KR100917489B1 - Method for producing an anisotropic conductive connector - Google Patents

Abstract

The present invention is an anisotropic conductive connector having a structure in which an axis of a plurality of conductive paths penetrating in the thickness direction of a film substrate forms a predetermined angle with respect to a vertical line of a main surface of a film substrate, and can obtain high connection reliability with respect to a connection object. An object of the present invention is to provide a method for producing an anisotropic conductive connector that can efficiently produce an anisotropic conductive connector. A feature of the present invention is to separate the roll-shaped material obtained by integrating the insulating film and the conductive wire on the core material from the core material, cut it out to form a flat shape, and then cut the plurality of conductive wire-attached films 10A from the flat shape. Then, the plurality of conductive wire rod attaching films are overlapped so that the conductive wire rods 2 of adjacent films are parallel to each other, and the obtained laminate is heated and pressed, and the obtained block is bonded to the conductive wire rod 2. It cuts into predetermined film thickness by making into the cross section the plane which crosses at an angle.

Description

Manufacturing method of anisotropically conductive connector {METHOD FOR PRODUCING AN ANISOTROPIC CONDUCTIVE CONNECTOR}

1A is a perspective view of an operation of winding an insulating film on a core material and winding a conductive wire in the first step of the present invention;

1B is a perspective view of the winding obtained by the above operation,

2 is a plan view of a flat plate obtained by developing a roll-like article formed by integrating an insulating film and a conductive wire rod;

3A and 3B are plan views of a plurality of conductive wire rod attached films obtained by cutting a flat plate;

4A is a perspective view of a conductive wire attachment film,

4B is a cross-sectional view of the conductive wire attachment film,

4C is a plan view of the conductive wire attachment film,

5 is a perspective view showing an operation of overlapping a conductive wire attachment film (FIG. 4);

6 is a perspective view of a laminate obtained by superimposing a conductive wire attachment film (FIG. 4);

7 is a perspective view of a block in which the laminate (FIG. 6) is integrated by heating and pressing;

8 is a perspective view of the operation of cutting out the film from the block (FIG. 7);                 

9 is a perspective view illustrating a state in which the laminate (FIG. 6) is placed in a heat resistant box body;

10 is a perspective view showing a state where a laminate (FIG. 6) is accommodated in a heat resistant box body;

11A is a plan view of an anisotropic conductive connector manufactured by the present invention,

11B is a sectional view of the anisotropic conductive connector.

Explanation of symbols for the main parts of the drawings

1: insulating film 1a: main surface of insulating film

2: conductive wire L1: shaft of conductive wire

L2: One side of linear shape α1: Inclined angle

6: plate-shaped object 10A, 10B: film with conductive wire rod

30: block 50: film substrate

51: conductive path 60: anisotropic conductive connector

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an anisotropically conductive connector, and more particularly, to a method for manufacturing an anisotropically conductive connector having a structure in which a conductive path is inclined in the thickness direction of a film substrate.

Background Art In recent years, anisotropically conductive connectors have been widely used to electrically connect electronic components such as semiconductor devices (IC chips) and circuit boards. Conventionally, the anisotropically conductive connector is known to be formed by dispersing conductive fine particles in an insulating film. However, the anisotropically conductive connector has a problem in that it is difficult to connect to a connection object having a fine pitch in structure, or a terminal such as a semiconductor element. There is a problem that the electrode or the like must be made into a convex shape (bump shape). Accordingly, as an anisotropic conductive connector capable of solving such a problem, that is, fine pitch and also capable of cope with unmelting, the present applicant has disclosed an insulating film substrate in WO 98/07216 (US Pat. No. 6,245,175). An anisotropically conductive connector (film) in which a plurality of conductive paths are insulated from each other and penetrated in the thickness direction of a film substrate is proposed.

By the way, the anisotropically conductive connector is largely used for the following two purposes. One is an application as a so-called installation connector for thermally crimping both of them by interposing an anisotropic conductive connector between an electronic component such as a semiconductor element and a circuit board, and electrically and mechanically connecting the electronic component and the circuit board. In another, in the functional inspection of electronic components such as semiconductor devices, anisotropically conductive connectors are inserted between the electronic components and the circuit board to be pressure-contacted to both, so-called inspection for conducting the electronic component and the circuit board so that they can be inspected. It is used as a connector.

Using an anisotropic conductive connector as a test connector means that if the electronic component is inspected after the electronic component is installed on the circuit board, the defective circuit board will be disposed together if the electronic component is defective. It is because the yield of a board | substrate falls and cost loss also becomes large.

In the inspection of electronic components such as semiconductor devices, in order to prevent damage to the terminals and deformation of the terminals, it is necessary to bring the anisotropic conductive connector into contact with the electronic components and the circuit board at a lower pressure. Accordingly, the present applicant of the International Publication No. WO 98/07216 has a structure in which a plurality of conductive paths penetrating in the thickness direction of the film substrate are arranged such that their axis is angled with respect to the vertical line of the main surface of the film substrate. Anisotropically conductive connectors are proposed. That is, when a plurality of conductive paths penetrating in the thickness direction of the film substrate are inclined in a predetermined direction, when the electronic component is mounted on the circuit board via an anisotropic conductive connector, and the electronic component is pressed from above, The conductive path is bent to reduce the pressure applied to the electronic component and the circuit board.

Conventionally, such an anisotropically conductive connector is capable of winding multiple insulation coils (metal wires covered with an insulating resin layer) on a core material, i.e., the method described in WO 98/07216, and separating them from each other. Winding blocks in which coating layers were bonded to each other were fabricated so as to be cut, and the blocks were cut into a desired film thickness with a plane formed at an angle with respect to each insulated conductor (metal wire). However, since such a conventional manufacturing method winds insulated conductors multiplely, the winding direction of the insulated conductor (metal wire) in the winding block is difficult to align in a certain direction. Therefore, the inclination directions of the plurality of conductive paths in the anisotropically conductive connector obtained by cutting the winding block are not the same, and the direction in which the conductive paths are bent when the anisotropically conductive connector is pressed is dispersed, and therefore, the connection in the anisotropically conductive connector The error of the contact pressure with an object (a circuit board, a semiconductor element, etc.) becomes large (uniformity falls), and connection reliability with a connection object may fall. In addition, when cutting the winding block, the cutting surface is set so that the insulated conductor (metal wire) is at an angle with respect to the vertical line of the cutting surface (that is, the cutting shaft is set at an oblique angle to the cutting edge), but the block is cut in this way. If cut | disconnected, the film size (size) of the several sheets of the anisotropically conductive connector obtained by cutting | distributing will be disperse | distributed, and in order to unify film size, the post-process for that must be performed. Therefore, there is a problem that an anisotropic conductive connector of a desired size cannot be efficiently produced.

In view of the above circumstances, the present invention is an anisotropic conductive connector having a structure in which the axis of the plurality of conductive paths penetrating in the thickness direction of the film substrate is angled with respect to the vertical line of the main surface of the film substrate, wherein the inclination between the plurality of conductive paths is inclined. It is an object of the present invention to provide a method for producing an anisotropic conductive connector which can efficiently manufacture an anisotropic conductive connector having a small gap in a direction (direction in which a conductive path is bent) and high connection reliability with respect to a connection object.

Moreover, the anisotropically conductive connector which can manufacture efficiently the anisotropically conductive connector which has small dispersion | distribution of the inclination direction (direction of bending of the conductive path | route) between these some conductive path | routes, and obtains high connection reliability with respect to a connection object to a desired film size. An object of the present invention is to provide a method for producing the same.

In order to achieve the above object, the present invention has the following features.                         

(1) A method of manufacturing an anisotropic conductive connector having a structure in which a plurality of conductive paths penetrating in a thickness direction of a film substrate are angled with respect to a vertical line of a main surface of a film substrate, and the insulating film is wound around the outer circumference of the core material. The conductive wire is wound in a spiral shape at a constant pitch on the outer circumference of the insulating film, or the conductive wire is wound in a spiral shape at a constant pitch on the outer circumference of the core material, and then the insulating film is wound to cover the conductive wire, and then heated and pressurized. The insulating film and the conductive wire are integrated on a core to obtain a roll, and then the roll is separated from the core, cut into a flat, and then a plurality of conductive wires are attached from the flat. The film is cut out, and then the plurality of conductive wire-attached films are adjacent to each other. The conductive wires are overlapped so as to be parallel to each other to obtain a laminate, and the laminate is heated and pressed to form a block in which a plurality of conductive wire attachment films are integrated, and then the block is angled with the conductive wire. The method of manufacturing an anisotropically conductive connector, characterized in that for making an anisotropically conductive connector by cutting the film to a predetermined film thickness by making a cross plane as a cross section.

(2) The film with a plurality of conductive wire rods is cut out such that the main surface of the insulating film has a linear one side, and the axis of the plurality of conductive wires has a predetermined inclination angle with respect to the one side of the linear shape, The block obtained by stacking a plurality of conductive wire-attached films with parallel one side of the adjacent insulating film in parallel to form a laminate, and the block obtained from the laminated body with one straight side of the main surface of the insulating film. The plane orthogonal to the straight end of the cross section is cut into a predetermined film thickness, and the method for producing an anisotropic conductive connector according to the above ①.

(3) The insulating film and the conductive wire wound on the core are placed in a space capable of forming a reduced pressure or vacuum state together with the core, and the inside of the space is put under a reduced pressure or vacuum state and then heated and pressurized to form an insulating film on the core. And a conductive wire rod are integrated. The method for manufacturing an anisotropic conductive connector according to the above ① or ②.

(4) The method for producing the anisotropically conductive connector according to the above (3), wherein a space capable of forming the reduced pressure or vacuum state is an inner space of a bag composed of a flexible film.

(5) The method for producing an anisotropic conductive connector according to (3) or (4) above, wherein the pressurization is performed by introducing a compressed gas into a space capable of forming the reduced pressure or vacuum state.

(6) Any one of the above ① to ⑤, wherein the laminate is placed in a space capable of forming a reduced pressure or vacuum state, and the inside of the space is made a reduced pressure or vacuum state, followed by heating and pressurizing the laminate. The manufacturing method of the anisotropically conductive connector of description.

(7) The manufacturing method of the anisotropically conductive connector as described in said (6) whose space which can form a reduced pressure or a vacuum state is an inner space of the white body comprised from a flexible film.

(8) When the laminate is accommodated, the laminate is accommodated in a heat-resistant box of a size such that a slight gap is formed between the inner surface and the side surface of the laminate, and the heat-resistant box and The laminate is placed together in an inner space of a white body composed of a flexible film, and the inside of the space is made into a reduced pressure or vacuum state, and then the laminate is heated and pressurized. Method of preparation.

In this specification, the "main surface of a film substrate" means both thickness direction cross sections of a film substrate, and the "main surface of an insulating film" means both thickness direction cross sections of an insulating film. In addition, when it is called "the surface of a film substrate" or "the surface of an insulating film" without a notice especially, it means "the main surface of a film substrate" and the "main surface of an insulating film."

Hereinafter, the present invention will be described in detail with reference to the drawings.

The anisotropically conductive connector manufactured by the present invention has a plurality of conductive paths 51 penetrating in the thickness direction (the arrow A direction in FIG. 11B) of the film substrate 50 shown in FIGS. 11A and 11B. L10 is an anisotropically conductive connector 60 arranged to form an angle α with respect to the vertical line L20 of the main surface 50a (and 50b) of the film substrate 50. 11A is a plan view, and FIG. 11B is a sectional view taken along the line XIb-XIb in FIG. 11A. In the drawings, D1 and D2 are the first and second directions orthogonal to the conduction path 51 in the anisotropic conductive connector (the direction of the arrow X in the main surface 50a of the film substrate 50). Direction of arrow Y].

The angle α at which the plurality of conductive paths 51 (axial center L10 of) form the vertical line L20 of the main surface 50a of the film substrate 50 is generally due to the bending of the conductive paths 51. 5 degrees or more is preferable so that the effect of reducing the pressure to a connection object (an electronic component, a circuit board, etc.) is fully obtained, and if the angle is too large, two connection objects (e.g., an electronic component and a circuit) to be electrically connected are required. Since the position adjustment (offset) between the substrates) is required, the angle is preferably 45 degrees or less.

The anisotropically conductive connector produced by this invention is especially preferable as a test | inspection connector, The thickness of the film board | substrate 50 is generally about 20-1000 micrometers, Preferably it is about 50-500 micrometers. The cross-sectional shape of the conduction path (perpendicular to the axis L10) may be circular, polygonal or other, and is not particularly limited. However, the cross section is appropriate in terms of connection reliability with the connection object (terminal). . In addition, the diameter (thickness) generally has a diameter of about 10 to 80 μm when the cross-sectional shape is circular in terms of connection reliability with the connection object (terminal) and conductivity (electric resistance) of the conductive path itself. Preferably, it is about 12-60 micrometers especially, and when a cross-sectional shape is a polygon or other shape, it is good to set it as the diameter (thickness) which becomes an area equivalent to the area of the circle of the diameter in the said range. proper. In addition, the pitch of the conduction path 51 (D1 and D2 in the drawing) is generally preferably 20 to 200 µm in view of connection reliability with the connection object (terminal of) and deformability (flexibility) of the anisotropic conductive connector, respectively. Especially preferably, it is 20-150 micrometers.

In the present invention, the plurality of conductive paths 51 (axial center L10) are arranged so as to form an angle with respect to the vertical line L20 of the main surface 50a of the film substrate 50 (that is, of the film substrate). A method of manufacturing an anisotropic conductive connector 60 having a structure in which a plurality of conductive paths are penetrated in the thickness direction and the plurality of conductive paths are inclined at a predetermined angle in a predetermined direction. (Step of creating a plurality of conductive wire rod attached films), a second step (step of creating a block in which a plurality of conductive wire rod attached films are integrated), and a third step (step of cutting a block).
[1st process (process of making the film with a conductive wire rod of several sheets)]

delete

As shown in FIG. 1A, the insulating film 1 is wound around the outer periphery of the core 4, and then one conductive wire 2 is wound around the outer periphery of the insulating film 1 in a spiral shape at a predetermined pitch (or On the contrary, on the outer circumference of the core material 4, one conductive wire 2 is first wound in a spiral shape at a constant pitch, and then the insulating film 1 is wound so as to cover the conductive wire 2]. Water 5 (FIG. 1B) is prepared. Here, the winding can be performed by a known winding device such as a lateral alignment winding machine. Next, this winding overlap 5 (FIG. 1B) is heated and pressurized, the insulating film 1 and the conductive wire 2 are integrated on the core material 4, and roll shape is obtained. Subsequently, the roll-shaped object in which the insulating film 1 and the conductive wire 2 are integrated is separated from the core material 4, and a part of the roll-shaped object is cut and developed into a flat-shaped object 6 (Fig. 2). The flat plate 6 is cut out to cut out a plurality of films with conductive wire rods.                     

3A and 3B are specific examples of the film with a plurality of conductive wire rods. In the conductive wire rod attached film 10A of FIG. 3A, the main surface 1a of the insulating film 1 becomes rectangular from the flat plate 6 (FIG. 2), and the direction of the conductive wire rod 2 (axial center) is insulated. It cut out so that it may be inclined with respect to the predetermined | prescribed side (linear side) of the rectangular main surface 1a of the film 1, and the film 10B with conductive wire rod of FIG. 3B is a flat-shaped object 6 (FIG. 2). From the above, the main surface 1a of the insulating film 1 becomes a rectangle, and the direction of the conductive wire rod 2 (axial center) is relative to the side of the rectangular main surface 1a of the insulating film 1 (both sides). It is cut out to be parallel and orthogonal. In addition, the dashed-dotted line in FIG. 2 has shown the cutting line at the time of cutting out the film 10A with the conductive wire rod of FIG. 3A.

The film substrate 50 of the conduction path 51 (axial center L10 of FIG. 11A) of the anisotropically conductive connector 60 (FIGS. 11A and 11B) finally manufactured is carried out with the film 10A of the conductive wire sticking film 10A of FIG. The angle α of the main surface 50a of the main surface 50a is the inclination angle of the conductive wire rod 2 (axial center) of the conductive wire rod attachment film 10A (the main portion of the insulating film 1). It is intended to set in advance by defining the inclination angle [alpha] 1 with respect to one side of a predetermined linear shape on the surface 1a. By using the conductive wire rod attaching film 10A, a predetermined linear end face of the block (a step of cutting a block in which a plurality of conductive wire attach films is integrated) is formed (insulating film 1). Anisotropically conductive connector 60 in which a plurality of conductive paths 51 are inclined at an angle α by only cutting a plane orthogonal to a cross section orthogonal to one side derived from a linear one side of the main surface 1a of the cross section. 11A and 11B can be obtained.

On the other hand, in the case of using the conductive wire rod attaching film 10B shown in Fig. 3B, in the third step, when cutting the block, the conductive wire 2 (axial center) of the conductive wire rod 2 with respect to the vertical line of the cut surface is the angle α. By setting the cut surface so as to achieve the shape, the anisotropically conductive connector 60 (FIGS. 11A and 11B) inclined at a plurality of conductive paths 51 at an angle α can be obtained.

4 is an enlarged view (FIG. 4A is a perspective view, FIG. 4B is a sectional view, FIG. 4C is a top view) of the said conductive wire sticking film 10A. In the said conductive wire sticking film 10A, the rectangle of the insulating film 1 is rectangular. A plurality of conductive wires 2 arranged in parallel with each other at a constant pitch d2 are fixed to the main surface 1a of the plurality of conductive wires 2 (each shaft center L1 of the conductive wires 2). It forms a predetermined inclination angle (alpha) 1 with respect to the predetermined linear side L2 of the main surface 1a of, and is located in parallel with the main surface 1a. As shown in FIG. 4C, the term “forms a predetermined inclination angle α1” means that when the main surface 1a of the insulating film is viewed from the vertical upper side thereof, the axial center L1 of the conductive wire rod and one side of the linear shape ( It means that L2) intersects at a predetermined acute angle α1 (that is, it is not orthogonal or parallel). As described above, the predetermined inclination angle α1 is a conductive surface 51 (axial center L10 of the anisotropically conductive connector (FIGS. 11A and 11B) to be manufactured. 50a (50b)] corresponds to the angle α formed with the vertical line L20.

The insulating film 1 constitutes the film substrate 50 of the anisotropically conductive connector 60 (FIGS. 11A and 11B). Therefore, as a material of the said insulating film 1, the well-known material conventionally used for the film board | substrate of an anisotropically conductive connector is used. That is, it is itself a material which shows adhesiveness in the state, or it does not show adhesiveness in that state, but is a material which can be adhere | attached at least by pressurization or heating, for example, a thermoplastic polyimide resin, an epoxy resin, a polyetherimide Thermoplastic or thermosetting resins such as resins, polyamide resins, silicone resins, phenokin resins, acrylic resins, polycarbodiimide resins, fluorine resins, polyester resins and polyurethane resins; Thermoplastic elastomers such as polyurethane-based plastic elastomers, polyester-based plastic elastomers, and polyamide-based plastic elastomers; Etc. can be mentioned. These resins and elastomers may be used alone or in combination of two or more thereof. In addition, various fillers, plasticizers, or rubber materials may be added to these resins and elastomers. As a filler, for example, SiO ₂ , Al ₂ O ₃ , as a plasticizer, for example, TCP (tricresyl phosphate), DOP (dioctyl phthalate), rubber materials, for example, NBS (acrylonitrile butadiene rubber), SBS ( Polystyrene-polybutylene-polystyrene), and the like.

In addition, the thickness of the insulating film 1 is a main element which determines the pitch of the one direction (the pitch D1 of the 1st direction in FIG. 11A and FIG. 11B) in the film substrate of the conduction path of the anisotropically conductive connector, Generally it is about 20-200 micrometers, Preferably it is about 20-150 micrometers.

The conductive wire 2 constitutes a conductive path 51 of the anisotropic conductive connector 60 (FIGS. 11A and 11B). As the conductive wire 2, a so-called insulated conductor wire having an insulating coating on a linear body made of a conductive material or a linear body made of the conductive material is used. As the linear body made of a conductive material, a metal wire made of at least one metal (including alloy) selected from gold, copper, aluminum, stainless steel, nickel, etc. is used in terms of electrical conductivity, and an insulated wire In the case of using, as the material used for coating, the same materials as those exemplified as the material of the insulating film 1 may be mentioned.

The cross-sectional shape of the linear body made of the conductive material corresponds to the cross-sectional shape of the conductive path described above, and may be circular, polygonal or other shapes, and is not particularly limited, but circular is appropriate. In addition, the diameter (thickness) of the linear body corresponds to the diameter (thickness) of the conductive path described above, and when the cross-sectional shape is circular, the diameter is preferably about 10 to 80 µm, particularly preferably 12 to It is about 60 micrometers. In the case where the cross-sectional shape is polygonal or other shape, it is preferable that the cross-sectional area is the same as the area of the circle of the diameter within the above range. The thickness of the insulation coating in the case of using an insulated conductor is the point which ensures insulation between conductors (linear body), the point of adhesiveness with an insulating film, and the workability of the insulated conductor (workability of the winding work mentioned later). In view of the above, it is generally about 0.5 to 10 m, preferably about 1 to 5 m.

In addition, the arrangement | positioning interval (that is, pitch d2 in FIG. 4B and FIG. 4C) of the conductive wire 2 on the main surface 1a of the insulating film 1 in the conductive wire attachment film is an anisotropic conductive connector ( 60) corresponds to the pitch between the adjacent conductive paths (the pitch D2 in the second direction in FIGS. 11A and 11B) in the film substrate of the conductive path of FIG. It is suitably set within the range of.

In the first step, the heating temperature and the pressing force in the heating and pressurization for integrating the insulating film 1 and the conductive wire 2 on the core 4 are the conductive wire 2 and the insulating film 1. ) Also differs depending on the material constituting (), and when the conductive wire 2 is used as the conductive wire 2, the conductive wire 2 tends to adhere to the insulating film 1, and the heating temperature is generally 50 It is about 250-250 degreeC, Preferably it is about 100-200 degreeC. The pressing force is generally about 2 to 30 kgf / cm 2, preferably about 3 to 20 kgf / cm 2.

Moreover, the winding overlap 5 (FIG. 1B) obtained by winding the insulating film 1 and the conductive wire material 2 on the core material 4 is used as it is (that is, the insulating film 1 and the conductive wire material 2). Simultaneously with (4), it is preferable to arrange | position in the space which can form a reduced pressure or a vacuum state, to make the inside of a space into a reduced pressure or a vacuum state, and to perform the said heating and pressurization after that. That is, before heating and pressurizing, by placing the winding overlap 5 (FIG. 1B) under reduced pressure or vacuum, the voids between the core 4, the insulating film 1, and the conductive wire 2 can be effectively reduced. Therefore, the durability (holding force of the conductive path) of the manufactured anisotropic conductive connector is improved. The reduced pressure is a pressure smaller than the normal pressure, and usually means a pressure of 0.06 MPa or less, and the vacuum means a pressure of 0.001 MPa or less, especially during the reduced pressure. In addition, from the viewpoint of efficiently removing the voids, it is more preferable to perform heating and pressurization under vacuum. Moreover, although the method for forming a reduced pressure or a vacuum state is not specifically limited, Suction by a pump (vacuum pump) is preferable from a viewpoint of workability.

The space capable of forming the reduced pressure or vacuum state is, for example, provided with a rigid box (that is, when the reduced pressure or vacuum state is formed, itself does not deform and has rigidity capable of maintaining the shape thereof. The inner space of a box body, the inner space of the bag comprised from a flexible film, etc. are mentioned. Examples of the material of the rigid box body include metals such as iron, aluminum, stainless steel, carbon steel, and bronze, and plastics such as polyethylene, polyurethane, acrylic resin, polyamide, and polycarbonate. As the flexible film, a plastic film such as a metal film such as aluminum, a nylon film, a polyester film, a polyethylene film, a polyimide film, or a laminated film obtained by laminating an aluminum film or the like on a polyethylene film can be used.

When the white body comprised from a flexible film is used, when the inner space is made into a vacuum state, since a white body will adhere to the winding overlap 5, a space | gap can be removed more effectively.

In the pressurization at the time of heating and pressurization, it is preferable that a uniform pressure is applied to the core so that the winding state (pitch, winding direction, etc.) of the conductive wire is not disturbed. A method of introducing compressed gas into (a space capable of forming a reduced pressure or vacuum state) is suitable. In the case of introducing this compressed gas, when an inert gas such as nitrogen gas is used as the compressed gas, oxidation of the conductive wire rod can be suppressed, which is more preferable.

[2nd process (process of creating the block in which the film with a conductive wire rod of several sheets integrated)]

The said 2nd process overlaps the several sheets with a conductive wire rod film created by the said 1st process so that the conductive wire rod 2 of an adjacent film may mutually be parallel, and obtains a laminated body, and heats and pressurizes the obtained laminated body. This is a step of creating a block in which a plurality of conductive wire rod attached films are integrated. Such heating and pressurization is a process which fuses at least an insulating film to a conductive wire between adjacent film with a conductive wire rod, Preferably heating and pressurization is carried out so that an insulating film may be fused to a conductive wire rod and the insulating films may be fused together. Run

In the heating and pressurization treatment, the heating temperature is generally selected from the softening point of the resin (elastomer) constituting the insulating film to about 300 ° C. (specifically, 50 to 300 ° C.). Moreover, when thermosetting resin is used for the insulating film 1, it is preferable to heat at temperature lower than hardening temperature. The pressing force is generally about 0.49 to 2.94 MPa, and preferably about 0.49 to 1.96 MPa.

5 to 7 show an angle α1 of the plurality of conductive wires 2 (axial center L1 of the conductive wire 2) with respect to one side L2 of a predetermined linear shape of the main surface 1a of the insulating film 1. 10A (FIG. 3A and FIG. 4A-4C) of the conductive wire sticking film 10A (FIG. 3A and FIG. 4C) which were made inclined, overlap | superposed so that the linear one side L2 of the adjacent insulating film 1 may overlap in parallel (FIG. 5), The laminated body 20 (FIG. 6) obtained in this way is heated and pressurized, and the block 30 (FIG. 7) was created.

As shown in FIG. 7, in the present invention, a plurality of conductive wire rod attaching films 10A are integrated by the second step, and a plurality of conductive wires are disposed in parallel with each other in the vertical direction (overlapping direction) and the horizontal direction. The block 30 of the structure in which the insulating resin R was interposed between the wire rods 2 is formed.                     

Moreover, the space | interval of the conductive wire rod 2 with respect to the direction (arrow B2 direction in FIG. 7) corresponding to the superimposition direction (direction of arrow B1 in FIG. 6) of the conductive wire attachment film 10A in a block. 7 (d1) shows a pitch in one direction in the film substrate of the conductive path 51 of the anisotropic conductive connector 60 (FIGS. 11A and 11B) (the pitch D1 in the first direction in FIG. 11). Corresponds to)]. That is, the thickness of the insulating film 1 (when using an insulated wire as the conductive wire 2, the sum of the thickness of the insulating film 1 and the thickness of the coating layer by the insulating resin of the insulated wire), and the second Pitch in one direction (first direction) in the film substrate of the conductive path 51 of the anisotropic conductive connector 60 (FIGS. 11A and 11B) according to the heating and pressurizing treatment conditions (temperature, pressure) in the step. (D1 in FIGS. 11A and 11B) is determined.

Thus, in the said 2nd process, although the heating and pressurization are carried out to the laminated body of several sheets with a conductive wire rod film, and the block which integrated the several sheets with conductive wire rod film is created, also in the said 2nd process, the said Prior to heating and pressurization as in step 1, the laminate of the plurality of conductive wire-attached films is disposed in a space capable of forming a reduced pressure or vacuum state, and the space is placed in a reduced pressure or vacuum state, and then the heating is performed. And pressurization is preferred. By doing in this way, when the space | gap between the conductive wire rod adhesion film which overlaps up and down can be removed, and a space | gap remains in the conductive wire rod adhesion film, this space | gap can be removed and it is preferable. The reduced pressure or vacuum is the same as that in the first step, and the space in which the reduced pressure or vacuum can be formed also includes the inner space of the rigid body and the inner space of the white body composed of the flexible film. It is available. In addition, the method for forming a reduced pressure or vacuum state is not particularly limited, but suction by the pump is preferable in view of workability. Moreover, also in the said 2nd process, in order to form a reduced pressure or a vacuum state like the said 1st process, it is preferable to use the white body comprised from a flexible film. When a white body composed of a flexible film is used, when the inner space is made into a vacuum state, the white body is in close contact with the laminate, and the voids between the overlapping conductive wire rod attached films can be more effectively removed.

Moreover, more preferable results are obtained if the heating and pressurizing treatment in the second step are performed as follows. That is, as shown in FIGS. 9 and 10, when the laminate 20 is accommodated, as a heat-resistant box body having a size such that a slight gap is formed between the inner surface and the laminate 20. The laminated body 20 is accommodated in the box body 40 which has the opening 41 for opening and receiving the laminated body 20, and the laminated body 20 is a heat resistant box body according to this state (state of FIG. 10). When it is arrange | positioned in the inner space of the white body which consists of said flexible film with 40, and makes the inside of this space into a reduced pressure or a vacuum state, when it is made to heat and pressurize the laminated body 20, Position shift between the plurality of conductive wire rod attachment films 10A constituting the laminate 20 can be prevented, and the inclination direction and the inclination angle of the plurality of conductive wire rods (conduction paths) in the anisotropic conductive connector to be manufactured. Uniformity increases. In addition, when the "slight gap" is formed, a gap of about 0.5 to 20 mm is generated between the side surface of the laminate and the inner surface of the box body. In addition, the "heat resistance" in a heat-resistant box body means that it does not deform | transform or soften (melt) at the time of the said heat processing, and the specific example of the heat-resistant box body is abbreviated as aluminum (henceforth an aluminium). ), A metal box body made of iron, stainless steel, or the like, or a box body made of ceramics.

[3rd process (process cutting a block)]

The said 3rd process is a process of obtaining the anisotropically conductive connector by cutting the block created by the said 2nd process into the cross section which made the plane which cross | intersects at the angle with a conductive wire rod as a cross section. FIG. 8 shows the conductive wire-attached film in which the conductive wire 2 (axial center L1) is inclined at an angle α1 with respect to the linear one side L2 of the main surface 1a of the insulating film 1. It is an example which cut | disconnects the block 30 (FIG. 7) obtained by overlapping (10A) (FIG. 3A and FIG. 4A-FIG. 4C).

In FIG. 8, although the cutting tool 3 shows a tool with a blade, if it can cut out a film from a block in the said process, it is not limited to a tool with a blade, and various cutting tools (wire saw, slicer, planer, laser) Etc.) can be used.

In the example of FIG. 8, the predetermined | prescribed linear one side L2 of the main surface 1a of the insulating film 1 in the film with a conductive wire rod in the block 30 (refer FIG. 4A-6). The block 30 is cut | disconnected so that the plane 30b orthogonal to the predetermined linear end edge L2 'derived from may become a cut surface. That is, as the conductive wire rod attached film, the conductive wire rod 2 (axial center L1) is formed at an angle α1 with respect to one side L2 of a predetermined linear shape of the main surface 1a of the insulating film 1. Block 30 derived from the predetermined linear one side L2 of the main surface 1a of the insulating film 1 using the inclined conductive wire rod attaching film 10A (FIGS. 3A and 4A to 4C). The inclination angle of the conductive wire rod 2 set in the conductive wire rod attaching film 10A by cutting the block 30 so that the plane 30b perpendicular to this becomes a cutting plane with respect to the end side L2 'of). Anisotropically conductive connector 60 in which the inclination angle? 1 of the shaft center L1 of the conductive wire 2 with respect to the predetermined straight one-side L2 of the main surface 1a of the insulating film 1 is produced as it is. Angle (α) formed with respect to the vertical line L20 of the main surface 50a of the film substrate 50 of the conduction path 51 (axial center L10 of FIG. 11A) (FIG. 11A and 11B). It is. Therefore, in the cutting operation, setting of the cut surface is easy, the plurality of conductive paths are inclined at the desired inclination angle, and the uniformity of the inclination direction between the plurality of conductive paths is high (multiple conductive paths are all in a constant direction). Tilted) anisotropically conductive connectors can be manufactured reliably. Moreover, since the film size (product size) obtained by cutting | disconnection is unified, there is also no problem that a yield falls large.

On the other hand, as an electrically conductive wire sticking film, it is anisotropic from the block made from not inclining the conductive wire rod (axial center) with respect to the linear one side of the main surface of an insulating film like conductive wire sticking film 10B (FIG. 3B). When the conductive connector is cut out, the angle formed by the conductive wire rod (axial center) with respect to the vertical line of the cut surface is the conductive path 51 (axial center L10 of the anisotropic conductive connector 60 (FIGS. 11A and 11B)). The cut surface is set to be equal to the angle α formed with respect to the vertical line L20 of the main surface 50a of the film substrate 50.

In the production method of the present invention, as described above, a plurality of conductive wire attaching films (each of which is cut out from a large-size conductive wire attaching film) having a plurality of conductive wires (in a row) aligned in parallel at the same pitch. In the anisotropically conductive connector due to a mismatch in the winding direction of the insulated conductor (metal wire) in the winding block obtained by winding the conventional insulated conductor multiplely by cutting the anisotropically conductive connector from the block in which the same film) is overlapped. It is possible to prevent the problem that the inclination direction of the conductive paths is not smooth, and the plurality of conductive paths are inclined at a predetermined inclination angle, and an anisotropic conductive connector with a small error in the inclination direction between the plurality of conductive paths is easily provided. It can manufacture. In addition, the post-processing for unifying the film size (product size) of the anisotropically conductive connector cut out after cutting while adjusting the position of a block and a cutting blade in consideration of the direction of the wire (axis center of a wire) in a block as before, or after cutting. Since there is no need to do this, the complexity of a manufacturing operation can also be eliminated. Therefore, the anisotropically conductive connector of desired size (film size (product size)) with high connection reliability to a connection object (a circuit board, a semiconductor element) can be manufactured with high yield.

In addition, although the manufacturing method of this invention was demonstrated above by illustrating the film with a conductive wire rod whose outer shape (outer surface of a principal surface) of an insulating film is rectangular, in this invention, the outer shape of the insulating film in the film with conductive wire rod is It may be a shape other than a rectangle. However, as understood from the above description, it is preferable that the main surface of the insulating film in the film with conductive wire is preferably a shape (outer shape) having one side of a linear shape that can define the inclination angle of the conductive wire such as a rectangle. Needless to say.                     

In addition, since the anisotropically conductive connector is generally used in the general use (an installation connector, an inspection connector (especially an inspection connector)), the thing which made the whole shape (outer form of a film board | substrate) rectangular is used also in this invention. It is preferable to make the external shape of the insulating film in the film with conductive wires rectangular so that the rectangular anisotropic conductive connector can be obtained by only slicing (cutting) the block.

In addition, in the above description, although the manufacturing method of this invention was demonstrated referring the anisotropically conductive connector 60 which has the square matrix shape arrangement | positioning state of the conduction path 51 shown to FIG. 11A and FIG. 11B, the conduction path 51 In the case of manufacturing an anisotropically conductive connector having the most dense shape), each conductive wire in the odd-numbered conductive wire-clad film is laminated evenly in the preparation of the laminate of the conductive wire-clad film. The superposition may be performed so as to be disposed between the gaps between the conductive wires of the conductive wire attachment film.

In addition, in this invention, the form in which the edge part of the conduction path of all or the specific part of a conduction path protrudes or is cut off from the main surface of a film board | substrate, and with respect to each conduction path, only one side or both sides are main parts of a film substrate. When manufacturing the anisotropically conductive connector which protrudes or digs from a surface, the process described below is performed after the said 1st-3rd process.

In the case where the end of the conductive path is projected from the main surface of the film substrate, a method of selectively removing the periphery of the conductive path which should project the end of the film substrate is mentioned. Specifically, methods such as wet etching with an organic solvent, dry etching with plasma etching, argon ion laser, KrF excimer laser, or the like are employed alone or in combination. In addition, although the said organic solvent is suitably selected by the material of the coating layer of a film substrate or an insulated wire, For example, dimethylacetamide, dioxane, tetrahydrofran, methylene chloride, etc. are mentioned.

In addition, it is also possible to deposit and protrude a metal at the end (cross section) of the conductive path which should protrude by plating or vapor deposition. In depositing such a metal, the metal may be the same as or different from the metal constituting the conductive path. Suitable examples include, for example, Ni / Au layers by electroless plating. By providing the Ni / Au layer by electroless plating, there is an advantage that the contact resistance of the connection object (electronic component, circuit board, etc.) with the terminal can be reduced to a low level.

As a method of recessing the conductive path from the surface of the film substrate, a method of selectively removing only the conductive path exposed to the surface of the film substrate is employed, and specifically, chemical etching with an acid or an alkali is employed.

The protrusion amount (height from the main surface of the film substrate to the tip surface of the conductive path) of the conductive path is generally selected from the range of 5 to 60 mu m.

The anisotropically conductive connector produced by the method of the present invention is particularly preferable as the connector for inspection, and in this respect, the modulus of elasticity of the connector as a whole is preferably 5 to 100 MPa at 0 to 50 ° C, and particularly preferably 5 to 70 MPa. Do. The elastic modulus as the whole connector is measured using a dynamic viscoelasticity measuring device (DMS210, manufactured by Seiko Instruments Co., Ltd.). The measurement conditions were a constant frequency (10 Hz) in the tension mode with respect to one of the directions in which the surface of the film substrate of the anisotropic conductive connector was extended, and the temperature was raised to 5 ° C / min to measure from -30 ° C to 250 ° C. do. The thickness of the sample input at the time of a measurement is made into the thickness (symbol T in FIG. 11A and 11B) of the film substrate in the anisotropically conductive connector 60 (FIGS. 11A and 11B).

As an element for determining the elastic modulus of the anisotropically conductive connector 60 (FIGS. 11A and 11B) as the whole connector, the material, thickness (diameter), cross-sectional shape, inclination angle and pitch of the conductive path 51, and a film substrate The material, thickness, etc. are mentioned. Therefore, in the manufacturing method of the anisotropically conductive connector of this invention, the elasticity modulus as the whole connector of the anisotropically conductive connector obtained by adjusting these values is in the range of 0-50 degreeC in the said -30-250 degreeC measurement. Is preferably set to 5 to 70 MPa.

Example

Hereinafter, an Example and a comparative example are described and this invention is demonstrated in detail.

(Example 1)

A cylindrical core made of aluminum having a diameter of 320 mm and a length of 270 mm was installed in a horizontal alignment winding machine HPW-02 type (manufactured by Nitto-ku Engineering Co., Ltd.). After winding one layer of a film composed of 100 µm thick thermoplastic polyurethane elastomer [Esmer URS, manufactured by Nihon Matai Co., Ltd., Softening Point 60 ° C.], a heat resistant polyurethane coated wire having a diameter of 29 µm (copper wire having a diameter of 25 µm) Coated with a heat-resistant polyurethane at a thickness of 2 μm) was wound 250 mm at a winding interval (pitch) of 100 μm. Furthermore, a 50-micrometer-thick fluororesin film was wound as a release film so that the said wound wire might be covered, and the aluminum plate of 1 mm thickness was arrange | positioned along the cylindrical shape of the core as the bonding plate on the outer side.

At a size of 1000 mm x 1530 mm, a heat-resistant nylon film (WL8400-003-60-1000, -SHT9, manufactured by Airtech, softening point: 220 ° C) and sealing tape GS213 (manufactured by Airtech) with a thickness of 80 µm. By this, a white body capable of forming a vacuum space is created, and the hoisted body composed of the core, the film, and the wire rod and the bonding plate are integrally disposed in the white body, and the film space part is kept in a sealed state, and the vacuum hose (vacuum It connected to a pump), and the film space part was made into the vacuum state. And the white body which accommodated such a hoist and a joining board was put into the autoclave apparatus (made by Ashida Seisakusho Co., Ltd.) which can heat-pressurize, maintaining the said vacuum state. After the addition, the tube was heated so that the core temperature was 155 ° C. (tube temperature: 200 ° C.), pressurized with nitrogen gas so that the pressure in the tube was 10 kgf / cm 2, and the core temperature and the pressure inside the tube were targeted. After reaching | attaining a value, it hold | maintained for about 30 minutes and cooled, and after the temperature reached 70 degreeC, the pressure was released.

Thereafter, the bag containing the hoist consisting of the core, the film and the wire rod is taken out of the autoclave, the hoist is taken out of the bag, and the core is separated. Got a block.

Next, one side of the roll-shaped block is cut out to form a flat plate, and a Thompson blade is parallel to each other at a pitch of 100 μm from the flat plate to a main surface of a rectangular thermoplastic urethane elastomer film having a size of 120 mm × 62 mm. 22 sheets of the wire-attached film in the state which the several heat-resistant urethane coating line to align arrange | position at 15 degrees of inclinations ((alpha) 1) with respect to the linear one side L2 of the thermoplastic urethane elastomer film of the state of FIG. Cut out. Next, as shown in Fig. 5, the 22 wire-attached films were loaded in the vertical direction, and the laminate was placed in an aluminum box as shown in Figs. 9 and 10.

In addition, the aluminum box has an opening on the top surface of which the laminate can be put in the state, and has a depth that can completely accommodate the laminate, and the inner side and the side surface of the laminate (thermoplastic). The box which is a rectangular parallelepiped in which 1.5 mm gap is formed between the sides of a urethane elastomer film) was used.

Next, an aluminum plate having a thickness of 10 mm and a size of 120 × 62 mm was placed in the box body from the opening on the upper surface of the box made of aluminum, and mounted on the uppermost surface of the laminate. And in this state, the aluminum box which accommodated the laminated body was put into the inside of the white body which consists of the nylon film which the said vacuum space can form, and makes a film space part a vacuum state, heating, maintaining the said vacuum state It was put into a pressurized autoclave device (manufactured by Ashida Seisakusho Co., Ltd.) and heated so that the temperature of the aluminum box was 175 ° C (200 ° C in the tube), and the pressure in the tube was 15 kgf / cm 2. Pressurized with nitrogen gas. After the inside temperature and pressure reached the target value, the inside of the pipe was cooled. As a result, a block in which the laminate was integrated was formed.

The above-mentioned block is a wire saw (F-600 type | mold by Yasunaga Co., Ltd.), and a cut surface is orthogonal with respect to the predetermined | prescribed edge of the said block (the edge which originates from the linear one side L2 of a thermoplastic urethane elastomer film). It sliced to predetermined film thickness so that it might become a direction to make, and 200 pieces of the anisotropically conductive connectors whose thickness of a film substrate is 100 micrometers and size are 120 mm x 60 mm were cut out.

Five samples were arbitrarily sampled from the obtained 200 anisotropically conductive connectors, and the errors of the inclination direction and the inclination angle of the conduction path were respectively examined with a side microscope (Olymps Industrial Co., Ltd.) from two directions of cross sections of the anisotropically conductive connector. That is, the 1st cross section cut | disconnected in the direction orthogonal to the main surface of a film substrate, and the 2nd cross section cut | disconnected in parallel with the main surface of a film substrate were observed with a side microscope. As a result, it can be seen from the observation of the second cross section that the error in the inclination direction (angle error in the inclination direction) is 0.15 ° for all the conducting paths in the cross section, and that the error in the inclination angle is 0.22 ° from the observation in the first cross section. there was.

(Comparative Example 1)

An insulated wire coated with a thermoplastic polyurethane elastomer used in the above example in a copper wire having a diameter of 25 μm with a thickness of 2 μm, using a winding device, having a total length (wound width) of 640 mm and a cross-sectional shape of 160 mm x 160 mm square The wire rod was densely packed in an array of prismatic plastic cores of to form a winding coil with an average winding number of 3500 turns per layer and 150 winding layers (that is, about 12 mm thick). The obtained roll-shaped winding coil was pressurized at 10 kgf / cm 2 while heating to about 150 ° C, the thermoplastic polyurethane elastomer was fused, cooled to room temperature, and a wound coil block in which the wound wires were integrated with each other. This winding coil block was sliced into a block shape with a wire rod wound with a band saw and a plane having an inclination angle of 15 ° as a cross section, and a block of a shear layer of an anisotropic conductive film having a size of 120 mm x 180 mm and a thickness of 10 mm was obtained. . The obtained block was sliced with a wire saw, and the outer diameter dimension was finished, and 2800 anisotropically conductive connectors whose size is 10 mm x 120 mm and thickness were 100 micrometers were produced.

Five samples are randomly sampled from the obtained 2800 anisotropically conductive connectors, and each of them is performed in the same manner as in the above embodiment, and the errors of the inclination direction and the inclination angle of the conduction path are examined from the two-direction cross-sectional direction of the anisotropically conductive connector with a side microscope. did. As a result, the error in the inclination direction (angle error in the inclination direction) was 0.45 °, and the error in the inclination angle was 0.35 °.

The connection test (conduction test) between the electronic component and circuit board which are described below was performed using the anisotropically conductive connector produced by the said Example 1 and the comparative example 1.

[Specifications of Electronic Components for Evaluation]

Component size: 9.6mm * 7.0mm * 1.65mm (thickness)

Electrode size: 1.0mm * 0.8mm

Number of electrodes: 12                     

Intermediate pitch in electrode arrangement: 1.8mm

[Specifications of Circuit Board for Evaluation]

Substrate: Glass epoxy base material (FR-4)

Overall thickness including circuit pattern: 1 mm

Ratio of the width of the circuit width and the gap portion of the circuit pattern: (1.0 mm: 0.8 mm)

[Assessment Methods]

The anisotropically conductive connector is interposed between the evaluation electronic component and the evaluation circuit board, and a contact load of 25 N is applied from the electronic component side, so that the entire terminal (electrode) of the electronic component is conducted between the circuit boards (i.e., the whole See if the dot is conducting). Then, this test is repeated 10 times.

[result]

When the anisotropically conductive connector of the comparative example 1 was used, it was eight times that the whole point became conductive by ten tests. On the other hand, when the anisotropically conductive connector of Example 1 was used, ten times and the whole point became conductive in ten tests.

From this result, the anisotropically conductive connector obtained by the manufacturing method of the present invention has a small error in the inclination direction (direction in which the conductive path is bent) between the plurality of conductive paths, good contact with the connection object, and high connection reliability. It can be seen that it is a high anisotropic conductive connector.

As is clear from the above description, according to the present invention, the error in the inclination direction (the direction in which the conductive path is bent) between the plurality of conductive paths is small, the contact with the connection object is good, and the connection object is high. The anisotropically conductive connector which can obtain connection reliability can be manufactured efficiently. Moreover, the anisotropic conductive connector which can obtain high connection reliability with such a connection object can be manufactured by high yield with a desired film size.

Claims (8)

In the manufacturing method of the anisotropically conductive connector of the structure which the axial center of the some conductive path which penetrates in the thickness direction of a film board | substrate makes an angle with respect to the perpendicular | vertical line of the main surface of a film board | substrate, The insulating film is wound around the outer periphery of the core material, and then the conductive wire is spirally wound around the outer periphery of the insulating film at a constant pitch, or the conductive wire is spirally wound around the core material at a constant pitch, and then the conductive wire is wound around the core. After winding the insulating film to cover, it is heated and pressurized, and the insulating film and the conductive wire are integrated on the core material to obtain a roll shape, and then the roll shape is separated from the core material, and it is cut and made into a flat shape, A plurality of conductive wire attaching films are cut out from the flat plate, and the plurality of conductive wire attaching films is then superimposed so that the conductive wires of adjacent films are parallel to each other to obtain a laminate, and the laminate is heated and Pressurizing to create a block in which a plurality of conductive wire-bearing films are integrated; By a plane intersecting a conductive wire made with the angle block to the negative as the cut surface were cut to a predetermined film thickness (predetermined film thickness). Obtained the anisotropically conductive connector, A plurality of conductive wire-attached films are cut out so that the main surface of the insulating film has one side having a linear shape and the axis of the plurality of predetermined inclination angle wires has a predetermined inclination angle with respect to the one side of the linear shape. At the same time, a plurality of conductive wire-attached films overlap a single side of the linear shape of the adjacent insulating film in parallel to form a laminate, and the block obtained from the laminate is derived from a straight side of the main surface of the insulating film. Cut to a predetermined film thickness using a plane orthogonal to the straight end of the block to be a cutting plane. Method for producing an anisotropic conductive connector. delete The method of claim 1, The insulating film wound on the core material and the conductive wire are placed together with the core in a space capable of forming a reduced pressure or vacuum state, and the inside of the space is reduced or vacuumed, followed by heating and pressurization. Integrating a conductive wire, characterized in that Method for producing an anisotropic conductive connector. The method of claim 3, wherein The space capable of forming the reduced pressure or vacuum state is an internal space of a bag composed of a flexible film. Method for producing an anisotropic conductive connector. The method of claim 3, wherein The pressurization is performed by introducing a compressed gas into a space capable of forming the reduced pressure or vacuum state. Method for producing an anisotropic conductive connector. The method of claim 1, The laminated body is arrange | positioned in the space which can form a reduced pressure or a vacuum state, and after making the inside of this space into a reduced pressure or a vacuum state, the laminated body is heated and pressurized, It is characterized by the above-mentioned. Method for producing an anisotropic conductive connector. The method of claim 6, The space capable of forming a reduced pressure or vacuum state is an internal space of a white body composed of a flexible film. Method for producing an anisotropic conductive connector. The method of claim 6, When the laminate is accommodated, the laminate is accommodated in a heat-resistant box of a size such that clearance is formed between an inner surface thereof and a side surface of the laminate, and the heat-resistant box body and The laminate is placed together in the inner space of the box body composed of the flexible film, After the inside of the space is reduced or vacuum, the laminate is heated and pressurized. Method for producing an anisotropic conductive connector.

Images