TW201947698A - Vacuum positioning device for fan-out wafer- panel level packaging - Google Patents
Vacuum positioning device for fan-out wafer- panel level packaging Download PDFInfo
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Abstract
Description
本發明係關於一種真空定位設備,尤指一種面板級扇出型封裝之真空定位設備。The invention relates to a vacuum positioning device, in particular to a vacuum positioning device of a panel-level fan-out package.
在晶圓級封裝製程中,一晶圓基板必須以固定在一真空吸盤上,即藉由該真空吸盤的向下真空吸力,將該晶圓底面吸附並暫時固定在該真空吸盤上,以進行相關封裝製程。In the wafer-level packaging process, a wafer substrate must be fixed on a vacuum chuck, that is, the bottom surface of the wafer is adsorbed and temporarily fixed on the vacuum chuck by the downward vacuum suction force of the vacuum chuck to perform Related packaging process.
隨著晶圓基板尺寸增加且厚度不增反減,晶圓基板開始出現翹曲問題,即愈大尺寸的晶圓基板,翹曲尤其明顯,目前晶圓級封裝製程使用的真空吸盤已無法克服大尺寸晶圓基板的翹曲,故而大尺寸的晶圓基板已不能完全平貼在該真空吸盤上。As the size of the wafer substrate increases and the thickness does not increase, the wafer substrate begins to warp, that is, the larger the size of the wafer substrate, the warpage is particularly obvious. At present, the vacuum chucks used in wafer-level packaging processes cannot be overcome. The large-size wafer substrate is warped, so the large-size wafer substrate cannot be completely flatly attached to the vacuum chuck.
此外,目前半導體封裝也進入面板級扇出封裝,除了面板基板尺寸更大而同樣有翹曲問題外,該面板基板的形狀、材料特性也與晶圓基板形狀、材料特性不同,故目前晶圓級封裝用之真空吸盤已完全不適用於固定面板級扇出封裝之面板基板,而必要進一步提出解決方案,以確保封裝良率。In addition, the current semiconductor package also enters the panel-level fan-out package. In addition to the larger panel substrate and the same warpage problem, the shape and material characteristics of the panel substrate are also different from the wafer substrate shape and material characteristics. Vacuum chucks for level packaging are completely unsuitable for panel substrates that fix panel level fan-out packaging, and further solutions are necessary to ensure packaging yield.
有鑑於前揭真空吸盤無法用於固定面板級扇出封裝之面板基板的問題,本發明主要發明目的係提出一種面板級扇出型封裝之真空定位設備,以克服面板基板因翹曲而無法被固定之問題。In view of the problem that the previously-disclosed vacuum chuck cannot be used to fix the panel substrate of the panel-level fan-out package, the main purpose of the present invention is to propose a vacuum positioning device for the panel-level fan-out package to overcome the panel substrate's inability to be warped due to warpage. Fixed issue.
欲達上述目的所使用的主要技術手段係令該面板級扇出型封裝之真空定位設備包含有: 一真空吸盤,係形成有複數真空孔洞; 一基板,係置放於該真空吸盤上,並包含有一第一表面及一第二表面;其中該第一表面包含有一半導體元件區及一邊緣區,該第二表面係對應該真空吸盤的該些真空孔洞;其中該第一表面的邊緣區未形成有半導體元件;以及 一壓力件,係位在該真空吸盤上方,並包含有一平壓台及一傳動結構;其中該傳動結構係控制該平壓台移動,該平壓台係對準該基板之第一表面的邊緣區。The main technical means used to achieve the above purpose is to make the panel-level fan-out package vacuum positioning equipment include: a vacuum chuck, which is formed with a plurality of vacuum holes; a substrate, which is placed on the vacuum chuck, and The first surface includes a first surface and a second surface. The first surface includes a semiconductor device region and an edge region. The second surface corresponds to the vacuum holes corresponding to the vacuum chuck. The edge region of the first surface is not A semiconductor element is formed; and a pressure member is located above the vacuum chuck and includes a flat pressing table and a transmission structure; wherein the driving structure controls the movement of the flat pressing table and the flat pressing table is aligned with the substrate Edge area of the first surface.
由上述說明可知,該真空定位設備主要提供一壓力件,其平壓台係對準置放在真空吸盤上之基板的邊緣區,之後再下壓該基板並直到該基板平貼於該真空吸盤上;於下壓期間,由於該平壓台只與該基板的邊緣區接觸,可避免在下壓期間損壞該基板的半導體元件;因此,本發明不僅可輔助真空吸盤將邊緣翹曲的基板確實壓平貼合,令該基板可全面真空吸附平貼在真空吸盤上,以利後續封裝製程的進行。It can be known from the above description that the vacuum positioning device mainly provides a pressure member, and the flat pressing table is aligned with the edge area of the substrate placed on the vacuum chuck, and then the substrate is pressed down until the substrate is flat against the vacuum chuck. Up; during pressing, the flattening stage only contacts the edge region of the substrate, which can avoid damaging the semiconductor elements of the substrate during pressing; therefore, the invention can not only assist the vacuum chuck to press the substrate with warped edges really The flat lamination enables the substrate to be fully vacuum-adhered to the vacuum chuck and facilitates subsequent packaging processes.
本發明係針對一種用於面板級扇出型封裝之真空定位設備,以下以實施例配合圖式加以說明真空定位設備的詳細結構及其動作。The present invention is directed to a vacuum positioning device for a panel-level fan-out package. The detailed structure and operation of the vacuum positioning device will be described below with reference to the embodiments and the drawings.
首先請參閱圖1所示,係為本發明用於面板級扇出型封裝之真空定位設備10的一實施例,該真空定位設備10由下至上包含有一真空吸盤20(Vacuum Chuck)、一基板30及一壓力件40。First, please refer to FIG. 1, which is an embodiment of a vacuum positioning device 10 for a panel-level fan-out package according to the present invention. The vacuum positioning device 10 includes a vacuum chuck 20 and a substrate from bottom to top. 30 和 一 压 件 40。 30 and a pressure member 40.
請參閱圖1及圖5A所示,上述真空吸盤20形成有複數真空孔洞21,該真空吸盤20的內部空間係依控制而產生一負壓環境,當負壓環境產生時,該些真空孔洞20即提供一向下真空吸附力F,如圖5C所示。於本實施例,該真空吸盤20係呈一矩形。Please refer to FIG. 1 and FIG. 5A. The vacuum chuck 20 is formed with a plurality of vacuum holes 21. The internal space of the vacuum chuck 20 is controlled to generate a negative pressure environment. When the negative pressure environment is generated, the vacuum holes 20 That is, a downward vacuum suction force F is provided, as shown in FIG. 5C. In this embodiment, the vacuum chuck 20 is rectangular.
請參閱圖1、圖3A、圖3B及圖5A所示,上述基板30係置放於該真空吸盤20上,並包含有一第一表面31及一第二表面32;其中該第一表面31包含有一半導體元件區311及一邊緣區312,該第二表面32係朝下對應該真空吸盤20的該些真空孔洞21;其中該第一表面31的半導體元件區311係形成有複數半導體元件313,而該邊緣區312則未形成有半導體元件313。於本實施例,該基板30係為面板級扇出型封裝用的一面板基板,係呈矩形,其尺寸係小於該真空吸盤20。Please refer to FIGS. 1, 3A, 3B and 5A. The substrate 30 is placed on the vacuum chuck 20 and includes a first surface 31 and a second surface 32. The first surface 31 includes There is a semiconductor element region 311 and an edge region 312. The second surface 32 faces downward the vacuum holes 21 corresponding to the vacuum chuck 20. The semiconductor element region 311 of the first surface 31 is formed with a plurality of semiconductor elements 313. The edge region 312 is not formed with the semiconductor element 313. In this embodiment, the substrate 30 is a panel substrate for a panel-level fan-out package. The substrate 30 is rectangular and has a size smaller than that of the vacuum chuck 20.
請參閱圖1、圖2及圖5A所示,上述壓力件40係位在該基板30上方,並包含有一平壓台41及一傳動結構42;其中該傳動結構42係連接該平壓台41的頂面,以控制該平壓台41位置,使該平壓台41對準該基板30的邊緣區312。於本實施例,該平壓台41係包含有一座體411及一矩形凸肋412,該座體411的一頂面係連接至該傳動結構42,而該矩形凸肋412則設置在該座體411之一底面,且該矩形凸肋412的尺寸係匹配該基板30的邊緣區312,即該矩形凸肋的各肋條寬度w11、w12不大於其所對應該邊緣區之區域寬度w21、w22;較佳者,該矩形凸肋的各肋條寬度w11、w12為其所對應邊緣區的1/2~2/3區域寬度w21、w22。於本實施例,該傳動結構42係為一種三軸傳動結構,用以控制該壓力件40在三軸的位置。Please refer to FIG. 1, FIG. 2 and FIG. 5A. The pressure member 40 is located above the base plate 30 and includes a flat pressing table 41 and a transmission structure 42. The driving structure 42 is connected to the flat pressing table 41. To control the position of the flat platen 41 so that the flat platen 41 is aligned with the edge region 312 of the substrate 30. In this embodiment, the flat platen 41 includes a base 411 and a rectangular rib 412. A top surface of the base 411 is connected to the transmission structure 42, and the rectangular rib 412 is disposed on the base. A bottom surface of the body 411, and the size of the rectangular rib 412 matches the edge region 312 of the substrate 30, that is, the widths of the ribs w11, w12 of the rectangular rib are not larger than the widths w21, w22 of the corresponding edge region. Preferably, the rib widths w11 and w12 of the rectangular convex ribs are 1/2 to 2/3 of the widths w21 and w22 of the corresponding edge region. In this embodiment, the transmission structure 42 is a three-axis transmission structure, which is used to control the position of the pressure member 40 on the three axes.
為進一步使該平壓台41輕量化,該平壓台41係呈一矩形鏤空結構,即包含有一柱體413及一框架,該框架係包含有一矩形外框414以及一固定於該矩形外框414內側壁的內格網415,該柱體413即固定於該內格網415上;其中該矩形凸肋412係設置並凸出於該矩形外框414之底面;於本實施例,該矩形外框414係選用鋁材製成,可更減輕其重量,而該矩形凸肋412為一種軟性緩衝墊,尤其是一種耐高溫(大於攝氏150度)之軟性緩衝墊,以確保在後續高溫檢測設備(如:三溫檢測設備)中不受高溫破壞。In order to further reduce the weight of the flat platen 41, the flat platen 41 has a rectangular hollow structure, that is, it includes a column 413 and a frame. The frame includes a rectangular outer frame 414 and a fixed frame. The inner grid 415 on the inner side wall of 414, the pillar 413 is fixed on the inner grid 415; the rectangular rib 412 is provided and protrudes from the bottom surface of the rectangular outer frame 414; in this embodiment, the rectangle The outer frame 414 is made of aluminum, which can reduce its weight. The rectangular rib 412 is a soft cushion, especially a high-temperature (more than 150 degrees Celsius) soft cushion, to ensure subsequent high-temperature detection. The equipment (such as: three temperature detection equipment) is not damaged by high temperature.
以上為本發明真空定位設備10的結構說明,以下進一步說明本發明真空定位設備的動作。The above is a structural description of the vacuum positioning device 10 of the present invention, and the operation of the vacuum positioning device of the present invention is further described below.
首先請參閱圖1、圖4A及圖5A,將一邊緣翹曲的基板30置放於該真空吸盤20上,以該三軸傳動結構42控制該下壓件40的該平壓台41對準該基板30,使該平壓台41之座體411底面的矩形凸肋412對準該基板30之邊緣區312,之後再控制該平壓台41向下移動,使其矩形凸肋412接觸該基板30之邊緣區312,如圖5B所示。First, referring to FIG. 1, FIG. 4A and FIG. 5A, a substrate 30 with a warped edge is placed on the vacuum chuck 20, and the three-axis transmission structure 42 controls the flattening stage 41 of the pressing member 40 to align. The base plate 30 aligns the rectangular ribs 412 on the bottom surface of the base 411 of the flat platen 41 with the edge region 312 of the base plate 30, and then controls the flat platen 41 to move downward so that the rectangular ribs 412 contact the The edge region 312 of the substrate 30 is shown in FIG. 5B.
接著,請參閱圖4B及圖5C所示,控制該平壓台41持續向下移動,將基板30翹曲的邊緣向下壓,直到全面平貼於該真空吸盤20上。此時,該真空吸盤20的內部空間產生一負壓環境,並透過該些真空孔洞21提供一向下真空吸附力F,可將全面平貼在該真空吸盤20上的基板30真空吸附並固定在該真空吸盤20上,待基板30受真空吸附力F固定在該真空吸盤20後,即可控制該平壓台41上移,以遠離該基板30,如圖4C及圖5D所示,令該基板30開始進入面板級扇出型封裝製程。Next, referring to FIG. 4B and FIG. 5C, the flat platen 41 is controlled to continue to move downward, and the warped edge of the substrate 30 is pressed down until it is fully flat against the vacuum chuck 20. At this time, a negative pressure environment is generated in the internal space of the vacuum chuck 20, and a downward vacuum suction force F is provided through the vacuum holes 21, so that the substrate 30 fully adhered to the vacuum chuck 20 can be vacuum-sucked and fixed on the vacuum chuck 20. On the vacuum chuck 20, after the substrate 30 is fixed to the vacuum chuck 20 by the vacuum suction force F, the flat platen 41 can be controlled to move upward to move away from the substrate 30, as shown in FIGS. 4C and 5D. The substrate 30 starts to enter a panel-level fan-out packaging process.
綜上所述,本發明真空定位設備係主要於真空吸盤上設置一壓力件,且該壓力件於動作時,先將其平壓台對準置放在真空吸盤上之基板的邊緣區,之後再下壓該基板並直到該基板平貼於該真空吸盤上;如此可於下壓期間,僅由該平壓台與該基板的邊緣區接觸,可避免在下壓期間損壞該基板的半導體元件;因此,本發明不僅可輔助真空吸盤將邊緣翹曲的基板確實壓平貼合,令該基板可全面真空吸附平貼在真空吸盤上,以利後續封裝製程的進行。In summary, the vacuum positioning device of the present invention is mainly provided with a pressure member on the vacuum chuck, and when the pressure member is in operation, the flat pressing table is first aligned with the edge area of the substrate placed on the vacuum chuck, and then The substrate is further pressed down until the substrate is flatly attached to the vacuum chuck; in this way, during the pressing, only the flat pressing table is in contact with the edge region of the substrate, which can avoid damaging the semiconductor elements of the substrate during the pressing; Therefore, the present invention can not only assist the vacuum chuck to flatten and adhere the substrate with warped edges, so that the substrate can be fully vacuum-adhered and affixed to the vacuum chuck to facilitate the subsequent packaging process.
以上所述僅是本發明的實施例而已,並非對本發明做任何形式上的限制,雖然本發明已以實施例揭露如上,然而並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本發明技術方案的內容,依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內。The above description is only an embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed by the embodiments as above, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field of the art, Within the scope not departing from the technical solution of the present invention, when the above disclosed technical content can be used to make a few changes or modifications to equivalent equivalent embodiments, as long as it does not depart from the technical solution of the present invention, it is in accordance with the technical essence of the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.
10‧‧‧真空定位設備10‧‧‧Vacuum positioning equipment
20‧‧‧真空吸盤20‧‧‧Vacuum suction cup
21‧‧‧真空孔洞21‧‧‧Vacuum hole
30‧‧‧基板30‧‧‧ substrate
31‧‧‧第一表面31‧‧‧first surface
311‧‧‧半導體元件區311‧‧‧Semiconductor element area
312‧‧‧邊緣區312‧‧‧Marginal zone
313‧‧‧半導體元件313‧‧‧Semiconductor
32‧‧‧第二表面32‧‧‧ second surface
40‧‧‧壓力件40‧‧‧Pressure
41‧‧‧平壓台41‧‧‧Flat pressure table
411‧‧‧座體411‧‧‧ seat
412‧‧‧矩形凸肋412‧‧‧Rectangular rib
413‧‧‧柱體413‧‧‧ cylinder
412‧‧‧矩形外框412‧‧‧rectangular frame
415‧‧‧內格網415‧‧‧ Inner Grid
圖1:本發明之面板級扇出型封裝之真空定位設備的立體外觀圖。 圖2:本發明之壓力件的立體外觀圖。 圖3A:本發明之基板的俯視平面圖。 圖3B:本發明之基板的立體圖。 圖4A至圖4C:本發明真空定位設備的立體動作示意圖。 圖5A至圖5D:本發明真空定位設備的側視動作示意圖。FIG. 1 is a perspective view of a vacuum positioning device of a panel-level fan-out package according to the present invention. Figure 2: A perspective view of a pressure member of the present invention. FIG. 3A is a top plan view of a substrate of the present invention. FIG. 3B is a perspective view of a substrate of the present invention. FIG. 4A to FIG. 4C are schematic three-dimensional operation diagrams of the vacuum positioning device of the present invention. FIG. 5A to FIG. 5D are schematic side-view actions of the vacuum positioning device of the present invention.
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