TW202023009A - Temperature adjusting equipment of high-temperature oven for greatly enhancing heating and cooling efficiency of gas and effectively reducing production cost - Google Patents

Abstract

The present invention relates to a temperature adjusting equipment of high-temperature oven, which comprises: an oven including an oven chamber, at least one gas-intaking manifold, at least one gas-exhausting manifold, an inner frame cover, at least one heating element, and a chamber door. The interior of the oven chamber is formed as a processing chamber. The inner wall of the oven chamber is configured with the inner frame cover in a surrounding manner. The inner frame cover is heated by the at least one heating element, and then the processing chamber is heated in a heat radiation manner through the inner frame cover. The chamber door is disposed on the bottom of the oven chamber that may be elevated vertically. The present invention also comprises a gas re-processing device which includes a gas-recycling device for sucking the gas in the processing chamber into the gas re-processing device, wherein the sucked gas may be directly exhausted to the gas re-processing device and flow back to the processing chamber after re-processing.

Description

Temperature adjustment equipment for high temperature oven

The present invention belongs to the technical field of electronic packaging, and particularly refers to the technically providing a high-temperature oven temperature adjustment equipment. The gas flowing out of the processing chamber is cooled by the cooler in the gas reprocessing device, and the gas is heated by the heater. The gas in the gas reprocessing device is reused by the gas recovery device to send the gas back to the processing chamber, which greatly improves the heating and cooling efficiency of the gas, and achieves the purpose of gas recovery and reuse, effectively reducing production costs.

In recent years, electronic technology has been advancing with each passing day. Electronic products composed of integrated circuit components have become an indispensable tool in modern people’s daily life. In the semiconductor packaging process, the cooling process and the heating process often play an important role, and it is often necessary to switch between the cooling process and the heating process. For example, cooling from high temperature to low temperature or cooling from high temperature to low temperature and then heating to high temperature, etc., the faster the cooling and/or heating rate, the higher the process efficiency. In the conventional cooling process, air-cooled or water-cooled coolers are often used directly in the processing chamber for gas cooling. However, the heat capacity of the cavity is too large to achieve rapid cooling effects. In addition, in the conventional In the heating process, the heater is often used directly in the processing chamber for gas heating. Also, because the heat capacity of the chamber is too large, the effect of rapid heating cannot be achieved. Therefore, in order to achieve the effect of rapid cooling and rapid heating, the conventional The cooling process often uses the direct discharge of high-temperature gas, and then the low-temperature gas is introduced to achieve the effect of rapid cooling. However, since the existing high-temperature gas must be evacuated, and then new low-temperature gas must be introduced from the outside, the existing gas cannot be effectively used, resulting in waste of gas costs. In the above circumstances, if it is further desired to return the process temperature to the temperature level before cooling (or even reach a higher temperature level than before cooling), the low-temperature gas must be evacuated first, and then a new high temperature is introduced from the outside Gas also leads to waste of gas costs. In addition, during the heating process, some of the process chemicals will be diffused in the processing chamber due to volatilization or evaporation. When the process is cooled, the gaseous process chemicals floating in the processing chamber are condensed to form pollutants attached to it. The inner wall of the cavity increases the maintenance cost of the machine and reduces the production capacity. In addition, the oven used in the conventional semiconductor packaging process is heated by heat convection. This heating method requires a set of fans to be placed inside the oven to make the inside The heated gas produces convection. In order to increase the temperature quickly and the uniformity of the temperature rise, it is necessary to consider accelerating the flow of the heated gas. The vibration of the baked product caused by such gas disturbance poses an unpredictable risk for many semiconductor components. There is a need for improvement.

Therefore, in view of the above-mentioned problems of conventional semiconductor packaging due to process switching, how to develop a temperature adjustment device that is more ideal and practical while taking into account economic benefits is actually the goal and direction of the relevant industry to actively research and develop breakthroughs.

In view of this, the inventor has been engaged in the manufacturing, development and design of related products for many years. Aiming at the above-mentioned goals, after detailed design and careful evaluation, the inventor finally obtained a practical invention.

Technical problem to be solved: The conventional semiconductor package cannot achieve rapid cooling and rapid heating due to the large heat capacity of the cavity during process switching. In order to improve the cooling and heating effect, the cooling process often uses direct discharge of high-temperature gas , And then pass in low-temperature gas, which leads to waste of gas cost. In order to make the temperature quickly reach the temperature level before cooling during the heating process, the low-temperature gas must be evacuated first, and then new high-temperature gas is introduced from the outside. This leads to a waste of gas cost. In addition, the oven used in the conventional semiconductor packaging process is heated by thermal convection. In order to increase the temperature quickly and the temperature uniformity during the temperature increase, the acceleration of the heating gas flow must be considered. For many semiconductor components, the vibration of the baked product presents an unpredictable risk, and it is necessary to improve it.

Technical features for solving the problem: In order to improve the above problem, the first embodiment of the present invention provides a high-temperature oven temperature adjustment equipment, including: an oven, the oven includes an oven cavity, at least one intake manifold, at least one An exhaust manifold, an inner frame sleeve, at least one heating element, and a chamber door. The oven cavity forms a processing chamber. One side of the processing chamber is equipped with at least one intake manifold, and the other side is installed At least one of the exhaust manifolds is provided, at least one of the intake manifolds is provided with a plurality of intake holes through the outer circumference, at least one of the exhaust manifolds is provided with a plurality of exhaust holes through the outer circumference, and the oven cavity is surrounded by the inner A frame sleeve is formed inside the inner frame sleeve. At least one heating element is arranged in the accommodating space. The inner frame sleeve is heated by the at least one heating element, and then the inner frame sleeve is heated The processing chamber is heated by radiation, the door can be vertically raised and lowered at the bottom of the oven cavity, the inner surface of the door is provided with a processing frame, and the processing frame can be placed The target, the target to be processed may be a semiconductor wafer.

A gas reprocessing device, the gas in the processing chamber flows into the gas reprocessing device, and the gas is processed by the gas reprocessing device. The gas reprocessing device includes a cooler, a heater and a gas recovery device, and the gas in the gas reprocessing device is cooled by the cooler. The heater is used to heat the gas flowing back to the processing chamber through the gas reprocessing device. Use the gas recovery device to suck the gas in the processing chamber into the gas reprocessing device. The inhaled gas can be directly discharged from the gas reprocessing device or flow back to the processing chamber after reprocessing. The gas recovery device is a fan .

In the foregoing, at least one of the heating elements is a heating jacket or a heating rod.

As mentioned above, the gas in at least one of the intake manifolds is ejected through each of the intake holes to disturb the gas in the processing chamber, and the gas in the processing chamber is discharged by at least one of the exhaust manifolds. Heat convection promotes temperature regulation inside the processing chamber and effectively improves the uniformity of gas temperature distribution.

The second embodiment of the present invention provides a temperature adjustment device for a high-temperature oven, which includes: an oven, which includes an oven cavity, at least one intake manifold, at least one exhaust manifold, at least one heating jacket, and a cavity Door, the inside of the oven cavity forms a processing chamber, and at least one intake manifold is installed on one side of the processing chamber, at least one exhaust manifold is installed on the other side, and at least one intake manifold outer periphery A plurality of air inlet holes are arranged, at least one exhaust manifold is provided with a plurality of air outlet holes on the periphery, at least one heating jacket is arranged on the outer wall of the oven cavity, and at least one heating jacket heats the outer wall of the oven cavity, The processing chamber is heated by heat radiation through the oven cavity. The door can be vertically raised and lowered at the bottom of the oven cavity. The inner surface of the cavity door is provided with a processing frame on which the processing frame can be placed. The target, the target to be processed may be a semiconductor wafer.

A gas reprocessing device, the gas in the processing chamber flows into the gas reprocessing device, and the gas is processed by the gas reprocessing device. The gas reprocessing device includes a cooler, a heater and a gas recovery device, and the gas in the gas reprocessing device is cooled by the cooler. The heater is used to heat the gas flowing back to the processing chamber through the gas reprocessing device. Use the gas recovery device to suck the gas in the processing chamber into the gas reprocessing device. The inhaled gas can be directly discharged from the gas reprocessing device or flow back to the processing chamber after reprocessing. The gas recovery device is a fan .

As mentioned above, the gas in at least one of the intake manifolds is injected through each of the intake holes Out, disturb the gas in the processing chamber, and exhaust the gas in the processing chamber through at least one exhaust manifold to form thermal convection, promote the temperature regulation inside the processing chamber, and effectively improve the uniformity of the gas temperature distribution Sex.

The third embodiment of the present invention provides a temperature adjustment device for a high-temperature oven, including: an oven including an oven cavity, at least one intake manifold, at least one exhaust manifold, at least one heating element, and a cavity Door, the inside of the oven cavity forms a processing chamber, and at least one intake manifold is installed on one side of the processing chamber, at least one exhaust manifold is installed on the other side, and at least one intake manifold outer periphery A plurality of air inlet holes are arranged, at least one exhaust manifold is arranged with a plurality of air outlet holes, at least one heating element is arranged between the oven cavity and at least one side of the inlet manifold, and the gas is At least one of the intake manifolds is sprayed out through each of the intake holes to allow at least one of the heating elements to heat the processing chamber in a thermal convection manner. The chamber door can be vertically raised and lowered at the bottom of the oven cavity. A processing frame is arranged on the inner surface of the cavity door, and an object to be processed can be placed on the processing frame, and the object to be processed can be a semiconductor wafer.

A gas reprocessing device, the gas in the processing chamber flows into the gas reprocessing device, and the gas is processed by the gas reprocessing device. The gas reprocessing device includes a cooler, a heater and a gas recovery device, and the gas in the gas reprocessing device is cooled by the cooler. The heater is used to heat the gas flowing back to the processing chamber through the gas reprocessing device. Use the gas recovery device to suck the gas in the processing chamber into the gas reprocessing device. The inhaled gas can be directly discharged from the gas reprocessing device or flow back to the processing chamber after reprocessing. The gas recovery device is a fan .

In the foregoing, at least one of the heating elements is a heating jacket or a heating rod.

As mentioned above, the temperature adjustment equipment of the high-temperature oven further includes a gas delivery unit that includes a gas input pipeline, a gas discharge pipeline, a gas recovery pipeline, and a gas discharge pipeline. The gas input pipeline One end is connected to at least one of the intake manifold, and the other end is connected to a gas source or connected to the gas recovery pipeline. The gas source is an air compressor or a service gas pipeline. The gas source passes a predetermined pressure of gas through The gas input pipeline is input into the processing chamber, one end of the gas discharge pipeline is connected to at least one exhaust manifold, the other end is connected to the gas reprocessing device, one end of the gas recovery pipeline is connected to the gas input pipeline, or directly At least one of the intake manifolds is connected, the other end is connected to the gas reprocessing device, and one end of the gas discharge pipeline is connected to the gas reprocessing device, by discharging the gas in the gas reprocessing device to the outside.

As mentioned above, the air intake holes are arranged at equal intervals.

As mentioned above, the vent holes are arranged at equal intervals.

As mentioned above, the cavity door is opened and closed by pneumatic, hydraulic or motor drive.

As mentioned above, the gas reprocessing device further includes at least one filter, and the gas flowing out of the processing chamber is filtered through the at least one filter.

As mentioned above, the gas reprocessing device further includes a catalytic converter, and the gas is processed by the catalytic converter during the heating of the gas.

As mentioned above, when the process temperature requirement of the processing chamber is relatively high, a heater and a catalytic converter can be installed in the gas recovery pipeline after the gas leaves the gas reprocessing device and before returning to the processing chamber. To further heat and/or process the gas leaving the gas reprocessing device, so as to shorten the time for heating the gas in the processing chamber and/or further purify the gas by catalytic reaction.

As mentioned above, the gas mixed with gaseous process chemicals flows into each of the exhaust holes, and flows out of the processing chamber through at least one exhaust manifold.

As mentioned above, when the door is opened, the processing frame is synchronously moved out of the processing chamber, and the object can be easily placed and taken out. When the door is closed, the processing frame is moved into the processing chamber synchronously, effectively saving labor cost.

Compared with the effect of the prior art: the temperature adjustment equipment of the high temperature oven of the present invention uses a heater to heat the gas flowing back to the processing chamber through the gas reprocessing device, shortening the time for heating the gas in the processing chamber, and effectively increasing the gas Use a gas recovery device to suck the gas in the processing chamber into the gas reprocessing device, and the inhaled gas flows back to the processing chamber after reprocessing, achieving the purpose of gas recovery and reuse, effectively reducing production costs; The gas mixed with gaseous process chemicals in the processing chamber flows into the gas reprocessing device through the gas exhaust pipe after the process is completed, and the process chemical pollutants in the gas are filtered out through at least one of the filters, which can avoid gas recovery and reuse. The processing chamber is contaminated; the gas in the processing chamber flows into the gas reprocessing device, and the gas is cooled by a cooler. Compared with the gas cooling directly in the processing chamber at a higher temperature, the heat capacity of the oven without the oven is too large The effect of, can effectively improve the cooling efficiency of the gas; the gas is ejected through each of the inlet holes, disturbing the gas in the processing chamber, forming thermal convection, promoting the temperature adjustment inside the processing chamber, and effectively improving the uniformity of the gas temperature distribution.

With regard to the techniques, methods and effects adopted by the present invention, a few preferred embodiments and detailed descriptions are given in conjunction with the drawings. I believe that the above-mentioned objectives, structures and features of the present invention should be understood in detail. .

2‧‧‧Oven

5‧‧‧Gas delivery unit

6‧‧‧Gas reprocessing device

20‧‧‧Oven cavity

21‧‧‧Intake Manifold

211‧‧‧Air Inlet

22‧‧‧Exhaust Manifold

221‧‧‧Exhaust hole

23‧‧‧Inner frame cover

231‧‧‧accommodating space

24‧‧‧Heating element

24a‧‧‧Heating jacket

25‧‧‧cavity door

27‧‧‧Processing chamber

28‧‧‧Processing framework

51‧‧‧Gas input pipeline

52‧‧‧Gas discharge line

53‧‧‧Gas recovery pipeline

54‧‧‧Gas discharge pipeline

55‧‧‧Gas source

61‧‧‧Cooler

62‧‧‧Filter

63‧‧‧Heater

64‧‧‧Catalyst converter

65‧‧‧Gas recovery device

66‧‧‧Heater

67‧‧‧Catalyst converter

Figure 1 is a schematic diagram of the temperature adjustment equipment of the high temperature oven of the first embodiment of the present invention.

Figure 2 is a schematic diagram of the oven structure of the first embodiment of the present invention.

Figure 3 is a schematic diagram of the temperature adjustment equipment of the high temperature oven of the second embodiment of the present invention.

Figure 4 is a schematic diagram of the oven structure of the second embodiment of the present invention.

Fig. 5 is a schematic diagram of the temperature adjustment equipment of the high-temperature oven of the third embodiment of the present invention.

Figure 6 is a schematic diagram of the oven structure of the third embodiment of the present invention.

Referring to Figures 1 and 2, the first embodiment of the present invention provides a high-temperature oven temperature adjustment equipment, including: an oven 2 including an oven cavity 20, at least one intake manifold 21, At least one exhaust manifold 22, an inner frame cover 23, at least one heating element 24, and a chamber door 25. A processing chamber 27 is formed inside the oven cavity 20, and at least one of the processing chambers 27 is installed on one side of the chamber. At least one exhaust manifold 22 is installed on the other side of the intake manifold 21, and at least one intake manifold 21 is provided with a plurality of intake holes 211 on its periphery, and each of the intake holes 211 is arranged at equal intervals. At least one exhaust manifold 22 is provided with a plurality of exhaust holes 221 through the outer circumference, and each of the exhaust holes 221 is arranged at equal intervals. The inner wall of the oven cavity 20 is surrounded by the inner frame sleeve 23, and the inner frame sleeve 23 An annular accommodating space 231 is formed in the accommodating space 231. At least one heating element 24 is arranged in the accommodating space 231. At least one heating element 24 is a heating jacket or a heating rod. The inner frame is covered by at least one heating element 24. 23 is heated, and then the processing chamber 27 is heated by thermal radiation through the inner frame sleeve 23, so that the processing chamber 27 is enveloped in a high temperature and high pressure working environment, and the working temperature in the processing chamber 27 is between Celsius The range of 20 degrees (room temperature) to 1500 degrees Celsius, the working pressure varies from 1 atmosphere (atm) to 100 atmospheres (atm). At least one of the gas in the intake manifold 21 passes through each The air hole 211 is ejected to disturb the gas in the processing chamber 27, and the gas in the processing chamber is discharged by at least one exhaust manifold to form thermal convection, which promotes the temperature adjustment inside the processing chamber 27, effectively To improve the uniformity of the gas temperature distribution, the chamber door 25 can be vertically lifted At the bottom of the oven cavity 20, the door 25 is opened and closed by pneumatic, hydraulic or motor drive. The inner surface of the door 25 is provided with a processing frame 28 on which the object to be processed can be placed. The object to be processed may be a semiconductor wafer.

A gas delivery unit 5 comprising a gas input pipeline 51, a gas discharge pipeline 52, a gas recovery pipeline 53, and a gas discharge pipeline 54. One end of the gas input pipeline 51 is connected to at least one The other end of the intake manifold 21 is connected to a gas source 55 or connected to the gas recovery pipeline 53, the gas source 55 is an air compressor or a service gas pipeline, and the gas source 55 transfers a gas of a predetermined pressure The processing chamber 27 is input through the gas input line 51, one end of the gas discharge line 52 is connected to at least one exhaust manifold 22, and one end of the gas recovery line 53 is connected to the gas input line 51, or directly connected to at least One the intake manifold 21.

A gas reprocessing device 6, the gas reprocessing device 6 includes a cooler 61, at least one filter 62, a heater 63, a catalytic converter 64 and a gas recovery device 65, the gas discharge pipeline 52 is also One end is connected to the gas reprocessing device 6, the gas in the processing chamber 27 can flow into the gas reprocessing device 6 through the gas discharge pipe 52, the gas is cooled by the cooler 61, and passes through at least one of the filters 62 The gas flowing out of the processing chamber 27 is filtered. The heater 63 is used to heat the gas flowing back to the processing chamber 27 through the gas reprocessing device 6, and the gas is processed by the catalytic converter 64 during the heating of the gas, for example, through the catalytic converter 64 The gas is purified by catalytic reaction (for example, the CO, HC, NO x and other components in the gas are converted into gases that are harmless to the human body, such as CO 2, H 2 O, N 2, O 2 and so on). The catalytic converter 64 may contain metal such as rhodium, platinum, palladium, etc. as a catalyst. The catalyst converter 64 may be a binary catalyst converter, a ternary catalyst converter, or a combination of a binary catalyst converter and a ternary catalyst converter. The gas recovery pipe 53 is connected to the gas reprocessing device 6 at the other end, and the gas in the processing chamber 27 is sucked into the gas reprocessing device 6 by the gas recovery device 65, and the sucked gas can be directly discharged from the gas for reprocessing The device 6 may flow back to the processing chamber 27 after reprocessing, and the gas recovery device 65 is a fan.

Referring to Figures 3 and 4 (where the same components as the first embodiment use the same component symbols), the second embodiment of the present invention provides a high-temperature oven temperature adjustment equipment, including: an oven 2, the oven 2 Including an oven cavity 20, at least one intake manifold 21, at least one exhaust manifold 22, at least one heating jacket 24a, and a chamber door 25. The oven cavity 20 forms a processing chamber 27. The processing At least one intake manifold 21 is installed on one side of the chamber 27, and the other side is installed At least one of the exhaust manifold 22 is provided, and at least one of the intake manifolds 21 is provided with a plurality of intake holes 211 through the outer circumference, each of the intake holes 211 is arranged at equal intervals, and at least one of the exhaust manifold 22 penetrates through the outer circumference A plurality of exhaust holes 221 are provided, and each of the exhaust holes 221 is arranged at equal intervals. The outer wall of the oven cavity 20 is provided with at least one heating jacket 24a, and at least one heating jacket 24a is arranged on the outer wall of the oven cavity 20 Heating, and then heat the processing chamber 27 by means of thermal radiation through the oven cavity 20, so that the processing chamber 27 is enveloped in a high-temperature and high-pressure working environment, and the working temperature in the processing chamber 27 is 20 degrees Celsius Degrees (room temperature) to 1500 degrees Celsius, and the working pressure varies from 1 atmosphere (atm) to 100 atmospheres (atm). At least one gas in the intake manifold 21 passes through each The hole 211 is ejected to disturb the gas in the processing chamber 27, and the gas in the processing chamber is discharged by at least one exhaust manifold to form thermal convection, which promotes the temperature adjustment inside the processing chamber 27 and effectively increases The uniformity of the gas temperature distribution. The door 25 can be vertically lifted and lowered at the bottom of the oven cavity 20. The door 25 is opened and closed by pneumatic, hydraulic or motor drive. The inner surface of the door 25 is provided A processing frame 28 on which an object to be processed can be placed, and the object to be processed may be a semiconductor wafer.

A gas delivery unit 5 comprising a gas input pipeline 51, a gas discharge pipeline 52, a gas recovery pipeline 53, and a gas discharge pipeline 54. One end of the gas input pipeline 51 is connected to at least one The other end of the intake manifold 21 is connected to a gas source 55 or connected to the gas recovery pipeline 53, the gas source 55 is an air compressor or a service gas pipeline, and the gas source 55 transfers a gas of a predetermined pressure The processing chamber 27 is input through the gas input line 51, one end of the gas discharge line 52 is connected to at least one exhaust manifold 22, and one end of the gas recovery line 53 is connected to the gas input line 51, or directly connected to at least One the intake manifold 21.

A gas reprocessing device 6, the gas reprocessing device 6 includes a cooler 61, at least one filter 62, a heater 63, a catalytic converter 64 and a gas recovery device 65, the gas discharge pipeline 52 is also One end is connected to the gas reprocessing device 6, the gas in the processing chamber 27 can flow into the gas reprocessing device 6 through the gas discharge pipe 52, the gas is cooled by the cooler 61, and passes through at least one of the filters 62 The gas flowing out of the processing chamber 27 is filtered. The heater 63 is used to heat the gas flowing back to the processing chamber 27 through the gas reprocessing device 6, and the gas is processed by the catalytic converter 64 during the heating of the gas. The gas recovery pipe 53 is connected to the gas reprocessing device 6 at the other end, and the gas in the processing chamber 27 is sucked into the gas reprocessing device 6 by the gas recovery device 65, and the sucked gas can be directly discharged from the gas for reprocessing Install Set 6 or flow back to the processing chamber 27 after reprocessing, the gas recovery device 65 is a fan.

Referring to Figures 5 and 6 (where the same components as those in the first embodiment use the same component symbols), the third embodiment of the present invention provides a temperature adjustment device for a high-temperature oven, including: an oven 2, the oven 2 Including an oven cavity 20, at least one intake manifold 21, at least one exhaust manifold 22, at least one heating element 24, and a chamber door 25. The oven cavity 20 forms a processing chamber 27 inside. At least one intake manifold 21 is installed on one side of the chamber 27, and at least one exhaust manifold 22 is installed on the other side. At least one intake manifold 21 is provided with a plurality of intake holes 211 through its outer periphery. The air intake holes 211 are arranged at equal intervals, at least one exhaust manifold 22 is provided with a plurality of exhaust holes 221 through the outer circumference, each of the exhaust holes 221 is arranged at equal intervals, and at least one heating element 24 is arranged in the oven Between the inner wall of the cavity 20 and at least one side of the intake manifold 21, the gas is sprayed out through each of the intake holes 211 in at least one of the intake manifolds 21, so that at least one of the heating elements 24 is thermally convective. The processing chamber 27 is heated so that the processing chamber 27 is enveloped in a high-temperature and high-pressure working environment. The working temperature in the processing chamber 27 ranges from 20 degrees Celsius (room temperature) to 1500 degrees Celsius. The pressure range is between 1 atmosphere (atm) and 100 atmospheres (atm). The door 25 can be vertically raised and lowered at the bottom of the oven cavity 20. The door 25 is driven by pneumatic, hydraulic or motor The door 25 is opened and closed. A processing frame 28 is provided on the inner surface of the chamber door 25. The processing frame 28 can place an object to be processed, and the object to be processed may be a semiconductor wafer.

A gas delivery unit 5 comprising a gas input pipeline 51, a gas discharge pipeline 52, a gas recovery pipeline 53, and a gas discharge pipeline 54. One end of the gas input pipeline 51 is connected to at least one The other end of the intake manifold 21 is connected to a gas source 55 or connected to the gas recovery pipeline 53, the gas source 55 is an air compressor or a service gas pipeline, and the gas source 55 transfers a gas of a predetermined pressure The processing chamber 27 is input through the gas input line 51, one end of the gas discharge line 52 is connected to at least one exhaust manifold 22, and one end of the gas recovery line 53 is connected to the gas input line 51, or directly connected to at least One the intake manifold 21.

A gas reprocessing device 6, the gas reprocessing device 6 includes a cooler 61, at least one filter 62, a heater 63, a catalytic converter 64 and a gas recovery device 65, the gas discharge pipeline 52 is also One end is connected to the gas reprocessing device 6, the gas in the processing chamber 27 can flow into the gas reprocessing device 6 through the gas discharge pipe 52, the gas is cooled by the cooler 61, and passes through at least one of the filters 62 The gas flowing out of the processing chamber 27 is filtered. The gas flowing back to the processing chamber 27 through the gas reprocessing device 6 is heated by the heater 63, During the heating of the gas, the catalytic converter 64 processes the gas. The gas recovery pipe 53 is connected to the gas reprocessing device 6 at the other end, and the gas in the processing chamber 27 is sucked into the gas reprocessing device 6 by the gas recovery device 65, and the sucked gas can be directly discharged from the gas for reprocessing The device 6 may flow back to the processing chamber 27 after reprocessing, and the gas recovery device 65 is a fan.

As mentioned above, one end of the gas discharge pipe 54 is connected to the gas reprocessing device 6, and the gas in the gas reprocessing device 6 is discharged to the outside.

As mentioned above, when the process requirement temperature of the processing chamber 27 is relatively high, a heater can be provided in the gas recovery line 53 after the gas leaves the gas reprocessing device 6 and before returning to the processing chamber 27 66 and a catalytic converter 67 to further heat and/or process the gas leaving the gas aftertreatment device 6, so as to shorten the time for heating the gas in the processing chamber 27 and/or use a catalytic reaction to further the gas Purify.

As mentioned above, the gas mixed with gaseous process chemicals flows into each of the exhaust holes 221 and flows out of the processing chamber 27 through at least one exhaust manifold 22.

As mentioned above, when the door 25 is opened, the processing frame 28 is synchronously moved out of the processing chamber 27, so that the subject can be easily placed and taken out. When the door 25 is closed, the processing frame 28 is synchronously moved into the processing chamber 27 Inside, effectively saving labor cost.

The temperature adjustment equipment of the high-temperature oven of the present invention uses the heater 63 to heat the gas flowing back to the processing chamber 27 through the gas reprocessing device 6, shortening the time for heating the gas in the processing chamber 27, and effectively increasing the gas The heating efficiency.

The temperature adjustment equipment of the high-temperature oven of the present invention uses a gas recovery device 65 to suck the gas in the processing chamber 27 into the gas reprocessing device 6, and the sucked gas flows back to the processing chamber 27 after being reprocessed. The purpose of gas recovery and reuse is to effectively reduce production costs.

In the temperature adjustment equipment of the high-temperature oven of the present invention, the gas in the processing chamber 27 mixed with gaseous process chemicals flows into the gas reprocessing device 6 through the gas discharge line 52 after the process is completed, and is filtered out through at least one of the filters 62 The process chemical pollutants in the gas can prevent the processing chamber 27 from being polluted when the gas is recycled and reused.

In the temperature adjustment equipment of the high-temperature oven of the present invention, the gas in the processing chamber 27 can flow into the gas reprocessing device 6 through the gas discharge pipe 52, and the gas is cooled by the cooler 61, which is compared with directly Gas cooling is performed in the processing chamber 27 at a high temperature without the influence of too much heat capacity of the oven cavity 20, which can effectively improve the cooling efficiency of the gas.

In the temperature adjustment device of the high-temperature oven of the present invention, the gas is ejected through each of the air inlet holes 211 to disturb the gas in the processing chamber 27 to form thermal convection, promote the temperature adjustment inside the processing chamber 27, and effectively increase the gas temperature Uniformity of distribution.

The temperature adjustment equipment of the high-temperature oven of the present invention provides a heat radiation heating method to solve the problem of the conventional oven, but the heat generated by the heat radiation is inversely proportional to the fourth power of the heat source distance, and there is a problem of uneven heating. The invention further introduces the solution of introducing high pressure gas supplemented with trace heat convection as described above.

The foregoing is a detailed description of the preferred embodiments of the present invention and the technical features of the present invention; however, those skilled in the art should make changes and modifications to the present invention without departing from the spirit and principle of the present invention. Such changes and modifications shall be covered in the scope defined by the scope of the following patent applications.

2‧‧‧Oven

5‧‧‧Gas delivery unit

6‧‧‧Gas reprocessing device

20‧‧‧Oven cavity

21‧‧‧Intake Manifold

211‧‧‧Air Inlet

22‧‧‧Exhaust Manifold

221‧‧‧Exhaust hole

23‧‧‧Inner frame cover

231‧‧‧accommodating space

24‧‧‧Heating element

25‧‧‧cavity door

27‧‧‧Processing chamber

28‧‧‧Processing framework

51‧‧‧Gas input pipeline

52‧‧‧Gas discharge line

53‧‧‧Gas recovery pipeline

54‧‧‧Gas discharge pipeline

55‧‧‧Gas source

61‧‧‧Cooler

62‧‧‧Filter

63‧‧‧Heater

64‧‧‧Catalyst converter

65‧‧‧Gas recovery device

66‧‧‧Heater

67‧‧‧Catalyst converter

Claims (16)

A temperature adjustment device for a high-temperature oven, comprising: an oven, the oven comprising an oven cavity, at least one intake manifold, at least one exhaust manifold, an inner frame sleeve and at least one heating element, inside the oven cavity A processing chamber is formed. At least one intake manifold is installed on one side of the processing chamber, at least one exhaust manifold is installed on the other side, and at least one intake manifold is provided with a plurality of air intake holes on its periphery. , At least one exhaust manifold is provided with a plurality of exhaust holes through the periphery, the inner frame sleeve is arranged in the oven cavity, and an annular accommodating space is formed inside the inner frame sleeve, and the accommodating space is provided with at least One heating element heats the inner frame jacket through at least one heating element, and then heats the processing chamber by means of thermal radiation through the inner frame jacket. The gas in at least one intake manifold passes through each of the The air inlet is ejected to disturb the gas in the processing chamber, and the gas in the processing chamber is exhausted by at least one exhaust manifold to form thermal convection; and a gas reprocessing device in which the gas in the processing chamber flows into The gas reprocessing device processes the gas by the gas reprocessing device. A temperature adjustment device for a high-temperature oven, comprising: an oven including an oven cavity, at least one intake manifold, at least one exhaust manifold, and at least one heating jacket. A processing chamber is formed in the oven cavity At least one intake manifold is installed on one side of the processing chamber, at least one exhaust manifold is installed on the other side, and at least one intake manifold is provided with a plurality of intake holes on its periphery, at least one row A plurality of vent holes are arranged on the outer periphery of the air manifold, the outer wall of the oven cavity is provided with at least one heating jacket, and at least one heating jacket heats the outer wall of the oven cavity, and then heats the outer wall of the oven cavity by heat radiation through the oven cavity The processing chamber is heated, and the gas in at least one of the intake manifolds is ejected through each of the intake holes to disturb the gas in the processing chamber, and the gas in the processing chamber is removed by at least one of the exhaust manifolds Discharge to form thermal convection; and A gas reprocessing device, the gas in the processing chamber flows into the gas reprocessing device, and the gas is processed by the gas reprocessing device. A temperature adjustment device for a high-temperature oven, comprising: an oven, the oven including an oven cavity, at least one intake manifold, at least one exhaust manifold, and at least one heating element, and a processing chamber is formed in the oven cavity At least one intake manifold is installed on one side of the processing chamber, at least one exhaust manifold is installed on the other side, and at least one intake manifold is provided with a plurality of intake holes on its periphery, at least one row The outer circumference of the gas manifold is provided with a plurality of exhaust holes. At least one heating element is arranged between the inner wall of the oven cavity and at least one side of the intake manifold. The gas is in at least one of the intake manifolds and passes through each of the The air inlet is ejected to allow at least one of the heating elements to heat the processing chamber in a thermal convection manner; and a gas reprocessing device, the gas in the processing chamber flows into the gas reprocessing device, and is processed by the gas reprocessing device The gas. As described in item 1 or 3 of the scope of patent application, at least one of the heating elements is a heating jacket, heating plate, heating wire or heating rod. The temperature adjustment equipment of the high-temperature oven described in item 1, 2 or 3 of the scope of patent application further includes a gas delivery unit including a gas input pipeline, a gas discharge pipeline and a gas recovery pipeline One end of the gas input pipeline is connected to at least one intake manifold, and the other end is connected to a gas source or connected to the gas recovery pipeline. The gas source inputs a gas of a predetermined pressure into the processing chamber through the gas input pipeline One end of the gas discharge pipeline is connected to at least one exhaust manifold, the other end is connected to the gas reprocessing device, one end of the gas recovery pipeline is connected to the gas input pipeline or directly connected to at least one of the intake manifold, and the other end Connect the gas reprocessing device. The temperature adjustment equipment of the high-temperature oven as described in item 5 of the scope of patent application, wherein the gas The sending unit further includes a gas discharge pipe, one end of the gas discharge pipe is connected to the gas reprocessing device, and the gas in the gas reprocessing device is discharged to the outside. The temperature adjustment device of the high-temperature oven described in item 1, 2 or 3 of the scope of patent application, wherein the oven further includes a cavity door which can be vertically raised and lowered at the bottom of the oven cavity. For example, the temperature adjustment equipment of the high-temperature oven described in item 7 of the scope of patent application, wherein the cavity door is opened and closed by pneumatic, hydraulic or motor drive. For example, the temperature adjustment equipment of the high-temperature oven described in item 7 of the scope of patent application, wherein a processing frame is provided on the inner surface of the chamber door, and the processing frame is synchronously moved out of the processing chamber when the chamber door is opened, and when the chamber door is closed Simultaneously move the processing frame into the processing chamber. The temperature adjustment equipment of the high-temperature oven described in item 1, 2 or 3 of the scope of patent application, wherein the gas reprocessing device includes a cooler, and the gas in the gas reprocessing device is cooled by the cooler. According to the temperature adjustment equipment of the high-temperature oven described in item 1, 2 or 3 of the scope of patent application, the gas reprocessing device further includes at least one filter, and the gas flowing out of the processing chamber is filtered through the at least one filter. For example, the temperature adjustment equipment of the high-temperature oven described in item 1, 2 or 3 of the scope of patent application, wherein the gas reprocessing device further includes a gas recovery device, and the gas in the processing chamber is sucked into the gas by the gas recovery device. Processing device, the inhaled gas can be directly discharged from the gas reprocessing device or flow back to the processing chamber after reprocessing. The temperature adjustment equipment of the high-temperature oven described in item 1, 2 or 3 of the scope of the patent application, wherein the gas reprocessing device further includes a heater, and the heater is used to heat the gas and flow back to the process through the gas reprocessing device The gas in the chamber. According to the temperature adjustment equipment of the high-temperature oven described in claim 13, wherein the gas reprocessing device further includes a catalytic converter, and the gas is processed by the catalytic converter during the heating of the gas. The temperature adjustment equipment of the high-temperature oven as described in item 1, 2 or 3 of the scope of patent application, wherein when the process demand temperature of the processing chamber is high, the gas can be returned after the gas leaves the gas reprocessing device Before entering the processing chamber, a heater is installed in the gas recovery pipeline to heat the gas leaving the gas reprocessing device, thereby shortening the time for heating the gas in the processing chamber. As described in the 15th item of the scope of patent application, the temperature adjustment equipment of the high-temperature oven, wherein during the heating of the gas by the heater, a catalytic converter can be used to treat the gas leaving the gas reprocessing device, and the gas Purify.

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