TW202000615A - Substrate positioning mechanism and substrate positioning method for substrate processing apparatus capable of automatically positioning a substrate in a short time without using a CCD camera - Google Patents

Abstract

This invention provides a novel positioning mechanism and positioning method capable of automatically positioning a substrate in a short time without using a CCD camera in a simple mechanism. This invention provides a substrate positioning mechanism for a substrate processing apparatus which sends the substrate W mounted on the substrate conveyance table 2 to the scribe part 1, and processes the scribe line for dividing on the substrate surface; the table 2 is configured to be tiltable through the rotation shaft 3 along the substrate conveyance direction; a plurality of stoppers 6 are formed on the upper surface of the table in the vicinity of the side surface 2a which is formed to be tilted lower side during the tilting of the table 2. The stoppers 6 and 6 are arranged at intervals on an imaginary line parallel to the rotation shaft 3 whereby the substrate W on the table is moved to the tilted lower side due to its own weight when the table 2 is tilted, and one side of the substrate W is abutted against the stopper 6.

Description

Substrate positioning mechanism and substrate positioning method of substrate processing device

The present invention relates to a positioning mechanism and a positioning method for positioning a substrate placed on a transfer table in an appropriate position in a substrate processing device for scribe processing for dividing a resin substrate or a brittle material substrate. In particular, the present invention relates to a substrate positioning mechanism and a substrate positioning method, which are suitable for performing scribing processing on or along a rectangular substrate (hereinafter referred to as a short strip substrate) arranged in a row corresponding to a unit substrate cut out Substrate processing device for wire breaking.

In general, when cutting out a unit substrate from a substrate to be processed, a scribing process for breaking the surface of the substrate with a cutting wheel or laser light, and then flexing the substrate from the scribing and breaking it . During the scribing process, in order to perform the scribing process correctly along the predetermined scribing line, it is necessary to position the substrate placed on the stage that becomes the processing stage at an appropriate processing position.

As this positioning method, an optical method using a CCD (Charge Couple Device) camera as shown in Patent Document 1 is generally widely implemented. According to this method, the alignment marks are pre-applied on two parts of the substrate to be processed, and the alignment marks are photographed by two CCD cameras provided above the processing device and the positions of the alignment marks are specified. Based on the position data of the specific alignment marks, the position deviation when the substrate is placed is detected and moved to an appropriate position on the stage, thereby making corrections.

In addition, as a simple positioning method, there is also a method of positioning the substrate by manually positioning one side of the substrate along the pin by providing a plurality of positioning pins on the stage. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-162395

[Problems to be solved by the invention]

However, in the optical method using a CCD camera, there are problems that so-called cameras or monitors, and electronic devices that analyze and process image data are expensive and it takes time to locate the substrate based on the image data. In addition, in the method of using the positioning pin, since the operator performs manual work, the operation is troublesome, and there is a concern that the substrate may collide with the positioning pin violently and damage the end surface of the substrate. In addition, in the case where the substrate is thin, there is a problem that the substrate cannot be accurately positioned due to bending of the substrate when the positioning pin is touched.

Therefore, in view of the above-mentioned problems, the present invention aims to provide a novel positioning mechanism and positioning method that can automatically perform substrate positioning in a short time without using a CCD camera. [Technical means to solve the problem]

In order to achieve the above object, the present invention adopts the following technical methods. That is, the present invention provides a substrate positioning mechanism, which is a substrate positioning mechanism of a substrate processing apparatus that feeds a substrate placed on a substrate transfer stage into a scribing portion and performs a scribing process for breaking on the surface of the substrate, It is configured that the stage is formed to be tiltable via a rotating shaft along the conveying direction, and when the stage is tilted, a plurality of stoppers are provided on the upper surface of the stage that becomes the inclined lower side, the above The plurality of stoppers are arranged on the imaginary line parallel to the rotation axis at an empty interval.

In addition, the present invention is also characterized by a substrate positioning method, which is a positioning method for positioning a substrate placed on a stage conveyed to a scribing portion to an appropriate position, which causes the above-mentioned stage to pass along the substrate conveying direction Rotate the shaft to tilt, and move the substrate on the stage to the inclined lower side by its own weight, and make one side of the substrate contact the stopper waiting on the inclined lower side, thereby positioning the substrate.

In the present invention, the table may be formed in a quadrangular shape in plan view, and one side thereof may be the inclined lower side. In addition, the above-mentioned substrate transfer stage may be formed by a floating stage that ejects compressed gas from a plurality of small holes formed on the surface thereof to float the substrate. [Effect of invention]

According to the present invention, it has the following effect: Only by tilting the stage that becomes the transfer stage, the substrate can be positioned automatically and quickly and the efficiency of the substrate processing operation can be improved, and because the mechanism for tilting is relatively simple, it can be provided at a low price. .

In the present invention, it is preferable to form the stopper so as to be movable in the substrate conveying direction. In this way, by adjusting the position where the stopper abuts to the part of the end material region that is cut off at the time of breaking, damage to the end surface of the unit substrate that becomes the product can be avoided.

In addition, in the present invention, a roller including an elastic material may form the stopper, and be formed such that the circumferential surface of the roller contacts the substrate. Thereby, there is an effect that the end material region with a narrow width can also abut on the part of the end material region correctly with point contact on the circumference, and because the raw material is an elastic material, it can be softly received.

Hereinafter, the details of the substrate positioning mechanism of the present invention will be described in detail based on FIGS. 1 to 5. Here, as shown in FIG. 4, the substrate positioning mechanism of the present invention is implemented in a substrate processing apparatus that performs scribe processing on a short strip-shaped substrate W, and the short strip-shaped substrate W has a scribe line shown by a broken line The plurality of unit substrates W1 divided by the predetermined line S are arranged in a row of a split pattern with the end material region T interposed.

This substrate processing apparatus includes a horizontal stage 2 on which a short strip-shaped substrate W to be processed is placed and transferred to the scribing section 1. The stage 2 has a rectangular shape in a plan view with a long substrate conveying direction, and is formed such that one side 2a along the longitudinal direction can be inclined downward by a rotating shaft 3 arranged along the substrate conveying direction under the stage. Way. Moreover, the fluid cylinder 4 for rocking the stage 2 from the horizontal posture to the inclined posture is provided below the stage 2. In the following description, the substrate transport direction will be referred to as the X direction, and the direction orthogonal to the horizontal direction with respect to the X direction will be referred to as the Y direction.

The carrier 2 has a plurality of small holes (not shown) for ejecting air formed on the surface, and the short strip-shaped substrate can be floated without contacting the surface of the carrier by ejecting gas from the small holes The so-called "floating platform" is formed. Moreover, the conveyance member 14 which sucks the short strip-shaped board|substrate W by the suction pad 14a from the sky, and conveys in the X direction is provided. The suction pad 14a is held by the support portion 14b and is movably installed along the guide rail 14c extending in the X direction. In addition, the suction pad 14a is formed to be movable up and down by the cylinder 14d.

In addition, when the stage 2 is tilted, two stoppers 6, 6 are provided on the upper surface of the stage in the vicinity of one side 2a that becomes the inclined lower side. The stoppers 6, 6 are arranged at intervals on an imaginary line parallel to the rotation axis 3, and are formed such that when the stage 2 tilts, the short strip-shaped substrate W on the stage moves to the inclined lower side due to its own weight, and Abut on one side along the long side and stop it. The stopper 6 is formed of a roller containing an elastic material such as rubber, and is formed so as to catch the short strip-shaped substrate W with the circumferential surface of the roller. In addition, the stopper 6 is held by the support arm 7, and the support arm 7 is formed to be movable along the rail 8 a extending in the X direction of the driving portion 8, whereby the contact position with respect to the short strip-shaped substrate W can be adjusted.

The scribing section 1 is provided with scribing heads 10 having cutting wheels 9 above and below at the positions above and below the transported short strip substrate W, respectively. The scribing head 10 is formed so as to be able to move up and down on a door-shaped frame 11 provided so as to straddle a short strip-shaped substrate W that is conveyed, and to be able to follow the guide rail 13 of a beam (beam) 12 provided on the frame 11 Move in Y direction. As a result, the cutting wheel 9 can be pressed against the surface of the substrate W and moved in the Y direction, whereby the front and back surfaces of the short strip-shaped substrate W can be scribed in the Y direction.

Next, the operation of assembling the substrate processing device of this positioning mechanism will be described. First, as shown in FIG. 4, the short strip-shaped substrate W is placed on the stage with the longitudinal direction facing the X direction. As the short strip-shaped substrate W to be divided, in this embodiment, a laminated substrate in which a plurality of substrates are laminated is targeted. As described above, the short strip-shaped substrate W is set by a split pattern in which four unit substrates W1 divided along a predetermined scribe line S shown by broken lines are arranged via the end material region T.

Before the short strip-shaped substrate W is fed into the scribing section 1, the short strip-shaped substrate W placed on the stage 2 is positioned. This positioning is used to correctly position the predetermined scribe line S in the Y direction of the substrate in the direction of travel of the cutting wheel when the scribing section 1 scribes the short strip-shaped substrate W.

The positioning of the substrate is performed by tilting the stage so that the fluid cylinder 4 is driven and the side 2a of the stage 2 is inclined downward. At this time, the rear end surface of the short strip-shaped substrate W in the conveying direction comes into contact with the contact roller 5 mounted on the stage 2. When the stage 2 is tilted, the short strip-shaped substrate moves to the inclined lower side due to its own weight, and one side of the short strip-shaped substrate W in the longitudinal direction abuts against the stopper 6 and stops. By pre-setting the positions of the two stoppers 6 at the stop position, the predetermined scribe line S in the Y direction of the short strip-shaped substrate coincides with the traveling direction of the cutting wheel 9, and the substrate can be positioned correctly. In addition, when the stage is tilted, the substrate W is slightly raised in a non-contact state by ejecting gas from the small hole provided on the upper surface of the stage, and can smoothly move along the inclined surface.

During this positioning, the stopper 6 may be moved along the rail 8a of the drive unit 8 to adjust its position in advance so as to abut the portion of the end material region T of the short strip-shaped substrate W. By this, since the stopper 6 abuts on the end material region portion that is cut off at the time of breaking, it is possible to avoid damage to the end surface of the unit substrate W1 that becomes a product. In addition, since the stopper 6 is formed of a roller and abuts on the short strip-shaped substrate W with its circumferential surface, even in the end material region T with a narrow width, it can be correctly abutted on the end material region by point contact on the circumference, And because the raw material is an elastic material, it can be received softly.

After positioning, the stage 2 is returned to the horizontal position, and the short-shaped substrate W is sucked by the suction pad 14a of the conveying member 14 and transported in the X direction, and comes to the cutting wheel relative to the scribing portion 1 at the predetermined scribing line S Stop at 10 and place it on the stage. Then, by pressing the cutting wheel 10 against the surface of the substrate and traveling in the Y direction, the scribing process for breaking can be accurately performed along the predetermined scribing line S. The short strip-shaped substrate W after the scribing process is further transported in the X direction, and is divided along the scribing line in the next step to take out the unit substrate W1.

In this way, according to the substrate positioning mechanism of the present invention, only the tilting of the carrier, which is the transfer stage, can automatically and quickly position the substrate and improve the efficiency of the substrate processing operation, and because the mechanism for tilting is relatively simple, it can be lowered. Price offer.

Although the representative embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, it is also possible to replace the above-mentioned stage with a tiltable conveyor belt. In addition, in the above-described embodiment, the scribing wheel is used to process the scribe line, but it can also be processed by laser irradiation. In addition, in the above-mentioned embodiment, a short strip-shaped substrate is used as a processing object, but it is not limited to a short strip-shaped substrate, and all quadrilateral substrates may be used as a processing object.

In addition, the processed substrate may be a laminated substrate in which only one veneer is laminated to a plurality of substrates, or a brittle material substrate or a resin substrate whose raw material is glass or the like. In addition, in the case where the processed substrate is a single board, any one of the cutting wheels above and below the fractured portion may be omitted. [Industry availability]

The substrate positioning mechanism of the present invention can be used for substrate positioning when scribing the substrate.

1‧‧‧ Crossing Department 2‧‧‧ stage 2a‧‧‧Side 3‧‧‧Rotating shaft 4‧‧‧ fluid cylinder 5‧‧‧Abutting roller 6‧‧‧stop 7‧‧‧Support arm 8‧‧‧Drive 8a‧‧‧ Orbit 9‧‧‧cutting wheel 10‧‧‧Scribe head 11‧‧‧door frame 12‧‧‧beam 13‧‧‧rail 14‧‧‧Transport components 14a‧‧‧Adsorption pad 14b‧‧‧Support 14c‧‧‧rail 14d‧‧‧cylinder S‧‧‧Dated line T‧‧‧End material area W‧‧‧Substrate W1‧‧‧ unit substrate X‧‧‧ direction Y‧‧‧ direction

FIG. 1 is a side view of a substrate processing device incorporating the positioning mechanism of the present invention. FIG. 2 is a plan view of the above substrate processing apparatus. Figure 3 is an enlarged front view of the stage portion. 4 is a plan view showing a state where a short strip-shaped substrate is placed on a stage. Fig. 5 is an enlarged front view of Fig. 3 showing the operation of the positioning mechanism.

2‧‧‧ stage

2a‧‧‧Side

3‧‧‧Rotating shaft

4‧‧‧ fluid cylinder

6‧‧‧stop

W‧‧‧Substrate

Claims (8)

A substrate positioning mechanism, which is a substrate positioning mechanism of a substrate processing device of a substrate processing apparatus that feeds a substrate placed on a substrate transfer stage into a scribing portion and performs a scribing process for breaking the surface of the substrate; and The above-mentioned stage is formed to be tiltable via a rotation axis along the substrate conveying direction; When the above-mentioned stage tilts, a plurality of stoppers are provided on the upper surface of the stage which becomes the inclined lower side; The plurality of stoppers are arranged on a line parallel to the rotation axis with an interval. The substrate positioning mechanism according to claim 1, wherein the above-mentioned stage is formed in a quadrangular shape in plan view, and is formed such that one side thereof becomes an inclined lower side when the stage is tilted. The substrate positioning mechanism according to claim 1, wherein the substrate conveying stage is formed by a floating stage that ejects compressed gas from a plurality of small holes formed on the surface to float the substrate. The substrate positioning mechanism according to claim 2, wherein the substrate conveying stage is formed by a floating stage that ejects compressed gas from a plurality of small holes formed on the surface to float the substrate. The substrate positioning mechanism according to any one of claims 1 to 4, wherein the stopper is formed to be movable in the substrate conveying direction. The substrate positioning mechanism according to any one of claims 1 to 4, wherein the stopper is formed of a roller containing an elastic material, and is formed to catch the substrate on the circumferential surface of the roller. The substrate positioning mechanism according to claim 5, wherein the stopper is formed of a roller containing an elastic material, and is formed to catch the substrate with the circumferential surface of the roller. A substrate positioning method, which is a positioning method for positioning a substrate placed on a stage that is transferred to a scribing section at an appropriate position; and The above-mentioned stage is tilted via a rotating shaft along the conveying direction of the substrate, so that the substrate on the stage is moved to the inclined lower side due to its own weight; The positioning of the substrate is performed by abutting one side of the substrate to the stopper that is waiting on the inclined lower side.

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