring board in an embodiment of the present invention. Fig. 3E is a cross-sectional view showing a step of manufacturing a multilayer printed wiring board in an embodiment of the present invention.

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Claims (12)

A method for manufacturing a film, which comprises: The step of disposing the photosensitive resin composition on the substrate, thereby forming the coating film on the aforementioned substrate; The step of irradiating the light emitted by the light source on the aforementioned coating film to perform exposure; and, The step of developing the aforementioned coating film after the aforementioned exposure using an alkaline solution; Wherein, the aforementioned photosensitive resin composition contains a carboxyl group-containing resin (A), an unsaturated compound (B) having at least one ethylenically unsaturated bond in one molecule, a photopolymerization initiator (C), and an epoxy resin (D); The absorption spectrum of the aforementioned photopolymerization initiator (C) has a first absorption band in a wavelength range of 350 nm or more and 370 nm or less, and a second absorption band in a wavelength range that is longer than 370 nm and 415 nm or less; The light irradiated on the coating film in the aforementioned exposure step includes the first light, the second light and the third light, The wavelength range of the first light is within the wavelength range of the first absorption band, The wavelength region of the aforementioned second light is within the wavelength range of the aforementioned second absorption band, The wavelength region of the aforementioned third light is within the wavelength range of 305nm or more and 325nm or less; In addition, in the spectrum of the light irradiated on the coating film, the area under the curve in the wavelength range from 200 nm to 500 nm is shorter than 280 nm and the area under the curve in the wavelength range up to 200 nm is longer than 415 nm. The total percentage of the area under the curve in the wavelength range up to 500 nm is 5% or less. The method of manufacturing a coating film according to claim 1, wherein the second absorption band includes at least an absorption band in a wavelength range longer than 400 nm and 415 nm or less, The aforementioned second light includes at least light in a wavelength region longer than 400 nm and 415 nm or less. The method of manufacturing a coating film according to claim 1 or 2, wherein the absorption spectrum of the photopolymerization initiator (C) further has a third absorption band in a wavelength range of 305 nm or more and 325 nm or less, and The wavelength range of the third light is within the wavelength range of the third absorption band. The method for manufacturing a coating film according to claim 1 or 2, wherein in the absorption spectrum of the coating film, the maximum absorbance in the wavelength range from 350 nm to 370 nm is in the wavelength range from 305 nm to 325 nm. The maximum absorbance is 3 times or more. The method for manufacturing a coating film according to claim 1 or 2, wherein the light source is at least one selected from the group consisting of a metal halide lamp, a high pressure mercury lamp, and an ultra high pressure mercury lamp. The method for manufacturing a coating film according to claim 1 or 2, wherein in the exposure step, the light emitted by the light source is passed through a filter and then irradiated on the coating film, and the filter can block It interrupts light in a wavelength range shorter than 280 nm and 200 nm or more, and light in a wavelength range longer than 415 nm and 500 nm or less. The method of manufacturing a coating film according to claim 1 or 2, wherein the photopolymerization initiator (C) contains a photopolymerization initiator (C1) selected from the group consisting of phosphine oxide-based photopolymerization initiators (C1) and α-aminoalkylphenyl groups. At least one of the ketone-based photopolymerization initiator (C2) and the oxime ester-based photopolymerization initiator (C3). The method for producing a coating film according to claim 1 or 2, wherein the photopolymerization initiator (C) includes a dehydrogenation type photopolymerization initiator (C4). The method for producing a coating film according to claim 1 or 2, wherein the carboxyl group-containing resin (A) includes a carboxyl group-containing resin having an ethylenically unsaturated group. The method for manufacturing a coating film according to claim 1 or 2, wherein the photosensitive resin composition contains a component having a bisphenol sulfonate skeleton. The method for producing a coating film according to claim 1 or 2, wherein the photosensitive resin composition further has a colorant (E). A printed circuit board, comprising: a conductive layer; and, an insulating layer, which overlaps the aforementioned conductive layer; The aforementioned insulating layer includes a coating film produced by the method of manufacturing the coating film according to any one of claims 1 to 11.

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