TW202007931A - Thickness measurement device, correction method and correction fixture thereof capable of reducing the error caused by environmental factors and greatly improving the measurement accuracy - Google Patents
Thickness measurement device, correction method and correction fixture thereof capable of reducing the error caused by environmental factors and greatly improving the measurement accuracy Download PDFInfo
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本發明是有關於一種厚度測量裝置,特別是指一種用於測量薄片厚度的厚度測量裝置及其校正方法與校正治具。The invention relates to a thickness measuring device, in particular to a thickness measuring device for measuring the thickness of a sheet, a correction method and a correction jig.
傳統取得物件之尺寸數據的手段僅能透過游標尺,不但較不精準且容易損傷物件表面,今日科技則已能透過光學測量器,配合雷射或不同光源投射的變化,取得物件的尺寸數據。惟,光學測量器雖然精度高,但是容易受到環境因素影響,而產生誤差,以環境溫差3度為例,前述雷射測量器所測量的厚度誤差,就會達到2.5μm。The traditional method of obtaining the size data of an object can only be achieved through a vernier ruler, which is not only less accurate and easy to damage the surface of the object. Today's technology has been able to obtain the size data of the object through the optical measuring device, with the change of the laser or different light source projection. However, although the optical measuring instrument has high accuracy, it is susceptible to environmental factors and may cause errors. Taking the environmental temperature difference of 3 degrees as an example, the thickness error measured by the aforementioned laser measuring instrument will reach 2.5 μm.
參閱圖1,一種中華民國專利第I372234號專利案所揭露之習知的雙雷射非接觸式厚度量測系統1,用於測量一薄片2的厚度,主要包含可被驅動而沿一方向X位移的二雷射測量器11,及位於定點的一校正治具12。該校正治具12與該薄片2都配置在該等雷射測量器11的運動路徑中,並具有相隔一間距的二表面121。Referring to FIG. 1, a conventional dual-laser non-contact thickness measurement system 1 disclosed in Patent No. I372234 of the Republic of China is used to measure the thickness of a
測量每一薄片2的厚度時,該等雷射測量器11會先位移至該校正治具12的二側,測量出該校正治具12之表面121間的基準厚度後,再沿該方向X位移,並掃描位於運動路徑中的薄片2,藉此,以該校正治具12的基準厚度為校正參考值,彌補前述環境因素所造成的誤差,而計算出該物件2的厚度。惟,前述校正方式雖然提供了補償機制,仍存有以下缺點:When measuring the thickness of each
一、誠如第I372234號專利案之說明書中所揭示,該等雷射測量器11是通過滑塊與線軌的配合,達到移動的目的,而滑塊與線軌本身就存在有滑動間隙,在不同的位置就會有不同的測量結果,因此,位移中的該等雷射測量器11即使在相對該校正治具12的位置時已完成校正,但在位移至相對該薄片2的過程中,容易因為前述滑動間隙,而造成量測上的誤差。1. As disclosed in the specification of Patent No. I372234, the
二、由於該等雷射測量器11分別以不同的時規皮帶傳動,因此,若要在移動後,使上、下側的雷射測量器11均定位在能夠上、下相對且使該等雷射測量器11所發出的雷射光都投射在共點的位置,則所需要的組裝精度,及組件加工精度都非常高,不但成本過高,且容易產生測量誤差,亦即,上、下側的雷射測量器11所發出的雷射光投射在薄片2的上、下表面的光點在方向X上是容易相互偏移,導致計算出來的厚度並不是精確地由同一點位置所得到的。2. Since the
三、受限於該等雷射測量器11位移的方式,若要設置多個會移動的電射測量器11,將會提升傳動組件的複雜程度,及成本,因此,第I372234號專利案只安裝二個雷射測量器11,所以,也只能夠沿該軸線X取得一組沿該軸線X分佈的多個厚度測量值,有取樣分佈不均,測量精度不夠精準,且效率較差的問題。3. Limited by the displacement method of these
因此,本發明的目的,即在提供一種能夠大幅提升測量精度的厚度測量裝置及其校正方法與校正治具。Therefore, the object of the present invention is to provide a thickness measuring device, a calibration method and a calibration jig that can greatly improve the measurement accuracy.
於是,本發明之厚度測量裝置的校正方法,該厚度測量裝置包含至少一測量組,及與該測量組相互通訊的一控制單元,該至少一測量組包括相對配置且適用於測量一物件單元之厚度的二光學測量器,該校正方法以一校正治具為工具,該校正治具有相隔一間距的至少二基準面,該校正方法通過該控制單元實現以下步驟:Therefore, the method for calibrating the thickness measurement device of the present invention includes at least one measurement group and a control unit communicating with the measurement group. The at least one measurement group includes a relative configuration and is suitable for measuring an object unit Two optical measuring instruments of thickness. The calibration method uses a calibration jig as a tool. The calibration tool has at least two reference planes separated by a distance. The calibration method implements the following steps by the control unit:
(a):驅動該校正治具相對該至少一測量組由一退回位置位移至一校正位置,在該校正位置時,該校正治具的該等基準面位於該等光學測量器的光程範圍,在該退回位置時,該校正治具的該等基準面脫離該等光學測量器的光程範圍。(a): driving the calibration jig relative to the at least one measurement group from a retracted position to a calibration position, and at the calibration position, the reference planes of the calibration jig are located in the optical path range of the optical measuring devices At the retracted position, the reference planes of the calibration jig deviate from the optical path range of the optical measuring instruments.
(b):接收來自於該等光學測量器測量該等基準面的二測量訊號。(b): Receive two measurement signals from the optical measuring instruments to measure the reference planes.
(c):根據該等測量訊號,計算出位於該等基準面間的一基準厚度。(c): Based on the measurement signals, calculate a reference thickness between the reference planes.
(d):驅動該校正治具由該校正位置位移至該退回位置。(d): Drive the correction jig from the correction position to the retracted position.
本發明之厚度測量裝置的校正治具,該厚度測量裝置包含一平台,及至少一測量組,該至少一測量組包括相對配置在該平台二側且適用於測量一物件之厚度的二光學測量器,該校正治具包含:至少一載台,及至少一基準片。The calibration jig of the thickness measurement device of the present invention includes a platform and at least one measurement group, and the at least one measurement group includes two optical measurements relatively disposed on both sides of the platform and suitable for measuring the thickness of an object The calibration jig includes: at least one stage and at least one reference sheet.
該至少一載台設置在該平台上,且相對該至少一測量組在一退回位置與一校正位置間位移,在該校正位置時,該至少一載台相對於該至少一測量組,在該退回位置時,該至少一載台脫離該至少一測量組。The at least one carrier is disposed on the platform and is displaced between a retracted position and a calibration position relative to the at least one measurement group. In the calibration position, the at least one carrier is relative to the at least one measurement group. When returning to the position, the at least one carrier is separated from the at least one measurement group.
該至少一基準片包括設置在該載台上且相隔一間距的二基準面,在該至少一載台位於該退回位置時,該等基準面脫離該等光學測量器的光程範圍,在該至少一載台位於該校正位置時,該等基準面位於該等光學測量器的光程範圍,供該等光學測量器測量出位於該等基準面間的一基準厚度。The at least one reference sheet includes two reference planes disposed on the stage and separated by a distance. When the at least one stage is in the retracted position, the reference planes deviate from the optical path range of the optical measuring devices. When at least one stage is located at the calibration position, the reference planes are located in the optical path range of the optical measuring devices, so that the optical measuring devices can measure a reference thickness between the reference planes.
本發明的厚度測量裝置,適用於測量一物件單元的厚度,該物件單元包括至少一物件,該厚度測量裝置包含:一平台單元、一測量單元、一校正治具、一驅動單元、一輸送單元,及一控制單元。The thickness measuring device of the present invention is suitable for measuring the thickness of an object unit. The object unit includes at least one object. The thickness measuring device includes: a platform unit, a measuring unit, a calibration jig, a driving unit, and a conveying unit , And a control unit.
該平台單元包括一平台。The platform unit includes a platform.
該測量單元包括包括至少一測量組,該測量組具有用於測量厚度的二光學測量器,該等光學測量器相對配置在該平台二側,且分別輸出一測量訊號。The measurement unit includes at least one measurement group. The measurement group has two optical measuring devices for measuring thickness. The optical measuring devices are relatively arranged on two sides of the platform and output a measuring signal respectively.
該校正治具設置在該平台上,並包括相對該至少一測量組在一退回位置與一校正位置間位移的至少一載台,及設置在該至少一載台上的至少一基準片,該基準片具有相隔一間距的二基準面,在該至少一載台位於該退回位置時,該等基準面脫離該等光學測量器的光程範圍,在該至少一載台位於該校正位置時,該等基準面位於該等光學測量器的光程範圍。The calibration jig is disposed on the platform, and includes at least one stage displaced relative to the at least one measurement group between a retracted position and a calibration position, and at least one reference sheet disposed on the at least one stage, the The reference sheet has two reference planes separated by a distance. When the at least one stage is at the retracted position, the reference planes deviate from the optical path range of the optical measuring devices, and when the at least one stage is at the correction position, The reference planes are located in the optical path range of the optical measuring devices.
該驅動單元安裝在該平台,且用於驅動該至少一載台位移。The driving unit is installed on the platform and is used to drive the displacement of the at least one stage.
該輸送單元安裝在該平台,且用於輸送該至少一物件位移至該等光學測量器的光程範圍內。The conveying unit is installed on the platform and is used to convey the at least one object to the optical path range of the optical measuring devices.
該控制單元與該測量組相互通訊且電連接於該校正治具與該輸送單元,並根據該等測量訊號,計算出位於該等基準面間的一基準厚度,及以該基準厚度為校正值,計算出該至少一物件的厚度。The control unit communicates with the measurement group and is electrically connected to the calibration jig and the conveying unit, and calculates a reference thickness between the reference planes based on the measurement signals, and uses the reference thickness as a correction value To calculate the thickness of the at least one object.
本發明之功效在於:以該等光學測量器固定不動,而該校正治具移動的方式,完成校正作業,及後續的測量作業,不但可以減少環境因素所產生的誤差,且能夠大幅提升測量精度。The effect of the present invention is that the optical measuring instruments are fixed and the calibration jig is moved to complete the calibration operation and subsequent measurement operations, which can not only reduce the errors caused by environmental factors, but also greatly improve the measurement accuracy .
參閱圖2、圖3與圖6,本發明厚度測量裝置的一實施例,適用於測量薄片狀的物件3(如圖12、圖13)。在本實施例中,物件3(如圖12、圖13)是一種5吋的晶片(wafer),且通過一運送裝置(圖未示)逐一輸送至該厚度測量裝置。該厚度測量裝置包含:一平台單元4、一測量單元5、一校正治具6、一驅動單元7、一輸送單元8,及一控制單元9。Referring to FIGS. 2, 3 and 6, an embodiment of the thickness measuring device of the present invention is suitable for measuring thin objects 3 (see FIGS. 12 and 13 ). In this embodiment, the object 3 (as shown in FIGS. 12 and 13) is a 5-inch wafer, and is transported to the thickness measurement device one by one by a transport device (not shown). The thickness measuring device includes a
圖2箭頭X的方向為一預定方向,在本實施例中,該預定方向設定為一第一方向X,且以圖2垂直於該第一方向X之箭頭Z的方向為一第二方向Z,及以垂直於該第一方向X與該第二方向Z之箭頭Y的方向為一第三方向Y。應當注意的是,前述第一方向X與第三方向Y不限於垂直,在本實施例的其它樣態中,也可以彼此呈一夾角。The direction of arrow X in FIG. 2 is a predetermined direction. In this embodiment, the predetermined direction is set as a first direction X, and the direction of arrow Z in FIG. 2 perpendicular to the first direction X is a second direction Z , And the direction of the arrow Y perpendicular to the first direction X and the second direction Z is a third direction Y. It should be noted that the foregoing first direction X and third direction Y are not limited to being perpendicular, and in other aspects of this embodiment, they may also form an angle with each other.
該平台單元4包括沿該第一方向X延伸的一平台41,及二軌條42(如圖9)。該平台41具有沿該第二方向Z相隔一間距的二台面411、412,及貫穿該等台面411、412且沿該第三方向Y排列的三槽口413(如圖8)。該等軌條42(如圖9)固設在該台面412(如圖9)且沿該第一方向X延伸。The
參閱圖2~圖5與圖7,該測量單元5包括沿該第三方向Y相隔一間距且位於該平台41二側的二支架51、連接該等支架51且沿該第二方向Z相隔一間距的的二軌架52、設置在該等軌架52的二定位組53,及三測量組54。每一軌架52具有沿該第三方向Y延伸且相隔一間距的二滑槽組521。每一滑槽組521具有沿該第二方向Z相隔一間距的二滑槽522。每一定位組53具有沿該第三方向Y排列的三定位架531。在本實施例中,該等定位架532與對應之軌架52的該等滑槽組521滑合且定位在對應之軌架52。每一測量組54具有用於測量厚度且沿該第二方向Z上、下相對的二光學測量器541。每一光學測量器541固設在各別之定位架531,且用於輸出一測量訊號S,並具有用於發射感測光線552的一發射部542,及接收反射光線554的一感測部543。該發射部542與該感測部541相對於該平台41的槽口413,前述感測光線與反射光線的路徑構成一光程範圍,且感測光線的入射方向朝向槽口413。2 to 5 and 7, the
在本實施例中,該等光學測量器541是一種雷射測量器,且以一傾角安裝在各別之定位架531,該傾角可以使感測光線552相對於一平面的入射角度α、β約略等於反射光線554的反射角度γ,使該感測部543直接感測到反射光線554。前述入射角度α、β可以相同或是不相同,且角度在45度以內,較佳在25度以內,角度越小則光學測量器541所佔的體積也可以越小,且反射光線554的光束可以越集中,使量測信號越精準。重要的是,該等測量組54的光學測量器541通過該等定位架532沿該第二方向Z上、下相對,因此,可以使上、下相對之光學測量器541所發出的感測光線552都投射在共點的位置(如圖4,感測光線552都投射到同一條法線L的位置)。由於上、下相對的光學測量器541已經固定於該等定位架531上,因此,每一感測光線552可以持續投射在共點的位置,不會像習知技術會有感測光線偏移導致無法精準共點的問題產生。另外,可以選擇性地設置一減光鏡544於光學測量器541與物件3之間,以降低感測光線552或是反射光線554的強度,防止光線過強導致的訊號干擾。In this embodiment, the
另外,該等測量組54的數目不限於三組,在本實施例的其它樣態中,也可以是一組、二組,或四組以上。In addition, the number of
參閱圖8、圖9與圖10,該校正治具6設置在該平台41上,並包括一載台61、二軌道62、數磁鐵63,及三基準片64。Referring to FIG. 8, FIG. 9 and FIG. 10, the
該載台61相對該等測量組54沿該第一方向X與該第一方向X的反向在一退回位置(如圖5、圖12)與一校正位置(如圖4與圖9)間位移,並具有可位移地穿置在該平台41之該等槽口413內的三凸部611。每一凸部611具有界定出一窗口610的一環壁612。該環壁612具有一安裝槽613。沿該第三方向Y位於二外側之凸部611的安裝槽613沿該第三方向Y延伸,且槽寬大於位於中間之凸部611的安裝槽613槽寬。值得說明的是,本實施例中的載台61不限於沿該第一方向X位移或沿該第一方向X的反向位移,在本實施例的其它樣態中,該載台61也可以沿該第三方向Y、該第三方向Y的反向,或其他方向進行位移,而在一退回位置與一校正位置間位移(圖未示)。甚至,該載台61的數目也不限於一個,在本實施例的其它樣態中,可以設置複數個載台61(圖未示),例如二個載台61設置於該平台41的兩側,並且該等載台61可以分別沿該第三方向Y與該第三方向Y的反向(或沿著其他方向),在一退回位置與一校正位置之間位移。The
在該載台61位於該退回位置時,該等窗口610脫離該等光學測量器641的光程範圍,在該載台61位於該校正位置時,該等窗口610位於該等光學測量器541的光程範圍。When the
該等軌道62固設在該載台61且與該平台單元4之該等軌條42滑合。The
該等磁鐵63相對該載台61之該等安裝槽613設置在該等凸部611的環壁612。The
每一基準片64沿該第三方向Y的徑寬不大於各別之安裝槽613的槽寬,且可卸離地安裝在對應之安裝槽613而覆蓋對應之窗口610的一部份或全部,並具有沿該第二方向Z相隔一間距的二基準面641。該等基準面641分別向上側與向下側朝向該等光學測量器541。在本實施例中,該等基準片64是一種磁性材料,且通過該等磁鐵63吸附在該載台61上。前述導磁元件可以例如是高碳鉻的合金鋼,但不以此為限,只要是性質穩定且因溫度變形量少的材料皆可。在該載台61位於該退回位置時,該等基準面641脫離該等光學測量器541的光程範圍,在該載台61位於該校正位置時,該等基準面641位於該等光學測量器541的光程範圍。The diameter width of each
該載台61位於二外側之安裝槽613的槽寬可以設計成與中間的安裝槽613的槽寬一樣大或者比較大,因此,當該載台61二外側之安裝槽613的槽寬比中間的安裝槽613的槽寬還要大時,可供對應安裝的基準片64沿該第三方向Y或沿異於該第三方向Y的一第四方向(圖未示)在一第一尺寸位置(如圖8、圖11)與一第二尺寸位置(如圖14)間位移,在該第一尺寸位置時,該等基準片64沿該第三方向Y的總距離L1(如圖11)最小,在該第二尺寸位置時,該等基準片64沿該第三方向Y的總距離L2(如圖14)最大,上述的總距離L1、L2皆是以位於載台61之一側的基準片64的最外側邊緣至載台61之另一側的基準片64的最外側邊緣之間的距離。這樣的設計可以適用於不同尺寸物件3的測量需求,例如位於第一尺寸位置的基準片64可以用以測量5吋的晶片(wafer),位於第二尺寸位置的基準片64可以用以測量6吋的晶片。也就是說,安裝槽613的槽寬可以依照需求而設計,以針對不同晶片尺寸的量測需求進行定位基準片64。亦即,前述安裝槽613的槽寬可以大於對應之基準片64的寬度,例如本實施例中一個安裝槽613的槽寬是一個基準片64的寬度的兩倍,藉此設計可以變換基準片64的位置,例如將對應的基準片64由靠近該載台61中央的位置更換到靠近該載台61外側的位置,甚至也可以旋轉該基準片64,只要該基準片64的位置經過變換後能夠使總距離L2大於總距離L1皆屬本發明的範圍內。The groove width of the mounting
應當注意的是,如段落〔0027〕所記載,前述異於該第三方向Y的第四方向與該第一方向X夾一個預設角度,使該載台61的安裝槽613可以沿該第四方向以一傾角延伸。該預設角度界於0度~180度。藉此,同樣可供對應安裝的基準片64沿該第四方向在該第一尺寸位置與該第二尺寸位置間位移,進而變化該等基準片64沿該第三方向Y的總距離。It should be noted that, as stated in paragraph [0027], the aforementioned fourth direction different from the third direction Y and the first direction X are sandwiched by a preset angle, so that the mounting
參閱圖9與圖10,該驅動單元7安裝在該平台41,並包括樞設在平台41且沿該第一方向X相隔一間距的二帶輪71、套聯該等帶輪71的一環繞帶72,及驅動其中一帶輪71正向、反向轉動的一校正馬達73。該環繞帶72區分有繞經在該等帶輪72的二環繞部721,及位於該等環繞部721間沿該第一方向X移動的二直線部722。其中一直線部722連結於該載台61,使該環繞帶72與該載台61形成連動。Referring to FIGS. 9 and 10, the driving
參閱圖3與圖8,該輸送單元8安裝在該平台41,並包括沿該第一方向X配置在該平台41二側的二轉軸組81、樞設在該平台單元4的數張力輪82、沿該第一方向X環繞該等轉軸組81、該等張力輪82與該平台41的四輸送帶83,及驅動其中一轉軸組81轉動的一輸送馬達84。該等輸送帶83沿該第三方向Y排列,供每一物件3跨置在該等輸送帶83上而位於該平台41的台面411上方,而輸送每一物件3沿該第一方向X位移通過該等光學測量器541的光程範圍。較佳地,該物件3在持續移動的過程中,同時被來自上、下二側(第二方向Z)的感測光線552照射其表面並形成反射光線554回到測量組54。Referring to FIGS. 3 and 8, the conveying
參閱圖2、圖3與圖6,該控制單元9與該等測量組54相互通訊,且電連接於該輸送單元8的輸送馬達84、該驅動單元7的校正馬達73,並根據該等測量訊號S,計算出一待測物件的厚度。Referring to FIGS. 2, 3 and 6, the
參圖15,在本發明測量每一批相同之物件3(如圖12、圖13)的厚度之前或之後,會進行校正,而本發明厚度測量裝置的校正方法與量測方法的步驟如下:Referring to FIG. 15, before or after measuring the thickness of each batch of the same objects 3 (as shown in FIGS. 12 and 13) in the present invention, calibration will be performed. The steps of the calibration method and the measuring method of the thickness measuring device of the present invention are as follows:
步驟101:參閱圖3~圖5、圖8、圖9與圖10,控制該校正馬達73驅動該等帶輪71與該環繞帶72以順/逆時針方向轉動,並通過該環繞帶72的直線部722帶動該載台61,使該校正治具6的載台61通過該等軌道62與該等軌條42的滑合關係,沿該第一方向X朝該等光學測量器541方向位移至該校正位置。藉此,如圖8所示,該載台61上的該等凸部611會由該平台41之槽口413的右側位移至左側;如圖9所示,該載台61上的該等凸部611會由該平台41之槽口413的左側位移至右側。Step 101: Refer to FIG. 3 to FIG. 5, FIG. 8, FIG. 9 and FIG. 10, control the
此時,該校正治具6之該等基準片64的該等基準面641分別位於該等光學測量器541的光程範圍,且分別朝向該等光學測量器541。也就是說,每一基準片64的二基準面641(上表面與下表面)分別朝向位於該基準片64上方與下方的二光學測量器541,並位於該等光學測量器541的光程範圍。At this time, the reference planes 641 of the
步驟102:參閱圖4、圖5、圖7與圖11,控制該等光學測量器541通過該等發射部542產生感測光線552,使感測光線552直接投射在該等基準片64朝向上方的基準面641而形成三個第一測量點P11,及通過該載台61的窗口610投射在該等基準片64朝向下方的基準面641而形成三個第二測量點P12,藉此,該等光學測量器541會通過該等感測部541感測由該等基準面641反射的反射光線554後,輸出六個測量訊號S。Step 102: Referring to FIG. 4, FIG. 5, FIG. 7 and FIG. 11, the
靠近物件3邊緣的第一測量點P11與靠近物件3邊緣的第二測量點P12的位置,由物件3邊緣起算,通常沿該第三方向Y位於物件3寬度的三分之一寬度範圍內,也因此每一基準片64的定位位置較佳是設計成可以調整位置的方式。這樣就可以不用大費周章拆卸更換整組載台來適應於不同尺寸的晶片。The positions of the first measuring point P11 near the edge of the
步驟103:接收來自於該等光學測量器541的該等測量訊號S。Step 103: Receive the measurement signals S from the
步驟104:根據步驟103的該等測量訊號S,計算出位於該等基準面641間且沿該第三方向Y分佈在相當於該總距離L1之範圍內的三個基準厚度T0
。Step 104: Based on the measurement signals S of
換句話說,當一第一測量點P11與一第二測量點P12被同一條垂直基準面641的法線L所貫穿時,此時第一測量點P11與第二測量點P12所量測到的位置視為共點,此共點所在位置的物件3厚度(測量厚度T1)即可由反射光線554所得知的二個測量訊號S計算出來。In other words, when a first measurement point P11 and a second measurement point P12 are penetrated by the normal line L of the same
物件3的厚度可以有多種的計算方式,舉例來說,由反射光線554所得到的測量訊號S可轉換為距離值,當兩個對應的光學測量器541之間的固定距離值減去該兩個對應的光學測量器541所得到的二個距離值即可得知物件3的測量厚度T1
,惟本發明物件3的測量厚度T1
的計算方式並不以此為限。再者,前述以光線如雷射測量厚度的技術,與習知相同,且非本案申請的技術特徵,由於本領域中具有通常知識者根據以上說明可以推知擴充細節,因此不多加說明。The thickness of the
步驟105:參閱圖9與圖12,控制該校正馬達73驅動該等帶輪71與該環繞帶72以逆/順時針方向轉動,並通過該環繞帶72的直線部722帶動該載台61,使該校正治具6的載台61通過該等軌道62與該等軌條42的滑合關係,沿該第一方向X的反向位移至該退回位置。藉此,如圖12所示,該載台61上的該等凸部611(如圖9所示)會由該平台41之槽口413的左側位移至右側。Step 105: Referring to FIG. 9 and FIG. 12, the
此時,該校正治具6之該等基準片64的該等基準面641分別脫離該等光學測量器541的光程範圍。At this time, the reference planes 641 of the
步驟106:參閱圖12,控制該輸送馬達84驅動該等轉軸組81與該等輸送帶83轉動,使位於該平台41之台面411上方的一個或多個物件3由圖12右側向左側逐一輸送至該等輸送帶83上,並沿該第一方向X由圖12右側向圖12左側移動,接著,通過該等光學測量器541的光程範圍。該載台61在校正位置與退回位置之間來回位移,執行這個位移動作的時機點視需求而定,可以每測量一個物件3後啟動載台61執行位移,也可以測量多個物件3之後才執行,例如測量50片晶片後執行位移來進行厚度校正,如此可以讓檢測速度加快,提高產能。Step 106: Referring to FIG. 12, the conveying
由於該等輸送帶83環繞該平台41的台面411、412,而該載台61的凸部611穿置在該平台41的槽口413內,因此,在該等輸送帶83輸送該物件3沿該第一方向X移動的過程中,該物件3會由該載台61與該等基準片62的上方通過,而不會互相干擾。Since the
步驟107:在每一物件3通過該等光學測量器541之光程範圍的過程中,控制該等光學測量器541通過該等發射部542產生感測光線552,使感測光線552直接投射在該物件3的一上表面31(如圖5)而形成至少三個第一測量點P21,及通過該平台41的槽口413投射在該物件3的一下表面32(如圖5)而形成至少三個第二測量點P22,藉此,該等光學測量器541會通過該等感測部543感測由該等基準面641反射的反射光線554後,而輸出數測量訊號S。Step 107: While each
如圖5所示,在本實施例中,當該物件3在該等光學測量器541的光程範圍內時,至少一物件3是沿一預定方向(如該第一方向X)在不停止的狀態下往圖面左側行進,因此,物件3是一邊移動一邊受到感測光線552的照射,此時,該校正治具6的載台61位於該退回位置。在另一實施例中,物件3也可以沿該預定方向(如該第一方向X)的反向在不停止的狀態下往圖面右側行進。在又一實施例中,物件3也可以沿該第一方向X往圖面左側行進到該等光學測量器541的光程範圍內時停止在預設位置,並接受到感測光線552的照射後,再開始往圖面左側繼續行進。As shown in FIG. 5, in this embodiment, when the
步驟108:接收來自於該等光學測量器541的該等測量訊號S。Step 108: Receive the measurement signals S from the
步驟109:根據步驟108的該等測量訊號S,及以前述基準厚度T0
為補償值,計算出該物件3的數個測量厚度T1
。Step 109: Calculate several measured thicknesses T 1 of the
步驟108之測量訊號S的數目,是根據實務及該物件3的尺寸設定,至少包括由該等光學測量器541測量前述三個第一測量點P21與前述三個第二測量點P22後所輸出的六個測量訊號S,獲得沿該第三方向Y分佈在相當於該總距離L1之範圍內的三個厚度T1
,應當注意的是,前述測量訊號S並不限於六個,在本實施例的其他變化例中,也可以在該物件3沿該第一方向X行進的過程中,通過該等光學測量器541沿該第一方向X掃描該物件3,在該物件3的上表面31與下表面32形成多個第一測點量P21與多個第二測量點P22,而輸出多個測量訊號S,並獲得沿該第一方向X與該第三方向Y呈矩陣分佈之數個位置的數個厚度T1
,如六個厚度T1
、九個厚度T1
、十二個厚度T1
,或十二個以上的厚度T1
。上述實施例中的每一個測量訊號S可以定義為一預定時間內所感測接收到的資訊。The number of measurement signals S in
上述的步驟是以三個測量組54、三個第一測量點P11、三個第二測量點P12舉例說明,但本發明不予以限制,只要至少一個測量組54、至少一個第一測量點P11以及至少一個第二測量點P12即為本發明的範圍所涵蓋。The above steps are illustrated with three
值得說明的是,前述第一測量點P11、P21、第二測量點P12、P22的位置並不限於只有一種,參閱圖10與圖14,改變測量點時,只需鬆釋位於二外側的該等定位架531,並沿該第三方向Y依循該等軌架52之滑槽組521向二外側擴大位於二外側之該等定位架531的間距,再定位前述位於二外側之該等定位架531於該軌架52上,藉此,維持該等光學測量器541於固定位置。It is worth noting that the positions of the first measurement points P11, P21, and the second measurement points P12, P22 are not limited to only one. Referring to FIGS. 10 and 14, when changing the measurement points, you only need to release the Wait for the
然後,將位於二外側之該等基準片64設置在該載台61位於二外側之安裝槽613的第二尺寸位置。Then, the
校正時,同樣可以通過該驅動單元7驅動該載台61位於該校正位置,供該等光學測量器541通過該載台61的窗口61測量該等基準片62,計算出位於該等基準面641間且沿該第三方向Y分佈在該總距離L2的三個基準厚度T0
。During calibration, the driving
測量物件3時,同樣是通過該輸送單元8輸送該物件3通過該等光學測量器541的光程範圍,及以前述基準厚度T0
為參考值,計算出沿該第三方向Y分佈在相當於該總距離L2之範圍內的三個厚度T1
。藉此,可以適用測量不同尺寸的物件3,如5寸晶片、或6寸晶片。When measuring the
應當注意的是,該校正治具6之該等第一測量點P11與該等第二測量點P12的位置變化,並不限於將該等基準片64安裝在該第一尺寸位置或該第二尺寸位置的方式,在本實施例的其他變化例中,也可以使該等基準片64沿該第三方向Y延伸,亦即使該等基準片64的尺寸變大,藉此,在不需要變化該等基準片64位置的情形下,只需調整該等光學測量器541的固定位置,就可以沿該第三方向Y在不同位置測量厚度。It should be noted that the position changes of the first measurement points P11 and the second measurement points P12 of the
經由以上的說明,可將前述實施例的優點歸納如下:Through the above description, the advantages of the foregoing embodiments can be summarized as follows:
一、本發明的該等光學測量器541在測量該等基準片61的厚度,或該物件3的厚度時,分別定位在該等軌架52上而固定不動,因此,在完成校正的步驟後,就己經補償了環境因素所造成的誤差,而能夠大幅提升測量時的精準度。1. When measuring the thickness of the
二、由於該等光學測量器541在測量過程中固定不動,因此,定位後,就可以使感測光線位於共點的位置,不但組裝容易,且成本較低,能夠進一步提升測量精準度。2. Since the
三、校正或測量該物件3的厚度時,只有該校正治具6與該物件3會移動,該等光學測量器541間,或該等光學測量器541、該物件3與該校正治具6彼此之間並不會互相干擾,而能設置多個測量組54,獲得沿該第一方向X與該第三方向Y呈矩陣分佈之數個位置的數個厚度T1
,而能夠大幅提升取樣值,及提升檢測效率。3. When calibrating or measuring the thickness of the
惟以上所述者,僅為本發明的實施例而已,當不能以此限定本發明實施的範圍,凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾,皆仍屬本發明專利涵蓋的範圍內。However, the above are only examples of the present invention, and the scope of implementation of the present invention cannot be limited by this, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still classified as Within the scope of the invention patent.
3‧‧‧物件31‧‧‧上表面32‧‧‧下表面4‧‧‧平台單元41‧‧‧平台411‧‧‧台面412‧‧‧台面413‧‧‧槽口42‧‧‧軌條5‧‧‧測量單元51‧‧‧支架52‧‧‧軌架521‧‧‧滑槽組522‧‧‧滑槽53‧‧‧定位組531‧‧‧定位架54‧‧‧測量組541‧‧‧光學測量器542‧‧‧發射部543‧‧‧感測部544‧‧‧減光鏡552‧‧‧感測光線554‧‧‧反射光線6‧‧‧校正治具61‧‧‧載台610‧‧‧窗口611‧‧‧凸部612‧‧‧環壁613‧‧‧安裝槽62‧‧‧軌道63‧‧‧磁鐵64‧‧‧基準片641‧‧‧基準面7‧‧‧驅動單元71‧‧‧帶輪72‧‧‧環繞帶721‧‧‧環繞部722‧‧‧直線部73‧‧‧校正馬達8‧‧‧輸送單元81‧‧‧轉軸組82‧‧‧張力輪83‧‧‧輸送帶84‧‧‧輸送馬達9‧‧‧控制單元X‧‧‧第一方向Z‧‧‧第二方向Y‧‧‧第三方向S‧‧‧測量訊號L1‧‧‧總距離L2‧‧‧總距離T0‧‧‧基準厚度T1‧‧‧測量厚度P11‧‧‧第一測量點P12‧‧‧第二測量點P21‧‧‧第一測量點P22‧‧‧第二測量點101~109‧‧‧步驟流程α‧‧‧入射角度β‧‧‧入射角度γ‧‧‧反射角度3‧‧‧Object 31‧‧‧Upper surface 32‧‧‧Lower surface 4‧‧‧Platform unit 41‧‧‧Platform 411‧‧‧Platform 412‧‧‧Platform 413‧‧‧Slot 42‧‧‧rail 5‧‧‧Measurement unit 51‧‧‧Bracket 52‧‧‧Rack 521‧‧‧Chute group 522‧‧‧Chute 53‧‧‧ Positioning group 531‧‧‧Placement frame 54‧‧‧Measurement group 541‧ ‧‧Optical measuring instrument 542‧‧‧Emitting part 543‧‧‧ Sensing part 544‧‧‧Reducing mirror 552‧‧‧Sensed light 554‧‧‧Reflected light 6‧‧‧Calibration fixture 61‧‧‧ Table 610‧‧‧Window 611‧‧‧Convex part 612‧‧‧Ring wall 613‧‧‧Mounting groove 62‧‧‧Track 63‧‧‧Magnet 64‧‧‧Reference piece 641‧‧‧Reference surface 7‧‧‧ Drive unit 71 ‧‧‧ pulley 72 ‧ ‧ ‧ wrap belt 721 ‧ ‧ ‧ wrap section 722 ‧ ‧ ‧ linear section 73 ‧ ‧ ‧ correction motor 8 83‧‧‧Conveyor belt 84‧‧‧Convey motor 9‧‧‧Control unit X‧‧‧ First direction Z‧‧‧ Second direction Y‧‧‧ Third direction S‧‧‧Measurement signal L1‧‧‧ Distance L2‧‧‧Total distance T 0 ‧‧‧ Base thickness T 1 ‧‧‧Measured thickness P11‧‧‧ First measurement point P12‧‧‧ Second measurement point P21‧‧‧First measurement point P22‧‧‧ Two measurement points 101~109‧‧‧ Step flow α‧‧‧incidence angle β‧‧‧incidence angle γ‧‧‧reflection angle
本發明的其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一張示意圖,說明中華民國專利第I372234號專利案所揭露之習知的雙雷射非接觸式厚度量測系統; 圖2是一張立體圖,說明本發明厚度測量裝置及其校正方法與校正治具的一實施例; 圖3是該實施例的一張前視圖; 圖4是一示意圖,說明該實施中的三測量組測量每一基準片的一基準厚度; 圖5是一示意圖,說明該實施例中的該等測量組測量一物的測量厚度; 圖6是該實施例的一張方塊圖; 圖7是一張局部立體分解圖,說明該實施例中的一測量單元; 圖8是一張立體圖,說明該實施例中的一平台單元、一輸送單元、一控制單元,及一校正治具,且該校正治具位於一校正位置; 圖9是一張類似於圖8的立體圖,但從另一個角度觀看; 圖10是一張不完整的局部立體分解圖,說明該實施例中的一校正治具; 圖11是一張示意圖,說明該實施例中三測量組用於測量該校正治具之三基準片的厚度,且其中二基準片分別位於一第一尺寸位置; 圖12是一張不完整的頂視圖,說明該實施例中的校正治具位於一退回位置; 圖13是一張示意圖,說明該實施例中三測量組用於測量一物件的厚度; 圖14是一張側視圖,說明該實施例中該等測量組沿一第三方向的測量距離擴大,且其中二基準片分別位於一第二尺寸位置;及 圖15是該實施例的一張流程圖。Other features and effects of the present invention will be clearly presented in the embodiment with reference to the drawings, in which: FIG. 1 is a schematic diagram illustrating the conventional double laser exposure disclosed in the Patent Case No. I372234 of the Republic of China Contact thickness measurement system; FIG. 2 is a perspective view illustrating an embodiment of the thickness measurement device of the present invention and its calibration method and calibration jig; FIG. 3 is a front view of the embodiment; FIG. 4 is a schematic diagram , Illustrating that the three measurement groups in the implementation measure a reference thickness of each reference sheet; FIG. 5 is a schematic diagram illustrating that the measurement groups in the embodiment measure the measured thickness of an object; FIG. 6 is a part of the embodiment A block diagram; FIG. 7 is a partial perspective exploded view illustrating a measuring unit in this embodiment; FIG. 8 is a perspective view illustrating a platform unit, a conveying unit, a control unit in this embodiment, and A correction jig, and the correction jig is located at a correction position; FIG. 9 is a perspective view similar to FIG. 8, but viewed from another angle; FIG. 10 is an incomplete partial perspective exploded view illustrating the implementation A calibration jig in the example; FIG. 11 is a schematic diagram illustrating that three measurement groups in this embodiment are used to measure the thickness of three reference pieces of the calibration jig, and two of the reference pieces are located at a first size position; FIG. 12 is an incomplete top view illustrating that the calibration jig in this embodiment is in a retracted position; FIG. 13 is a schematic diagram illustrating that three measurement groups in this embodiment are used to measure the thickness of an object; FIG. 14 Is a side view illustrating that the measurement distances of the measurement groups along a third direction in this embodiment are enlarged, and two of the reference plates are located at a second size position; and FIG. 15 is a flowchart of the embodiment .
5‧‧‧測量單元 5‧‧‧Measurement unit
51‧‧‧支架 51‧‧‧Bracket
52‧‧‧軌架 52‧‧‧Rack
521‧‧‧滑槽組 521‧‧‧Chute group
522‧‧‧滑槽 522‧‧‧Chute
53‧‧‧定位組 53‧‧‧Positioning group
531‧‧‧定位架 531‧‧‧Locating frame
610‧‧‧窗口 610‧‧‧window
611‧‧‧凸部 611‧‧‧Convex
612‧‧‧環壁 612‧‧‧ring wall
64‧‧‧基準片 64‧‧‧ benchmark
L1‧‧‧總距離 L1‧‧‧Total distance
P11‧‧‧第一測量點 P11‧‧‧ First measuring point
P12‧‧‧第二測量點 P12‧‧‧Second measuring point
54‧‧‧測量組 54‧‧‧Measurement Team
541‧‧‧光學測量器 541‧‧‧ optical measuring instrument
61‧‧‧載台 61‧‧‧ stage
Z‧‧‧第二方向 Z‧‧‧Second direction
Y‧‧‧第三方向 Y‧‧‧ third direction
Claims (19)
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