TW202010221A - Heat dissipating device - Google Patents

Abstract

A heat dissipating device that is used for dissipating the heat generated from a heat source includes a heat conducting plate, a heat dissipating assembly, at least one first fan and an air circulating assembly. The heat conducting plate can be in thermal contact with the heat source. The heat dissipating assembly is connected to the heat conducting plate. The at least one first fan is disposed on the heat dissipating assembly. The air circulating assembly includes a case and at least one piston. The case is disposed on the heat dissipating assembly and has a ventilating surface that faces the heat dissipating assembly and a vent. The vent locates at the ventilating surface. The at least one piston is movably disposed on the case so as to generate a circulating airflow. The circulating airflow flows through the vent and can cool the heat dissipating assembly.

Description

Radiator

The invention relates to a heat dissipation device, especially an air-cooled heat dissipation device.

With the evolution of technology in the electronics field, the performance of electronic components has been continuously improved, and the increase in performance has also increased the heat generated by electronic components. If the heat cannot be effectively removed from the electronic components, the temperature of the electronic components will increase due to the accumulation of heat. When the temperature of the electronic component is too high, the electronic component may crash or even burn out. Therefore, the electronic component is usually provided with a heat dissipation device to remove the heat accumulated in the electronic component.

Generally speaking, heat sinks are divided into liquid-cooled heat sinks and air-cooled heat sinks. The liquid-cooled heat dissipation device uses a compressor or a pump to drive the cooling liquid in the cooling tube, so that the cooling liquid and the electronic components exchange heat to remove the heat of the electronic components. The air-cooled heat dissipation device uses a fan to guide the cold air, so that the cold air exchanges heat with the heat dissipation fins that are in thermal contact with the electronic components, and then removes the heat of the electronic components through the heat dissipation fins. Compared with liquid-cooled heat sinks, air-cooled heat sinks have cost advantages because they do not require a compressor, pump, or coolant. Therefore, manufacturers generally use air-cooled heat sinks to remove heat from electronic components.

However, the conventional air-cooled heat dissipation device only guides the cold air to the heat dissipation fins in a single path, so that the heat accumulated in the heat dissipation fins cannot be effectively taken away by the cold air, which further reduces the heat dissipation efficiency of the traditional air-cooled heat dissipation device. Heat accumulates in the heat dissipation fins and is difficult to lift.

The invention is to provide a heat dissipation device to solve the problem that the heat dissipation efficiency of the traditional air-cooled heat dissipation device is difficult to be improved due to the accumulation of heat in the heat dissipation fins.

The heat dissipation device disclosed in an embodiment of the invention is used to dissipate the heat energy generated by a heat source. The heat dissipation device includes a heat conduction plate, a heat dissipation component, at least one first heat dissipation fan, and an air circulation group. The heat conducting plate is used to thermally contact the heat source. The heat dissipation component is connected to the heat conduction plate. At least one first heat dissipation fan is disposed on the heat dissipation component. The air circulation group includes a housing and at least one piston. The casing is disposed on the heat dissipation component, and has a ventilation surface facing the heat dissipation component and a first ventilation hole. The first ventilation hole is located on the ventilation surface. At least one piston is movably disposed in the housing to generate a circulating air flow that dissipates heat through the first vent hole to the heat dissipation component.

According to the heat dissipation device disclosed in the above embodiment, by arranging the air circulation group in the heat dissipation component, the reciprocating movement of the piston can form the circulating air flow to dissipate the heat dissipation component through the first ventilation hole of the housing. In this way, the first cooling fan and the airflow circulation group can guide the cold air to the heat dissipation component through different paths for heat dissipation, so that the heat accumulated in the heat dissipation component can be effectively removed, thereby improving the heat dissipation efficiency of the heat dissipation device.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figure 1 and Figure 2. FIG. 1 is a perspective view of a heat dissipation device and a heat source according to a first embodiment of the invention. 2 is an exploded view of the heat dissipation device and heat source of FIG.

The heat dissipation device 10 of this embodiment is used to dissipate the heat energy generated by a heat source 20. The heat source 20 is, for example, a central processing unit. The heat dissipation device 10 includes a heat conduction plate 100, a heat dissipation component 200, two first heat dissipation fans 300, and an air circulation group 400.

The heat conducting plate 100 is used to thermally contact the heat source 20. The heat dissipation component 200 is connected to the heat conducting plate 100. In detail, the heat dissipation assembly 200 includes a plurality of heat dissipation fins 210 and a plurality of heat pipes 220. Each heat dissipation fin 210 is parallel to the heat conducting plate 100, and each heat dissipation fin 210 has two heat dissipation surfaces 211, an annular side surface 212, and a plurality of heat dissipation holes 213. In each heat dissipation fin 210, the two heat dissipation surfaces 211 are opposite to each other, and the annular side surface 212 is connected to the two heat dissipation surfaces 211. These heat dissipation holes 213 penetrate the two heat dissipation surfaces 211. The heat-conducting tubes 220 penetrate and thermally contact the heat-dissipating fins 210. The heat-conducting plate 100 is connected and thermally contacted to the side of each heat-conducting tube 220 away from the heat-dissipating fins 210. Therefore, the heat received by the heat conduction plate 100 from the heat source 20 can be conducted to the heat dissipation fins 210 through the heat transfer tubes 220, so that the heat dissipation fins 210 can escape the heat. In addition, in this embodiment, the heat dissipation component 200 includes a plurality of heat pipes 220, but it is not limited to this. In other embodiments, the heat dissipation component may also include only one heat pipe.

The two first cooling fans 300 are disposed on opposite sides of the annular side surface 212 of each cooling fin 210 to guide cold air to each cooling fin 210. In this embodiment, the heat dissipation device 10 includes two first heat dissipation fans 300, but it is not limited thereto. In other embodiments, the heat dissipation device may include only a first heat dissipation fan.

The air circulation group 400 includes a housing 410, a plurality of pistons 420, a connecting rod 430, a driving element 440, and a second cooling fan 450.

The casing 410 is, for example, a transparent casing, and the casing 410 and the heat conduction plate 100 are located on opposite sides of the heat dissipation fins 210, and the heat conduction plate 100 and the casing 410 respectively cover the outermost two heat dissipation surfaces 211 of the heat dissipation surfaces 211. .

The housing 410 includes a lower housing 411 and an upper housing 412 connected. The lower housing 411 is disposed on the heat dissipation assembly 200 and has a ventilation surface 413 and a first ventilation hole 414. The ventilation surface 413 faces the heat dissipation assembly 200, that is, the ventilation surface 413 of the housing 410 faces the heat dissipation surface 211 of the heat dissipation surfaces 211 that is farthest from the heat conduction plate 100. The first ventilation hole 414 is located on the ventilation surface 413. The upper casing 412 has a plurality of second vent holes 415 and a plurality of first accommodating grooves 416. These second vent holes 415 are located on opposite sides of the upper housing 412, respectively. The first accommodating grooves 416 communicate with the first vent hole 414 and the second vent holes 415. In this embodiment, the lower casing 411 has a first ventilation hole 414, but it is not limited thereto. In other embodiments, the lower casing 411 may also have a plurality of first ventilation holes.

In this embodiment, each of the heat dissipation fins 210 is parallel to the heat conducting plate 100, and the ventilation surface 413 of the housing 410 faces the outermost heat dissipation surface 211, but it is not limited to this. In other embodiments, each heat dissipation fin 210 It can also be changed to be perpendicular to the heat conduction plate, and the ventilation surface of the shell is thus changed to face each annular side. Alternatively, in other embodiments, the parallel relationship between the heat-dissipating fins and the heat-conducting plate may be maintained, and the ventilation surface may be changed to face the annular side surfaces.

The pistons 420 are respectively movably disposed in the first receiving grooves 416, and each has a body 4200 and an elastic element 4201. The elastic element 4201 is, for example, a spring and in each piston 420, the elastic element 4201 is disposed in a second accommodating groove 4202 of the body 4200.

Please refer to Figure 3. FIG. 3 is a partially enlarged view of a schematic cross-sectional view of the heat dissipation device of FIG. 1. In this embodiment, the pistons 420 are a plurality of first pistons 421 and a plurality of second pistons 422, respectively. The first pistons 421 each have a first center line C1, and the second pistons 422 each have a second center line C2. The heat dissipation surface 211 located on the outermost side facing the ventilation surface 413 has a normal N. An acute angle θ between the first centerline C1 and the second centerline C2 and the normal N is, for example, 60 degrees, and presents a visual effect like a V-type engine, but it is not limited to this, in other embodiments The first centerline and the second centerline can also be parallel to the normal, and present a visual effect like a vertical engine. Alternatively, in other embodiments, the first center line and the second center line may also be perpendicular to the normal line, and correspond to each other to present a horizontal visual effect on the horizontal engine. Furthermore, in other embodiments, the first centerline and the second centerline can also be perpendicular to the normal line, and the six centerlines scatter outwards at a center point, presenting a visual effect like a star engine.

The connecting rod 430 includes a crankshaft 431 and a plurality of cams 432. The cams 432 are disposed on the crankshaft 431, and the bodies 4200 of the pistons 420 are in contact with the cams 432 of the connecting rod 430, respectively. The driving element 440 is, for example, a motor or a fan rotor, and is connected to the crankshaft 431 and used to drive the crankshaft 431 to rotate. When the crankshaft 431 rotates, the cams 430 are rotated to push the pistons 420. Then, the elastic element 4201 is compressed against the upper housing 412. Finally, the elastic force of the elastic element 4201 can drive the pistons 420 to return. In this way, the pistons 420 can reciprocate in the first accommodating grooves 416 through the cooperation of the cams 432 of the connecting rod 430 and the elastic elements 4201 of the pistons 420, and then pass through the first vent holes 414 These heat dissipation fins 210 dissipate heat.

The second cooling fan 450 is connected to one side of the connecting rod 430, and the driving element 440 and the second cooling fan 450 are respectively connected to two opposite sides of the connecting rod 430. The rotation axis L2 of the second heat dissipation fan 450 is not parallel to the rotation axis L1 of the first heat dissipation fan 300, so that the first heat dissipation fan 300 and the second heat dissipation fan 450 guide the cold air to dissipate the heat dissipation fins 210 through different paths . In addition, the cold air guided by the second cooling fan 450 can also remove heat around electronic components (not shown) adjacent to the heat source 20. In this embodiment, the rotation axis L2 of the second heat dissipation fan 450 is perpendicular to the rotation axis L1 of the first heat dissipation fan 300, but it is not limited to this. In other embodiments, the rotation axis L2 of the second heat dissipation fan may also be An acute angle with the rotation axis of the first cooling fan is, for example, 30 degrees. In addition, in this embodiment, the second cooling fan 450 and the driving element 440 are respectively connected to the opposite sides of the connecting rod 430, but it is not limited to this. In other embodiments, the second cooling fan and the driving element may also be Connect to the same side of the connecting rod.

When the heat dissipation device 10 of this embodiment operates, the driving element 440 will drive the connecting rod 430 to rotate. These pistons 420 and the second cooling fan 450 are driven by the connecting rod 430 to reciprocate and rotate, respectively. At this time, these pistons 420 form a circulating airflow A (as shown in FIG. 3) in the housing 410 due to the reciprocating motion, and the circulating airflow A circulating in the housing 410 can enter through the first vent hole 414 The heat dissipation holes 213 further dissipate the heat dissipation fins 210.

On the other hand, the second heat dissipation fan 450 can not only help the circulating air flow A in the housing 410 to dissipate the heat dissipation fins 210 through the second ventilation holes 415, but also guide the cold air to the electronic components adjacent to the heat source 20 (Not shown) around to dissipate heat around electronic components (not shown). In this way, the cold air guided by the first cooling fan 300, the circulating airflow A, and the cold air guided by the second cooling fan 450 all guide the airflow to dissipate the heat dissipating fins 210 in different paths, so that The heat of the heat dissipation fin 210 can be effectively removed. In addition, the second cooling fan 450 can also help to remove the heat around the electronic components (not shown) adjacent to the heat source 20.

For example, taking the point B (as shown in FIG. 3) in the outermost heat dissipation fin 210 as an example, when the heat source 20 operates, the heat dissipation device 10 without the air circulation group 400, the temperature of the point B is, for example, Celsius 53.4 degrees. When the heat dissipation device 10 additionally provided with the air circulation group 400 operates on the heat source 20, the temperature of point B is reduced from 53.4 degrees Celsius to 49.42 degrees Celsius, for example. Therefore, the air circulation group 400 can effectively remove the heat accumulated in the heat dissipation fins 210.

On the other hand, after the airflow circulation group 400 is additionally provided on the heat dissipation device 10, the lower-level electronic components such as memory (not shown), power converter (not shown), and display card (not shown) adjacent to the heat dissipation device 10 (Pictured) The surrounding temperature has dropped. In detail, the temperature around the memory (not shown) drops from 56.21 degrees Celsius to 52.45 degrees Celsius, for example. The temperature around the power converter (not shown) drops from 57.8 degrees Celsius to 53.25 degrees Celsius, for example. The temperature around the display card (not shown) drops from 56.42 degrees Celsius to 55.51 degrees Celsius, for example. Therefore, the air circulation group 400 can not only effectively remove the heat accumulated in the heat dissipation fins 210, but also remove the heat around the electronic components adjacent to the heat source 20.

In addition, because the housing 410 is a transparent housing, the heat dissipation device 10 can not only allow the user to judge the operation status of the heat dissipation device 10 by observing the movement of the pistons 420, but also increase the visual effect of the heat dissipation device 10. Furthermore, in other embodiments, the heat dissipation device may also include a plurality of light-emitting elements. In this way, the heat-dissipation device can generate rich sound and light effects when the pistons operate with engine sound effects and light effects of the light-emitting elements.

Furthermore, the airflow circulation group 400 of this embodiment is provided in the heat dissipation assembly 200, but it is not limited to this. In other embodiments, the airflow circulation group 400 can also be disposed outside the electronic device through the universal serial bus connector. As a result, the airflow circulation group is an independent heat dissipation device and can help to remove the heat around the electronic device.

Please refer to Figure 4. 4 is a schematic cross-sectional view of a heat dissipation device and heat source according to a second embodiment of the invention. In this embodiment, the heat dissipation device 10a further includes an air guide 500a to enhance the heat dissipation effect of the second heat dissipation fan 450a on the heat dissipation fins 210a. The air guide hood 500a has an air guide channel 510a. One end of the air guide channel 510a corresponds to the second cooling fan 450a, and the other end of the air guide channel 510a corresponds to the heat dissipation fins 210a. In this way, the cold air guided by the second cooling fan 450a can enter the air guide channel 510a and dissipate heat from the heat dissipation fins 210a when exiting the air guide channel 510a.

Please refer to Figure 5 and Figure 6. FIG. 5 is an exploded view of the connecting rod and piston of the third embodiment of the invention. 6 is a schematic cross-sectional view of a heat dissipation device according to a third embodiment of the invention.

In the first embodiment, the pistons 420 can reciprocate by matching the cams 432 of the connecting rod 430 and the elastic elements 4201 of the pistons 420, but it is not limited to this. In this embodiment, the connecting rod 430b It can also be changed to an eccentric shaft, and the pistons 420b each include a connected body 4200b and a pivot portion 4203b, and the pivot portions 4203b are pivotally connected to the connecting rod 430b. In this way, in this embodiment, the pistons 420b can be reciprocated by matching the eccentric shaft structure of the connecting rod 430b and the pivot portions 4203b of the pistons 420.

According to the heat dissipation device disclosed in the above embodiment, by arranging the air circulation group in the heat dissipation component, the reciprocating movement of the piston can form the circulating air flow to dissipate the heat dissipation component through the first ventilation hole of the housing. In this way, the first cooling fan and the airflow circulation group can guide the cold air to the heat dissipation component through different paths for heat dissipation, so that the heat accumulated in the heat dissipation component can be effectively removed, thereby improving the heat dissipation efficiency of the heat dissipation device.

In addition, by disposing the second cooling fan in the casing, the second cooling fan can not only guide the cold air to the cooling fins through another path for heat dissipation, but also guide the cold air to the surrounding electronic components near the heat source Conduct heat dissipation. In this way, not only the heat dissipation efficiency of the heat dissipation device is further improved, but also the electronic components adjacent to the heat source are provided with additional heat dissipation effects.

In addition, the design of the heat sink with the piston not only changes the monotonous appearance of the heat sink visually, but also allows the heat sink to match the lighting effect of the light emitting element and the sound effect of the engine, which produces more traditional heat dissipation when the piston is operating The device has rich sound and light effects.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.

10, 10a‧‧‧radiating device 100‧‧‧Heat conduction board 200‧‧‧Cooling components 210, 210a‧‧‧fin fins 211‧‧‧radiation surface 212‧‧‧ring side 220‧‧‧Heat pipe 300‧‧‧The first cooling fan 400‧‧‧Air circulation group 410‧‧‧Housing 411‧‧‧Lower case 412‧‧‧Upper case 413‧‧‧Ventilation surface 414‧‧‧First vent 415‧‧‧ Second vent 416‧‧‧First receiving slot 420, 420b ‧‧‧ piston 4200, 4200b‧‧‧Body 4201‧‧‧Elastic element 4202‧‧‧Second accommodating slot 4203b‧‧‧Pivot 421‧‧‧The first piston 422‧‧‧Second Piston 430, 430b ‧‧‧ connecting rod 431‧‧‧Crankshaft 432‧‧‧Cam 440‧‧‧Drive element 450, 450a‧‧‧second cooling fan 500a‧‧‧Wind hood 510a‧‧‧Wind channel 20‧‧‧heat source L1, L2‧‧‧Rotation axis A‧‧‧Circulation airflow N‧‧‧Normal C1‧‧‧First Centerline C2‧‧‧Second Centerline θ‧‧‧Acute angle

FIG. 1 is a perspective view of a heat dissipation device and a heat source according to a first embodiment of the invention. 2 is an exploded view of the heat dissipation device and heat source of FIG. FIG. 3 is a partially enlarged view of a schematic cross-sectional view of the heat dissipation device of FIG. 1. 4 is a schematic cross-sectional view of a heat dissipation device and heat source according to a second embodiment of the invention. FIG. 5 is an exploded view of the connecting rod and piston of the third embodiment of the invention. 6 is a schematic cross-sectional view of a heat dissipation device according to a third embodiment of the invention.

10‧‧‧radiating device

100‧‧‧Heat conduction board

200‧‧‧Cooling components

210‧‧‧ Fin

220‧‧‧Heat pipe

300‧‧‧The first cooling fan

400‧‧‧Air circulation group

410‧‧‧Housing

420‧‧‧piston

430‧‧‧Link

440‧‧‧Drive element

450‧‧‧Second cooling fan

20‧‧‧heat source

L1, L2‧‧‧Rotation axis

Claims (10)

A heat dissipation device is used to dissipate the heat energy generated by a heat source. The heat dissipation device includes: a heat conduction plate for thermal contact with the heat source; a heat dissipation component connected to the heat conduction plate; at least one first heat dissipation fan provided in The heat dissipation component; and an air circulation group including a housing and at least one piston, the housing is disposed on the heat dissipation component, and has a ventilation surface facing the heat dissipation component and a first ventilation hole, the first ventilation The hole is located on the ventilation surface, and the at least one piston is movably disposed in the housing to generate a circulating air flow that radiates heat to the heat dissipation assembly through the first ventilation hole. The heat dissipation device as described in item 1 of the patent scope, wherein the heat dissipation assembly includes a plurality of heat dissipation fins and a heat pipe, the heat dissipation fins and the heat conduction plate are respectively connected to opposite sides of the heat pipe, and the heat conduction The tube is in thermal contact with the heat-conducting plate and the heat-dissipating fins, and the shell of the air circulation group is disposed on one side of the heat-dissipating fins. The heat dissipation device as described in item 2 of the patent application scope, wherein each of the heat dissipation fins has two heat dissipation surfaces and an annular side surface, and in each heat dissipation fin, the two heat dissipation surfaces are opposed to each other, and the annular side surface is connected to the Two heat dissipation surfaces. The ventilation surface faces the outermost heat dissipation surface. The heat dissipation device as described in item 2 of the patent application scope, wherein each of the heat dissipation fins has two heat dissipation surfaces and an annular side surface, and in each heat dissipation fin, the two heat dissipation surfaces are opposed to each other, and the annular side surface is connected to the Two heat dissipation surfaces, the ventilation surface faces the annular side surfaces. The heat dissipation device as described in item 3 or item 4 of the patent application scope, wherein the airflow circulation group further includes a connecting rod and a driving element, the connecting rod includes a crankshaft and a plurality of cams, the cams are disposed on the crankshaft And the pistons are in contact with the cams of the connecting rod, respectively, and the driving element is connected to the crankshaft and used to drive the crankshaft to rotate, so that the crankshaft drives the cams to push the pistons to reciprocate. The heat dissipation device as described in item 5 of the patent application scope, wherein the airflow circulation group further includes a second heat dissipation fan, the second heat dissipation fan is disposed on one side of the connecting rod, and the rotation axis of the second heat dissipation fan is The rotation axis of the first cooling fan is not parallel. The heat dissipation device as described in item 6 of the patent application scope, wherein the second heat dissipation fan and the driving element are respectively connected to opposite sides of the connecting rod. The heat dissipation device as described in item 6 of the patent application scope, wherein the second heat dissipation fan and the driving element are connected to the same side of the connecting rod. The heat dissipation device as described in item 6 of the patent application scope further includes an air guide hood, the air guide hood has an air guide channel, one end of the air guide channel corresponds to the second cooling fan, and the other end of the air guide channel Corresponding to some heat sink fins. The heat dissipation device as described in item 1 of the patent application scope, wherein the casing is a transparent casing.

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