TW202000724A - Thermal adhesive polyester composition, thermal adhesive polyester complex-fiber comprising the same, and non-woven fabric - Google Patents

Abstract

The present invention relates to a polyester composition for a thermally adhesive fiber and, more specifically, to: a polyester composition for a thermally adhesive fiber, which has an excellent spinning property and excellent thermal adhesion with respect to a fiber, ages minimally and is stably stored at room temperature, and can have an excellent feel when implemented in a product; and a thermally adhesive composite fiber and a porous structure which are implemented using same.

Description

Polyester composition for thermally bonded fibers, thermally bonded composite fibers and nonwoven fabrics realized therefrom

The present invention relates to a polyester composition for thermally bonding fibers. More specifically, the fibers have excellent spinnability and thermal bonding properties over a wide temperature range, and can also minimize changes in aging and storage under summer storage conditions. A polyester composition for thermally bonded fibers, thermally bonded composite fibers and non-woven fabrics with improved stability and products that can exhibit excellent tactile and dyeing characteristics.

Generally, synthetic fibers have a high melting point, so their use is limited in many cases. In particular, in the case of bonding applications such as fibers, etc., as a core, etc., or as an adhesive inserted between the fabrics on the tape to press-bond, the fiber fabric itself may be deteriorated by heating, and it is necessary to use Special equipment such as a high-frequency sewing machine is troublesome, and therefore, it is necessary to easily achieve bonding by a simple heating press without using such special equipment.

When the existing low-melting polyester fibers are used for mattresses, automotive interior materials or various non-woven fabric repairs, etc., in order to bond different types of fibers in the mutual fiber structure used, hot melt (Hot Melt) type Bonded fibers are widely used.

For example, U.S. Patent No. 4,129,675 discloses a low-melting polyester copolymerized with terephthalic acid (terephthalic acid: TPA) and isophthalic acid (IPA), and Korean Patent No. 10-1216690 No. discloses a low-melting polyester fiber including isophthalic acid and diethylene glycol for improving adhesion.

However, although the existing low-melting polyester fiber as described above may have a certain degree of spinnability and adhesion, there is a non-woven fabric with a hard feeling obtained after thermal bonding due to the strong ring structure of the modifier. Problems with fabric structures.

Moreover, with the development of a low melting point or a low glass transition temperature in order to exhibit the characteristics of the adhesive, the heat resistance of the polyester achieved becomes poor, so it also significantly occurs under storage conditions exceeding 40°C in summer The aging changes, so that the storage stability is also significantly deteriorated due to the bonding between polyester chips or fibers during storage.

Therefore, there is an urgent need to develop heat that can maintain or improve the spinnability and adhesion of existing low-melting polyester fibers, have significantly improved feel and dyeing characteristics, minimize changes over time at normal temperature, and improve storage stability. Adhesive polyester fiber.

The present invention was developed in view of the above problems, and its object is to provide excellent fiber spinnability, exhibit good thermal adhesion, and achieve products that can exhibit significantly improved tactile and dyeing characteristics, and minimize changes over time at room temperature 1. Polyester composition for thermal bonding fiber with improved storage stability, thermal bonding composite fiber and non-woven fabric realized by it.

In order to achieve the above object, the present invention provides a polyester composition for thermally bonding fibers, which is characterized by comprising: an acid component containing terephthalic acid and a compound represented by Chemical Formula 1 containing ethylene glycol and by Copolyester of the polycondensation of the esterified compound produced by the reaction of the diol component of the compound represented by Chemical Formula 2.

[Chemical Formula 1]

[Chemical Formula 2]

According to an embodiment of the present invention, the total content of the compound represented by Chemical Formula 1 and the compound represented by Chemical Formula 2 in the diol component may be 30 to 45 mole percent.

And, in the diol component, the content of the compound represented by Chemical Formula 1 (mole percentage) may be greater than the content of the compound represented by Chemical Formula 2 (mole percentage).

Also, the glycol component may not actually include glycol.

Moreover, the acid component may further include isophthalic acid in a percentage of 1 to 10 moles based on the acid component.

Moreover, in the diol component, the content of the compound represented by Chemical Formula 1 may be 1 to 40 mole percent, and the content of the compound represented by Chemical Formula 2 may be 1 to 20 mole percent; more preferably Preferably, the content of the compound represented by Chemical Formula 1 may be 20-40 mole percent, and the content of the compound represented by Chemical Formula 2 may be 1-10 mole percent; more preferably, the content represented by Chemical Formula 1 The content of the compound may be 30-40 mole percent, and the content of the compound represented by Chemical Formula 2 may be 1-6 mole percent.

Moreover, the acid component may further include isophthalic acid, and the total content of the isophthalic acid, the compound represented by Chemical Formula 1 and the compound represented by Chemical Formula 2 in the copolyester may be 55 Ear percentage or less.

Moreover, the composition has no melting point and exhibits softening behavior, and the glass transition temperature may be 60 to 75°C; more preferably, it may be 65 to 72°C.

Moreover, the inherent viscosity of the composition may be 0.500 to 0.800 dl/g.

Also, the present invention provides a polyester chip characterized by including the polyester composition for thermally bonding fibers according to the present invention.

Also, the present invention provides a heat-bonded composite fiber, which includes: a core portion including a polyester-based component; and a sheath portion that surrounds the core portion and includes the polyester combination for heat-bonding fibers according to the present invention Thing.

Also, the present invention provides a nonwoven fabric characterized by including the heat-bonded composite fiber according to the present invention alone or including the heat-bonded composite fiber and polyester-based fiber and formed into a predetermined shape.

According to an embodiment of the present invention, the non-woven fabric may be configured to be one selected from the group consisting of automobile mattress materials, building interior materials, bedding materials, clothing insulation materials, and agricultural insulation materials.

According to the present invention, the fiber is excellent in spinnability and exhibits good thermal adhesion, and the product achieved can exhibit significantly improved tactile and dyeing characteristics. In addition, changes in aging at room temperature are minimized and storage stability is improved. Furthermore, when the polyester composition is made into chips, the drying time is significantly reduced, so that the manufacturing time can be shortened. Therefore, products achieved using the composition are also minimized in aging changes under storage conditions such as summer (for example, 40° C. or higher), and have good storage stability, so it is possible to prevent deformation of the original shape of the product or Deformation during use.

Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those of ordinary skill in the art to which the present invention pertains can easily implement the present invention. The present invention can be implemented in many different embodiments, and is not limited to the embodiments described in this specification.

The polyester composition for thermally bonding fibers according to the present invention includes reacting an acid component containing terephthalic acid with a glycol component containing ethylene glycol, a compound represented by Chemical Formula 1, and a compound represented by Chemical Formula 2. Copolyester made from polycondensation of esterified compounds.

[Chemical Formula 1]

[Chemical Formula 2]

First, the acid component may include terephthalic acid, in addition to terephthalic acid, it may also include an aromatic polycarboxylic acid having 6 to 14 carbon atoms or an aliphatic polycarboxylic acid having 2 to 14 carbon atoms Acid and/or sulfonic acid metal salts.

The aromatic polycarboxylic acid having 6 to 14 carbon atoms can use, without limitation, a well-known acid component for preparing polyester; preferably, it can be selected from dimethyl terephthalate, More than one of the group consisting of isophthalic acid and dimethyl isophthalate; more preferably, in terms of reaction stability with terephthalic acid, ease of handling and economy, it can be isophthalic acid Formic acid.

Also, the aliphatic polycarboxylic acid having 2 to 14 carbon atoms can be used without limitation as a known acid component for preparing polyester, and as a non-limiting example thereof, it can be selected from oxalic acid, malonic acid , Succinic acid, glutaric acid, adipic acid, sorbic acid, citric acid, fume acid, azelaic acid, sebacic acid, nonanoic acid, capric acid, dodecanoic acid and caproic acid More than one.

In addition, the metal sulfonate may be sodium 3,5-dicarbomethoxybenzenesulfonate (Sodium 3,5-dicarbomethoxybenzenesulfonate).

On the other hand, as the acid component, other components that may be included in addition to terephthalic acid may reduce the heat resistance of the polyester composition, therefore, it is preferable not to include other components that can be included in addition to terephthalic acid ingredient. However, when other types of acid components are further included in consideration of reaction stability with terephthalic acid, ease of handling, and economy, isophthalic acid is preferably included. In this case, preferably, the content of isophthalic acid is 1 to 10 mole percent based on the acid component. If the content of isophthalic acid is less than 1 mole percent based on the acid component, it may be difficult to exhibit high thermal adhesion at the additional low temperature required, and when the content is greater than 10 mole percent, the product achieved is excessive The hard and soft touch is significantly reduced, and the glass transition temperature becomes too low, resulting in reduced heat resistance. Also, in the copolyester, the total content of the compound represented by Chemical Formula 1, the compound represented by Chemical Formula 2, and isophthalic acid, which will be described below, increases excessively, but instead functions as a main component capable of forming crystals to significantly reduce the It may be difficult to achieve the purpose of the invention due to the thermal bonding characteristics at the required temperature.

Next, the diol component includes ethylene glycol, a compound represented by the following Chemical Formula 1 and a compound represented by the following Chemical Formula 2.

[Chemical Formula 1]

[Chemical Formula 2]

First, the compound represented by the chemical formula 1 can lower the crystallinity and glass transition temperature of the prepared polyester composition to exhibit excellent thermal adhesion properties. Moreover, after being made into a fibrous shape, it is possible to make the dyeing process under normal pressure to make the dyeing process easier, the washing fastness is improved due to the excellent dyeing performance, and it can be improved such as non-woven fabrics, etc. The touch of molded products. Preferably, in the diol component, the content of the compound represented by Chemical Formula 1 may be 13-40 mole percent; more preferably, it may be 20-40 mole percent; further more preferably, it may be It is 30-40 mole percent. If the content of the compound represented by Chemical Formula 1 is less than 13 mole percent based on the diol component, although the spinnability is good, the bonding temperature is increased or the thermal bonding property is reduced, and the use is limited. In addition, if the content of the compound represented by Chemical Formula 1 is more than 40 mole percent, it is difficult to achieve commercialization due to poor spinnability, and on the contrary, the crystallinity increases, resulting in a decrease in thermal adhesion.

On the other hand, preferably, the content of the compound represented by Chemical Formula 1 may be equal to or greater than 20 mole percent, and thus, the polyester composition at a low temperature can be further improved together with the compound represented by Chemical Formula 2 to be described below The heat-bonding properties of the resin, and when chipping the polyester composition, can significantly shorten the drying time.

The compound represented by the chemical formula 2 together with the compound represented by the chemical formula 1 further improves the thermal adhesive properties of the prepared polyester composition, and prevents a significant decrease in the glass transition temperature of the compound represented by the chemical formula 1, Thus, even at a storage temperature of 40° C. or higher, it is possible to minimize changes over time and improve storage stability. Regarding the thermal adhesiveness, the compound represented by Chemical Formula 2 and the compound represented by Chemical Formula 1 are used in combination so that the heat-adhesive fibers using the realized polyester composition exhibit appropriate shrinkage characteristics. When bonding, the point bonding force is further improved, so that the thermal bonding characteristics can be further increased.

Preferably, in the diol component, the content of the compound represented by Chemical Formula 2 may be 1-20 mole percent; more preferably, it may be 1-10 mole percent; further more preferably, it may be It is 1~6 mole percentage.

If the content of the compound represented by Chemical Formula 2 is less than 1 mole percent based on the diol component, it is difficult to improve the required heat resistance, and therefore the storage stability is poor, resulting in excessive aging changes. Also, when the compound represented by Chemical Formula 2 is used in combination with the compound represented by Chemical Formula 1 and the compound represented by Chemical Formula 2 is greater than 20 mole percent, the spinnability is poor, so it is difficult to achieve commercialization. In this case, the crystallinity is sufficiently reduced, and there is no further effect. When the content of the further added isophthalic acid is increased, the crystallinity is increased, resulting in a significant decrease in the excellent thermal adhesion characteristics at the desired temperature, etc. The purpose of the present invention is achieved. In addition, when it is realized in a fibrous shape or the like, the shrinkage is remarkably increased, and processing is difficult.

According to a preferred embodiment of the present invention, preferably, the total content of the compound represented by Chemical Formula 1 and the compound represented by Chemical Formula 2 in the diol component is 30 to 45 mole percent; more preferably , Can be 33 to 41 mole percent. If the total content is less than 30 mole percent, the crystallinity of the copolyester increases, showing a high melting point, or it is difficult to achieve a softening point at a low temperature, resulting in a significant increase in the heat-bondable temperature, which may not show excellent at low temperatures Thermal bonding properties. Also, if the compound represented by Chemical Formula 2 is greater than 45 mole percent, the polymerization reactivity and spinnability may be significantly reduced, and the crystallinity of the prepared copolyester is increased instead, so it is difficult to exhibit high thermal bonding characteristics at a desired temperature .

At this time, in the diol component, the content of the compound represented by Chemical Formula 1 may be greater than the content (mole percentage) of the compound represented by Chemical Formula 2. If the content of the compound represented by Chemical Formula 1 is equal to or less than the content of the compound represented by Chemical Formula 2, it is difficult to exhibit the desired thermal bonding characteristics, and it is necessary to perform bonding at a high temperature, so the application of the developed product will be limited. Also, due to the appearance of excessive shrinkage characteristics, it may be difficult to process the product into a developed product. In addition, there may be a problem that it is difficult to use for a desired use.

On the other hand, the diol component may further include another diol component other than the compound represented by Chemical Formula 1, the compound represented by Chemical Formula 2, and ethylene glycol.

The another diol component may be a well-known diol component used in the preparation of polyester, which is not particularly limited in the present invention, and as a non-limiting example thereof, there may be exemplified those having 2 to 14 carbon atoms The aliphatic diol component, specifically, may be selected from 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, propylene glycol, trimethyl glycol, tetramethylene Diol, pentamethyldiol, hexamethylene glycol, heptamethylene glycol, octamethylene glycol, non-methylene glycol, deca-methylene glycol, undemethylene glycol , More than one of the group consisting of dodecamethylene glycol and tridecanediol. However, in order to have both the desired level of thermal adhesion characteristics and heat resistance, preferably, the another diol component is not further included, and in particular, diethylene glycol may not actually be included in the diol component. When diethylene glycol is included in the diol component, the glass transition temperature rapidly decreases, so that even if the compound represented by Chemical Formula 2 is included, the desired level of heat resistance may not be achieved. At this time, the fact that diethylene glycol is not actually included in the diol component means that diethylene glycol was not intentionally added when preparing the copolyester, but this does not mean that it is not included in the esterification reaction of the acid component and the diol component And diethylene glycol naturally occurring in the polycondensation reaction. On the other hand, according to an embodiment of the present invention, the content of naturally occurring diethylene glycol included in the polyester composition may be less than 3% by weight relative to the entire composition. If the content of naturally occurring diethylene glycol exceeds an appropriate level, the package pressure is increased during spinning into fibers and frequent yarn breakage is caused, so that the spinnability is significantly reduced.

The acid component and the diol component can be made into a copolyester through an esterification reaction and polycondensation under well-known synthesis conditions in the field of polyester synthesis. At this time, the acid component and the diol component may be input at a molar ratio of 1:1.1 to 2.0 to generate a reaction, but the present invention is not limited to this.

On the other hand, the acid component and the diol component may be mixed at a suitable molar ratio as described above, and then subjected to an esterification reaction and condensation to make a copolyester, or may be added in the acid component and the diol component. In the esterification reaction between the diol and the compound represented by Chemical Formula 1, the compound represented by Chemical Formula 2 is introduced and subjected to esterification reaction and condensation to produce a copolyester, which is not particularly limited in the present invention.

In the esterification reaction, a catalyst may also be included. As the catalyst, a catalyst generally used when preparing polyester can be used, and as a non-limiting example thereof, it can be prepared under a metal acetate catalyst.

And, preferably, the esterification reaction is performed at a temperature of 200 to 270°C and a pressure of 1100 to 1350 Torr. If the above conditions are not satisfied, the esterification reaction time is prolonged or the reactivity is reduced, so that an esterified compound suitable for polycondensation reaction may not be formed.

In addition, the polycondensation reaction can be carried out at a temperature of 250 to 300°C and a pressure of 0.3 to 1.0 Torr. If the conditions are not met, there may be a delay in the reaction time, a reduction in the degree of polymerization, and pyrolysis, etc. The problem.

At this time, in the polycondensation reaction, a catalyst may also be included. The catalyst may use antimony compounds in order to ensure sufficient reactivity and reduce production costs, or phosphorus compounds or the like may also be used to prevent discoloration due to pyrolysis at high temperatures.

As the antimony compound, antimony oxides such as antimony trioxide, antimony tetraoxide, antimony pentoxide, etc., antimony halides such as antimony trisulfide, antimony trifluoride, antimony trichloride, antimony triacetate, Antimony benzoate, antimony tristearate, etc.

Preferably, the amount of the antimony compound used as the catalyst is 100 to 600 ppm based on the total weight of the polymer obtained after polymerization.

As the phosphorus compound, phosphoric acids such as phosphoric acid, monomethyl phosphoric acid, trimethyl phosphoric acid, tributyl phosphoric acid and derivatives thereof are preferably used, among which, in particular, trimethyl phosphoric acid, triethyl phosphoric acid or triphenyl phosphoric acid Phosphoric acid is preferred because of its excellent effect, and the use amount of the phosphorus compound is preferably 100 to 500 ppm based on the total weight of the polymer obtained after polymerization.

The polyester composition according to the present invention prepared by the method may have an intrinsic viscosity of 0.5 to 0.8 dl/g. If the intrinsic viscosity is less than 0.5 dl/g, problems may occur when forming a cross section, and if the intrinsic viscosity is greater than 0.8 dl/g, there may be problems in spinnability due to the high package pressure.

Moreover, the polyester composition has no melting point, and may have thermal characteristics such as softening behavior. Preferably, the softening point may be 90 to 110°C, which may be beneficial to achieve the purpose of the present invention.

Moreover, the glass transition temperature of the polyester composition may be 60 to 75°C.

If the glass transition temperature is less than 60°C, the polyester chips, fibers or articles realized by the polyester composition will also change greatly over time under the temperature conditions exceeding 40°C such as summer, and the chips or fibers There is adhesion between them, so the storage stability will be significantly reduced. Also, when bonding occurs between chips, it may cause spinning defects. Furthermore, after being realized as a fiber or the like, the shrinkage characteristics are excessively exhibited, and the adhesion characteristics are reduced. In addition, there may be a problem that the time required for the process may be prolonged or the related process may not be smoothly performed due to the limitation of the required heat treatment such as the drying process after forming the chip and the post-processing process after spinning into fiber.

Moreover, if the glass transition temperature is greater than 75°C, the thermal bonding characteristics will be significantly reduced, and the execution temperature of the bonding process is limited to high temperatures, so it may be limited in developing applications.

The polyester composition according to an embodiment of the present invention can be realized as a polyester chip. The manufacturing method of the polyester chips and the specifications of the chips may be based on well-known manufacturing methods and specifications in the technical field, and thus detailed descriptions thereof will be omitted in the present invention.

Also, as shown in FIG. 1, the present invention realizes a heat-bonded composite fiber including a core portion 21 including a polyester-based component, and surrounding the core portion 21 and including The sheath portion 20 of the fiber-bonded polyester composition.

The polyester component forming the core portion may be a known polyester having higher heat resistance and mechanical strength than the sheath portion, and as an example, may be polyethylene terephthalate or polybutylene terephthalate. Glycol esters, polytrimethylene terephthalate, etc., but the invention is not limited thereto.

As an example, the core portion and the sheath portion may be compositely spun at a weight ratio of 8:2 to 2:8, but the present invention is not limited thereto, and the ratio may be appropriately adjusted according to the purpose to perform spinning.

The spinning conditions of the composite fiber, the spinning device, and the steps of cooling and drawing the composite fiber after spinning can be performed by well-known conditions, devices, and processes in the technical field, or can be known by appropriately modifying The conditions, devices, and procedures are executed. Therefore, there is no particular limitation on this in the present invention.

As an example, the composite fiber may be spun at a spinning temperature of 270 to 290°C, or may be drawn 2.5 to 4.0 times after spinning. Moreover, the fineness of the composite fiber may be 1 to 15 deniers, and the fiber length may be, for example, 1 to 100 mm.

On the other hand, the present invention includes a non-woven fabric realized by including thermally bonded composite fibers.

The non-woven fabric may be realized by including thermally bonded composite fibers alone or by including the thermally bonded composite fibers and polyester fibers. Specifically, the heat-bonded composite fiber and polyester-based fiber may be short fibers. Each short fiber can be made into non-woven fabric by heat treatment after blending and opening.

According to an embodiment of the present invention, the heat-bonded composite fiber and the polyester-based fiber may be mixed at a ratio of 3:7 to 1:9, but the present invention is not limited to this, and can be appropriately changed in consideration of usage and the like.

Moreover, the heat treatment temperature may be 100-180°C, more preferably 120-180°C, and thus, further improved adhesion characteristics may be exhibited.

Furthermore, as an example, the porous structure may be configured to be selected from the group consisting of automobile mattresses, interior materials for buildings, bedding materials, heat insulation materials for clothing, and heat insulation materials for agriculture One of them, but the invention is not limited to this.

The present invention will be described more specifically with reference to the following examples. However, the following examples should not be construed as limiting the scope of the present invention, but should be interpreted as helping to understand the present invention.

<Example 1>

A compound represented by the following chemical formula 1 of 38 mole percent as a diol component and a compound represented by the following chemical formula 3 of 3 mole percent, ethylene glycol of 59 mole percent as a remaining diol component and as 100 mole percent terephthalic acid of the acid component, the acid component and the diol component are subjected to an esterification reaction at a ratio of 1:1.5 at 250° C. and a pressure of 1140 Torr to obtain an ester reaction product. The reaction rate was 97.5%. The ester reaction product formed was transferred to a polycondensation reactor, and 300 ppm of antimony trioxide as a polycondensation catalyst and 150 ppm of phosphoric acid as a thermal stabilizer were gradually reduced to make the final pressure 0.5 Torr. At the same time, the temperature was raised To 285° C. to perform a polycondensation reaction to obtain a polyester composition for thermally bonded fibers including a copolyester, which is then made into a width of 2 mm, a length of 4 mm, and a height of 3 mm by a conventional method Polyester slices.

Then, in order to manufacture a core-sheath type composite fiber including the polyester composition as a sheath portion and polyethylene terephthalate (PET) having an intrinsic viscosity of 0.65 dl/g as a core portion, the polyester The polyester chips and PET chips realized by the composition are separately put into a hopper, then melted, and put into a core-sheath type spinning nozzle, respectively, and then spun at a spinning speed of 1000 mpm at 275°C so that the core and The sheath portion had a weight ratio of 5:5 and was stretched 3.0 times to produce a core-sheath type thermally bonded composite fiber having a fiber length of 51 mm and a fineness of 4.0 de as shown in Table 1 below.

[Chemical Formula 1]

[Chemical Formula 2]

<Examples 2 to 14>

Except that the composition ratio of the monomer used for preparing the copolyester was changed as shown in Table 1, Table 2 or Table 3 below, the rest were manufactured in the same manner as in Example 1 as shown in Table 1, Table 2 or Table 3 below Polyester chips and core-sheath composite fibers using them.

<Comparative Examples 1 to 4>

Except that the composition ratio of the monomer used for preparing the copolyester was changed as shown in Table 2 below, the polyester chips shown in Table 2 below and core-sheath type composite fibers using the same were produced in the same manner as in Example 1. .

<Experimental example>

The following physical properties of polyester chips or core-sheath type thermally bonded composite fibers manufactured according to Examples and Comparative Examples were evaluated, and the results are shown in Tables 1 to 3 below.

1. Intrinsic viscosity

Using o-chlorophenol (Ortho-Chloro Phenol) as a solvent, the polyester chips were melted at a concentration of 2.0g/25ml at 110°C for 30 minutes, and then incubated at 25°C for 30 minutes, and an automatic viscosity connected to a CANON viscometer was used The measuring device analyzes.

2. Glass transition temperature and melting point

The glass transition temperature and melting point were measured using a differential calorimeter. As analysis conditions, the temperature increase rate is 20°C/min.

3. Drying time of polyester chips

After chipping the prepared polyester composition, the moisture content was measured every 4 hours at 55° C. in a vacuum dryer. As a result of the measurement, the moisture content was 100 ppm or less, and this time was expressed as dry time.

4. Short fiber storage stability

In a chamber at a temperature of 40° C. and a relative humidity of 45%, a pressure of 2 kgf/cm ² was applied to 500 g of the manufactured core-sheath composite fiber, and it was allowed to stand for 3 days, and the fusion between the fibers was visually observed by 10 experts As a result, as a result, based on the case where no fusion occurs at 10 points and the case where all fibers are fused at 0 points, the evaluation is 0 to 10 points, and then the average value is calculated. As a result, the case where the average value is 9.0 or more is indicated as excellent (◎), the case where the average value is 7.0 or more and less than 9.0 is indicated as excellent (○), and the average value is 5.0 or more and The case of less than 7.0 is indicated as normal (△), and the case of an average value of less than 5.0 is indicated as difference (×).

5. Spinning operability

As for spinning maneuverability, for the core-sheath type composite fibers spun at the same content according to the respective Examples and Comparative Examples, the drip sensor was used to calculate the drip during spinning (this means that some fibers passing through the nozzle Filament fusion or agglomerates formed by the irregular fusion of fiber filaments after fiber breakage), the value of the drop occurrence in Example 1 is used as a 100% benchmark, and the relative percentage is expressed in the remaining examples and comparative examples The number of drops that occurred.

6. Evaluation of dyeing rate

A dyeing solution containing a blue dye of 2 weight percent based on the weight of the core-sheath composite fiber at a bath ratio of 1:50 at 90°C for 60 minutes using a color measurement system of Kurabo Industries, Ltd. The spectral reflectance of the dyed composite fiber in the visible region (360 to 740 nm at intervals of 10 nm) was measured, and then the total K/S value as an index of the amount of dyeing based on the CIE 1976 standard was calculated to evaluate the color yield of the dye.

7. Adhesive strength

The manufactured core-sheath composite fiber and polyethylene terephthalate (PET) short fiber (fiber length 51mm, fineness 4.0de) were mixed and opened at a ratio of 5:5, and then at 120 Heat treatment under temperature conditions of ℃, 140°C and 160°C to achieve a hot-melt nonwoven fabric with a basis weight of 35g/m ² and a sample with a width of 100mm, a length of 20mm and a thickness of 10mm, based on KS M The ISO 36 method uses a universal testing machine (UTM) to determine the bond strength.

On the other hand, when the shape is deformed due to excessive shrinkage during heat treatment, it is evaluated as "shape deformation", and the bonding strength is not evaluated.

8. Soft touch

In order to evaluate the bonding strength, a group of 10 peer experts conducted a functional check on a nonwoven fabric manufactured by heat treatment at a temperature of 140°C. As an evaluation result, 8 or more experts judged the soft The situation is divided into excellent (◎), the case where 6-7 experts judge softness is good (○), the case where 4-5 experts judge softness is normal (△), and the case where less than 4 experts judge softness The situation is divided into poor (×).

Table 1

Table 2

table 3

As can be seen from Tables 1 to 3, in the case of the comparative example, it can be confirmed that the drying time is significantly extended (Comparative Examples 1 to 3), the spinning workability is significantly poor (Comparative Example 2, Comparative Example 3), and the storage stability of the short fiber It becomes very poor (Comparative Example 2, Comparative Example 3), shape deformation occurs in the evaluation of the adhesive strength at each temperature (Comparative Example 4), so it can be confirmed that all physical properties cannot be satisfied at the same time, but it can be confirmed that all examples The physical properties have reached an excellent level.

On the other hand, it can be confirmed that even in the Examples, Example 15 in which the content of the compound represented by Chemical Formula 2 is greater than the content of the compound represented by Chemical Formula 1 is evaluated for the bonding strength at each temperature compared to other Examples The shape deformation occurs in the medium, so it is not suitable to achieve the required physical properties.

As described above, an embodiment of the present invention is described, but the protection of the present invention is not limited to the embodiment of the present invention. Those skilled in the art can add, modify, delete, add, etc. to the constituent elements within the same protection scope. Other embodiments are easily proposed, and these also fall within the protection scope of the present invention.

20‧‧‧Sheath 21‧‧‧Core

The described and/or other aspects and features of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

FIG. 1 is a cross-sectional view of a composite fiber according to an embodiment of the present invention.

20‧‧‧Sheath

21‧‧‧Core

Claims (13)

A polyester composition for thermally bonding fibers, comprising: an acid component containing terephthalic acid and a glycol containing ethylene glycol, a compound represented by Chemical Formula 1, and a compound represented by Chemical Formula 2 Copolyesters of polycondensation of esterified compounds resulting from the reaction of components, [Chemical Formula 1]

[Chemical Formula 2]

. The polyester composition for thermally bonding fibers as described in item 1 of the patent application range is characterized in that the glycol component does not actually include glycol. The polyester composition for thermal bonding fibers as described in item 1 of the patent application range, wherein the compound represented by Chemical Formula 1 and the compound represented by Chemical Formula 2 in the diol component The total content is 30 to 45 mole percent. The polyester composition for thermally bonding fibers as described in item 1 of the patent application range, wherein the acid component further includes isophthalic acid in a percentage of 1 to 10 moles based on the acid component. The polyester composition for thermal bonding fibers as described in item 1 of the patent application range, characterized in that, in the diol component, the content of the compound represented by Chemical Formula 1 is greater than that represented by Chemical Formula 2 Content of compounds. The polyester composition for thermal bonding fibers as described in item 1 of the patent application range, characterized in that, in the diol component, the content of the compound represented by Chemical Formula 1 is 20 to 40 mole percent The content of the compound represented by Chemical Formula 2 is 1 to 10 mole percent. The polyester composition for thermal bonding fibers as described in item 1 of the patent application range is characterized in that it has no melting point, exhibits softening behavior, and has a glass transition temperature of 60 to 75°C. The polyester composition for thermal bonding fibers as described in item 6 of the patent application range, characterized in that, in the diol component, the content of the compound represented by Chemical Formula 1 is 30 to 40 mole percent The content of the compound represented by Chemical Formula 2 is 1 to 6 mole percent. The polyester composition for thermal bonding fibers as described in item 1 of the patent application range is characterized in that the inherent viscosity is 0.500 to 0.800 dl/g. A polyester chip characterized by comprising the polyester composition for thermally bonding fibers as described in any one of claims 1 to 9 of the patent application. A thermally bonded composite fiber, which is characterized by comprising: Core, containing polyester components; and The sheath part surrounds the core part and contains the polyester composition for thermally bonding fibers as described in any one of claims 1 to 9 of the patent application. A non-woven fabric characterized by comprising the heat-bonded composite fiber as described in item 11 of the patent application scope and formed into a predetermined shape. The non-woven fabric as described in item 12 of the patent application range, characterized in that the non-woven fabric is selected from the group consisting of automobile mattress materials, building interior materials, bedding materials, clothing insulation materials and agricultural insulation materials One of the groups formed.

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