TW202007722A - Circuit board structure and composition for forming insulating substrates - Google Patents

Abstract

A composition for forming an insulating substrate includes 100 parts by weight of modified liquid crystal polymer and 0.5-85 parts by weight of dielectric filler. The modified liquid crystal polymer has a repeat unit structure of, where Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene, or 4,4'-biphenylene, Y is -O- or -NH-, and X is a carboxamido group, an imido/imino group, an amidino group, an aminocarbonylamino group, an aminothiocarbonyl group, an aminocarbonyloxy group, an aminosulfonyl group, an aminosulfonyloxy group, an aminosulfonylamino group, a carboxyl ester group, a (carboxyl ester) amino group, an (alkoxycarbonyl) oxy group, an alkoxycarbonyl group, a hydroxyamino group, an alkoxyamino group, a cyanato group, an isocyanato group, or a combination thereof.

Description

Circuit board structure and composition for forming an insulating substrate

The invention relates to a composition for forming an insulating substrate and a circuit board structure.

For consumer electronics products, the main features of System in Package (SIP) technology should be cost saving and miniaturization. For a platform that uses a substrate as an integrated component, there are two directions. One is to use a common organic material substrate or a multilayer printed circuit board (Printed Wiring Board, PWB); the other is an inorganic material substrate, such as a silicon substrate. The latter usually has the advantage of shrinking combined with chip circuits or manufacturing processes, but cost is a consideration. For the former, in addition to its low-cost characteristics, it can now be compounded by sophisticated process technologies, such as high-density interconnection (HDI) technology, combined with special materials. It can still meet the requirements of systematic construction.

In addition, as information products move toward higher speeds and higher frequencies, the substrate materials needed for the development of new generation products in the future, such as wireless communication networks, satellite communication equipment, high-power and broadband products, high-speed computers and computer workstations, etc., need to have high Substrate materials for glass transition temperature (Tg), low dissipation factor (Df) and low dielectric constant (Dk). At present, the copper foil substrates used in printed circuit boards (PCBs) are mainly made of epoxy resin-made FR-4 sheets, regardless of the number or technical level. Electrical properties such as electric constant and loss factor have gradually failed to meet the high-frequency requirements. Therefore, there is an urgent need for a substrate material that has a high dielectric constant and can maintain a low loss factor.

One aspect of the present invention is to provide a composition for forming an insulating substrate. By adjusting the composition of the composition, the dielectric constant value of the insulating substrate can be adjusted.

，其中Ar為

(1,4-phenylene，1,4-伸苯基)、

(1,3-phenylene，1,3-伸苯基)、

(2,6-naphthalene，2,6-萘基)或

(4,4'-biphenylene，4,4'-亞 聯苯基)，Y為＊-O-＊或

，且X為

(醯胺基)、

(亞胺基)、

(脒基)、

(氨基羰基 氨基)、

(氨基硫代羰基)、

(氨基羰基氧基)、

(氨 基磺醯基)、

(氨基磺醯氧基)、

(氨基磺醯基氨基)、

(羧 酸酯)、

((羧酸酯)氨基)、

((烷氧基羰基)氧基)、

(烷氧基羰基)、

(羥 胺基)、

(烷氧基氨基)、

(氰氧基)、

(異氰 酸基)或其組合，其中R₁、R₂和R₃可為C_nH_2n+1，且n為一正整數。 The above composition for forming an insulating substrate includes 100 parts by weight of a modified liquid crystal polymer and 0.5 to 85 parts by weight of a dielectric filler. The modified liquid crystal polymer has a repeating unit structure as

, Where Ar is

(1,4-phenylene, 1,4-phenylene),

(1,3-phenylene, 1,3-phenylene),

(2,6-naphthalene, 2,6-naphthyl) or

(4,4 ' -biphenylene, 4,4 ' -biphenylene), Y is *-O-＊ or

And X is

(Acylamino),

(Imino group),

(Amidino),

(Aminocarbonylamino),

(Aminothiocarbonyl),

(Aminocarbonyloxy),

(Aminosulfonyl),

(Aminosulfonyloxy),

(Aminosulfonylamino),

(Carboxylate),

((Carboxylate) amino),

((Alkoxycarbonyl)oxy),

(Alkoxycarbonyl),

(Hydroxylamine group),

(Alkoxyamino),

(Cyanooxy),

(Isocyanate group) or a combination thereof, wherein R ₁ , R ₂ and R ₃ may be C _n H _2n+1 and n is a positive integer.

According to some embodiments of the present invention, the dielectric filler is selected from the group consisting of a ceramic material, a modified ceramic material, a conductive particle, a modified conductive particle, an organic material, and a modified organic material Group.

According to some embodiments of the invention, the ceramic material is selected from the group consisting of barium titanate, lead titanate, barium strontium titanate (BST), titanium oxide, lead oxide, lead zirconate titanate (PZT), and perovskite cubic The group consisting of crystal structure (CaCu ₃ Ti ₄ O ₁₂ , CCTO) and lead niobate-lead titanate (PMN-PT).

According to some embodiments of the present invention, the modified ceramic material includes a modified group, and the modified group includes a silane group.

According to some embodiments of the present invention, the conductive particles include a carbon-based particle and a metal particle.

According to some embodiments of the present invention, the carbon-based particles are selected from the group consisting of carbon sixty (C ₆₀ ), graphene, carbon black, carbon fiber, and carbon nanotube (CNT).

According to some embodiments of the invention, the metal particles are selected from the group consisting of silver, aluminum, copper, nickel, zinc, and iron.

According to some embodiments of the present invention, the modified conductive particles include a modified carbon-based particle, the modified carbon-based particle includes a modified group, and the modified group is selected from the group consisting of an amine group, an aniline group, The group consisting of amide group, carboxyl group and hydroxyl group.

According to some embodiments of the invention, the organic material is selected from the group consisting of conductive polyaniline and copper titanium cyanide (CuPc).

According to some embodiments of the present invention, the modified organic material includes a modified group selected from the group consisting of sulfonic acid group, hydroxyl group, ether group, amino group and (p-chloromethylbenzene) vinyl group The group formed.

According to some embodiments of the present invention, the modified organic material includes a modified group selected from the group consisting of sulfonic acid group, hydroxyl group, ether group, amino group and (p-chloromethylbenzene) vinyl group The group formed.

Another aspect of the present invention is to provide a circuit board structure. The circuit board structure includes at least one insulating substrate and at least one redistribution layer. The at least one insulating substrate includes the composition for forming an insulating substrate as described above. The at least one redistribution layer is located on the insulating substrate.

According to some embodiments of the present invention, the circuit board structure further includes an adhesive layer between the insulating substrate and the redistribution layer.

According to some embodiments of the present invention, the adhesive layer is selected from the group consisting of fluororesin, polyphenylene ether resin, aralkyl-type epoxy resin, epoxy resin, phenoxy resin, acrylic resin, urethane The group consisting of ester resin, silicone rubber-based resin, parylene resin, liquid crystal polymer, bismaleimide resin and polyimide resin.

10‧‧‧ circuit board structure

12‧‧‧Insulated substrate

14‧‧‧ Redistribution layer

16‧‧‧adhesive layer

18‧‧‧conductive blind hole

In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious and understandable, the drawings are described in detail as follows: FIGS. 1 to 4 illustrate circuit boards according to various embodiments of the present invention A schematic cross-sectional view of the structure.

In order to make the description of this disclosure more detailed and complete, the following provides an illustrative description of the implementation form and specific embodiments of the present invention; however, this is not the only form for implementing or using specific embodiments of the present invention. The embodiments disclosed below can be combined or replaced with each other under beneficial circumstances, and other embodiments can be added to an embodiment without further description or description.

In order to make the description of the present disclosure more detailed and complete, reference may be made to the accompanying drawings and various embodiments described below. The same numbers in the drawings represent the same or similar elements.

The vocabulary used throughout this article generally represents its usual meaning, and some special vocabulary will be specifically defined below to provide additional guidance for practitioners. For convenience, some words may be specially marked, such as using italics and/or quotation marks. Regardless of whether it is specially marked, the scope and meaning of its vocabulary are not affected in any way, and are the same as the scope and meaning of ordinary vocabulary. It is understandable that the same thing can be described in more than one way. Therefore, alternative language and synonyms for one or more terms may be used in this article, but it is not intended to state that a vocabulary has any special meaning in what is discussed in this article. Synonyms of certain words will be used. Repeated use of one or more synonyms will not exclude the use of other synonyms. Any illustrations discussed in this specification are for illustrative purposes only and do not in any way limit the scope and meaning of the invention or its illustrations. Likewise, the present invention is not limited to the various embodiments proposed in this specification.

Unless there are other clear references in the content, the singular terms used in this article include plural referents. By referring to the specific reference of "one embodiment", in at least one of the embodiments of the invention of the present invention, it represents a specific feature, structure, or characteristic. When the language appears through a special reference, it is not necessary to refer to the same embodiment. Furthermore, in one or more embodiments, these special features, structures, or characteristics can be combined with each other as appropriate.

One aspect of the present invention provides a composition for forming an insulating substrate, which includes 100 parts by weight of a modified liquid crystal polymer and 0.5 to 85 parts by weight of a dielectric filler. The modified liquid crystal polymer has a repeating unit structure of the following formula (1)

；1,3- 伸苯基(1,3-phenylene)，化學式為

；2,6- 萘基(2,6-naphthalene)，化學式為

；或4,4'-亞聯苯基 (4,4'-biphenylene)，化學式為

Ar in formula (1) can be 1,4-phenylene (1,4-phenylene), the chemical formula is

; 1,3-phenylene (1,3-phenylene), the chemical formula is

; 2,6-naphthalene (2,6-naphthalene), the chemical formula is

; Or 4,4 ' -biphenylene (4,4 ' -biphenylene), the chemical formula is

。 Y in formula (1) can be *-O-* or

.

；亞胺基(Imido/Imino)，化學 式為

；脒基(Amidino)，化學式為

；氨基羰基氨基 (Aminocarbonylamino)，化學式為

；氨基硫代羰基 (Aminothiocarbonyl)，化學式為

；氨 基羰基氧基(Aminocarbonyloxy)，化學式為

；氨基磺醯基(Aminosulfonyl)， 化學式為

；氨基磺醯氧基 (Aminosulfonyloxy)，化學式為

；氨 基磺醯基氨基(Aminosulfonylamino)，化學式為

；羧酸酯(Carboxyl ester)，化學式為

；(羧酸酯)氨基((Carboxyl ester) amino)，化學式為

；(烷氧基羰基) 氧基((Alkoxycarbonyl)oxy)，化學式為

；烷氧基羰基 (Alkoxycarbonyl)化學式為，

； 羥胺基(Hydroxyamino)，化學式為

；烷 氧基氨基(Alkoxyamino)，化學式為

；氰氧基(Cyanato)，化學式為

；異氰酸基(Isocyanato)，化學 式為

；或其組合，其中烷氧基R₁、R₂和R₃ 的通式為C_nH_2n+1，且n為一正整數。 X in formula (1) may be an amide group (Carboxamido), the chemical formula is

; Imino (Imido/Imino), the chemical formula is

; Amidino (Amidino), the chemical formula is

; Aminocarbonylamino (Aminocarbonylamino), the chemical formula is

; Aminothiocarbonyl (Aminothiocarbonyl), the chemical formula is

; Aminocarbonyloxy (Aminocarbonyloxy), the chemical formula is

; Aminosulfonyl (Aminosulfonyl), the chemical formula is

; Aminosulfonyloxy (Aminosulfonyloxy), the chemical formula is

; Aminosulfonylamino (Aminosulfonylamino), the chemical formula is

; Carboxyl ester (Carboxyl ester), the chemical formula is

; (Carboxyl ester) amino (Carboxyl ester) amino, the chemical formula is

; (Alkoxycarbonyl)oxy ((Alkoxycarbonyl)oxy), the chemical formula is

; The alkoxycarbonyl (Alkoxycarbonyl) chemical formula is,

; Hydroxyamino (Hydroxyamino), the chemical formula is

; Alkoxyamino, the chemical formula is

; Cyanato, the chemical formula is

; Isocyanato (Isocyanato), the chemical formula is

; Or a combination thereof, wherein the general formula of alkoxy R ₁ , R ₂ and R ₃ is C _n H _2n+1 , and n is a positive integer.

According to various embodiments of the present invention, any one of the above Ar can be combined with any Y and any X together. It may have the same or different technical effects in different combinations.

In more detail, the above modified liquid crystal polymer can be dissolved in a specific solvent to form a modified liquid crystal polymer solution. For example, the specific solvent may be selected from N-methyl-2-pyrrolidone, N,N-dimethylacetamide, γ-butyrolactone, dimethylformamide, 2-butoxy Ethyl alcohol and 2-ethoxyethanol group. Compared with traditional liquid crystal polymers, the solubility of soluble liquid crystal polymers is higher than that of traditional liquid crystal polymers in certain solvents. It can be understood that the modified liquid crystal polymer solution can be formed on a carrier plate by coating and the like, and then the solvent is evaporated to form an insulating substrate containing the modified liquid crystal polymer.

其中Ar為1,4-伸苯基、1,3-伸苯基、2,6-萘基或4,4'-亞聯苯基，Y為-O-或-NH-，且X為醯胺基、亞胺基、脒基、氨基羰基氨基、氨基硫代羰基、氨基羰基氧基、氨基磺醯基、氨基磺醯氧基、氨基磺醯基氨基、羧酸酯、(羧酸酯)氨基、(烷氧基羰基)氧基、烷氧基羰基、羥胺基、烷氧基氨基、氰氧基、異氰酸基或其組合。 For example, the modified liquid crystal polymer solution may be an aromatic liquid crystal polyester solution, which includes one of the above solvents and an aromatic liquid crystal polyester. The weight percentage of the solid component of the aromatic liquid crystal polyester is 1wt% to 85% by weight, for example, 5wt%, 15wt%, 25wt%, 35wt%, 45wt%, 55wt%, 65wt% or 75wt%. When the weight percentage of the solid component of the aromatic liquid crystal polyester is less than a certain value, such as 1 wt%, the insulating substrate needs to perform multiple coating processes to achieve the required thickness, which is quite time-consuming and costly. Conversely, when the weight percentage of the solid component of the aromatic liquid crystal polyester is greater than a certain value, for example, 85 wt%, the solid component of the aromatic liquid crystal polyester is not easily dissolved in the solvent to cause gelatinization. Specifically, the aromatic liquid crystal polyester has a repeating unit structure as follows:

Wherein Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene group or 4,4 '- biphenylene, Y is -O- or -NH-, and X is acyl Amino, imino, amidino, aminocarbonylamino, aminothiocarbonyl, aminocarbonyloxy, sulfamoyl, sulfamoyl, sulfamoylamino, carboxylate, (carboxylate) Amino group, (alkoxycarbonyl)oxy group, alkoxycarbonyl group, hydroxylamine group, alkoxyamino group, cyanooxy group, isocyanato group or a combination thereof.

If the content of the dielectric filler is greater than a certain value, such as 85 parts by weight, the dielectric fillers will communicate with each other, so that the material changes from an insulator to a conductor, and the dielectric constant and conductivity of the material will be huge Change, and then lose the performance as an insulating substrate. In various embodiments, the dielectric filler is selected from the group consisting of ceramic materials, modified ceramic materials, conductive particles, modified conductive particles, organic materials, and modified organic materials. More specifically, in many examples, the ceramic material is selected from the group consisting of barium titanate (BT), lead titanate, barium strontium titanate (BST), titanium oxide, and lead oxide. Lead zirconate titanate (Pb(ZrTi)O ₃ , PZT), perovskite cubic crystal structure (CaCu ₃ Ti ₄ O ₁₂ , CCTO) and lead niobate-lead titanate (PMN-PT) group. In various examples, the modified ceramic material includes a modified group, and the modified group of the modified ceramic material includes a silane group. In many examples, the conductive particles include carbon-based particles and metal particles. For example, the carbon-based particles are selected from the group consisting of carbon sixty (C ₆₀ ), graphene (Graphene), carbon black, carbon fiber, and carbon nanotube (CNT); and metal particles It is selected from the group consisting of silver, aluminum, copper, nickel, zinc and iron. In various examples, the modified conductive particles include a modified carbon-based particle, and the modified carbon-based particle includes a modified group, and the modified group of the modified carbon-based particle is selected from the group consisting of an amine group and an aniline A group consisting of a group, an amide group, a carboxyl group and a hydroxyl group. In various examples, the organic material is selected from the group consisting of conductive polyaniline and Copper Phthalocyanine (CuPc). In many examples, the modified organic material includes a modified group, and the modified group of the modified organic material is selected from the group consisting of sulfonic acid group, hydroxyl group, ether group, amino group and (p-chloromethylbenzene) ethylene The group formed by the base. It is understandable that the dielectric filler is added to the solution of the above modified liquid crystal polymer and formed on the carrier plate by coating and the like, and then the solvent is evaporated by heating to form an improved dielectric Constant insulation substrate. It is worth noting that the dielectric filler is not dissolved in the solution of the modified liquid crystal polymer, but is evenly dispersed in the solution of the modified liquid crystal polymer.

In some embodiments, the average particle size of the dielectric filler is 0.1 to 20 microns. According to various embodiments, when the average particle size of the dielectric filler is less than a certain value, for example, 0.1 μm, the effect of increasing the dielectric constant is not significant. Conversely, when the average particle size of the dielectric filler is greater than a certain value, such as 20 microns, it is difficult to control the dispersibility of the dielectric filler particles, and it is easy to make the dielectric filler particles communicate with each other, so that subsequent formation Of insulating substrates lose their insulating properties. Therefore, the average particle diameter of the dielectric filler may be, for example, 0.5 microns, 1.0 microns, 1.5 microns, 2.0 microns, 2.5 microns, 3.0 microns, 3.5 microns, 4.0 microns, 4.5 microns, 5.0 microns, 5.5 microns, 6.0 microns, 6.5 Micrometer, 7.0 micrometer, 7.5 micrometer, 8.0 micrometer, 8.5 micrometer, 9.0 micrometer, 9.5 micrometer, 10.0 micrometer, 12.0 micrometer, 14.0 micrometer, 16.0 micrometer, or 18.0 micrometer.

Generally speaking, the modified liquid crystal polymer itself has good processability, heat resistance, low water absorption, low dielectric constant (Dk) (for example, between 2 and 4) and low loss factor (Df) (for example, between 0.003 and 0.008), therefore, the composition for forming an insulating substrate of the present invention includes the above-mentioned dielectric filler that can increase the dielectric constant, which can increase the dielectric constant to 3 Between 200 and 200, and maintain a loss factor between 0.003 and 0.008. Typically, the dielectric material can be divided into a high dielectric constant (for example, greater than 4) and a low dielectric constant (for example, less than or equal to 4) according to the level of the dielectric constant. High dielectric materials are mainly used in gate dielectric materials, energy storage materials and wireless communication materials to reduce the power consumption of electronic products; low dielectric materials are mainly used to prepare electronic packaging materials to reduce RC delay (RC delay ) Adverse effects.

In other alternative embodiments, the composition used to form the insulating substrate may include modified polyimide (Polyimide, PI) and a dielectric filler. Specifically, the modified polyimide contains aromatic monomers and/or other functional monomers that help reduce water absorption. For example, the aromatic monomer may include aromatic diamine, aromatic dianhydride, aromatic polyamidoamine, polyphenylene terephthalamide (PPTA), polyparaphenylenebenzoxylene (Poly(p-phenylene-2,6-benzobisoxazole, PBO) and copolymers of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid (poly(p-hydroxybenzoic acid-co-2-hydroxy-6- naphthoic acid)). The characteristics and embodiments of the dielectric filler have been described in detail above, so they will not be repeated here.

Another aspect of the invention provides a circuit board structure 10. 1 to 4 are schematic cross-sectional views of circuit board structures according to various embodiments of the present invention. Please refer to FIG. 1 first, the circuit board structure 10 includes at least one insulating substrate 12 and at least one redistribution layer 14. The at least one insulating substrate 12 includes the composition for forming an insulating substrate as described above. That is, the composition forming the at least one insulating substrate 12 includes 100 parts by weight of the modified liquid crystal polymer and 0.5 to 85 parts by weight of the dielectric filler. The features and embodiments of both the modified liquid crystal polymer and the dielectric filler have been described in detail above, so they will not be repeated here. The at least one redistribution layer 14 is located on the insulating substrate.

In some examples, the material of the redistribution layer 14 may include copper, aluminum, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zinc, chromium, manganese, cobalt, gold, tin, lead, or stainless steel, or more An alloy formed by mixing at least two of metal materials. In more detail, the redistribution layer 14 may be formed by etching a metal foil, such as copper foil, aluminum foil, silver foil, tin foil, and/or gold foil. In some embodiments, the surface of the redistribution layer 14 may be coated, so that the surface of the redistribution layer 14 is covered with a coating layer (not shown), such as a nickel-gold layer, a zinc layer, or a cobalt layer.

Please refer to FIG. 2. In various embodiments, the circuit board structure 10 may further include an adhesive layer 16 between the insulating substrate 12 and the redistribution layer 14. More specifically, the adhesive layer 16 has the same pattern as the redistribution layer 14. By forming the adhesive layer 16, the insulating substrate 12 and the redistribution layer 14 can have a better bonding force. In various examples, the adhesive layer 16 is selected from the group consisting of fluororesin, polyphenylene ether resin (PPO/PPE), aralkyl epoxy resin, epoxy resin, phenoxy resin, acrylic resin, amine The group consisting of urethane resin, silicone rubber resin, parylene resin, liquid crystal polymer, bismaleimide resin and polyimide resin. For example, the fluororesin may include polytetrafluoroethylene (PTFE), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (Polyfluoroalkoxy, PFA), and tetrafluoroethylene-hexafluoropropylene copolymer (Fluorinated Ethylene Propylene (FEP), ethylene-tetrafluoroethylene copolymer (Ethylene-tetra-fluoro-ethylen, ETFE); aralkyl epoxy resin may contain biphenyl epoxy resin. The schematic diagram of the circuit board structure 10 shown in FIGS. 1 and 2 is a single-sided circuit board (single-sided circuit board) structure.

However, the present invention is not limited to the single-sided circuit board described above, the circuit board structure 10 may also be a multilayer circuit board structure, which can determine the respective of the insulating substrate 12 and the redistribution layer 14 according to the required circuit layout Number of layers. The circuit board structure 10 shown in FIG. 3 is different from the circuit board structure 10 shown in FIG. 1 in that the circuit board structure 10 shown in FIG. 3 includes two layers of insulating substrates 12 and three layers of redistribution Layer 14, and the two insulating substrates 12 are sandwiched between two adjacent double-wiring layers 14. It can be understood that the signal transmission between any two wiring layers 14 is implemented by the conductive blind holes 18 provided in the insulating substrate 12. Therefore, the circuit board structure 10 may further include at least one conductive blind hole 18 penetrating the insulating substrate 12. In some embodiments, the material of the conductive blind hole 18 may be similar to the material of the redistribution layer 14.

Please refer to FIG. 4. In various embodiments, the circuit board structure 10 may further include an adhesive layer 16 between the insulating substrate 12 and the redistribution layer 14. More specifically, the conductive blind hole 18 will penetrate the adhesive layer 16 and electrically connect the two adjacent wiring layers 14. The features and embodiments of the adhesive layer 16 have been described in detail above, so they will not be repeated here. In other embodiments of the present invention, the circuit board structure may also include two or more insulating substrates and a redistribution layer between the insulating substrates.

In summary, the composition for forming an insulating substrate of the present invention includes a modified liquid crystal polymer and a dielectric filler. By adjusting the composition of this composition, the dielectric constant of the insulating substrate is greatly improved, resulting in a high dielectric Constant (for example, 4 to 200) insulating substrate can still have a low dielectric loss factor (for example, 0.003 to 0.008) under high-frequency signal transmission, to reduce the occurrence of signal transmission delay or loss, thereby increasing the speed of signal transmission and /Or frequency. Not only that, the composition for forming an insulating substrate of the present invention can also ensure the quality and stability of signal transmission under the severe environmental conditions of high temperature and high humidity. In addition, the composition for forming an insulating substrate of the present invention can also form an insulating substrate having a low dielectric constant (for example, 4 or less). This insulating substrate having a low dielectric constant can be The insulating substrates are combined to stack new multifunctional electronic products.

Although the present invention has been disclosed as above in the embodiments, the above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Anyone who is familiar with this skill can consider it as within the spirit and scope of the present invention. All equivalent changes and modifications shall fall within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined in the attached patent application.

10‧‧‧ circuit board structure

12‧‧‧Insulated substrate

14‧‧‧ Redistribution layer

Claims (14)

A composition for forming an insulating substrate, comprising: a modified liquid crystal polymer, which is 100 parts by weight. The modified liquid crystal polymer has a repeating unit structure as follows:

Where Ar is

,

,

or

, Y is *-O-* or

And X is

,

Or a combination thereof, wherein R ₁ , R ₂ and R ₃ are C _n H _2n+1 and n is a positive integer; and a dielectric filler is 0.5 parts by weight to 85 parts by weight. The composition of claim 1, wherein the dielectric filler is selected from a ceramic material, a modified ceramic material, a conductive particle, a modified conductive particle, an organic material, and a modified organic material The group formed. The composition of claim 2, wherein the ceramic material is selected from the group consisting of barium titanate, lead titanate, barium strontium titanate (BST), titanium oxide, lead oxide, lead zirconate titanate (PZT), calcium A group consisting of a cubic structure of titanium ore (CaCu ₃ Ti ₄ O ₁₂ , CCTO) and lead niobate-lead titanate (PMN-PT). The composition of claim 2, wherein the modified ceramic material includes a modified group, and the modified group includes a silane group. The composition according to claim 2, wherein the conductive particles include a carbon-based particle and a metal particle. The composition of claim 5, wherein the carbon-based particles are selected from the group consisting of carbon sixty (C ₆₀ ), graphene, carbon black, carbon fiber, and carbon nanotubes. The composition of claim 5, wherein the metal particles are selected from the group consisting of silver, aluminum, copper, nickel, zinc, and iron. The composition according to claim 2, wherein the modified conductive particles include a modified carbon-based particle, the modified carbon-based particle includes a modified group, and the modified group is selected from the group consisting of an amine group, Aniline, amide, carboxyl and hydroxyl groups. The composition of claim 2, wherein the organic material is selected from the group consisting of conductive polyaniline and copper titanium cyanide (CuPc). The composition according to claim 2, wherein the modified organic material comprises a modified group selected from the group consisting of sulfonic acid group, hydroxyl group, ether group, amino group and (p-chloromethylbenzene ) A group consisting of vinyl. The composition of claim 1, wherein one of the dielectric fillers has an average particle size of 0.1 to 20 microns. A circuit board structure includes: at least one insulating substrate, including a composition for forming the insulating substrate as described in item 1 of the patent application scope; and at least one redistribution layer located on the insulating substrate. The circuit board structure according to claim 12, further comprising an adhesive layer between the insulating substrate and the redistribution layer. The circuit board structure according to claim 13, wherein the adhesive layer is selected from the group consisting of fluororesin, polyphenylene ether resin, aralkyl epoxy resin, epoxy resin, phenoxy resin, acrylic resin, The group consisting of urethane resin, silicone rubber-based resin, parylene resin, liquid crystal polymer, bismaleimide resin and polyimide resin.

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