TW202018422A - Mark position detecting apparatus, writing apparatus and mark position detecting method - Google Patents

Mark position detecting apparatus, writing apparatus and mark position detecting method Download PDF

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TW202018422A
TW202018422A TW108116118A TW108116118A TW202018422A TW 202018422 A TW202018422 A TW 202018422A TW 108116118 A TW108116118 A TW 108116118A TW 108116118 A TW108116118 A TW 108116118A TW 202018422 A TW202018422 A TW 202018422A
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image
area
mark
substrate
unit
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TW108116118A
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Chinese (zh)
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TWI734111B (en
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田中尚武
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日商斯庫林集團股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/70681Metrology strategies
    • G03F7/70683Mark designs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073Alignment marks and their environment
    • G03F9/7084Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

A writing apparatus includes a function as a mark position detecting apparatus detecting a position of a mark on a substrate held on a stage. The writing apparatus obtains a first image (83a) showing a first region on the substrate, the region including a position of a mark in design, and obtains a second image (83b) showing a second region a part of which overlaps on the first region while moving the stage. Further, the writing apparatus composes the first image (83a) and the second image (83b) to produce a composed image (85). The writing apparatus obtains a position of the mark on the basis of the composed image (85). This makes it possible to easily enlarge the field of vision without lowering resolution of the image capturing device, and to thereby reduce error of detecting a position of the mark on the substrate.

Description

標記位置檢測裝置、描繪裝置以及標記位置檢測方法Mark position detection device, drawing device and mark position detection method

[0001]     本發明係有關於一種檢測基板上之標記的位置的技術,較佳為利用於在基板描繪圖案(pattern)的描繪裝置。[0001] The present invention relates to a technique for detecting the position of a mark on a substrate, and is preferably used in a drawing device for drawing a pattern on a substrate.

[0002]     以往已在各種場面利用了將光照射於基板且於基板上直接描繪圖案的描繪裝置。此種描繪方法亦被稱為直接成像(direct imaging)。於描繪之前,藉由以攝影部讀取形成於基板上且被稱為對齊標記(alignment mark)的標記的位置求得從設計上的位置偏移的標記的位置的偏移量。進而,根據偏移量求得基板的位置、伸縮量、歪曲量等,參照這些資訊而即時地一邊補正描繪資料一邊進行描繪。藉此,可實現配合基板的位置偏移、變形以高精度進行描繪。例如可舉出日本特開2015-64461號公報所揭示的裝置作為此種描繪裝置。直接成像係適合於對基板的位置偏移、變形大且具有可撓性的基板的描繪。 [0003]     然而,依據基板的種類、品質,存有在支持基板的工作台(stage)上標記的位置大幅偏移的情形。例如,在具有可撓性的基板的情形中,由於基板製造時的裁斷精度低,處理性(handling)精度亦低,故將基板載置於工作台時的標記的位置偏移會變大。另外,於具有可撓性的基板的情形中,基板的伸縮、歪曲等的變形大亦成為標記的位置偏移的原因。結果,於攝影標記時,標記位於攝影範圍外的頻度變高。一旦標記的位置的檢測失敗,則製造線會停止,生產性大幅降低。 [0004]     為了成為即使標記的位置從所期望的位置大幅偏移仍可攝影,例如有需要使攝影部從桌台遠離且降低光學系統的倍率而擴展攝影範圍。於該情形中,圖像的解析度降低,標記的位置的檢測精度降低。故為了維持解析度,有需要增多成像感測器的畫素數量,但於該情形中,攝影部變得高價並且攝影部在物理上變大。[0002] In the past, a drawing device that irradiates light on a substrate and directly draws a pattern on the substrate has been used in various scenes. This kind of drawing method is also called direct imaging. Before drawing, the position of the mark, which is offset from the design position, is obtained by reading the position of the mark called the alignment mark formed on the substrate with the imaging unit. Furthermore, the position of the substrate, the amount of expansion and contraction, the amount of distortion, and the like are obtained based on the offset, and drawing is performed while correcting the drawing data with reference to the information. With this, it is possible to draw with high accuracy in accordance with the positional deviation and deformation of the substrate. For example, the device disclosed in Japanese Patent Laid-Open No. 2015-64461 can be cited as such a drawing device. The direct imaging system is suitable for depicting substrates that are offset, deformed, and flexible. [0003] However, depending on the type and quality of the substrate, there may be a case where the position of the mark on the stage supporting the substrate is largely shifted. For example, in the case of a flexible substrate, since the cutting accuracy at the time of manufacturing the substrate is low and the handling accuracy is also low, the positional deviation of the mark when the substrate is placed on the table becomes large. In addition, in the case of a flexible substrate, the deformation of the substrate such as expansion and contraction and distortion is also a cause of the positional deviation of the mark. As a result, when photographing a mark, the frequency of the mark outside the shooting range becomes higher. Once the detection of the marked position fails, the manufacturing line is stopped and the productivity is greatly reduced. [0004] In order to be able to shoot even if the position of the mark is greatly shifted from the desired position, for example, it is necessary to move the imaging section away from the table and reduce the magnification of the optical system to expand the imaging range. In this case, the resolution of the image is lowered, and the detection accuracy of the position of the mark is lowered. Therefore, in order to maintain the resolution, it is necessary to increase the number of pixels of the imaging sensor, but in this case, the imaging section becomes expensive and the imaging section becomes physically large.

[0005]     本發明之目的為藉由不降低攝影部之解析度且輕易地擴大視野而減低標記的位置的檢測錯誤(error)。 [0006]     本發明係適合用於檢測被工作台保持的基板上的標記之位置的標記位置檢測裝置。本發明之較佳的一形態之標記位置檢測裝置係具備有:工作台,係保持基板;攝影部,係取得形成於前述基板上的標記的圖像;移動機構,係在平行於前述基板的主表面的方向使前述工作台相對於前述攝影部相對地移動;攝影控制部,係藉由控制前述攝影部以及前述移動機構而取得第一圖像以及第二圖像,前述第一圖像係顯示前述基板上的第一區域,前述第一區域係包含有前述標記的設計上的位置,前述第二圖像係顯示僅有一部分與前述第一區域重疊的第二區域;圖像合成部,係將前述第一圖像與前述第二圖像合成而生成合成圖像;以及位置取得部,係根據前述合成圖像求得前述標記相對於前述工作台的位置。 [0007]     依據本發明,可不降低攝影部之解析度且輕易地擴大視野而可減低基板上的標記的位置的檢測錯誤。 [0008]     較佳為,前述第一區域與前述第二區域係分別具有彼此垂直的長邊與短邊;前述第一區域與前述第二區域係排列於與前述短邊幾乎平行的方向。 [0009]     進一步較佳為,前述圖像合成部係在求得前述第二圖像相對於前述第一圖像的相對位置時,利用將前述第一區域以及前述第二區域的前述短邊和前述第一區域的中心與前述第二區域的中心連結的直線所成的角度。 [0010]     較佳為,前述移動機構係使前述工作台相對於前述攝影部於移動方向相對地且直線狀地移動;前述攝影部係在前述工作台相對於前述攝影部的相對移動中取得前述第一圖像以及前述第二圖像。 [0011]     較佳為,前述移動機構係使前述工作台相對於前述攝影部於移動方向相對地且直線狀地移動;前述攝影部係取得於前述移動方向排列的奇數個的複數個區域的圖像,前述複數個區域的各者係僅有一部分與鄰接的區域重疊;前述第一區域係前述複數個區域中的中央的區域;前述第二區域係與前述第一區域鄰接的一個區域。 [0012]     較佳為,前述合成圖像中的前述第一圖像與另一個圖像重疊的部位的畫素值係前述第一圖像的畫素值。 [0013]     較佳的實施形態中,標記位置檢測裝置係進一步具備有:另一個攝影部,係取得形成於前述基板上的另一個標記的圖像;前述攝影控制部係藉由控制前述另一個攝影部以及前述移動機構而取得另一個第一圖像以及另一個第二圖像,前述另一個第一圖像係顯示前述基板上的另一個第一區域,前述另一個第一區域係包含有前述另一個標記的設計上的位置,前述另一個第二圖像係顯示僅有一部分與前述另一個第一區域重疊的另一個第二區域;前述圖像合成部係將前述另一個第一圖像與前述另一個第二圖像合成而生成另一個合成圖像;前述合成圖像的尺寸與前述另一個合成圖像的尺寸係相同。 [0014]     較佳為,前述基板係具有可撓性。 [0015]     本發明亦適合用於在基板描繪圖案的描繪裝置。描繪裝置係具備有:上述標記位置檢測裝置,係檢測形成於基板上的複數個標記的位置;補正部,係根據前述複數個標記的位置補正描繪資料;描繪頭,係對前述工作台上的前述基板照射調變後的光;以及描繪控制部,係控制前述移動機構以及前述描繪頭,藉此根據補正後的描繪資料於前述基板上進行描繪。 [0016]     本發明亦適合用於檢測被工作台保持的基板上的標記之位置的標記位置檢測方法。標記位置檢測方法係具有:工序(a),係取得第一圖像,前述第一圖像係顯示包含有被工作台保持的基板上的標記的設計上的位置的第一區域;工序(b),係取得第二圖像,前述第二圖像係顯示僅有一部分與前述第一區域重疊的第二區域;工序(c),係將前述第一圖像與前述第二圖像合成而生成合成圖像;以及工序(d),係根據前述合成圖像求得前述標記相對於前述工作台的位置。 [0017]     上述目的以及其他的目的、特徵、態樣以及優點係可參照添付的圖式並藉由以下進行的本發明之詳細說明而明瞭。[0005] The purpose of the present invention is to reduce the detection error of the position of the mark by easily reducing the resolution of the photographing section and easily expanding the field of view. [0006] The present invention is a mark position detection device suitable for detecting the position of a mark on a substrate held by a table. A preferred form of the marker position detection device of the present invention is provided with: a table to hold the substrate; a photographing section to obtain an image of the marker formed on the substrate; a moving mechanism parallel to the substrate The direction of the main surface moves the table relative to the photographing section; the photographing control section acquires the first image and the second image by controlling the photographing section and the moving mechanism. The first image is Displaying a first area on the substrate, the first area including the design position of the mark, and the second image displaying a second area that only partially overlaps the first area; an image synthesis section, The first image is combined with the second image to generate a combined image; and the position acquisition unit obtains the position of the mark relative to the table based on the combined image. [0007] According to the present invention, it is possible to easily expand the field of view without reducing the resolution of the imaging section and reduce the detection error of the position of the mark on the substrate. [0008] Preferably, the first area and the second area respectively have long sides and short sides perpendicular to each other; the first area and the second area are arranged in a direction almost parallel to the short side. [0009] It is further preferred that the image synthesis unit utilizes the sum of the short sides of the first area and the second area when determining the relative position of the second image with respect to the first image The angle formed by the straight line connecting the center of the first area and the center of the second area. [0010] Preferably, the moving mechanism moves the table relatively linearly in the moving direction with respect to the photographing section; the photographing section acquires the aforesaid relative movement of the table relative to the photographing section The first image and the aforementioned second image. [0011] Preferably, the moving mechanism moves the table relatively linearly in the moving direction with respect to the imaging unit; the imaging unit obtains a picture of an odd number of plural regions arranged in the moving direction For example, only a part of each of the plurality of regions overlaps the adjacent region; the first region is the central region among the plurality of regions; and the second region is a region adjacent to the first region. [0012] Preferably, the pixel value of a portion where the first image overlaps with another image in the composite image is the pixel value of the first image. [0013] In a preferred embodiment, the mark position detection device is further provided with: another photographing unit that acquires an image of another mark formed on the substrate; the photographing control unit controls the other The photography unit and the moving mechanism acquire another first image and another second image. The other first image displays another first area on the substrate, and the other first area includes the The design position of the aforementioned another mark, the aforementioned another second image shows another second area where only a part overlaps with the aforementioned another first area; the aforementioned image synthesizing section compares the aforementioned another first image The image is synthesized with the aforementioned another second image to generate another synthesized image; the size of the aforementioned synthesized image is the same as the size of the aforementioned another synthesized image. [0014] Preferably, the aforementioned substrate is flexible. [0015] The present invention is also suitable for a drawing device for drawing a pattern on a substrate. The drawing device is provided with: the above-mentioned mark position detecting device, which detects the positions of a plurality of marks formed on the substrate; the correction part, which corrects the drawing data according to the positions of the plurality of marks; The substrate is irradiated with modulated light; and a drawing control unit controls the moving mechanism and the drawing head, thereby drawing on the substrate based on the corrected drawing data. [0016] The present invention is also suitable for a mark position detection method for detecting the position of a mark on a substrate held by a table. The mark position detection method includes: step (a), which obtains a first image that displays a first area including a design position of the mark on the substrate held by the table; and step (b) ), a second image is obtained, the second image shows a second area that only partially overlaps the first area; step (c), the first image is combined with the second image Generating a composite image; and step (d), the position of the mark relative to the table is obtained from the composite image. [0017] The above-mentioned objectives and other objectives, features, aspects, and advantages can be understood by referring to the attached drawings and by the following detailed description of the present invention.

[0019]     圖1係顯示本發明的一實施形態之描繪系統100的構成的方塊圖。描繪系統100係用以對印刷配線基板等的基板上的感光材料照射光並於該感光材料描繪配線等的圖案之系統。較佳為,基板為具有可撓性的印刷配線基板。作為基板,可利用其他的各種基板,且可為剛性的基板或者利用於電路的配線以外的基板。 [0020]     描繪系統100係具備有電腦101以及描繪裝置1。描繪裝置1係包含有作為用以檢測基板上的標記的位置之標記位置檢測裝置的功能。電腦101係用以生成設計資料,該設計資料係顯示應描繪於基板的整體圖案。設計資料係例如顯示整體圖案的向量資料。描繪裝置1係具備有電腦21以及裝置本體10。電腦21係擔任裝置本體10的整體控制。電腦21亦進行從設計資料生成裝置本體10中所使用的描繪資料的生成。電腦101、電腦21以及裝置本體10係可彼此通信地連接。 [0021]     圖2為顯示裝置本體10的立體圖。圖2中係將彼此正交的三個方向作為X方向、Y方向以及Z方向而以箭號表示(於其他的圖中亦相同)。於圖2之例中,X方向以及Y方向為水平方向,Z方向為鉛直方向。視描繪裝置1的設計,Z方向亦可為對於鉛直方向傾斜的方向或水平方向。 [0022]     裝置本體10係具備有複數個描繪頭31、工作台41、工作台升降機構42、工作台移動機構43以及攝影單元5。工作台41係在描繪頭31的下方((-Z)側)保持基板9。複數個描繪頭31係於X方向(以下,亦稱為「寬度方向」。)排列。各描繪頭31中,從光源朝向光調變部射出雷射光,藉由光調變部調變該光。被調變(空間調變)的光係照射在工作台41上的基板9中的朝向(+Z)方向的主表面91。本實施形態中,二維地排列有複數個微小鏡的DMD(digital mirror device;數位鏡元件)係被利用於作為各描繪頭31的光調變部。光調變部亦可為一維地排列有複數個光調變元件的調變器等。 [0023]     工作台升降機構42係使工作台41於Z方向移動。工作台移動機構43係使工作台41與工作台升降機構42一起於Y方向(以下,亦稱「移動方向」)移動。工作台移動機構43係例如用以使工作台41沿著導軌直線狀地移動之機構,且使用例如線性伺服馬達(linear servo motor)作為驅動源。藉此,使工作台41以高精度移動。亦可使用於滾珠螺桿裝設馬達作為工作台移動機構43的驅動源。於描繪裝置1中,可省略工作台升降機構42,或亦可設置以平行於Z方向的軸作為中心使工作台41旋轉的旋轉機構。 [0024]     攝影單元5係配置在複數個描繪頭31的(-Y)側。攝影單元5係具備有複數個攝影部51。複數個攝影部51係在寬度方向隔著間隔排列。各攝影部51係攝影工作台41上的基板9且取得圖像的資料。攝影部51係取得形成在基板9上的標記即所謂對齊標記的圖像。攝影部51係包含有二維影像感測器(2D image sensor)以及攝影光學系統的所謂數位靜物攝影機(digital still camera)。 [0025]     於工作台41上設置有接觸基板9之邊緣的抵接部411。於基板9載置於工作台41上時,藉由基板9的邊緣接觸抵接部411而可決定基板9在工作台41上的位置以及方向。本實施形態中,抵接部411為三個銷(pin)。抵接部411不限定為銷,例如亦可為於X方向以及Y方向延伸並且向上方突出的部位。基板9係藉由吸引吸附而被固定於工作台41上。基板9亦可為藉由其他的手法而被固定於工作台41。 [0026]     於由描繪頭31所進行的圖案的描繪中,工作台移動機構43係使工作台41於移動方向連續地移動,來自各描繪頭31的光所照射的基板9上的位置係相對於基板9於移動方向掃描。另外,同步於工作台41的移動,描繪頭31的DMD被控制。藉此,對於在主表面91上的移動方向延伸的帶區域進行了由各描繪頭31所進行的圖案的描繪。 [0027]     本實施形態中,藉由工作台41往移動方向的1次連續移動而在基板9的描繪區域整體描繪圖案(所謂一次通過描繪(one pass drawing))。描繪裝置1中,亦可藉由將工作台41往移動方向的連續移動與往垂直於移動方向的寬度方向的間歇移動重複複數次而進行往描繪區域的整體的圖案的描繪(所謂多次通過描繪(multi pass drawing))。 [0028]     圖3為顯示裝置本體10之一部分的側視圖。圖3係朝向(-X)方向觀看裝置本體10之圖。各攝影部51係可藉由攝影部移動機構52於X方向移動。攝影部移動機構52係例如組合了用以以馬達驅動滾珠螺桿的機構以及用以將滾珠螺桿於X方向導引的機構。亦可使用線性伺服馬達作為攝影部移動機構52的驅動源。攝影部51係具備有照明部53。照明部53係連桿(link)照明裝置。亦可採用用以將照明光經由攝影光學系統照射於基板9的裝置作為照明部53。亦可組合連桿照明裝置與用以經由攝影光學系統照明的裝置作為照明部53。 [0029]     於工作台41的(+Y)側的端部裝設有標尺(scale)44。標尺44係只要被固定於工作台41,則亦可設置在其他的位置。標尺44係於X方向長且存在於X方向的可描繪範圍整體。標尺44係透明的板,具有在板上於X方向排列的複數個十字圖案。亦可採用其他形狀作為標尺44所具有的圖案。 [0030]     於標尺44的下方配置有下攝影部61。下攝影部61係藉由下攝影部移動機構62而可於X方向移動。下攝影部移動機構62係例如組合了用以以馬達驅動滾珠螺桿的機構以及用以將滾珠螺桿於X方向導引的機構。亦可使用線性伺服馬達作為下攝影部移動機構62的驅動源。在從一個描繪頭31向標尺44射出預先決定之圖案的光的狀態中,下攝影部61取得標尺44的圖像,藉由演算處理該圖像而取得描繪頭31與標尺44之間的位置關係。由於標尺44係被固定於工作台41,故亦取得描繪頭31與工作台41之間的位置關係。 [0031]     各描繪頭31係藉由頭移動機構32而可於X方向移動。頭移動機構32係例如組合了用以以馬達驅動滾珠螺桿的機構以及用以將滾珠螺桿於X方向導引的機構。亦可使用線性伺服馬達作為頭移動機構32的驅動源。各描繪頭31與工作台41之間的位置關係的取得係配合於基板9描繪的圖案而在每次描繪頭31重新配置時進行。可藉由一個下攝影部61於X方向移動而取得全部的描繪頭31與工作台41之間的位置關係,或者亦可設置複數個下攝影部61並由一個下攝影部61取得一部分的描繪頭31與工作台41之間的關係。 [0032]     另外,藉由變更工作台41的位置且使攝影部51攝影標尺44,則亦可取得攝影部51與工作台41之間的位置關係。攝影部51與標尺44之間的位置關係的取得雖只要在描繪前進行一次即可,但亦可在後述的標記的攝影時於每次工作台41的移動皆進行。 [0033]     圖4為將電腦21的功能構成與周邊構成一起顯示的方塊圖。電腦21的功能構成係藉由電腦21執行程式而實現。亦即,藉由電腦21的CPU(Central Processing Unit;中央處理器)、ROM(Read Only Memory;唯讀記憶體)、RAM(Random Access Memory;隨機存取記憶體)、固定碟、介面等依循程式動作而實現各功能構成。各功能構成亦可藉由專用的電子電路而實現或者專用的電子電路以及程式的執行而實現。電腦21係可為複數個電腦,亦可藉由專用的電子電路與複數個電腦之間的組合而實現。 [0034]     電腦21係包含有攝影控制部211、圖像合成部212、位置取得部213、補正部214、描繪控制部215以及記憶部216。記憶部216係主要藉由電腦21的固定碟裝置或記憶元件而實現。攝影控制部211係控制工作台移動機構43並且依循來自工作台移動機構43的信號而控制攝影部51所進行的攝影。圖像合成部212係將由攝影部51取得的複數個圖像合成。位置取得部213係根據於合成圖像顯現的標記的像(以下,稱為「標記像」。)而取得標記相對於工作台41的位置。記憶部216係記憶描繪資料8。補正部214係根據標記的位置取得基板9的位置、變形並補正描繪資料8。描繪控制部215係控制工作台移動機構43以及描繪頭31,根據被補正的描繪資料8執行對於基板9的描繪。 [0035]     以下的說明中,正確而言圖像的取得係指圖像的資料的取得,正確而言對於圖像的處理係指對於圖像的資料的處理。 [0036]     圖5為顯示描繪裝置1的動作之流程的圖。如上所述,在描繪裝置1中,在進行了基板9上的標記的位置的檢測後(步驟S11至步驟S15),根據標記的位置配合基板9的位置、變形來補正描繪資料8(步驟S16),依循已補正的描繪資料於基板9上描繪圖案(步驟S17)。正確而言所謂「標記的位置」係指標記相對於以工作台41為基準設定的基準位置的相對的位置。「相對於工作台41的位置」係指相對於設定在工作台41的基準位置的相對位置。 [0037]     圖6為顯示基板9上的標記92之配置的一例的俯視圖。標記92係例如形成於基板9的微小的孔或形成於基板9上的銅箔的圖案。可利用十字、圓形等的各種圖案作為銅箔的圖案。圖9之例的情形中,九個標記92係在X方向以及Y方向排列成三行三列。標記92的X方向的位置係對應攝影部51的X方向的位置。當然,標記92的位置、數量可有各種變更。 [0038]     預先利用標尺44取得攝影部51相對於工作台41的位置。攝影部51相對於工作台41的位置係包含有攝影部51相對於工作台41的旋轉位置,亦即包含有以朝向Z方向的軸作為中心的攝影部51之旋轉量。該旋轉量係將攝影部51裝設於裝置時的誤差程度的微小量。 [0039]     若以基板9的邊緣接觸工作台41的抵接部411的方式將基板9配置於工作台41上,則標記92的X方向的各位置係與任一個攝影部51的X方向的位置大概一致。於該狀態下,基板9係以通過攝影部51之下方的方式開始工作台41的移動(步驟S11)。工作台41的移動方向可為(+Y)方向亦可為(-Y)方向。各標記92通過任一個攝影部51之下方時,藉由攝影控制部211的控制攝影部51係取得複數個圖像(步驟S12)。之後,停止移動工作台41(步驟S13)。 [0040]     圖7係在步驟S12中與一個標記92關連且成為攝影對象的基板9上的區域93a、93b的圖。將區域93a、93b總稱時稱為「區域93」。於圖7之例中,三個區域93b、93a、93b係相對於一個標記92依序於Y方向排列。圖7中顯示有於基板9沒有位置偏移亦沒有伸縮、歪曲等的變形之情形中的設計上的標記92的位置。 [0041]     以下的說明中,將包含有設計上的標記92的位置的區域93a稱為「第一區域」,將僅有一部分重疊於第一區域93a的區域93b稱為「第二區域」。另外,將顯示第一區域93a的圖像稱為「第一圖像」,將顯示第二區域93b的圖像稱為「第二圖像」。設計上的標記92的位置係第一區域93a的中心。兩個第二區域93b係於Y方向中在第一區域93a的前後且僅有一部分與第一區域93a重疊的區域。 [0042]     各區域93係具有彼此垂直的長邊與短邊的矩形。第一區域93a以及第二區域93b係於幾乎平行於短邊的方向排列。短邊係幾乎平行於Y方向。所謂「幾乎平行於Y方向」的表現亦包含有平行於Y方向的情形。區域93的大小係例如長邊為約14mm,短邊為約7mm。鄰接的區域93之中心間的距離為約4mm。圖7中雖將區域93刻意地描繪為對於Y方向傾斜,但實際上區域93的傾斜亦即區域93的旋轉量係如上所述地為將攝影部51裝設於裝置時的誤差程度。 [0043]     攝影控制部211係藉由控制攝影部51以及工作台移動機構43而使由攝影部51所進行的攝影能夠在工作台41的移動中不使工作台41停止地進行。為了實現在工作台41的移動中的攝影,在工作台41通過預先決定之位置時照明部53係瞬間性地射出光,利用該光進行瞬間性的攝影。藉由照明部53發光三次,從第二區域93b、第一區域93a、第二區域93b依序分別取得第二圖像、第一圖像、第二圖像。藉由在工作台41相對於攝影部51的相對移動中取得複數個圖像,而可迅速地取得複數個圖像。 [0044]     圖8為用以說明圖像合成部212之處理的樣子的圖。圖像合成部212係將一個第一圖像83a與兩個第二圖像83b合成而生成合成圖像(步驟S14)。圖8中,將在用以合成圖像的二維空間中的彼此垂直的方向顯示為x方向以及y方向。x方向以及y方向係畫素排列的方向。x方向係對應於第一圖像83a以及第二圖像83b的長邊方向。y方向係對應於第一圖像83a以及第二圖像83b的短邊方向。 [0045]     於xy空間配置第一圖像83a以及第二圖像83b的情形中,與這些圖像對應的圖7的Y方向係成為區域93的傾斜達至傾斜的角度θ的方向。在此,如圖8所示,Y方向係相對於y方向順時鐘旋轉達至(-θ)的方向。另外,將與第一區域93a的中心與第二區域93b的中心之間的距離D(參照圖7)對應的xy空間中的距離設為d。此外,於圖7的xy空間中,y方向係對應於第一區域93a以及第二區域93b的短邊的方向,Y方向係對應於移動方向亦即將第一區域93a的中心與第二區域93b的中心連結的直線。如此,若以區域93為基準而表現角度θ,則角度θ係區域93的短邊與區域中心間的直線所成的角度。 [0046] 圖像合成部212為了保持第一區域93a以及第二區域93b的相對性的位置關係不變地將第一圖像83a以及第二圖像83b配置於xy空間,故使(+y)側的第二圖像83b的中心相對於第一圖像83a的中心位於(+y)側達至d・cosθ且相對於第一圖像83a的中心位於(-x)側達至d・sinθ。同樣地,使(-y)側的第二圖像83b的中心相對於第一圖像83a的中心位於(-y)側達至d・cosθ,相對於第一圖像83a的中心位於(+x)側達至d・sinθ。由於可正確地取得工作台41的位置,故可正確地取得距離D以及距離d。圖像合成部212係在求得第二圖像83b相對於第一圖像83a的相對位置時,不僅利用距離d且亦利用角度θ,故可高精度地進行合成。 [0047]     如圖9所示,設計上係使標記像82顯現於第一圖像83a的中心。如此,藉由第一圖像83a與第二圖像83b如上所述地重疊,而成為即使假設標記像82從第一圖像83a往(±y)方向超出標記像82仍會顯現在第二圖像83b中。 [0048]     例如,即使在由於基板9的製造時的裁斷精度低所導致的裁斷位置的偏移、傾斜或者由於基板9的伸縮、歪曲等的變形而導致如元件符號82a所示地標記像82a的整體或一部分未顯現於第一圖像83a的情形中,只要第二圖像83b中有顯現標記像82a,則位置取得部213仍可檢測合成圖像85中的標記像82的位置。此外,實際上合成圖像85係先修剪圖9中的以虛線表示的範圍後才以位置取得部213進行標記檢測處理。由於預先取得攝影部51相對於工作台41的位置,故位置取得部213係可以根據合成圖像85中的標記像82的位置而檢測實際的標記92相對於工作台41的位置(步驟S15)。 [0049]     如上所述,在描繪裝置1中藉由利用合成圖像85而可不降低攝影部51之解析度地輕易地擴大視野,而可減低標記92的位置的檢測錯誤。另外,由於以區域93的短邊成為幾乎平行於Y方向的方式配置攝影部51,故確保合成圖像85的x方向的寬度且使合成圖像85易於接近成大的正方形。藉此,成為標記92從設計上的位置偏移時能輕易地將標記92收在視野內。 [0050]     在此,如圖9所示,圖像合成部212係在第一圖像83a與第二圖像83b重疊的區域中優先地合成第一圖像83a。亦即,合成圖像85中的第一圖像83a與第二圖像83b重疊的部位的畫素值係成為第一圖像83a的畫素值。作為優先地合成第一圖像83a的處理,可採用將第二圖像83b寫入記憶體空間後才覆寫第一圖像83a,或者亦可對記憶體空間的各畫素逐一選擇寫入圖像。 [0051]     由於標記像82在設計上係顯現於第一圖像83a的中心,故實際上標記像82在第一圖像83a顯現的機率係較在第二圖像83b顯現的機率高。因此,藉由較第二圖像83b優先地利用第一圖像83a,可降低標記像82與合成圖像85中的合成的邊界重疊的機率。結果,可以使標記像82易於在合成圖像85中清晰地顯現,而可抑制標記92的位置的檢測精度的降低。 [0052]     在圖7至圖9的例中,雖在工作台41相對於攝影部51的相對移動中取得三個圖像,但圖像的數量不被限定為三個。較佳為,攝影部51係取得在移動方向排列的奇數個的複數個區域的圖像,複數個區域的各者係僅有一部分與鄰接的區域重疊。此時,標記像82的設計上的位置係設定在與上述第一圖像83a對應的中央的圖像的中心。另外,與圖8的情形中同樣地,於合成圖像中,中央的圖像與鄰接的另一個圖像重疊的部位的畫素值係設為中央的圖像的畫素值。藉此,可以減低標記像82跨及兩個圖像的可能性。即使在對於一個標記92取得複數個圖像的情形中,由於圖像係在基板9的移動中取得,故取得圖像所需的時間與僅取得一個圖像的情形相同。鄰接的區域93重疊的面積係較佳為區域93的面積的1/10以上1/3以下。 [0053]     如圖2所示描繪裝置1係具備有三個攝影部51,如圖6所示在基板9上三行三列地排列有九個標記92的情形中,在藉由工作台移動機構43使工作台41於Y方向移動一次的期間中,各攝影部51係進行三次標記像82的取得。各標記像的取得中,如上所述地進行複數次攝影並進行圖像的合成。藉此,可高速地取得九個標記像82。 [0054]     此時,藉由攝影控制部211所進行的各攝影部51以及工作台移動機構43的控制,各攝影部51中同樣地進行了圖像的取得。例如,當藉由一個攝影部51取得了如圖8所示的一個第一圖像83a以及兩個第二圖像83b時,在另一個攝影部51亦同樣地取得了一個第一圖像83a以及兩個第二圖像83b。然後,於由圖像合成部212所進行的合成後,合成圖像85係被修剪成相同尺寸。藉此,取得與九個標記92對應的相同尺寸的九個合成圖像85。藉由與標記92的種類、大小無關地將複數個合成圖像85設為相同尺寸,而可使標記92的位置的檢測處理的大部分共通化,而使得檢測程式的製作或者硬體化變得容易。 [0055]     描繪裝置1係可有各種變化。 [0056]     第二圖像83b亦可為一個。於該情形中,關於一個標記92所取得的圖像的數量為2。較佳為,關於一個標記92所取得的圖像的數量為3以上。較佳為,所取得的圖像的數量為3以上的奇數,但亦可為偶數。 [0057]     取得圖像時,亦可停止工作台41的移動。亦即,取得第一圖像83a的工序與取得第二圖像83b的工序並不需要連續地進行。在攝影時工作台41停止的情形中,可以採用廉價的攝影部作為攝影部51。第一區域93a與第二區域93b亦可在X方向亦即垂直於工作台41的移動方向的方向排列。於該情形中,可設置使攝影部51或工作台41於X方向高精度地移動的移動機構。進一步地,可對第一區域93a在前後左右的位置設定四個第二區域93b,亦可對第一區域93a在八個附近的位置設定八個第二區域93b。 [0058]     在攝影部51的影像感測器的畫素正確地於XY方向排列的情形中,合成圖像時的上述Y方向與y方向之間所成的角度θ成為0,而不需要考慮角度θ。於圖像的合成時,亦可並非以第一圖像83a為優先而是以單純地依循攝影順序覆寫的方式進行合成。 [0059]     標記92無須是專用的對齊標記。例如,亦可藉由攝影部51將形成於基板9的通孔或特徵性的圖案作為標記92利用。 [0060]     工作台41無須藉由抵接部411決定基板9的位置。例如,工作台41亦可把持基板9的端部。或亦可為僅單純地載置基板9。 [0061]     亦可於與基板9的主表面平行的方向設置用以使攝影部51相對於工作台41直線狀地移動的移動機構取替工作台移動機構43。只要為工作台41相對於攝影部51相對移動即可。 [0062]     標記92的配置係可適宜變更。較佳為,於標記92的X方向的各位置配置攝影部51。當然,標記92的X方向的位置的數量亦可較攝影部51的數量多。於該情形中,工作台41於Y方向的移動以及攝影結束後,攝影部51於X方向移動,且使工作台41再次一邊於Y方向移動一邊進行攝影。 [0063]     從合成圖像85檢測標記像82的位置的處理係可以對每個標記92逐次進行,亦可以並行處理。 [0064]     從描繪頭31射出的光亦可為被單純地ON/OFF(導通/關斷)調變的一個光束(beam)。 [0065]                      亦可為在描繪裝置1中,設置有用以將描繪頭31於移動方向移動的移動機構。亦即,在描繪裝置1中,設置有用以使工作台41相對於描繪頭31相對地移動且於移動方向連續地移動的移動機構。 [0066]     描繪圖案的基板9係除了印刷配線基板以外,亦可為半導體基板、玻璃基板等。雖基板9較佳為具有可撓性的基板,但不限定於印刷配線基板。 [0067]     上述實施形態以及各變化例中的構成係可在不互相矛盾的前提下適宜組合。 [0068]     雖詳細描寫且說明了本發明,但以上所述之說明僅為例示而非限定。如此,在不逸脫本發明之範圍的前提下可有複數個變化、態樣。[0019] FIG. 1 is a block diagram showing the structure of a rendering system 100 according to an embodiment of the present invention. The drawing system 100 is a system for irradiating light to a photosensitive material on a substrate such as a printed wiring board and drawing a pattern of wiring or the like on the photosensitive material. Preferably, the substrate is a flexible printed circuit board. As the substrate, various other substrates may be used, and it may be a rigid substrate or a substrate other than wiring used for circuits. [0020] The rendering system 100 is provided with a computer 101 and a rendering device 1. The drawing device 1 includes a function as a mark position detection device for detecting the position of the mark on the substrate. The computer 101 is used to generate design data that displays the overall pattern that should be drawn on the substrate. The design data is, for example, vector data showing the overall pattern. The drawing device 1 includes a computer 21 and a device body 10. The computer 21 is responsible for the overall control of the device body 10. The computer 21 also generates drawing data used in the design data generating device body 10. The computer 101, the computer 21, and the device body 10 are communicably connected to each other. [0021] FIG. 2 is a perspective view of the display device body 10. In FIG. 2, three directions orthogonal to each other are shown as arrows in the X direction, Y direction, and Z direction (the same is true in other drawings). In the example of FIG. 2, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction. Depending on the design of the drawing device 1, the Z direction may be a direction inclined to the vertical direction or a horizontal direction. [0022] The apparatus body 10 is provided with a plurality of drawing heads 31, a table 41, a table lifting mechanism 42, a table moving mechanism 43, and a photographing unit 5. The table 41 holds the substrate 9 below the drawing head 31 ((-Z) side). The plurality of drawing heads 31 are arranged in the X direction (hereinafter, also referred to as "width direction"). In each drawing head 31, laser light is emitted from the light source toward the light modulation section, and the light is modulated by the light modulation section. The modulated (spatially modulated) light system irradiates the main surface 91 in the (+Z) direction in the substrate 9 on the table 41. In the present embodiment, a DMD (digital mirror device) in which a plurality of micro mirrors are arranged two-dimensionally is used as the optical modulation section of each drawing head 31. The optical modulation section may also be a modulator in which a plurality of optical modulation elements are arranged one-dimensionally. [0023] The table lifting mechanism 42 moves the table 41 in the Z direction. The table moving mechanism 43 moves the table 41 together with the table elevating mechanism 42 in the Y direction (hereinafter, also referred to as "moving direction"). The table moving mechanism 43 is, for example, a mechanism for linearly moving the table 41 along the guide rail, and uses, for example, a linear servo motor (linear servo motor) as a driving source. With this, the table 41 is moved with high accuracy. It is also possible to use a ball screw mounting motor as the driving source of the table moving mechanism 43. In the drawing device 1, the table lifting mechanism 42 may be omitted, or a rotating mechanism may be provided that rotates the table 41 with an axis parallel to the Z direction as the center. [0024] The photographing unit 5 is arranged on the (-Y) side of the plurality of drawing heads 31. The photography unit 5 includes a plurality of photography units 51. The plural imaging units 51 are arranged at intervals in the width direction. Each photographing unit 51 is the substrate 9 on the photographing stage 41 and acquires image data. The imaging unit 51 acquires an image of a so-called alignment mark, which is a mark formed on the substrate 9. The photographing unit 51 is a so-called digital still camera including a two-dimensional image sensor and a photographing optical system. [0025] On the table 41, a contact portion 411 that contacts the edge of the substrate 9 is provided. When the substrate 9 is placed on the table 41, the position and direction of the substrate 9 on the table 41 can be determined by the edge of the substrate 9 contacting the contact portion 411. In this embodiment, the contact portion 411 is three pins. The contact portion 411 is not limited to a pin, and may be, for example, a portion extending in the X direction and Y direction and protruding upward. The substrate 9 is fixed on the table 41 by suction. The substrate 9 may be fixed to the table 41 by other methods. [0026] In the drawing of the pattern by the drawing head 31, the table moving mechanism 43 continuously moves the table 41 in the moving direction, and the position on the substrate 9 irradiated with the light from each drawing head 31 is opposed The substrate 9 is scanned in the moving direction. In addition, in synchronization with the movement of the table 41, the DMD of the drawing head 31 is controlled. With this, the pattern of each drawing head 31 is drawn on the belt area extending in the moving direction on the main surface 91. [0027] In this embodiment, the pattern is drawn in the entire drawing area of the substrate 9 by one continuous movement of the table 41 in the moving direction (so-called one pass drawing). In the drawing device 1, the entire pattern in the drawing area can also be drawn by repeating the continuous movement of the table 41 in the moving direction and the intermittent movement in the width direction perpendicular to the moving direction (so-called multiple passes) Multipass drawing). [0028] FIG. 3 is a side view of a part of the display device body 10. FIG. 3 is a view of the device body 10 viewed in the (-X) direction. Each imaging unit 51 can be moved in the X direction by the imaging unit moving mechanism 52. The photographing unit moving mechanism 52 is, for example, a mechanism for driving a ball screw with a motor and a mechanism for guiding the ball screw in the X direction. A linear servo motor can also be used as the driving source of the moving mechanism 52 of the photographing unit. The photography unit 51 includes an illumination unit 53. The lighting unit 53 is a link lighting device. As the illumination unit 53, a device for irradiating illumination light onto the substrate 9 via the imaging optical system may be used. A lighting device 53 may be combined with a link lighting device and a device for lighting through a photographic optical system. [0029] A scale 44 is provided at the end of the (+Y) side of the work table 41. As long as the scale 44 is fixed to the table 41, it may be installed at another position. The scale 44 is long in the X direction and exists in the entire drawable range in the X direction. The scale 44 is a transparent plate having a plurality of cross patterns arranged in the X direction on the plate. Other shapes can also be used as the pattern of the scale 44. [0030] Below the scale 44, a lower photographing section 61 is arranged. The lower imaging unit 61 can be moved in the X direction by the lower imaging unit moving mechanism 62. The lower camera moving mechanism 62 is, for example, a mechanism for driving a ball screw with a motor and a mechanism for guiding the ball screw in the X direction. A linear servo motor can also be used as the driving source of the moving mechanism 62 of the lower imaging unit. In a state where a predetermined pattern of light is emitted from one drawing head 31 to the scale 44, the lower photographing unit 61 acquires an image of the scale 44 and obtains the position between the drawing head 31 and the scale 44 by calculating the image by calculation relationship. Since the scale 44 is fixed to the table 41, the positional relationship between the drawing head 31 and the table 41 is also obtained. [0031] Each drawing head 31 is movable in the X direction by a head moving mechanism 32. The head moving mechanism 32 combines, for example, a mechanism for driving the ball screw with a motor and a mechanism for guiding the ball screw in the X direction. A linear servo motor can also be used as the driving source of the head moving mechanism 32. The acquisition of the positional relationship between each drawing head 31 and the table 41 is performed every time the drawing head 31 is rearranged in accordance with the pattern drawn by the substrate 9. The positional relationship between all the drawing heads 31 and the table 41 may be obtained by moving one lower imaging unit 61 in the X direction, or a plurality of lower imaging units 61 may be provided and a portion of the rendering may be acquired by one lower imaging unit 61 The relationship between the head 31 and the table 41. [0032] In addition, by changing the position of the table 41 and allowing the photographing unit 51 to photograph the scale 44, the positional relationship between the photographing unit 51 and the table 41 can also be obtained. The positional relationship between the photographing unit 51 and the scale 44 may be acquired only once before drawing, but it may be performed every time the table 41 moves during photographing of a marker described later. [0033] FIG. 4 is a block diagram showing the functional configuration of the computer 21 together with the peripheral configuration. The functional configuration of the computer 21 is realized by the computer 21 executing a program. That is, through the computer 21's CPU (Central Processing Unit; central processing unit), ROM (Read Only Memory; read only memory), RAM (Random Access Memory; random access memory), fixed disk, interface, etc. The program operates to realize each functional structure. Each functional configuration can also be realized by a dedicated electronic circuit or a dedicated electronic circuit and program execution. The computer 21 can be a plurality of computers, or can be realized by a combination of a dedicated electronic circuit and a plurality of computers. [0034] The computer 21 includes an imaging control unit 211, an image synthesis unit 212, a position acquisition unit 213, a correction unit 214, a rendering control unit 215, and a memory unit 216. The memory portion 216 is mainly realized by a fixed disk device or a memory element of the computer 21. The photographing control section 211 controls the stage moving mechanism 43 and controls the photographing by the photographing section 51 in accordance with the signal from the stage moving mechanism 43. The image synthesis unit 212 synthesizes a plurality of images acquired by the imaging unit 51. The position obtaining unit 213 obtains the position of the mark relative to the table 41 based on the mark image (hereinafter, referred to as “mark image”) appearing in the composite image. The memory section 216 is a memory drawing data 8. The correction unit 214 obtains the position and deformation of the substrate 9 based on the position of the mark, and corrects the drawing data 8. The drawing control unit 215 controls the table moving mechanism 43 and the drawing head 31 to perform drawing on the substrate 9 based on the corrected drawing data 8. [0035] In the following description, the acquisition of an image refers to the acquisition of image data, and the processing of an image refers to the processing of image data. [0036] FIG. 5 is a diagram showing a flow of drawing operations of the device 1. As described above, in the drawing device 1, after detecting the position of the mark on the substrate 9 (steps S11 to S15), the drawing data 8 is corrected according to the position of the mark and the position and deformation of the substrate 9 (step S16 ), draw a pattern on the substrate 9 according to the corrected drawing data (step S17). To be precise, the “mark position” refers to the relative position of the mark with respect to the reference position set based on the table 41. The "position relative to the table 41" refers to a relative position with respect to the reference position set at the table 41. 6 is a plan view showing an example of the arrangement of marks 92 on the substrate 9. The mark 92 is, for example, a pattern of a tiny hole formed in the substrate 9 or a copper foil formed on the substrate 9. Various patterns such as crosses and circles can be used as patterns for copper foil. In the case of the example of FIG. 9, nine marks 92 are arranged in three rows and three columns in the X direction and the Y direction. The position of the mark 92 in the X direction corresponds to the position of the imaging unit 51 in the X direction. Of course, the position and number of marks 92 can be variously changed. [0038] The position of the photographing unit 51 relative to the table 41 is obtained in advance using a scale 44. The position of the imaging unit 51 with respect to the table 41 includes the rotational position of the imaging unit 51 with respect to the table 41, that is, the rotation amount of the imaging unit 51 centered on the axis toward the Z direction. The amount of rotation is a minute amount of error when the imaging unit 51 is installed in the device. [0039] If the substrate 9 is arranged on the table 41 such that the edge of the substrate 9 contacts the contact portion 411 of the table 41, the positions of the marks 92 in the X direction are the same as those of any imaging unit 51 in the X direction The location is probably the same. In this state, the substrate 9 starts the movement of the table 41 so as to pass under the imaging unit 51 (step S11). The moving direction of the table 41 may be the (+Y) direction or the (-Y) direction. When each mark 92 passes under any of the imaging units 51, the imaging unit 51 is controlled by the imaging control unit 211 to acquire a plurality of images (step S12). After that, the moving table 41 is stopped (step S13). [0040] FIG. 7 is a diagram of the regions 93a and 93b on the substrate 9 that is associated with one mark 92 and becomes a photographing target in step S12. The areas 93a and 93b are collectively referred to as "area 93". In the example of FIG. 7, the three regions 93b, 93a, and 93b are arranged in the Y direction with respect to one mark 92 in sequence. FIG. 7 shows the position of the design mark 92 in the case where the substrate 9 has no positional deviation and no deformation such as expansion and contraction or distortion. [0041] In the following description, the area 93a including the position of the design mark 92 is referred to as a "first area", and the area 93b where only a portion overlaps the first area 93a is referred to as a "second area". In addition, the image displaying the first area 93a is referred to as a "first image", and the image displaying the second area 93b is referred to as a "second image". The position of the design mark 92 is the center of the first area 93a. The two second regions 93b are in the Y direction before and after the first region 93a and only a part of the region overlaps the first region 93a. [0042] Each area 93 is a rectangle having long and short sides perpendicular to each other. The first region 93a and the second region 93b are arranged in a direction almost parallel to the short side. The short side system is almost parallel to the Y direction. The expression "almost parallel to the Y direction" also includes the case parallel to the Y direction. The size of the region 93 is, for example, about 14 mm on the long side and about 7 mm on the short side. The distance between the centers of adjacent regions 93 is about 4 mm. Although the area 93 is deliberately depicted as being inclined in the Y direction in FIG. 7, the inclination of the area 93, that is, the rotation amount of the area 93 is actually the degree of error when the imaging unit 51 is installed in the device as described above. [0043] The photographing control unit 211 controls the photographing unit 51 and the table moving mechanism 43 so that the photographing by the photographing unit 51 can be performed without stopping the table 41 during the movement of the table 41. In order to realize photography while the table 41 is moving, the illumination unit 53 emits light momentarily when the table 41 passes a predetermined position, and the light is used for instant photography. When the lighting unit 53 emits light three times, the second image, the first image, and the second image are sequentially acquired from the second area 93b, the first area 93a, and the second area 93b, respectively. By acquiring a plurality of images during the relative movement of the table 41 relative to the photographing unit 51, the plurality of images can be quickly acquired. [0044] FIG. 8 is a diagram for explaining the processing performed by the image synthesizing unit 212. The image synthesis unit 212 synthesizes one first image 83a and two second images 83b to generate a synthesized image (step S14). In FIG. 8, directions perpendicular to each other in the two-dimensional space for synthesizing images are displayed as the x direction and the y direction. The x direction and the y direction are the directions in which pixels are arranged. The x direction corresponds to the longitudinal direction of the first image 83a and the second image 83b. The y direction corresponds to the short side direction of the first image 83a and the second image 83b. [0045] In the case where the first image 83a and the second image 83b are arranged in the xy space, the Y direction in FIG. 7 corresponding to these images becomes the direction in which the area 93 is inclined up to the inclined angle θ. Here, as shown in FIG. 8, the Y direction rotates clockwise with respect to the y direction to a direction of (−θ). In addition, let the distance in the xy space corresponding to the distance D (refer to FIG. 7) between the center of the first region 93a and the center of the second region 93b be d. In addition, in the xy space of FIG. 7, the y direction corresponds to the direction of the short sides of the first region 93 a and the second region 93 b, and the Y direction corresponds to the moving direction, that is, the center of the first region 93 a and the second region 93 b A straight line connecting the center of. In this way, if the angle θ is expressed with the area 93 as a reference, the angle θ is the angle formed by the straight line between the short side of the area 93 and the center of the area. [0046] The image synthesis unit 212 arranges the first image 83a and the second image 83b in the xy space in order to maintain the relative positional relationship between the first region 93a and the second region 93b, so that (+y ) Side of the center of the second image 83b relative to the center of the first image 83a is located on the (+y) side up to d·cosθ and relative to the center of the first image 83a on the (-x) side up to d sinθ. Similarly, the center of the (-y) side second image 83b is located on the (-y) side relative to the center of the first image 83a up to d·cosθ, and the center of the first image 83a is located on the (+ x) The side reaches d·sinθ. Since the position of the table 41 can be accurately acquired, the distance D and the distance d can be accurately acquired. When the relative position of the second image 83b with respect to the first image 83a is obtained, the image synthesizing unit 212 uses not only the distance d but also the angle θ, so that it can be synthesized with high accuracy. As shown in FIG. 9, the mark image 82 is designed to appear in the center of the first image 83a. In this way, by overlapping the first image 83a and the second image 83b as described above, even if it is assumed that the mark image 82 exceeds the mark image 82 from the first image 83a in the (±y) direction, it will still appear in the second Image 83b. [0048] For example, even if the cutting position is shifted or tilted due to low cutting accuracy at the time of manufacturing the substrate 9, or due to deformation of the substrate 9, such as expansion and contraction of the substrate 9, the image 82a is marked as shown by the element symbol 82a In the case where the whole or a part of the image is not displayed on the first image 83a, as long as the mark image 82a appears in the second image 83b, the position acquisition unit 213 can still detect the position of the mark image 82 in the composite image 85. In addition, actually, the synthesized image 85 is trimmed by the range indicated by the broken line in FIG. 9 before the mark detection processing is performed by the position acquisition unit 213. Since the position of the photographing unit 51 relative to the table 41 is obtained in advance, the position obtaining unit 213 can detect the position of the actual mark 92 relative to the table 41 based on the position of the mark image 82 in the composite image 85 (step S15) . [0049] As described above, by using the synthesized image 85 in the rendering device 1, the field of view can be easily expanded without reducing the resolution of the photographing unit 51, and the detection error of the position of the mark 92 can be reduced. In addition, since the imaging unit 51 is arranged so that the short side of the area 93 becomes almost parallel to the Y direction, the width of the composite image 85 in the x direction is ensured, and the composite image 85 can be easily approached into a large square. As a result, when the mark 92 deviates from the design position, the mark 92 can be easily received in the visual field. [0050] Here, as shown in FIG. 9, the image synthesizing unit 212 preferentially synthesizes the first image 83a in a region where the first image 83a and the second image 83b overlap. That is, the pixel value of the portion of the composite image 85 where the first image 83a and the second image 83b overlap becomes the pixel value of the first image 83a. As a process of preferentially synthesizing the first image 83a, the first image 83a may be overwritten after the second image 83b is written into the memory space, or each pixel in the memory space may be selectively written one by one image. [0051] Since the mark image 82 is designed to appear in the center of the first image 83a, the probability that the mark image 82 appears in the first image 83a is actually higher than that in the second image 83b. Therefore, by preferentially using the first image 83a over the second image 83b, the probability that the marker image 82 and the synthesized boundary in the synthesized image 85 overlap may be reduced. As a result, the mark image 82 can be made to appear clearly in the composite image 85, and the decrease in the detection accuracy of the position of the mark 92 can be suppressed. [0052] In the examples of FIGS. 7 to 9, although three images are acquired during the relative movement of the table 41 relative to the photographing unit 51, the number of images is not limited to three. Preferably, the imaging unit 51 acquires images of an odd number of plural regions arranged in the moving direction, and each of the plural regions only partially overlaps the adjacent regions. At this time, the design position of the mark image 82 is set at the center of the central image corresponding to the first image 83a. In addition, as in the case of FIG. 8, in the composite image, the pixel value of the portion where the center image overlaps with another adjacent image is the pixel value of the center image. Thereby, the possibility that the mark image 82 crosses two images can be reduced. Even in the case where a plurality of images are acquired for one mark 92, since the images are acquired during the movement of the substrate 9, the time required to acquire the images is the same as the case where only one image is acquired. The area where the adjacent regions 93 overlap is preferably 1/10 or more and 1/3 or less of the area of the region 93. [0053] The drawing device 1 as shown in FIG. 2 is provided with three photographing sections 51, and as shown in FIG. 6, when nine marks 92 are arranged on the substrate 9 in three rows and three columns, the mechanism is moved by the table. 43 While the table 41 is moved once in the Y direction, each imaging unit 51 acquires the mark image 82 three times. In the acquisition of each mark image, a plurality of photographs are performed as described above, and images are synthesized. Thereby, nine mark images 82 can be acquired at high speed. [0054] At this time, under the control of each imaging unit 51 and the table moving mechanism 43 by the imaging control unit 211, each imaging unit 51 similarly acquires an image. For example, when one first image 83a and two second images 83b shown in FIG. 8 are acquired by one imaging unit 51, one first image 83a is also acquired at the other imaging unit 51 And two second images 83b. Then, after the synthesis by the image synthesis unit 212, the synthesized image 85 is trimmed to the same size. Thereby, nine composite images 85 of the same size corresponding to the nine marks 92 are obtained. By setting the plurality of composite images 85 to the same size regardless of the type and size of the mark 92, most of the detection processing of the position of the mark 92 can be made common, and the production or hardware of the detection program can be changed It's easy. [0055] The drawing device 1 may have various changes. [0056] The second image 83b may also be one. In this case, the number of images acquired for one mark 92 is two. Preferably, the number of images acquired for one mark 92 is 3 or more. Preferably, the number of acquired images is an odd number of 3 or more, but it may be an even number. [0057] When acquiring an image, the movement of the table 41 may also be stopped. That is, the process of acquiring the first image 83a and the process of acquiring the second image 83b do not need to be performed continuously. In the case where the table 41 is stopped during shooting, an inexpensive shooting section may be used as the shooting section 51. The first area 93a and the second area 93b may be arranged in the X direction, that is, a direction perpendicular to the moving direction of the table 41. In this case, a moving mechanism that moves the imaging unit 51 or the table 41 in the X direction with high accuracy may be provided. Furthermore, four second regions 93b may be set at the positions of front, back, left, and right of the first region 93a, or eight second regions 93b may be set at positions of the first region 93a near eight. [0058] In the case where the pixels of the image sensor of the photographing section 51 are correctly arranged in the XY direction, the angle θ formed between the Y direction and the y direction when synthesizing the image becomes 0, and there is no need to consider Angle θ. When compositing images, the first image 83a may not be prioritized, but may be synthesized by simply overwriting in the order of photography. [0059] The mark 92 need not be a dedicated alignment mark. For example, the imaging unit 51 can also use the through hole or the characteristic pattern formed in the substrate 9 as the mark 92. [0060] The table 41 does not need to determine the position of the substrate 9 by the contact portion 411. For example, the table 41 may hold the end of the substrate 9. Alternatively, the substrate 9 may be simply placed. [0061] A moving mechanism for moving the imaging unit 51 linearly relative to the table 41 may be provided in a direction parallel to the main surface of the substrate 9 to replace the table moving mechanism 43. It suffices that the table 41 moves relative to the imaging unit 51. [0062] The configuration of the mark 92 may be changed as appropriate. Preferably, the imaging unit 51 is arranged at each position of the mark 92 in the X direction. Of course, the number of positions of the mark 92 in the X direction may be larger than the number of the imaging unit 51. In this case, after the movement of the table 41 in the Y direction and the shooting are completed, the photographing unit 51 moves in the X direction, and the table 41 is moved again in the Y direction while shooting. [0063] The processing system for detecting the position of the mark image 82 from the composite image 85 may be performed for each mark 92 one by one, or may be processed in parallel. [0064] The light emitted from the drawing head 31 may also be a beam modulated by ON/OFF (on/off). [0065] The drawing device 1 may also be provided with a moving mechanism for moving the drawing head 31 in the moving direction. That is, the drawing device 1 is provided with a moving mechanism that moves the table 41 relative to the drawing head 31 and continuously moves in the moving direction. [0066] In addition to the printed wiring substrate, the patterned substrate 9 may be a semiconductor substrate, a glass substrate, or the like. Although the substrate 9 is preferably a flexible substrate, it is not limited to a printed circuit board. [0067] The configuration in the above-mentioned embodiments and the modified examples can be combined as appropriate without contradicting each other. [0068] Although the present invention is described and described in detail, the above description is only an example and not a limitation. As such, there can be multiple variations and appearances without departing from the scope of the present invention.

[0069] 1:描繪裝置(標記位置檢測裝置) 5:攝影單元 8:描繪資料 9:基板 10:裝置本體 21:電腦 31:描繪頭 32:頭移動機構 41:工作台 42:工作台升降機構 43:工作台移動機構 44:標尺 51:攝影部 52:攝影部移動機構 53:照明部 61:下攝影部 62:下攝影部移動機構 82、82a:標記像 83a:第一圖像 83b:第二圖像 85:合成圖像 91:主表面 92:標記 93a:第一區域 93b:第二區域 100:描繪系統 101:電腦 211:攝影控制部 212:圖像合成部 213:位置取得部 214:補正部 215:描繪控制部 216:記憶部 411工作台 D、d:距離 θ:角度[0069] 1: Drawing device (mark position detection device) 5: Photography unit 8: Describe the data 9: substrate 10: Device body 21: Computer 31: Paint head 32: head moving mechanism 41: Workbench 42: table lifting mechanism 43: Worktable moving mechanism 44: Ruler 51: Photography Department 52: Mobile Department of Photography Department 53: Lighting Department 61: Lower Photography Department 62: Moving mechanism of lower photography department 82, 82a: mark like 83a: first image 83b: second image 85: Composite image 91: Main surface 92: Mark 93a: first area 93b: Second area 100: drawing system 101: Computer 211: Photography Control Department 212: Image synthesis department 213: Position acquisition department 214: Correction Department 215: Drawing Control Department 216: Memory Department Workbench 411 D, d: distance θ: angle

[0018]     圖1為顯示描繪系統之構成的方塊圖。 圖2為顯示裝置本體的立體圖。 圖3為顯示裝置本體之一部分的側視圖。 圖4為將電腦(computer)的功能構成與周邊構成一起顯示的方塊圖。 圖5為顯示描繪裝置的動作之流程的圖。 圖6為顯示基板上的標記之配置的一例的俯視圖。 圖7為例示了成為攝影對象的基板上之區域的圖。 圖8為用以說明圖像合成部之處理的圖。 圖9為用以說明圖像合成部之處理的圖。[0018] FIG. 1 is a block diagram showing the composition of the drawing system. 2 is a perspective view of the display device body. 3 is a side view showing a part of the device body. FIG. 4 is a block diagram showing the functional configuration of a computer and the peripheral configuration. FIG. 5 is a diagram showing the flow of the operation of the drawing device. 6 is a plan view showing an example of the arrangement of marks on a substrate. 7 is a diagram illustrating an area on a substrate to be photographed. FIG. 8 is a diagram for explaining the processing of the image synthesis unit. FIG. 9 is a diagram for explaining the processing of the image synthesis unit.

82、82a:標記像 82, 82a: mark like

83a:第一圖像 83a: first image

83b:第二圖像 83b: second image

85:合成圖像 85: Composite image

Claims (10)

一種標記位置檢測裝置,係用以檢測被工作台保持的基板上的標記之位置,且具備有: 前述工作台,係保持前述基板; 攝影部,係取得形成於前述基板上的標記的圖像; 移動機構,係在平行於前述基板的主表面的方向使前述工作台相對於前述攝影部相對地移動; 攝影控制部,係藉由控制前述攝影部以及前述移動機構而取得第一圖像以及第二圖像,前述第一圖像係顯示前述基板上的第一區域,前述第一區域係包含有前述標記的設計上的位置,前述第二圖像係顯示僅有一部分與前述第一區域重疊的第二區域; 圖像合成部,係將前述第一圖像與前述第二圖像合成而生成合成圖像;以及 位置取得部,係根據前述合成圖像求得前述標記相對於前述工作台的位置。A mark position detection device is used to detect the position of a mark on a substrate held by a worktable, and is provided with: The aforementioned workbench holds the aforementioned substrate; The photography department acquires images of the marks formed on the substrate; The moving mechanism moves the table relative to the imaging unit in a direction parallel to the main surface of the substrate; The photography control unit acquires a first image and a second image by controlling the photography unit and the movement mechanism, the first image displays a first area on the substrate, and the first area includes the In terms of the design position of the mark, the aforementioned second image shows a second area where only a portion overlaps with the aforementioned first area; An image synthesis unit that synthesizes the first image and the second image to generate a synthesized image; and The position acquisition unit obtains the position of the mark relative to the table based on the synthesized image. 如請求項1所記載之標記位置檢測裝置,其中前述第一區域與前述第二區域係分別具有彼此垂直的長邊與短邊; 前述第一區域與前述第二區域係排列於與前述短邊幾乎平行的方向。The mark position detection device according to claim 1, wherein the first area and the second area have long sides and short sides perpendicular to each other, respectively; The first area and the second area are arranged in a direction almost parallel to the short side. 如請求項2所記載之標記位置檢測裝置,其中前述圖像合成部係在求得前述第二圖像相對於前述第一圖像的相對位置時,利用將前述第一區域以及前述第二區域的前述短邊和前述第一區域的中心與前述第二區域的中心連結的直線所成的角度。The marker position detection device according to claim 2, wherein the image synthesis unit uses the first area and the second area when determining the relative position of the second image relative to the first image The angle formed by the straight line connecting the short side of the first area and the center of the first area and the center of the second area. 如請求項1所記載之標記位置檢測裝置,其中前述移動機構係使前述工作台相對於前述攝影部於移動方向相對地且直線狀地移動; 前述攝影部係在前述工作台相對於前述攝影部的相對移動中取得前述第一圖像以及前述第二圖像。The mark position detection device according to claim 1, wherein the moving mechanism moves the table relatively linearly in the moving direction with respect to the imaging unit; The imaging unit acquires the first image and the second image during the relative movement of the table relative to the imaging unit. 如請求項1所記載之標記位置檢測裝置,其中前述移動機構係使前述工作台相對於前述攝影部於移動方向相對地且直線狀地移動; 前述攝影部係取得於前述移動方向排列的奇數個的複數個區域的圖像,前述複數個區域的各者係僅有一部分與鄰接的區域重疊; 前述第一區域係前述複數個區域中的中央的區域; 前述第二區域係與前述第一區域鄰接的一個區域。The mark position detection device according to claim 1, wherein the moving mechanism moves the table relatively linearly in the moving direction with respect to the imaging unit; The photographing unit acquires images of an odd number of plural regions arranged in the moving direction, and each of the plural regions only overlaps with adjacent regions; The first area is the central area of the plurality of areas; The second area is an area adjacent to the first area. 如請求項1所記載之標記位置檢測裝置,其中前述合成圖像中的前述第一圖像與另一個圖像重疊的部位的畫素值係前述第一圖像的畫素值。The marker position detection device according to claim 1, wherein the pixel value of a portion where the first image overlaps another image in the composite image is the pixel value of the first image. 如請求項1所記載之標記位置檢測裝置,其中進一步具備有:另一個攝影部,係取得形成於前述基板上的另一個標記的圖像; 前述攝影控制部係藉由控制前述另一個攝影部以及前述移動機構而取得另一個第一圖像以及另一個第二圖像,前述另一個第一圖像係顯示前述基板上的另一個第一區域,前述另一個第一區域係包含有前述另一個標記的設計上的位置,前述另一個第二圖像係顯示僅有一部分與前述另一個第一區域重疊的另一個第二區域; 前述圖像合成部係將前述另一個第一圖像與前述另一個第二圖像合成而生成另一個合成圖像; 前述合成圖像的尺寸與前述另一個合成圖像的尺寸係相同。The mark position detection device according to claim 1, further comprising: another photographing section that acquires an image of another mark formed on the substrate; The photography control unit obtains another first image and another second image by controlling the other photography unit and the moving mechanism, and the other first image displays another first image on the substrate Area, the other first area includes the design position of the another mark, and the other second image shows another second area that only partially overlaps the other first area; The image synthesis unit synthesizes the other first image and the other second image to generate another synthesized image; The size of the aforementioned composite image is the same as the size of the aforementioned another composite image. 如請求項1所記載之標記位置檢測裝置,其中前述基板係具有可撓性。The mark position detection device according to claim 1, wherein the substrate has flexibility. 一種描繪裝置,係用以對基板描繪圖案,且具備有: 如請求項1至8中任一項所記載之標記位置檢測裝置,係檢測形成於基板上的複數個標記的位置; 補正部,係根據前述複數個標記的位置補正描繪資料; 描繪頭,係在前述工作台上的前述基板照射調變後的光;以及 描繪控制部,係控制前述移動機構以及前述描繪頭,藉此根據補正後的描繪資料於前述基板上進行描繪。A drawing device is used to draw a pattern on a substrate, and is provided with: The mark position detection device described in any one of claims 1 to 8 detects the positions of a plurality of marks formed on the substrate; The correction section corrects the drawing data according to the positions of the aforementioned plural marks; A drawing head, which irradiates the modulated light on the substrate on the working table; and The drawing control unit controls the moving mechanism and the drawing head to draw on the substrate based on the corrected drawing data. 一種標記位置檢測方法,係用以檢測被工作台保持的基板上的標記之位置,且具有: 工序(a),係取得第一圖像,前述第一圖像係顯示包含有被前述工作台保持的前述基板上的標記的設計上的位置的第一區域; 工序(b),係取得第二圖像,前述第二圖像係顯示僅有一部分與前述第一區域重疊的第二區域; 工序(c),係將前述第一圖像與前述第二圖像合成而生成合成圖像;以及 工序(d),係根據前述合成圖像求得前述標記相對於前述工作台的位置。A mark position detection method is used to detect the position of a mark on a substrate held by a worktable, and has: In step (a), a first image is obtained, and the first image shows a first area including the design position of the mark on the substrate held by the table; In step (b), a second image is obtained, and the second image displays a second area where only a portion overlaps with the first area; Step (c) is to synthesize the first image and the second image to generate a composite image; and Step (d) is to obtain the position of the mark relative to the table based on the synthesized image.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778659B (en) * 2020-09-23 2022-09-21 日商斯庫林集團股份有限公司 Drawing system

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7478029B2 (en) * 2020-06-01 2024-05-02 住友重機械工業株式会社 Image data generating device and image data generating method
JP7461240B2 (en) 2020-07-22 2024-04-03 株式会社Screenホールディングス Position detection device, drawing system, and position detection method
KR102635249B1 (en) * 2020-08-31 2024-02-08 세메스 주식회사 Image acquiring method, image acquiring apparatus and wafer inspection apparatus

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0724360B2 (en) * 1990-02-20 1995-03-15 松下電工株式会社 Position correction method for parts
JP4484288B2 (en) * 1999-12-03 2010-06-16 富士機械製造株式会社 Image processing method and image processing system
US7015418B2 (en) * 2002-05-17 2006-03-21 Gsi Group Corporation Method and system for calibrating a laser processing system and laser marking system utilizing same
JP2004006527A (en) * 2002-05-31 2004-01-08 Canon Inc Position detection device and position detection method, exposure device, and device manufacturing method and substrate
WO2005008753A1 (en) * 2003-05-23 2005-01-27 Nikon Corporation Template creation method and device, pattern detection method, position detection method and device, exposure method and device, device manufacturing method, and template creation program
JP2006073841A (en) * 2004-09-03 2006-03-16 I-Pulse Co Ltd Inspection device of mounted substrate
JP2006102991A (en) * 2004-09-30 2006-04-20 Fuji Photo Film Co Ltd Image recording device and image recording method
CN1766738A (en) * 2004-09-30 2006-05-03 富士胶片株式会社 Method and apparatus for recording images on deformed image-recordable object
JP4744954B2 (en) * 2005-06-29 2011-08-10 富士フイルム株式会社 Substrate manufacturing method and exposure apparatus
JP2008058797A (en) * 2006-09-01 2008-03-13 Fujifilm Corp Drawing device and drawing method
JP2008170371A (en) * 2007-01-15 2008-07-24 Hoya Corp Pattern flaw inspection method, and pattern flaw inspecting device
US8396269B2 (en) * 2010-04-08 2013-03-12 Digital Pathco LLC Image quality assessment including comparison of overlapped margins
KR101435352B1 (en) * 2010-09-01 2014-08-28 미쓰비시덴키 가부시키가이샤 Laser processing apparatus and substrate position detecting method
CN102467738A (en) * 2010-11-08 2012-05-23 北京大学 Image splicing method and system
JP5561214B2 (en) * 2011-03-15 2014-07-30 オムロン株式会社 Image processing apparatus and image processing program
KR101324015B1 (en) * 2011-08-18 2013-10-31 바슬러 비전 테크놀로지스 에이지 Apparatus and method for detecting the surface defect of the glass substrate
JP2013120108A (en) 2011-12-07 2013-06-17 Sumitomo Heavy Ind Ltd Thin film formation device and thin film formation method
JP5896788B2 (en) * 2012-03-07 2016-03-30 キヤノン株式会社 Image composition apparatus and image composition method
JP6114151B2 (en) * 2013-09-20 2017-04-12 株式会社Screenホールディングス Drawing apparatus, substrate processing system, and drawing method
JP6223091B2 (en) 2013-09-25 2017-11-01 株式会社Screenホールディングス Position measuring apparatus, alignment apparatus, pattern drawing apparatus, and position measuring method
KR102193996B1 (en) * 2014-01-28 2020-12-22 엘지전자 주식회사 Exposure apparatus and Exposure method using the same
US10334209B2 (en) * 2015-12-17 2019-06-25 Nike, Inc. Image stitching for footwear component processing
JP6719246B2 (en) * 2016-03-25 2020-07-08 キヤノン株式会社 Measuring method, measuring apparatus, lithographic apparatus, and article manufacturing method
JP6759053B2 (en) * 2016-10-26 2020-09-23 株式会社ニューフレアテクノロジー Polarized image acquisition device, pattern inspection device, polarized image acquisition method, and pattern inspection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778659B (en) * 2020-09-23 2022-09-21 日商斯庫林集團股份有限公司 Drawing system

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