SG10201807439SA - Carriage device, bonding equipment having the same and transport method using the same - Google Patents

Carriage device, bonding equipment having the same and transport method using the same

Info

Publication number
SG10201807439SA
SG10201807439SA SG10201807439SA SG10201807439SA SG10201807439SA SG 10201807439S A SG10201807439S A SG 10201807439SA SG 10201807439S A SG10201807439S A SG 10201807439SA SG 10201807439S A SG10201807439S A SG 10201807439SA SG 10201807439S A SG10201807439S A SG 10201807439SA
Authority
SG
Singapore
Prior art keywords
same
carriage device
platform
transport method
bonding equipment
Prior art date
Application number
SG10201807439SA
Inventor
DONG Sheng-Hsin
ZENG Jian-Wei
Original Assignee
All Ring Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by All Ring Tech Co Ltd filed Critical All Ring Tech Co Ltd
Publication of SG10201807439SA publication Critical patent/SG10201807439SA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Automatic Assembly (AREA)
  • Wire Bonding (AREA)

Abstract

CARRIAGE DEVICE, BONDING EQUIPMENT HAVING THE SAME AND TRANSPORT METHOD USING THE SAME A carriage device includes frame seat and working 5 stage . The frame seat includes an upper platform, a lower platform that is disposed below and spaced apart from the upper platform, a guide rod that interconnects the upper and lower platforms, and an adjusting mechanism that is operable to adjust the distance between the upper 10 and lower platforms . The working stage is disposed on the frame seat and includes a carrying platform. The carrying platform has a plurality of engaging seats that protrude upwardly and that are arranged in rows and columns. Each of the engaging seats has at least one 15 communication hole. Figure 2
SG10201807439SA 2018-02-14 2018-08-30 Carriage device, bonding equipment having the same and transport method using the same SG10201807439SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107105630A TWI683394B (en) 2018-02-14 2018-02-14 Processing carrier, laminating equipment and transportation method using the processing carrier

Publications (1)

Publication Number Publication Date
SG10201807439SA true SG10201807439SA (en) 2019-09-27

Family

ID=67636258

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201807439SA SG10201807439SA (en) 2018-02-14 2018-08-30 Carriage device, bonding equipment having the same and transport method using the same

Country Status (3)

Country Link
CN (1) CN110167263A (en)
SG (1) SG10201807439SA (en)
TW (1) TWI683394B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112390011B (en) * 2020-10-29 2022-11-04 苏州华兴源创科技股份有限公司 Pressing mechanism
CN117361053B (en) * 2023-12-07 2024-02-13 广州市昊志影像科技有限公司 Material carrying platform

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596694B (en) * 2015-06-30 2017-08-21 All Ring Tech Co Ltd Electronic component carrier transport method and device
WO2017115684A1 (en) * 2015-12-28 2017-07-06 株式会社ニコン Substrate bonding device and substrate bonding method
TWI567011B (en) * 2016-06-15 2017-01-21 All Ring Tech Co Ltd Method and device for conveying the components of the bonding process
CN206885985U (en) * 2017-06-05 2018-01-16 东莞市宝巨自动化科技有限公司 Carrier conveyer

Also Published As

Publication number Publication date
TWI683394B (en) 2020-01-21
TW201935611A (en) 2019-09-01
CN110167263A (en) 2019-08-23

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