TW201935793A - Semiconductor device - Google Patents

Semiconductor device Download PDF

Info

Publication number
TW201935793A
TW201935793A TW107104405A TW107104405A TW201935793A TW 201935793 A TW201935793 A TW 201935793A TW 107104405 A TW107104405 A TW 107104405A TW 107104405 A TW107104405 A TW 107104405A TW 201935793 A TW201935793 A TW 201935793A
Authority
TW
Taiwan
Prior art keywords
semiconductor
terminal
emitter
collector
resistor
Prior art date
Application number
TW107104405A
Other languages
Chinese (zh)
Inventor
盧昭正
Original Assignee
盧昭正
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 盧昭正 filed Critical 盧昭正
Priority to TW107104405A priority Critical patent/TW201935793A/en
Publication of TW201935793A publication Critical patent/TW201935793A/en

Links

Landscapes

  • Electronic Switches (AREA)

Abstract

The semiconductor device comprises a first semiconductor, a second semiconductor and a third semiconductor, constituting a semiconductor device that is required for an application circuit having a load overload or short-circuit protection function, and is equivalent to a single semiconductor characteristic, which avoids the damage caused by overload or short-circuit at both terminals of the load.

Description

半導體裝置 Semiconductor device

本發明半導體裝置,具有在電路應用過程中負載兩端發生過載或短路之保護功能及其包括有第一半導體、第二半導體及第三半導體之電子技術領域。 The semiconductor device of the present invention has the protection function of overload or short circuit occurring at both ends of a load during a circuit application process, and an electronic technology field including a first semiconductor, a second semiconductor, and a third semiconductor.

如圖1所示,為電池放電保護裝置之實施例,係為台灣發明專利,專利字號:發明第I583089號,為一種安全性的手動運作裝置,其特徵如下: As shown in Figure 1, it is an example of a battery discharge protection device, which is a Taiwan invention patent, patent number: Invention No. I583089, is a safe manual operation device, which has the following characteristics:

1.若負載100發生短路時,其第一半導體12開路,電流供電停止而保護電池11。 1. If the load 100 is short-circuited, the first semiconductor 12 is opened, and current supply is stopped to protect the battery 11.

2.若要恢復正常的電路功能,必需將負載100兩端之短路原因排除,再重新將電池11送電。 2. To restore the normal circuit function, it is necessary to eliminate the cause of the short circuit at both ends of the load 100, and then re-power the battery 11.

本發明的目的: Purpose of the invention:

本發明應用第一半導體、第二半導體、第三半導體及電路元件,達到等同單一半導體功能的三電極特徵,而且能在直流電源供電中發生負載短路時直流電源得到保護。 The present invention uses the first semiconductor, the second semiconductor, the third semiconductor, and the circuit element to achieve the three-electrode feature equivalent to a single semiconductor function, and can protect the DC power supply when a load short circuit occurs during the DC power supply.

當負載發生短路時,本發明應用第二半導體能在極短之時間內執行第一半導體開路動作,達到保護直流電源之功能及避免因負載短路而引起之各種災 害。 When the load is short-circuited, the application of the second semiconductor in the present invention can perform the open-circuit action of the first semiconductor in a very short period of time to achieve the function of protecting the DC power supply and avoiding various disasters caused by the load short-circuit. harm.

本發明應用第三半導體,執行本發明重置(Reset)之功能,達到短路原因排除時不必重新再送直流電源的動作。 The present invention uses a third semiconductor to perform the reset function of the present invention, and it is not necessary to resend the DC power when the cause of the short circuit is eliminated.

本發明有下列之特徵: The invention has the following features:

1.本發明之第一半導體其負責直流電源之開路(Off)與導通(On)供電於負載。 1. The first semiconductor of the present invention is responsible for supplying power to the load by turning off and on the direct current power.

2.本發明之第二半導體,其負責控制第一半導體之開路與導通動作,以達到負載兩端發生短路時保護直流電源的目的。 2. The second semiconductor of the present invention is responsible for controlling the opening and conducting actions of the first semiconductor to achieve the purpose of protecting the DC power supply when a short circuit occurs across the load.

3.本發明之第三半導體負責重置功能,當負載短路排除時,不必重啟直流電源之開路與導通動作。 3. The third semiconductor of the present invention is responsible for the reset function. When the load short circuit is eliminated, it is not necessary to restart the open circuit and conduction of the DC power supply.

4.本發明之第一半導體包括N通道金屬氧化半導體場效電晶體(N Channel Metal Oxide Semiconductor Field Effect Transistor,N Channel MOSFET)、N型電晶體(N Type transistor)及絕緣閘極雙極電晶體(Insulated Gate Bipolar Transistor,IGBT)三者可以根據需求自行選用。 4. The first semiconductor of the present invention includes an N-Channel Metal Oxide Semiconductor Field Effect Transistor (N Channel MOSFET), an N-type transistor, and an insulated gate bipolar transistor. (Insulated Gate Bipolar Transistor, IGBT) The three can be selected according to their needs.

5.本發明之第二半導體包括N型電晶體、N通道金屬氧化半導體場效電晶體及絕緣閘極雙極電晶體三者可以根據需求自行選用。 5. The second semiconductor of the present invention includes an N-type transistor, an N-channel metal oxide semiconductor field effect transistor, and an insulated gate bipolar transistor. The three semiconductors can be selected according to demand.

6.本發明之第三半導體為光電耦合器(Photo Coupler),並且設有時間控制單元以達到控制重置的時間。 6. The third semiconductor of the present invention is a photo coupler, and a time control unit is provided to control the reset time.

7.本發明可以選用第一電阻器、第二電阻器、第三電阻器、第四電阻器及第一電容器組成具有三端特徵的半導體單體以方便應用。 7. The present invention may use a first resistor, a second resistor, a third resistor, a fourth resistor, and a first capacitor to form a semiconductor monomer with three-terminal characteristics for convenient application.

11‧‧‧第一半導體 11‧‧‧First Semiconductor

12‧‧‧第二半導體 12‧‧‧Second Semiconductor

13‧‧‧第三半導體 13‧‧‧Third Semiconductor

14‧‧‧第四半導體 14‧‧‧ Fourth Semiconductor

15‧‧‧第五半導體 15‧‧‧Fifth Semiconductor

16‧‧‧第六半導體 16‧‧‧ Sixth Semiconductor

17‧‧‧第七半導體 17‧‧‧Seventh Semiconductor

21‧‧‧第一電阻器 21‧‧‧first resistor

22‧‧‧第二電阻器 22‧‧‧Second resistor

23‧‧‧第三電阻器 23‧‧‧Third resistor

24‧‧‧第四電阻器 24‧‧‧Fourth resistor

25‧‧‧第一電容器 25‧‧‧first capacitor

30‧‧‧第一端 30‧‧‧ the first end

40‧‧‧第二端 40‧‧‧ second end

50‧‧‧第三端 50‧‧‧ third end

60‧‧‧第一開關 60‧‧‧First switch

R‧‧‧第一開關的主接點 R‧‧‧ the main contact of the first switch

T‧‧‧第一開關的第一接點 T‧‧‧First contact of the first switch

U‧‧‧第一開關的第二接點 U‧‧‧ the second contact of the first switch

V‧‧‧第一開關的第三接點 V‧‧‧ the third contact of the first switch

100‧‧‧負載 100‧‧‧ load

200‧‧‧第一直流電源 200‧‧‧First DC Power Supply

300‧‧‧第二直流電源 300‧‧‧second DC power supply

圖1為習知電池放電保護裝置之實施例。 FIG. 1 shows an embodiment of a conventional battery discharge protection device.

圖2為本發明半導體裝置第一實施例。 FIG. 2 is a first embodiment of a semiconductor device according to the present invention.

圖3為本發明半導體裝置第二實施例。 FIG. 3 is a second embodiment of the semiconductor device of the present invention.

圖4為本發明半導體裝置第三實施例。 FIG. 4 is a third embodiment of the semiconductor device of the present invention.

圖5為本發明半導體裝置第四實施例。 FIG. 5 shows a fourth embodiment of the semiconductor device of the present invention.

圖6為本發明半導體裝置第五實施例。 FIG. 6 is a fifth embodiment of the semiconductor device of the present invention.

如圖2所示,為本發明半導體裝置第一實施例,自圖中可知,其包括第一半導體11、第二半導體12、第三半導體13、第一電阻器21(First Resistor,21)、第二電阻器22(Second Resistor,22)、第三電阻器23(Third Resistor 23)、第四電阻器24(Fourth Resistor,24)、第一電容器25(First Capacity,25)、第一端30(First Termina,30)、第二端40(SecondTerminal,40)、第三端50(Third Terminal.50)、第一開關60(First Switch,60)、負載100(Load,100)、第一直流電源200(First DC Power Source,200)及第二直流電源300(Second DC Power Source,300);第一半導體11的源極S(Source,S)連接第二半導體12的射極E(Emitter,E)、第四電阻器24的另一端、第三半導體13的陰極端N(Cathode,N)及第一電容器25的負電端,第一半導體11的閘極G(Gate,G)連接第二半導體12的集極C(Collector,C)及第一電阻器21的另一端,第一電阻器21的一端連接第一端30;第二半導體12的基極B(Base,B)連接第三半導體13的射極E及第四電阻器24的一端,第二半導體12的射極E連接第三端50;第二電阻器22的一端及第一半導體11 的汲極D(Drain,D)連接第二端40,第二電阻器22的另一端連接第三半導體13的受極C,第三電阻器23的一端連接第一端30,第三電阻器23的另一端連接第三半導體13的陽極端P(Anode,P)及第一電容器25的正電端,第一電容器25的負電端連接第四電阻器24的另一端、第一半導體11的源極S及第二半導體12的射極E,連接第三端50;負載100的一端連接第一直流電源200的正電端,負載100的另一端連接第二端40,第一直流電源200的負電端及第二直流電源300的負電端連接第三端50,第一開關60的主接點R連接第一端30,第一開關60的第一接點T連接第一直流電源200的正電端,第一開關60的第二接點U為空檔,第一開關60的第三接點V連接第二直流電源300的正電端;第一半導體11為N通道金屬氧化半導體場效電晶體,第二半導體12為N型電晶體,第三半導體13為光電耦合器。 As shown in FIG. 2, this is a first embodiment of a semiconductor device according to the present invention. As can be seen from the figure, it includes a first semiconductor 11, a second semiconductor 12, a third semiconductor 13, a first resistor 21 (First Resistor, 21), Second resistor 22 (Second Resistor, 22), third resistor 23 (Third Resistor 23), fourth resistor 24 (Fourth Resistor, 24), first capacitor 25 (First Capacity, 25), first terminal 30 (First Termina, 30), second terminal 40 (SecondTerminal, 40), third terminal 50 (Third Terminal. 50), first switch 60 (First Switch, 60), load 100 (Load, 100), first Current source 200 (First DC Power Source, 200) and second DC power source 300 (Second DC Power Source, 300); the source S (Source, S) of the first semiconductor 11 is connected to the emitter E (Emitter) of the second semiconductor 12 E), the other end of the fourth resistor 24, the cathode terminal N (Cathode, N) of the third semiconductor 13, and the negative electrical terminal of the first capacitor 25, and the gate G (Gate, G) of the first semiconductor 11 is connected to the The collector C (Collector, C) of the two semiconductors 12 and the other end of the first resistor 21, one end of the first resistor 21 is connected to the first end 30; the base B (Base, B) of the second semiconductor 12 is connected to the first The emitter E of the three semiconductors 13 and one end of the fourth resistor 24, the emitter E of the second semiconductor 12 is connected to the third end 50; one end of the second resistor 22 and the first semiconductor 11 The drain D (Drain, D) is connected to the second terminal 40, the other end of the second resistor 22 is connected to the acceptor C of the third semiconductor 13, one end of the third resistor 23 is connected to the first terminal 30, and the third resistor The other end of 23 is connected to the anode terminal P (Anode, P) of the third semiconductor 13 and the positive electrical end of the first capacitor 25, and the negative electrical end of the first capacitor 25 is connected to the other end of the fourth resistor 24 and the first semiconductor 11 The source S and the emitter E of the second semiconductor 12 are connected to the third terminal 50; one end of the load 100 is connected to the positive terminal of the first DC power supply 200, and the other end of the load 100 is connected to the second terminal 40 and the first DC The negative electrical terminal of the power supply 200 and the negative electrical terminal of the second DC power supply 300 are connected to the third terminal 50. The main contact R of the first switch 60 is connected to the first terminal 30. The first contact T of the first switch 60 is connected to the first DC. The positive terminal of the power supply 200. The second contact U of the first switch 60 is neutral. The third contact V of the first switch 60 is connected to the positive terminal of the second DC power supply 300. The first semiconductor 11 is an N-channel metal. The semiconductor field effect transistor is oxidized, the second semiconductor 12 is an N-type transistor, and the third semiconductor 13 is a photocoupler.

如圖2所示,當第一開關60的主接點R轉向第一接點T,此時第一直流電源200的正電端供電於第一端30及負載100到第二端40,而第一直流電源200的負電端連接第三端50,此時第一端30供電於第一電阻器21到第一半導體11的閘極G及第二半導體12的集極C,因此第一半導體11的汲極D與源極S導通,第一直流電源200供電於負載100,同時第三電阻器23供電於第三半導體13的陽極端P到陰極端N,此時第三半導體13的集極C與射極E導通,因此第二半導體12的集極C與射極E開路;其中第三電阻器23與第一電容器25構成一時間常數電路(Time Constant Circuit),可以控制第三半 導體13的陽極端P與陰極端N的導通時間,以達到重置時間的控制或用同等功能的時間控制器替代,而不自限。 As shown in FIG. 2, when the main contact R of the first switch 60 is turned to the first contact T, the positive electric terminal of the first DC power supply 200 is supplied to the first terminal 30 and the load 100 to the second terminal 40 at this time. The negative terminal of the first DC power source 200 is connected to the third terminal 50. At this time, the first terminal 30 supplies power to the gate G of the first resistor 21 to the first semiconductor 11 and the collector C of the second semiconductor 12, so the first The drain D and the source S of a semiconductor 11 are turned on. The first DC power source 200 supplies power to the load 100, and the third resistor 23 supplies power from the anode terminal P to the cathode terminal N of the third semiconductor 13. At this time, the third semiconductor The collector C of 13 is connected to the emitter E, so the collector C of the second semiconductor 12 is open to the emitter E. The third resistor 23 and the first capacitor 25 form a time constant circuit, which can be controlled. Third half The conducting time of the anode terminal P and the cathode terminal N of the conductor 13 is controlled by the reset time or replaced by a time controller with the same function, without limitation.

如圖2所示,若將第一開關60的主接點R轉向第二接點U時,第一直流電源200不供電於第一端30,此時第一半導體11的汲極D與源極S開路,第一直流電源200不供電於負載100,第三半導體13的集極C與射極E開路,第二半導體12的基極B與射極E無電壓。 As shown in FIG. 2, when the main contact R of the first switch 60 is turned to the second contact U, the first DC power supply 200 does not supply power to the first terminal 30. At this time, the drain D of the first semiconductor 11 and the The source S is open, the first DC power source 200 does not supply power to the load 100, the collector C and the emitter E of the third semiconductor 13 are open, and the base B and the emitter E of the second semiconductor 12 have no voltage.

如圖2所示,當第一開關60的主接點R轉向第三接點V,此時第二直流電源300的正電端供電於第一端30及第一直流電源200的正電端供電於負載100到第二端40,而第一直流電源200的負電端連接第三端50,因為有第二直流電源300供電於第一端30,此時第一端30供電於第一電阻器21到第一半導體11的閘極G及第二半導體12的集極C,此時第一半導體11的汲極D與源極S導通,第一直流電源200供電於負載100,同時經由第三電阻器23供電於第三半導體13的陽極端P與陰極端N,此時第三半導體13的射極E與集極C導通,第四電阻器24兩端之電壓低,因此第二半導體12的集極C與射極E開路。 As shown in FIG. 2, when the main contact R of the first switch 60 is turned to the third contact V, the positive electric terminal of the second DC power source 300 supplies power to the first terminal 30 and the positive electric power of the first DC power source 200. The first terminal 30 supplies power to the load 100 to the second terminal 40, and the negative terminal of the first DC power supply 200 is connected to the third terminal 50 because the second DC power supply 300 supplies power to the first terminal 30. At this time, the first terminal 30 supplies power to the third terminal 50. A resistor 21 to the gate G of the first semiconductor 11 and the collector C of the second semiconductor 12. At this time, the drain D and the source S of the first semiconductor 11 are turned on, and the first DC power source 200 supplies power to the load 100. At the same time, the anode terminal P and the cathode terminal N of the third semiconductor 13 are powered through the third resistor 23. At this time, the emitter E and the collector C of the third semiconductor 13 are turned on, and the voltage across the fourth resistor 24 is low. The collector C and the emitter E of the second semiconductor 12 are open.

如圖2所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100兩端短路,其等同將第一直流電源200的正電壓供電於第二電阻器22,此時第二半導體12的集極C與射極E導通,第一半導體11的閘極G與源極S兩端電壓低,於是第一半導體11的汲極D與源極S開路,第一直流電 源200不供電於負載100,而達到短路保護第一直流電源200的目的。 As shown in FIG. 2, when the first terminal 30 is connected to the first DC power supply 200 or the second DC power supply 300, the first DC power supply 200 supplies power to both ends of the load 100. If the two ends of the load 100 are short-circuited, it is equivalent to The positive voltage of the first DC power source 200 is supplied to the second resistor 22. At this time, the collector C and the emitter E of the second semiconductor 12 are turned on, and the voltage across the gate G and the source S of the first semiconductor 11 is low. Then, the drain D and the source S of the first semiconductor 11 are open, and the first direct current is The source 200 does not supply power to the load 100, but achieves the purpose of short-circuit protection of the first DC power source 200.

如圖2所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100兩端短路的原因去除,將第一開關60的主接點R轉向第二接點U,再轉向第一接點T或第三接點V,此時第三半導體13的集極C與射極E導通,第二半導體12的基極B與射極E兩端電壓低,第二半導體12的集極C與射極E開路,第一半導體11的閘極G與源極S開路,於是第一半導體11的汲極D與源極S導通,亦就是第一直流電源200供電於負載100;若將第一開關60的主接點R轉向第二接點U,第二直流電源300不供電於第一端30,此時第一直流電源200不供電於負載100。 As shown in FIG. 2, when the first terminal 30 is connected to the first DC power supply 200 or the second DC power supply 300, the first DC power supply 200 supplies power to the two ends of the load 100. , Turn the main contact R of the first switch 60 to the second contact U, and then to the first contact T or the third contact V. At this time, the collector C and the emitter E of the third semiconductor 13 are turned on, and the second The voltage across the base B and the emitter E of the semiconductor 12 is low, the collector C and the emitter E of the second semiconductor 12 are open, and the gate G and the source S of the first semiconductor 11 are open. The pole D is in conduction with the source S, that is, the first DC power supply 200 supplies power to the load 100; if the main contact R of the first switch 60 is turned to the second contact U, the second DC power supply 300 is not supplied to the first terminal. 30. At this time, the first DC power source 200 does not supply power to the load 100.

如圖2所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100加大亦就是增大負載200電流量,此時第一半導體11的汲極D與源極S之電壓降值大於第二半導體12的基射極導通電壓時,第二半導體12的集極C與射極E導通,第一半導體11的閘極G與源極S兩端電壓低,於是第一半導體11的汲極D與源極S開路,第一直流電源200不供電於負載100,而達到過電流保護第一直流電源200的目的。 As shown in FIG. 2, when the first terminal 30 is connected to the first DC power supply 200 or the second DC power supply 300, the first DC power supply 200 supplies power to both ends of the load 100. With a load of 200 currents, when the voltage drop between the drain D and the source S of the first semiconductor 11 is greater than the base-emitter on-voltage of the second semiconductor 12, the collector C and the emitter E of the second semiconductor 12 are turned on. The voltage across the gate G and the source S of the first semiconductor 11 is low, so the drain D and the source S of the first semiconductor 11 are open-circuited, and the first DC power source 200 does not supply power to the load 100, and achieves an overcurrent protection level. The purpose of a DC power supply 200.

由上述可知,當第一開關60的主接點R轉向第二接點U與第三接點V來回切換時,就如同第一端30接上正電壓脈波與零電壓,因此第一端30如同半導體的閘極或基極,而第二端40連接負載100如 同半導體的汲極或集極,第三端50連接第一直流電源200與第二直流電源300的負電端如同半導體的源極或射極。 It can be known from the above that when the main contact R of the first switch 60 is switched to the second contact U and the third contact V to switch back and forth, it is as if the first terminal 30 is connected to a positive voltage pulse and zero voltage, so the first terminal 30 is like the gate or base of a semiconductor, and the second terminal 40 is connected to a load 100 such as Like the drain or collector of a semiconductor, the third terminal 50 is connected to the negative electric terminal of the first DC power source 200 and the second DC power source 300 like the source or emitter of a semiconductor.

如圖3所示,為本發明半導體裝置第二實施例,自圖中可知,第四半導體14為N型電晶體,將第四半導體14替代圖2的第一半導體11,其第四半導體14的集極C替代第一半導體11的汲極D,第四半導體14的射極E替代第一半導體11的源極S,第四半導體14的基極B替代第一半導體11的閘極G,其餘電路組成皆相同,而不贅述。 As shown in FIG. 3, this is a second embodiment of the semiconductor device of the present invention. As can be seen from the figure, the fourth semiconductor 14 is an N-type transistor. The fourth semiconductor 14 is substituted for the first semiconductor 11 of FIG. The collector C of the first semiconductor 11 replaces the drain D of the first semiconductor 11, the emitter E of the fourth semiconductor 14 replaces the source S of the first semiconductor 11, the base B of the fourth semiconductor 14 replaces the gate G of the first semiconductor 11, The rest of the circuit components are the same, and will not be described in detail.

如圖3所示,當第一開關60的主接點R轉向第一接點T,此時第一直流電源200的正電端供電於第一端30及負載100到第二端40,而第一直流電源200的負電端連接第三端50,此時第一端30供電於第一電阻器21到第四半導體14的基極B及第二半導體12的集極C,因此第四半導體14的集極C與射極E導通,第一直流電源200供電於負載100,同時經由第三電阻器23供電於第三半導體13的陽極端P與陰極端N,此時第三半導體13的集極C與射極E導通,第二半導體12的基極B與射極E兩端電壓低,因此第二半導體12的集極C與射極E開路。 As shown in FIG. 3, when the main contact R of the first switch 60 is turned to the first contact T, the positive electrical terminal of the first DC power supply 200 is supplied with power to the first terminal 30 and the load 100 to the second terminal 40. The negative terminal of the first DC power source 200 is connected to the third terminal 50. At this time, the first terminal 30 supplies power to the base B of the first resistor 21 to the fourth semiconductor 14 and the collector C of the second semiconductor 12, so the first The collector C and the emitter E of the four semiconductors 14 are turned on, and the first DC power source 200 supplies power to the load 100, and at the same time supplies the anode terminal P and the cathode terminal N of the third semiconductor 13 through the third resistor 23, and at this time the third The collector C and the emitter E of the semiconductor 13 are turned on, and the voltage across the base B and the emitter E of the second semiconductor 12 is low. Therefore, the collector C and the emitter E of the second semiconductor 12 are open.

如圖3所示,若將第一開關60的主接點R轉向第二接點U時,第一直流電源200不供電於第一端30,此時第四半導體14的集極C與射極E開路,第一直流電源200不供電於負載100,第三半導體13的集極C與射極E開路,第二半導體12的基極B與射極E無電壓。 As shown in FIG. 3, when the main contact R of the first switch 60 is turned to the second contact U, the first DC power source 200 does not supply power to the first terminal 30. At this time, the collector C of the fourth semiconductor 14 and the The emitter E is open, the first DC power source 200 is not supplying power to the load 100, the collector C and the emitter E of the third semiconductor 13 are open, and the base B and the emitter E of the second semiconductor 12 have no voltage.

如圖3所示,當第一開關60的主接點R轉向第 三接點V,此時第二直流電源300的正電端供電於第一端30及第一直流電源200的正電端供電於負載100到第二端40,而第一直流電源200的負電端連接第三端50,因為有第二直流電源300供電於第一端30,此時第一端30供電於第一電阻器21到第四半導體14的基極B及第二半導體12的集極C,此時第四半導體14的集極C與射極E導通,第一直流電源200供電於負載100,同時經由第三電阻器23供電於第三半導體13的陽極端P到陰極端N,此時第三半導體13的射極E與集極C導通,第四電阻器24兩端之電壓低,因此第二半導體12的集極C與射極E開路。 As shown in FIG. 3, when the main contact R of the first switch 60 turns to the Three contacts V. At this time, the positive electric terminal of the second DC power supply 300 is supplied to the first terminal 30 and the positive electric terminal of the first DC power supply 200 is supplied to the load 100 to the second terminal 40, and the first DC power supply 200 The negative terminal is connected to the third terminal 50 because a second DC power source 300 supplies power to the first terminal 30. At this time, the first terminal 30 supplies power to the base B of the first resistor 21 to the fourth semiconductor 14 and the second semiconductor 12 At this time, the collector C of the fourth semiconductor 14 and the emitter E are turned on, and the first DC power source 200 supplies power to the load 100, and at the same time supplies the anode terminal P to the third semiconductor 13 through the third resistor 23 At the cathode terminal N, at this time, the emitter E and the collector C of the third semiconductor 13 are turned on, and the voltage across the fourth resistor 24 is low, so the collector C and the emitter E of the second semiconductor 12 are open.

如圖3所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100兩端短路,其等同將第一直流電源200的正電壓供電於第二電阻器22,此時第二半導體12的集極C與射極E導通,第四半導體14的基極B與射極E兩端電壓低,於是第四半導體14的集極C與射極E開路,第一直流電源200不供電於負載100,而達到短路保護第一直流電源200的目的。 As shown in FIG. 3, when the first terminal 30 is connected to the first DC power supply 200 or the second DC power supply 300, the first DC power supply 200 supplies power to both ends of the load 100. If the two ends of the load 100 are short-circuited, it is equivalent to The positive voltage of the first DC power source 200 is supplied to the second resistor 22. At this time, the collector C and the emitter E of the second semiconductor 12 are turned on, and the voltage between the base B and the emitter E of the fourth semiconductor 14 is low. Therefore, the collector C and the emitter E of the fourth semiconductor 14 are open-circuited, and the first DC power source 200 does not supply power to the load 100, but achieves the purpose of short-circuit protection of the first DC power source 200.

如圖3所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100兩端短路的原因去除,將第一開關60的主接點R轉向第二接點U,再轉向第一接點T或第三接點V,此時第三半導體13的集極C與射極E導通,第二半導體12的基極B與射極E兩端電壓低,第二半導體12的集極C與射極E開路,第四半導體14的基極B與射極E兩端 電壓低,於是第四半導體14的集極C與射極E導通,亦就是第一直流電源200供電於負載100;若將第一開關60的主接點R轉向第二接點U,第二直流電源300不供電於第一端30,此時第一直流電源200不供電於負載100。 As shown in FIG. 3, when the first DC power source 200 or the second DC power source 300 is connected to the first terminal 30, the first DC power source 200 supplies power to both ends of the load 100. If the two ends of the load 100 are short-circuited, the cause is removed. , Turn the main contact R of the first switch 60 to the second contact U, and then to the first contact T or the third contact V. At this time, the collector C and the emitter E of the third semiconductor 13 are turned on, and the second The voltage across the base B and the emitter E of the semiconductor 12 is low, the collector C of the second semiconductor 12 is open to the emitter E, and the base B and the emitter E of the fourth semiconductor 14 are open The voltage is low, so the collector C and the emitter E of the fourth semiconductor 14 are turned on, that is, the first DC power source 200 supplies power to the load 100; if the main contact R of the first switch 60 is turned to the second contact U, the first The two DC power sources 300 do not supply power to the first terminal 30. At this time, the first DC power source 200 does not supply power to the load 100.

如圖3所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100加大亦就是增大負載200電流量,此時第四半導體14的集極C與射極E之電壓降值大於第二半導體12的基射極導通電壓時,第二半導體12的集極C與射極E導通,第四半導體14的基極B與射極E兩端電壓低,於是第四半導體14的集極C與射極E開路,第一直流電源200不供電於負載100,而達到過電流保護第一直流電源200的目的。 As shown in FIG. 3, when the first terminal 30 is connected to the first DC power supply 200 or the second DC power supply 300, the first DC power supply 200 supplies power to both ends of the load 100. If the load 100 is increased, it is increased. With a load of 200 current, when the voltage drop between the collector C and the emitter E of the fourth semiconductor 14 is greater than the base-emitter on-voltage of the second semiconductor 12, the collector C and the emitter E of the second semiconductor 12 are turned on. The voltage across the base B and the emitter E of the fourth semiconductor 14 is low, so the collector C and the emitter E of the fourth semiconductor 14 are open-circuited. The first DC power source 200 does not supply power to the load 100, and reaches the overcurrent protection level. The purpose of a DC power supply 200.

由上述可知,當第一開關60的主接點R轉向第二接點U與第三接點V來回切換時,就如同第一端30接上正電壓脈波與零電壓,因此第一端30如同半導體的閘極或基極,而第二端40連接負載100如同半導體的汲極或集極,第三端50連接第一直流電源200與第二直流電源300的負電端如同半導體的源極或射極。 It can be known from the above that when the main contact R of the first switch 60 is switched to the second contact U and the third contact V to switch back and forth, it is as if the first terminal 30 is connected to a positive voltage pulse and zero voltage, so the first terminal 30 is like the gate or base of a semiconductor, while the second terminal 40 is connected to a load 100 like a sink or collector of a semiconductor, and the third terminal 50 is connected to the negative DC terminal of the first DC power supply 200 and the second DC power supply 300 as semiconductor Source or emitter.

如圖4所示,為本發明半導體裝置第三實施例,自圖中可知,第五半導體15為絕緣閘極雙極電晶體,將第五半導體15替代圖2的第一半導體11,其第五半導體15的集極C替代第一半導體11的汲極D,第五半導體15的射極E替代第一半導體11的源極S,第五半導體15的閘極G替代第一半導體11的閘極G,其餘電路組成皆相同,而不贅述。 As shown in FIG. 4, this is a third embodiment of the semiconductor device of the present invention. As can be seen from the figure, the fifth semiconductor 15 is an insulated gate bipolar transistor, and the fifth semiconductor 15 is substituted for the first semiconductor 11 of FIG. The collector C of the five semiconductors 15 replaces the drain D of the first semiconductor 11, the emitter E of the fifth semiconductor 15 replaces the source S of the first semiconductor 11, and the gate G of the fifth semiconductor 15 replaces the gate of the first semiconductor 11. Pole G, the remaining circuit components are the same, and will not be described in detail.

如圖4所示,當第一開關60的主接點R轉向第一接點T,此時第一直流電源200的正電端供電於第一端30及負載100到第二端40,而第一直流電源200的負電端連接第三端50,此時第一端30供電於第一電阻器21到第五半導體15的閘極G及第二半導體12的集極C,因此第五半導體15的集極C與射極E導通,第一直流電源200供電於負載100,同時第三電阻器23供電於第三半導體13的陽極端P與陰極端N,此時第三半導體13的集極C與射極E導通.因此第二半導體12的集極C與射極E開路。 As shown in FIG. 4, when the main contact R of the first switch 60 is turned to the first contact T, the positive electrical terminal of the first DC power supply 200 is supplied to the first terminal 30 and the load 100 to the second terminal 40. The negative terminal of the first DC power source 200 is connected to the third terminal 50. At this time, the first terminal 30 supplies power to the gate G of the first resistor 21 to the fifth semiconductor 15 and the collector C of the second semiconductor 12. The collector C and the emitter E of the five semiconductors 15 are turned on. The first DC power source 200 supplies power to the load 100, and the third resistor 23 supplies power to the anode terminal P and the cathode terminal N of the third semiconductor 13. At this time, the third semiconductor The collector C and emitter E of 13 are turned on. Therefore, the collector C and the emitter E of the second semiconductor 12 are open.

如圖4所示,若將第一開關60的主接點R轉向第二接點U時,第一直流電源200不供電於第一端30,此時第五半導體15的集極C與射極E開路,第一直流電源200不供電於負載100,第三半導體13的集極C與射極E開路,第二半導體12的基極B與射極E無電壓。 As shown in FIG. 4, when the main contact R of the first switch 60 is turned to the second contact U, the first DC power source 200 does not supply power to the first terminal 30. At this time, the collectors C and The emitter E is open, the first DC power source 200 is not supplying power to the load 100, the collector C and the emitter E of the third semiconductor 13 are open, and the base B and the emitter E of the second semiconductor 12 have no voltage.

如圖4所示,當第一開關60的主接點R轉向第三接點V,此時第二直流電源300的正電端供電於第一端30及第一直流電源200的正電端供電於負載100到第二端40,而第一直流電源200的負電端連接第三端50,因為有第二直流電源300供電於第一端30,此時第一端30供電於第一電阻器21到第五半導體15的閘極G及第二半導體12的集極C,此時第五半導體15的集極C與射極E導通,第一直流電源200供電於負載100,同時第三電阻器23供電於第三半導體13的陽極端P與陰極端N,此時第三半導體13的射極E與集極C導通,第四電阻器24兩端之電壓低,因此第二半導體12的集極 C與射極E開路。 As shown in FIG. 4, when the main contact R of the first switch 60 is turned to the third contact V, the positive electric terminal of the second DC power source 300 supplies power to the first terminal 30 and the positive electric power of the first DC power source 200. The first terminal 30 supplies power to the load 100 to the second terminal 40, and the negative terminal of the first DC power supply 200 is connected to the third terminal 50 because the second DC power supply 300 supplies power to the first terminal 30. At this time, the first terminal 30 supplies power to the third terminal 50. A resistor 21 to a gate G of the fifth semiconductor 15 and a collector C of the second semiconductor 12. At this time, the collector C of the fifth semiconductor 15 is connected to the emitter E, and the first DC power source 200 supplies power to the load 100. At the same time, the third resistor 23 supplies power to the anode terminal P and the cathode terminal N of the third semiconductor 13. At this time, the emitter E and the collector C of the third semiconductor 13 are turned on, and the voltage across the fourth resistor 24 is low. Collector of two semiconductors 12 C and emitter E are open.

如圖4所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100兩端短路,其等同將第一直流電源200的正電壓供電於第二電阻器22,此時第二半導體12的集極C與射極E導通,第五半導體15的基極B與射極E兩端電壓低,於是第五半導體15的集極C與射極E開路,第一直流電源200不供電於負載100,而達到短路保護第一直流電源200的目的。 As shown in FIG. 4, when the first terminal 30 is connected to the first DC power supply 200 or the second DC power supply 300, the first DC power supply 200 supplies power to both ends of the load 100. If the two ends of the load 100 are short-circuited, it is equivalent to The positive voltage of the first DC power source 200 is supplied to the second resistor 22. At this time, the collector C and the emitter E of the second semiconductor 12 are turned on, and the voltage between the base B and the emitter E of the fifth semiconductor 15 is low. Therefore, the collector C and the emitter E of the fifth semiconductor 15 are open-circuited, and the first DC power source 200 does not supply power to the load 100, but achieves the purpose of short-circuit protection of the first DC power source 200.

如圖4所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100兩端短路的原因去除,將第一開關60的主接點R轉向第二接點U,再轉向第一接點T或第三接點V,此時第三半導體13的集極C與射極E導通,第二半導體12的基極B與射極E兩端電壓低,第二半導體12的集極C與射極E開路,第五半導體15的閘極G與射極E開路,於是第五半導體15的集極C與射極E導通,亦就是第一直流電源200供電於負載100;若將第一開關60的主接點R轉向第二接點U,第二直流電源300不供電於第一端30,此時第一直流電源200不供電於負載100。 As shown in FIG. 4, when the first terminal 30 is connected to the first DC power supply 200 or the second DC power supply 300, the first DC power supply 200 supplies power to the two ends of the load 100. , Turn the main contact R of the first switch 60 to the second contact U, and then to the first contact T or the third contact V. At this time, the collector C and the emitter E of the third semiconductor 13 are turned on, and the second The voltage across the base B and the emitter E of the semiconductor 12 is low, the collector C of the second semiconductor 12 is open to the emitter E, and the gate G and the emitter E of the fifth semiconductor 15 are open, so the collector of the fifth semiconductor 15 is open. The pole C and the emitter E are turned on, that is, the first DC power source 200 supplies power to the load 100. If the main contact R of the first switch 60 is turned to the second contact U, the second DC power source 300 is not supplied to the first terminal. 30. At this time, the first DC power source 200 does not supply power to the load 100.

如圖4所示,當第一端30接有第一直流電源200或第二直流電源300時,第一直流電源200供電於負載100兩端,若將負載100加大亦就是增大負載200電流量,此時第五半導體15的集極C與射極E之電壓降值大於第二半導體12的基射極導通電壓時,第二半導體12的集極C與射極E導通,第五 半導體15的閘極G與射極E兩端電壓低,於是第五半導15的集極C與射極E開路,第一直流電源200不供電於負載100,而達到過電流保護第一直流電源200的目的。 As shown in FIG. 4, when the first terminal 30 is connected to the first DC power supply 200 or the second DC power supply 300, the first DC power supply 200 supplies power to both ends of the load 100. With a load of 200 currents, when the voltage drop between the collector C and the emitter E of the fifth semiconductor 15 is greater than the base-emitter on-voltage of the second semiconductor 12, the collector C and the emitter E of the second semiconductor 12 are turned on. fifth The voltage across the gate G and the emitter E of the semiconductor 15 is low, so the collector C and the emitter E of the fifth semiconductor 15 are open-circuited. The first DC power source 200 does not supply power to the load 100, and achieves the first overcurrent protection. Purpose of DC power supply 200.

由上述可知,當第一開關60的主接點R轉向第二接點U與第三接點V來回切換時,就如同第一端30接上正電壓脈波與零電壓,因此第一端30如同半導體的閘極或基極,而第二端40連接負載100如同半導體的汲極或集極,第三端50連接第一直流電源200與第二直流電源300的負電端如同半導體的源極或射極。 It can be known from the above that when the main contact R of the first switch 60 is switched to the second contact U and the third contact V to switch back and forth, it is as if the first terminal 30 is connected to a positive voltage pulse and zero voltage, so the first terminal 30 is like the gate or base of a semiconductor, while the second terminal 40 is connected to a load 100 like a sink or collector of a semiconductor, and the third terminal 50 is connected to the negative DC terminal of the first DC power supply 200 and the second DC power supply 300 as semiconductor Source or emitter.

如圖5所示,為本發明半導體裝置第四實施例,自圖中可知,第六半導體16為N通道金屬氧化半導體場效電晶體,將第六半導體16替代圖2的第二半導體12,其第六半導體16的汲極D替代第二半導體12的集極C,第六半導體16的源極S替代第二半導體12的射極E,第六半導體16的閘極G替代第二半導體12的基極B,其餘電路組成皆相同,而不贅述;其第六半導體16替代第二半導體12在於二者的特性有差異,但其第六半導體16與圖2之第一半導體11的動作原理相同,其執行開路與導通的開關功能相同,在圖2己詳述而不再贅述,本發明可以根據需求選用其特性,而不自限。 As shown in FIG. 5, this is a fourth embodiment of the semiconductor device of the present invention. As can be seen from the figure, the sixth semiconductor 16 is an N-channel metal oxide semiconductor field effect transistor, and the sixth semiconductor 16 is substituted for the second semiconductor 12 of FIG. 2. The drain D of the sixth semiconductor 16 replaces the collector C of the second semiconductor 12, the source S of the sixth semiconductor 16 replaces the emitter E of the second semiconductor 12, and the gate G of the sixth semiconductor 16 replaces the second semiconductor 12. Base B, the rest of the circuit composition is the same, without repeating it; its sixth semiconductor 16 replaces the second semiconductor 12 because the characteristics of the two are different, but the operation principle of the sixth semiconductor 16 and the first semiconductor 11 of FIG. 2 The same, the functions of performing the open circuit and the conducting switch are the same, which have been described in detail in FIG. 2 without further description. The present invention can select its characteristics according to requirements without limitation.

如圖6所示,為本發明半導體裝置第五實施例,自圖中可知,第七半導體17為絕緣閘極雙極電晶體,將第七半導體17替代圖2的第二半導體12,其第七半導體17的集極C替代第二半導體12的集極C,第七半導體17的源極S替代第二半導體12的射極E,第七半導體17的閘極G替代第二半導體 12的基極B,其餘電路組成皆相同,而不贅述;其第七半導體17替代第二半導體12在於二者的特性有差異,但其第七半導體17與圖4之第五半導體15的動作原理相同,其執行開路與導通的開關功能相同,在圖4己詳述而不再贅述,本發明可以根據需求選用其特性,而不自限。 As shown in FIG. 6, it is a fifth embodiment of the semiconductor device of the present invention. As can be seen from the figure, the seventh semiconductor 17 is an insulated gate bipolar transistor, and the seventh semiconductor 17 is substituted for the second semiconductor 12 of FIG. 2. The collector C of the seventh semiconductor 17 replaces the collector C of the second semiconductor 12, the source S of the seventh semiconductor 17 replaces the emitter E of the second semiconductor 12, and the gate G of the seventh semiconductor 17 replaces the second semiconductor. The base B of 12 and the rest of the circuit composition are the same without further description; the seventh semiconductor 17 replaces the second semiconductor 12 because the characteristics of the two are different, but the operations of the seventh semiconductor 17 and the fifth semiconductor 15 of FIG. 4 The principle is the same, and the functions of performing the open circuit and the conducting switch are the same, which are described in detail in FIG. 4 and will not be repeated. The present invention can select its characteristics according to requirements without limitation.

發明人從事電子科技研究有50多年,本發明所提的實施例皆經過實驗及實作證明其成功,並且可據予實施,以上所述實施例僅是為充分說明本發明所舉的較佳的實施例,本發明的保護範圍不限於此,包括本技術領域的技術人員,在本發明基礎上所作的等同替代或變換,皆在本發明的保護範圍內。本發明的保護範圍以申請專利範圍書為準。 The inventor has been engaged in electronic technology research for more than 50 years. The examples of the present invention have proved their success through experiments and implementations, and can be implemented according to them. The above-mentioned examples are merely to fully illustrate the advantages of the present invention. In the embodiments, the protection scope of the present invention is not limited thereto, and equivalent substitutions or transformations made by those skilled in the art based on the present invention are all within the protection scope of the present invention. The protection scope of the present invention is subject to the scope of patent application.

Claims (10)

一種半導體裝置,其特徵在於應用於一個具有發生負載過載或短路保護功能之電路,該半導體裝置包括:一第一半導體,具有一汲極、一源極及一閘極;一第二半導體,具有一集極、一射極及一基極,該第二半導體的集極連接該第一半導體的閘極,該第二半導體的射極連接該第一半導體的源極;及一第三半導體,具有一陽極端、一陰極端、一集極及一射極,該第三半導體的射極連接該第二半導體的基極。 A semiconductor device is characterized in that it is applied to a circuit having a load overload or short-circuit protection function. The semiconductor device includes: a first semiconductor having a drain, a source, and a gate; and a second semiconductor having A collector, an emitter, and a base; the collector of the second semiconductor is connected to the gate of the first semiconductor; the emitter of the second semiconductor is connected to the source of the first semiconductor; and a third semiconductor, It has an anode terminal, a cathode terminal, a collector and an emitter, and the emitter of the third semiconductor is connected to the base of the second semiconductor. 如申請專利範圍第1項的半導體裝置,其中該第一半導體包括:一汲極,為N通道金屬氧化半導體場效電晶體的汲極,可以由N型電晶體的集極或N型絕緣閘極雙極電晶體的集極替代;一源極,為N通道金屬氧化半導體場效電晶體的源極,可以由N型電晶體的射極或N型絕緣閘極雙極電晶體的射極替代;及一閘極,為N通道金屬氧化半導體場效電晶體的閘極,可以由N型電晶體的基極或N型絕緣閘極雙極電晶體的閘極替代。 For example, the semiconductor device according to item 1 of the patent application scope, wherein the first semiconductor includes: a drain, which is a drain of an N-channel metal oxide semiconductor field effect transistor, which may be a collector of an N-type transistor or an N-type insulation gate Collector replacement of a pole bipolar transistor; a source is the source of an N-channel metal oxide semiconductor field effect transistor, which can be the emitter of an N-type transistor or the emitter of an N-type insulated gate bipolar transistor And a gate, which is the gate of an N-channel metal oxide semiconductor field effect transistor, and can be replaced by the base of an N-type transistor or the gate of an N-type insulated gate bipolar transistor. 如申請專利範圍第1項的半導體裝置,其中該第二半導體包括:一集極,為N型電晶體的集極,可以由N通道金屬氧化半導體場效電晶體的汲極或N型絕緣閘極雙極電晶體的集極替代;一射極,為N型電晶體的射極,可以由N通道金屬氧化半導體場效電晶體的源極或N型絕緣閘極雙極電晶體的射極替代;及 一基極,為N型電晶體的基極,可以由N通道金屬氧化半導體場效電晶體的閘極或N型絕緣閘極雙極電晶體的閘極替代。 For example, the semiconductor device of the first patent application scope, wherein the second semiconductor includes: a collector, which is an collector of an N-type transistor, which can be an N-channel metal-oxide semiconductor field effect transistor's drain or an N-type insulating gate Collector replacement of a pole bipolar transistor; an emitter is the emitter of an N-type transistor, which can be the source of an N-channel metal oxide semiconductor field effect transistor or the emitter of an N-type insulated gate bipolar transistor Substitution; and A base is the base of an N-type transistor, and can be replaced by the gate of an N-channel metal oxide semiconductor field effect transistor or the gate of an N-type insulated gate bipolar transistor. 如申請專利範圍第1項的半導體裝置,其中該第三半導體包括:一陽極端,為光電耦合器的陽極端;一陰極端,為光電耦合器的陰極端;一集極,為光電耦合器的集極;及一射極,為光電耦合器的射極。 For example, the semiconductor device of the first patent application scope, wherein the third semiconductor includes: an anode terminal, which is the anode terminal of the photocoupler; a cathode terminal, which is the cathode terminal of the photocoupler; and a collector, which is the photocoupler's Collector; and an emitter, which is the emitter of the photocoupler. 如申請專利範圖第1項的半導體裝置,其中該第一半導體包括:一汲極,該汲極連接第二電阻器的一端及第二端;一源極,該源極連接第三端;及一閘極,該閘極連接該第二半導體的集極及第一電阻器的另一端。 For example, the semiconductor device according to item 1 of the patent application chart, wherein the first semiconductor includes: a drain connected to one end and a second end of a second resistor; a source connected to a third end; And a gate connected to the collector of the second semiconductor and the other end of the first resistor. 如申請專利範圖第1項的半導體裝置,其中該第二半導體包括:一集極,該集極連接該第一半導體的閘極及該第一電阻器的另一端;一射極,該射極連接該第三端;及一基極,該基極連接該第三半導體的射極及第四電阻器的一端。 For example, the semiconductor device according to item 1 of the patent application chart, wherein the second semiconductor includes: a collector connected to the gate of the first semiconductor and the other end of the first resistor; an emitter, the emitter A pole is connected to the third end; and a base is connected to the emitter of the third semiconductor and one end of the fourth resistor. 如申請專利範圖第1項的半導體裝置,其中該第三半導體包括:一陽極端,該陽極端連接第三電阻器的另一端及第一電容器的正電端;一陰極端,該陰極端連接該第一電容器的負電端、該第四電阻器的另一端及該第三端; 一集極,該集極連接該第二電阻器的另一端;及一射極,該射極連接該第二半導體的基極及該第四電阻器的一端。 For example, the semiconductor device according to item 1 of the patent application chart, wherein the third semiconductor includes: an anode terminal connected to the other end of the third resistor and the positive terminal of the first capacitor; a cathode terminal connected to the cathode terminal; The negative terminal of the first capacitor, the other terminal of the fourth resistor, and the third terminal; A collector is connected to the other end of the second resistor; and an emitter is connected to the base of the second semiconductor and one end of the fourth resistor. 如申請專利範圖第5及7項的半導體裝置,其中該第一電阻器的一端及該第三電阻器的一端連接第一端。 For example, the semiconductor device according to items 5 and 7 of the patent application chart, wherein one end of the first resistor and one end of the third resistor are connected to the first end. 如申請專利範圖第5及8項的半導體裝置,其中該第三端連接第一直流電源負電端及第二直流電源的負電端,該第二端連接該第一直流電源的正電端,該第一端連接該第一直流電源的正電端或該第二直流電源的正電端。 For example, the semiconductor device according to items 5 and 8 of the patent application diagram, wherein the third terminal is connected to the negative terminal of the first DC power source and the negative terminal of the second DC power source, and the second terminal is connected to the positive terminal of the first DC power source. Terminal, the first terminal is connected to the positive electrical terminal of the first DC power source or the positive electrical terminal of the second DC power source. 如申請專利範圖第7項的半導體裝置,其中該第三電阻器及該第一電容器構成時間常數控制器以控制該第三半導體的陽極端與陰極端導通的時間或用同等功能的時間控制器替代。 For example, the semiconductor device according to item 7 of the patent application chart, wherein the third resistor and the first capacitor constitute a time constant controller to control the time during which the anode terminal and the cathode terminal of the third semiconductor are turned on or control the time with an equivalent function. Device replacement.
TW107104405A 2018-02-08 2018-02-08 Semiconductor device TW201935793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW107104405A TW201935793A (en) 2018-02-08 2018-02-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107104405A TW201935793A (en) 2018-02-08 2018-02-08 Semiconductor device

Publications (1)

Publication Number Publication Date
TW201935793A true TW201935793A (en) 2019-09-01

Family

ID=68618533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107104405A TW201935793A (en) 2018-02-08 2018-02-08 Semiconductor device

Country Status (1)

Country Link
TW (1) TW201935793A (en)

Similar Documents

Publication Publication Date Title
US8742828B2 (en) Disconnector switch for galvanic direct current interruption
TW201935793A (en) Semiconductor device
TWI760188B (en) Electronic circuit protector
TWI779519B (en) Semiconductor device
TWI728650B (en) Semiconductor protection device
CN210110647U (en) Direct current relay control circuit
TW202042469A (en) Semiconductor circuit device
CN210807225U (en) Switch control circuit
TW201931712A (en) Surge protection circuit with timely switch-off circuit wherein when an input power source electrically connected to the power input end generates a high-voltage surge, both ends of the capacitor are equally short-circuited so that the first switch is turned off in time
TW201933712A (en) Semiconductor devices
TW202215737A (en) Semiconductor protection device
EP3484003A1 (en) Circuit arrangement for an electric power converter, electric power converter for a vehicle and vehicle
CN213341997U (en) Fool-proof circuit for power supply, electronic equipment and power line
CN109637892A (en) A kind of direct current is after electrical switching circuit
TW202213892A (en) Semiconductor device
TW202005217A (en) Alternating current circuits protection device
CN215300152U (en) Power input control circuit
TW202213891A (en) Dc short circuits protection device
CN212063966U (en) Switching circuit and switching device
TW202230923A (en) Semiconductor circuits device
TW202215758A (en) Semiconductor circuits device
TW202339386A (en) Semiconductor protector
CN109792064B (en) Fuel cell system and control method thereof
TW202040900A (en) Semiconductor device
TW201826655A (en) Short circuit protection device for dc power source