TW201947698A - Vacuum positioning device for fan-out wafer- panel level packaging - Google Patents

Abstract

The present invention relates a vacuum positioning device for Fan-out Wafer- Panel Level Packaging (FOPLP) and has a vacuum chuck on which a substrate is placed and a pressing element used to press down the substrate on the vacuum chuck. Before the pressing element presses down, a pressing head of the pressing element aligns with an edge area of the substrate and then the pressing head only touches the edge area until the substrate is completely mounted on the vacuum chuck. During pressing down, the pressing head only touches the edge area of the substrate, so multiple semiconductor elements formed on the substrate are kept from damaging. Therefore, the present invention not only makes the substrate with an edge warpage completely be mounted on the vacuum chuck, but also makes that the vacuum chuck completely fix the substrate thereon by vacuum suction to facilitate the subsequent packaging process.

Description

Panel-level fan-out package vacuum positioning equipment

The invention relates to a vacuum positioning device, in particular to a vacuum positioning device of a panel-level fan-out package.

In the wafer-level packaging process, a wafer substrate must be fixed on a vacuum chuck, that is, the bottom surface of the wafer is adsorbed and temporarily fixed on the vacuum chuck by the downward vacuum suction force of the vacuum chuck to perform Related packaging process.

As the size of the wafer substrate increases and the thickness does not increase, the wafer substrate begins to warp, that is, the larger the size of the wafer substrate, the warpage is particularly obvious. At present, the vacuum chucks used in wafer-level packaging processes cannot be overcome. The large-size wafer substrate is warped, so the large-size wafer substrate cannot be completely flatly attached to the vacuum chuck.

In addition, the current semiconductor package also enters the panel-level fan-out package. In addition to the larger panel substrate and the same warpage problem, the shape and material characteristics of the panel substrate are also different from the wafer substrate shape and material characteristics. Vacuum chucks for level packaging are completely unsuitable for panel substrates that fix panel level fan-out packaging, and further solutions are necessary to ensure packaging yield.

In view of the problem that the previously-disclosed vacuum chuck cannot be used to fix the panel substrate of the panel-level fan-out package, the main purpose of the present invention is to propose a vacuum positioning device for the panel-level fan-out package to overcome the panel substrate's inability to be warped due to warpage. Fixed issue.

The main technical means used to achieve the above purpose is to make the panel-level fan-out package vacuum positioning equipment include: a vacuum chuck, which is formed with a plurality of vacuum holes; a substrate, which is placed on the vacuum chuck, and The first surface includes a first surface and a second surface. The first surface includes a semiconductor device region and an edge region. The second surface corresponds to the vacuum holes corresponding to the vacuum chuck. The edge region of the first surface is not A semiconductor element is formed; and a pressure member is located above the vacuum chuck and includes a flat pressing table and a transmission structure; wherein the driving structure controls the movement of the flat pressing table and the flat pressing table is aligned with the substrate Edge area of the first surface.

It can be known from the above description that the vacuum positioning device mainly provides a pressure member, and the flat pressing table is aligned with the edge area of the substrate placed on the vacuum chuck, and then the substrate is pressed down until the substrate is flat against the vacuum chuck. Up; during pressing, the flattening stage only contacts the edge region of the substrate, which can avoid damaging the semiconductor elements of the substrate during pressing; therefore, the invention can not only assist the vacuum chuck to press the substrate with warped edges really The flat lamination enables the substrate to be fully vacuum-adhered to the vacuum chuck and facilitates subsequent packaging processes.

The present invention is directed to a vacuum positioning device for a panel-level fan-out package. The detailed structure and operation of the vacuum positioning device will be described below with reference to the embodiments and the drawings.

First, please refer to FIG. 1, which is an embodiment of a vacuum positioning device 10 for a panel-level fan-out package according to the present invention. The vacuum positioning device 10 includes a vacuum chuck 20 and a substrate from bottom to top. 30 和 一 压 件 40。 30 and a pressure member 40.

Please refer to FIG. 1 and FIG. 5A. The vacuum chuck 20 is formed with a plurality of vacuum holes 21. The internal space of the vacuum chuck 20 is controlled to generate a negative pressure environment. When the negative pressure environment is generated, the vacuum holes 20 That is, a downward vacuum suction force F is provided, as shown in FIG. 5C. In this embodiment, the vacuum chuck 20 is rectangular.

Please refer to FIGS. 1, 3A, 3B and 5A. The substrate 30 is placed on the vacuum chuck 20 and includes a first surface 31 and a second surface 32. The first surface 31 includes There is a semiconductor element region 311 and an edge region 312. The second surface 32 faces downward the vacuum holes 21 corresponding to the vacuum chuck 20. The semiconductor element region 311 of the first surface 31 is formed with a plurality of semiconductor elements 313. The edge region 312 is not formed with the semiconductor element 313. In this embodiment, the substrate 30 is a panel substrate for a panel-level fan-out package. The substrate 30 is rectangular and has a size smaller than that of the vacuum chuck 20.

Please refer to FIG. 1, FIG. 2 and FIG. 5A. The pressure member 40 is located above the base plate 30 and includes a flat pressing table 41 and a transmission structure 42. The driving structure 42 is connected to the flat pressing table 41. To control the position of the flat platen 41 so that the flat platen 41 is aligned with the edge region 312 of the substrate 30. In this embodiment, the flat platen 41 includes a base 411 and a rectangular rib 412. A top surface of the base 411 is connected to the transmission structure 42, and the rectangular rib 412 is disposed on the base. A bottom surface of the body 411, and the size of the rectangular rib 412 matches the edge region 312 of the substrate 30, that is, the widths of the ribs w11, w12 of the rectangular rib are not larger than the widths w21, w22 of the corresponding edge region. Preferably, the rib widths w11 and w12 of the rectangular convex ribs are 1/2 to 2/3 of the widths w21 and w22 of the corresponding edge region. In this embodiment, the transmission structure 42 is a three-axis transmission structure, which is used to control the position of the pressure member 40 on the three axes.

In order to further reduce the weight of the flat platen 41, the flat platen 41 has a rectangular hollow structure, that is, it includes a column 413 and a frame. The frame includes a rectangular outer frame 414 and a fixed frame. The inner grid 415 on the inner side wall of 414, the pillar 413 is fixed on the inner grid 415; the rectangular rib 412 is provided and protrudes from the bottom surface of the rectangular outer frame 414; in this embodiment, the rectangle The outer frame 414 is made of aluminum, which can reduce its weight. The rectangular rib 412 is a soft cushion, especially a high-temperature (more than 150 degrees Celsius) soft cushion, to ensure subsequent high-temperature detection. The equipment (such as: three temperature detection equipment) is not damaged by high temperature.

The above is a structural description of the vacuum positioning device 10 of the present invention, and the operation of the vacuum positioning device of the present invention is further described below.

First, referring to FIG. 1, FIG. 4A and FIG. 5A, a substrate 30 with a warped edge is placed on the vacuum chuck 20, and the three-axis transmission structure 42 controls the flattening stage 41 of the pressing member 40 to align. The base plate 30 aligns the rectangular ribs 412 on the bottom surface of the base 411 of the flat platen 41 with the edge region 312 of the base plate 30, and then controls the flat platen 41 to move downward so that the rectangular ribs 412 contact the The edge region 312 of the substrate 30 is shown in FIG. 5B.

Next, referring to FIG. 4B and FIG. 5C, the flat platen 41 is controlled to continue to move downward, and the warped edge of the substrate 30 is pressed down until it is fully flat against the vacuum chuck 20. At this time, a negative pressure environment is generated in the internal space of the vacuum chuck 20, and a downward vacuum suction force F is provided through the vacuum holes 21, so that the substrate 30 fully adhered to the vacuum chuck 20 can be vacuum-sucked and fixed on the vacuum chuck 20. On the vacuum chuck 20, after the substrate 30 is fixed to the vacuum chuck 20 by the vacuum suction force F, the flat platen 41 can be controlled to move upward to move away from the substrate 30, as shown in FIGS. 4C and 5D. The substrate 30 starts to enter a panel-level fan-out packaging process.

In summary, the vacuum positioning device of the present invention is mainly provided with a pressure member on the vacuum chuck, and when the pressure member is in operation, the flat pressing table is first aligned with the edge area of the substrate placed on the vacuum chuck, and then The substrate is further pressed down until the substrate is flatly attached to the vacuum chuck; in this way, during the pressing, only the flat pressing table is in contact with the edge region of the substrate, which can avoid damaging the semiconductor elements of the substrate during the pressing; Therefore, the present invention can not only assist the vacuum chuck to flatten and adhere the substrate with warped edges, so that the substrate can be fully vacuum-adhered and affixed to the vacuum chuck to facilitate the subsequent packaging process.

The above description is only an embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed by the embodiments as above, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field of the art, Within the scope not departing from the technical solution of the present invention, when the above disclosed technical content can be used to make a few changes or modifications to equivalent equivalent embodiments, as long as it does not depart from the technical solution of the present invention, it is in accordance with the technical essence of the present invention. Any simple modifications, equivalent changes, and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.

10‧‧‧Vacuum positioning equipment

20‧‧‧Vacuum suction cup

21‧‧‧Vacuum hole

30‧‧‧ substrate

31‧‧‧first surface

311‧‧‧Semiconductor element area

312‧‧‧Marginal zone

313‧‧‧Semiconductor

32‧‧‧ second surface

40‧‧‧Pressure

41‧‧‧Flat pressure table

411‧‧‧ seat

412‧‧‧Rectangular rib

413‧‧‧ cylinder

412‧‧‧rectangular frame

415‧‧‧ Inner Grid

FIG. 1 is a perspective view of a vacuum positioning device of a panel-level fan-out package according to the present invention. Figure 2: A perspective view of a pressure member of the present invention. FIG. 3A is a top plan view of a substrate of the present invention. FIG. 3B is a perspective view of a substrate of the present invention. FIG. 4A to FIG. 4C are schematic three-dimensional operation diagrams of the vacuum positioning device of the present invention. FIG. 5A to FIG. 5D are schematic side-view actions of the vacuum positioning device of the present invention.

Claims (10)

A vacuum positioning device for a panel-level fan-out package includes: a vacuum chuck, which is formed with a plurality of vacuum holes; a substrate, which is placed on the vacuum chuck, and includes a first surface and a second surface; The first surface includes a semiconductor element region and an edge region, and the second surface is corresponding to the vacuum holes of the vacuum chuck; wherein the semiconductor element is not formed in the edge region of the first surface; and a pressure member is positioned. Above the vacuum chuck, a flat platen and a transmission structure are included; wherein the transmission structure controls the movement of the flat platen, and the flat platen is aligned with the edge region of the first surface of the substrate. The vacuum positioning device according to claim 1, wherein: the vacuum chuck has a rectangular shape; the substrate has a rectangular shape; and the flat pressing table includes: a body whose top surface is connected to the transmission structure; A rectangular rib is provided and protrudes from a bottom surface of the base body, and its size matches the edge region of the first surface of the substrate. According to the vacuum positioning device described in claim 2, the width of each rib of the rectangular convex rib is 1/2 to 2/3 of the width of the corresponding edge region. The vacuum positioning device according to claim 2, the seat system includes: a cylinder connected to the transmission structure; and a frame connected to the cylinder, and including a rectangular outer frame and a fixed to the An inner grid of the inner side wall of the rectangular outer frame; wherein the rectangular convex rib is arranged on the bottom surface of the rectangular outer frame. The vacuum positioning device according to any one of claims 2 to 4, wherein the rectangular convex rib is a soft cushion. According to the vacuum positioning device according to any one of claims 2 to 4, the flat pressing table is made of aluminum. According to the vacuum positioning device described in claim 5, the flat platen is made of aluminum. According to the vacuum positioning device described in any one of claims 1 to 4, the transmission structure is a three-axis transmission structure. According to the vacuum positioning device described in claim 5, the transmission structure is a three-axis transmission structure. The vacuum positioning device according to claim 6, the transmission structure is a three-axis transmission structure.