TW201936788A - Composition, coating film, cured film, lens, solid-state imaging device, resin - Google Patents

Composition, coating film, cured film, lens, solid-state imaging device, resin Download PDF

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TW201936788A
TW201936788A TW108106080A TW108106080A TW201936788A TW 201936788 A TW201936788 A TW 201936788A TW 108106080 A TW108106080 A TW 108106080A TW 108106080 A TW108106080 A TW 108106080A TW 201936788 A TW201936788 A TW 201936788A
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金子祐士
田口貴規
瀧下大貴
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日商富士軟片股份有限公司
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0638Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with at least three nitrogen atoms in the ring
    • C08G73/0644Poly(1,3,5)triazines
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
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    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
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    • G02OPTICS
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    • GPHYSICS
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    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00Simple or compound lenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures

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Abstract

Provided is a composition capable of giving a cured film in which the occurrence of defects is suppressed even after repeated exposure to a high temperature-low temperature environment. Also provided are a coating film, a cured film, a lens, a solid-state imaging device, and a novel resin. The composition contains a resin containing a repeating unit represented by general formula (I-1) or a repeating unit represented by general formula (I-2), a solvent, and a specific metal ion selected from the group consisting of a sodium ion, potassium ion, and calcium ion, and the total content of the specific metal ion is 0.01-30 mass ppm relative to the total mass of the composition.

Description

組成物、塗佈膜、硬化膜、透鏡、固體攝像元件、樹脂Composition, coating film, cured film, lens, solid-state imaging device, resin

本發明係關於一種組成物、塗佈膜、硬化膜、透鏡、固體攝像元件及樹脂。The present invention relates to a composition, a coating film, a cured film, a lens, a solid-state image sensor, and a resin.

以往,對用於光學材料(例如裝載於影像感測器上之顯微透鏡形成材料及濾色器的折射率調整劑等)之化合物要求高耐熱性、高透明性、高折射率、高溶解性及低體積收縮率等諸多特性。
例如,在專利文獻1中揭示有含三𠯤環的聚合物作為具有高耐熱性、高透明性、高折射率、高溶解性及低體積收縮率性之材料。
[先前技術文獻]
[專利文獻]
Conventionally, compounds for optical materials (for example, a microlens forming material mounted on an image sensor and a refractive index modifier of a color filter) are required to have high heat resistance, high transparency, high refractive index, and high solubility. Sex and low volume shrinkage and many other characteristics.
For example, Patent Document 1 discloses a tricyclic ring-containing polymer as a material having high heat resistance, high transparency, high refractive index, high solubility, and low volume shrinkage.
[Previous Technical Literature]
[Patent Literature]

[專利文獻1]日本特開2015-025131號公報[Patent Document 1] JP-A-2015-025131

本發明人等對由包含專利文獻1中所記載之含三𠯤環的聚合物之組成物形成之硬化膜進行了研究的結果,已知在高溫環境下及低溫環境下(高溫-低溫環境下)反覆曝光之上述硬化膜產生很多缺陷。The inventors of the present invention have studied the cured film formed of the composition containing the triguanidine ring-containing polymer described in Patent Document 1, and are known to be in a high temperature environment and a low temperature environment (high temperature-low temperature environment). The above-mentioned cured film which is repeatedly exposed has many defects.

因此,本發明的課題在於提供一種能夠提供在高溫-低溫環境下反覆曝光之後亦可以抑制缺陷產生之硬化膜之組成物。
又,本發明的課題在於提供一種由上述組成物形成之塗佈膜、硬化上述塗佈膜來形成之硬化膜、透鏡及固體攝像元件。
又,本發明的課題在於提供一種能夠適當地用作高折射率材料之新型樹脂。
Accordingly, an object of the present invention is to provide a composition capable of providing a cured film which can suppress the occurrence of defects after repeated exposure in a high-temperature-low temperature environment.
Further, an object of the present invention is to provide a coating film formed of the above composition, a cured film formed by curing the coating film, a lens, and a solid-state image sensor.
Further, an object of the present invention is to provide a novel resin which can be suitably used as a high refractive index material.

本發明人等為了實現上述課題而進行了深入研究之結果,發現了藉由包括包含特定結構的三𠯤環之樹脂、規定含量的特定金屬離子及溶劑之組成物能夠解決上述課題,從而完成了本發明。
亦即,發現了藉由以下的結構能夠實現上述目的。
As a result of intensive studies to achieve the above problems, the inventors of the present invention have found that the above problems can be solved by including a resin containing a tri-ring of a specific structure, a specific metal ion of a predetermined content, and a solvent. this invention.
That is, it was found that the above object can be achieved by the following structure.

(1)一種組成物,其包括:
樹脂,包含由後述之通式(I-1)表示之重複單元或由後述之通式(I-2)表示之重複單元;
溶劑;及
特定金屬離子,選自包括鈉離子、鉀離子及鈣離子之群組,
特定金屬離子的總含量相對於組成物總質量為0.01~30質量ppm。
(2)如(1)所述之組成物,其中
溶劑包含甲苯,
甲苯的含量相對於組成物總質量為0.001~10質量ppm。
(3)如(1)或(2)所述之組成物,其中
通式(I-1)中,V為由後述之通式(II)表示之基團。
(4)如(3)所述之組成物,其中
通式(II)中,m表示0,n表示1,R4 表示芳基、雜環基、氰基、硝基、烷基、烷硫基或鹵素原子。
(5)如(4)所述之組成物,其中
由後述之通式(II)表示之基團為由後述之通式(IIA)表示之基團。
(6)如(1)~(5)中任一項所述之組成物,其中
通式(I-1)中,X1 ~X3 均為-NR1 -。
(7)如(1)~(6)中任一項所述之組成物,其中
通式(I-1)中的W1 及通式(I-2)中的W2 分別獨立地為由後述之通式(III)表示之2價的連接基。
(8)如(7)所述之組成物,其中
通式(I-2)的W2 中,A1 ~A3 均表示伸芳基。
(9)如(7)或(8)所述之組成物,其中
通式(I-2)的W2 中,伸芳基為1,4-伸苯基。
(10)如(1)~(9)中任一項所述之組成物,其還包含硬化性化合物。
(11)如(1)~(10)中任一項所述之組成物,其還包含聚合起始劑。
(12)一種塗佈膜,其由(1)~(11)中任一項所述之組成物形成。
(13)一種硬化膜,其硬化(12)所述之塗佈膜來形成。
(14)一種透鏡,其包括(13)所述之硬化膜。
(15)一種固體攝像元件,其具備(14)所述之透鏡。
(16)一種樹脂,其包含由後述之通式(IV-1)表示之重複單元。
(17)一種樹脂,其包含由後述之通式(IV-2)表示之重複單元。
[發明效果]
(1) A composition comprising:
The resin includes a repeating unit represented by the following formula (I-1) or a repeating unit represented by the formula (I-2) described later;
a solvent; and a specific metal ion selected from the group consisting of sodium ions, potassium ions, and calcium ions.
The total content of the specific metal ions is 0.01 to 30 ppm by mass based on the total mass of the composition.
(2) The composition according to (1), wherein the solvent contains toluene,
The content of toluene is 0.001 to 10 ppm by mass based on the total mass of the composition.
(3) The composition according to (1) or (2), wherein, in the formula (I-1), V is a group represented by the formula (II) which will be described later.
(4) The composition according to (3), wherein, in the formula (II), m represents 0, n represents 1, and R 4 represents an aryl group, a heterocyclic group, a cyano group, a nitro group, an alkyl group, an alkyl sulfide. Base or halogen atom.
(5) The composition represented by the formula (II), wherein the group represented by the formula (II) described later is a group represented by the formula (IIA) described later.
(6) The composition according to any one of (1) to (5), wherein, in the formula (I-1), X 1 to X 3 are each -NR 1 -.
The composition according to any one of (1) to (6), wherein W 1 in the general formula (I-1) and W 2 in the general formula (I-2) are each independently A divalent linking group represented by the formula (III) which will be described later.
(8) The composition according to (7), wherein in W 2 of the formula (I-2), all of A 1 to A 3 represent an exoaryl group.
(9) The composition according to (7) or (8), wherein in the W 2 of the formula (I-2), the exoaryl group is a 1,4-phenylene group.
(10) The composition according to any one of (1) to (9) further comprising a curable compound.
(11) The composition according to any one of (1) to (10) further comprising a polymerization initiator.
(12) A coating film formed of the composition according to any one of (1) to (11).
(13) A cured film formed by curing the coating film described in (12).
(14) A lens comprising the cured film of (13).
(15) A solid-state imaging device comprising the lens described in (14).
(16) A resin comprising a repeating unit represented by the following formula (IV-1).
(17) A resin comprising a repeating unit represented by the formula (IV-2) described later.
[Effect of the invention]

依本發明,能夠提供一種能夠提供在高溫-低溫環境下反覆曝光之後亦可以抑制缺陷產生之硬化膜之組成物。
又,依本發明,能夠提供一種由上述組成物形成之塗佈膜、硬化上述塗佈膜來形成之硬化膜、透鏡及固體攝像元件。
又,依本發明,能夠提供一種能夠適當地用作高折射率材料之新型樹脂。
According to the present invention, it is possible to provide a composition capable of providing a cured film which can suppress the occurrence of defects after repeated exposure in a high-temperature-low temperature environment.
Moreover, according to the present invention, it is possible to provide a coating film formed of the above composition, a cured film formed by curing the coating film, a lens, and a solid-state image sensor.
Moreover, according to the present invention, it is possible to provide a novel resin which can be suitably used as a high refractive index material.

以下,對本發明進行詳細內容說明。
在本說明書中,用“~”來表示之數值範圍係指將記載於“~”前後之數值作為下限值及上限值而包括之範圍。
本說明書中的“光化射線”或“放射線”係指例如以水銀燈的明線光譜、準分子雷射為代表之遠紫外線、極紫外線(EUV光)、X射線及電子束等。又,本發明中,光係指光化射線或放射線。本說明書中的“曝光”只要沒有特別說明,不僅包含以水銀燈的明線光譜、準分子雷射為代表之基於遠紫外線、X射線及EUV光等之曝光,亦包含基於電子束及離子束等粒子束之繪製之曝光。
本說明書中,“(甲基)丙烯酸酯”表示丙烯酸酯及甲基丙烯酸酯,「(甲基)丙烯酸”表示丙烯酸及甲基丙烯酸,“(甲基)丙烯醯基”表示丙烯醯基及甲基丙烯醯基。
本說明書中,“步驟”這一術語不僅包含獨立之步驟,即使在無法與其他步驟明確區分之情況下,只要能夠達成該步驟的所期望的作用,則包含於本術語中。
本說明書中,重量平均分子量及數平均分子量定義為藉由凝膠滲透層析法(GPC)測量的聚苯乙烯換算值。本說明書中,藉由例如作為測量裝置使用HLC-8220(TOSOH CORPORATION製)、作為管柱使用TSKgel Super AWM-H(TOSOH CORPORATION製、6.0mmID(內徑)×15.0cm)、作為洗提液使用10mmol/L 溴化鋰NMP(N-甲基吡咯啶酮)溶液,求出重量平均分子量(Mw)及數平均分子量(Mn)。
本說明書中,聚合性化合物係指具有聚合性基之化合物,可以為單體,亦可以為聚合物。聚合性基係指與聚合反應有關之基團。
本說明書中,總固體成分係指從整體組成物除了溶劑以外的成分之合計質量。
Hereinafter, the present invention will be described in detail.
In the present specification, the numerical range expressed by "~" means a range including the numerical values described before and after "~" as the lower limit and the upper limit.
The "actinic ray" or "radiation" in the present specification means, for example, a far-line ultraviolet ray represented by a bright line spectrum of a mercury lamp, an excimer laser, an extreme ultraviolet ray (EUV light), an X-ray, an electron beam, or the like. Further, in the present invention, light means actinic rays or radiation. The "exposure" in the present specification includes not only exposures based on far-ultraviolet rays, X-rays, and EUVs, such as bright-line spectra of mercury lamps and excimer lasers, but also electron beam, ion beam, etc., unless otherwise specified. The exposure of the particle beam.
In the present specification, "(meth)acrylate" means acrylate and methacrylate, "(meth)acrylic" means acrylic acid and methacrylic acid, and "(meth)acryloyl group" means propylene fluorenyl group and nail Acryl fluorenyl.
In this specification, the term "step" includes not only independent steps, but even if it cannot be clearly distinguished from other steps, it is included in the term as long as the desired effect of the step can be achieved.
In the present specification, the weight average molecular weight and the number average molecular weight are defined as polystyrene-converted values measured by gel permeation chromatography (GPC). In the present specification, for example, HLC-8220 (manufactured by TOSOH CORPORATION) is used as a measuring device, and TSKgel Super AWM-H (manufactured by TOSOH CORPORATION, 6.0 mm ID (inner diameter) × 15.0 cm) is used as a column, and used as an eluent. A 10 mmol/L lithium bromide NMP (N-methylpyrrolidone) solution was used to determine a weight average molecular weight (Mw) and a number average molecular weight (Mn).
In the present specification, the polymerizable compound means a compound having a polymerizable group, and may be a monomer or a polymer. The polymerizable group refers to a group related to the polymerization reaction.
In the present specification, the total solid content means the total mass of components other than the solvent from the entire composition.

在本說明書中的基團(原子團)的標記中,未標有經取代及未經取代之標記包含不具有取代基並且具有取代基之基團。例如,“烷基”不僅包含不具有取代基之烷基(未經取代之烷基),而且還包含具有取代基之烷基(經取代之烷基)。作為取代基,例如可舉出選自下述取代基群組T之基團。In the label of the group (atomic group) in the present specification, the label which is not labeled with a substitution and an unsubstituted includes a group which has no substituent and has a substituent. For example, "alkyl" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). The substituent may, for example, be a group selected from the group of substituents T described below.

(取代基T)
作為取代基T,可舉出鹵素原子、烷基、環烷基、烯基、環烯基、炔基、芳基、雜環基、氰基、羥基、硝基、羧基、烷氧基、芳氧基、矽氧基、雜環氧基、醯氧基、胺甲醯氧基、胺基(包含烷胺基及苯胺基)、醯胺基、胺基羰基胺基、烷氧基羰基胺基、芳氧基羰基胺基、胺磺醯基胺基、烷基或芳基磺醯基胺基、巰基、烷硫基、芳硫基、雜環硫基、胺磺醯基、磺基、烷基或芳基亞磺醯基、烷基或芳基磺醯基、醯基、芳基氧羰基、烷氧羰基、胺甲醯基、芳基或雜環偶氮基、醯亞胺基、膦基、氧膦基、氧膦基氧基、氧膦基胺基及甲矽烷基等。以下,對各基團進行詳述。
(substituent T)
Examples of the substituent T include a halogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group, an alkynyl group, an aryl group, a heterocyclic group, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkoxy group, and an aromatic group. Oxyl, decyloxy, heterocyclic oxy, decyloxy, amine methyl methoxy, amine (including alkylamino and anilino), decylamino, aminocarbonylamino, alkoxycarbonylamino , aryloxycarbonylamino, aminesulfonylamino, alkyl or arylsulfonylamino, fluorenyl, alkylthio, arylthio, heterocyclic thio, sulfonyl, sulfo, alkane Or arylsulfinyl, alkyl or arylsulfonyl, fluorenyl, aryloxycarbonyl, alkoxycarbonyl, aminemethanyl, aryl or heterocyclic azo, quinone imine, phosphine A group, a phosphinyl group, a phosphinyloxy group, a phosphinylamino group, a formyl group, and the like. Hereinafter, each group will be described in detail.

可舉出鹵素原子(例如、氟原子、氯原子、溴原子及碘原子)、
直鏈狀或支鏈狀的烷基(為直鏈狀或支鏈狀的、經取代或未經取代的烷基,較佳為碳數1~30的烷基。例如甲基、乙基、正丙基、異丙基、第三丁基、正辛基、2-氯乙基、2-氰基乙基及2-乙基己基等)、
環烷基(較佳為碳數3~30的經取代或未經取代的環烷基。環烷基可以為單環亦可以為多環。作為單環的環烷基,例如可舉出環己基及環戊基等。又,作為多環的環烷基,例如為雙環烷基(較佳為碳數5~30的經取代或未經取代的雙環烷基,具體而言,可舉出雙環[1,2,2]庚烷-2-基及雙環[2,2,2]辛烷-3-基等)及三環烷基等。作為環烷基,其中,單環的環烷基或雙環烷基為較佳,單環的環烷基為更佳。)、
A halogen atom (for example, a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom) may be mentioned.
a linear or branched alkyl group (which is a linear or branched, substituted or unsubstituted alkyl group, preferably an alkyl group having 1 to 30 carbon atoms. For example, methyl, ethyl, N-propyl, isopropyl, tert-butyl, n-octyl, 2-chloroethyl, 2-cyanoethyl and 2-ethylhexyl, etc.,
a cycloalkyl group (preferably a substituted or unsubstituted cycloalkyl group having 3 to 30 carbon atoms. The cycloalkyl group may be a single ring or a polycyclic ring. Examples of the monocyclic cycloalkyl group include a ring. Further, as the polycyclic cycloalkyl group, for example, a bicycloalkyl group (preferably a substituted or unsubstituted bicycloalkyl group having 5 to 30 carbon atoms), specifically, may be mentioned. Bicyclo[1,2,2]heptan-2-yl and bicyclo[2,2,2]octane-3-yl, etc., and tricycloalkyl, etc. as a cycloalkyl group, wherein a monocyclic naphthenic group A benzyl or bicycloalkyl group is preferred, and a monocyclic cycloalkyl group is more preferred.

直鏈狀或支鏈狀的烯基(為直鏈狀或支鏈狀的、經取代或未經取代的烯基,較佳為碳數2~30的烯基。例如乙烯基、烯丙基、異戊二烯基、香葉基及油烯基等)、
環烯基(較佳為碳數3~30的經取代或未經取代的環烯基。環烯基可以為單環亦可以為多環。作為單環的環烯基,例如可舉出2-環戊烯-1-基及2-環己烯-1-基。又,作為多環的環烯基,係雙環烯基(較佳為碳數5~30的經取代或未經取代的雙環烯基。具體而言,可舉出雙環[2,2,1]庚-2-烯-1-基及雙環[2,2,2]辛-2-烯-4-基等)及三環烯基等。作為環烯基,其中,單環的環烯基為較佳。)、
炔基(較佳為碳數2~30的經取代或未經取代的炔基。例如乙炔基、炔丙基及三甲基矽烷基乙炔基等)、
a linear or branched alkenyl group (which is a linear or branched, substituted or unsubstituted alkenyl group, preferably an alkenyl group having 2 to 30 carbon atoms. For example, a vinyl group, an allyl group , isoprenyl, geranyl and oleyl, etc.)
a cycloalkenyl group (preferably a substituted or unsubstituted cycloalkenyl group having 3 to 30 carbon atoms. The cycloalkenyl group may be a single ring or a polycyclic ring. Examples of the monocyclic cycloalkenyl group include 2 a cyclopenten-1-yl group and a 2-cyclohexen-1-yl group. Further, as a polycyclic cycloalkenyl group, a bicycloalkenyl group (preferably a substituted or unsubstituted carbon number of 5 to 30) Bicycloalkenyl. Specific examples thereof include bicyclo[2,2,1]hept-2-en-1-yl and bicyclo[2,2,2]oct-2-en-4-yl, etc., and A cycloalkenyl group or the like. As the cycloalkenyl group, a monocyclic cycloalkenyl group is preferred.)
An alkynyl group (preferably a substituted or unsubstituted alkynyl group having 2 to 30 carbon atoms, such as an ethynyl group, a propargyl group, a trimethyldecyl ethynyl group, etc.),

芳基(較佳為碳數6~30的經取代或未經取代的芳基。例如苯基、對甲苯基、萘基、間氯苯基、鄰十六醯胺基苯基、芘基、聯苯基及三苯基等)、
雜環基(雜環基可以為經取代或未經取代的脂環雜環基及芳香族雜環基中的任一個。又,脂環雜環基可以為飽和及不飽和中的任一個。又,雜環基可以為單環亦可以為縮環。作為雜環基,包含1個以上的選自包括氮原子、氧原子及硫原子之群組中之雜原子為較佳,碳數3~30的5員或6員的芳香族雜環基為更佳。例如可舉出2-呋喃基、2-噻吩基、2-吡啶基、4-吡啶基、2-嘧啶基及2-苯并噻唑基等。)、
氰基、羥基、硝基、羧基、
An aryl group (preferably a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, such as phenyl, p-tolyl, naphthyl, m-chlorophenyl, o-hexadecanoylphenyl, fluorenyl, Biphenyl and triphenyl, etc.)
The heterocyclic group (heterocyclic group may be any of a substituted or unsubstituted alicyclic heterocyclic group and an aromatic heterocyclic group. Further, the alicyclic heterocyclic group may be either saturated or unsaturated. Further, the heterocyclic group may be a monocyclic ring or a condensed ring. As the heterocyclic group, one or more hetero atoms selected from the group consisting of a nitrogen atom, an oxygen atom and a sulfur atom are preferred, and the carbon number is 3 The aromatic heterocyclic group of 5 or 6 members of ~30 is more preferable, and examples thereof include 2-furyl group, 2-thienyl group, 2-pyridyl group, 4-pyridyl group, 2-pyrimidinyl group and 2-benzene group. And thiazolyl, etc.),
Cyano, hydroxyl, nitro, carboxyl,

烷氧基(較佳為碳數1~30的經取代或未經取代的烷氧基。例如甲氧基、乙氧基、異丙氧基、第三丁氧基、正辛氧基及2-甲氧基乙氧基等)、
芳氧基(較佳為碳數6~30的經取代或未經取代的芳氧基。例如苯氧基、2-甲基苯氧基、2,4-二-第三戊基苯氧基、4-第三丁基苯氧基、3-硝基苯氧基及2-十四醯胺基苯氧基等)、
矽氧基(較佳為碳數3~20的矽氧基。例如三甲基矽烷基氧基及第三丁基二甲基矽氧基等)、
雜環氧基(較佳為碳數2~30的經取代或未經取代的雜環氧基。作為雜環氧基中的雜環基,可舉出從上述之雜環基去除了1個氫原子之2價的雜環基。作為雜環氧基,例如可舉出1-苯基四唑-5-氧基及2-四氫吡喃氧基等。)、
Alkoxy (preferably a substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms, such as methoxy, ethoxy, isopropoxy, tert-butoxy, n-octyloxy and 2 -methoxyethoxy, etc.),
An aryloxy group (preferably a substituted or unsubstituted aryloxy group having 6 to 30 carbon atoms), for example, a phenoxy group, a 2-methylphenoxy group, a 2,4-di-tripentylphenoxy group , 4-tert-butylphenoxy, 3-nitrophenoxy, 2-tetradecylaminophenoxy, etc.),
a decyloxy group (preferably a decyloxy group having 3 to 20 carbon atoms, such as a trimethyl decyloxy group and a tert-butyldimethyl methoxy group),
a heterocyclic oxy group (preferably a substituted or unsubstituted heterocyclic oxy group having 2 to 30 carbon atoms. As the heterocyclic group in the heterocyclic oxy group, one excluding the above heterocyclic group is mentioned a divalent heterocyclic group of a hydrogen atom. Examples of the heterocyclic oxy group include a 1-phenyltetrazole-5-oxy group and a 2-tetrahydropyranyloxy group.

醯氧基(較佳為、甲醯氧基、碳數2~30的經取代或未經取代的烷基羰氧基或碳數6~30的經取代或未經取代的芳基羰氧基。例如甲醯氧基、乙醯氧基、三甲基乙醯氧基、硬脂醯氧基、苯甲醯氧基、對甲氧基苯基羰氧基、丙烯醯氧基及丙烯醯氧基等)、
胺甲醯氧基(較佳為碳數1~30的經取代或未經取代的胺甲醯氧基。例如、N,N-二甲基胺甲醯氧基、N,N-二乙基胺甲醯氧基、嗎啉基羰氧基、N,N-二-正辛基胺基羰氧基及N-正辛基胺甲醯氧基等)、
烷氧基羰氧基(較佳為碳數2~30的經取代或未經取代烷氧基羰氧基。例如甲氧基羰氧基、乙氧基羰氧基、第三丁氧基羰氧基及正辛基羰氧基等)、
芳氧基羰氧基(較佳為碳數7~30的經取代或未經取代的芳氧基羰氧基。例如苯氧基羰氧基、對甲氧基苯氧基羰氧基及對正十六烷氧基苯氧基羰氧基等)、
a decyloxy group (preferably, a methyl methoxy group, a substituted or unsubstituted alkylcarbonyloxy group having 2 to 30 carbon atoms or a substituted or unsubstituted arylcarbonyloxy group having 6 to 30 carbon atoms. For example, methyl methoxy, ethoxylated, trimethyl ethoxylated, stearyloxy, benzyl methoxy, p-methoxyphenylcarbonyloxy, acryloxy and propylene oxide Base, etc.)
Aminomethyloxy (preferably a substituted or unsubstituted amine methyloxy group having 1 to 30 carbon atoms. For example, N,N-dimethylaminemethyl methoxy, N,N-diethyl Aminomethyloxy, morpholinylcarbonyloxy, N,N-di-n-octylaminocarbonyloxy and N-n-octylaminemethyloxy, etc.)
Alkoxycarbonyloxy group (preferably a substituted or unsubstituted alkoxycarbonyloxy group having 2 to 30 carbon atoms, such as a methoxycarbonyloxy group, an ethoxycarbonyloxy group, a third butoxycarbonyl group) Oxyl and n-octylcarbonyloxy, etc.)
An aryloxycarbonyloxy group (preferably a substituted or unsubstituted aryloxycarbonyloxy group having 7 to 30 carbon atoms, such as a phenoxycarbonyloxy group, a p-methoxyphenoxycarbonyloxy group, and a N-hexadecyloxyphenoxycarbonyloxy, etc.),

胺基(較佳為未經取代胺基、碳數1~30的經取代或未經取代的烷胺基、碳數6~30的經取代或未經取代的芳胺基或碳數0~30的雜環胺基。例如胺基、甲胺基、二甲胺基、苯胺基、N-甲基-苯胺基、二苯胺基及N-1,3,5-三𠯤-2-基胺基等)、
醯胺基(較佳為甲醯胺基、碳數1~30的經取代或未經取代的烷基羰基胺基或碳數6~30的經取代或未經取代的芳基羰基胺基。例如甲醯胺基、乙醯基胺基、新戊醯基胺基、月桂醯胺基、苯甲醯胺基、3,4,5-三-正辛氧基苯基羰基胺基、丙烯醯基胺基及甲基丙烯醯基胺基等)、
胺基羰基胺基(較佳為碳數1~30的經取代或未經取代的胺基羰基胺基。例如胺甲醯基胺基、N,N-二甲基胺基羰基胺基、N,N-二乙基胺基羰基胺基及嗎啉基羰基胺基等)、
烷氧基羰基胺基(較佳為碳數2~30的經取代或未經取代烷氧基羰基胺基。例如甲氧基羰基胺基、乙氧基羰基胺基、第三丁氧基羰基胺基、正十八烷氧基羰基胺基及N-甲基-甲氧基羰基胺基等)、
Amino group (preferably unsubstituted amino group, substituted or unsubstituted alkylamino group having 1 to 30 carbon atoms, substituted or unsubstituted arylamino group having 6 to 30 carbon atoms or carbon number 0 to a heterocyclic amino group of 30. For example, an amine group, a methylamino group, a dimethylamino group, an anilino group, an N-methyl-anilino group, a diphenylamino group, and an N-1,3,5-trian-2-ylamine Base, etc.)
Amidino group (preferably a formamidine group, a substituted or unsubstituted alkylcarbonylamino group having 1 to 30 carbon atoms or a substituted or unsubstituted arylcarbonylamino group having 6 to 30 carbon atoms. For example, amidoxime, etidylamino, neopentylamino, laurylamine, benzamidine, 3,4,5-tri-n-octyloxyphenylcarbonylamino, propylene oxime Amino group and methacrylamide group, etc.)
Aminocarbonylamino group (preferably a substituted or unsubstituted aminocarbonylamino group having 1 to 30 carbon atoms. For example, an aminomethylamino group, N,N-dimethylaminocarbonylamino group, N , N-diethylaminocarbonylamino group and morpholinylcarbonylamino group, etc.)
An alkoxycarbonylamino group (preferably a substituted or unsubstituted alkoxycarbonylamino group having 2 to 30 carbon atoms, such as a methoxycarbonylamino group, an ethoxycarbonylamino group, a third butoxycarbonyl group) Amino group, n-octadecyloxycarbonylamino group, N-methyl-methoxycarbonylamino group, etc.)

芳氧基羰基胺基(較佳為碳數7~30的經取代或未經取代的芳氧基羰基胺基。例如苯氧基羰基胺基、對氯苯氧基羰基胺基及間正辛氧基苯氧基羰基胺基等)、
胺磺醯基胺基(較佳為碳數0~30的經取代或未經取代的胺磺醯基胺基。例如胺磺醯基胺基、N,N-二甲基胺基磺醯基胺基及N-正辛基胺基磺醯基胺基等)、
烷基或芳基磺醯基胺基(較佳為碳數1~30的經取代或未經取代的烷基磺醯基胺基或碳數6~30的經取代或未經取代的芳基磺醯基胺基。例如甲基磺醯基胺基、丁基磺醯基胺基、苯基磺醯基胺基、2,3,5-三氯苯基磺醯基胺基及對甲基苯基磺醯基胺基等)、
巰基、
An aryloxycarbonylamino group (preferably a substituted or unsubstituted aryloxycarbonylamino group having 7 to 30 carbon atoms, such as a phenoxycarbonylamino group, a p-chlorophenoxycarbonylamino group and a meta-n-octane group; Oxyphenoxycarbonylamino group, etc.)
Aminesulfonylamino group (preferably a substituted or unsubstituted amine sulfonylamino group having a carbon number of 0 to 30. For example, an aminesulfonylamino group, an N,N-dimethylaminosulfonyl group Amino group and N-n-octylaminosulfonylamino group, etc.)
An alkyl or arylsulfonylamino group (preferably a substituted or unsubstituted alkylsulfonylamino group having 1 to 30 carbon atoms or a substituted or unsubstituted aryl group having 6 to 30 carbon atoms Sulfhydrylamino group, such as methylsulfonylamino, butylsulfonylamino, phenylsulfonylamino, 2,3,5-trichlorophenylsulfonylamino and p-methyl Phenylsulfonylamino group, etc.)
巯基,

烷硫基(較佳為碳數1~30的經取代或未經取代的烷硫基。例如甲硫基、乙硫基及正十六烷硫基等)、
芳硫基(較佳為碳數6~30的經取代或未經取代的芳硫基。例如苯硫基、對氯苯硫基及間甲氧基苯硫基等)、
雜環硫基(較佳為碳數2~30的經取代或未經取代的雜環硫基。作為雜環硫基中的雜環基,可舉出從上述之雜環基去除了1個氫原子之2價的雜環基。作為雜環硫基,例如可舉出2-苯并噻唑硫基及1-苯基四唑-5-基硫基。)、
胺磺醯基(較佳為碳數0~30的經取代或未經取代的胺磺醯基。例如N-乙基胺磺醯基、N-(3-十二烷氧基丙基)胺磺醯基、N,N-二甲基胺磺醯基、N-乙醯基胺磺醯基、N-苯甲醯胺磺醯基及N-(N’-苯基胺甲醯基)胺磺醯基等)、
磺基、
An alkylthio group (preferably a substituted or unsubstituted alkylthio group having 1 to 30 carbon atoms, such as a methylthio group, an ethylthio group, an n-hexadecylthio group, etc.),
An arylthio group (preferably a substituted or unsubstituted arylthio group having 6 to 30 carbon atoms, such as a phenylthio group, a p-chlorophenylthio group, a m-methoxyphenylthio group, etc.),
a heterocyclic thio group (preferably a substituted or unsubstituted heterocyclic thio group having 2 to 30 carbon atoms. The heterocyclic group in the heterocyclic thio group may be one removed from the above heterocyclic group. a divalent heterocyclic group of a hydrogen atom. Examples of the heterocyclic thio group include a 2-benzothiazolylthio group and a 1-phenyltetrazol-5-ylthio group.
Aminesulfonyl (preferably a substituted or unsubstituted sulfonyl group having a carbon number of 0 to 30. For example, N-ethylaminesulfonyl, N-(3-dodecyloxypropyl)amine Sulfonyl, N,N-dimethylaminesulfonyl, N-acetamimidoxime, N-benzamidesulfonyl and N-(N'-phenylaminecarbamyl)amine Sulfonyl group, etc.)
Sulfo,

烷基或芳基亞磺醯基(較佳為碳數1~30的經取代或未經取代的烷基亞磺醯基或6~30的經取代或未經取代的芳基亞磺醯基。例如甲基亞磺醯基、乙基亞磺醯基、苯基亞磺醯基及對甲基苯基亞磺醯基等)、
烷基或芳基磺醯基(較佳為碳數1~30的經取代或未經取代的烷基磺醯基或碳數6~30的經取代或未經取代的芳基磺醯基。例如甲基磺醯基、乙基磺醯基、苯基磺醯基及對甲基苯基磺醯基等)、
醯基(較佳為甲醯基、碳數2~30的經取代或未經取代的烷基羰基或碳數7~30的經取代或未經取代的芳基羰基。例如乙醯基、三甲基乙醯基、2-氯乙醯基、硬脂醯基、苯甲醯基、對正辛氧基苯基羰基、丙烯醯基及甲基丙烯醯基等)、
芳基氧羰基(較佳為碳數7~30的經取代或未經取代的芳基氧羰基。例如苯氧基羰基、鄰氯苯氧基羰基、間硝基苯氧基羰基及對第三丁基苯氧基羰基等)、
An alkyl or arylsulfinyl group (preferably a substituted or unsubstituted alkylsulfinyl group having 1 to 30 carbon atoms or a substituted or unsubstituted arylsulfinyl group of 6 to 30) For example, methylsulfinyl, ethylsulfinyl, phenylsulfinyl and p-methylphenylsulfinyl, etc.,
An alkyl or arylsulfonyl group (preferably a substituted or unsubstituted alkylsulfonyl group having 1 to 30 carbon atoms or a substituted or unsubstituted arylsulfonyl group having 6 to 30 carbon atoms. For example, methylsulfonyl, ethylsulfonyl, phenylsulfonyl and p-methylphenylsulfonyl, etc.,
Mercapto group (preferably a mercapto group, a substituted or unsubstituted alkylcarbonyl group having 2 to 30 carbon atoms or a substituted or unsubstituted arylcarbonyl group having 7 to 30 carbon atoms. For example, an acetamino group, a methyl ethyl fluorenyl group, a 2-chloroethyl fluorenyl group, a stearyl sulfonyl group, a benzhydryl group, a p-octyloxyphenylcarbonyl group, an acryl fluorenyl group, a methacryl fluorenyl group, etc.)
An aryloxycarbonyl group (preferably a substituted or unsubstituted aryloxycarbonyl group having 7 to 30 carbon atoms, such as a phenoxycarbonyl group, an o-chlorophenoxycarbonyl group, a m-nitrophenoxycarbonyl group, and a third group) Butylphenoxycarbonyl, etc.)

烷氧羰基(較佳為碳數2~30的經取代或未經取代烷氧羰基。例如甲氧基羰基、乙氧基羰基、第三丁氧基羰基及正十八烷氧基羰基等)、
胺甲醯基(較佳為碳數1~30的經取代或未經取代的胺甲醯基。例如胺甲醯基、N-甲基胺甲醯基、N,N-二甲基胺甲醯基、N,N-二-正辛基胺甲醯基及N-(甲基磺醯基)胺甲醯基等)、
芳基或雜環偶氮基(較佳為碳數6~30的經取代或未經取代的芳基偶氮基或碳數3~30的經取代或未經取代的雜環偶氮基(作為雜環偶氮基中的雜環基,可舉出從上述之雜環基去除了1個氫原子之2價的雜環基)。例如苯基偶氮基、對氯苯基偶氮基及5-乙硫基-1,3,4-噻二唑-2-基偶氮基等)、
醯亞胺基(較佳為碳數2~30的經取代或未經取代的醯亞胺基。例如N-琥珀醯亞胺基及N-鄰苯二甲醯亞胺基等)、
膦基(較佳為碳數2~30的經取代或未經取代的膦基。例如二甲基膦基、二苯基膦基及甲基苯氧基膦基等)、
氧膦基(較佳為碳數2~30的經取代或未經取代的氧膦基。例如氧膦基、二辛氧基氧膦基及二乙氧基氧膦基等)、
An alkoxycarbonyl group (preferably a substituted or unsubstituted alkoxycarbonyl group having 2 to 30 carbon atoms, such as a methoxycarbonyl group, an ethoxycarbonyl group, a tert-butoxycarbonyl group, an n-octadecyloxycarbonyl group, etc.) ,
Aminomethyl thiol (preferably a substituted or unsubstituted amine carbenyl group having 1 to 30 carbon atoms), for example, an amine methyl sulfhydryl group, an N-methyl amine methyl fluorenyl group, and an N,N-dimethylamine group Anthracenyl, N,N-di-n-octylamine methyl sulfhydryl and N-(methylsulfonyl)amine methyl sulfhydryl, etc.
An aryl or heterocyclic azo group (preferably a substituted or unsubstituted arylazo group having 6 to 30 carbon atoms or a substituted or unsubstituted heterocyclic azo group having 3 to 30 carbon atoms ( Examples of the heterocyclic group in the heterocyclic azo group include a divalent heterocyclic group in which one hydrogen atom is removed from the above heterocyclic group. For example, a phenylazo group or a p-chlorophenylazo group. And 5-ethylthio-1,3,4-thiadiazol-2-ylazo, etc.),
a quinone imine group (preferably a substituted or unsubstituted quinone imine group having 2 to 30 carbon atoms, such as N-succinimide group and N-phthalimido group, etc.),
a phosphino group (preferably a substituted or unsubstituted phosphino group having 2 to 30 carbon atoms, such as a dimethylphosphino group, a diphenylphosphino group, a methylphenoxyphosphino group, etc.),
a phosphinyl group (preferably a substituted or unsubstituted phosphinyl group having 2 to 30 carbon atoms, such as a phosphinyl group, a dioctyloxyphosphinyl group, a diethoxyphosphinyl group, etc.),

氧膦基氧基(較佳為碳數2~30的經取代或未經取代的氧膦基氧基。例如二苯氧基氧膦基氧基及二辛氧基氧膦基氧基等)、
氧膦基胺基(較佳為碳數2~30的經取代或未經取代的氧膦基胺基。例如二甲氧基氧膦基胺基及二甲基胺基氧膦基胺基等)及
甲矽烷基(較佳為碳數3~30的經取代或未經取代的甲矽烷基。例如三甲基矽烷基、第三丁基二甲基甲矽烷基及苯基二甲基甲矽烷基等)。
a phosphinyloxy group (preferably a substituted or unsubstituted phosphinyloxy group having 2 to 30 carbon atoms, such as a diphenoxyphosphinyloxy group and a dioctyloxyphosphinyloxy group) ,
a phosphinylamino group (preferably a substituted or unsubstituted phosphinylamino group having 2 to 30 carbon atoms, such as a dimethoxyphosphinylamino group and a dimethylaminophosphinylamino group; And a germyl group (preferably a substituted or unsubstituted carboxyalkyl group having a carbon number of 3 to 30. For example, trimethyldecyl, tert-butyldimethylformamidin, and phenyldimethylmethyl)矽 alkyl, etc.).

在上述官能基中,具有氫原子者的官能基中的氫原子的部分可以被上述任一基團取代。作為能夠作為取代基導入的官能基的例,可舉出烷基羰基胺基磺醯基(例如乙醯基胺基磺醯基等)、芳基羰基胺基磺醯基(例如苯甲醯胺基磺醯基等)、烷基磺醯基胺基羰基(例如甲基磺醯基胺基羰基等)及芳基磺醯基胺基羰基(例如對甲基苯基磺醯基胺基羰基等)等。In the above functional group, a portion of a hydrogen atom in a functional group having a hydrogen atom may be substituted with any of the above groups. Examples of the functional group which can be introduced as a substituent include an alkylcarbonylaminosulfonyl group (for example, an ethyl sulfonylsulfonyl group) and an arylcarbonylaminosulfonyl group (for example, benzamide). An alkylsulfonylaminocarbonyl group (for example, a methylsulfonylaminocarbonyl group) and an arylsulfonylaminocarbonyl group (for example, a p-methylphenylsulfonylaminocarbonyl group, etc.) )Wait.

〔組成物〕
本發明的組成物包括:樹脂,包含由後述之通式(I-1)表示之重複單元或由後述之通式(I-2)表示之重複單元;溶劑;以及特定金屬離子,選自包括鈉離子、鉀離子及鈣離子之群組,上述特定金屬離子的總含量相對於組成物總質量為0.01~30質量ppm。
[composition]
The composition of the present invention includes a resin comprising a repeating unit represented by the following formula (I-1) or a repeating unit represented by the following formula (I-2); a solvent; and a specific metal ion selected from the group consisting of In the group of sodium ions, potassium ions, and calcium ions, the total content of the specific metal ions is 0.01 to 30 ppm by mass based on the total mass of the composition.

作為上述組成物的特徵點,可舉出併用包含由後述之通式(I-1)表示之重複單元或由後述之通式(I-2)表示之重複單元之樹脂(以下,亦稱為“特定三𠯤系樹脂”)及規定含量的特定金屬離子。
以三𠯤系樹脂為代表之顯示高折射率性之材料因其分子間相互作用而締合且容易形成聚集體。此次,本發明人等對包含上述聚集體之硬化膜進行了研究之結果,發現了若上述硬化膜在高溫-低溫環境下反覆曝光,則容易產生微相分離(聚集部分與非聚集部分的相分離),由於該微相分離,硬化膜的缺陷增加。
本發明人等依據上述見解進一步進行了研究之結果,已知了藉由摻合特定三𠯤系樹脂及規定含量的特定金屬離子之組成物所形成之硬化膜難以產生微相分離,其結果,上述硬化膜在高溫-低溫環境下反覆曝光之後亦可以抑制缺陷產生。
上述作用機制雖不明確,但是可推測由於上述特定金屬離子容易與特定三𠯤系樹脂中的氮原子等產生離子相互作用,藉由組成物形成塗佈膜之過程中抑制特定三𠯤系樹脂的締合。另一方面,若組成物中的上述特定金屬離子的含量過多,則藉由組成物形成塗佈膜之過程中,上述特定金屬離子與特定三𠯤系樹脂容易絡合,因此容易產生硬化膜的微相分離(絡合部分與非絡合部分的相分離)。尤其,若硬化膜在高溫-低溫環境下反覆曝光,則進而進行體系內的上述特定金屬離子與特定三𠯤系樹脂的絡合,微相分離的產生量更加增加。該結果,在高溫-低溫環境下反覆曝光之硬化膜的缺陷增加。
本發明人等已知有,組成物中,上述特定金屬離子的總含量相對於組成物總質量為0.01~30質量ppm之情況下,可抑制特定三𠯤系樹脂的締合及特定三𠯤系樹脂與特定金屬離子的絡合,所得到之硬化膜在高溫-低溫環境下反覆曝光之後亦可以抑制缺陷產生。又,還確認到上述硬化膜在高溫-低溫環境下反覆曝光之後,分光變動(透射率的變化)減少。
The characteristic point of the above-mentioned composition is a resin containing a repeating unit represented by the formula (I-1) described later or a repeating unit represented by the formula (I-2) described later (hereinafter also referred to as "Specific triterpenoid resin") and a specified amount of a specific metal ion.
A material exhibiting high refractive index, represented by a triterpenoid resin, is associated by intermolecular interaction and is easy to form aggregates. The inventors of the present invention have studied the cured film containing the above aggregates, and found that if the cured film is repeatedly exposed in a high-temperature-low temperature environment, microphase separation (aggregation and non-aggregation) is likely to occur. Phase separation), due to the microphase separation, the defects of the cured film increase.
As a result of further research conducted by the present inventors based on the above findings, it is known that it is difficult to cause microphase separation by a cured film formed by blending a specific tricreide resin and a composition of a specific metal ion having a predetermined content, and as a result, The above-mentioned cured film can also suppress the occurrence of defects after repeated exposure in a high-temperature-low temperature environment.
Although the above-described mechanism of action is not clear, it is presumed that since the specific metal ion easily interacts with a nitrogen atom or the like in a specific tricreide resin, the specific triterpene resin is inhibited during formation of the coating film by the composition. Association. On the other hand, when the content of the specific metal ion in the composition is too large, the specific metal ion and the specific tricreide-based resin are easily complexed during the formation of the coating film by the composition, so that the cured film is likely to be generated. Microphase separation (phase separation of the complexed moiety from the non-complexed moiety). In particular, when the cured film is repeatedly exposed to a high-temperature-low temperature environment, the specific metal ions in the system are further complexed with the specific tricreide-based resin, and the amount of microphase separation is further increased. As a result, defects in the cured film which are repeatedly exposed in a high-temperature-low temperature environment increase.
The present inventors have known that in the composition, when the total content of the specific metal ions is 0.01 to 30 ppm by mass based on the total mass of the composition, the association of the specific triterpenoid resin and the specific triterpenoid can be suppressed. When the resin is complexed with a specific metal ion, the resulting cured film can also suppress the occurrence of defects after repeated exposure in a high-temperature environment. Further, it was confirmed that the above-mentioned cured film was repeatedly exposed to exposure in a high-temperature-low temperature environment, and the spectral variation (change in transmittance) was reduced.

另外,上述組成物包含甲苯作為溶劑,上述甲苯的含量相對於組成物總質量為0.001~10質量ppm之情況下,藉由組成物形成之塗佈膜的表面外觀優異。該作用機制雖不明確,但是可推測為甲苯對特定三𠯤系樹脂的相溶性帶來影響。In addition, when the composition contains toluene as a solvent and the content of the toluene is 0.001 to 10 ppm by mass based on the total mass of the composition, the surface of the coating film formed of the composition is excellent in appearance. Although this mechanism of action is not clear, it is presumed that toluene affects the compatibility of a specific triterpene resin.

以下,對上述組成物中所包含之各成分進行詳述。Hereinafter, each component contained in the above composition will be described in detail.

<特定三𠯤系樹脂>
上述組成物包括包含由通式(I-1)表示之重複單元或由通式(I-2)表示之重複單元之樹脂(特定三𠯤系樹脂)。
(由通式(I-1)表示之重複單元)
<Specific triterpenoid resin>
The above composition includes a resin (specific triterpenoid resin) containing a repeating unit represented by the formula (I-1) or a repeating unit represented by the formula (I-2).
(repeating unit represented by the general formula (I-1))

[化學式1]
[Chemical Formula 1]

通式(I-1)中,X1 、X2 及X3 分別獨立地表示-NR1 -、-O-或-S-。
從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面及在高溫-低溫環境下反覆曝光亦可以減少硬化膜的分光變動之方面考慮,作為X1 、X2 及X3 ,-NR1 -為較佳。
In the formula (I-1), X 1 , X 2 and X 3 each independently represent -NR 1 -, -O- or -S-.
The refractive index of the cured film after repeated exposure in a high-temperature-low temperature environment and the repeated exposure in a high-temperature-low temperature environment can also reduce the spectral variation of the cured film as X 1 , X 2 and X 3 . , -NR 1 - is preferred.

R1 表示氫原子或取代基。
作為由R1 表示之取代基並無特別限制,但是例如可舉出以上述之取代基群組T例示之基團,其中,烷基或芳基為較佳。
作為由R1 表示之烷基(可以為直鏈狀、支鏈狀及環狀中的任一個)並無特別限制,但是例如可舉出碳數1~10的烷基,碳數1~6的烷基為較佳,碳數1~3的烷基為更佳。又,作為由R1 表示之芳基並無特別限制,但是例如可舉出苯基等。
作為R1 ,其中,氫原子或碳數1~3的烷基為較佳,氫原子為更佳。
又,由R1 表示之烷基及芳基可以具有取代基(例如以取代基群組T例示之基團)。
R 1 represents a hydrogen atom or a substituent.
The substituent represented by R 1 is not particularly limited, and examples thereof include a group exemplified by the above-mentioned substituent group T, and an alkyl group or an aryl group is preferred.
The alkyl group represented by R 1 (which may be linear, branched or cyclic) is not particularly limited, and examples thereof include an alkyl group having 1 to 10 carbon atoms and a carbon number of 1 to 6 carbon atoms. The alkyl group is preferably an alkyl group having 1 to 3 carbon atoms. Further, the aryl group represented by R 1 is not particularly limited, and examples thereof include a phenyl group and the like.
R 1 is preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, more preferably a hydrogen atom.
Further, the alkyl group and the aryl group represented by R 1 may have a substituent (for example, a group exemplified by the substituent group T).

W1 表示2價的連接基。
作為由W1 表示之2價的連接基並無特別限制,但是例如可舉出-O-、-CO-、-S-、-SO2 -、-NRA -、伸芳基、伸烷基、雜伸芳基及包括該等組合之基團。伸烷基亦可以被鹵素原子等取代基(例如以取代基群組T例示之基團)取代。
W 1 represents a divalent linking group.
The divalent linking group represented by W 1 is not particularly limited, and examples thereof include -O-, -CO-, -S-, -SO 2 -, -NR A -, an extended aryl group, and an alkylene group. , heteroaryl groups and groups comprising the combinations. The alkylene group may also be substituted with a substituent such as a halogen atom (for example, a group exemplified by the substituent group T).

上述伸芳基的碳數並無特別限制,但是例如係6~20為較佳,6~14為更佳,6~10為進一步較佳。作為上述伸芳基,具體而言,可舉出1,4-伸苯基、1,3-伸苯基、1,4-伸萘基、1,5-伸萘基、2,7-芴基、3,6-芴基、9,9-芴基及蒽基等,1,4-伸苯基為較佳。
上述伸芳基可以具有取代基(例如以取代基群組T例示之基團)。
The carbon number of the above aryl group is not particularly limited, but is preferably 6 to 20, more preferably 6 to 14, and still more preferably 6 to 10. Specific examples of the above-mentioned aryl group include a 1,4-phenylene group, a 1,3-phenylene group, a 1,4-naphthyl group, a 1,5-anthranyl group, and a 2,7-fluorene group. The 1,4-phenylene group is preferably a group, a 3,6-fluorenyl group, a 9,9-fluorenyl group and a fluorenyl group.
The above aryl group may have a substituent (for example, a group exemplified by the substituent group T).

上述RA 表示氫原子或取代基,氫原子為較佳。
作為由上述RA 表示之取代基,與由上述R1 表示之取代基的含義相同。
The above R A represents a hydrogen atom or a substituent, and a hydrogen atom is preferred.
The substituent represented by the above R A has the same meaning as the substituent represented by the above R 1 .

從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面及在高溫-低溫環境下反覆曝光亦可以減少硬化膜的分光變動之方面考慮,作為由W1 表示之2價的連接基,由下述通式(III)表示之2價的連接基為較佳。The refractive index of the cured film after repeated exposure in a high-temperature-low temperature environment is more excellent, and the repeated exposure in a high-temperature-low temperature environment can also reduce the spectral variation of the cured film, and is considered to be a valence of W 1 . The linking group is preferably a divalent linking group represented by the following formula (III).

[化學式2]
[Chemical Formula 2]

通式(III)中,A1 及A3 分別獨立地表示單鍵或伸芳基,A1 及A3 中的至少一者表示伸芳基。A2 表示單鍵、-O-、CO-、-S-、-SO2 -、-NRA -或伸芳基。RA 表示氫原子或取代基。*表示鍵結位置。In the formula (III), A 1 and A 3 each independently represent a single bond or an extended aryl group, and at least one of A 1 and A 3 represents an extended aryl group. A 2 represents a single bond, -O-, CO-, -S-, -SO 2 -, -NR A - or an extended aryl group. R A represents a hydrogen atom or a substituent. * indicates the bonding position.

另外,關於由A1 、A2 及A3 表示之伸芳基及RA 的具體的態樣如上所述。
其中,作為由A1 ~A3 表示之伸芳基,1,4-伸苯基為較佳。
Further, specific examples of the exoaryl group and R A represented by A 1 , A 2 and A 3 are as described above.
Among them, as the extended aryl group represented by A 1 to A 3 , 1,4-phenylene is preferred.

以下示出由上述通式(III)表示之基團的具體例,但是並不限定於此。Specific examples of the group represented by the above formula (III) are shown below, but are not limited thereto.

[化學式3]
[Chemical Formula 3]

[化學式4]
[Chemical Formula 4]

V表示烷基、芳基或雜環基。
作為由V表示之烷基(可以為直鏈狀、支鏈狀及環狀中的任一個)並無特別限制,但是例如可舉出碳數1~10的烷基,碳數1~6的烷基為更佳,碳數1~3的烷基為進一步較佳。
作為由V表示之芳基,例如可舉出6~10員環或包括其縮合環之芳基。
作為構成芳基之環的具體例並無特別限制,但是例如可舉出苯環、萘環、蒽環、菲環、聯三伸苯(triphenylene)環、芘環及並四苯環等,苯環或萘環為較佳,苯環為更佳。另外,上述環藉由去除1個環上的氫原子來構成芳基。
作為由V表示之雜環基並無特別限制,例如可舉出脂肪族雜環基及芳香族雜環基。另外,作為脂肪族雜環,可舉出5員環、6員環或7員環或其縮合環。又,作為芳香族雜環,可舉出5員環、6員環或7員環或其縮合環。
另外,上述縮合環中,亦可以包含除了苯環等雜環基以外的環。
V represents an alkyl group, an aryl group or a heterocyclic group.
The alkyl group represented by V (which may be linear, branched or cyclic) is not particularly limited, and examples thereof include an alkyl group having 1 to 10 carbon atoms and a carbon number of 1 to 6. More preferably, the alkyl group is more preferably an alkyl group having 1 to 3 carbon atoms.
The aryl group represented by V may, for example, be a 6 to 10 membered ring or an aryl group including a condensed ring thereof.
Specific examples of the ring constituting the aryl group are not particularly limited, and examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a triphenylene ring, an anthracene ring, and a naphthacene ring. A ring or a naphthalene ring is preferred, and a benzene ring is more preferred. Further, the above ring forms an aryl group by removing a hydrogen atom on one ring.
The heterocyclic group represented by V is not particularly limited, and examples thereof include an aliphatic heterocyclic group and an aromatic heterocyclic group. Further, examples of the aliphatic heterocyclic ring include a 5-membered ring, a 6-membered ring, and a 7-membered ring or a condensed ring thereof. Further, examples of the aromatic heterocyclic ring include a 5-membered ring, a 6-membered ring, and a 7-membered ring or a condensed ring thereof.
Further, the condensed ring may contain a ring other than a heterocyclic group such as a benzene ring.

作為上述脂肪族雜環基所包含之雜原子,例如可舉出氮原子、氧原子及硫原子。脂肪族雜環的碳數並無特別限制,但是3~20為較佳。
作為上述脂肪族雜環的具體例並無特別限制,但是例如可舉出氧戊環、噁烷環、哌啶環及哌𠯤環等。另外,上述脂肪族雜環藉由去除1個環上的氫原子來構成脂肪族雜環基。
Examples of the hetero atom contained in the aliphatic heterocyclic group include a nitrogen atom, an oxygen atom, and a sulfur atom. The carbon number of the aliphatic heterocyclic ring is not particularly limited, but 3 to 20 is preferred.
Specific examples of the aliphatic heterocyclic ring are not particularly limited, and examples thereof include an oxylanyl ring, an oxane ring, a piperidine ring, and a piperidine ring. Further, the above aliphatic heterocyclic ring constitutes an aliphatic heterocyclic group by removing a hydrogen atom on one ring.

作為上述芳香族雜環基所包含之雜原子,例如可舉出氮原子、氧原子及硫原子。芳香族雜環基的碳數並無特別限制,但是3~20為較佳。
作為上述芳香族雜環的具體例並無特別限制,但是可舉出呋喃環、噻吩環、吡咯環、口咢唑環、異口咢唑環、口咢二唑環、噻唑環、異噻唑環、噻二唑環、咪唑環、吡唑環、三唑環、呋咱環、四唑環、吡啶環、嗒𠯤環、嘧啶環、吡𠯤環、三𠯤環、四嗪環、苯并呋喃環、異苯并呋喃環、苯并噻吩環、吲哚環、吲哚啉環、異吲哚環、苯并㗁唑環、苯并噻唑環、吲唑環、苯并咪唑環、喹啉環、異喹啉環、噌啉環、酞嗪環、喹唑啉環、喹咢啉環、二苯并呋喃環、二苯并噻吩環、咔唑環、吖啶環、啡啶環、啡啉環、啡嗪環、萘啶環、嘌呤環及蝶啶基環等。另外,上述芳香族雜環藉由去除1個環上的氫原子來構成芳香族雜環基。
Examples of the hetero atom contained in the aromatic heterocyclic group include a nitrogen atom, an oxygen atom, and a sulfur atom. The carbon number of the aromatic heterocyclic group is not particularly limited, but 3 to 20 is preferred.
Specific examples of the aromatic heterocyclic ring are not particularly limited, and examples thereof include a furan ring, a thiophene ring, a pyrrole ring, an orthoazole ring, an iso-oxazole ring, a oxadiazole ring, a thiazole ring, and an isothiazole ring. , thiadiazole ring, imidazole ring, pyrazole ring, triazole ring, furazan ring, tetrazole ring, pyridine ring, anthracene ring, pyrimidine ring, pyridinium ring, triterpene ring, tetrazine ring, benzofuran Ring, isobenzofuran ring, benzothiophene ring, anthracene ring, porphyrin ring, isoindole ring, benzoxazole ring, benzothiazole ring, indazole ring, benzimidazole ring, quinoline ring , isoquinoline ring, porphyrin ring, pyridazine ring, quinazoline ring, quinoxaline ring, dibenzofuran ring, dibenzothiophene ring, indazole ring, acridine ring, pyridine ring, phenanthroline Ring, phenazine ring, naphthyridine ring, anthracene ring and pteridine ring. Further, the aromatic heterocyclic ring constitutes an aromatic heterocyclic group by removing a hydrogen atom in one ring.

由V表示之烷基、芳基及雜環基亦可以具有取代基(例如以取代基群組T例示之基團)。The alkyl group, the aryl group and the heterocyclic group represented by V may have a substituent (for example, a group exemplified by the substituent group T).

從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面考慮,作為上述V,具有取代基之芳基為較佳,其中,由下述通式(II)表示之基團為更佳。In view of the fact that the refractive index of the cured film after the reverse exposure in the high-temperature-low temperature environment is more excellent, the aryl group having a substituent is preferable as the above-mentioned V, and the group represented by the following formula (II) is preferable. For better.

[化學式5]
[Chemical Formula 5]

通式(II)中,*表示與通式(I-1)中的X3 的鍵結位置。
R3 表示取代基。其中,作為R3 ,氰基、硝基、烷基、烷硫基或鹵素原子為較佳。
作為由R3 表示之烷基(可以為直鏈狀、支鏈狀及環狀中的任一個)並無特別限制,但是例如可舉出碳數1~10的烷基,碳數1~6的烷基為更佳,碳數1~3的烷基為進一步較佳。
作為由R3 表示之鹵素原子,可舉出氟原子、氯原子、溴原子及碘原子等。
作為由R3 表示之烷硫基並無特別限制,但是例如可舉出碳數1~10的烷硫基,碳數1~6的烷硫基為更佳,碳數1~3的烷硫基為進一步較佳。另外,烷硫基中的伸烷基可以為直鏈狀、支鏈狀及環狀中的任一個。
另外,由R3 表示之烷基及烷硫基還可以具有取代基(例如以取代基群組T例示之基團)。
In the formula (II), * represents a bonding position with X 3 in the formula (I-1).
R 3 represents a substituent. Among them, as R 3 , a cyano group, a nitro group, an alkyl group, an alkylthio group or a halogen atom is preferred.
The alkyl group represented by R 3 (which may be any of a linear chain, a branched chain, and a cyclic group) is not particularly limited, and examples thereof include an alkyl group having 1 to 10 carbon atoms and a carbon number of 1 to 6 carbon atoms. The alkyl group is more preferably an alkyl group having 1 to 3 carbon atoms is further preferred.
Examples of the halogen atom represented by R 3 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
The alkylthio group represented by R 3 is not particularly limited, and examples thereof include an alkylthio group having 1 to 10 carbon atoms, an alkylthio group having 1 to 6 carbon atoms, and more preferably an alkylsulfide having 1 to 3 carbon atoms. The base is further preferred. Further, the alkylene group in the alkylthio group may be any of a linear chain, a branched chain, and a cyclic chain.
Further, the alkyl group and the alkylthio group represented by R 3 may further have a substituent (for example, a group exemplified by the substituent group T).

從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面考慮,作為R3 ,氰基為較佳。From the viewpoint of more excellent refractive index of the cured film after repeated exposure in a high-temperature-low temperature environment, a cyano group is preferable as R 3 .

R4 表示取代基。其中,作為R4 ,芳基、雜環基、氰基、硝基、烷基、烷硫基或鹵素原子為較佳。
作為由R4 表示之芳基及雜環基,與由上述V表示之芳基及雜環基的含義相同。作為由R4 表示之芳基,苯基為較佳。
作為由R4 表示之烷基、烷硫基及鹵素原子,與由上述R3 表示之烷基、烷硫基及鹵素原子的含義相同,較佳的態樣亦相同。
從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面考慮,作為R4 ,芳基、氰基、硝基或鹵素原子為較佳。
R 4 represents a substituent. Among them, R 4 , an aryl group, a heterocyclic group, a cyano group, a nitro group, an alkyl group, an alkylthio group or a halogen atom is preferred.
The aryl group and the heterocyclic group represented by R 4 have the same meanings as the aryl group and the heterocyclic group represented by the above V. As the aryl group represented by R 4 , a phenyl group is preferred.
The alkyl group, the alkylthio group and the halogen atom represented by R 4 have the same meanings as the alkyl group, the alkylthio group and the halogen atom represented by the above R 3 , and the preferred embodiment is also the same.
From the viewpoint of more excellent refractive index of the cured film after repeated exposure in a high-temperature-low temperature environment, as R 4 , an aryl group, a cyano group, a nitro group or a halogen atom is preferred.

m及n分別獨立地表示0~5的整數。但是,m+n為1~5。
從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面考慮,m係0為較佳,n係1為更佳。
m and n each independently represent an integer of 0 to 5. However, m+n is 1 to 5.
From the viewpoint of more excellent refractive index of the cured film after repeated exposure in a high-temperature-low temperature environment, m-based 0 is preferable, and n-based 1 is more preferable.

作為由上述通式(II)表示之基團,其中,從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面考慮,由下述通式(IIA)表示之基團為較佳。In the group represented by the above formula (II), the group represented by the following formula (IIA) is considered to be more excellent in the refractive index of the cured film after the reverse exposure in a high-temperature-low temperature environment. Preferably.

[化學式6]
[Chemical Formula 6]

通式(IIA)中,*表示與通式(I-1)中的X3 的鍵結位置。
通式(IIA)中,R4 與通式(II)中的R4 的含義相同,較佳的態樣亦相同。
作為R4 ,其中,R4 所取代之苯基中,相對於與上述苯基相鄰之伸苯基的鍵結位置位於對位為較佳。亦即,例如,R4 表示芳基之情況下,由通式(IIA)表示之基團係對三伸苯基為較佳。
In the formula (IIA), * represents a bonding position with X 3 in the formula (I-1).
In the general formula (IIA), the same as R 4 in the general formula (II) the meaning of R 4, preferred aspects are also the same.
R 4 wherein, in the phenyl group substituted with R 4 , the bonding position with respect to the phenyl group adjacent to the phenyl group is preferably in the para position. That is, for example, in the case where R 4 represents an aryl group, the group represented by the formula (IIA) is preferably a triphenylene group.

(由通式(I-2)表示之重複單元)(repeating unit represented by the general formula (I-2))

[化學式7]
[Chemical Formula 7]

通式(I-2)中,X4 、X5 及X6 分別獨立地表示-NR2 -、-O-或-S-。W2 表示2價的連接基。R2 表示氫原子或取代基。In the formula (I-2), X 4 , X 5 and X 6 each independently represent -NR 2 -, -O- or -S-. W 2 represents a divalent linking group. R 2 represents a hydrogen atom or a substituent.

通式(I-2)中,作為R2 ,與通式(I-1)中的R1 的含義相同,較佳的態樣亦相同。
通式(I-2)中,作為W2 ,與通式(I-1)中的W1 的含義相同。
又,從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面及在高溫-低溫環境下反覆曝光亦可以減少硬化膜的分光變動之方面考慮,作為由W2 表示之2價的連接基,較佳為1,4-伸苯基作為由A1 ~A3 表示之伸芳基。
從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面及在高溫-低溫環境下反覆曝光亦可以減少硬化膜的分光變動之方面考慮,作為由W2 表示之2價的連接基,A1 ~A3 均表示伸芳基(較佳為1,4-伸苯基)為更佳。
In the formula (I-2), R 2 has the same meaning as R 1 in the formula (I-1), and preferred embodiments are also the same.
In the general formula (I-2), W 2 has the same meaning as W 1 in the general formula (I-1).
Moreover, the refractive index of the cured film after the reverse exposure in a high-temperature-low temperature environment is more excellent, and the repeated exposure in a high-temperature-low temperature environment can also reduce the spectral variation of the cured film, and is represented by W 2 . The valent linking group is preferably a 1,4-phenylene group as an extended aryl group represented by A 1 to A 3 .
The refractive index of the cured film after repeated exposure in a high-temperature-low temperature environment is more excellent, and the repeated exposure in a high-temperature-low temperature environment can also reduce the spectral variation of the cured film, and is considered to be a valence of W 2 . The linking group, each of A 1 to A 3 , preferably represents an extended aryl group (preferably 1,4-phenylene group).

從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面及在高溫-低溫環境下反覆曝光亦可以減少硬化膜的分光變動之方面考慮,作為X4 、X5 及X6 ,-NR2 -為較佳。The refractive index of the cured film after repeated exposure in a high-temperature-low temperature environment and the repeated exposure in a high-temperature-low temperature environment can also reduce the spectral variation of the cured film as X 4 , X 5 and X 6 . , -NR 2 - is preferred.

包含由上述通式(I-2)表示之重複單元之化合物例如可舉出由下述表示之化合物(縮聚物及複加成物)。Examples of the compound containing the repeating unit represented by the above formula (I-2) include compounds (polycondensate and complex addition) represented by the following.

(例示1)由下述通式(V)表示之化合物與由下述通式(VI)表示之化合物的縮聚物或複加成物。(Example 1) A polycondensate or a complex addition product of a compound represented by the following formula (V) and a compound represented by the following formula (VI).

[化學式8]
[Chemical Formula 8]

上述通式(V)中,Y1 ~Y3 表示脫離基(例如鹵素原子)或異氰酸酯基。
上述通式(VI)中,X7 及X8 分別獨立地表示-NR2 -、-O-或-S-。R2 表示氫原子或取代基。W3 表示2價的連接基。
作為由上述R2 表示之取代基,可舉出與上述之通式(II-2)中的R2 相同者。
作為由上述W3 表示之2價的連接基,可舉出與上述之通式(II-2)中的W2 相同者。
In the above formula (V), Y 1 to Y 3 represent a leaving group (for example, a halogen atom) or an isocyanate group.
In the above formula (VI), X 7 and X 8 each independently represent -NR 2 -, -O- or -S-. R 2 represents a hydrogen atom or a substituent. W 3 represents a divalent linking group.
The substituent represented by the above R 2 may be the same as R 2 in the above formula (II-2).
The divalent linking group represented by the above W 3 may be the same as W 2 in the above formula (II-2).

(例示2)由下述通式(VII)表示之化合物與由下述通式(VIII)表示之化合物的縮聚物或複加成物。(Example 2) A polycondensate or a complex addition product of a compound represented by the following formula (VII) and a compound represented by the following formula (VIII).

[化學式9]
[Chemical Formula 9]

上述通式(VII)中,X9 ~X11 分別獨立地表示-NR2 -、-O-或-S-。R2 表示氫原子或取代基。
作為由上述R2 表示之取代基,可舉出與上述之通式(II-2)中的R2 相同者。
上述通式(VIII)中,Y4 及Y5 表示脫離基(例如鹵素原子)或異氰酸酯基。W4 表示2價的連接基。
作為由上述W4 表示之2價的連接基,可舉出與上述之通式(II-2)中的W2 相同者。
In the above formula (VII), X 9 to X 11 each independently represent -NR 2 -, -O- or -S-. R 2 represents a hydrogen atom or a substituent.
The substituent represented by the above R 2 may be the same as R 2 in the above formula (II-2).
In the above formula (VIII), Y 4 and Y 5 represent a leaving group (for example, a halogen atom) or an isocyanate group. W 4 represents a divalent linking group.
The divalent linking group represented by the above W 4 may be the same as W 2 in the above formula (II-2).

以下示出由通式(I-1)表示之重複單元及由通式(I-2)表示之重複單元的具體例,但是本發明並不限定於此。另外,下述具體例中“Me”表示甲基。Specific examples of the repeating unit represented by the formula (I-1) and the repeating unit represented by the formula (I-2) are shown below, but the present invention is not limited thereto. Further, in the following specific examples, "Me" represents a methyl group.

[化學式10]
[Chemical Formula 10]

[化學式11]
[Chemical Formula 11]

特定三𠯤系樹脂中,由上述通式(I-1)表示之重複單元或由上述通式(I-2)表示之重複單元相對於特定三𠯤系樹脂中的總重複單元係50~100莫耳%為較佳,80~100莫耳%為更佳,90~100莫耳%為進一步較佳。In the specific triterpene resin, the repeating unit represented by the above formula (I-1) or the repeating unit represented by the above formula (I-2) is 50 to 100 with respect to the total repeating unit in the specific triterpene resin. Molar% is preferred, 80 to 100 mol% is more preferred, and 90 to 100 mol% is further preferred.

特定三𠯤系樹脂能夠按照公知的方法(縮聚)來合成。The specific triterpene resin can be synthesized by a known method (polycondensation).

特定三𠯤系樹脂的重量平均分子量係2,000~100,000為較佳,2,000~50,000為更佳,4,000~20,000為進一步較佳。分散度(Mw/Mn)通常為1.0~3.0,1.0~2.6為較佳,1.0~2.0為更佳,1.1~2.0為進一步較佳。The weight average molecular weight of the specific triterpene resin is preferably 2,000 to 100,000, more preferably 2,000 to 50,000, still more preferably 4,000 to 20,000. The degree of dispersion (Mw/Mn) is usually 1.0 to 3.0, 1.0 to 2.6 is preferred, 1.0 to 2.0 is more preferred, and 1.1 to 2.0 is further preferred.

上述組成物中,特定三𠯤系樹脂可以單獨使用1種,亦可以併用2種以上。
上述組成物中,特定三𠯤系樹脂的含量(存在複數個之情況下其合計)相對於組成物的總固體成分,一般為80.0質量%以上的情況較多,85.0質量%以上為較佳,90.0質量%以上為更佳。上限並無特別限制,但是99.9質量%以下為較佳,99.5質量%以下為更佳。
In the above composition, the specific triterpenoid resin may be used singly or in combination of two or more.
In the above-mentioned composition, the content of the specific triterpene resin (the total amount in the case where there are a plurality of them) is generally 80.0% by mass or more based on the total solid content of the composition, and preferably 85.0% by mass or more. More than 90.0% by mass is more preferable. The upper limit is not particularly limited, but 99.9 mass% or less is preferable, and 99.5 mass% or less is more preferable.

<特定金屬離子>
上述組成物包含選自包括鈉離子、鉀離子及鈣離子之群組中之特定金屬離子。
上述組成物中,上述特定金屬離子的總含量相對於組成物總質量為0.01~30質量ppm,從在高溫-低溫環境下反覆曝光之後的硬化膜的缺陷抑制性更優異之方面考慮,0.03~10質量ppm為較佳。
又,上述組成物中,上述特定金屬離子的總含量相對於特定三𠯤系樹脂係0.1~300質量ppm為較佳,從在高溫-低溫環境下反覆曝光之後的硬化膜的缺陷抑制性更優異之方面考慮,0.3~100質量ppm為較佳。
另外,能夠藉由ICP(Inductively Coupled Plasma)發光分光分析裝置(例如Perkin Elmer製“Optima7300DV”)測量上述組成物中的特定金屬離子的含量。
<specific metal ion>
The above composition contains a specific metal ion selected from the group consisting of sodium ions, potassium ions, and calcium ions.
In the above-mentioned composition, the total content of the specific metal ions is 0.01 to 30 ppm by mass based on the total mass of the composition, and the defect resistance of the cured film after repeated exposure in a high-temperature-low temperature environment is more excellent, 0.03 to 10 ppm by mass is preferred.
In the above-mentioned composition, the total content of the specific metal ions is preferably 0.1 to 300 ppm by mass based on the specific tricreide resin, and the cured film after repeated exposure in a high-temperature-low temperature environment is more excellent in defect suppression property. In view of the above, 0.3 to 100 ppm by mass is preferred.
Further, the content of a specific metal ion in the above composition can be measured by an ICP (Inductively Coupled Plasma) luminescence spectrometer (for example, "Optima 7300 DV" manufactured by Perkin Elmer).

<溶劑>
上述組成物包含溶劑。
作為上述溶劑,例如可舉出乙基溶纖劑乙酸酯、乙基卡必醇乙酸酯、丁基卡必醇乙酸酯、乙二醇單甲基醚乙酸酯、乙二醇單乙基醚乙酸酯、乙二醇單丁基醚乙酸酯、丙二醇單甲基醚乙酸酯(PGMEA)、丙二醇單乙基醚乙酸酯、3-甲氧基丙基乙酸酯、3-甲氧基丁基乙酸酯、3-甲氧基丙酸甲酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、丙二醇二乙酸酯、二乙二醇單丁基醚乙酸鹽、γ-丁內酯、乙酸乙酯、乙酸丁酯、乳酸甲酯、乳酸乙酯、乙酸環己酯等酯類;乙二醇單甲基醚、乙二醇單乙基醚、乙二醇二甲基醚、丙二醇單甲基醚(PGME)、丙二醇單乙基醚、乙二醇單異丙基醚、3-甲氧基丙醇、1-甲氧基-2-丙醇、甲氧基甲氧基乙醇、二丙二醇二甲基醚、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇二甲基醚及二乙二醇二乙基醚等醇類;苯、二甲苯、乙基苯及茴香醚等芳香族烴類;環己烷等脂肪族烴類;乙腈等腈類;丙酮、甲基乙基酮、乙醯基丙酮、環己酮、2-庚酮、環戊酮及二丙酮醇等酮類;二氯乙烷等鹵化合物;環己基甲基醚及二丁基醚等醚類;3-甲氧基-N,N-二甲基丙醯胺、N-乙基-2-吡咯叮酮及3-丁氧基-N,N-二甲基丙醯胺等醯胺類;等。
另外,上述溶劑的詳細內容內容能夠參閱國際公開WO2015/166779號公報的0223段的記載,該內容編入到本說明書中。其中,作為上述溶劑的芳香族烴類有時因環保方面等理由而降低為較佳(例如,相對於溶劑總量,亦能夠設為50質量ppm(parts per million,百萬分之一)以下,亦能夠設為10質量ppm以下,還能夠設為1質量ppm以下)。
<solvent>
The above composition contains a solvent.
Examples of the solvent include ethyl cellosolve acetate, ethyl carbitol acetate, butyl carbitol acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol single. Ethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monoethyl ether acetate, 3-methoxypropyl acetate, 3-methoxybutyl acetate, methyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propylene glycol diacetate, diethylene Alcohol monobutyl ether acetate, γ-butyrolactone, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, cyclohexyl acetate and other esters; ethylene glycol monomethyl ether, ethylene glycol single Ethyl ether, ethylene glycol dimethyl ether, propylene glycol monomethyl ether (PGME), propylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, 3-methoxypropanol, 1-methoxy- 2-propanol, methoxymethoxyethanol, dipropylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether and diethylene Alcohols such as alcohol diethyl ether; benzene, xylene, ethylbenzene and fennel Aromatic hydrocarbons; aliphatic hydrocarbons such as cyclohexane; nitriles such as acetonitrile; acetone, methyl ethyl ketone, ethyl ketone acetone, cyclohexanone, 2-heptanone, cyclopentanone, diacetone alcohol, etc. a ketone; a halogen compound such as dichloroethane; an ether such as cyclohexyl methyl ether and dibutyl ether; 3-methoxy-N,N-dimethylpropionamide, N-ethyl-2-pyrrole Anthranes such as anthrone and 3-butoxy-N,N-dimethylpropionamide; and the like.
Further, the details of the above-mentioned solvent can be referred to in the description of paragraph 0223 of WO 2015/166779, which is incorporated herein by reference. In particular, the aromatic hydrocarbons as the solvent may be preferably reduced for reasons such as environmental protection (for example, it may be 50 parts by mass or less per million by mass relative to the total amount of the solvent). Further, it can be 10 mass ppm or less, and can be 1 mass ppm or less.

(甲苯)
上述組成物可以包含甲苯作為溶劑。
上述組成物中,甲苯的總含量相對於組成物總質量為0.001~10質量ppm為較佳。組成物中的甲苯的總含量在上述數值範圍內之情況下,藉由組成物形成之塗佈膜的表面外觀優異。
又,上述組成物中,上述甲苯的總含量相對於特定三𠯤系樹脂,0.01~100質量ppm為較佳。
另外,能夠藉由氣相色譜法來測量上述組成物中的甲苯的含量。
(toluene)
The above composition may contain toluene as a solvent.
In the above composition, the total content of toluene is preferably 0.001 to 10 ppm by mass based on the total mass of the composition. When the total content of toluene in the composition is within the above numerical range, the surface of the coating film formed by the composition is excellent in appearance.
Further, in the above composition, the total content of the toluene is preferably 0.01 to 100 ppm by mass based on the specific triterpene resin.
Further, the content of toluene in the above composition can be measured by gas chromatography.

上述組成物中,上述溶劑可以單獨使用1種,亦可以組合2種以上而使用。In the above-mentioned composition, one type of the above-mentioned solvents may be used alone or two or more types may be used in combination.

本發明中,使用金屬含量少的溶劑為較佳,溶劑的金屬含量例如係10質量ppb(十億分率(parts per billion))以下為較佳。根據需要亦可以使用質量ppt(兆分率(parts per trillion))級別的溶劑,該種高純度溶劑例如由TOYO Gosei Co.,Ltd.提供(化學工業日報,2015年11月13日)。In the present invention, a solvent having a small metal content is preferably used, and a metal content of the solvent is, for example, 10 mass ppb (parts per billion) or less. A solvent of a mass ppt (parts per trillion) grade, which is supplied, for example, by TOYO Gosei Co., Ltd. (Chemical Industries Daily, November 13, 2015), can also be used as needed.

作為從溶劑去除金屬等雜質之方法,例如可舉出蒸餾(分子蒸餾及薄膜蒸餾等)或使用過濾器之過濾。作為過濾中所使用之過濾器的過濾器孔徑,10nm以下為較佳,5nm以下為更佳,3nm以下為進一步較佳。過濾器的材質係聚四氟乙烯、聚乙烯或尼龍為較佳。Examples of the method for removing impurities such as metals from the solvent include distillation (such as molecular distillation and thin film distillation) or filtration using a filter. The filter pore size of the filter used for filtration is preferably 10 nm or less, more preferably 5 nm or less, and still more preferably 3 nm or less. The material of the filter is preferably polytetrafluoroethylene, polyethylene or nylon.

溶劑可以包含異構物(相同原子數且不同之結構的化合物)。又,異構物可以僅包含一種,亦可以包含複數種。The solvent may contain isomers (compounds of the same atomic number and different structures). Further, the isomer may contain only one kind, and may also contain plural kinds.

本發明中,溶劑中過氧化物的含量係0.8mmol/L以下為較佳,實質上不包含過氧化物為更佳。In the present invention, the content of the peroxide in the solvent is preferably 0.8 mmol/L or less, and it is more preferable that the peroxide is not substantially contained.

溶劑的含量中,組成物的固體成分濃度係1~90質量%之量為較佳,組成物的固體成分濃度係1~50質量%之量為更佳,組成物的固體成分濃度係5~30質量%之量為進一步較佳,5~20質量%之量為特佳。
另外,組成物的固體成分濃度係指相對於組成物總質量之總固體成分的濃度(亦即,係指組成物中的形成硬化膜之成分的濃度)。另外,關於總固體成分的定義如上所述。
In the solvent content, the solid content concentration of the composition is preferably from 1 to 90% by mass, and the solid content concentration of the composition is preferably from 1 to 50% by mass, and the solid content concentration of the composition is 5 to The amount of 30% by mass is further preferably, and the amount of 5 to 20% by mass is particularly preferable.
Further, the solid content concentration of the composition means the concentration of the total solid content relative to the total mass of the composition (that is, the concentration of the component forming the cured film in the composition). In addition, the definition of the total solid content is as described above.

<其他成分>
上述組成物亦可以包含除了上述之成分以外的其他成分。作為其他成分,可舉出硬化性化合物(包含聚合性化合物。)、聚合起始劑、抗氧化劑、矽烷偶合劑、聚合抑制劑、界面活性劑、紫外線吸收劑、填充材料(例如無機粒子)、硬化促進劑、塑化劑、低分子量有機羧酸等顯影性提升劑及凝集抑制劑等各種添加劑。
<Other ingredients>
The above composition may also contain other components than the above components. Examples of the other component include a curable compound (including a polymerizable compound), a polymerization initiator, an antioxidant, a decane coupling agent, a polymerization inhibitor, a surfactant, a UV absorber, and a filler (for example, inorganic particles). Various additives such as a curing accelerator, a plasticizer, a developing property enhancer such as a low molecular weight organic carboxylic acid, and a coagulation inhibitor.

(硬化性化合物)
上述組成物包含硬化性化合物為較佳。
作為硬化性化合物,能夠使用能夠藉由自由基、酸或熱來硬化的公知的化合物。例如可舉出包含具有乙烯性不飽和鍵之基團之化合物、具有環氧基之化合物以及具有羥甲基及硫醇基等反應性基之化合物等。作為具有乙烯性不飽和鍵之基團,可舉出乙烯基、(甲基)丙烯酸基、(甲基)丙烯醯基及(甲基)丙烯醯氧基等,(甲基)丙烯醯基或(甲基)丙烯醯氧基為較佳。硬化性化合物係聚合性化合物為較佳,自由基聚合性化合物為更佳。作為聚合性化合物,可舉出包含具有乙烯性不飽和鍵之基團之化合物等。
(hardening compound)
It is preferred that the above composition contains a curable compound.
As the curable compound, a known compound which can be cured by a radical, an acid or heat can be used. For example, a compound containing a group having an ethylenically unsaturated bond, a compound having an epoxy group, and a compound having a reactive group such as a methylol group and a thiol group may, for example, be mentioned. Examples of the group having an ethylenically unsaturated bond include a vinyl group, a (meth)acryl group, a (meth)acryl fluorenyl group, a (meth) acryloxy group, and the like, and a (meth) acrylonitrile group or (Methyl) propylene fluorenyloxy group is preferred. A curable compound-based polymerizable compound is preferred, and a radical polymerizable compound is more preferred. The polymerizable compound may, for example, be a compound containing a group having an ethylenically unsaturated bond.

硬化性化合物的含量相對於組成物的總固體成分,1~80質量%為較佳。下限係3質量%以上為更佳,4質量%以上為進一步較佳。上限係70質量%以下為更佳,60質量%以下為進一步較佳,30質量%以下為特佳。
上述組成物中,硬化性化合物可以為單獨1種,亦可以併用2種以上。上述組成物包含2種以上的硬化性化合物之情況下,合計含量在上述範圍內為較佳。
The content of the curable compound is preferably from 1 to 80% by mass based on the total solid content of the composition. The lower limit is preferably 3% by mass or more, and more preferably 4% by mass or more. The upper limit is preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 30% by mass or less.
In the above composition, the curable compound may be used alone or in combination of two or more. When the composition contains two or more kinds of curable compounds, the total content is preferably within the above range.

・包含具有乙烯性不飽和鍵之基團之化合物(聚合性化合物)
本發明中,作為硬化性化合物,能夠使用包含具有乙烯性不飽和鍵之基團之化合物(以下亦稱為聚合性化合物)。聚合性化合物係單體為較佳。聚合性化合物的分子量係100~3000為較佳。上限係2000以下為更佳,1500以下為進一步較佳。下限係150以上為更佳,250以上為進一步較佳。聚合性化合物係3~15官能的(甲基)丙烯酸酯化合物為較佳,3~6官能的(甲基)丙烯酸酯化合物為更佳。
・A compound containing a group having an ethylenically unsaturated bond (polymerizable compound)
In the present invention, as the curable compound, a compound containing a group having an ethylenically unsaturated bond (hereinafter also referred to as a polymerizable compound) can be used. A polymerizable compound-based monomer is preferred. The molecular weight of the polymerizable compound is preferably from 100 to 3,000. The upper limit is preferably 2,000 or less, and more preferably 1,500 or less. The lower limit is preferably 150 or more, and more preferably 250 or more. The polymerizable compound is preferably a 3- to 15-functional (meth) acrylate compound, and more preferably a 3- to 6-functional (meth) acrylate compound.

作為聚合性化合物的例,能夠參閱日本特開2013-253224號公報的0033~0034段的記載,該內容編入到本說明書中。作為聚合性化合物,環氧乙烷改質新戊四醇四丙烯酸酯(作為市售品,NK ESTER ATM-35E;Shin-Nakamura Chemical Co.,Ltd.製)、二新戊四醇三丙烯酸酯(作為市售品,KAYARAD D-330;Nippon Kayaku Co.,Ltd.製)、二新戊四醇四丙烯酸酯(作為市售品,KAYARAD D-320;Nippon Kayaku Co.,Ltd.製)、二新戊四醇五(甲基)丙烯酸酯(作為市售品, KAYARAD D-310;Nippon Kayaku Co.,Ltd.製)、二新戊四醇六(甲基)丙烯酸酯(作為市售品,KAYARAD DPHA;Nippon Kayaku Co.,Ltd.製、A-DPH-12E;Shin-Nakamura Chemical Co.,Ltd.製)及該等(甲基)丙烯醯基係經由乙二醇殘基和/或丙二醇殘基鍵結之結構為較佳。又,亦能夠使用該等寡聚物類型。又,能夠參閱日本特開2013-253224號公報的0034~0038段的記載,該內容編入到本說明書中。又,可舉出日本特開2012-208494號公報的0477段(所對應之美國專利申請公開第2012/0235099號說明書的0585段)中所述之聚合性單體等,該等內容編入到本說明書中。又,二甘油EO(環氧乙烷)改質(甲基)丙烯酸酯(作為市售品,M-460;TOAGOSEI CO.,LTD.製)、新戊四醇四丙烯酸酯(Shin-Nakamura Chemical Co.,Ltd.製、A-TMMT)、1,6-己二醇二丙烯酸酯(Nippon Kayaku Co.,Ltd.製、KAYARAD HDDA)亦為較佳。亦能夠使用該等寡聚物類型。例如可舉出RP-1040(Nippon Kayaku Co.,Ltd.製)等。As an example of the polymerizable compound, the descriptions of paragraphs 0033 to 0034 of JP-A-2013-253224 can be referred to, and the contents are incorporated in the present specification. As a polymerizable compound, ethylene oxide-modified pentaerythritol tetraacrylate (commercially available, NK ESTER ATM-35E; manufactured by Shin-Nakamura Chemical Co., Ltd.), dipentaerythritol triacrylate (a commercially available product, KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetraacrylate (a commercially available product, KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), Dipentaerythritol penta (meth) acrylate (commercially available, KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth) acrylate (as a commercial product) , KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd., A-DPH-12E; manufactured by Shin-Nakamura Chemical Co., Ltd.) and the (meth)acrylonitrile groups via ethylene glycol residues and/or The structure in which the propylene glycol residue is bonded is preferred. Also, these oligomer types can be used. Moreover, the description of paragraphs 0034 to 0038 of JP-A-2013-253224 can be referred to, and the content is incorporated in the present specification. Further, a polymerizable monomer or the like described in paragraph 0477 of the Japanese Patent Laid-Open Publication No. 2012-208494 (paragraph 0585 of the specification of the corresponding U.S. Patent Application Publication No. 2012/0235099) is incorporated herein by reference. In the manual. Further, diglycerin EO (ethylene oxide) modified (meth) acrylate (commercially available, M-460; manufactured by TOAGOSEI CO., LTD.), neopentyl alcohol tetraacrylate (Shin-Nakamura Chemical) Also produced by Co., Ltd., A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA) is also preferred. These oligomer types can also be used. For example, RP-1040 (made by Nippon Kayaku Co., Ltd.) or the like can be mentioned.

聚合性化合物亦可以具有羧基、磺基及磷酸基等酸基。作為具有酸基之聚合性化合物,可舉出脂肪族聚羥基化合物與不飽和羧酸的酯等。使非芳香族羧酸酐與脂肪族聚羥基化合物的未反應的羥基進行反應而得到酸基之聚合性化合物為較佳,該酯中脂肪族聚羥基化合物係新戊四醇和/或二新戊四醇為更加。作為市售品,例如作為TOAGOSEI CO.,LTD.製的多鹼酸改質丙烯酸寡聚物,可舉出ARONIX系列的M-305、M-510及M-520等。
具有酸基之聚合性化合物的酸值係0.1~40mgKOH/g為較佳。下限係5mgKOH/g以上為更佳。上限係30mgKOH/g以下為更佳。
The polymerizable compound may have an acid group such as a carboxyl group, a sulfo group or a phosphoric acid group. Examples of the polymerizable compound having an acid group include an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid. It is preferred to react a non-aromatic carboxylic anhydride with an unreacted hydroxyl group of an aliphatic polyhydroxy compound to obtain an acid group-containing polymerizable compound, wherein the aliphatic polyhydroxy compound is neopentyl alcohol and/or dipentaerythritol. Alcohol is even more. As a commercially available product, for example, a polybasic acid-modified acrylic oligomer manufactured by TOAGOSEI CO., LTD., examples include M-305, M-510, and M-520 of the ARONIX series.
The acid value of the polymerizable compound having an acid group is preferably from 0.1 to 40 mgKOH/g. The lower limit is preferably 5 mgKOH/g or more. The upper limit is preferably 30 mgKOH/g or less.

聚合性化合物係具有己內酯結構之化合物亦為較佳的態樣。作為具有己內酯結構之聚合性化合物,只要在分子內具有己內酯結構就無特別限定,但是例如可舉出藉由對三羥甲基乙烷、二三羥甲基乙烷、三羥甲基丙烷、二三羥甲基丙烷、新戊四醇、二新戊四醇、三新戊四醇、甘油、二甘油及三羥甲基三聚氰胺等多元醇與(甲基)丙烯酸及ε-己內酯進行酯化而得到之ε-己內酯改質多官能(甲基)丙烯酸酯。作為具有己內酯結構之聚合性化合物,能夠參閱日本特開2013-253224號公報的0042~0045段的記載,該內容編入到本說明書中。具有己內酯結構之化合物,例如可舉出作為KAYARAD DPCA系列而從Nippon Kayaku Co.,Ltd.市售之DPCA-20、DPCA-30、DPCA-60及DPCA-120等以及Sartomer Company, Inc.製的具有4個環氧乙烷鏈之4官能丙烯酸酯亦即SR-494及具有3個伸異丁氧基鏈之3官能丙烯酸酯亦即TPA-330等。It is also preferred that the polymerizable compound is a compound having a caprolactone structure. The polymerizable compound having a caprolactone structure is not particularly limited as long as it has a caprolactone structure in the molecule, and examples thereof include tris(hydroxymethyl)ethane, ditrimethylolethane, and trishydroxyl. Polyols such as methyl propane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, tripentenol, glycerin, diglycerin and trimethylol melamine with (meth)acrylic acid and ε- The ε-caprolactone modified polyfunctional (meth) acrylate obtained by esterification of caprolactone. As a polymerizable compound having a caprolactone structure, the descriptions of paragraphs 0044 to 0045 of JP-A-2013-253224 can be referred to, and the contents are incorporated in the present specification. The compound having a caprolactone structure may, for example, be DPCA-20, DPCA-30, DPCA-60, DPCA-120, etc., commercially available from Nippon Kayaku Co., Ltd. as KAYARAD DPCA series, and Sartomer Company, Inc. The tetrafunctional acrylate having four ethylene oxide chains, that is, SR-494 and a trifunctional acrylate having three extended isobutoxy chains, that is, TPA-330, and the like.

作為聚合性化合物,日本特公昭48-041708號公報、日本特開昭51-037193號公報、日本特公平2-032293號公報及日本特公平2-016765號公報中所記載之胺基甲酸酯丙烯酸酯類以及日本特公昭58-049860號公報、日本特公昭56-017654號公報、日本特公昭62-039417號公報及日本特公昭62-039418號公報中所記載之具有環氧乙烷系骨架之胺酯化合物類亦為較佳。又,能夠使用日本特開昭63-277653號公報、日本特開昭63-260909號公報及日本特開平1-105238號公報中所記載之在分子內具有胺基構造和/或硫化物結構之加成聚合性化合物類。作為市售品,可舉出胺酯寡聚物UAS-10及UAB-140(Sanyo Kokusaku Pulp Co.,Ltd製)、UA-7200(Shin-Nakamura Chemical Co.,Ltd.製)、DPHA-40H(Nippon Kayaku Co.,Ltd.製)以及UA-306H、UA-306T、UA-306I、AH-600、T-600及AI-600(Kyoeisha Chemical Co.,Ltd.製)等。The urethane described in Japanese Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. An oxirane group having an ethylene oxide-based skeleton as described in Japanese Patent Publication No. Sho-62-039, pp. Amino ester compounds are also preferred. In addition, it is possible to have an amine group structure and/or a sulfide structure in a molecule as described in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. Addition of polymeric compounds. A commercially available product is exemplified by an amine ester oligomer UAS-10 and UAB-140 (manufactured by Sanyo Kokusaku Pulp Co., Ltd.), UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), and DPHA-40H. (manufactured by Nippon Kayaku Co., Ltd.) and UA-306H, UA-306T, UA-306I, AH-600, T-600, and AI-600 (manufactured by Kyoeisha Chemical Co., Ltd.).

・具有環氧基之化合物
作為硬化性化合物,亦能夠使用具有環氧基之化合物。具有環氧基之化合物可舉出在1分子內具有1個以上環氧基之化合物,在1分子內具有2個以上環氧基之化合物為較佳。環氧基在1分子內具有1~100個為較佳。上限例如能夠設為10個以下,亦能夠設為5個以下。下限係2個以上為較佳。
・A compound having an epoxy group can be used as a curable compound, and a compound having an epoxy group can also be used. The compound having an epoxy group is preferably a compound having one or more epoxy groups in one molecule, and a compound having two or more epoxy groups in one molecule is preferred. It is preferred that the epoxy group has from 1 to 100 in one molecule. The upper limit can be, for example, 10 or less, or can be 5 or less. It is preferable that the lower limit is two or more.

具有環氧基之化合物的環氧當量(=具有環氧基之化合物的分子量/環氧基的數)係500g/當量以下為較佳,100~400g/當量為更佳,100~300g/當量為進一步較佳。The epoxy equivalent of the compound having an epoxy group (= the molecular weight of the compound having an epoxy group / the number of epoxy groups) is preferably 500 g / equivalent or less, more preferably 100 to 400 g / equivalent, and 100 to 300 g / equivalent. It is further preferred.

具有環氧基之化合物可以為低分子化合物(例如,分子量小於1000),亦可以為高分子化合物(macromolecule)(例如,分子量1000以上的聚合物的情況下,重量平均分子量為1000以上)。具有環氧基之化合物的重量平均分子量係200~100000為較佳,500~50000更為佳。重量平均分子量的上限係10000以下為更佳,5000以下為進一步較佳,3000以下為特佳。The compound having an epoxy group may be a low molecular compound (for example, having a molecular weight of less than 1,000) or a macromolecular compound (for example, in the case of a polymer having a molecular weight of 1,000 or more, the weight average molecular weight is 1,000 or more). The weight average molecular weight of the compound having an epoxy group is preferably from 200 to 100,000, more preferably from 500 to 50,000. The upper limit of the weight average molecular weight is preferably 10,000 or less, more preferably 5,000 or less, and particularly preferably 3,000 or less.

具有環氧基之化合物亦能夠使用市售品。例如可舉出EHPE3150(Daicel Chemical Industries Ltd.製)及EPICLON N-695(DIC CORPORATION製)等。又,具有環氧基之化合物還能夠使用日本特開2013-011869號公報的0034~0036段、日本特開2014-043556號公報的0147~0156段、日本特開2014-089408號公報的0085~0092段中所記載之化合物。該等內容編入到本說明書中。A commercially available product can also be used as the compound having an epoxy group. For example, EHPE3150 (made by Daicel Chemical Industries Ltd.), EPICLON N-695 (made by DIC CORPORATION), etc. are mentioned. In addition, the compound having an epoxy group can also be used in paragraphs 0034 to 0036 of JP-A-2013-011869, paragraphs 0147 to 0156 of JP-A-2014-043556, and 0085 to JP-A-2014-089408. The compound described in paragraph 0092. These contents are incorporated into this specification.

(聚合起始劑)
上述組成物可以包含聚合起始劑,包含光聚合起始劑為較佳。作為光聚合起始劑並無特別限制,能夠從公知的光聚合起始劑之中適當選擇。例如,光聚合起始劑係具有相對於從紫外區域到可見區域的光線具有感光性之化合物為較佳。
(polymerization initiator)
The above composition may contain a polymerization initiator, and a photopolymerization initiator is preferred. The photopolymerization initiator is not particularly limited, and can be appropriately selected from known photopolymerization initiators. For example, a photopolymerization initiator is preferably a compound having photosensitivity with respect to light from an ultraviolet region to a visible region.

作為光聚合起始劑,例如可舉出鹵化烴衍生物(例如具有三𠯤骨架之化合物及具有口咢二唑骨架之化合物等)、醯基膦氧化物等醯基膦化合物、六芳基雙咪唑、肟衍生物等肟化合物、有機過氧化物、硫化合物、酮化合物、芳香族鎓鹽、酮肟醚、胺基苯乙酮化合物以及羥基苯乙酮等。從曝光靈敏度的觀點考慮,光聚合起始劑係選自包括三鹵甲基三嗪(trihalo methyl triazine)化合物、苄基二甲基縮酮化合物、α-羥基酮化合物、α-胺基酮化合物、醯基膦化合物、氧化膦化合物、茂金屬化合物、肟化合物、三芳基咪唑二聚物、鎓化合物、苯并噻唑化合物、二苯甲酮化合物、苯乙酮化合物、環戊二烯-苯-鐵錯合物、鹵甲基㗁二唑化合物及3-芳基取代香豆素化合物之群組中之化合物為較佳,選自包括肟化合物、α-羥基酮化合物、α-胺基酮化合物及醯基膦化合物中之化合物之群組中之化合物為更佳。從所得到之膜更優異之方面考慮,其中,肟化合物為進一步較佳。作為光聚合起始劑,能夠參閱日本特開2014-130173號公報的0065~0111段的記載,該內容編入到本說明書中。Examples of the photopolymerization initiator include a halogenated hydrocarbon derivative (for example, a compound having a triterpene skeleton and a compound having a oxindazole skeleton), a mercaptophosphine compound such as a mercaptophosphine oxide, or a hexaaryl double. An anthracene compound such as an imidazole or an anthracene derivative, an organic peroxide, a sulfur compound, a ketone compound, an aromatic onium salt, a ketoxime ether, an aminoacetophenone compound, and a hydroxyacetophenone. From the viewpoint of exposure sensitivity, the photopolymerization initiator is selected from the group consisting of a trihalo methyl triazine compound, a benzyldimethylketal compound, an α-hydroxyketone compound, and an α-aminoketone compound. , mercaptophosphine compound, phosphine oxide compound, metallocene compound, antimony compound, triaryl imidazole dimer, antimony compound, benzothiazole compound, benzophenone compound, acetophenone compound, cyclopentadiene-benzene- A compound of the group of an iron complex, a halomethyl oxadiazole compound and a 3-aryl-substituted coumarin compound is preferably selected from the group consisting of a ruthenium compound, an α-hydroxyketone compound, and an α-amino ketone compound. Further, the compound in the group of the compounds in the mercaptophosphine compound is more preferred. Among them, the ruthenium compound is further preferable from the viewpoint that the obtained film is more excellent. As a photopolymerization initiator, the descriptions of paragraphs 0065 to 0111 of JP-A-2014-130173 can be referred to, and the contents are incorporated in the present specification.

作為光聚合起始劑,亦能夠較佳地使用α-羥基酮化合物、α-胺基酮化合物及醯基膦化合物。例如亦能夠使用日本特開平10-291969號公報中所記載之α-胺基酮化合物及日本專利第4225898號公報中所記載之醯基膦化合物。作為α-羥基酮化合物的市售品,可舉出IRGACURE-184、DAROCUR-1173、IRGACURE-500、IRGACURE-2959及IRGACURE-127(以上為BASF公司製)。作為α-胺基酮化合物的市售品,可舉出IRGACURE-907、IRGACURE-369、IRGACURE-379及IRGACURE-379EG(以上為BASF公司製)。作為醯基膦化合物的市售品,可舉出市售品亦即IRGACURE-819及DAROCUR-TPO(以上為BASF公司製)。作為肟化合物的市售品,可舉出IRGACURE-OXE01、IRGACURE-OXE02、IRGACURE-OXE03及IRGACURE-OXE04(以上為BASF公司製)、TR-PBG-304(Changzhou Tronly New Electronic Materials Co.,Ltd.製)、ADEKA ARKLSNCI-831(ADEKA CORPORATION製)、ADEKA ARKLSNCI-930(ADEKA CORPORATION製)以及ADEKA OPTOMER N-1919(ADEKA CORPORATION製、日本特開2012-014052號公報中所記載之光聚合起始劑2)等。As the photopolymerization initiator, an α-hydroxyketone compound, an α-amino ketone compound, and a mercaptophosphine compound can also be preferably used. For example, the α-amino ketone compound described in Japanese Laid-Open Patent Publication No. Hei 10-291969 and the mercaptophosphine compound described in Japanese Patent No. 4,258,899 can also be used. Commercial products of the α-hydroxyketone compound include IRGACURE-184, DAROCUR-1173, IRGACURE-500, IRGACURE-2959, and IRGACURE-127 (all manufactured by BASF Corporation). Commercial products of the α-amino ketone compound include IRGACURE-907, IRGACURE-369, IRGACURE-379, and IRGACURE-379EG (all manufactured by BASF Corporation). Commercially available products of the mercaptophosphine compound include IRGACURE-819 and DAROCUR-TPO (all manufactured by BASF Corporation). As a commercial product of a ruthenium compound, IRGACURE-OXE01, IRGACURE-OXE02, IRGACURE-OXE03, and IRGACURE-OXE04 (above, BASF) and TR-PBG-304 (Changzhou Tronly New Electronic Materials Co., Ltd.) are mentioned. , ADEKA ARKLSNCI-831 (made by ADEKA CORPORATION), ADEKA ARKLSNCI-930 (made by ADEKA CORPORATION), and ADEKA OPTOMER N-1919 (Photopolymerization initiators described in ADEKA CORPORATION, JP-A-2012-014052) 2) Wait.

在本發明中,作為光聚合起始劑還能夠使用具有茀環之肟化合物。作為具有茀環之肟化合物的具體例,可舉出日本特開2014-137466號公報中所記載之化合物。該內容編入到本說明書中。In the present invention, a ruthenium compound having an anthracene ring can also be used as a photopolymerization initiator. Specific examples of the ruthenium compound having an anthracene ring include the compounds described in JP-A-2014-137466. This content is incorporated into this specification.

在本發明中,作為光聚合起始劑,還能夠使用具有氟原子之肟化合物。作為具有氟原子之肟化合物的具體例,可舉出日本特開2010-262028號公報中所記載之化合物、日本特表2014-500852號公報中所記載之化合物24、36~40及日本特開2013-164471號公報中所記載之化合物(C-3)等。該等內容編入到本說明書中。In the present invention, as the photopolymerization initiator, a ruthenium compound having a fluorine atom can also be used. Specific examples of the ruthenium compound having a fluorine atom include the compounds described in JP-A-2010-262028, and the compounds 24 and 36 to 40 described in JP-A-2014-500852. Compound (C-3) or the like described in Japanese Patent Publication No. 2013-164471. These contents are incorporated into this specification.

本發明中,作為光聚合起始劑能夠使用具有硝基之肟化合物。具有硝基之肟化合物設為二聚體亦較佳。作為具有硝基之肟化合物的具體例,可舉出日本特開2013-114249號公報的0031~0047段、日本特開2014-137466號公報的0008~0012段及0070~0079段中所記載之化合物、日本專利4223071號公報的0007~0025段中所記載之化合物以及ADEKA ARKLS NCI-831(ADEKA CORPORATION製)。In the present invention, a ruthenium compound having a nitro group can be used as a photopolymerization initiator. It is also preferred that the ruthenium compound having a nitro group be a dimer. Specific examples of the ruthenium compound having a nitro group include those described in paragraphs 003 to 0047 of JP-A-2013-114249, paragraphs 0008 to 0012, and paragraphs 0070 to 0079 of JP-A-2014-137466. The compound and the compound described in paragraphs 0007 to 0025 of Japanese Patent No. 4,223,071, and ADEKA ARKLS NCI-831 (manufactured by ADEKA CORPORATION).

以下示出本發明中較佳地使用之肟化合物的具體例,但本發明並不限定於該等。Specific examples of the ruthenium compound which is preferably used in the present invention are shown below, but the present invention is not limited thereto.

[化學式12]
[Chemical Formula 12]

[化學式13]
[Chemical Formula 13]

肟化合物在350~500nm的波長區域具有極大吸收之化合物為較佳,在360~480nm的波長區域具有極大吸收之化合物為更佳。又,肟化合物係365nm及405nm的吸光度較高的化合物為較佳。
從靈敏度的觀點考慮,肟化合物的365nm或405nm中的莫耳吸光係數係1,000~300,000為較佳,2,000~300,000為更佳,5,000~200,000為進一步較佳。
化合物的莫耳吸光係數能夠使用公知的方法來測量。例如藉由紫外可見分光光度計(Varian公司製Cary-5 spectrophotometer)使用乙酸乙酯溶劑以0.01g/L的濃度測量為較佳。
The ruthenium compound is preferably a compound having a maximum absorption in a wavelength region of 350 to 500 nm, and more preferably a compound having a maximum absorption in a wavelength region of 360 to 480 nm. Further, the ruthenium compound is preferably a compound having a high absorbance at 365 nm and 405 nm.
From the viewpoint of sensitivity, the molar absorption coefficient in the 365 nm or 405 nm of the cerium compound is preferably from 1,000 to 300,000, more preferably from 2,000 to 300,000, still more preferably from 5,000 to 200,000.
The molar absorption coefficient of the compound can be measured using a known method. For example, it is preferably measured by using an ultraviolet-visible spectrophotometer (Cary-5 spectrophotometer manufactured by Varian Co., Ltd.) using an ethyl acetate solvent at a concentration of 0.01 g/L.

光聚合起始劑包含肟化合物及α-胺基酮化合物亦為較佳。藉由併用兩者,容易形成提高顯影性且矩形性優異之圖案。併用肟化合物與α-胺基酮化合物之情況下,相對於肟化合物100質量份包含50~600質量份的α-胺基酮化合物為較佳,150~400質量份為更佳。It is also preferred that the photopolymerization initiator contains an anthracene compound and an α-aminoketone compound. By using both, it is easy to form a pattern which improves developability and is excellent in squareness. In the case of using an oxime compound and an α-amino ketone compound, it is preferably 50 to 600 parts by mass of the α-amino ketone compound, and more preferably 150 to 400 parts by mass, per 100 parts by mass of the ruthenium compound.

聚合起始劑的含量相對於組成物的總固體成分,0.1~50質量%為較佳,0.5~30質量%為更佳,1~20質量%為進一步較佳,1~10質量%為特佳。
聚合起始劑的含量在上述範圍的情況下,容易形成靈敏度更優異且矩形性優異之圖案。上述組成物可以僅包含1種聚合起始劑,亦可以包含2種以上的聚合起始劑。上述組成物包含2種以上的聚合起始劑之情況下,其合計含量在上述範圍內為較佳。
The content of the polymerization initiator is preferably from 0.1 to 50% by mass, more preferably from 0.5 to 30% by mass, even more preferably from 1 to 20% by mass, even more preferably from 1 to 10% by mass, based on the total solid content of the composition. good.
When the content of the polymerization initiator is in the above range, it is easy to form a pattern having more excellent sensitivity and excellent squareness. The above composition may contain only one type of polymerization initiator, or may contain two or more types of polymerization initiators. When the composition contains two or more kinds of polymerization initiators, the total content thereof is preferably within the above range.

(抗氧化劑)
上述組成物亦可以包含抗氧化劑。
作為抗氧化劑,可舉出苯酚化合物、亞磷酸酯化合物及硫醚化合物等。作為抗氧化劑,分子量500以上的苯酚化合物、分子量500以上的亞磷酸酯化合物或分子量500以上的硫醚化合物為較佳。該等可以混合2種以上而使用。作為苯酚化合物,能夠使用作為苯酚系抗氧化劑而已知之任意苯酚化合物,多取代苯酚系化合物為較佳。多取代苯酚系化合物大致分為具有其取代位置及結構不同之3種(受阻型、半受阻型及低受阻型)。又,作為抗氧化劑,較佳地使用在同一分子內具有苯酚基及亞磷酸酯基之化合物。又,作為抗氧化劑,亦較佳地使用磷系抗氧化劑。抗氧化劑亦能夠使用市售品。作為抗氧化劑的市售品,例如可舉出ADKSTAB AO-20、ADKSTAB AO-30、ADKSTAB AO-40、ADKSTAB AO-50、ADKSTAB AO-50F、ADKSTAB AO-60、ADKSTAB AO-60G、ADKSTAB AO-80及ADKSTAB AO-330(ADEKA CORPORATION製)。又,作為抗氧化劑,能夠參閱日本特開2014-032380號公報的0033~0043段的記載,該內容編入到本說明書中。
(Antioxidants)
The above composition may also contain an antioxidant.
Examples of the antioxidant include a phenol compound, a phosphite compound, and a thioether compound. As the antioxidant, a phenol compound having a molecular weight of 500 or more, a phosphite compound having a molecular weight of 500 or more, or a thioether compound having a molecular weight of 500 or more is preferable. These can be used by mixing two or more types. As the phenol compound, any phenol compound known as a phenol antioxidant can be used, and a polysubstituted phenol compound is preferable. The polysubstituted phenol-based compound is roughly classified into three types (blocked type, semi-blocked type, and low-blocked type) having different substitution positions and structures. Further, as the antioxidant, a compound having a phenol group and a phosphite group in the same molecule is preferably used. Further, as the antioxidant, a phosphorus-based antioxidant is also preferably used. Commercially available products can also be used as the antioxidant. As a commercial product of the antioxidant, for example, ADKSTAB AO-20, ADKSTAB AO-30, ADKSTAB AO-40, ADKSTAB AO-50, ADKSTAB AO-50F, ADKSTAB AO-60, ADKSTAB AO-60G, ADKSTAB AO- 80 and ADKSTAB AO-330 (made by ADEKA CORPORATION). Moreover, as an antioxidant, the description of paragraphs 0033 to 0043 of JP-A-2014-032380 can be referred to, and the contents are incorporated in the present specification.

抗氧化劑的含量相對於組成物的總固體成分,0.01~20質量%為較佳,0.3~15質量%為更佳。抗氧化劑可以僅為1種,亦可以為2種以上。上述組成物包含2種以上的抗氧化劑之情況下,其合計含量在上述範圍內為較佳。The content of the antioxidant is preferably from 0.01 to 20% by mass, more preferably from 0.3 to 15% by mass, based on the total solid content of the composition. The antioxidant may be used alone or in combination of two or more. When the composition contains two or more kinds of antioxidants, the total content thereof is preferably within the above range.

(矽烷偶合劑)
上述組成物亦包含矽烷偶合劑。
本發明中,偶合劑係指具有水解性基和其以外的官能基之矽烷化合物。又,水解性基係指與矽原子直接連接且能夠藉由水解反應及縮合反應中的至少任意一種反應產生矽氧烷鍵之取代基。作為水解性基,例如可舉出鹵素原子、烷氧基及醯氧基等,烷氧基為較佳。亦即,矽烷偶合劑係具有烷氧基矽基之化合物為較佳。又,除了水解性基以外的官能基係在與樹脂之間形成相互作用或鍵結而顯示出親和性之基團為較佳。例如可舉出乙烯基、苯乙烯基、(甲基)丙烯醯基、巰基、環氧基、氧雜環丁基、胺基、脲基、硫醚基、異氰酸酯基及苯基等,(甲基)丙烯醯基或環氧基為較佳。
(decane coupling agent)
The above composition also contains a decane coupling agent.
In the present invention, the coupling agent means a decane compound having a hydrolyzable group and a functional group other than the same. Further, the hydrolyzable group means a substituent which is directly bonded to a ruthenium atom and which is capable of generating a siloxane chain bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and a decyloxy group, and an alkoxy group is preferred. That is, a decane coupling agent is preferably a compound having an alkoxyfluorenyl group. Further, a functional group other than the hydrolyzable group is preferably a group which exhibits an affinity or bond with the resin to exhibit affinity. Examples thereof include a vinyl group, a styryl group, a (meth)acryl fluorenyl group, a fluorenyl group, an epoxy group, an oxetanyl group, an amine group, a ureido group, a thioether group, an isocyanate group, and a phenyl group. Acryl fluorenyl or epoxy groups are preferred.

作為矽烷偶合劑的具體例,例如可舉出3-甲基丙烯醯氧丙基甲基二甲氧基矽烷等。又,作為矽烷偶合劑,可舉出日本特開2009-288703號公報的0018~0036段中所記載之化合物及日本特開2009-242604號公報的0056~0066段中所記載之化合物,該等內容編入到本說明書中。矽烷偶合劑亦能夠使用市售品。作為矽烷偶合劑的市售品,可舉出Shin-Etsu Chemical Co.,Ltd.製的KBM-13、KBM-22、KBM-103、KBE-13、KBE-22、KBE-103、KBM-3033、KBE-3033、KBM-3063、KBM-3066、KBM-3086、KBE-3063、KBE-3083、KBM-3103、KBM-7103、SZ-31、KPN-3504、KBM-1003、KBE-1003、KBM-303、KBM-402、KBM-403、KBE-402、KBE-403、KBM-1403、KBM-502、KBM-503、KBE-502、KBE-503、KBM-5103、KBM-602、KBM-603、KBM-903、KBE-903、KBE-9103、KBM-573、KBM-575、KBM-9659、KBE-585、KBM-802、KBM-803、KBE-846、KBE-9007、X-40-1053、X-41-1059A、X-41-1056、X-41-1805、X-41-1818、X-41-1810、X-40-2651、X-40-2655A、KR-513、KC-89S、KR-500、KR-516、KR-517、X-40-9296、X-40-9225、X-40-9246、X-40-9250、KR-401N、X-40-9227、X-40-9247、KR-510、KR-9218、KR-213、X-40-2308及X-40-9238等。Specific examples of the decane coupling agent include 3-methacryloxypropylmethyldimethoxydecane. In addition, examples of the decane coupling agent include the compounds described in paragraphs 0018 to 0036 of JP-A-2009-288703, and the compounds described in paragraphs 0056 to 0066 of JP-A-2009-242604. The content is incorporated into this specification. Commercially available products can also be used as the decane coupling agent. As a commercial item of a decane coupling agent, KBM-13, KBM-22, KBM-103, KBE-13, KBE-22, KBE-103, KBM-3033 by Shin-Etsu Chemical Co., Ltd. , KBE-3033, KBM-3063, KBM-3066, KBM-3086, KBE-3063, KBE-3083, KBM-3103, KBM-7103, SZ-31, KPN-3504, KBM-1003, KBE-1003, KBM -303, KBM-402, KBM-403, KBE-402, KBE-403, KBM-1403, KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603 , KBM-903, KBE-903, KBE-9103, KBM-573, KBM-575, KBM-9659, KBE-585, KBM-802, KBM-803, KBE-846, KBE-9007, X-40-1053 , X-41-1059A, X-41-1056, X-41-1805, X-41-1818, X-41-1810, X-40-2651, X-40-2655A, KR-513, KC-89S , KR-500, KR-516, KR-517, X-40-9296, X-40-9225, X-40-9246, X-40-9250, KR-401N, X-40-9227, X-40 -9247, KR-510, KR-9218, KR-213, X-40-2308 and X-40-9238.

矽烷偶合劑的含量相對於組成物的總固體成分,0.01~15.0質量%為較佳,0.05~10.0質量%為更佳。矽烷偶合劑可以僅為1種,亦可以為2種以上。上述組成物包含2種以上的矽烷偶合劑之情況下,其合計含量在上述範圍內為較佳。The content of the decane coupling agent is preferably from 0.01 to 15.0% by mass, more preferably from 0.05 to 10.0% by mass, based on the total solid content of the composition. The decane coupling agent may be used alone or in combination of two or more. When the composition contains two or more kinds of decane coupling agents, the total content thereof is preferably within the above range.

(聚合抑制劑)
上述組成物亦可以包含聚合抑制劑。
聚合抑制劑可舉出氫醌、對甲氧基苯酚、二-第三丁基-對甲酚、鄰苯三酚、第三丁基鄰苯二酚、苯醌、4,4’-硫代雙(3-甲基-6-第三丁基苯酚)、2,2’-亞甲基雙(4-甲基-6-第三丁基苯酚)及N-亞硝基苯基羥基胺鹽(銨鹽及亞鈰鹽等)。其中,對甲氧基苯酚為較佳。另外,聚合抑制劑亦有時作為抗氧化劑而發揮功能。
(polymerization inhibitor)
The above composition may also contain a polymerization inhibitor.
The polymerization inhibitor may, for example, be hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butyl catechol, benzoquinone, 4,4'-thio Bis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-tert-butylphenol) and N-nitrosophenylhydroxylamine salt (ammonium salts and sulfonium salts, etc.). Among them, p-methoxyphenol is preferred. Further, the polymerization inhibitor may also function as an antioxidant.

聚合抑制劑的含量相對於聚合起始劑100質量份係0.01~10質量份為較佳,0.01~8質量份為更佳,0.01~5質量份為進一步較佳。The content of the polymerization inhibitor is preferably 0.01 to 10 parts by mass, more preferably 0.01 to 8 parts by mass, even more preferably 0.01 to 5 parts by mass, based on 100 parts by mass of the polymerization initiator.

(界面活性劑)
從更提高塗佈性之觀點考慮,上述組成物亦可以包含各種界面活性劑。
作為界面活性劑,能夠使用氟系界面活性劑、非離子系界面活性劑、陽離子系界面活性劑、陰離子系界面活性劑及聚矽氧系界面活性劑等各種界面活性劑。界面活性劑能夠參閱國際公開WO2015/166779號公報的0238~0245段,該內容編入到本說明書中。
(surfactant)
The above composition may also contain various surfactants from the viewpoint of further improving coatability.
As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a polyfluorene-based surfactant can be used. The surfactant can be referred to paragraphs 0238 to 0245 of International Publication WO2015/166779, which is incorporated herein by reference.

藉由上述組成物包含氟系界面活性劑,更提高作為塗佈液製備時的液特性(尤其流動性),能夠更改善塗佈厚度的均勻性及省液性。使用運用了包含氟系界面活性劑之組成物之塗佈液來進行膜形成之情況下,被塗佈面與塗佈液的界面張力降低,改善對被塗佈面的潤濕性,提高對被塗佈面的塗佈性。因此,能夠更佳地實施厚度不均勻較小的均勻厚度的膜形成。When the composition contains a fluorine-based surfactant, the liquid properties (especially fluidity) at the time of preparation of the coating liquid are further improved, and the uniformity of the coating thickness and the liquid-saving property can be further improved. When the film formation is carried out using a coating liquid using a composition containing a fluorine-based surfactant, the interfacial tension between the coated surface and the coating liquid is lowered, and the wettability to the coated surface is improved, and the film is improved. The coatability of the coated surface. Therefore, film formation of a uniform thickness having a small thickness unevenness can be more preferably performed.

氟系界面活性劑中的氟含有率係3~40質量%為適宜,更佳為5~30質量%,特佳為7~25質量%。氟含有率在該範圍內之氟系界面活性劑在塗佈膜的厚度的均勻性及省液性的觀點上有效,在組成物中之溶解性亦良好。The fluorine content in the fluorine-based surfactant is preferably from 3 to 40% by mass, more preferably from 5 to 30% by mass, even more preferably from 7 to 25% by mass. The fluorine-based surfactant having a fluorine content in this range is effective from the viewpoint of the uniformity of the thickness of the coating film and the liquid-saving property, and the solubility in the composition is also good.

作為氟系界面活性劑,具體而言,可舉出日本特開2014-041318號公報的0060~0064段(對應之國際公開2014/017669號公報的0060~0064段)等中所記載之界面活性劑及日本特開2011-132503號公報的0117~0132段中所記載之界面活性劑,該等內容編入到本說明書中。作為氟系界面活性劑的市售品,例如可舉出MEGAFACE F171、MEGAFACE F172、MEGAFACE F173、MEGAFACE F176、MEGAFACE F177、MEGAFACE F141、MEGAFACE F142、MEGAFACE F143、MEGAFACE F144、MEGAFACE R30、MEGAFACE F437、MEGAFACE F475、MEGAFACE F479、MEGAFACE F482、MEGAFACE F554及MEGAFACE F780(以上為DIC CORPORATION製)、FLUORAD FC430、FLUORAD FC431及FLUORAD FC171(以上為Sumitomo 3M Limited製)、SURFLON S-382、SURFLON SC-101、SURFLON SC-103、SURFLON SC-104、SURFLON SC-105、SURFLON SC-1068、SURFLON SC-381、SURFLON SC-383、SURFLON S-393及SURFLON KH-40(以上為ASAHI GLASS CO.,LTD.製)以及PolyFox PF636、PF656、PF6320、PF6520及PF7002(以上為OMNOVA SOLUTIONS INC. SOLUTIONS INC.製)等。Specific examples of the fluorine-based surfactants include the interfacial activity described in paragraphs 0060 to 0064 of JP-A-2014-041318 (corresponding to paragraphs 0060 to 0064 of International Publication No. 2014/017669). The surfactants described in paragraphs 0117 to 0132 of JP-A-2011-132503, the contents of which are incorporated herein by reference. Examples of commercially available fluorine-based surfactants include MEGAFACE F171, MEGAFACE F172, MEGAFACE F173, MEGAFACE F176, MEGAFACE F177, MEGAFACE F141, MEGAFACE F142, MEGAFACE F143, MEGAFACE F144, MEGAFACE R30, MEGAFACE F437, and MEGAFACE F475. MEGAFACE F479, MEGAFACE F482, MEGAFACE F554 and MEGAFACE F780 (above DIC CORPORATION), FLUORAD FC430, FLUORAD FC431 and FLUORAD FC171 (above is Sumitomo 3M Limited), SURFLON S-382, SURFLON SC-101, SURFLON SC- 103, SURFLON SC-104, SURFLON SC-105, SURFLON SC-1068, SURFLON SC-381, SURFLON SC-383, SURFLON S-393, and SURFLON KH-40 (above, manufactured by ASAHI GLASS CO., LTD.) and PolyFox PF636, PF656, PF6320, PF6520, and PF7002 (above, OMNOVA SOLUTIONS INC. SOLUTIONS INC.).

又,氟系界面活性劑亦能夠較佳地使用丙烯酸系化合物,該具有包含氟原子之官能基之分子結構且施加熱時含有氟原子之官能基的部分被切斷而揮發氟原子。作為該種氟系界面活性劑,可舉出DIC Corporation製的MEGAFACE DS系列(化學工業日報,2016年2月22日)(日經產業新聞,2016年2月23日),例如MEGAFACE DS-21。Further, the fluorine-based surfactant can also preferably use an acrylic compound having a molecular structure containing a functional group of a fluorine atom and a portion containing a functional group containing a fluorine atom when heat is applied, and the fluorine atom is volatilized. As such a fluorine-based surfactant, MEGAFACE DS series manufactured by DIC Corporation (Chemical Industry Daily, February 22, 2016) (Nikkei Industry News, February 23, 2016), for example, MEGAFACE DS-21 .

作為氟系界面活性劑,亦能夠使用嵌段聚合物。例如可舉出日本特開2011-089090號公報中所記載之化合物。氟系界面活性劑亦能夠較佳地使用含氟高分子化合物,該含氟高分子化合物包含來源於具有氟原子之(甲基)丙烯酸酯化合物之重複單元和來源於具有2個以上(較佳為5個以上)伸烷氧基(較佳為伸乙氧基或伸丙氧基)之(甲基)丙烯酸酯化合物之重複單元。下述化合物亦可以作為本發明中所使用之氟系界面活性劑而進行例示。As the fluorine-based surfactant, a block polymer can also be used. For example, the compound described in JP-A-2011-089090 can be mentioned. The fluorine-based surfactant can also preferably be a fluorine-containing polymer compound containing a repeating unit derived from a (meth) acrylate compound having a fluorine atom and having two or more sources (preferably). It is a repeating unit of a (meth) acrylate compound which is an alkoxy group (preferably an ethoxy group or a propoxy group) of 5 or more. The following compounds can also be exemplified as the fluorine-based surfactant used in the present invention.

[化學式14]
[Chemical Formula 14]

上述化合物的重量平均分子量係例如係3,000~50,000為較佳,具體而言,可舉出14,000。上述化合物中,表示重複單元的比例之%係質量%。The weight average molecular weight of the above compound is preferably, for example, 3,000 to 50,000, and specifically, 14,000. In the above compound, % of the ratio of the repeating unit is % by mass.

又,氟系界面活性劑亦能夠使用在側鏈上具有乙烯性不飽和基之含氟聚合物。作為具體例,可舉出日本特開2010-164965號公報的0050~0090段及0289~0295段中所記載之化合物,例如DIC Corporation製的MEGAFACE RS-101、RS-102、RS-718K及RS-72-K等。氟系界面活性劑亦能夠使用日本特開2015-117327號公報的0015~0158段中所記載之化合物。Further, as the fluorine-based surfactant, a fluorine-containing polymer having an ethylenically unsaturated group in a side chain can also be used. Specific examples include compounds described in paragraphs 0050 to 0090 and 0289 to 0295 of JP-A-2010-164965, for example, MEGAFACE RS-101, RS-102, RS-718K, and RS manufactured by DIC Corporation. -72-K and so on. As the fluorine-based surfactant, the compound described in paragraphs 0015 to 0158 of JP-A-2015-117327 can also be used.

作為非離子系界面活性劑,可舉出甘油、三羥甲基丙烷、三羥甲基乙烷以及該等乙氧基化物及丙氧基化物(例如甘油丙氧基化物及甘油乙氧基化物等)等。又,亦可舉出聚氧乙烯月桂基醚、聚氧乙烯硬脂基醚、聚氧乙烯油基醚、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚、聚乙二醇二月桂酸酯、聚乙二醇二硬脂酸酯、山梨醇酐脂肪酸酯、PLURONIC L10、L31、L61、L62、10R5、17R2及25R2(BASF公司製)、TETRONIC 304、701、704、901、904及150R1(BASF公司製)、SOLSPERSE 20000(Lubrizol Japan Limited.製)、NCW-101、NCW-1001及NCW-1002(Wako Pure Chemical Industries, Ltd.製)、PIONIN D-6112、D-6112-W及D-6315(Takemoto Oil & Fat Co.,Ltd.製)以及OLFINE E1010、SURFYNOL104、400及440(issin Chemical Co.,Ltd.製)等。Examples of the nonionic surfactant include glycerin, trimethylolpropane, trimethylolethane, and the like, and ethoxylates and propoxylates (for example, glycerol propoxylate and glycerol ethoxylate). and many more. Further, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene nonylphenyl ether, polyethylene glycol Dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, PLURONIC L10, L31, L61, L62, 10R5, 17R2 and 25R2 (manufactured by BASF Corporation), TETRONIC 304, 701, 704, 901 904 and 150R1 (manufactured by BASF Corporation), SOLSPERSE 20000 (manufactured by Lubrizol Japan Limited), NCW-101, NCW-1001, and NCW-1002 (manufactured by Wako Pure Chemical Industries, Ltd.), PIONIN D-6112, D-6112 -W and D-6315 (manufactured by Takemoto Oil & Fat Co., Ltd.) and OLFINE E1010, SURFYNOL 104, 400 and 440 (manufactured by Issin Chemical Co., Ltd.) and the like.

又,作為氟系界面活性劑,亦能夠使用乙烯醚聚合型氟系界面活性劑。作為乙烯醚聚合型氟系界面活性劑,例如可舉出日本特開2016-216602號公報的實施例欄中所記載者(例如氟系界面活性劑(1))等。Further, as the fluorine-based surfactant, a vinyl ether polymerizable fluorine-based surfactant can also be used. For example, as described in the column of the examples of JP-A-2016-216602 (for example, a fluorine-based surfactant (1)), etc. are mentioned as a vinyl ether type-type fluorine-type surfactant.

界面活性劑的含量相對於組成物的總固體成分,0.0001~5.0質量%為較佳,0.0005~3.0質量%為更佳。界面活性劑可以僅為1種,亦可以為2種以上。上述組成物包含2種以上的界面活性劑之情況下,其合計含量在上述範圍內為較佳。The content of the surfactant is preferably 0.0001 to 5.0% by mass, more preferably 0.0005 to 3.0% by mass, based on the total solid content of the composition. The surfactant may be used alone or in combination of two or more. When the composition contains two or more kinds of surfactants, the total content thereof is preferably within the above range.

(紫外線吸收劑)
上述組成物亦可以包含紫外線吸收劑。
作為紫外線吸收劑,可舉出共軛二烯化合物、胺基二烯化合物、水楊酸酯化合物、二苯甲酮化合物、苯并三唑化合物、丙烯腈化合物及羥基苯基三𠯤化合物等。關於該等詳細內容,能夠參閱日本特開2012-208374號公報的0052~0072段及日本特開2013-068814號公報的0317~0334段的記載,該等內容編入到本說明書中。作為共軛二烯化合物的市售品,例如可舉出UV-503(DAITO CHEMICAL CO.,LTD.製)等。又,作為苯并三唑化合物,可以使用MIYOSHI OIL & FAT CO.,LTD.製的MYUA系列(化學工業日報,2016年2月1日)。
紫外線吸收劑的含量相對於組成物的總固體成分,0.1~10質量%為較佳,0.1~5質量%為更佳,0.1~3質量%為進一步較佳。又,紫外線吸收劑可以僅為1種,亦可以為2種以上。上述組成物包含2種以上的紫外線吸收劑之情況下,其合計含量在上述範圍內為較佳。
(UV absorber)
The above composition may also contain an ultraviolet absorber.
Examples of the ultraviolet absorber include a conjugated diene compound, an aminodiene compound, a salicylate compound, a benzophenone compound, a benzotriazole compound, an acrylonitrile compound, and a hydroxyphenyl triazine compound. For the details, the descriptions of paragraphs 0053 to 0823 of JP-A-2012-208374 and paragraphs 0317 to 0334 of JP-A-2013-068814 can be referred to in the present specification. The commercially available product of the conjugated diene compound is, for example, UV-503 (manufactured by DAITO CHEMICAL CO., LTD.). Further, as the benzotriazole compound, MYUA series (Chemical Industry Daily, February 1, 2016) manufactured by MIYOSHI OIL & FAT CO., LTD. can be used.
The content of the ultraviolet absorber is preferably from 0.1 to 10% by mass, more preferably from 0.1 to 5% by mass, even more preferably from 0.1 to 3% by mass, based on the total solid content of the composition. Further, the ultraviolet absorber may be used alone or in combination of two or more. When the composition contains two or more kinds of ultraviolet absorbers, the total content thereof is preferably within the above range.

(填充材料)
作為填充材料,例如可舉出無機粒子。作為無機粒子,折射率高且無色、白色或透明的無機粒子為較佳,鈦(Ti)、鋯(Zr)、鋁(Al)、矽(Si)、鋅(Zn)或鎂(Mg)等氧化物粒子為較佳,二酸化鈦(TiO2 )粒子、氧化鋯(ZrO2 )粒子或二酸化矽(SiO2 )粒子為更佳。
無機粒子的一次粒徑並無特別限制,1~100nm為較佳,1~80nm為更佳,1~50nm為進一步較佳。若無機粒子的一次粒徑在上述範圍內,則分散性更優異並且更提高折射率及透射率。
無機粒子的折射率並無特別限制,但是從得到高折射率之觀點考慮,1.75~2.70為較佳,1.90~2.70為更佳。
無機粒子的比表面積並無特別限制,但是10~400m2 /g為較佳,20~200m2 /g為更佳,30~150m2 /g為進一步較佳。
又,無機粒子的形狀並無特別限制,例如可舉出米粒狀、球形狀、立方體狀、紡錘形狀及不定形狀等。
無機粒子亦可以為藉由有機化合物進行表面處理者。作為用於表面處理之有機化合物,例如可舉出多元醇、烷醇胺、硬脂酸、矽烷偶合劑及鈦酸偶合劑。其中,硬脂酸或矽烷偶合劑為較佳。
又,從更提高耐候性之方面考慮,無機粒子的表面藉由鋁、矽及氧化鋯等氧化物來包覆亦為較佳。
作為無機粒子,能夠較佳地使用市售者。
上述組成物中,無機粒子可以為單獨1種,亦可以組合2種以上而使用。
(Filler)
Examples of the filler include inorganic particles. As the inorganic particles, inorganic particles having a high refractive index and being colorless, white or transparent are preferable, and titanium (Ti), zirconium (Zr), aluminum (Al), cerium (Si), zinc (Zn) or magnesium (Mg), etc. The oxide particles are preferably titanium dichloride (TiO 2 ) particles, zirconium oxide (ZrO 2 ) particles or cerium disilicate (SiO 2 ) particles.
The primary particle diameter of the inorganic particles is not particularly limited, and is preferably 1 to 100 nm, more preferably 1 to 80 nm, and still more preferably 1 to 50 nm. When the primary particle diameter of the inorganic particles is within the above range, the dispersibility is more excellent and the refractive index and the transmittance are further improved.
The refractive index of the inorganic particles is not particularly limited, but from the viewpoint of obtaining a high refractive index, 1.75 to 2.70 is preferable, and 1.90 to 2.70 is more preferable.
The specific surface area of the inorganic particles is not particularly limited, but 10 ~ 400m 2 / g is preferred, 20 ~ 200m 2 / g is more preferably, 30 ~ 150m 2 / g is further preferred.
Further, the shape of the inorganic particles is not particularly limited, and examples thereof include a rice grain shape, a spherical shape, a cubic shape, a spindle shape, and an indefinite shape.
The inorganic particles may also be surface treated by an organic compound. Examples of the organic compound used for the surface treatment include a polyhydric alcohol, an alkanolamine, a stearic acid, a decane coupling agent, and a titanate coupling agent. Among them, stearic acid or a decane coupling agent is preferred.
Further, from the viewpoint of further improving the weather resistance, the surface of the inorganic particles is preferably coated with an oxide such as aluminum, lanthanum or zirconia.
As the inorganic particles, a commercially available one can be preferably used.
In the above composition, the inorganic particles may be used alone or in combination of two or more.

(硬化促進劑)
上述組成物作為硬化性化合物包含具有陽離子聚合性基之化合物(例如具有環氧基之化合物)之情況下,組成物包含硬化促進劑為較佳。
作為提高硬化速度之硬化促進劑,可舉出酸酐、鹼(脂肪族胺、芳香族胺及改質胺等)、酸(磺酸、磷酸及羧酸等)及多硫醇等。其中,酸酐為較佳,脂肪族酸酐為進一步較佳。
(hardening accelerator)
When the composition contains a compound having a cationically polymerizable group (for example, a compound having an epoxy group) as the curable compound, the composition preferably contains a curing accelerator.
Examples of the curing accelerator for increasing the curing rate include an acid anhydride, a base (such as an aliphatic amine, an aromatic amine, and a modified amine), an acid (such as a sulfonic acid, a phosphoric acid, and a carboxylic acid), and a polythiol. Among them, an acid anhydride is preferred, and an aliphatic acid anhydride is further preferred.

<組成物的製備方法>
上述組成物能夠混合前述成分來製備。製備組成物時,可以一併摻合各成分,亦可以在溶劑中溶解或分散各成分之後逐步摻合。例如,亦可以同時在溶劑中溶解或分散所有成分來製備組成物。又,亦可以在溶劑及樹脂中分散顯示出粒子性之成分來製備組成物,並混合所得到之組成物與其他成分(例如特定三𠯤系樹脂及硬化性化合物等)。
<Preparation method of composition>
The above composition can be prepared by mixing the above components. When the composition is prepared, the components may be blended together, or the components may be gradually mixed after dissolving or dispersing the components in a solvent. For example, it is also possible to prepare a composition by simultaneously dissolving or dispersing all the components in a solvent. Further, a component which exhibits particle properties may be dispersed in a solvent or a resin to prepare a composition, and the obtained composition and other components (for example, a specific triterpenoid resin and a curable compound) may be mixed.

上述組成物包含顯示出粒子性之成分之情況下,組成物的製備方法中,包括使粒子分散之製程為較佳。在使粒子分散之製程中,作為用於粒子的分散之機械力,可舉出壓縮、壓榨、衝擊、剪斷及氣蝕等。作為該等製程的具體例,可舉出珠磨、砂磨、輥磨、球磨、塗料攪拌器、微射流、高速葉輪、混砂、噴射流混合、高壓濕式微粒化及超聲波分散等。又,在砂磨(珠磨)中的粒子的粉碎中,以如下條件處理為較佳:藉由使用直徑較小之微珠,且提高微珠的填充率來提高粉碎效率。又,在粉碎處理之後藉由過濾、離心分離等來去除粗粒子為較佳。又,作為使粒子分散之製程及分散機,能夠較佳地使用“分散技術大全、JOHOKIKO CO., LTD.發行,2005年7月15日”及“圍繞懸浮液(固體/液體分散體系)之分散技術與工業上的實際應用綜合資料集,經營開發中心出版部發行,1978年10月10日”、日本特開2015-157893號公報的0022段中所記載的製程及分散機。又,使粒子分散之製程中,鹽磨步驟中亦可以進行粒子的微細化處理。關於鹽磨步驟中所使用之原材料、設備及處理條件等,例如能夠參閱日本特開2015-194521號公報及日本特開2012-046629號公報的記載。In the case where the above composition contains a component exhibiting particle properties, the method for preparing the composition includes a process of dispersing the particles. In the process of dispersing the particles, as the mechanical force for dispersing the particles, compression, pressing, impact, shearing, cavitation, and the like are exemplified. Specific examples of such processes include bead milling, sanding, roll milling, ball milling, paint agitator, microjet, high speed impeller, sand mixing, jet mixing, high pressure wet micronization, and ultrasonic dispersion. Further, in the pulverization of the particles in the sanding (bead grinding), it is preferred to treat the pulverization efficiency by using microbeads having a small diameter and increasing the filling ratio of the microbeads. Further, it is preferred to remove coarse particles by filtration, centrifugation or the like after the pulverization treatment. Further, as a process for dispersing particles and a dispersing machine, it is possible to preferably use "dispersion technology, JOHOKIKO CO., LTD., issued July 15, 2005" and "surrounding suspension (solid/liquid dispersion system)" The process and disperser described in paragraph 0022 of the Japanese Patent Laid-Open Publication No. 2015-157893, issued on October 10, 1978. Further, in the process of dispersing the particles, the particles may be subjected to a refining treatment in the salt milling step. For the raw materials, the equipment, the processing conditions, and the like, which are used in the salt milling step, for example, the descriptions of JP-A-2015-194521 and JP-A-2012-046629 can be referred to.

製備上述組成物時,以去除異物及降低缺陷等的目的,藉由過濾器過濾組成物為較佳。作為過濾器,只要是從以往用於過濾用途等之過濾器,則能夠無特別限制地使用。例如可舉出使用了聚四氟乙烯(PTFE)等氟樹脂、尼龍(例如尼龍-6及尼龍-6,6)等聚醯胺系樹脂以及聚乙烯及聚丙烯(PP)等聚烯烴樹脂(包含高密度和/或超高分子量的聚烯烴樹脂)等原材料之過濾器。在該等原材料中,聚丙烯(包含高密度聚丙烯)及尼龍為較佳。
過濾器的孔徑係0.01~7.0μm左右為較佳,0.01~3.0μm左右為更佳,0.05~0.5μm左右為進一步較佳。若過濾器的孔徑在上述範圍,則能夠確實地去除微細的異物。使用纖維狀的過濾材料亦為較佳。作為纖維狀過濾材料,例如可舉出聚丙烯纖維、尼龍纖維、玻璃纖維等。具體而言,可舉出ROKI TECHNO CO.,LTD.製的SBP類型系列(SBP008等)、TPR類型系列(TPR002及TPR005等)及SHPX類型系列(SHPX003等)等過濾芯。
When the above composition is prepared, it is preferred to filter the composition by a filter for the purpose of removing foreign matter and reducing defects. The filter can be used without any particular limitation as long as it is a filter that has been conventionally used for filtration applications. For example, a fluororesin such as polytetrafluoroethylene (PTFE), a polyamide resin such as nylon (for example, nylon-6 and nylon-6,6), and a polyolefin resin such as polyethylene or polypropylene (PP) may be used. A filter containing raw materials such as high density and/or ultra high molecular weight polyolefin resin). Among these raw materials, polypropylene (including high density polypropylene) and nylon are preferred.
The pore size of the filter is preferably about 0.01 to 7.0 μm, more preferably about 0.01 to 3.0 μm, and still more preferably about 0.05 to 0.5 μm. When the pore diameter of the filter is in the above range, fine foreign matter can be reliably removed. It is also preferred to use a fibrous filter material. Examples of the fibrous filter material include polypropylene fibers, nylon fibers, and glass fibers. Specifically, a filter core such as an SBP type series (SBP008 or the like), a TPR type series (such as TPR002 and TPR005), and a SHPX type series (SHPX003 or the like) manufactured by ROKI TECHNO CO., LTD.

當使用過濾器時,可以組合不同的過濾器(例如,第1過濾器和第2過濾器等)。此時,各過濾器中的過濾可以僅為1次,亦可以進行2次以上。又,在上述之範圍內亦可以組合不同之孔徑的過濾器。其中的孔徑能夠參閱過濾器廠商的標稱值。作為市售的過濾器,例如能夠從由NIHON PALL Corporation(DFA4201NIEY等)、Advantec Toyo Kaisha, Ltd.、Nihon Entegris K.K.(Formerly Nippon Mykrolis Corporation)及KITZ MICROFILTER CORPORATION等提供之各種過濾器中選擇。第2過濾器能夠使用由與第1過濾器相同的原材料等形成者。又,第1過濾器中的過濾僅對混合有樹脂及溶劑之混合液進行,混合其他成分之後,亦可以藉由第2過濾器進行過濾。When a filter is used, different filters (for example, a first filter, a second filter, etc.) can be combined. At this time, the filtration in each filter may be performed only once or twice or more. Further, it is also possible to combine filters of different apertures within the above range. The aperture can be referred to the nominal value of the filter manufacturer. As a commercially available filter, for example, it can be selected from various filters supplied by NIHON PALL Corporation (DFA4201NIEY, etc.), Advantec Toyo Kaisha, Ltd., Nihon Entegris K.K. (Formerly Nippon Mykrolis Corporation), and KITZ MICROFILTER CORPORATION. The second filter can be formed using the same material or the like as the first filter. Further, the filtration in the first filter is performed only on the mixed liquid in which the resin and the solvent are mixed, and after mixing the other components, the filtration may be carried out by the second filter.

<用途>
上述組成物及後述之本發明的樹脂的用途並無特別限制,但是例如作為固體攝像元件的高折射構件(顯微透鏡、濾色器的基底層及相鄰層等透明膜以及濾色器的白色像素等)、透鏡(眼鏡透鏡、數位相機用透鏡、菲涅耳透鏡及棱鏡透鏡等)、光學用外塗劑、硬塗劑、防反射膜、光纖維、光導波路、LED(Light Emitting Diode,發光二極管)用密封材料、LED用平坦化材料及太陽光電池用塗佈材料而有用。
<Use>
The composition of the present invention and the resin of the present invention to be described later are not particularly limited, but are, for example, a high refractive member (a microlens, a base layer of a color filter, a transparent film such as an adjacent layer, and a color filter). White pixels, etc., lenses (glass lenses, digital camera lenses, Fresnel lenses, prism lenses, etc.), optical external coating agents, hard coating agents, antireflection films, optical fibers, optical waveguides, LEDs (Light Emitting Diodes) Light-emitting diodes are useful for sealing materials, planarizing materials for LEDs, and coating materials for solar cells.

〔膜〕
本發明的膜為從本發明的組成物得到之膜。
其中,上述“膜”均係指硬化藉由本發明的組成物形成之塗佈膜(未硬化的膜)及塗佈膜來形成之硬化膜。
另外,組成物中包含硬化性化合物之情況下,藉由對由上述組成物形成之塗佈膜實施硬化處理來得到硬化膜。
上述膜的折射率(波長589nm)並無特別限制,但是1.55以上為較佳,1.6~2.0為更佳。
上述膜的透光率並無特別限制,但是橫跨400~700nm的波長區域所有區域係90%以上為較佳,95%以上為更佳,100%為進一步較佳。
上述膜的厚度並無特別限制,但是0.1~20μm為較佳,0.1~10μm為更佳,0.5~4μm為進一步較佳。
〔membrane〕
The film of the present invention is a film obtained from the composition of the present invention.
Here, the above-mentioned "film" means a cured film formed by curing a coating film (unhardened film) formed by the composition of the present invention and a coating film.
Further, when the composition contains a curable compound, the cured film is obtained by subjecting the coating film formed of the above composition to a curing treatment.
The refractive index (wavelength: 589 nm) of the film is not particularly limited, but is preferably 1.55 or more, and more preferably 1.6 to 2.0.
The light transmittance of the film is not particularly limited, but 90% or more of all regions in the wavelength region of 400 to 700 nm are preferable, 95% or more is more preferable, and 100% is further preferable.
The thickness of the film is not particularly limited, but is preferably 0.1 to 20 μm, more preferably 0.1 to 10 μm, and still more preferably 0.5 to 4 μm.

使上述組成物硬化之方法並無特別限制,可舉出加熱及曝光等。用於加熱之裝置並無特別限制,能夠使用送風乾燥機、烘箱、紅外線乾燥機及加熱輥等。曝光中使用裝置並無特別限制,能夠使用水銀燈、金屬鹵化物燈、疝氣(Xe)燈、化學燈及碳弧燈等。The method of hardening the above composition is not particularly limited, and examples thereof include heating, exposure, and the like. The apparatus for heating is not particularly limited, and a blower dryer, an oven, an infrared dryer, a heating roller, or the like can be used. The apparatus used for the exposure is not particularly limited, and a mercury lamp, a metal halide lamp, a xenon (Xe) lamp, a chemical lamp, a carbon arc lamp, or the like can be used.

<圖案狀硬化膜之製造方法>
以下,作為硬化膜之製造方法的一例,對製造圖案狀的硬化膜之進行詳述。
<Method for Producing Patterned Cured Film>
Hereinafter, a patterned cured film will be described in detail as an example of a method for producing a cured film.

圖案狀的硬化膜之製造方法包括:在基板上塗佈上述組成物來形成組成物層(塗佈膜)之步驟(以下,適當地簡稱為“組成物層形成步驟”。);經由遮罩曝光上述組成物層之步驟(以下,適當地簡稱為“曝光步驟”。);及顯影曝光後的組成物層來形成圖案狀的硬化膜之步驟(以下,適當地簡稱為“顯影步驟”。)。
另外,通常在上述中所使用之組成物包含硬化性化合物及光聚合起始劑。
The method for producing a patterned cured film includes the step of forming the composition layer (coating film) by coating the above composition on a substrate (hereinafter, simply referred to as "the composition layer forming step"); The step of exposing the composition layer (hereinafter, simply referred to as "exposure step" as appropriate) and the step of developing the patterned composition layer after exposure to form a patterned cured film (hereinafter, simply referred to as "development step" as appropriate). ).
Further, the composition generally used in the above contains a curable compound and a photopolymerization initiator.

具體而言,直接或經由其他層將上述組成物塗佈於基板上,形成組成物層(組成物層形成步驟),經由規定的遮罩圖案進行曝光,僅硬化經光照射之組成物層部分(曝光步驟),藉由顯影液來顯影(顯影步驟),藉此能夠形成包括像素之圖案狀的硬化膜。
以下,對各步驟進行說明。
Specifically, the composition is applied onto a substrate directly or via another layer to form a composition layer (formation layer forming step), and exposure is performed via a predetermined mask pattern, and only the portion of the composition layer that is irradiated with light is hardened. (Exposure step), development is carried out by a developing solution (developing step), whereby a cured film including a pattern of pixels can be formed.
Hereinafter, each step will be described.

・組成物層形成步驟
組成物層形成步驟中,在基板上塗佈上述組成物來形成組成物層(塗佈膜)。
- Composition Layer Formation Step In the composition layer formation step, the composition is applied onto a substrate to form a composition layer (coating film).

作為基板並無特別限制,例如可舉出用於液晶顯示裝置等之無鹼玻璃、鈉玻璃、PYREX(註冊商標)玻璃、石英玻璃及在該等附著有透明導電膜者、用於固體攝像元件等之光電轉換元件基板(例如矽基板等)、CCD(Charge Coupled Device,電荷耦合器件)基板以及CMOS(Complementary Metal Oxide Semiconductor,互補金屬氧化物半導體)基板等。The substrate is not particularly limited, and examples thereof include alkali-free glass for liquid crystal display devices, soda glass, PYREX (registered trademark) glass, quartz glass, and those having a transparent conductive film attached thereto, and are used for a solid-state image sensor. A photoelectric conversion element substrate (for example, a germanium substrate), a CCD (Charge Coupled Device) substrate, a CMOS (Complementary Metal Oxide Semiconductor) substrate, or the like.

作為對基板上塗佈上述組成物的方法,能夠運用狹縫塗佈、噴墨法、旋轉塗佈、流延塗佈、輥塗佈或網板印刷法等各種塗佈方法。As a method of applying the above composition to the substrate, various coating methods such as slit coating, inkjet method, spin coating, cast coating, roll coating, or screen printing can be employed.

作為組成物的塗佈膜厚,能夠藉由用途適當選擇,但是例如為0.1~20μm,0.1~10μm為更佳,0.5~4μm為進一步較佳。The coating film thickness of the composition can be appropriately selected by the use, but is, for example, 0.1 to 20 μm, more preferably 0.1 to 10 μm, still more preferably 0.5 to 4 μm.

塗佈於基板上之組成物通常在70~110℃下在2~4分鐘左右的條件下進行乾燥。藉此,能夠形成組成物層。The composition coated on the substrate is usually dried at 70 to 110 ° C for about 2 to 4 minutes. Thereby, a composition layer can be formed.

・曝光步驟
曝光步驟中,經由遮罩曝光組成物層形成步驟中形成之組成物層(塗佈膜),僅硬化經光照射之塗佈膜部分。
關於曝光,藉由光化射線或放射線的照射來進行為較佳,尤其,g射線、h射線或i射線等紫外線為更佳。照射強度係5~1500mJ/cm2 為較佳,10~1000mJ/cm2 為更佳。
In the exposure step exposure step, the composition layer (coating film) formed in the composition layer forming step is exposed through the mask, and only the portion of the coating film irradiated with light is hardened.
The exposure is preferably carried out by irradiation with actinic rays or radiation, and in particular, ultraviolet rays such as g-rays, h-rays or i-rays are more preferable. The irradiation intensity is preferably 5 to 1,500 mJ/cm 2 , more preferably 10 to 1000 mJ/cm 2 .

・顯影步驟
曝光步驟中,接著進行鹼性顯影處理(顯影步驟),在鹼水溶液溶出曝光步驟中的光未照射部分。藉此,僅殘留經光硬化之部分(經光照射之塗佈膜部分)。
作為顯影液,期望不對基底的電路等帶來損傷之有機鹼性顯影液。作為顯影溫度通常為20~30℃,顯影時間為20~90秒鐘。
- Development Step The exposure step is followed by an alkali development treatment (development step) in which the light is not irradiated in the alkali aqueous solution elution step. Thereby, only the portion which is photohardened (the portion of the coating film which is irradiated with light) remains.
As the developer, an organic alkaline developer which does not cause damage to the circuit of the substrate or the like is desired. The development temperature is usually 20 to 30 ° C, and the development time is 20 to 90 seconds.

作為鹼性的水溶液,例如可舉出無機系顯影液及有機系顯影液。作為無機系顯影液,可舉出以濃度成為0.001~10質量%、較佳為0.01~1質量%的方式溶解了氫氧化鈉、氫氧化鉀、碳酸鈉、碳酸氫鈉、矽酸鈉或甲基矽酸鈉之鹼性水溶液。作為有機系顯影液,可舉出以濃度成為0.001~10質量%、較佳為0.01~1質量%的方式溶解了氨水、乙胺、二乙胺、二甲基乙醇胺、氫氧化四甲基銨(TMAH)、氫氧化四乙基銨、膽鹼、吡咯、哌啶或1,8-二吖雙環-[5.4.0]-7-十一烯等鹼性化合物之鹼性水溶液。鹼性水溶液中亦能夠適量添加例如甲醇或乙醇等水溶性有機溶劑和/或界面活性劑等。另外,使用了包括該等鹼性水溶液之顯影液之情況下,通常顯影後藉由純水來洗淨(沖洗)。Examples of the alkaline aqueous solution include an inorganic developer and an organic developer. The inorganic developing solution is dissolved in sodium hydroxide, potassium hydroxide, sodium carbonate, sodium hydrogencarbonate, sodium citrate or aluminum so as to have a concentration of 0.001 to 10% by mass, preferably 0.01 to 1% by mass. An alkaline aqueous solution of sodium citrate. The organic developing solution is dissolved in ammonia, ethylamine, diethylamine, dimethylethanolamine or tetramethylammonium hydroxide so as to have a concentration of 0.001 to 10% by mass, preferably 0.01 to 1% by mass. An alkaline aqueous solution of a basic compound such as (TMAH), tetraethylammonium hydroxide, choline, pyrrole, piperidine or 1,8-dioxabicyclo-[5.4.0]-7-undecene. A water-soluble organic solvent such as methanol or ethanol and/or a surfactant may be added to the alkaline aqueous solution in an appropriate amount. Further, in the case where a developer containing the alkaline aqueous solution is used, it is usually washed (rinsed) with pure water after development.

作為顯影方法,例如能夠使用旋覆浸沒顯影方法或噴淋顯影方法等。As the developing method, for example, a spin-on immersion developing method, a shower developing method, or the like can be used.

〔透鏡〕
本發明的膜(較佳為硬化膜)亦能夠用作透鏡。作為透鏡,其中,能夠較佳地使用上述之固體攝像元件的顯微透鏡。
〔lens〕
The film of the present invention (preferably a cured film) can also be used as a lens. As the lens, a microlens of the above solid-state imaging element can be preferably used.

〔固體攝像元件〕
本發明的膜(較佳為硬化膜)能夠較佳地運用於固體攝像元件。
作為本發明的固體攝像元件的構造,例如可舉出在基板上具有包括構成固體攝像元件(CCD影像感測器、CMOS影像感測器等)的受光區域之複數個光二極體及多晶矽等之受光元件,並且在濾色器下具備本發明的膜亦即底塗膜之構造等。
[solid-state imaging device]
The film of the present invention (preferably a cured film) can be preferably applied to a solid-state image sensor.
The structure of the solid-state imaging device of the present invention includes, for example, a plurality of photodiodes and polycrystalline silicon including a light receiving region constituting a solid-state imaging device (a CCD image sensor, a CMOS image sensor, etc.) on a substrate. The light-receiving element and the structure of the film of the present invention, that is, the undercoat film, are provided under the color filter.

〔樹脂〕
本發明亦係關於一種能夠適當地用作高折射率材料之新型樹脂。本發明的樹脂為包含由下述通式(IV-1)表示之重複單元或由下述通式(IV-2)表示之重複單元之樹脂。另外,包含由下述通式(IV-1)表示之重複單元或由下述通式(IV-2)表示之重複單元之樹脂相當於上述之特定三𠯤系樹脂的一形態。
以下,對本發明的樹脂進行詳述。
<由通式(IV-1)表示之重複單元>
[resin]
The present invention also relates to a novel resin which can be suitably used as a high refractive index material. The resin of the present invention is a resin containing a repeating unit represented by the following formula (IV-1) or a repeating unit represented by the following formula (IV-2). Further, a resin containing a repeating unit represented by the following formula (IV-1) or a repeating unit represented by the following formula (IV-2) corresponds to one form of the above specific triterpenoid resin.
Hereinafter, the resin of the present invention will be described in detail.
<Repeating unit represented by the general formula (IV-1)>

[化學式15]
[Chemical Formula 15]

通式(IV-1)中,X1 、X2 及X3 分別獨立地表示-NR1 -、-O-或-S-。W1 表示2價的連接基。R1 表示氫原子或取代基。R5 表示雜環基、氰基、硝基、烷基、烷硫基或鹵素原子。In the formula (IV-1), X 1 , X 2 and X 3 each independently represent -NR 1 -, -O- or -S-. W 1 represents a divalent linking group. R 1 represents a hydrogen atom or a substituent. R 5 represents a heterocyclic group, a cyano group, a nitro group, an alkyl group, an alkylthio group or a halogen atom.

通式(IV-1)中,X1 、X2 、X3 及W1 與上述之通式(I-1)中的X1 、X2 、X3 及W1 的含義相同,較佳的態樣亦相同。Formula (IV-1) In, X 1, X 2, X 3 , and W 1 of the aforementioned general formula X 1 (I-1) is, X 2, X 3 and W 1 have the same meaning and preferred The same is true.

通式(IV-1)中,R5 表示雜環基、氰基、硝基、烷基、烷硫基或鹵素原子。
作為由上述R5 表示之雜環基、烷基、烷硫基及鹵素原子的較佳態樣分別與由上述之通式(II)中的R4 表示之雜環基、烷基、烷硫基及鹵素原子相同。
In the formula (IV-1), R 5 represents a heterocyclic group, a cyano group, a nitro group, an alkyl group, an alkylthio group or a halogen atom.
Preferred examples of the heterocyclic group, the alkyl group, the alkylthio group and the halogen atom represented by the above R 5 are the same as the heterocyclic group, alkyl group or alkyl sulfide represented by R 4 in the above formula (II). The base is the same as the halogen atom.

作為上述通式(IV-1),從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面考慮,其中,由下述通式(IV-1A)表示之基團為較佳。In the above formula (IV-1), the refractive index of the cured film after the reverse exposure in a high-temperature-low temperature environment is more excellent, wherein the group represented by the following general formula (IV-1A) is good.

[化學式16]
[Chemical Formula 16]

其中,相對於與R5 所取代之苯基相鄰之伸苯基的鍵結位置,R5 位於對位為較佳。Among them, R 5 is preferably in the para position with respect to the bonding position of the phenyl group adjacent to the phenyl group substituted with R 5 .

<由下述通式(IV-2)表示之重複單元><Repeating unit represented by the following general formula (IV-2)>

[化學式17]
[Chemical Formula 17]

通式(IV-2)中,X4 、X5 及X6 分別獨立地表示-NR2 -、-O-或-S-。R2 表示氫原子或取代基。In the formula (IV-2), X 4 , X 5 and X 6 each independently represent -NR 2 -, -O- or -S-. R 2 represents a hydrogen atom or a substituent.

通式(IV-2)中,X4 、X5 及X6 與上述之通式(I-2)中的X4 、X5 及X6 的含義相同,較佳的態樣亦相同。In the general formula (IV-2), X 4 , X 5 and X 6 of the aforementioned general formula X (I-2) 4, and X 5 have the same meaning of X 6, preferred aspects are also the same.

作為上述通式(IV-2),從在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異之方面考慮,其中,由下述通式(IV-2A)表示之基團為較佳。The above formula (IV-2) is considered to be more excellent in the refractive index of the cured film after the reverse exposure in a high-temperature-low temperature environment, wherein the group represented by the following formula (IV-2A) is comparatively preferable. good.

[化學式18]
[Chemical Formula 18]

上述樹脂中,由上述通式(I-1)表示之重複單元或由上述通式(I-2)表示之重複單元相對於樹脂中的總重複單元,50~100莫耳%為較佳,80~100莫耳%為更佳,90~100莫耳%為進一步較佳。In the above resin, the repeating unit represented by the above formula (I-1) or the repeating unit represented by the above formula (I-2) is preferably 50 to 100 mol% based on the total repeating unit in the resin. More preferably, 80 to 100 mol%, and still more preferably 90 to 100 mol%.

上述樹脂的重量平均分子量係2,000~100,000為較佳,2,000~50,000為更佳,4,000~20,000為進一步較佳。分散度(Mw/Mn)通常為1.0~3.0,1.0~2.6為較佳,1.0~2.0為更佳,1.1~2.0為進一步較佳。
[實施例]
The weight average molecular weight of the above resin is preferably 2,000 to 100,000, more preferably 2,000 to 50,000, still more preferably 4,000 to 20,000. The degree of dispersion (Mw/Mn) is usually 1.0 to 3.0, 1.0 to 2.6 is preferred, 1.0 to 2.0 is more preferred, and 1.1 to 2.0 is further preferred.
[Examples]

以下,依據實施例對本發明進行詳細內容說明。以下實施例所示之材料、使用量、比例、處理內容及處理順序等只要不脫離本發明的主旨便能夠適當變更。然而,本發明的範圍並非係藉由以下所示之實施例限定地解釋者。Hereinafter, the present invention will be described in detail based on examples. The materials, the amounts, the ratios, the processing contents, the processing procedures, and the like shown in the following examples can be appropriately changed without departing from the gist of the invention. However, the scope of the invention is not to be construed as being limited by the embodiments shown below.

〔1〕包含由通式(I-1)表示之重複單元或由下述通式(I-2)表示之重複單元之樹脂的合成
<合成例1:樹脂(A-1)>
[1] Synthesis of a resin comprising a repeating unit represented by the formula (I-1) or a repeating unit represented by the following formula (I-2) <Synthesis Example 1: Resin (A-1)>

[化學式19]
[Chemical Formula 19]

在容器內秤取氰脲酸醯氯9.0g及四氫呋喃13.2g,在氮氣氣流下攪拌所得到之溶液並且進行了冰浴。接著,向進行了該冰浴之溶液滴加在四氫呋喃76.8g中溶解了4-胺基-4’-氰基聯苯10.0g之溶液,進而攪拌了2小時。向攪拌後的反應溶液添加0.2質量%的鹽酸水380g,過濾了所得到之固體。接著,藉由離子交換水1000g洗淨經過濾之固體,在60℃下進行真空乾燥,藉此得到了16.0g的化合物(i-1)。9.0 g of guanidine cyanurate chloride and 13.2 g of tetrahydrofuran were weighed in a container, and the resulting solution was stirred under a nitrogen stream and subjected to an ice bath. Then, a solution of 10.0 g of 4-amino-4'-cyanobiphenyl dissolved in 76.8 g of tetrahydrofuran was added dropwise to the solution in which the ice bath was carried out, and the mixture was further stirred for 2 hours. 380 g of 0.2% by mass hydrochloric acid water was added to the stirred reaction solution, and the obtained solid was filtered. Then, the filtered solid was washed with 1000 g of ion-exchanged water, and vacuum-dried at 60 ° C to obtain 16.0 g of the compound (i-1).

[化學式20]
[Chemical Formula 20]

在容器內秤取1,4-伸苯基二胺2.0g及N,N-二甲基乙醯胺40.6g,在氮氣氣流下將所得到之混合物加熱到100℃。接著,向加熱之溶液添加溶解於N,N-二甲基乙醯胺25.7g中之化合物(i-1)6.4g之溶液,並攪拌了1小時。接著,向攪拌後的反應溶液添加苯胺0.9mL,進而攪拌了10分鐘。將所得到之反應溶液冷卻至室溫之後,添加到三乙胺7.0g及離子交換水380g的水溶液。過濾經析出之固體之後,藉由離子交換水100g洗淨經過濾之固體3次,接著藉由乙醇100g洗淨了1次。在60℃下對所得到之固體進行真空乾燥,藉此得到了7.2g的化合物(A-1)。In a container, 2.0 g of 1,4-phenylenediamine and 40.6 g of N,N-dimethylacetamide were weighed, and the resulting mixture was heated to 100 ° C under a nitrogen gas stream. Next, a solution of 6.4 g of the compound (i-1) dissolved in 25.7 g of N,N-dimethylacetamide was added to the heated solution, and the mixture was stirred for 1 hour. Next, 0.9 mL of aniline was added to the stirred reaction solution, and the mixture was further stirred for 10 minutes. After the obtained reaction solution was cooled to room temperature, an aqueous solution of 7.0 g of triethylamine and 380 g of ion-exchanged water was added. After the precipitated solid was filtered, the filtered solid was washed three times with 100 g of ion-exchanged water, and then washed once with 100 g of ethanol. The obtained solid was vacuum dried at 60 ° C, whereby 7.2 g of the compound (A-1) was obtained.

<合成例2:樹脂(A-2)>
分別將4-胺基-4’-氰基聯苯及1,4-伸苯基二胺變更為4-胺基-對三聯苯及1,3-伸苯基二胺,以相同的莫耳當量進行了反應,除此以外,實施與合成例1相同的操作,從而得到了化合物(A-2)。
<Synthesis Example 2: Resin (A-2)>
Change 4-amino-4'-cyanobiphenyl and 1,4-phenylene diamine to 4-amino-p-terphenyl and 1,3-phenylene diamine, respectively, to the same molar The same operation as in Synthesis Example 1 was carried out except that the reaction was carried out to give Compound (A-2).

<合成例3:樹脂(A-3)>
分別將4-胺基-4’-氰基聯苯及1,4-伸苯基二胺變更為4-胺基-4’-氯聯苯及4,4’-二胺基苯醯苯胺,以相同的莫耳當量進行了反應,除此以外,實施與合成例1相同的操作,從而得到了化合物(A-3)。
<Synthesis Example 3: Resin (A-3)>
4-Amino-4'-cyanobiphenyl and 1,4-phenylenediamine were changed to 4-amino-4'-chlorobiphenyl and 4,4'-diaminophenyl anilide, respectively. The same operation as in Synthesis Example 1 was carried out, except that the reaction was carried out in the same molar ratio to give Compound (A-3).

<合成例4:樹脂(A-4)>
分別將4-胺基-4’-氰基聯苯及1,4-伸苯基二胺變更為4-胺基-4’-甲基聯苯及4,4’-二胺基二苯基醚,以相同的莫耳當量進行了反應,除此以外,實施與合成例1相同的操作,從而得到了化合物(A-4)。
<Synthesis Example 4: Resin (A-4)>
Change 4-amino-4'-cyanobiphenyl and 1,4-phenylenediamine to 4-amino-4'-methylbiphenyl and 4,4'-diaminodiphenyl The same procedure as in Synthesis Example 1 was carried out except that the ether was reacted in the same molar ratio to obtain Compound (A-4).

<合成例5:樹脂(A-5)>
分別將4-胺基-4’-氰基聯苯及1,4-伸苯基二胺變更為4-胺基-4’-硝基聯苯及雙(4-胺基苯基)硫化物,以相同的莫耳當量進行了反應,除此以外,實施與合成例1相同的操作,從而得到了化合物(A-5)。
<Synthesis Example 5: Resin (A-5)>
Change 4-amino-4'-cyanobiphenyl and 1,4-phenylenediamine to 4-amino-4'-nitrobiphenyl and bis(4-aminophenyl) sulfide, respectively The same procedure as in Synthesis Example 1 was carried out, except that the reaction was carried out in the same molar ratio to give Compound (A-5).

<合成例6:樹脂(A-6)>
分別將4-胺基-4’-氰基聯苯及1,4-伸苯基二胺變更為4-胺基-4’-甲硫基聯苯及雙(4-胺基苯基)碸,以相同的莫耳當量進行了反應,除此以外,實施與合成例1相同的操作,從而得到了化合物(A-6)。
<Synthesis Example 6: Resin (A-6)>
Change 4-amino-4'-cyanobiphenyl and 1,4-phenylenediamine to 4-amino-4'-methylthiobiphenyl and bis(4-aminophenyl)anthracene The compound (A-6) was obtained by the same operation as in Synthesis Example 1 except that the reaction was carried out in the same molar ratio.

<合成例7:樹脂(A-7)>
分別將4-胺基-4’-氰基聯苯及1,4-伸苯基二胺變更為對氰基苯胺及4,4”-二胺基-對三聯苯,以相同的莫耳當量進行了反應,除此以外,實施與合成例1相同的操作,從而得到了化合物(A-7)。
<Synthesis Example 7: Resin (A-7)>
Change 4-amino-4'-cyanobiphenyl and 1,4-phenylenediamine to p-cyanoaniline and 4,4"-diamino-p-terphenyl, respectively, with the same molar equivalent The same operation as in Synthesis Example 1 was carried out, and the compound (A-7) was obtained.

<合成例8:樹脂(A-8)>
分別將4-胺基-4’-氰基聯苯及1,4-伸苯基二胺變更為4-胺基-對三聯苯及4,4”-二胺基-對三聯苯,以相同的莫耳當量進行了反應,除此以外,實施與合成例1相同的操作,從而得到了化合物(A-8)。
<Synthesis Example 8: Resin (A-8)>
Change 4-amino-4'-cyanobiphenyl and 1,4-phenylenediamine to 4-amino-p-terphenyl and 4,4"-diamino-p-terphenyl, respectively. The same operation as in Synthesis Example 1 was carried out, and the compound (A-8) was obtained.

<合成例9:樹脂(A-9)><Synthesis Example 9: Resin (A-9)>

[化學式21]
[Chemical Formula 21]

在容器內秤取氰脲酸醯氯9.2g、4,4”-二胺基-對三聯苯8.7g及N,N-二甲基乙醯胺56.7g,在氮氣氣流下將所得到之混合物加熱到100℃,並攪拌了1小時。接著,向攪拌後的反應溶液添加苯胺3.0mL,進而攪拌了10分鐘。將所得到之反應溶液冷卻至室溫之後,添加到三乙胺14.0g及離子交換水760g的水溶液。過濾經析出之固體之後,藉由離子交換水200g洗淨經過濾之固體3次,接著藉由乙醇200g洗淨了1次。在60℃下對所得到之固體進行真空乾燥,藉此得到了15.1g的化合物(A-9)。9.2 g of guanidine cyanurate chloride, 8.7 g of 4,4"-diamino-p-terphenyl and 56.7 g of N,N-dimethylacetamide were weighed in a container, and the obtained mixture was obtained under a nitrogen stream. The mixture was heated to 100 ° C and stirred for 1 hour. Then, 3.0 mL of aniline was added to the stirred reaction solution, and the mixture was further stirred for 10 minutes. After the obtained reaction solution was cooled to room temperature, it was added to 14.0 g of triethylamine and An aqueous solution of 760 g of ion-exchanged water was filtered. After the precipitated solid was filtered, the filtered solid was washed three times with 200 g of ion-exchanged water, and then washed once with 200 g of ethanol. The obtained solid was subjected to 60 ° C. It was dried under vacuum, whereby 15.1 g of the compound (A-9) was obtained.

<合成例10:樹脂(A-10)>
將4,4”-二胺基-對三聯苯變更為1,3-伸苯基二胺,以相同的莫耳當量進行了反應,除此以外,實施與合成例9相同的操作,從而得到了化合物(A-10)。
<Synthesis Example 10: Resin (A-10)>
The same operation as in Synthesis Example 9 was carried out except that the 4,4"-diamino-p-terphenyl was changed to 1,3-phenylenediamine and the reaction was carried out in the same molar equivalent. Compound (A-10).

<合成例11:樹脂(A-11)><Synthesis Example 11: Resin (A-11)>

[化學式22]
[Chemical Formula 22]

在容器內秤取化合物(i-2)9.6g、4-胺基苯酚4.4g、1,8-二吖雙環[5.4.0]-7-十一烯1,8-二吖雙環[5.4.0]-7-十一烯14.0g及N,N-二甲基乙醯胺32.7g,在氮氣氣流下將所得到之混合物加熱到100℃,並攪拌了1小時。接著,向攪拌後的反應溶液添加苯胺2.0mL,進而攪拌了10分鐘。將所得到之反應溶液冷卻至室溫之後,添加到離子交換水760g的水溶液。過濾經析出之固體之後,藉由離子交換水200g洗淨經過濾之固體3次,接著藉由乙醇200g洗淨了1次。在60℃下對所得到之固體進行真空乾燥,藉此得到了10.7g的化合物(A-11)。The compound (i-2) 9.6 g, 4-aminophenol 4.4 g, 1,8-dioxabicyclo[5.4.0]-7-undecene 1,8-diindole bicyclo[5.4. 0]-7-undecene 14.0 g and N,N-dimethylacetamide 32.7 g, the resulting mixture was heated to 100 ° C under a nitrogen stream, and stirred for 1 hour. Next, 2.0 mL of aniline was added to the stirred reaction solution, and the mixture was further stirred for 10 minutes. After the obtained reaction solution was cooled to room temperature, it was added to an aqueous solution of 760 g of ion-exchanged water. After the precipitated solid was filtered, the filtered solid was washed three times with 200 g of ion-exchanged water, and then washed once with 200 g of ethanol. The obtained solid was vacuum dried at 60 ° C, whereby 10.7 g of the compound (A-11) was obtained.

以下示出樹脂(A-1)~(A-11)的結構。The structures of the resins (A-1) to (A-11) are shown below.

[化學式23]
[Chemical Formula 23]

表1中示出了樹脂(A-1)~(A-11)的藉由GPC(Gel Permeation Chromatography,凝膠滲透色譜)測量之重量平均分子量(聚苯乙烯換算值)。Table 1 shows the weight average molecular weight (polystyrene equivalent value) of the resins (A-1) to (A-11) measured by GPC (Gel Permeation Chromatography).

又,對樹脂(A-1)~(A-11)中所包含之鈉離子、鉀離子及鈣離子的含量進行定量之結果,確認到分別小於0.01質量ppm。另外,鈉離子、鉀離子及鈣離子的定量中使用了ICP發光分光分析裝置(Perkin Elmer製“Optima7300DV”)。Further, as a result of quantifying the contents of sodium ions, potassium ions, and calcium ions contained in the resins (A-1) to (A-11), it was confirmed that they were each less than 0.01 ppm by mass. Further, an ICP emission spectroscopic analyzer ("Optima 7300 DV" manufactured by Perkin Elmer) was used for the quantification of sodium ions, potassium ions, and calcium ions.

又,對樹脂(A-1)~(A-11)中所包含之甲苯的含量進行定量之結果,確認到小於0.001質量ppm。
另外,按照公知的方法,對藉由氣相色譜法製成校準曲線之基礎上,對樹脂中的甲苯濃度進行了定量。
In addition, as a result of quantifying the content of toluene contained in the resins (A-1) to (A-11), it was confirmed that the content was less than 0.001 ppm by mass.
Further, the toluene concentration in the resin was quantified based on a calibration curve prepared by gas chromatography in accordance with a known method.

[表1]
[Table 1]

〔2〕各種成分
以下示出組成物中所包含之各種成分。
<特定三𠯤系樹脂>
關於特定三𠯤系樹脂(包含由通式(I-1)表示之重複單元或由下述通式(I-2)表示之重複單元之樹脂),使用了上述之樹脂(A-1)~(A-11)。
[2] Various Components The various components included in the composition are shown below.
<Specific triterpenoid resin>
With respect to a specific triterpene resin (a resin comprising a repeating unit represented by the formula (I-1) or a repeating unit represented by the following formula (I-2)), the above-mentioned resin (A-1) is used. (A-11).

<硬化性化合物>
使用了以下所示之硬化性化合物M-1~M-7。
<hardening compound>
The curable compounds M-1 to M-7 shown below were used.

[化學式24]
[Chemical Formula 24]

<光聚合起始劑>
使用了以下所示之光聚合起始劑I-1~I-12。
構造式中“Me”表示甲基,“Ph”表示苯基。
<Photopolymerization initiator>
The photopolymerization initiators I-1 to I-12 shown below were used.
In the formula, "Me" represents a methyl group, and "Ph" represents a phenyl group.

[化學式25]
[Chemical Formula 25]

<除了甲苯以外的溶劑>
作為除了甲苯以外的溶劑,使用了以下所示之溶劑。
NEP:N-乙基-2-吡咯叮酮
MFG:1-甲氧基-2-丙醇
CPN:環戊酮
<Solvent other than toluene>
As a solvent other than toluene, the solvent shown below was used.
NEP: N-ethyl-2-pyrrolidone
MFG: 1-methoxy-2-propanol
CPN: cyclopentanone

<界面活性劑>
使用了以下所示之界面活性劑。
MEGAFACE R-40(DIC CORPORATION製)
<Surfactant>
The surfactants shown below were used.
MEGAFACE R-40 (made by DIC CORPORATION)

<各成分中的特定金屬離子的含量>
關於上述之各成分,分別實施純化,確認各成分中的鈉離子、鉀離子及鈣離子的含量分別小於0.01質量ppm之後使用。另外,關於鈉離子、鉀離子及鈣離子的定量方法如上所述。
<Content of specific metal ions in each component>
Each of the above components was purified, and it was confirmed that the content of sodium ions, potassium ions, and calcium ions in each component was less than 0.01 mass ppm, respectively. Further, the quantitative methods for sodium ions, potassium ions, and calcium ions are as described above.

<各成分中的甲苯的含量>
關於上述之各成分,藉由真空乾燥,確認各成分中的甲苯的含量小於0.001質量ppm之後使用。另外,關於各成分中的甲苯的含量的定量方法如上所述。
<Content of toluene in each component>
Each of the above components was used by vacuum drying to confirm that the content of toluene in each component was less than 0.001 ppm by mass. Further, the method for quantifying the content of toluene in each component is as described above.

〔3〕組成物的製備
以表2所示之摻合比混合了上述各種成分(樹脂、除了甲苯以外的溶劑、硬化性化合物、聚合起始劑及界面活性劑)之後,對所得到之混合物進行真空乾燥,確認乾燥物中的鈉離子、鉀離子及鈣離子的含量分別小於0.01質量ppm。又,確認了甲苯的含量小於0.001質量ppm。
[3] Preparation of Composition The above various components (resin, solvent other than toluene, curable compound, polymerization initiator, and surfactant) were mixed at the blending ratio shown in Table 2, and the obtained mixture was obtained. Vacuum drying was performed to confirm that the content of sodium ions, potassium ions, and calcium ions in the dried product was less than 0.01 ppm by mass, respectively. Further, it was confirmed that the content of toluene was less than 0.001 ppm by mass.

接著,以成為表2中所記載的含量的方式添加樹脂、硬化性化合物、聚合起始劑、界面活性劑、除了甲苯以外的溶劑以及下述所示之甲苯、鈉離子(作為鈉源,溴化鈉甲醇溶液)、鉀離子(作為鉀源,溴化鉀甲醇溶液)及鈣離子(作為鈣離子源,溴化鈣甲醇溶液),藉此分別製備了各種組成物。另外,表2中的“除了甲苯以外的溶劑”欄中亦包括微量的上述離子源中的甲醇。又,表2中的各成分的含量表示相對於組成物總質量之含有比例(%)。Then, a resin, a curable compound, a polymerization initiator, a surfactant, a solvent other than toluene, and toluene and sodium ions (to be used as a sodium source, bromine) are added so as to have a content as shown in Table 2 Various compositions were prepared by separately dissolving sodium chloride solution, potassium ion (as potassium source, potassium bromide methanol solution) and calcium ion (as calcium ion source, calcium bromide methanol solution). Further, in the column of "solvent other than toluene" in Table 2, a trace amount of methanol in the above ion source is also included. Further, the content of each component in Table 2 indicates the content ratio (%) with respect to the total mass of the composition.

關於所得到之組成物中的鈉離子、鉀離子及鈣離子的含量,使用ICP發光分光分析裝置(Agilent Technologies Japan, Ltd製“Agilent7800 ICP-MS”)來進行了定量。
又,關於所得到之組成物中的甲苯的含量,按照公知的方法,在藉由氣相色譜法製成校準曲線之基礎上進行了定量。
The content of sodium ions, potassium ions, and calcium ions in the obtained composition was quantified using an ICP emission spectroscopic analyzer ("Agilent 7800 ICP-MS" manufactured by Agilent Technologies Japan Co., Ltd.).
Further, the content of toluene in the obtained composition was quantified based on a calibration curve prepared by gas chromatography in accordance with a known method.

〔4〕評價
使用所得到之組成物,進行了熱循環後的硬化膜的折射率的評價、熱循環後的硬化膜的分光變動、熱循環後的硬化膜的缺陷抑制性的評價及塗佈膜的表面外觀評價。
[4] Evaluation of the composition obtained by using the obtained composition, evaluation of the refractive index of the cured film after thermal cycling, spectroscopic fluctuation of the cured film after the thermal cycle, evaluation of the defect suppressing property of the cured film after the thermal cycle, and coating Evaluation of the surface appearance of the film.

<熱循環後的硬化膜的折射率的評價>
分別在使用環氧樹脂(JER-827、Japan Epoxy Resins Co., Ltd.製)形成了環氧樹脂層之5cm×5cm的玻璃基板上旋轉塗佈表2中所記載的組成物,在100℃下烘烤(加熱)了3分鐘。接著,使用高壓水銀燈,對所得到之塗佈膜進行了積算曝光量成為200mJ/cm2 之曝光。之後,在200℃下烘烤玻璃基板3分鐘,得到了膜厚為1μm的硬化膜。將所得到之硬化膜加入到冷熱衝擊試驗裝置(ESPEC THERMAL Shock CHAMBER TSA-70L (TABAI ESPEC公司製)),施加300個週期的-65℃/30分鐘→125℃/30分鐘的冷熱循環。使用J.A.Woollam Co.,Inc.製VASE,測量波長300~1500nm的折射率,將波長589nm中的折射率的值作為各膜的折射率。
<Evaluation of refractive index of cured film after thermal cycle>
The composition described in Table 2 was spin-coated on a glass substrate of 5 cm × 5 cm in which an epoxy resin layer was formed using an epoxy resin (JER-827, manufactured by Japan Epoxy Resins Co., Ltd.) at 100 ° C. Bake (heated) for 3 minutes. Next, the obtained coating film was subjected to exposure with an integrated exposure amount of 200 mJ/cm 2 using a high pressure mercury lamp. Thereafter, the glass substrate was baked at 200 ° C for 3 minutes to obtain a cured film having a film thickness of 1 μm. The obtained cured film was placed in a thermal shock test apparatus (ESPEC THERMAL Shock CHAMBER TSA-70L (manufactured by TABAI ESPEC)), and 300 cycles of -65 ° C / 30 minutes → 125 ° C / 30 minutes of hot and cold cycles were applied. The refractive index of the wavelength of 300 to 1500 nm was measured using VASE manufactured by JA Woollam Co., Inc., and the value of the refractive index at a wavelength of 589 nm was defined as the refractive index of each film.

關於測量之折射率的值,依據以下基準評價了熱循環後的硬化膜的折射率。
“A”:折射率為1.85以上
“B”:折射率為1.70以上且小於1.85
“C”:折射率小於1.70
Regarding the value of the measured refractive index, the refractive index of the cured film after the thermal cycle was evaluated in accordance with the following criteria.
"A": refractive index is 1.85 or more "B": refractive index is 1.70 or more and less than 1.85
"C": refractive index less than 1.70

<熱循環後的硬化膜的分光變動(透射率的變化)>
上述折射率的評價中,測量了冷熱衝擊試驗前後的硬化膜的波長450nm的透射率的變化量(|冷熱衝擊試驗後的透射率-冷熱衝擊試驗前的透射率|(絕對值))。
關於所測量之透射率的變化量,依據以下基準評價了熱循環後的硬化膜的分光變動(透射率的變化)。
“A”:透射率的變動率小於1%。
“B”:透射率的變動率為1%以上且小於5%。
“C”:透射率的變動率為5%以上,且實用上有問題之等級。
另外,上述透射率的變動率(%)係藉由{(透射率的變化量)/(冷熱衝擊試驗前的透射率)}×100來算出之值。
<Spectral variation of the cured film after thermal cycling (change in transmittance)>
In the evaluation of the refractive index, the amount of change in transmittance at a wavelength of 450 nm of the cured film before and after the thermal shock test (the transmittance after the thermal shock test - the transmittance before the thermal shock test | (absolute value)) was measured.
Regarding the amount of change in the measured transmittance, the spectral variation (change in transmittance) of the cured film after the heat cycle was evaluated based on the following criteria.
"A": The rate of change of transmittance is less than 1%.
"B": The rate of change of the transmittance is 1% or more and less than 5%.
"C": The rate of change in transmittance is 5% or more, and is practically problematic.
In addition, the rate of change (%) of the transmittance is a value calculated by {(amount of change in transmittance)/(transmittance before cold shock test)}×100.

<熱循環後的硬化膜的缺陷抑制性的評價>
分別在使用環氧樹脂(JER-827、Japan Epoxy Resins Co., Ltd.製)形成了環氧樹脂層之矽晶片上旋轉塗佈表2中所記載的組成物,進而在100℃下烘烤(加熱)3分鐘,形成了膜厚1μm的塗佈膜。接著,使用高壓水銀燈,對所得到之塗佈膜進行了積算曝光量成為200mJ/cm2 的曝光。之後,在200℃下烘烤玻璃基板3分鐘,得到了膜厚為1μm的硬化膜。將所得到之硬化膜加入到冷熱衝擊試驗裝置(ESPEC THERMAL Shock CHAMBER TSA-70L (TABAI ESPEC公司製)),施加300個週期的-65℃/30分鐘→125℃/30分鐘的冷熱循環之後,使用缺陷檢查裝置(Applied Materials, Inc.製ComPlus)進行了硬化膜的缺陷數(個/cm2 )測量。
<Evaluation of defect inhibition property of cured film after thermal cycle>
The composition described in Table 2 was spin-coated on a tantalum wafer in which an epoxy resin layer was formed using an epoxy resin (JER-827, manufactured by Japan Epoxy Resins Co., Ltd.), and further baked at 100 ° C. (heating) for 3 minutes, a coating film having a film thickness of 1 μm was formed. Next, the obtained coating film was subjected to exposure with an integrated exposure amount of 200 mJ/cm 2 using a high pressure mercury lamp. Thereafter, the glass substrate was baked at 200 ° C for 3 minutes to obtain a cured film having a film thickness of 1 μm. The obtained cured film was placed in a thermal shock test apparatus (ESPEC THERMAL Shock CHAMBER TSA-70L (manufactured by TABAI ESPEC)), and after 300 cycles of -65 ° C / 30 minutes → 125 ° C / 30 minutes of hot and cold cycles were applied. The number of defects (number/cm 2 ) of the cured film was measured using a defect inspection device (ComPlus manufactured by Applied Materials, Inc.).

關於測量之缺陷數,依據以下基準評價了熱循環後的硬化膜的缺陷抑制性。
“A”:缺陷數為0個/cm2 以上且小於10個/cm2
“B”:缺陷數為10個/cm2 以上且小於20個/cm2
“C”:缺陷數為20個/cm2 以上,且實用上有問題之等級。
Regarding the number of defects measured, the defect suppressing property of the cured film after the heat cycle was evaluated based on the following criteria.
"A": the number of defects is 0 / cm 2 or more and less than 10 / cm 2
"B": the number of defects is 10 / cm 2 or more and less than 20 / cm 2
"C": The number of defects is 20 pieces/cm 2 or more, and there is a problem level in practical use.

<塗佈膜的表面外觀評價(塗佈膜的PCD(Post Coating Delay,塗佈後延遲))評價>
分別在使用環氧樹脂(JER-827、Japan Epoxy Resins Co., Ltd.製)形成了環氧樹脂層之矽晶片上旋轉塗佈表2中所記載的組成物,進而在100℃烘烤(加熱)3分鐘,形成膜厚1μm的塗佈膜A,藉由光學顯微鏡觀察到沒有異常。在25℃下將該塗佈膜A放置100小時,藉由光學顯微鏡觀察到塗佈膜B。
<Evaluation of Surface Appearance of Coating Film (PCD (Post Coating Delay) of Coating Film) Evaluation>
The composition described in Table 2 was spin-coated on a silicon wafer on which an epoxy resin layer was formed using an epoxy resin (JER-827, manufactured by Japan Epoxy Resins Co., Ltd.), and further baked at 100 ° C ( The coating film A having a film thickness of 1 μm was formed by heating for 3 minutes, and no abnormality was observed by an optical microscope. This coating film A was allowed to stand at 25 ° C for 100 hours, and the coating film B was observed by an optical microscope.

與以下的基準區分,評價所觀察之塗佈膜B,評價了塗佈膜的表面外觀。
“A”:沒有觀察到膜的表面粗糙度或異物。
“B”:儘管局部觀察到膜的表面粗糙度或異物,但是實用上沒有問題之等級。
“C”:局部觀察到膜的表面粗糙度或異物,實用上有問題之等級。
The coating film B observed was evaluated in accordance with the following criteria, and the surface appearance of the coating film was evaluated.
"A": No surface roughness or foreign matter of the film was observed.
"B": Although the surface roughness or foreign matter of the film was partially observed, there was no problem in practical use.
"C": The surface roughness or foreign matter of the film was observed locally, and the level of the problem was practically problematic.

以下示出表2。
另外,表2中,“特定金屬離子”欄中的“0”係指組成物中的特定金屬離子的含量小於0.01質量ppm。又,“甲苯”欄中的“0”係指組成物中的甲苯的含量小於0.001質量ppm。
又,表2中的“除了甲苯以外的溶劑”欄的“剩餘量”係指從組成物的所有比例(100%)去除了組成物中的“除了甲苯以外的溶劑”以外的構成成分的合計質量比例之量。
Table 2 is shown below.
Further, in Table 2, "0" in the column of "specific metal ions" means that the content of the specific metal ions in the composition is less than 0.01 mass ppm. Further, "0" in the "toluene" column means that the content of toluene in the composition is less than 0.001 ppm by mass.
In addition, the "residual amount" in the column of "solvent other than toluene" in Table 2 means the total of the components other than the solvent other than toluene removed from the composition in all ratios (100%) of the composition. The amount of mass ratio.

[表2]
[Table 2]

從表2的結果可知,藉由實施例的組成物,所得到之硬化膜在高溫-低溫環境下反覆曝光之後亦可以抑制缺陷產生,又在高溫-低溫環境下反覆曝光之後亦可以抑制分光變動(透射率的變化)減少。
又,從實施例1~21的對比確認到,上述組成物中特定金屬離子的總含量相對於組成物總質量為0.03~10質量ppm之情況下,在高溫-低溫環境下反覆曝光之後的硬化膜的缺陷抑制性更優異。
又,從實施例1~21的對比確認到,上述組成物中甲苯的含量相對於組成物總質量為0.001~10質量ppm之情況下,表面外觀特性更優異。
又,從實施例9、實施例15及實施例19的對比確認到,上述組成物包含由上述之通式(I-2)表示之三𠯤樹脂之情況下,W2 係由上述之通式(III)表示之2價的連接基且A1 ~A3 中所包含之伸芳基為1,4-伸苯基時或A1 ~A3 均表示伸芳基時,在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異,並且在高溫-低溫環境下反覆曝光之後硬化膜的分光變動(透射率的變化)亦減少。
又,從實施例1~3、實施例7、8、實施例10~14及實施例17~18及實施例16的對比確認到,上述組成物包含上述之通式(I-1)中的X1 ~X3 均為-NR1 -之特定三𠯤系樹脂之情況下,在高溫-低溫環境下反覆曝光之後的硬化膜的折射率更優異,並且在高溫-低溫環境下反覆曝光之後制硬化膜的分光變動(透射率的變化)亦減少。
From the results of Table 2, it is understood that the cured film obtained by the composition of the examples can also suppress the occurrence of defects after repeated exposure in a high-temperature-low temperature environment, and can also suppress the spectral change after repeated exposure in a high-temperature-low temperature environment. (change in transmittance) is reduced.
Further, from the comparison of Examples 1 to 21, it was confirmed that the total content of the specific metal ions in the above composition was from 0.03 to 10 ppm by mass based on the total mass of the composition, and hardening after repeated exposure in a high-temperature-low temperature environment. The film has more excellent defect suppressing properties.
Moreover, it was confirmed from the comparison of Examples 1 to 21 that when the content of the toluene in the above composition is 0.001 to 10 ppm by mass based on the total mass of the composition, the surface appearance characteristics are more excellent.
Further, from the comparison of Example 9, Example 15, and Example 19, it was confirmed that the above composition contains the triterpene resin represented by the above formula (I-2), and the W 2 system has the above formula. (III) indicates a divalent linking group and the exoaryl group contained in A 1 to A 3 is a 1,4-phenylene group or when both of A 1 to A 3 represent an exoaryl group, in a high-temperature environment The cured film after the reverse exposure is more excellent in refractive index, and the spectral variation (change in transmittance) of the cured film after repeated exposure in a high-temperature-low temperature environment is also reduced.
Further, from the comparison of Examples 1 to 3, Examples 7 and 8, Examples 10 to 14, and Examples 17 to 18 and Example 16, it was confirmed that the above composition contained the above formula (I-1). In the case where the specific triterpene resin of X 1 to X 3 is -NR 1 -, the refractive index of the cured film after repeated exposure in a high-temperature-low temperature environment is more excellent, and is formed after repeated exposure in a high-temperature-low temperature environment. The spectral variation (change in transmittance) of the cured film is also reduced.

no

Claims (17)

一種組成物,其包括: 樹脂,包含由通式(I-1)表示之重複單元或由通式(I-2)表示之重複單元; 溶劑;以及 特定金屬離子,選自包括鈉離子、鉀離子及鈣離子之群組, 相對於組成物總質量,該特定金屬離子的總含量為0.01質量ppm~30質量ppm, 通式(I-1)中,X1 、X2 及X3 分別獨立地表示-NR1 -、-O-或-S-,W1 表示2價的連接基,V表示烷基、芳基或雜環基,R1 表示氫原子或取代基, 通式(I-2)中,X4 、X5 及X6 分別獨立地表示-NR2 -、-O-或-S-,W2 表示2價的連接基,R2 表示氫原子或取代基。A composition comprising: a resin comprising a repeating unit represented by the formula (I-1) or a repeating unit represented by the formula (I-2); a solvent; and a specific metal ion selected from the group consisting of sodium ions and potassium The group of ions and calcium ions, the total content of the specific metal ions is 0.01 mass ppm to 30 mass ppm, relative to the total mass of the composition. In the formula (I-1), X 1 , X 2 and X 3 each independently represent -NR 1 -, -O- or -S-, W 1 represents a divalent linking group, and V represents an alkyl group or an aryl group. Or a heterocyclic group, R 1 represents a hydrogen atom or a substituent, Formula (I-2) in, X 4, X 5 and X 6 each independently represents a -NR 2 -, - O- or -S-, W 2 represents a divalent linking group, R 2 represents a hydrogen atom or a substituted base. 如申請專利範圍第1項所述之組成物,其中 該溶劑包含甲苯, 相對於組成物總質量,該甲苯的含量為0.001質量ppm~10質量ppm。Such as the composition described in claim 1, wherein The solvent contains toluene, The content of the toluene is from 0.001 ppm by mass to 10 ppm by mass based on the total mass of the composition. 如申請專利範圍第1項或第2項所述之組成物,其中 通式(I-1)中,該V為由通式(II)表示之基團, 通式(II)中,*表示與通式(I-1)中的X3 的鍵結位置,R3 及R4 分別獨立地表示取代基,m及n分別獨立地表示0~5的整數,其中,m+n為1~5。The composition according to claim 1 or 2, wherein in the formula (I-1), the V is a group represented by the formula (II), In the formula (II), * represents a bonding position with X 3 in the formula (I-1), and R 3 and R 4 each independently represent a substituent, and m and n each independently represent an integer of 0 to 5 Where m+n is 1 to 5. 如申請專利範圍第3項所述之組成物,其中 通式(II)中,該m表示0,該n表示1,該R4 表示芳基、雜環基、氰基、硝基、烷基、烷硫基或鹵素原子。The composition according to claim 3, wherein in the formula (II), the m represents 0, and the n represents 1, and the R 4 represents an aryl group, a heterocyclic group, a cyano group, a nitro group, an alkyl group. , alkylthio or halogen atom. 如申請專利範圍第4項所述之組成物,其中 由該通式(II)表示之基團為由通式(IIA)表示之基團, 通式(IIA)中,*表示與通式(I-1)中的X3 的鍵結位置,R4 表示芳基、雜環基、氰基、硝基、烷基、烷硫基或鹵素原子。The composition according to claim 4, wherein the group represented by the formula (II) is a group represented by the formula (IIA). In the formula (IIA), * represents a bonding position with X 3 in the formula (I-1), and R 4 represents an aryl group, a heterocyclic group, a cyano group, a nitro group, an alkyl group, an alkylthio group or a halogen. atom. 如申請專利範圍第1項或第2項所述之組成物,其中 通式(I-1)中,該X1 ~X3 均為-NR1 -。The composition according to claim 1 or 2, wherein in the formula (I-1), the X 1 to X 3 are -NR 1 -. 如申請專利範圍第1項或第2項所述之組成物,其中 通式(I-1)中的該W1 及通式(I-2)中的該W2 分別獨立地為由通式(III)表示之2價的連接基, 通式(III)中,A1 及A3 分別獨立地表示單鍵或伸芳基,A1 及A3 中的至少一者表示伸芳基,A2 表示單鍵、-O-、CO-、-S-、-SO2 -、-NRA -或伸芳基,RA 表示氫原子或取代基,*表示鍵結位置。The composition according to claim 1 or 2, wherein the W 1 in the formula (I-1) and the W 2 in the formula (I-2) are each independently a formula (III) indicates a divalent linking group, In the formula (III), A 1 and A 3 each independently represent a single bond or an extended aryl group, and at least one of A 1 and A 3 represents an extended aryl group, and A 2 represents a single bond, -O-, CO-. , -S-, -SO 2 -, -NR A - or an extended aryl group, R A represents a hydrogen atom or a substituent, and * represents a bonding position. 如申請專利範圍第7項所述之組成物,其中 通式(I-2)的該W2 中,該A1 ~A3 均表示伸芳基。The composition according to claim 7, wherein in the W 2 of the formula (I-2), the A 1 to A 3 each represent an extended aryl group. 如申請專利範圍第7項所述之組成物,其中 通式(I-2)的該W2 中,該伸芳基為1,4-伸苯基。The composition according to claim 7, wherein in the W 2 of the formula (I-2), the extended aryl group is a 1,4-phenylene group. 如申請專利範圍第1項或第2項所述之組成物,其還包含硬化性化合物。The composition of claim 1 or 2, further comprising a curable compound. 如申請專利範圍第1項或第2項所述之組成物,其還包含聚合起始劑。The composition of claim 1 or 2, further comprising a polymerization initiator. 一種塗佈膜,其由申請專利範圍第1項至第11項中任一項所述之組成物形成。A coating film which is formed from the composition according to any one of claims 1 to 11. 一種硬化膜,其硬化申請專利範圍第12項所述之組成物來形成。A cured film formed by curing the composition described in claim 12 of the patent application. 一種透鏡,其包括申請專利範圍第13項所述之硬化膜。A lens comprising the cured film of claim 13 of the patent application. 一種固體攝像元件,其具備申請專利範圍第14項所述之透鏡。A solid-state imaging device comprising the lens of claim 14 of the patent application. 一種樹脂,其包含由通式(IV-1)表示之重複單元, 通式(IV-1)中,X1 、X2 及X3 分別獨立地表示-NR1 -、-O-或-S-,W1 表示2價的連接基,R1 表示氫原子或取代基,R5 表示雜環基、氰基、硝基、烷基、烷硫基或鹵素原子。a resin comprising a repeating unit represented by the formula (IV-1), In the formula (IV-1), X 1 , X 2 and X 3 each independently represent -NR 1 -, -O- or -S-, W 1 represents a divalent linking group, and R 1 represents a hydrogen atom or a substitution. And R 5 represents a heterocyclic group, a cyano group, a nitro group, an alkyl group, an alkylthio group or a halogen atom. 一種樹脂,其包含由通式(IV-2)表示之重複單元, 通式(IV-2)中,X4 、X5 及X6 分別獨立地表示-NR2 -、-O-或-S-,R2 表示氫原子或取代基。a resin comprising a repeating unit represented by the formula (IV-2), In the formula (IV-2), X 4 , X 5 and X 6 each independently represent -NR 2 -, -O- or -S-, and R 2 represents a hydrogen atom or a substituent.
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JP3817696B2 (en) * 2002-11-07 2006-09-06 山栄化学株式会社 Triazine dihalide and aromatic (poly) guanamine containing phenolic hydroxyl group, and composition thereof
JP2007077230A (en) * 2005-09-13 2007-03-29 Toyobo Co Ltd Polyimide film
JP5712921B2 (en) * 2009-05-07 2015-05-07 日産化学工業株式会社 Triazine ring-containing polymer and film-forming composition containing the same
JP6412316B2 (en) * 2013-10-01 2018-10-24 出光興産株式会社 Composition comprising a triazine ring-containing polymer
JP6515811B2 (en) * 2013-12-24 2019-05-22 日産化学株式会社 Triazine polymer-containing composition
WO2016114337A1 (en) * 2015-01-15 2016-07-21 日産化学工業株式会社 Triazine-ring-containing polymer and composition containing same
KR102647609B1 (en) * 2015-12-21 2024-03-14 닛산 가가쿠 가부시키가이샤 Triazine ring-containing polymer and composition for forming a film containing the same
WO2017138547A1 (en) * 2016-02-09 2017-08-17 日産化学工業株式会社 Triazine-ring-containing polymer and composition including same

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