JP6560156B2 - Anisotropic conductive sheet and manufacturing method thereof - Google Patents

Description

  The present invention relates to an anisotropic conductive sheet having conductivity in a predetermined direction and a method for manufacturing the same.

  Conventionally, an electrical connector called a contact probe has been used in order to confirm normal continuity of wiring such as a semiconductor IC package or a high-frequency component. In recent years, contact probes have been downsized in accordance with the narrowing of the wiring pitch and the thinning of the wiring itself. However, the contact probe is a precision mechanical part including a spring, a metal thin tube, and the like, and there is a limit to downsizing. For this reason, anisotropic conductive sheets are used as electrical connectors that can replace contact probes. An anisotropic conductive sheet has a form in which the length direction of a highly conductive metal wire is penetrated in the thickness direction of the elastic elastomer and oriented at a high density, and is conductive only in the length direction of the metal wire. It is the sheet | seat which gave.

  FIG. 13 shows a plan view (13A) of a state in which a conventionally known anisotropic conductive sheet is fixed on a circuit board, and a cross-sectional view taken along line II in the plan view (13B).

  An anisotropic conductive sheet 100 shown in FIG. 13 has a plurality of metal wires 101 arranged in the thickness direction of the insulating sheet 102 at substantially equal intervals in the vertical and horizontal directions in the plane of the insulating sheet 102 made of silicone rubber. It has a structure that penetrates substantially vertically. Here, the term “substantially vertical” is because there are those that penetrate at a predetermined angle. The metal wire 101 protrudes from both the front and back surfaces of the insulating sheet 102. The anisotropic conductive sheet 100 is disposed in the contact region of the circuit board 110 (the substrate having a structure in which the wiring 112 is formed on the insulating substrate 111), and the outer peripheral portion of the anisotropic conductive sheet 100 from above (indicated by X in the figure). The region shown) is used while being fixed by the connector pressing jig 120. The connector pressing jig 120 includes an opening 122 that penetrates in the thickness direction. The surface of the opening 122 opposite to the circuit board 110 is opened larger than the inside of the opening 122. An inclined surface 123 inclined in a funnel shape toward the inside in the thickness direction is provided. The size of the opening 122 on the circuit board 110 side is smaller than the size of the anisotropic conductive sheet 100. The connector holding jig 120 is fixed to the circuit board 110 by inserting screws 121 into screw holes (not shown) formed in the circuit board 110.

  As described above, the anisotropic conductive sheet 100 is fixed so as to be sandwiched between the connector pressing jig 120 and the circuit board 110, and from above the opening 122 toward the front side surface of the anisotropic conductive sheet 100. Then, an LGA (Land Grid Array) package 130 to be measured is pressed. The LGA package 130 includes a plurality of flat electrodes 131 in a land shape on the lower surface thereof and in contact with the anisotropic conductive sheet 100. When a voltage is applied between the wiring 112 of the circuit board 110 and the flat electrode 131 of the LGA package 130, if the LGA package 130 is normal, the flat electrode 131, the metal wire 101 of the anisotropic conductive sheet 100, the circuit board 110. Electricity flows to the upper wiring 112. However, if the LGA package 130 has a defect such as disconnection, electricity does not flow. By such a contact test, it is possible to confirm whether or not the LGA package 130 is free from defects such as disconnection (see, for example, Patent Document 1 and Patent Document 2).

  The anisotropic conductive sheet 100 is substantially square in plan view, but instead, a long anisotropic conductive sheet is manufactured on one side, and a predetermined number of times in one region in the length direction of the sheet. After the continuity test is completed, the connector holding jig 120 or the chuck jig (hereinafter referred to as “connector holding jig 120 or the like”) is removed, the sheet is moved in the length direction, and the connector holding jig is repaired again. An anisotropic conductive sheet that can be used many times is used, such as setting the tool 120 and conducting a continuity test in a new area.

JP 2012-22805 A (see FIG. 7) Japanese Patent Laying-Open No. 2012-22828 (see FIG. 14)

  However, further improvements are also required for conventionally known anisotropic conductive sheets as described above. The conventionally known anisotropic conductive sheet (hereinafter referred to as “anisotropic conductive sheet 100” representing the conventionally known anisotropic conductive sheet) has a high density of metal wires 101 in the surface thereof. Prepare. Since a part of the anisotropic conductive sheet 100 (for example, the outer peripheral portion indicated by X in FIG. 13 (13B)) is an area necessary for fixing to the circuit board 110 by the contact pressing jig 120 or the like, Even if the wire 101 is provided, the region cannot be used for the continuity test.

  Further, in order to fix the contact holding jig 120 to the circuit board 110 with the screws 121, the circuit board 110 needs to be provided with screw holes. The circuit board 110 has no screw holes or cannot be formed. On the other hand, the contact pressing jig 120 cannot be used.

  The present invention has been made in view of the above problems, and is an anisotropic that can effectively use a contact region, reduce dead space, and perform a continuity test regardless of the type of circuit board used. It aims at providing a conductive sheet and its manufacturing method.

  An anisotropic conductive sheet according to an embodiment for achieving the above object is a layer having a plurality of metal wires and an insulation property sufficient to ensure insulation between the metal wires, An insulating layer having a plurality of metal wires penetrated in the thickness direction and an outer sheet member fixed to a part or all of the outer periphery of the insulating layer having the metal wires penetrated.

  In the anisotropic conductive sheet according to another embodiment, the outer sheet member may be made of silicone rubber.

  In the anisotropic conductive sheet according to another embodiment, a silicone rubber having a hardness according to JIS K6253 durometer type A of 50 degrees or more and 90 degrees or less may be used.

  In the anisotropic conductive sheet according to another embodiment, the silicone rubber may have an elongation (%) of 200% or less when cut according to JIS K6251.

  In the anisotropic conductive sheet according to another embodiment, a film member having a hardness higher than that of the outer sheet member is laminated on at least one of the front side surface and the back side surface of the outer sheet member. May be.

  The anisotropic conductive sheet according to another embodiment further includes the total thickness of the laminated portion of the outer sheet member and the film member, the thickness of the insulating layer, or the perpendicular between both ends of the metal wire penetrating the insulating layer. It may be the same or smaller than the length in the direction.

  An anisotropic conductive sheet according to another embodiment is a frame having a hardness higher than that of the outer sheet member on a part or all of the outer peripheral edge portion of the outer sheet member with a region in contact with the circuit board interposed therebetween. A member may be provided.

  The anisotropic conductive sheet according to another embodiment further includes the total thickness of the laminated portion of the outer sheet member and the frame member, the thickness of the insulating layer, or the perpendicular between both ends of the metal wire penetrating the insulating layer. It may be the same or smaller than the length in the direction.

  An anisotropic conductive sheet according to another embodiment may also include a plurality of insulating layers through which metal wires penetrate, and may include an outer sheet member on a part or all of the outer periphery of these insulating layers.

  The anisotropic conductive sheet according to another embodiment may be configured such that a metal wire is erected in the insulating layer while being inclined with respect to the thickness direction of the insulating layer.

  A method for manufacturing an anisotropic conductive sheet according to an embodiment is a method for manufacturing any of the above-described anisotropic conductive sheets, wherein a plurality of metal wires are penetrated in the thickness direction of the insulating layer. A curable rubber composition supplying step for supplying a liquid curable rubber composition capable of curing the outer sheet member to a part or all of the outer periphery of one or more anisotropically conductive connectors; and a curable rubber composition A curing step for curing the object.

  The method for producing an anisotropic conductive sheet according to another embodiment further includes a multilayer block preparation step of preparing a multilayer block formed by laminating a plurality of anisotropic conductive connectors, and a container having an opening in at least one of them. A multilayer block setting step for inserting the multilayer block so that a surface side exposing the end face of the metal wire in the multilayer block faces the opening, and the step of supplying the curable rubber composition in the container A step of supplying a liquid curable rubber composition capable of forming an outer sheet member fixed to a part or all of the outer periphery of the insulating layer through which the metal wire passes, and the curing step in the container An outer sheet member comprising a step of curing a curable rubber composition and an outer sheet member around a multilayer block obtained after the curing step From come multilayer block, and the cut step of cutting out one or more of the anisotropically conductive sheet may contain.

  The method for producing an anisotropic conductive sheet according to another embodiment is also such that, prior to the curable rubber composition supply step, the outer sheet member is bonded to the bonding surface of the anisotropic conductive connector with the outer sheet member. An easy adhesion treatment step for performing easy adhesion treatment may be further performed.

  The method for manufacturing an anisotropic conductive sheet according to another embodiment further includes a film member having a hardness higher than that of the outer sheet member on at least one of the front side surface and the back side surface of the outer sheet member. A film member laminating step for laminating may be further included.

  According to another embodiment of the method for manufacturing an anisotropic conductive sheet, the outer sheet member may be higher than the outer sheet member at a part or all of the outer peripheral edge across the region that can contact the circuit board. A frame member forming step of forming a frame member having hardness may be further included.

  According to the present invention, an anisotropic conductive sheet capable of effectively using a contact region and reducing dead space and performing a continuity test regardless of the type of circuit board to be used, and a method for manufacturing the same are provided. can do.

FIG. 1 is a plan view (1A) of an anisotropic conductive sheet according to a first embodiment of the present invention, a cross-sectional view taken along line AA of the plan view, and an enlarged view (1B) of a part B thereof. Each is shown. FIG. 2 shows respective plan views of the first modified example (2A) and the second modified example (2B) of the anisotropic conductive sheet of FIG. FIG. 3 shows cross-sectional views of a third modified example (3A) and a fourth modified example (3B) of the anisotropic conductive sheet of FIG. FIG. 4 schematically shows a flow for manufacturing the anisotropic conductive sheet of FIG. 1 and its situation. FIG. 5 shows a flow for manufacturing a plurality of anisotropic conductive sheets of FIG. FIG. 6 illustrates the situation in the first half of the flow of FIG. FIG. 7 illustrates the situation in the second half of the flow of FIG. FIG. 8 illustrates the situation in the latter half of the flow of FIG. 5 following FIG. FIG. 9 shows a manufacturing situation according to a modification of the above-described second embodiment. FIG. 10 shows two types of steps (10A, 10B) specific to the method for manufacturing an anisotropic conductive sheet according to the third embodiment. FIG. 11: shows each sectional drawing of the 5th modification (11A) and the 6th modification (11B) of the anisotropically conductive sheet of this invention. FIG. 12 shows sectional views of a seventh modified example (12A) and an eighth modified example (12B) of the anisotropic conductive sheet of the present invention. FIG. 13 shows a plan view (13A) of a state in which a conventionally known anisotropic conductive sheet is fixed on a circuit board, and a cross-sectional view taken along line II in the plan view (13B).

  Next, each embodiment of the anisotropic conductive sheet and the manufacturing method thereof according to the present invention will be described with reference to the drawings. Each embodiment described below does not limit the invention according to the scope of claims, and all the elements and combinations thereof described in each embodiment are included in the present invention. It is not always essential to the solution.

1. Configuration of Anisotropic Conductive Sheet Hereinafter, the anisotropic conductive sheet according to the embodiment of the present invention will be described.

  FIG. 1 shows a plan view (1A) of an anisotropic conductive sheet according to an embodiment of the present invention, a cross-sectional view taken along line AA of the plan view, and an enlarged view (1B) of a part B thereof.

  An anisotropic conductive sheet 1 according to an embodiment of the present invention is a layer having a plurality of metal wires 12 and an insulation property sufficient to ensure insulation between the metal wires 12, and the thickness of the layers. An insulating layer 11 having a plurality of metal wires 12 penetrated in the direction and an outer sheet member 13 fixed to the entire periphery of the outer peripheral end 14 of the insulating layer 11 having the metal wires 12 penetrated. The plurality of metal wires 12 and the insulating layer 11 constitute an anisotropic conductive connector 10 disposed on the surface of the circuit board. By providing the outer sheet member 13 on the outer side of the anisotropic conductive connector 10, almost the entire surface can be used as a contact region. In this embodiment, the outer sheet member 13 is fixed all around the outer peripheral end 14 of the insulating layer 11, but only a part of the outer peripheral end 14, for example, three sides of the insulating layer 11, or The four sides may be fixed in a rib shape at predetermined intervals.

  Here, the “penetration” of the metal wire 12 in the thickness direction of the insulating layer 11 means that the metal wire 12 reaches the surface 15 b on the opposite side from the one surface (surface to be attached to the circuit board) 15 a of the insulating layer 11. However, the present invention is not limited to the case where both ends of the metal wire 12 protrude from both surfaces 15 a and 15 b of the insulating layer 11. The “penetration” as used in the present application is a state in which both end surfaces of the metal wire 12 are at least flush with both surfaces 15a and 15b of the insulating layer 11 even if the protruding state is not reached. It is interpreted broadly to include. That is, the metal wire 12 protrudes from the one surface 15a of the insulating layer 11 or from the one surface 15a, and from the surface 15b opposite to the one surface 15a of the insulating layer 11 from the surface 15b that is flush with or opposite to the one surface 15a. Protruding. In this embodiment, the metal wire 12 penetrates in the thickness direction of the insulating layer 11 and protrudes from both the one surface 15 a and the opposite surface 15 b of the insulating layer 11. Further, in the present application, the penetration of the metal wire 12 in the thickness direction of the insulating layer 11 is not limited to a case where the metal wire 12 is completely parallel to the thickness direction, but includes a case where the metal layer 12 is inclined at a predetermined angle. To be interpreted.

The term “insulation” or “insulating” as used in the present application means that the metal wires 12 have sufficient electrical resistance to ensure insulation, and preferably have a volume resistivity of 1.0 ×. It means a property of 10 ¹² Ω · cm or more. The insulating layer 11 ensures the insulation between the metal wires 12 penetrating in the substantially thickness direction, and silicone rubber, urethane rubber, chloroprene rubber, ethylene-propylene-diene copolymer (EPDM), styrene-butadiene. It is preferably made of an elastomer such as a copolymer, an acrylonitrile-butadiene copolymer, a polyester rubber, a polybutadiene rubber, or a natural rubber. A more preferable material for the insulating layer 11 may be silicone rubber. In particular, the preferred insulating layer 11 is a silicone rubber having a hardness according to JIS K6253 durometer type A (hereinafter also referred to as “Shore A hardness” or “Shore hardness A” as appropriate) of 40 to 80 degrees.

"Conductive" or "conductive" as used in the present application means having a low electrical resistance that allows a current to flow when a voltage of 1.5 V or more is applied in contact with the wiring of the circuit board. For example, it preferably refers to the property that the volume resistivity is 1.0 × 10 ⁻¹ Ω · cm or less.

  The metal wire 12 is a thin wire made of a conductive metal. The interval between the metal wires 12 can be appropriately changed according to the size of the electrode terminal of the device under test represented by the LGA package. The anisotropic conductive sheet 1 in this embodiment is of a type that is connected to the electrode terminal by a plurality of metal wires 12. Further, when it is necessary to reduce the connection resistance value, it is preferable that the distance between the metal wires 12 be as narrow as possible so that as many metal wires 12 as possible can be brought into contact with one electrode terminal. In this embodiment, the preferred vertical and horizontal intervals between the metal wires 12 are both in the range of 20 to 200 μm. Moreover, there is no restriction | limiting in particular also about the outer diameter and length of metal wire 12 itself. In this embodiment, the preferred outer diameter of the metal wire 12 is 10 to 50 μm, and the preferred length is 0.1 to 3.5 mm. There are no particular restrictions on the external dimensions of the insulating layer 11, but in this embodiment, it is assumed that the preferred thickness of the insulating layer 11 is equal to or less than the length of the metal wire 12. 1 to 3 mm, and preferable vertical and horizontal dimensions are 4.5 mm wide and 5.5 mm long, respectively.

  In this embodiment, the metal wire 12 protrudes from both surfaces of the one surface 15a and the opposite surface 15b of the insulating layer 11 as described above. The length of projection from each of the surfaces 15a and 15b is not particularly limited, but in this embodiment, both are 10 to 40 μm, more preferably 15 to 30 μm. However, when the surface accuracy of the flat electrode surface of the circuit board or the LGA package is poor or warping is large, the protruding length is increased to a range of 50 to 100 μm, and the metal wire 12 is connected to the metal wire 12. It is preferable to improve the contact property of the electrode.

  The metal wire 12 may be made of a single metal, but is preferably made of a plurality of types of metals. The metal wire 12 in this embodiment is composed of a copper alloy as a core material, nickel or a nickel-based alloy as an intermediate coating material on the outer periphery thereof, and gold (Au) as an outermost surface coating material on the outer periphery thereof. The metal wire 12 preferably has a cut surface exposed in the manufacturing process, but the cut surface is coated in the order of the intermediate covering material and the outermost surface covering material. The reason for coating the outermost surface coating material is that it is necessary to enhance the electrical connection with the electrode of the device under test. The reason for coating the intermediate covering material is that it is necessary to prevent the outermost surface covering material from diffusing into the core material. The metal wire 12 may be composed only of gold (Au), but in that case, the life of the anisotropic conductive sheet 1 is shortened and the cost is increased because the strength of the metal wire 12 is reduced. . For this reason, the core material which is excellent in strength is used for the metal wire 12. Further, the intermediate coating material is for preventing gold (Au) from diffusing into the core material when gold (Au) is used as the outermost surface coating material.

  The outer sheet member 13 is sandwiched between the surface of the circuit board and a connector pressing jig (not shown), and is a pressing part for fixing the anisotropic conductive sheet 1 so as not to move with respect to the circuit board. is there. Materials constituting the outer sheet member 13 include silicone rubber, urethane rubber, chloroprene rubber, ethylene-propylene-diene copolymer (EPDM), styrene-butadiene copolymer, acrylonitrile-butadiene copolymer, and polyester rubber. It can be suitably formed from elastomers such as polybutadiene rubber and natural rubber. Among these, as a more suitable material for the outer sheet member 13, silicone rubber excellent in insulation and the like can be exemplified. In particular, silicone rubber that is easily bonded and integrated with the anisotropic conductive connector 10 is preferable. Among the silicone rubbers, silicone rubber having a hardness according to JIS K6253 durometer type A of 50 degrees or more and 90 degrees or less is more preferable as a material for the outer sheet member 13.

  Further, the silicone rubber used for the outer sheet member 13 is not necessarily affected by the hardness, and it is preferable that the elongation (%) when cut according to JIS K6251 is 200% or less. Considering both the hardness and elongation, the most preferable silicone rubber used for the outer sheet member 13 has a hardness according to JIS K6253 durometer type A of 50 degrees or more and 90 degrees or less and an elongation (%) when cut according to JIS K6251. 200% or less silicone rubber. Examples of the curable rubber composition that can constitute the silicone rubber used for the outer sheet member 13 include KE-26 manufactured by Shin-Etsu Chemical Co., Ltd. (the hardness of the cured silicone rubber is about 85 degrees according to JIS K6253 durometer type A). And elongation (%) at the time of cutting according to JIS K6251 is preferably about 70%).

  As the characteristics of the silicone rubber constituting the outer sheet member 13, the hardness is more important among the hardness and the elongation. By using silicone rubber having a relatively high hardness of 50 degrees or more and 90 degrees or less according to JIS K6253 durometer type A, the anisotropic conductive sheet 1 can be easily cut out in the manufacturing process described with reference to FIGS. Become. Further, by using silicone rubber having an elongation (%) of 200% or less when cut according to JIS K6251, when the outer sheet member 13 is pressed by the connector pressing jig, the outer sheet member 13 is distorted by the pressure. Can be reduced. In particular, when conducting a continuity test while shifting the elongated anisotropic conductive sheet 1 in its length direction, for example, the outer sheet member 13 is pressed with a connector pressing jig to shift the connector portion, or the elongated anisotropic conductive sheet A so-called roll-to-roll system in which the outer sheet members 13 at both ends in the length direction of the sheet 1 are wound around a roller, and when the service life of a specific connector region comes, the roller is rotated to change the use site to another connector region. When is used, it is preferable that the outer sheet member 13 does not extend as much as possible. Thus, as a characteristic of the silicone rubber constituting the outer sheet member 13, it is more important that the hardness is particularly high in terms of the manufacturing method, and it is more important that the elongation is particularly small in terms of use.

  In this embodiment, the outer sheet member 13 is fixed to the outer peripheral end 14 of the insulating layer 11 of the anisotropic conductive connector 10, and preferably covers one surface 15a of the insulating layer 11 and the opposite surface 15b. Not. The thickness of the outer sheet member 13 may have any relationship with the thickness of the insulating layer 11 of the anisotropic conductive connector 10, but considering the manufacturing method of FIGS. Preferably they are the same. However, the thickness of the outer sheet member 13 is not required to be exactly the same as the thickness of the insulating layer 11, and a preferable allowable range is ± 20% with respect to the thickness of the insulating layer 11.

  In the insulating layer 11, it is preferable that the outer peripheral edge 14 bonded to the outer sheet member 13 is an easily adhesive treatment surface. This is because the adhesive strength between the insulating layer 11 and the outer sheet member 13 can be further increased. Here, the easy adhesion treatment for forming the easy adhesion treatment surface is performed by applying a coupling agent to the outer peripheral edge 14 of the insulating layer 11, flame treatment, plasma irradiation, ultraviolet irradiation, and a flammable gas mixed with a silane compound. A process that can improve the adhesion between the outer peripheral edge 14 of the insulating layer 11 and the outer sheet member 13, such as a flame process using “Itro process (registered trademark)”.

  FIG. 2 shows respective plan views of the first modified example (2A) and the second modified example (2B) of the anisotropic conductive sheet of FIG.

  As shown in FIG. 2 (2A), the anisotropic conductive sheet 1a according to the first modified example has four anisotropic conductive connectors 10 arranged in one plane with a predetermined distance from each other. It has a form in which an outer sheet member 13 a exists around the conductive connector 10, and is different from the anisotropic conductive sheet 1 including only one anisotropic conductive connector 10. In addition, the anisotropic conductive sheet 1b according to the second modification includes an outer sheet member 13b having a substantially circular shape in a plan view surrounding one anisotropic conductive connector 10 as shown in FIG. 2 (2B). It is different from the above-described anisotropic conductive sheet 1 having the rectangular outer sheet member 13 in plan view.

  FIG. 3 shows cross-sectional views of a third modified example (3A) and a fourth modified example (3B) of the anisotropic conductive sheet of FIG. (3A) also shows an enlarged view of part C.

  The anisotropic conductive sheet 1 c according to the third modification has a structure in which a film member 20 is laminated on the upper surface of the outer sheet member 13 of the anisotropic conductive sheet 1. In this modification, the film member 20 is laminated on the entire upper surface of the outer sheet member 13, but may be laminated on a part of the upper surface of the outer sheet member 13. Further, the film member 20 may be laminated on the lower surface of the outer sheet member 13. When the anisotropic conductive sheet 1 is too thin, the film member 20 is provided for the purpose of reinforcing it and making it easy to handle. The film member 20 is a layer having a higher hardness than the outer sheet member 13, and can be formed of resin, rubber, metal, or the like. The film member 20 is preferably made of a resin and may be made of either a thermoplastic resin or a thermosetting resin. A more preferable resin material constituting the film member 20 is polyimide or polyester. The preferable thickness of the film member 20 is 50-500 micrometers, More preferably, it is 100-300 micrometers. The film member 20 may have an alignment hole penetrating in the thickness direction.

  An anisotropic conductive sheet 1d according to the fourth modification is an outer sheet member 13 of the anisotropic conductive sheet 1, and the frame member 25 is disposed on the entire outer peripheral edge of the region that can contact the circuit board. Is provided. In this modification, the frame member 25 is provided on the entire outer peripheral edge, but may be provided on a part of the outer peripheral edge. The frame member 25 is formed so as to protrude on both surfaces of the outer sheet member 13, but may be formed on only one of the surfaces. The frame member 25 may be formed on either the upper surface or the lower surface of the outer sheet member 13. The frame member 25 is provided for the purpose of improving the handleability as well as the film member 20 and for the purpose of improving the flatness of the anisotropic conductive sheet 1. The frame member 25 is a member having higher hardness than the outer sheet member 13 and can be formed of resin, rubber, metal, glass, ceramics, or the like. The frame member 25 is preferably made of a resin, and may be made of either a thermoplastic resin or a thermosetting resin. As a more preferable resin material constituting the frame member 25, since high rigidity is required, polyacetal (POM), polyamide (PA), polycarbonate (PC), modified polyphenylene ether (m- PPE), polybutylene terephthalate (PBT), amorphous polyarylate (PAR), polysulfone (PSF), polyethersulfone (PES), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyimide (PI) , Polyetherimide (PEI), fluororesin, and liquid crystal polymer are preferably used.

  In the anisotropic conductive sheets 1, 1 a, 1 b, 1 c, and 1 d described with reference to FIGS. 1 to 3, the outer sheet member 13 is fixed to a part or all of the outer peripheral end 14 of the anisotropic conductive connector 10. ing. However, the outer sheet member 13 is bonded to at least one of the both surfaces 15 a and 15 b of the insulating layer 11 of the anisotropic conductive connector 10 in addition to the outer peripheral end 14 of the anisotropic conductive connector 10. May be. In that case, it contacts on the edge of the insulating layer 11 so that the metal wire 12 in the insulating layer 11 may not be contacted. Further, the outer sheet member 13 can be bonded to at least one of the both surfaces 15a and 15b of the insulating layer 11 of the anisotropic conductive connector 10 without being bonded to the outer peripheral end 14. . Even in that case, it is a condition that the outer sheet member 13 contacts the edge of the insulating layer 11 so as not to contact the metal wire 12 in the insulating layer 11.

  The anisotropic conductive sheets 1, 1 a, 1 b, 1 c, and 1 d described above have a structure in which the metal wire 12 penetrates substantially parallel to the thickness direction of the insulating layer 11. In contrast, the metal wire 12 may be configured to stand upright in the insulating layer 11 while being inclined with respect to the thickness direction of the insulating layer 11. The inclination angle (θ) from the thickness direction of the insulating layer 11 (direction perpendicular to the plane of the insulating layer 11) is not limited as long as it is an acute angle in the range of 1 to 60 degrees, preferably 10 to 50 degrees, More preferably, it is 20 to 45 degrees. The metal wire 12 is inclined at an angle θ when the pressure is applied from the upper surface of the anisotropic conductive sheet 1, 1a, 1b, 1c, 1d without applying 100% of the pressure in the axial direction of the metal wire 12. This is because it is necessary to make the metal wire 12 less likely to buckle and extend its life. Further, the compression resistance of the metal wire 12 is weakened so that the anisotropic conductive sheets 1, 1a, 1b, 1c, 1d are not compressed too little. As a result, the compression load at the time of contact can be reduced. Because.

2. Method for Manufacturing Anisotropic Conductive Sheet (1) First Embodiment Hereinafter, a method for manufacturing an anisotropic conductive sheet according to the first embodiment of the present invention will be described.

  FIG. 4 schematically shows a flow for manufacturing the anisotropic conductive sheet of FIG. 1 and its situation.

An exemplary flow of a method for manufacturing an anisotropic conductive sheet according to this embodiment is as follows:
1) Connector preparation step (step S101),
2) Easy adhesion processing step (step S102),
3) a curable rubber composition supplying step (step S103), and 4) a curing step (step S104).
Hereinafter, each step will be described with reference to FIG.

1) Connector preparation step (step S101)
This step is a step of preparing the anisotropic conductive connector 10 of FIG. “Preparation” is broadly construed to include not only manufacturing but also purchasing commercially available products. When this step is a manufacturing step, the anisotropic conductive connector 10 may be manufactured by any method as long as a structure in which the metal wire 12 is penetrated through the insulating layer 11 can be realized. For example, as in a second embodiment to be described later, a multilayer block may be produced, and the anisotropic conductive connectors 10 may be cut thinly one by one from there.

2) Easy adhesion processing step (step S102)
This step is a step of performing an easy adhesion process on the outer periphery of the anisotropic conductive connector 10. In this embodiment, as shown by the arrow D in FIG. 4, the outer periphery is irradiated with ultraviolet rays, but the other easy adhesion treatment described above may be performed. Further, this step is not an essential step, and may be omitted when the outer sheet member 13 can be firmly bonded to the outer periphery of the anisotropic conductive connector 10.

3) Curable rubber composition supply step (Step S103)
This step is a step of supplying a curable rubber composition 28 a capable of curing the outer sheet member 13 to the outer periphery of the anisotropic conductive connector 10. The method for supplying the curable rubber composition 28a is not particularly limited, and for example, printing represented by screen printing or ink jet printing, spraying, dipping (immersion), or a method using a bar coater may be used. it can. In this embodiment, printing is used. Specifically, a rectangular frame 27 having a space larger than that of the anisotropic conductive connector 10 is prepared, and the anisotropic conductive connector 10 is disposed at a substantially center inside thereof. The frame body 27 and the anisotropic conductive connector 10 are preferably fixed on a smooth sheet. Printing is performed using an ink containing the curable rubber composition 28 a in the region inside the frame 27 and outside the anisotropic conductive connector 10.

4) Curing step (step S104)
This step is a step of curing the curable rubber composition 28a. Whether or not to warm from room temperature (23 ° C.) is not questioned during curing, but it is desirable to cure by heating. As an example, it is preferable to heat and cure in the range of 70 to 100 ° C. under reduced pressure. When the frame body 27 is removed after curing, one anisotropic conductive sheet 1 having the outer sheet member 13 on the outer periphery of the anisotropic conductive connector 10 is obtained.

  Note that a step of etching the surface of the insulating layer 11 may be performed after the curing step, during or after the connector preparation step, or after the easy adhesion treatment step. In this step, from the state where the thickness of the insulating layer 11 and the length of the metal wire 12 inside the insulating layer 11 are substantially the same, the metal wire 12 is moved to any one of the front side surface and the back side surface of the insulating layer 11. This is an effective means when it is desired to protrude from the surface. The etching process may be any kind of etching process such as laser etching, plasma etching, chemical etching (etching using acid or the like). Further, the etching process is not an essential process, and is unnecessary when the metal wire 12 is not projected from both surfaces of the insulating layer 11.

(2) Second Embodiment Next, a method for manufacturing an anisotropic conductive sheet according to a second embodiment of the present invention will be described.

  FIG. 5 shows a flow for manufacturing a plurality of anisotropic conductive sheets of FIG. FIG. 6 illustrates the situation in the first half of the flow of FIG. 7 and 8 illustrate the situation in the latter half of the flow of FIG.

An exemplary flow of a method for manufacturing an anisotropic conductive sheet according to this embodiment is as follows:
1) Curable composition lamination step (step S201),
2) Metal line placement step (step S202),
3) Bonding step (step S203),
4) Curing step (step S204),
5) Two-stage stacking step (step S205),
6) Curing step (step S206),
7) Multi-stacking step (step S207),
8) Multi-layer block setting step (step S300),
9) Curable rubber composition supply step (step S400),
10) Curing step (Step S500)
11) cutting step (step S600) and 12) etching step (step S700).
The above steps 1) to 7) are collectively referred to as a multilayer block preparation step (step S200). Hereinafter, the steps 1) to 12) will be described with reference to FIGS.

1) Curable composition lamination step (Step S201)
On one surface of a square base film (for example, a polyester film) 30, a curable composition 11a that becomes the insulating layer 11 after curing is laminated. There are no particular restrictions on the lamination method, and in this embodiment, a millable silicone rubber material is used as the curable composition 11a, formed into a thin sheet by a calender roll facility, and then topped on the base film 30. ing. Other methods include, for example, printing typified by screen printing or inkjet printing, spraying, dipping (immersion), or a method using a bar coater.

2) Metal line placement step (step S202)
Next, the metal wires 12 are arranged on the surface of the curable composition 11 a so that the plurality of metal wires 12 are parallel to each other and also to one side of the base film 30.

3) Bonding step (step S203)
Next, the base film 30 with the curable composition 11a produced by the same method as step S201 is bonded to the metal wire 12 with the curable composition 11a on the metal wire 12 side. Thereby, the single layer product 40a provided with the base film 30 on both sides is completed.

4) Curing step (step S204)
Next, after defoaming, heating is performed to cure the curable composition 11a in the single-layer product 40a.

5) Two-stage stacking step (step S205)
Two cured single-layer products 40 prepared in the above steps S201 to S204 are prepared, and the base film 30 is peeled off from the cured single-layer product 40 one by one, and the adhesive 45 between the two peeled surfaces. Two cured single-layer products 40 are laminated with a gap interposed therebetween. The adhesive 45 is preferably various adhesives based on silicone, vinyl chloride-vinyl acetate copolymer or cyanoacrylate. A particularly suitable adhesive is a silicone-based adhesive, and more preferably an adhesive that can form a layer having a Shore hardness A lower than that of the insulating layer 11 after curing. For example, when the insulating layer 11 is a silicone rubber layer having a Shore hardness A of 60 to 80 degrees, it is preferably a silicone rubber layer having a Shore hardness A of 40 to 55 degrees after curing of the adhesive 45. .

6) Curing step (step S206)
Next, the adhesive 45 is cured by heating. After curing, the base film 30 on one side is peeled off to complete a two-layer laminate 50 having the base film 30 on one side.

7) Multi-stacking step (Step S207)
After aligning a predetermined number (N) of the two-stage laminated bodies 50, the adhesive 45 is interposed therebetween and laminated in multiple layers. Preferably, the multi-layered body is cut, and the multi-layered body thus cut is further laminated with an adhesive 45 interposed therebetween. In the lamination in this step, pressurization can be performed with a press. Such pressurization is preferably performed inside a pressure-resistant container (such as a mold). Through this process, the multilayer block 60 is manufactured. The multilayer block 60 produced in this way is formed by laminating a plurality of the anisotropic conductive connectors 10 described above.

8) Multi-layer block setting step (step S300)
Next, as shown in FIG. 7, in the container 70 having the opening 71 on at least one side, the surface 60 a side exposing the end face of the metal wire 12 in the multilayer block 60 is directed toward the opening 71. A multilayer block 60 is inserted (see an enlarged view of part E in the figure). Since the container 70 is deeper than the side parallel to the length direction of the metal wire 12 of the multilayer block 60, the multilayer block 60 can be put to the upper surface. Further, the opening 71 of the container is sufficiently larger than the surface 60 a of the multilayer block 60. For this reason, when the multilayer block 60 is placed on the inner bottom surface of the container 70 at the approximate center of the opening 71 of the container 70, a sufficient gap is formed around the outer periphery of the multilayer block 60.

9) Curable rubber composition supply step (step S400)
Next, the liquid curable rubber composition 28 a is supplied into the container 70. The curable rubber composition 28 a is a composition that can form the outer sheet member 13 that is fixed to the entire outer periphery of the insulating layer 11 that penetrates the metal wire 12. The curable rubber composition 28 a is preferably put to the same height as the surface 60 a of the multilayer block 60. However, the curable rubber composition 28a may be lower or higher than the surface 60a.

10) Curing step (Step S500)
Next, the curable rubber composition 28a in the container 70 is cured. Whether or not to warm from room temperature (23 ° C.) is not questioned during curing, but it is preferable to cure at room temperature for a long time. For example, in this step, curing is performed at room temperature and atmospheric pressure.

11) Cut step (step S600)
Next, after the curing step, the multilayer block 90 with the outer sheet member including the outer sheet member 13 around the multilayer block 60 is taken out from the container 70, and one or more anisotropic conductive sheets are removed from the multilayer block 90 with the outer sheet member. Cut 1 thinly.

12) Etching step (step S700)
In the anisotropic conductive sheet 1 after the cutting step, the thickness of the insulating layer 11 and the length of the metal wire 12 inside the insulating layer 11 are substantially the same. When it is desired to protrude the metal wire 12 from any one of the front surface and the back surface of the insulating layer 11, etching is performed from the surface to be protruded as indicated by an arrow F in FIG. Processing is performed to selectively etch the surface of the insulating layer 11 so that the metal wire 12 protrudes from the surface of the insulating layer 11. The etching step is the same as the method described in the first embodiment.

  FIG. 9 shows a manufacturing situation according to a modification of the above-described second embodiment.

  In the modification shown in FIG. 9, the multilayer block 95 put in the container 70 is different from the multilayer block 60 shown in FIG. Specifically, the multilayer block 95 in this modification is prepared by preparing a plurality of hardened single-layer products 40 from which the base film 30 has been peeled off, and laminating them while gradually shifting them in the length direction of the metal wires 12. is there. As shown in the enlarged view of part G in FIG. 9, the multilayer block 95 is placed on the inner bottom surface of the container 70 with the surface 95 a exposing the tip of the metal wire 12 facing the opening 71. Thereafter, similarly to the description based on FIGS. 7 and 8, the curable rubber composition supply step (step S400), the curing step (step S500), and the cut step for thinly cutting the multilayer block 96 with the outer sheet member (step S600). I do. However, when the inside of the container 70 has a rectangular parallelepiped shape, the outer sheet member 13 is not formed with the same width on the outer periphery of the anisotropic conductive connector 10. For this reason, it is preferable to cut a part of the outer sheet member 13. Through such steps, the anisotropic conductive sheet 1e formed by inclining the metal wire 12 with respect to the thickness direction of the insulating layer 11 and standing in the insulating layer 11 can be manufactured. Note that an etching step (step S700) may be performed after the cutting step (step S600).

  The shape and size of the container 70 can be appropriately changed according to the shape and size of the anisotropic conductive sheet. For example, when forming the anisotropic conductive sheet 1 a having four anisotropic conductive connectors 10, a container 70 having a large opening 71 may be used. Moreover, what is necessary is just to make the container 70 into a cylindrical shape, when forming the anisotropically conductive sheet 1b whose external shape is circular.

(3) Third Embodiment Next, a method for manufacturing an anisotropic conductive sheet according to a third embodiment of the present invention will be described.

  FIG. 10 shows two types of steps (10A, 10B) specific to the method for manufacturing an anisotropic conductive sheet according to the third embodiment.

  The method for manufacturing the anisotropic conductive sheet according to the third embodiment is a method for manufacturing the anisotropic conductive sheet 1 c provided with the film member 20 and the anisotropic conductive sheet 1 d provided with the frame member 25. When manufacturing the anisotropic conductive sheet 1c, a film member lamination step (step S800) can be performed following step S103, step S104, step S600, or step S700. The film member laminating step (step S800) is a step of laminating the film member 20 having higher hardness than the outer sheet member 13 on at least one of the front side surface and the back side surface of the outer sheet member 13. . In this step, it is preferable that an adhesive is interposed between the film member 20 and the outer sheet member 13 to bond them together.

  When manufacturing the anisotropic conductive sheet 1d, a frame member forming step (step S900) can be performed following step S103, step S104, step S600, or step S700. In the frame member forming step (step S900), a frame member 25 having a hardness higher than that of the outer sheet member 13 is formed on a part or all of the outer peripheral edge of the outer sheet member 13 with a region that can contact the circuit board interposed therebetween. It is a step to do. In this step, it is preferable that an adhesive is interposed between the frame member 25 and the outer sheet member 13 to bond them together. The frame member forming step (step S900) can be performed before or after the film member stacking step (step S800). In that case, it is preferable to adhere to the outer sheet member 13 so that the film member 20 and the frame member 25 do not overlap.

3. Other Embodiments As described above, the preferred embodiments of the anisotropic conductive sheet and the manufacturing method thereof according to the present invention have been described. However, the present invention is not limited to the above-described embodiments, and various modifications may be made. It can be implemented.

  FIG. 11: shows each sectional drawing of the 5th modification (11A) and the 6th modification (11B) of the anisotropically conductive sheet of this invention. FIG. 12 shows sectional views of a seventh modified example (12A) and an eighth modified example (12B) of the anisotropic conductive sheet of the present invention.

  An anisotropic conductive sheet 1f of the fifth modification (11A) is a further modification of the anisotropic conductive sheet 1c according to the third modification shown in FIG. 3 (3A). As is clear from an enlarged view of a part H of the anisotropic conductive sheet 1f, the anisotropic conductive sheet 1f has the total thickness (T1) of the laminated portion of the outer sheet member 13 and the film member 20 as the insulating layer. 11 (T1 <T2). Further, the total thickness (T1) is within the range of the thickness (T2) of the insulating layer 11, and does not protrude outside the range. The same applies to the following modifications. Here, the film member 20 is laminated on both the front and back surfaces of the outer sheet member 13. For this reason, the total thickness of the laminated portion of the outer sheet member 13 and the film member 20 is the thickness from the surface of one film member 20 sandwiching the outer sheet member 13 from both front and back surfaces to the back surface of the other film member 20. Say. However, the total thickness (T1) may be equal to the thickness (T2) of the insulating layer 11. Furthermore, when the vertical length between both ends of the metal wire 12 protruding from the surface of the insulating layer 11 is T2, the total thickness (T1) is the vertical length between both ends of the metal wire 12. It may be smaller than (T2) or equal to the vertical length (T2) between both ends of the metal wire 12. Even in this case, the total thickness (T1) is within the range of the length (T2) in the vertical direction between both ends of the metal wire 12, and does not protrude outside the range. The same applies to the following modifications.

  An anisotropic conductive sheet 1g of the sixth modification (11B) is a modification of the anisotropic conductive sheet 1f according to the fifth modification shown in (11A) above. As is clear from the enlarged view of a part I of the anisotropic conductive sheet 1g, the anisotropic conductive sheet 1g has a total thickness (T1) smaller than the thickness (T2) of the insulating layer 11. (T1 <T2). Here, the film member 20 is laminated only on the surface of the outer sheet member 13. For this reason, the total thickness of the laminated portion of the outer sheet member 13 and the film member 20 refers to the thickness from the back surface of the outer sheet member 13 to the surface of the film member 20. However, the total thickness (T1) may be equal to the thickness (T2) of the insulating layer 11. Furthermore, when the vertical length between both ends of the metal wire 12 protruding from the surface of the insulating layer 11 is T2, the total thickness (T1) is the vertical length between both ends of the metal wire 12. It may be smaller than (T2) or equal to the vertical length (T2) between both ends of the metal wire 12.

  An anisotropic conductive sheet 1h of the seventh modification (12A) is a further modification of the anisotropic conductive sheet 1d according to the fourth modification shown in FIG. 3 (3B). As is clear from the enlarged view of a part J of the anisotropic conductive sheet 1h, the anisotropic conductive sheet 1h has the total thickness (T1) of the laminated portion of the outer sheet member 13 and the frame member 25 as the insulating layer. 11 (T1 <T2). Here, the frame member 25 is laminated on both the front and back surfaces of the outer sheet member 13. For this reason, the total thickness of the laminated portion of the outer sheet member 13 and the frame member 25 is the thickness from the surface of one frame member 25 sandwiching the outer sheet member 13 from both the front and back surfaces to the back surface of the other frame member 25. Say. However, the total thickness (T1) may be equal to the thickness (T2) of the insulating layer 11. Furthermore, when the vertical length between both ends of the metal wire 12 protruding from the surface of the insulating layer 11 is T2, the total thickness (T1) is the vertical length between both ends of the metal wire 12. It may be smaller than (T2) or equal to the vertical length (T2) between both ends of the metal wire 12.

  An anisotropic conductive sheet 1i of the eighth modification (12B) is a modification of the anisotropic conductive sheet 1h according to the seventh modification shown in (12A) above. As is clear from the enlarged view of a part K of the anisotropic conductive sheet 1i, the total thickness (T1) is smaller than the thickness (T2) of the insulating layer 11 in the anisotropic conductive sheet 1i. (T1 <T2). Here, the frame member 25 is laminated only on the surface of the outer sheet member 13. For this reason, the total thickness of the laminated portion of the outer sheet member 13 and the frame member 25 refers to the thickness from the back surface of the outer sheet member 13 to the surface of the frame member 25. However, the total thickness (T1) may be equal to the thickness (T2) of the insulating layer 11. Furthermore, when the vertical length between both ends of the metal wire 12 protruding from the surface of the insulating layer 11 is T2, the total thickness (T1) is the vertical length between both ends of the metal wire 12. It may be smaller than (T2) or equal to the vertical length (T2) between both ends of the metal wire 12.

  The anisotropic conductive sheets 1f, 1g, 1h, and 1i are formed by thinly cutting the outer sheet member 13 by laser etching or the like in each of the manufacturing processes described above, and the film member 20 or the frame member 25 on one side of the outer sheet member 13 or Even when pasted on both sides, it can be easily manufactured by adjusting the thickness so that the total thickness (T1) is equal to or less than the vertical length (T2) between both ends of the insulating layer 11 or the metal wire 12. It is.

  The anisotropic conductive sheets 1 f, 1 g, 1 h, 1 i have a form in which the position of the surface of the film member 20 or the frame member 25 is recessed rather than the positions of both ends of the metal wire 12. The dent amount on the surface of the film member 20 or the frame member 25 with respect to the positions of both ends of the metal wire 12 is preferably 0 to 50%, more preferably 10 to 40%, with respect to the length of the metal wire 12 in the vertical direction. is there. As a result, even if the outer shape of the object to be inspected (LGA package) is wider than the area of the anisotropic conductive connector 10, the anisotropic conductive sheets 1f, 1g, 1h, 1i, the object to be connected, and the circuit board It is possible to make it difficult to hinder the electrical connection. Further, since the outer peripheral portions of the anisotropic conductive sheets 1f, 1g, 1h, and 1i do not need to come into contact with an object to be connected or a circuit board at the time of compression connection, the pushing load can be reduced. The film member 20 or the frame member 25 may be formed on either the upper surface or the lower surface of FIG. 11 (11B) or FIG. 12 (12B) when formed on one side of the outer sheet member 13.

  The film member 20 is not limited to the case where the film member 20 is disposed so as to surround the outer periphery of the anisotropic conductive connector 10, and may be disposed on a part of the outer periphery of the anisotropic conductive connector 10. For example, when the anisotropic conductive connector 10 is square in plan view, it may be formed only on two opposing sides. This configuration is the same for the frame member 25.

  The anisotropic conductive sheet 1 a includes four anisotropic conductive connectors 10, but may include two, three, or five or more anisotropic conductive connectors 10. Further, the outer periphery of the anisotropic conductive connector 10 includes the outer sheet member 13 without a gap, but the outer sheet member 13 includes a through-hole penetrating in the thickness direction along the outer periphery. Also good.

  The manufacturing method of the multilayer block 60 described with reference to FIG. 6 is only a preferable manufacturing method, and may be another manufacturing method. For example, by forming a single-layer product 40 in a mold, placing a thin layer of the curable composition 11a on the metal wire 12 and further on the metal wire 12, and repeating that, the two-tiered laminates 50 are formed. The multi-layer block 60 can also be produced by sequentially laminating the single-layer products 40 without bonding.

  The anisotropic conductive sheet which concerns on this invention can be utilized for the continuity test of the member which has wiring, such as an electronic circuit and an electronic component, for example.

1, 1a, 1b, 1c, 1d, 1e, 1f, 1g, 1h, 1i Anisotropic conductive sheet 10 Anisotropic conductive connector 11 Insulating layer 12 Metal wires 13, 13a, 13b Outer sheet member 20 Film member 25 Frame member 28a Curable rubber composition 60 Multi-layer block 70 Container 71 Opening 90 Multi-layer block with outer sheet member 95 Multi-layer block 96 Multi-layer block with outer sheet member

Claims (10)

Multiple metal wires,
An insulating layer sufficient to ensure insulation between the metal wires, the insulating layer having the plurality of metal wires penetrated in the thickness direction of the layer; and
An outer sheet member fixed to a part or all of the outer periphery of the insulating layer through which the metal wire penetrates;
In the outer periphery of the insulating layer, a frame member having a hardness higher than that of the outer sheet member provided on a part or all of the outer peripheral edge with a region in contact with the circuit board interposed therebetween,
An anisotropic conductive sheet comprising:   The anisotropic conductive sheet according to claim 1, wherein the outer sheet member is made of silicone rubber.   The anisotropic conductive sheet according to claim 2, wherein the silicone rubber has a hardness according to JIS K6253 durometer type A of 50 degrees or more and 90 degrees or less.   The anisotropic conductive sheet according to claim 2 or 3, wherein the silicone rubber has an elongation (%) of 200% or less when cut according to JIS K6251.   The total thickness of the laminated portions of the outer sheet member and the frame member is equal to or less than the thickness of the insulating layer or the vertical length between both ends of the metal wire that penetrates the insulating layer. The anisotropic conductive sheet according to any one of claims 1 to 4, wherein the anisotropic conductive sheet is provided.   6. The anisotropic conductive material according to claim 1, comprising a plurality of the insulating layers penetrating the metal wires, and the outer sheet member provided on a part or all of the outer periphery of the insulating layers. Sheet.   The anisotropic conductive sheet according to any one of claims 1 to 6, wherein the metal wire is erected in the insulating layer so as to be inclined with respect to a thickness direction of the insulating layer. A method for producing the anisotropic conductive sheet according to any one of claims 1 to 7,
Liquid curable rubber composition capable of curing and forming an outer sheet member on part or all of the outer periphery of one or more anisotropically conductive connectors in which a plurality of metal wires are penetrated in the thickness direction of the insulating layer A curable rubber composition supply step for supplying
A curing step for curing the curable rubber composition;
A frame member forming step of forming a frame member having a hardness higher than that of the outer sheet member on a part or all of the outer peripheral edge portion across the region in contact with the circuit board on the outer periphery of the insulating layer ;
The manufacturing method of the anisotropically conductive sheet containing this. A multilayer block preparation step of preparing a multilayer block formed by laminating a plurality of the anisotropic conductive connectors;
A multilayer block setting step in which the multilayer block is placed in a container having an opening in at least one side so that a surface side exposing the end face of the metal wire in the multilayer block faces the opening;
Including
The step of supplying the curable rubber composition includes forming the outer sheet member fixed to a part or all of the outer periphery of the insulating layer through the metal wire in the outer periphery of the multilayer block in the container. Providing a possible liquid curable rubber composition;
The curing step is a step of curing the curable rubber composition in the container,
A cutting step of cutting out one or a plurality of the anisotropic conductive sheets from the multilayer block with an outer sheet member provided with the outer sheet member around the multilayer block obtained after the curing step;
The manufacturing method of the anisotropically conductive sheet of Claim 8 containing this. Prior to the curable rubber composition supplying step,
The anisotropic treatment according to claim 8 or 9, further comprising an easy adhesion treatment step of performing an easy adhesion treatment for easily adhering to the outer sheet member on a sticking surface of the anisotropic conductive connector to the outer sheet member. A method for producing a conductive sheet.