KR102509121B1 - Thermal adhesive fiber, polyester chip for thermal adhesive fiber, fabric comprising the same - Google Patents

Abstract

The present invention relates to a heat-sealable fiber, and more particularly, to a heat-sealable fiber with improved thermal properties and spinnability, a polyester chip for heat-sealable fiber, and a fabric containing the same.

Description

Thermal adhesive fiber, polyester chip for thermal adhesive fiber, and fabric including the same {Thermal adhesive fiber, polyester chip for thermal adhesive fiber, fabric comprising the same}

The present invention relates to a heat-sealable fiber, and more particularly, to a heat-sealable fiber with improved thermal properties and spinnability, a polyester chip for heat-sealable fiber, and a fabric containing the same.

In general, synthetic fibers have a high melting point, so their uses are often limited. In particular, when it is used as an adhesive that is press-bonded by inserting it between tape-shaped fabrics or as a wick for bonding applications such as fibers, the textile fabric itself may be deteriorated by heating, and special equipment such as a high-frequency sewing machine must be used. Since there is a hassle to do, it is desired to easily bond by a simple ordinary heat press without using such special equipment.

Conventional low-melting polyester fibers have been widely used for the purpose of bonding heterogeneous fibers in fiber structures such as mattresses, interior and exterior materials for automobiles, or non-woven fabrics used in the manufacture of various non-woven fabrics for patting purposes.

For example, Korean Patent Registration No. 10-1216690 discloses a low-melting polyester fiber implemented by including isophthalic acid and diethylene glycol to improve adhesion.

However, the conventional low-melting polyester fiber as described above may have a certain level of spinnability and adhesiveness, but as the development progresses in the direction of having a low melting point or low glass transition temperature for the expression of binder properties, polyester implemented Due to poor heat resistance, significant changes over time occur even in storage conditions exceeding 40 ° C in summer, and polyester chips or bonds between fibers occur during storage, resulting in a significant decrease in storage stability.

Therefore, it is possible not only to maintain or improve the spinnability and adhesiveness of the conventional heat-sealable fiber, but also to minimize aging and improve storage stability at room temperature along with significantly improved dyeing properties, and furthermore, heat-sealable fiber. It is an urgent time to develop a heat-sealable fiber that can minimize the increase in processing cost when it is implemented into a fabric.

Korean Patent Registration No. 10-1216690

The present invention has been devised in view of the above points, and has excellent spinnability into fibers, exhibits excellent thermal adhesion and dyeing properties, and at the same time, improves fairness when implemented into a predetermined article using this, while reducing processing costs. It is an object of the present invention to provide a fabric realized by including heat-sealable fibers, polyester chips for heat-sealable fibers, and heat-sealable fibers that can be reduced, and furthermore, change over time at room temperature is minimized and storage stability is improved.

In order to solve the above-described problems, the present invention is a thermal process comprising a copolyester in which an esterified compound obtained by reacting an acid component including terephthalic acid and isophthalic acid and a diol component including ethylene glycol and isosorbide is polymerized and condensed. An adhesive fiber is provided.

According to one embodiment of the present invention, the copolyester may be amorphous.

According to another embodiment of the present invention, the copolyester may have a softening point of 100°C or higher and a glass transition temperature of 70°C or higher.

According to another embodiment of the present invention, the isophthalic acid is included in 15 to 35 mol% based on the acid component, and the isocarbide may be included in 5 to 15 mol% based on the diol component.

According to another embodiment of the present invention, the sum of the content (mol%) of isophthalic acid based on the acid component and the content (mol%) of isosorbide based on the diol component may be 20 to 50 mol% there is.

According to another embodiment of the present invention, the copolyester may further include 0.5 to 3.0% by weight based on the weight of the copolyester of polyethylene glycol having a weight average molecular weight of 1,000 to 10,000 polycondensed with the esterified compound. .

According to another embodiment of the present invention, the ratio of the content (mol%) of isophthalic acid based on the acid component and the content (mol%) of isocarbide based on the diol component is 1.5 to 4.0: 1 can be

According to another embodiment of the present invention, the copolyester may have an intrinsic viscosity (I.V) of 0.60 to 0.70 dl/g.

According to another embodiment of the present invention, the heat-sealable fiber may be a sheath-core type composite fiber including the copolyester in a sheath part.

In addition, the present invention is a master for heat-sealable fibers comprising a copolyester in which an acid component including terephthalic acid and isophthalic acid and a diol component including ethylene glycol and isocarbide are reacted and an esterified compound is polycondensed. Batch chips are provided.

In addition, the present invention provides a fabric comprising the heat-sealable fiber according to the present invention.

According to one embodiment of the present invention, the fabric may be for any one purpose selected from the group consisting of a member for automobiles, a member for building, a member for bedding, a member for sanitary materials, a member for clothing, and a member for agriculture.

According to the present invention, it is possible to reduce processing costs while improving processability when being implemented into a predetermined article using this, while exhibiting excellent spinnability to fibers and excellent thermal adhesiveness. In addition, change over time at room temperature is minimized, and storage stability can be improved. Furthermore, when manufacturing the polyester composition into chips, the drying time can be remarkably reduced, thereby significantly shortening the manufacturing time. In addition, the product realized using this also minimizes change over time even under storage conditions such as summer (eg, 40 ° C or higher), and has excellent storage stability, so that deformation of the initial shape of the product or deformation during use can be prevented.

1 is a cross-sectional view of a heat-sealable fiber according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. This invention may be embodied in many different forms and is not limited to the embodiments set forth herein.

The heat-sealable fiber according to the present invention is implemented by including a copolyester in which an esterified compound obtained by reacting an acid component including terephthalic acid and isophthalic acid and a diol component including ethylene glycol and isocarbide is polymerized and condensed. .

First, the acid component includes terephthalic acid and isophthalic acid, and may further include other aromatic polyvalent carboxylic acids having 6 to 14 carbon atoms or aliphatic polyvalent carboxylic acids having 2 to 14 carbon atoms and/or metal salts of sulfonic acids. there is.

At this time, the aliphatic polyhydric carboxylic acids having 2 to 14 carbon atoms may be used without limitation as well-known acid components used for the production of polyester, but non-limiting examples thereof include oxalic acid, malonic acid, succinic acid, and glutaric acid. acid, adipic acid, suberic acid, citric acid, pimmeric acid, azelaic acid, sebacic acid, nonanoic acid, decanoic acid, dodecanoic acid, and hexanodecanoic acid.

In addition, the sulfonic acid metal salt may be sodium 3,5-dicarbomethoxybenzene sulfonate.

On the other hand, as the acid component, other acidic components that may be included other than terephthalic acid and isophthalic acid may lower the thermal characteristics such as the glass transition temperature or softening point of the copolyester, and thus may not be preferably included. According to an example, the acid component may consist of terephthalic acid and isophthalic acid.

The isophthalic acid is a monomer that lowers the crystallinity of the copolyester and lowers the glass transition temperature and melting point/softening point, and is preferably used in an amount of 10 to 37 mol% based on the total number of moles of the acid component, more preferably 10 to 37 mol%. Preferably it may be included in 15 to 35 mol%, more preferably 20 to 33 mol%. If isophthalic acid is included in an amount of less than 10 mol%, the copolyester may be crystalline, or the crystalline portion may increase, and the melting point/softening point may increase, resulting in an increase in processing temperature and an increase in processing cost when implemented into an article. can In addition, there is a possibility that the adhesive properties may be deteriorated. In addition, if isophthalic acid exceeds 37 mol%, it may not be easy to increase the polymerization degree due to the low reactivity of isophthalic acid, and the glass transition temperature and softening point are excessively lowered due to the excessive isophthalic acid content, resulting in a decrease in thermal properties. It may be difficult to achieve the object of the present invention, such as being.

Next, the diol component includes ethylene glycol and isocarbide. The isocarbide increases the glass transition temperature while maintaining the softening point of the copolyester designed to a predetermined value through isophthalic acid, thereby facilitating the processability of heat-sealed fibers into articles, and has improved thermal characteristics such as storage stability and aging by heat. It is a monomer that prevents change. In addition, as isocarbide is used together with the above-mentioned isophthalic acid, it expresses appropriate shrinkage characteristics for heat-sealable fibers, and due to the expression of these characteristics, it can express more elevated heat-sealing properties by further increasing point adhesive force during thermal bonding. can

The isosorbide may be included in preferably 5 to 15 mol%, more preferably 5 to 12 mol%, based on the total number of moles of the diol component in the diol component. If isocarbide is contained in less than 5 mol%, it is difficult to increase the glass transition temperature to a desired level, and thus the improvement in thermal properties may be insignificant. In addition, if isocarbide is contained in excess of 15 mol%, it may not be easy to increase the degree of polymerization due to the low reactivity of isocarbide, and there is a risk of cost increase due to an increase in the amount of monomer used.

The diol component may further include other types of diol components in addition to the aforementioned isocarbide and ethylene glycol. The other type of diol component may be a known diol component used in the manufacture of polyester, so the present invention is not particularly limited thereto, but as a non-limiting example thereof, it may be an aliphatic diol component having 2 to 14 carbon atoms, , Specifically, 1,3-propanediol, 2-methyl-1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, propylene glycol, trimethylglycol, tetramethylene glycol, pentachloride It may be at least one selected from the group consisting of methyl glycol, hexamethylene glycol, heptamethylene glycol, octamethylene glycol, nonamethylene glycol, decamethylene glycol, undecamethylene glycol, dodecamethylene glycol, and tridecamethylene glycol. However, in order to prevent a decrease in the glass transition temperature that may occur due to the added diol component while expressing the desired level of thermal bonding characteristics, it is preferable not to further include the other type of diol component, in particular, diethylene glycol It is preferable that silver is not included in the diol component. If diethylene glycol is included in the diol component, it may cause a rapid decrease in glass transition temperature, and thus heat resistance at a desired level may not be achieved even when isosorbide is included. At this time, the meaning that diethylene glycol is not included in the diol component means that diethylene glycol is not added as a raw material when preparing the copolyester, and in the esterification reaction and polycondensation reaction of the acid component and the diol component This does not mean that naturally occurring diethylene glycol is not included. Meanwhile, according to one embodiment of the present invention, the content of naturally occurring diethylene glycol included in the heat-sealable fiber together with the copolyester may be less than 3% by weight based on the weight of the copolyester. If the content of naturally occurring diethylene glycol exceeds an appropriate level, there is a problem in that the pack pressure is increased during spinning into fibers and the spinnability may be significantly reduced by causing frequent trimming.

According to one embodiment of the present invention, the sum of the content (mol%) of isophthalic acid based on the acid component and the content (mol%) of isocarbide based on the diol component is 20 to 50 mol%, more preferably It may be 25 to 50 mol%, more preferably 30 to 45 mol%, and even more preferably 35 to 45 mol%, through which the production reaction of the esterified compound or the polycondensation reaction is smoothly induced It is possible to prepare a copolyester having a desired degree of polymerization, and it is advantageous to realize an amorphous copolyester, and to have a high glass transition temperature while having an appropriate level of softening point to improve thermal bonding properties, It may be more advantageous to achieve the object of the present invention, such as minimizing or preventing change over time and improving storage stability. If the total amount of isophthalic acid and isocarbide is less than 20 mol%, the softening point is increased, and thermal bonding properties cannot be implemented at a specific temperature, which may cause a problem of thermal processing at a high temperature. In addition, crystalline copolyester may be formed, and the melting point/softening point is less reduced compared to PET, so that it is difficult to use as a heat-sealable fiber or there is a concern that the processing temperature must be increased during use. In addition, there is a concern that the adhesive properties are also reduced after thermal bonding. In addition, if the total amount of isophthalic acid and isocarbide exceeds 50 mol%, the reduction in softening point and glass transition temperature is excessive, so that thermally adhesive fibers having very poor thermal properties can be implemented. Alternatively, a copolyester having a melting point and a high melting point may be embodied, which may limit the use of the heat-sealable fiber or increase the processing temperature, resulting in an increase in processing cost.

More preferably, the content of isophthalic acid based on the acid component (mol%) is the content of isocarbide based on the diol component (mol%) It may be 1.5 times or more, more preferably 4.0 times or less, and as another example, 3.2 times or less, which is advantageous to have an improved glass transition temperature while having an appropriate softening point, and an advantage in improving thermal properties. there is If the mole% of isophthalic acid based on the mole% of isosorbide is less than 1.5 times, it may be difficult to obtain an amorphous copolyester, and a copolyester having a reduced melting point or softening point compared to PET may be obtained, The adhesive strength of the heat-sealed fiber realized through this may also be lowered. In addition, there may be a problem in that the heat sealing temperature needs to be raised. In addition, when the mole% of isophthalic acid based on the mole% of isosorbide exceeds 4.0 times, an excessive softening point and/or a drop in glass transition temperature may be caused to obtain a copolyester having poor thermal properties, Since it is difficult to maintain the shape after bonding, it may not be easy to realize the shape of the product. In addition, there may be a problem in raising the polymer polymerization degree.

In addition, the copolyester may further include polyethylene glycol poly-condensed with the esterified compound, and through this, it may contribute to improving dyeability, adhesive strength, and spinning workability of the heat-sealable fiber. In particular, when the acid component and the diol component are modified with isophthalic acid and isosorbide, spinning workability is lowered and it may be difficult to manufacture in a fibrous form. . In this case, the polyethylene glycol may be included in an amount of 0.5 to 3.0% by weight, more preferably 1 to 1.5% by weight based on the weight of the copolyester. If it is included in more than 3.0% by weight, the improvement in dyeability and adhesive strength may be insignificant, and there is a risk of increasing the cost of heat-sealable fibers and reducing thermal properties.

In addition, the polyethylene glycol may have a weight average molecular weight of 1000 to 10,000, and if the weight average molecular weight is less than 1000, the intended effect may be insignificant through polyethylene glycol, and if the weight average molecular weight exceeds 10,000 In this case, the improvement in dyeability and adhesive strength may be insignificant, and there is a risk of increasing the cost of heat-sealable fibers.

The above-described copolyester may be prepared through esterification and polymerization/condensation of an acid component and a diol component using known synthesis conditions in the field of polyester synthesis. At this time, the acid component and the diol component may be added to react at a molar ratio of 1: 1.1 to 2.0, but is not limited thereto.

A catalyst may be further included in the esterification reaction. As the catalyst, a catalyst typically used in polyester production may be used, and as a non-limiting example thereof, it may be prepared under a metal acetate catalyst.

In addition, the esterification reaction may be preferably carried out at a temperature of 200 ~ 270 ℃ and a pressure of 1100 ~ 1350 Torr (Torr). If the above conditions are not satisfied, there may be problems in that an esterification compound suitable for a polycondensation reaction cannot be formed due to an increase in esterification reaction time or a decrease in reactivity.

In addition, the polycondensation reaction may be performed at a temperature of 250 to 300 ° C and a pressure of 0.3 to 1.0 Torr, and if the above conditions are not satisfied, there may be problems such as delay in reaction time, decrease in polymerization degree, induction of thermal decomposition, etc. .

In this case, a catalyst may be further included during the polycondensation reaction. The catalyst may use an antimony compound to secure appropriate reactivity and lower production cost, or a phosphorus compound to prevent discoloration through thermal decomposition at high temperatures.

Examples of the antimony compound include antimony oxides such as antimony trioxide, antimony tetraoxide, and antimony pentoxide, antimony halogenated compounds such as antimony trisulfide, antimony trifluoride, and antimony trichloride, antimony triacetate, antimony benzoate, antimony tristearate, and the like. can be used

The amount of antimony compound used as the catalyst is preferably 100 to 600 ppm based on the total weight of the polymer obtained after polymerization.

As the phosphorus compound, it is preferable to use phosphoric acids such as phosphoric acid, monomethyl phosphate, trimethyl phosphate, tributyl phosphate, and the like, and derivatives thereof. The amount of the phosphorus compound used is preferably 100 to 500 ppm based on the total weight of the polymer obtained after polymerization.

The copolyester prepared through the above method may have an intrinsic viscosity of 0.6 to 0.7 dL/g, more preferably 0.65 to 0.70 dL. If the intrinsic viscosity is less than 0.6 dl/g, spinnability may be lowered, and there may be a concern that the cross-section of the fiber may not be smoothly formed. There is a risk that this may deteriorate.

In addition, the copolyester may be amorphous, have no melting point, and may have thermal properties showing softening behavior, preferably having a softening point of 100° C. or higher and a glass transition temperature of 70° C. or higher, more preferably may have a softening point of 100 to 115 ° C and a glass transition temperature of 70 to 82 ° C, and through this, it may be more advantageous to express excellent adhesive strength and shape stability even for articles requiring heat resistance. If the glass transition temperature is less than 70 ° C, the polyester masterbatch chips, fibers, or articles implemented through the copolyester exhibit large changes over time even in the temperature condition exceeding 40 ° C, such as in summer, and chips or Bonding between fibers may occur and storage stability may be significantly deteriorated. In addition, when coupling between chips occurs, there is a risk of causing radiation failure. Furthermore, after being implemented into fibers, etc., shrinkage characteristics are excessively expressed, and there is a concern that bonding characteristics may deteriorate. In addition, due to the limitations of the heat treatment required for the drying process after chip formation and the post-processing process after spinning into fibers, there may be a problem in that the process time is prolonged or the process cannot be performed smoothly.

In addition, if the glass transition temperature exceeds 82 ° C, the softening point may also increase, which may cause a significant decrease in thermal bonding properties, making it difficult to realize amorphous copolyester, and increasing the temperature of the bonding process. As it is limited to high temperatures, there is a concern that there may be restrictions on application development.

The above-described copolyester alone constitutes a heat-sealable fiber, or as shown in FIG. 1, it is provided in the sheath part 20 surrounding the core part 21 to realize a sheath-core type heat-sealable fiber. can

In the case of a sheath-core type heat-sealable fiber, the core part 21 may include a known fiber-forming component in the textile field, and non-limiting examples thereof include polyethylene terephthalate, polybutylene terephthalate, poly It can be polyester, such as propylene terephthalate, or polyamide, such as nylon 6 and nylon 66.

In addition, the core part 21 and the sheath part 20 may be composite spun at a weight ratio of 8: 2 to 2: 8, for example, but are not limited thereto. there is. Conditions for spinning the composite fibers, detailed configuration of the spinning device, and processes such as cooling and stretching of the composite fibers after spinning can be performed through conditions, devices and processes known in the art or by appropriately modifying them, so that the present invention The invention is not particularly limited in this regard. For example, the composite fiber may be spun at a spinning temperature of 270 to 290 ° C, and may be stretched 2.5 to 4.0 times after spinning. In addition, the fineness of the composite fiber is 1 to 15 denier, and the fiber length may be 1 to 100 mm, for example.

On the other hand, in the above-described copolyester, the polycondensed copolyester can be directly put into a spinneret to realize heat-sealable fibers, but the copolyester can be realized as a masterbatch chip, and the masterbatch chip can be heat-sealed. In the manufacture of a flexible fiber, it may be put into a hopper, melted, and put into a spinneret to realize a heat-sealable fiber. At this time, the method of manufacturing the master batch chip and the specification of the chip may follow known manufacturing methods and specifications in the art, so a detailed description thereof is omitted in the present invention.

In addition, the present invention includes a fabric implemented by including the heat-sealable fiber described above. The fabric may be woven, knitted or non-woven. At this time, the fabric may be composed of only heat-sealable fibers or together with heterogeneous fibers. A method of manufacturing a woven, knitted, or nonwoven fabric may employ conventional equipment and conditions in the art, so a detailed description thereof is omitted in the present invention.

In addition, the fabric may be used for any one selected from the group consisting of a member for automobiles, a member for building, a member for bedding, a member for sanitary materials, a member for clothing, and a member for agriculture. The automobile member may be an automobile interior or exterior material, for example, a door trim, an iso pad, an under cover, a back seat, a floor carpet, or the like. In addition, the building member may be an interior member such as an insulator, an interior finishing material, wallpaper, or blinds. In addition, the sanitary agent member may be a diaper, a sanitary napkin, or the like. Further, the agricultural member may be a heat insulating material or the like.

Although the present invention will be described in more detail through the following examples, the following examples are not intended to limit the scope of the present invention, which should be interpreted to aid understanding of the present invention.

<Example 1>

Based on the acid component, 80 mol% of terephthalic acid and 20 mol% of isophthalic acid were added, and 5 mol% of isocarbide and 95 mol% of ethylene glycol were added based on the diol component, but the acid component and the diol component were added in a ratio of 1: 1.5 The esterification reaction was carried out at 250 ° C. at a ratio of 1.5 kg / cm 2 G pressure. Thereafter, the ester reactant is transferred to a polycondensation reactor, 300 ppm of antimony trioxide and 150 ppm of an antioxidant are added as a polycondensation catalyst, and the polycondensation reaction is performed by raising the temperature to 265 to 270 ° C while slowly reducing the pressure to a final pressure of 0.5 torr. The copolyester thus obtained was manufactured into polyester chips having width, length, and height of 2 mm × 4 mm × 3 mm, respectively, by a conventional method.

Thereafter, the polyethylene tetraphthalate (PET) chip having an intrinsic viscosity of 0.65 dl/g and the prepared polyester chip were put into a hopper and melted, and then transported to a sheath-core type spinneret to form PET at a spinning speed of 1000 mpm at 275 ° C. Sheath-core type heat-sealable fiber as shown in Table 1 below having a fiber length of 51 mm and a fineness of 4.0 de after conjugate spinning so that the phosphorus core portion and the copolyester sheath portion have a weight ratio of 5: 5, and stretched 3.0 times. was manufactured.

<Examples 2 to 11>

It was prepared in the same manner as in Example 1, but the composition and composition ratio of the monomers for preparing the copolyester were changed as shown in Table 1 below to prepare masterbatch chips and heat-sealable fibers using the same as shown in Table 1 below.

<Comparative Examples 1 to 2>

It was prepared in the same manner as in Example 1, but the composition and composition ratio of the monomers for preparing the copolyester were changed as shown in Table 1 below to prepare masterbatch chips and heat-sealable fibers using the same as shown in Table 1 below.

<Experimental example>

The following physical properties were evaluated for the polyester chips or heat-sealable fibers prepared according to Examples and Comparative Examples, and the results are shown in Table 1 below.

1. Intrinsic viscosity

For the masterbatch chip, ortho-chlorophenol (Ortho-Chloro Phenol) as a solvent was melted at 110 ° C and a concentration of 2.0 g / 25 ml for 30 minutes, and then incubated at 25 ° C for 30 minutes. It was analyzed from a viscosity measuring device.

2. Glass transition temperature, softening point, melting point

The glass transition temperature, softening point, and melting point were measured using a differential calorimeter, and the temperature increase rate was 20°C/min as the analysis condition.

3. Chip drying time

After chipping the polyester, drying it in a vacuum dryer at different temperature conditions for 12 hours, setting the highest temperature among the temperatures that do not cause bonding between chips as the drying temperature, and drying to a moisture content of 100 ppm or less under the temperature conditions. The time allowed was measured and expressed as the drying time.

4. Short fiber storage stability

500g of the manufactured heat-sealable fiber was left for 3 days under a pressure of 2kgf/cm2 in a chamber with a temperature of 50℃ and a relative humidity of 45%, and 10 experts visually observed the fusion state between the fibers. As a result, fusion did not occur. The case was evaluated on a scale of 0 to 10, based on 10 points and 0 points for all cases where fusion occurred, and then the average value was calculated. As a result, when the average value was 9.0 or more, it was very good (◎), 7.0 or more and less than 9.0 was excellent (○), 5.0 or more and less than 7.0 was normal (Δ), and less than 5.0 was bad (X).

5. Radiation workability

Spinning workability occurs during spinning process for heat-sealable fibers spun at the same content for each example and comparative example (meaning a lump formed by partially fusion of fiber strands passing through the nozzle or irregular fusion of strands after trimming) The values were counted through a drip detector, and based on the drip generation value in Example 1 being 100, the number of drips generated in the other Examples and Comparative Examples was expressed as a relative percentage.

6. Adhesion strength

A hot-melt nonwoven fabric with a basis weight of 390 g/m2 by mixing and opening the manufactured heat-sealable fiber and polyethylene terephthalate (PET) short fibers (fiber length 51 mm, fineness 4.0 de) at a ratio of 5:5 and heat-treating at 140 ° C. was implemented, and the adhesive strength was measured using a universal testing machine (UTM) according to the KS M ISO 36 method by implementing a specimen having a width, length, and thickness of 300 mm × 300 mm × 10 mm, respectively.

In addition, after mixing and opening in the same way, the temperature condition was changed to 160 ° C to realize a hot melt nonwoven fabric of the same basis weight, and the adhesive strength was measured in the same way.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 copolyester Acid content (mol%) TPA 80 80 74 67 65 65 IPA 20 20 26 33 35 35 Diol component (mol%) ISB 5 10 10 12 10 15 EG 95 90 90 88 90 85 IPA+ISB (mol %) 25 30 36 45 45 50 IPA (mole %)/ISB (mole %) 4.00 2.00 2.60 2.75 3.50 2.33 Properties Tg (℃) 72 74 71 71 70 73 Tm (℃) - - - - - - Ts (℃) 115 112 104 101 100 102 I.V (dl/g) 0.67 0.68 0.65 0.66 0.63 0.63 Chip drying time (Hr) 36 28 30 30 34 28 storage stability ○ ○ ○ ○ △ ○ spinning workability ○ ○ ○ ○ ○ ○ 140℃ adhesive strength (N) 89 108 125 145 138 148 160℃ adhesive strength (N) 125 142 163 185 178 189

Example 7 Example 8 Example 9 Example
10 Example
11 Comparative Example 1 Comparative Example 2 copolyester acid component
(mole%) TPA 63 82 88 90 85 72 65 IPA 37 18 12 10 15 30 35 Diol component
(mole%) ISB 15 12 5 10 5 0 0 EG 85 88 95 90 95 100 100 IPA+ISB (mol%) 52 30 17 20 20 30 35 IPA (mole %)/ISB (mole %) 2.47 1.50 2.40 1.00 3.00 - - M.W 4000 PEG (% by weight) 0 0 0 0 0 1.3 1.3 Properties Tg (℃) 72 75 79 83 74 65 63 Tm (℃) - - 213 210 - - - Ts (℃) 102 104 117 117 114 175 165 I.V (dl/g) 0.63 0.65 0.66 0.67 0.67 0.66 0.65 Chip drying time (Hr) 36 28 20 16 34 48 52 storage stability × ○ ◎ ◎ ○ × × spinning workability △ ○ ◎ ◎ ○ △ △ 140℃ adhesive strength (N) 150 106 unadhesive unadhesive 30 112 127 160℃ adhesive strength (N) 195 138 29 35 51 143 158

As can be seen from Tables 1 and 2 above,

In the case of the heat-sealable fibers of Comparative Examples 1 and 2 having the copolyester not containing isocarbide, it can be seen that the adhesive performance is exhibited, but the storage stability is poor and the spinning workability is deteriorated.

In contrast, it can be seen that the storage stability of the examples having the copolyester containing isocarbide is improved. However, in the case of Example 7 in which the total amount of isophthalic acid and isocarbide significantly increased even when isocarbide was contained, it can be seen that the storage stability was greatly reduced and the spinning workability was also reduced.

Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments presented herein, and those skilled in the art who understand the spirit of the present invention may add elements within the scope of the same spirit. However, other embodiments can be easily proposed by means of changes, deletions, additions, etc., but these will also fall within the scope of the present invention.

Claims (13)

An acid component composed of aromatic polyhydric carboxylic acids including terephthalic acid and isophthalic acid, and a diol component including ethylene glycol and isosorbide but not diethylene glycol are reacted to form an esterified compound that is poly-condensed. ,
The sum of the content (mol%) of isophthalic acid based on the acid component and the content (mol%) of isocarbide based on the diol component is 30 to 50 mol%, and the amount of isophthalic acid based on the acid component The content (mol%) is a heat-sealable fiber containing more than 1.5 times the content (mol%) of isocarbide based on the diol component. According to claim 1,
The copolyester is a heat-sealable fiber, characterized in that amorphous. According to claim 1,
The copolyester has a softening point of 100 ° C. or higher and a glass transition temperature of 70 ° C. or higher. delete According to claim 1,
The copolyester further comprises 0.5 to 3.0% by weight of polyethylene glycol having a weight average molecular weight of 1000 to 10,000, based on the weight of the copolyester, which is polycondensed with the esterified compound. According to claim 1,
The isophthalic acid is contained in 15 to 35 mol% based on the acid component, and the isosorbide is a heat-sealable fiber, characterized in that contained in 5 to 15 mol% based on the diol component. delete delete According to claim 1,
The copolyester is a heat-sealable fiber, characterized in that the intrinsic viscosity (IV) is 0.60 ~ 0.70 dl / g. According to claim 1,
The heat-sealable fiber is a sheath-core type composite fiber comprising the copolyester in a sheath portion. An acid component composed of aromatic polyhydric carboxylic acids including terephthalic acid and isophthalic acid, and a diol component including ethylene glycol and isosorbide but not diethylene glycol are reacted to form an esterified compound that is poly-condensed. ,
The sum of the content (mol%) of isophthalic acid based on the acid component and the content (mol%) of isocarbide based on the diol component is 30 to 50 mol%, and the amount of isophthalic acid based on the acid component The content (mol%) is a polyester chip for heat-sealable fiber containing 1.5 times or more compared to the content (mol%) of isocarbide based on the diol component. A fabric comprising the heat-sealable fiber according to any one of claims 1 to 3, 5, 6, 9 and 10. According to claim 12,
The fabric is a fabric, characterized in that for any one purpose selected from the group consisting of members for automobiles, members for building, members for bedding, members for sanitary materials, members for clothing and agricultural members.

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