TW201935782A - Electrical connector and manufacturing method thereof - Google Patents

Electrical connector and manufacturing method thereof Download PDF

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Publication number
TW201935782A
TW201935782A TW107146167A TW107146167A TW201935782A TW 201935782 A TW201935782 A TW 201935782A TW 107146167 A TW107146167 A TW 107146167A TW 107146167 A TW107146167 A TW 107146167A TW 201935782 A TW201935782 A TW 201935782A
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Taiwan
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rubber sheet
layer
electrical connector
metal
thin
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TW107146167A
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Chinese (zh)
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土屋昌俊
清水敦也
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日商信越聚合物股份有限公司
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Publication of TW201935782A publication Critical patent/TW201935782A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides an electrical connector (10) that is disposed between a connecting terminal of a first device and a connecting terminal of a second device and electrically connects therebetween, includes a rectangular solid shape multi-layer main body (20) in which a resin layer (21) and a metallic thin layer (22) are alternately and multiply layered, wherein the metallic thin layer (22) penetrates the multi-layer main body (20) in the thickness direction and the depth direction of the multi-layer main body (20), an exposure surface of the metallic thin layer (22) in a connection surface (20a) that connects with the connecting terminal of the multi-layer main body (20) has a rectangle shape, the metallic thin layer (22) is composed of a precious metal or a precious metal alloy, and the short length of the rectangular shape is 0.01 [mu]m or more and 10 [mu]m or less.

Description

電連接器及其製造方法 Electric connector and manufacturing method thereof

本發明係關於電連接器及其製造方法。本案係在2017年12月21日依據日本所申請之特願2017-245575號申請案主張優先權,在此援用其內容。 The invention relates to an electrical connector and a method for manufacturing the same. This case claims priority based on Japanese Patent Application No. 2017-245575 filed on December 21, 2017, and its contents are incorporated herein.

在液晶顯示器等之顯示裝置與電路基板之連接、或電子電路基板間之連接等,使用將含有銀之導電性物質的導電性彈性體層與絕緣性彈性體層構成斑馬紋狀(縱條紋狀)之異向導電性連接器係已為人所知(例如參照專利文獻1)。該異向導電性連接器係將導電性彈性體層與絕緣性彈性體層以其接合面成為互相平行之方式,交互且多重地積層而成。 In a connection between a display device such as a liquid crystal display and a circuit board, or a connection between electronic circuit boards, a zebra-like (vertical stripe) structure is used in which a conductive elastomer layer containing a conductive substance containing silver and an insulating elastomer layer are used. Anisotropic conductive connectors are known (for example, refer to Patent Document 1). This anisotropic conductive connector is formed by alternately and multi-layering a conductive elastomer layer and an insulating elastomer layer so that their joint surfaces become parallel to each other.

又,已知一種異向導電性連接器,其係將線徑為5μm至100μm之金屬細線以與被連接構件之電極間距相同之間隔埋設,且僅被埋設於與被連接構件之電極部相對之部分,金屬細線為沿著各電極之延伸方向而排列(例如參照專利文獻2)。 In addition, an anisotropic conductive connector is known in which thin metal wires having a wire diameter of 5 μm to 100 μm are buried at the same interval as the electrode pitch of the connected members, and are buried only opposite to the electrode portions of the connected members. In this part, the thin metal wires are arranged along the extending direction of each electrode (for example, refer to Patent Document 2).

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2000-251980號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2000-251980

[專利文獻2]日本實開平7-014570號公報 [Patent Document 2] Japanese Shikaihei 7-014570

記載於專利文獻1之異向導電性連接器係藉由將與電極連接之連接面以硫醇系化合物進行表面處理,防止起因於遷移之短路。惟,在嚴苛的使用環境中,有不容易完全防止遷移發生的問題。 The anisotropic conductive connector described in Patent Document 1 is surface-treated with a thiol-based compound on the connection surface to which the electrode is connected to prevent a short circuit due to migration. However, in severe use environments, it is not easy to completely prevent migration from occurring.

又,記載於專利文獻2之異向導電性連接器,就金屬細線而言,因使用比較廉價之黄銅線、或經施予金鍍敷之磷青銅線等,故有因為金屬細線而容易損傷到被連接構件之電極之問題。 In addition, the anisotropic conductive connector described in Patent Document 2 is susceptible to damage due to the thin metal wire because it uses a relatively inexpensive brass wire or a phosphor bronze wire coated with gold. To the electrode of the connected member.

本發明係有鑑於上述事情而成者,目的在於提供一種防止起因於遷移之短路,同時並防止檢査對象之電極損傷的異向導電性連接器及其製造方法。 The present invention has been made in view of the above circumstances, and an object thereof is to provide an anisotropic conductive connector that prevents short circuits due to migration and at the same time prevents damage to an electrode to be inspected, and a method for manufacturing the same.

[1]一種電連接器,係配置於第一裝置之連接端子與第二裝置之連接端子之間,而將此等電性連接者,該電連接器係具備多層本體,該多層本體係由樹脂層及金屬薄層交互地多重積層而成之長方體形狀者,前述金屬薄層係朝厚度方向及縱深方向貫通前述多層本體,前述多層本體之與前述連接端子連接的連接面中之前述金屬薄層之露出面的形狀為矩形,前述金屬薄層為由貴金屬或貴金屬合金所構成,且前述矩形之短邊的長度為0.01μm以上10μm以下。 [1] An electrical connector is arranged between the connection terminal of the first device and the connection terminal of the second device, and for those who are electrically connected, the electrical connector is provided with a multilayer body, and the multilayer system is composed of In the case of a rectangular parallelepiped shape in which a resin layer and a metal thin layer are alternately multiple laminated, the metal thin layer penetrates the multilayer body in a thickness direction and a depth direction, and the metal thin portion in a connection surface of the multilayer body connected to the connection terminal The shape of the exposed surface of the layer is rectangular, the thin metal layer is made of a precious metal or a precious metal alloy, and the length of the short side of the rectangle is 0.01 μm or more and 10 μm or less.

[2]如[1]項所述之電連接器,其中,在前述矩形之短邊方向的前述金屬薄層之間距為4μm以上600μm以下。 [2] The electrical connector according to item [1], wherein a distance between the thin metal layers in a short-side direction of the rectangle is 4 μm or more and 600 μm or less.

[3]如[1]或[2]項所述之電連接器,其中,前述金屬薄層之一部份為露出之沿著前述多層本體之厚度方向的側面係設有被覆層。 [3] The electrical connector according to [1] or [2], wherein a part of the metal thin layer is provided with a covering layer on a side surface exposed in a thickness direction of the multilayer body.

[4]一種電連接器之製造方法,係具有下列步驟:在基材之一面形成鍍敷層;在形成於前述基材之一面的前述鍍敷層貼合第1未硬化之橡膠片的一面後,將前述第1未硬化之橡膠片硫化(Vulcanization)而形成第1橡膠片;除去前述基材,使前述鍍敷層殘留於前述第1橡膠片之一面;在前述第1橡膠片之一面以被覆前述鍍敷層之方式,貼合第2未硬化之橡膠片後,將前述第2未硬化之橡膠片硫化而形成第2橡膠片,形成由前述第1橡膠片、前述鍍敷層及前述第2橡膠片所構成的彈性體;以前述鍍敷層成為互相平行之方式,積層複數個前述彈性體而形成積層體;以及以與前述積層體中之前述鍍敷層的延伸方向垂直之方式切割前述積層體。 [4] A method for manufacturing an electrical connector, comprising the steps of: forming a plating layer on one surface of a substrate; and adhering one surface of a first unhardened rubber sheet to the plating layer formed on one surface of the substrate. Then, the first uncured rubber sheet is vulcanized to form a first rubber sheet; the substrate is removed, and the plating layer is left on one surface of the first rubber sheet; on one surface of the first rubber sheet After the second uncured rubber sheet is bonded to cover the plating layer, the second uncured rubber sheet is vulcanized to form a second rubber sheet, and the first rubber sheet, the plating layer, and An elastic body composed of the second rubber sheet; a plurality of the elastic bodies are laminated so that the plating layers become parallel to each other to form a laminated body; and an elastic body perpendicular to an extension direction of the plating layers in the laminated body Way to cut the aforementioned laminated body.

[5]一種電連接器之製造方法,係具有下列步驟:在基材之一面塗佈金屬奈米膏劑;燒製塗佈在前述基材之一面的金屬奈米膏劑,形成金屬薄層;在形成於前述基材之一面的前述金屬薄層,貼合第1未硬化之橡膠片的一面後,將前述第1未硬化之橡膠片硫化而形成第1橡膠片;除去前述基材,使前述金屬薄層殘留於前述第1橡膠片之一面;在前述第1橡膠片之一面以被覆前述金屬薄層之方式,貼合第2未硬化之橡膠片後,將前述第2未硬化之橡膠片硫化而形成第2橡膠片,形成由前述第1橡膠片、前述金屬薄層及前述第2橡膠片所構成的彈性體;以前述金屬薄層成為互相平行之方式,積層複數個前述彈性體而形成積層體;以及以與前述積層體中之前述金屬薄層的延伸方向垂直之方式切割前述積層體。 [5] A method for manufacturing an electrical connector, comprising the steps of: coating a metal nano paste on one surface of a substrate; firing the metal nano paste applied on one surface of the substrate to form a thin metal layer; The thin metal layer formed on one side of the base material is bonded to one side of the first unhardened rubber sheet, and the first unhardened rubber sheet is vulcanized to form a first rubber sheet; the base material is removed, and the first A thin metal layer remains on one side of the first rubber sheet; a second unhardened rubber sheet is bonded to one side of the first rubber sheet to cover the metal thin layer, and then the second unhardened rubber sheet is bonded. A second rubber sheet is formed by vulcanization, and an elastic body composed of the first rubber sheet, the metal thin layer, and the second rubber sheet is formed; a plurality of the elastic bodies are laminated so that the metal thin layers become parallel to each other. Forming a laminated body; and cutting the laminated body so as to be perpendicular to the extending direction of the thin metal layer in the laminated body.

若依據本發明,可提供一種防止起因於遷移之短路,同時並防止檢査對象之電極損傷的異向導電性連接器及其製造方法。 According to the present invention, it is possible to provide an anisotropic conductive connector that prevents a short circuit due to migration and at the same time prevents damage to an electrode to be inspected, and a method for manufacturing the same.

10‧‧‧電連接器 10‧‧‧electrical connector

20‧‧‧多層本體 20‧‧‧Multi-layer Ontology

20a‧‧‧主面 20a‧‧‧Main face

20b‧‧‧主面 20b‧‧‧ main face

20c‧‧‧側面 20c‧‧‧side

21‧‧‧樹脂層 21‧‧‧resin layer

22‧‧‧金屬薄層 22‧‧‧Thin metal layer

23‧‧‧彈性體 23‧‧‧ Elastomer

40‧‧‧接著層 40‧‧‧ Adjacent layer

50‧‧‧被覆層 50‧‧‧ Coating

60‧‧‧基材 60‧‧‧ substrate

61‧‧‧第1層 61‧‧‧ Level 1

62‧‧‧第2層 62‧‧‧ Level 2

70‧‧‧鍍敷層 70‧‧‧Plating

81‧‧‧第1黏土狀橡膠片 81‧‧‧The first clay-like rubber sheet

81A‧‧‧第1橡膠片 81A‧‧‧The first rubber sheet

82‧‧‧第2黏土狀橡膠片 82‧‧‧ 2nd clay-like rubber sheet

82A‧‧‧第2橡膠片 82A‧‧‧Second rubber sheet

90‧‧‧積層體 90‧‧‧ laminated body

100‧‧‧接著劑 100‧‧‧ Adhesive

110‧‧‧金屬奈米膏劑 110‧‧‧ Metal Nano Plaster

120‧‧‧金屬薄層 120‧‧‧Thin metal layer

L1‧‧‧長度 L 1 ‧‧‧ length

L2‧‧‧長度 L 2 ‧‧‧ length

P1‧‧‧間距 P 1 ‧‧‧ pitch

第1圖係表示第1實施形態之電連接器的概略構成之剖面圖。 FIG. 1 is a cross-sectional view showing a schematic configuration of the electrical connector according to the first embodiment.

第2圖係表示第1實施形態之電連接器的製造方法之概略剖面圖。 Fig. 2 is a schematic sectional view showing a method of manufacturing the electrical connector according to the first embodiment.

第3圖係表示第1實施形態之電連接器的製造方法之概略剖面圖。 Fig. 3 is a schematic sectional view showing a method of manufacturing the electrical connector according to the first embodiment.

第4圖係表示第2實施形態之電連接器的製造方法之概略剖面圖。 Fig. 4 is a schematic cross-sectional view showing a method of manufacturing the electrical connector according to the second embodiment.

第5圖係表示第2實施形態之電連接器的製造方法之概略剖面圖。 Fig. 5 is a schematic cross-sectional view showing a method of manufacturing the electrical connector according to the second embodiment.

第6圖係表示有關使用實施例之電連接器時,積層體之位移量(壓縮量)、及施加於電連接器之荷重的關係之圖。 Fig. 6 is a diagram showing the relationship between the displacement (compression) of the laminated body and the load applied to the electrical connector when the electrical connector of the embodiment is used.

第7圖係表示有關使用比較例之電連接器時,積層體之位移量(壓縮量)、及施加於電連接器之荷重的關係之圖。 Fig. 7 is a graph showing the relationship between the displacement (compression) of the laminated body and the load applied to the electrical connector when the electrical connector of the comparative example is used.

第8圖係表示有關使用實施例或比較例之電連接器時,積層體之位移量(壓縮量)、及探針與連接端子之間的電阻值之關係之圖。 FIG. 8 is a diagram showing the relationship between the displacement (compression) of the laminated body and the resistance value between the probe and the connection terminal when the electrical connector of the embodiment or the comparative example is used.

第9圖係表示實施例中以掃描型電子顯微鏡攝影的圖像。 FIG. 9 shows an image taken by a scanning electron microscope in the example.

第10圖係表示比較例中以掃描型電子顯微鏡攝影之圖像。 Fig. 10 shows an image photographed with a scanning electron microscope in a comparative example.

說明有關本發明之電連接器及其製造方法的實施形態。 Embodiments of the electrical connector and the method for manufacturing the same according to the present invention will be described.

又,本實施形態係為了充分理解發明之旨意而具體說明者,尤其只要無指定,不限定本發明。 In addition, the present embodiment is specifically described in order to fully understand the meaning of the invention. In particular, the invention is not limited as long as it is not specified.

(第1實施形態) (First Embodiment) [電連接器] [Electric connector]

第1圖係表示本實施形態之電連接器的概略構成,(a)為平面圖,(b)為正面圖。 Fig. 1 shows a schematic configuration of the electrical connector according to this embodiment. (A) is a plan view and (b) is a front view.

如第1圖所示,本實施形態之電連接器10係具備多層本體20,其係由樹脂層21及金屬薄層22交互地多重積層而成之長方體形狀者。 As shown in FIG. 1, the electrical connector 10 according to this embodiment is provided with a multilayer body 20, which is a rectangular parallelepiped shape formed by alternately laminating a resin layer 21 and a thin metal layer 22.

金屬薄層22係朝厚度方向(第1(b)圖之Z方向)及縱深方向(第1(a)圖之Y方向)貫通多層本體20。又,金屬薄層22係在多層本體20之與連接端子連接的第1連接面(多層本體20之一主面)20a中的金屬薄層22之一部份露出之面(露出面)的形狀為矩形。相同地,在多層本體20之與連接端子連接的第2連接面(多層本體20之另一主面)20b中的金屬薄層22之露出面的形狀亦為矩形。 The thin metal layer 22 penetrates the multilayer body 20 in a thickness direction (Z direction in FIG. 1 (b)) and a depth direction (Y direction in FIG. 1 (a)). In addition, the thin metal layer 22 has a shape where a part of the thin metal layer 22 is exposed (exposed surface) in the first connection surface (a main surface of the multilayer body 20) 20a of the multilayer body 20 that is connected to the connection terminal. Is rectangular. Similarly, the shape of the exposed surface of the thin metal layer 22 in the second connection surface (the other main surface of the multilayer body 20) 20b connected to the connection terminal of the multilayer body 20 is also rectangular.

在此,有關多層本體20,厚度方向(第1(b)圖之Z方向)、寬度方向(第1(a)圖之X方向)、縱深方向(第1(a)圖之Y方向)係互相正交之方向。 Here, regarding the multilayer body 20, the thickness direction (Z direction in Fig. 1 (b)), the width direction (X direction in Fig. 1 (a)), and the depth direction (Y direction in Fig. 1 (a)) are Orthogonal directions.

在本發明中「矩形」之4個內角不須為嚴謹的90度,「矩形」可視為具有厚度之線形。此時,矩形長邊的長度為線形之長度,矩形短邊之長度相當於線形之厚度。 In the present invention, the four inner corners of the "rectangular" need not be exactly 90 degrees, and the "rectangular" can be regarded as a linear shape having a thickness. At this time, the length of the long side of the rectangle is the length of the line, and the length of the short side of the rectangle is equivalent to the thickness of the line.

又,金屬薄層22為由貴金屬或貴金屬合金所構成的。 The thin metal layer 22 is made of a noble metal or a noble metal alloy.

再者,金屬薄層22之前述矩形短邊的長度為0.01μm以上10μm以下。 The length of the rectangular short side of the thin metal layer 22 is 0.01 μm or more and 10 μm or less.

電連接器10係配置於圖示省略之第一裝置的連接端子、及圖示省略之第二裝置的連接端子之間,用以將此等電性連接者。在電連接器10中,金屬薄層22係進行第一裝置之連接端子與第二裝置之連接端子的電性連接之構件。裝置可舉例如半導體封裝體或電路基板、矽晶圓、被動零件、液晶模組及感測器。 The electrical connector 10 is disposed between a connection terminal of a first device (not shown) and a connection terminal of a second device (not shown), and is used to electrically connect these. In the electrical connector 10, the thin metal layer 22 is a member for electrically connecting the connection terminal of the first device and the connection terminal of the second device. The device may be, for example, a semiconductor package or a circuit substrate, a silicon wafer, a passive part, a liquid crystal module, and a sensor.

將樹脂層21、金屬薄層22、及樹脂層21依序積層並形成彈性體23。 The resin layer 21, the thin metal layer 22, and the resin layer 21 are sequentially laminated to form an elastic body 23.

多層本體20係由複數個彈性體23隔著接著層40而積層於多層本體20之一主面20a的長邊方向(第1(a)圖所示之X方向)(連續性連接)而成。積層彈性體23之數量,亦即,多層本體20之長邊的長度(第1(a)圖所示之X方向的長度)並無特別限定,可依照成為檢査對象之電極的數量、大小(面積)、間距等而適當調整。又,多層本體20之一主面20a的短邊長度(第1(a)圖所示之Y方向的長度)並無特別限定,係依照成為檢査對象之電極的數量、大小(面積)、間距等而適當調整。 The multilayer body 20 is formed by laminating a plurality of elastic bodies 23 on the long side direction (the X direction shown in FIG. 1 (a)) of one of the main surfaces 20a of the multilayer body 20 via an adhesive layer 40 (continuous connection). . The number of laminated elastic bodies 23, that is, the length of the long side of the multilayer body 20 (the length in the X direction shown in FIG. 1 (a)) is not particularly limited, and it can be according to the number and size of the electrodes to be inspected ( Area), pitch, etc. The length of the short side of the main surface 20a of the multilayer body 20 (the length in the Y direction shown in FIG. 1 (a)) is not particularly limited, and it depends on the number, size (area), and pitch of the electrodes to be inspected. Wait and adjust appropriately.

彈性體23不須隔著接著層40而積層,亦可藉由後述之電連接器的製造方法,製造省略接著層40之電連接器10。又,彈性體23可為由1層之樹脂層21與1層之金屬薄層22所構成的積層體。 The elastic body 23 does not need to be laminated with the adhesive layer 40 interposed therebetween, and the electrical connector 10 in which the adhesive layer 40 is omitted may be manufactured by a method of manufacturing an electrical connector described later. The elastic body 23 may be a laminated body composed of one resin layer 21 and one metal thin layer 22.

金屬薄層22係配置於彈性體23之長邊方向(第1(a)圖所示之Y方向)的中心線上。 The thin metal layer 22 is arranged on the center line of the longitudinal direction of the elastic body 23 (the Y direction shown in FIG. 1 (a)).

複數個彈性體23係分別以金屬薄層22成為互相平行之方式連續性連接(積層)。 The plurality of elastic bodies 23 are continuously connected (laminated) such that the thin metal layers 22 become parallel to each other.

多層本體20之厚度(第1(b)圖所示之Z方向的長度),亦即,一主面20a與另一主面20b的距離以0.03mm以上25mm以下為較佳。 The thickness of the multilayer body 20 (the length in the Z direction shown in FIG. 1 (b)), that is, the distance between one main surface 20a and the other main surface 20b is preferably 0.03 mm or more and 25 mm or less.

多層本體20之長邊方向的長度可舉例如0.05mm至300mm之例。 The length in the longitudinal direction of the multilayer body 20 may be, for example, 0.05 mm to 300 mm.

多層本體20之一主面20a及另一主面20b中之金屬薄層22的矩形長邊之長度(第1(a)圖所示之Y方向的長度)L1較佳為0.03mm以上10mm以下,更佳係0.3mm以上5mm以下。 The length of the rectangular long side of the metal thin layer 22 in one of the main surface 20a and the other main surface 20b of the multilayer body 20 (the length in the Y direction shown in FIG. 1 (a)) L 1 is preferably 0.03 mm or more and 10 mm or less. Hereinafter, it is more preferably 0.3 mm to 5 mm.

若金屬薄層22之矩形長邊之長度L1為上述之範圍內的話,可使第一裝置之連接端子與第二裝置之連接端子的電性連接經長期間保持安定。 If the length L 1 of the rectangular long side of the thin metal layer 22 is within the above range, the electrical connection between the connection terminal of the first device and the connection terminal of the second device can be kept stable for a long period of time.

多層本體20之一主面20a及另一主面20b中的金屬薄層22之矩形短邊的長度(第1(a)圖所示之X方向的長度)L2為0.01μm以上10μm以下,較佳為0.05μm以上5μm以下,更佳為0.1μm以上2μm以下。 The length of the rectangular short side of the thin metal layer 22 in one of the main surfaces 20a and the other main surface 20b of the multilayer body 20 (the length in the X direction shown in FIG. 1 (a)) L 2 is 0.01 μm or more and 10 μm or less, It is preferably 0.05 μm or more and 5 μm or less, and more preferably 0.1 μm or more and 2 μm or less.

若金屬薄層22之矩形短邊的長度L2為上述之範圍內的話,不會使檢査對象之電極損傷。又,可使第一裝置之連接端子與第二裝置之連接端子的電性連接經長期間保持安定。 If the length L 2 of the rectangular short side of the thin metal layer 22 is within the above range, the electrode to be inspected will not be damaged. In addition, the electrical connection between the connection terminal of the first device and the connection terminal of the second device can be kept stable for a long period of time.

在多層本體20之一主面20a及另一主面20b中,較佳係矩形之短邊方向(第1(a)圖所示之X方向)的金屬薄層22之間距P1為1μm以上600μm以下,更佳係1μm以上200μm以下,再更佳係1μm以上50μm以下。 In the main surface 20a and the other main surface 20b of the multilayer body 20 in one of the short sides of the rectangular-based preferred direction of the metal sheet (first shown in FIG. 1 (a) of FIG X direction) of the pitch P 1 is 22 or more 1μm 600 μm or less, more preferably 1 μm or more and 200 μm or less, and even more preferably 1 μm or more and 50 μm or less.

若矩形之短邊方向的金屬薄層22之間距P1為0.2mm以下的話,可進行與窄間距之電極的電性連接。又,可使第一裝置之連接端子與第二裝置之連接端子的電性連接經長期間維持安定。 If the pitch of the metal thin layer of the short side direction of the rectangular shape of 22 P 1 is 0.2mm or less, may be electrically connected to the electrode of a narrow pitch. In addition, the electrical connection between the connection terminal of the first device and the connection terminal of the second device can be maintained stable for a long period of time.

在本實施形態之電連接器10中,可沿著多層本體20之厚度方向的側面,在金屬薄層22之一部分為露出之側面20c設有被覆層50。 In the electrical connector 10 according to this embodiment, a covering layer 50 may be provided on a side surface 20c of a part of the thin metal layer 22 along the side surface in the thickness direction of the multilayer body 20.

被覆層50之厚度並無特別限定,可設為例如1μm至5mm。 The thickness of the coating layer 50 is not particularly limited, and may be, for example, 1 μm to 5 mm.

形成多層本體20之樹脂層21的材質(材料)只要為具有絕緣性及彈性者即可,無特別限定,但可舉例如聚矽氧橡膠、氟橡膠、聚丁二烯橡膠、聚異戊二烯橡膠、聚胺基甲酸酯橡膠、氯丁烯橡膠、聚酯系橡膠、苯乙烯-丁二烯共聚物橡膠、天然橡膠等。此等之中,從高彈性且耐熱性優異之點而言,以聚矽氧橡膠為較佳。 The material (material) of the resin layer 21 forming the multilayer body 20 is not particularly limited as long as it has insulation and elasticity, but examples thereof include silicone rubber, fluorine rubber, polybutadiene rubber, and polyisoprene. Rubber, polyurethane rubber, chloroprene rubber, polyester rubber, styrene-butadiene copolymer rubber, natural rubber, etc. Among these, from the viewpoint of high elasticity and excellent heat resistance, silicone rubber is preferred.

金屬薄層22之材質(材料)較佳係比銀更難產生遷移之金屬,排除銀,可舉例如金、鉑、鈀、銠、銦、釕等之貴金屬、或此等之貴金屬合金。又,貴金屬以外,亦可舉例錫、銅、鉛、鎳、或此等之合金。此等材質之中,若考量導電性、耐腐蝕性,以金、鉑等貴金屬為較佳,以金、鉑為特佳。 The material (material) of the thin metal layer 22 is preferably a metal which is more difficult to migrate than silver. Excluding silver, precious metals such as gold, platinum, palladium, rhodium, indium, ruthenium, or the precious metal alloys can be mentioned. In addition to the noble metals, tin, copper, lead, nickel, or alloys thereof can be exemplified. Among these materials, in consideration of conductivity and corrosion resistance, noble metals such as gold and platinum are preferred, and gold and platinum are particularly preferred.

構成接著層40之接著劑並無特別限定,但可使用與樹脂層21相同的材質,亦可使用與樹脂層21之材質相異者。前述接著劑可舉例如聚矽氧橡膠系接著劑、改質聚矽氧橡膠系接著劑、天然橡膠乳膠接著劑、胺基甲酸酯樹脂系接著劑、胺基甲酸酯樹脂系接著劑、氯化乙烯基樹脂系接著劑、氯丁烯橡膠系接著劑、腈橡膠系接著劑、硝基纖維素接著劑、酚樹脂系接著劑、聚醯亞胺系接著劑、聚胺基甲酸酯樹脂系接著劑、聚乙烯醇系接著劑等。此等之中,較佳係容易薄膜化之液狀聚矽氧橡膠。在此,液狀聚矽氧橡膠係在塗佈時為液體,但藉由硬化,成為流動性低或固形狀之聚矽氧橡膠。 The adhesive constituting the adhesive layer 40 is not particularly limited, but the same material as the resin layer 21 may be used, or a material different from the material of the resin layer 21 may be used. Examples of the adhesive include a silicone rubber-based adhesive, a modified silicone rubber-based adhesive, a natural rubber latex adhesive, a urethane resin-based adhesive, a urethane resin-based adhesive, Chlorinated vinyl resin adhesive, chloroprene rubber adhesive, nitrile rubber adhesive, nitrocellulose adhesive, phenol resin adhesive, polyimide adhesive, polyurethane Resin-based adhesives, polyvinyl alcohol-based adhesives, and the like. Among these, liquid silicone rubber which is easy to form a thin film is preferable. Here, the liquid silicone rubber is a liquid at the time of coating, but is hardened to become a silicone rubber having low fluidity or a solid shape.

被覆層50之材質(材料)只要具有絕緣性及彈性者即可,並無特別限定,可舉例如與樹脂層21相同的材質。 The material (material) of the coating layer 50 is not particularly limited as long as it has insulation and elasticity, and examples thereof include the same material as the resin layer 21.

本實施形態之電連接器10係具備由樹脂層21、金屬薄層22交互地多重積層而成之長方體形狀的多層本體20,金屬薄層22係朝厚度方向(第1(b)圖之Z方向)及縱深方向(第1(a)圖之Y方向)貫通多層本體20,在多層本體20之與連接端子連接的連接面20a中的金屬薄層22之露出面的形狀為矩形,金屬薄層22係由貴金屬或貴金屬合金所構成,矩形短邊之長度為0.01μm以上10μm以下。因此,可防止起因於遷移之短路。又,在將要連接於電連接器10之裝置的連接端子與金屬薄層22連接時,對於裝置之連接端子不會施加來自金屬薄層22過剩的力,可防止其連接端子損傷。再者,本實施形態之電連接器10具備矩形 短邊之長度為0.01μm以上10μm以下之金屬薄層22,故高頻特性亦優異,可進行與窄間距之電極的電性連接。 The electrical connector 10 of this embodiment is provided with a rectangular parallelepiped-shaped multilayer body 20 formed by alternately stacking a resin layer 21 and a thin metal layer 22, and the thin metal layer 22 faces the thickness direction (Z in FIG. 1 (b)). Direction) and depth direction (Y direction in FIG. 1 (a)) penetrate the multilayer body 20, and the shape of the exposed surface of the metal thin layer 22 in the connection surface 20a of the multilayer body 20 connected to the connection terminal is rectangular, and the metal thin The layer 22 is composed of a noble metal or a noble metal alloy, and the length of the short rectangular side is 0.01 μm or more and 10 μm or less. Therefore, a short circuit due to migration can be prevented. In addition, when the connection terminals of the device to be connected to the electrical connector 10 are connected to the thin metal layer 22, an excessive force from the thin metal layer 22 is not applied to the connection terminals of the device, and damage to the connection terminals can be prevented. In addition, the electrical connector 10 of this embodiment is provided with a rectangular shape. The thin metal layer 22 having a short side length of 0.01 μm to 10 μm is excellent in high-frequency characteristics and can be electrically connected to narrow-pitch electrodes.

電連接器10具有之金屬薄層22的端部係可從一主面20a及另一主面20b的至少一方突出。所謂「金屬薄層之端部」係意指從金屬薄層之端面(端邊)至金屬薄層之Z方向的長度之1/4長度為止的範圍。金屬薄層22之端部從主面突出時之突出量並無特別限定,依照藉由電連接器10而電性連接之2個裝置的連接端子之形狀、配置等而適當調整。 The ends of the thin metal layer 22 included in the electrical connector 10 may protrude from at least one of the main surface 20 a and the other main surface 20 b. The "end portion of the thin metal layer" means a range from an end surface (end edge) of the thin metal layer to a quarter length of the length in the Z direction of the thin metal layer. The amount of protrusion when the end portion of the thin metal layer 22 protrudes from the main surface is not particularly limited, and is appropriately adjusted in accordance with the shape and arrangement of the connection terminals of the two devices electrically connected by the electrical connector 10.

電連接器10具有之金屬薄層22的端部從一主面20a或另一主面20b突出時,亦可對此突出之端部施予鍍敷加工,而形成與金屬薄層22相異之其他鍍敷層。其他鍍敷層的材質並無特別限定,係依照金屬薄層22之材質而適當選擇。金屬薄層22端部之表面積(剖面積)會因為其他鍍敷層而增加,金屬薄層22之端部、與所要連接之裝置的連接端子之間的接觸面積會增加,而可更安定地維持此等電性的連接狀態。 When the end portion of the thin metal layer 22 included in the electrical connector 10 protrudes from the one main surface 20a or the other main surface 20b, the protruding end portion may be plated to form a difference from the thin metal layer 22 Other plating. The material of the other plating layers is not particularly limited, and is appropriately selected in accordance with the material of the thin metal layer 22. The surface area (cross-sectional area) of the end portion of the thin metal layer 22 will be increased by other plating layers, and the contact area between the end portion of the thin metal layer 22 and the connection terminals of the device to be connected will be increased, so that it can be more stable. Maintain these electrical connections.

[電連接器之製造方法] [Manufacturing method of electric connector]

本實施形態之電連接器的製造方法係具有:在基材之一面形成鍍敷層之步驟(以下,稱為「步驟A1」。);在形成於基材之一面的鍍敷層貼合第1黏土狀橡膠片之一面後,將第1黏土狀橡膠片硫化而形成第1橡膠片之步驟(以下,稱為「步驟B1」。);將基材藉由濕式蝕刻除去,將鍍敷層殘留於第1橡膠片之一面的步驟(以下,稱為「步驟C1」。);在第1橡膠片之一面以被覆鍍敷層之方式,貼合第2黏土狀橡膠片後,將第2黏土狀橡膠片硫化而形成第2橡膠片,形成由第1橡膠片、鍍敷層及第2橡膠片所構成的彈性體之步驟(以下,稱為「步驟D1」。);以鍍敷層成為互相平行之方式,積層複數個彈性體,使積層體成形之 步驟(以下,稱為「步驟E1」。);以及以與積層體中之鍍敷層的延伸方向垂直之方式切割積層體之步驟(以下,稱為「步驟F1」。)。 The method for manufacturing an electrical connector according to this embodiment includes a step of forming a plating layer on one surface of a base material (hereinafter referred to as "step A1"); and attaching a plating layer to the plating layer formed on one surface of the base material. (1) A step of vulcanizing the first clay-shaped rubber sheet to form the first rubber sheet after one surface of the clay-shaped rubber sheet (hereinafter referred to as "step B1"); removing the base material by wet etching, and plating A step in which a layer is left on one surface of the first rubber sheet (hereinafter, referred to as "step C1"); after a second clay-like rubber sheet is bonded to one surface of the first rubber sheet so as to be covered with a plating layer, the first 2Clay-like rubber sheet is vulcanized to form a second rubber sheet, and a step of forming an elastomer composed of a first rubber sheet, a plating layer, and a second rubber sheet (hereinafter referred to as "step D1"); and plating The layers become parallel to each other, and a plurality of elastic bodies are laminated to form the laminated body. Step (hereinafter, referred to as "step E1"); and a step of cutting the multilayer body perpendicular to the extension direction of the plating layer in the multilayer body (hereinafter, referred to as "step F1").

在此,前述第1及前述第2黏土狀橡膠片為第1及第2未硬化橡膠片之一例。 Here, the first and second clay-like rubber sheets are examples of the first and second unhardened rubber sheets.

可使用由液狀聚矽氧橡膠所構成的橡膠片取代前述第1及前述第2黏土狀橡膠片。使用由液狀聚矽氧橡膠所構成的橡膠片時,較佳係使用使液狀聚矽氧橡膠半硬化之薄片或將流動性比較低之液狀聚矽氧橡膠成形為片狀者。 The rubber sheet made of liquid silicone rubber may be used in place of the first and second clay rubber sheets. When a rubber sheet made of liquid silicone rubber is used, it is preferable to use a sheet which is a semi-hardened liquid silicone rubber or a liquid silicone rubber having a relatively low fluidity formed into a sheet.

以下,參照第2(a)圖至第2(c)圖及第3(a)圖至第3(c)圖,說明本實施形態之電連接器的製造方法。 Hereinafter, a method for manufacturing the electrical connector according to this embodiment will be described with reference to FIGS. 2 (a) to 2 (c) and FIGS. 3 (a) to 3 (c).

第2(a)圖至第2(c)圖及第3(a)圖至第3(c)圖係表示本實施形態之電連接器的製造方法之概略剖面圖。又,第2圖及第3圖中,在第1圖所示之本實施形態中的電連接器相同的構成中,賦予相同的符號,並省略重複之說明。 Figures 2 (a) to 2 (c) and 3 (a) to 3 (c) are schematic cross-sectional views showing a method of manufacturing the electrical connector of this embodiment. In Figs. 2 and 3, the same reference numerals are given to the same configuration of the electrical connector in this embodiment shown in Fig. 1, and redundant descriptions are omitted.

如第2(a)圖所示,在基材60之一面60a形成鍍敷層70(步驟A1)。 As shown in FIG. 2 (a), a plating layer 70 is formed on one surface 60a of the substrate 60 (step A1).

在步驟A1中,在基材60之一面60a藉由電解鍍敷或無電解鍍敷形成鍍敷層70。 In step A1, a plating layer 70 is formed on one surface 60a of the substrate 60 by electrolytic plating or electroless plating.

基材60只要可藉由電解鍍敷或無電解鍍敷而形成鍍敷層70者即可,並無特別限定。基材60係例如如第2(a)圖所示,可使用由銅或黄銅、磷青銅或白銅(nickel silver)等之銅合金所構成的第1層61、與由鎳或鋅所構成的第2層62積層而成之合金、或在水溶性膜之一面形成金鍍敷層、鉑鍍敷層、銅鍍敷層或鎳鍍敷層者。又,水溶性膜可舉例如聚乙烯醇等。 The base material 60 is not particularly limited as long as it can form the plating layer 70 by electrolytic plating or electroless plating. The substrate 60 is, for example, as shown in FIG. 2 (a), a first layer 61 made of a copper alloy such as copper or brass, phosphor bronze, or nickel silver, and a layer made of nickel or zinc can be used. An alloy formed by laminating the second layer 62, or forming a gold plating layer, a platinum plating layer, a copper plating layer, or a nickel plating layer on one side of the water-soluble film. Examples of the water-soluble film include polyvinyl alcohol.

鍍敷層70之材質係排除銀,可舉例如金、鉑等之貴金屬、或此等貴金屬之合金。 The material of the plating layer 70 excludes silver, and examples thereof include precious metals such as gold and platinum, or alloys of these precious metals.

然後,如第2(b)圖所示,在形成於基材60之一面60a的鍍敷層70,貼合第1黏土狀橡膠片81之一面81a後,將第1黏土狀橡膠片81硫化而形成第1橡膠片(步驟B1)。 Then, as shown in FIG. 2 (b), the first clay rubber sheet 81 is bonded to the plating layer 70 formed on the first surface 60a of the substrate 60, and then the first clay rubber sheet 81 is vulcanized. Thus, a first rubber sheet is formed (step B1).

第1黏土狀橡膠片81係無特別限定,可舉例如藉由加熱或光、電磁波照射而硫化並硬化之黏土狀聚矽氧橡膠、黏土狀氟橡膠、黏土狀聚丁二烯橡膠、黏土狀聚異戊二烯橡膠、黏土狀聚胺基甲酸酯橡膠、黏土狀氯丁烯橡膠、黏土狀聚酯系橡膠、黏土狀苯乙烯-丁二烯共聚物橡膠、黏土狀天然橡膠等。 The first clay-like rubber sheet 81 is not particularly limited, and examples thereof include clay-like silicone rubber, clay-like fluorine rubber, clay-like polybutadiene rubber, and clay-like shape that are vulcanized and hardened by heating or light or electromagnetic wave irradiation. Polyisoprene rubber, clay-like polyurethane rubber, clay-like chloroprene rubber, clay-like polyester-based rubber, clay-like styrene-butadiene copolymer rubber, clay-like natural rubber, etc.

此等黏土狀橡膠片係在可混練複合物(millable compound)中加入硫化劑及依需要之添加劑並混練而成者。 These clay-like rubber sheets are obtained by adding a vulcanizing agent and additives as needed to a millable compound and kneading them.

黏土狀聚矽氧橡膠之具體例可舉例如信越化學工業股份有限公司製KE-174-U等之所謂橡膠複合物。 Specific examples of the clay-like silicone rubber include a so-called rubber compound such as KE-174-U manufactured by Shin-Etsu Chemical Industry Co., Ltd.

黏土狀聚矽氧橡膠硬化後之硬度(Durometer A)以20以上為較佳,以30以上為更佳。該硬度之上限值以90以下為較佳。若硬度為上述範圍,可對電連接器賦予適度的剛性。 The hardness (Durometer A) of the clay-like silicone rubber after hardening is preferably 20 or more, and more preferably 30 or more. The upper limit of the hardness is preferably 90 or less. When the hardness is in the above range, moderate rigidity can be imparted to the electrical connector.

上述硬度係依據JIS K 6249:2003之方法而測定。 The hardness is measured in accordance with the method of JIS K 6249: 2003.

又,可取代黏土狀聚矽氧橡膠而使用之前述液狀聚矽氧橡膠的具體例可舉例如藉由信越化學工業股份有限公司製之KE-1935-A,KE-1935-B等之加成反應而熱硬化者。 Specific examples of the liquid silicone rubber that can be used in place of the clay silicone rubber include, for example, KE-1935-A, KE-1935-B, and the like manufactured by Shin-Etsu Chemical Industry Co., Ltd. Reaction and heat hardening.

液狀聚矽氧橡膠硬化前的黏度比起黏土狀聚矽氧之複合物係低非常低,例如以500Pa‧s以下為佳,以200Pa‧s以下為較佳,以100Pa‧s以下為更佳。該黏度之下限值以10Pa‧s以上為較佳。 The viscosity of the liquid silicone rubber before curing is lower than that of the clay-like silicone composite system. For example, it is preferably below 500Pa‧s, preferably below 200Pa‧s, and more preferably below 100Pa‧s. good. The lower limit of the viscosity is preferably 10 Pa · s or more.

液狀聚矽氧橡膠硬化前的密度(23℃,單位:g/cm3)較佳係比黏土狀聚矽氧橡膠更低,例如以未達1.10為佳,以1.06以下為較佳,以1.03以下為更佳。該密度之下限值通常為1.00以上。若密度為上述範圍,液狀聚矽氧橡膠之塗佈變容易。 The density (23 ° C, unit: g / cm 3 ) of the liquid silicone rubber before curing is preferably lower than that of the clay silicone rubber. For example, it is preferably less than 1.10, and preferably less than 1.06. Below 1.03 is more preferred. The lower limit of the density is usually 1.00 or more. When the density is in the above range, application of the liquid silicone rubber becomes easy.

液狀聚矽氧橡膠硬化後的硬度(Durometer A)係以20以上為佳,以30以上為更佳。該硬度之上限值以90以下為較佳。若硬度為上述範圍,可對電連接器賦予適度的剛性。 The hardness (Durometer A) of the liquid silicone rubber after hardening is preferably 20 or more, and more preferably 30 or more. The upper limit of the hardness is preferably 90 or less. When the hardness is in the above range, moderate rigidity can be imparted to the electrical connector.

上述黏度、密度及硬度係依據JIS K 6249:2003之方法而測定。 The viscosity, density and hardness are measured in accordance with the method of JIS K 6249: 2003.

第1黏土狀橡膠片81之厚度並無特別限定,可依照將藉由第1黏土狀橡膠片81所形成之彈性體23連接而成的多層本體20要求之厚度而適當調整。可舉例如0.0005mm至0.5mm之厚度。薄片係亦可替換稱為膜。 The thickness of the first clay-like rubber sheet 81 is not particularly limited, and can be appropriately adjusted in accordance with the thickness required for the multilayer body 20 formed by connecting the elastic body 23 formed by the first clay-like rubber sheet 81. For example, a thickness of 0.0005 mm to 0.5 mm can be mentioned. The sheet system may also be referred to as a film.

在步驟B1中,將第1黏土狀橡膠片81加熱、硫化而形成第1橡膠片81A。 In step B1, the first clay rubber sheet 81 is heated and vulcanized to form a first rubber sheet 81A.

然後,如第2(c)圖所示,將基材60藉由濕式蝕刻除去,使鍍敷層70殘留於第1橡膠片81A之一面81a(步驟C1)。 Then, as shown in FIG. 2 (c), the base material 60 is removed by wet etching to leave the plating layer 70 on one surface 81a of the first rubber sheet 81A (step C1).

使用銅作為基材60時,將在形成有鍍敷層70之基材60貼合第1橡膠片81A者浸漬於氯化鐵之溶液。又,使用水溶性膜作為基材60時,將在形成有鍍敷層70之基材60貼合第1橡膠片81A者浸漬於水。藉此,將基材60溶解並除去。 When copper is used as the base material 60, the first rubber sheet 81A bonded to the base material 60 on which the plating layer 70 is formed is immersed in a solution of ferric chloride. When a water-soluble film is used as the base material 60, the first rubber sheet 81A bonded to the base material 60 on which the plating layer 70 is formed is immersed in water. Thereby, the base material 60 is dissolved and removed.

在步驟C1中,藉由將基材60藉由濕式蝕刻除去,使鍍敷層70轉印於第1橡膠片81A之一面81a。 In step C1, the base material 60 is removed by wet etching, and the plating layer 70 is transferred to one surface 81a of the first rubber sheet 81A.

然後,如第3(a)圖所示,在第1橡膠片81A之一面81a以被覆鍍敷層70之方式貼合第2黏土狀橡膠片82後,將第2黏土狀橡膠片82硫化而形成第2橡膠片,使由第1橡膠片81A、鍍敷層70及第2橡膠片82A所構成的彈性體23成形(步驟D1)。 Then, as shown in FIG. 3 (a), the second clay rubber sheet 82 is bonded to the first surface 81a of the first rubber sheet 81A so as to cover the plating layer 70, and then the second clay rubber sheet 82 is vulcanized to A second rubber sheet is formed, and an elastic body 23 composed of the first rubber sheet 81A, the plating layer 70, and the second rubber sheet 82A is formed (step D1).

第2黏土狀橡膠片82係使用與第1黏土狀橡膠片81相同者。 The second clay rubber sheet 82 is the same as the first clay rubber sheet 81.

第2黏土狀橡膠片82之厚度係與第1黏土狀橡膠片81之厚度相等。 The thickness of the second clay rubber sheet 82 is equal to the thickness of the first clay rubber sheet 81.

在步驟D1中,將第2黏土狀橡膠片82加熱,硫化,形成第2橡膠片82A。 In step D1, the second clay rubber sheet 82 is heated and vulcanized to form a second rubber sheet 82A.

繼而,如第3(b)圖所示,以鍍敷層70成為互相平行之方式,將步驟A1至步驟D1所得之彈性體23複數積層,成形為如第3(c)圖所示之積層體90(步驟E1)。 Next, as shown in FIG. 3 (b), the elastic bodies 23 obtained in steps A1 to D1 are laminated in a manner that the plating layers 70 become parallel to each other, and formed into a laminate as shown in FIG. 3 (c). Body 90 (step E1).

積層彈性體23之方法可舉例如使用接著劑100之方法;藉由電暈放電、真空紅外線等之表面處理使樹脂層21活性化,使樹脂層21彼此間化學鍵結之方法。 The method of laminating the elastic body 23 may be, for example, a method using an adhesive 100; a method of activating the resin layer 21 by surface treatment such as corona discharge or vacuum infrared rays, and a method of chemically bonding the resin layers 21 to each other.

接著劑100係可使用與構成接著層40之接著劑相同者。 The adhesive 100 is the same as the adhesive constituting the adhesive layer 40.

然後,以與積層體90中之鍍敷層70的延伸方向垂直之方式切割在步驟E1所得之積層體90(步驟G1)。第3(c)圖之鍍敷層70的延伸方向為紙面之左右方向,故例如可沿著第3(c)圖之紙面的縱深方向進行切割、或在紙面之上下方向進行切割。 Then, the laminated body 90 obtained in step E1 is cut so as to be perpendicular to the extending direction of the plating layer 70 in the laminated body 90 (step G1). The extending direction of the plating layer 70 in FIG. 3 (c) is the left-right direction of the paper surface. Therefore, for example, cutting can be performed along the depth direction of the paper surface in FIG.

藉此,獲得如第1(a)圖及第1(b)圖所示之電連接器10。又,將鍍敷層70在預定的長度切割而成為金屬薄層22。 Thereby, the electrical connector 10 shown in FIG. 1 (a) and FIG. 1 (b) is obtained. The plated layer 70 is cut into a predetermined length to form a thin metal layer 22.

若依據本實施形態之電連接器之製造方法的話,可獲得電連接器10,而該電連接器10係可防止起因於遷移之短路,且對於連接於電連接器10之裝置的連接端子,不會施加來自金屬薄層22之過剩的力,可防止裝置之連接端子損傷。又,若依據本實施形態之電連接器的製造方法的話,可將製作步驟簡單化,而容易地製造電連接器10。 According to the manufacturing method of the electrical connector according to this embodiment, the electrical connector 10 can be obtained, and the electrical connector 10 can prevent short circuit due to migration, and for the connection terminals of the device connected to the electrical connector 10, Excessive force from the thin metal layer 22 is not applied, and the connection terminals of the device can be prevented from being damaged. In addition, according to the method for manufacturing an electrical connector according to this embodiment, the manufacturing steps can be simplified, and the electrical connector 10 can be easily manufactured.

(第2實施形態) (Second Embodiment) [電連接器之製造方法] [Manufacturing method of electric connector]

實施形態之電連接器的製造方法係具有:在基材之一面塗佈金屬奈米膏劑之步驟(以下,稱為「步驟A2」。);燒製塗佈於基材之一面的金屬奈米膏劑,形成金屬薄層之步驟(以下,稱為「步驟B2」。);在形成於基材之一面的金屬薄層,貼合第1黏土狀橡膠片之一面後,將第1黏土狀橡膠片硫化而形成第1橡膠片之步驟(以下,稱為「步驟C2」。);將基材藉由濕式蝕刻除去,使金屬薄層殘留於第1橡膠片之一面的步驟(以下,稱為「步驟D2」。);在第1橡膠片之一面以被覆金屬薄層之方式,貼合第2黏土狀橡膠片後,將第2黏土狀橡膠片硫化而形成第2橡膠片,形成由第1橡膠片、金屬薄層及第2橡膠片所構成的彈性體之步驟(以下,稱為「步驟E2」。);以金屬薄層成為互相平行之方式,積層複數個彈性體,使積層體成形之步驟(以下,稱為「步驟F2」。);以及以與在積層體中之金屬薄層的延伸方向垂直之方式切割積層體之步驟(以下,稱為「步驟G2」。)。 The manufacturing method of the electrical connector according to the embodiment includes a step of applying a metal nano paste on one surface of a base material (hereinafter referred to as "step A2"); and firing the metal nano-coating material applied on one surface of the base material. Paste (hereinafter referred to as "step B2"); forming a thin metal layer on one surface of the base material and bonding the first clay-shaped rubber sheet to the first clay-shaped rubber sheet; A step of vulcanizing the sheet to form a first rubber sheet (hereinafter, referred to as "step C2"); a step of removing the base material by wet etching, and leaving a thin metal layer on one surface of the first rubber sheet (hereinafter, referred to as It is "step D2".); After the second clay-like rubber sheet is bonded to one surface of the first rubber sheet by coating a thin metal layer, the second clay-like rubber sheet is vulcanized to form a second rubber sheet. Step of elastic body composed of first rubber sheet, metal thin layer and second rubber sheet (hereinafter, referred to as "step E2"); a plurality of elastic bodies are laminated so that the metal thin layers become parallel to each other, so that the layers are laminated A step of forming a body (hereinafter, referred to as "step F2"); and A step (hereinafter, referred to as "step G2") of cutting the laminated body such that the extension direction of the metal thin layer in the body is perpendicular.

在本實施形態中,與第1實施形態相同地,亦可使用由液狀聚矽氧橡膠所構成的橡膠片取代前述第1及前述第2黏土狀橡膠片。 In this embodiment, as in the first embodiment, a rubber sheet composed of a liquid silicone rubber may be used instead of the first and second clay rubber sheets.

以下,參照第4(a)圖至第4(c)圖及第5(a)圖至第5(c)圖,說明本實施形態之電連接器的製造方法。 Hereinafter, a method of manufacturing the electrical connector according to this embodiment will be described with reference to FIGS. 4 (a) to 4 (c) and FIGS. 5 (a) to 5 (c).

第4(a)圖至第4(c)圖及第5(a)圖至第5(c)圖係表示本實施形態之電連接器的製造方法之概略剖面圖。又,第4圖及第5圖中,與在第1圖所示之第1實施形態中的電連接器、以及第2(a)圖至第2(c)圖及第3(a)圖至第3(c)圖所示之第1實施形態中之電連接器的製造方法相同的構成中,賦予相同的符號,並省略重複之說明。 Figures 4 (a) to 4 (c) and 5 (a) to 5 (c) are schematic cross-sectional views showing a method of manufacturing the electrical connector of this embodiment. 4 and 5 are the electrical connector of the first embodiment shown in Fig. 1 and Figs. 2 (a) to 2 (c) and 3 (a). In the same configuration of the method of manufacturing the electrical connector according to the first embodiment shown in FIG. 3 (c), the same reference numerals are given, and redundant descriptions are omitted.

如第4(a)圖所示,在基材60之一面60a塗佈金屬奈米膏劑110(步驟A2)。 As shown in FIG. 4 (a), the metal nanopaste 110 is applied to one surface 60a of the substrate 60 (step A2).

在基材60之一面60a塗佈金屬奈米膏劑110之方法並無特別限定,可舉例如噴墨法、凹版印刷法、靜電塗佈法、旋轉塗佈法、模頭塗佈法等。 The method for applying the metal nano paste 110 to one surface 60 a of the substrate 60 is not particularly limited, and examples thereof include an inkjet method, a gravure printing method, an electrostatic coating method, a spin coating method, and a die coating method.

金屬奈米膏劑係例如排除銀,而將金、鉑等貴金屬、或此等貴金屬之合金等的奈米大小(平均粒徑1nm至未達1μm)之金屬粒子分散於黏結劑樹脂者。 The metal nanopaste is, for example, excluding silver, and dispersing metal particles of nano size (average particle diameter of 1 nm to less than 1 μm) of precious metals such as gold and platinum or alloys of these precious metals in the binder resin.

然後,燒製塗佈於基材60之一面60a的金屬奈米膏劑110,形成金屬薄層120(步驟B2)。 Then, the metal nano paste 110 applied on one surface 60a of the base material 60 is fired to form a thin metal layer 120 (step B2).

在步驟B2中,燒製金屬奈米膏劑110。 In step B2, the metal nano paste 110 is fired.

繼而,如第4(b)圖所示,在形成於基材60之一面60a的金屬薄層120,貼合第1黏土狀橡膠片81之一面81a後,將第1黏土狀橡膠片81硫化而形成第1橡膠片81A(步驟C2)。 Next, as shown in FIG. 4 (b), the first clay-like rubber sheet 81 is adhered to the thin metal layer 120 formed on the first surface 60a of the substrate 60, and the first clay-like rubber sheet 81 is vulcanized Thus, a first rubber sheet 81A is formed (step C2).

在步驟C2中,與上述之步驟B1相同地,將第1黏土狀橡膠片81硫化而形成第1橡膠片81A。 In step C2, similarly to the above-mentioned step B1, the first clay rubber sheet 81 is vulcanized to form a first rubber sheet 81A.

然後,如第4(c)圖所示,將基材60藉由濕式蝕刻除去,使金屬薄層120殘留於第1橡膠片81A之一面81a(步驟D2)。 Then, as shown in FIG. 4 (c), the base material 60 is removed by wet etching, so that the thin metal layer 120 remains on one surface 81a of the first rubber sheet 81A (step D2).

在步驟D2中,與上述之步驟C1相同地,將基材60藉由濕式蝕刻除去。 In step D2, similar to step C1 described above, the substrate 60 is removed by wet etching.

在步驟D2中,藉由將基材60藉由濕式蝕刻除去,在第1橡膠片81A之一面81a上轉印金屬薄層120。 In step D2, the base material 60 is removed by wet etching, and the thin metal layer 120 is transferred onto one surface 81a of the first rubber sheet 81A.

其次,如第5(a)圖所示,在第1橡膠片81A之一面81a,以被覆金屬薄層120的方式,貼合第2黏土狀橡膠片82後,將第2黏土狀橡膠片82硫化而形成第2橡膠片82A,使由第1橡膠片81A、金屬薄層120及第2橡膠片82A所構成的彈性體23成形(步驟E2)。 Next, as shown in FIG. 5 (a), the second clay-like rubber sheet 82 is bonded to the first surface 81 a of the first rubber sheet 81A so as to cover the thin metal layer 120, and then the second clay-like rubber sheet 82 is bonded. The second rubber sheet 82A is formed by vulcanization, and the elastic body 23 composed of the first rubber sheet 81A, the thin metal layer 120, and the second rubber sheet 82A is formed (step E2).

在步驟E2中,與上述之步驟D1相同地,使彈性體23成形。 In step E2, the elastic body 23 is formed in the same manner as in step D1 described above.

然後,如第5(b)圖所示,以金屬薄層120成為互相平行之方式,將在步驟A2至步驟E2所得的彈性體23複數積層,形成如第5(c)圖所示之積層體90(步驟F2)。 Then, as shown in FIG. 5 (b), a plurality of elastomers 23 obtained in steps A2 to E2 are laminated so that the thin metal layers 120 become parallel to each other to form a laminate as shown in FIG. 5 (c). Body 90 (step F2).

在步驟F2中,與上述之步驟E1相同地,使積層體90成形。 In step F2, the laminated body 90 is shape | molded similarly to the said step E1.

繼而,以與積層體90中之金屬薄層120的延伸方向垂直之方式切割在步驟F2所得之積層體90(步驟G2)。 Then, the laminated body 90 obtained in step F2 is cut perpendicular to the extending direction of the thin metal layer 120 in the laminated body 90 (step G2).

藉由此,獲得如第1(a)圖及第1(b)圖所示之電連接器10。又,金屬薄層120切割成預定之長度而為金屬薄層22。 Thereby, the electrical connector 10 shown in FIG. 1 (a) and FIG. 1 (b) is obtained. The thin metal layer 120 is cut into a predetermined length to form the thin metal layer 22.

若依據本實施形態之電連接器的製造方法的話,可獲得電連接器10,而該電連接器10係可防止起因於遷移之短路,且對於連接於電連接器10之裝置的連接端子,不會施加來自金屬薄層22之過剩的力,可防止裝置之連接端子損傷。又,若依據本實施形態之電連接器的製造方法的話,將製作步驟簡化,可容易地製造電連接器10。 According to the manufacturing method of the electrical connector according to this embodiment, the electrical connector 10 can be obtained, and the electrical connector 10 can prevent short circuit due to migration, and for the connection terminals of the device connected to the electrical connector 10, Excessive force from the thin metal layer 22 is not applied, and the connection terminals of the device can be prevented from being damaged. In addition, according to the method for manufacturing an electrical connector according to this embodiment, the manufacturing steps are simplified, and the electrical connector 10 can be easily manufactured.

又,各本實施形態之電連接器的製造方法係可具有從電連接器10之一主面20a及另一主面20b的至少一者,使複數層金屬薄層22之端部突出的步驟(突出步驟)。 In addition, the method for manufacturing an electrical connector of each embodiment may include a step of protruding the ends of the plurality of metal thin layers 22 from at least one of the main surface 20 a and the other main surface 20 b of the electrical connector 10. (Highlight step).

使金屬薄層22之端部從主面突出之方法可舉例如雷射蝕刻、化學蝕刻、切削等之機械加工,削去構成電連接器10之主面的樹脂層之一部分的方法。 As a method of protruding the end portion of the thin metal layer 22 from the main surface, a method such as laser etching, chemical etching, cutting, etc. may be used to cut off a part of the resin layer constituting the main surface of the electrical connector 10.

使其突出之金屬薄層22的端部形成鍍敷層時,可適用公知之電解鍍敷或無電解鍍敷之方法。 When a plating layer is formed on the end of the protruding metal thin layer 22, a known method such as electrolytic plating or electroless plating can be applied.

[實施例] [Example]

以下,藉由實施例及比較例更具體地說明本發明,但本發明不限定於以下之實施例。 Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples, but the present invention is not limited to the following examples.

[實施例] [Example]

參照第1圖、第2(a)圖至第2(c)圖及第3(a)圖至第3(c)圖,說明本發明之實施例。 An embodiment of the present invention will be described with reference to Figs. 1, 2 (a) to 2 (c), and 3 (a) to 3 (c).

準備金鍍敷板,該金鍍敷板係具有在厚度50μm之銅板的兩面具備厚度0.5μm之鎳鍍敷層的基材、及在基材之鎳鍍敷層的表面積層厚度0.5μm之金鍍敷層。 A gold-plated plate was prepared. The gold-plated plate had a base material having a nickel plating layer having a thickness of 0.5 μm on both sides of a copper plate having a thickness of 50 μm, and a gold plating layer having a surface area layer having a thickness of 0.5 μm on the nickel plating layer of the base material. Floor.

在可混練複合物(品號:KE-174-U、信越化學工業公司製)100質量份加入硫化劑(品號:C-19A、信越化學工業公司製)0.6質量份及硫化劑(品號:C-19B、信越化學工業公司製)2.5質量份、及矽烷偶合劑(品號:KBM-403、信越化學工業公司製)1質量份並混練,製作第1黏土狀聚矽氧橡膠。 To 100 parts by mass of the kneadable compound (product number: KE-174-U, manufactured by Shin-Etsu Chemical Industry Co., Ltd.) was added 0.6 parts by mass of curing agent (Product No .: C-19A, manufactured by Shin-Etsu Chemical Co., Ltd.) and curing agent (Product No. : C-19B, 2.5 parts by mass of Shin-Etsu Chemical Industry Co., Ltd., and 1 part by mass of silane coupling agent (article number: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) and kneaded to produce the first clay-like silicone rubber.

將該第1黏土狀聚矽氧橡膠成形為厚度85μm。 This 1st clay-like silicone rubber was shape | molded to 85 micrometers in thickness.

然後,在金鍍敷板之金鍍敷層貼合第1黏土狀橡膠片之一面後,在135℃加熱第1黏土狀橡膠片40分鐘,將第1黏土狀橡膠片硫化並使其硬化,設為由聚矽氧橡膠所構成的第1橡膠片。 Then, after the gold plating layer of the gold plating plate was bonded to one side of the first clay-like rubber sheet, the first clay-like rubber sheet was heated at 135 ° C for 40 minutes, and the first clay-like rubber sheet was vulcanized and hardened. It is the first rubber sheet made of silicone rubber.

繼而,將在金鍍敷板貼合有第1橡膠片者浸漬於氯化鐵之溶液,除去白銅及鎳鍍敷層。藉此,在第1橡膠片之一面上轉印金鍍敷層。 Next, the one having the first rubber sheet bonded to the gold plating plate was immersed in a solution of ferric chloride to remove the copper and nickel plating layers. Thereby, a gold plating layer is transferred on one surface of the first rubber sheet.

然後,在第1橡膠片之一面以被覆金鍍敷層之方式,貼合與第1黏土狀橡膠片之構成及厚度相等的第2黏土狀橡膠片後,該第2黏土狀橡膠片在135℃加熱40分鐘,將第2黏土狀橡膠片硫化而使其硬化,設為由聚矽氧橡膠所構成的第2橡膠片。藉此,使由第1橡膠片及第2橡膠片、及夾住此等之金鍍敷層所構成的彈性體成形。 Then, on one surface of the first rubber sheet, the second clay-shaped rubber sheet having the same structure and thickness as the first clay-shaped rubber sheet was laminated with a gold plating layer. It heated at 40 degreeC for 40 minutes, vulcanized and hardened the 2nd clay-like rubber sheet, and it was set as the 2nd rubber sheet | seat which consists of silicone rubber. Thereby, the elastic body which consists of a 1st rubber sheet and a 2nd rubber sheet, and these gold plating layers is shape | molded.

再者,以金鍍敷層為互相平行地疊合之方式,透過液狀聚矽氧橡膠,將彈性體複數積層,使積層體成形。在此,在彈性體之貼著面藉由網版印刷,以厚度成為30μm之方式塗佈液狀聚矽氧橡膠。又,透過液狀聚矽氧橡膠,積層彈性體後,將積層體在135℃加熱40分鐘,將液狀聚矽氧橡膠硫化而使其硬化。 In addition, the gold plating layers are stacked in parallel with each other, and the liquid silicone rubber is used to laminate a plurality of elastomers to form a laminated body. Here, a liquid silicone rubber was coated on the contact surface of the elastomer by screen printing so as to have a thickness of 30 μm. In addition, after the elastomer was laminated through the liquid silicone rubber, the laminate was heated at 135 ° C for 40 minutes, and the liquid silicone rubber was vulcanized to harden.

繼而,以與在積層體中之金鍍敷層延伸之方向垂直之方式切割所得之積層體,獲得如第1圖所示之電連接器。 Then, the obtained laminated body was cut in a manner perpendicular to the extending direction of the gold plating layer in the laminated body to obtain an electrical connector as shown in FIG. 1.

在實施例之電連接器中,接合面的金鍍敷層之矩形長邊的長度為5mm,在接合面之金鍍敷層的矩形短邊之長度為0.5μm,在接合面之矩形的短邊方向之金鍍敷層的間距為200μm。 In the electrical connector of the embodiment, the length of the rectangular long side of the gold plating layer on the joint surface is 5 mm, the length of the rectangular short side of the gold plating layer on the joint surface is 0.5 μm, and the length of the rectangle on the joint surface is short. The pitch of the gold plating layers in the side direction was 200 μm.

[比較例] [Comparative example]

在形成於聚對苯二甲酸乙二酯基材上的由聚矽氧橡膠所構成的厚度110μm之第一樹脂層的一面上,使多數之導電構件方向一致地以200μm的間隔排列配置。 On one side of the 110 μm-thick first resin layer made of silicone rubber formed on a polyethylene terephthalate substrate, most of the conductive members are arranged in a uniform direction at intervals of 200 μm.

導電構件係使用具有由黄銅所構成的直徑39.6μm之圓柱狀芯材、及形成於其芯材的外周面之厚度0.1μm的鎳鍍敷層及厚度0.1μm之金鍍敷層者。 As the conductive member, a cylindrical core material having a diameter of 39.6 μm made of brass, a nickel plating layer having a thickness of 0.1 μm, and a gold plating layer having a thickness of 0.1 μm formed on the outer peripheral surface of the core material were used.

然後,在配置有多數導電構件之第一樹脂層的一面上,形成由聚矽氧橡膠所構成的厚度110μm之第二樹脂層,使第二樹脂層與第一樹脂層一體化,同時並在第一樹脂層與第二樹脂層之間固定導電構件,形成含有導電構件的薄片。 Then, a second resin layer made of silicone rubber and having a thickness of 110 μm is formed on one side of the first resin layer on which a plurality of conductive members are arranged. The second resin layer and the first resin layer are integrated, and simultaneously A conductive member is fixed between the first resin layer and the second resin layer to form a sheet containing the conductive member.

然後,互相地使導電構件之方向一致而將含有導電構件的薄片之複數片積層,形成含有導電構件的薄片之積層體。 Then, the directions of the conductive members are aligned with each other, and a plurality of sheets containing the conductive member are laminated to form a laminated body including the sheets containing the conductive member.

然後,以成為厚度300μm之方式,藉由切削加工,以與導電構件的延伸方向垂直之方式切割積層體,獲得具備經圓切之導電構件被接合之貫通孔的電連接器。 Then, the laminated body was cut so as to have a thickness of 300 μm so as to be perpendicular to the extending direction of the conductive member by cutting, to obtain an electrical connector having a through-hole through which the conductive member was cut in a circle.

在比較例之電連接器中,接合面之導電構件的直徑為40μm,在接合面之橫方向的導電構件之間距為250μm。 In the electrical connector of the comparative example, the diameter of the conductive member on the bonding surface was 40 μm, and the distance between the conductive members in the lateral direction of the bonding surface was 250 μm.

[評估1] [Evaluation 1]

將實施例與比較例之電連接器配置於在銅之表面施予鎳鍍敷及金鍍敷的直徑1.0mm之探針、及具有經金鍍敷之連接端子的基板之間,形成積層體(試驗裝置)。 The electrical connectors of the examples and comparative examples were arranged between a 1.0 mm diameter probe having nickel plating and gold plating applied to the surface of copper, and a substrate having a gold-plated connection terminal to form a laminate. (Testing device).

又,為了測定探針與基板上之連接端子之間的電阻值,在探針與連接端子連接電阻測定器(商品名:RM3545-01、日置電機公司製)。 In addition, in order to measure the resistance value between the probe and the connection terminal on the substrate, a resistance measuring device (trade name: RM3545-01, manufactured by Hitachi Electric Corporation) was connected to the probe and the connection terminal.

以該狀態,一邊將積層體朝其厚度方向壓縮,一邊測定探針與連接端子之間的電阻值,研究積層體之位移量(積層體朝厚度方向被壓縮之量)、及探針與連接端子之間的電阻值之關係。又,積層體之位移量相等於電連接器之位移量。 In this state, while compressing the multilayer body in the thickness direction, measure the resistance value between the probe and the connection terminal, and study the displacement of the multilayer body (the amount by which the multilayer body is compressed in the thickness direction), and the probe and connection The relationship between the resistance values of the terminals. In addition, the displacement of the laminated body is equal to the displacement of the electrical connector.

又,壓縮積層體時,藉由自動荷重試驗機(商品名:MAX-1KN-S-1、日本計測系統公司製),測定施加於積層體之荷重,研究積層體之位移量(壓縮量)與荷重之關係。 When the laminated body is compressed, an automatic load tester (trade name: MAX-1KN-S-1, manufactured by Japan Measurement System Corporation) is used to measure the load applied to the laminated body, and the displacement (compression amount) of the laminated body is studied. Relationship to load.

從以上之結果,研究探針與基板之間的電阻值及施加於電連接器之荷重的關係。將使用實施例之電連接器時的積層體之位移量與荷重之關係的結果表示於第6圖。將使用比較例之電連接器時的積層體之位移量與荷重之關係的結果表示於第7圖。將使用實施例或比較例之電連接器時的積層體之位移量、及探針與連接端子之間的電阻值之關係的結果表示於第8圖。 From the above results, the relationship between the resistance value between the probe and the substrate and the load applied to the electrical connector was studied. The result of the relationship between the displacement of the laminated body and the load when the electrical connector of the example is used is shown in FIG. 6. The result of the relationship between the displacement of the laminated body and the load when the electrical connector of the comparative example is used is shown in FIG. 7. The results of the relationship between the amount of displacement of the laminated body and the resistance value between the probe and the connection terminal when the electrical connectors of the examples or comparative examples are used are shown in FIG. 8.

從第6圖至第8圖之結果,電阻值為安定之壓縮量,在實施例中為0.015mm,在比較例中為0.02mm。在比較例中,電阻值為安定時之壓縮量為實施例之約2倍。其時之荷重在實施例中為0.58N,在比較例中為4.76N。亦即,在比較例中,電阻值為安定時之荷重為實施例之約8倍。因此,在實施例中可降低對檢査對象之電極施加的荷重,並可抑制電極之損傷。 From the results of FIGS. 6 to 8, the resistance value is a stable amount of compression, which is 0.015 mm in the embodiment and 0.02 mm in the comparative example. In the comparative example, the amount of compression of the resistance value is about two times that of the embodiment. The load at that time was 0.58 N in the examples and 4.76 N in the comparative examples. That is, in the comparative example, the load of the resistance value is about 8 times that of the example. Therefore, in the embodiment, the load applied to the electrode to be inspected can be reduced, and damage to the electrode can be suppressed.

[評估2] [Assessment 2]

將實施例與比較例之電連接器配置於對鉛之表面施予鎳鍍敷及金鍍敷之直徑1.0mm的探針、及貼附有由厚度35μm之銅層與厚度25μm之導電性黏著劑所構成的銅箔膠帶之玻璃基板之間,朝向銅層而形成積層體(試驗裝置)。 The electrical connectors of the examples and the comparative examples were arranged on a lead having a diameter of 1.0 mm, and nickel plating and gold plating were applied to the surface of lead, and a 35 μm-thick copper layer and a 25 μm-thick conductive adhesive were attached. A laminated body (testing device) was formed between the glass substrates of the copper foil tape composed of the adhesive toward the copper layer.

在該狀態,將積層體朝其厚度方向壓縮。 In this state, the laminated body is compressed in the thickness direction.

在實施例及比較例中,有關施加8N荷重時,藉由掃描型電子顯微鏡觀察電連接器與銅箔膠帶之接觸面。將在實施例中之掃描型電子顯微鏡攝影出的圖像表示於第9圖。將在比較例中之掃描型電子顯微鏡攝影出的圖像表示於第10圖。 In the examples and comparative examples, when an 8N load was applied, the contact surface between the electrical connector and the copper foil tape was observed with a scanning electron microscope. An image taken by a scanning electron microscope in the example is shown in FIG. 9. An image taken by a scanning electron microscope in a comparative example is shown in FIG. 10.

從第9圖之結果,在實施例中,在銅箔膠帶看不到起因於電連接器之金屬薄層的損傷。另一方面,從第10圖之結果,在比較例中,在銅箔膠帶可看出起因於電連接器之導電構件的損傷。 From the results of FIG. 9, in the embodiment, no damage caused by the thin metal layer of the electrical connector was observed in the copper foil tape. On the other hand, from the results of FIG. 10, in the comparative example, damage to the conductive member due to the electrical connector can be seen in the copper foil tape.

Claims (5)

一種電連接器,係配置於第一裝置之連接端子與第二裝置之連接端子之間,而將此等電性連接者,該電連接器係具備:多層本體,該多層本體係由樹脂層及金屬薄層交互地多重積層而成之長方體形狀者,前述金屬薄層係朝厚度方向及縱深方向貫通前述多層本體,前述多層本體之與前述連接端子連接的連接面中之前述金屬薄層之露出面的形狀為矩形,前述金屬薄層為由貴金屬或貴金屬合金所構成,且前述矩形之短邊的長度為0.01μm以上10μm以下。 An electrical connector is arranged between a connection terminal of a first device and a connection terminal of a second device, and for those who are electrically connected, the electrical connector is provided with: a multi-layer body, the multi-layer system is made of a resin layer In the case of a rectangular parallelepiped formed by multiple lamination with a metal thin layer, the metal thin layer penetrates the multilayer body in a thickness direction and a depth direction, and the metal thin layer in a connection surface of the multilayer body and the connection terminal is connected to the metal thin layer. The shape of the exposed surface is rectangular, the thin metal layer is made of a precious metal or a precious metal alloy, and the length of the short side of the rectangular is 0.01 μm or more and 10 μm or less. 如申請專利範圍第1項所述之電連接器,其中,前述矩形之短邊方向的前述金屬薄層之間距為4μm以上600μm以下。 The electrical connector according to item 1 of the scope of patent application, wherein the distance between the thin metal layers in the short side direction of the rectangle is 4 μm or more and 600 μm or less. 如申請專利範圍第1或2項所述之電連接器,其中,在前述金屬薄層之一部份為露出之沿著前述多層本體之厚度方向的側面係設有被覆層。 The electrical connector according to item 1 or 2 of the scope of patent application, wherein a covering layer is provided on a side of a part of the metal thin layer that is exposed along the thickness direction of the multilayer body. 一種電連接器之製造方法,係具有下列步驟:在基材之一面形成鍍敷層;在形成於前述基材之一面的前述鍍敷層貼合第1未硬化之橡膠片的一面後,將前述第1未硬化之橡膠片硫化而形成第1橡膠片;除去前述基材,使前述鍍敷層殘留於前述第1橡膠片之一面;在前述第1橡膠片之一面以被覆前述鍍敷層之方式,貼合第2未硬化之橡膠片後,將前述第2未硬化之橡膠片硫化而形成第2橡膠片,形成由前述第1橡膠片、前述鍍敷層及前述第2橡膠片所構成的彈性體; 以前述鍍敷層成為互相平行之方式,積層複數個前述彈性體而形成積層體;以及以與前述積層體中之前述鍍敷層的延伸方向垂直之方式切割前述積層體。 An electrical connector manufacturing method includes the following steps: forming a plating layer on one side of a base material; and after the plating layer formed on one side of the base material is bonded to one side of a first unhardened rubber sheet, The first unhardened rubber sheet is vulcanized to form a first rubber sheet; the base material is removed to leave the plating layer on one surface of the first rubber sheet; the one surface of the first rubber sheet is coated with the plating layer In the method, after the second uncured rubber sheet is bonded, the second uncured rubber sheet is vulcanized to form a second rubber sheet, and the first rubber sheet, the plating layer, and the second rubber sheet are formed. Constitutive elastomer A plurality of the elastic bodies are laminated so that the plating layers become parallel to each other to form a laminated body; and the laminated body is cut so as to be perpendicular to the extending direction of the plating layer in the laminated body. 一種電連接器之製造方法,係具有下列步驟:在基材之一面塗佈金屬奈米膏劑;燒製塗佈在前述基材之一面的金屬奈米膏劑,形成金屬薄層;在形成於前述基材之一面的前述金屬薄層,貼合第1未硬化之橡膠片的一面後,將前述第1未硬化之橡膠片硫化而形成第1橡膠片;除去前述基材,使前述金屬薄層殘留於前述第1橡膠片之一面;在前述第1橡膠片之一面以被覆前述金屬薄層的方式,貼合第2未硬化之橡膠片後,將前述第2未硬化之橡膠片硫化而形成第2橡膠片,形成由前述第1橡膠片、前述金屬薄層及前述第2橡膠片所構成的彈性體;以前述金屬薄層成為互相平行之方式,積層複數個前述彈性體而形成積層體;以及以與前述積層體中之前述金屬薄層的延伸方向垂直之方式切割前述積層體。 An electrical connector manufacturing method includes the following steps: coating a metal nano paste on one surface of a substrate; firing the metal nano paste applied on one surface of the substrate to form a thin metal layer; The thin metal layer on one side of the base material is bonded to one side of the first unhardened rubber sheet, and then the first unhardened rubber sheet is vulcanized to form a first rubber sheet; the base material is removed to make the thin metal layer It remains on one surface of the first rubber sheet; on the one surface of the first rubber sheet, the second uncured rubber sheet is bonded to the one surface of the first rubber sheet, and then the second uncured rubber sheet is vulcanized to form A second rubber sheet forms an elastic body composed of the first rubber sheet, the metal thin layer, and the second rubber sheet; a plurality of the elastic bodies are laminated so that the metal thin layers become parallel to each other to form a laminated body. And cutting the laminated body so as to be perpendicular to the extending direction of the thin metal layer in the laminated body.
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