TW202015125A - Wet processing equipment and processing method wherein the wet processing equipment includes a conveying device, an etching zone, a first cleaning zone, a deoxidizing zone, and a second cleaning zone - Google Patents

Abstract

A wet processing equipment is suitable for processing plural wafers carried by a carrier. The wet processing equipment includes a conveying device, an etching zone, a first cleaning zone, a deoxidizing zone, and a second cleaning zone. The conveying device can transport the carrier to move. The etching zone has a first chemical solution for soaking the carrier transported by the conveying device to etch plural pins of the wafer. The first cleaning zone is located on the downstream side of the etching zone to clean the wafers on the carrier output through the etching zone. The deoxidizing zone is located on the downstream side of the first cleaning zone and has a second chemical solution for soaking the carrier transported by the conveying device to generate a deoxidation reaction on the pins of each wafer. The second cleaning zone is located on the downstream side of the deoxidizing zone to clean the wafers on the carrier output through the deoxidizing zone.

Description

Wet processing equipment and processing method

The invention relates to a wet processing equipment, in particular to a wet processing equipment and a processing method for performing wet chemical processing on a packaged wafer.

Existing blanks packaged in a quad flat no-lead package (QFN) method need to be sawed by a cutting machine to distinguish multiple wafers. The saw blade of the cutting machine is in the process of sawing the insulating package of the material. Due to the high temperature generated during sawing, the metal pins on the sides of the wafers are partially melted, which makes the saw blade very moving. It is easy to pull the molten metal to move to form a wire-like metal wire.

Among them, when the metal wire is directly connected between two adjacent pins, it will cause a short circuit of the chip. When the metal wire is pulled out from one of the pins but is spaced apart from another adjacent pin, or when the molten metal is not drawn into the metal wire, it will not cause a short circuit of the chip. Although the above two situations will not immediately cause a short circuit of the chip, under the influence of the thermal expansion and contraction of the chip for a long time, the wire or the pin will have a migration phenomenon, which is easy to cause the wire and the other phase to migrate. Adjacent pins are in contact or two adjacent pins are in contact with each other, which causes a short circuit of the chip.

Therefore, an object of the present invention is to provide a wet processing apparatus capable of overcoming at least one disadvantage of the prior art.

Therefore, the wet processing equipment of the present invention is suitable for processing a plurality of wafers carried by a carrying jig. The wet processing equipment includes a conveying device, an etching area, a first cleaning area, and a deoxidizing area , And a second cleaning area.

The conveying device can convey the carrying jig along a first conveying direction to move. The etching area has a first chemical solution for soaking the carrying jig transported by the transport device to etch a plurality of pins of each wafer. The first cleaning zone is located on the downstream side of the etching zone for cleaning the wafers on the carrier jig output through the etching zone. The deoxidation zone is located on the downstream side of the first cleaning zone, and has a second chemical solution for immersing the carrier jig transported by the transfer device to generate a deoxidation reaction to the pins of each wafer. The second cleaning zone is located on the downstream side of the deoxidation zone for cleaning the wafers on the carrier jig output through the deoxidation zone.

Another object of the present invention is to provide a processing method that can overcome at least one disadvantage of the prior art.

Therefore, the processing method of the present invention is suitable for processing a plurality of wafers carried by a carrier jig. The processing method includes the following steps:

Conveying the carrying jig movement along a first conveying direction through a conveying device;

Etching a plurality of pins of each wafer moving along the first conveying direction with a first chemical solution through an etching area;

Cleaning the wafers output from the etching area along the first conveying direction through a first cleaning area;

Passing through a deoxidation zone with a second chemical solution to produce a deoxidation reaction on the pins of each wafer moving along the first conveying direction; and

The wafers output from the deoxidation zone along the first conveying direction are cleaned through a second cleaning zone.

The effect of the present invention lies in that the first chemical solution in the etching area reacts with each pin of the wafer or the metal wire generated by sawing of the wafer and etchs each pin or metal wire, so that the two adjacent The distance between the pins can be increased to a preset length, or the wire can be removed to prevent the chip from being in contact with another adjacent pin due to thermal expansion and contraction during subsequent use. Two adjacent pins are in contact with each other, which causes a short circuit.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

1 and 2, FIG. 1 is a bottom view of a wafer 1 to be processed by an embodiment of the wet processing apparatus 300 of the present invention, and FIG. 2 is a side view of the wafer 1. The chip 1 is packaged by, for example, a dual row quad flat no lead (DR-QFN) method, a quad flat no-lead package (QFN) method or a double-sided no-lead package (DFN) method Made. The wafer 1 is exemplified by a rectangular shape. Of course, it may also be a square shape. The chip 1 includes an insulating package 11, a plurality of pins 12, a metal thermal conductive layer 13, and a metal protective layer 14. The insulating package 11 has a first surface 111, a second surface 112 opposite to the first surface 111, and four side surfaces 113 connected between the first surface 111 and the second surface 112. Each pin 12 is made of copper and is partially covered by an insulating package 11. Some of the pins 12 are arranged in a double row at the side 113 on the two short sides. One row of pins 12 is exposed on the first surface 111 of the insulating package 11 and the other row of pins 12 is It is exposed on the first surface 111 and the side surface 113 of the insulating package 11 at the same time. The remaining portions of the pins 12 are arranged in a single row on the side surfaces 113 on the two long sides, and are exposed on the first surface 111 and the side surfaces 113 of the insulating package 11 at the same time. The metal heat-conducting layer 13 is made of, for example, tin and is partially covered by the insulating package 11. The metal heat-conducting layer 13 may be exposed on the first surface 111 of the insulating package 11. The metal protective layer 14 is made of, for example, silver and is plated on the metal heat conduction layer 13 to shield the metal heat conduction layer 13.

Referring to FIG. 3, FIG. 4 and FIG. 5, a carrier jig 2 is used to simultaneously carry a plurality of wafers 1 as shown in FIG. 1, the carrier jig 2 includes a carrier plate 21, and a detachable cover is attached to the carrier plate 21的盖板23。 21 cover plate 23. The bearing plate 21 includes a rectangular plate body 211, a plurality of bearing units 212, a plurality of bump units 213, and four pad units 214. The disc body 211 is formed with a plurality of through holes 215 arranged in an array, and three positioning holes 216. Each positioning hole 216 is adjacent to the corresponding corner of the disc body 211. Each bearing unit 212 is formed on the disk body 211 to define an inner peripheral surface 210 of each through hole 215, and includes four protruding arms 217 and four bearing pieces 223. Each protruding arm 217 is protruded at a corresponding corner of the inner peripheral surface 210. Each carrier piece 223 is connected between the corresponding two adjacent protruding arms 217 for supporting the first surface 111 (see FIG. 2) or the second surface 112 (see FIG. 2) of the wafer 1. In this embodiment, it is described that each bearing piece 223 carries the first surface 111. Each bump unit 213 includes four bumps 218 protruding on the top surface of the disc body 211. The bumps 218 are adjacent to the four corners of the inner peripheral surface 210. Each pad unit 214 includes a plurality of pads 219 protruding on the top surface of the disc body 211 and located at corresponding corners of the disc body 211. The pads 219 define a plurality of grooves 220 that are vertically and staggered and communicate with each other. The top surface of the disc body 211 has two long face parts 221 and two short face parts 222. The two long faces 221 are respectively located on the two long sides of the disc body 211, and the two short faces 222 are respectively located on the two short sides of the disc body 211. Each long face 221 is located between two corresponding pad units 214, and each short face 222 is located between two corresponding pad units 214.

The cover plate 23 includes a rectangular plate body 231 and three positioning posts 232. The plate body 231 is formed with a plurality of opening units 233 arranged in an array, and a plurality of through holes 234. Each opening unit 233 includes a first opening 230 and four second openings 235 surrounding the first opening 230. The perforations 234 are adjacent to the two long sides and the two short sides of the plate body 231 and surround the outside of the opening units 233. The plate body 231 has a plurality of blocking frames 236, and each blocking frame 236 has a frame shape and defines a first opening 230. Each blocking frame 236 is used to block the second surface 112 of the wafer 1. Each positioning post 232 is protrudingly arranged on the bottom surface of the plate body 231 and is adjacent to the corresponding corner of the plate body 231 for being caught in the corresponding positioning hole 216.

Referring to FIGS. 6 and 7, after placing each wafer 1 on the corresponding carrier unit 212, the four carrier sheets 223 of the carrier unit 212 will abut on the first surface 111 of the wafer 1 to carry the wafer 1. Subsequently, the cover plate 23 is covered on the bearing plate 21, so that each positioning post 232 (see FIG. 4) is locked in the corresponding positioning hole 216 (see FIG. 3), and the top surface of each protrusion 218 and each pad 219 (See FIG. 3) The top surface abuts the bottom surface of the plate body 231, that is, the assembly of the cover plate 23 is completed. At this time, most areas of the first surface 111 of the wafer 1 and all the pins 12 and the metal protective layer 14 exposed on the first surface 111 will correspond to the through holes 215 of the carrier plate 21, so that the processing liquid, Fluid such as cleaning fluid or compressed air can flow into the wafer 1 in the carrier jig 2 through the through hole 215 to perform chemical reaction, cleaning, or drying on the wafer 1. Most areas of the second surface 112 of the wafer 1 will correspond to the positions of the first opening 230 and the four second openings 235 of the corresponding opening unit 233 of the cover plate 23, thereby allowing processing liquid, cleaning liquid or compressed air The isofluid can flow into the wafer 1 in the carrier jig 2 through the first opening 230 and the second opening 235 to perform chemical reaction, cleaning, or drying on the wafer 1.

The second surface 112 of the wafer 1 will be separated from a blocking end 237 of the bottom surface of the blocking frame 236 of the cover plate 23 by this distance, thereby allowing the wafer 1 to receive the impact of the aforementioned fluid when the carrier sheet 223 and the blocking frame The stop end 237 of 236 shakes up and down. In addition, each side 113 of the wafer 1 will be separated from the corresponding bump 218 by a distance, thereby allowing the wafer 1 to swing back and forth or left and right between the bumps 218 when subjected to the aforementioned fluid impact.

Referring to FIG. 8, each long face 221 of the bearing tray 21 and the corresponding two pad units 214, and the bottom surface of the plate body 231 of the cover plate 23 define a side flow channel 24 together. Referring to FIG. 9, each short surface portion 222 of the bearing tray 21 and the corresponding two pad units 214, and the bottom surface of the plate body 231 of the cover plate 23 together define an end flow channel 25.

Referring to FIGS. 3, 4, 8 and 9, each pad unit 214 can reduce the contact area with the bottom surface of the plate body 231 by a plurality of pads 219 abutting the bottom surface of the plate body 231, so that the processing liquid Or the cleaning liquid is less likely to stick between the top surface of each pad 219 and the bottom surface of the plate body 231. The design of the groove 220 can allow fluid to flow in it, so that when compressed air is blown to the grooves 220 on the left and right sides of the carrying fixture 2, the processing liquid or cleaning liquid in the groove 220 can be blown out so that it can pass through The end flow channel 25 or the through hole 215 is discharged. At the same time, the compressed air flowing in the groove 220 can also improve the effect of blowing away the residual treatment liquid or cleaning liquid between the top surface of each pad 219 and the bottom surface of the plate body 231. In addition, when the compressed air is blown to the side flow channels 24 on the left and right sides of the carrier jig 2, the residual processing liquid or cleaning liquid on the long surface 221 can be blown away and discharged through the through hole 215. Also, compressed air can be blown to each wafer 1 and dried.

By designing the perforations 234 of the cover plate 23 corresponding to the pad units 214, the long face portions 221, and the short face portions 222 of the carrier plate 21, compressed air is blown from the cover plate 23 toward the perforations 234 At this time, compressed air can be blown to each block unit 214, each long face 221 and each short face 222 through the perforations 234, which can blow away the treatment liquid or cleaning liquid remaining on the aforementioned structure through the groove 220, The side flow channel 24 and the end flow channel 25 are discharged.

10 and 11, it is an embodiment of the wet processing equipment 300 of the present invention, which is suitable for processing a plurality of wafers 1 (as shown in FIG. 7) carried by the carrier jig 2. The wet processing equipment 300 includes a body 3, a conveying device 5, and a transfer device 6.

The body 3 includes a front end 301 and a rear end 302. The directions passing through the front end 301 and the rear end 302 of the body 3 are defined as a front-rear direction X, a left-right direction Y perpendicular to the front-rear direction X, and an up-down direction Z perpendicular to the front-rear direction X and the left-right direction Y.

The body 3 includes a wetting area 31, an etching area 32, a first cleaning area 33, a deoxidizing area 35, a second cleaning area 36, an inspection area 38, a removal area 39, a third cleaning area 40 , A neutralization zone 41, a fourth cleaning zone 42, a drying zone 44, and a reflux zone 45. The aforementioned wet area 31, etching area 32, first cleaning area 33, deoxidation area 35, second cleaning area 36, inspection area 38, removal area 39, third cleaning area 40, neutralization area 41, fourth cleaning area 42 and the drying area 44 are arranged in a row along the front-back direction X from front to back in sequence. The recirculation zone 45 extends into another row along the front-rear direction X and is arranged on the right side of the aforementioned row along the left-right direction Y. The return area 45 and the wet area 31 together define the front end 301, and the return area 45 and the drying area 44 together define the rear end 302.

The conveying device 5 includes a first conveying mechanism 51 and a second conveying mechanism 52 spaced apart from the first conveying mechanism 51 in the left-right direction Y. The first conveying mechanism 51 is disposed in the aforementioned wetting area 31, etching area 32, first cleaning area 33, deoxidation area 35, second cleaning area 36, inspection area 38, removal area 39, third cleaning area 40, neutralization Zone 41, fourth cleaning zone 42 and drying zone 44. The first conveying mechanism 51 has a feeding front end 511 located in the wetting zone 31 and adjacent to the front end 301, and a discharging front end 512 located in the drying zone 44 and adjacent to the rear end 302. The first conveying mechanism 51 can convey the carrying jig 2 in a first conveying direction D1 from front to back to move in the aforementioned areas. The second conveying mechanism 52 is disposed in the recirculation zone 45 and has a feeding rear end 521 adjacent to the rear end 302 and a discharging front end 522 adjacent to the front end 301. The second conveying mechanism 52 can convey the carrying jig 2 to move in the return area 45 along a second conveying direction D2 opposite to the first conveying direction D1.

Referring to FIGS. 12 and 13, the wet zone 31 includes a feed section 311, a wet section 312 located downstream of the feed section 311, and a blow-dry section 313 located downstream of the wet section 312. The wetting section 312 includes a plurality of spraying elements 314 arranged at intervals in the first conveying direction D1. The two spray members 314 of each pair are spaced in the vertical direction Z, wherein the lower spray member 314 is used to spray water 310 upward, and the upper spray member 314 is used to spray water 310 downward. As a result, the aforementioned spraying member 314 can spray water 310 on the wafer 1 (see FIG. 7) on the carrying jig 2 conveyed by the first conveying mechanism 51 to perform the wetting operation.

The first conveyance mechanism 51 includes a plurality of lower conveyance rollers 513 arranged at intervals in the front-rear direction X, and a plurality of upper conveyance rollers 514 arranged at intervals in the front-rear direction X. The lower conveying rollers 513 and the upper conveying rollers 514 are located between the feeding front end 511 and the discharging rear end 512 (see FIG. 10), each lower conveying roller 513 is an active roller, and each upper conveying roller 514 is A driven roller. The number of upper conveying rollers 514 is less than the number of lower conveying rollers 513, and each upper conveying roller 514 is located above the corresponding lower conveying roller 513. The first conveying mechanism 51 drives the carrying jig 2 to move in the first conveying direction D1 through the lower conveying roller 513 and the upper conveying roller 514.

Referring to FIGS. 12 and 14, the drying section 313 includes two pairs of jet heads 315 on the downstream side of the spray member 314 and two side jet nozzles 316 (see FIG. 14 ). Two pairs of jet heads 315 are arranged at intervals in the first conveying direction D1, and the two jet heads 315 of each pair are spaced apart in the vertical direction Z, and each jet head 315 is used to eject compressed gas in the form of an air knife. Among them, the lower jet head 315 jets obliquely upward and forward, and the upper jet head 315 jets obliquely downward and forward. As a result, the aforementioned jet head 315 can jet the wafer 1 (see FIG. 7) on the carrying jig 2 conveyed by the first conveying mechanism 51 to remove the water 310 on the wafer 1. The two side jet nozzles 316 are spaced apart in the left-right direction Y, one of which is a side jet of the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along a left jet direction D3, and the other is The wafer 1 on the jig 2 is jetted sideways along a right jet direction D4 opposite to the left jet direction D3, thereby removing the water 310 on the wafer 1.

Referring to FIGS. 15 and 16, the etching area 32 includes a separation section 321, a chemical reaction section 322 on the downstream side of the separation section 321, and a drying section 323 on the downstream side of the chemical reaction section 322. The separating section 321 is located on the downstream side of the drying section 313 (see FIG. 12) of the wet area 31 to separate the drying section 313 and the chemical reaction section 322 to prevent the chemical liquid in the chemical reaction section 322 from seeping into the drying section 313 Inside. The chemical reaction section 322 forms a first chemical liquid tank 324 through which the carrying jig 2 conveyed by the first conveying mechanism 51 passes.药液325. In this embodiment, the first chemical solution 325 is an etching solution for etching the pins 12 of each wafer 1 (see FIG. 1). The chemical reaction section 322 includes a plurality of first chemical liquid spray heads 326 disposed in the first chemical liquid tank 324 and spaced along the first conveying direction D1 and alternately arranged up and down. A portion of the first chemical liquid spray heads 326 sprays the first chemical liquid 325 in the form of a water jet on the wafer 1 on the carrier 2 upwards, and another portion sprays the first water jet in the form of a water jet on the wafer 1 downwards药液325. The first conveying mechanism 51 further includes two solid rollers 515 and two liquid cutting rollers 516. The two solid rollers 515 are located at the front and rear ends of the first chemical tank 324, respectively. The two liquid cutting rollers 516 are respectively in contact with the two solid rollers 515 to block the first chemical liquid 325 to prevent it from overflowing into the partition section 321 and the drying section 323. The portion of each liquid cutting roller 516 supported by the load-bearing jig 2 can be displaced upward to allow the load-bearing jig 2 to pass between the solid roller 515 and the liquid-cut roller 516.

15 and 17, the drying section 323 includes two pairs of first spray heads 327 and two first side nozzles 328 located on the downstream side of the first chemical liquid tank 324. The two pairs of first nozzles 327 are arranged at intervals in the first conveying direction D1, and the two first nozzles 327 of each pair are arranged at intervals in the vertical direction Z. The structure and arrangement of each first spray head 327 are the same as the structure and arrangement of the spray head 315 (see FIG. 12). The lower first spray head 327 is inclined upward and sprays forward, and the upper first spray head 327 is inclined inclined. Jet down and forward. In this way, the first spray head 327 can jet the wafer 1 (see FIG. 7) on the carrier jig 2 transported by the first transport mechanism 51 to remove the first chemical liquid 325 on the wafer 1. The structure and installation manner of each first side nozzle 328 are the same as the structure and installation manner of the side air nozzle 316 (see FIG. 14 ). The two first side nozzles 328 are spaced apart in the left-right direction Y, and one of the two first side nozzles 328 is lateral to the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left jet direction D3 Jetting, and the other one is jetting the wafer 1 on the carrier jig 2 sideways along the right jet direction D4, thereby removing the first chemical liquid 325 on the wafer 1.

Referring to FIG. 18, the first cleaning zone 33 includes a first cleaning section 331 located downstream of the drying section 323 (see FIG. 15), a second cleaning section 332 located downstream of the first cleaning section 331, and a second cleaning section 332 A third cleaning section 333 on the downstream side of the cleaning section 332, and a fourth cleaning section 334 on the downstream side of the third cleaning section 333. The first cleaning section 331 includes two first spray heads 335 spaced apart in the vertical direction Z, and two first spray heads 336 spaced apart in the vertical direction and located on the downstream side of the first spray head 335. The structure of each first water spray head 335 is the same as the structure of the first chemical liquid spray head 326 (see FIG. 15). One of the two first water-jet heads 335 sprays water 337 in the form of a waterjet toward the wafer 1 on the jig 2 upward, and the other sprays water 337 in the form of a waterjet toward the wafer 1 downward, thereby, In order to perform the first cleaning of the wafer 1. The structure and arrangement of each first jet head 336 is the same as that of jet head 315 (see FIG. 12). The lower first jet head 336 jets obliquely upward and forward, and the upper first jet head 336 is Jet downwards obliquely and forward. In this way, the aforementioned first jetting head 336 can jet the wafer 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 to remove the water 337 on the wafer 1.

The second cleaning section 332 is formed with a water tank 338 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through. The water tank 338 contains water 339 for the carrier jig 2 to soak for cleaning the wafer 1. Two solid rollers 515 and two liquid cutting rollers 516 are also arranged at the front and rear ends of the water tank 338. The second cleaning section 332 includes a plurality of second sprinkler heads 340 disposed in the water tank 338 and spaced along the first conveying direction D1 and staggered up and down, and two second water spray heads 340 spaced along the vertical direction Z and located on the downstream side of the water tank 338 Two jet heads 341. A part of the second water jet heads 340 sprays water 339 in the form of a waterjet toward the wafer 1 on the carrier 2 upward, and another part sprays water 339 in the form of a waterjet toward the wafer 1 downward, thereby, In order to perform the second cleaning of the wafer 1. The structure and arrangement of each second jet head 341 are the same as those of the jet head 315 (as shown in FIG. 12). The lower second jet head 341 jets obliquely upward and forward, and the upper second jet head 341 is Jet downwards obliquely and forward. As a result, the aforementioned second jet head 341 can jet the wafer 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 to remove the water 339 on the wafer 1.

The third cleaning section 333 includes a plurality of pairs of first spraying elements 342 spaced apart along the first conveying direction D1, and two third jetting heads 343 spaced along the vertical direction Z and located downstream of the first spraying elements 342. The structure and arrangement of each first spraying member 342 are the same as the structure and arrangement of the spraying member 314 (see FIG. 12). The two first spraying members 342 of each pair are spaced apart in the vertical direction Z, wherein the lower first spraying member 342 is used to spray water 344 to the wafer 1 upwards, and the upper first spraying member 342 is used to face downwards Wafer 1 sprayed with water 344. In this way, the first spraying member 342 can perform the third cleaning of the wafer 1. The structure and arrangement of each third jet head 343 are the same as those of the jet head 315 (see FIG. 12). The lower third jet head 343 jets the wafer 1 obliquely upward and forward, and the upper third jet head 343 343 jets wafer 1 obliquely downward and forward. In this way, the compressed gas ejected from the third jet head 343 can remove the water 344 on the wafer 1.

The fourth cleaning section 334 includes a plurality of pairs of second spray members 345 arranged at intervals along the first conveying direction D1, two pairs of fourth spray heads 346 located downstream of the second spray members 345, and two pairs of second spray members 345 The downstream side jet nozzle 347. The structure and arrangement of each second spraying member 345 are the same as the structure and arrangement of the spraying member 314 (see FIG. 12). The two second spraying members 345 of each pair are spaced apart in the vertical direction Z, wherein the lower second spraying member 345 is used to spray water 348 upwards to the wafer 1, and the upper second spraying member 345 is used to downwardly couple Wafer 1 is sprayed with water 348. In this way, the aforementioned second spraying member 345 can perform the fourth cleaning of the wafer 1.

Referring to FIGS. 18 and 19, two pairs of fourth jet heads 346 are spaced apart along the first conveying direction D1, and the two fourth jet heads 346 of each pair are spaced apart in the vertical direction Z. The structure and arrangement of each fourth jet head 346 are the same as those of the jet head 315 (see FIG. 12). The lower fourth jet head 346 jets the wafer 1 (see FIG. 7) obliquely upward and forward. The upper fourth jet head 346 jets the wafer 1 obliquely downward and forward. With this, the compressed gas ejected from the aforementioned fourth jet head 361 can remove the water 348 on the wafer 1. The structure and arrangement of each side jet nozzle 347 are the same as the structure and arrangement of side jet nozzle 316 (see FIG. 14). The two side jet nozzles 347 are spaced apart in the left-right direction Y, and one of the two side jet nozzles 347 jets the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 laterally along the left jet direction D3. The other one is to laterally jet the wafer 1 on the carrier jig 2 along the right jet direction D4, thereby removing the water 348 on the wafer 1.

Referring to FIGS. 20 and 21, the overall structure of the deoxidation zone 35 is the same as the structure of the etching zone 32 of FIG. 15. The deoxidation zone 35 includes a separation section 351, a chemical reaction section 352 located downstream of the separation section 351, and a chemical The drying section 353 on the downstream side of the reaction section 352. The separating section 351 is located on the downstream side of the fourth cleaning section 334 (see FIG. 18 ), and is used to separate the fourth cleaning section 334 and the chemical reaction section 352 to prevent the chemical liquid in the chemical reaction section 352 from flowing into the fourth cleaning section 334 . The chemical reaction section 352 forms a second medicinal liquid tank 354 for the carrying jig 2 conveyed by the first conveying mechanism 51 to pass therethrough. Medicine liquid 355. Two solid rollers 515 and two liquid cutting rollers 516 are also disposed at the front and rear ends of the second chemical liquid tank 354. In this embodiment, the second chemical solution 355 is a deoxidizing solution for generating a deoxidizing reaction on the pins 12 of each wafer 1 (see FIG. 1). The chemical reaction section 352 includes a plurality of second chemical liquid spray heads 356 disposed in the second chemical liquid tank 354 and spaced along the first conveying direction D1 and staggered up and down. A part of the second chemical liquid spray heads 356 sprays a second chemical liquid 355 in the form of a water jet on the wafer 1 on the carrier 2 upward, and a second part sprays a second water jet in the form of a water jet on the wafer 1 downward Medicine liquid 355.

Referring to FIGS. 20 and 21, the drying section 353 includes two pairs of second spray heads 357 and two second side nozzles 358 on the downstream side of the second chemical liquid tank 354. The two pairs of second heads 357 are arranged at intervals in the first conveying direction D1, and the two second heads 357 of each pair are spaced at intervals in the vertical direction Z. The structure and arrangement of each second nozzle 357 are the same as the structure and arrangement of the jet nozzle 315 (as shown in FIG. 12). The lower second nozzle 357 jets obliquely upward and forward, and the upper first nozzle 327 jets obliquely. Jet down and forward. In this way, the aforementioned first shower head 327 can jet the wafer 1 to remove the second chemical liquid 355 on the wafer 1. The structure and installation manner of each second side nozzle 358 are the same as the structure and installation manner of the side air nozzle 316 (see FIG. 14 ). The two second side nozzles 358 are spaced apart in the left-right direction Y, and one of the two second side nozzles 358 is lateral to the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left jet direction D3 Jetting, and the other one is jetting the wafer 1 on the carrier jig 2 laterally along the right jet direction D4, thereby removing the second chemical liquid 355 on the wafer 1.

Referring to FIG. 22, the structure of the second cleaning area 36 is similar to the structure of the first cleaning area 33 of FIG. 18, the only difference is that the second cleaning area 36 lacks the third cleaning section 333 like the first cleaning area 33 (as shown in FIG. 18 ). The second cleaning zone 36 includes a first cleaning section 361 located downstream of the blow drying section 353 (see FIG. 20), a second cleaning section 362 located downstream of the first cleaning section 361, and a second cleaning section 362 The third cleaning section 363 on the downstream side. The first cleaning section 361 includes two first spray heads 364 spaced apart in the vertical direction Z, and two first spray heads 365 spaced apart in the vertical direction and located on the downstream side of the first spray head 364. The structure of each first water jet head 364 is the same as the structure of the first water jet head 335 (see FIG. 18). One of the two first water spray heads 364 sprays water 366 in the form of a waterjet upward to the wafer 1 (see FIG. 7) on the carrier fixture 2, and the other sprays water in the form of a waterjet downward to the wafer 1 366, by which the first cleaning of the wafer 1 is performed. The structure and arrangement of each first jet head 365 are the same as those of the jet head 315 (see FIG. 12). The lower first jet head 365 jets obliquely upward and forward, and the upper first jet head 365 is Jet downwards obliquely and forward. In this way, the aforementioned first jet head 365 can jet the wafer 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 to remove the water 366 on the wafer 1.

The second cleaning section 362 forms a water tank 367 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through. The water tank 367 contains water 368 for the carrier jig 2 to soak to clean the wafer 1. Two solid rollers 515 and two liquid cutting rollers 516 are also arranged at the front and rear ends of the water tank 367. The second cleaning section 362 includes a plurality of second sprinkler heads 369 disposed in the water tank 367 and spaced along the first conveying direction D1 and staggered up and down, and two second water jet heads spaced along the vertical direction Z and located on the downstream side of the water tank 367 Two jet heads 370. A part of the second water jet heads 369 sprays water 368 in the form of a water jet toward the wafer 1 on the carrier jig 2 upward, and another part sprays water 368 in the form of a water jet toward the wafer 1 downward, thereby, In order to perform the second cleaning of the wafer 1. The structure and arrangement of each second jet head 370 are the same as those of the jet head 315 (as shown in FIG. 12). The lower second jet head 370 jets obliquely upward and forward, and the upper second jet head 370 is Jet downwards obliquely and forward. As a result, the aforementioned second jet head 370 can jet the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 to remove the water 368 on the wafer 1.

Referring to FIG. 22 and FIG. 23, the third cleaning section 363 includes a plurality of pairs of spray members 371 spaced apart along the first conveying direction D1, two pairs of third jet heads 372 located downstream of the spray members 371, and two spray members 371 The downstream side jet nozzle 373. The structure and arrangement of each spraying member 371 are the same as the structure and arrangement of the spraying member 314 (see FIG. 12). The two spraying members 371 of each pair are spaced along the vertical direction Z, wherein the lower spraying member 371 is used to spray water 374 on the wafer 1 upward, and the upper spraying member 371 is used to spray water 374 on the wafer 1 downward. Thereby, the aforementioned spraying member 371 can perform the third cleaning of the wafer 1.

The two pairs of third jet heads 372 are arranged at intervals in the first conveying direction D1, and the two third jet heads 372 of each pair are spaced at intervals in the vertical direction Z. The structure and arrangement of each third jet head 372 are the same as those of the jet head 315 (see FIG. 12). The lower third jet head 372 jets the wafer 1 obliquely upward and forward, and the upper third jet head 372 jets wafer 1 obliquely downward and forward. In this way, the compressed gas ejected from the third jet head 372 can remove the water 374 on the wafer 1. The structure and arrangement of each side jet nozzle 373 are the same as the structure and arrangement of side jet nozzle 316 (see FIG. 14). The two side jet nozzles 373 are spaced apart in the left-right direction Y, and one of the two side jet nozzles 373 jets the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 laterally along the left jet direction D3. The other one is to laterally jet the wafer 1 on the carrier jig 2 along the right jet direction D4, thereby removing the water 374 on the wafer 1.

10 and 11, the inspection area 38 is located on the downstream side of the third cleaning section 363 (see FIG. 22). When the first conveying mechanism 51 conveys the carrying jig 2 to the inspection area 38, the worker stops the operation by controlling the first conveying mechanism 51, and the carrying jig 2 can stop at the inspection area 38. In this way, the staff can take out the carrying jig 2 to check the etching and cleaning status of the pins 12 (see FIG. 1) of each wafer 1.

Referring to FIG. 24, the overall structure of the removed area 39 is the same as the structure of the etched area 32 of FIG. 15. The removed area 39 includes a separation section 391, a chemical reaction section 392 on the downstream side of the separation section 391, and a chemical reaction section 392吹干段393 on the downstream side. The separating section 391 is located on the downstream side of the inspection area 38 (see FIG. 11 ), and is used to separate the inspection area 38 and the chemical reaction section 392 to prevent the chemical liquid in the chemical reaction section 392 from seeping into the inspection area 38. The chemical reaction section 392 forms a third chemical liquid tank 394 through which the carrying jig 2 conveyed by the first conveying mechanism 51 passes. The third chemical liquid tank 394 accommodates a third liquid tank immersed for carrying the jig 2药液395. Two solid rollers 515 and two liquid cutting rollers 516 are also arranged at the front and rear ends of the third chemical liquid tank 394. In this embodiment, the third chemical solution 395 is a silver stripping agent, which is used to remove the metal protective layer 14 of each wafer 1 (see FIG. 2 ). The chemical reaction section 392 includes a plurality of third chemical liquid spray heads 396 disposed in the third chemical liquid tank 394 and spaced along the first conveying direction D1 and alternately arranged up and down. A part of the third chemical liquid spray heads 396 sprays the third chemical liquid 395 in the form of a water jet upward on the wafer 1 (see FIG. 7) on the carrier jig 2, and the other part sprays water on the wafer 1 downward The third medicine liquid 395 in the form of a knife.

Referring to FIGS. 24 and 25, the drying section 393 includes two pairs of third spray heads 397 and two third side nozzles 398 on the downstream side of the third chemical liquid tank 394. The two pairs of third nozzles 397 are arranged at intervals in the first conveying direction D1, and the two third nozzles 397 of each pair are arranged at intervals in the vertical direction Z. The structure and arrangement of each third nozzle 397 are the same as the structure and arrangement of the first nozzle 327 (see FIG. 15). The lower third nozzle 397 is inclined upward and jets forward, and the upper third nozzle 397 is inclined. Jet down and forward. As a result, the third nozzle 397 can jet the wafer 1 (see FIG. 7) to remove the third chemical liquid 395 on the wafer 1. The structure and arrangement of each third-side nozzle 398 are the same as the structure and arrangement of the first-side nozzle 328 (see FIG. 15). The two third side nozzles 398 are spaced apart in the left-right direction Y, and one of the two third side nozzles 398 is lateral to the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left jet direction D3 Jetting, and the other one is jetting the wafer 1 on the carrier jig 2 laterally along the right jet direction D4, thereby removing the third chemical liquid 395 on the wafer 1.

Referring to FIG. 26, the structure of the third cleaning area 40 is similar to the structure of the first cleaning area 33 of FIG. 18, the difference is that the third cleaning area 40 is less like the second cleaning section 332 and the third cleaning section of the first cleaning area 33 333 (Figure 18). The third cleaning zone 40 includes a first cleaning section 401 located downstream of the drying section 393 (see FIG. 24), and a second cleaning section 402 located downstream of the first cleaning section 401. The first cleaning section 401 includes two first spray heads 403 spaced apart in the vertical direction Z, and two first spray heads 404 spaced apart in the vertical direction and located on the downstream side of the first spray head 403. The structure of each first water jet head 403 is the same as the structure of the first water jet head 335 (see FIG. 18). One of the two first water jet heads 403 sprays water 405 in the form of a water jet upward to the wafer 1 (see FIG. 7) on the jig 2 and the other jets water in the form of a water jet downward to the wafer 1 405, by which the first cleaning of the wafer 1 is performed. The structure and arrangement of each first jet head 404 are the same as the structure and arrangement of the first jet head 336 (see FIG. 18). The lower first jet head 404 jets obliquely upward and forward, and the upper first jet head 404 It is inclined downward and jets forward. In this way, the aforementioned first jetting head 404 can jet the wafer 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 to remove the water 405 on the wafer 1.

Referring to FIGS. 26 and 27, the second cleaning section 402 includes a plurality of pairs of spray elements 406 spaced apart along the first conveying direction D1, two pairs of second jet heads 407 located downstream of the spray elements 406, and two spray elements The side jet nozzle 408 on the downstream side of 406. The structure and arrangement of each spraying member 406 are the same as the structure and arrangement of the second spraying member 345 (see FIG. 18). The two spraying members 406 of each pair are spaced apart in the vertical direction Z, wherein the lower spraying member 406 is used to spray water 409 upwards on the wafer 1 (see FIG. 7), and the upper spraying member 406 is used to downwardly spray the wafers 1Spray water 409. In this way, the aforementioned spraying member 406 can perform the second cleaning of the wafer 1.

Two pairs of second jet heads 407 are spaced apart along the first conveying direction D1, and two pairs of second jet heads 407 of each pair are spaced apart in the up-down direction Z. The structure and arrangement of each second jet head 407 is the same as that of the fourth jet head 346 (see FIG. 18). The lower second jet head 407 jets the wafer 1 obliquely upward and forward, and the second The jet head 407 jets the wafer 1 obliquely downward and forward. In this way, the compressed gas jetted from the second jet head 407 can remove the water 409 on the wafer 1. The structure and arrangement of each side air nozzle 408 are the same as the structure and arrangement of the side air nozzle 347 (see FIG. 19). The two side jet nozzles 408 are spaced apart in the left-right direction Y, and one of the two side jet nozzles 408 jets the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 laterally along the left jet direction D3. The other one is to laterally jet the wafer 1 on the carrier jig 2 along the right jet direction D4, thereby removing the water 409 on the wafer 1.

Referring to FIG. 28, the overall structure of the neutralization zone 41 is similar to the structure of the etching zone 32 of FIG. 15. The neutralization zone 41 includes a separation section 411, a chemical reaction section 412 on the downstream side of the separation section 411, and a chemical reaction section 412吹干段413 on the downstream side. The separation section 411 is located on the downstream side of the second cleaning section 402 (see FIG. 26) to separate the second cleaning section 402 and the chemical reaction section 412 to prevent the chemical liquid in the chemical reaction section 412 from seeping into the second cleaning section 402 . The chemical reaction section 412 forms a fourth chemical liquid tank 414 through which the carrying jig 2 conveyed by the first conveying mechanism 51 passes. The fourth chemical liquid tank 414 accommodates a fourth liquid tank immersed by the carrying jig 2药液415. Two solid rollers 515 and two liquid cutting rollers 516 are also arranged at the front and rear ends of the fourth chemical liquid tank 414. In the present embodiment, the fourth chemical solution 415 is a neutralizing agent, which is used to neutralize and remove the oxide formed on the metal thermal conductive layer 13 (as shown in FIG. 2) of each wafer 1. The chemical reaction section 412 includes a plurality of fourth chemical liquid spray heads 416 disposed in the fourth chemical liquid tank 414 and spaced along the first conveying direction D1 and staggered up and down. A part of the fourth chemical liquid spray heads 416 upward sprays the fourth chemical liquid 415 in the form of a water jet to the wafer 1 (see FIG. 7) on the carrier jig 2, and the other part sprays water downward to the wafer 1 The fourth medicine liquid 415 in the form of a knife.

Referring to FIGS. 28 and 29, the drying section 413 includes two pairs of fourth spray heads 417 and two fourth side nozzles 418 on the downstream side of the fourth chemical liquid tank 414. The two pairs of fourth heads 417 are arranged at intervals in the first conveying direction D1, and the two fourth heads 417 of each pair are spaced at intervals in the vertical direction Z. The structure and arrangement of each fourth nozzle 417 are the same as the structure and arrangement of the first nozzle 327 (as shown in FIG. 15). The lower fourth nozzle 417 is inclined upward and jets forward, and the upper fourth nozzle 417 is inclined. Jet down and forward. As a result, the aforementioned fourth shower head 417 can jet the wafer 1 (see FIG. 7) to remove the fourth chemical solution 415 on the wafer 1. The structure and arrangement of each fourth side nozzle 418 are the same as the structure and arrangement of the first side nozzle 328 (see FIG. 17). The two fourth side nozzles 418 are spaced in the left-right direction Y, and one of the two fourth side nozzles 418 is the side of the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left jet direction D3 Jetting, and the other one is jetting the wafer 1 on the carrier 2 laterally along the right jet direction D4, thereby removing the fourth chemical liquid 415 on the wafer 1.

Referring to FIG. 30, the structure of the fourth cleaning area 42 is the same as the structure of the second cleaning area 36 of FIG. The fourth cleaning zone 42 includes a first cleaning section 421 located downstream of the drying section 413 (see FIG. 28), a second cleaning section 422 located downstream of the first cleaning section 421, and a second cleaning section 422 The third cleaning section 423 on the downstream side. The first cleaning section 421 includes two first water jet heads 424 spaced apart in the vertical direction Z, and two first gas jet heads 425 spaced apart in the vertical direction and located on the downstream side of the first water spray head 424. The structure of each first water jet head 424 is the same as the structure of the first water jet head 364 (see FIG. 22). One of the two first water spray heads 424 sprays water 426 in the form of a waterjet upward toward the wafer 1 (see FIG. 7) on the carrier fixture 2, and the other sprays water in the form of a waterjet downward toward the wafer 1 426, thereby performing the first cleaning of the wafer 1. The structure and arrangement of each first jet head 425 are the same as the structure and arrangement of the first jet head 365 (see FIG. 22). The lower first jet head 425 jets obliquely upward and forward, and the upper first jet head 425 It is inclined downward and jets forward. In this way, the aforementioned first jetting head 425 can jet the wafer 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 to remove the water 426 on the wafer 1.

The second cleaning section 422 is formed with a water tank 427 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through. The water tank 427 contains water 428 for the carrier jig 2 to soak for cleaning the wafer 1. Two solid rollers 515 and two liquid cutting rollers 516 are also arranged at the front and rear ends of the water tank 427. The second cleaning section 422 includes a plurality of second water jet heads 429 disposed in the water tank 427 and spaced along the first conveying direction D1 and staggered up and down, and two second water jet heads spaced along the vertical direction Z and located on the downstream side of the water tank 427 Two jet heads 430. A part of the second water jet heads 429 sprays water 428 in the form of a water jet toward the wafer 1 on the carrier 2 upward, and another part sprays water 428 in the form of a water jet toward the wafer 1 downward, thereby, In order to perform the second cleaning of the wafer 1. The structure and arrangement of each second jet head 430 are the same as the structure and arrangement of the second jet head 370 (see FIG. 22). The lower second jet head 430 jets obliquely upward and forward, and the upper second jet head 430 It is inclined downward and jets forward. In this way, the aforementioned second jet head 430 can jet the wafer 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 to remove the water 428 on the wafer 1.

Referring to FIGS. 30 and 31, the third cleaning section 423 includes a plurality of pairs of spray elements 431 arranged at intervals along the first conveying direction D1, two pairs of third jet heads 432 located downstream of the spray elements 431, and two spray elements The side air nozzle 433 on the downstream side of 431. The structure and arrangement of each spraying member 431 are the same as the structure and arrangement of the spraying member 370 (see FIG. 22). The two spray members 431 of each pair are spaced apart in the vertical direction Z, wherein the lower spray member 431 is used to spray water 434 upward to the wafer 1 (see FIG. 7), and the upper spray member 431 is used to face the wafer downward 1Spray water 434. Thereby, the aforementioned spraying member 431 can perform the third cleaning of the wafer 1.

The two pairs of third jet heads 432 are arranged at intervals in the first conveying direction D1, and the two third jet heads 432 of each pair are spaced at intervals in the vertical direction Z. The structure and arrangement of each third jet head 432 are the same as the structure and arrangement of the third jet head 372 (see FIG. 22). The lower third jet head 432 jets the wafer 1 obliquely upward and forward, and the upper third The jet head 432 jets the wafer 1 obliquely downward and forward. In this way, the compressed gas ejected from the third jet head 432 can remove the water 434 on the wafer 1. The structure and installation method of each side air nozzle 433 are the same as the structure and installation method of the side air nozzle 373 (see FIG. 23). The two side jet nozzles 433 are spaced apart in the left-right direction Y, and one of the two side jet nozzles 433 jets the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 laterally along the left jet direction D3. The other one is to laterally jet the wafer 1 on the carrier jig 2 along the right jet direction D4, thereby removing the water 434 on the wafer 1.

Referring to FIG. 32, the drying zone 44 includes a drying section 441 located downstream of the third cleaning section 423 (see FIG. 30), and a drying section 442 located downstream of the drying section 441. The drying section 441 includes a plurality of pairs of first blowing members 443 arranged at intervals in the first conveying direction D1. The two first blowing members 443 of each pair are spaced apart in the vertical direction Z, wherein the lower first blowing member 443 is used to blow compressed air in the form of an air knife upward toward the wafer 1 (see FIG. 7), and the upper first The blower 443 blows compressed air in the form of an air knife toward the wafer 1 downward. In this way, the wafer 1 on the carrier jig 2 is blow dried. The drying section 442 includes a plurality of pairs of second blowing members 444 spaced along the first conveying direction D1 and staggered up and down. A part of the second blowing members 444 blows compressed air in the form of an air knife toward the wafer 1 on the carrier 2 upward, and another part blows compressed air in the form of an air knife toward the wafer 1 downward, thereby, To dry the wafer 1 on the carrier jig 2. In the present embodiment, the temperature of the compressed air blown by the first blowing element 443 is, for example, equal to or lower than 60°C, and the temperature of the compressed air blown by the second blowing element 444 is, for example, 85 to 90°C.

Referring to FIGS. 33, 34 and 35, the transfer device 6 is located at the rear end 302 of the machine body 3 and includes a temporary storage mechanism 61 on the downstream side of the drying zone 44 and a lateral movement mechanism 62 on the downstream side of the temporary storage mechanism 61 . The temporary storage mechanism 61 includes a first conveying unit 611, and a lifting unit 612. The first conveying unit 611 corresponds to the discharge rear end 512 of the first conveying mechanism 51, and has a plurality of first conveying wheels 613 arranged at intervals in the first conveying direction D1. The first conveying wheels 613 are used to receive the load-bearing jig 2 (as shown in FIG. 32) output from the discharge rear end 512, and can move the load-bearing jig 2 along the first conveying direction D1. The lifting unit 612 includes two guide rods 614, a sliding frame 615, multiple pairs of support rods 616, and a first driving assembly 617. The two guide rods 614 are arranged at intervals along the first conveying direction D1, and the axial direction of each guide rod 614 extends in the vertical direction Z. The sliding frame 615 is slidably connected to the two guide rods 614. A plurality of pairs of support rods 616 are disposed on the sliding frame 615 and are arranged at intervals in the vertical direction Z, and two support rods 616 of each pair are spaced apart in the front-rear direction X. Each supporting rod 616 can move in the vertical direction Z through the corresponding two first conveying wheels 613, so that each pair of supporting rods 616 can lift the supporting jig 2 located on the first conveying wheel 613 upward The supporting jig 2 is supported, or the supported supporting jig 2 is placed on the first conveying wheel 613. The first driving assembly 617 is connected to the sliding frame 615 to drive the sliding frame 615 to move up or down in the up-down direction Z.

The traverse mechanism 62 includes a second conveying unit 621 and a traverse unit 622. The second conveying unit 621 includes a plurality of second conveying wheels 623 arranged at intervals along the first conveying direction D1. The second conveying wheels 623 are used to receive the bearing jig 2 output by the first conveying unit 611 and can Output to the second conveying mechanism 52. The traverse unit 622 includes a guide rail 624, a sliding member 625, and a second driving assembly 626. The guide rail 624 has an elongated shape and its longitudinal direction extends in the left-right direction Y. The sliding member 625 is slidably connected to the guide rail 624 and can slide in the left-right direction Y, and the sliding member 625 is connected to the bottom end of the second conveying unit 621. The second driving assembly 626 is connected to the sliding member 625 to drive the sliding member 625 to slide in the left-right direction Y, so that the sliding member 625 can drive the second conveying unit 621 at a first position aligned with the first conveying unit 611 (see FIG. 35), and a second position (see FIG. 38) aligned with the rear end 521 of the feeding. When the second conveying unit 621 is in the first position, the second conveying unit 621 can receive the carrying jig 2 output by the first conveying unit 611. When the second conveying unit 621 is in the second position, the second conveying unit 621 can convey the received bearing jig 2 to the second conveying mechanism 52. As a result, the second conveying mechanism 52 can move the carrying jig 2 in the second conveying direction D2 (see FIG. 10) to move in the recirculation zone 45 and discharge through the discharge front end 522 (see FIG. 10 ).

The following describes the processing method of the wet processing device 300:

Referring to FIG. 36, the processing method of the wet processing apparatus 300 of this embodiment includes the following steps: conveying step S1, wetting step S2, etching step S3, first cleaning step S4, deoxidizing step S5, second cleaning step S6, The removal step S7, the third cleaning step S8, the neutralization step S9, the fourth cleaning step S10, the drying step S11, the transfer step S12, and the reflow step S13.

Referring to FIGS. 10 and 36, in the conveying step S1, a plurality of carrying jigs 2 are sequentially fed onto the first conveying mechanism 51 through the feeding front end 511, and then, through the first conveying mechanism 51 of the conveying device 5 Each carrying jig 2 is transported along the first transport direction D1 to move.

Referring to FIG. 7, FIG. 12 and FIG. 13, in the wetting step S2, the loading jig 2 fed onto the first conveying mechanism 51 via the feeding front end 511 is located in the feeding section 311 of the wetting area 31. Subsequently, the first conveying mechanism 51 conveys the carrying jig 2 to the moistening section 312 in the first conveying direction D1 and moves therein. The water 310 sprayed upward by the lower spray member 314 of the wetting section 312 will be sprayed to the wafer 1 through the through hole 215 of the carrier plate 21, and the water 310 sprayed downward by the upper spray member 314 will pass the first opening of the cover plate 23 230 and the second opening 235 are sprayed onto the wafer 1. In this way, in addition to pre-cleaning the wafer 1 to wash away the dust or dirt on it, it can also produce a wetting effect on the pins 12 of the wafer 1 (see FIG. 6) and the metal protective layer 14 so that the wafer 1 In subsequent steps, the reaction speed of each pin 12 and the metal protective layer 14 with the chemical liquid can become faster.

Referring to FIG. 7, FIG. 12 and FIG. 14, then, the first conveying mechanism 51 conveys the carrying jig 2 to the drying section 313 along the first conveying direction D1 and moves therein. First, the gas jetted downward from the downward jet head 315 adjacent to the wetting section 312 is sprayed onto the wafer 1 through the through hole 215 and drives the water 310 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper jet head 315 adjacent to the wetting section 312 obliquely downward will scrape off the water 310 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and The second opening 235 is sprayed onto the wafer 1 and drives the water 310 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of jet heads 315 away from the wet section 312 will also perform a second drying operation on the wafer 1 in the aforementioned manner.

7, FIG. 8, FIG. 9 and FIG. 14, on the other hand, the gas ejected by one side jet nozzle 316 along the left jet direction D3 will be sprayed to the wafer 1 via the corresponding side flow channel 24, while the other side The gas jetted by the jet nozzle 316 along the right jet direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can drive the water 310 (see FIG. 13) on the wafer 1 from the through hole 215 or the end flow channel 25 Discharge to perform the third drying operation on the wafer 1. In this way, it can be ensured that the water 310 on each wafer 1 is completely blown off, so as to avoid that the water 310 on the wafer 1 is brought to the etching zone 32 of the next station to affect or dilute the first chemical solution 325 (see FIG. 15 ).

Referring to FIG. 7, FIG. 8, FIG. 9 and FIG. 15, in the etching step S3, the first conveying mechanism 51 drives the carrier jig 2 into the first chemical liquid tank 324 of the chemical reaction section 322 through the partition section 321 of the etching zone 32 . The carrier jig 2 is completely immersed in the first medical liquid 325 during the movement in the first medical liquid tank 324. The first chemical liquid 325 can flow into the wafer 1 in the carrier jig 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the first chemical liquid 325 ejected upward by the lower first chemical liquid spray head 326 flows to the wafer 1 through the through hole 215, and the first chemical liquid 325 ejected downward by the upper first chemical liquid spray head 326 passes through the first An opening 230 and a second opening 235 flow to the wafer 1 so that the first chemical liquid 325 can smoothly flow in the carrier jig 2. Thereby, the first chemical liquid 325 can fully and surely react with each pin 12 of the wafer 1 (as shown in FIG. 6) or the metal wire generated by sawing of the wafer 1 and etch each pin 12 or metal Wire, so that the distance between two adjacent pins 12 can be increased to a predetermined length, or the wire can be removed to prevent the wafer 1 from being used due to thermal expansion and contraction during subsequent use The wire is in contact with another adjacent pin 12 or two adjacent pins 12 are in contact with each other, thereby causing a short circuit.

Referring to FIGS. 7 and 15, next, the first conveying mechanism 51 conveys the carrying jig 2 to the drying section 323 along the first conveying direction D1 and moves therein. First, the gas ejected obliquely upward by the first shower head 327 adjacent to the chemical reaction section 322 will be sprayed to the wafer 1 through the through hole 215 and drive the first chemical liquid 325 on the wafer 1 from the first opening 230 and the second opening The hole 235 is discharged. Subsequently, the gas sprayed by the first spray head 327 above and adjacent to the chemical reaction section 322 obliquely downward will scrape off the first chemical liquid 325 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the An opening 230 and a second opening 235 are sprayed onto the wafer 1 and drive the first chemical liquid 325 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of first shower heads 327 away from the chemical reaction section 322 will also perform a second drying operation on the wafer 1 according to the aforementioned method.

Referring to FIGS. 7, 8, 9 and 17, on the other hand, the gas emitted by one of the first side nozzles 328 along the left jet direction D3 is sprayed to the wafer 1 via the corresponding side flow channel 24, while the other The gas ejected by the first side nozzle 328 along the right jet direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can pass the first chemical liquid 325 (see FIG. 16) remaining on the wafer 1 through The hole 215 or the end channel 25 is discharged to perform a third drying operation on the wafer 1. This can ensure that the first chemical solution 325 on each wafer 1 is completely blown off.

Referring to FIGS. 7 and 18, in the first cleaning step S4, the first conveying mechanism 51 drives the carrying jig 2 to enter the first cleaning section 331 of the first cleaning area 33 first, and the first water spray below the first cleaning section 331 The water 337 sprayed upward by the head 335 is sprayed to the wafer 1 through the through hole 215, and the water 337 sprayed downward by the upper first spray head 335 is sprayed to the wafer 1 through the first opening 230 and the second opening 235, In order to perform the first cleaning on each wafer 1, the first chemical liquid 325 on each wafer 1 that has been blown dry is washed away. Then, the gas jetted downward from the first jet head 336 obliquely upward will be sprayed to the wafer 1 through the through hole 215 and drive the water 337 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper first jet head 336 obliquely downward will scrape off the water 337 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening The hole 235 is sprayed to the wafer 1 and drives the water 337 on the wafer 1 to be discharged from the through hole 215 to dry the wafer 1.

After that, the first conveying mechanism 51 drives the carrying jig 2 into the water tank 338 of the second cleaning section 332. When the carrying jig 2 moves in the water tank 338, it is completely immersed in the water 339. The water 339 can flow into the wafer 1 in the carrier jig 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the water 339 sprayed upward by the lower second water spray head 340 flows to the wafer 1 through the through hole 215, and the water 339 sprayed downward by the upper second water spray head 340 passes through the first opening 230 and the second opening The hole 235 flows to the wafer 1 so that the water 339 can smoothly flow in the carrier jig 2 to perform a second cleaning of each wafer 1. Next, the gas ejected from the second downward air jet head 341 obliquely upward will be sprayed to the wafer 1 through the through hole 215 and drive the water 339 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected from the upper second jet head 341 obliquely downward will scrape off the water 339 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 The water 339 sprayed onto the wafer 1 and driving the water 1 on the wafer 1 is discharged through the through hole 215 to blow dry the wafer 1.

The first conveying mechanism 51 then drives the carrying jig 2 into the third cleaning section 333. The water 344 sprayed upward from the lower first spraying member 342 of the third cleaning section 333 will be sprayed to the wafer 1 through the through hole 215, and the water 344 sprayed downward from the upper first spraying member 342 will pass the first opening 230 and The second opening 235 is sprayed to the wafer 1 to perform a third cleaning on each wafer 1. Then, the gas ejected by the downward third jet head 343 obliquely upward will be sprayed to the wafer 1 through the through hole 215 and drive the water 344 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected from the upper third jet head 343 tilting downward will scrape off the water 344 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 The water sprayed on the wafer 1 and driving the water 344 on the wafer 1 is discharged from the through hole 215 to dry the wafer 1.

Referring to FIGS. 7, 8, 18 and 19, the first conveying mechanism 51 then drives the carrying jig 2 into the fourth cleaning section 334. The water 348 sprayed upward by the second spray member 345 below the fourth cleaning section 334 will be sprayed to the wafer 1 through the through hole 215, and the water 348 sprayed downward by the second spray member 345 above will pass through the first opening 230 and The second opening 235 is sprayed to the wafer 1 to perform a fourth cleaning on each wafer 1. The four cleaning mechanisms of the first cleaning area 33 can ensure that the first chemical liquid 325 remaining on each wafer 1 is completely washed and removed, so as to avoid the first chemical liquid 325 remaining on the wafer 1 to be brought to the next station. The deoxidation zone 35 further affects the second chemical solution 355 (see FIG. 20).

The gas ejected from the fourth spray head 346 tilted upwards adjacent to the second spray member 345 is sprayed to the wafer 1 through the through hole 215 and drives the water 348 on the wafer 1 to be discharged from the first opening 230 and the second opening 235 . The gas sprayed by the fourth jet head 346 tilting downwards above the second spraying member 345 will scrape off the water 348 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 are sprayed to the wafer 1 and drive the water 348 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of fourth jet heads 346 away from the second spraying member 345 will also perform a second drying operation on the wafer 1 in the foregoing manner.

On the other hand, the gas ejected by one side jet nozzle 347 along the left jet direction D3 will be jetted to the wafer 1 via the corresponding side flow channel 24, while the gas jetted by the other side jet nozzle 347 along the right jet direction D4 It will be sprayed onto the wafer 1 through the corresponding side flow channel 24, so that the gas can drive the remaining water 348 on the wafer 1 to be discharged through the through hole 215 or the end flow channel 25, so as to perform a third drying operation on the wafer 1. In this way, it can be ensured that the water 348 on each wafer 1 is completely blown off, so as to avoid that the remaining water 348 on the wafer 1 is brought to the deoxidation zone 35 of the next station to affect or dilute the second chemical liquid 355.

Referring to FIGS. 7, 8, 9 and 20, in the deoxidation step S5, the first conveying mechanism 51 drives the carrying jig 2 into the second chemical liquid tank of the chemical reaction section 352 through the partition section 351 of the deoxidation zone 35 Within 354. The carrier jig 2 is completely immersed in the second medical liquid 355 while moving in the second medical liquid tank 354. The second chemical liquid 355 can flow into the wafer 1 in the carrier jig 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the second chemical liquid 355 ejected upward by the lower second chemical liquid spray head 356 flows to the wafer 1 through the through hole 215, and the second chemical liquid 355 ejected downward by the upper second chemical liquid spray head 356 passes through the first An opening 230 and a second opening 235 flow to the wafer 1 so that the second chemical liquid 355 can smoothly flow in the carrier jig 2. In this way, the second chemical solution 355 can fully and surely produce a chemical reaction with each pin 12 of the wafer 1 (see FIG. 6) for deoxidation. After the wafer 1 undergoes the etching step S3, due to the contact between the pins 12 and water and gas, local oxidation may occur. Therefore, the second chemical solution 355 and the pins 12 generate a deoxidation effect, which can The passivation is copper monoxide to form a protective layer to prevent each pin 12 from continuing to oxidize.

Referring to FIGS. 7 and 20, next, the first conveying mechanism 51 conveys the carrying jig 2 to the drying section 353 along the first conveying direction D1 and moves therein. First, the gas ejected from the second spray head 357 tilted upwards adjacent to the chemical reaction section 352 is sprayed to the wafer 1 through the through hole 215 and drives the second chemical liquid 355 on the wafer 1 from the first opening 230 and the second opening The hole 235 is discharged. Subsequently, the gas ejected from the second spray head 357 above the chemical reaction section 352 obliquely and downward will scrape off the second chemical liquid 355 discharged from the first opening 230 and the second opening 235, and at the same time, the gas An opening 230 and a second opening 235 are sprayed onto the wafer 1 and drive the second chemical liquid 355 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of second shower heads 357 away from the chemical reaction section 352 will also perform a second drying operation on the wafer 1 in the foregoing manner.

Referring to FIGS. 7, 8, 9 and 21, on the other hand, the gas emitted by one of the second side nozzles 358 along the left jet direction D3 will be sprayed to the wafer 1 via the corresponding side flow channel 24, while the other The gas ejected from the second side nozzle 358 along the right jet direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can flow the second chemical liquid 355 remaining on the wafer 1 from the through hole 215 or the end flow The lane 25 is discharged to perform the third drying operation on the wafer 1. With this, it is possible to ensure that the second chemical liquid 355 on each wafer 1 is completely blown off.

Referring to FIGS. 7 and 22, in the second cleaning step S6, the first conveying mechanism 51 drives the carrying jig 2 to enter the first cleaning section 361 of the second cleaning area 36 first, and the first water spray below the first cleaning section 361 The water 366 sprayed upward by the head 364 is sprayed to the wafer 1 through the through hole 215, and the water 366 sprayed downward by the upper first spray head 364 is sprayed to the wafer 1 through the first opening 230 and the second opening 235. In order to perform a first cleaning on each wafer 1, the second chemical liquid 355 on each wafer 1 that has been blown dry is washed away. Then, the gas ejected from the downward first jet head 365 obliquely upward will be sprayed to the wafer 1 through the through hole 215 and drive the water 366 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the first jet head 365 tilted downward will scrape off the water 366 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening The hole 235 is sprayed to the wafer 1 and drives the water 366 on the wafer 1 to be discharged from the through hole 215 to dry the wafer 1.

After that, the first conveying mechanism 51 drives the carrying jig 2 into the water tank 367 of the second cleaning section 362. During the movement of the carrying jig 2 in the water tank 367, it is completely immersed in the water 368. The water 368 can flow into the wafer 1 in the carrier jig 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the water 368 sprayed upward by the lower second water spray head 369 flows to the wafer 1 through the through hole 215, and the water 368 sprayed downward by the upper second water spray head 369 passes through the first opening 230 and the second opening The holes 235 flow to the wafer 1 so that the water 368 can smoothly flow in the carrier jig 2 to perform a second cleaning of each wafer 1. Then, the gas ejected by the downward second air jet head 370 tilting upward will be sprayed to the wafer 1 through the through hole 215 and drive the water 368 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected from the upper second jet head 370 tilting downward will scrape off the water 368 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 The water sprayed on the wafer 1 and driving the water 368 on the wafer 1 is discharged through the through hole 215 to dry the wafer 1.

7, 8, 9, 22 and 23, the first conveying mechanism 51 then drives the bearing jig 2 into the third cleaning section 363. The water 374 sprayed upward by the lower spray member 371 of the third cleaning section 363 will be sprayed to the wafer 1 through the through hole 215, and the water 374 sprayed downward by the upper spray member 371 will pass the first opening 230 and the second opening 235 sprays onto the wafer 1 to perform a third cleaning on each wafer 1. The three cleaning mechanisms of the second cleaning area 36 can ensure that the second chemical liquid 355 remaining on each wafer 1 is completely washed and removed, so as to prevent the second chemical liquid 355 remaining on the wafer 1 from being brought to the next station. The removal zone 39 in turn affects the third medical fluid 395 (see FIG. 24).

The gas ejected from the third air jet head 372 adjacent to the spray member 371 obliquely upward will be sprayed to the wafer 1 through the through hole 215 and drive the water 374 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected from the third jet head 372 tilted downwards above the spraying member 371 will scrape off the water 374 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and The second opening 235 is sprayed onto the wafer 1 and drives the water 374 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of third jet heads 372 far from the spray member 371 will also perform a second drying operation on the wafer 1 according to the aforementioned method.

Finally, the gas from one of the side jet nozzles 373 along the left jet direction D3 will be sprayed to the wafer 1 via the corresponding side flow channel 24, while the gas from the other side jet nozzle 373 along the right jet direction D4 will pass through The corresponding side flow channel 24 is sprayed to the wafer 1 so that the gas can drive the remaining water 374 on the wafer 1 to be discharged through the through hole 215 or the end flow channel 25 to perform the third drying operation on the wafer 1. In this way, it can be ensured that the water 374 on each wafer 1 is completely blown off, so as to avoid that the remaining water 374 on the wafer 1 is brought to the removal zone 39 of the next station to affect or dilute the third chemical solution 395.

Referring to FIGS. 10 and 11, the first conveying mechanism 51 will then drive the carrier jig 2 into the inspection area 38. The worker can stop the operation by controlling the first conveying mechanism 51 to take out the carrier jig 2 and inspect each wafer 1 The etching condition of pin 12.

Referring to FIGS. 7, 8, 9 and 24, in the removal step S7, the first conveying mechanism 51 drives the carrying jig 2 into the third chemical liquid tank of the chemical reaction section 392 through the separation section 391 of the removal area 39 Within 394. The carrier jig 2 is completely immersed in the third chemical liquid 395 while moving in the third chemical liquid tank 394. The third chemical solution 395 can flow into the wafer 1 in the carrier jig 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the third chemical liquid 395 ejected upward from the lower third chemical liquid spray head 396 flows to the wafer 1 through the through hole 215, and the third chemical liquid 395 ejected downward from the upper third chemical liquid spray head 396 passes through the first An opening 230 and a second opening 235 flow to the wafer 1 so that the third chemical liquid 395 can smoothly flow in the carrier jig 2. Thereby, the third chemical solution 395 can fully and surely generate a chemical reaction with the metal protective layer 14 of the wafer 1 to remove the metal protective layer 14, that is to say, the removing step S7 is a silver stripping step of stripping the metal protective layer 14 .

Referring to FIG. 7 and FIG. 24, the first conveying mechanism 51 conveys the bearing jig 2 to the drying section 393 along the first conveying direction D1 and moves therein. First, the gas ejected from the third spray head 397 below the chemical reaction section 392 tilting upward will be sprayed to the wafer 1 through the through hole 215 and drive the third chemical liquid 395 on the wafer 1 from the first opening 230 and the second opening The hole 235 is discharged. Subsequently, the gas ejected from the third nozzle 397 above the chemical reaction section 392 obliquely downward will scrape off the third chemical liquid 395 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the An opening 230 and a second opening 235 are sprayed onto the wafer 1 and drive the third chemical solution 395 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of third chemical solutions 395 away from the chemical reaction section 322 will also perform a second drying operation on the wafer 1 in the foregoing manner.

Referring to FIGS. 7, 8, 9 and 25, on the other hand, the gas emitted by one third side nozzle 398 along the left jet direction D3 will be sprayed to the wafer 1 via the corresponding side flow channel 24, while the other The gas ejected from the third side nozzle 398 along the right jet direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can flow the third chemical liquid 395 remaining on the wafer 1 from the through hole 215 or the end flow The lane 25 is discharged to perform the third drying operation on the wafer 1. With this, it is possible to ensure that the third chemical solution 395 on each wafer 1 is completely blown out.

Referring to FIGS. 7 and 26, in the third cleaning step S8, the first conveying mechanism 51 drives the carrying jig 2 to enter the first cleaning section 401 of the third cleaning area 40 first, and the first water spray below the first cleaning section 401 The water 405 sprayed upward by the head 403 is sprayed to the wafer 1 through the through hole 215, and the water 366 sprayed downward by the upper first spray head 403 is sprayed to the wafer 1 through the first opening 230 and the second opening 235, In order to perform the first cleaning on each wafer 1, the third chemical liquid 395 on each wafer 1 that has been blown dry is washed away. Next, the gas jetted downward from the first jet head 404 obliquely upward will be sprayed to the wafer 1 through the through hole 215 and drive the water 405 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper first jet head 404 obliquely downward will scrape off the water 405 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening The hole 235 is sprayed to the wafer 1 and drives the water 405 on the wafer 1 to be discharged through the through hole 215 to dry the wafer 1.

7, 8, 9, 26 and 27, the first conveying mechanism 51 then drives the bearing jig 2 into the second cleaning section 402. The water 409 sprayed upward by the lower spray member 406 of the second cleaning section 402 will be sprayed to the wafer 1 through the through hole 215, and the water 409 sprayed downward by the upper spray member 406 will pass the first opening 230 and the second opening 235 sprays onto the wafer 1 to perform a second cleaning on each wafer 1. The two cleaning mechanisms of the third cleaning area 40 can ensure that the third chemical solution 395 remaining on each wafer 1 is completely washed and removed, so as to prevent the third chemical solution 395 remaining on the wafer 1 from being brought to the next station The neutralization zone 41 in turn affects the fourth medical fluid 415 (see FIG. 28).

The gas ejected obliquely upward by the second air jet head 407 adjacent to the spraying member 406 will be sprayed to the wafer 1 through the through hole 215 and drive the water 409 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas jetted from the second jet head 407 above the spray member 406 at an oblique downward direction will scrape off the water 409 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and The second opening 235 is sprayed to the wafer 1 and drives the water 409 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of second jet heads 407 far from the spraying member 406 will also perform a second drying operation on the wafer 1 according to the aforementioned method.

Finally, the gas from one of the side jet nozzles 408 along the left jet direction D3 will be sprayed to the wafer 1 via the corresponding side flow channel 24, and the gas from the other side jet nozzle 408 along the right jet direction D4 will pass through The corresponding side flow channel 24 is sprayed to the wafer 1 so that the gas can drive the remaining water 374 on the wafer 1 to be discharged through the through hole 215 or the end flow channel 25 to perform the third drying operation on the wafer 1. In this way, it is possible to ensure that the water 409 on each wafer 1 is completely blown off, so as to avoid that the water 409 remaining on the wafer 1 is brought to the neutralization zone 41 of the next station to affect or dilute the fourth chemical solution 415.

Referring to FIG. 7, FIG. 8, FIG. 9 and FIG. 28, in the neutralization step S9, the first conveying mechanism 51 drives the carrying jig 2 into the fourth chemical liquid tank of the chemical reaction section 412 through the partition section 411 of the neutralization zone 41 Within 414. The carrier jig 2 is completely immersed in the fourth medical liquid 415 during the movement in the fourth medical liquid tank 414. The fourth chemical solution 415 can flow into the wafer 1 in the carrier jig 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the fourth chemical liquid 415 ejected upward from the lower fourth chemical liquid spray head 416 flows to the wafer 1 through the through hole 215, and the fourth chemical liquid 415 ejected downward from the upper fourth chemical liquid spray head 416 passes through the first An opening 230 and a second opening 235 flow to the wafer 1 so that the fourth chemical liquid 415 can flow smoothly in the carrier jig 2. Thereby, the fourth chemical solution 415 can fully and surely generate a chemical neutralization reaction with the metal heat conduction layer 13 of the wafer 1 to neutralize and remove the oxide formed on the metal heat conduction layer 13.

Referring to FIGS. 7 and 28, next, the first conveying mechanism 51 conveys the carrying jig 2 to the drying section 413 along the first conveying direction D1 and moves therein. First, the gas ejected obliquely upward from the fourth shower head 417 adjacent to the chemical reaction section 412 will be sprayed to the wafer 1 through the through hole 215 and drive the fourth chemical liquid 415 on the wafer 1 from the first opening 230 and the second opening The hole 235 is discharged. Subsequently, the gas ejected from the fourth nozzle 417 above the adjacent chemical reaction section 412 obliquely downward will scrape off the fourth chemical liquid 415 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the An opening 230 and a second opening 235 are sprayed onto the wafer 1 and drive the fourth chemical solution 415 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of fourth chemical liquids 415 far from the chemical reaction section 412 will also perform a second drying operation on the wafer 1 according to the aforementioned method.

Referring to FIGS. 7, 8, 9 and 29, finally, the gas emitted by one of the fourth side nozzles 418 along the left jet direction D3 will be sprayed to the wafer 1 via the corresponding side flow channel 24, while the other fourth The gas ejected by the side nozzle 418 along the right jet direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can discharge the fourth chemical liquid 415 remaining on the wafer 1 from the through hole 215 or the end flow channel 25 Discharge to perform the third drying operation on the wafer 1. With this, it is possible to ensure that the fourth chemical solution 415 on each wafer 1 is completely blown out.

Referring to FIGS. 7 and 30, in the fourth cleaning step S10, the first conveying mechanism 51 drives the carrying jig 2 to enter the first cleaning section 421 of the fourth cleaning area 42 first, and the first water spray below the first cleaning section 421 The water 426 sprayed upward by the head 424 is sprayed to the wafer 1 through the through hole 215, and the water 426 sprayed downward by the upper first water spray head 424 is sprayed to the wafer 1 through the first opening 230 and the second opening 235. In order to perform the first cleaning on each wafer 1, the fourth chemical liquid 415 on each wafer 1 that has been blown dry is washed away. Then, the gas jetted downward from the first gas jet head 425 upwardly is sprayed to the wafer 1 through the through hole 215 and drives the water 426 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas jetted from the upper first jet head 425 obliquely downward will scrape off the water 426 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening The hole 235 is sprayed to the wafer 1 and drives the water 426 on the wafer 1 to be discharged from the through hole 215 to dry the wafer 1.

After that, the first conveying mechanism 51 drives the carrying jig 2 into the water tank 427 of the second cleaning section 422. During the movement of the carrying jig 2 in the water tank 427, it is completely immersed in the water 428. The water 428 can flow into the wafer 1 in the carrier jig 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the water 428 sprayed upward by the lower second water spray head 429 flows to the wafer 1 through the through hole 215, and the water 428 sprayed downward by the upper second water spray head 429 passes the first opening 230 and the second opening The hole 235 flows to the wafer 1 so that the water 428 can smoothly flow in the carrier jig 2 to perform a second cleaning of each wafer 1. Then, the gas jetted downward from the second jet head 430 tilted upwards will be sprayed to the wafer 1 through the through hole 215 and drive the water 428 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected from the upper second jet head 430 tilting downward will scrape off the water 428 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 The water sprayed on the wafer 1 and driving the water 428 on the wafer 1 is discharged through the through hole 215 to dry the wafer 1.

Referring to FIGS. 7, 8, 30 and 31, the first conveying mechanism 51 then drives the bearing jig 2 into the third cleaning section 423. The water 434 sprayed upward by the lower spray member 431 of the third cleaning section 423 will be sprayed to the wafer 1 through the through hole 215, and the water 434 sprayed downward by the upper spray member 431 will pass the first opening 230 and the second opening 235 sprays onto the wafer 1 to perform a third cleaning on each wafer 1. The three cleaning mechanisms of the fourth cleaning area 42 can ensure that the fourth chemical liquid 415 remaining on each wafer 1 is completely washed and removed.

The gas ejected obliquely upward by the third jet head 432 adjacent to the spraying member 431 will be sprayed to the wafer 1 through the through hole 215 and drive the water 434 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected from the third jet head 432 above the spraying member 431 at an oblique downward direction will scrape off the water 434 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and The second opening 235 is sprayed to the wafer 1 and drives the water 434 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. Similarly, another pair of third jet heads 432 far from the spraying member 431 will also perform a second drying operation on the wafer 1 in the foregoing manner.

Finally, the gas from one of the side jet nozzles 433 along the left jet direction D3 will be sprayed to the wafer 1 via the corresponding side flow channel 24, while the gas from the other side jet nozzle 433 along the right jet direction D4 will pass through The corresponding side flow channel 24 is sprayed to the wafer 1 so that the gas can drive the remaining water 434 on the wafer 1 to be discharged through the through hole 215 or the end flow channel 25 to perform the third drying operation on the wafer 1. By this, it is possible to ensure that the water 434 on each wafer 1 is completely blown off.

Referring to FIGS. 7 and 32, in the drying step S11, the first conveying mechanism 51 drives the carrier jig 2 to enter the drying section 441 of the drying area 44 first, and the first blower 443 located below the gas ejected upward It will be sprayed to the wafer 1 through the through hole 215, and the gas blown downward by each first blowing member 443 located above will be sprayed to the wafer 1 through the first opening 230 and the second opening 235. Since the temperature of the compressed air blown by the first blowing member 443 is, for example, equal to or lower than 60°C, each wafer 1 can be dried first.

The first conveying mechanism 51 then drives the carrying jig 2 into the drying section 442, and the gas blown upward by each second blowing member 444 located below will be sprayed to the wafer 1 through the through hole 215, while each located above The gas blown down by the second blowing member 444 is sprayed to the wafer 1 through the first opening 230 and the second opening 235. Since the temperature of the compressed air blown out by the second blowing member 444 is, for example, between 85°C and 90°C, each wafer 1 can be dried first.

Referring to FIGS. 37 and 38, in the transfer step S12, the first conveying mechanism 51 drives the carrying jig 2 to discharge through the discharge rear end 512 and enters the first conveying unit 611 of the temporary storage mechanism 61. Subsequently, the first The first conveying wheel 613 of the conveying unit 611 conveys the jig 2 to the second conveying unit 621 of the traverse mechanism 62 in the first conveying direction D1. Next, the second driving assembly 626 drives the second conveying unit 621 to move from the first position shown in FIG. 38 to the second position shown in FIG. 39 through the slider 625 (see FIG. 35), so that the second conveying unit 621 is aligned Second delivery mechanism 52.

Referring to FIG. 34 and FIG. 37, it should be noted that if the traverse mechanism 62 fails and cannot be operated, the first conveying wheel 613 of the first conveying unit 611 will not move along the first conveying direction D1 carrying the jig 2 . At this time, the first driving assembly 617 of the lifting unit 612 drives the sliding frame 615 to move upward in the vertical direction Z for a distance, so that the pair of supporting rods 616 can move the supporting jig 2 located on the first conveying wheel 613 upward Lifted and moved away from the first conveying wheel 613. Thereby, in order to allow the next carrying jig 2 discharged from the discharging rear end 512 to move to the first conveying unit 611, the other pair of supporting rods 616 can be positioned on the first conveying wheel 613 in the foregoing manner The upper loading jig 2 is lifted up and moved away from the first conveying wheel 613. In this way, the effect of temporarily storing the bearing fixture 2 can be achieved. After the traverse mechanism 62 is repaired, the first driving assembly 617 of the lifting unit 612 drives the sliding frame 615 to move down a distance in the up-down direction Z, so that the pair of supporting rods 616 can place the supported supporting jig 2 back On the first conveying wheel 613. Then, the first conveying wheel 613 can convey the carrying jig 2 to the second conveying unit 621.

Referring to FIGS. 10 and 38, in the reflow step S13, the second conveying wheel 623 of the second conveying unit 621 in the second position will move the carrying jig 2 along the second conveying direction D2, so that the carrying jig 2 passes through The material rear end 521 is fed to the second conveying mechanism 52. Then, the second conveying mechanism 52 can move the carrying jig 2 in the second conveying direction D2, so that the carrying jig 2 is discharged through the discharge front end 522. In this way, the front end 301 of the machine body 3 can simultaneously handle the feeding and discharging operations of the carrying jig 2, which can save the number of workers and the labor cost.

Referring to FIGS. 2 and 11, in another embodiment of this embodiment, if each wafer 1 does not have the metal protection layer 14, the removal step S7 and the Three cleaning steps S8, neutralization step S9 and fourth cleaning step S10, that is, the removal area 39, a third cleaning area 40, a neutralization area 41 and the fourth cleaning area 42 of the wet processing equipment 300 are stopped . That is, the wet processing apparatus 300 can selectively perform or stop the removal step S7 (ie, the silver stripping step), the third cleaning step S8, the neutralization step S9, and the fourth cleaning step S10 according to the form of the wafer 1, so that the wet The processing device 300 is very flexible in use to meet the needs of users.

20 and 22, in another embodiment of this embodiment, as the characteristics of the second chemical liquid 355 used in the deoxidation zone 35 are different, the second cleaning step S6 can be omitted in the foregoing process, That is, the second cleaning area 36 does not need to be opened. As a result, the wet processing device 300 can flexibly adjust and control whether to use the second cleaning zone 36 according to the characteristics of the second chemical liquid 355 used in the deoxidation zone 35. The foregoing operation mode does not affect the etching step S3 and the first cleaning step S4, so that the wet processing apparatus 300 can still reliably perform the micro-etching operation on the wafer 1.

Referring to FIG. 7, the design of the wet processing equipment 300 with a dedicated carrier fixture 2 (referred to as Boat or Carrier) enables the chip 1 to selectively place the first surface 111 downward for each carrier piece 223 to carry, or Place the second surface 112 downward for each carrying piece 223 to carry. Thereby, the flexibility in use can be improved to meet the needs in use, and the quality of the processing wafer 1 can be improved.

In summary, the wet processing equipment 300 of the present embodiment can fully and surely contact the pins 12 of the wafer 1 or the wafer 1 due to sawing with the first chemical solution 325 in the etching area 32 The metal wire produces a chemical reaction and etches each pin 12 or wire so that the distance between two adjacent pins 12 can be increased to a predetermined length, or the wire is removed to prevent the wafer 1 from In the subsequent use, due to the factors of thermal expansion and contraction, the metal wire is in contact with another adjacent pin 12 or two adjacent pins 12 are in contact with each other, resulting in a short circuit situation, so it can indeed achieve the purpose of the invention .

However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. Any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still classified as This invention covers the patent.

1: Chip 11: Insulating package 111: First side 112: Second side 113: Side 12: Pin 13: Metal heat conduction layer 14: Metal protective layer 2: Carrier fixture 21: Carrier plate 211: Disc body 212: Carrier unit 213: bump unit 214: pad unit 215: through hole 216: positioning hole 217: protrusion arm 218: bump 219: pad 220: groove 221: long face 222: short face 223: carrier piece 23 : Cover plate 230: first opening 231: plate body 232: positioning column 233: opening unit 234: perforation 235: second opening 236: stop frame 237: stop end 24: side flow channel 25: end Flow channel 300: Wet processing equipment 3: Machine body 301: Front end 302: Rear end 31: Wetting zone 310: Water 311: Feeding section 312: Wetting section 313: Drying section 314: Spraying piece 315: Jet head 316: Side Jet nozzle 32: Etching area 321: Separation section 322: Chemical reaction section 323: Blow-drying section 324: First chemical solution tank 325: First chemical solution 326: First chemical solution nozzle 327: First nozzle 328: First side Nozzle 33: first cleaning zone 331: first cleaning section 332: second cleaning section 333: third cleaning section 334: fourth cleaning section 335: first water spray head 336: first spray head 337: water 338: water tank 339 : Water 340: Second sprinkler 341: Second jet 342: First spray 343: Third jet 344: Water 345: Second spray 346: Fourth jet 347: Side jet 348: Water 35 : Deoxidation zone 351: Separation section 352: Chemical reaction section 353: Drying section 354: Second chemical liquid tank 355: Second chemical liquid 356: Second chemical liquid spray head 357: Second spray head 358: Second side nozzle 36 : Second cleaning zone 361: First cleaning section 362: Second cleaning section 363: Third cleaning section 364: First spray head 365: First jet head 366: Water 367: Water tank 368: Water 369: Second spray head 370: Second jet head 371: Spray piece 372: Third jet head 373: Side jet nozzle 374: Water 38: Inspection area 39: Removal area 391: Separation section 392: Chemical reaction section 393: Drying section 394: No. Three chemical liquid tank 395: third chemical liquid 396: third chemical liquid spray head 397: third spray head 398: third side nozzle 40: third cleaning area 401: first cleaning section 402: second cleaning section 403: first Sprinkler head 404: First jet head 405: Water 406: Spray piece 407: Second jet head 408: Side jet nozzle 409: Water 41: Neutral zone 411: Separation section 412: Chemical reaction section 413: Drying section 414: Fourth chemical liquid tank 415: Fourth chemical liquid 416: Fourth chemical liquid spray head 417: Fourth spray head 418: Fourth side nozzle 42: Fourth cleaning area 421: First cleaning section 422: Second cleaning section 423: No. Third cleaning section 424: The first water spray head 425: First jet head 426: water 427: sink 428: water 429: second jet head 430: second jet head 431: spraying piece 432: third jet head 433: side jet nozzle 434: water 44: drying zone 441: blowing Drying section 442: Drying section 443: First blowing piece 444: Second blowing piece 45: Return area 5: Conveying device 51: First conveying mechanism 511: Feeding front end 512: Discharging rear end 513: Lower conveying roller 514 : Upper conveyor roller 515: Solid roller 516: Liquid cutting roller 52: Second conveyor mechanism 521: Feeding rear end 522: Discharging front end 6: Transfer device 61: Temporary storage mechanism 611: First conveying unit 612: Lifting unit 613: First conveyor wheel 614: Guide rod 615: Slide frame 616: Support rod 617: First drive assembly 62: Traverse mechanism 621: Second conveyor unit 622: Traverse unit 623: Second conveyor wheel 624: Guide rail 625: Slider 626: Second drive assembly S1: Conveying step S2: Wetting step S3: Etching step S4: First cleaning step S5: Deoxidation step S6: Second cleaning step S7: Removal step S8: Third Cleaning step S9: Neutralization step S10: Fourth cleaning step S11: Drying step S12: Transfer step S13: Reflow step D1: First conveying direction D2: Second conveying direction D3: Left jetting direction D4: Right jetting direction X: Front and back direction Y: left and right direction Z: up and down direction

Other features and functions of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is a bottom view of a wafer to be processed by an embodiment of the wet processing equipment of the present invention; FIG. 2 is a side view of the wafer; FIG. 3 is a top view of a carrier tray of a carrier jig for supporting the wafer; FIG. 4 is a top view of a cover plate of the carrier jig; FIG. 5 is the carrier An incomplete three-dimensional exploded view of the jig; FIG. 6 is an incomplete top view of the carrier jig, illustrating that the chip is assembled on the carrier tray; FIG. 7 is an incomplete cross-sectional view of the carrier jig, illustrating the chip assembly In the bearing jig; Figure 8 is an incomplete side view of the bearing jig; Figure 9 is an incomplete side view of the bearing jig; Figure 10 is a top view of the embodiment, illustrating The configuration relationship between a machine body, a conveying device, and a transfer device; FIG. 11 is a side view of the embodiment; FIG. 12 is a side view of a wet area of the embodiment; FIG. 13 is the embodiment FIG. 14 is a schematic side view of a wet section of the wet area of the embodiment; FIG. 14 is a schematic side view of a dry section of the wet area of the embodiment; FIG. 15 is a side view of an etching area of the embodiment; 16 is a schematic side view of a chemical reaction section of the etching zone of the embodiment; FIG. 17 is a schematic side view of a drying section of the etching zone of the embodiment; FIG. 18 is a first cleaning of the embodiment A side view of the zone; FIG. 19 is a schematic side view of a fourth cleaning section of the first cleaning zone of the embodiment; FIG. 20 is a side view of a deoxidation zone of the embodiment; FIG. 21 is the implementation An example of a side view of a drying section of the deoxidation zone; FIG. 22 is a side view of a second cleaning zone of the embodiment; FIG. 23 is a third cleaning zone of the second cleaning zone of the embodiment Fig. 24 is a side view of a removal area of the embodiment; Fig. 25 is a side view of a drying section of the removal area of the embodiment; Fig. 26 is a view of the embodiment A side view of a third cleaning area; FIG. 27 is a schematic side view of a second cleaning section of the third cleaning area of the embodiment; FIG. 28 is a side view of a neutralization area of the embodiment; 29 is a schematic side view of a drying section of the neutralization zone of the embodiment; FIG. 30 is a side view of a fourth cleaning zone of the embodiment; FIG. 31 is a side view of the fourth cleaning zone of the embodiment A schematic side view of the third cleaning section; FIG. 32 is a side view of a drying area of the embodiment; FIG. 33 is a perspective view of a transfer device of the embodiment; FIG. 34 is a transfer of the embodiment A side view of the device; FIG. 35 is an incomplete top view of the embodiment; FIG. 36 is a step flow chart of the processing method of the embodiment; FIG. 37 is an incomplete top view of the embodiment, illustrating a second conveyance The unit is in a first position; and FIG. 38 is an incomplete top view of the embodiment, illustrating the second conveying unit In a second position.

2: Bearing fixture

300: Wet processing equipment

3: body

301: front end

302: backend

31: Wet area

32: Etching area

33: The first cleaning area

35: Deoxidation zone

36: Second cleaning area

38: Inspection area

39: Remove area

40: Third cleaning area

41: Zhonghe District

42: Fourth cleaning area

44: Dry area

45: reflux area

5: Conveying device

51: The first conveying mechanism

511: feeding front

512: Discharging back end

52: Second conveying mechanism

521: Feeding back end

522: Discharging front end

6: Transfer device

D1: First conveying direction

D2: Second conveying direction

X: front and back direction

Y: left and right direction

Claims (27)

A wet processing device suitable for processing a plurality of wafers carried by a carrier jig. The wet processing device includes: a conveying device that can convey the carrier jig along a first conveying direction; an etching The area has a first chemical solution for immersing the carrying jig transported by the conveying device to etch a plurality of pins of each wafer; a first cleaning area located downstream of the etching area for cleaning via the The wafers on the carrier jig output by the etching zone; a deoxidation zone, located on the downstream side of the first cleaning zone, and having a carrier jig for the conveying device to immerse the wafer The pins generate a second chemical solution for deoxidation reaction; and a second cleaning zone, located on the downstream side of the deoxidation zone, is used to clean the wafers on the carrier jig output through the deoxidation zone. The wet processing apparatus according to claim 1, wherein the etching zone forms a first chemical solution tank for the carrying jig to pass through and contains the first chemical solution, the etching zone includes Two first spray heads and two first side nozzles on the downstream side of the first chemical liquid tank, the two first spray heads are spaced apart in an up-and-down direction perpendicular to the first conveying direction The wafers are jetted to remove the first chemical solution, and the two first side nozzles are spaced apart in a left-right direction perpendicular to the up-down direction, for laterally jetting the wafers on the carrying jig to remove The first liquid medicine. The wet processing apparatus according to claim 2, wherein the etching zone further includes a plurality of first chemical liquid spray heads disposed in the first chemical liquid tank, and a portion of the first chemical liquid spray heads face upward The wafers spray the first chemical liquid in the form of a water jet, and the other part sprays the first chemical liquid in the form of a water jet downward to the wafers. One of the two first side nozzles is directed in a left jet direction The wafers are jetted, and the other one is jetting the wafers in a right jet direction opposite to the left jet direction. The wet processing apparatus according to claim 1, wherein the first cleaning section includes a first cleaning section and a second cleaning section located downstream of the first cleaning section, the first cleaning section includes two A first water jet head spaced apart in an up and down direction perpendicular to the first conveying direction, and two first air jet heads spaced apart in the up and down direction and located on the downstream side of the two first water jet heads, the two first water jets The head is used to spray water in the form of a waterjet on the wafers, the first jet head is used to jet the wafers to remove the water, the second cleaning section forms a water tank, and the water tank is accommodated to clean the wafers For the water of the wafer, the second cleaning section includes two second water jet heads spaced apart in the up-down direction, and two second air jet heads spaced apart in the up-down direction and located on the downstream side of the two second water jet heads, The two second water jet heads are used to spray the water in the form of a waterjet on the wafers, and the two second air jet heads are used to spray the wafers to remove the water. The wet processing equipment according to claim 4, wherein the first cleaning zone further includes a third cleaning section located downstream of the second cleaning section, the third cleaning section includes a plurality of pairs along the first conveying direction A first spraying member arranged at intervals, and two third spray heads spaced apart in the up-down direction and located on the downstream side of the first spraying members, each pair of two first spraying members are arranged in the up-down direction The space is used to spray the water on the wafers, and the two third jet heads are used to spray the wafers to remove the water. The wet processing apparatus according to claim 5, wherein the first cleaning zone includes a fourth cleaning section located downstream of the third cleaning section, and the fourth cleaning section includes a plurality of pairs of phases along the first conveying direction A second spraying member arranged at intervals, two fourth spray heads spaced apart in the up-down direction and located on the downstream side of the second spraying members, and two side spray nozzles on the downstream side of the second spraying members, each A pair of two second spraying members are spaced along the up-down direction to spray the water on the wafers, the two fourth spray heads are used to spray the wafers to remove the water, and the two side spray nozzles A left and right direction perpendicular to the up and down direction is spaced to jet the wafers on the carrying jig transported by the first transport mechanism laterally to remove the water, one of the jet nozzles on both sides is The wafers are jetted in a left jet direction, and the other is jetted in a right jet direction opposite to the left jet direction. The wet processing equipment according to claim 2, wherein the deoxidation zone forms a second chemical solution tank for the carrying jig to pass through and contains the second chemical solution, the deoxidation zone includes Two second spray heads and two second side nozzles located on the downstream side of the second chemical liquid tank, the two second spray heads are spaced apart along the up-down direction to spray the wafers to remove the second chemical liquid, The two second-side nozzles are spaced apart in the left-right direction to spray the wafers laterally to remove the second chemical liquid. The wet processing apparatus according to claim 7, wherein the deoxidation zone further includes a plurality of second chemical liquid spray heads disposed in the second chemical liquid tank, and a part of the second chemical liquid spray heads face upward The second chemical liquid in the form of a water jet is sprayed onto the wafers, while the second chemical liquid in the form of a water jet is sprayed down on the wafers, and one of the two second side nozzles is in a left jet direction Jet the wafers, and the other one is jetting the wafers in a right jet direction opposite to the left jet direction. The wet processing apparatus according to claim 1, wherein the second cleaning zone includes a first cleaning section and a second cleaning section located downstream of the first cleaning section, the first cleaning section includes two A first water jet head spaced along an up-down direction perpendicular to the first conveying direction, and two first air jet heads spaced along the up-down direction and located on the downstream side of the two first water jet heads, the two first The water spray head is used to spray water in the form of a waterjet on the wafers, the first air spray head is used to spray the wafers to remove the water, the second cleaning section forms a water tank, and the water tank is accommodated to clean the water Waiting for the water of the wafer, the second cleaning section includes two second water jet heads spaced apart in the up-down direction, and two second air jet heads spaced apart in the up-down direction and located on the downstream side of the two second water jet heads The two second water jet heads are used to jet the water in the form of a waterjet on the wafers, and the two second air jet heads are used to jet the wafers to remove the water. The wet processing equipment according to claim 9, wherein the second cleaning zone further includes a third cleaning section located downstream of the second cleaning section, the third cleaning section includes a plurality of pairs along the first conveying direction Sprinklers arranged in intervals, two third jet heads spaced apart in the up-down direction and located on the downstream side of the sprinklers, and two side jet nozzles spaced in the up-down direction and located on the downstream side of the sprinklers , The two spraying members of each pair are spaced apart along the up and down direction to spray the water on the wafers, the two third jetting heads are used to spray the wafers to remove the water, and the jet nozzles on both sides Spaced apart in a left-right direction perpendicular to the up-down direction, for laterally jetting the wafers on the carrying jig transported by the first transport mechanism to remove the water, one of the jet nozzles on both sides The wafers are jetted in a left jet direction, and the other jets are jetted in a right jet direction opposite to the left jet direction. The wet processing apparatus according to claim 7, wherein each of the wafers has a metal thermal conductive layer, and a metal protective layer formed on the metal thermal conductive layer, the wet processing apparatus further includes a second cleaning area A removal zone on the downstream side, and a third cleaning zone on the downstream side of the removal zone, the removal zone forming a third chemical liquid tank for the carrying jig to pass through, the third chemical liquid tank A third chemical solution for immersing the wafers to remove the metal protective layer of each wafer is accommodated, and the removal area includes two third nozzles and two third nozzles on the downstream side of the third chemical solution tank Side nozzles, the two third nozzles are spaced apart along the up-down direction to jet the wafers to remove the third chemical liquid, and the two third side nozzles are spaced apart along the left-right direction to laterally target the wafers Air jet is used to remove the third chemical liquid, and the third cleaning zone is used to clean the wafers on the carrier jig output through the removal zone. The wet processing apparatus according to claim 11, wherein the removal area further includes a plurality of third chemical liquid spray heads disposed in the third chemical liquid tank, and a portion of the third chemical liquid spray heads face upward The third chemical liquid in the form of a water jet is sprayed onto the wafers, and the third chemical liquid in the form of a water jet is sprayed down on the wafers, and one of the two third side nozzles is in a left jet direction Jet the wafers, and the other one is jetting the wafers in a right jet direction opposite to the left jet direction. The wet processing equipment according to claim 11, wherein the third cleaning zone includes a first cleaning section and a second cleaning section located downstream of the first cleaning section, the first cleaning section includes two A first water jet head spaced apart in the up-down direction, and two first gas jet heads spaced apart in the up-down direction and located on the downstream side of the two first water jet heads, the two first water jet heads are used to eject the wafers Water in the form of a waterjet, the first jetting head is used to jet the wafers to remove the water, the second cleaning section includes a plurality of pairs of spraying elements spaced apart along the first conveying direction, two along the top and bottom A second jet head spaced apart in the direction and located on the downstream side of the spray elements, and two side jet nozzles spaced in the up and down direction and located on the downstream side of the spray elements, each of the pair of two spray elements along the The upper and lower directions are spaced apart to spray the water on the wafers, the two second jet heads are used to spray the wafers to remove the water, and the two jet nozzles are spaced along the left and right directions to The wafers on the carrying jig conveyed by a conveying mechanism are laterally jetted to remove the water, one of the two jet nozzles jets the wafers in a left jet direction, and the other A right jet direction opposite to the left jet direction jets the wafers. The wet processing apparatus according to claim 11, further comprising a neutralization zone located on the downstream side of the third cleaning zone, and a fourth cleaning zone located on the downstream side of the neutralization zone, the neutralization zone forming a function A fourth chemical solution tank for the carrying jig to pass through, the fourth chemical solution tank accommodating the first for immersing the wafers to neutralize and remove oxides formed on the metal thermal conductive layer of each wafer Four chemical liquids, the neutralization zone includes two fourth spray heads and two fourth side nozzles located on the downstream side of the fourth chemical liquid tank, the two fourth spray heads are spaced apart in the up and down direction to spray the wafers To remove the fourth chemical liquid, the two fourth side nozzles are spaced apart along the left-right direction to jet the wafers laterally to remove the fourth chemical liquid, and the fourth cleaning area is used to clean the medium And the wafers on the carrying jig output by the zone. The wet processing apparatus according to claim 14, wherein the neutralization zone further includes a plurality of fourth chemical liquid spray heads disposed in the fourth chemical liquid tank, and a part of the fourth chemical liquid spray heads face upward The fourth chemical liquid in the form of a water jet is sprayed onto the wafers, and the fourth chemical liquid in the form of a water jet is sprayed down on the wafers, and one of the two fourth side nozzles is in a left jet direction Jet the wafers, and the other one is jetting the wafers in a right jet direction opposite to the left jet direction. The wet processing apparatus according to claim 14, wherein the fourth cleaning zone includes a first cleaning section and a second cleaning section located downstream of the first cleaning section, the first cleaning section includes two A first water jet head spaced apart in the up-down direction, and two first gas jet heads spaced apart in the up-down direction and located on the downstream side of the two first water jet heads, the two first water jet heads are used to eject the wafers Water in the form of a waterjet, the first jet head is used to jet the wafers to remove the water, the second cleaning section forms a water tank, the water tank accommodates the water used to clean the wafers, the second The cleaning section includes two second spray heads spaced apart in the up-down direction, and two second spray heads spaced apart in the up-down direction and located on the downstream side of the two second spray heads. The wafers are sprayed with the water in the form of a waterjet, and the two second jet heads are used to spray the wafers to remove the water. The wet processing equipment according to claim 16, wherein the fourth cleaning zone further includes a third cleaning section located downstream of the second cleaning section, the third cleaning section includes a plurality of pairs along the first conveying direction Sprinklers arranged in intervals, two third jet heads spaced apart in the up-down direction and located on the downstream side of the sprinklers, and two side jet nozzles spaced in the up-down direction and located on the downstream side of the sprinklers , The two spraying members of each pair are spaced apart along the up and down direction to spray the water on the wafers, the two third jetting heads are used to spray the wafers to remove the water, and the jet nozzles on both sides Spaced apart in the left-right direction for jetting the wafers on the carrying jig transported by the first transport mechanism laterally to remove the water, one of the jet nozzles on both sides is along a left jet direction Jet the wafers, and the other one is jetting the wafers in a right jet direction opposite to the left jet direction. The wet processing equipment according to claim 14, further comprising a wetting zone located on the upstream side of the etching zone, and a drying zone located on the downstream side of the fourth cleaning zone, the wetting zone is used to wet the conveying device The wafers on the carrier jig, the drying zone dries the wafers by blowing hot air. The wet processing equipment according to claim 1, further comprising a wetting zone located on the upstream side of the etching zone, and a drying zone located on the downstream side of the second cleaning zone, the wetting zone for wetting the conveying device The wafers on the carrier jig, the drying zone dries the wafers by blowing hot air. The wet processing apparatus according to claim 18 or 19, wherein the conveying device includes a first conveying mechanism and a second conveying mechanism spaced apart from the first conveying mechanism in the left-right direction, the first conveying The mechanism can move the carrying jig along the first conveying direction, and has a feeding front end located in the wetting area and a discharging rear end located in the drying area. The second conveying mechanism can move along a direction opposite to the The second conveying direction of the first conveying direction conveys the carrying jig to move, and has a feeding rear end adjacent to the discharging rear end, and a discharging front end adjacent to the feeding front end, the wet processing equipment further includes A transfer device, the transfer device includes a temporary storage mechanism located on the downstream side of the drying area, and a lateral movement mechanism located on the downstream side of the temporary storage mechanism, the temporary storage mechanism includes a first conveying unit, and a lifting Unit, the first conveying unit corresponds to the discharge rear end for receiving the bearing jig output by the discharge rear end, the lifting unit includes a plurality of pairs of support rods arranged at intervals in the up-down direction, each The pair of supporting rods can be raised and lowered in the up and down direction and used to support the bearing jig on the first conveying unit. The traverse mechanism includes a second conveying unit and a traverse unit. The traverse unit is used To drive the second conveying unit to move between a first position aligned with the first conveying unit along the left-right direction and a second position aligned with the rear end of the feed, when the second conveying unit is in the first position At a position, the second conveying unit can receive the bearing jig output by the first conveying unit, and when the second conveying unit is at the second position, the second conveying unit can treat the bearing The tool is transported to the second transport mechanism. The wet processing apparatus according to claim 1, further comprising a wetting zone located on the upstream side of the etching zone, the wetting zone includes a plurality of pairs of spraying elements spaced apart along the first conveying direction, and two along the up and down direction The jet heads that are spaced apart and located on the downstream side of the spray members, and two side jet nozzles that are spaced apart and located on the downstream side of the spray members, and the two spray members of each pair are opposed in the up and down direction The interval is used for spraying the water on the wafers, the two jet heads are used to spray the wafers to remove the water, and the two jet nozzles are used on the carrying jig conveyed by the first conveying mechanism The wafers are jetted sideways to remove the water, one of the two jet nozzles jets the wafers in a left jet direction, and the other jets are jetted in a right jet direction opposite to the left jet direction The wafers are jetted. A processing method suitable for processing a plurality of wafers carried by a carrier jig. The processing method includes the following steps: conveying the carrier jig movement along a first conveying direction through a conveying device; through an etching area The first chemical solution is used to etch a plurality of pins of each wafer moving along the first conveying direction; through a first cleaning area, the wafers output from the etching area along the first conveying direction are processed Cleaning; through a deoxidation zone, a second chemical solution is used to deoxidize the pins of the wafer moving along the first conveying direction; and through a second cleaning zone pair along the first conveying direction The wafers output from the deoxidation zone are cleaned. The processing method according to claim 22, further comprising a drying step after cleaning the wafers in the second cleaning zone, and drying the wafers by blowing hot air through a drying zone. The processing method according to claim 23, further comprising a removal step after cleaning the wafers in the second cleaning zone and before the drying step, through a removal zone with a third chemical solution along the first A metal protective layer of each wafer output from the second cleaning area in the transport direction generates a chemical reaction to remove the metal protective layer. The processing method further includes a cleaning step after the removing step and before the drying step , Cleaning the wafers output from the removal area along the first conveying direction through a third cleaning area. The processing method according to claim 24, further comprising a neutralization step located after the cleaning step and before the drying step, passing a neutralization zone with a fourth chemical solution pair along the first conveying direction from the first A metal thermal conductive layer of each of the wafers output from the three cleaning zones generates a chemical reaction to neutralize and remove oxides formed on the metal protective layer. The processing method further includes a process located after the neutralization step and before the drying step In the cleaning step, the wafers output from the neutralization zone along the first conveying direction are cleaned through a fourth cleaning zone. The processing method of the wet processing equipment according to claim 23, wherein the conveying device conveys the carrying jig along the first conveying direction through a first conveying mechanism, and further includes a transfer after the drying step Step, and a reflow step after the transfer step. In the transfer step, the carrying jig is transferred to a second conveying mechanism of the conveying device through a transfer device. In the reflow step, through The second conveying mechanism conveys the carrying jig in a second conveying direction opposite to the first conveying direction. The processing method of the wet processing device according to claim 22, further includes a wetting step before etching the pins in the etching area, and wetting the wafers through a wetting area.

Images