JP2808164B2 - Manufacturing method of electrical connection member - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing an electrical connection member used when electrically connecting electric circuit components.

[Conventional technology]

As a method of electrically connecting electric circuit components to each other,
Wire bonding method, TAB (Tape Automated Bondin)
g) The method is conventionally known. However, these methods have drawbacks such as an inability to cope with an increase in the number of connection points between the two electric circuit components and an increase in cost. In order to solve such a problem, it is necessary to electrically connect the electric circuit components to each other by using an electric connection member having a configuration in which a plurality of conductive members are provided insulated from each other in an insulating holder. It is known (JP-A-63-22224, JP-A-63-2242).
No. 35 gazette).

FIG. 9 is a schematic diagram showing an electrical connection between electrical circuit components using such an electrical connection member, in which 31 is an electrical connection member, and 32 and 33 are electrical circuit components to be connected. Show. The electrical connection member 31 includes a plurality of conductive members 34 made of a metal or an alloy, each of which is electrically insulated from each other in a holding body 35 made of an electrically insulating material. The one end 38 of the conductive member 34 is connected to one electric circuit component.
The other end 39 of the conductive member 34 is exposed to the other electric circuit component 33 side (FIG. 9 (a)). And
The connection portion 36 of one electric circuit component 32 and one end 38 of the conductive member 34 exposed on the electric circuit component 32 side are alloyed to join them together, and the connection portion 37 of the other electric circuit component 33 is connected to the electric circuit. By joining the other end 39 of the conductive member 34 exposed to the component 33 side with the other, the two are joined to electrically connect the electric circuit components 32 and 33 (FIG. 9 (b)).

Such an electrical connection member has the following advantages.

By miniaturizing the size of the conductive member, the connection portion of the electric circuit component can be reduced in size and the number of connection points can be increased, so that higher-density connection between the electric circuit components can be achieved.

Even for electric circuit components with different thicknesses, changing the thickness of the electrical connection member makes it possible to keep the height of the electric circuit components constant at all times. Is possible.

By increasing the protruding height of the conductive member connected to the connection portion of the electric circuit component, stable connection can be performed even if the connection portion of the electric circuit component is dropped from the surface, and the Even electrical circuit components having a shape can be easily connected.

Since the heat generated from the electric circuit component is radiated through the holder of the electric connection member, the change in electric characteristics due to the heat is extremely small. In addition, since the heat radiation characteristics are excellent, the influence of thermal fatigue is small and the reliability is high.

Since the connection length of the connection between the electric circuit components is shortened, the impedance can be reduced and the speed of the electric circuit components can be increased.

As a method for manufacturing the above-described electrical connection member for performing electrical multipoint connection between electrical circuit components, Japanese Patent Application No.
There is one proposed in 133401. Hereinafter, this manufacturing method will be briefly described with reference to FIG. 10 schematically showing the steps.

First, a base 51 made of a metal sheet such as a copper plate is prepared (FIG. 10 (a)), a negative photosensitive resin 52 is applied on the base 51 by spin coating, and the temperature is set at about 100 ° C. Prebake is performed (FIG. 10 (b)). After irradiating (exposing) the photosensitive resin 52 with light through a photomask (not shown) having a predetermined pattern, development is performed. The photosensitive resin 52 remains in the exposed portion, and in the unexposed portion, the photosensitive resin 52 is removed by a developing process to form a plurality of holes 53 (FIG. 10 (c)). After the temperature is raised to 200 to 400 ° C. to cure the photosensitive resin 52, the substrate 51 is immersed in an etchant to perform etching, thereby forming a concave portion 54 communicating with the hole 53 in the substrate 51 (tenth embodiment). Figure (d). Then
Gold plating is performed using the base 51 as a common electrode,
4 is filled with gold 55, and gold plating is continued until a bump is formed (FIG. 10 (e)). Finally, the base 51 is removed by etching to manufacture the electrical connection member 31 (FIG. 10 (f)).

In the electrical connection member 31 manufactured in this manner, the gold 55 constitutes the conductive member 34, and the photosensitive resin 52 is
Make up 35. The dimensions of each part of the electrical connection member 31 are such that the thickness of the photosensitive resin 52 (the holder 35) is about 10 μm,
The diameter of the hole 53 (conductive member 34) is about 15 μm and the pitch is about 40 μm
The protrusion amount of the conductive member 34 is set to about several μm on both sides.

[Problems to be solved by the invention]

However, in the manufacturing method proposed in Japanese Patent Application No. 63-133401 as described above, the following problems remain, and there is room for further improvement.

Conventionally, the shape of the protrusion of the conductive member in the manufactured electrical connection member is limited by the shape of the recess formed in the base by immersion etching. However, in this immersion etching, it is difficult to precisely control the spread, and it is difficult to control the shape (projection height, area, volume, etc.) of the projection of the conductive member with high accuracy. is there. Further, there is a problem that it is difficult to change the shape of the protrusion in various ways.

The present invention has been made in view of such circumstances, and a photosensitive resin layer is provided so as to sandwich the photosensitive resin separately from the photosensitive resin serving as a holding body, and a hole for limiting the protruding shape of the conductive member is formed in the photosensitive resin. The object of the present invention is to provide a method for manufacturing an electrical connection member which can control the shape of the protrusion of the conductive member in various ways, can be controlled more precisely, and can manufacture an electrical connection member having stable characteristics. And

[Means for solving the problem]

The method for manufacturing an electrical connection member according to the first invention according to the present application includes:
A holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state from each other, and one end of each of the conductive members is exposed on one surface of the holder. In the method for manufacturing an electrical connection member in which the other end of each of the conductive members is exposed on the other surface of the holder, the first photosensitive resin may be a photosensitive wavelength. A step of providing a second photosensitive resin having a different band and serving as the holder and a third photosensitive resin having a different photosensitive wavelength band from the second photosensitive resin on the substrate in this order; Irradiating light to expose each of the first, second, and third photosensitive resins in a predetermined pattern;
Forming a plurality of holes in each photosensitive resin by developing the third photosensitive resin, filling the holes with a conductive material serving as the conductive member, and forming the first and third photosensitive resins. Removing the resin and the substrate.

The method for manufacturing an electrical connection member according to the second invention according to the present application includes:
A holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state from each other, and one end of each of the conductive members is exposed on one surface of the holder. In the method for manufacturing an electrical connection member in which the other end of each of the conductive members is exposed on the other surface of the holder, a first photosensitive resin is provided on a base to form a first predetermined pattern. The step of exposing, providing a second photosensitive resin having a photosensitive wavelength band different from that of the first photosensitive resin and serving as the holder on the first photosensitive resin and exposing to a second predetermined pattern; Providing a third photosensitive resin having a different photosensitive wavelength band from the second photosensitive resin on the second photosensitive resin and exposing the third photosensitive resin to a third predetermined pattern; Forming a plurality of holes by developing the second and third photosensitive resins; The conductive and filling a conductive material serving as member, characterized in that a step of removing the first, third photosensitive resin and the substrate to.

The method for manufacturing an electrical connection member according to the third invention according to the present application includes:
A holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state from each other, and one end of each of the conductive members is exposed on one surface of the holder. In the method for manufacturing an electrical connection member in which the other end of each of the conductive members is exposed on the other surface of the holding member, a first photosensitive resin is provided on a base, and is exposed and developed. Forming a first hole of the first photosensitive resin and a second photosensitive resin having a photosensitive wavelength band different from that of the first photosensitive resin.
Providing a photosensitive resin on the first photosensitive resin and exposing,
Developing and forming a plurality of second holes communicating with the first holes; and transferring the third photosensitive resin having a photosensitive wavelength band different from that of the second photosensitive resin to the second photosensitive resin. Providing a plurality of third holes communicating with the second holes by exposing and developing the resin on a resin; and forming a conductive material serving as the conductive member in the first, second, and third holes. A filling step; and a step of removing the first and third photosensitive resins and the base.

A method for manufacturing an electrical connection member according to a fourth aspect of the present invention includes:
In the first, second or third invention, the first photosensitive resin and the third photosensitive resin have different photosensitive wavelength bands, and are exposed by irradiating light of different wavelength bands. .

[Action]

In the method for manufacturing an electrical connection member of the present invention, the first
In the photosensitive resin and the third photosensitive resin, holes for limiting the shape of the protruding portion of the conductive member are formed. The protrusion height of the protrusion of the conductive member is controlled by the thickness of the first and third photosensitive resins, and the protrusion of the conductive member is controlled by the diameter of the hole formed in the first and third photosensitive resins. Control the area of the part. Furthermore, by selecting the first photosensitive resin that can easily expose the base, an electrical connection member having a uniform bump shape can be obtained.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings showing the embodiments.

(First Embodiment) FIG. 1 is a schematic sectional view showing a manufacturing process of the first embodiment. First, a copper plate 1 as a base is prepared (FIG. 1A). A first photosensitive resin 2a (hereinafter, referred to as a first resin 2a) is applied onto the copper plate 1 and prebaked (FIG. 1B). Here, since the protrusion height of the protrusion on one side of the conductive member in the manufactured electrical connection member is limited by the thickness of the first resin 2a, the thickness is adjusted to a desired protrusion height. Set. Next, on the first resin 2a, the second photosensitive resin 2b having a different photosensitive wavelength band from the first resin 2a and serving as a holder is provided.
(Hereinafter, referred to as a second resin 2b) and pre-baked (FIG. 1 (c)). Here, the thickness of the holder in the electrical connection member to be manufactured is limited by the thickness of the second resin 2b, and thus the thickness is set to match the desired thickness of the holder. Further, the first resin 2a and the second resin 2b are formed on the second resin 2b.
And a third photosensitive resin 2c having a different photosensitive wavelength band (hereinafter referred to as the third photosensitive resin 2c).
Resin 2c) is applied and prebaked (FIG. 1 (d)). Here, the projecting height of the projecting portion on the other side of the conductive member in the electrical connection member to be manufactured is limited by the application thickness of the third resin 2c. Set the As the first resin 2a and the third resin 2c, an epoxy resin, a general resist (for example, Tokyo Oka OMR series) or the like can be used, and as the second resin 2b, a polyimide resin (for example, CIBA-GEIGY Providimide 412) or the like Can be used.

FIG. 2 is a graph showing the photosensitive wavelength bands of these three kinds of resins to be applied, and the horizontal axis shows the wavelength. In FIG. 2, A, B, and C indicate the photosensitive wavelength bands of the first resin 2a, the second resin 2b, and the third resin 2c, respectively. They are different without overlapping.

Next, light is irradiated by exposing the light in the region A in FIG. 2 through the photomask 3a having a predetermined pattern (FIG. 1 (e)). At this time, since the light in the wavelength band for exposing the first resin 2a is irradiated, only the first resin 2a is exposed in a predetermined pattern, and the other second resin 2b and the third resin 2c are not exposed to the extent that there is no influence. . Since the area of the protruding portion on one side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3a, the pattern is set to match the desired area. Next, light is irradiated by irradiating the light in the region B in FIG. 2 through the photomask 3b having another predetermined pattern (FIG. 1 (f)). At this time, since the light in the wavelength band for exposing the second resin 2b is irradiated, only the second resin 2b is exposed in a predetermined pattern, and the third resin 2c is not exposed to the extent that there is no influence, and has already been formed. The exposure pattern of the first resin 2a is not affected. Since the diameter of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3b, the pattern is set to match the desired diameter. Further, light is irradiated by exposing the light in the region C in FIG. 2 through a photomask 3c having another predetermined pattern (FIG. 1 (g)). At this time, since the light in the wavelength band for exposing the third resin 2c is irradiated, only the third resin 2c is exposed in a predetermined pattern, and the already formed first resin 2a and second resin 2b are formed.
Are not affected. Since the area of the protruding portion on the other side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3c, the pattern is set to match the desired area.

After performing the above exposure processing, development is performed. In this example, since the first, second, and third resins both use a negative photosensitive resin, each of the resins 2a, 2b, and 2c remains in an exposed portion, and a portion that is not exposed is each resin by a development process. 2a, 2b, 2c
Are removed, and a plurality of holes 4 are formed in the resin laminate (FIG. 1 (h)). After that, the respective resins 2a, 2b, 2c are cured. Next, the gold 4 is filled in the hole 4 by gold plating using the copper plate 1 as a common electrode, and the gold plating is continued until it is flush with the surface of the third resin 2c (FIG. 1 (i)). Finally,
By removing the copper plate 1 by etching and dissolving and removing the first resin 2a and the third resin 2c, the electrical connection member 31 is manufactured (FIG. 1 (j)).

In the electrical connection member 31 manufactured in this manner, the gold 5 forms the conductive member 34, and the second resin 2b
Is configured.

(Second Embodiment) FIG. 3 is a schematic cross-sectional view showing a manufacturing process of the second embodiment. In this embodiment, the first resin 2a and the second resin 2a
b and the third resin 2c are the same as those in the first embodiment, and the photosensitive wavelength band is as shown in FIG. The photomasks 3a, 3b, 3c used are the same as those in the first embodiment.

First, a copper plate 1 as a base is prepared (FIG. 3A). The first resin 2a is applied on the copper plate 1 and prebaked (FIG. 3 (b)). Here, since the protrusion height of the protrusion on one side of the conductive member in the manufactured electrical connection member is limited by the thickness of the first resin 2a, the thickness is adjusted to a desired protrusion height. Set. The light in the region A in FIG. 2 is irradiated and exposed through the photomask 3a (FIG. 3C). Since the area of the protruding portion on one side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3a, the pattern is set to match the desired area. Next, the second resin 2b is applied on the first resin 2a and prebaked (FIG. 3D). Here, the second
The thickness of the resin 2b limits the thickness of the holder in the electrical connection member to be manufactured. Therefore, the thickness is set to match the desired thickness of the holder. Through the photomask 3b,
Exposure is performed by irradiating light in the region B in FIG. 2 (FIG. 3E). At this time, since the light in the wavelength band for exposing the second resin 2b is irradiated, only the second resin 2b is exposed to a predetermined pattern, and the already formed exposure pattern of the first resin 2a is not affected. Since the diameter of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3b, the pattern is set to match the desired diameter. Further, a third resin 2c is applied on the second resin 2b and prebaked (FIG. 3 (f)). Here, with the thickness of the third resin 2c,
Since the protruding height of the protruding portion on the other side of the conductive member in the manufactured electrical connection member is limited, the thickness is set to match the desired protruding height. The light in the region C in FIG. 2 is irradiated and exposed through the photomask 3c (FIG. 3 (g)). At this time, since the light in the wavelength band for exposing the third resin 2c is irradiated, only the third resin 2c is exposed in a predetermined pattern, and the exposure pattern of the first resin 2a and the second resin 2b already formed has no influence. I do not receive. Since the area of the protruding portion on the other side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3c, the pattern is set to match the desired area.

After the exposure process as described above, development is performed as in the first embodiment, and a plurality of holes 4 are formed in the resin laminate (FIG. 3 (h)). After that, similarly to the first embodiment, each resin 2a, 2b, 2c is cured, the hole 4 is filled with gold 5 by gold plating, and gold plating is continued until the surface is flush with the surface of the third resin 2c (see FIG. 3 (i)). Lastly, similarly to the first embodiment, the copper plate 1, the first resin 2a, and the third resin 2c are removed,
The same electrical connection member 31 as that of the first embodiment is manufactured (third embodiment).
Figure (j).

Third Embodiment FIG. 4 is a schematic cross-sectional view showing a manufacturing process of a third embodiment. In this embodiment, the first resin 2a and the second resin 2a
b and the third resin 2c are the same as those in the first embodiment, and the photosensitive wavelength band is as shown in FIG.

First, a copper plate 1 as a base is prepared (FIG. 4A). The first resin 2a is applied on the copper plate 1 and baked (FIG. 4 (b)). Here, since the protrusion height of the protrusion on one side of the conductive member in the manufactured electrical connection member is limited by the thickness of the first resin 2a, the thickness is adjusted to a desired protrusion height. Set. A region A in FIG. 2 is irradiated with light through a photomask 3d having a predetermined pattern for exposure (FIG. 4C). Since the area of the protruding portion on one side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3d, the pattern is set to match the desired area. After the exposure, the first resin 2a is developed to form a plurality of holes 4a in the first resin 2a (FIG. 4 (d)). Next, the second resin 2b is applied on the first resin 2a including the exposed surface of the copper plate 1 and prebaked (FIG. 4 (e)). Here, the thickness of the holder in the electrical connection member to be manufactured is limited by the thickness of the second resin 2b, and thus the thickness is set to match the desired thickness of the holder. The region B in FIG. 2 is irradiated with light through a photomask 3e having a wider mask pattern than the photomask 3d (FIG. 4F). At this time, since light in the wavelength band for exposing the second resin 2b is irradiated, only the second resin 2b is exposed in a predetermined pattern, and the first resin 2a is less affected by the exposure. Since the diameter of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3e, the pattern is set to match the desired diameter. After exposure, the second
The plurality of holes 4b communicating with the holes 4a by developing the resin 2b are formed in the second resin.
2b (FIG. 4 (g)). Furthermore, the exposed copper plate 1
The third resin 2c is applied on the second resin 2b including the surface of (2) and prebaked (FIG. 4 (h)). Here, since the protrusion height of the protrusion on the other side of the conductive member in the manufactured electrical connection member is limited by the thickness of the third resin 2c, the thickness is adjusted to a desired protrusion height. Set. Through the photomask 3f having a wider mask pattern than the photomask 3e, the second
Exposure is performed by irradiating light in a region C in the figure (FIG. 4 (i)).
At this time, since light in the wavelength band for exposing the third resin 2c is irradiated, only the third resin 2c is exposed in a predetermined pattern, and the first resin 2a and the second resin 2b are less affected by the exposure. Since the area of the protrusion on the other side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3f, the pattern is set so as to match the desired area. After the exposure, the third resin 2c is developed to form a plurality of holes communicating with the holes 4b.
4c is formed on the third resin 2c (FIG. 4 (j)).

After performing the above exposure and development processes, the respective resins 2a, 2b, 2c are cured as in the first embodiment, and the holes 4a, 4b, 4c are filled with gold 5 by gold plating. Gold plating is continued until it is flush with the surface of the resin 2c (FIG. 4 (k)). Finally, similarly to the first embodiment, the copper plate 1, the first resin 2a, and the third
By removing the resin 2c, the electrical connection member 31 is manufactured (FIG. 4 (l)).

Here, features of the above three embodiments will be described. In the first embodiment, since the exposure and development processes are continuously performed after the respective resins are successively laminated, the number of steps is minimized. In addition, the positioning of each photomask can be easily performed. Further, in the first and second embodiments, since the development processing of each resin is performed at the same time, the exposure pattern (removal pattern) in each resin can be made arbitrary, and each conductive member of the manufactured electrical connection member can be used. The diameter of the portion embedded in the holder and the area of the portion protruding from the holder can be arbitrarily set. In the third embodiment, since the developing process is sequentially performed for each resin, an exposure pattern (removal pattern) of each resin is used.
The resin on the side close to the copper plate 1 is smaller or the same, and the shape of each part of each conductive member of the manufactured electrical connection member is
It is limited as shown in FIG. Further, in the second and third embodiments, since the exposure processing is performed by individually providing a photomask to each resin to be exposed, the resin is likely to have irregularities, so that the contact between the photomask and the resin is good.

By the way, in the first embodiment, the second embodiment and the third embodiment, three resins having different photosensitive wavelength bands are used.
When the third photosensitive resin and the third photosensitive resin have substantially the same photosensitive wavelength band, the protrusion shapes in the width direction are the same. In this case, two masks, two light sources, and two exposures are required, and the electrical connection member can be easily manufactured.

By the way, in the above-mentioned three embodiments, the case where three kinds of resins whose photosensitive wavelength bands do not overlap or do not affect each other is used, but three kinds of resins whose photosensitive wavelength bands partially overlap each other are described. Even if a resin is used, an electrical connection member can be manufactured by using an optical filter to block light in unnecessary wavelength bands. Such an embodiment will be described below.

(Fourth Embodiment) FIG. 5 is a schematic sectional view showing a manufacturing process of a fourth embodiment. First, a copper plate 1 as a base is prepared (FIG. 5 (a)). A first photosensitive resin 2d (hereinafter, referred to as a first resin 2d) is applied onto the copper plate 1 and prebaked (FIG. 5B). Here, since the protrusion height of the protrusion on one side of the conductive member in the manufactured electrical connection member is limited by the thickness of the first resin 2d, the thickness is adjusted to a desired protrusion height. Set. Next, on the first resin 2d, the photosensitive wavelength band is different from that of the first resin 2d, and the second photosensitive resin 2e serving as a holder is provided.
(Hereinafter referred to as a second resin 2e) and pre-baked (FIG. 5 (c)). Here, since the thickness of the holder in the electrical connection member to be manufactured is limited by the thickness of the second resin 2e, the thickness is set to match the desired thickness of the holder. Further, the first resin 2d and the second resin 2e are formed on the second resin 2e.
And a third photosensitive resin 2f having a different photosensitive wavelength band (hereinafter referred to as a third photosensitive resin).
Resin 2f) is applied and prebaked (FIG. 5 (d)). Here, since the protrusion height of the protrusion on the other side of the conductive member in the manufactured electrical connection member is limited by the thickness of the third resin 2f, the thickness is adjusted to match the desired protrusion height. Set.

FIG. 6 is a graph showing the photosensitive wavelength bands of these three resins, and the horizontal axis shows the wavelength. In FIG. 6, D, E, and F indicate the photosensitive wavelength bands of the first resin 2d, the second resin 2e, and the third resin 2f, respectively, and the photosensitive wavelength bands of the respective resins are partially overlapped. The photosensitive wavelength band of the first resin 2d is the widest, and the photosensitive wavelength band of the third resin 2f is the narrowest.

Next, light is irradiated and exposed through a photomask 3g having a predetermined pattern (FIG. 5 (e)). here,
As the irradiation light, light transmitted through an optical filter (not shown) is used, and light in the wavelength band shown in FIG. 6J is applied. Then
Only the first resin 2d is exposed in a predetermined pattern, and the other second resin 2e and the third resin 2f are less affected by the exposure. Since the area of the protruding portion on one side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3g, the pattern is set to match the desired area. Next, light is irradiated and exposed through a photomask 3h having a mask pattern wider than the photomask 3g (FIG. 5 (f)). Here, the irradiation light is an optical filter (not shown).
The light having the wavelength band shown in FIG. Then, the third resin 2f is less affected by the exposure.
On the other hand, although the first resin 2d is exposed, the exposure area at this time is included in the previously exposed area, so that the already formed exposure pattern of the first resin 2d is not affected. Since the diameter of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3h, the pattern is set to match the desired diameter. Furthermore, a photomask
The light in the region F in FIG. 6 is irradiated and exposed through a photomask 3i having a mask pattern wider than 3h (FIG. 5 (g)). At this time, the first resin 2d and the second resin 2e are exposed. However, since the exposure area at this time is included in the previously exposed area, the already formed first resin 2d and the second resin 2e are formed.
Each exposure pattern of 2e is not affected. The area of the protruding portion on the other side of the conductive member in the manufactured electrical connection member,
Because it is limited by the pattern of this photomask 3i,
A pattern is set so as to fit a desired area.

After performing the above exposure processing, development is performed. In this example, each resin 2d, 2e, 2f remains in the exposed portion, and in the unexposed portion, each resin 2d, 2e, 2f is removed by a development process, and a plurality of holes 4 are formed in the resin laminate. Formed (fifth
Figure (h). Thereafter, the respective resins 2d, 2e, 2f are cured. Next, by gold plating using the copper plate 1 as a common electrode,
The hole 4 is filled with gold 5, and gold plating is continued until the hole 4 is flush with the surface of the third resin 2f (FIG. 5 (i)). Finally, copper plate 1
And the first resin 3d and the third resin 2f
Is dissolved and removed, and the same electrical connection members 31 as in the third embodiment are removed.
(FIG. 5 (j)).

In the fourth embodiment, as in the first embodiment, the exposure processing is continuously performed after the respective resins are continuously laminated, so that the alignment of each photomask is easy.

(Fifth Embodiment) FIG. 7 is a schematic sectional view showing the manufacturing process of the fifth embodiment. In this embodiment, the first resin 2g and the second resin 2g were used.
h and the third resin 2i also partially overlap the respective photosensitive wavelength bands as in the above-described fourth embodiment. FIG. 8 shows these three
It is a graph which shows the photosensitive wavelength band of a kind resin, and a horizontal axis shows a wavelength. In FIG. 8, G, H and I represent the first resin 2 g,
The photosensitive wavelength band of the second resin 2h and the third resin 2i is shown, and the photosensitive wavelength band of the first resin 2g is the narrowest.
The photosensitive wavelength band of the resin 2i is the widest.

First, a copper plate 1 as a base is prepared (FIG. 7A). 2 g of the first resin is applied on the copper plate 1 and prebaked (FIG. 7 (b)). Here, since the protrusion height of the protrusion on one side of the conductive member in the manufactured electrical connection member is limited by the thickness of the first resin 2g, the thickness is adjusted to match the desired protrusion height. Set. The light in the G area in FIG. 8 is irradiated and exposed through the photomask 3j having a predetermined pattern (FIG. 7C). Since the area of the protrusion on one side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3j, the pattern is set so as to match the desired area. Next, the second resin 2h is applied on the first resin 2g and baked (FIG. 7 (d)). Here, since the thickness of the holder in the electrical connection member to be manufactured is limited by the thickness of the second resin 2h,
The thickness is set to match the desired thickness of the holder. Light is irradiated and exposed through a photomask 3k having a smaller mask pattern than the photomask 3j (FIG. 7 (e)). Here, as the irradiation light, light transmitted through an optical filter (not shown) is used, and light in the wavelength band shown in FIG. 8L is irradiated. Then, only the second resin 2h is exposed in a predetermined pattern, and the first resin 2g is not exposed. Since the diameter of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3k, the pattern is set to match the desired diameter. Further, the third resin 2i is applied on the second resin 2h and prebaked (FIG. 7 (f)). Here, since the protrusion height of the protrusion on the other side of the conductive member in the manufactured electrical connection member is limited by the thickness of the third resin 2i, the thickness is adjusted to a desired protrusion height. Set. Light is irradiated and exposed through a photomask 31 having a smaller mask pattern than the photomask 3k (FIG. 7 (g)). Here, as the irradiation light, light transmitted through an optical filter (not shown) is used, and light in the wavelength band shown in FIG. 8M is irradiated. Then, the third resin
Only 2i is exposed in a predetermined pattern, and the first resin 2g and the second resin
The resin 2h is not exposed. Since the area of the protruding portion on the other side of the conductive member in the manufactured electrical connection member is limited by the pattern of the photomask 3l, the pattern is set to match the desired area.

After performing the exposure processing as described above, development is performed as in the fourth embodiment, and a plurality of holes 4 are formed in the resin laminate (FIG. 7 (h)). Thereafter, similarly to the fourth embodiment, each resin 2g, 2h, 2i is cured, the hole 4 is filled with gold 5 by gold plating, and the gold plating is continued until the surface is flush with the surface of the third resin 2i (see FIG. FIG. 7 (i)). Lastly, as in the fourth embodiment, the copper plate 1, the first resin 2g, and the third resin 2i are removed.
An electrical connection member 31 upside down from that of the fourth embodiment is manufactured (FIG. 7 (j)).

In the fifth embodiment, similar to the second and third embodiments, the exposure processing is performed by individually providing a photomask to each resin to be exposed, so that the contact between the photomask and the resin is good.

In this example, resins having different photosensitive wavelength bands were used.
For example, even if portions other than the peak and the half-value wavelength of the photosensitive wavelength band slightly overlap each other, it can be used as long as the influence of curing by light is small.

In each of the embodiments described above, the first resin and the third resin
Although the resin has a single-layer structure, it is needless to say that the first resin and / or the third resin may have a multi-layer structure. Can be set in a stepped shape.

In the first, second, and third resins, one or more of inorganic, metallic, and alloy materials having a desired shape such as powder, fiber, plate, rod, and sphere are formed. However, it may be dispersed and contained. Specifically, as the contained metal material and alloy material, Au, Ag, Cu, Al, Be, Ca, Mg, Mo, Fe, Ni, C
o, Mn, W, Cr, Nb, Zr, Ti, Ta, Zn, Sn, Pb-Sn and the like, as inorganic materials _{contained, SiO 2, B 2 O 3} , Al 2 O 3, Na 2 O, K ₂ O, C
aO, ZnO, BaO, PbO, Sb 2 O 3, As 2 O 3, La 2 O 3, ZrO 2, P 2 O 5, TiO 2, Mg
O, SiC, BeO, BP, BN, AlN, B ₄ C, TaC, TiB ₂ , CrB ₂ , TiN, Si ₃ N ₄ , Ta
Ceramics such as ₂ O ₅ , diamond, glass, carbon, boron and the like can be mentioned.

Further, in the present embodiment, the conductive member 34 is formed by filling the gold 5 by plating.
Selective growth by (chemical vapor deposition) may be performed.

Some electrical connection members manufactured according to the present invention have a wiring pattern. At this time, the wiring pattern may be present inside the holder, or may be present on one or both surfaces of the holder. The individual conductive members provided and the wiring pattern may or may not be electrically connected. Further, the electrical connection may be made inside the holder, or may be made on one or both of the surfaces of the holder. The material of the wiring pattern is not limited to a metal material, but may be another conductive material.
It is preferable that the end of the connection portion of the conductive member be convex. Further, the electrical connection member may be composed of one or two or more layers.

In this embodiment, gold 5 is used as the material of the conductive member 34. However, in addition to gold (Au), Cu, Ag, Be, Ca, Mg, Mo, Ni, W, Fe,
Metals or alloys such as Ti, In, Ta, Zn, Al, Sn, and Pb-Sn can be used. The conductive member 34 may be formed from one kind of metal and alloy, or may be formed by mixing several kinds of metal and alloy. Further, a material in which one or both of an organic material and an inorganic material are contained in a metal material may be used. The cross-sectional shape of the conductive member 34 can be circular, square, or any other shape, but preferably has no corners in order to avoid excessive concentration of stress. Also, the conductive member 34
It is not necessary to vertically dispose the holding member 35 in the holding member 35, and it may be inclined from one surface side of the holding member 35 to the other surface side of the holding member 35. The thickness of the conductive member 34 is not particularly limited. Note that the exposed portion of the conductive member 34 may be on the same surface as the holder 35, or may be protruded from the surface of the holder 35. However, in order to stably connect to the connection portion of the electric circuit component and to ensure the reliability of the connection portion, the conductive member 34 connected to the connection portion of the electric circuit component is stably connected to the holder 35. It is desirable to protrude.

Further, although the copper plate 1 was used as the base in the present embodiment, the present invention is not limited to this, but Au, Ag, Be, Ca, Mg, Mo, Ni, W, Fe, Ti, In, Ta, Zn, A
Thin plates of metals or alloys such as l, Sn, Pb-Sn can be used.
However, since only the substrate is selectively etched away in the final step, the material of the conductive member 34 and the material used for the substrate need to be different.

〔The invention's effect〕

In the manufacturing method of the present invention, since the holes for limiting the shape of the protrusion of the conductive member are formed in the first and third photosensitive resins, the thickness of the first and third photosensitive resins is controlled. The height of the protrusion of the conductive member can be easily controlled by controlling the shape of the hole formed in the first and third photosensitive resins, and the area of the protrusion of the conductive member can be easily controlled. it can.
As described above, according to the present invention, the shape of the protruding portion of the conductive member can be easily controlled, and an electrical connection member having a conductive member having an arbitrary protruding portion shape can be easily manufactured.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing the steps of the first embodiment of the manufacturing method according to the present invention, and FIG. 2 is a graph showing the photosensitive wavelength band of the photosensitive resin used in the first, second and third embodiments. FIG. 3 is a schematic cross-sectional view showing the steps of a second embodiment of the manufacturing method according to the present invention. FIG. 4 is a schematic cross-sectional view showing the steps of the third embodiment of the manufacturing method according to the present invention. FIG. 5 is a schematic sectional view showing the steps of the fourth embodiment of the manufacturing method according to the present invention, FIG. 6 is a graph showing the photosensitive wavelength band of the photosensitive resin used in the fourth embodiment, and FIG. FIG. 8 is a schematic cross-sectional view showing steps of a fifth embodiment of the manufacturing method according to the present invention, FIG. 8 is a graph showing a photosensitive wavelength band in a photosensitive resin used in the fifth embodiment, and FIG. FIG. 10 is a schematic cross-sectional view showing steps of a conventional manufacturing method. 1 Copper plate, 2a, 2d, 2g First photosensitive resin 2b, 2e, 2h Second photosensitive resin, 2c, 2f, 2i Third photosensitive resin, 3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h, 3i, 3j, 3k, 3l ……
Photomask, 4, 4a, 4b, 4c: Hole, 5: Gold, 31: Electrical connection member, 34: Conductive member, 35: Holder

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toyohide Miyazaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Hiroshi Kondo 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Incorporated (72) Inventor Yoshimi Terayama 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Yoichi Tamura 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Takahiro Okabayashi 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Kazuo Kondo 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Yasuo Nakatsuka 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Yuichi Ikegami Osaka 4-5-33 Kitahama, Chuo-ku, Osaka Sumitomo Metal Industries, Ltd. (56) References JP-A-3-192666 (JP, A) JP-A-3-182083 (JP, A) JP-A-2-49385 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01B 13/00 501 H01R 11/01 H01R 43/00

Claims (4)

(57) [Claims] 1. A holder comprising an electrically insulating material, and a plurality of conductive members provided in the holder in a state of being insulated from each other, one end of each of the conductive members being one end of the holder. A method of manufacturing an electrical connection member that is exposed on the surface and the other end of each of the conductive members is exposed on the other surface of the holding member, comprising: a first photosensitive resin; A second photosensitive resin having a different photosensitive wavelength band from the resin and serving as the holder;
Providing a third photosensitive resin having a different photosensitive wavelength band from the photosensitive resin on the substrate in this order; and irradiating light having a different wavelength band to the first, second, and third photosensitive resins. A step of exposing each of the resins to a predetermined pattern; a step of developing the first, second, and third photosensitive resins to form a plurality of holes in each photosensitive resin; and forming the conductive members in the holes. A method for manufacturing an electrical connection member, comprising: a step of filling a conductive material; and a step of removing the first and third photosensitive resins and the base. 2. A holding body made of an electrically insulating material, and a plurality of conductive members provided in the holding body in an insulated state from each other, one end of each of the conductive members being one end of the holding body. A method of manufacturing an electrical connection member that is exposed on the surface and the other end of each of the conductive members is exposed on the other surface of the holding member. Exposing to a first predetermined pattern, providing a second photosensitive resin having a photosensitive wavelength band different from that of the first photosensitive resin and serving as the holding member on the first photosensitive resin, Exposing to a predetermined pattern; and providing a third photosensitive resin having a different photosensitive wavelength band from the second photosensitive resin on the second photosensitive resin and exposing to a third predetermined pattern. And developing the first, second and third photosensitive resins to form a plurality of holes. And filling the hole with a conductive material to be the conductive member; and removing the first and third photosensitive resins and the base. Production method. 3. A holding body made of an electrically insulating material, and a plurality of conductive members provided in the holding body in a state of being insulated from each other, one end of each of the conductive members being one end of the holding body. A method of manufacturing an electrical connection member that is exposed on a surface and the other end of each of the conductive members is exposed on the other surface of the holding member; Forming a plurality of first holes; developing the second photosensitive resin having a photosensitive wavelength band different from that of the first photosensitive resin and serving as the holder by the first photosensitive resin. Forming a plurality of second holes communicating with the first holes by exposing and developing the third photosensitive resin; and disposing a third photosensitive resin having a different photosensitive wavelength band from the second photosensitive resin. A plurality of third holes provided on the second photosensitive resin for exposure and development, and communicating with the second holes; Forming, filling the first, second, and third holes with a conductive material to be the conductive member; and removing the first and third photosensitive resins and the base. A method for manufacturing an electrical connection member, comprising: 4. The method according to claim 1, wherein the first photosensitive resin and the third photosensitive resin have different photosensitive wavelength bands, and are exposed by irradiating light of different wavelength bands. A method for manufacturing an electrical connection member.