JP2019205991A5

JP2019205991A5 -

Info

Publication number: JP2019205991A5
Application number: JP2019040265A
Authority: JP
Filing date: 2019-03-06
Publication date: 2020-05-14
Anticipated expiration: 2039-03-06

Description

チャンバ１０の内部を減圧する場合には、まず、第１の排気部２１によりチャンバ１０の内圧が１０Ｐａ程度になるようにする。次に、第２の排気部２２によりチャンバ１０の内圧が１０Ｐａ〜１×１０−２Ｐａ程度となるようにする。この様にすれば、所望の圧力まで減圧するのに必要となる時間を短くすることができる。 When decompressing the inside of the chamber 10, first, the internal pressure of the chamber 10 is set to about 10 Pa by the first exhaust unit 21. Next, the internal pressure of the chamber 10 is adjusted to about 10 Pa to 1 × 10 −2 Pa by the second exhaust unit 22. In this way, the time required to reduce the pressure to the desired pressure can be shortened.

また、複数のワーク支持部３３の、少なくともワーク１００に接触する端部を熱伝導率
の低い材料から形成することができる。熱伝導率の低い材料は、例えば、セラミックスと
することができる。この場合、セラミックスの中でも２０℃における熱伝導率が３２Ｗ/
（ｍ・ｋ）以下の材料とすることが好ましい。セラミックスは、例えばアルミナ（Ａｌ２
Ｏ３）、窒化珪素（Ｓｉ３Ｎ４）、ジルコニア（ＺｒＯ２）などとすることができる。

Further, at least the ends of the plurality of work support portions 33 that come into contact with the work 100 can be formed of a material having a low thermal conductivity. The material having low thermal conductivity can be ceramics, for example. In this case, among the ceramics, the thermal conductivity at 20 ° C is 32 W /
It is preferable to use a material of (m · k) or less. Ceramics are, for example, alumina (Al2
O3), silicon nitride (Si3N4), zirconia ( ZrO2 ), or the like.

Claims

A chamber that can maintain an atmosphere depressurized below atmospheric pressure,
An exhaust unit capable of exhausting the inside of the chamber,
A first heating section provided inside the chamber, the first heating section having at least one first heater;
A second heating section provided inside the chamber, having at least one second heater, and provided to face the first heating section;
A process for supporting a work, which is between the first heating unit and the second heating unit, and includes a substrate and a solution containing an organic material and a solvent applied to the upper surface of the substrate. Area and
A cooling unit that supplies a cooling gas or a refrigerant into at least one of the first heating unit and the second heating unit;
Equipped with
An organic film forming apparatus in which the work supported in the processing region is cooled by supplying the cooling gas or the refrigerant to at least one of the first heating unit and the second heating unit. ..

The first heater has a rod shape, and a plurality of the first heaters are arranged side by side in a direction in which the surface of the work extends.
The first heating unit further includes at least one first heat equalizing plate provided on the second heating unit side so as to be separated from the plurality of first heaters,
The organic material according to claim 1, wherein the cooling unit supplies the cooling gas or the refrigerant in a direction in which a surface of the work extends in a space partitioned from the processing region by the first heat equalizing plate. Film forming equipment.

The second heater has a rod shape, and a plurality of the second heaters are arranged in a direction in which the surface of the work extends.
The second heating unit further includes at least one second heat equalizing plate provided on the first heating unit side so as to be separated from the plurality of second heaters.
The cooling unit supplies the cooling gas or the refrigerant in a direction in which a surface of the work extends in a space partitioned from the processing region by the second heat equalizing plate. The organic film forming apparatus described.

The organic film forming apparatus according to claim 2, wherein the coolant is supplied to the inside of a cooling body provided inside at least one of the first heating unit and the second heating unit.

The exhaust unit operates intermittently to operate again for a certain period of time while the cooling unit supplies the cooling gas or the refrigerant, and then stops, and then operates again . The organic film forming apparatus as described in any one .

A chamber that can maintain an atmosphere depressurized below atmospheric pressure,
A first exhaust unit capable of exhausting the inside of the chamber to a pressure lower than atmospheric pressure;
An upper exhaust port provided above the chamber,
A second exhaust unit connected to the upper exhaust port for exhausting a high temperature gas accumulated in the upper space of the chamber;
A first heating section provided inside the chamber, the first heating section having at least one first heater;
A second heating section provided inside the chamber, having at least one second heater, and provided to face the first heating section;
Between the first heating unit and the second heating unit, a work having a substrate and a solution containing an organic material and a solvent, which is applied to the upper surface of the substrate, is supported. Processing area,
A cooling unit that supplies a cooling gas or a refrigerant into at least one of the first heating unit and the second heating unit;
Equipped with
An organic film forming apparatus in which the work supported in the processing region is cooled by supplying the cooling gas or the refrigerant to at least one of the first heating unit and the second heating unit. ..

A plurality of the first heating units are provided in a vertical direction intersecting a direction in which the surface of the work extends,
The cooling unit increases the flow rate of a cooling gas or a refrigerant supplied to the inside of the first heating unit located above the first heating unit located below. 6. The organic film forming apparatus according to any one of 6.

8. The first exhaust unit operates intermittently so that the first exhaust unit operates for a certain period of time while the cooling unit supplies a cooling gas or a refrigerant, stops, and then operates again. The organic film forming apparatus described in 1.

A vacuum sensor for detecting the degree of vacuum in the chamber,
An oxygen concentration sensor for detecting the oxygen concentration in the chamber,
An opening provided in the chamber, and a pipe connected via a valve,
At least one of the vacuum sensor and the oxygen concentration sensor is provided on the downstream side of the valve in the pipe having the opening on the upstream side. Organic film forming apparatus.

The cooling unit introduces the cooling gas into the second heating unit from a direction different from the introduction direction of the cooling gas introduced into the first heating unit. The organic film forming apparatus described in any one of 1.

Heating a work having a substrate and a solution containing an organic material and a solvent applied to the upper surface of the substrate in an atmosphere depressurized below atmospheric pressure;
Cooling the work on which the organic film is formed by performing the heating,
Equipped with
In the step of heating the work, the work is heated in the processing region between the first heating unit and the second heating unit,
In the step of cooling the work,
Supplying a cooling gas or a refrigerant to the inside of at least one of the first heating unit and the second heating unit,
Production of an organic film in which the work supported in the processing region is cooled by supplying the cooling gas or the refrigerant to at least one of the first heating unit and the second heating unit. Method.

In the step of cooling the work,
The method for producing an organic film according to claim 11, wherein the gas having a high temperature staying in the upper space in the atmosphere depressurized below the atmospheric pressure is discharged.

In the step of cooling the work,
The exhaust unit for decompressing the atmosphere is intermittently stopped for a certain period of time to promote heat exchange into the atmosphere, and to operate again so that the gas containing heat after the heat exchange is discharged. 13. The method for producing an organic film according to claim 11, wherein the method operates as follows.