TW202023080A - Manufacturing method of micro fluid actuator - Google Patents

Abstract

A manufacturing method of a micro fluid actuator is disclosed and comprises following steps of providing a substrate and depositing a cavity layer on the substrate, depositing a vibration layer on the cavity layer, depositing and etching the vibration layer to form a piezoelectric actuation layer, etching the substrate to form a plurality of fluid channels, depositing a mask layer on the substrate and etching the substrate to form a plurality of communicating channels, etching the cavity layer to form a fluid storage chamber, providing an orifice layer and etching the orifice layer to form a plurality of openings, forming a channel layer and a plurality of channels on the orifice layer by a photo process and a photolithography process, and bonding the channel layer and the substrate by a thermo-compression bonding process and a flip-chip packaging process, so as to construct whole structure of the micro fluid actuator.

Description

Manufacturing method of microfluidic actuator

This case relates to a method for manufacturing a microfluidic actuator, especially a method for manufacturing a microfluidic actuator using a microelectromechanical semiconductor process.

At present, in various fields, whether it is medicine, computer technology, printing, energy and other industries, products are developing in the direction of refinement and miniaturization. Among them, products such as micro pumps, sprayers, inkjet heads, and industrial printing devices include The fluid transport structure is its key technology.

With the rapid development of science and technology, the application of fluid transport structure is becoming more and more diversified. For example, industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., even the recent popular wearable devices can be seen in its shadow. The traditional fluid transport structure has gradually become a trend toward miniaturization of devices and maximization of flow.

In the prior art, although the micro-electromechanical process has been used to manufacture an integrated miniaturized fluid transport structure, but due to the shortcomings of too small displacement of the film piezoelectric layer, the existing miniaturized fluid transport structure often has an actuating fluid compression ratio The problem of insufficiency makes the transmission flow too small. Therefore, how to break through the technological bottleneck through innovative microstructure is an important content of development.

The main purpose of this case is to provide a method for manufacturing a microfluidic actuator, which is manufactured by a standardized microelectromechanical semiconductor manufacturing process. The microfluidic actuator is made of a semiconductor film to transport fluid. Therefore, when the depth of the membrane cavity is controlled to a very shallow range, the fluid compression ratio when the microfluidic actuator is actuated can still be increased.

A broad implementation aspect of this case is a method for manufacturing a microfluidic actuator, which includes the following steps: 1. A substrate is provided for depositing a cavity layer, the substrate has a first surface and a second surface, which are deposited through an oxide material On the first surface of the substrate, the cavity layer is formed; 2. The cavity layer is deposited with a vibration layer, which is deposited on the cavity layer through a nitride material to form the vibration layer; 3. The vibration layer is deposited and etched the moving layer, first A first metal material is deposited on the vibrating layer to form a lower electrode layer, a piezoelectric material is deposited on the lower electrode layer to form a piezoelectric actuation layer, and a second metal material is deposited on the piezoelectric actuation layer. An upper electrode layer is formed on the moving layer, and finally the actuating layer is defined by etching; 4. The substrate is etched with a plurality of flow channels, and one of the outlet flow channels and two inlet flow channels of the substrate are defined by etching, and the inlet flow channels are respectively symmetrical It is arranged on both sides of the outlet flow channel; 5. The substrate is deposited with a mask layer to etch a plurality of connecting flow channels, which are first deposited on the second surface of the substrate and in the outlet flow channel and the inlet flow channel through the oxide material to form a mask The cover layer then exposes the substrate through the perforations, and the substrate is etched at low temperature to define an outflow connection channel, a plurality of first inlet connection channels, and two second inlet connection channels, and a plurality of first inlet channels The connecting runners are symmetrically arranged on both sides of the outflow connecting runner, and the second inflow connecting runners are respectively arranged symmetrically on both sides of the outflow connecting runner and at one end of the plurality of first inflow connecting runners; 6. The cavity layer is etched into a storage chamber. The storage chamber is defined by etching in the cavity layer. The storage chamber is connected with the outflow connection channel, a plurality of first inlet connection channels and the second inlet connection The runners are connected; 7. Provide an orifice layer to etch a plurality of runner openings, the orifice layer defines an outlet and two inlets through etching, and the inlets are arranged symmetrically on both sides of the outlet; 8. The orifice layer is rolled on the dry film and lithography to create multiple channels of the first channel layer. The orifice layer is first rolled on the orifice layer through a dry film material to form a flow channel layer, and then the flow channel layer is passed through the lithography In the flow channel layer, an outflow channel connected to the outlet port, two inflow channels respectively connected to the inlet port, and a plurality of columnar structures are defined in the flow channel layer, and the plurality of columnar structures are symmetrically arranged in the outflow channel. The two sides and the inflow channel are respectively symmetrically arranged on both sides of the outflow channel; and 9. Flip chip alignment and thermal compression bonding runner layer, the runner layer is on the substrate through flip chip alignment and thermal compression bonding runner layer The second surface connects the outlet channel of the orifice layer with the outlet channel of the substrate. The inlet channel of the channel layer corresponds to the inlet channel of the substrate, and the inlet channel of the orifice layer corresponds to the inlet channel of the substrate. The channels are connected to form the overall structure of the microfluidic actuator.

Some typical embodiments embodying the features and advantages of this case will be described in detail in the description in the following paragraphs. It should be understood that this case can have various changes in different forms, and it does not deviate from the scope of this case, and the descriptions and illustrations therein are essentially used for explanation, not for limiting this case.

The microfluidic actuator in this case is used to transport fluid. Please refer to Figure 1. In the first embodiment of this case, the microfluidic actuator 100 includes: a substrate 1a, a cavity layer 1b, a vibration layer 1c, and a lower electrode The manufacturing method of the layer 1d, a piezoelectric actuation layer 1e, an upper electrode layer 1f, an orifice layer 1h, and a flow channel layer 1i is described in the following steps.

Referring to FIGS. 2 and 3A, as shown in step S1, a substrate is provided to deposit a cavity layer, and an oxide material is deposited on the first surface 11a of the substrate 1a to form the cavity layer 1b. In the first embodiment of the present case, the deposition process can be a physical vapor deposition process (PVD), a chemical vapor deposition process (CVD), or a combination of the two, but not limited thereto. In the first embodiment of this case, the substrate 1a is a silicon substrate, and the oxide material is a silicon dioxide material, but it is not limited to this.

Please continue to refer to FIGS. 2 and 3A. As shown in step S2, the cavity layer is deposited with a vibration layer, which is deposited on the cavity layer 1b through a nitride material to form the vibration layer 1c. In the first embodiment of the present case, the nitride material is a silicon nitride material, but it is not limited to this.

Please refer to Fig. 2, Fig. 3A and Fig. 3B. As shown in step S3, the vibration layer is deposited and etched into the motion layer. A first metal material is deposited on the vibration layer 1c to form the lower electrode layer 1d. A piezoelectric material is deposited on the lower electrode layer 1d to form a piezoelectric actuating layer 1e, and a second metal material is deposited on the piezoelectric actuating layer 1e to form an upper electrode layer 1f, followed by etching The lower electrode layer 1d, the piezoelectric actuation layer 1e, and the upper electrode layer 1f define an actuating layer M of a required size. In the first embodiment of this case, the first metal material is a platinum metal material or a titanium metal material, but it is not limited to this. In the first embodiment of this case, the second metal material is a gold metal material or an aluminum metal material, but it is not limited to this. It should be noted that, in the first embodiment of the present invention, the etching process can be a wet etching process, a dry etching process, or a combination of the two, but it is not limited thereto.

Please refer to FIGS. 2 and 3C. As shown in step S4, the substrate is etched with a plurality of flow channels, which are etched on the second surface 12a of the substrate 1a through a dry etching process to form an outlet flow channel 13a and two inlet flow channels 14a And the outlet flow channel 13a and the two inlet flow channels 14a have the same etching depth, and the etching depth is etched between the first surface 11a and the second surface 12a without penetrating the first surface 11a. The two inlet flow passages 14a are arranged symmetrically on both sides of the outlet flow passage 13a, respectively.

Please refer to Figure 2 and Figures 3D to 3F. As shown in step S5, a mask layer is deposited on the substrate to etch a plurality of connecting channels, which are first deposited on the second surface 12a of the substrate 1a through an oxide material and A mask layer 1g is formed in the outlet flow channel 13a and the inlet flow channel 14a, and a first flow hole 11g is formed in the outlet flow channel 13a through a precision perforation process, and a plurality of second flow holes are formed in the inlet flow channel 14a respectively. Hole 12g and a third circulation hole 13g. In the first embodiment of the present case, the pore size of the first circulation hole 11g is larger than the pore size of the third circulation hole 13g, and the pore size of each third circulation hole 13g is larger than the pore size of each second circulation hole 12g, but not limited to this . The perforation depth of the first circulation hole 11g, the plurality of second circulation holes 12g, and the two third circulation holes 13g is to reach the substrate 1a, so that the substrate 1a is exposed. In the first embodiment of this case, the precision perforation process is an excimer laser processing process, but it is not limited to this. It is worth noting that since the first circulation hole 11g, the plurality of second circulation holes 12g, and the third circulation hole 13g each have a depth, if they are formed through the lithography process, there will be a problem of difficulty in focusing, and the excimer laser processing There is no such problem in the manufacturing process.

Please refer to Figure 2, Figure 3F and Figure 4, continuing from the above, in the first embodiment of the present case, after forming a first circulation hole 11g, a plurality of second circulation holes 12g and a third circulation hole 13g, The low-temperature deep-etching process etches the portion of the substrate 1a corresponding to the first flow hole 11g, the plurality of second flow holes 12g, and the third flow hole 13g, thereby forming one of the substrate 1a outflow connection flow channels 15a and a plurality of first inlet flows Connect the flow channel 16a and the two second inlet flow connection flow channels 17a. The outflow connection channel 15a is formed by etching along the first circulation hole 11g until it contacts the cavity layer 1b, and the plurality of first inflow connection channels 16a are respectively etched along the plurality of second circulation holes 12g to the cavity layer 1b. It is constructed until contact, and the second inflow connection flow channel 17a is constructed by etching along the third flow hole 13g until contacting the cavity layer 1b. A plurality of first inlet connection flow passages 16a are symmetrically arranged on both sides of the outlet connection flow passage 15a, and two second inlet connection flow passages 17a are respectively arranged symmetrically on both sides of the outlet connection flow passage 15a, and are adjacent to each other. It is set at one end of the plurality of first inlet flow connecting flow channels 16a. In the first embodiment of this case, the low-temperature deep etching process is a deep reactive ion etching (BOSCH Process), but it is not limited to this.

Please refer to Fig. 2, Fig. 3E and Fig. 6A, continuing from the above, in the first embodiment of the present case, the mask layer 1g uses an excimer laser processing process to form a first flow hole 11g and a plurality of second flow holes For the hole 12g and the third circulation hole 13g, in order to avoid the deviation of the perforation position or the perforation angle, a buffer distance e is specially reserved on the side walls of the outlet flow channel 13a and the inlet flow channel 14a. In addition, the deep reactive ion etching process (BOSCH Process) only etches the silicon material of the substrate 1a, so the excimer laser processing process is used to leave an overetch depth t on the substrate 1a, which is conducive to the reliability and ease of the substrate 1a. Etching from the over-etching depth t forms an outflow connection channel 15a, a plurality of first inflow connection channels 16a and a second inflow connection channel 17a. In the first embodiment of the present case, the minimum pore diameter of the outlet connecting flow passage 15a, the plurality of first inlet connecting flow passages 16a, and the second inlet connecting flow passage 17a is 5-50 microns (μm), and the pore size depends on Depending on the nature of the fluid. Next, referring to Figures 3F and 6B, the outflow connecting flow passage 15a, each first inflow connecting flow passage 16a, and each second inflow connecting flow passage 17a have a perforation depth d and a perforation aperture s , The aspect ratio d/s of the formed connecting runner can reach 40. Considering the aspect ratio d/s of the proper connecting runner in the implementation of this processing process, the high temperature generated by the processing can avoid the influence of the piezoelectric material on the back Polarity distribution causes depolarization reaction.

Referring to FIGS. 2 and 3G, as shown in step S6, the cavity layer etches a storage chamber, and the cavity layer 1b etches a storage chamber 11b inside the cavity layer 1b through a wet etching process. That is, the permeated etching solution flows in through the first circulation hole 11g, the plurality of second circulation holes 12g, and the third circulation hole 13g, and passes through the outflow connection flow channel 15a, the plurality of first inlet connection flow channels 16a and the second inlet The flow connecting flow channel 17a flows to the cavity layer 1b, and then etches and releases the portion of the cavity layer 1b to be removed, thereby defining the flow storage chamber 11b. Thereby, the storage chamber 11b is in communication with the outflow connecting flow passage 15a, the plurality of first inflow connecting flow passages 16a and the second inflow connecting flow passage 17a. In the first embodiment of the present case, the wet etching process uses hydrofluoric acid (HF) etching solution to etch the cavity layer 1b, but it is not limited to this. In the first embodiment of the present case, the thickness of the cavity layer 1b is 1 to 5 microns (μm), but it is not limited thereto. It is worth noting that when the reservoir chamber 11b is formed through the wet time process, the mask layer 1g will also be removed. After completing the shaping of the reservoir chamber 11b and the removal of the mask layer 1g, the outlet channel 13a of the substrate 1a communicates with the outlet connection channel 15a, and the inlet channel 14a is respectively connected to a plurality of first inlet connection channels 16a and The second inflow connecting flow passage 17a is connected.

Please refer to Figures 3G and 6C. In the first embodiment of the present invention, the wet etching process is usually isotropic etching. In the first embodiment of the present invention, when etching the liquid storage chamber 11b, the liquid storage chamber 11b There is a cavity depth r, which is equal to the thickness of the cavity layer 1b, and the side etching distance generated by wet etching is r', so the cavity depth r is equal to the side etching distance r', which is an isotropic etching. And because the pores of the outlet connecting flow passage 15a, each first inlet connecting flow passage 16a, and each second inlet connecting flow passage 17a are only between 5-50 microns (μm), and the cavity depth r It is only between 1 to 5 microns (μm), so an over-etching is required when etching the liquid storage chamber 11b to increase the etching time to remove the unetched material. In the first embodiment of the present case, when the liquid storage chamber 11b is formed by the wet etching process, an overetching distance L will be generated, and the overetching distance L is greater than the side etching distance r', so that the liquid storage chamber 11b can be made The silicon dioxide material in the range is completely removed.

Please refer to Figure 2, Figure 3H and Figure 3I. As shown in step S7, an orifice layer is provided to etch a plurality of flow channel openings. One outlet flow channel opening 11h and two are etched in the orifice layer 1h through an etching process 12h into the flow channel. The two inlets 12h are symmetrically arranged on both sides of the outlet 11h. In the first embodiment of the present invention, the etching process of the orifice layer 1h can be a wet etching process, a dry etching process, or a combination of the two, but is not limited to this. In the first embodiment of the present case, the orifice layer 1h is a stainless steel material or a glass material, but it is not limited to this.

Please refer to Fig. 2, Fig. 3J, Fig. 3K and Fig. 5. As shown in step S8, the orifice layer is rolled and the dry film is lithographic to form a plurality of channels of the first channel layer, which is first passed through a dry film material Rolled on the orifice layer 1h to form a flow channel layer 1i, and then form an outflow channel 11i, two inflow channels 12i and a plurality of columnar structures 13i on the flow channel layer 1i through a lithography process, and form a flow channel The channel 11i communicates with the outlet opening 11h of the orifice plate layer 1h, and the inflow channel 12i is respectively connected with the inlet opening 12h of the orifice plate layer 1h. A plurality of columnar structures 13i are symmetrically arranged on both sides of the outflow channel 11i, and the inflow channel 12i is symmetrically arranged on both sides of the outflow channel 11i. In the embodiment of this case, a plurality of columnar structures 13i are staggered and formed in the inflow channel 12i (as shown in FIG. 5) to filter impurities in the fluid. In the first embodiment of the present case, the dry film material is a photosensitive polymer dry film, but it is not limited to this.

Please return to Figure 1 and Figure 2. As shown in step S9, the flow channel layer 1i is bonded to the substrate through a flip chip alignment process and a thermal compression process. The second surface 12a of 1a forms the actuating unit 10 of the microfluidic actuator 100 of this embodiment. Thereby, the outlet port 11h of the orifice layer 1h is connected to the outlet channel 13a of the substrate 1a through the outlet channel 11i of the flow channel layer 1i; and the inlet port 12h of the orifice layer 1h is respectively connected via the flow channel layer 1i. The inlet channel 12i communicates with the inlet channel 14a of the substrate 1a.

It is worth noting that, since the diameter of each third flow hole 13g is larger than the diameter of each second flow hole 12g, the plurality of first inflow connection channels 16a are arranged corresponding to the positions of the plurality of second flow holes 12g, And the second inlet connecting flow passages 17a are arranged corresponding to the positions of the third flow holes 13g, so the aperture of each second inlet connecting flow passage 17a is larger than the aperture of each first inlet connecting flow passage 16a. Furthermore, the second inlet connection flow passage 17a is arranged at an edge portion relative to the liquid storage chamber 11b, so the arrangement of the second inlet connection flow passage 17a facilitates the wet etching process of the liquid storage chamber 11b.

Please refer to FIGS. 7A and 7B. In the first embodiment of the present invention, the specific operation mode of the microfluidic actuator 100 is to provide driving power with opposite phase charges to the upper electrode layer 1f and the lower electrode layer 1d to drive And control the vibration layer 1c to produce up and down displacement. As shown in Figure 7A, when a positive voltage is applied to the upper electrode layer 1f and a negative voltage is applied to the lower electrode layer 1d, the piezoelectric actuation layer 1e drives the vibrating layer 1c to move away from the substrate 1a, whereby the external fluid is moved away from the substrate 1a. The inlet 12h of the orifice layer 1h is sucked into the microfluidic actuator 100, and the fluid entering the microfluidic actuator 100 then sequentially passes through the inlet channel 12i of the flow channel layer 1i and the inlet channel 14a of the substrate 1a. And a plurality of first inlet connecting flow passages 16a and second inlet connecting flow passages 17a of the substrate 1a are finally collected in the storage chamber 11b of the cavity layer 1b. As shown in Figure 7B, the electrical properties of the upper electrode layer 1f and the lower electrode layer 1d are then converted, and a negative voltage is applied to the upper electrode layer 1f and a positive voltage is applied to the lower electrode layer 1d, so that the vibrating layer 1c is displaced toward the direction close to the substrate 1a , The volume in the storage chamber 11b is compressed by the vibrating layer 1c, so that the fluid collected in the storage chamber 11b can sequentially pass through the outflow connecting channel 15a of the substrate 1a, the outlet channel 13a of the substrate 1a, and the flow channel After the outlet channel 11i of the layer 1i, the outlet 11h of the orifice layer 1h is discharged out of the microfluidic actuator 100 to complete the fluid transmission.

It is worth noting that when the microfluidic actuator 100 sucks in external fluid, part of the external fluid will be sucked into the microfluidic actuator 100 through the outlet 11h of the orifice layer 1h, but due to the outflow of the orifice layer 1h The aperture of the passage 11h is smaller than the aperture of the inlet 12h, so the amount of external fluid sucked from the outlet 11h is relatively small. When the microfluidic actuator 100 discharges fluid, the plurality of columnar structures 13i of the flow channel layer 1i will have a damping effect on the returning fluid. In addition, the second flow-in connection flow channel 17a of the substrate 1a corresponds to the piezoelectric actuator The edge position where the displacement of layer 1c is the smallest. Therefore, the amount of fluid discharged from the inlet port 12h is relatively small.

Furthermore, it is worth noting that the problem of excessive flow resistance of the plurality of first inlet connection channels 16a of the substrate 1a can be improved by adjusting the voltage waveform or lengthening the actuation time of the microfluidic actuator 100 to suck external fluid.

Please refer to FIG. 8. The second embodiment of the present invention is substantially the same as the first embodiment, except that the microfluidic actuator 100 ′ includes two actuation units 10 to increase the flow output.

Please refer to Fig. 9. In other embodiments of the present case, the microfluidic actuator 100" includes a plurality of actuation units 10. The plurality of actuation units 10 can be arranged in series, parallel or series-parallel to increase the flow output. The arrangement of the plurality of actuation units 10 can be designed according to the usage requirements, and is not limited thereto.

It is worth noting that in the second embodiment of the present case, each actuation unit 10 has a symmetrical structure. In other embodiments of the present case, the structure of each actuation unit 10 can be designed according to usage requirements. Limit this.

This case provides a manufacturing method of a microfluidic actuator, which is mainly completed by a microelectromechanical semiconductor manufacturing process, and by applying driving power of different phase charges to the upper electrode layer and the lower electrode layer, the vibrating layer is displaced up and down to achieve Fluid transfer. In this way, the microfluidic actuator can increase the fluid compression ratio during operation to make up for the shortcomings of too small displacement of the piezoelectric layer, achieve the feasibility of transferring fluids and produce great transmission efficiency in the ultra-miniature structure, which is extremely industrial. To use the value, Yan filed an application in accordance with the law.

This case may be modified by any person familiar with the technology, such as Shi Shisi, but none of them are as protected as the scope of the patent application.

100, 100', 100": Microfluidic actuator 10: Actuating unit 1a: Substrate 11a: First surface 12a: Second surface 13a: Outlet flow channel 14a: Inlet flow channel 15a: Outflow connection flow channel 16a: The first inlet flow connection flow channel 17a: the second inlet flow connection flow channel 1b: the cavity layer 11b: the storage chamber 1c: the vibration layer 1d: the lower electrode layer 1e: the piezoelectric actuation layer 1f: the upper electrode layer 1g: shield Cover layer 11g: first flow hole 12g: second flow hole 13g: third flow hole 1h: orifice layer 11h: outlet opening 12h: inlet opening 1i: flow channel layer 11i: outlet channel 12i: inlet channel 13i: Columnar structure e: buffer distance t: over-etching depth d: perforation depth s: perforation aperture r: cavity depth r': side etching distance L: over-etching distance M: actuation layer S1~S9: microfluidic actuator The steps of the manufacturing method

Figure 1 is a schematic cross-sectional view of the first embodiment of the microfluidic actuator of the present invention. Figure 2 is a schematic flow diagram of the manufacturing method of the first embodiment of the microfluidic actuator of the present invention. Figures 3A to 3K are exploded schematic views of the manufacturing steps of the first embodiment of the microfluidic actuator of the present invention. Figure 4 is a schematic top view of the first embodiment of the microfluidic actuator of the present invention. Figure 5 is a schematic bottom view of the first embodiment of the microfluidic actuator of the present invention. Figures 6A to 6C are exploded schematic diagrams of the etching steps of the inlet connecting flow channel of the first embodiment of the microfluidic actuator of the present invention. Figures 7A to 7B are schematic diagrams of the operation of the first embodiment of the microfluidic actuator of the present invention. Figure 8 is a schematic cross-sectional view of the second embodiment of the microfluidic actuator of the present invention. Figure 9 is a schematic bottom view of other embodiments of the present invention.

S1~S9: Steps of manufacturing method of microfluidic actuator

Claims (23)

A method for manufacturing a microfluidic actuator includes the following steps: 1. A substrate is provided for depositing a cavity layer, the substrate has a first surface and a second surface, and is deposited on the first surface of the substrate through an oxide material. 2. The cavity layer is deposited on the surface to form the cavity layer; 2. The cavity layer is deposited with a vibration layer, which is deposited on the cavity layer through a nitriding material to form the vibration layer; 3. The vibration layer is deposited and etched as a motion layer, first A first metal material is deposited on the vibration layer to form a lower electrode layer, a piezoelectric material is deposited on the lower electrode layer to form a piezoelectric actuation layer, and a second metal material is deposited on the An upper electrode layer is formed on the piezoelectric actuation layer, and finally the actuation layer is defined by etching; 4. The substrate is etched with a plurality of channels, and one of the outlet channels and two inlet channels of the substrate are defined by etching , The inlet flow channels are respectively symmetrically arranged on both sides of the outlet flow channel; 5. The substrate deposits a mask layer to etch a plurality of connecting flow channels, which are first deposited on the second surface of the substrate through the oxide material And in the outlet flow channel and the inlet flow channels, the mask layer is formed, and the substrate is exposed through the perforation. The substrate is etched at low temperature to define an outflow connection channel and a plurality of first inlet connections The flow channel and the two second inlet flow connection flow channels, the plurality of first inlet flow connection flow channels are symmetrically arranged on both sides of the outlet flow connection flow channel, and the second inlet flow connection flow channels are respectively symmetrically arranged on the The outflow is connected to both sides of the flow channel, and at one end of the plurality of first inflow connection flow channels; 6. The cavity layer is etched with a storage chamber, and the storage chamber is defined by etching in the cavity layer , The storage chamber is communicated with the outlet connection flow channel, the plurality of first inlet connection flow channels and the second inlet connection flow channels; 7. Provide an orifice layer to etch a plurality of flow channel openings, The orifice layer is etched to define an outlet and two inlets, and the inlets are symmetrically arranged on both sides of the outlet; 8. The orifice layer is rolled by dry film and lithography to make a first channel The orifice layer is first rolled on the orifice layer through a dry film material to form the flow channel layer, and then the flow channel layer is defined in the flow channel layer through a lithography process. The outlet port is connected to an outlet channel, two inlet channels respectively connected to the inlet port openings, and a plurality of columnar structures, the plurality of columnar structures are symmetrically arranged on both sides of the outlet channel, and the The inflow channels are arranged symmetrically on both sides of the outflow channel; and 9. Flip chip alignment and thermal compression bonding the flow channel layer, the flow channel layer is bonded to the flow channel layer through flip chip alignment and thermal compression The second surface of the substrate connects the outlet channel of the orifice layer with the outlet channel of the substrate, and the inlet channels of the channel layer respectively correspond to the inlet channels of the substrate, And the inlet channels of the orifice layer are respectively communicated with the inlet channels of the substrate to form the overall structure of the microfluidic actuator. The method for manufacturing a microfluidic actuator as described in the first item of the scope of patent application, wherein the outlet flow channel is connected to the outlet flow channel, and the plurality of first inlet flow channels and the second inlet flow channels are connected The flow connection flow channels are respectively communicated with the inlet flow channels. According to the method of manufacturing a microfluidic actuator described in the scope of the patent application, step 5 further includes the steps of forming a first circulation hole through the perforation in the outlet flow channel, and respectively forming a first flow hole through the perforation A plurality of second circulation holes and two third circulation holes are formed in the inlet flow channel to expose the substrate. According to the manufacturing method of the microfluidic actuator described in the first item of the patent application, the low-temperature deep etching is a deep reactive ion etching process. According to the method for manufacturing the microfluidic actuator described in the scope of the patent application, step 6 is to etch the storage chamber inside the cavity layer through a hydrofluoric acid wet etching process. The method for manufacturing a microfluidic actuator as described in item 5 of the scope of patent application, wherein the hydrofluoric acid wet etching penetrates the etchant through the outflow connection flow channel, the plurality of first inlet flow connection flow channels and the The second inlet connecting flow channel flows to the cavity layer, and the portion of the cavity layer is released and removed to define the storage chamber, thereby forming the storage chamber and the outflow connecting flow passage, the plurality of first An inflow connecting flow channel and the second inflow connecting flow channels are connected. According to the method for manufacturing a microfluidic actuator as described in claim 1, wherein the plurality of columnar structures are developed and formed in the inlet channels. The method for manufacturing a microfluidic actuator as described in the first item of the patent application, wherein the substrate is a silicon substrate. The method for manufacturing a microfluidic actuator as described in the first item of the scope of patent application, wherein the oxidizing material is a silicon dioxide material. According to the manufacturing method of the microfluidic actuator described in claim 1, wherein the first metal material is a platinum metal material. According to the method for manufacturing a microfluidic actuator as described in claim 1, wherein the first metal material is a titanium metal material. According to the manufacturing method of the microfluidic actuator described in the first item of the scope of patent application, the second metal material is a gold metal material. According to the manufacturing method of the microfluidic actuator described in claim 1, wherein the second metal material is an aluminum metal material. The method for manufacturing a microfluidic actuator as described in the first item of the patent application, wherein the nitride material is a silicon nitride material. The manufacturing method of the microfluidic actuator described in the first item of the patent application, wherein the orifice plate layer is a stainless steel material. The manufacturing method of the microfluidic actuator described in the first item of the patent application, wherein the orifice layer is a glass material. According to the method for manufacturing a microfluidic actuator described in the first item of the patent application, the dry film material is a photosensitive polymer dry film. The method for manufacturing a microfluidic actuator as described in the first item of the scope of patent application, wherein driving power with different phase charges is provided to the upper electrode layer and the lower electrode layer to drive and control the vibration layer to produce up and down displacement , The fluid is sucked in from the inlets, flows to the storage chamber through the plurality of first inlet connection channels and the second inlet connection channels, and finally squeezed through the outlet connection channel , Discharge from the outlet to complete fluid transfer. The method for manufacturing a microfluidic actuator as described in claim 18, wherein after the fluid is sucked in from the inlets, it sequentially passes through the inlet channels, the inlet channels and the plurality of first inlets The connecting flow channel and the second inflow connecting flow channels flow into the storage chamber. The method for manufacturing a microfluidic actuator as described in item 18 of the scope of patent application, wherein the fluid in the storage chamber is squeezed and sequentially passes through the outflow connecting flow channel, the outlet flow channel, and the outlet flow After the passage, discharge from the outlet of the outlet. The method for manufacturing a microfluidic actuator as described in claim 18, wherein a positive voltage is applied to the upper electrode layer and a negative voltage is applied to the lower electrode layer, so that the piezoelectric actuation layer drives the vibrating layer away from The direction of the substrate is displaced, the external fluid has to be sucked into the microfluidic actuator through the inlets, and the fluid entering the microfluidic actuator passes through the inlet channels and the inlet channels in sequence. , And the plurality of first inlet connection flow passages and the second inlet connection flow passages are collected in the storage chamber, and then a negative voltage is applied to the upper electrode layer and a positive voltage is applied to the lower electrode layer, The vibrating layer is displaced toward the direction close to the substrate, so that the volume in the storage chamber is compressed by the vibrating layer, and the fluid collected in the storage chamber can sequentially pass through the outflow connecting flow channel, the outlet flow channel and the After the outflow channel is discharged from the outflow channel port to the outside of the microfluidic actuator, the fluid transmission is completed. A method for manufacturing a microfluidic actuator includes the following steps: 1. A substrate is provided for depositing a cavity layer, the substrate has a first surface and a second surface, and is deposited on the first surface of the substrate through an oxide material. 2. The cavity layer is deposited on the surface to form the cavity layer; 2. The cavity layer is deposited with a vibration layer, which is deposited on the cavity layer through a nitride material to form the vibration layer; 3. The vibration layer deposits and etches a plurality of actuation layers, A first metal material is deposited on the vibration layer to form a lower electrode layer, a piezoelectric material is deposited on the lower electrode layer to form a piezoelectric actuation layer, and then a second metal material is deposited An upper electrode layer is formed on the piezoelectric actuation layer, and finally the plurality of actuation layers are defined by etching; 4. The substrate is etched with a plurality of flow channels, and a plurality of outlet flow channels of the substrate are defined by etching And a plurality of inlet flow channels, two of the inlet flow channels are symmetrically arranged on both sides of each outlet flow channel; 5. The substrate is deposited with a mask layer to etch a plurality of connecting flow channels, which are first deposited on the substrate through the oxide material On the second surface of the substrate and in the plurality of outlet flow channels and the plurality of inlet flow channels to form the mask layer, the substrate is exposed through the through hole, and the substrate is etched to define a plurality of outlets Flow connection flow channels, a plurality of first inlet flow connection flow channels and a plurality of second inlet flow connection flow channels, the plurality of first inlet flow connection flow channels are symmetrically arranged on both sides of each outflow connection flow channel, and Two second inlet connection flow channels are symmetrically arranged on both sides of each of the outflow connection flow channels; 6. The cavity layer is etched with a plurality of storage chambers, and the plurality of storage chambers are defined by etching in the cavity layer A flow storage chamber, the plurality of flow storage chambers are respectively communicated with the plurality of outflow connection channels, the plurality of first inlet connection channels, and the plurality of second inlet connection channels; 7. Provide an orifice plate layer to etch a plurality of flow passage openings, the orifice plate layer defines a plurality of outlet passage openings and a plurality of inlet passage openings through etching, and two inlet passage openings are symmetrically arranged on both sides of each outlet passage opening; 8. The orifice layer is rolled dry film and lithography to form a plurality of channels of the first channel layer. The orifice layer is first rolled on the orifice layer through a dry film material to form the flow channel layer, and then the flow channel layer is formed. The channel layer defines a plurality of outflow channels respectively connected to the plurality of outflow channel openings, a plurality of inflow channels respectively connected to the plurality of inlet channel openings, and a plurality of columnar shapes in the channel layer through the lithography process. Structure, the plurality of columnar structures are symmetrically arranged on both sides of each outflow channel, and two inflow channels are symmetrically arranged on both sides of each outflow channel; and 9. flip chip alignment and thermocompression bonding The flow channel layer, the flow channel layer is bonded to the second surface of the substrate by flip chip alignment and thermal compression bonding, so that the plurality of flow channel openings of the orifice layer are respectively connected to the substrate The plurality of outlet channels are connected, the plurality of inlet channels of the flow channel layer respectively correspond to the plurality of inlet channels of the substrate, and the plurality of inlet channels of the orifice layer are respectively connected with the plurality of the substrate The inlet flow channel is connected to form the entire microfluidic actuator体结构。 Body structure. A method for manufacturing a microfluidic actuator includes the following steps: 1. A substrate is provided for depositing a cavity layer, the substrate has a first surface and a second surface, and is deposited on the first surface of the substrate through an oxide material. 2. The cavity layer is deposited on the surface to form the cavity layer; 2. The cavity layer is deposited with a vibration layer, which is deposited on the cavity layer through a nitride material to form the vibration layer; 3. The vibration layer deposits and etches at least the motion layer, which is A first metal material is deposited on the vibration layer to form a lower electrode layer, a piezoelectric material is deposited on the lower electrode layer to form a piezoelectric actuation layer, and a second metal material is deposited on An upper electrode layer is formed on the piezoelectric actuating layer, and finally the at least actuating layer is defined by etching; 4. The substrate is etched with a plurality of channels, and at least one outlet channel and at least of the substrate are defined by etching. An inlet flow channel; 5. The substrate is deposited with a mask layer to etch a plurality of connecting flow channels, which are first deposited on the second surface of the substrate through the oxide material and the at least one outlet flow channel and the at least one inlet flow In the channel, the mask layer is formed, and the substrate is exposed through the through hole. The substrate is etched at low temperature to define at least one outflow connection channel, a plurality of first inflow connection channels and at least one second inflow channel Connecting the flow channel; 6. The cavity layer is etched with at least one storage chamber, the at least one storage chamber is defined by etching in the cavity layer, and the at least one storage chamber is connected to the at least one outlet flow channel , The plurality of first inlet connection flow passages and the at least one second inlet connection flow passage are connected; 7. An orifice plate layer is provided to etch a plurality of flow passage openings, and the orifice plate layer defines at least one outlet flow through etching A crossing and at least a first-grade crossing; 8. The orifice layer is rolled with dry film and lithography to form a plurality of channels for the first-grade layer. The orifice layer is first rolled on the orifice layer through a dry film material to form the In the runner layer, at least one outflow channel connected to the at least one outflow channel opening and at least one inflow channel connected to the at least one inflow channel opening are defined in the flow channel layer through a lithography process Channels and a plurality of columnar structures; and 9. Flip-chip alignment and thermal compression bonding of the flow channel layer, the flow channel layer is bonded to the second surface of the substrate by flip chip alignment and thermal compression bonding the flow channel layer , Making the at least one outlet channel of the orifice layer communicate with the at least one outlet channel of the substrate, the at least one inlet channel of the channel layer corresponds to the at least one inlet channel of the substrate, and the The at least one inlet flow channel of the orifice layer is communicated with the at least one inlet flow channel of the substrate to form the overall structure of the microfluidic actuator.

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