CN111252727A

CN111252727A - Microfluidic actuator

Info

Publication number: CN111252727A
Application number: CN201811451909.3A
Authority: CN
Inventors: 莫皓然; 余荣侯; 张正明; 戴贤忠; 廖文雄; 黄启峰; 韩永隆; 蔡长谚
Original assignee: Microjet Technology Co Ltd
Current assignee: Microjet Technology Co Ltd
Priority date: 2018-11-30
Filing date: 2018-11-30
Publication date: 2020-06-09

Abstract

A micro-fluid actuator comprises a substrate, a cavity layer, a vibration layer, a lower electrode layer, a piezoelectric actuation layer, an upper electrode layer, an orifice plate layer and a flow channel layer. The substrate is etched to form an outlet hole, a first inlet hole and a second inlet hole. The cavity layer is formed on the substrate, and the flow storage cavity is formed through an etching process. The vibration layer is formed on the cavity layer. The lower electrode layer is formed on the vibration layer. The piezoelectric actuation layer is formed on the lower electrode layer. The upper electrode layer is formed on the piezoelectric actuation layer. The aperture plate layer is etched to form a flow outlet and a flow inlet. The flow channel layer is formed on the aperture plate layer, forms an outflow channel and an inflow channel through a photoetching process, and is jointed with the substrate. And providing a driving power source to the upper electrode layer and the lower electrode layer to drive and control the vibration layer to generate up-and-down displacement so as to complete fluid transmission.

Description

Microfluidic actuator

[ technical field ] A method for producing a semiconductor device

The present disclosure relates to an actuator, and more particularly, to a micro-fluid actuator fabricated using a micro-electromechanical semiconductor film.

[ background of the invention ]

At present, in various fields, no matter in medicine, computer technology, printing, energy and other industries, products are developed toward refinement and miniaturization, wherein fluid actuators included in products such as micropumps, sprayers, inkjet heads, industrial printing devices and the like are key technologies.

With the development of technology, the applications of fluid conveying structures are becoming more diversified, such as industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., and even recently, the image of a wearable device is seen in a hot-door wearable device, which shows that the conventional fluid actuators have gradually tended to be miniaturized and maximized in flow rate.

In the prior art, although there is a micro-fluid actuator manufactured by using a micro-electro-mechanical process, the flow rate transmitted by the micro-fluid actuator is insufficient due to the small displacement of the piezoelectric layer during operation, so that how to break through the technical bottleneck of the micro-fluid actuator by means of an innovative structure is an important content of development.

[ summary of the invention ]

The present invention is directed to a micro-fluid actuator, which is fabricated by a micro-electromechanical semiconductor process and can transmit fluid. The micro-fluid actuator is made of a semiconductor film, and the depth of the flow storage cavity can be designed to be very shallow, so that the fluid compression ratio during actuation is increased, and the defect that the displacement of the piezoelectric layer is too small is overcome.

One broad aspect of the present disclosure is a micro-fluidic actuator comprising a substrate, a cavity layer, a vibration layer, a lower electrode layer, a piezoelectric actuation layer, an upper electrode layer, an aperture plate layer, and a channel layer. The substrate has a first surface and a second surface, and an outlet groove, two inlet grooves, an outlet hole, a plurality of first inlet holes and two second inlet holes are formed by etching. The outlet groove is communicated with the outflow hole. Each inlet groove is communicated with part of the plurality of first inflow holes and the corresponding second inflow holes. The inlet grooves are respectively and symmetrically arranged at two sides of the outlet groove. A plurality of first influent stream holes are symmetrically arranged at two sides of the effluent stream hole. The second inflow holes are respectively and symmetrically arranged at two sides of the outflow hole and at one end of the first inflow holes. The cavity layer is formed on the first surface of the substrate through a deposition process, and a flow storage cavity is formed through an etching process. The flow storage chamber is communicated with the outflow hole, the first inflow holes and the second inflow holes. The vibration layer is formed on the cavity layer by a deposition process. The lower electrode layer is formed on the vibration layer through a deposition process and an etching process. The piezoelectric actuating layer is formed on the lower electrode layer through a deposition process and an etching process. The upper electrode layer is formed on the piezoelectric actuation layer through a deposition process and an etching process. The aperture plate layer is formed with an outlet and two inlets by etching process. The inlet ports are respectively and symmetrically arranged at two sides of the outlet port. The flow channel layer is formed on the hole plate layer through a dry film material rolling process, an outflow channel, two inflow channels and a plurality of columnar structures are formed through a photoetching process, and the flow channel layer is connected to the second surface of the substrate through a flip chip alignment process and a hot pressing process. The inflow channels are respectively and symmetrically arranged at two sides of the outflow channel. A plurality of columnar structures are symmetrically arranged on two sides of the outflow channel. The outflow port of the orifice layer is communicated with the outlet groove of the substrate through the outflow channel. The inlet of the orifice plate layer is respectively communicated with the inlet groove of the substrate through the inlet channel. And providing a driving power supply with different phase charges to the upper electrode layer and the lower electrode layer to drive and control the vibration layer to generate vertical displacement, so that the fluid is sucked from the inlet, flows to the fluid storage chamber through the first inlet holes and the second inlet holes, and is extruded through the outlet holes and then is discharged from the outlet to finish fluid transmission.

[ description of the drawings ]

Fig. 1 is a schematic cross-sectional view of a first embodiment of the microfluidic actuator of the present disclosure.

Fig. 2A to 2K are exploded views illustrating the manufacturing steps of the first embodiment of the present disclosure.

Fig. 3 is a schematic top view of the first embodiment of the present disclosure.

Fig. 4 is a schematic bottom view of the first embodiment of the present disclosure.

Fig. 5A to 5C are exploded views illustrating an etching process of an inlet hole according to a first embodiment of the present disclosure.

Fig. 6A to 6B are operation diagrams of the first embodiment of the present disclosure.

Fig. 7 is a schematic cross-sectional view of a second embodiment of the microfluidic actuator of the present disclosure.

Fig. 8 is a schematic bottom view of another embodiment of the disclosure.

[ detailed description ] embodiments

Exemplary embodiments that embody features and advantages of this disclosure are described in detail below in the detailed description. It will be understood that the present disclosure is capable of various modifications without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Referring to fig. 1, in an embodiment of a microfluidic actuator 100 for delivering a fluid, the microfluidic actuator includes: a substrate 1a, a cavity layer 1b, a vibration layer 1c, a lower electrode layer 1d, a piezoelectric layer 1e, an upper electrode layer 1f, an aperture plate layer 1h and a channel layer 1 i. The flow channel layer 1i, the orifice plate layer 1h, the substrate 1a, the cavity layer 1b, the vibration layer 1c, the lower electrode layer 1d, the piezoelectric actuation layer 1e, and the upper electrode layer 1f are stacked and bonded in this order to form a single body, and the configuration thereof is as described below. In the first embodiment, the micro-fluid actuator 100 comprises an actuating unit 10.

Referring to fig. 2A, in the first embodiment of the present invention, a substrate 1a is a silicon substrate. The substrate 1a has a first surface 11a and a second surface 12a opposite to the first surface 11 a. In the first embodiment, the cavity layer 1b is formed on the first surface 11a of the substrate 1a by a silicon dioxide material deposition process, which may be a physical vapor deposition Process (PVD), a chemical vapor deposition process (CVD), or a combination thereof, but is not limited thereto. In the first embodiment, the vibration layer 1c is formed on the cavity layer 1b by a silicon nitride material deposition process. In the first embodiment of the present disclosure, the lower electrode layer 1d is formed on the vibration layer 1c by a metal material deposition process, and the lower electrode layer 1d is a platinum metal material or a titanium metal material, but not limited thereto. In the first embodiment, the piezoelectric actuation layer 1e is formed on the lower electrode layer 1d by a piezoelectric material deposition process. In the first embodiment, the upper electrode layer 1f is formed on the piezoelectric actuation layer 1e by a metal material deposition process, and the upper electrode layer 1f is a gold metal material or an aluminum metal material, but not limited thereto. It is noted that the structure shown in fig. 2A is a structure that can be fabricated by the conventional process technology, and therefore has the advantage of low cost.

Referring to fig. 2B, in the first embodiment of the present invention, the lower electrode layer 1d, the piezoelectric actuation layer 1e and the upper electrode layer 1f are etched by photolithography and etching processes to define an active region M. It should be noted that, in the first embodiment of the present invention, the etching process may be a wet etching process, a dry etching process or a combination of the two, but not limited thereto.

Referring to fig. 2C, in the first embodiment, the second surface 12a of the substrate 1a is etched by a dry etching process to form an outlet trench 13a and two inlet trenches 14 a. The outlet trench 13a and the inlet trench 14a have the same etching depth, and the etching depth is such that the etching depth is between the first surface 11a and the second surface 12a and is not in contact with the cavity layer 1 b. The inlet grooves 14a are symmetrically disposed at both sides of the inlet groove 13a, respectively.

Referring to fig. 2D and 2E, in the first embodiment of the present invention, a masking layer 1g is formed on the second surface 12a of the substrate 1a and in the outlet trench 13a and the inlet trench 14a by a silicon dioxide material deposition process. The mask layer 1g is then formed with a first through hole 11g in the outlet trench 13a by a precision drilling process, and a plurality of second through holes 12g and a third through hole 13g are formed in the inlet trench 14a, respectively. In the first embodiment of the present disclosure, the aperture of the first through hole 11g is larger than the aperture of the third through hole 13g, and the aperture of the third through hole 13g is larger than the aperture of each second through hole 12g, but not limited thereto. The first, second, and

third flow holes

11g, 12g, and 13g are formed to have a depth of penetration until they come into contact with the substrate 1a, so that the substrate 1a is exposed. In the first embodiment, the precise via process is an excimer laser processing process, but not limited thereto.

Referring to fig. 2E, 2F and 3, in the first embodiment of the present invention, the substrate 1a is etched through a low temperature deep etching process on portions of the substrate 1a corresponding to the first through hole 11g, the second through holes 12g and the third through hole 13g, so as to form an outflow hole 15a, a plurality of first inflow holes 16a and two second inflow holes 17a of the substrate 1 a. The outflow holes 15a are formed by etching along the first through holes 11g until they contact the cavity layer 1b, the first inflow holes 16a are formed by etching along the second through holes 12g until they contact the cavity layer 1b, and the second inflow holes 17a are formed by etching along the third through holes 13g until they contact the cavity layer 1 b. A plurality of first inlet holes 16a are symmetrically arranged on both sides of the outlet holes 15 a. The second inlet holes 17a are symmetrically disposed at two sides of the outlet hole 15a, respectively, and are located at one end of the first inlet holes 16 a. In the first embodiment, the low temperature deep etching Process is a deep reactive ion etching (BOSCH Process), but not limited thereto. Referring to fig. 2E and 5A, in the first embodiment of the present invention, when the mask layer 1g forms the first through hole 11g, the second through holes 12g and the third through hole 13g by using an excimer laser processing process, a buffer distance E is specially reserved on the sidewalls of the outlet trench 13a and the inlet trench 14a to avoid the deviation of the perforation position or the perforation angle. In addition, since the silicon substrate of the substrate 1a is only etched by the deep reactive ion etching Process (BOSCH Process), an over-etching depth t is left on the substrate 1a by the excimer laser processing Process, which is beneficial for the substrate 1a to be etched from the over-etching depth t to form the exit hole 15a, the plurality of first entrance holes 16a and the second entrance holes 17 a. In the first embodiment, the minimum aperture of the exit hole 15a, the plurality of first entrance holes 16a and the second entrance holes 17a is 5-50 μm, and the size of the aperture depends on the fluid property. Referring to fig. 2F and 5B, the exit holes 15a, each of the first entrance holes 16a, and each of the second entrance holes 17a have a perforation depth d and a perforation aperture s, and the aspect ratio d/s of the formed holes can reach 40.

Referring to fig. 2E and 2G, in the first embodiment of the present invention, the cavity layer 1b is etched to form a fluid storage chamber 11b therein by a wet etching process. That is, the etching solution flows in from the first through hole 11g, the second through holes 12g and the third through hole 13g, flows to the cavity layer 1b through the outflow hole 15a, the first inflow holes 16a and the second inflow holes 17a, and etches and releases the portion of the cavity layer 1b, thereby defining a flow storage chamber 11 b. Thereby, the flow storage chamber 11b communicates with the outlet hole 15a, the plurality of first inlet holes 16a and the second inlet holes 17 a. In the first embodiment, the wet etching process utilizes a hydrofluoric acid (HF) etching solution to etch the cavity layer 1b, but not limited thereto. In the first embodiment, the thickness of the cavity layer 1b is 1 to 5 μm, but not limited thereto. It is noted that the mask layer 1g is also removed at the same time as the flow storage chamber 11b is formed by a wet etching process. After the formation of the fluid storage chamber 11b and the removal of the mask layer 1g are completed, the outlet groove 13a of the substrate 1a communicates with the outlet hole 15a, and the inlet groove 14a communicates with the first inlet holes 16a and the second inlet holes 17a, respectively. Referring to fig. 2G and fig. 5C, in the first embodiment, the wet etching process is usually isotropic etching, and in the first embodiment, when the liquid storage chamber 11b is etched, the liquid storage chamber 11b has a cavity depth r, which is equal to the thickness of the cavity layer 1b, and the undercut distance generated by the wet etching is r ', so that the cavity depth r and the undercut distance r' are equal, which is isotropic etching. Since the apertures of the exit holes 15a, each of the first inlet holes 16a and each of the second inlet holes 17a are only between 5 to 50 micrometers (μm), and the cavity depth r is only between 1 to 5 micrometers (μm), an over-etching process is required to etch the liquid storage chamber 11b, so as to prolong the etching time to completely remove the unetched remainder. In the first embodiment, when the liquid storage chamber 11b is formed by performing the wet etching process, an over-etching distance L is generated, and the over-etching distance L is greater than the under-etching distance r', so that the silicon dioxide material within the liquid storage chamber 11b can be completely removed.

Referring to fig. 2H and 2I, in the first embodiment of the present invention, a hole plate layer 1H is provided, and an outlet 11H and two inlets 12H are etched in the hole plate layer 1H through an etching process. The inlet 12h is symmetrically disposed on both sides of the outlet 11 h. In the first embodiment, the etching process of the aperture plate layer 1h may be a wet etching process, a dry etching process or a combination thereof, but not limited thereto. In the first embodiment of the present disclosure, the aperture plate layer 1h is made of a stainless material or a glass material, but not limited thereto.

Referring to fig. 2J, fig. 2K and fig. 4, in the first embodiment of the present disclosure, the flow channel layer 1i is formed on the aperture plate layer 1h through a dry film material rolling process, and an outflow channel 11i, two inflow channels 12i and a plurality of columnar structures 13i are formed on the flow channel layer 1i through a photolithography process, and the outflow channel 11i is formed to be communicated with the outflow port 11h of the aperture plate layer 1h, and the inflow channels 12i are formed to be respectively communicated with the inflow ports 12h of the aperture plate layer 1 h. The inlet channels 12i are respectively symmetrically arranged at two sides of the outlet channel 11 i. In the first embodiment of the present disclosure, a plurality of pillar structures 13i are formed in the inlet channel 12i in a staggered manner (as shown in fig. 4) for filtering impurities in the fluid. In the first embodiment of the present disclosure, the dry film material is a photosensitive polymer dry film, but not limited thereto.

Referring back to fig. 1, the flow channel layer 1i is finally bonded to the second surface 12a of the substrate 1a by flip chip alignment and a thermal compression process to form the actuating unit 10 of the micro-fluidic actuator 100. Therefore, the outflow port 11h of the orifice layer 1h is communicated with the outlet groove 13a of the substrate 1a through the outflow channel 11i of the channel layer 1 i; and the inlet 12h of the orifice plate layer 1h is respectively communicated with the inlet groove 14a of the substrate 1a through the inlet channel 12i of the flow channel layer 1 i.

Referring to fig. 6A and 6B, in the first embodiment of the present invention, the micro-fluid actuator 100 provides a driving power source with opposite phase charges to the upper electrode layer 1f and the lower electrode layer 1d to drive and control the vibrating layer 1c to move up and down. As shown in fig. 6A, when a positive voltage is applied to the upper electrode layer 1f and a negative voltage is applied to the lower electrode layer 1d, the piezoelectric actuation layer 1e drives the vibration layer 1c to move in a direction away from the substrate 1a, so that the external fluid is sucked into the micro-fluid actuator 100 from the inlet 12h of the aperture plate layer 1h, and the fluid entering the micro-fluid actuator 100 then sequentially passes through the inlet channel 12i of the channel layer 1i, the inlet groove 14a of the substrate 1a, and the first inlet holes 16A and the second inlet holes 17a of the substrate 1a, and finally collects in the flow storage chamber 11b of the cavity layer 1 b. As shown in fig. 6B, the electrical properties of the upper electrode layer 1f and the lower electrode layer 1d are then switched, and a negative voltage is applied to the upper electrode layer 1f and a positive voltage is applied to the lower electrode layer 1d, so that the vibration layer 1c is displaced toward the substrate 1a, and the volume of the fluid storage chamber 11B is compressed by the vibration layer 1c, so that the fluid collected in the fluid storage chamber 11B is discharged from the outlet 11h of the orifice layer 1h to the outside of the micro fluid actuator 100 after sequentially passing through the outlet hole 15a of the substrate 1a, the outlet groove 13a of the substrate 1a and the outlet channel 11i of the channel layer 1i, thereby completing the fluid transmission.

It is to be noted that when the microfluidic actuator 100 sucks in external fluid, part of the external fluid may be sucked into the microfluidic actuator 100 from the outlet 11h of the orifice plate layer 1h, but since the aperture of the outlet 11h of the orifice plate layer 1h is smaller than that of the inlet 12h, the external fluid is sucked in from the outlet 11h by a relatively small amount. When the micro fluid actuator 100 discharges the fluid, the plurality of pillar structures 13i of the flow channel layer 1i generate a damping effect on the reflowed fluid, and the second flow hole 17a of the substrate 1a corresponds to an edge position where the displacement of the piezoelectric actuation layer 1c is minimum. The amount of fluid discharged from the inlet port 12h is relatively small.

Furthermore, it should be noted that the problem of the flow resistance of the first inlet holes 16a of the substrate 1a can be improved by adjusting the voltage waveform or extending the operation time of the micro-fluid actuator 100 to suck the external fluid.

Referring to fig. 7, a second embodiment of the present invention is substantially the same as the first embodiment except that the micro-fluid actuator 100' includes two actuating units 10 to increase the flow output.

Referring to fig. 8, in another embodiment of the present disclosure, a micro-fluidic actuator 100 ″ includes a plurality of actuating units 10. The plurality of actuating units 10 may be arranged in series, in parallel, or in series-parallel to increase the flow output, and the arrangement of the plurality of actuating units 10 may be designed according to the usage requirement, which is not limited thereto.

It should be noted that, in the first embodiment and the second embodiment of the present invention, each of the actuating units 10 has a symmetrical structure, and in other embodiments of the present invention, the structural arrangement of each of the actuating units 10 can be designed according to the use requirement, which is not limited thereto.

The present invention provides a micro-fluid actuator, which is mainly a micro-electromechanical semiconductor process, and the micro-fluid actuator is achieved by applying driving power sources with different phase charges to an upper electrode layer and a lower electrode layer to enable a vibration layer to generate up-and-down displacement, thereby achieving fluid transmission. Therefore, the micro fluid actuator can increase the fluid compression ratio to compensate for the defect of too small displacement of the piezoelectric layer during operation, thereby achieving the feasibility of fluid transmission and great transmission efficiency in a miniaturized structure, and having great industrial application value.

Various modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims.

[ notation ] to show

100. 100', 100 ": the microfluidic actuator 10: actuating unit

1 a: substrate

11 a: first surface

12 a: second surface

13 a: outlet groove

14 a: inlet channel

15 a: outflow hole

16 a: first inflow hole

17 a: second inlet hole

1 b: cavity layer

11 b: flow storage chamber

1 c: vibration layer

1 d: lower electrode layer

1 e: piezoelectric actuation layer

1 f: upper electrode layer

1 g: mask layer

11 g: first flow through hole

12 g: second flow through hole

13 g: third flow through hole

1 h: orifice plate layer

11 h: outflow opening

12 h: inlet port

1 i: flow channel layer

11 i: outflow channel

12 i: inflow channel

13 i: columnar structure

e: buffer distance

t: depth of over-etching

d: depth of perforation

s: diameter of the perforation

r: depth of cavity

r': lateral erosion distance

L: over-etch distance

M: actuation zone

Claims

1. A microfluidic actuator, comprising:

a substrate having a first surface and a second surface, an outlet groove, two inlet grooves, an outlet hole, a plurality of first inlet holes and two second inlet holes formed by etching, wherein the outlet groove is communicated with the outlet hole, each inlet groove is communicated with part of the plurality of first inlet holes and the corresponding plurality of second inlet holes, the plurality of inlet grooves are symmetrically arranged at two sides of the outlet groove, the plurality of first inlet holes are symmetrically arranged at two sides of the outlet hole, the second inlet holes are symmetrically arranged at two sides of the outlet hole, and one end of each first inlet hole is located at one end of the corresponding second inlet hole;

a cavity layer formed on the first surface of the substrate by a deposition process and forming a flow storage chamber by an etching process, wherein the flow storage chamber is communicated with the outflow hole, the first inflow holes and the second inflow holes;

a vibration layer formed on the cavity layer by deposition process;

a lower electrode layer formed on the vibration layer by a deposition process and an etching process;

a piezoelectric actuating layer formed on the lower electrode layer by deposition process and etching process;

an upper electrode layer formed on the piezoelectric actuation layer by a deposition process and an etching process;

the hole plate layer is formed into an outflow port and two inflow ports through an etching process, and the inflow ports are respectively and symmetrically arranged on two sides of the outflow port; and

a flow channel layer formed on the aperture plate layer by a dry film material rolling process, forming an outflow channel, two inflow channels and a plurality of columnar structures by a photoetching process, and bonding the outflow channel, the two inflow channels and the plurality of columnar structures on the second surface of the substrate by flip chip alignment and hot pressing processes, wherein the plurality of inflow channels are respectively and symmetrically arranged on two sides of the outflow channel, the plurality of columnar structures are symmetrically arranged on two sides of the outflow channel, the outflow port of the aperture plate layer is communicated with the outlet groove of the substrate by the outflow channel, and the plurality of inflow ports of the aperture plate layer are respectively communicated with the plurality of inlet grooves of the substrate by the plurality of inflow channels;

and finally, the fluid is extruded through the outflow holes and then discharged from the outflow port to finish fluid transmission.

2. The microfluidic actuator of claim 1, wherein fluid flows into the reservoir chamber through the plurality of inlet channels, the plurality of inlet grooves, the plurality of first inlet holes and the plurality of second inlet holes in sequence after being drawn from the plurality of inlet ports.

3. The micro-fluidic actuator as claimed in claim 1, wherein the fluid in the reservoir chamber is extruded to sequentially pass through the outflow hole, the outlet groove and the outflow channel and then is discharged from the outflow port.

4. The microfluidic actuator of claim 1, wherein the plurality of columnar structures are formed in the inlet channel.

5. The microfluidic actuator of claim 1, wherein the substrate is a silicon substrate.

6. The microfluidic actuator of claim 1, wherein the cavity layer is a silicon dioxide material.

7. The microfluidic actuator of claim 1, wherein the bottom electrode layer is a platinum metal material.

8. The microfluidic actuator of claim 1, wherein the bottom electrode layer is a titanium metal material.

9. The microfluidic actuator of claim 1, wherein the top electrode layer is a gold metal material.

10. The microfluidic actuator of claim 1, wherein the top electrode layer is an aluminum metal material.

11. The microfluidic actuator of claim 1, wherein the substrate is formed with the exit hole, the first plurality of inlet holes, and the second plurality of inlet holes by a deep reactive ion etching process.

12. The microfluidic actuator of claim 1, wherein the cavity layer forms the reservoir chamber by a hydrofluoric acid wet etch process.

13. The microfluidic actuator of claim 1, wherein the orifice plate layer is a stainless steel material.

14. The microfluidic actuator of claim 1, wherein the orifice plate layer is a glass material.

15. The microfluidic actuator of claim 1, wherein the dry film material of the flow channel layer is a photosensitive dry polymer film.

16. The micro fluid actuator of claim 1, wherein a positive voltage is applied to the upper electrode layer and a negative voltage is applied to the lower electrode layer, such that the piezoelectric actuation layer drives the vibration layer to displace in a direction away from the substrate.

17. The micro fluid actuator of claim 1, wherein a negative voltage is applied to the upper electrode layer and a positive voltage is applied to the lower electrode layer, such that the piezoelectric actuation layer drives the vibration layer to displace toward a direction close to the substrate.

18. The microfluidic actuator of claim 1, wherein:

applying positive voltage to the upper electrode layer and negative voltage to the lower electrode layer, so that the piezoelectric actuation layer drives the vibration layer to displace towards the direction far away from the substrate, thereby external fluid is sucked into the micro-fluid actuator from the plurality of inlet ports and flows into the fluid in the micro-fluid actuator sequentially through the plurality of inlet channels, the plurality of inlet grooves, the plurality of first inlet holes and the plurality of second inlet holes and then is collected in the fluid storage chamber; and

and converting the electrical properties of the upper electrode layer and the lower electrode layer, and applying a negative voltage to the upper electrode layer and a positive voltage to the lower electrode layer, so that the vibration layer moves towards the direction close to the substrate, and the volume in the fluid storage chamber is compressed by the vibration layer, so that the fluid collected in the fluid storage chamber can be discharged out of the micro-fluid actuator from the fluid outlet after sequentially passing through the fluid outlet hole, the fluid outlet groove and the fluid outlet channel, and the fluid transmission is completed.

19. A microfluidic actuator, comprising:

a plurality of actuation units, each of the actuation units comprising:

a substrate having a first surface and a second surface, at least one outlet groove, a plurality of inlet grooves, an outflow hole, a plurality of first inflow holes and two second inflow holes formed by etching, wherein the outlet groove is communicated with the outflow hole, each inlet groove is communicated with part of the plurality of first inflow holes and the corresponding plurality of second inflow holes, the plurality of inlet grooves are respectively symmetrically arranged at two sides of the outlet groove, the plurality of first inflow holes are symmetrically arranged at two sides of the outflow hole, and the second inflow holes are respectively symmetrically arranged at two sides of the outflow hole and at one end of the plurality of first inflow holes;

a vibration layer formed on the cavity layer by deposition process;

a flow channel layer formed on the aperture plate layer by a dry film material rolling process, forming an outflow channel, two inflow channels and a plurality of columnar structures by a photoetching process, and jointing the second surface of the substrate by flip chip alignment and hot pressing processes, wherein the inflow channels are respectively and symmetrically arranged at two sides of the outflow channel, the columnar structures are symmetrically arranged at two sides of the outflow channel, the outflow port of the aperture plate layer is communicated with the outlet groove of the substrate by the outflow channel, and the inflow ports of the aperture plate layer are respectively communicated with the inlet grooves of the substrate by the inflow channels;

providing a driving power source with different phase charges to the upper electrode layer and the lower electrode layer to drive and control the vibration layer to generate vertical displacement, so that fluid is sucked from the plurality of inlet holes, flows to the fluid storage chamber through the plurality of first inlet holes and the plurality of second inlet holes, and is extruded through the outlet holes and then is discharged from the outlet to finish fluid transmission; and the plurality of actuating units are connected in series, parallel or series-parallel.

20. A microfluidic actuator, comprising:

a substrate having a first surface and a second surface, at least one outlet trench, at least one inlet trench, at least one outlet hole, at least one first inlet hole and at least one second inlet hole are formed by etching, the at least one outlet trench is communicated with the at least one outlet hole, and the at least one inlet trench is communicated with the at least one first inlet hole and the at least one second inlet hole;

a cavity layer formed on the first surface of the substrate by a deposition process and formed with at least one fluid storage chamber by an etching process, the at least one fluid storage chamber being in communication with the at least one exit flow hole, the at least one first inlet flow hole and the at least one second inlet flow hole;

a vibration layer formed on the cavity layer by deposition process;

at least a lower electrode layer formed on the vibration layer by a deposition process and an etching process;

at least one piezoelectric actuating layer formed on the at least one lower electrode layer by a deposition process and an etching process;

at least one upper electrode layer formed on the at least one piezoelectric actuation layer by a deposition process and an etching process;

a hole plate layer, which forms at least one outflow port and at least one inflow port through an etching process; and

a flow channel layer formed on the aperture plate layer by a dry film material rolling process, at least one outflow channel, at least one inflow channel and a plurality of columnar structures formed by a photoetching process, and bonded to the second surface of the substrate by flip chip alignment and hot pressing processes, wherein the at least one outflow port of the aperture plate layer is communicated with the at least one outlet groove of the substrate by the at least one outflow channel, and the at least one inflow port of the aperture plate layer is communicated with the at least one inlet groove of the substrate by the at least one inflow channel;

and finally, the vibration layer is extruded to pass through the at least one outflow hole and then is discharged from the at least one outflow hole, so that the fluid transmission is completed.