TW201935611A - Processing carrier, and bonding apparatus and transportation method using the same capable of increasing the production efficiency and reducing the requirement of manpower - Google Patents

Processing carrier, and bonding apparatus and transportation method using the same capable of increasing the production efficiency and reducing the requirement of manpower Download PDF

Info

Publication number
TW201935611A
TW201935611A TW107105630A TW107105630A TW201935611A TW 201935611 A TW201935611 A TW 201935611A TW 107105630 A TW107105630 A TW 107105630A TW 107105630 A TW107105630 A TW 107105630A TW 201935611 A TW201935611 A TW 201935611A
Authority
TW
Taiwan
Prior art keywords
platform
carrier
patent application
scope
processing
Prior art date
Application number
TW107105630A
Other languages
Chinese (zh)
Other versions
TWI683394B (en
Inventor
董聖鑫
曾建偉
Original Assignee
萬潤科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 萬潤科技股份有限公司 filed Critical 萬潤科技股份有限公司
Priority to TW107105630A priority Critical patent/TWI683394B/en
Priority to CN201810217385.5A priority patent/CN110167263A/en
Priority to SG10201807439SA priority patent/SG10201807439SA/en
Publication of TW201935611A publication Critical patent/TW201935611A/en
Application granted granted Critical
Publication of TWI683394B publication Critical patent/TWI683394B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automatic Assembly (AREA)
  • Wire Bonding (AREA)

Abstract

The present invention relates to a processing carrier, and a bonding apparatus and a transportation method using the same. The processing carrier comprises: a base frame including an upper platform and a lower platform, wherein a height interval is maintained between the upper platform and the lower platform, and the height interval is limited and adjusted by a pushing and moving mechanism and is driven to move up and down; and a working table disposed on the base frame, and provided with a platform, wherein a plurality of insertion bases are arranged in a matrix above the platform, and each insertion base is provided with an air hole. The bonding apparatus corresponds to a position above the processing carrier by a track on a rail frame. The rail frame is provided with a belt driven to be transported under the rail, and a loading step and a loading tray step are performed to enable the processing carrier to transport a carrying tray.

Description

加工載具及使用該加工載具的貼合設備、搬送方法Processing vehicle, laminating equipment using the processing vehicle, and conveying method

本發明係有關於一種加工載具,尤指一種用於盛放待加工工件,並可配合軌道所輸送的載盤,以承接該載盤供於該載盤上執行加工作業的加工載具及使用該加工載具的貼合設備、搬送方法。The invention relates to a processing carrier, in particular to a processing carrier for holding a workpiece to be processed, and can cooperate with a carrier transported by a track to receive the carrier for performing processing operations on the carrier and Laminating equipment using this processing carrier and conveying method.

按,一般軟性電路板通常需要在加工時執行與一基板或另一 軟性電路板的貼合作業,此項製程通常必需藉由將一軟性電路板或一基板置於一加工載具上,再提取另一軟性電路板進行置放在原該加工載具上的軟性電路板或基板上,使二者透過熱壓或黏著方式進行貼合。According to the general flexible circuit board, it is usually required to perform a lamination operation with a substrate or another flexible circuit board during processing. This process usually requires placing a flexible circuit board or a substrate on a processing carrier, and then Extract another flexible circuit board and place it on the flexible circuit board or substrate originally on the processing carrier, so that the two are bonded by hot pressing or adhesion.

惟先前技術中,該加工載具常採定置於機台台面,並於該加 工載具上方設置一壓合機構來進行貼合操作,操作人員必需將軟性電路板、基板或另一軟性電路板逐一放置於該加工載具上,再操作該壓合機構來進行貼合操作,這樣的產能效率低落,且耗費龐大的人力,並無法適應大量的生產;雖然曾有採用將軟性電路板、基板或另一軟性電路板置於一載盤中以複數個作矩陣排列方式置放,操作人員可一次將整個載盤置於該壓合機構下作逐一壓合的操作,但仍然在效率上有待提昇,且壓合後的成品必需再移置其它檢測機台進行檢查是否有貼合不正或其它瑕疵,整個製程仍有待改善。However, in the prior art, the processing carrier is usually fixed on the machine table, and a pressing mechanism is provided above the processing carrier to perform the bonding operation. The operator must place a flexible circuit board, a substrate or another flexible circuit board. Place them one by one on the processing carrier, and then operate the pressing mechanism to perform the laminating operation. This kind of production efficiency is low, and it consumes a large amount of manpower, and cannot adapt to mass production. Or another flexible circuit board is placed in a carrier plate and placed in a matrix arrangement. The operator can place the entire carrier plate under the pressing mechanism at a time for one-by-one pressing operation, but the efficiency still needs to be determined. It is lifted, and the finished product must be moved to another testing machine to check whether there is incorrect fit or other defects. The entire process needs to be improved.

爰是,本發明的目的,在於提供一種可適於承載載盤進行加工的加工載具。That is, it is an object of the present invention to provide a processing carrier suitable for carrying a carrier for processing.

本發明的另一目的,在於提供一種使用該加工載具的貼合設備。Another object of the present invention is to provide a bonding apparatus using the processing carrier.

本發明的另一目的,在於提供一種使用該加工載具的貼合設備搬送方法。Another object of the present invention is to provide a laminating device conveying method using the processing carrier.

本發明的又一目的,在於提供一種用以執行如所述貼合設備搬送方法之裝置。Yet another object of the present invention is to provide a device for performing the method for transferring laminating equipment.

依據本發明目的之加工載具,包括:一座架,包括一上平台及一下平台,該上平台及下平台間設有可受連動作上、下昇降的樞軸,該上平台與下平台間保持一高度之間距,該高度之間距受一推移機構所限定及調整,該上平台被該推移機構連動作上、下位移而調整該間距的高度;一工作台,設於該座架上,其設有一平台,該平台上方以矩陣排列複數個嵌座,各嵌座上分別設有氣孔。A processing vehicle according to the purpose of the present invention includes: a frame including an upper platform and a lower platform, and a pivot axis capable of being moved up and down can be connected between the upper platform and the lower platform; Maintaining a height interval, the height interval is limited and adjusted by a pushing mechanism, and the upper platform is moved up and down by the pushing mechanism to adjust the height of the distance; a workbench is provided on the seat frame, A platform is provided. A plurality of inserts are arranged in a matrix above the platform, and air holes are provided on each of the inserts.

依據本發明另一目的貼合設備,使用如所述加工載具,包括: 一軌架,該軌架以其上的一軌道對應該於該加工載具上方的位置,該軌架中於該軌道下方設有受驅動可作傳送運行的皮帶以搬送一載盤。According to another object of the present invention, the laminating device uses the processing vehicle as described, comprising: a rail frame, the rail frame corresponding to a position above the processing vehicle with a track thereon, Below the track there is a belt driven for conveying operation to carry a carrier disk.

依據本發明又一目的之貼合設備搬送方法,使用如所述加工載具,包括:一載盤載入步驟:將一載盤自一供收料裝置之一框盒被一第一推送機構推移出後,進入一轉換裝置中的一軌架的一軌道中留置;一承接載盤步驟:使該加工載具的該工作台之平台上方各嵌座恰對應於該載盤上複數個矩陣排列的吸附區下方,使該載盤被該加工載具承接,並以各嵌座上的氣孔中的負壓吸附各該吸附區中的一被貼合物,使其獲得定位。According to another object of the present invention, a laminating device transfer method using the processing carrier as described includes: a loading tray loading step: loading a loading tray from a frame box of a feeding and receiving device by a first pushing mechanism After being pushed out, it is left in a track of a rack in a conversion device; a carrier receiving step: making each inlay above the platform of the workbench of the processing carrier correspond to a plurality of matrices on the carrier Below the arranged adsorption area, the carrier is taken up by the processing carrier, and a paste in each of the adsorption areas is adsorbed by the negative pressure in the pores on each of the inserts to obtain positioning.

依據本發明再一目的之貼合設備,包括:用以執行如所述貼合設備搬送方法之裝置。A laminating device according to another object of the present invention includes a device for performing the laminating device transfer method as described above.

本發明實施例之加工載具及使用該加工載具的貼合設備、搬送方法,由於該座架的上平台及下平台間設有樞軸,該上平台與下平台間保持一高度之間距,該高度之間距受該推移機構所限定及調整,並可因該上平台被該推移機構連動作上、下位移而調整該間距的高度;因此可在設於軌座上並配合安裝在貼合設備中進行搬送時,可降低或上昇高度配合該轉換裝置中的該軌架進行載盤搬送,並利用設於該座架上的該工作台之該平台上方矩陣排列複數個嵌座上氣孔穩固被貼合物,使被貼合物可以在貼合設備中被自動化搬送及作貼合加工,以提高生產效率,穩定品質。According to the processing carrier of the embodiment of the present invention, the bonding equipment using the processing carrier, and the conveying method, since a pivot is provided between the upper platform and the lower platform of the seat frame, a distance between the upper platform and the lower platform is maintained. The distance between the heights is limited and adjusted by the moving mechanism, and the height of the distance can be adjusted because the upper platform is moved up and down by the moving mechanism; therefore, it can be installed on the rail seat and installed on the sticker When carrying in the combined equipment, the height can be lowered or raised to cooperate with the rails in the conversion device to carry the tray, and the air holes on the plurality of inserts can be arranged in a matrix above the platform of the workbench provided on the seat. Stable the adhered material, so that the adhered material can be automatically transported and applied in the laminating equipment to improve production efficiency and stabilize the quality.

請參閱圖1、2,本發明實施例之加工載具A包括: 一座架A1,包括各為平板狀的一上平台A11及一下平台A12,該上平台A11及下平台A12間的四角落分別各相隔間距設有可受連動作上、下昇降的樞軸A13,該上平台A11與下平台A12間在Z軸向保持一高度之間距,該高度之間距受一推移機構A14所限定,並可因該上平台A11被該推移機構A14連動作上、下位移而調整該間距的高度; 一工作台A2,設於該座架A1的上平台A11上,為一框盒狀本體,內部形成一中空的腔室A21,其開口A22朝下,上方設有一矩形的平台A23,該平台A23上方以矩陣排列複數個凸設狀之嵌座A231,各嵌座A231上分別各設有相隔間距的複數個氣孔A232,該平台A23上表面於近四角落處分別各設有凸錐狀定位部A233,在X軸向的各嵌座A231 排列區外的兩端二定位部A233間,分別各對應設有一鏤孔A234與該中空的腔室A21相通,各鏤孔A234中分別各設有一感測元件A24;該平台A23四周緣分別各向下方垂直設一適當高度的框邊A25,各框邊A25分別各向外水平延伸一段底座邊A251,其中位於對應該感測元件A24的X軸向的兩側該底座邊A251上,分別各開有一凹設的鏤設缺槽A252,可於該處藉螺固件(圖中未示)將該工座台A2以開口A22朝下固設於一平板狀的底座A26上; 一荷重量測元件A3,設於該工作台A2與該座架A1的上平台A11間,用以偵測該工作台A2的該平台A23上各嵌座A231上所承受的荷重; 整體加工載具A可以該座架A1的下平台A12設於呈X軸向設置的一軌座B的一滑座B1上,使該加工載具A可受該軌座B上一驅動件B2對該滑座B1的驅動而被連動在X軸向位移。Please refer to FIGS. 1 and 2. The processing vehicle A according to the embodiment of the present invention includes: a frame A1 including an upper platform A11 and a lower platform A12 each having a flat plate shape, and four corners between the upper platform A11 and the lower platform A12, respectively; Each spaced apart is provided with a pivot axis A13 that can be moved up and down by a continuous action. The upper platform A11 and the lower platform A12 maintain a height distance in the Z axis. The height distance is limited by a pushing mechanism A14. The height of the gap can be adjusted because the upper platform A11 is moved up and down by the moving mechanism A14 in a continuous motion; a work table A2 is set on the upper platform A11 of the seat A1, and is a box-shaped body formed inside. A hollow chamber A21 has an opening A22 facing downward, and a rectangular platform A23 is arranged above the platform A23. A plurality of convex inserts A231 are arranged in a matrix above the platform A23. A plurality of air holes A232, the upper surface of the platform A23 is provided with convex cone-shaped positioning portions A233 at the four corners, and the two positioning portions A233 at the two ends outside the arrangement area of the inserts A231 in the X axis are respectively corresponding. There is a hollow hole A234 and the hollow cavity A 21 is connected, and each of the perforations A234 is provided with a sensing element A24; the peripheral edge of the platform A23 is provided with a frame edge A25 of an appropriate height vertically downward, and each frame edge A25 extends a horizontally outwardly of a base edge A251 , Which are located on the two sides corresponding to the X-axis of the sensing element A24 on the base side A251, each of which is provided with a recessed cutout slot A252, which can be screwed there by a screw fastener (not shown) The workbench A2 is fixed on a flat base A26 with the opening A22 facing downwards; a load measuring element A3 is provided between the workbench A2 and the upper platform A11 of the base A1 to detect the work The load carried by each inlay A231 on the platform A23 of platform A2; the overall processing vehicle A may be provided on the lower platform A12 of the seat A1 on a slide B1 of a rail seat B arranged in the X-axis direction, The processing vehicle A can be driven to move in the X-axis direction by being driven by a driving member B2 on the rail base B to the sliding base B1.

請參閱圖3〜5,該推移機構A14設於該上平台A11及下平台A12間,其包括:樞設於該上平台A11下方呈Y軸向的二相互平行並在X軸向相隔間距圓筒狀的輪體A141,該輪體A141係由四個軸承A142所構成,其共同樞設在一軸桿A143中段部位,並於該上平台A11底部設有方形鏤孔A144供該輪體A141在未與該鏤孔A144內周緣接觸下納置其間,而該軸桿A143兩端則受固設於該鏤孔A144兩外側之V型槽溝A145中;該輪體A141納置在該鏤孔A144中時,其輪徑的圓周一部份深入該鏤孔A144中,使該上平台A11底部下方僅露出一部份輪徑;該推移機構A14於該下平台A12上表面上設有一X軸向滑軌A146,該滑軌A146上設有可在滑軌A146上作X軸向水平滑移的二滑塊A147,該二滑塊A147上設有一推抵件A148受一驅動件A149驅動,而可與該二滑塊A147連動在該滑軌A146上作X軸向水平直線位移,該推抵件A148呈長方體狀,其上表面形成二低抵部A1481及二高抵部A1482,該低抵部A1481與高抵部A1482間形成一傾斜的斜抵面A1483,其在X軸向直線排列由左至右依序為低抵部A1481→斜抵面A1483→高抵部A1482→低抵部A1481→斜抵面A1483→高抵部A1482;在該上平台A11與下平台A12間的X軸向兩側,每側分別各以相隔間距設有二彈簧構成的彈性元件A150,每一彈性元件A150各以Z軸向的上下端分別扣設於該在Z軸向保持一高度之間距,該高度之間距受一推移機構A14所限定該上平台A11或下平台A12側邊的一繫扣件A1501上,而以彈性回復力提供拉引該上平台A11或下平台A12相互靠近的驅力,並使該上平台A11底部的二該輪體A141隨時保持下方抵於該推抵件A148上表面。Please refer to FIGS. 3 to 5. The pushing mechanism A14 is disposed between the upper platform A11 and the lower platform A12, and includes: two pivots arranged below the upper platform A11 in a Y-axis parallel to each other and spaced apart in a circle in the X-axis Cylindrical wheel body A141, which is composed of four bearings A142, which are pivotally located in the middle of a shaft A143, and a square hole A144 is provided at the bottom of the upper platform A11 for the wheel body A141 to The shaft A143 is not in contact with the inner periphery of the hole A144, and the two ends of the shaft A143 are fixed in the V-shaped groove A145 on the outside of the hole A144. The wheel body A141 is received in the hole. When A144 is in the middle, a part of the circumference of the wheel diameter penetrates into the perforation A144, so that only a part of the wheel diameter is exposed below the bottom of the upper platform A11; the moving mechanism A14 is provided with an X axis on the upper surface of the lower platform A12 To the slide rail A146, the slide rail A146 is provided with two slide blocks A147 capable of sliding in the X-axis horizontally on the slide rail A146. The two slide blocks A147 are provided with a pushing member A148 driven by a driving member A149. It can be linked with the two sliders A147 to make X-axis horizontal and linear displacement on the slide rail A146. The pushing piece A148 has a rectangular parallelepiped shape. Two low-resistance portions A1481 and two high-resistance portions A1482 are formed on the surface, and an inclined inclined surface A1483 is formed between the low-resistance portions A1481 and the high-resistance portions A1482. The linear arrangement in the X-axis direction is from left to right, and the low-resistance portions are sequentially. Part A1481 → oblique abutment surface A1483 → high abutment part A1482 → low abutment part A1481 → oblique abutment surface A1483 → high abutment part A1482; on both sides of the X axis between the upper platform A11 and the lower platform A12, each side is respectively Elastic elements A150 composed of two springs are arranged at intervals, and each elastic element A150 is respectively buckled at the upper and lower ends of the Z axis at a distance maintained in the Z axis, and the height distance is controlled by a pushing mechanism A14. A series of fasteners A1501 on the side of the upper platform A11 or the lower platform A12 are limited, and the elastic restoring force is provided to drive the upper platform A11 or the lower platform A12 toward each other, and the two on the bottom of the upper platform A11 are closed. The wheel body A141 keeps abutting against the upper surface of the pushing member A148 at any time.

請參閱圖6、7,本發明實施例之加工載具A可使用於如圖所示貼合設備的搬送上,使該加工載具A與一軌座B組構成一模組,並以兩模組在水平且相互平行下併置於一機台C的機台台面C1上,並於一端以一固設於該機台C一側的供收料裝置D與其對應,及在另一近端側設置一檢測裝置E與其對應; 該供收料裝置D以一固定座D1固設於該機台C的一側邊C2,其呈立設狀設有一立設的第一軌座D2,並於該第一軌座D2的一側設有一可受驅動在該第一軌座D2作上、下位移的滑座D3,該滑座D3一側上下間水平橫設有三個座架D4,每一座架D4上可供置放一框盒D5,每一框盒D5中可供容納複數個片狀長方形的載盤D6,該框盒D5兩端各設有開放性開口D51,使該載盤以長方形的短邊露出設於該框盒D5的開放性開口D51,該開放性開口D51其一端對應該機台1上的轉換裝置F,另一端對應一第一推送機構D7; 該轉換裝置F係在該供收料裝置D與該加工載具A間設有呈Y軸向跨於二軌座B上方的一第一龍門F1,該第一龍門F1的橫樑為一Y軸向軌座F11,其上設有一可受該軌座F11上一驅動件F12驅動而作Y軸向位移的滑座F13,該滑座F13上設有一軌架F2,該軌架F2可受該滑座F13連動而在Y軸向位移並定位,而以其上的一軌道F21對應該任一組軌座B上加工載具A上方的位置,該軌架F2亦可受該滑座F13連動而在Y軸向位移並定位,而以其上該軌道F21對應該供收料裝置D之框盒D5,以承接被推送出該框盒D5的該載盤D6或將載盤D6移入該框盒D5;其中,該軌架F2中於該軌道F21下方設有受驅動可作傳送運行的皮帶F22以搬送該載盤D6,於該軌架F2一側並設有 一第二推送機構F23可將該軌道F21中的載盤D6推入該框盒D5中收納; 該檢測裝置E係在該兩組加工載具A的軌座B近端側設置一第二龍門E1,該第二龍門E1朝該供收料裝置D之一側設有呈Z軸向配置而由上往下檢視的第一檢測機構E2,其設於該第二龍門E1之Y軸向水平設置之橫樑E3上的一Y軸向軌座E31的滑座E32及該軌座E31下方一Y軸向滑軌E33上,可受該軌座E31的一驅動件E34驅動該滑座E32而被連動作Y軸向位移;該第二龍門E1朝該供收料裝置D之相反的另一側設有呈Z軸向配置而由上往下檢視的第二檢測機構E4,其設於該第二龍門E1之Y軸向水平設置之橫樑E3上的一Y軸向軌座E41的滑座E42及該軌座E41下方一Y軸向滑軌E43(圖中未示)上,可受該軌座E41的一驅動件E44驅動該滑座E42而被連動作Y軸向位移。Please refer to FIGS. 6 and 7. The processing carrier A according to the embodiment of the present invention can be used for conveying the laminating equipment as shown in the figure, so that the processing carrier A and a rail base B constitute a module, and two The module is horizontal and parallel to each other and is placed on the table surface C1 of a machine C, and at one end is corresponding to a feeding and receiving device D fixed to the side of the machine C, and at the other near end A detection device E is provided on the side corresponding to the detection device E. The feeding and receiving device D is fixed on one side C2 of the machine C with a fixing base D1, which is provided with an upright first rail base D2, and On one side of the first rail base D2 is provided a slide base D3 which can be driven to move upwards and downwards on the first rail base D2. Three sides of the base D3 are horizontally provided with three base frames D4. A frame D4 can be used to place a frame box D5, and each frame box D5 can accommodate a plurality of sheet-shaped rectangular carrier disks D6. The frame box D5 is provided with open openings D51 at both ends, so that the carrier disk An open opening D51 provided in the frame box D5 is exposed on the short side of the rectangle. One end of the open opening D51 corresponds to the conversion device F on the machine 1 and the other end corresponds to a first A feeding mechanism D7; the conversion device F is provided between the feeding and receiving device D and the processing carrier A with a first gantry F1 which is in a Y-axis direction above the second rail seat B, and a beam of the first gantry F1 It is a Y-axis rail base F11, which is provided with a slide base F13 which can be driven by a drive member F12 on the rail base F11 for Y-axis displacement. A slide frame F2 is provided on the slide base F13. F2 can be displaced and positioned in the Y-axis direction by the linkage of the slide F13, and a track F21 on it corresponds to the position above the processing vehicle A on any group of rails B, and the rail F2 can also be affected by the The sliding seat F13 is displaced and positioned in the Y-axis in conjunction with the track F21 corresponding to the frame box D5 of the supply and receiving device D to receive the carrier plate D6 pushed out of the box box D5 or the carrier plate D6 is moved into the frame box D5. Among them, the track frame F2 is provided with a belt F22 driven by the track F21 for conveying operation to carry the carrier D6, and a second push is provided on one side of the track frame F2. The mechanism F23 can push the carrier D6 in the track F21 into the frame box D5 for storage; the detection device E is provided with a second on the proximal end side of the rail seat B of the two sets of processing carriers A A gantry E1, the second gantry E1 is provided with a first detection mechanism E2 arranged in the Z-axis direction and viewed from the top toward one side of the feeding and collecting device D, and is arranged in the Y-axis direction of the second gantry E1 A Y-axis slide E32 on a horizontally disposed beam E3 and a Y-axis slide E33 below the rail E31 can be driven by a drive E34 of the rail E31. The Y axis is displaced by the continuous action; the second gantry E1 is provided with a second detection mechanism E4 arranged in the Z axis direction and viewed from the top to the other side of the opposite side of the feeding and collecting device D. The second gantry E1 has a Y-axis rail seat E41 on the Y-axis horizontally disposed crossbeam E3, and a Y-axis slide rail E43 (not shown in the figure) below the rail seat E41. A drive member E44 of the rail seat E41 drives the slide seat E42 to be displaced in the Y-axis by a continuous action.

請參閱圖8,該載盤D6係由一上盤D61及一下盤D62相磁吸併設所組成,其間夾設一軟性電路板(Flex)之被貼合物D63,該被貼合物D63上形成多個矩陣排列的待貼覆區D631,該上盤D61對應該等待貼覆區D631設有複數個矩陣排列的鏤空狀之工作區D611,該下盤D62對應同列整組的該被貼合物D63上多個待貼覆區D631設有複數個鏤空狀吸附區D621,各工作區D611分別各與吸附區D621相通的區間受該被貼合物D63的該待貼覆區D631所阻隔。Please refer to FIG. 8, the carrier disk D6 is composed of an upper disk D61 and a lower disk D62 magnetically arranged, and a flexible circuit board (Flex) is attached to the substrate D63, which is placed on the substrate D63. A plurality of matrix-arranged to-be-applied areas D631 are formed. The upper plate D61 is provided with a plurality of matrix-shaped hollow work areas D611 corresponding to the wait-to-apply areas D631, and the lower plate D62 corresponds to the entire group of the same array. The plurality of to-be-applied areas D631 on the object D63 are provided with a plurality of hollow adsorption areas D621, and the sections of each work area D611 that are in communication with the adsorption area D621 are blocked by the to-be-applied area D631 of the adherend D63.

請參閱圖6〜7,本發明實施例在該貼合設備的搬送方法上,包括: 一載盤載入步驟:該載盤D6自該供收料裝置D之該框盒D5被該第一推送機構D7推移出後,將進入該轉換裝置F中該軌架F2的該軌道F21中留置; 一第一轉換流路步驟:依該轉換裝置F中該軌架F2被預先設定的順序,使該軌架F2選擇位移至對應其中一軌座B所形成的輸送流路上方;並使被對應的該軌座B上該加工載具A被該滑座B1連動位移至該軌架F2上的該載盤D6下方進行對位; 一承接載盤步驟:完成該對位載盤步驟後,請配合參閱圖8、9,此時加工載具A的該工作台A2之平台A23上方各嵌座A231恰對應於該載盤D6上複數個矩陣排列的吸附區D621下方,為使載盤D6被該加工載具A承接,該推移機構A14的驅動件A149驅動該推抵件A148作X軸向水平直線往該供收料裝置D側之方向位移,使原受該彈性元件A150拉引而下抵於該二低抵部A1481的上平台A11下方的該輪體A141被連動,而循二斜抵面A1483滾昇至二高抵部A1482,連帶使該上平台A11在令該彈性元件A150撐張蓄積回復力下作直線垂直上昇,而以該工作台A2之該平台A23上頂該載盤D6脫離該軌架F2的該軌道F21並承接載盤D6,同時使該平台A23上方的各嵌座A231分別恰對應嵌入該載盤D6上的各吸附區D621中,並以各嵌座A231上的氣孔A232中的負壓吸附各該吸附區D621中的該被貼合物D63,使其獲得定位不偏移;在本實施例中,由於該軌座B已佔據相當高度,故為使整體加工載具A的高度可以下降,除該輪體A141納置在該鏤孔A144中時,其輪徑的圓周一部份深入該鏤孔A144中,使該上平台A11底部下方僅露出一部份輪徑外,該推移機構A14以在該滑軌A146上作X軸向水平直線位移,而連動該輪體A141使該上平台A11作直線垂直上昇或下降,充份可以使該上平台A11、下平台A12的高度之間距縮短,而可移入該軌架F2的該軌道F21下方並承接載盤D6; 一被貼合物檢查步驟:請參閱圖6〜8,該載盤D6被上頂脫離該軌架F2的該軌道F21後,該加工載具A將其移送至該第二龍門E1處的該檢測裝置E的該第一檢測機構E2下方,使該載盤D6上的各被貼合物D63被作檢視; 一貼合成品檢查步驟:請參閱圖6〜8,完成後,該加工載具A將其移送至該第二龍門E1的另一側之該軌座B末端,以接受進行貼合其它貼合物(如另一軟性電路板,此項貼合製程非本發明特徵,茲不贅述),其中,該貼合物自該上盤D61的鏤空狀工作區D611對應貼覆於各被貼合物D63的該等待貼覆區D631上,該貼合製程中貼合其它貼合物所施加的重力,可藉由該荷重量測元件A3進行偵測該工作台A2的該平台A23上各嵌座A231上所承受的荷重而取得所需要調整的控制;完成貼合製程後該加工載具A被連動執行返回行程,並經該第二檢測機構E2進行貼合成品的檢查; 一返回搬送步驟,請配合參閱圖6〜7,完成該貼合成品檢查步驟後,該加工載具A再將已貼有貼合物的該載盤D6移至該軌架F2處; 一第二轉換流路步驟:使該轉換裝置F中該軌架F2被位移至對應該執行返回搬送步驟的軌座B所形成的輸送流路上方;並使該執行返回搬送步驟的該軌座B上該加工載具A被該滑座B1連動位移,而將該載盤D6位移至該軌架F2的該軌道F21上方進行對位; 一交接載盤步驟:請參閱圖6〜8,使該推移機構A14的驅動件A149驅動該推抵件A148作X軸向往該供收料裝置D側之反方向位移,使原滾昇至二高抵部A1482的該輪體A141被該彈性元件A150回復力對上平台A11的作用連動,而循二斜抵面A1483滾降至該二低抵部A1481,而使該工作台A2之該平台A23下降令該載盤D6落置該軌架F2的該軌道F21上,同時使該平台A23上方的各嵌座A231上的氣孔A232中的負壓停止對各該吸附區D621中的該被貼合物D63吸附; 一收納步驟:請配合參閱圖6〜7,使該軌架F2的該軌道F21將已貼有貼合物的該載盤D6送入原框盒D5中的原置放位置被收納; 由於該加工載具A與一軌座B組構成一模組,並以兩模組在水平且相互平行下併置於一機台C的機台台面C1上,上述係該第一轉換流路步驟中選擇其中一模組中該軌座B上該加工載具A進行搬送之步驟實施例,當依該第一轉換流路步驟將該軌架F2中的載盤D6移除後,該軌架F2將被驅動作Y軸向位移至對另一模組的該軌座B上方,以承接該另一模組中正執行該第二轉換流路步驟、交接載盤步驟,收納步驟的搬送。Please refer to FIG. 6 to FIG. 7. The embodiment of the present invention on the method for transferring the laminating equipment includes: a loading tray loading step: the loading tray D6 is removed from the frame box D5 of the feeding and receiving device D by the first After the pushing mechanism D7 is pushed out, it will be left in the track F21 of the rail F2 in the conversion device F; a first conversion flow path step: According to the preset order of the rail F2 in the conversion device F, The rail F2 is selected to be displaced above the conveying flow path corresponding to one of the rail bases B; and the processing vehicle A on the corresponding rail base B is moved and moved to the rail F2 by the sliding base B1 in a coordinated manner. Positioning is performed under the carrier D6; a step of receiving the carrier: after completing the step of positioning the carrier, please refer to Figs. 8 and 9, at this time, the upper seats of the platform A23 of the workbench A2 of the carrier A are processed. A231 corresponds to the bottom of the plurality of adsorption areas D621 arranged in a matrix on the carrier D6. In order for the carrier D6 to be accepted by the processing carrier A, the driving member A149 of the shift mechanism A14 drives the pushing member A148 as the X axis. The horizontal straight line is displaced toward the side of the feeding and receiving device D, so that the original element A150 is pulled by The wheel body A141 below the upper platform A11 of the second low abutment portion A1481 is linked, and the second inclined surface A1483 is rolled up to the second high abutment portion A1482, which in turn makes the upper platform A11 make the elasticity. Element A150 stretches straight and rises vertically under the accumulative restoring force, and the platform A23 on the table A2 lifts the carrier D6 off the track F21 of the rail F2 and receives the carrier D6. At the same time, the platform A23 is above Each of the inserts A231 corresponds to the respective adsorption areas D621 embedded in the carrier D6, and adsorbs the adherend D63 in each of the adsorption areas D621 with a negative pressure in the air hole A232 on each of the inserts A231. In this embodiment, since the rail seat B already occupies a considerable height, in order to reduce the height of the overall processing vehicle A, except that the wheel body A141 is housed in the hole A144. Part of the circumference of the wheel diameter penetrates into the perforation A144, so that only a part of the wheel diameter is exposed below the bottom of the upper platform A11, and the moving mechanism A14 makes an X-axis horizontal straight line on the slide rail A146 Displacement, and in conjunction with the wheel body A141, the upper platform A11 can be vertically raised or lowered in a straight line, which can fully make The distance between the height of the upper platform A11 and the lower platform A12 is shortened, and it can be moved under the track F21 of the rail F2 and can receive the carrier D6. Steps for inspecting a bonded object: Please refer to Figure 6 ~ 8. After D6 is lifted off the track F21 of the rail F2, the processing vehicle A moves it to the first detection mechanism E2 of the detection device E at the second gantry E1, and places the carrier D6 on Each attached D63 is inspected; a composite inspection step: please refer to Figures 6 ~ 8. After completion, the processing vehicle A moves it to the rail seat on the other side of the second gantry E1. At the B end, it is acceptable to paste other pastes (such as another flexible circuit board, this paste process is not a feature of the present invention, and will not be described in detail), wherein the paste is formed from the hollow-shaped work of the upper plate D61. The area D611 is correspondingly attached to the waiting-to-be-applied area D631 of each of the attached components D63. The gravity applied by the other components during the lamination process can be detected by the load cell A3. The load to be carried on each inlay A231 on the platform A23 of the workbench A2 to obtain the control needed to be adjusted; end After the lamination process, the processing vehicle A is executed to perform the return stroke, and the second inspection mechanism E2 is used to inspect the lamination product. For a return transfer step, please refer to Figures 6 to 7 to complete the inspection process of the lamination product. After that, the processing carrier A moves the carrier D6 to which the sticker has been attached to the rail F2; a second conversion flow path step: the rail F2 in the conversion device F is displaced to the opposite position Above the conveying flow path formed by the rail base B that should perform the return transfer step; and move the processing carrier A on the rail base B that is subjected to the return transfer step by the carriage B1 to displace the carrier D6. The alignment is performed above the rail F21 of the rail frame F2. A transfer carrier step: please refer to Figs. 6-8, so that the driving member A149 of the pushing mechanism A14 drives the pushing member A148 for X-axis feeding and receiving. The displacement in the opposite direction of the D side of the device caused the wheel body A141, which was originally rolled up to the second high abutment portion A1482, to be linked to the upper platform A11 by the restoring force of the elastic element A150, and rolled down to the second inclined surface A1483 Low arrival at A1481, and lowering the platform A23 of the workbench A2 caused the The carrier D6 is placed on the track F21 of the rail F2, and at the same time, the negative pressure in the air holes A232 on the inserts A231 above the platform A23 is stopped from adsorbing the adherend D63 in each of the adsorption areas D621. A storage step: please refer to FIGS. 6 to 7 so that the track F21 of the rail F2 sends the carrier D6 to which the laminate has been pasted into the original storage position in the original frame box D5 to be stored; The processing vehicle A and a rail base B constitute a module, and the two modules are horizontally and parallel to each other and are placed on the machine table surface C1 of a machine C. The above is the first conversion flow path step. An embodiment of the step of selecting the processing carrier A on the rail base B in one of the modules for carrying, and after removing the carrier D6 in the rail F2 according to the first conversion flow path step, the rail F2 The Y is driven to be axially displaced above the rail base B of another module to carry the second conversion flow path step, the transfer tray step, and the storage step in the other module.

本發明實施例之加工載具及使用該加工載具的貼合設備、搬送方法,由於該座架A1的上平台A11及下平台A12間設有樞軸A13,該上平台A11與下平台A12間保持一高度之間距,該高度之間距受該推移機構所限定及調整,並可因該上平台被該推移機構A14連動作上、下位移而調整該間距的高度;因此可在設於軌座B上並配合安裝在貼合設備中進行搬送時,可降低或上昇高度配合該轉換裝置F中的該軌架F2進行載盤D6搬送,並利用設於該座架A1上的該工作台A2之該平台A23上方矩陣排列複數個嵌座A231上氣孔A232穩固被貼合物D63,使被貼合物D63可以在貼合設備中被自動化搬送及作貼合加工,以提高生產效率,穩定品質。According to the processing carrier of the embodiment of the present invention, the bonding equipment using the processing carrier, and the conveying method, since a pivot A13 is provided between the upper platform A11 and the lower platform A12 of the seat frame A1, the upper platform A11 and the lower platform A12 Maintain a height distance between the height, the height distance is limited and adjusted by the moving mechanism, and the height of the distance can be adjusted because the upper platform is moved up and down by the moving mechanism A14; When it is carried on the seat B and installed in the laminating equipment, it can be lowered or raised to cooperate with the rail F2 in the conversion device F to carry the carrier D6, and use the workbench provided on the seat A1. The platform A23 above the platform A23 arranges a plurality of inserts A231. The air holes A232 on the platform stabilize the bonded D63, so that the bonded D63 can be automatically transported and processed in the bonding equipment to improve production efficiency and stability. quality.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此 限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.

A‧‧‧加工載具A‧‧‧Processing Vehicle

A1‧‧‧座架A1‧‧‧seat

A11‧‧‧上平台A11‧‧‧on the platform

A12‧‧‧下平台A12‧‧‧Under platform

A13‧‧‧樞軸A13‧‧‧ Pivot

A14‧‧‧推移機構A14‧‧‧Transition agency

A141‧‧‧輪體A141‧‧‧wheel

A142‧‧‧軸承A142‧‧‧bearing

A143‧‧‧軸桿A143‧‧‧Shaft

A144‧‧‧鏤孔A144‧‧‧hole

A145‧‧‧槽溝A145‧‧‧Slot

A146‧‧‧滑軌A146‧‧‧Slide

A147‧‧‧滑塊A147‧‧‧Slider

A148‧‧‧推抵件A148‧‧‧Pushing

A1481‧‧‧低抵部A1481‧‧‧Low Arrival Department

A1482‧‧‧高抵部A1482‧‧‧High arrival department

A1483‧‧‧斜抵面A1483‧‧‧ obliquely

A149‧‧‧驅動件A149‧‧‧Driver

A150‧‧‧彈性元件A150‧‧‧Elastic element

A1501‧‧‧繫扣件A1501‧‧‧series fastener

A2‧‧‧工作台A2‧‧‧Workbench

A21‧‧‧腔室A21‧‧‧chamber

A22‧‧‧開口A22‧‧‧ opening

A23‧‧‧平台A23‧‧‧Platform

A231‧‧‧嵌座A231‧‧‧Inlay

A232‧‧‧氣孔A232‧‧‧Stoma

A233‧‧‧定位部A233‧‧‧Positioning Department

A234‧‧‧鏤孔A234‧‧‧hole

A24‧‧‧感測元件A24‧‧‧Sensing element

A25‧‧‧框邊A25‧‧‧Frame border

A251‧‧‧底座邊A251‧‧‧Base edge

A252‧‧‧缺槽A252‧‧‧Slot

A26‧‧‧底座A26‧‧‧base

A3‧‧‧荷重量測元件A3‧‧‧Load-weight measuring element

B‧‧‧軌座B‧‧‧ rail seat

B1‧‧‧滑座B1‧‧‧slide

B2‧‧‧驅動件B2‧‧‧Driver

C‧‧‧機台C‧‧‧machine

C1‧‧‧機台台面C1‧‧‧machine table top

C2‧‧‧側邊C2‧‧‧ side

D‧‧‧供收料裝置D‧‧‧feeding and receiving device

D1‧‧‧固定座D1‧‧‧Fixed

D2‧‧‧第一軌座D2‧‧‧First rail seat

D3‧‧‧滑座D3‧‧‧Slide

D4‧‧‧座架D4‧‧‧Seat

D5‧‧‧框盒D5‧‧‧Box

D51‧‧‧開口D51‧‧‧ opening

D6‧‧‧載盤D6‧‧‧carriage

D61‧‧‧上盤D61‧‧‧on the market

D611‧‧‧工作區D611‧‧‧Working area

D62‧‧‧下盤D62‧‧‧Place

D621‧‧‧吸附區D621‧‧‧ Adsorption zone

D63‧‧‧被貼合物D63‧‧‧ paste

D631‧‧‧待貼覆區D631‧‧‧To be covered

D7‧‧‧第一推送機構D7‧‧‧The first push agency

E‧‧‧檢測裝置E‧‧‧Detection device

E1‧‧‧第二龍門E1‧‧‧Second Dragon Gate

E2‧‧‧第一檢測機構E2‧‧‧The first testing agency

E3‧‧‧橫樑E3‧‧‧ Beam

E31‧‧‧軌座E31‧‧‧rail mount

E32‧‧‧滑座E32‧‧‧slide

E33‧‧‧滑軌E33‧‧‧Slide

E34‧‧‧驅動件E34‧‧‧Driver

E4‧‧‧第二檢測機構E4‧‧‧Second Testing Agency

E41‧‧‧軌座E41‧‧‧rail mount

E42‧‧‧滑座E42‧‧‧slide

E43‧‧‧滑軌E43‧‧‧Slide

E44‧‧‧驅動件E44‧‧‧Driver

F‧‧‧轉換裝置F‧‧‧ Conversion device

F1‧‧‧第一龍門F1‧‧‧First Dragon Gate

F11‧‧‧軌座F11‧‧‧rail mount

F12‧‧‧驅動件F12‧‧‧Driver

F13‧‧‧滑座F13‧‧‧Slide

F2‧‧‧軌架F2‧‧‧rail

F21‧‧‧軌道F21‧‧‧track

F22‧‧‧皮帶F22‧‧‧Belt

F23‧‧‧第二推送機構 F23‧‧‧Second Pushing Agency

圖1係本發明實施例中加工載具設於軌座之立體示意圖。 圖2係本發明實施例中加工載具設於軌座之一側面示意圖。 圖3係本發明實施例中座架之立體分解示意圖。 圖4係本發明實施例中輪體設於上平台下方之示意圖。 圖5係本發明實施例中該上平台底部下方僅露出一部份輪體輪徑之示意圖。 圖6係本發明實施例中該貼合設備之部份立體示意圖。 圖7係本發明實施例中該貼合設備之部份俯視示意圖。 圖 8係本發明實施例中該載盤與加工載具分解之示意圖。 圖9係本發明實施例中該推移機構進行推移之示意圖。FIG. 1 is a schematic perspective view of a processing carrier provided on a rail base in an embodiment of the present invention. FIG. 2 is a schematic side view of a processing carrier provided on one of the rail bases in the embodiment of the present invention. FIG. 3 is an exploded perspective view of the seat frame in the embodiment of the present invention. FIG. 4 is a schematic diagram of the wheel body disposed under the upper platform in the embodiment of the present invention. FIG. 5 is a schematic diagram showing only a part of the wheel diameter below the bottom of the upper platform in the embodiment of the present invention. FIG. 6 is a perspective view of a part of the bonding device according to an embodiment of the present invention. FIG. 7 is a schematic plan view of a part of the bonding device according to an embodiment of the present invention. FIG. 8 is an exploded view of the carrier and the processing carrier in the embodiment of the present invention. FIG. 9 is a schematic diagram of a shift performed by the shift mechanism in the embodiment of the present invention.

Claims (17)

一種加工載具,包括: 一座架,包括一上平台及一下平台,該上平台及下平台間設有樞軸,該上平台與下平台間保持一高度之間距,該高度之間距受一推移機構所限定及調整,該上平台被該推移機構連動作上、下位移而調整該間距的高度; 一工作台,設於該座架上,其設有一平台,該平台上方以矩陣排列複數個嵌座,各嵌座上分別設有氣孔。A processing vehicle includes: a frame including an upper platform and a lower platform, a pivot is provided between the upper platform and the lower platform, and a distance between the upper platform and the lower platform is maintained, and the height distance is subject to a shift The upper platform is limited and adjusted by the moving mechanism to adjust the height of the gap by the upward and downward displacement of the moving mechanism; a working table is set on the seat frame, which is provided with a platform, and a plurality of platforms are arranged above the platform in a matrix. Inserts are provided with air holes on each insert. 如申請專利範圍第1項所述加工載具,其中,該平台上表面設有凸錐狀定位部。The processing vehicle according to item 1 of the scope of patent application, wherein a convex cone-shaped positioning portion is provided on the upper surface of the platform. 如申請專利範圍第1項所述加工載具,其中,該平台上表面在各嵌座的排列區外設有感測元件。The processing vehicle according to item 1 of the scope of the patent application, wherein the upper surface of the platform is provided with a sensing element outside the arrangement area of each inlay. 如申請專利範圍第1項所述加工載具,其中,該工作台為一框盒狀本體,內部形成一中空的腔室,其開口朝下,上方設為該平台,工作台以開口朝下固設於一底座上。The processing carrier according to item 1 of the scope of patent application, wherein the workbench is a frame-shaped box-shaped body, and a hollow cavity is formed inside, the opening of which is downward, and the upper part is set as the platform, and the workbench is with the opening downward. It is fixed on a base. 如申請專利範圍第1項所述加工載具,其中,該工作台與該座架的上平台間設有一荷重量測元件。The processing vehicle according to item 1 of the scope of patent application, wherein a load measuring element is provided between the worktable and the upper platform of the seat frame. 如申請專利範圍第1項所述加工載具,其中,該加工載具以該座架的下平台設於一軌座的一滑座上,使該加工載具可受該軌座上一驅動件對該滑座的驅動而被連動位移。The processing vehicle according to item 1 of the scope of the patent application, wherein the processing vehicle is provided on a slide of a rail base with the lower platform of the base frame, so that the processing vehicle can be driven by a rail base. The drive of the piece is moved in tandem. 如申請專利範圍第1項所述加工載具,其中,該推移機構包括:設於該上平台下方的輪體,以及設於該下平台上受一驅動件驅動的一推抵件。The processing vehicle according to item 1 of the scope of patent application, wherein the moving mechanism includes: a wheel body provided below the upper platform, and a pushing member provided on the lower platform and driven by a driving member. 如申請專利範圍第7項所述加工載具,其中,該輪體包括:樞設於該上平台下方的二相互平行並相隔間距的輪體,該推抵件上表面形成二低抵部及二高抵部,該低抵部與高抵部間形成一傾斜的斜抵面。The processing vehicle according to item 7 in the scope of the patent application, wherein the wheel body comprises: two mutually parallel and spaced apart wheel bodies pivotally arranged below the upper platform; the upper surface of the pushing member forms two low-resistance portions and Two high abutment portions, and an inclined inclined abutment surface is formed between the low abutment portion and the high abutment portion. 如申請專利範圍第7項所述加工載具,其中,該輪體係由複數個軸承所構成,其共同樞設在一軸桿中段部位。The processing vehicle according to item 7 of the scope of the patent application, wherein the wheel system is composed of a plurality of bearings, and the wheel system is pivotally disposed at a middle portion of a shaft. 如申請專利範圍第9項所述加工載具,其中,該上平台底部設有方形鏤孔供該輪體在未與該鏤孔內周緣接觸下納置其間,而該軸桿兩端則受固設於該鏤孔兩外側之V型槽溝中;該輪體納置在該鏤孔中時,其輪徑的圓周一部份深入該鏤孔中,使該上平台底部下方僅露出一部份輪徑。The processing vehicle according to item 9 of the scope of the patent application, wherein the bottom of the upper platform is provided with a square perforation for the wheel body to be interposed therebetween without contacting the inner periphery of the perforation, and the two ends of the shaft are affected by It is fixed in the V-shaped grooves on the two outer sides of the perforation; when the wheel body is accommodated in the perforation, a part of the circumference of the wheel diameter penetrates into the perforation, so that only one under the bottom of the upper platform appears Partial wheel diameter. 如申請專利範圍第7項所述加工載具,其中,該下平台上表面上設有一滑軌,該滑軌上設有可在滑軌上作X軸向滑移的二滑塊,該二滑塊上設該推抵件。The processing vehicle according to item 7 of the scope of patent application, wherein the upper surface of the lower platform is provided with a slide rail, and the slide rail is provided with two slide blocks capable of X-axis sliding on the slide rail. The pusher is provided on the slider. 如申請專利範圍第1項所述加工載具,其中,該上平台與下平台間設有彈性元件,而以彈性回復力提供拉引該上平台、下平台相互靠近的驅力。The processing vehicle according to item 1 of the scope of the patent application, wherein an elastic element is provided between the upper platform and the lower platform, and a driving force for pulling the upper platform and the lower platform closer to each other is provided by an elastic restoring force. 一種貼合設備,使用如申請專利範圍第1至12項任一項所述加工載具,包括: 一軌架,該軌架以其上的一軌道對應該於該加工載具上方的位置,該軌架中於該軌道下方設有受驅動可作傳送運行的皮帶以搬送一載盤。A laminating device using the processing carrier according to any one of claims 1 to 12 of the scope of patent application, comprising: a rail rack, the rail rack corresponding to a position above the processing carrier, A belt driven under the track is provided in the track rack for conveying operation to carry a carrier disc. 如申請專利範圍第1項所述貼合設備,其中,該載盤由一上盤及一下盤併設組成,其間夾設一被貼合物。According to the bonding device described in the first item of the patent application scope, wherein the carrier disk is composed of a juxtaposition of an upper disk and a lower disk, and an adherend is interposed therebetween. 一種貼合設備搬送方法,使用如申請專利範圍第1至12項任一項所述加工載具,包括: 一載盤載入步驟:將一載盤自一供收料裝置之一框盒被一第一推送機構推移出後,進入一轉換裝置中的一軌架的一軌道中留置; 一承接載盤步驟:使該加工載具的該工作台之平台上方各嵌座恰對應於該載盤上複數個矩陣排列的吸附區下方,使該載盤被該加工載具承接,並以各嵌座上的氣孔中的負壓吸附各該吸附區中的一被貼合物,使其獲得定位。A method for transferring laminating equipment using the processing carrier according to any one of claims 1 to 12 of the scope of patent application, including: a loading tray loading step: loading a loading tray from a frame box of a feeding and receiving device After a first pushing mechanism is pushed out, it is left in a track of a rail rack in a conversion device; a step of receiving a tray: making each inlay above the platform of the workbench of the processing carrier correspond to the carrier Below the plurality of adsorption regions arranged in a matrix on the disk, the carrier is taken up by the processing carrier, and one of the adherends in each of the adsorption regions is adsorbed by the negative pressure in the pores on each insert to obtain Positioning. 如申請專利範圍第1項所述貼合設備搬送方法,其中,該加工載具將載盤移送至進行一貼合製程,使一貼合物自該載盤的一鏤空狀工作區對應貼覆於各被貼合物的一待貼覆區上。The method for transferring laminating equipment as described in item 1 of the scope of the patent application, wherein the processing carrier moves the carrier to a laminating process, so that a lamination is correspondingly pasted from a hollow working area of the carrier. On a to-be-applied area of each of the adhered objects. 一種貼合設備搬送方法,包括:用以執行如申請專利範圍第15至16項中任一項所述推送方法之裝置。A method for carrying a laminating device includes a device for performing the pushing method according to any one of items 15 to 16 of the scope of patent application.
TW107105630A 2018-02-14 2018-02-14 Processing carrier, laminating equipment and transportation method using the processing carrier TWI683394B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW107105630A TWI683394B (en) 2018-02-14 2018-02-14 Processing carrier, laminating equipment and transportation method using the processing carrier
CN201810217385.5A CN110167263A (en) 2018-02-14 2018-03-16 Process carrier and abutted equipment, transport method using the processing carrier
SG10201807439SA SG10201807439SA (en) 2018-02-14 2018-08-30 Carriage device, bonding equipment having the same and transport method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107105630A TWI683394B (en) 2018-02-14 2018-02-14 Processing carrier, laminating equipment and transportation method using the processing carrier

Publications (2)

Publication Number Publication Date
TW201935611A true TW201935611A (en) 2019-09-01
TWI683394B TWI683394B (en) 2020-01-21

Family

ID=67636258

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107105630A TWI683394B (en) 2018-02-14 2018-02-14 Processing carrier, laminating equipment and transportation method using the processing carrier

Country Status (3)

Country Link
CN (1) CN110167263A (en)
SG (1) SG10201807439SA (en)
TW (1) TWI683394B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112390011B (en) * 2020-10-29 2022-11-04 苏州华兴源创科技股份有限公司 Pressing mechanism
CN117361053B (en) * 2023-12-07 2024-02-13 广州市昊志影像科技有限公司 Material carrying platform

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596694B (en) * 2015-06-30 2017-08-21 All Ring Tech Co Ltd Electronic component carrier transport method and device
WO2017115684A1 (en) * 2015-12-28 2017-07-06 株式会社ニコン Substrate bonding device and substrate bonding method
TWI567011B (en) * 2016-06-15 2017-01-21 All Ring Tech Co Ltd Method and device for conveying the components of the bonding process
CN206885985U (en) * 2017-06-05 2018-01-16 东莞市宝巨自动化科技有限公司 Carrier conveyer

Also Published As

Publication number Publication date
CN110167263A (en) 2019-08-23
SG10201807439SA (en) 2019-09-27
TWI683394B (en) 2020-01-21

Similar Documents

Publication Publication Date Title
TWI512877B (en) Workpiece transport method and workpiece transport device
CN112520413B (en) Full-automatic aging test loading and unloading system and method
JP2011017692A (en) Substrate storing container, and substrate inspection apparatus including the same
CN101180548A (en) Pick-and-place mechanism of electronic device, electronic device handling apparatus and suction method of electronic device
TW201935611A (en) Processing carrier, and bonding apparatus and transportation method using the same capable of increasing the production efficiency and reducing the requirement of manpower
JP2006058411A (en) Method and apparatus for bonding polarizing plate to liquid crystal panel
CN206050319U (en) A kind of classification Palletizer based on mechanical hand
CN108502543B (en) Substrate transmission device and method
CN210876353U (en) Processing-oriented apparatus
KR20130090827A (en) Substrate transport method and substrate transport apparatus
TWI513382B (en) Radiator placement method and device
CN111496490A (en) Jig circulation device and method for automatic assembly of earphone coil body
KR20180064270A (en) Conveyer, conveying apparatus, and scribing system
CN114247662A (en) Chip screening device and chip detection production line
TW201407171A (en) Electronic component testing and classification equipment
CN113600505A (en) Sensor element detects sorting facilities
CN209787738U (en) Automatic paste dress equipment
CN115837358A (en) Direct-push type wafer sorting machine and wafer sorting process thereof
TWI651024B (en) Fitting device and carrying method thereof
CN114252396A (en) Intelligent automatic feeding formula lithium cell multiaspect detects with shooting device of getting looks
CN109824261B (en) Substrate cutting device and substrate cutting method
CN217360169U (en) Chip testing device
CN212221603U (en) Full-automatic burning system
JP5291665B2 (en) Panel processing system and panel processing method
CN109177313B (en) Glue dispensing buffer cushion device for wine box base