TW202019571A - Wafer cleaning equipment and wafer production line - Google Patents

Abstract

The invention discloses wafer cleaning equipment and a wafer production line and relates to the field of wafer cleaning technologies. The wafer cleaning equipment comprises a cleaning main body, a clamping assembly, a cleaning assembly and a protection assembly. The clamping assembly is provided with a clamping station. A to-be-cleaned wafer is placed on the clamping station, and the clamping assembly is used for clamping the to-be-cleaned wafer. The cleaning assembly is used for cleaning the to-be-cleaned wafer. The cleaning main body is provided with a cleaning groove. The clamping assembly is arranged in the cleaning groove. The protection assembly comprises a protection cover, and the protection cover is movably connected to the cleaning main body and can move in the first direction so as to surround the to-be-cleaned wafer. The first direction is the outward direction of the groove opening of the cleaning groove. Through the wafer cleaning equipment and the wafer production line, the to-be-cleaned wafer can be prevented from being contaminated in the cleaning process, and the cleaning effect is improved.

Description

Wafer cleaning equipment and wafer production line

The present invention relates to the field of wafer cleaning processes, and in particular, to a wafer cleaning device and a wafer production line.

With the modern requirements for crystal integration and the advancement of semiconductor manufacturing technology, a large integrated circuit often contains very tiny electronic components. In the manufacturing process, pollutants such as fine dust particles, metal particles or oil stains are easily attached to electronic components, thus causing damage to the circuit functions in the chip, such as short circuit or open circuit, etc., resulting in the failure of the entire integrated circuit product . Therefore, the wafer cleaning process is a very important step.

In the normal wafer cleaning process, the wet cleaning process is a commonly used method, because it does not damage the wafer surface and can effectively remove contaminants. However, impurities are easily entered during the cleaning process to form secondary pollution.

In view of this, it is particularly important to develop and design a wafer cleaning equipment and wafer production line that can solve the above technical problems.

An object of the present invention is to provide a wafer cleaning device which can prevent the wafer to be cleaned from being contaminated during the cleaning process and improve the cleaning effect.

Another object of the present invention is to provide a wafer production line, which can prevent the wafer to be cleaned from being contaminated during the cleaning process and improve the cleaning effect.

The present invention provides a technical solution: In a first aspect, an embodiment of the present invention provides a wafer cleaning apparatus for cleaning a wafer to be cleaned. The wafer cleaning apparatus includes a cleaning body, a clamping assembly, a cleaning assembly, and a protection assembly; the clamping assembly is provided There is a clamping station, the wafer to be cleaned is placed in the clamping station, and the clamping assembly is used to clamp the wafer to be cleaned; the cleaning assembly is used to clean the crystal to be cleaned Round; the cleaning body is provided with a cleaning tank, the clamping assembly is provided in the cleaning tank; the protective assembly includes a protective cover, the protective cover is movably connected to the cleaning body, and the protective cover It can move in a first direction to surround the wafer to be cleaned, wherein the first direction is an outward direction of the notch of the cleaning tank.

With reference to the first aspect, in a first implementation manner of the first aspect, the protective cover is sleeved in the cleaning tank, and the outer wall of the protective cover is disposed near the side wall of the cleaning tank; the protective assembly It also includes a protective drive, which is connected to the protective cover and can drive the protective cover to move along a straight line in the first direction.

With reference to the first aspect and the foregoing implementation manners, in a second implementation manner of the first aspect, the protection assembly further includes a blower exhaust; the blower exhaust is disposed outside the cleaning tank and is clean Corresponding to the notch of the groove, the air blower can blow clean air to the cleaning groove; the bottom wall of the cleaning groove is provided with an air outlet, and the clean air can be discharged from the cleaning groove through the air outlet.

With reference to the first aspect and the foregoing implementation manners, in a third implementation manner of the first aspect, the cleaning assembly includes a cleaning mechanism and a drying mechanism; the cleaning mechanism includes a cleaning swing arm, a cleaning driving member, and a first cleaning nozzle , The cleaning driving member, the cleaning swing arm and the first cleaning nozzle are connected in sequence, and the cleaning driving member and the first cleaning nozzle are respectively disposed at both ends of the cleaning swing arm, and the cleaning driving member can drive The cleaning swing arm rotates to drive the first cleaning nozzle to the notch of the cleaning tank, and the first cleaning nozzle can spray cleaning agent to the wafer to be cleaned; the drying mechanism includes drying A swing arm, a drying driving member and a first drying nozzle, the drying driving member, the drying swing arm and the first drying nozzle are connected in sequence, and the drying driving member and the first drying nozzle are respectively provided on the drying swing arm At both ends of the drying drive, the drying drive can drive the drying swing arm to rotate to move the first drying nozzle to the slot of the cleaning tank, and the first drying nozzle can Dry gas is sprayed round.

With reference to the first aspect and the foregoing implementation manners, in a fourth implementation manner of the first aspect, the cleaning mechanism further includes a second cleaning nozzle, the second cleaning nozzle is disposed on the bottom wall of the cleaning tank, and A cleaning agent can be sprayed onto a side of the wafer to be cleaned facing the bottom wall of the cleaning tank; the drying mechanism further includes a second drying nozzle, the second drying nozzle is provided on the bottom wall of the cleaning tank, and Drying gas can be sprayed onto the side of the wafer to be cleaned facing the bottom wall of the cleaning tank.

With reference to the first aspect and the foregoing implementation manners, in a fifth implementation manner of the first aspect, the clamping assembly includes a fixing frame, a plurality of clamping pieces, and a plurality of bearing pieces; the plurality of clamping pieces are all Rotatingly connected to the edge of the fixing frame, a plurality of the carrier members are all disposed on the edge of the fixing frame, the carrier member is used to carry the wafer to be cleaned, the fixing frame and the cleaning tank The bottom wall is rotationally connected; the clamping member has an elastic reset portion, a rotational connection portion and a clamping portion connected in sequence, the rotational connection portion is rotationally connected to the edge of the fixing frame, and the clamping portion is clamped by the clamping portion When the wafer to be cleaned, the elastic reset portion is elastically deformed and compressed between the fixing frame and the rotating connection portion, and provides a force for the clamping portion to rotate toward the middle of the fixing frame.

With reference to the first aspect and the foregoing implementation manners, in a sixth implementation manner of the first aspect, the clamping assembly further includes a clamping drive member; the clamping drive member is disposed opposite to the elastic reset portion, so The clamping drive can push the elastic reset portion to drive the clamping portion to rotate away from the middle of the fixing frame.

With reference to the first aspect and the foregoing implementation manners, in a seventh implementation manner of the first aspect, the wafer cleaning apparatus further includes a detection control component, and the detection control component includes a first placement detection component and a Two placement detectors, the second placement detector is electrically connected to the clamping assembly; the first placement detector can emit a laser light signal to the second placement detector, the first placement detector and The connection line between the second placement detection parts passes through the clamping station.

With reference to the first aspect and the foregoing implementation manners, in an eighth implementation manner of the first aspect, the detection control component further includes a first horizontal detection member and a second horizontal detection member that are relatively disposed, and the second horizontal detection Is electrically connected to the clamping assembly; the first horizontal detection member can emit a laser light signal to the second horizontal detection member, and the connection between the first horizontal detection member and the second horizontal detection member Parallel and close to the clamping station.

In a second aspect, an embodiment of the present invention provides a wafer production line, including a production transfer mechanism and the wafer cleaning equipment. The wafer cleaning equipment includes a cleaning body, a clamping assembly, a cleaning assembly, and a protective assembly; The clamping assembly is provided with a clamping station, the wafer to be cleaned is placed at the clamping station, and the clamping assembly is used to clamp the wafer to be cleaned; the cleaning assembly is used to clean the A wafer to be cleaned; a cleaning tank is opened on the cleaning body, and the clamping assembly is disposed in the cleaning tank; the protection assembly includes a protection cover, and the protection cover is movably connected to the cleaning body, and The protective cover can move in a first direction to surround the wafer to be cleaned, wherein the first direction is an outward direction of the notch of the cleaning tank. The production transfer mechanism is disposed close to the clamping station and is used to transfer the wafer to be cleaned to the clamping assembly.

Compared with the prior art, the beneficial effects of the wafer cleaning device and the wafer production line provided by the embodiments of the present invention are as follows.

The wafer cleaning equipment and the wafer production line are movably connected to the cleaning body through a protective cover, and the protective cover can move in the first direction to surround the wafer to be cleaned, thereby avoiding the adhesion of impurities and the wafer to be cleaned during the cleaning process. The shielding of the protective cover prevents the wafer to be cleaned from adhering to impurities during the cleaning process and improves the cleaning effect.

In order to make the above objects, features, and advantages of the present invention more comprehensible, preferred embodiments are described below in conjunction with the accompanying drawings, which are described in detail below.

To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all the embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein can be arranged and designed in various different configurations.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, so once an item is defined in a drawing, there is no need to further define and explain it in subsequent drawings. The terms "upper", "lower", "inner", "outer", "left", "right", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or when the product of the invention is used The usual orientation or positional relationship, or the orientational or positional relationship commonly understood by those skilled in the art, is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation It is constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present invention. The terms "first", "second", etc. are only used to distinguish descriptions, and cannot be understood as indicating or implying relative importance. The terms "include", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also others that are not explicitly listed Elements, or also include elements inherent to such processes, methods, objects, or equipment. Without more restrictions, the element defined by the sentence "include one..." does not exclude that there are other identical elements in the process, method, article or equipment that includes the element.

It should also be noted that, unless otherwise clearly specified and limited, terms such as “setup” and “connection” should be understood in a broad sense. For example, “connection” may be a fixed connection, a detachable connection, or an integral connection ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, or it can be a connection between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

The specific embodiments of the present invention will be described in detail below with reference to the drawings.

[Example]

Please refer to FIG. 1. FIG. 1 is a schematic structural diagram of a wafer cleaning device 10 provided in an embodiment of the present invention applied to a wafer production line 100.

The wafer production line 100 includes a wafer cleaning device 10 and a production transfer mechanism 20. The production transfer mechanism 20 is disposed close to the wafer cleaning device 10 and is used to transfer the wafer 30 to be cleaned to the wafer cleaning device 10. It can be understood that the wafer The production line 100 can also use a robotic arm to grab or attract the wafers 30 to be cleaned to the wafer cleaning device 10, which can prevent impurities from contaminating the wafers 30 to be cleaned during the cleaning process, and the cleaning effect is good.

Since the wafer production line 100 adopts the wafer cleaning equipment 10, the wafer production line 100 also has the characteristics of being able to avoid contamination of the wafer 30 to be cleaned by impurities during the cleaning process, and has a good cleaning effect.

The structural composition, working principle and beneficial effects of the wafer cleaning device 10 provided by the embodiments of the present invention will be specifically described below.

Please refer to FIG. 2, which is a schematic structural cross-sectional view of a wafer cleaning apparatus 10 according to an embodiment of the present invention.

The wafer cleaning apparatus 10 includes a cleaning body 19, a clamping assembly 17, a cleaning assembly 15 and a protective assembly 12, the cleaning body 19 is used to provide a cleaning space, the clamping assembly 17 is used to clamp a wafer 30 to be cleaned, and the cleaning assembly 15 It is used to clean the wafer 30 to be cleaned, and the protection assembly 12 is used to prevent impurities from falling into the wafer cleaning process; Wherein, the clamping assembly 17 is provided with a clamping station 171, and the wafer 30 to be cleaned is placed at the clamping station 171. During cleaning, the clamping assembly 17 clamps the wafer 30 to be cleaned at the clamping station 171 to clean The assembly 15 is used to clean the wafer 30 to be cleaned. A cleaning tank 191 is opened on the cleaning body 19, and the clamping assembly 17 is disposed in the cleaning tank 191.

The protective assembly 12 includes a protective cover 121 movably connected to the cleaning body 19, and the protective cover 121 can move in the first direction to surround the wafer 30 to be cleaned, thereby preventing impurities from adhering to the cleaning process during the cleaning process For cleaning the wafer 30, the first direction is the outward direction of the notch of the cleaning tank 191, that is, the direction of the arrow in the figure.

In the process of cleaning the wafer 30 to be cleaned, the wafer 30 to be cleaned is first placed in the clamping station 171, the clamping assembly 17 clamps the wafer 30 to be cleaned, and the protective cover 121 of the protective assembly 12 moves in the first direction, and The wafer 30 to be cleaned is blocked, and the cleaning assembly 15 cleans the wafer 30 to be cleaned again, and is shielded by the protective cover 121 to prevent the wafer 30 to be cleaned from adhering to impurities during the cleaning process and improve the cleaning effect.

Further, the protective cover 121 is sleeved in the cleaning tank 191, and the outer wall of the protective cover 121 is disposed close to the inner wall of the cleaning tank 191, that is, the outer wall of the protective cover 121 matches the side wall of the cleaning tank 191, and the outer wall of the protective cover 121 is attached The side wall of the cleaning tank 191 is tight, but the protective cover 121 can move relative to the cleaning body 19 in the first direction, so that the protective cover 121 has a better effect of preventing foreign matter from entering, and the protective assembly 12 may further include a protective driving member 122 to protect the drive The component 122 is connected to the protective cover 121, and the protective driving member 122 can drive the linear movement of the protective cover 121 in the first direction, that is, the protective driving member 122 can drive the protective cover 121 to extend out of the protective cover 121 in the first direction, After the cleaning process is completed, the protective cover 121 is retracted, so as to take the wafer 30 to be cleaned after cleaning to improve the automation degree of the wafer cleaning device 10.

Please continue to refer to FIG. 2. The protection assembly 12 may further include an air blower 123. The air blower 123 is disposed outside the cleaning tank 191 and corresponds to the slot of the cleaning tank 191. The air blower 123 can also face the cleaning tank 191. Blowing clean air, at the same time, the bottom wall of the cleaning tank 191 can also be provided with an air outlet 192, the clean air can be discharged from the air outlet 192 to the cleaning tank 191, so that the air blowing 123 blows clean air, and the air outlet 192 discharges clean The air makes a clean gas environment from top to bottom in the space inside the cleaning tank 191 and the protective cover 121. The wafer 30 to be cleaned is placed in a clean environment, which further prevents foreign particles and other impurities from contaminating the wafer 30 to be cleaned. Moreover, the wafer 30 to be cleaned can be dried faster in the air flow of clean air, and the cleaning speed of the wafer cleaning device 10 is improved.

It can be understood that, when the protective cover 121 moves in the first direction, it can also be in contact with the blower 123 when the cleaning tank 191 is not fully extended, so that the protective cover 121, the blower 123, and the cleaning tank The inner walls of 191 together form an enclosed clean space, which further prevents external impurities from contaminating the wafer 30 to be cleaned and improves the cleaning effect.

It should be noted that the above-mentioned air blower 123 may also be a high-efficiency air filtration device, which directly blows the filtered clean air directly to the wafer 30 to be cleaned by the high-efficiency air filtration device, avoiding pipeline transmission and improving the cleanliness of the clean air .

Please continue to refer to FIG. 2. The cleaning assembly 15 may include a cleaning mechanism 152 and a drying mechanism 153. The cleaning mechanism 152 is used to clean the wafer 30 to be cleaned with a cleaning agent, and the drying mechanism 153 dries the cleaned wafer 30 by spraying air.

The cleaning mechanism 152 includes a cleaning swing arm 1521, a cleaning driving member 1522, and a first cleaning nozzle 1523. The cleaning driving member 1522, the cleaning swing arm 1521, and the first cleaning nozzle 1523 are connected in sequence, and the cleaning driving member 1522 and the first cleaning nozzle 1523 are respectively disposed at both ends of the cleaning swing arm 1521, the cleaning driving member 1522 can drive the cleaning swing arm 1521 to rotate, so as to drive the first cleaning nozzle 1523 to the slot of the cleaning tank 191, and the first cleaning nozzle 1523 can be cleaned The wafer 30 sprays cleaning chemicals, and the cleaning drive 1522 can also drive the cleaning swing arm 1521 to rotate, so as to drive the first cleaning nozzle 1523 to turn away from the slot of the cleaning tank 191, so as to take the cleaned wafer 30 to be cleaned.

The drying mechanism 153 includes a drying swing arm 1531, a drying driving member 1532 and a first drying nozzle 1533, the drying driving member 1532, the drying swing arm 1531 and the first drying nozzle 1533 are connected in sequence, and the drying driving member 1532 and the first drying nozzle 1533 are respectively Set at both ends of the drying swing arm 1531, the drying driving member 1532 can drive the drying swing arm 1531 to rotate to drive the first drying nozzle 1533 to the slot of the cleaning tank 191, and the first drying nozzle 1533 can be directed toward the wafer to be cleaned 30. Drying gas is sprayed to dry the wafer 30 to be cleaned, and the drying drive 1532 can also drive the drying swing arm 1531 to rotate, so as to drive the first drying nozzle 1533 to rotate away from the slot of the cleaning tank 191, so that it is easy to take The cleaned wafer 30 to be cleaned is completed.

In addition, the cleaning mechanism 152 may further include a second cleaning nozzle 1524 disposed on the bottom wall of the cleaning tank 191 and capable of spraying cleaning agent toward the side of the wafer 30 to be cleaned facing the bottom wall of the cleaning tank 191, that is, The wafer 30 to be cleaned is cleaned from the side opposite to the first cleaning nozzle 1523, and the cleaning agent is sprayed from the upper and lower sides of the wafer 30 to be cleaned, thereby improving the cleaning effect of the wafer cleaning apparatus 10.

The drying mechanism 153 further includes a second drying nozzle 1534 that is disposed on the bottom wall of the cleaning tank 191 and can spray drying gas toward the side of the wafer 30 to be cleaned facing the bottom wall of the cleaning tank 191, that is, the The side of the wafer 30 opposite to the first drying nozzle 1533 is blown, and at the same time, the drying gas is sprayed from the upper and lower sides of the wafer 30 to be cleaned, so as to increase the drying speed of the wafer cleaning apparatus 10.

Please refer to FIG. 3, which is a schematic structural diagram of the detection control component 18 of the clamping component 17 of the wafer cleaning apparatus 10 according to an embodiment of the present invention.

The wafer cleaning apparatus 10 may further include a detection control component 18, and the detection control component 18 includes a first placement detection element 181 and a second placement detection element 182 disposed oppositely. The first placement detection element 181 and the second placement detection element 182 are respectively Laser light transmitter and receiver, the first placement detector 181 can emit a laser light signal to the second placement detector 182, because the connection between the first placement detector 181 and the second placement detector 182 passes through the clamping station 171, so when there is no wafer 30 to be cleaned on the clamping station 171, the second placement detector 182 can receive the laser signal, and then detect whether the wafer 30 to be cleaned is placed on the clamping station 171. After the placement detector 182 receives the laser light signal, the second placement detector 182 generates the unplaced signal, or generates the placement signal when the second placement detector 182 does not receive the laser light signal, the clamping assembly 17 and the second placement detection The component 182 is electrically connected, and clamps the wafer 30 to be cleaned when receiving the placement signal, so as to increase the degree of automation of the wafer cleaning apparatus 10 and facilitate automatic cleaning operations.

Further, the detection control component 18 may further include a first horizontal detection member 183 and a second horizontal detection member 184 that are relatively disposed. The second horizontal detection member 184 is electrically connected to the clamping assembly 17, the first horizontal detection member 183 can emit a laser light signal to the second horizontal detection member 184, and the connection between the first horizontal detection member 183 and the second horizontal detection member 184 Parallel and close to the clamping station 171, when the wafer 30 to be cleaned clamped by the clamping assembly 17 is not horizontal or reaches a preset angle, the wafer 30 to be cleaned will block the laser light emitted by the first horizontal detection member 183, In turn, the second horizontal detection member 184 cannot receive the laser light signal. The second horizontal detection member 184 generates a non-horizontal signal when it fails to receive the laser light signal. The clamping assembly 17 releases the crystal to be cleaned after receiving the non-horizontal signal. Circle 30 to facilitate repositioning, or prompt the operator to check if there is a malfunction.

It should be noted that the detection control component 18 may further include a main controller 185, and the main controller 185 is respectively connected to the first horizontal detection piece 183, the second horizontal detection piece 184, the first placement detection piece 181, and the second placement detection piece 182 and the driving members of the clamping assembly 17 and the guard assembly 12 are electrically connected, so that the wafer cleaning apparatus 10 automatically performs cleaning operations.

It can be understood that the above main controller 185 may also be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU), a network processor (Network Processor, NP), a voice processor, a video processor, etc.; It can be a digital signal processor, a dedicated integrated circuit, a field programmable gate array or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component. The disclosed logical block diagram in the embodiments of the present invention may be implemented or executed. The main controller 185 may also be any conventional processor, such as PLC (Programmable Logic Controller, programmable logic controller), single chip microcomputer, and so on. Of course, the main controller 185 may also be a relay contactor control system, which uses a combination of switches, relays, and buttons to control signals to achieve signal reception and make line switching or switch functions.

Please refer to FIG. 4, which is a schematic structural cross-sectional view of the clamping assembly 17 of the wafer cleaning apparatus 10 according to an embodiment of the present invention.

The clamping assembly 17 includes a fixing frame 172, a plurality of clamping pieces 173, and a plurality of carrying pieces 175. The plurality of clamping pieces 173 are all rotatably connected to the edge of the fixing frame 172. The plurality of carrying pieces 175 are all disposed on the fixing frame 172. At the edge, the carrier 175 is used to carry the wafer 30 to be cleaned, and the fixing frame 172 is rotatably connected to the bottom wall of the cleaning tank 191.

The clamping member 173 has an elastic reset portion 1731, a rotation connection portion 1732 and a clamping portion 1733 connected in sequence. The rotation connection portion 1732 is rotationally connected to the edge of the fixing frame 172, and the wafer 30 to be cleaned is clamped in the clamping portion 1733 At this time, the elastic reset portion 1731 is elastically deformed and compressed between the fixing frame 172 and the rotation connecting portion 1732, and provides the clamping portion 1733 with a rotating force toward the middle of the fixing frame 172 to clamp the wafer 30 to be cleaned, ie The compressed elastic reset portion 1731 has a force to restore the deformation, and gives the rotating connection portion 1732 a force to turn the clamping portion 1733 toward the middle of the fixing frame 172, so that the clamping portion 1733 can clamp the wafer 30 to be cleaned.

It should be noted that the carrier 175 is provided with a guide inclined surface 1751, a carrier vertical surface 1752 and a carrier surface 1753 connected in sequence. When the wafer 30 to be cleaned is placed, the carrier vertical surface 1752 and the guide inclined surface 1751 restrict the wafer 30 to be cleaned The lateral displacement of the bearing surface 1753 is used to carry the wafer 30 to be cleaned; and the elastic reset portion 1731 may be an elastic rubber member or a sleeved spring toward the fixing frame 172.

Further, the clamping assembly 17 further includes a clamping driving member 176 opposite to the elastic reset portion 1731. The clamping driving member 176 can push the elastic reset portion 1731, compress the elastic reset portion 1731, and then drive the clamp The holding portion 1733 rotates toward the middle away from the fixing frame 172 to release the wafer 30 to be cleaned.

It should be noted that the clamping assembly 17 further includes a clamping rotation driving member 177, and the fixing frame 172 is connected to the bottom wall of the cleaning tank 191 through the clamping rotation driving member 177, and the clamping rotation driving member 177 can drive the fixed rotation to facilitate The wafer 30 to be cleaned is cleaned more uniformly.

The working principle of the wafer cleaning apparatus 10 provided by the embodiment of the present invention is as follows.

The protective assembly 12 includes a protective cover 121 movably connected to the cleaning body 19, and the protective cover 121 can move in the first direction to surround the wafer 30 to be cleaned, thereby preventing impurities from adhering to the cleaning during the cleaning process The wafer 30 is shielded by the protective cover 121 to prevent the wafer 30 to be cleaned from adhering to impurities during the cleaning process and improve the cleaning effect.

And the process of cleaning the wafer 30 to be cleaned is as follows.

The first placement detector 181 and the second placement detector 182 detect whether the wafer 30 to be cleaned is placed on the clamping station 171; when it is detected that the wafer 30 to be cleaned is placed on the clamping station 171, the clamping assembly 17 The clamping member 173 clamps the wafer 30 to be cleaned, and can also rotate the wafer 30 to be cleaned; the first horizontal detection piece 183 and the second horizontal detection piece 184 detect whether the wafer 30 to be cleaned is placed horizontally; when the crystal to be cleaned is detected The circle 30 is placed horizontally, and the protective cover 121 moves in the first direction and surrounds the wafer 30 to be cleaned; the first cleaning nozzle 1523 of the cleaning mechanism 152 moves to the slot of the cleaning tank 191, the first cleaning nozzle 1523 and the second cleaning The nozzles 1524 jointly spray the cleaning agent to the wafer 30 to be cleaned; the first drying nozzle 1533 of the drying mechanism 153 moves to the slot of the cleaning tank 191, and the first drying nozzle 1533 and the second drying nozzle 1534 simultaneously blow the wafer 30 to be cleaned At the same time, the air blower 123 blows clean air to the wafer 30 to be cleaned to form a clean space wrapped with clean air, and the clamping member 173 releases the wafer 30 to be cleaned after the cleaning is completed.

[In summary]

The wafer cleaning device 10 provided by the embodiment of the present invention can prevent the wafer 30 to be cleaned from being contaminated during the cleaning process and improve the cleaning effect.

The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the features in the above embodiments can be combined with each other without conflict, the present invention There can also be various changes and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention. Furthermore, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the scope of the attached patent application rather than the above description. All changes within the scope are included in the present invention. Any component symbol in the scope of patent application shall not be regarded as limiting the scope of patent application involved.

10: Wafer cleaning equipment 12: Protective components 15: Clean components 17: clamping assembly 18: Detection control components 19: Clean the main body 20: Production transmission mechanism 30: Wafer to be cleaned 100: Wafer production line 121: Protective cover 122: protective drive 123: Insufflation 152: Cleaning agency 153: Drying mechanism 171: Clamping station 172: fixed frame 173: clamping piece 175: Carrier 176: clamping drive 177: clamping rotating drive 181: The first placement test piece 182: Second placement test piece 183: The first level test piece 184: Second level detection piece 185: main controller 191: Cleaning tank 192: Outlet 1521: Cleaning the swing arm 1522: Clean the drive 1523: First cleaning nozzle 1524: Second cleaning nozzle 1531: Dry swing arm 1532: Dry drive parts 1533: First drying nozzle 1534: Second drying nozzle 1731: Elastic reset section 1732: Rotating connection 1733: Clamping section 1751: Guide bevel 1752: Bearing vertical plane 1753: bearing surface

In order to more clearly explain the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be considered as limiting the scope. For those of ordinary skill in the art, on the premise of not paying creative work, other related drawings can also be obtained according to these drawings.

FIG. 1 is a schematic structural diagram of a wafer cleaning device provided in an embodiment of the present invention applied to a wafer production line.

2 is a schematic structural cross-sectional view of a wafer cleaning device provided by an embodiment of the present invention.

FIG. 3 is a schematic structural diagram of a detection control component of a clamping component of a wafer cleaning device according to an embodiment of the present invention.

4 is a schematic structural cross-sectional view of a clamping assembly of a wafer cleaning device provided by an embodiment of the present invention.

121: Protective cover

122: protective drive

123: Insufflation

152: Cleaning agency

153: Drying mechanism

171: Clamping station

191: Cleaning tank

192: Outlet

1521: Cleaning the swing arm

1522: Clean the drive

1523: First cleaning nozzle

1524: Second cleaning nozzle

1531: Dry swing arm

1532: Dry drive parts

1533: First drying nozzle

1534: Second drying nozzle

Claims (10)

A wafer cleaning device is used to clean a wafer to be cleaned. The wafer cleaning device includes a cleaning body, a clamping component, a cleaning component, and a protective component; The clamping assembly is provided with a clamping station, the wafer to be cleaned is placed at the clamping station, and the clamping assembly is used to clamp the wafer to be cleaned; The cleaning assembly is used to clean the wafer to be cleaned; A cleaning tank is opened on the cleaning body, and the clamping assembly is disposed in the cleaning tank; The protective assembly includes a protective cover, the protective cover is movably connected to the cleaning body, and the protective cover can move in a first direction to surround the wafer to be cleaned, wherein the first direction is Describe the outward direction of the notch of the cleaning tank. The wafer cleaning apparatus according to claim 1, wherein the protective cover is sleeved in the cleaning tank, and the outer wall of the protective cover is disposed near the side wall of the cleaning tank; The protection assembly further includes a protection driving member, the protection driving member is connected to the protection cover, and can drive the protection cover to move along a straight line in the first direction. The wafer cleaning device according to claim 1, wherein the protection assembly further includes an air blower; The air blowing row is provided outside the cleaning tank and corresponds to the slot of the cleaning tank, and the air blowing row can blow clean air to the cleaning tank; An air outlet is opened on the bottom wall of the cleaning tank, and the clean air can be discharged from the cleaning tank through the air outlet. The wafer cleaning apparatus according to any one of claims 1 to 3, wherein the cleaning assembly includes a cleaning mechanism and a drying mechanism; The cleaning mechanism includes a cleaning swing arm, a cleaning driving member and a first cleaning nozzle, the cleaning driving member, the cleaning swing arm and the first cleaning nozzle are connected in sequence, and the cleaning driving member and the first cleaning nozzle The cleaning nozzles are respectively disposed on both ends of the cleaning swing arm, and the cleaning driving member can drive the cleaning swing arm to rotate to drive the first cleaning nozzle to the slot of the cleaning tank, and the first A cleaning nozzle capable of spraying cleaning agent to the wafer to be cleaned; The drying mechanism includes a drying swing arm, a drying driving member and a first drying nozzle, the drying driving member, the drying swing arm and the first drying nozzle are connected in sequence, and the drying driving member and the first drying nozzle The drying nozzles are respectively disposed at both ends of the drying swing arm, and the drying driving member can drive the drying swing arm to rotate, so as to drive the first drying nozzle to move to the slot of the cleaning tank, and the first A drying nozzle can spray drying gas onto the wafer to be cleaned. The wafer cleaning apparatus according to claim 4, wherein the cleaning mechanism further includes a second cleaning nozzle, the second cleaning nozzle is provided on the bottom wall of the cleaning tank, and can be directed toward the wafer to be cleaned Spraying cleaning agent towards the bottom wall of the cleaning tank; The drying mechanism further includes a second drying nozzle, which is provided on the bottom wall of the cleaning tank and is capable of spraying drying gas toward the side of the wafer to be cleaned facing the bottom wall of the cleaning tank. The wafer cleaning apparatus according to any one of claims 1 to 3, wherein the clamping assembly includes a fixing frame, a plurality of clamping pieces, and a plurality of carrying pieces; A plurality of the clamping members are all rotatably connected to the edge of the fixing frame, and a plurality of the carrier members are all disposed on the edge of the fixing frame. The carrier members are used to carry the wafer to be cleaned. The fixing frame is rotatably connected to the bottom wall of the cleaning tank; The clamping member has an elastic reset part, a rotation connection part and a clamping part connected in sequence, the rotation connection part is rotatably connected with an edge of the fixing frame, and the wafer to be cleaned is clamped in the clamping part At this time, the elastic reset portion is elastically deformed and compressed between the fixing frame and the rotating connection portion, and provides a force for the clamping portion to rotate toward the middle of the fixing frame. The wafer cleaning apparatus according to claim 6, wherein the clamping assembly further includes a clamping drive; The clamping driving member is disposed opposite to the elastic resetting portion, and the clamping driving member can push the elastic resetting portion to drive the clamping portion to rotate away from the middle of the fixing frame. The wafer cleaning apparatus according to any one of claims 1 to 3, wherein the wafer cleaning apparatus further includes a detection control assembly, and the detection control assembly includes a first placement detector and a second placement that are oppositely disposed A detection element, the second placement detection element is electrically connected to the clamping assembly; The first placement detector can emit a laser light signal to the second placement detector, and the connection between the first placement detector and the second placement detector passes through the clamping station. The wafer cleaning apparatus according to claim 8, wherein the detection control assembly further includes a first horizontal detection member and a second horizontal detection member disposed oppositely, the second horizontal detection member and the clamping Components electrical connection; The first horizontal detection element can emit a laser light signal to the second horizontal detection element, and a line between the first horizontal detection element and the second horizontal detection element is parallel and close to the clamping station. A wafer production line includes a production conveying mechanism and the wafer cleaning equipment according to any one of claims 1 to 9, the production conveying mechanism is disposed close to the clamping station and used to feed the clamping assembly Transfer the wafer to be cleaned.

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