TW202020212A - Gas-mixing structure and reaction device - Google Patents
Gas-mixing structure and reaction device Download PDFInfo
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- TW202020212A TW202020212A TW108119660A TW108119660A TW202020212A TW 202020212 A TW202020212 A TW 202020212A TW 108119660 A TW108119660 A TW 108119660A TW 108119660 A TW108119660 A TW 108119660A TW 202020212 A TW202020212 A TW 202020212A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45512—Premixing before introduction in the reaction chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/10—Mixing gases with gases
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/10—Mixing gases with gases
- B01F23/19—Mixing systems, i.e. flow charts or diagrams; Arrangements, e.g. comprising controlling means
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Abstract
Description
本發明係關於一種混氣結構,特別是關於應用於反應設備之混氣結構。The invention relates to a gas-mixing structure, in particular to a gas-mixing structure applied to a reaction device.
在半導體鍍膜工藝過程中,一般原理是使一種或多種氣體進入真空反應室,在特定溫度、電場、壓力等條件下,在基材表面發生化學反應而產生鍍膜。In the semiconductor coating process, the general principle is to allow one or more gases to enter the vacuum reaction chamber, and under a specific temperature, electric field, pressure and other conditions, a chemical reaction occurs on the substrate surface to produce a coating.
隨著科技的日亦進步,對鍍膜的品質均勻性的要求也不斷提高,進而對參與化學反應的多種氣體能否均勻混合而有對應的要求。然而不同功能的氣體要在基材表面均勻、對稱的噴灑,對反應氣體的混氣結構設計仍是一大挑戰。With the advancement of technology, the requirements for the uniformity of the quality of the coating are also increasing, and there are corresponding requirements for the uniform mixing of the various gases participating in the chemical reaction. However, the gas of different functions should be sprayed uniformly and symmetrically on the surface of the substrate, which is still a big challenge for the design of the mixed structure of the reaction gas.
有鑑於此,本發明的目的在於提供一種混氣結構,其能有效地將氣體混合。In view of this, the object of the present invention is to provide a gas-mixing structure that can effectively mix gases.
本發明提供一種混氣結構,係用來將氣體混合,前述混氣結構係在內部形成有:一混氣室;複數個氣體通道;及其中前述混氣室具有一頂端以及一開口端,前述頂端係呈現穹頂狀,前述複數個氣體通道係連通於前述頂端而與前述混氣室連通,前述開口端係用來供經混合的氣體流出。The present invention provides a gas-mixing structure for mixing gases. The gas-mixing structure includes: a gas-mixing chamber; a plurality of gas channels; and wherein the gas-mixing chamber has a top end and an open end. The top end has a dome shape, the plurality of gas channels communicate with the top end and communicate with the gas mixing chamber, and the open end is used for the mixed gas to flow out.
較佳地,前述複數個氣體通道係相對於前述混氣室的中心軸線呈現對稱配置。較佳地,前述對稱配置係為旋轉對稱配置。Preferably, the plurality of gas channels are arranged symmetrically with respect to the central axis of the gas mixing chamber. Preferably, the aforementioned symmetrical configuration is a rotationally symmetrical configuration.
較佳地,前述複數個氣體通道的軸線係與前述混氣室的中心軸線於徑向上夾一間隔距離。較佳地,前述複數個氣體入口通道的軸線與前述混氣室的中心軸線於徑向上所夾之前述間隔距離皆相等。較佳地,前述複數個氣體通道相對於前述開口係位於相同之高度位置。較佳地,前述混氣室的直徑係大於前述複數個氣體通道的直徑的兩倍。Preferably, the axes of the plurality of gas channels are radially spaced from the central axis of the gas mixing chamber. Preferably, the spacing distances between the axes of the plurality of gas inlet channels and the central axis of the mixing chamber in the radial direction are all equal. Preferably, the plurality of gas channels are located at the same height relative to the opening. Preferably, the diameter of the gas mixing chamber is greater than twice the diameter of the plurality of gas channels.
本發明另提供一種反應設備,其係包含:如前所述之混氣結構;及一反應室,其中前述混氣結構係位於前述反應室的上方,且前述開口係與前述反應室連通。The present invention also provides a reaction device, comprising: the gas mixing structure as described above; and a reaction chamber, wherein the gas mixing structure is located above the reaction chamber, and the opening is in communication with the reaction chamber.
較佳地,至少一個前述複數個氣體通道比前述開口更位於前述反應室的上方。Preferably, at least one of the plurality of gas channels is located above the reaction chamber more than the opening.
藉由如上所述之本案發明,氣體得以在混氣室內均勻地混合,另外藉由穹頂狀的頂端的設計,可使氣體在混氣室中均勻地流動,而不會再角落積累,此外亦易於混氣室的清洗。By the invention of the present invention as described above, the gas can be uniformly mixed in the gas mixing chamber. In addition, by the design of the dome-shaped top, the gas can flow uniformly in the gas mixing chamber without accumulating in the corners. Easy to clean the air mixing room.
為利於本發明之技術特徵、內容與優點及其所能達成之功效,茲將本發明配合附圖,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,不受限於圖式及樣式,未必為本發明實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的權利範圍,合先敘明。In order to facilitate the technical features, content and advantages of the present invention and the achievable effects, the present invention is described in detail in conjunction with the drawings and in the form of expressions of the embodiments, and the figures used therein are only for the purpose of The use of illustrations and auxiliary instructions is not limited to the drawings and styles, and may not be the true scale and precise configuration after the implementation of the present invention, so it should not be interpreted and limited to the actual relationship between the scale and configuration of the attached drawings. The scope of rights in implementation shall be stated first.
本發明所述「穹頂狀」,係指由空腔的密封端往其開口端的方向上,其橫截面的面積係逐漸變大的形狀。前述「橫截面」係指與該空腔的中心軸線垂直的截面,該橫截面可呈現任意的形狀,較佳可為圓形、橢圓形或者等邊多邊形。當該橫截面為圓形或橢圓形時,該「穹頂狀」的密封端係可呈現為特定曲率半徑密封的球頂狀。當該橫截面為等邊多邊形時,該「穹頂狀」的密封端係可呈現為特定曲率密封半徑球頂狀或角錐狀,但不以此為限。The "dome shape" in the present invention refers to a shape in which the cross-sectional area gradually increases from the sealed end of the cavity toward the open end thereof. The aforementioned "cross-section" refers to a cross-section perpendicular to the central axis of the cavity. The cross-section may have any shape, preferably a circle, an ellipse, or an equilateral polygon. When the cross-section is circular or elliptical, the "dome-shaped" sealing end system may assume a spherical dome shape with a specific radius of curvature. When the cross-section is an equilateral polygon, the "dome-shaped" sealing end system may present a dome-shaped or pyramid-shaped seal radius of a specific curvature, but not limited to this.
本發明所述「渦流」,係指流體於空腔中呈現環繞特定中心軸線旋轉的流動。具體而言所述「特定中心軸線」可為空腔的中心軸線,或者與該空腔的中心軸線平行的軸線。The "vortex" in the present invention refers to the fluid flowing in the cavity rotating around a specific central axis. Specifically, the "specific central axis" may be the central axis of the cavity, or an axis parallel to the central axis of the cavity.
本發明所述「對稱配置」,係指一配置關係,其係相對於空腔的中心軸線呈現各種形式的對稱,具體可為點對稱、線對稱、旋轉對稱或者面對稱等。本發明所述「旋轉對稱配置」,係指一配置關係,其繞中心軸線一特定角度後仍可呈現相同的配置之配置關係,具體而言該特定角度可為360/n,其中n為自然數的角度。The "symmetrical configuration" in the present invention refers to a configuration relationship, which exhibits various forms of symmetry with respect to the central axis of the cavity, which may be point symmetry, line symmetry, rotational symmetry, or plane symmetry. The "rotationally symmetrical configuration" in the present invention refers to a configuration relationship, which can still exhibit the same configuration configuration relationship after a specific angle around the central axis. Specifically, the specific angle can be 360/n, where n is natural Number of angles.
[第一實施例][First Embodiment]
請參考第一圖。第一圖所示係關於本發明第一實施例之反應設備10之結構示意圖。如圖所示,反應設備10包含一反應部11;一蝕刻氣體發生部12;一氣箱13;及混氣結構14。在第一實施例中,在反應部11與蝕刻氣體發生室14之間設置有蝕刻氣體管路15。而在氣箱13與混氣結構14之間設置有氣體管路16a與氣體管路16b,用來分別傳輸氣體A與氣體B至混氣結構14內。Please refer to the first picture. The first figure shows a schematic structural diagram of the
請參閱第二圖。第二圖所示係本發明第一實施例之反應設備10的局部放大剖面圖。如圖所示,反應部11的上方係設置有用來密封反應室111的上蓋板112。混氣塊17係設置於蝕刻氣體管路15與反應部11之間,其內部形成有一蝕刻氣體通道171與一混合氣體通道172。蝕刻氣體通道171係與蝕刻氣體管路15與上蓋板112上的開口連通,使得蝕刻氣體得以被送至反應室111。反應室111設置有噴淋板113,使被送至反應室111內的反應氣體得以均勻地噴灑至位於噴淋板113下方之承載盤114上。混氣塊17的混合氣體通道172係一端與蝕刻氣體通道171連通,另一端與混氣室141的開口端1412連通,使得經混合的氣體A與氣體B得以透過混合氣體通道172與蝕刻氣體通道171而被送至反應室111。See the second picture. The second figure shows a partially enlarged cross-sectional view of the
請繼續參照第二圖。混氣結構14係在內部形成有:一混氣室141;氣體通道142a;以及氣體通道142b。混氣室141的內徑係為氣體通道142a、142b的兩倍以上。混氣室141係具有一頂端1411以及一開口端1412。混氣室141的頂端1411係構成為穹頂狀,而氣體通道142a與氣體通道142b則連通至頂端1411,使得來自氣體管路16a與氣體管路16b的氣體得以透過氣體通道142a與氣體通道142b而送至混氣室141。混氣室141的開口端1412與混氣塊17中的混合氣體通道172連通,而可將被混合之氣體透過混合氣體通道172而送至蝕刻氣體通道171以及反應室111。氣體通道16a與氣體通道16b係在距離開口端1412相同的位置上相對於混氣室141的中心軸線X1而對稱設置,且與混氣室141的中心軸線X1垂直。Please continue to refer to the second figure. The
請參照第三圖。第三圖所示係本發明第一實施例之混氣結構14的俯視圖。如圖所示,氣體管路16a與氣體管路16b的管徑相同,並與氣體通道142a與氣體通道142b連通,且相對於混氣室141的中心軸線X1(從平面射出)呈旋轉對稱配置(即旋轉180度後仍有相同配置)。俯視下的混氣室141的橫截面係呈現圓形,而氣體通道142a與氣體通道142b的軸線Y1均與混氣室141的中心軸線X1於徑向上具有一相同的間隔距離D1,使得由氣體管路16a與氣體管路16b所送來的氣體得以在混氣室141形成繞中心軸線X1的渦流,使氣體A與氣體B均勻混合。Please refer to the third figure. The third figure shows a top view of the
藉由如上所述本發明第一實施例的混氣結構14,氣體A與氣體B得以在混氣室141均勻地混合,藉由穹頂狀的頂端1411的設計,可使氣體在混氣室141均勻地流動,而不會再角落積累,此外亦易於混氣室141的清洗。By the
[第二實施例][Second Embodiment]
請參考第四圖。第四圖所示係本發明第二實施例之混氣結構24。如圖所示,相較於第一實施例相比,混氣室241係直接連通於蝕刻氣體管路25,使經混合的氣體順著蝕刻氣體管路25,而進入反應部21。反應部21的上方係設置有用來密封反應室211的上蓋板212。反應室211設置有噴淋板213,使被送至反應室211的反應氣體得以均勻地噴灑至位於噴淋板213下方之承載盤214上。Please refer to the fourth picture. The fourth figure shows the
請繼續參照第四圖。混氣結構24係在內部形成有:一混氣室241;氣體通道242a;以及氣體通道242b。與第一實施例相同,混氣室241係具有一頂端2411以及一開口端2412。混氣室241的內徑係為氣體通道242a、242b的兩倍以上。混氣室241的頂端2411係構成為穹頂狀,而氣體通道242a與氣體通道242b則連通於頂端2411,使得來自氣體管路26a與氣體管路26b的氣體A與氣體B得以透過氣體通道242a與氣體通道242b而送至混氣室241。氣體通道242a與氣體通道242b係在距離開口端2412相同的位置上相對於混氣室241的中心軸線X2而對稱延伸設置,且皆平行於混氣室241的中心軸線X2。Please continue to refer to the fourth figure. The
藉由如上所述本發明第二實施例的混氣結構24,氣體A與氣體B得以在混氣室241均勻地混合,藉由穹頂狀的頂端2411的設計,可使氣體在混氣室中均勻地流動,而不會再角落積累,此外亦易於混氣室241的清洗。By the
[第三實施例][Third Embodiment]
請參考第五圖。第五圖所示係本發明第三實施例之混氣結構34。混氣結構34係在內部形成有:混氣室341;氣體通道342a;以及氣體通道342b。與第一實施例相同,混氣室341係具有一頂端3411以及一開口端3412。混氣室341的內徑係為氣體通道342a、342b的兩倍以上。混氣室341的頂端3411係構成為穹頂狀,而氣體通道342a與氣體通道342b則連通於頂端3411,使得來自氣體管路36a與氣體管路36b的氣體A與氣體B得以透過氣體通道342a與氣體通道342b而送至混氣室341內。混氣結構34內,氣體通道342a與氣體管路36a連通的區段342a’係沿著與混氣室341的中心軸線X3垂直的方向,接著氣體通道342a再彎折成與混氣室341的中心軸線X3夾60度的α角後,而與連通至混氣室341。與氣體通道342a相同地,氣體通道342b與氣體管路36b連通的區段342b’係沿著與混氣室341的中心軸線X3垂直的方向,接著氣體通道342b再彎折成與混氣室341的中心軸線X3夾45度的β角後,而與連通至混氣室341。氣體通道342a與氣體通道342b係以相對於混氣室341的中心軸線X3實質上對稱的方式配置。Please refer to the fifth picture. The fifth figure shows the
藉由如上所述本發明第三實施例的混氣結構34,藉由穹頂狀的頂端3411的設計,可使氣體在混氣室341均勻地流動,而不會再角落積累,此外亦易於混氣室341的清洗。另外藉由氣體通道342a與氣體通道342b相對於混氣室341的中心軸線X3分別夾不同角度的配置,可有效調控氣體A與氣體B在混氣室341的流向,而讓氣體均勻混合後自開口端3412流出。By the
[第四實施例][Fourth embodiment]
請參考第六圖。第六圖所示係本發明第四實施例之混氣結構44之俯視圖。混氣結構44係在內部形成有:一混氣室441;氣體通道442a;氣體通道442b;以及氣體通道442c。與第一實施例相同,混氣室441係具有一頂端以及一開口端(圖未示)。混氣室441的內徑係為氣體通道442a、442b、442c的兩倍以上。如圖所示,氣體管路46a、氣體管路46b與氣體管路46c的管徑相同,並分別連通至氣體通道442a、氣體通道442b與氣體通道442c而將氣體A、氣體B與氣體C送至混氣室441。氣體通道442a、氣體通道442b與氣體通道442c係相對於混氣室441的中心軸線X4呈旋轉對稱配置(即旋轉120度後仍有相同配置)。氣體管路46a、氣體管路46b與氣體管路46c的沿線Y4均離混氣室441的中心軸線X4一特定距離D4,使得由氣體管路46a、氣體管路46b與氣體管路46c所送來的氣體A、氣體B及氣體C得以在混氣室441形成繞混氣室441的中心軸線X4的渦流,使氣體均勻混合。Please refer to the sixth figure. The sixth figure shows a top view of the
藉由如上所述本發明第四實施例的混氣結構44,氣體A、氣體B與氣體C得以在混氣室441均勻地混合,藉由穹頂狀的頂端的設計,可使氣體在混氣室中均勻地流動,而不會再角落積累,此外亦易於混氣室441的清洗。By the
至此,本發明之混氣結構的較佳實施例,已經由上述說明以及圖式加以說明。在本說明書中所揭露的所有特徵都可能與其他手段結合,本說明書中所揭露的每一個特徵都可能選擇性的以相同、相等或相似目的特徵所取代,因此,除了特別顯著的特徵之外,所有的本說明書所揭露的特徵僅是相等或相似特徵中的一個例子。經過本發明較佳實施例之描述後,熟悉此一技術領域人員應可瞭解到,本發明實為一新穎、進步且具產業實用性之發明,深具發展價值。本發明得由熟悉技藝之人任施匠思而為諸般修飾(例如修改氣體通道與混氣室的中心軸線夾角α及β的角度),然不脫如附申請範圍所欲保護者。So far, the preferred embodiments of the gas mixing structure of the present invention have been described by the above description and the drawings. All features disclosed in this specification may be combined with other means. Each feature disclosed in this specification may be selectively replaced by features with the same, equal or similar purpose. Therefore, in addition to the features that are particularly significant All the features disclosed in this specification are only examples of equal or similar features. After the description of the preferred embodiments of the present invention, those familiar with this technical field should understand that the present invention is indeed a novel, progressive and industrially practical invention, which is of great development value. The present invention can be modified by any person skilled in the arts (such as modifying the angles α and β between the central axis of the gas channel and the gas mixing chamber), but not as protected by the scope of the application.
10:反應設備
11、21:反應部
12:蝕刻氣體發生部
13:氣箱
14、24、34、44:混氣結構
15、25:蝕刻氣體管路
17:混氣塊
16a、26a、36a、46a、16b、26b、36b、46b、46c:氣體管路
111、211:反應室
112、212:上蓋板
113、213:噴淋板
114、214:承載盤
141、241、341:混氣室
142a、242a、342a、442a、142b、242b、342b、442b、442c:氣體通道
342a’、342b’:區段
171:蝕刻氣體通道
172:混合氣體通道
1411、3411:頂端
1412、3412:開口端
D1、D4:間隔距離
X1、X2、X3、X4:中心軸線
Y1、Y4:軸線
α、β:角度
10:
第一圖所示為本發明第一實施例之反應設備的結構示意圖。The first figure shows a schematic structural diagram of the reaction device according to the first embodiment of the present invention.
第二圖所示為本發明第一實施例之反應設備的局部放大剖面圖。The second figure shows a partially enlarged cross-sectional view of the reaction apparatus according to the first embodiment of the present invention.
第三圖所示為本發明第一實施例之混氣室之俯視圖。The third figure shows a top view of the mixing chamber of the first embodiment of the present invention.
第四圖所示為本發明第二實施例之反應設備的局部放大剖面圖。The fourth figure shows a partially enlarged cross-sectional view of the reaction device of the second embodiment of the present invention.
第五圖所示為本發明第三實施例之混氣室之側視剖面圖。The fifth figure shows a side cross-sectional view of a gas mixing chamber according to a third embodiment of the invention.
第六圖所示為本發明第四實施例之混氣室之俯視圖。The sixth figure shows a top view of the mixing chamber of the fourth embodiment of the present invention.
11:反應部 11: Reaction Department
14:混氣結構 14: Mixed gas structure
15:蝕刻氣體管路 15: Etching gas pipeline
16a、16b:氣體管路 16a, 16b: gas pipeline
17:混氣塊 17: air block
111:反應室 111: Reaction room
112:上蓋板 112: upper cover
113:噴淋板 113: spray plate
114:承載盤 114: Carrier plate
141:混氣室 141: air mixing room
142a、142b:氣體通道 142a, 142b: gas channel
171:蝕刻氣體通道 171: Etching gas channel
172:混合氣體通道 172: Mixed gas channel
1411:頂端 1411: Top
1412:開口端 1412: Open end
X1:中心軸線 X1: Central axis
Claims (10)
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CN201811381958.4 | 2018-11-20 | ||
CN201811381958.4A CN109609929A (en) | 2018-11-20 | 2018-11-20 | Gas mixed nub structure and consersion unit |
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TW202020212A true TW202020212A (en) | 2020-06-01 |
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US5523063A (en) * | 1992-12-02 | 1996-06-04 | Applied Materials, Inc. | Apparatus for the turbulent mixing of gases |
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US9574268B1 (en) * | 2011-10-28 | 2017-02-21 | Asm America, Inc. | Pulsed valve manifold for atomic layer deposition |
US10232324B2 (en) * | 2012-07-12 | 2019-03-19 | Applied Materials, Inc. | Gas mixing apparatus |
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