TWI673943B - Heat dissipating device - Google Patents

Abstract

A heat dissipation device is used to dissipate thermal energy generated by a heat source. The heat dissipating device includes a heat conducting plate, a heat dissipating component, at least a first heat dissipating fan, and an air circulation group. The heat conducting plate is used for thermal contact with a heat source. The heat dissipation component is connected to the heat conducting plate. At least one first cooling fan is disposed on the heat dissipation component. The air circulation group includes a casing and at least one piston. The casing is disposed on the heat dissipation component, and has a ventilation surface facing the heat dissipation component and a first ventilation hole. The first ventilation hole is located on the ventilation surface. At least one piston is movably disposed on the casing to generate a circulating airflow for radiating heat to the heat dissipation component through the first ventilation hole.

Description

Heat sink

The invention relates to a heat dissipation device, in particular to an air-cooled heat dissipation device.

With the evolution of technology in the electronic field, the efficiency of electronic components has been continuously improved, but the increase in efficiency has also increased the heat generated by electronic components. If the heat cannot be effectively removed from the electronic component, the temperature of the electronic component will increase due to the accumulation of heat. When the temperature of the electronic components is too high, the electronic components may crash or even burn out. Therefore, the electronic component is usually provided with a heat sink to remove heat accumulated in the electronic component.

Generally speaking, heat sinks are divided into liquid-cooled heat sinks and air-cooled heat sinks. The liquid-cooled heat-dissipating device uses a compressor or a pump to drive the cooling liquid in the cooling tube, so that the cooling liquid and the electronic components perform heat exchange to remove the heat of the electronic components. The air-cooled heat dissipation device uses a fan to guide the cold air, so that the cold air and the heat-dissipating fins that are in thermal contact with the electronic components perform heat exchange, and then the heat of the electronic components is eliminated through the heat-dissipating fins. Compared with liquid-cooled heat sinks, air-cooled heat sinks have cost advantages because there is no need to install compressors, pumps, and coolant. Therefore, manufacturers generally use air-cooled heat sinks to remove heat from electronic components.

However, the conventional air-cooled heat dissipation device only guides cold air to the heat dissipation fins in a single path, resulting in that the heat accumulated in the heat dissipation fins cannot be effectively taken away by the cold air, and the heat dissipation efficiency of the conventional air-cooled heat dissipation device is therefore Heat accumulates in the heat sink fins and is difficult to lift.

The present invention is to provide a heat dissipation device to solve the problem that the heat dissipation efficiency of a conventional air-cooled heat dissipation device is difficult to improve because heat is accumulated in the heat dissipation fins.

The heat dissipation device disclosed in one embodiment of the present invention is used to dissipate thermal energy generated by a heat source. The heat dissipating device includes a heat conducting plate, a heat dissipating component, at least a first heat dissipating fan, and an air circulation group. The heat conducting plate is used for thermal contact with a heat source. The heat dissipation component is connected to the heat conducting plate. At least one first cooling fan is disposed on the heat dissipation component. The air circulation group includes a casing and at least one piston. The casing is disposed on the heat dissipation component, and has a ventilation surface facing the heat dissipation component and a first ventilation hole. The first ventilation hole is located on the ventilation surface. At least one piston is movably disposed on the casing to generate a circulating airflow for radiating heat to the heat dissipation component through the first ventilation hole.

According to the heat dissipating device disclosed in the above embodiment, the circulating airflow formed by reciprocating the piston can be radiated through the first ventilation hole of the housing to dissipate the heat dissipating component by providing the airflow circulating group in the heat dissipating component. In this way, the first cooling fan and the air circulation group can respectively guide the cold air to the heat dissipation component through different paths to dissipate heat, so that the heat accumulated in the heat dissipation component can be effectively removed, thereby improving the heat dissipation efficiency of the heat dissipation device.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.

Please refer to FIG. 1 and FIG. 2. FIG. 1 is a perspective view of a heat sink and a heat source according to a first embodiment of the present invention. FIG. 2 is an exploded view of the heat dissipation device and heat source of FIG. 1.

The heat dissipation device 10 of this embodiment is used to dissipate thermal energy generated by a heat source 20. The heat source 20 is, for example, a central processing unit. The heat dissipation device 10 includes a heat conducting plate 100, a heat dissipation assembly 200, two first heat dissipation fans 300, and an air circulation group 400.

The heat conducting plate 100 is used to thermally contact the heat source 20. The heat dissipation component 200 is connected to the heat conducting plate 100. In detail, the heat dissipation assembly 200 includes a plurality of heat dissipation fins 210 and a plurality of heat conducting tubes 220. Each heat-dissipating fin 210 is parallel to the heat-conducting plate 100, and each heat-dissipating fin 210 has two heat-dissipating surfaces 211, an annular side surface 212, and a plurality of heat-dissipating holes 213. In each of the heat dissipation fins 210, the two heat dissipation surfaces 211 are opposite to each other, and the annular side surface 212 is connected to the two heat dissipation surfaces 211. These heat dissipation holes 213 penetrate the two heat dissipation surfaces 211. The heat-conducting tubes 220 pass through and thermally contact the heat-dissipating fins 210. The heat-conducting plate 100 is connected to and thermally contacts a side of each heat-conducting tube 220 away from the heat-dissipating fins 210. Therefore, the heat received by the heat-conducting plate 100 from the heat source 20 can be conducted to the heat-dissipating fins 210 through the heat-conducting pipes 220 to dissipate the heat through the heat-dissipating fins 210. In addition, in this embodiment, the heat dissipating component 200 includes a plurality of heat conducting tubes 220, but is not limited thereto. In other embodiments, the heat dissipating component may include only one heat conducting tube.

Two first heat dissipation fans 300 are disposed on opposite sides of the annular side surface 212 of each heat dissipation fin 210 to guide cold air to each heat dissipation fin 210. In this embodiment, the heat sink 10 includes two first heat sink fans 300, but is not limited thereto. In other embodiments, the heat sink may also include only a first heat sink fan.

The air circulation group 400 includes a casing 410, a plurality of pistons 420, a connecting rod 430, a driving element 440, and a second cooling fan 450.

The case 410 is, for example, a transparent case, and the case 410 and the heat conducting plate 100 are located on opposite sides of the heat dissipation fins 210, and the heat conducting plate 100 and the case 410 respectively cover the two outermost heat dissipation surfaces 211 of the heat dissipation surfaces 211. .

The casing 410 includes a lower casing 411 and an upper casing 412 connected to each other. The lower case 411 is disposed on the heat dissipation assembly 200 and has a ventilation surface 413 and a first ventilation hole 414. The ventilation surface 413 faces the heat-dissipating component 200, that is, the ventilation surface 413 of the housing 410 faces the heat-dissipating surface 211 of the heat-dissipating surface 211 farthest from the heat-conducting plate 100. The first ventilation hole 414 is located on the ventilation surface 413. The upper casing 412 has a plurality of second ventilation holes 415 and a plurality of first receiving slots 416. These second ventilation holes 415 are respectively located on opposite sides of the upper casing 412. The first receiving slots 416 communicate with the first ventilation hole 414 and two second ventilation holes 415. In this embodiment, the lower casing 411 has a first ventilation hole 414, but is not limited thereto. In other embodiments, the lower casing may also have a plurality of first ventilation holes.

In this embodiment, each of the heat dissipation fins 210 is parallel to the heat conducting plate 100, and the ventilation surface 413 of the housing 410 faces the outermost heat dissipation surface 211, but it is not limited thereto. In other embodiments, each heat dissipation fin It can also be changed to be perpendicular to the heat-conducting plate instead, and the ventilation surface of the shell is therefore changed to face each annular side. Alternatively, in other embodiments, the parallel relationship between the heat radiating fins and the heat conducting plate may be maintained, and the ventilation surface may be changed to face each annular side surface.

The pistons 420 are movably disposed in the first receiving grooves 416, respectively, and each has a body 4200 and an elastic element 4201. The elastic element 4201 is, for example, a spring, and in each piston 420, the elastic element 4201 is disposed in a second receiving groove 4202 of the main body 4200.

See Figure 3. FIG. 3 is a partial enlarged view of a schematic cross-sectional view of the heat dissipation device of FIG. 1. In this embodiment, the pistons 420 are a plurality of first pistons 421 and a plurality of second pistons 422, respectively. Each of the first pistons 421 has a first centerline C1, and each of the second pistons 422 has a second centerline C2. The heat dissipation surface 211 located at the outermost side and facing the ventilation surface 413 has a normal line N. The acute angle θ between the first centerline C1 and the second centerline C2 and the normal N is, for example, 60 degrees, and presents a visual effect like a V-type engine, but is not limited thereto. In other embodiments These first centerlines and these second centerlines can also be parallel to the normal, and present a visual effect like a vertical engine. Alternatively, in other embodiments, the first center lines and the second center lines may be perpendicular to the normal line and correspond to each other to present a visual effect such as a horizontal to horizontal engine. Furthermore, in other embodiments, the first center lines and the second center lines may be perpendicular to the normal line, and the six center lines are scattered outward with a center point to present a visual effect like a star engine.

The connecting rod 430 includes a crankshaft 431 and a plurality of cams 432. The cams 432 are disposed on the crankshaft 431, and the bodies 4200 of the pistons 420 are in contact with the cams 432 of the connecting rod 430, respectively. The driving element 440 is, for example, a motor or a fan rotor, and is connected to the crankshaft 431 to drive the crankshaft 431 to rotate. When the crankshaft 431 rotates, the cams 430 are rotated to push the pistons 420. Then, the elastic element 4201 is compressed against the upper casing 412. Finally, the elastic force of the elastic element 4201 can drive the pistons 420 to reset. In this way, the pistons 420 can reciprocate in the first receiving grooves 416 through the combination of the cams 432 of the connecting rod 430 and the elastic elements 4201 of the pistons 420, and then pass through the first ventilation holes 414 to These heat dissipation fins 210 dissipate heat.

The second cooling fan 450 is connected to one side of the link 430, and the driving element 440 and the second cooling fan 450 are connected to two opposite sides of the link 430, respectively. The rotation axis L2 of the second cooling fan 450 is not parallel to the rotation axis L1 of the first cooling fan 300, so that the first cooling fan 300 and the second cooling fan 450 guide cold air through different paths to dissipate the cooling fins 210. . In addition, the cold air guided by the second cooling fan 450 can also remove the heat around the electronic components (not shown) adjacent to the heat source 20. In this embodiment, the rotation axis L2 of the second cooling fan 450 is, for example, perpendicular to the rotation axis L1 of the first cooling fan 300, but is not limited thereto. In other embodiments, the rotation axis of the second cooling fan may also An acute angle with the rotation axis of the first cooling fan is, for example, 30 degrees. In addition, in this embodiment, the second cooling fan 450 and the driving element 440 are respectively connected to two opposite sides of the connecting rod 430, but are not limited thereto. In other embodiments, the second cooling fan and the driving element may be Connected to the same side of the link.

When the heat dissipation device 10 of this embodiment is in operation, the driving element 440 drives the connecting rod 430 to rotate, and the piston 420 and the second cooling fan 450 are driven by the connecting rod 430 to reciprocate and rotate. At this time, the pistons 420 form a circulating airflow A in the casing 410 due to the reciprocating motion (as shown in FIG. 3), and the circulating airflow A circulating in the casing 410 can enter through the first ventilation hole 414. The heat dissipation holes 213 further dissipate heat from the heat dissipation fins 210.

On the other hand, the second cooling fan 450 can not only assist the circulating airflow A in the housing 410 to dissipate the heat dissipation fins 210 through the second ventilation holes 415, but also guide cold air to the electronic components adjacent to the heat source 20. (Not shown) to dissipate heat around the electronic component (not shown). In this way, the cold air guided by the first cooling fan 300, the circulating airflow A, and the cold air guided by the second cooling fan 450 all guide the airflow through different paths to dissipate the heat dissipation fins 210, so that they accumulate in these The heat of the heat dissipation fins 210 can be effectively removed. In addition, the second cooling fan 450 can also help to remove heat around the electronic components (not shown) adjacent to the heat source 20.

For example, taking point B in the outermost heat dissipation fin 210 (as shown in FIG. 3) as an example, when the heat source 20 is operating, the temperature of the point B in the heat dissipation device 10 without the air circulation group 400 is, for example, Celsius 53.4 degrees. When the heat dissipation device 10 additionally provided with the air circulation group 400 operates at the heat source 20, the temperature at point B is reduced from, for example, 53.4 degrees Celsius to 49.42 degrees Celsius. Therefore, the air circulation group 400 can more effectively remove the heat accumulated in the heat dissipation fins 210.

On the other hand, after the air circulation group 400 is additionally disposed on the heat sink 10, the lower-level electronic components such as a memory (not shown), a power converter (not shown), and a graphics card (not shown) adjacent to the heat sink 10 (Illustrated) The surrounding temperature may decrease. In detail, the temperature around the memory (not shown) decreases, for example, from 56.21 degrees Celsius to 52.45 degrees Celsius. The temperature around the power converter (not shown) drops from 57.8 degrees Celsius to 53.25 degrees Celsius, for example. The temperature around the graphics card (not shown) drops, for example, from 56.42 degrees Celsius to 55.51 degrees Celsius. Therefore, the air circulation group 400 can not only remove the heat accumulated in the heat dissipation fins 210 more effectively, but also remove the heat around the electronic components adjacent to the heat source 20.

In addition, since the casing 410 is a transparent casing, when the heat dissipation device 10 operates, not only can the user judge the operation status of the heat dissipation device 10 by observing the movement of these pistons 420, but also the visual effect of the heat dissipation device 10 can be increased. Furthermore, in other embodiments, the heat dissipating device may also include a plurality of light-emitting elements. In this way, the heat dissipating device can generate rich acousto-optic effects with the engine sound effects and the light effect of the light-emitting elements when these pistons are operating.

Furthermore, the air circulation group 400 in this embodiment is disposed on the heat dissipation assembly 200, but is not limited thereto. In other embodiments, the air circulation group may also be provided outside the electronic device through a universal serial bus connector. As a result, the air circulation group is an independent heat dissipation device, and can help remove heat around the electronic device.

See Figure 4. 4 is a schematic cross-sectional view of a heat dissipation device and a heat source according to a second embodiment of the present invention. In this embodiment, the heat dissipation device 10a further includes an air hood 500a to enhance the heat dissipation effect of the second heat dissipation fan 450a on the heat dissipation fins 210a. The air hood 500a has an air guide channel 510a. One end of the air guide channel 510a corresponds to the second heat dissipation fan 450a, and the other end of the air guide channel 510a corresponds to the heat radiation fins 210a. In this way, the cold air guided by the second cooling fan 450a can enter the air guide channel 510a, and dissipate the heat radiating fins 210a when it exits the air guide channel 510a.

Please refer to FIG. 5 and FIG. 6. 5 is an exploded view of a connecting rod and a piston according to a third embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of a heat dissipation device according to a third embodiment of the present invention.

In the first embodiment, the pistons 420 can reciprocate by the combination of the cams 432 of the connecting rod 430 and the elastic elements 4201 of the pistons 420, but it is not limited to this. In this embodiment, the connecting rod 430b It can also be changed to an eccentric shaft, and these pistons 420b each include a body 4200b and a pivot joint 4203b connected to each other, and these pivot joints 4203b are pivotally connected to the connecting rod 430b. In this way, in this embodiment, the pistons 420b can be reciprocated by the combination of the eccentric shaft structure of the connecting rod 430b and the pivot joint portion 4203b of the pistons 420.

According to the heat dissipating device disclosed in the above embodiment, the circulating airflow formed by reciprocating the piston can be radiated through the first ventilation hole of the housing to dissipate the heat dissipating component by providing the airflow circulating group in the heat dissipating component. In this way, the first cooling fan and the air circulation group can respectively guide the cold air to the heat dissipation component through different paths to dissipate heat, so that the heat accumulated in the heat dissipation component can be effectively removed, thereby improving the heat dissipation efficiency of the heat dissipation device.

In addition, by providing a second cooling fan in the casing, the second cooling fan can not only guide the cold air to the cooling fins through another path for heat dissipation, but also guide the cold air to the surrounding electronic components near the heat source. For cooling. This not only further improves the heat dissipation efficiency of the heat dissipation device, but also enables the electronic components adjacent to the heat source to obtain an additional heat dissipation effect.

In addition, the design of the heat dissipation device with the piston not only changes the monotonous appearance of the heat dissipation device visually, but also enables the heat dissipation device to be matched with the light effect of the light emitting element and the sound effect of the engine, and generates more traditional heat dissipation when the piston operates. Rich sound and light effects.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in similar arts can make some changes and retouch without departing from the spirit and scope of the present invention. The scope of patent protection of an invention shall be determined by the scope of patent application attached to this specification.

10, 10a‧‧‧ heat dissipation device

100‧‧‧Heat conduction plate

200‧‧‧Cooling Components

210, 210a‧‧‧ heat dissipation fins

211‧‧‧Cooling surface

212‧‧‧Circular side

220‧‧‧ heat pipe

300‧‧‧The first cooling fan

400‧‧‧air circulation group

410‧‧‧shell

411‧‧‧lower case

412‧‧‧upper shell

413‧‧‧Ventilation surface

414‧‧‧first vent

415‧‧‧second vent

416‧‧‧First receiving slot

420, 420b‧‧‧Piston

4200, 4200b‧‧‧

4201‧‧‧Elastic element

4202‧‧‧Second accommodation slot

4203b‧‧‧Pivot

421‧‧‧First Piston

422‧‧‧Second Piston

430, 430b‧‧‧ connecting rod

431‧‧‧ crankshaft

432‧‧‧cam

440‧‧‧Drive element

450, 450a‧‧‧Second cooling fan

500a‧‧‧Air duct

510a‧‧‧Air duct

20‧‧‧ heat source

L1, L2‧‧‧Axis of rotation

A‧‧‧ circulating airflow

N‧‧‧normal

C1‧‧‧First Centerline

C2‧‧‧Second Centerline

θ‧‧‧ acute angle

FIG. 1 is a perspective view of a heat sink and a heat source according to a first embodiment of the present invention. FIG. 2 is an exploded view of the heat dissipation device and heat source of FIG. 1. FIG. 3 is a partial enlarged view of a schematic cross-sectional view of the heat dissipation device of FIG. 1. 4 is a schematic cross-sectional view of a heat dissipation device and a heat source according to a second embodiment of the present invention. 5 is an exploded view of a connecting rod and a piston according to a third embodiment of the present invention. FIG. 6 is a schematic cross-sectional view of a heat dissipation device according to a third embodiment of the present invention.

Claims (10)

A heat dissipation device for dissipating thermal energy generated by a heat source. The heat dissipation device includes: a heat conducting plate for thermally contacting the heat source; a heat dissipating component connected to the heat conducting plate; and at least a first heat dissipating fan provided at The heat dissipation component; and an air circulation group including a housing and at least one piston, the housing is disposed on the heat dissipation component, and has a ventilation surface facing the heat dissipation component and a first ventilation hole, the first ventilation The hole is located on the ventilation surface, and the at least one piston is movably disposed in the casing to generate a circulating airflow for dissipating the heat dissipation component through the first ventilation hole; wherein the airflow circulation group further includes a continuous airflow. A rod and a driving element, the at least one piston is in contact with the connecting rod, and the driving element is used to drive the at least one piston to reciprocate through the connecting rod. The heat dissipation device according to item 1 of the patent application scope, wherein the heat dissipation component includes a plurality of heat dissipation fins and a heat conducting tube, and the heat dissipation fins and the heat conducting plate are respectively connected to two opposite sides of the heat conducting tube, and the heat conduction The tube is in thermal contact with the heat conducting plate and the heat dissipation fins, and the casing of the air circulation group is disposed on one side of the heat dissipation fins. The heat dissipation device according to item 2 of the scope of patent application, wherein each of the heat dissipation fins has two heat dissipation surfaces and an annular side surface, and in each of the heat dissipation fins, the two heat dissipation surfaces are opposite to each other, and the annular side surface is connected to the heat dissipation device. Two heat dissipation surfaces, the ventilation surface faces the outermost heat dissipation surface. The heat dissipation device according to item 2 of the scope of patent application, wherein each of the heat dissipation fins has two heat dissipation surfaces and an annular side surface, and in each of the heat dissipation fins, the two heat dissipation surfaces are adjacent to each other. In contrast, the annular side surface is connected to the two heat dissipation surfaces, and the ventilation surface faces the annular side surfaces. The heat dissipation device according to item 3 or item 4 of the scope of patent application, wherein the connecting rod includes a crankshaft and a plurality of cams, the cams are disposed on the crankshaft, the number of the at least one piston is multiple, and the number of The pistons respectively contact the cams of the connecting rod, the driving element is connected to the crankshaft, and is used to drive the crankshaft to rotate, so that the crankshaft drives the cams to push the pistons to reciprocate. The heat dissipation device according to item 5 of the scope of patent application, wherein the air circulation group further includes a second heat dissipation fan, the second heat dissipation fan is disposed on one side of the connecting rod, and a rotation axis of the second heat dissipation fan and The rotation axes of the first cooling fan are not parallel. The heat dissipation device according to item 6 of the scope of patent application, wherein the second heat dissipation fan and the driving element are respectively connected to two opposite sides of the link. The heat dissipation device according to item 6 of the scope of patent application, wherein the second heat dissipation fan and the driving element are connected to the same side of the link. The heat dissipation device according to item 6 of the scope of the patent application, further includes an air guide hood, the air guide hood has an air guide channel, one end of the air guide channel corresponds to the second heat dissipation fan, and the other end of the air guide channel Correspond to some cooling fins. The heat dissipation device according to item 1 of the scope of patent application, wherein the casing is a transparent casing.