CN111048436A - Wet processing apparatus and processing method - Google Patents
Wet processing apparatus and processing method Download PDFInfo
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- CN111048436A CN111048436A CN201811345994.5A CN201811345994A CN111048436A CN 111048436 A CN111048436 A CN 111048436A CN 201811345994 A CN201811345994 A CN 201811345994A CN 111048436 A CN111048436 A CN 111048436A
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- 238000012545 processing Methods 0.000 title claims abstract description 75
- 238000003672 processing method Methods 0.000 title claims description 21
- 238000004140 cleaning Methods 0.000 claims abstract description 315
- 239000007788 liquid Substances 0.000 claims abstract description 149
- 239000003814 drug Substances 0.000 claims abstract description 89
- 238000006243 chemical reaction Methods 0.000 claims abstract description 53
- 238000005530 etching Methods 0.000 claims abstract description 50
- 238000002791 soaking Methods 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 349
- 238000005507 spraying Methods 0.000 claims description 220
- 239000007921 spray Substances 0.000 claims description 179
- 239000000126 substance Substances 0.000 claims description 141
- 230000007246 mechanism Effects 0.000 claims description 127
- 239000000243 solution Substances 0.000 claims description 73
- 238000001035 drying Methods 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 53
- 238000007664 blowing Methods 0.000 claims description 31
- 239000010410 layer Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 30
- 238000006386 neutralization reaction Methods 0.000 claims description 30
- 238000009736 wetting Methods 0.000 claims description 28
- 238000002347 injection Methods 0.000 claims description 25
- 239000007924 injection Substances 0.000 claims description 25
- 238000007599 discharging Methods 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 7
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 238000010992 reflux Methods 0.000 claims description 4
- 238000005406 washing Methods 0.000 claims 9
- 238000010981 drying operation Methods 0.000 description 27
- 238000011068 loading method Methods 0.000 description 11
- 238000007689 inspection Methods 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- 230000003472 neutralizing effect Effects 0.000 description 8
- 239000012530 fluid Substances 0.000 description 7
- 238000000861 blow drying Methods 0.000 description 6
- 238000002161 passivation Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 239000013043 chemical agent Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
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- 238000013508 migration Methods 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
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- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The wet processing equipment is suitable for processing a plurality of chips carried by a carrying jig, and comprises a conveying device, an etching area, a first cleaning area, a deoxidation area and a second cleaning area. The conveying device can convey the bearing jig to move. The etching area is provided with a first liquid medicine for the bearing fixture conveyed by the conveying device to soak so as to etch the pins of the chip. The first cleaning area is positioned at the downstream side of the etching area and used for cleaning the chip on the bearing fixture output by the etching area. The deoxidation area is positioned at the downstream side of the first cleaning area and is provided with a second liquid medicine used for soaking the bearing jig conveyed by the conveying device so as to generate deoxidation reaction on the pins of the chips. The second cleaning area is positioned at the downstream side of the deoxidation area and is used for cleaning the chip on the bearing fixture output by the deoxidation area.
Description
Technical Field
The present invention relates to a wet processing apparatus, and more particularly, to a wet processing apparatus and a wet processing method for wet chemical processing of a packaged chip.
Background
In the conventional material sheet packaged in a quad flat non-leaded package (QFN) manner, a cutting machine is required to saw the material sheet so as to distinguish a plurality of chips. When a sawing blade of the cutting machine is used for sawing an insulating packaging body of a material sheet, the metal pins on the side edge of each chip are easily partially molten due to high temperature generated during sawing, so that the sawing blade can easily pull the molten metal to move to form a filiform metal wire during moving.
Wherein a short circuit of the chip is caused when the wire is directly connected between two adjacent pins. When the metal wire is pulled out from one pin but is separated from the other adjacent pin, or the molten metal is not pulled into the metal wire, the chip is not short-circuited. Although the two situations do not cause the chip short circuit immediately, under the influence of the use environment of the chip expanding with heat and contracting with cold for a long time, the metal wire or the pin has a migration (migration) phenomenon, which easily causes the metal wire to contact with another adjacent pin or two adjacent pins to contact with each other, thereby causing the chip short circuit.
Disclosure of Invention
It is therefore an object of the present invention to provide a wet treatment apparatus which overcomes at least one of the disadvantages of the background art.
The object of the present invention and the technical problem to be solved by the present invention are achieved by the following technical solutions, and the wet processing apparatus according to the present invention is suitable for processing a plurality of chips carried by the carrying fixture.
The wet processing equipment comprises a conveying device, an etching area, a first cleaning area, a deoxidation area and a second cleaning area, the conveying device can convey the bearing jig to move along a first conveying direction, the etching area is provided with a first liquid medicine for soaking the bearing jig conveyed by the conveying device to etch the pins of each chip, the first cleaning area is positioned at the downstream side of the etching area and used for cleaning the chip on the bearing fixture output by the etching area, the deoxidation area is positioned at the downstream side of the first cleaning area, and a second liquid medicine used for soaking the bearing jig conveyed by the conveying device to generate a deoxidation reaction on the pins of each chip, the second cleaning area is positioned at the downstream side of the deoxidation area and is used for cleaning the chip on the bearing fixture output by the deoxidation area.
In the wet processing apparatus of the present invention, the etching area forms a first chemical solution tank for the carrying fixture to pass through and containing the first chemical solution, the etching area includes two first nozzles and two first side nozzles located at a downstream side of the first chemical solution tank, the first nozzles are spaced apart from each other in an up-down direction perpendicular to the first conveying direction and are configured to blow air to the chip on the carrying fixture to remove the first chemical solution, and the first side nozzles are spaced apart from each other in a left-right direction perpendicular to the up-down direction and are configured to blow air to the chip on the carrying fixture in a lateral direction to remove the first chemical solution.
In the wet processing apparatus of the present invention, the etching region further includes a plurality of first chemical liquid nozzles disposed in the first chemical liquid tank, a part of the first chemical liquid nozzles spray the first chemical liquid in the form of a water jet to the chip while the other part sprays the first chemical liquid in the form of a water jet to the chip while the other part is directed downward, one of the first side nozzles sprays the gas to the chip along a left gas spraying direction, and the other one sprays the gas to the chip along a right gas spraying direction opposite to the left gas spraying direction.
The wet processing apparatus of the present invention, wherein the first cleaning section includes a first cleaning section and a second cleaning section located at a downstream side of the first cleaning section, the first cleaning section includes two first water jets spaced apart from each other in an up-down direction perpendicular to the first conveying direction, and two first air jets spaced apart from each other in the up-down direction and located at a downstream side of the first water jets, the first water jets are configured to eject water in the form of water jet to the chip, the first air jets are configured to eject air to the chip to remove the water, the second cleaning section forms a water tank containing water for cleaning the chip, the second cleaning section includes two second water jets spaced apart from each other in the up-down direction, and two second air jets spaced apart from each other in the up-down direction and located at a downstream side of the second water jets, the second water jets are configured to eject water in the form of water jet to the chip, the second gas nozzle is used for spraying gas to the chip to remove the water.
In the wet processing apparatus of the present invention, the first cleaning area further includes a third cleaning section located at a downstream side of the second cleaning section, the third cleaning section includes a plurality of pairs of first spraying members arranged at intervals along the first conveying direction, and two third air jets located at intervals along the up-down direction and at a downstream side of the first spraying members, the two first spraying members of each pair are arranged at intervals along the up-down direction to spray water onto the chips, and the third air jets are configured to jet air onto the chips to remove the water.
In the wet processing apparatus of the present invention, the first cleaning area includes a fourth cleaning section located at a downstream side of the third cleaning section, the fourth cleaning section includes a plurality of pairs of second spraying members arranged at intervals along the first conveying direction, two fourth air nozzles located at intervals along the up-down direction and at a downstream side of the second spraying members, and two side air nozzles located at a downstream side of the second spraying members, two second spraying members of each pair are spaced at intervals along the up-down direction for spraying water to the chips, the fourth air nozzles are used for spraying air to the chips to remove the water, the side air nozzles are spaced at intervals along a left-right direction perpendicular to the up-down direction for spraying air laterally to the chips on the carrying jig conveyed by the first conveying mechanism to remove the water, one of the side air nozzles is used for spraying air to the chips along the left air spraying direction, and the other is to jet the chip in a right jet direction opposite to the left jet direction.
In the wet processing apparatus of the present invention, the oxidation removing area forms a second liquid chemical tank through which the carrying jig passes and in which the second liquid chemical is accommodated, the oxidation removing area includes two second spray heads and two second side nozzles, the two second spray heads are located at a downstream side of the second liquid chemical tank, the second spray heads are spaced apart in the up-down direction to spray air to the chip to remove the second liquid chemical, and the second side nozzles are spaced apart in the left-right direction to spray air to the chip laterally to remove the second liquid chemical.
In the wet processing apparatus of the present invention, the deoxidation area further includes a plurality of second chemical liquid nozzles disposed in the second chemical liquid tank, a part of the second chemical liquid nozzles spray the second chemical liquid in the form of a water jet to the chips while the other part sprays the second chemical liquid in the form of a water jet to the chips while the other part is directed downward, one of the second side nozzles sprays the gas to the chips along a left gas spraying direction, and the other one sprays the gas to the chips along a right gas spraying direction opposite to the left gas spraying direction.
The wet processing apparatus of the present invention, wherein the second cleaning section includes a first cleaning section and a second cleaning section located at a downstream side of the first cleaning section, the first cleaning section includes two first water jets spaced apart from each other in an up-down direction perpendicular to the first conveying direction, and two first air jets spaced apart from each other in the up-down direction and located at a downstream side of the first water jets, the first water jets are configured to eject water in the form of water jet to the chip, the first air jets are configured to eject air to the chip to remove the water, the second cleaning section forms a water tank containing water for cleaning the chip, the second cleaning section includes two second water jets spaced apart from each other in the up-down direction, and two second air jets spaced apart from each other in the up-down direction and located at a downstream side of the second water jets, the second water jets are configured to eject water in the form of water jet to the chip, the second gas nozzle is used for spraying gas to the chip to remove the water.
In the wet processing apparatus of the present invention, the second cleaning area further includes a third cleaning section located at a downstream side of the second cleaning section, the third cleaning section includes a plurality of pairs of spraying members arranged at intervals along the first conveying direction, two third air nozzles located at intervals along the up-down direction and at a downstream side of the spraying members, and two side air nozzles located at intervals along the up-down direction and at a downstream side of the spraying members, two spraying members of each pair are spaced at intervals along the up-down direction for spraying water to the chips, the third air nozzle is configured to blow air to the chips to remove the water, the side air nozzles are spaced at intervals along a left-right direction perpendicular to the up-down direction for blowing air laterally to the chips on the carrying jig conveyed by the first conveying mechanism to remove the water, one of the side air nozzles blows air to the chips along the left air blowing direction, and the other is to jet the chip in a right jet direction opposite to the left jet direction.
The wet processing equipment of the invention is characterized in that each chip is provided with a metal heat conduction layer and a metal protection layer formed on the metal heat conduction layer, the wet processing equipment also comprises a removing area positioned at the downstream side of the second cleaning area and a third cleaning area positioned at the downstream side of the removing area, the removing area forms a third liquid medicine tank for the bearing jig to pass through, the third liquid medicine tank contains a third liquid medicine for soaking the chips to remove the metal protection layer of each chip, the removing area comprises two third spray heads and two third side nozzles positioned at the downstream side of the third liquid medicine tank, the third spray heads are spaced along the vertical direction and used for spraying air to the chips to remove the third liquid medicine, the third side nozzles are spaced along the horizontal direction and used for spraying air to the chips laterally to remove the third liquid medicine, the third cleaning area is used for cleaning the chip on the bearing fixture output by the removing area.
In the wet processing apparatus of the present invention, the removing section further includes a plurality of third chemical liquid nozzles disposed in the third chemical liquid tank, a part of the third chemical liquid nozzles spray the third chemical liquid in the form of a water jet to the chip while the other part of the third chemical liquid nozzles spray the third chemical liquid in the form of a water jet to the chip while one of the third side nozzles sprays the gas to the chip along a left gas spraying direction and the other side nozzle sprays the.
In the wet processing apparatus of the present invention, the third cleaning section includes a first cleaning section and a second cleaning section located at a downstream side of the first cleaning section, the first cleaning section includes two first water jets spaced apart in the up-down direction and two first air jets spaced apart in the up-down direction and located at a downstream side of the first water jets, the first water jets are configured to spray water in the form of a water jet to the chip, the first air jets are configured to jet air to the chip to remove the water, the second cleaning section includes a plurality of pairs of spraying members arranged at intervals in the first conveying direction, two second air jets spaced apart in the up-down direction and located at a downstream side of the spraying members, and two side air jets spaced apart in the up-down direction and located at a downstream side of the spraying members, two spraying members of each pair are spaced apart in the up-down direction and configured to spray water to the chip, the second air injection head is used for injecting air to the chip to remove the water, the side air injection nozzles are spaced along the left-right direction and used for injecting air to the chip on the bearing jig conveyed by the first conveying mechanism in a lateral direction to remove the water, one of the side air injection nozzles injects air to the chip along the left air injection direction, and the other side air injection nozzle injects air to the chip along the right air injection direction opposite to the left air injection direction.
The wet processing apparatus of the present invention further comprises a neutralization zone located on the downstream side of said third cleaning zone, and a fourth cleaning zone located on the downstream side of said neutralization zone, the neutralization area forms a fourth liquid medicine groove for the bearing fixture to pass through, the fourth liquid medicine groove contains a fourth liquid medicine for the chips to soak so as to neutralize and remove oxides formed on the metal heat conduction layer of each chip, the neutralization area comprises two fourth spray heads and two fourth side nozzles which are positioned at the downstream side of the fourth liquid medicine groove, the fourth nozzle is spaced along the up-down direction and used for spraying air to the chip to remove the fourth liquid medicine, the fourth side nozzle is spaced along the left-right direction and used for jetting air to the chip laterally to remove the fourth liquid medicine, the fourth cleaning area is used for cleaning the chip on the bearing fixture output by the neutralization area.
In the wet processing apparatus of the present invention, the neutralization region further includes a plurality of fourth chemical solution nozzles disposed in the fourth chemical solution tank, a part of the fourth chemical solution nozzles face upward to spray the fourth chemical solution in the form of a water jet to the chip, and another part of the fourth chemical solution nozzles face downward to spray the fourth chemical solution in the form of a water jet to the chip, and one of the fourth side nozzles sprays air to the chip in a left air spraying direction, and the other of the fourth side nozzles sprays air to the chip in a right air spraying direction opposite to the left air spraying direction.
In the wet processing apparatus of the present invention, the fourth cleaning region includes a first cleaning section and a second cleaning section located at a downstream side of the first cleaning section, the first cleaning section includes two first water jets spaced apart in the up-down direction and two first air jets spaced apart in the up-down direction and located at a downstream side of the first water jets, the first water jets are configured to eject water in the form of a water jet to the chip, the first air jets are configured to eject air to the chip to remove the water, the second cleaning section is formed with a water tank containing water for cleaning the chip, the second cleaning section includes two second water jets spaced apart in the up-down direction and two second air jets spaced apart in the up-down direction and located at a downstream side of the second water jets, the second water jets are configured to eject water in the form of a water jet to the chip, the second gas nozzle is used for spraying gas to the chip to remove the water.
In the wet processing apparatus of the present invention, the fourth cleaning area further includes a third cleaning section located at a downstream side of the second cleaning section, the third cleaning section includes a plurality of pairs of spraying members arranged at intervals along the first conveying direction, two third air nozzles located at intervals along the up-down direction and at a downstream side of the spraying members, and two side air nozzles located at intervals along the up-down direction and at a downstream side of the spraying members, two spraying members of each pair are spaced at intervals along the up-down direction for spraying water to the chips, the third air nozzle is configured to blow air to the chips to remove the water, the side air nozzles are spaced at intervals along the left-right direction for blowing air to the chips on the carrying jig conveyed by the first conveying mechanism to remove the water, one of the side air nozzles blows air to the chips along the left air blowing direction, and the other is to jet the chip in a right jet direction opposite to the left jet direction.
The wet processing equipment further comprises a wetting area positioned on the upstream side of the etching area and a drying area positioned on the downstream side of the fourth cleaning area, wherein the wetting area is used for wetting the chips on the bearing jig conveyed by the conveying device, and the drying area dries the chips by blowing hot air.
The wet processing equipment further comprises a wetting area positioned on the upstream side of the etching area and a drying area positioned on the downstream side of the second cleaning area, wherein the wetting area is used for wetting the chips on the bearing jig conveyed by the conveying device, and the drying area dries the chips through hot air blowing.
The wet processing equipment of the invention comprises a conveying device, a conveying device and a transferring device, wherein the conveying device comprises a first conveying mechanism and a second conveying mechanism which is separated from the first conveying mechanism along the left and right direction, the first conveying mechanism can convey the bearing jig along the first conveying direction and is provided with a feeding front end positioned in the wet area and a discharging rear end positioned in the dry area, the second conveying mechanism can convey the bearing jig along a second conveying direction opposite to the first conveying direction and is provided with a feeding rear end adjacent to the discharging rear end and a discharging front end adjacent to the feeding front end, the transferring device comprises a temporary storage mechanism positioned at the downstream side of the dry area and a transverse moving mechanism positioned at the downstream side of the temporary storage mechanism, and the temporary storage mechanism comprises a first conveying unit, and a lifting unit, the first conveying unit corresponding to the rear end of the discharging unit is used for bearing the bearing jig output by the rear end of the discharging unit, the lifting unit comprises a plurality of pairs of bearing rods which are arranged at intervals along the up-down direction, each pair of bearing rods can lift along the up-down direction and is used for bearing the bearing jig on the first conveying unit, the transverse moving mechanism comprises a second conveying unit and a transverse moving unit, the transverse moving unit is used for driving the second conveying unit to move between a first position aligned with the first conveying unit and a second position aligned with the rear end of the feeding unit along the left-right direction, when the second conveying unit is at the first position, the second conveying unit can bear the bearing jig output by the first conveying unit, when the second conveying unit is at the second position, the second conveying unit can convey the bearing jig to the second conveying mechanism.
The wet processing equipment of the invention also comprises a wetting area positioned at the upstream side of the etching area, the wetting area comprises a plurality of pairs of spraying pieces which are arranged at intervals along the first conveying direction, two gas nozzles which are arranged at intervals along the up-down direction and positioned at the downstream side of the spraying pieces, and two side gas nozzles which are arranged at intervals along the left-right direction and positioned at the downstream side of the spraying pieces, the two spraying pieces of each pair are arranged at intervals along the up-down direction and used for spraying water to the chips, the air nozzle is used for spraying air to the chip to remove the water, the side air nozzles are used for spraying air to the chip on the bearing fixture conveyed by the first conveying mechanism in a side direction to remove the water, one of the side air nozzles is used for spraying air to the chip along a left air spraying direction, and the other is to jet the chip in a right jet direction opposite to the left jet direction.
It is another object of the present invention to provide a processing method that overcomes at least one of the disadvantages of the background art.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme, and the processing method provided by the invention is suitable for processing a plurality of chips carried by the carrying jig.
The processing method comprises the following steps:
conveying the bearing jig to move along a first conveying direction through a conveying device;
etching a plurality of leads of each of the chips moving in the first conveying direction with a first chemical solution through an etching region;
cleaning the chip output from the etching area along the first conveying direction by a first cleaning area;
generating a deoxidation reaction on the pins of each chip moving along the first conveying direction by using a second liquid medicine through a deoxidation area; and
and cleaning the chip output by the deoxidation area along the first conveying direction through a second cleaning area.
The processing method of the invention further comprises a drying step which is positioned after the second cleaning area cleans the chip, and the chip is dried by blowing hot air through the drying area.
The processing method of the present invention further includes a removing step of removing the metal protective layer by a third chemical solution through the removing section after the second cleaning section cleans the chips and before the drying step, and the processing method further includes a cleaning step of cleaning the chips output from the removing section in the first conveying direction through the third cleaning section after the removing step and before the drying step.
The treatment method of the present invention further includes a neutralization step, which is located after the cleaning step and before the drying step, and which causes a chemical reaction with a fourth chemical solution in the neutralization zone on the metal heat conductive layer of each of the chips output from the third cleaning zone in the first transport direction to neutralize and remove oxides formed on the metal protective layer, and a cleaning step, which is located after the neutralization step and before the drying step, and which cleans the chips output from the neutralization zone in the first transport direction in the fourth cleaning zone.
In the processing method of the present invention, the conveying device conveys the carrier jig in the first conveying direction by the first conveying mechanism, the processing method further includes a transferring step after the drying step, and a refluxing step after the transferring step, in the transferring step, the carrier jig is transferred to the second conveying mechanism of the conveying device by the transferring device, and in the refluxing step, the carrier jig is conveyed in a second conveying direction opposite to the first conveying direction by the second conveying mechanism.
The processing method of the invention also comprises a wetting step before the etching area etches the pin, and the chip is wetted by the wetting area.
The invention has the beneficial effects that: the first liquid medicine in the etching area and each pin of the chip or the metal wire generated by sawing the chip generate chemical reaction and etch each pin or metal wire, so that the distance between two adjacent pins can be increased to a preset length, or the metal wire is removed, and the situation that the chip is in contact with another adjacent pin or two adjacent pins are in contact with each other due to the factors of expansion with heat and contraction with cold in the subsequent use process, and further short circuit is caused is prevented.
Drawings
FIG. 1 is a bottom view of a wafer to be processed in one embodiment of the wet processing apparatus of the present invention;
FIG. 2 is a side view of the chip;
FIG. 3 is a top view of a carrier tray of a carrier tool for carrying the chips;
fig. 4 is a top view of a cover plate of the carrying fixture;
fig. 5 is a fragmentary exploded perspective view of the carrying fixture;
FIG. 6 is a fragmentary top view of the carrier fixture illustrating the chip mounted on the carrier tray;
fig. 7 is a fragmentary cross-sectional view of the carrier fixture illustrating the chip mounted therein;
fig. 8 is a fragmentary side view of the carrying jig;
fig. 9 is a fragmentary side view of the carrying jig;
FIG. 10 is a top view of the embodiment, illustrating the arrangement relationship between a body, a conveying device, and a transferring device;
FIG. 11 is a side view of the embodiment;
FIG. 12 is a side view of a wetted zone of the embodiment;
FIG. 13 is a schematic side view of a wetted section of the wetted region of the embodiment;
FIG. 14 is a schematic side view of a blow-dry section of the wet zone of the embodiment;
FIG. 15 is a side view of an etch region of the embodiment;
FIG. 16 is a schematic side view of a chemical reaction section of the etch zone of the embodiment;
FIG. 17 is a schematic side view of a blow-dry section of the etch zone of the embodiment;
FIG. 18 is a side view of a first cleaning zone of the embodiment;
FIG. 19 is a schematic side view of a fourth cleaning stage of the first cleaning zone of the embodiment;
FIG. 20 is a side view of a deoxidized region of the embodiment;
FIG. 21 is a schematic side view of a blow-dry section of the deoxidation zone of this embodiment;
FIG. 22 is a side view of a second cleaning zone of the embodiment;
FIG. 23 is a schematic side view of a third cleaning stage of the second cleaning zone of the embodiment;
FIG. 24 is a side view of a removal area of the embodiment;
FIG. 25 is a schematic side view of a blow-dry section of the removal zone of the embodiment;
FIG. 26 is a side view of a third wash zone of the embodiment;
FIG. 27 is a schematic side view of a second cleaning section of the third cleaning zone of the embodiment;
FIG. 28 is a side view of a neutralization zone of the embodiment;
FIG. 29 is a schematic side view of a blow-dry section of the neutralization zone of the embodiment;
FIG. 30 is a side view of a fourth wash zone of the embodiment;
FIG. 31 is a schematic side view of a third cleaning section of the fourth cleaning zone of the embodiment;
FIG. 32 is a side view of a drying zone of the embodiment;
fig. 33 is a perspective view of a transfer device according to the embodiment;
fig. 34 is a side view of a transfer device of the embodiment;
FIG. 35 is a fragmentary top plan view of the embodiment;
FIG. 36 is a flow chart of one step of a processing method of the embodiment;
FIG. 37 is a fragmentary top plan view of the embodiment, illustrating a second conveyor unit in a first position; and
fig. 38 is a fragmentary top view of the embodiment, illustrating the second conveyor unit in a second position.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Before the present invention is described in detail, it should be noted that in the following description, like elements are represented by like reference numerals.
Referring to fig. 1 and 2, fig. 1 is a bottom view of a chip 1 to be processed according to an embodiment of a wet processing apparatus 300 (fig. 11) of the present invention, and fig. 2 is a side view of the chip 1. The chip 1 is packaged by, for example, a double Row Quad Flat No lead (DR-QFN) method, a Quad Flat No lead (QFN) method, or a double edge No lead (DFN) method. The chip 1 is illustrated as a rectangle, but it may be a square. The chip 1 includes an insulating package 11, a plurality of leads 12, a metal heat-conducting layer 13, and a metal passivation layer 14. The insulating package 11 has a first surface 111, a second surface 112 opposite to the first surface 111, and four side surfaces 113 connected between the first surface 111 and the second surface 112. Each lead 12 is made of copper and is partially covered by an insulating package 11. Some of the leads 12 are arranged in two rows at the side surfaces 113 on two short sides, wherein one row of the leads 12 is exposed on the first surface 111 of the insulating package 11, and the other row of the leads 12 is exposed on both the first surface 111 and the side surfaces 113 of the insulating package 11. The rest of the leads 12 are arranged in a single row at the side surfaces 113 on the two long sides and are exposed at the first surface 111 and the side surfaces 113 of the insulating package 11. The metal heat conduction layer 13 is made of, for example, tin and is partially covered by the insulating package 11, and the metal heat conduction layer 13 can be exposed on the first surface 111 of the insulating package 11. The metal protection layer 14 is made of, for example, silver and is plated on the metal heat conduction layer 13 to shield the metal heat conduction layer 13.
Referring to fig. 3, 4 and 5, a carrier 2 is used for simultaneously carrying a plurality of chips 1 shown in fig. 1, and the carrier 2 includes a carrier tray 21 and a cover plate 23 detachably covering the carrier tray 21. The carrier tray 21 includes a rectangular tray body 211, a plurality of carrier units 212, a plurality of bump units 213, and four pad units 214. The tray body 211 is formed with a plurality of through holes 215 arranged in an array, and three positioning holes 216. Each positioning hole 216 is adjacent to a corresponding corner of the tray 211. Each of the supporting units 212 is formed on an inner circumferential surface 210 of the tray 211 defining each of the through holes 215, and includes four protruding arms 217 and four supporting pieces 223. Each protruding arm 217 protrudes from a corresponding corner of the inner circumferential surface 210. Each of the carrier sheets 223 is connected between two corresponding adjacent protruding arms 217 for carrying the first surface 111 (fig. 2) or the second surface 112 (fig. 2) of the chip 1. In the present embodiment, the first side 111 is carried by each carrying sheet 223. Each bump unit 213 includes four bumps 218 protruding from the top surface of the disc 211, the bumps 218 being adjacent to four corners of the inner periphery 210. Each pad unit 214 includes a plurality of pads 219 protruding from the top surface of the tray 211 and located at corresponding corners of the tray 211, wherein the pads 219 define a plurality of grooves 220 vertically and alternately connected to each other. The top surface of the tray body 211 has two long surface portions 221 and two short surface portions 222. The two long surface portions 221 are respectively located on two long sides of the tray body 211, and the two short surface portions 222 are respectively located on two short sides of the tray body 211. Each long face 221 is located between a corresponding two of the pad units 214, and each short face 222 is located between a corresponding two of the pad units 214.
The cover plate 23 includes a rectangular plate 231 and three positioning posts 232. The plate 231 is formed with a plurality of opening units 233 arranged in an array, and a plurality of through holes 234. Each of the opening units 233 includes a first opening 230, and four second openings 235 around the outer circumference of the first opening 230. The through holes 234 are adjacent to two long sides and two short sides of the plate body 231 and surround the outer circumference of the hole unit 233. The plate 231 has a plurality of stop frames 236, and each stop frame 236 is frame-shaped and defines the first opening 230. Each of the stop frames 236 is used to stop the second surface 112 of the chip 1. Each positioning post 232 is disposed on the bottom surface of the plate 231 and adjacent to a corresponding corner of the plate 231 for being engaged in the corresponding positioning hole 216.
Referring to fig. 6 and 7, after each chip 1 is placed on the corresponding carrying unit 212, the four carrying pieces 223 of the carrying unit 212 abut against the first surface 111 of the chip 1 to carry the chip 1. Subsequently, the cover plate 23 is covered on the carrier tray 21, so that the positioning posts 232 (see fig. 4) are engaged in the corresponding positioning holes 216 (see fig. 3), and the top surfaces of the bumps 218 and the top surfaces of the pads 219 (see fig. 3) abut against the bottom surface of the plate 231, thereby completing the assembly of the cover plate 23. At this time, most of the first surface 111 of the chip 1, and all of the leads 12 and the metal protection layer 14 exposed on the first surface 111 correspond to the through holes 215 of the carrier tray 21, so that the processing solution, the cleaning solution or the compressed air and other fluids can flow into the chip 1 in the carrier fixture 2 through the through holes 215 to perform chemical reaction, cleaning or drying on the chip 1. Most areas of the second surface 112 of the chip 1 correspond to the first opening 230 and the four second openings 235 of the opening unit 233 of the cover plate 23, so that the processing fluid, the cleaning fluid or the compressed air can flow into the chip 1 in the carrier fixture 2 through the first opening 230 and the second openings 235, and perform the actions of chemical reaction, cleaning or drying on the chip 1.
The second surface 112 of the chip 1 is spaced apart from a stop end 237 of the bottom surface of the stop frame 236 of the cover plate 23, thereby allowing the chip 1 to swing up and down between the carrier plate 223 and the stop end 237 of the stop frame 236 when impacted by the fluid. In addition, each side surface 113 of the chip 1 is spaced apart from the corresponding bump 218 by a distance, thereby allowing the chip 1 to rock back and forth or left and right between the bumps 218 when being impacted by the fluid.
Referring to fig. 8, a side flow channel 24 is defined between each long surface 221 of the carrier tray 21 and the two corresponding pad units 214, and the bottom surface of the plate 231 of the cover plate 23. Referring to fig. 9, each short portion 222 of the carrier tray 21, the two corresponding pad units 214, and the bottom surface 231 of the cover plate 23 define an end flow channel 25 therebetween.
Referring to fig. 3, 4, 8 and 9, the pad units 214 can reduce the contact area with the bottom surface of the plate 231 in such a manner that the pads 219 abut against the bottom surface of the plate 231, so that the treating solution or the cleaning solution is less likely to adhere between the top surfaces of the pads 219 and the bottom surface of the plate 231. By the design of the grooves 220 allowing the fluid to flow therein, when the compressed air is blown to the grooves 220 on the left and right sides of the carrying fixture 2, the processing liquid or the cleaning liquid in the grooves 220 can be blown out and discharged through the end channels 25 or the through holes 215. Meanwhile, the compressed air can also improve the effect of blowing away the residual treating or cleaning fluid between the top surface of each pad 219 and the bottom surface of the plate 231 during the flowing process in the groove 220. When the compressed air is blown to the side channels 24 on the left and right sides of the carrier jig 2, the residual processing liquid or cleaning liquid on the long surface portion 221 can be blown away and discharged through the through hole 215. And, compressed air can be blown to each chip 1 and blow-dried.
By the design of the through holes 234 of the cover plate 23 corresponding to the positions above the pad units 214, the long surface parts 221 and the short surface parts 222 of the susceptor 21, when compressed air is blown from above the cover plate 23 to the through holes 234, the compressed air can be blown to the pad units 214, the long surface parts 221 and the short surface parts 222 through the through holes 234, and the residual processing liquid or cleaning liquid on the structure can be blown away and discharged through the grooves 220, the side channels 24 and the end channels 25.
Referring to fig. 10 and 11, a wet processing apparatus 300 according to an embodiment of the present invention is adapted to process a plurality of chips 1 (as shown in fig. 7) carried by a carrying tool 2. The wet processing apparatus 300 includes a body 3, a conveying device 5, and a transfer device 6.
The body 3 includes a front end 301 and a rear end 302. The directions passing through the front end 301 and the rear end 302 of the body 3 are defined as a front-rear direction X, a left-right direction Y perpendicular to the front-rear direction X, and an up-down direction Z perpendicular to the front-rear direction X and the left-right direction Y.
The body 3 includes a wetting region 31, an etching region 32, a first cleaning region 33, a deoxidation region 35, a second cleaning region 36, an inspection region 38, a removal region 39, a third cleaning region 40, a neutralization region 41, a fourth cleaning region 42, a drying region 44, and a reflow region 45. The wet area 31, the etching area 32, the first cleaning area 33, the deoxidation area 35, the second cleaning area 36, the inspection area 38, the removal area 39, the third cleaning area 40, the neutralization area 41, the fourth cleaning area 42, and the drying area 44 are arranged in a row in the front-back direction X from front to back. The recirculation zones 45 extend in another row along the front-back direction X and are arranged on the right side of the row along the left-right direction Y. The recirculation zone 45 and the wet zone 31 together define a front end 301, and the recirculation zone 45 and the dry zone 44 together define a rear end 302.
The conveying device 5 includes a first conveying mechanism 51, and a second conveying mechanism 52 spaced from the first conveying mechanism 51 in the left-right direction Y. The first conveying mechanism 51 is disposed in the wet area 31, the etching area 32, the first cleaning area 33, the deoxidation area 35, the second cleaning area 36, the inspection area 38, the removal area 39, the third cleaning area 40, the neutralization area 41, the fourth cleaning area 42, and the drying area 44. The first conveying mechanism 51 has an inlet front end 511 located in the wetting zone 31 and adjacent to the front end 301, and an outlet rear end 512 located in the drying zone 44 and adjacent to the rear end 302. The first conveying mechanism 51 can convey the loading jig 2 in the first conveying direction D1 from front to back to move in the regions. The second conveying mechanism 52 is disposed in the recirculation zone 45 and has a feeding rear end 521 adjacent to the rear end 302 and a discharging front end 522 adjacent to the front end 301. The second conveying mechanism 52 can convey the carriers 2 in the reflow region 45 along a second conveying direction D2 opposite to the first conveying direction D1.
Referring to fig. 12 and 13, the wetting zone 31 includes a feeding section 311, a wetting section 312 located at a downstream side of the feeding section 311, and a drying section 313 located at a downstream side of the wetting section 312. The wetting section 312 includes a plurality of pairs of spray elements 314 spaced apart along a first conveyance direction D1. The two spraying members 314 of each pair are spaced apart in the vertical direction Z, wherein the lower spraying member 314 sprays water 310 upward, and the upper spraying member 314 sprays water 310 downward. Thereby, the spraying member 314 can spray water 310 onto the chips 1 (as shown in fig. 7) on the carrier 2 conveyed by the first conveying mechanism 51 for wetting operation.
The first conveying mechanism 51 includes a plurality of lower conveying rollers 513 arranged at intervals in the front-rear direction X, and a plurality of upper conveying rollers 514 arranged at intervals in the front-rear direction X. The lower roller 513 and the upper roller 514 are located between the front end 511 and the rear end 512 (fig. 10), each lower roller 513 is a driving roller, and each upper roller 514 is a driven roller. The number of the upper conveying rollers 514 is smaller than that of the lower conveying rollers 513, and each upper conveying roller 514 is located above the corresponding lower conveying roller 513. The first conveying mechanism 51 drives the carrying fixture 2 to move along the first conveying direction D1 through the lower conveying roller 513 and the upper conveying roller 514.
Referring to fig. 12 and 14, the drying section 313 includes two pairs of nozzles 315 located on the downstream side of the spray element 314, and two side nozzles 316 (fig. 14). Two pairs of nozzles 315 are arranged at intervals in the first conveying direction D1, the two nozzles 315 of each pair being spaced apart in the up-down direction Z, each nozzle 315 being configured to eject compressed gas in the form of air knives (air knife). The lower showerhead 315 is inclined upward and jets air forward, and the upper showerhead 315 is inclined downward and jets air forward. Thereby, the air-jet head 315 can jet air to the chip 1 (as shown in fig. 7) on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the water 310 on the chip 1. The two side air nozzles 316 are spaced apart from each other along the left-right direction Y, one of which is used for laterally spraying air to the chip 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 along a left air spraying direction D3, and the other of which is used for laterally spraying air to the chip 1 on the carrying jig 2 along a right air spraying direction D4 opposite to the left air spraying direction D3, so as to remove the water 310 on the chip 1.
Referring to fig. 15 and 16, the etching area 32 includes a separating section 321, a chemical reaction section 322 located at a downstream side of the separating section 321, and a blow drying section 323 located at a downstream side of the chemical reaction section 322. The separating section 321 is located at the downstream side of the drying section 313 (see fig. 12) of the wet area 31 for separating the drying section 313 and the chemical reaction section 322 to prevent the chemical solution in the chemical reaction section 322 from flowing into the drying section 313. The chemical reaction section 322 forms a first chemical solution tank 324 for the carrying fixture 2 conveyed by the first conveying mechanism 51 to pass through, and the first chemical solution tank 324 contains a first chemical solution 325 for soaking the carrying fixture 2. In the present embodiment, the first chemical 325 is an etching solution for etching the leads 12 (see fig. 1) of each chip 1. The chemical reaction section 322 includes a plurality of first chemical solution nozzles 326 disposed in a first chemical solution tank 324 and spaced apart from each other in a first conveying direction D1 and staggered up and down. One part of the first chemical liquid spray nozzle 326 sprays the first chemical liquid 325 in the form of a water jet to the chip 1 on the bearing jig 2 upwards, and the other part sprays the first chemical liquid 325 in the form of a water jet to the chip 1 downwards. The first conveyor mechanism 51 also includes two solid rollers 515 and two fluid-cutting rollers 516. Two solid rollers 515 are respectively located at the front and rear ends of the first chemical liquid tank 324. The two liquid-cutting rollers 516 abut against the two solid rollers 515 respectively to block the first liquid medicine 325 from overflowing into the separating section 321 and the drying section 323. The portion of each of the liquid-cutting rollers 516 supported by the carrier 2 can be displaced upward to allow the carrier 2 to pass between the solid roller 515 and the liquid-cutting roller 516.
Referring to fig. 15 and 17, the blowing section 323 includes two pairs of first spray heads 327 and two first side nozzles 328 located at the downstream side of the first chemical solution tank 324. Two pairs of first spray heads 327 are arranged at intervals along the first conveying direction D1, and the two first spray heads 327 of each pair are arranged at intervals along the up-down direction Z. The structure and arrangement of the first nozzles 327 are the same as those of the showerhead 315 (see fig. 12), wherein the lower first nozzle 327 is inclined upward and jets air forward, and the upper first nozzle 327 is inclined downward and jets air forward. Thereby, the first nozzle 327 can spray air to the chip 1 (as shown in fig. 7) on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the first chemical 325 on the chip 1. The first side nozzles 328 are each configured and arranged in the same manner as the side nozzle caps 316 (FIG. 14). The two first side nozzles 328 are spaced apart from each other in the left-right direction Y, one of the two first side nozzles 328 laterally ejects air to the chip 1 on the carrier 2 conveyed by the first conveying mechanism 51 along the left air ejection direction D3, and the other one laterally ejects air to the chip 1 on the carrier 2 along the right air ejection direction D4, so as to remove the first chemical 325 on the chip 1.
Referring to fig. 18, the first cleaning zone 33 includes a first cleaning section 331 located at a downstream side of the blow-drying section 323 (see fig. 15), a second cleaning section 332 located at a downstream side of the first cleaning section 331, a third cleaning section 333 located at a downstream side of the second cleaning section 332, and a fourth cleaning section 334 located at a downstream side of the third cleaning section 333. The first cleaning section 331 includes two first nozzles 335 spaced apart along the up-down direction Z and two first nozzles 336 spaced apart along the up-down direction Z and located at a downstream side of the first nozzles 335. The first spray heads 335 have the same structure as the first chemical solution spray head 326 (see fig. 15). One of the two first water spraying heads 335 sprays water 337 in the form of water jet upward to the chip 1 on the carrying fixture 2, and the other one sprays water 337 in the form of water jet downward to the chip 1, thereby performing a first cleaning operation on the chip 1. The structure and arrangement of each of the first showerhead 336 is the same as that of the showerhead 315 (see FIG. 12), with the lower first showerhead 336 facing upward and spraying air forward at an angle, and the upper first showerhead 336 facing downward and spraying air forward at an angle. Therefore, the first air-spraying head 336 can spray air to the chip 1 on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the water 337 on the chip 1.
The second cleaning section 332 is formed with a water tank 338 for the carrying jig 2 conveyed by the first conveying mechanism 51 to pass through, and the water tank 338 contains water 339 for the carrying jig 2 to soak for cleaning the chip 1. The front and rear ends of the water tank 338 are similarly provided with two solid rollers 515 and two liquid-cutting rollers 516. The second cleaning section 332 includes a plurality of second water spraying heads 340 disposed in the water tank 338 and spaced apart from each other along the first conveying direction D1 and staggered up and down, and two second air spraying heads 341 spaced apart from each other along the up-down direction Z and located at the downstream side of the water tank 338. One part of the second water spray heads 340 sprays water 339 in the form of water jet upwards to the chip 1 on the carrying fixture 2, and the other part sprays water 339 in the form of water jet downwards to the chip 1, thereby performing a second cleaning on the chip 1. The structure and arrangement of each second showerhead 341 are the same as those of the showerhead 315 (see FIG. 12), in that the lower second showerhead 341 is inclined upward and jets air forward, and the upper second showerhead 341 is inclined downward and jets air forward. Thereby, the second air nozzle 341 can spray air to the chip 1 on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the water 339 on the chip 1.
The third cleaning section 333 includes a plurality of pairs of first spraying members 342 spaced apart along the first conveying direction D1, and two third spraying heads 343 spaced apart along the up-down direction Z and located at the downstream side of the first spraying members 342. The structure and arrangement of each first spraying member 342 are the same as those of the spraying member 314 (see fig. 12). The two first spraying members 342 of each pair are spaced apart from each other in the vertical direction Z, wherein the lower first spraying member 342 sprays water 344 upward toward the chip 1, and the upper first spraying member 342 sprays water 344 downward toward the chip 1. Thereby, the first spraying member 342 can perform a third cleaning operation on the chip 1. The structure and arrangement of each third showerhead 343 are the same as those of the showerhead 315 (see fig. 12), and the lower third showerhead 343 is inclined upward and jets gas forward toward the chip 1, and the upper third showerhead 343 is inclined downward and jets gas forward toward the chip 1. Thereby, the compressed gas ejected from the third showerhead 343 removes the water 344 from the chip 1.
The fourth cleaning section 334 includes a plurality of pairs of second spraying members 345 spaced apart in the first conveying direction D1, two pairs of fourth nozzles 346 located on the downstream side of the second spraying members 345, and two side nozzle 347 located on the downstream side of the second spraying members 345. The second spraying members 345 are constructed and arranged in the same manner as the spraying members 314 (see fig. 12). The two second spraying members 345 of each pair are spaced apart from each other in the vertical direction Z, wherein the lower second spraying member 345 sprays water 348 toward the chips 1 while the upper second spraying member 345 sprays water 348 toward the chips 1. Thereby, the second spraying member 345 can perform a fourth cleaning operation on the chip 1.
Referring to FIGS. 18 and 19, two pairs of the fourth heads 346 are spaced apart in the first conveyance direction D1, and the two fourth heads 346 of each pair are spaced apart in the up-down direction Z. The fourth showerhead 346 is constructed and arranged in the same manner as the showerhead 315 (see FIG. 12), with the lower fourth showerhead 346 being inclined upward and blowing gas forward toward the chip 1 (see FIG. 7), and the upper fourth showerhead 346 being inclined downward and blowing gas forward toward the chip 1. Thereby, the compressed gas ejected from the fourth showerhead 361 can remove the water 348 on the chip 1. Each side nozzle 347 is constructed and arranged in the same manner as side nozzle 316 (FIG. 14). The two side air nozzles 347 are spaced apart from each other in the left-right direction Y, one of the two side air nozzles 347 laterally sprays air to the chip 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 along the left air spraying direction D3, and the other side air nozzle laterally sprays air to the chip 1 on the carrying jig 2 along the right air spraying direction D4, so as to remove the water 348 on the chip 1.
Referring to fig. 20 and 21, the overall structure of the deoxidation zone 35 is the same as that of the etching zone 32 of fig. 15, and the deoxidation zone 35 comprises a separation section 351, a chemical reaction section 352 at the downstream side of the separation section 351, and a blow drying section 353 at the downstream side of the chemical reaction section 352. The separating section 351 is located at the downstream side of the fourth cleaning section 334 (as shown in fig. 18) and is used for separating the fourth cleaning section 334 from the chemical reaction section 352 to prevent the chemical solution in the chemical reaction section 352 from seeping into the fourth cleaning section 334. The chemical reaction section 352 forms a second chemical solution tank 354 for the carrying fixture 2 conveyed by the first conveying mechanism 51 to pass through, and the second chemical solution tank 354 contains a second chemical solution 355 for the carrying fixture 2 to soak. Two solid rollers 515 and two liquid cutting rollers 516 are also arranged at the front end and the rear end of the second liquid medicine groove 354. In the present embodiment, the second chemical liquid 355 is a deoxidizing liquid for generating a deoxidizing reaction on the leads 12 (as shown in fig. 1) of each chip 1. The chemical reaction section 352 includes a plurality of second chemical solution nozzles 356 disposed in a second chemical solution tank 354 and spaced apart from each other in the first conveying direction D1 and arranged in an up-and-down staggered manner. One part of the second chemical solution spray head 356 sprays the second chemical solution 355 in the form of a water jet upward to the chip 1 on the carrying fixture 2, and the other part sprays the second chemical solution 355 in the form of a water jet downward to the chip 1.
Referring to fig. 20 and 21, the blowing section 353 includes two pairs of second spray heads 357 and two second side nozzles 358 at the downstream side of the second chemical solution tank 354. Two pairs of second spray heads 357 are arranged at intervals along the first conveying direction D1, and the two second spray heads 357 of each pair are arranged at intervals along the up-down direction Z. The structure and arrangement of the second nozzles 357 are the same as those of the showerhead 315 (see FIG. 12), and the lower second nozzle 357 sprays air upward and forward in an inclined manner, and the upper first nozzle 327 sprays air downward and forward in an inclined manner. Thereby, the first nozzle 327 can spray air to the chip 1 to remove the second chemical 355 on the chip 1. The second side nozzles 358 are constructed and arranged in the same manner as the side nozzle caps 316 (see FIG. 14). The two second side nozzles 358 are spaced apart from each other along the left-right direction Y, one of the two second side nozzles 358 laterally ejects air to the chip 1 on the carrier 2 conveyed by the first conveying mechanism 51 along the left air ejection direction D3, and the other one of the two second side nozzles 358 laterally ejects air to the chip 1 on the carrier 2 along the right air ejection direction D4, so as to remove the second chemical solution 355 on the chip 1.
Referring to fig. 22, the structure of second cleaning zone 36 is similar to the structure of first cleaning zone 33 of fig. 18, except that second cleaning zone 36 lacks third cleaning zone 333 (fig. 18) such as first cleaning zone 33. The second cleaning zone 36 includes a first cleaning section 361 on the downstream side of the blow-dry section 353 (fig. 20), a second cleaning section 362 on the downstream side of the first cleaning section 361, and a third cleaning section 363 on the downstream side of the second cleaning section 362. The first cleaning section 361 includes two first nozzles 364 spaced apart from each other in the vertical direction Z, and two first nozzles 365 spaced apart from each other in the vertical direction Z and located at the downstream side of the first nozzles 364. The first sprinkler head 364 is constructed in the same manner as the first sprinkler head 335 (see fig. 18). One of the two first water spraying heads 364 upwards sprays water 366 in the form of water jet to the chip 1 (as shown in fig. 7) on the carrying fixture 2, and the other one downwards sprays water 366 in the form of water jet to the chip 1, thereby performing a first cleaning on the chip 1. The first showerhead 365 is constructed and arranged in the same manner as the showerhead 315 (FIG. 12), with the lower first showerhead 365 angled upward and spraying forward and the upper first showerhead 365 angled downward and spraying forward. Thereby, the first air-spraying head 365 can spray air to the chip 1 on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the water 366 on the chip 1.
The second cleaning section 362 forms a water tank 367 for the carrying jig 2 conveyed by the first conveying mechanism 51 to pass through, and the water tank 367 contains water 368 for the carrying jig 2 to soak for cleaning the chip 1. The front and rear ends of the water channel 367 are similarly provided with two solid rollers 515 and two liquid-cutting rollers 516. The second cleaning section 362 includes a plurality of second water spray heads 369 disposed in the water tank 367 and spaced apart from each other in the first conveying direction D1 and staggered up and down, and two second air spray heads 370 spaced apart from each other in the up-down direction Z and located at a downstream side of the water tank 367. One part of the second water spray heads 369 upwardly sprays water 368 in the form of water jet to the chip 1 on the carrying fixture 2, and the other part downwardly sprays water 368 in the form of water jet to the chip 1, thereby performing a second cleaning operation on the chip 1. The second showerhead 370 is constructed and arranged in the same manner as the showerhead 315 (FIG. 12), with the lower second showerhead 370 facing obliquely upward and spraying gas forward and the upper second showerhead 370 facing obliquely downward and spraying gas forward. Thereby, the second air-jet head 370 can jet air to the chip 1 on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the water 368 on the chip 1.
Referring to fig. 22 and 23, the third cleaning section 363 includes a plurality of pairs of spraying members 371 arranged at intervals along the first conveying direction D1, two pairs of third air nozzles 372 located at the downstream side of the spraying members 371, and two side air nozzles 373 located at the downstream side of the spraying members 371. The structure and arrangement of each spray 371 is the same as that of the spray 314 (see fig. 12). The two spraying members 371 of each pair are spaced apart in the up-down direction Z, wherein the lower spraying member 371 sprays water 374 upward toward the chip 1, and the upper spraying member 371 sprays water 374 downward toward the chip 1. Thereby, the spraying part 371 can perform the third cleaning on the chip 1.
Two pairs of the third nozzles 372 are arranged at intervals in the first conveying direction D1, and the two third nozzles 372 of each pair are spaced apart in the up-down direction Z. The structure and arrangement of each third showerhead 372 are the same as those of the showerhead 315 (see FIG. 12), and the lower third showerhead 372 is inclined upward and jets air toward the chip 1, and the upper third showerhead 372 is inclined downward and jets air toward the chip 1. Thereby, the compressed gas ejected from the third showerhead 372 removes the water 374 on the chip 1. The structure and arrangement of each side air nozzle 373 is the same as that of the side air nozzle 316 (see FIG. 14). The two side air nozzles 373 are spaced apart from each other along the left-right direction Y, one of the two side air nozzles 373 laterally sprays air to the chip 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 along the left air spraying direction D3, and the other side air nozzle laterally sprays air to the chip 1 on the carrying jig 2 along the right air spraying direction D4, so as to remove the water 374 on the chip 1.
Referring to fig. 10 and 11, the inspection zone 38 is located downstream of the third cleaning stage 363 (fig. 22). When the first conveying mechanism 51 conveys the carrying jig 2 to the inspection area 38, the worker can stop the carrying jig 2 at the inspection area 38 by controlling the first conveying mechanism 51 to stop operation. Therefore, the worker can take out the carrier jig 2 to check the etching and cleaning conditions of the pins 12 (as shown in fig. 1) of each chip 1.
Referring to fig. 24, the overall structure of the removing section 39 is the same as that of the etching section 32 of fig. 15, and the removing section 39 includes a dividing section 391, a chemical reaction section 392 located at the downstream side of the dividing section 391, and a blow-drying section 393 located at the downstream side of the chemical reaction section 392. The separating section 391 is located at a downstream side of the inspection area 38 (see fig. 11) for separating the inspection area 38 and the chemical reaction section 392, so as to prevent the chemical solution in the chemical reaction section 392 from flowing into the inspection area 38. The chemical reaction section 392 forms a third chemical solution tank 394 for the carrying fixture 2 conveyed by the first conveying mechanism 51 to pass through, and the third chemical solution tank 394 contains a third chemical solution 395 for the carrying fixture 2 to soak. Two solid rollers 515 and two liquid cutting rollers 516 are also arranged at the front end and the rear end of the third liquid medicine groove 394. In the present embodiment, the third chemical 395 is a silver remover for removing the metal passivation layer 14 (as shown in fig. 2) of each chip 1. The chemical reaction section 392 includes a plurality of third chemical solution nozzles 396 disposed in the third chemical solution tank 394 and spaced apart and staggered up and down along the first conveying direction D1. One part of the third chemical liquid spray heads 396 is upward to spray the water jet type third chemical liquid 395 to the chip 1 (as shown in fig. 7) on the bearing jig 2, and the other part is downward to spray the water jet type third chemical liquid 395 to the chip 1.
Referring to fig. 24 and 25, the blowing section 393 includes two pairs of third spray heads 397 and two third side nozzles 398 located at a downstream side of the third chemical tank 394. Two pairs of third shower heads 397 are arranged at intervals in the first conveying direction D1, and two third shower heads 397 of each pair are arranged at intervals in the up-down direction Z. The third heads 397 are arranged in the same manner as the first heads 327 (see fig. 15), such that the lower third heads 397 face upward obliquely and eject air forward, and the upper third heads 397 face downward obliquely and eject air forward. Thereby, the third spraying head 397 can spray air onto the chip 1 (as shown in fig. 7) to remove the third liquid 395 from the chip 1. The third side nozzles 398 are configured and arranged in the same manner as the first side nozzles 328 (see fig. 15). The two third side nozzles 398 are spaced apart from each other along the left-right direction Y, one of the two third side nozzles 398 laterally injects the air to the chip 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left air injection direction D3, and the other one of the two third side nozzles 398 laterally injects the air to the chip 1 on the carrier jig 2 along the right air injection direction D4, so as to remove the third liquid medicine 395 on the chip 1.
Referring to fig. 26, the third cleaning zone 40 has a structure similar to that of the first cleaning zone 33 of fig. 18, except that the third cleaning zone 40 has fewer second cleaning stages 332 and third cleaning stages 333 (fig. 18) as the first cleaning zone 33. The third wash zone 40 includes a first wash section 401 downstream of the blow-dry section 393 (see fig. 24) and a second wash section 402 downstream of the first wash section 401. The first cleaning section 401 includes two first nozzles 403 spaced apart in the vertical direction Z, and two first nozzles 404 spaced apart in the vertical direction Z and located at the downstream side of the first nozzles 403. The first sprinkler heads 403 are each constructed in the same manner as the first sprinkler heads 335 (see fig. 18). One of the two first water spraying heads 403 is upward to spray water 405 in the form of water jet to the chip 1 (as shown in fig. 7) on the carrying fixture 2, and the other one is downward to spray water 405 in the form of water jet to the chip 1, thereby performing a first cleaning operation on the chip 1. The structure and arrangement of each first showerhead 404 is the same as the first showerhead 336 (see FIG. 18), with the lower first showerhead 404 facing upward and spraying gas forward at an angle, and the upper first showerhead 404 facing downward and spraying gas forward at an angle. Therefore, the first air-spraying head 404 can spray air to the chip 1 on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the water 405 on the chip 1.
Referring to fig. 26 and 27, the second cleaning section 402 includes a plurality of pairs of spraying members 406 arranged at intervals along the first conveying direction D1, two pairs of second nozzles 407 located at the downstream side of the spraying members 406, and two side nozzles 408 located at the downstream side of the spraying members 406. The structure and arrangement of each spray member 406 is the same as the structure and arrangement of the second spray member 345 (see fig. 18). The two spraying members 406 of each pair are spaced apart in the up-down direction Z, wherein the lower spraying member 406 is used for spraying water 409 to the chip 1 (see fig. 7) upward, and the upper spraying member 406 is used for spraying water 409 to the chip 1 downward. Thereby, the spraying member 406 can perform a second cleaning process on the chip 1.
Two pairs of the second showerhead 407 are arranged at intervals in the first conveying direction D1, and the two second showerhead 407 of each pair are spaced apart in the up-down direction Z. The second showerhead 407 is configured and arranged in the same manner as the fourth showerhead 346 (see FIG. 18), with the lower second showerhead 407 being tilted upward and spraying gas forward toward the chip 1, and the upper second showerhead 407 being tilted downward and spraying gas forward toward the chip 1. Thereby, the compressed gas ejected from the second showerhead 407 can remove the water 409 on the chip 1. The structure and arrangement of each side nozzle 408 is the same as that of side nozzle 347 (FIG. 19). The two side air nozzles 408 are spaced apart from each other along the left-right direction Y, one of the two side air nozzles 408 laterally sprays air to the chip 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 along the left air spraying direction D3, and the other side air nozzle laterally sprays air to the chip 1 on the carrying jig 2 along the right air spraying direction D4, so as to remove the water 409 on the chip 1.
Referring to fig. 28, the neutralization region 41 has an overall structure similar to that of the etching region 32 of fig. 15, and the neutralization region 41 includes a separation section 411, a chemical reaction section 412 on the downstream side of the separation section 411, and a blow-drying section 413 on the downstream side of the chemical reaction section 412. The separating section 411 is located at the downstream side of the second cleaning section 402 (as shown in fig. 26) for separating the second cleaning section 402 from the chemical reaction section 412 to prevent the chemical solution in the chemical reaction section 412 from seeping into the second cleaning section 402. The chemical reaction section 412 forms a fourth chemical solution tank 414 for the carrying tool 2 conveyed by the first conveying mechanism 51 to pass through, and the fourth chemical solution tank 414 contains a fourth chemical solution 415 for soaking the carrying tool 2. The front and rear ends of the fourth liquid medicine tank 414 are also provided with two solid rollers 515 and two liquid cutting rollers 516. In the present embodiment, the fourth liquid medicine 415 is a neutralizing agent for neutralizing and removing oxides formed on the metal heat conduction layer 13 (as shown in fig. 2) of each chip 1. The chemical reaction section 412 includes a plurality of fourth liquid medicine nozzles 416 disposed in the fourth liquid medicine tank 414 and spaced apart from each other in the first conveying direction D1 and staggered up and down. One part of the fourth chemical liquid nozzle 416 sprays the fourth chemical liquid 415 in the form of a water jet upward to the chip 1 (see fig. 7) on the carrying fixture 2, and the other part sprays the fourth chemical liquid 415 in the form of a water jet downward to the chip 1.
Referring to fig. 28 and 29, the blowing section 413 includes two pairs of fourth spray nozzles 417 and two fourth side spray nozzles 418 located at the downstream side of the fourth chemical solution tank 414. Two pairs of fourth spray heads 417 are arranged at intervals in the first conveying direction D1, and the two fourth spray heads 417 of each pair are arranged at intervals in the up-down direction Z. The fourth nozzles 417 are arranged in the same manner as the first nozzles 327 (see fig. 15), and the lower fourth nozzle 417 is inclined upward and sprays air forward, and the upper fourth nozzle 417 is inclined downward and sprays air forward. Thereby, the fourth nozzle 417 can spray air to the chip 1 (as shown in fig. 7) to remove the fourth liquid medicine 415 on the chip 1. The fourth side nozzles 418 are configured and arranged in the same manner as the first side nozzles 328 (see fig. 17). The two fourth nozzles 418 are spaced apart from each other along the left-right direction Y, one of the two fourth nozzles 418 jets the gas toward the chip 1 on the carrying jig 2 conveyed by the first conveying mechanism 51 along the left gas jetting direction D3, and the other one of the two fourth nozzles 418 jets the gas toward the chip 1 on the carrying jig 2 along the right gas jetting direction D4, so as to remove the fourth chemical solution 415 on the chip 1.
Referring to fig. 30, the fourth cleaning region 42 has the same structure as the second cleaning region 36 of fig. 22. The fourth cleaning zone 42 includes a first cleaning section 421 located at the downstream side of the blow-drying section 413 (see fig. 28), a second cleaning section 422 located at the downstream side of the first cleaning section 421, and a third cleaning section 423 located at the downstream side of the second cleaning section 422. The first cleaning section 421 includes two first nozzles 424 spaced apart from each other along the vertical direction Z, and two first nozzles 425 spaced apart from each other along the vertical direction Z and located at the downstream side of the first nozzles 424. The first sprinkler head 424 is constructed identically to the first sprinkler head 364 (see fig. 22). One of the two first water spraying heads 424 sprays water 426 in the form of water jet upwards to the chip 1 (as shown in fig. 7) on the carrying fixture 2, and the other one sprays water 426 in the form of water jet downwards to the chip 1, thereby performing a first cleaning on the chip 1. The first showerhead 425 is constructed and arranged in the same manner as the first showerhead 365 (see FIG. 22), with the lower first showerhead 425 oriented obliquely upward and spraying gas forward and the upper first showerhead 425 oriented obliquely downward and spraying gas forward. Thereby, the first air nozzle 425 can spray air to the chip 1 on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the water 426 on the chip 1.
The second cleaning section 422 forms a water tank 427 for the carrying jig 2 conveyed by the first conveying mechanism 51 to pass through, and the water tank 427 contains water 428 for the carrying jig 2 to soak for cleaning the chip 1. The water tank 427 is similarly provided with two solid rollers 515 at the front and rear ends thereof, and two liquid-cutting rollers 516. The second cleaning section 422 includes a plurality of second water jet heads 429 disposed in the water tank 427 and spaced apart from each other in the first conveying direction D1 and staggered up and down, and two second water jet heads 430 spaced apart from each other in the up-down direction Z and disposed at the downstream side of the water tank 427. One part of the second water jet 429 upwardly jets water 428 in the form of water jet to the chip 1 on the carrying fixture 2, and the other part jets water 428 in the form of water jet to the chip 1, thereby performing a second cleaning operation on the chip 1. The second showerhead 430 is configured and arranged in the same manner as the second showerhead 370 (see FIG. 22), with the lower second showerhead 430 being angled upward and spraying gas forward and the upper second showerhead 430 being angled downward and spraying gas forward. Thereby, the second air-jet head 430 can jet air to the chip 1 on the carrying fixture 2 conveyed by the first conveying mechanism 51 to remove the water 428 on the chip 1.
Referring to fig. 30 and 31, the third cleaning section 423 includes a plurality of pairs of spraying members 431 arranged at intervals along the first conveying direction D1, two pairs of third nozzles 432 located at the downstream side of the spraying members 431, and two side nozzles 433 located at the downstream side of the spraying members 431. The structure and arrangement of each spray member 431 are the same as those of the spray member 371 (see fig. 22). The two spraying members 431 of each pair are spaced apart in the up-down direction Z, wherein the lower spraying member 431 sprays water 434 toward the chip 1 (see fig. 7) upward, and the upper spraying member 431 sprays water 434 toward the chip 1 downward. Thereby, the spraying member 431 can perform a third cleaning of the chip 1.
Two pairs of the third gas jets 432 are spaced apart in the first conveyance direction D1, and the two third gas jets 432 of each pair are spaced apart in the up-down direction Z. The third showerhead 432 is constructed and arranged in the same manner as the third showerhead 372 (see FIG. 22), in which the lower third showerhead 432 is inclined upward and jets air toward the chip 1, and the upper third showerhead 432 is inclined downward and jets air toward the chip 1. Thereby, the compressed gas ejected from the third showerhead 432 removes the water 434 on the chip 1. The structure and arrangement of each side air nozzle 433 are the same as those of the side air nozzle 373 (see FIG. 23). The two side air nozzles 433 are spaced apart from each other along the left-right direction Y, one of the two side air nozzles 433 sprays air to the chip 1 on the carrying fixture 2 conveyed by the first conveying mechanism 51 along the left air spraying direction D3, and the other one of the two side air nozzles 433 sprays air to the chip 1 on the carrying fixture 2 along the right air spraying direction D4, so as to remove the water 434 on the chip 1.
Referring to fig. 32, the drying section 44 includes a drying section 441 located downstream of the third cleaning section 423 (see fig. 30), and a drying section 442 located downstream of the drying section 441. The drying section 441 includes a plurality of pairs of first blowing members 443 arranged at intervals in the first conveying direction D1. The two first blowing members 443 of each pair are spaced apart from each other in the up-down direction Z, wherein the lower first blowing member 443 blows compressed air in the form of air knives toward the upper pair of chips 1 (see fig. 7), and the upper first blowing member 443 blows compressed air in the form of air knives toward the lower pair of chips 1. Therefore, the chip 1 on the bearing jig 2 is dried. The drying section 442 includes a plurality of pairs of second blowing members 444 arranged alternately and vertically in a staggered manner in the first conveying direction D1. One part of the second blowing member 444 blows compressed air in the form of an air knife upward toward the chip 1 on the carrier 2, and the other part blows compressed air in the form of an air knife downward toward the chip 1, thereby drying the chip 1 on the carrier 2. In the embodiment, the temperature of the compressed air blown out by the first blowing member 443 is, for example, equal to or less than 60 ℃, and the temperature of the compressed air blown out by the second blowing member 444 is, for example, between 85 ℃ and 90 ℃.
Referring to fig. 33, 34 and 35, the transfer device 6 is located at the rear end 302 of the machine body 3 and includes a temporary storage mechanism 61 located at the downstream side of the drying area 44 and a traverse mechanism 62 located at the downstream side of the temporary storage mechanism 61. The temporary storage mechanism 61 includes a first conveying unit 611 and a lifting unit 612. The first conveying unit 611 corresponds to the discharge rear end 512 of the first conveying mechanism 51, and has a plurality of first conveying wheels 613 arranged at intervals in the first conveying direction D1. The first conveying wheel 613 is used for receiving the loading jig 2 (see fig. 32) output from the discharging rear end 512, and can convey the loading jig 2 along the first conveying direction D1. The lift unit 612 includes two guide rods 614, a carriage 615, pairs of support rods 616, and a first drive assembly 617. The two guide bars 614 are arranged at intervals along the first conveying direction D1, and the axial direction of each guide bar 614 extends in the vertical direction Z. The carriage 615 is slidably coupled to the two guide rods 614. The plurality of pairs of support rods 616 are disposed on the carriage 615 and are spaced apart from each other in the vertical direction Z, and the two support rods 616 of each pair are spaced apart from each other in the front-rear direction X. Each of the supporting rods 616 can move along the vertical direction Z through between the two corresponding first conveying wheels 613, so that each pair of supporting rods 616 can lift the carrier jig 2 on the first conveying wheels 613 to support the carrier jig 2, or place the supported carrier jig 2 on the first conveying wheels 613. The first drive assembly 617 is coupled to the carriage 615 to drive the carriage 615 in an upward or downward direction Z.
The traverse mechanism 62 includes a second conveying unit 621, and a traverse unit 622. The second conveying unit 621 includes a plurality of second conveying wheels 623 arranged at intervals along the first conveying direction D1, wherein the second conveying wheels 623 are configured to receive the carrying jigs 2 outputted from the first conveying unit 611 and output the carrying jigs to the second conveying mechanism 52. The traverse unit 622 includes a guide 624, a slider 625, and a second drive assembly 626. The guide rail 624 is long and extends in the left-right direction Y. The slider 625 is slidably coupled to the guide rail 624 and can slide in the left-right direction Y, and the slider 625 is coupled to the bottom end of the second transporting unit 621. The second driving assembly 626 is connected to the sliding member 625 for driving the sliding member 625 to slide along the left-right direction Y, so that the sliding member 625 can drive the second conveying unit 621 to move between a first position (as shown in fig. 35) aligned with the first conveying unit 611 and a second position (as shown in fig. 38) aligned with the feeding rear end 521. When the second conveying unit 621 is at the first position, the second conveying unit 621 can receive the carrying fixture 2 output by the first conveying unit 611. When the second conveying unit 621 is at the second position, the second conveying unit 621 can convey the received carrier fixture 2 to the second conveying mechanism 52. Thereby, the second conveying mechanism 52 can convey the carrying tool 2 along the second conveying direction D2 (as shown in fig. 10) to move in the reflow region 45 and discharge the carrying tool through the discharging front end 522 (as shown in fig. 10).
The following description is made with respect to a processing method of the wet processing apparatus 300:
referring to fig. 36, the processing method of the wet processing apparatus 300 of the present embodiment includes the following steps: a conveyance step S1, a wetting step S2, an etching step S3, a first cleaning step S4, a deoxidation step S5, a second cleaning step S6, a removal step S7, a third cleaning step S8, a neutralization step S9, a fourth cleaning step S10, a drying step S11, a transfer step S12, and a reflow step S13.
Referring to fig. 10 and fig. 36, in the conveying step S1, a plurality of carriers 2 are sequentially fed onto the first conveying mechanism 51 through the feeding front end 511, and then each carrier 2 is conveyed by the first conveying mechanism 51 of the conveying device 5 along the first conveying direction D1.
Referring to fig. 7, 12 and 13, in the wetting step S2, the loading jig 2 loaded onto the first conveying mechanism 51 through the loading front end 511 is located at the loading section 311 of the wetting region 31. Subsequently, the first conveying mechanism 51 conveys the carrying fixture 2 to the wetting section 312 along the first conveying direction D1 and moves therein. The water 310 sprayed upward from the lower spray members 314 of the wetting section 312 is sprayed to the chip 1 through the through holes 215 of the carrier tray 21, and the water 310 sprayed downward from the upper spray members 314 is sprayed to the chip 1 through the first openings 230 and the second openings 235 of the cover plate 23. Therefore, the chip 1 can be cleaned in advance to wash away dust or dirt on the chip 1, and the pins 12 (as shown in fig. 6) and the metal protection layer 14 of the chip 1 can be wetted, so that the reaction speed of the pins 12 and the metal protection layer 14 with the chemical liquid in the subsequent steps of the chip 1 can be increased.
Referring to fig. 7, 12 and 14, the first conveying mechanism 51 conveys the carrying fixture 2 to the drying section 313 along the first conveying direction D1 and moves therein. First, the gas ejected from the lower showerhead 315 adjacent to the wet section 312 is ejected to the chip 1 through the through hole 215 and drives the water 310 on the chip 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper gas nozzle 315 adjacent to the wet section 312 in a downward inclined manner scrapes off the water 310 discharged from the first opening 230 and the second opening 235, and the gas is also ejected to the chip 1 through the first opening 230 and the second opening 235 and drives the water 310 on the chip 1 to be discharged from the through hole 215, so as to perform a first drying operation on the chip 1. Similarly, another pair of nozzles 315, which are located away from the wet section 312, perform a second drying operation on the chip 1 in the manner described above.
Referring to fig. 7, 8, 9 and 14, on the other hand, the gas ejected from one of the side nozzles 316 along the left gas ejection direction D3 is ejected to the chip 1 through the corresponding side flow channel 24, and the gas ejected from the other side nozzle 316 along the right gas ejection direction D4 is ejected to the chip 1 through the corresponding side flow channel 24, so that the gas can drive the water 310 (as shown in fig. 13) on the chip 1 to be discharged through the through hole 215 or the end flow channel 25, so as to perform a third drying operation on the chip 1. Thereby, it is ensured that the water 310 on each chip 1 is completely blown off to avoid the water 310 on the chip 1 from being brought to the etching area 32 of the next station to affect or dilute the first chemical 325 (see fig. 15).
Referring to fig. 7, 8, 9 and 15, in the etching step S3, the first conveying mechanism 51 drives the carrying fixture 2 to enter the first chemical solution tank 324 of the chemical reaction section 322 through the separation section 321 of the etching area 32. The carrying tool 2 is completely immersed in the first chemical solution 325 during the movement of the first chemical solution tank 324. The first chemical 325 can flow into the chip 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side channel 24 and the end channel 25. In addition, the first chemical solution 325 sprayed upwards by the lower first chemical solution nozzle 326 flows to the chip 1 through the through hole 215, and the first chemical solution 325 sprayed downwards by the upper first chemical solution nozzle 326 flows to the chip 1 through the first opening 230 and the second opening 235, so that the first chemical solution 325 can smoothly flow in the carrier fixture 2. Therefore, the first chemical solution 325 can sufficiently and reliably react with each pin 12 (as shown in fig. 6) of the chip 1 or with the metal wire of the chip 1 generated by sawing and etch each pin 12 or metal wire, so that the distance between two adjacent pins 12 can be increased to a preset length, or the metal wire is removed, thereby preventing the metal wire from contacting with another adjacent pin 12 or two adjacent pins 12 from contacting with each other due to thermal expansion and cold contraction during subsequent use of the chip 1, and further causing short circuit.
Referring to fig. 7 and fig. 15, the first conveying mechanism 51 conveys the carrier fixture 2 to the drying section 323 along the first conveying direction D1 and moves therein. First, the gas ejected from the first nozzle 327 under the chemical reaction section 322 is ejected to the chip 1 through the through hole 215 and drives the first chemical 325 on the chip 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas sprayed from the first nozzle 327 above the chemical reaction section 322 in an inclined downward direction scrapes the first chemical 325 discharged from the first opening 230 and the second opening 235, and the gas is sprayed to the chip 1 through the first opening 230 and the second opening 235 to drive the first chemical 325 on the chip 1 to be discharged from the through hole 215, so as to perform a first drying operation on the chip 1. Similarly, another pair of first nozzles 327 apart from the chemical reaction section 322 performs a second drying operation on the chip 1 according to the above-mentioned manner.
Referring to fig. 7, 8, 9 and 17, on the other hand, the gas jetted from one of the first side nozzles 328 along the left gas jetting direction D3 is jetted to the chip 1 through the corresponding side flow channel 24, and the gas jetted from the other first side nozzle 328 along the right gas jetting direction D4 is jetted to the chip 1 through the corresponding side flow channel 24, so that the gas can discharge the first chemical 325 (as shown in fig. 16) remaining on the chip 1 through the through hole 215 or the end flow channel 25, so as to perform a third drying operation on the chip 1. This ensures that the first chemical 325 on each chip 1 is completely removed.
Referring to fig. 7 and 18, in the first cleaning step S4, the first conveying mechanism 51 drives the carrying fixture 2 to enter the first cleaning section 331 of the first cleaning region 33, the water 337 sprayed upwards from the first water spray head 335 below the first cleaning section 331 is sprayed to the chips 1 through the through holes 215, and the water 337 sprayed downwards from the first water spray head 335 above is sprayed to the chips 1 through the first opening 230 and the second opening 235, so as to perform a first cleaning process on the chips 1, and wash off the dried first liquid 325 on the chips 1. Then, the gas ejected from the lower first showerhead 336 is ejected to the chip 1 through the through hole 215 and drives the water 337 on the chip 1 to be discharged through the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper first showerhead 336 is tilted downward to scrape off the water 337 discharged from the first and second openings 230 and 235, and the gas is also ejected to the chip 1 through the first and second openings 230 and 235 to drive the water 337 on the chip 1 to be discharged from the through hole 215, thereby drying the chip 1.
Then, the first conveying mechanism 51 drives the carrying fixture 2 to enter the water tank 338 of the second cleaning section 332. The carrying tool 2 is completely immersed in the water 339 during the movement of the water tank 338. The water 339 can flow into the chip 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side runner 24 and the end runner 25. In addition, the water 339 sprayed upward by the lower second water spraying head 340 flows to the chip 1 through the through hole 215, and the water 339 sprayed downward by the upper second water spraying head 340 flows to the chip 1 through the first opening 230 and the second opening 235, so that the water 339 can smoothly flow in the carrying fixture 2 to perform a second cleaning process on each chip 1. Then, the gas ejected from the second lower showerhead 341 in an upward slant is ejected to the chip 1 through the through hole 215 and drives the water 339 on the chip 1 to be discharged from the first opening 230 and the second opening 235. The gas jetted from the upper second showerhead 341 inclined downward will scrape the water 339 discharged from the first and second openings 230 and 235, and at the same time, the gas will be jetted to the chip 1 through the first and second openings 230 and 235 to drive the water 339 on the chip 1 to be discharged from the through hole 215, so as to dry the chip 1.
The first conveying mechanism 51 then drives the loading fixture 2 into the third cleaning section 333. The water 344 sprayed upwards by the first spraying member 342 below the third cleaning section 333 is sprayed to the chips 1 through the through holes 215, and the water 344 sprayed downwards by the first spraying member 342 above is sprayed to the chips 1 through the first opening 230 and the second opening 235, so as to perform a third cleaning process on each chip 1. Then, the gas ejected from the third lower showerhead 343 is ejected to the chip 1 through the through hole 215 and drives the water 344 on the chip 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected from the upper third showerhead 343 is tilted downward to scrape off the water 344 discharged from the first opening 230 and the second opening 235, and the gas is also ejected to the chip 1 through the first opening 230 and the second opening 235 to drive the water 344 on the chip 1 to be discharged from the through hole 215, thereby drying the chip 1.
Referring to fig. 7, 8, 18 and 19, the first conveying mechanism 51 then drives the loading jig 2 into the fourth cleaning section 334. The water 348 sprayed upward by the second spraying members 345 below the fourth cleaning section 334 is sprayed to the chips 1 through the through holes 215, and the water 348 sprayed downward by the second spraying members 345 above is sprayed to the chips 1 through the first openings 230 and the second openings 235, so as to perform a fourth cleaning operation on each chip 1. By means of the four cleaning mechanisms of the first cleaning region 33, the first chemical solution 325 remaining on each chip 1 can be completely cleaned and removed, so as to prevent the first chemical solution 325 remaining on the chip 1 from being brought to the next station oxidation removal region 35 to affect the second chemical solution 355 (as shown in fig. 20).
The gas emitted from the fourth nozzle 346 adjacent to the second spraying member 345 is sprayed to the chip 1 through the through hole 215 and drives the water 348 on the chip 1 to be discharged from the first opening 230 and the second opening 235. The gas sprayed from the fourth nozzle 346 adjacent to the second spraying member 345 in a downward direction will scrape the water 348 discharged from the first and second openings 230 and 235, and the gas will be sprayed to the chip 1 through the first and second openings 230 and 235 to drive the water 348 on the chip 1 to be discharged from the through hole 215, so as to perform the first drying operation on the chip 1. Similarly, another pair of fourth nozzles 346, which are far from the second spraying member 345, perform a second drying operation on the chip 1 in the manner described above.
On the other hand, the gas ejected from one of the side nozzles 347 along the left gas ejecting direction D3 will be ejected to the chip 1 through the corresponding side flow channel 24, and the gas ejected from the other side nozzle 347 along the right gas ejecting direction D4 will be ejected to the chip 1 through the corresponding side flow channel 24, so that the gas can drive the water 348 remaining on the chip 1 to be discharged through the through hole 215 or the end flow channel 25, so as to perform a third drying operation on the chip 1. Thereby, it is ensured that the water 348 on each chip 1 is completely blown off, so as to prevent the water 348 remaining on the chip 1 from being brought to the next deoxidation area 35 to affect or dilute the second liquid medicine 355.
Referring to fig. 7, 8, 9 and 20, in the deoxidation step S5, the first conveying mechanism 51 drives the carrying fixture 2 to enter the second chemical solution tank 354 of the chemical reaction section 352 through the separation section 351 of the deoxidation area 35. The carrying tool 2 is completely immersed in the second chemical liquid 355 during the process of moving in the second chemical liquid tank 354. The second liquid 355 can flow into the chip 1 in the carrier 2 through the through hole 215, the first opening 230, the second opening 235, the side channel 24 and the end channel 25. In addition, the second chemical liquid 355 sprayed upwards by the lower second chemical liquid spray head 356 flows to the chip 1 through the through hole 215, and the second chemical liquid 355 sprayed downwards by the upper second chemical liquid spray head 356 flows to the chip 1 through the first opening 230 and the second opening 235, so that the second chemical liquid 355 can smoothly flow in the carrier tool 2. Thereby, the second chemical 355 can sufficiently and reliably perform a chemical reaction of deoxidation with each lead 12 (see fig. 6) of the chip 1. After the chip 1 goes through the etching step S3, since the leads 12 are partially oxidized when contacting water and gas, the second chemical 355 deoxidizes the leads 12 to passivate the leads 12 with copper oxide to form a protective layer to prevent the leads 12 from being oxidized.
Referring to fig. 7 and 20, the first conveying mechanism 51 conveys the carrying jig 2 to the drying section 353 along the first conveying direction D1 and moves therein. First, the gas sprayed from the second nozzle 357 under the chemical reaction section 352 and inclined upward is sprayed to the chip 1 through the through hole 215 and drives the second chemical 355 on the chip 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas sprayed from the second nozzle 357 disposed above the chemical reaction section 352 and inclined downward will scrape the second chemical 355 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will be sprayed to the chip 1 through the first opening 230 and the second opening 235 to drive the second chemical 355 on the chip 1 to be discharged from the through hole 215, so as to perform the first drying operation on the chip 1. Similarly, another pair of second nozzles 357 apart from the chemical reaction section 352 performs a second drying operation on the chip 1 according to the above-mentioned manner.
Referring to fig. 7, 8, 9 and 21, on the other hand, the gas ejected from one of the second side nozzles 358 along the left gas ejection direction D3 is ejected to the chip 1 through the corresponding side flow channel 24, and the gas ejected from the other second side nozzle 358 along the right gas ejection direction D4 is ejected to the chip 1 through the corresponding side flow channel 24, so that the gas can discharge the second chemical 355 remaining on the chip 1 through the through hole 215 or the end flow channel 25, so as to perform a third drying operation on the chip 1. This ensures that the second chemical 355 on each chip 1 is completely removed.
Referring to fig. 7 and 22, in the second cleaning step S6, the first conveying mechanism 51 drives the carrying fixture 2 to enter the first cleaning section 361 of the second cleaning region 36, the water 366 sprayed upward from the first water spraying head 364 below the first cleaning section 361 is sprayed to the chips 1 through the through holes 215, and the water 366 sprayed downward from the first water spraying head 364 above is sprayed to the chips 1 through the first opening 230 and the second opening 235, so as to perform a first cleaning process on the chips 1, and wash off the dried second liquid medicine 355 on the chips 1. Then, the gas ejected from the lower first showerhead 365 is ejected to the chip 1 through the through hole 215 and drives the water 366 on the chip 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper first showerhead 365 while tilting downward will scrape the water 366 discharged from the first opening 230 and the second opening 235, and the gas will also be ejected to the chip 1 through the first opening 230 and the second opening 235 and drive the water 366 on the chip 1 to be discharged from the through hole 215, so as to dry the chip 1.
Then, the first conveying mechanism 51 drives the carrying fixture 2 to enter the water tank 367 of the second cleaning section 362. The carrying fixture 2 is completely immersed in the water 368 during the movement in the water tank 367. The water 368 can flow into the chip 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side runners 24 and the end runners 25. In addition, the water 368 jetted upwards by the lower second water jet 369 flows to the chip 1 through the through hole 215, and the water 368 jetted downwards by the upper second water jet 369 flows to the chip 1 through the first opening 230 and the second opening 235, so that the water 368 can smoothly flow in the carrying fixture 2 to perform the second cleaning on each chip 1. Then, the gas ejected from the second showerhead 370 is ejected to the chip 1 through the through hole 215 and drives the water 368 on the chip 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected by the second showerhead 370 is blown downward and is blown to the chip 1 through the first and second openings 230 and 235, and drives the water 368 on the chip 1 to be discharged through the through hole 215, so as to dry the chip 1.
Referring to fig. 7, 8, 9, 22 and 23, the first conveying mechanism 51 then drives the loading fixture 2 into the third cleaning section 363. The water 374 sprayed upwards from the lower spraying part 371 of the third cleaning section 363 is sprayed to the chip 1 through the through hole 215, and the water 374 sprayed downwards from the upper spraying part 371 is sprayed to the chip 1 through the first opening 230 and the second opening 235, so as to perform a third cleaning process on each chip 1. By the three cleaning mechanisms of the second cleaning region 36, the second liquid medicine 355 remaining on each chip 1 can be completely cleaned and removed, so as to prevent the second liquid medicine 355 remaining on the chip 1 from being brought to the removing region 39 of the next station and further affecting the third liquid medicine 395 (see fig. 24).
The gas jetted from the third nozzle 372 under the adjacent spraying part 371 is jetted to the chip 1 through the through hole 215 and drives the water 374 on the chip 1 to be discharged from the first opening 230 and the second opening 235. The gas jetted from the third nozzle 372, which is adjacent to the spraying part 371, is inclined downward to scrape off the water 374 discharged from the first opening 230 and the second opening 235, and the gas is also jetted to the chip 1 through the first opening 230 and the second opening 235 to drive the water 374 on the chip 1 to be discharged from the through hole 215, so as to perform a first drying operation on the chip 1. Similarly, another pair of third nozzles 372 away from the spraying unit 371 performs a second drying operation on the chip 1 in the manner described above.
Finally, the gas ejected from one of the side nozzles 373 along the left gas ejection direction D3 is ejected to the chip 1 through the corresponding side channel 24, and the gas ejected from the other side nozzle 373 along the right gas ejection direction D4 is ejected to the chip 1 through the corresponding side channel 24, so that the gas can drive the water 374 remaining on the chip 1 to be discharged through the through hole 215 or the end channel 25, so as to perform a third drying operation on the chip 1. Thereby, it is ensured that the water 374 on each chip 1 is completely blown off to avoid that the water 374 remaining on the chip 1 is brought to the removal region 39 of the next station to affect or dilute the third liquid medicine 395.
Referring to fig. 10 and 11, the first conveying mechanism 51 then drives the carrier 2 into the inspection area 38, and the worker can take out the carrier 2 and inspect the etching condition of the leads 12 of each chip 1 by controlling the first conveying mechanism 51 to stop operating.
Referring to fig. 7, 8, 9 and 24, in the removing step S7, the first conveying mechanism 51 drives the carrying fixture 2 to enter the third liquid chemical tank 394 of the chemical reaction section 392 through the separating section 391 of the removing region 39. The carrying tool 2 is completely immersed in the third chemical 395 during the movement of the third chemical 394. The third liquid 395 can flow into the chip 1 in the carrier 2 through the through hole 215, the first opening 230, the second opening 235, the side channel 24 and the end channel 25. In addition, the third chemical agent 395 sprayed upward from the lower third chemical agent nozzle 396 flows to the chip 1 through the through hole 215, and the third chemical agent 395 sprayed downward from the upper third chemical agent nozzle 396 flows to the chip 1 through the first opening 230 and the second opening 235, so that the third chemical agent 395 can smoothly flow in the carrying fixture 2. Therefore, the third chemical 395 can sufficiently and reliably react with the metal passivation layer 14 of the chip 1 to remove the metal passivation layer 14, that is, the removing step S7 is a silver stripping step for stripping the metal passivation layer 14.
Referring to fig. 7 and 24, next, the first conveying mechanism 51 conveys the carrying jig 2 to and moves in the drying section 393 along the first conveying direction D1. First, the gas ejected from the third showerhead 397 inclined upward under the chemical reaction section 392 is ejected to the chip 1 through the through hole 215 and drives the third solution 395 on the chip 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected by the third nozzle 397 inclined downward from the upper portion of the chemical reaction section 392 scrapes off the third liquid 395 discharged from the first opening 230 and the second opening 235, and the gas is also ejected to the chip 1 through the first opening 230 and the second opening 235 to drive the third liquid 395 on the chip 1 to be discharged from the through hole 215, so as to perform a first drying operation on the chip 1. Similarly, another pair of third liquid chemicals 395 far away from the chemical reaction section 322 will perform the second drying operation on the chip 1 according to the aforementioned manner.
Referring to fig. 7, 8, 9 and 25, on the other hand, the gas ejected from one of the third side nozzles 398 along the left gas ejection direction D3 is ejected to the chip 1 through the corresponding side flow channel 24, and the gas ejected from the other third side nozzle 398 along the right gas ejection direction D4 is ejected to the chip 1 through the corresponding side flow channel 24, so that the gas can discharge the third liquid medicine 395 remaining on the chip 1 through the through hole 215 or the end flow channel 25, so as to perform a third drying operation on the chip 1. This ensures that the third chemical 395 on each chip 1 is completely removed.
Referring to fig. 7 and 26, in the third cleaning step S8, the first conveying mechanism 51 drives the carrying fixture 2 to enter the first cleaning section 401 of the third cleaning region 40, the water 405 sprayed upward from the first water spraying head 403 below the first cleaning section 401 is sprayed to the chips 1 through the through holes 215, and the water 366 sprayed downward from the first water spraying head 403 above is sprayed to the chips 1 through the first opening 230 and the second opening 235, so as to perform a first cleaning process on the chips 1, and wash off the dried third liquid medicine 395 on the chips 1. Then, the gas ejected from the lower first showerhead 404 is ejected to the chip 1 through the through hole 215 and drives the water 405 on the chip 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper first showerhead 404 by tilting downward will scrape the water 405 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will be ejected to the chip 1 through the first opening 230 and the second opening 235 and drive the water 405 on the chip 1 to be discharged from the through hole 215, so as to dry the chip 1.
Referring to fig. 7, 8, 9, 26 and 27, the first conveying mechanism 51 then drives the carrying fixture 2 into the second cleaning section 402. The water 409 sprayed upward from the lower spray member 406 of the second cleaning section 402 is sprayed to the chips 1 through the through holes 215, and the water 409 sprayed downward from the upper spray member 406 is sprayed to the chips 1 through the first openings 230 and the second openings 235, so as to perform a second cleaning process on each chip 1. By means of the two cleaning mechanisms of the third cleaning region 40, the third liquid medicine 395 remaining on each chip 1 can be completely cleaned and removed, so as to avoid the third liquid medicine 395 remaining on the chip 1 from being brought to the neutralizing region 41 of the next station to affect the fourth liquid medicine 415 (see fig. 28).
The gas ejected from the second showerhead 407, which is located below and adjacent to the spraying member 406 and is inclined upward, is sprayed to the chip 1 through the through hole 215 and drives the water 409 on the chip 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected by the second nozzle 407 obliquely downward adjacent to the spraying member 406 scrapes off the water 409 discharged from the first opening 230 and the second opening 235, and the gas is also ejected to the chip 1 through the first opening 230 and the second opening 235 and drives the water 409 on the chip 1 to be discharged from the through hole 215, so as to perform a first drying operation on the chip 1. Similarly, another pair of second nozzles 407, which are far from the spraying member 406, performs a second drying operation on the chip 1 in the manner described above.
Finally, the gas ejected from one of the side nozzles 408 along the left gas ejection direction D3 is ejected to the chip 1 through the corresponding side channel 24, and the gas ejected from the other side nozzle 408 along the right gas ejection direction D4 is ejected to the chip 1 through the corresponding side channel 24, so that the gas can drive the water 374 remaining on the chip 1 to be discharged through the through hole 215 or the end channel 25, so as to perform a third drying operation on the chip 1. Thereby, it is ensured that the water 409 on each chip 1 is completely blown off to avoid that the water 409 remaining on the chip 1 is brought to the neutralization zone 41 of the next station to influence or dilute the fourth liquid medicine 415.
Referring to fig. 7, 8, 9 and 28, in the neutralizing step S9, the first conveying mechanism 51 drives the carrying fixture 2 to enter the fourth liquid medicine tank 414 of the chemical reaction section 412 through the separating section 411 of the neutralizing area 41. The carrying tool 2 is completely immersed in the fourth liquid medicine 415 during the moving process of the fourth liquid medicine tank 414. The fourth liquid medicine 415 can flow into the chip 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side runners 24 and the end runners 25. In addition, the fourth chemical solution 415 sprayed upwards by the lower fourth chemical solution nozzle 416 flows to the chip 1 through the through hole 215, and the fourth chemical solution 415 sprayed downwards by the upper fourth chemical solution nozzle 416 flows to the chip 1 through the first opening 230 and the second opening 235, so that the fourth chemical solution 415 can smoothly flow in the carrier fixture 2. Thereby, the fourth chemical solution 415 can sufficiently and reliably generate a chemical neutralization reaction with the metal heat conduction layer 13 of the chip 1 to neutralize and remove oxides formed on the metal heat conduction layer 13.
Referring to fig. 7 and 28, the first conveying mechanism 51 conveys the carrier jig 2 to the drying section 413 along the first conveying direction D1 and moves therein. First, the gas ejected from the fourth nozzle 417 under the chemical reaction section 412 is ejected to the chip 1 through the through hole 215 and drives the fourth chemical 415 on the chip 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper fourth nozzle 417 adjacent to the chemical reaction section 412 in an inclined downward direction scrapes off the fourth chemical 415 discharged from the first opening 230 and the second opening 235, and the gas is also ejected to the chip 1 through the first opening 230 and the second opening 235 and drives the fourth chemical 415 on the chip 1 to be discharged from the through hole 215, so as to perform a first drying operation on the chip 1. Similarly, another pair of fourth liquids 415 away from the chemical reaction section 412 performs a second drying operation on the chip 1 in the manner described above.
Referring to fig. 7, 8, 9 and 29, finally, the gas ejected from one of the fourth nozzles 418 along the left gas ejection direction D3 is ejected to the chip 1 through the corresponding side channel 24, and the gas ejected from the other fourth nozzle 418 along the right gas ejection direction D4 is ejected to the chip 1 through the corresponding side channel 24, so that the gas can discharge the fourth chemical 415 remaining on the chip 1 through the through hole 215 or the end channel 25, so as to perform a third drying operation on the chip 1. This ensures that the fourth chemical 415 on each chip 1 is completely removed.
Referring to fig. 7 and 30, in the fourth cleaning step S10, the first conveying mechanism 51 drives the carrying fixture 2 to enter the first cleaning section 421 of the fourth cleaning region 42, the water 426 sprayed upwards from the first water spraying head 424 below the first cleaning section 421 is sprayed to the chips 1 through the through holes 215, and the water 426 sprayed downwards from the first water spraying head 424 above is sprayed to the chips 1 through the first opening 230 and the second opening 235, so as to perform a first cleaning process on the chips 1, and wash off the dried fourth liquid medicine 415 on the chips 1. Then, the gas ejected from the lower first showerhead 425 obliquely upward is ejected to the chip 1 through the through hole 215 and drives the water 426 on the chip 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected from the upper first showerhead 425 by tilting downward will scrape the water 426 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will be ejected to the chip 1 through the first opening 230 and the second opening 235 and drive the water 426 on the chip 1 to be discharged from the through hole 215, so as to dry the chip 1.
Then, the first conveying mechanism 51 drives the carrying fixture 2 to enter the water tank 427 of the second cleaning section 422. The supporting tool 2 is completely immersed in the water 428 during the movement in the water trough 427. The water 428 can flow into the chip 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side runners 24 and the end runners 25. In addition, the water 428 jetted upward from the lower second water jet 429 flows to the chip 1 through the through hole 215, and the water 428 jetted downward from the upper second water jet 429 flows to the chip 1 through the first opening 230 and the second opening 235, so that the water 428 can smoothly flow in the carrying fixture 2 for performing the second cleaning on each chip 1. Then, the gas ejected from the second lower showerhead 430 is ejected to the chip 1 through the through hole 215 and drives the water 428 on the chip 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected from the upper second showerhead 430 is blown downward in an inclined manner to scrape off the water 428 discharged from the first and second openings 230 and 235, and the gas is also blown to the chip 1 through the first and second openings 230 and 235 to drive the water 428 on the chip 1 to be discharged from the through hole 215, thereby drying the chip 1.
Referring to fig. 7, 8, 30 and 31, the first conveying mechanism 51 then drives the loading fixture 2 into the third cleaning section 423. The water 434 sprayed upwards by the lower spraying member 431 of the third cleaning section 423 is sprayed to the chip 1 through the through hole 215, and the water 434 sprayed downwards by the upper spraying member 431 is sprayed to the chip 1 through the first opening 230 and the second opening 235, so as to perform a third cleaning process on each chip 1. The third cleaning mechanism of the fourth cleaning region 42 can ensure that the fourth chemical 415 remaining on each chip 1 can be completely cleaned and removed.
The gas emitted from the third gas nozzle 432 under the spraying member 431 and inclined upward is sprayed to the chip 1 through the through hole 215 and drives the water 434 on the chip 1 to be discharged from the first opening 230 and the second opening 235. The gas sprayed from the third nozzle 432 adjacent to the spraying member 431 and inclined downward will scrape the water 434 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will be sprayed to the chip 1 through the first opening 230 and the second opening 235 and drive the water 434 on the chip 1 to be discharged from the through hole 215, so as to perform the first drying operation on the chip 1. Similarly, another pair of third nozzles 432 far from the spraying member 431 performs a second drying operation on the chip 1 in the manner described above.
Finally, the gas ejected from one of the side nozzles 433 along the left gas ejection direction D3 is ejected to the chip 1 through the corresponding side channel 24, and the gas ejected from the other side nozzle 433 along the right gas ejection direction D4 is ejected to the chip 1 through the corresponding side channel 24, so that the gas can drive the residual water 434 on the chip 1 to be discharged through the through hole 215 or the end channel 25, so as to perform a third drying operation on the chip 1. This ensures that the water 434 on each chip 1 is completely blown off.
Referring to fig. 7 and 32, in the drying step S11, the first conveying mechanism 51 drives the carrier fixture 2 to enter the drying section 441 of the drying region 44, the gas ejected upward by the first blowing members 443 located below is ejected to the chip 1 through the through holes 215, and the gas ejected downward by the first blowing members 443 located above is ejected to the chip 1 through the first openings 230 and the second openings 235. Since the temperature of the compressed air blown out by the first blowing member 443 is, for example, 60 ℃ or less, the chips 1 can be blown dry first.
The first conveying mechanism 51 then drives the carrier fixture 2 into the drying section 442, the gas ejected upward from the lower second blowing members 444 is ejected to the chip 1 through the through holes 215, and the gas ejected downward from the upper second blowing members 444 is ejected to the chip 1 through the first openings 230 and the second openings 235. Since the temperature of the compressed air blown out by the second blowing member 444 is, for example, 85 to 90 ℃, each chip 1 can be dried first.
Referring to fig. 37 and 38, in the transferring step S12, the first conveying mechanism 51 drives the carrier 2 to be discharged from the discharge rear end 512 and enter the first conveying unit 611 of the temporary storage mechanism 61, and then the first conveying wheel 613 of the first conveying unit 611 conveys the carrier 2 to the second conveying unit 621 of the traverse mechanism 62 along the first conveying direction D1. Next, the second driving assembly 626 drives the second transporting unit 621 to move from the first position shown in fig. 38 to the second position shown in fig. 38 through the sliding member 625 (see fig. 35), so that the second transporting unit 621 aligns with the second transporting mechanism 52.
Referring to fig. 34 and 37, it should be noted that if the traversing mechanism 62 fails and cannot operate, the first conveying wheel 613 of the first conveying unit 611 does not convey the loading jig 2 along the first conveying direction D1. At this time, the first driving assembly 617 of the lifting unit 612 drives the sliding rack 615 to move upward along the up-down direction Z for a certain distance, so that the pair of supporting rods 616 can lift the carrying jig 2 on the first transporting wheel 613 upward to move away from the first transporting wheel 613. Thereby, the next carrier 2 discharged from the discharging rear end 512 can be moved to the first conveying unit 611, so that the other pair of supporting rods 616 can lift the carrier 2 on the first conveying wheel 613 upward and move away from the first conveying wheel 613 in the manner described above. Therefore, the temporary storage bearing jig 2 is achieved. After the traverse mechanism 62 is repaired, the first driving assembly 617 of the lifting unit 612 drives the sliding frame 615 to move downward along the up-down direction Z for a certain distance, so that the pair of supporting rods 616 can place the supported carrier 2 back on the first conveying wheel 613. Then, the first conveying wheel 613 can convey the carrier tool 2 to the second conveying unit 621.
Referring to fig. 10 and 38, in the reflow step S13, the second conveying wheel 623 of the second conveying unit 621 at the second position conveys the carrier 2 along the second conveying direction D2, so that the carrier 2 is fed to the second conveying mechanism 52 through the feeding rear end 521. Subsequently, the second conveying mechanism 52 can convey the carrier 2 along the second conveying direction D2 to discharge the carrier 2 through the discharging front end 522. Therefore, the feeding and discharging operations of the bearing jig 2 can be processed at the front end 301 of the machine body 3, and the configuration quantity and the labor cost of personnel can be saved.
Referring to fig. 2 and 11, in another implementation of the present embodiment, if each chip 1 does not have the metal passivation layer 14, the removing step S7, the third cleaning step S8, the neutralizing step S9 and the fourth cleaning step S10 may be omitted in the processing method of the wet processing apparatus 300, i.e., the removing region 39, the third cleaning region 40, the neutralizing region 41 and the fourth cleaning region 42 of the wet processing apparatus 300 are stopped. That is, the wet processing apparatus 300 may selectively perform or stop the removing step S7 (i.e., the silver stripping step), the third cleaning step S8, the neutralizing step S9, and the fourth cleaning step S10 according to the form of the chip 1, so that the wet processing apparatus 300 is very flexible in use to meet the user' S demand.
Referring to fig. 20 and 22, in another embodiment of the present invention, the second cleaning step S6 may be omitted in the aforementioned process according to the different characteristics of the second chemical 355 used in the deoxidation area 35, that is, the second cleaning area 36 is not opened. Thereby, the wet processing apparatus 300 can flexibly adjust and control whether to open the second cleaning region 36 according to the characteristics of the second chemical liquid 355 used in the deoxidation region 35. The above operation does not affect the etching step S3 and the first cleaning step S4, so that the wet processing apparatus 300 can still perform the operation of micro-etching the chip 1.
Referring to fig. 7, the wet processing apparatus 300 is designed with a dedicated Carrier jig 2 (referred to as "Boat" or "Carrier") so that the chip 1 can selectively hold the first surface 111 facing downward on each Carrier 223 or hold the second surface 112 facing downward on each Carrier 223. Therefore, the flexibility in use can be improved to meet the requirements in use, and the quality of the processing chip 1 can be improved.
In summary, in the wet processing apparatus 300 of the embodiment, the first chemical solution 325 in the etching area 32 can sufficiently and reliably react with each of the pins 12 of the chip 1 or the metal wire of the chip 1 generated by sawing and etch each of the pins 12 or the metal wire, so that the distance between two adjacent pins 12 can be increased to a preset length, or the metal wire is removed, so as to prevent the metal wire from contacting another adjacent pin 12 or two adjacent pins 12 from contacting each other due to thermal expansion and contraction during subsequent use of the chip 1, thereby causing a short circuit, and the purpose of the present invention can be achieved.
Claims (27)
1. The wet processing equipment is suitable for processing a plurality of chips carried by a carrying jig; the method is characterized in that:
the wet processing equipment comprises a conveying device, an etching area, a first cleaning area, a deoxidation area and a second cleaning area, the conveying device can convey the bearing jig to move along a first conveying direction, the etching area is provided with a first liquid medicine for soaking the bearing jig conveyed by the conveying device to etch the pins of each chip, the first cleaning area is positioned at the downstream side of the etching area and used for cleaning the chip on the bearing fixture output by the etching area, the deoxidation area is positioned at the downstream side of the first cleaning area, and a second liquid medicine used for soaking the bearing jig conveyed by the conveying device to generate a deoxidation reaction on the pins of each chip, the second cleaning area is positioned at the downstream side of the deoxidation area and is used for cleaning the chip on the bearing fixture output by the deoxidation area.
2. The wet processing apparatus of claim 1, wherein: the etching area is provided with two first spray heads and two first side nozzles, the two first spray heads are positioned on the downstream side of the first liquid medicine tank, the first spray heads are spaced in the vertical direction perpendicular to the first conveying direction and used for spraying air to the chip on the bearing jig so as to remove the first liquid medicine, and the first side nozzles are spaced in the horizontal direction perpendicular to the vertical direction and used for spraying air to the chip on the bearing jig so as to remove the first liquid medicine.
3. The wet processing apparatus of claim 2, wherein: the etching area further comprises a plurality of first liquid medicine nozzles arranged in the first liquid medicine tank, one part of the first liquid medicine nozzles upwards sprays the first liquid medicine in a water jet mode to the chip, the other part downwards sprays the first liquid medicine in the water jet mode to the chip, one of the first side nozzles sprays air to the chip along a left air spraying direction, and the other one sprays air to the chip along a right air spraying direction opposite to the left air spraying direction.
4. The wet processing apparatus of claim 1, wherein: the first cleaning section comprises a first cleaning section and a second cleaning section located at the downstream side of the first cleaning section, the first cleaning section comprises two first water spray heads which are spaced from each other in the vertical direction perpendicular to the first conveying direction, and two first air spray heads which are spaced from each other in the vertical direction and located at the downstream side of the first water spray heads, the first water spray heads are used for spraying water in the form of a water knife to the chip, the first air spray heads are used for spraying air to the chip to remove the water, the second cleaning section is formed with a water tank which contains the water used for cleaning the chip, the second cleaning section comprises two second water spray heads which are spaced from each other in the vertical direction, and two second air spray heads which are spaced from each other in the vertical direction and located at the downstream side of the second water spray heads, and the second water spray heads are used for spraying water in the form of a water knife to the chip, the second gas nozzle is used for spraying gas to the chip to remove the water.
5. The wet processing apparatus of claim 4, wherein: first washing district still including being located the third washing section of second washing section downstream side, the third washing section contains many pairs of edges first spraying piece of first direction of delivery looks interval arrangement, and two edges upper and lower direction looks interval just is located the third jet-propelled head of first spraying piece downstream side, every pair of two first spraying pieces edge upper and lower direction looks interval is used for right the chip sprays water, the third jet-propelled head is used for right the chip spouts the gas in order to remove water.
6. The wet processing apparatus of claim 5, wherein: the first cleaning area comprises a fourth cleaning section positioned at the downstream side of the third cleaning section, the fourth cleaning section comprises a plurality of pairs of second spraying pieces arranged at intervals along the first conveying direction, two fourth air nozzles arranged at intervals along the upper direction and the lower direction and positioned at the downstream side of the second spraying pieces, and two side air nozzles positioned at the downstream side of the second spraying pieces, and each pair of the two second spraying pieces are used for spraying water to the chip at intervals along the upper direction and the lower direction, the fourth air nozzle is used for spraying air to the chip to remove the water, the side air nozzles are spaced along the left-right direction perpendicular to the up-down direction, the chip carrying fixture is used for carrying the chip on the chip carrying fixture and is conveyed by the first conveying mechanism, the chip carrying fixture is used for carrying out lateral air injection to remove the water, one of the lateral air injection nozzles is used for injecting air to the chip along the left air injection direction, and the other is to jet the chip in a right jet direction opposite to the left jet direction.
7. The wet processing apparatus of claim 2, wherein: the deoxidation area is used for allowing the bearing jig to penetrate through and accommodating a second liquid medicine tank of the second liquid medicine, the deoxidation area comprises two second spray heads and two second side nozzles, the two second spray heads are located on the downstream side of the second liquid medicine tank, the second spray heads are used for spraying air to the chip at intervals along the vertical direction so as to remove the second liquid medicine, and the second side nozzles are used for spraying air to the chip laterally at intervals along the left-right direction so as to remove the second liquid medicine.
8. The wet processing apparatus of claim 7, wherein: the deoxidation area also comprises a plurality of second liquid medicine spray heads arranged in the second liquid medicine tank, one part of the second liquid medicine spray heads upwards sprays the second liquid medicine in a water jet mode to the chip, the other part downwards sprays the second liquid medicine in the water jet mode to the chip, one of the second side nozzles sprays air to the chip along a left air injection direction, and the other side nozzle sprays air to the chip along a right air injection direction opposite to the left air injection direction.
9. The wet processing apparatus of claim 1, wherein: the second cleaning section comprises a first cleaning section and a second cleaning section located at the downstream side of the first cleaning section, the first cleaning section comprises two first water spray heads which are spaced from each other in the vertical direction perpendicular to the first conveying direction, and two first air spray heads which are spaced from each other in the vertical direction and located at the downstream side of the first water spray heads, the first water spray heads are used for spraying water in the form of a water knife to the chip, the first air spray heads are used for spraying air to the chip to remove the water, the second cleaning section is formed with a water tank which contains the water used for cleaning the chip, the second cleaning section comprises two second water spray heads which are spaced from each other in the vertical direction, and two second air spray heads which are spaced from each other in the vertical direction and located at the downstream side of the second water spray heads, and the second water spray heads are used for spraying water in the form of a water knife to the chip, the second gas nozzle is used for spraying gas to the chip to remove the water.
10. The wet processing apparatus of claim 9, wherein: the second washs the district still includes and is located the third washing section of second washing section downstream side, the third washing section contains many to along first direction of delivery looks interval arrangement spray, two along upper and lower direction looks interval and be located spray the third jet-propelled head of a downstream side, and two are followed upper and lower direction looks interval and be located spray the side air cock of a downstream side, every pair of two spray along upper and lower direction looks interval be used for to the chip spray water, the third jet-propelled head is used for to the chip jet-propelled in order to remove the water, the side air cock is along perpendicular to the left and right direction looks interval of upper and lower direction for to the chip side direction jet-propelled on bearing the tool that first conveying mechanism carried is in order to remove the water, one of the side air cock is along left jet-propelled direction to the chip jet-propelled, and the other is to jet the chip in a right jet direction opposite to the left jet direction.
11. The wet processing apparatus of claim 7, wherein: each chip is provided with a metal heat conduction layer and a metal protection layer formed on the metal heat conduction layer, the wet type treatment equipment further comprises a removal area located on the downstream side of the second cleaning area and a third cleaning area located on the downstream side of the removal area, the removal area forms a third liquid medicine tank for the bearing jig to pass through, the third liquid medicine tank contains third liquid medicine for soaking the chips to remove the metal protection layer of each chip, the removal area comprises two third spray heads and two third side nozzles located on the downstream side of the third liquid medicine tank, the third spray heads are spaced along the vertical direction and used for spraying air to the chips to remove the third liquid medicine, the third side nozzles are spaced along the left-right direction and used for spraying air to the chips laterally to remove the third liquid medicine, and the third cleaning area is used for cleaning the chips on the bearing jig output by the removal area.
12. The wet processing apparatus of claim 11, wherein: the removing area further comprises a plurality of third liquid medicine nozzles arranged in the third liquid medicine tank, one part of the third liquid medicine nozzles upwards sprays the third liquid medicine in a water jet mode to the chip, the other part downwards sprays the third liquid medicine in a water jet mode to the chip, one of the third side nozzles sprays air to the chip along a left air spraying direction, and the other side nozzle sprays air to the chip along a right air spraying direction opposite to the left air spraying direction.
13. The wet processing apparatus of claim 11, wherein: the third cleaning area comprises a first cleaning section and a second cleaning section located on the downstream side of the first cleaning section, the first cleaning section comprises two first water spraying heads which are arranged at intervals along the vertical direction and two first air spraying heads which are arranged at intervals along the vertical direction and are located on the downstream side of the first water spraying heads, the first water spraying heads are used for spraying water in a water knife form to the chip, the first air spraying heads are used for spraying air to the chip to remove the water, the second cleaning section comprises a plurality of pairs of spraying pieces which are arranged at intervals along the first conveying direction, two second air spraying heads which are arranged at intervals along the vertical direction and are located on the downstream side of the spraying pieces, and two side spraying pieces which are arranged at intervals along the vertical direction and are located on the downstream side of the spraying pieces, and two spraying pieces of each pair of spraying pieces are used for spraying water to the chip along the intervals along the vertical direction, the second air injection head is used for injecting air to the chip to remove the water, the side air injection nozzles are spaced along the left-right direction and used for injecting air to the chip on the bearing jig conveyed by the first conveying mechanism in a lateral direction to remove the water, one of the side air injection nozzles injects air to the chip along the left air injection direction, and the other side air injection nozzle injects air to the chip along the right air injection direction opposite to the left air injection direction.
14. The wet processing apparatus of claim 11, wherein: further comprising a neutralization zone located on the downstream side of the third washing zone, and a fourth washing zone located on the downstream side of the neutralization zone, the neutralization area forms a fourth liquid medicine groove for the bearing fixture to pass through, the fourth liquid medicine groove contains a fourth liquid medicine for the chips to soak so as to neutralize and remove oxides formed on the metal heat conduction layer of each chip, the neutralization area comprises two fourth spray heads and two fourth side nozzles which are positioned at the downstream side of the fourth liquid medicine groove, the fourth nozzle is spaced along the up-down direction and used for spraying air to the chip to remove the fourth liquid medicine, the fourth side nozzle is spaced along the left-right direction and used for jetting air to the chip laterally to remove the fourth liquid medicine, the fourth cleaning area is used for cleaning the chip on the bearing fixture output by the neutralization area.
15. The wet processing apparatus of claim 14, wherein: the neutralization area also comprises a plurality of fourth liquid medicine nozzles arranged in the fourth liquid medicine tank, one part of the fourth liquid medicine nozzles upwards sprays the fourth liquid medicine in a water jet mode to the chip, the other part downwards sprays the fourth liquid medicine in a water jet mode to the chip, one of the fourth side nozzles sprays air to the chip along a left air spraying direction, and the other side nozzles sprays air to the chip along a right air spraying direction opposite to the left air spraying direction.
16. The wet processing apparatus of claim 14, wherein: the fourth cleaning section comprises a first cleaning section and a second cleaning section located at the downstream side of the first cleaning section, the first cleaning section comprises two first water spray heads spaced apart from each other in the up-down direction and two first air spray heads spaced apart from each other in the up-down direction and located at the downstream side of the first water spray heads, the first water spray heads are used for spraying water in the form of water jet to the chip, the first air spray heads are used for spraying air to the chip to remove the water, the second cleaning section is provided with a water tank containing the water for cleaning the chip, the second cleaning section comprises two second water spray heads spaced apart from each other in the up-down direction and two second air spray heads spaced apart from each other in the up-down direction and located at the downstream side of the second water spray heads, and the second water spray heads are used for spraying water in the form of water jet to the chip, the second gas nozzle is used for spraying gas to the chip to remove the water.
17. The wet processing apparatus of claim 16, wherein: the fourth cleaning area further comprises a third cleaning section positioned at the downstream side of the second cleaning section, the third cleaning section comprises a plurality of pairs of spraying pieces arranged at intervals along the first conveying direction, two third air nozzles arranged at intervals along the upper direction and the lower direction and positioned at the downstream side of the spraying pieces, and two side air nozzles arranged at intervals along the upper direction and the lower direction and positioned at the downstream side of the spraying pieces, each pair of two spraying pieces are used for spraying water to the chip at intervals along the upper direction and the lower direction, the third air nozzle is used for spraying air to the chip to remove the water, the side air nozzles are spaced along the left-right direction, the chip carrying fixture is used for carrying the chip on the chip carrying fixture and is conveyed by the first conveying mechanism, the chip carrying fixture is used for carrying out lateral air injection to remove the water, one of the lateral air injection nozzles is used for injecting air to the chip along the left air injection direction, and the other is to jet the chip in a right jet direction opposite to the left jet direction.
18. The wet processing apparatus of claim 14, wherein: the wet area is used for wetting the chips on the bearing jig conveyed by the conveying device, and the drying area dries the chips through hot air blowing.
19. The wet processing apparatus of claim 1, wherein: the chip cleaning device further comprises a wetting area positioned on the upstream side of the etching area and a drying area positioned on the downstream side of the second cleaning area, wherein the wetting area is used for wetting the chip on the bearing jig conveyed by the conveying device, and the drying area dries the chip through hot air blowing.
20. A wet treatment apparatus as claimed in claim 18 or 19, wherein: the conveying device comprises a first conveying mechanism and a second conveying mechanism which is arranged at the left and right directions and is spaced from the first conveying mechanism, the first conveying mechanism can convey the bearing jig to move along the first conveying direction and is provided with a feeding front end which is arranged in the wet area and a discharging rear end which is arranged in the dry area, the second conveying mechanism can convey the bearing jig to move along a second conveying direction which is opposite to the first conveying direction and is provided with a feeding rear end which is adjacent to the discharging rear end and a discharging front end which is adjacent to the feeding front end, the wet processing equipment further comprises a transfer device, the transfer device comprises a temporary storage mechanism which is arranged at the downstream side of the dry area and a transverse movement mechanism which is arranged at the downstream side of the temporary storage mechanism, the temporary storage mechanism comprises a first conveying unit and a lifting unit, the first conveying unit is corresponding to the discharging rear end and is used for receiving the bearing jig output by the discharging rear end The lifting unit comprises a plurality of pairs of bearing rods which are arranged at intervals along the vertical direction, each pair of bearing rods can lift along the vertical direction and is used for bearing the bearing jig on the first conveying unit, the transverse moving mechanism comprises a second conveying unit and a transverse moving unit, the transverse moving unit is used for driving the second conveying unit to move between a first position which is aligned with the first conveying unit and a second position which is aligned with the rear end of the feeding material along the left-right direction, when the second conveying unit is at the first position, the second conveying unit can bear the bearing jig output by the first conveying unit, and when the second conveying unit is at the second position, the second conveying unit can convey the borne bearing jig to the second conveying mechanism.
21. The wet processing apparatus of claim 1, wherein: still contain and be located the moist district of etching district upstream side, moist district contains many pairs of edges the piece, two edges of spraying of first conveying direction looks interval arrangement about, direction looks interval just is located spray the jet-propelled head of piece downstream side, and two edges about, direction looks interval just is located spray the side air jet mouth of piece downstream side, every pair two spray the piece along about, direction looks interval is used for right the chip sprays water, the jet-propelled head is used for right the chip jet-propelled in order to remove water, side air jet mouth is used for right first conveying mechanism carries on the tool the chip side jet-propelled in order to remove water, one of them of side air jet mouth is along left air jet direction pair the chip jet-propelled, and one of them is along opposite to the right air jet direction of left air jet direction is to the chip jet-propelled.
22. A processing method is suitable for processing a plurality of chips carried by a carrying jig; the method is characterized in that:
the processing method comprises the following steps:
conveying the bearing jig to move along a first conveying direction through a conveying device;
etching a plurality of leads of each of the chips moving in the first conveying direction with a first chemical solution through an etching region;
cleaning the chip output from the etching area along the first conveying direction by a first cleaning area;
generating a deoxidation reaction on the pins of each chip moving along the first conveying direction by using a second liquid medicine through a deoxidation area; and
and cleaning the chip output by the deoxidation area along the first conveying direction through a second cleaning area.
23. The process of claim 22, wherein: and a drying step of drying the chip by blowing hot air through the drying zone after the chip is cleaned in the second cleaning zone.
24. The process of claim 23, wherein: the processing method further comprises a removing step of removing the metal protective layer by a third liquid medicine through the removing region after the second cleaning region cleans the chips and before the drying step, and the processing method further comprises a cleaning step of cleaning the chips output from the removing region in the first conveying direction through the third cleaning region after the removing step and before the drying step.
25. The process of claim 24, wherein: the treatment method further comprises a neutralization step which is positioned after the cleaning step and before the drying step, and the metal heat conduction layer of each chip output from the third cleaning region along the first conveying direction is subjected to chemical reaction through a neutralization zone by a fourth liquid medicine so as to neutralize and remove the oxide formed on the metal protection layer, and the treatment method further comprises a cleaning step which is positioned after the neutralization step and before the drying step, and the chips output from the neutralization zone along the first conveying direction are cleaned through a fourth cleaning zone.
26. The process of claim 23, wherein: the conveying device conveys the bearing jig along the first conveying direction through a first conveying mechanism, the processing method further comprises a transferring step after the drying step and a refluxing step after the transferring step, in the transferring step, the bearing jig is transferred to a second conveying mechanism of the conveying device through a transferring device, and in the refluxing step, the bearing jig is conveyed to move along a second conveying direction opposite to the first conveying direction through the second conveying mechanism.
27. The process of claim 22, wherein: the method also comprises a wetting step which is positioned before the pins are etched in the etching area, and the chip is wetted through the wetting area.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107135992 | 2018-10-12 | ||
| TW107135992A TWI733060B (en) | 2018-10-12 | 2018-10-12 | Wet treatment equipment and wet treatment method thereof |
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| CN111048436A true CN111048436A (en) | 2020-04-21 |
| CN111048436B CN111048436B (en) | 2022-05-20 |
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| CN (1) | CN111048436B (en) |
| TW (1) | TWI733060B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI733060B (en) | 2021-07-11 |
| CN111048436B (en) | 2022-05-20 |
| TW202015125A (en) | 2020-04-16 |
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