TW201935136A - Attachment structure for optical device, and exposure device - Google Patents

Attachment structure for optical device, and exposure device Download PDF

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Publication number
TW201935136A
TW201935136A TW107137300A TW107137300A TW201935136A TW 201935136 A TW201935136 A TW 201935136A TW 107137300 A TW107137300 A TW 107137300A TW 107137300 A TW107137300 A TW 107137300A TW 201935136 A TW201935136 A TW 201935136A
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Taiwan
Prior art keywords
guide member
light
optical device
hole
mounting
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TW107137300A
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Chinese (zh)
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TWI772544B (en
Inventor
米澤良
杉本重人
山崎祥平
町田孝二
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日商V科技股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70025Production of exposure light, i.e. light sources by lasers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/20Light-tight connections for movable optical elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation

Abstract

The present invention keeps an optical axis from shaking when an optical device is moved up/down. According to the present invention, a round hole that passes substantially in the vertical direction is formed in a frame body, and a guide member that is substantially thin-plate shaped and, in plan view, substantially disc-shaped, is provided to the frame body to cover the round hole. An attachment hole that is formed substantially at the center of the guide member is arranged to be substantially concentric with the round hole. A cylindrical part: is inserted into the attachment hole such that an optical axis substantially coincides with the center of the attachment hole; and is fixed to the guide member.

Description

光學裝置之安裝構造及曝光裝置Mounting structure of optical device and exposure device

本發明係關於一種光學裝置之安裝構造及曝光裝置。The present invention relates to a mounting structure of an optical device and an exposure device.

於專利文獻1中揭示有一種曝光裝置,其係於對設置於曝光台之單片膠片進行曝光處理時,在使曝光台升降之同時,對構成曝光頭之稜鏡對進行控制而進行焦點調整處理。 [先前技術文獻] [專利文獻]Patent Document 1 discloses an exposure device for performing focus adjustment on a pair of films constituting an exposure head while raising and lowering the exposure table when performing exposure processing on a single film provided on the exposure table. deal with. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本特開2006-235457號公報[Patent Document 1] Japanese Patent Laid-Open No. 2006-235457

[發明所欲解決之課題][Problems to be Solved by the Invention]

專利文獻1中所記載之發明係藉由改變稜鏡對之厚度而進行焦點調整,但若於會聚光中光程長度改變則會產生像差,因此會因焦點調整導致光學系統之性能變化。如此,於藉由改變光學零件之配置而進行曝光頭之焦點調整之情形時,有無法使光學性能最佳化之虞。The invention described in Patent Document 1 adjusts the focus by changing the thickness of the pair. However, if the optical path length is changed in the condensed light, aberrations will occur, so the performance of the optical system will change due to the focus adjustment. As described above, in the case where the focus adjustment of the exposure head is performed by changing the arrangement of the optical components, the optical performance may not be optimized.

為了應對此種問題,而考慮不改變光學零件之配置而使光學裝置整體上下移動之方法。然而,於使光學裝置整體上下移動之情形時,有隨著上下移動而光軸抖動(光軸之水平方向之位置發生偏移),而描繪精度降低之虞。尤其於設置複數個光學裝置之情形時,複數個光學裝置之相對關係較為重要,因此需要使光軸之抖動量變得更小。To cope with such a problem, a method of moving the entire optical device up and down without changing the arrangement of the optical components is considered. However, when the entire optical device is moved up and down, the optical axis may be shaken (the position in the horizontal direction of the optical axis is shifted) with the up and down movement, and the drawing accuracy may be reduced. Especially when a plurality of optical devices are provided, the relative relationship between the plurality of optical devices is more important, so it is necessary to make the amount of jitter of the optical axis smaller.

又,於用以製造如專利文獻1中所記載之發明中之印刷基板之裝置中,一般使用NA為0.2~0.3左右之透鏡。然而,若欲將如專利文獻1中所記載之發明中所記載之稜鏡對,應用於使用NA為0.65左右之透鏡的裝置,則像差變大,且能夠使焦點聚合之範圍變窄。In addition, in an apparatus for manufacturing a printed circuit board in the invention described in Patent Document 1, a lens having an NA of about 0.2 to 0.3 is generally used. However, if the pair of pairs described in the invention described in Patent Document 1 is to be applied to a device using a lens with an NA of about 0.65, the aberration becomes large and the range of focus convergence can be narrowed.

本發明係鑒於此種狀況而成者,且目的在於提供一種能夠於使光學裝置上下移動時防止光軸之抖動的光學裝置之安裝構造及曝光裝置。 [解決課題之技術手段]The present invention has been made in view of such a situation, and an object thereof is to provide an optical device mounting structure and an exposure device capable of preventing the optical axis from being shaken when the optical device is moved up and down. [Technical means to solve the problem]

為了解決上述課題,本發明之光學裝置之安裝構造係特徵在於:例如具備具有筒狀部之光學裝置、供組裝上述光學裝置之框體、於上述光學裝置之組裝時設置於上述光學裝置與上述框體之間之大致呈薄板狀之導向構件、及設置於上述框體且使上述光學裝置沿鉛直方向移動之驅動部,其中上述框體形成有沿大致鉛直方向貫通之圓孔,上述導向構件為俯視時大致呈圓板形狀且以覆蓋上述圓孔之方式設置於上述框體,上述導向構件在大致中央處形成有安裝孔,上述安裝孔與上述圓孔呈大致同心圓狀配置,上述筒狀部係以光軸與上述安裝孔之中心大致一致之方式被插入至上述安裝孔中而固定於上述導向構件。In order to solve the above-mentioned problems, the installation structure of the optical device of the present invention is characterized by including, for example, an optical device having a cylindrical portion, a frame for assembling the optical device, and installing the optical device and the optical device when the optical device is assembled. A substantially thin plate-shaped guide member between the frame bodies and a driving portion provided in the frame body and moving the optical device in a vertical direction, wherein the frame body is formed with a circular hole penetrating in a substantially vertical direction, and the guide member The guide member has a substantially circular plate shape in plan view and is provided on the frame so as to cover the circular hole. The guide member is formed with a mounting hole at a substantially center. The mounting hole and the circular hole are arranged in a substantially concentric circle. The shape portion is inserted into the mounting hole so that the optical axis substantially coincides with the center of the mounting hole, and is fixed to the guide member.

根據本發明之光學裝置之安裝構造,於框體形成沿大致鉛直方向貫通之圓孔,為大致呈薄板狀且俯視時大致呈圓板形狀之導向構件係以覆蓋圓孔之方式設置於上述框體。形成於導向構件之大致中央處之安裝孔與圓孔呈大致同心圓狀配置,筒狀部係以光軸與上述安裝孔之中心大致一致之方式被插入至安裝孔中而固定於導向構件。藉由如此使導向構件平均地變形,可於使光學裝置上下移動時防止光軸之抖動、即不使光學裝置沿水平方向移動而使光學裝置沿上下方向移動。According to the installation structure of the optical device of the present invention, a circular hole penetrating in a substantially vertical direction is formed in the frame, and a guide member that is substantially thin plate-shaped and substantially circular plate-shaped in plan view is provided on the frame to cover the circular hole. body. The mounting hole and the circular hole formed at the approximate center of the guide member are arranged in a substantially concentric circle shape, and the cylindrical portion is inserted into the mounting hole so that the optical axis substantially coincides with the center of the mounting hole, and is fixed to the guide member. By uniformly deforming the guide member in this way, it is possible to prevent the optical axis from being shaken when the optical device is moved up and down, that is, to move the optical device in the vertical direction without moving the optical device in the horizontal direction.

於此,為上述框體具有大致水平地設置之底板、及大致水平地且設置於上述底板之上側的支持板,且於上述底板及上述支持板分別形成作為上述圓孔之第1圓孔及第2圓孔,於俯視時,上述第1圓孔之中心與上述第2圓孔之中心大致一致,於上述光學裝置被組裝至上述框體時,上述光學裝置之重心位於上述驅動部推升上述光學裝置之位置之附近亦可。藉此,驅動部於光學裝置之重心之附近推升光學裝置,可使光學裝置之上下移動變得穩定。Here, the frame has a bottom plate provided substantially horizontally, and a support plate provided substantially horizontally and on the upper side of the bottom plate, and a first circular hole and a first circular hole are formed on the bottom plate and the support plate, respectively. The second circular hole has, in a plan view, a center of the first circular hole and a center of the second circular hole. When the optical device is assembled into the frame, a center of gravity of the optical device is located at the driving portion and is pushed up. The vicinity of the position of the optical device may be used. Thereby, the driving part pushes up the optical device near the center of gravity of the optical device, so that the up and down movement of the optical device can be stabilized.

於此,為上述框體具有大致水平地設置之支持部、分別設置於上述支持部之兩端之柱、及使上述支持部沿鉛直方向移動之移動機構,且於上述支持部形成支持部側滑動面,於上述柱以與上述支持部側滑動面對向之方式形成柱側滑動面,上述支持部由磁性材料所形成,於上述柱設置具有永久磁石及電磁石之永電磁石,於上述移動機構不使上述支持部移動時,藉由向上述電磁石之線圈流入電流,而讓上述永電磁石吸附上述支持部,使上述支持部側滑動面與上述柱側滑動面密接亦可。藉此,藉由使支持部、即光學裝置整體沿鉛直方向移動,可不使光軸移動而使光學裝置上下移動。又,於不使支持部移動時,藉由使支持部側滑動面與柱側滑動面密接,可以支持部之高度方向之位置不變之方式藉由支持部側滑動面與柱側滑動面之間之摩擦來支承支持部。Here, the frame has a support portion provided substantially horizontally, pillars respectively provided at both ends of the support portion, and a moving mechanism for moving the support portion in a vertical direction, and a support portion side is formed on the support portion. A sliding surface forms a column-side sliding surface on the column so as to face the supporting portion-side sliding surface. The supporting portion is formed of a magnetic material. A permanent magnet with permanent magnets and electromagnets is provided on the column, and the moving mechanism is provided on the column. When the supporting portion is not moved, the permanent magnet may be caused to adsorb the supporting portion by flowing a current into the coil of the electromagnet, and the supporting portion-side sliding surface and the column-side sliding surface may be closely contacted. Accordingly, by moving the support portion, that is, the entire optical device in the vertical direction, the optical device can be moved up and down without moving the optical axis. In addition, when the support portion is not moved, the support portion side sliding surface and the column side sliding surface are closely contacted, so that the position of the support portion in the height direction can be maintained. Friction to support the support.

於此,為上述移動機構具有於與上述支持部之長度方向大致正交之端面沿著上下方向設置之齒條、及可旋轉地設置於上述柱之小齒輪,且於沿著上述支持部之長度方向觀察時,上述齒條之齒通過上述支持部之重心,且位於與上下方向大致平行之線上亦可。藉此,可於使支持部上下移動時不產生力矩。Here, the moving mechanism includes a rack provided along an up-down direction on an end surface substantially orthogonal to the length direction of the support portion, and a pinion gear rotatably provided on the post, and is disposed along the support portion. When viewed in the longitudinal direction, the teeth of the rack may pass through the center of gravity of the support portion and may be located on a line approximately parallel to the vertical direction. Thereby, no moment is generated when the support portion is moved up and down.

於此,為上述導向構件由厚度為大致0.1 mm左右之金屬所形成亦可。藉此,可製成容易變形且堅韌之導向構件。Here, the guide member may be formed of a metal having a thickness of approximately 0.1 mm. Thereby, a guide member which is easily deformed and tough can be manufactured.

於此,為於上述導向構件沿著圓周方向形成複數個環狀扇形狀之切除孔亦可。藉此,可使光學裝置沿旋轉方向移動。Here, a plurality of annular fan-shaped cutout holes may be formed in the guide member along the circumferential direction. Thereby, the optical device can be moved in the rotation direction.

於此,為上述導向構件由厚度為大致1 mm左右之金屬所形成,且於上述導向構件分別形成複數個大致呈圓弧形狀之第1切除孔及第2切除孔,上述第2切除孔配置於上述第1切除孔之外側,包括上述第1切除孔之端之端部區域、與包括上述第2切除孔之端之端部區域在圓周方向之位置大致一致亦可。藉此,即便使用厚度為大致1 mm左右之相對較厚之金屬板作為導向構件,亦可不取決於圓周方向之場所而使變形量大致固定。又,由於導向構件相對較厚,故而可降低導向構件超出彈性極限而塑性變形之可能性。Here, the guide member is formed of a metal having a thickness of about 1 mm, and a plurality of first cutout holes and second cutout holes each having a substantially circular arc shape are formed in the guide member, and the second cutout holes are arranged. The position of the end region including the end of the first cutout hole and the end region including the end of the second cutout hole in the circumferential direction may be substantially coincident with each other outside the first cutout hole. Thereby, even if a relatively thick metal plate having a thickness of about 1 mm is used as the guide member, the amount of deformation can be substantially fixed regardless of the location in the circumferential direction. In addition, since the guide member is relatively thick, the possibility of the guide member being plastically deformed beyond the elastic limit can be reduced.

於此,為上述導向構件具有大致沿著外周之大致呈環狀之第1厚壁部、及大致沿著上述安裝孔之大致呈環狀之第2厚壁部,上述導向構件與上述框體透過上述第1厚壁部固定,且上述導向構件與上述筒狀部透過上述第2厚壁部固定亦可。藉此,可防止導向構件之變形。Here, the guide member has a first thick-walled portion having a substantially annular shape substantially along an outer periphery, and a second thick-walled portion having a substantially annular shape substantially along the mounting hole, and the guide member and the frame body are provided. It may be fixed through the first thick wall portion, and the guide member and the tubular portion may be fixed through the second thick wall portion. Thereby, deformation of the guide member can be prevented.

於此,為上述光學裝置具有AF處理部,該AF處理部具有照射朝向下之光之AF用光源、及供反射光入射之AF感測器,於上述導向構件在通過上述安裝孔之中心之線上以隔著上述安裝孔之方式形成2個孔,且上述2個孔於俯視時與上述AF用光源及上述AF感測器之位置重疊亦可。藉此,即便於使用導向構件之情形時亦可進行光學裝置之AF處理。Here, the above-mentioned optical device has an AF processing section having an AF light source for radiating downward light and an AF sensor for reflected light to be incident on the center of the guide member passing through the mounting hole. Two holes are formed on the line through the mounting holes, and the two holes may overlap the positions of the AF light source and the AF sensor in a plan view. Thereby, the AF processing of the optical device can be performed even when a guide member is used.

於此,為上述光學裝置具有AF處理部,該AF處理部具有照射朝向下之光之AF用光源、及供反射光入射之AF感測器,且上述切除孔於俯視時與上述AF用光源及上述AF感測器之位置重疊亦可。藉此,即便於使用導向構件之情形時亦可進行光學裝置之AF處理。Here, the above-mentioned optical device has an AF processing unit having an AF light source for irradiating downward light and an AF sensor for reflected light to be incident, and the cutout hole and the AF light source are viewed in plan view. And the position of the AF sensor may overlap. Thereby, the AF processing of the optical device can be performed even when a guide member is used.

為了解決上述課題,本發明之曝光裝置係例如特徵在於:具備供載置工件之平板、具有筒狀部且向上述工件照射光之光照射部、供組裝上述光照射部並將上述光照射部保持於上述平板之上方之框體、於上述光照射部之組裝時設置於上述光照射部與上述框體之間之大致呈薄板狀之導向構件、及設置於上述框體且使上述光照射部沿鉛直方向移動之驅動部,且於上述框體形成沿大致呈鉛直方向貫通之圓孔,上述導向構件係以覆蓋上述圓孔之方式設置於上述框體,關於上述導向構件,為俯視時大致呈圓板形狀,且於中央部形成安裝孔,上述安裝孔與上述圓孔呈大致同心圓狀配置,上述筒狀部係以光軸與上述安裝孔之中心大致一致之方式被插入至上述安裝孔中而固定於上述導向構件。藉由如此使導向構件平均地變形,可於使光學裝置上下移動時防止光軸之抖動。 [發明之效果]In order to solve the above-mentioned problems, the exposure device of the present invention is characterized by, for example, including a flat plate on which a workpiece is placed, a light irradiation portion having a cylindrical portion and irradiating light to the workpiece, an assembly of the light irradiation portion, and the light irradiation portion. A frame held above the flat plate, a substantially thin plate-shaped guide member provided between the light irradiating portion and the frame during assembly of the light irradiating portion, and a light irradiating the light provided on the frame A driving part that moves in a vertical direction and forms a circular hole penetrating in the vertical direction in the frame. The guide member is provided in the frame so as to cover the circular hole. The guide member is a plan view. It has a substantially circular plate shape, and a mounting hole is formed in the central portion. The mounting hole and the circular hole are arranged in a substantially concentric circle. The cylindrical portion is inserted into the optical axis so that the optical axis substantially coincides with the center of the mounting hole. The mounting hole is fixed to the guide member. By uniformly deforming the guide member in this way, it is possible to prevent the optical axis from being shaken when the optical device is moved up and down. [Effect of the invention]

根據本發明,可於使光學裝置上下移動時防止光軸之抖動。According to the present invention, the optical axis can be prevented from being shaken when the optical device is moved up and down.

以下,以應用於一面使保持於大致水平方向之感光性基板(例如玻璃基板)沿掃描方向移動一面照射雷射等光而生成光罩之曝光裝置之實施形態為例,參照圖式對本發明進行詳細說明。於各圖式中,對同一要素標註同一符號,關於重複之部分省略說明。Hereinafter, the present invention will be described as an example of an embodiment of an exposure device that is applied to a photosensitive substrate (such as a glass substrate) that is held in a substantially horizontal direction while moving in the scanning direction to irradiate light such as laser light to generate a photomask. Detailed description. In each drawing, the same element is denoted by the same symbol, and description of the duplicated part is omitted.

作為感光性基板,例如使用熱膨脹率非常小(例如約5.5×10- 7 /K左右)之石英玻璃。藉由曝光裝置生成之光罩例如為用於製造液晶顯示裝置用基板之曝光用遮罩。光罩係一邊例如超過1 m(例如1400 mm×1220 mm)之大型之大致呈矩形形狀之基板上形成有1個或複數個圖像設備用轉印圖案者。以下,以包括加工前、加工中及加工後之感光性基板之概念使用遮罩M這一用語。As the photosensitive substrate, for example, thermal expansion coefficient is very small (e.g., about 5.5 × 10 - about 7 / K) of quartz glass. The photomask produced by the exposure device is, for example, a mask for exposure used for manufacturing a substrate for a liquid crystal display device. The photomask is one in which one or a plurality of image device transfer patterns are formed on a large, substantially rectangular substrate on one side, for example, more than 1 m (for example, 1400 mm × 1220 mm). Hereinafter, the term “mask M” is used in a concept including a photosensitive substrate before, during, and after processing.

但是,本發明之曝光裝置並不限於遮罩製造裝置。本發明之曝光裝置係包括一面使保持於大致水平方向之基板沿掃描方向移動一面照射光(包括雷射、UV、偏光光等)之各種裝置之概念。又,本發明之光學裝置並不限於向感光性基板照射光之光照射部。However, the exposure apparatus of the present invention is not limited to a mask manufacturing apparatus. The exposure device of the present invention is a concept including various devices that irradiate light (including laser, UV, polarized light, etc.) while moving a substrate held in a substantially horizontal direction in a scanning direction. The optical device of the present invention is not limited to a light irradiating portion that irradiates light onto a photosensitive substrate.

圖1係表示第1實施形態之曝光裝置1之概略之立體圖。曝光裝置1主要具有:壓盤11、板狀部12、軌道13、14、框體15、遮罩保持部20、光照射部30、測定部40(參照圖2)、雷射干涉儀50、及讀取部60。另外,於圖1中,省略了關於一部分構成之圖示。又,曝光裝置1係藉由覆蓋裝置整體之未圖示之溫度調整部而保持為固定溫度。FIG. 1 is a schematic perspective view showing an exposure apparatus 1 according to the first embodiment. The exposure device 1 mainly includes a platen 11, a plate-like portion 12, rails 13, 14, a frame 15, a mask holding portion 20, a light irradiating portion 30, a measuring portion 40 (see FIG. 2), a laser interferometer 50, And reading section 60. In addition, in FIG. 1, illustration of a part of the configuration is omitted. The exposure device 1 is maintained at a fixed temperature by a temperature adjustment unit (not shown) that covers the entire device.

壓盤11為大致呈長方體形狀(厚板狀)之構件,例如由岩石(例如花崗岩)或低膨脹率之鑄件(例如鎳系合金)所形成。壓盤11於上側(+z側)具有大致水平(與xy平面大致平行)之上表面11a。The pressure plate 11 is a member having a substantially rectangular parallelepiped shape (thick plate shape), and is formed of, for example, a rock (such as granite) or a low expansion coefficient casting (such as a nickel-based alloy). The platen 11 has an upper surface 11 a on the upper side (+ z side) which is substantially horizontal (substantially parallel to the xy plane).

壓盤11載置於設置面(例如地板)上所載置之複數個除振台(未圖示)上。藉此,壓盤11透過除振台載置於設置面上。除振台由於為已公知者,故而省略詳細之說明。另外,除振台並非必需。於壓盤11之+x側設置將遮罩M設置於遮罩保持部20之載入器(未圖示)。The pressure plate 11 is placed on a plurality of vibration isolation tables (not shown) placed on a setting surface (such as a floor). Thereby, the pressure plate 11 is placed on the installation surface through the vibration isolation table. Since the vibration isolator is already known, detailed description is omitted. In addition, a vibration isolator is not necessary. A loader (not shown) is provided on the + x side of the platen 11 to set the mask M to the mask holding portion 20.

軌道13為陶瓷製之細長之板狀之構件,且以長度方向沿著x方向之方式固定於壓盤11之上表面11a。3條軌道13之高度(z方向之位置)大致相同,且上表面以高精度及高平坦度形成。The rail 13 is an elongated plate-shaped member made of ceramics, and is fixed to the upper surface 11 a of the platen 11 so as to extend along the x direction in the longitudinal direction. The heights (positions in the z direction) of the three rails 13 are substantially the same, and the upper surfaces are formed with high accuracy and high flatness.

載入器側(+x側)之軌道13之端配置於上表面11a之端部,載入器相反側(-x側)之軌道13之端配置於較上表面11a之端部更靠近內側。The end of the track 13 on the loader side (+ x side) is arranged on the end of the upper surface 11a, and the end of the track 13 on the opposite side of the loader (-x side) is arranged closer to the inside than the end of the upper surface 11a .

板狀部12載置於軌道13上。板狀部12為陶瓷製之大致呈板狀之構件,且整體為大致呈矩形形狀。於板狀部12之下表面(-z側之面)以長度方向沿著x方向之方式設置導向部(未圖示)。藉此,限制板狀部12之移動方向,以使板狀部12不沿x方向以外之方向移動。The plate-like portion 12 is placed on the rail 13. The plate-shaped portion 12 is a substantially plate-shaped member made of ceramic, and has a substantially rectangular shape as a whole. A guide portion (not shown) is provided on the lower surface (the surface on the −z side) of the plate-like portion 12 along the x direction in the length direction. Thereby, the moving direction of the plate-shaped portion 12 is restricted so that the plate-shaped portion 12 does not move in a direction other than the x direction.

於板狀部12之上表面12a設置軌道14。軌道14係以長度方向沿著y方向之方式固定。軌道14之高度大致相同,且上表面以高精度及高平坦度形成。A rail 14 is provided on the upper surface 12 a of the plate-shaped portion 12. The rail 14 is fixed in such a manner that the longitudinal direction is along the y-direction. The heights of the rails 14 are substantially the same, and the upper surface is formed with high accuracy and flatness.

遮罩保持部20為俯視大致呈矩形形狀之大致板狀,且係使用熱膨脹係數為大致0.5~1×10-7 /K之低膨脹性陶瓷而形成。藉此,可防止遮罩保持部20之變形。另外,遮罩保持部20亦可使用熱膨脹係數為大致5×10-8 /K之超低膨脹性玻璃陶瓷而形成。於該情形時,即便產生無法控制之溫度變化,亦可確實地防止遮罩保持部20之變形。另外,亦可利用與遮罩M同樣地伸縮之材料形成遮罩保持部20。The mask holding portion 20 is a substantially plate shape having a substantially rectangular shape in plan view, and is formed using a low-expansion ceramic having a thermal expansion coefficient of approximately 0.5 to 1 × 10 -7 / K. Accordingly, deformation of the mask holding portion 20 can be prevented. The mask holding portion 20 may be formed using an ultra-low-expansion glass ceramic having a thermal expansion coefficient of approximately 5 × 10 -8 / K. In this case, even if an uncontrollable temperature change occurs, deformation of the mask holding portion 20 can be reliably prevented. In addition, the mask holding portion 20 may be formed of a material that expands and contracts similarly to the mask M.

遮罩保持部20載置於軌道14上。換言之,遮罩保持部20係透過板狀部12及軌道13、14設置於上表面11a。The mask holding portion 20 is placed on the rail 14. In other words, the mask holding portion 20 is provided on the upper surface 11 a through the plate-like portion 12 and the rails 13 and 14.

於遮罩保持部20之下表面以長度方向沿著y方向之方式設置導向部(未圖示)。藉此,以使遮罩保持部20、即板狀部12不會沿y方向以外之方向移動之方式,限制遮罩保持部20之移動方向。A guide portion (not shown) is provided on the lower surface of the mask holding portion 20 so that the longitudinal direction is along the y direction. Thereby, the moving direction of the mask holding part 20 is restricted so that the mask holding part 20, that is, the plate-shaped part 12 does not move in directions other than the y direction.

如此,遮罩保持部20(板狀部12)沿著軌道13以能夠沿x方向移動之方式設置,遮罩保持部20沿著軌道14以能夠沿y方向移動之方式設置。In this manner, the mask holding portion 20 (plate-like portion 12) is provided along the rail 13 so as to be movable in the x direction, and the mask holding portion 20 is provided along the rail 14 so as to be movable in the y direction.

遮罩保持部20具有大致呈水平之上表面20a。於上表面20a載置遮罩M(省略圖示)。又,於上表面20a設置棒鏡21、22、23(參照圖2)。The mask holding portion 20 has a substantially horizontal upper surface 20a. A mask M (not shown) is placed on the upper surface 20a. In addition, rod mirrors 21, 22, and 23 are provided on the upper surface 20a (see FIG. 2).

曝光裝置1具有未圖示之驅動部81、82(圖1中未圖示,參照圖13)。驅動部81、82例如為線性馬達。驅動部81使遮罩保持部20(板狀部12)沿著軌道13於x方向移動,驅動部82使遮罩保持部20沿著軌道14於y方向移動。關於驅動部81、82使板狀部12或遮罩保持部20移動之方法,可使用已公知之各種方法。The exposure apparatus 1 includes drive units 81 and 82 (not shown in FIG. 1, see FIG. 13). The driving sections 81 and 82 are linear motors, for example. The driving section 81 moves the mask holding section 20 (plate-like section 12) along the rail 13 in the x direction, and the driving section 82 moves the mask holding section 20 along the rail 14 in the y direction. As the method of moving the plate-shaped part 12 or the mask holding part 20 by the drive parts 81 and 82, various well-known methods can be used.

於壓盤11設置框體15。框體15例如使用低膨脹率之鑄件(例如鎳系合金)。框體15具有支持部15a、及於兩端支承支持部15a之2根柱15c。框體15於遮罩保持部20之上方(+z方向)保持光照射部30。於支持部15a安裝光照射部30。關於框體15,於後會詳細敍述。A frame 15 is provided on the platen 11. The frame 15 is made of, for example, a low-expansion casting (for example, a nickel-based alloy). The frame 15 includes a support portion 15a and two pillars 15c that support the support portion 15a at both ends. The frame body 15 holds the light irradiation section 30 above (+ z direction) the mask holding section 20. A light irradiation unit 30 is attached to the support unit 15a. The frame 15 will be described in detail later.

光照射部30向遮罩M照射光(於本實施形態中為雷射光)。光照射部30係沿著y方向以固定間隔(例如隔開大致200 mm)設置。於本實施形態中,具有共7個的光照射部30a、光照射部30b、光照射部30c、光照射部30d、光照射部30e、光照射部30f、光照射部30g。未圖示之驅動部係以光照射部30a~30g之焦點位置與遮罩M之上表面會合之方式,使光照射部30a~30g整體於10 mm左右之範圍內沿z方向移動。又,驅動部39(39a(參照圖6)~39g,於後會詳細敍述)係為了對光照射部30a~30g之焦點位置進行微調,而使光照射部30a~30g於30 μm(微米)左右之範圍內沿z方向移動。關於光照射部30,於後會詳細敍述。The light irradiating unit 30 irradiates light to the mask M (laser light in the present embodiment). The light irradiation sections 30 are provided at a fixed interval (for example, approximately 200 mm apart) along the y direction. In this embodiment, there are a total of seven light irradiation sections 30a, 30b, 30c, 30d, 30e, 30f, and 30g. The driving portion (not shown) moves the light irradiating portions 30a to 30g in the z direction as a whole within a range of about 10 mm so that the focal position of the light irradiating portions 30a to 30g meets the upper surface of the mask M. In addition, the driving unit 39 (39a (refer to FIG. 6) to 39g, which will be described later in detail) is for finely adjusting the focal position of the light irradiation unit 30a to 30g, so that the light irradiation unit 30a to 30g is 30 μm (micron) Move in the z direction within the left and right range. The light irradiation unit 30 will be described in detail later.

讀取部60讀取形成於遮罩M之圖案。讀取部60具有共7個的讀取部60a、讀取部60b、讀取部60c、讀取部60d、讀取部60e、讀取部60f、讀取部60g。讀取部60a~60g係以分別與光照射部30a~30g鄰接之方式設置於光照射部30a~30g。關於讀取部60,於後會詳細敍述。The reading section 60 reads a pattern formed on the mask M. The reading unit 60 includes a total of seven reading units 60a, 60b, 60c, 60d, 60e, 60f, and 60g. The reading sections 60a to 60g are provided on the light irradiation sections 30a to 30g so as to be adjacent to the light irradiation sections 30a to 30g, respectively. The reading section 60 will be described in detail later.

測定部40(圖1中省略圖示,參照圖2)例如為線性編碼器,測定遮罩保持部20之位置之雷射干涉儀50具有雷射干涉儀51、52(圖1中省略圖示,參照圖2)。於設置在框體15之-y側之柱設置雷射干涉儀51。又,於壓盤11之+x側之側面設置雷射干涉儀52(圖1中省略圖示)。The measurement unit 40 (illustration omitted in FIG. 1, see FIG. 2) is, for example, a linear encoder. The laser interferometer 50 for measuring the position of the mask holding unit 20 includes laser interferometers 51 and 52 (illustration omitted in FIG. 1). Refer to Figure 2). A laser interferometer 51 is provided on a pillar provided on the -y side of the frame 15. A laser interferometer 52 (not shown in FIG. 1) is provided on a side surface on the + x side of the platen 11.

圖2係表示測定部40及雷射干涉儀50對遮罩保持部20之位置進行測定之狀況的概略圖。另外,於圖2中,僅圖示了軌道13、14之一部分。又,於圖2中,僅圖示光照射部30a、30g,關於光照射部30b~30f,省略圖示。FIG. 2 is a schematic diagram showing a state where the measurement unit 40 and the laser interferometer 50 measure the position of the mask holding unit 20. In addition, in FIG. 2, only a part of the tracks 13 and 14 is shown. In FIG. 2, only the light irradiation sections 30 a and 30 g are shown, and the light irradiation sections 30 b to 30 f are not shown.

測定部40具有位置測定部41、42。位置測定部41、42分別具有游標尺41a、42a、及檢測頭41b、42b。The measurement section 40 includes position measurement sections 41 and 42. The position measuring units 41 and 42 include verniers 41a and 42a and detection heads 41b and 42b, respectively.

游標尺41a設置於+y側之軌道13之+y側之端面及-y側之軌道13之-y側之端面。檢測頭41b設置於板狀部12(圖2中省略圖示)之+y側及-y側之端面。於圖2中,省略關於+y側之游標尺41a及檢測頭41b之圖示。The vernier 41a is provided on the + y-side end surface of the + y-side track 13 and the -y-side end surface of the -y-side track 13. The detection head 41b is provided on the + y-side and -y-side end faces of the plate-like portion 12 (not shown in FIG. 2). In FIG. 2, illustrations of the vernier 41 a and the detection head 41 b on the + y side are omitted.

游標尺42a設置於+x側之軌道14之+x側之端面及-x側之軌道13之-x側之端面。檢測頭42b設置於遮罩保持部20之+x側及-x側之端面。於圖2中,省略關於-x側之游標尺42a及檢測頭42b之圖示。The vernier 42a is provided on the + x-side end surface of the + x-side track 14 and the -x-side end surface of the -x-side track 13. The detection head 42 b is provided on the end faces on the + x side and the −x side of the mask holding portion 20. In FIG. 2, the illustration of the vernier 42 a and the detection head 42 b on the −x side is omitted.

游標尺41a、42a例如為雷射全息游標尺,且以0.512 nm(奈米)間距形成有記憶體。檢測頭41b、42b係照射光(例如雷射光),並獲取被游標尺41a、42a反射之光,將藉此所產生之訊號分為512等分而獲得1 nm,將藉此所產生之訊號分為5120等分而獲得0.1 nm。位置測定部41、42為已公知者,因此省略詳細之說明。The vernier scales 41a and 42a are, for example, laser holographic vernier scales, and a memory is formed at a pitch of 0.512 nm (nanometer). The detection heads 41b and 42b are irradiated light (such as laser light) and obtain the light reflected by the vernier scales 41a and 42a. The signal generated by this is divided into 512 equal parts to obtain 1 nm, and the signal generated by this Divide into 5120 equal parts to obtain 0.1 nm. Since the position measuring units 41 and 42 are known, detailed descriptions are omitted.

於光照射部30a設置具有與xz平面大致平行之反射面之反射鏡55a。於光照射部30g設置具有與xz平面大致平行之反射面之反射鏡55b、55c。反射鏡55a、55b、55c係以x方向之位置不重疊之方式設置。The light irradiating portion 30a is provided with a reflecting mirror 55a having a reflecting surface substantially parallel to the xz plane. Mirrors 55b and 55c having a reflecting surface substantially parallel to the xz plane are provided on the light irradiating portion 30g. The reflecting mirrors 55a, 55b, and 55c are provided so that positions in the x direction do not overlap.

於光照射部30a設置具有與yz平面大致平行之反射面之反射鏡56a。於光照射部30g設置具有與yz平面大致平行之反射面之反射鏡56g。The light irradiating portion 30a is provided with a reflecting mirror 56a having a reflecting surface substantially parallel to the yz plane. A reflecting mirror 56g having a reflecting surface substantially parallel to the yz plane is provided on the light irradiating portion 30g.

雷射干涉儀51、52照射4束雷射光。雷射干涉儀51具有雷射干涉儀51a、51b、51c。雷射干涉儀52具有雷射干涉儀52a、52g。The laser interferometers 51 and 52 irradiate four laser beams. The laser interferometer 51 includes laser interferometers 51a, 51b, and 51c. The laser interferometer 52 includes laser interferometers 52a and 52g.

於圖2中,以2點鏈線表示雷射光之路徑。自雷射干涉儀51a、51b、51c照射之光中之2束被棒鏡23反射,而該反射光被雷射干涉儀51a、51b、51c接收。In FIG. 2, the path of the laser light is indicated by a two-dot chain line. Two of the lights irradiated from the laser interferometers 51a, 51b, and 51c are reflected by the rod mirror 23, and the reflected light is received by the laser interferometers 51a, 51b, and 51c.

自雷射干涉儀51a照射之光中之剩餘2束被反射鏡55a反射,而該反射光被雷射干涉儀51a接收。自雷射干涉儀51b照射之光中之剩餘2束被反射鏡55b反射,而該反射光被雷射干涉儀51b接收。自雷射干涉儀51c照射之光中之剩餘2束被反射鏡55c反射,而該反射光被雷射干涉儀51c接收。The remaining two beams of the light irradiated from the laser interferometer 51a are reflected by the mirror 55a, and the reflected light is received by the laser interferometer 51a. The remaining two beams of the light irradiated from the laser interferometer 51b are reflected by the mirror 55b, and the reflected light is received by the laser interferometer 51b. The remaining two beams of the light irradiated from the laser interferometer 51c are reflected by the mirror 55c, and the reflected light is received by the laser interferometer 51c.

雷射干涉儀51a~51c係藉由分別以反射鏡55a~35c之位置為基準測定棒鏡23之位置,而測定光照射部30a、30g與遮罩保持部20在y方向之位置關係。The laser interferometers 51a to 51c measure the position of the rod mirror 23 with the positions of the mirrors 55a to 35c as reference, and measure the positional relationship between the light irradiating portions 30a and 30g and the mask holding portion 20 in the y direction.

自雷射干涉儀52a照射之光中之2束被棒鏡22反射,而該反射光被雷射干涉儀52a接收。自雷射干涉儀52g照射之光中之2束被棒鏡21反射,而該反射光被雷射干涉儀52g接收。Two of the lights irradiated from the laser interferometer 52a are reflected by the rod mirror 22, and the reflected light is received by the laser interferometer 52a. Two of the lights irradiated from the laser interferometer 52g are reflected by the rod mirror 21, and the reflected light is received by the laser interferometer 52g.

自雷射干涉儀52a照射之光中之剩餘2束被反射鏡56a反射,而該反射光被雷射干涉儀52a接收。自雷射干涉儀52g照射之光中之剩餘2束被反射鏡56g反射,而該反射光被雷射干涉儀52g接收。The remaining two beams of the light irradiated from the laser interferometer 52a are reflected by the mirror 56a, and the reflected light is received by the laser interferometer 52a. The remaining 2 beams of the light irradiated from the laser interferometer 52g are reflected by the reflecting mirror 56g, and the reflected light is received by the laser interferometer 52g.

雷射干涉儀52a、52g係藉由分別以反射鏡56a、56g之位置為基準測定棒鏡21、22之位置,而測定光照射部30a~30g與遮罩保持部20在x方向之位置關係。The laser interferometers 52a and 52g measure the positions of the rod mirrors 21 and 22 with the positions of the mirrors 56a and 56g as reference, respectively, and measure the positional relationship between the light irradiating portions 30a to 30g and the mask holding portion 20 in the x direction .

於本實施形態中,於光照射部30b~30f未設置反射鏡,亦未設置測定該反射鏡之位置之雷射干涉儀。其原因在於:使光照射部30a~30g於30 μm左右之範圍內沿z方向移動時之光軸之抖動小至幾nm以下(於後會詳細敍述),可基於光照射部30a、30g之位置藉由內插而求出光照射部30b~30f之位置。藉此,可使裝置小型化,且可降低成本。In this embodiment, no reflection mirror is provided on the light irradiation sections 30b to 30f, and no laser interferometer for measuring the position of the reflection mirror is provided. The reason is that the jitter of the optical axis when the light irradiating sections 30a to 30g are moved in the z direction within a range of about 30 μm is as small as a few nm or less (which will be described in detail later). The positions are obtained by interpolation to obtain the positions of the light irradiating sections 30b to 30f. Thereby, the device can be miniaturized and the cost can be reduced.

其次,對框體15進行說明。圖3、4係表示框體15之支持部15a之概略之立體圖。圖3係自背面側(-x側)觀察之圖,圖4係自正面側(+x側)觀察之圖。圖3、4係為了說明而將支持部15a與柱15c稍微分離圖示,但實際上支持部15a與柱15c鄰接。Next, the housing 15 will be described. 3 and 4 are perspective views showing the outline of the supporting portion 15a of the frame body 15. Fig. 3 is a diagram viewed from the back side (-x side), and Fig. 4 is a diagram viewed from the front side (+ x side). 3 and 4 show the support portion 15a and the column 15c slightly apart for illustration, but the support portion 15a and the column 15c are actually adjacent to each other.

支持部15a係剖面形狀為大致呈矩形形狀之大致棒狀,內部成為空腔。支持部15a係以長度方向沿著y方向之方式設置。支持部15a主要具有:底板151、支持板153、設置於底板151及支持板153之兩側之側板152、154、及間隔壁159。底板151及支持板153大致水平地設置,側板152、154大致鉛直地設置。The support portion 15a has a substantially rod-like shape in cross-section, and has an internal cavity. The support part 15a is provided so that the longitudinal direction may be along the y direction. The support portion 15 a mainly includes a bottom plate 151, a support plate 153, side plates 152 and 154 provided on both sides of the bottom plate 151 and the support plate 153, and a partition wall 159. The bottom plate 151 and the support plate 153 are provided substantially horizontally, and the side plates 152 and 154 are provided substantially vertically.

於本實施形態中,底板151、支持板153及側板152、154之板厚為大致15 mm~20 mm,底板151、支持板153及側板152、154在y方向之長度(圖9中之W1)為大致2.2 m。In this embodiment, the thickness of the bottom plate 151, the support plate 153, and the side plates 152, 154 is approximately 15 mm to 20 mm. The length of the bottom plate 151, the support plate 153, and the side plates 152, 154 in the y direction (W1 in FIG. 9). ) Is approximately 2.2 m.

於底板151及支持板153分別沿著y方向形成圓孔155a~155g、156a~156g。圓孔155a~155g、156a~156g係分別沿大致鉛直方向貫通底板151及支持板153之孔,且為俯視時大致呈圓形。於俯視時,圓孔155a~155g之中心之位置、與圓孔156a~156g之中心之位置大致一致。Circular holes 155a-155g and 156a-156g are formed in the bottom plate 151 and the support plate 153 along the y direction, respectively. The circular holes 155a to 155g and 156a to 156g are holes that pass through the bottom plate 151 and the support plate 153 in a substantially vertical direction, respectively, and are substantially circular in plan view. In a plan view, the position of the center of the circular holes 155a to 155g is substantially the same as the position of the center of the circular holes 156a to 156g.

於圓孔155a~155g、156a~156g分別透過以覆蓋圓孔155a~155g、156a~156g之方式設置之導向構件70、70A(於後會詳細敍述)安裝光照射部30a~30g。關於將光照射部30a~30g安裝於框體15之安裝構造,於後會詳細敍述。Light irradiating sections 30a to 30g are mounted on the circular holes 155a to 155g and 156a to 156g through guide members 70 and 70A (described later in detail) provided to cover the circular holes 155a to 155g and 156a to 156g, respectively. The mounting structure for mounting the light irradiating portions 30a to 30g on the frame 15 will be described in detail later.

又,於底板151以與圓孔155a~155g鄰接之方式形成圓孔157a~157g。於圓孔157a~157g中插入讀取部60之鏡筒601(於後會詳細敍述)。Further, circular holes 157a to 157g are formed on the bottom plate 151 so as to be adjacent to the circular holes 155a to 155g. The lens barrel 601 of the reading section 60 is inserted into the circular holes 157a to 157g (described in detail later).

於側板152、154分別形成孔152a~152i、154a~154i。孔152a~152g、154a~154g係以分別與圓孔155a~155g、156a~156g在y方向的位置重疊之方式設置。孔152a~152g、154a~154g用於向圓孔157a~157g安裝讀取部60。孔152h、152i分別設置於孔152a~152g之兩側,孔154h、154i分別設置於圓孔154a~154g之兩側。框體15為鑄件,孔152a~152i、154a~154i係作為於鑄造時將鑄砂排出而形成內部空間之鑄衝孔而被利用。Holes 152a-152i and 154a-154i are formed in the side plates 152 and 154, respectively. The holes 152a to 152g and 154a to 154g are provided so as to overlap the positions of the circular holes 155a to 155g and 156a to 156g in the y direction, respectively. The holes 152a to 152g and 154a to 154g are used to mount the reading section 60 to the circular holes 157a to 157g. The holes 152h and 152i are respectively provided on both sides of the holes 152a to 152g, and the holes 154h and 154i are respectively provided on both sides of the round holes 154a to 154g. The frame 15 is a casting, and the holes 152a to 152i and 154a to 154i are used as casting punches that discharge the foundry sand to form an internal space during casting.

支持部15a之內部為空腔,但作為補強而於支持部15a之內部設置間隔壁159。間隔壁159為板狀之構件,且端面與底板151、支持板153及側板152、154抵接。藉此,於設置有間隔壁159之位置,支持部15a之內部之空腔消失,而防止支持部15a之振動或變形(撓曲、扭曲等)。The inside of the support portion 15a is a cavity, but a partition wall 159 is provided inside the support portion 15a as a reinforcement. The partition wall 159 is a plate-shaped member, and an end surface thereof comes into contact with the bottom plate 151, the support plate 153, and the side plates 152 and 154. Thereby, at the position where the partition wall 159 is provided, the cavity inside the support portion 15a disappears, and vibration or deformation (deflection, distortion, etc.) of the support portion 15a is prevented.

框體15具有使支持部15a沿著柱15c於z方向移動之移動機構161。移動機構161使支持部15a沿z方向於10 mm左右之範圍內移動。本實施形態之移動機構161具有於與支持部15a之長度方向大致正交之端面上沿著z方向設置之齒條161a、及可旋轉地設置於柱15c之小齒輪161b。齒條161a係對自支持部15a之側面向外側突出之凸部158使用螺絲等(省略圖示)而固定。The frame 15 includes a moving mechanism 161 that moves the support portion 15a along the column 15c in the z direction. The moving mechanism 161 moves the support portion 15a in the z direction within a range of about 10 mm. The moving mechanism 161 of this embodiment includes a rack 161a provided along the z-direction on an end surface substantially orthogonal to the longitudinal direction of the support portion 15a, and a pinion 161b rotatably provided on the column 15c. The rack 161a is fixed to the convex part 158 which protrudes outward from the side surface of the support part 15a using a screw etc. (not shown).

又,框體15具有設置於柱15c之2個永電磁石163。2個永電磁石163配置於支持部15a之長度方向之兩端附近。永電磁石163係具有永久磁石及電磁石之永電磁式,僅於裝卸時向電磁石之線圈中流入電流,進行內置之永久磁石之打開-關閉(ON-OFF)。框體15所使用之低膨脹合金為磁性材料,因此可藉由永電磁石163進行移動。永電磁石163於打開-關閉(ON-OFF)時只要僅通電短時間(例如為0.2秒左右)即可,因此幾乎無發熱。又,永電磁石163之永久磁石被打開(ON)後之磁力固定且不變。The frame 15 includes two permanent magnets 163 provided on the column 15c. The two permanent magnets 163 are arranged near both ends in the longitudinal direction of the support portion 15a. Permanent magnet 163 is a permanent magnet with permanent magnets and electromagnets. Only when loading and unloading current flows into the coil of the electromagnet, the built-in permanent magnet is turned on-off. The low-expansion alloy used in the frame 15 is a magnetic material, so it can be moved by the permanent magnet 163. The permanent magnet 163 only needs to be energized for a short time (for example, about 0.2 seconds) when it is turned on and off, and therefore has almost no heat generation. In addition, the permanent magnet of the permanent magnet 163 is fixed and unchanged after being turned on.

圖5係表示沿圖3之面C將框體15切斷時之概略之圖。於柱15c形成有凸部161c。凸部161c之+x側之面為滑動面161d,被實施減少摩擦阻力之研磨加工即刮擦(scraping)處理。FIG. 5 is a diagram schematically illustrating a case where the frame body 15 is cut along the plane C of FIG. 3. A convex portion 161c is formed on the pillar 15c. The surface on the + x side of the convex portion 161c is a sliding surface 161d, and is subjected to a scraping process that is a grinding process that reduces frictional resistance.

支持部15a之-x側之面為滑動面161e。對於滑動面161e,與滑動面161d同樣地被實施刮擦處理。於滑動面161e與滑動面161d之間,藉由滯留於滑動面161d、161e之微小之凹凸間之潤滑油而具有幾μm左右之油膜。The surface on the -x side of the support portion 15a is a sliding surface 161e. The sliding surface 161e is subjected to a scraping treatment in the same manner as the sliding surface 161d. Between the sliding surface 161e and the sliding surface 161d, an oil film having a thickness of about several μm is provided by the lubricating oil retained between the minute irregularities of the sliding surfaces 161d and 161e.

藉由使設置於柱15c之小齒輪161b旋轉,而固定有齒條161a之支持部15a上下移動。於移動機構161使支持部15a上下移動時,藉由滑動面161d與滑動面161e之間所形成之油膜,而滑動面161d與滑動面161e順暢地滑動。By rotating the pinion 161b provided in the column 15c, the support portion 15a to which the rack 161a is fixed moves up and down. When the moving mechanism 161 moves the support portion 15a up and down, the sliding surface 161d and the sliding surface 161e slide smoothly by the oil film formed between the sliding surface 161d and the sliding surface 161e.

於沿著y方向觀察時,齒條161a之齒位於支持部15a之x方向上之中心線c上。換言之,齒條161a之齒通過支持部15a之重心,且位於與z方向大致平行之線上。因此,於小齒輪161b旋轉而使齒條161a(支持部15a)上下移動時不會產生力矩。When viewed in the y direction, the teeth of the rack 161a are located on the center line c in the x direction of the support portion 15a. In other words, the teeth of the rack 161a pass through the center of gravity of the support portion 15a and are located on a line approximately parallel to the z-direction. Therefore, no torque is generated when the pinion 161b is rotated to move the rack 161a (supporting portion 15a) up and down.

如圖3、4所示般,於未設置有齒條161a及小齒輪161b之側之柱15c,亦形成實施了刮擦處理之滑動面161d。並且,以與該滑動面抵接之方式,於支持部15a形成實施了刮擦處理之滑動面161e(參照圖5)。As shown in Figs. 3 and 4, a sliding surface 161d is also formed on the post 15c on the side where the rack 161a and the pinion 161b are not provided. In addition, a sliding surface 161e (see FIG. 5) subjected to a scratching process is formed on the support portion 15a so as to be in contact with the sliding surface.

於支持部15a之端沿著柱15c設置有彈性構件160。於圖3、4中,僅對設置於-y側之端之彈性構件160進行表示,關於設置於+y側之端之彈性構件160省略了圖示。如圖5所示般,彈性構件160設置於支持部15a之下側。於彈性構件160與支持部15a之間設置定位構件162。藉由將彈性構件160插入至形成於定位構件162之底面之凹部162a中,而決定彈性構件160之xy方向之位置,伴隨著支持部15a之上下移動而彈性構件160可進行伸縮。如此,設置於支持部15a之兩端之彈性構件160支承支持部15a之重量。支持部15a為大致660 kg~700 kg,彈性構件160可支承大致600 kg之重量。An elastic member 160 is provided at the end of the support portion 15a along the column 15c. In FIGS. 3 and 4, only the elastic member 160 provided at the end on the −y side is shown, and the illustration of the elastic member 160 provided on the end on the + y side is omitted. As shown in FIG. 5, the elastic member 160 is provided below the support portion 15 a. A positioning member 162 is provided between the elastic member 160 and the support portion 15a. By inserting the elastic member 160 into the recessed portion 162a formed on the bottom surface of the positioning member 162, the position in the xy direction of the elastic member 160 is determined, and the elastic member 160 can expand and contract as the support portion 15a moves up and down. In this way, the elastic members 160 provided at both ends of the support portion 15a support the weight of the support portion 15a. The support portion 15a is approximately 660 kg to 700 kg, and the elastic member 160 can support a weight of approximately 600 kg.

彈性構件160所無法支承之支持部15a之重量係藉由滑動面161d與滑動面161e之間之摩擦而支承。永電磁石163設置於柱15c,藉由向電磁石之線圈中流入電流而吸附支持部15a。於移動機構161不沿著柱15c使支持部15a上下移動時,永電磁石163吸附支持部15a,藉此支持部15a、即齒條161a及滑動面161e向圖5左方向(參照圖5之箭頭)移動,而滑動面161d與滑動面161e密接。藉由強力地壓縮滑動面161d與滑動面161e,而排除滑動面161d與滑動面161e之間所形成之油膜。其結果為,滑動面161d與滑動面161e之間產生摩擦。The weight of the support portion 15a that cannot be supported by the elastic member 160 is supported by friction between the sliding surface 161d and the sliding surface 161e. The permanent magnet 163 is provided in the column 15c, and attracts the support portion 15a by flowing a current into the coil of the electromagnet. When the moving mechanism 161 does not move the supporting portion 15a up and down along the column 15c, the permanent magnet 163 attracts the supporting portion 15a, whereby the supporting portion 15a, that is, the rack 161a and the sliding surface 161e, are directed to the left in FIG. 5 (refer to the arrow in FIG. 5) ), And the sliding surface 161d is in close contact with the sliding surface 161e. By strongly compressing the sliding surface 161d and the sliding surface 161e, the oil film formed between the sliding surface 161d and the sliding surface 161e is eliminated. As a result, friction occurs between the sliding surface 161d and the sliding surface 161e.

排除了油膜時之滑動面161d與滑動面161e之摩擦係數為0.1~0.2,若永電磁石163之吸附力為1500 kg,則藉由滑動面161d與滑動面161e之間之摩擦而支承150 kg之重量。滑動面於支持部15a之兩側存在2個部位,因此彈性構件所160無法支承之支持部15a之重量ta(大致60 kg~100 kg)可藉由摩擦力支承。如此,於移動機構161不使支持部15a上下移動時,可以支持部15a之高度方向之位置不變之方式支承支持部15a。When the oil film is excluded, the friction coefficient between the sliding surface 161d and the sliding surface 161e is 0.1 to 0.2. If the adsorption force of the permanent magnet 163 is 1500 kg, the friction between the sliding surface 161d and the sliding surface 161e supports 150 kg. weight. There are two parts of the sliding surface on both sides of the support portion 15a, so the weight ta (approximately 60 kg to 100 kg) of the support portion 15a that cannot be supported by the elastic member 160 can be supported by friction. In this way, when the moving mechanism 161 does not move the supporting portion 15a up and down, the supporting portion 15a can be supported so that the position in the height direction of the supporting portion 15a does not change.

另外,於永電磁石163未吸附支持部15a時,齒條161a與小齒輪161b可利用嚙合使齒條161a、即固定有齒條161a之支持部15a及形成於支持部15a之滑動面161e向圖5左方向移動。彈性構件160所無法支承之支持部15a之重量ta自齒條161a傳向小齒輪161b,藉由齒條161a及小齒輪161b之壓力角為20度,而小齒輪161b以重量ta×cos20°之力推升齒條161a即支持部15a,並以重量ta×sin20°之力將齒條161a即滑動面161e壓抵於滑動面161d。In addition, when the permanent magnet 163 does not attract the support portion 15a, the rack 161a and the pinion 161b can be meshed to make the rack 161a, that is, the support portion 15a to which the rack 161a is fixed and the sliding surface 161e formed on the support portion 15a to the figure. 5Move to the left. The weight ta of the support portion 15a that cannot be supported by the elastic member 160 is transmitted from the rack 161a to the pinion 161b. The pressure angle of the rack 161a and the pinion 161b is 20 degrees, and the pinion 161b is ta × cos20 ° in weight. The rack portion 161a, that is, the supporting portion 15a is pushed up, and the rack surface 161a, that is, the sliding surface 161e, is pressed against the sliding surface 161d by a force of ta × sin 20 °.

其次,對光照射部30進行說明。圖6係表示光照射部30a之概略之主要部分透視圖。光照射部30a主要具有:DMD31a、物鏡32a、光源部33a、AF處理部34a、筒狀部35a、凸緣36a、安裝部37a、38a、及驅動部39a。光照射部30b~光照射部30g分別具有DMD31b~31g、物鏡32b~32g、光源部33b~33g、AF處理部34b~34g、筒狀部35b~35g、凸緣36b~36g、安裝部37b~37g、38b~38g、及驅動部39b~39g。光照射部30b~光照射部30g由於為與光照射部30a相同之構成,故而省略說明。Next, the light irradiation unit 30 will be described. FIG. 6 is a perspective view of a main part showing the outline of the light irradiation section 30a. The light irradiation section 30a mainly includes a DMD 31a, an objective lens 32a, a light source section 33a, an AF processing section 34a, a cylindrical portion 35a, a flange 36a, mounting portions 37a, 38a, and a driving portion 39a. The light irradiating part 30b ~ 30g has DMD31b ~ 31g, objective lens 32b ~ 32g, light source part 33b ~ 33g, AF processing part 34b ~ 34g, cylindrical part 35b ~ 35g, flange 36b ~ 36g, mounting part 37b ~ 37g, 38b ~ 38g, and driving parts 39b ~ 39g. Since the light irradiating portion 30b to 30g have the same configuration as the light irradiating portion 30a, description thereof is omitted.

DMD31a為數位微鏡裝置(Digital Mirror Device,DMD),能夠照射面狀之雷射光。DMD31a具有多片可動式微鏡(省略圖示),自1片微鏡照射1像素量之光。微鏡之大小為大致10 μm,且該微鏡呈二維狀配置。自光源部33a(於後會詳細敍述)對DMD31a照射光,光被各微鏡反射。微鏡可以與其對角線大致平行之軸為中心進行旋轉,而可進行打開(ON)(向遮罩M反射光)與關閉(OFF)(不向遮罩M反射光)之切換。DMD31a為已公知者,因此省略詳細之說明。DMD31a is a digital micromirror device (DMD), which can illuminate planar laser light. The DMD31a includes a plurality of movable micromirrors (not shown), and one pixel of light is irradiated from one micromirror. The size of the micromirror is approximately 10 μm, and the micromirror is arranged in a two-dimensional shape. The DMD 31a is irradiated with light from the light source section 33a (to be described in detail later), and the light is reflected by each micromirror. The micromirror can rotate around an axis substantially parallel to its diagonal line, and can switch between ON (reflecting light to the mask M) and OFF (not reflecting light to the mask M). Since DMD31a is known, detailed description is omitted.

物鏡32a使被DMD31a之各微鏡反射之雷射光成像於遮罩M之表面。於描繪時,分別自光照射部30a~光照射部30g照射光,該光於遮罩M上成像,藉此於遮罩M描繪圖案。The objective lens 32 a images the laser light reflected by each micromirror of the DMD 31 a on the surface of the mask M. At the time of drawing, light is irradiated from the light irradiation portion 30a to the light irradiation portion 30g, respectively, and this light forms an image on the mask M, thereby drawing a pattern on the mask M.

光源部33a主要具有:光源331、透鏡332、複眼透鏡333、透鏡334、335、及反射鏡336。光源331例如為雷射二極體,自光源331出射之光透過光纖等被引導至透鏡332。The light source section 33 a mainly includes a light source 331, a lens 332, a fly-eye lens 333, lenses 334, 335, and a mirror 336. The light source 331 is, for example, a laser diode, and light emitted from the light source 331 is guided to the lens 332 through an optical fiber or the like.

光自透鏡332被引導至複眼透鏡333。複眼透鏡333係將複數片透鏡(未圖示)二維狀地配置而成者,於複眼透鏡333中製作大量點光源。通過複眼透鏡333之光通過透鏡334、335(例如聚光透鏡)成為平行光,被反射鏡336朝向DMD31a反射。Light is guided from the lens 332 to the fly-eye lens 333. The fly-eye lens 333 is a two-dimensional arrangement of a plurality of lenses (not shown), and a large number of point light sources are produced in the fly-eye lens 333. The light passing through the fly-eye lens 333 becomes parallel light through the lenses 334 and 335 (for example, a condenser lens), and is reflected by the mirror 336 toward the DMD 31 a.

AF處理部34a係將向遮罩M照射之光之焦點聚集於遮罩M者,主要具有:AF用光源341、準直透鏡342、AF用柱面透鏡343、五稜鏡344、345、透鏡346、及AF感測器347、348。自AF用光源341照射之光透過準直透鏡342成為平行光,透過AF用柱面透鏡343成為線狀之光,被五稜鏡344反射而成像於遮罩M之表面。於遮罩M處反射之光被五稜鏡345反射,被透鏡346聚光,並入射至AF感測器347、348。五稜鏡344、345以大致97度之彎曲角度使光彎曲。另外,亦可使用反射鏡代替五稜鏡344、345,但因反射鏡之角度偏差會引起焦點模糊,因此較理想為使用五稜鏡。AF處理部34a基於被AF感測器347、348接收光之結果進行求出聚焦位置之自動調焦處理。另外,此種光槓桿式(optical lever type)之自動調焦處理為已公知者,因此省略詳細之說明。The AF processing unit 34a gathers the focus of the light irradiated onto the mask M on the mask M, and mainly includes: an AF light source 341, a collimating lens 342, an AF cylindrical lens 343, a five lens 344, 345 and a lens 346 , And AF sensors 347, 348. The light irradiated from the AF light source 341 passes through the collimating lens 342 to become parallel light, passes through the AF cylindrical lens 343 to become linear light, is reflected by the lens 344, and is imaged on the surface of the mask M. The light reflected at the mask M is reflected by the five lenses 345, condensed by the lens 346, and incident on the AF sensors 347, 348. The five beams 344, 345 bend the light at a bending angle of approximately 97 degrees. In addition, mirrors can be used in place of the Mayan 344, 345, but the focus deviation is caused by the angular deviation of the reflector, so it is ideal to use Mayan. The AF processing unit 34a performs an auto-focusing process for determining a focus position based on a result of light received by the AF sensors 347 and 348. In addition, such an optical lever type (automatic focus type) automatic focusing process is known, so detailed description is omitted.

光照射部30a具有內部設置有光學系統(包括物鏡32a)之大致呈圓筒形狀之筒狀部35a。於筒狀部35a之上側之端設置凸緣36a。凸緣36a於上側保持透鏡332、複眼透鏡333及透鏡334、335。因此,光照射部30a之重心自光軸ax向圖6中之左方向偏離。The light irradiating portion 30 a includes a cylindrical portion 35 a having a substantially cylindrical shape in which an optical system (including the objective lens 32 a) is provided. A flange 36a is provided at an end on the upper side of the cylindrical portion 35a. The flange 36 a holds the lens 332, the fly-eye lens 333, and the lenses 334 and 335 on the upper side. Therefore, the center of gravity of the light irradiation portion 30a is shifted from the optical axis ax to the left direction in FIG. 6.

又,於筒狀部35a設置安裝部37a、38a。安裝部37a、38a用於向框體15安裝。安裝部37a設置於凸緣36a之附近,安裝部38a設置於筒狀部35a之下端附近。於安裝部37a形成具有較安裝部38a之外徑大之直徑之中空部372。藉此,筒狀部35a可向上方拉抽。另外,於圖6中,省略了形成於安裝部37a、38a之螺絲孔371、381(於後會詳細敍述)之圖示。Further, mounting portions 37a and 38a are provided on the cylindrical portion 35a. The mounting portions 37 a and 38 a are used for mounting to the frame body 15. The mounting portion 37a is provided near the flange 36a, and the mounting portion 38a is provided near the lower end of the cylindrical portion 35a. A hollow portion 372 having a larger diameter than the outer diameter of the mounting portion 38a is formed in the mounting portion 37a. Thereby, the cylindrical portion 35a can be pulled upward. In addition, in FIG. 6, illustrations of the screw holes 371 and 381 (described later in detail) formed in the mounting portions 37 a and 38 a are omitted.

安裝部37a(即光照射部30a)係藉由驅動部39a沿鉛直方向(z方向)移動。圖7係表示驅動部39a之概略之側視圖。驅動部39a主要具有壓電元件391、及連結部392。The mounting portion 37a (ie, the light irradiation portion 30a) is moved in the vertical direction (z direction) by the driving portion 39a. FIG. 7 is a side view schematically showing the driving unit 39a. The driving portion 39 a mainly includes a piezoelectric element 391 and a connection portion 392.

壓電元件391係藉由施加電壓而產生位移之固體致動器。壓電元件391之不位移之部分(例如下端)透過安裝部395設置於框體15之支持部15a(參照圖11)。若對壓電元件391施加電壓,則壓電元件391伸長,壓電元件391之上側之端向上方移動。圖7之虛線表示壓電元件391收縮之狀態,圖7之實線表示壓電元件391延伸之狀態。The piezoelectric element 391 is a solid actuator that is displaced by applying a voltage. The non-displaced portion (for example, the lower end) of the piezoelectric element 391 is provided on the support portion 15 a of the frame 15 through the mounting portion 395 (see FIG. 11). When a voltage is applied to the piezoelectric element 391, the piezoelectric element 391 expands, and the upper end of the piezoelectric element 391 moves upward. A broken line in FIG. 7 indicates a state where the piezoelectric element 391 is contracted, and a solid line in FIG. 7 indicates a state where the piezoelectric element 391 is extended.

連結部392係下端螺合於壓電元件391之大致呈圓柱形狀之構件。連結部392隨著壓電元件391之伸縮而上下移動。The connection portion 392 is a substantially cylindrical member whose lower end is screwed to the piezoelectric element 391. The connection portion 392 moves up and down as the piezoelectric element 391 expands and contracts.

於連結部392之上端設置前端為圓弧形狀之凸部393。凸部393之前端抵接於安裝部37a(參照圖6)之下側。因此,若壓電元件391伸長則光照射部30a向+z方向移動,若壓電元件391收縮則光照射部30a向-z方向移動。A convex portion 393 having an arcuate tip is provided on the upper end of the connecting portion 392. The front end of the convex portion 393 is in contact with the lower side of the mounting portion 37 a (see FIG. 6). Therefore, when the piezoelectric element 391 is extended, the light irradiation portion 30a moves in the + z direction, and when the piezoelectric element 391 contracts, the light irradiation portion 30a moves in the -z direction.

於連結部392之側面設置有複數個槽394。槽394係以隨著接近中心軸而向斜下方切入之方式形成。因此,即便壓電元件391彎曲並伸長(參照圖7二點鏈線),連結部392亦於槽394之部分發生變形,從而可使凸部393不沿水平方向移動而僅沿鉛直方向移動。A plurality of grooves 394 are provided on a side surface of the connecting portion 392. The groove 394 is formed so as to cut diagonally downward as it approaches the central axis. Therefore, even if the piezoelectric element 391 is bent and extended (refer to the two-dot chain line in FIG. 7), the connecting portion 392 is deformed in the portion of the groove 394, so that the convex portion 393 can be moved in the vertical direction without moving in the horizontal direction.

其次,對讀取部60進行說明。讀取部60a~讀取部60g為同一構成,因此,以下對讀取部60a進行說明。Next, the reading unit 60 will be described. The reading unit 60a to the reading unit 60g have the same configuration. Therefore, the reading unit 60a will be described below.

圖8係表示讀取部60a之概略之立體圖,且為主要部分之透視圖。讀取部60a為高倍率顯微鏡光學系統,主要具有顯微鏡、以及使藉由顯微鏡所獲取之圖案成像之相機606,該顯微鏡具有內部設置有物鏡之鏡筒601、向物鏡照射光(此處為可見光)之光源單元602、由鈦、氧化鋯等低導熱體所形成之鏡筒603、設置於鏡筒603之內部之管透鏡604、及使來自光源單元602之光透過並且將自物鏡導入之光反射之半反射鏡605。FIG. 8 is a perspective view showing the outline of the reading section 60a, and is a perspective view of the main part. The reading section 60a is a high magnification microscope optical system, and mainly includes a microscope and a camera 606 for imaging a pattern obtained by the microscope. The microscope has a lens barrel 601 with an objective lens inside, and irradiates light to the objective lens (here, visible light). ), A light source unit 602, a lens barrel 603 formed of a low thermal conductor such as titanium, zirconia, a tube lens 604 provided inside the lens barrel 603, and light transmitted from the light source unit 602 and guided from an objective lens Reflective half mirror 605.

光源單元602係照射可見光線(例如波長為大致450~600 nm之光)之構件,且照射面光源狀之光。光源單元602具有:設置於遠方之光源621、引導來自光源621之光之光纖束622、設置於光纖之端面附近之擴散板623、及與擴散板623鄰接設置之準直透鏡624。The light source unit 602 is a member that irradiates visible light (for example, light having a wavelength of approximately 450 to 600 nm) and irradiates light in the form of a surface light source. The light source unit 602 includes a light source 621 disposed in a distance, a fiber bundle 622 that guides light from the light source 621, a diffusion plate 623 disposed near an end face of the optical fiber, and a collimating lens 624 disposed adjacent to the diffusion plate 623.

光源621例如為白色LED,且照射可見光區域之光。由於光源621會發熱,故而光源621設置於與讀取部60a隔開之位置。自光源621照射之光係使用光纖束622被導光。擴散板623將藉由光纖束622被導光而自光纖束622之端面被輻射之光擴展並平均地轉換後,準直透鏡624將該光引導至物鏡。The light source 621 is, for example, a white LED, and emits light in a visible light region. Since the light source 621 generates heat, the light source 621 is disposed at a position separated from the reading section 60a. The light emitted from the light source 621 is guided using a fiber bundle 622. After the diffusion plate 623 is guided by the optical fiber bundle 622, the light radiated from the end surface of the optical fiber bundle 622 is expanded and converted uniformly, and the collimating lens 624 guides the light to the objective lens.

自光源單元602照射之光通過物鏡並於圖案P等處反射後,再次被引導至物鏡。物鏡係具有倍率為大致100倍之高倍率、數值孔徑(NA,numerical aperture)為大致0.8、作動距離為大致2 mm之特性之可見光透鏡。管透鏡604係使來自經無限遠校正之物鏡之光成像之透鏡,且焦距為大致200 mm。The light irradiated from the light source unit 602 passes through the objective lens and is reflected at the pattern P or the like, and then is guided to the objective lens again. The objective lens is a visible light lens having a high magnification of approximately 100 times, a numerical aperture (NA, numerical aperture) of approximately 0.8, and an operating distance of approximately 2 mm. The tube lens 604 is a lens that images light from an infinity-corrected objective lens and has a focal length of approximately 200 mm.

相機606係解析度為UXGA(1600×1200像素)左右,大小為2/3英吋左右,功耗為3 W左右。相機606獲取圖案P之影像。相機606由水冷用水套所包圍。相機606可藉由控制部201a(參照圖13)進行超低速掃描,因此,可正確地讀取遮罩M上所描繪之細小之圖案。The camera 606 series has a resolution of about UXGA (1600 × 1200 pixels), a size of about 2/3 inches, and a power consumption of about 3 W. The camera 606 acquires an image of the pattern P. The camera 606 is surrounded by a water-cooled water jacket. The camera 606 can perform ultra-low-speed scanning by the control unit 201 a (see FIG. 13). Therefore, the fine pattern drawn on the mask M can be accurately read.

讀取部60a透過未圖示之安裝部固定於筒狀部35a。藉此,讀取部60a與光照射部30a一併沿z方向移動。The reading portion 60a is fixed to the cylindrical portion 35a through a mounting portion (not shown). Thereby, the reading section 60a moves in the z direction together with the light irradiation section 30a.

其次,對將光照射部30a~30g安裝於框體15之安裝構造進行說明。於本實施形態之安裝構造中,將導向構件70安裝於底板151,將導向構件70A安裝於支持板153,將光照射部30a~30g安裝於導向構件70、70A,藉此將光照射部30a~30g安裝於框體15。Next, a mounting structure for mounting the light irradiating sections 30a to 30g on the frame 15 will be described. In the mounting structure of this embodiment, the guide member 70 is mounted on the base plate 151, the guide member 70A is mounted on the support plate 153, and the light irradiation portions 30a to 30g are mounted on the guide members 70 and 70A, thereby the light irradiation portion 30a ~ 30g is installed in frame 15.

圖9(A)表示將導向構件70安裝於底板151時之底板151與導向構件70之位置關係,圖9(B)表示將導向構件70A安裝於支持板153時之支持板153與導向構件70A之位置關係。FIG. 9 (A) shows the positional relationship between the base plate 151 and the guide member 70 when the guide member 70 is mounted on the base plate 151, and FIG. 9 (B) shows the support plate 153 and the guide member 70A when the guide member 70A is mounted on the support plate 153 Location relationship.

導向構件70係以覆蓋圓孔155a~155g之方式於底板151設置7個。導向構件70A係以覆蓋圓孔156a~156g之方式於支持板153設置7個。Seven guide members 70 are provided on the bottom plate 151 so as to cover the circular holes 155a to 155g. Seven guide members 70A are provided on the support plate 153 so as to cover the circular holes 156a to 156g.

導向構件70與導向構件70A之差異係有無孔75、76及直徑。於導向構件70之導向部本體71形成有孔75、76,但於導向構件70A之導向部本體71A未形成有孔75、76。The difference between the guide member 70 and the guide member 70A is the presence or absence of the holes 75 and 76 and the diameter. Holes 75 and 76 are formed in the guide body 71 of the guide member 70, but holes 75 and 76 are not formed in the guide body 71A of the guide member 70A.

於導向構件70、70A在大致中央處形成安裝孔74、74A。孔75、76係於通過安裝孔74之中心之線上以隔著安裝孔74之方式形成。關於導向構件70、70A,於後會詳細敍述。Mounting holes 74 and 74A are formed in the guide members 70 and 70A at substantially the center. The holes 75 and 76 are formed on a line passing through the center of the mounting hole 74 with the mounting hole 74 therebetween. The guide members 70 and 70A will be described in detail later.

導向構件70與圓孔155a~155g呈大致呈同心圓狀配置,導向構件70A與圓孔156a~156g呈大致呈同心圓狀配置。The guide member 70 and the circular holes 155a to 155g are arranged substantially concentrically, and the guide member 70A and the circular holes 156a to 156g are arranged substantially concentrically.

導向構件70及圓孔155a~155g係於底板151之中央部分平均地配置,導向構件70A及圓孔156a~156g係於支持板153之中央部分平均地配置。鄰接之圓孔155a~155g(即導向構件70)之間隔及鄰接之圓孔156a~156g(即導向構件70A)之間隔W2與光照射部30a~30g之間隔大致相同。The guide members 70 and the circular holes 155a to 155g are evenly arranged in the central portion of the bottom plate 151, and the guide members 70A and the circular holes 156a to 156g are evenly arranged in the central portion of the support plate 153. The interval between the adjacent circular holes 155a to 155g (that is, the guide member 70) and the interval W2 between the adjacent circular holes 156a to 156g (that is, the guide member 70A) are approximately the same as the interval between the light irradiation portions 30a to 30g.

於設置於圓孔155a、156a之導向構件70、70A設置光照射部30a之筒狀部35。於設置於圓孔155b、156b之導向構件70、70A設置光照射部30b。同樣地,於設置於圓孔155c~155g、156c~156g之導向構件70、70A分別設置光照射部30c~30g。A cylindrical portion 35 of a light irradiation portion 30a is provided on the guide members 70 and 70A provided in the circular holes 155a and 156a. A light irradiation section 30b is provided on the guide members 70 and 70A provided in the circular holes 155b and 156b. Similarly, the light irradiating portions 30c to 30g are provided on the guide members 70 and 70A provided in the circular holes 155c to 155g and 156c to 156g, respectively.

圓孔155a與圓孔156a係以俯視時之位置重疊之方式形成。同樣地,圓孔155b~155g與圓孔156b~156g係以各自俯視時之位置重疊之方式形成。The circular hole 155a and the circular hole 156a are formed so as to overlap with each other in a plan view. Similarly, the circular holes 155b to 155g and the circular holes 156b to 156g are formed so that their positions in a plan view overlap each other.

其次,以光照射部30a向底板151之安裝為例,對安裝構造進行說明。圖10係將光照射部30a安裝於底板151之部分的安裝構造之分解立體圖。另外,將光照射部30b~30g安裝於底板151之安裝構造,及將光照射部30a~30g安裝於支持板153之安裝構造由於與將光照射部30a安裝於底板151之安裝構造相同,故而省略說明。Next, the mounting structure will be described by taking the mounting of the light irradiating portion 30a to the bottom plate 151 as an example. FIG. 10 is an exploded perspective view of a mounting structure of a portion where the light irradiation portion 30 a is mounted on the bottom plate 151. The mounting structure for mounting the light irradiating portions 30b to 30g on the base plate 151 and the mounting structure for mounting the light irradiating portions 30a to 30g on the support plate 153 are the same as the mounting structure for mounting the light irradiating portion 30a on the base plate 151, Explanation is omitted.

首先,對導向構件70進行說明。導向構件70主要具有大致呈薄板狀之導向部本體71、及按壓環72、73。First, the guide member 70 will be described. The guide member 70 mainly includes a substantially thin plate-shaped guide portion body 71 and pressing rings 72 and 73.

導向部本體71為大致呈薄板狀,且為俯視時大致呈圓板形狀。導向部本體71由厚度為大致0.1 mm左右之金屬所形成,以使容易變形。作為金屬,可使用不鏽鋼、磷青銅等,但較理想為使用更均質之磷青銅。The guide body 71 has a substantially thin plate shape, and has a substantially circular plate shape in a plan view. The guide body 71 is formed of a metal having a thickness of approximately 0.1 mm so as to be easily deformed. As the metal, stainless steel, phosphor bronze, or the like can be used, but it is preferable to use a more homogeneous phosphor bronze.

於導向部本體71在大致中央處形成安裝孔74。安裝孔74係以導向部本體71之中心a1成為安裝孔74之中心之方式形成。又,於導向部本體71,沿著導向部本體71之外周形成複數個孔77,沿著安裝孔74形成複數個孔78。孔77係供插入螺絲85之孔,孔78係供插入螺絲86之孔。另外,孔77、78之位置及數量並不限於圖示之形態。A mounting hole 74 is formed in the guide portion body 71 at substantially the center. The mounting hole 74 is formed such that the center a1 of the guide body 71 becomes the center of the mounting hole 74. Further, a plurality of holes 77 are formed along the outer periphery of the guide portion body 71 in the guide portion body 71, and a plurality of holes 78 are formed along the mounting hole 74. Hole 77 is a hole for inserting the screw 85, and hole 78 is a hole for inserting the screw 86. The positions and numbers of the holes 77 and 78 are not limited to those shown in the drawings.

於導向部本體71被設置於底板151之狀態下,安裝孔74與圓孔155a呈大致呈同心圓狀配置。於安裝孔74中插入筒狀部35a。於筒狀部35a被插入至安裝孔74中之狀態下,光軸ax與安裝孔74之中心a1大致一致。In a state where the guide body 71 is provided on the bottom plate 151, the mounting holes 74 and the circular holes 155a are arranged in a substantially concentric circle shape. The cylindrical portion 35 a is inserted into the mounting hole 74. In a state where the cylindrical portion 35 a is inserted into the mounting hole 74, the optical axis ax and the center a1 of the mounting hole 74 substantially coincide.

按壓環72、73係厚度為大致3 mm左右,且由與導向部本體71相同之材料所形成。於本實施形態中,導向部本體71及按壓環72、73分別單獨形成,但亦可將導向部本體71及按壓環72、73一體形成。The pressing rings 72 and 73 have a thickness of about 3 mm and are formed of the same material as the guide body 71. In this embodiment, the guide body 71 and the pressure rings 72 and 73 are formed separately, but the guide body 71 and the pressure rings 72 and 73 may be integrally formed.

按壓環72為大致呈環狀,且大致沿著導向部本體71之外周而設置。按壓環73為大致呈環狀,且大致沿著安裝孔74而設置。於按壓環72形成複數個供插入螺絲85之孔77A,於按壓環73形成複數個供插入螺絲86之孔78A。The pressing ring 72 is substantially annular and is provided substantially along the outer periphery of the guide body 71. The pressing ring 73 is substantially annular and is provided substantially along the mounting hole 74. A plurality of holes 77A for inserting screws 85 are formed in the pressing ring 72, and a plurality of holes 78A for inserting screws 86 are formed in the pressing ring 73.

其次,對光照射部30a向底板151之安裝進行說明。導向構件70設置於光照射部30a與框體15(此處為底板151)之間。Next, the attachment of the light irradiation part 30a to the base plate 151 is demonstrated. The guide member 70 is provided between the light irradiation portion 30 a and the frame 15 (here, the bottom plate 151).

導向構件70係以覆蓋圓孔155a之方式設置於底板151。將按壓環72載置於導向部本體71上,將螺絲85插入至孔77、77A中,並使螺絲85螺合於形成於底板151之螺絲孔155h,藉此將導向構件70固定於底板151。The guide member 70 is provided on the bottom plate 151 so as to cover the circular hole 155a. Place the pressing ring 72 on the guide body 71, insert the screws 85 into the holes 77, 77A, and screw the screws 85 into the screw holes 155h formed in the bottom plate 151, thereby fixing the guide member 70 to the bottom plate 151 .

光照射部30a(即筒狀部35a)透過安裝部38a設置於導向構件70。將按壓環73設置於導向部本體71下,將螺絲86插入至孔78、78A中,並使螺絲86螺合於形成於凸緣38之螺絲孔381,藉此將導向構件70固定於安裝部38a。The light irradiation portion 30 a (that is, the cylindrical portion 35 a) is provided on the guide member 70 through the mounting portion 38 a. Set the pressing ring 73 under the guide body 71, insert the screw 86 into the holes 78, 78A, and screw the screw 86 into the screw hole 381 formed in the flange 38, thereby fixing the guide member 70 to the mounting portion 38a.

藉由如此透過按壓環72、73將導向構件70固定於框體15及筒狀部35,可防止導向部本體71之變形。By fixing the guide member 70 to the frame body 15 and the cylindrical portion 35 through the pressing rings 72 and 73 in this manner, deformation of the guide portion body 71 can be prevented.

關於藉由本發明之安裝構造而將光照射部30a~30g安裝於框體15之狀態,以光照射部30a為例進行說明。另外,光照射部30b~30g向框體15之安裝狀態由於與光照射部30a向框體15之安裝狀態相同,故而省略說明。The state where the light irradiating portions 30a to 30g are mounted on the housing 15 by the mounting structure of the present invention will be described using the light irradiating portion 30a as an example. The mounting state of the light irradiating portions 30b to 30g to the frame body 15 is the same as the mounting state of the light irradiating portion 30a to the frame body 15, and therefore description thereof is omitted.

圖11係示意性地表示光照射部30a被安裝於框體15(此處為支持部15a)之狀態的圖。於圖11中,表示沿通過安裝孔74及孔75、76之中心之面切斷而成之狀態。於圖11中,剖面展現了一部分之構成要件。又,於圖11中,省略螺絲85、86等緊固構件及供設置該等之孔之圖示。FIG. 11 is a diagram schematically showing a state where the light irradiation section 30 a is mounted on the frame body 15 (here, the support section 15 a). FIG. 11 shows a state cut along a surface passing through the center of the mounting hole 74 and the holes 75 and 76. In Fig. 11, the cross-section shows a part of the constituent elements. In FIG. 11, illustrations of fastening members such as screws 85 and 86 and holes for providing these are omitted.

筒狀部35a被插入至導向構件70、70A之安裝孔74、74A中。於安裝部38a位於導向構件70之上側,且較筒狀部35a之安裝部38a更靠近下側之部分位於較導向構件70更靠近下側之狀態下,使用按壓環73將導向構件70與安裝部38a固定在一起。又,於安裝部37a位於導向構件70A之上側,且較筒狀部35a之安裝部37a更靠近下側之部分位於較導向構件70A更靠近下側之狀態下,使用按壓環73A將導向構件70A與安裝部37a固定在一起。導向構件70係使用按壓環72而固定於底板151,導向構件70A係使用按壓環72A而固定於支持板153。The cylindrical portion 35a is inserted into the mounting holes 74 and 74A of the guide members 70 and 70A. In a state where the mounting portion 38 a is positioned above the guide member 70 and a portion closer to the lower side than the mounting portion 38 a of the cylindrical portion 35 a is positioned closer to the lower side than the guide member 70, the guide member 70 and the mounting member are mounted using the pressing ring 73. The parts 38a are fixed together. Further, in a state where the mounting portion 37a is positioned above the guide member 70A, and a portion closer to the lower side than the mounting portion 37a of the cylindrical portion 35a is positioned closer to the lower side than the guide member 70A, the guide member 70A is pressed using the pressing ring 73A. It is fixed to the mounting portion 37a. The guide member 70 is fixed to the bottom plate 151 using a pressing ring 72, and the guide member 70A is fixed to the support plate 153 using a pressing ring 72A.

於俯視時,圓孔155a之中心與圓孔156a之中心大致一致,因此以光軸ax成為大致鉛直方向之方式將光照射部30a安裝於支持部15a。In a plan view, the center of the circular hole 155a and the center of the circular hole 156a are substantially the same. Therefore, the light irradiating portion 30a is mounted on the support portion 15a so that the optical axis ax becomes a substantially vertical direction.

孔75、76係以自AF用光源341向下照射之光及遮罩M處之反射光能夠通過之方式,分別與AF用光源341及AF感測器347、348在水平方向位置一致。換言之,孔75、76之位置分別於俯視時與AF用光源341及AF感測器347、348之位置重疊。藉由如此形成孔75、76,即便於使用導向構件70、70A之情形時,亦可進行光照射部30a之AF處理。The holes 75 and 76 are aligned with the positions of the AF light source 341 and the AF sensors 347 and 348 in a horizontal direction in such a manner that the light radiated downward from the AF light source 341 and the reflected light at the mask M can pass through, respectively. In other words, the positions of the holes 75 and 76 overlap the positions of the AF light source 341 and the AF sensors 347 and 348 in a plan view, respectively. By forming the holes 75 and 76 in this manner, even when the guide members 70 and 70A are used, the AF processing of the light irradiation portion 30a can be performed.

驅動部39a透過按壓環73A推升安裝部37a。光照射部30a之重心G位於驅動部39a推升安裝部37a之位置之附近。因此,驅動部39a於重心G之附近推升光照射部30a。藉此,光照射部30a之上下移動穩定。The driving portion 39a pushes up the mounting portion 37a through the pressing ring 73A. The center of gravity G of the light irradiation portion 30a is located near the position where the driving portion 39a pushes up the mounting portion 37a. Therefore, the driving portion 39a pushes up the light irradiation portion 30a near the center of gravity G. Thereby, the light irradiation part 30a moves stably up and down.

圖12之(A)表示光照射部30a未移動之狀態(行程中央),(B)表示光照射部30a移動至下側之狀態(行程下端),(C)表示光照射部30a移動至上側之狀態(行程上端)。(A) of FIG. 12 shows a state in which the light irradiating portion 30a is not moved (center of the stroke), (B) shows a state in which the light irradiating portion 30a is moved to the lower side (lower stroke end), and (C) shows that the light irradiating portion 30a is moved to the upper side Status (upper stroke).

由於導向構件70、70A透過安裝部37a、38a(圖12中省略圖示)固定於筒狀部35a,故而若筒狀部35a藉由驅動部39a進行上下移動,則導向構件70、70A伴隨於該上下移動而變形。Since the guide members 70 and 70A are fixed to the cylindrical portion 35a through the mounting portions 37a and 38a (not shown in FIG. 12), if the cylindrical portion 35a is moved up and down by the drive portion 39a, the guide members 70 and 70A are accompanied by This up and down movement deforms.

藉由驅動部39a所獲得之筒狀部35a之移動量為大致30 μm。由於導向構件70、70A為較薄之金屬製造,故而導向構件70、70A配合著大致30 μm之筒狀部35a之上下移動而伸縮(彈性變形)。由於導向構件70、70A為俯視時大致呈圓形狀,故而導向構件70、70A之變形量不取決於場所,為大致固定,筒狀部35a於xy方向不移動。另外,由於孔75、76足夠小,故而對導向構件70、70A之變形賦予之影響較小。又,藉由驅動部39a所獲得之筒狀部35a之移動量即大致30 μm為AF所需之量之例示,驅動部39a使筒狀部35a以大致幾十μm單位進行移動亦可。The moving amount of the cylindrical portion 35a obtained by the driving portion 39a is approximately 30 μm. Since the guide members 70 and 70A are made of thin metal, the guide members 70 and 70A expand and contract (elastically deform) in cooperation with the cylindrical portion 35a of approximately 30 μm to move up and down. Since the guide members 70 and 70A have a substantially circular shape in a plan view, the amount of deformation of the guide members 70 and 70A does not depend on the place, and is substantially fixed, and the cylindrical portion 35a does not move in the xy direction. In addition, since the holes 75 and 76 are sufficiently small, the influence given to the deformation of the guide members 70 and 70A is small. In addition, by exemplifying that the movement amount of the cylindrical portion 35a obtained by the driving portion 39a, that is, approximately 30 μm is the amount required for the AF, the driving portion 39a may move the cylindrical portion 35a by approximately several tens of μm.

另外,隨著光照射部30a之上下移動,設置於光照射部30a之讀取部60a(圖12中省略圖示)亦上下移動。讀取部60a之鏡筒601被插入至圓孔157a(參照圖3等)中,鏡筒601未被固定於圓孔157a中,因此不會因鏡筒601之上下移動而產生缺陷。In addition, as the light irradiation section 30a moves up and down, the reading section 60a (not shown in FIG. 12) provided in the light irradiation section 30a also moves up and down. The lens barrel 601 of the reading section 60a is inserted into the circular hole 157a (see FIG. 3 and the like), and the lens barrel 601 is not fixed in the circular hole 157a. Therefore, the lens barrel 601 does not cause defects due to its movement up and down.

圖13係表示曝光裝置1之電氣構成之方塊圖。曝光裝置1具有CPU(Central Processing Unit,中央處理單元)201、RAM(Random Access Memory,隨機存取記憶體)202、ROM(Read Only Memory,唯讀記憶體)203、輸入輸出介面(I/F)204、通訊介面(I/F)205、及媒體介面(I/F)206,該等與光照射部30、位置測定部41、42、雷射干涉儀51、52、驅動部81、82、83等相互連接。FIG. 13 is a block diagram showing the electrical configuration of the exposure apparatus 1. As shown in FIG. The exposure device 1 includes a central processing unit (CPU) 201, a random access memory (RAM) 202, a read only memory (ROM) 203, and an input / output interface (I / F). ) 204, communication interface (I / F) 205, and media interface (I / F) 206, which are related to the light irradiation section 30, the position measuring sections 41 and 42, the laser interferometers 51 and 52, and the driving sections 81 and 82. , 83, etc. are interconnected.

CPU201基於RAM202、ROM203中所儲存之程式進行動作,而控制各部。對於CPU201,自位置測定部41、42、雷射干涉儀51、52等輸入訊號。自CPU201輸出之訊號被輸出至驅動部81、82、83、光照射部30。The CPU 201 operates based on programs stored in the RAM 202 and the ROM 203 and controls each unit. The CPU 201 receives input signals from the position measuring units 41 and 42 and the laser interferometers 51 and 52. The signals output from the CPU 201 are output to the driving sections 81, 82, and 83 and the light irradiation section 30.

RAM202為揮發性記憶體。ROM203為記憶有各種控制程式等之非揮發性記憶體。CPU201基於RAM202、ROM203中所儲存之程式進行動作,而控制各部。又,ROM203儲存曝光裝置1之啟動時CPU201所進行之啟動程式、或相依於曝光裝置1之硬體之程式、向遮罩M之描繪資料等。又,RAM202儲存CPU201所執行之程式及CPU201所使用之資料等。The RAM 202 is a volatile memory. The ROM 203 is a non-volatile memory that stores various control programs and the like. The CPU 201 operates based on programs stored in the RAM 202 and the ROM 203 and controls each unit. In addition, the ROM 203 stores a startup program performed by the CPU 201 when the exposure device 1 is started, a program depending on the hardware of the exposure device 1, and drawing data to the mask M, and the like. The RAM 202 stores programs executed by the CPU 201 and data used by the CPU 201.

CPU201透過輸入輸出介面204控制鍵盤或滑鼠等輸入輸出裝置211。通訊介面205透過網路212自其他機器接收資料並發送至CPU201,並且將CPU201所生成之資料透過網路212發送至其他機器。The CPU 201 controls an input / output device 211 such as a keyboard or a mouse through the input / output interface 204. The communication interface 205 receives data from other devices through the network 212 and sends it to the CPU 201, and sends data generated by the CPU 201 to other devices through the network 212.

媒體介面206讀取記憶媒體213中所儲存之程式或資料,並儲存至RAM202中。另外,記憶媒體213例如為IC卡、SD卡、DVD等。The media interface 206 reads programs or data stored in the memory medium 213 and stores the programs or data in the RAM 202. The storage medium 213 is, for example, an IC card, an SD card, or a DVD.

另外,實現各功能之程式例如被自記憶媒體213讀出,透過RAM202被安裝至曝光裝置1中,並藉由CPU201執行。In addition, a program that realizes each function is read from, for example, the storage medium 213, is installed in the exposure device 1 through the RAM 202, and is executed by the CPU 201.

CPU201具有基於輸入訊號控制曝光裝置1之各部的控制部201a之功能。控制部201a係藉由執行CPU201所讀入之特定程式而構建。關於控制部201a所進行之處理,於後會詳細敍述。The CPU 201 has a function of a control section 201 a that controls each section of the exposure apparatus 1 based on an input signal. The control unit 201a is constructed by executing a specific program read by the CPU 201. The processing performed by the control unit 201a will be described in detail later.

圖13所示之曝光裝置1之構成係於說明本實施形態之特徵時說明了主要構成,例如並不排除一般之資訊處理裝置所具備之構成。曝光裝置1之構成要素根據處理內容分類為更多之構成要素亦可,為1個構成要素執行複數個構成要素之處理亦可。The configuration of the exposure device 1 shown in FIG. 13 is the main configuration when describing the features of this embodiment. For example, the configuration provided by a general information processing device is not excluded. The constituent elements of the exposure device 1 may be classified into more constituent elements according to the processing content, and processing of a plurality of constituent elements may be performed for one constituent element.

對如此構成之曝光裝置1之作用進行說明。以下處理主要藉由控制部201a而進行。The operation of the exposure apparatus 1 configured as described above will be described. The following processing is mainly performed by the control unit 201a.

控制部201a係使用雷射干涉儀51、52進行位置測定部41、42之校準。雷射干涉儀51、52之測定值雖然正確,但於曝光裝置1中之乾淨空氣之降流下產生接近10 nm之波動。又,雷射干涉儀51、52只可測定相對位置(無法知曉原點)。The control unit 201a uses the laser interferometers 51 and 52 to perform the calibration of the position measuring units 41 and 42. Although the measured values of the laser interferometers 51 and 52 are correct, fluctuations close to 10 nm occur under the downflow of clean air in the exposure device 1. In addition, the laser interferometers 51 and 52 can only measure the relative position (the origin cannot be known).

位置測定部41、42之測定結果包含因遮罩保持部20之縱傾或側擺造成之誤差等。因此,以藉由位置測定部41、42所獲得之測定結果不含誤差之方式事先調查雷射干涉儀51、52之測定值與藉由位置測定部41、42所獲得之測定值之關係,在進行了位置測定部41、42之校正處理後,使用位置測定部41、42進行描繪處理,藉此可提高精度。The measurement results of the position measurement sections 41 and 42 include errors and the like caused by the pitch and sideways of the mask holding section 20. Therefore, the relationship between the measurement values of the laser interferometers 51 and 52 and the measurement values obtained by the position measurement sections 41 and 42 is investigated in advance so that the measurement results obtained by the position measurement sections 41 and 42 contain no errors. After the correction processing by the position measuring units 41 and 42 is performed, the drawing processing is performed using the position measuring units 41 and 42 to improve accuracy.

控制部201a於進行描繪處理之前朝向臨時之遮罩M自光照射部30a~30g照射光而描繪圖案,並藉由讀取部60讀取該圖案,藉此生成修正資料。又,控制部201a若藉由AF處理部34a~34g檢測出光照射部30a~30g未聚焦,則藉由驅動部39a~39g使光照射部30a~30g分別沿z方向移動,而使光照射部30a~30g聚焦。The control unit 201 a draws a pattern toward the temporary mask M from the light irradiation portions 30 a to 30 g before performing drawing processing, and reads the pattern by the reading portion 60 to generate correction data. In addition, when the control unit 201a detects that the light irradiation units 30a to 30g are not focused by the AF processing units 34a to 34g, the drive units 39a to 39g respectively move the light irradiation units 30a to 30g in the z direction to cause the light irradiation units 30a ~ 30g focus.

描繪處理係於將遮罩M載置於遮罩保持部20後經過數小時後進行。控制部201a基於位置測定部41、42之測定結果使遮罩保持部20沿x方向及y方向移動。控制部201a一面使遮罩保持部20移動,一面於遮罩M通過光照射部30之下側時自光照射部30照射光而進行描繪處理。The drawing process is performed after several hours have passed after the mask M is placed on the mask holding portion 20. The control unit 201a moves the mask holding unit 20 in the x direction and the y direction based on the measurement results of the position measurement units 41 and 42. While the control unit 201 a moves the mask holding unit 20, it irradiates light from the light irradiation unit 30 when the mask M passes under the light irradiation unit 30 to perform drawing processing.

根據本實施形態,具有使用導向構件70、70A之安裝構造,因此可使光照射部30沿鉛直方向上下移動且防止光軸ax之抖動。According to this embodiment, since the mounting structure using the guide members 70 and 70A is provided, the light irradiation portion 30 can be moved up and down in the vertical direction and the optical axis ax can be prevented from being shaken.

例如於在光照射部30之上下移動中使用交叉輥導向器之情形時,由於輥之圓筒度存在極限,故而使之移動30 μm左右時之光軸ax之抖動會產生100 nm左右。又,例如於在光照射部30之上下移動中使用空氣滑件之情形時,於使之移動30 μm左右時光照射部30會於水平方向振動30 nm左右。該等方法由於光軸ax之水平方向之移動量過大,故而無法基於光照射部30a、30g之位置藉由內插求出光照射部30b~30f之位置,而無法控制描繪位置。相對於此,本實施形態具有使用導向構件70、70A之安裝構造,因此可使在使光照射部30上下移動時之光軸ax之抖動變至極小(光軸ax之抖動為幾nm以下),並於描繪中藉由光槓桿式之AF處理部34a~34g獲取作為描繪對象之遮罩M之厚度變化或遮罩保持部20之高度方向(z方向)之變化,且可以較高之精度進行描繪處理。For example, when a cross roller guide is used in the upward and downward movement of the light irradiating part 30, since the cylindricality of the roller has a limit, the jitter of the optical axis ax when it is moved about 30 μm will generate about 100 nm. In addition, for example, when an air slider is used for moving the light irradiating part 30 up and down, the light irradiating part 30 vibrates about 30 nm in the horizontal direction when it is moved about 30 μm. In these methods, since the amount of movement in the horizontal direction of the optical axis ax is too large, the positions of the light irradiation parts 30b to 30f cannot be obtained by interpolation based on the positions of the light irradiation parts 30a and 30g, and the drawing position cannot be controlled. In contrast, this embodiment has a mounting structure using the guide members 70 and 70A, so that the jitter of the optical axis ax when the light irradiating part 30 is moved up and down can be minimized (the jitter of the optical axis ax is several nm or less) In the drawing, a light lever-type AF processing section 34a to 34g is used to obtain a change in the thickness of the mask M as a drawing object or a change in the height direction (z direction) of the mask holding section 20 with high accuracy. Perform drawing processing.

尤其是本實施形態由於光照射部30之上下移動較小,為大致幾十μm左右,故而即便光照射部30上下移動,導向構件70、70A亦不會塑性變形,而可採用使用較薄之金屬製之導向構件70、70A的安裝構造。並且,由於導向構件70、70A為俯視時大致呈圓板形狀,導向構件70、70A平均地變形,故而可使在使光照射部30上下移動時之光軸ax之抖動變小為幾nm以下。尤其是藉由將導向構件70、70A設為厚度為大致0.1 mm左右之金屬製造,可製成容易變形且堅韌之導向構件70、70A。In particular, in this embodiment, since the light irradiating portion 30 moves up and down relatively small, which is about several tens of μm, even if the light irradiating portion 30 moves up and down, the guide members 70 and 70A will not be plastically deformed. Mounting structure of metal guide members 70 and 70A. In addition, since the guide members 70 and 70A have a substantially circular plate shape in plan view, and the guide members 70 and 70A are evenly deformed, the jitter of the optical axis ax when the light irradiation portion 30 is moved up and down can be reduced to a few nm or less. . In particular, the guide members 70 and 70A are made of metal having a thickness of approximately 0.1 mm, and the guide members 70 and 70A can be easily deformed and tough.

又,根據本實施形態,導向構件70、70A具有按壓環72、73,因此可防止因將導向構件70、70A安裝於框體15及光照射部30所引起之導向部本體71之變形。Moreover, according to this embodiment, since the guide members 70 and 70A have the pressing rings 72 and 73, deformation of the guide body 71 caused by mounting the guide members 70 and 70A to the frame 15 and the light irradiation portion 30 can be prevented.

又,根據本實施形態,製成使光照射部30整體上下移動而使之聚焦之構成,因此對於使用NA為0.65左右之高解析度之透鏡的遮罩製造裝置亦可進行焦點調整處理。例如,將改變光學零件之配置之焦點調整處理應用於遮罩製造裝置之行為,由於會產生像差變大或聚焦範圍變窄等缺陷,故而不切實際。針對於此,若為使光照射部30整體上下移動之焦點調整處理,則可應用於遮罩製造裝置。換言之,本實施形態於應用於高精度之曝光裝置即遮罩製造裝置之方面尤其有價值。In addition, according to this embodiment, since the entire light irradiation unit 30 is moved up and down to focus it, it is possible to perform focus adjustment processing on a mask manufacturing apparatus using a high-resolution lens having an NA of about 0.65. For example, the application of focus adjustment processing that changes the configuration of optical components to a mask manufacturing device is impractical because defects such as aberrations become larger or focus ranges become narrower. In view of this, if it is a focus adjustment process for moving the entire light irradiation unit 30 up and down, it can be applied to a mask manufacturing apparatus. In other words, this embodiment is particularly valuable for applying to a mask manufacturing apparatus that is a high-precision exposure apparatus.

〈第2實施形態〉 本發明之第2實施形態係於導向構件形成有複數個切除孔之狀態。以下,對第2實施形態之曝光裝置進行說明。第1實施形態之曝光裝置1、與第2實施形態之曝光裝置之差異僅為光照射部30之安裝構造,因此,以下僅對第2實施形態之曝光裝置中之光照射部30之安裝構造進行說明。又,關於與第1實施形態相同之部分,標註同一符號並省略說明。<Second Embodiment> A second embodiment of the present invention is a state in which a plurality of cutout holes are formed in the guide member. Hereinafter, an exposure apparatus according to a second embodiment will be described. The difference between the exposure device 1 of the first embodiment and the exposure device of the second embodiment is only the mounting structure of the light irradiation portion 30. Therefore, the following describes only the mounting structure of the light irradiation portion 30 in the exposure device of the second embodiment. Be explained. The same parts as those in the first embodiment are denoted by the same reference numerals and descriptions thereof are omitted.

圖14係關於第2實施形態之曝光裝置,且(A)表示將導向構件70B安裝於底板151時之底板151與導向構件70B之位置關係,(B)表示將導向構件70C安裝於支持板153時之支持板153與導向構件70C之位置關係。FIG. 14 relates to the exposure apparatus of the second embodiment, and (A) shows the positional relationship between the base plate 151 and the guide member 70B when the guide member 70B is mounted on the base plate 151, and (B) shows the guide member 70C on the support plate 153. The positional relationship between the support plate 153 and the guide member 70C.

於將光照射部30a~30g安裝於框體15之安裝構造中,將導向構件70B、70C安裝於底板151及支持板153,將光照射部30a~30g安裝於導向構件70B、70C。導向構件70B係以覆蓋圓孔155a~155g之方式於底板151設置7個,導向構件70C係以覆蓋圓孔156a~156g之方式於支持板153設置7個。In the mounting structure in which the light irradiating portions 30a to 30g are mounted on the housing 15, the guide members 70B and 70C are mounted on the base plate 151 and the support plate 153, and the light irradiating portions 30a to 30g are mounted on the guide members 70B and 70C. Seven guide members 70B are provided on the bottom plate 151 so as to cover the circular holes 155a to 155g, and seven guide members 70C are provided on the support plate 153 so as to cover the circular holes 156a to 156g.

導向構件70與導向構件70B之差異、及導向構件70A與導向構件70C之差異為有無切除孔79。導向構件70B、70C分別具有大致呈薄板狀之導向部本體71B、71C。導向部本體71B與導向部本體71C之差異僅為直徑。The difference between the guide member 70 and the guide member 70B and the difference between the guide member 70A and the guide member 70C are the presence or absence of a cutout hole 79. The guide members 70B and 70C each have a guide plate body 71B and 71C having a substantially thin plate shape. The difference between the guide body 71B and the guide body 71C is only the diameter.

導向部本體71B、71C與導向部本體71、71A同樣地為由厚度為大致0.1 mm左右之金屬所形成之大致呈薄板狀,且為俯視時大致呈圓板形狀。於導向部本體71B、71C在大致中央處形成安裝孔74、74A。The guide body 71B and 71C are formed in the same manner as the guide bodies 71 and 71A, and are formed into a substantially thin plate shape by a metal having a thickness of approximately 0.1 mm, and have a substantially circular plate shape in a plan view. Mounting holes 74 and 74A are formed in the guide body 71B and 71C at approximately the center.

於導向部本體71B、71C形成複數個環狀扇形狀之切除孔79。切除孔79係沿著圓周方向而形成。於本實施形態中,以大致45度間隔配置8個切除孔79,切除孔79之數量、位置、大小、形狀等並不限於此。A plurality of annular fan-shaped cutout holes 79 are formed in the guide body 71B and 71C. The cutout hole 79 is formed along the circumferential direction. In this embodiment, the eight cutout holes 79 are arranged at intervals of approximately 45 degrees, and the number, position, size, shape, and the like of the cutout holes 79 are not limited to this.

圖15係將光照射部30a安裝於支持板153之部分的安裝構造之分解立體圖。於圖15中省略了較光照射部30a之凸緣36a位於更上方之部分。將光照射部30a~30g安裝於底板151之安裝構造,及將光照射部30b~30g安裝於支持板153之安裝構造由於與將光照射部30a安裝於支持板153之安裝構造相同,故而省略說明。FIG. 15 is an exploded perspective view of a mounting structure of a portion where the light irradiation portion 30 a is mounted on the support plate 153. In FIG. 15, a portion located above the flange 36 a of the light irradiation portion 30 a is omitted. The mounting structure for mounting the light irradiating portion 30a to 30g on the base plate 151 and the mounting structure for mounting the light irradiating portion 30b to 30g on the support plate 153 are the same as the mounting structure for mounting the light irradiating portion 30a to the support plate 153, and are therefore omitted. Instructions.

導向構件70C係以覆蓋圓孔156a之方式設置於支持板153。將按壓環72A載置於導向部本體71B上,將螺絲85插入至孔77、77A中,並使螺絲85螺合於形成於支持板153之螺絲孔156h中,藉此將導向構件70C固定於支持板153。The guide member 70C is provided on the support plate 153 so as to cover the circular hole 156a. Place the pressing ring 72A on the guide body 71B, insert the screw 85 into the holes 77 and 77A, and screw the screw 85 into the screw hole 156h formed in the support plate 153, thereby fixing the guide member 70C to Support board 153.

筒狀部35a透過安裝部37a設置於導向構件70C。將按壓環73A設置於導向部本體71B下,將螺絲86插入至孔78、78A中,並使螺絲86螺合於形成於凸緣37之螺絲孔371中,藉此將導向構件70C固定於安裝部37a。The cylindrical portion 35a is provided on the guide member 70C through the mounting portion 37a. Set the pressing ring 73A under the guide body 71B, insert the screw 86 into the holes 78, 78A, and screw the screw 86 into the screw hole 371 formed in the flange 37, thereby fixing the guide member 70C to the installation部 37a。 37a.

圖16係表示光照射部30a被安裝於框體15之狀態之圖。筒狀部35a被插入至導向構件70B、70C之安裝孔74、74A中。AF用光源341及AF感測器347、348與切除孔79在水平方向位置一致。換言之,切除孔79之位置於俯視時與AF用光源341及AF感測器347、348之位置重疊。因此,自AF用光源341向下照射之光於遮罩M處反射,反射光入射至AF感測器347、348。FIG. 16 is a view showing a state in which the light irradiating portion 30 a is mounted on the housing 15. The cylindrical portion 35a is inserted into the mounting holes 74 and 74A of the guide members 70B and 70C. The AF light source 341 and the AF sensors 347 and 348 are aligned with the cutout hole 79 in the horizontal direction. In other words, the position of the cutout hole 79 overlaps the positions of the AF light source 341 and the AF sensors 347 and 348 in a plan view. Therefore, the light radiated downward from the AF light source 341 is reflected at the mask M, and the reflected light is incident on the AF sensors 347 and 348.

本實施形態由於導向構件70B、70C具有切除孔79,故而可對光照射部30a之旋轉方向之位置進行微調。以下,對旋轉驅動部90a進行說明。另外,關於光照射部30b~30g,亦與光照射部30a同樣地分別具有旋轉驅動部90b~90g,但由於旋轉驅動部90a~90g為相同構造,故而關於旋轉驅動部90b~90g省略說明。In this embodiment, since the guide members 70B and 70C have cutout holes 79, the position of the light irradiation portion 30a in the rotation direction can be fine-tuned. The rotation driving unit 90a will be described below. In addition, the light irradiating sections 30b to 30g also have the rotation driving sections 90b to 90g similarly to the light irradiating section 30a. However, since the rotation driving sections 90a to 90g have the same structure, the description of the rotation driving sections 90b to 90g is omitted.

如圖15所示般,旋轉驅動部90a主要具有:突起91a、壓電元件92a、及彈性構件93a。突起91a為大致呈棒狀,且設置於凸緣36a之側面。壓電元件92a之前端抵接於突起91a。壓電元件92a之不位移之部分(未與突起91a抵接之側之端)設置於支持部15a(參照圖3等)。又,於突起91a設置彈性構件93a。彈性構件93a例如為壓縮彈簧,且一端設置於突起91a,另一端設置於支持部15a。因此,若壓電元件92a伸長,則自+z方向觀察,光照射部30a沿逆時針方向旋轉,若壓電元件92a收縮,則自+z方向觀察,光照射部30a沿順時針方向旋轉。As shown in FIG. 15, the rotation driving unit 90 a mainly includes a protrusion 91 a, a piezoelectric element 92 a, and an elastic member 93 a. The protrusion 91a has a substantially rod shape and is provided on a side surface of the flange 36a. The front end of the piezoelectric element 92a is in contact with the protrusion 91a. The non-displaced portion of the piezoelectric element 92a (the end on the side not in contact with the protrusion 91a) is provided on the support portion 15a (see FIG. 3 and the like). An elastic member 93a is provided on the protrusion 91a. The elastic member 93a is, for example, a compression spring, and one end is provided on the protrusion 91a, and the other end is provided on the support portion 15a. Therefore, when the piezoelectric element 92a is elongated, the light irradiating portion 30a is rotated in a counterclockwise direction when viewed from the + z direction, and when the piezoelectric element 92a is contracted, the light irradiating portion 30a is rotated in a clockwise direction when viewed from the + z direction.

根據本實施形態,具有使用導向構件70B、70C之安裝構造,因此可於使光照射部30上下移動時防止光軸ax之抖動。又,藉由於導向構件70B、70C形成切除孔79,不僅可使光照射部30沿上下方向移動,亦可使之沿旋轉方向移動。由於旋轉方向之移動使用壓電元件92a,故而可以秒單位之角度(1秒=大致2.78度)進行調整。According to this embodiment, since the mounting structure using the guide members 70B and 70C is provided, the optical axis ax can be prevented from being shaken when the light irradiation section 30 is moved up and down. Further, since the cutout holes 79 are formed in the guide members 70B and 70C, not only the light irradiation portion 30 can be moved in the vertical direction, but also can be moved in the rotation direction. Since the piezoelectric element 92a is used for movement in the rotation direction, the angle can be adjusted in seconds (1 second = approximately 2.78 degrees).

又,根據本實施形態,於俯視時切除孔79之位置與AF用光源341及AF感測器347、348之位置重疊,因此無需於導向構件70B、70C形成孔75、76。並且,由於切除孔79大致平均地配置於圓周方向,故而於使光照射部30a上下移動時,導向部本體71B、71C平均地變形。因此,可防止光照射部30a向水平方向移動。In addition, according to this embodiment, the position of the cutout hole 79 overlaps the positions of the AF light source 341 and the AF sensors 347 and 348 in a plan view. Therefore, it is not necessary to form the holes 75 and 76 in the guide members 70B and 70C. In addition, since the cutout holes 79 are arranged approximately evenly in the circumferential direction, when the light irradiation portion 30a is moved up and down, the guide portion bodies 71B and 71C are evenly deformed. Therefore, the light irradiation portion 30a can be prevented from moving in the horizontal direction.

另外,於本實施形態中,使用了旋轉驅動部90a~90g分別使光照射部30a~30g旋轉,但使光照射部30a~30g旋轉之方法並不限於此。例如,亦可於突起91a設置進給螺絲,使進給螺絲之前端抵接於側板154,並手動使進給螺絲旋轉,藉此使光照射部30a旋轉。In this embodiment, the rotation driving units 90a to 90g are used to rotate the light irradiation units 30a to 30g, respectively, but the method of rotating the light irradiation units 30a to 30g is not limited to this. For example, a feed screw may be provided on the protrusion 91a so that the front end of the feed screw abuts on the side plate 154, and the feed screw may be manually rotated to rotate the light irradiation portion 30a.

〈第3實施形態〉 本發明之第3實施形態係導向構件之板厚較厚為1 mm左右之形態。以下,對第3實施形態之曝光裝置進行說明。第1實施形態之曝光裝置1、與第3實施形態之曝光裝置之差異僅為光照射部30之安裝構造,因此,以下僅對第3實施形態之曝光裝置中之光照射部30之安裝構造進行說明。又,關於與第1實施形態相同之部分,標註同一符號並省略說明。<Third Embodiment> A third embodiment of the present invention is a configuration in which the plate thickness of the guide member is about 1 mm. Hereinafter, an exposure apparatus according to a third embodiment will be described. The difference between the exposure device 1 of the first embodiment and the exposure device of the third embodiment is only the mounting structure of the light irradiation section 30. Therefore, the following describes only the mounting structure of the light irradiation section 30 in the exposure device of the third embodiment. Be explained. The same parts as those in the first embodiment are denoted by the same reference numerals and descriptions thereof are omitted.

圖17係關於第3實施形態之曝光裝置,且(A)表示將導向構件70D安裝於底板151時之底板151與導向構件70D之位置關係,(B)表示將導向構件70E安裝於支持板153時之支持板153與導向構件70E之位置關係。FIG. 17 is an exposure apparatus according to the third embodiment, and (A) shows the positional relationship between the base plate 151 and the guide member 70D when the guide member 70D is mounted on the base plate 151, and (B) shows the guide member 70E on the support plate 153. The positional relationship between the support plate 153 and the guide member 70E.

於將光照射部30a~30g安裝於框體15之安裝構造中,將導向構件70D、70E安裝於底板151及支持板153,將光照射部30a~30g(圖17中省略圖示)安裝於導向構件70D、70E。導向構件70D係以覆蓋圓孔155a~155g之方式於底板151設置7個,導向構件70E係以覆蓋圓孔156a~156g之方式於支持板153設置7個。In the mounting structure in which the light irradiating portions 30a to 30g are mounted on the frame 15, the guide members 70D and 70E are mounted on the base plate 151 and the support plate 153, and the light irradiating portions 30a to 30g (not shown in FIG. 17) are mounted on The guide members 70D and 70E. Seven guide members 70D are provided on the bottom plate 151 so as to cover the circular holes 155a to 155g, and seven guide members 70E are provided on the support plate 153 so as to cover the circular holes 156a to 156g.

導向構件70D、70E分別具有大致呈薄板狀之導向部本體71D、71E。圖18(A)係表示導向部本體71D之概略之圖,圖18(B)係表示導向部本體71E之概略之圖。The guide members 70D and 70E respectively have guide portion bodies 71D and 71E having a substantially thin plate shape. FIG. 18 (A) is a diagram showing the outline of the guide body 71D, and FIG. 18 (B) is a diagram showing the outline of the guide body 71E.

導向構件70與導向構件70D之差異、及導向構件70A與導向構件70E之差異係板厚及有無切除孔79A~79D。另外,於圖18(A)中省略了孔76。The difference between the guide member 70 and the guide member 70D, and the difference between the guide member 70A and the guide member 70E are the plate thickness and the presence or absence of cutout holes 79A to 79D. In addition, the hole 76 is omitted in FIG. 18 (A).

導向部本體71D、71E為大致呈薄板狀,且為俯視時大致呈圓板形狀。導向部本體71D、71E由厚度為大致1 mm左右之金屬所形成。作為金屬,可使用不鏽鋼、磷青銅等,但較理想為使用更均質之磷青銅。另外,本發明中之所謂大致1 mm左右,係指相對於大致1 mm包含大致1 mm以下之誤差者。The guide portion bodies 71D and 71E are substantially thin plates, and are substantially circular plates in a plan view. The guide body 71D and 71E are formed of a metal having a thickness of approximately 1 mm. As the metal, stainless steel, phosphor bronze, or the like can be used, but it is preferable to use a more homogeneous phosphor bronze. In addition, the term "approximately 1 mm" in the present invention means an error including approximately 1 mm or less with respect to approximately 1 mm.

於導向部本體71D、71E在大致中央處形成安裝孔74、74A。又,於導向部本體71D、71E沿著導向部本體71之外周形成複數個孔77,且沿著安裝孔74、74A形成複數個孔78。Mounting holes 74 and 74A are formed in the guide body 71D and 71E at approximately the center. Further, a plurality of holes 77 are formed along the outer periphery of the guide portion body 71 in the guide portion bodies 71D and 71E, and a plurality of holes 78 are formed along the mounting holes 74 and 74A.

於導向部本體71D分別形成複數個大致呈圓弧形狀之切除孔79A、79B,以使導向部本體71D容易變形。切除孔79A、79B分別沿著圓周方向等間隔地配置。切除孔79A之半徑小於切除孔79B之半徑,切除孔79B配置於切除孔79A之外側。又,包含切除孔79A之端之端部區域79Aa、與包含切除孔79B之端之端部區域79Ba在圓周方向之位置大致一致。另外,端部區域79Aa、79Ba分別存在於切除孔79A、79B之兩端。A plurality of cutout holes 79A, 79B each having a substantially circular arc shape are formed in the guide portion body 71D, so that the guide portion body 71D is easily deformed. The cutout holes 79A and 79B are arranged at equal intervals in the circumferential direction, respectively. The radius of the cutout hole 79A is smaller than the radius of the cutout hole 79B. The cutout hole 79B is disposed outside the cutout hole 79A. In addition, the end region 79Aa including the end of the cutout hole 79A and the end region 79Ba including the end of the cutout hole 79B approximately coincide with each other in the circumferential direction. In addition, end regions 79Aa and 79Ba exist at both ends of the cutout holes 79A and 79B, respectively.

於導向部本體71E分別形成複數個大致呈圓弧形狀之切除孔79C、79D,以使導向部本體71E容易變形。切除孔79C、79D分別沿著圓周方向等間隔地配置。切除孔79C之半徑小於切除孔79D之半徑,切除孔79D配置於切除孔79C之外側。又,包含切除孔79C之端之端部區域79Ca、與包含切除孔79D之端之端部區域79Da在圓周方向之位置大致一致。另外,端部區域79Ca、79Da分別存在於切除孔79C、79D之兩端。A plurality of cutout holes 79C and 79D each having a substantially circular arc shape are formed in the guide portion body 71E, so that the guide portion body 71E is easily deformed. The cutout holes 79C and 79D are arranged at equal intervals in the circumferential direction, respectively. The radius of the cutting hole 79C is smaller than the radius of the cutting hole 79D, and the cutting hole 79D is disposed outside the cutting hole 79C. In addition, the end region 79Ca including the end of the cutout hole 79C and the end region 79Da including the end of the cutout hole 79D substantially coincide with each other in the circumferential direction. In addition, end regions 79Ca and 79Da exist at both ends of the cutout holes 79C and 79D, respectively.

於本實施形態中,切除孔79A、79B、79C、79D各為4個,切除孔79A、79B、79C、79D之位置及數量並不限於此。In this embodiment, there are four cutout holes 79A, 79B, 79C, and 79D, and the positions and numbers of the cutout holes 79A, 79B, 79C, and 79D are not limited thereto.

端部區域79Aa與端部區域79Ba在圓周方向之位置大致一致,該重疊之位置平均(例如每隔大致45度)地配置於圓周方向。又,端部區域79Ca與端部區域79Da在圓周方向之位置大致一致,該重疊之位置平均(例如每隔大致45度)地配置於圓周方向。因此,若自導向部本體71D、71E之中心點起劃沿徑向呈輻射狀伸長之線,則該線必定通過切除孔79A~79D中之至少1個。因此,導向部本體71D、71E之變形量不取決於圓周方向之場所,為大致固定。又,藉由如此配置切除孔79A~79D,即便將厚度為1 mm左右之較厚之薄板用於導向部本體71D、71E,導向部本體71D、71E亦隨著大致30 μm之筒狀部35a之上下移動進行伸縮。The positions of the end region 79Aa and the end region 79Ba in the circumferential direction are substantially the same, and the overlapping positions are arranged in the circumferential direction on average (for example, at approximately every 45 degrees). Further, the positions of the end region 79Ca and the end region 79Da in the circumferential direction are substantially the same, and the overlapping positions are arranged in the circumferential direction on average (for example, at approximately every 45 degrees). Therefore, if a line extending radially in a radial direction is drawn from the center point of the guide body 71D, 71E, the line must pass through at least one of the cutout holes 79A to 79D. Therefore, the amount of deformation of the guide body 71D, 71E is substantially constant regardless of the position in the circumferential direction. In addition, by arranging the cutout holes 79A to 79D in this way, even if a thicker plate having a thickness of about 1 mm is used for the guide portion bodies 71D and 71E, the guide portion bodies 71D and 71E follow the cylindrical portion 35a of approximately 30 μm. Move up and down to scale.

圖19係將光照射部30a安裝於支持板153之部分的安裝構造之分解立體圖。於圖19中省略了較光照射部30a之凸緣36a位於更上方之部分。將光照射部30a~30g安裝於底板151之安裝構造,及將光照射部30b~30g安裝於支持板153之安裝構造由於與將光照射部30a安裝於支持板153之安裝構造相同,故而省略說明。FIG. 19 is an exploded perspective view of a mounting structure of a portion where the light irradiation portion 30 a is mounted on the support plate 153. In FIG. 19, a portion located above the flange 36 a of the light irradiation portion 30 a is omitted. The mounting structure for mounting the light irradiating portion 30a to 30g on the base plate 151 and the mounting structure for mounting the light irradiating portion 30b to 30g on the support plate 153 are the same as the mounting structure for mounting the light irradiating portion 30a to the support plate 153, and are omitted. Instructions.

導向構件70E係以覆蓋圓孔156a之方式設置於支持板153。將螺絲85插入至孔77中,並使螺絲85螺合於形成於支持板153之螺絲孔156h中,藉此將導向構件70E固定於支持板153。The guide member 70E is provided on the support plate 153 so as to cover the circular hole 156a. The screw 85 is inserted into the hole 77, and the screw 85 is screwed into the screw hole 156h formed in the support plate 153, thereby fixing the guide member 70E to the support plate 153.

筒狀部35a透過安裝部37a設置於導向構件70E。將螺絲86插入至孔78中,並使螺絲86螺合於形成於凸緣37之螺絲孔371中,藉此將導向構件70E固定於安裝部37a。The cylindrical portion 35a is provided on the guide member 70E through the mounting portion 37a. The screw 86 is inserted into the hole 78, and the screw 86 is screwed into the screw hole 371 formed in the flange 37, thereby fixing the guide member 70E to the mounting portion 37a.

如此,導向構件70E透過安裝部37a固定於筒狀部35a,因此導向構件70E隨著大致30 μm之筒狀部35a之上下移動而變形。As described above, since the guide member 70E is fixed to the cylindrical portion 35a through the mounting portion 37a, the guide member 70E is deformed as the cylindrical portion 35a of approximately 30 μm moves up and down.

根據本實施形態,使用大致1 mm左右之金屬形成了導向構件70D、70E,因此即便於光照射部30較重之情形時,亦可使導向構件70D、70E彈性變形。例如於使用大致0.1 mm左右之金屬形成導向構件之情形時,有若光照射部30變重則導向構件會超出彈性極限之虞。相對於此,於利用大致1 mm左右之金屬形成導向構件70D、70E之情形時,導向構件70D、70E變得堅韌,因此可降低導向構件70D、70E超出彈性極限而塑性變形之可能性。According to this embodiment, since the guide members 70D and 70E are formed using a metal of approximately 1 mm, the guide members 70D and 70E can be elastically deformed even when the light irradiation portion 30 is heavy. For example, when the guide member is formed using a metal of about 0.1 mm, the guide member may exceed the elastic limit if the light irradiation portion 30 becomes heavy. On the other hand, when the guide members 70D and 70E are formed of a metal of about 1 mm, the guide members 70D and 70E become tough. Therefore, it is possible to reduce the possibility of the guide members 70D and 70E plastically deforming beyond the elastic limit.

另外,於本實施形態中,導向構件70D、70E分別具有導向部本體71D、71E,但導向構件70D、70E亦可分別具有按壓環72、72A及按壓環73、73A。但是,由於本實施形態之導向構件70D、70E之厚度較厚,為大致1 mm左右,故按壓環72、72A、73、73A不為必須。In addition, in this embodiment, the guide members 70D and 70E have the guide body 71D and 71E, respectively, but the guide members 70D and 70E may have the pressure rings 72 and 72A and the pressure rings 73 and 73A, respectively. However, since the thicknesses of the guide members 70D and 70E in this embodiment are relatively large, about 1 mm, the pressing rings 72, 72A, 73, and 73A are not necessary.

以上,參照圖式對本發明之實施形態進行了詳細敍述,但具體之構成並不限於該實施形態,亦包括不脫離本發明之主旨之範圍之設計變更等。若為所屬技術領域中具有通常知識者,則可對實施形態之各要素進行適宜變更、追加、轉換等。As mentioned above, the embodiment of the present invention has been described in detail with reference to the drawings, but the specific configuration is not limited to the embodiment, and also includes design changes without departing from the scope of the present invention. As long as it is a person with ordinary knowledge in the technical field to which he belongs, each element of the embodiment can be appropriately changed, added, converted, or the like.

又,於本發明中,所謂「大概」,係指包含不失相同性之程度之誤差或變形之概念,而非僅嚴密地相同之情形。例如,所謂大致水平,並不限於嚴密地水平之情形,例如為包含幾度程度之誤差之概念。又,例如於僅表達為平行、正交等之情形時,視為包括大致平行、大致正交等情形,而非僅嚴密地平行、正交等情形。又,於本發明中,所謂「附近」,意指包含成為基準之位置之附近之某一範圍(可任意地決定)的區域。例如於提及A之附近之情形時,為表示如下情況之概念,即,為A之附近之某一範圍之區域,可包含A亦可不包含A。In addition, in the present invention, the term "approximately" refers to a concept including a degree of error or deformation without losing the sameness, rather than a case where it is exactly the same. For example, the term "approximately horizontal" is not limited to the case where it is strictly horizontal, for example, it is a concept including an error of several degrees. In addition, for example, when the expression is only parallel, orthogonal, etc., it is considered to include situations that are substantially parallel, orthogonal, etc., rather than strictly parallel, orthogonal, etc. In addition, in the present invention, "nearby" means an area including a certain range (optionally determined) in the vicinity of the position serving as a reference. For example, when referring to the situation around A, it is a concept that indicates a situation in which a range of areas around A may include A or not.

1‧‧‧曝光裝置1‧‧‧Exposure device

11‧‧‧壓盤11‧‧‧ platen

11a‧‧‧上表面11a‧‧‧upper surface

12‧‧‧板狀部12‧‧‧ plate

12a‧‧‧上表面12a‧‧‧upper surface

13、14‧‧‧軌道13, 14‧‧‧ track

15‧‧‧框體15‧‧‧Frame

15a‧‧‧支持部15a‧‧‧Support Department

15c‧‧‧柱15c‧‧‧column

20‧‧‧遮罩保持部20‧‧‧Mask holding section

20a‧‧‧上表面20a‧‧‧upper surface

21、22、23‧‧‧棒鏡 30、30a、30b、30c、30d、30e、30f、30g‧‧‧光照射部21, 22, 23‧‧‧ rod mirrors 30, 30a, 30b, 30c, 30d, 30e, 30f, 30g

32a、32b、32c、32d、32e、32f、32g‧‧‧物鏡32a, 32b, 32c, 32d, 32e, 32f, 32g

33a、33b、33c、33d、33e、33f、33g‧‧‧光源部33a, 33b, 33c, 33d, 33e, 33f, 33g

34a、34b、34c、34d、34e、34f、34g‧‧‧AF處理部34a, 34b, 34c, 34d, 34e, 34f, 34g‧‧‧AF processing department

35、35a、35b、35c、35d、35e、35f、35g‧‧‧筒狀部35, 35a, 35b, 35c, 35d, 35e, 35f, 35g

36、36a、36b、36c、36d、36e、36f、36g‧‧‧凸緣36, 36a, 36b, 36c, 36d, 36e, 36f, 36g‧‧‧ flange

37、37a‧‧‧安裝部37, 37a‧‧‧Mounting Department

38、38a‧‧‧安裝部38, 38a‧‧‧Mounting Department

39、39a、39b、39c、39d、39e、39f、39g‧‧‧驅動部39, 39a, 39b, 39c, 39d, 39e, 39f, 39g‧‧‧Driver

40‧‧‧測定部40‧‧‧Measurement Department

41、42‧‧‧位置測定部41, 42‧‧‧ Position Measurement Department

41a、42a‧‧‧游標尺41a, 42a‧‧‧ Vernier

41b、42b‧‧‧檢測頭41b, 42b‧‧‧detection head

50、51、51a、51b、51c、52、52a、52g‧‧‧雷射干涉儀50, 51, 51a, 51b, 51c, 52, 52a, 52g‧‧‧ laser interferometer

55a、55b、55c、56a、56g‧‧‧反射鏡55a, 55b, 55c, 56a, 56g

60、60a、60b、60c、60d、60e、60f、60g‧‧‧讀取部60, 60a, 60b, 60c, 60d, 60e, 60f, 60g

70、70A、70B、70C、70D、70E‧‧‧導向構件70, 70A, 70B, 70C, 70D, 70E‧‧‧Guide members

71、71A、71B、71C、71D、71E‧‧‧導向部本體71, 71A, 71B, 71C, 71D, 71E‧‧‧ guide body

72、72A、73、73A‧‧‧按壓環72, 72A, 73, 73A‧‧‧Press ring

74、74A‧‧‧安裝孔74, 74A‧‧‧Mounting holes

75、76、77、77A、78、78A‧‧‧孔75, 76, 77, 77A, 78, 78A ‧‧‧ holes

79、79A、79B、79C、79D‧‧‧切除孔79, 79A, 79B, 79C, 79D‧‧‧‧cut hole

79Aa、79Ba、79Ca、79Da‧‧‧端部區域79Aa, 79Ba, 79Ca, 79Da‧‧‧End regions

81、82、83‧‧‧驅動部81, 82, 83‧‧‧Driver

85、86‧‧‧螺絲85, 86‧‧‧ Screw

90a、90b、90c、90d、90e、90f、90g‧‧‧旋轉驅動部90a, 90b, 90c, 90d, 90e, 90f, 90g‧‧‧rotation drive unit

91a‧‧‧突起91a‧‧‧ protrusion

92a‧‧‧壓電元件92a‧‧‧piezoelectric element

93a‧‧‧彈性構件93a‧‧‧elastic member

151‧‧‧底板151‧‧‧ floor

153‧‧‧支持板153‧‧‧Support board

152、154‧‧‧側板152, 154‧‧‧Side panels

152a、152b、152c、152d、152e、152f、152g‧‧‧孔152a, 152b, 152c, 152d, 152e, 152f, 152g‧‧‧ holes

154a、154b、154c、154d、154e、154f、154g‧‧‧孔154a, 154b, 154c, 154d, 154e, 154f, 154g

152h、152i、154h、154i‧‧‧孔152h, 152i, 154h, 154i‧‧‧ holes

155a、155b、155c、155d、155e、155f、155g‧‧‧圓孔155a, 155b, 155c, 155d, 155e, 155f, 155g

155h‧‧‧螺絲孔155h‧‧‧Screw hole

156a、156b、156c、156d、156e、156f、156g‧‧‧圓孔156a, 156b, 156c, 156d, 156e, 156f, 156g‧‧‧ round hole

156h‧‧‧螺絲孔156h‧‧‧Screw hole

157a、157b、157c、157d、157e、157f、157g‧‧‧圓孔157a, 157b, 157c, 157d, 157e, 157f, 157g

158‧‧‧凸部158‧‧‧ convex

159‧‧‧間隔壁159‧‧‧ partition

160‧‧‧彈性構件160‧‧‧ Elastic member

161‧‧‧移動機構161‧‧‧mobile agency

161a‧‧‧齒條161a‧‧‧ rack

161b‧‧‧小齒輪161b‧‧‧pinion

161c‧‧‧凸部161c‧‧‧ convex

161d、161e‧‧‧滑動面161d, 161e‧‧‧ sliding surface

162‧‧‧定位構件162‧‧‧Positioning member

162a‧‧‧凹部162a‧‧‧Concave

163‧‧‧永電磁石163‧‧‧Permanent Magnet

201‧‧‧CPU201‧‧‧CPU

201a‧‧‧控制部201a‧‧‧Control Department

202‧‧‧RAM202‧‧‧RAM

203‧‧‧ROM203‧‧‧ROM

204‧‧‧輸入輸出介面204‧‧‧I / O interface

205‧‧‧通訊介面205‧‧‧Communication interface

206‧‧‧媒體介面206‧‧‧Media Interface

211‧‧‧輸入輸出裝置211‧‧‧I / O device

212‧‧‧網路212‧‧‧Internet

213‧‧‧記憶媒體213‧‧‧Memory Media

331‧‧‧光源331‧‧‧light source

332‧‧‧透鏡332‧‧‧Lens

333‧‧‧複眼透鏡333‧‧‧Flying Eye Lens

334、335‧‧‧透鏡334, 335‧‧‧ lens

336‧‧‧反射鏡336‧‧‧Reflector

341‧‧‧AF用光源341‧‧‧AF light source

342‧‧‧準直透鏡342‧‧‧Collimating lens

343‧‧‧AF用柱面透鏡343‧‧‧AF cylindrical lens

344、345‧‧‧五稜鏡344, 345‧‧‧Five

346‧‧‧透鏡346‧‧‧lens

347、348‧‧‧AF感測器347, 348‧‧‧AF sensor

371、381‧‧‧螺絲孔371, 381‧‧‧ screw holes

372‧‧‧中空部372‧‧‧Hollow

391‧‧‧壓電元件391‧‧‧piezoelectric element

392‧‧‧連結部392‧‧‧Connection Department

393‧‧‧凸部393‧‧‧ convex

394‧‧‧槽394‧‧‧slot

395‧‧‧安裝部395‧‧‧Mounting Department

601‧‧‧鏡筒601‧‧‧Mirror tube

602‧‧‧光源單元602‧‧‧light source unit

603‧‧‧鏡筒603‧‧‧Mirror tube

604‧‧‧管透鏡604‧‧‧ tube lens

605‧‧‧半反射鏡605‧‧‧half mirror

606‧‧‧相機606‧‧‧ Camera

621‧‧‧光源621‧‧‧light source

622‧‧‧光纖束622‧‧‧Fiber Bundle

623‧‧‧擴散板623‧‧‧ diffuser

624‧‧‧準直透鏡624‧‧‧ Collimating lens

a1‧‧‧導向部本體之中心a1‧‧‧ the center of the guide body

ax‧‧‧光軸ax‧‧‧optical axis

圖1係表示第1實施形態之曝光裝置1之概略之立體圖。 圖2係表示測定部40及雷射干涉儀50對遮罩保持部20之位置進行測定之狀況的概略圖。 圖3係表示框體15之支持部15a之概略之立體圖,且為自背面側(+x側)觀察之圖。 圖4係表示框體15之支持部15a之概略之立體圖,且為自正面側(-x側)觀察之圖。 圖5係表示沿圖3之面C將框體15切斷時之概略之圖。 圖6係表示光照射部30a之概略之主要部分透視圖。 圖7係表示驅動部39a之概略之側視圖。 圖8係表示讀取部60a之概略之立體圖,且為主要部分之透視圖。 圖9(A)表示將導向構件70安裝於底板151時之底板151與導向構件70之位置關係,圖9(B)表示將導向構件70A安裝於支持板153時之支持板153與導向構件70A之位置關係。 圖10係將光照射部30a安裝於底板151之部分的安裝構造之分解立體圖。 圖11係表示光照射部30a被安裝於框體15之狀態之圖。 圖12(A)表示光照射部30a未移動之狀態(行程中央),圖12(B)表示光照射部30a移動至下側之狀態(行程下端),圖12(C)表示光照射部30a移動至上側之狀態(行程上端)。 圖13係表示曝光裝置1之電氣構成之方塊圖。 圖14係關於第2實施形態之曝光裝置,(A)表示將導向構件70B安裝於底板151時之底板151與導向構件70B之位置關係,(B)表示將導向構件70C安裝於支持板153時之支持板153與導向構件70C之位置關係。 圖15係將光照射部30a安裝於支持板153之部分的安裝構造之分解立體圖。 圖16係表示光照射部30a被安裝於框體15之狀態之圖。 圖17係關於第3實施形態之曝光裝置,且(A)表示將導向構件70D安裝於底板151時之底板151與導向構件70D之位置關係,(B)表示將導向構件70E安裝於支持板153時之支持板153與導向構件70E之位置關係。 圖18(A)係表示導向部本體71D之概略之圖,圖18(B)係表示導向部本體71E之概略之圖。 圖19係將光照射部30a安裝於支持板153之部分的安裝構造之分解立體圖。FIG. 1 is a schematic perspective view showing an exposure apparatus 1 according to the first embodiment. FIG. 2 is a schematic diagram showing a state where the measurement unit 40 and the laser interferometer 50 measure the position of the mask holding unit 20. FIG. 3 is a schematic perspective view showing a supporting portion 15 a of the frame body 15 and is a view viewed from the back side (+ x side). FIG. 4 is a schematic perspective view showing the support portion 15 a of the frame body 15 and is a view viewed from the front side (−x side). FIG. 5 is a diagram schematically illustrating a case where the frame body 15 is cut along the plane C of FIG. 3. FIG. 6 is a perspective view of a main part showing the outline of the light irradiation section 30a. FIG. 7 is a side view schematically showing the driving unit 39a. FIG. 8 is a perspective view showing the outline of the reading section 60a, and is a perspective view of the main part. FIG. 9 (A) shows the positional relationship between the base plate 151 and the guide member 70 when the guide member 70 is mounted on the base plate 151, and FIG. 9 (B) shows the support plate 153 and the guide member 70A when the guide member 70A is mounted on the support plate 153 Location relationship. FIG. 10 is an exploded perspective view of a mounting structure of a portion where the light irradiation portion 30 a is mounted on the bottom plate 151. FIG. 11 is a diagram showing a state in which the light irradiating portion 30 a is mounted on the housing 15. FIG. 12 (A) shows a state in which the light irradiation portion 30a is not moved (center of the stroke), FIG. 12 (B) shows a state in which the light irradiation portion 30a is moved to the lower side (lower stroke), and FIG. 12 (C) shows a light irradiation portion 30a Move to the upper side (upper stroke end). FIG. 13 is a block diagram showing the electrical configuration of the exposure apparatus 1. As shown in FIG. 14 is an exposure apparatus according to the second embodiment. (A) shows the positional relationship between the bottom plate 151 and the guide member 70B when the guide member 70B is mounted on the bottom plate 151, and (B) shows the position member when the guide member 70C is mounted on the support plate 153. The positional relationship between the support plate 153 and the guide member 70C. FIG. 15 is an exploded perspective view of a mounting structure of a portion where the light irradiation portion 30 a is mounted on the support plate 153. FIG. 16 is a view showing a state in which the light irradiating portion 30 a is mounted on the housing 15. FIG. 17 is an exposure apparatus according to the third embodiment, and (A) shows the positional relationship between the base plate 151 and the guide member 70D when the guide member 70D is mounted on the base plate 151, and (B) shows the guide member 70E on the support plate 153. The positional relationship between the support plate 153 and the guide member 70E. FIG. 18 (A) is a diagram showing the outline of the guide body 71D, and FIG. 18 (B) is a diagram showing the outline of the guide body 71E. FIG. 19 is an exploded perspective view of a mounting structure of a portion where the light irradiation portion 30 a is mounted on the support plate 153.

Claims (11)

一種光學裝置之安裝構造,其特徵在於具備 具有筒狀部之光學裝置; 供組裝上述光學裝置之框體; 於上述光學裝置之組裝時設置於上述光學裝置與上述框體之間之大致呈薄板狀之導向構件;及 設置於上述框體且使上述光學裝置沿鉛直方向移動之驅動部;其中, 上述框體形成有沿大致鉛直方向貫通之圓孔; 上述導向構件為俯視時大致呈圓板形狀,且以覆蓋上述圓孔之方式設置於上述框體; 上述導向構件在大致中央處形成有安裝孔; 上述安裝孔與上述圓孔呈大致同心圓狀配置; 上述筒狀部係以光軸與上述安裝孔之中心大致一致之方式被插入至上述安裝孔中而固定於上述導向構件。An optical device mounting structure, comprising an optical device having a cylindrical portion; a frame for assembling the optical device; and a substantially thin plate provided between the optical device and the frame when the optical device is assembled A guide member that is arranged in the frame and moves the optical device in a vertical direction; wherein the frame is formed with a circular hole penetrating in a substantially vertical direction; the guide member is a substantially circular plate in plan view Shape, and is provided on the frame so as to cover the circular hole; the guide member is formed with a mounting hole at approximately the center; the mounting hole and the circular hole are arranged in a substantially concentric circle; the cylindrical portion is based on an optical axis It is inserted into the said mounting hole and fixed to the said guide member so that it may correspond substantially to the center of the said mounting hole. 如請求項1所述之光學裝置之安裝構造,其中上述框體具有大致呈水平地設置之底板、及大致水平地且設置於上述底板之上側之支持板;且 上述底板及上述支持板分別形成有作為上述圓孔之第1圓孔及第2圓孔; 俯視時,上述第1圓孔之中心與上述第2圓孔之中心大致一致; 當上述光學裝置被組裝至上述框體時,上述光學裝置之重心位於上述驅動部推升上述光學裝置之位置之附近。The installation structure of the optical device according to claim 1, wherein the frame body has a bottom plate disposed substantially horizontally, and a support plate disposed substantially horizontally and disposed above the bottom plate; and the bottom plate and the support plate are formed separately. There are a first circular hole and a second circular hole as the circular hole. In a plan view, the center of the first circular hole and the center of the second circular hole are substantially the same. When the optical device is assembled to the frame, the above The center of gravity of the optical device is located near the position where the driving unit pushes up the optical device. 如請求項1或2所述之光學裝置之安裝構造,其中上述框體具有大致水平地設置之支持部、分別設置於上述支持部之兩端之柱、及使上述支持部沿鉛直方向移動之移動機構;且 上述支持部形成有支持部側滑動面; 上述柱以與上述支持部側滑動面對向之方式形成有柱側滑動面; 上述支持部由磁性材料所形成; 上述柱設置有具有永久磁石及電磁石之永電磁石; 當上述移動機構不使上述支持部移動時,藉由向上述電磁石之線圈流入電流,而讓上述永電磁石吸附上述支持部,使上述支持部側滑動面與上述柱側滑動面密接。The mounting structure of the optical device according to claim 1 or 2, wherein the frame body has a support portion provided substantially horizontally, pillars respectively provided at both ends of the support portion, and a mechanism for moving the support portion in a vertical direction. A moving mechanism; and the supporting portion is formed with a supporting portion side sliding surface; the column is formed with a column side sliding surface so as to face the supporting portion side sliding surface; the supporting portion is formed of a magnetic material; Permanent magnets of permanent magnets and electromagnets; when the moving mechanism does not move the support portion, the permanent magnet is attracted to the support portion by flowing a current into the coil of the electromagnet, so that the support portion sliding surface and the column The side sliding surfaces are in close contact. 如請求項3所述之光學裝置之安裝構造,其中上述移動機構具有於與上述支持部之長度方向大致正交之端面沿著上下方向設置之齒條、及可旋轉地設置於上述柱之小齒輪;且 當沿著上述支持部之長度方向觀察時,上述齒條之齒通過上述支持部之重心,且位於與上下方向大致平行之線上。The mounting structure of the optical device according to claim 3, wherein the moving mechanism has a rack provided along an up-down direction on an end surface substantially orthogonal to the length direction of the support portion, and a small portion rotatably provided on the post. A gear; and when viewed along the length direction of the support portion, the teeth of the rack gear pass through the center of gravity of the support portion and are located on a line substantially parallel to the vertical direction. 如請求項1至4中任一項所述之光學裝置之安裝構造,其中上述導向構件由厚度為大致0.1 mm左右之金屬所形成。The mounting structure of the optical device according to any one of claims 1 to 4, wherein the guide member is formed of a metal having a thickness of approximately 0.1 mm. 如請求項5所述之光學裝置之安裝構造,其中於上述導向構件沿著圓周方向形成有複數個環狀扇形狀之切除孔。The mounting structure of the optical device according to claim 5, wherein a plurality of annular fan-shaped cutout holes are formed in the guide member along the circumferential direction. 如請求項1至4中任一項所述之光學裝置之安裝構造,其中上述導向構件由厚度為大致1 mm左右之金屬所形成;且 上述導向構件分別形成有複數個大致呈圓弧形狀之第1切除孔及第2切除孔; 上述第2切除孔配置於上述第1切除孔之外側; 包括上述第1切除孔之端之端部區域,與包括上述第2切除孔之端之端部區域在圓周方向之位置大致一致。The mounting structure of the optical device according to any one of claims 1 to 4, wherein the guide member is formed of a metal having a thickness of approximately 1 mm; and the guide member is formed with a plurality of approximately circular arc shapes, respectively. A first cutout hole and a second cutout hole; the second cutout hole is disposed outside the first cutout hole; an end region including an end of the first cutout hole, and an end portion including an end of the second cutout hole The positions of the regions in the circumferential direction are substantially the same. 如請求項1至7中任一項所述之光學裝置之安裝構造,其中上述導向構件具有大致沿著外周之大致呈環狀之第1厚壁部、及大致沿著上述安裝孔之大致呈環狀之第2厚壁部; 上述導向構件與上述框體透過上述第1厚壁部固定;且 上述導向構件與上述筒狀部透過上述第2厚壁部固定。The mounting structure of the optical device according to any one of claims 1 to 7, wherein the guide member has a first thick wall portion having a substantially annular shape substantially along an outer periphery, and a substantially The ring-shaped second thick wall portion; the guide member and the frame body are fixed through the first thick wall portion; and the guide member and the cylindrical portion are fixed through the second thick wall portion. 如請求項1至8中任一項所述之光學裝置之安裝構造,其中上述光學裝置具有AF處理部,該AF處理部具有照射朝向下之光之AF用光源,及供反射光入射之AF感測器; 上述導向構件在通過上述安裝孔之中心之線上以隔著上述安裝孔之方式形成有2個孔;且 上述2個孔於俯視時與上述AF用光源及上述AF感測器之位置重疊。The mounting structure of the optical device according to any one of claims 1 to 8, wherein the optical device has an AF processing section having an AF light source for radiating downward-pointing light, and an AF for reflecting light incidence The sensor; the guide member is formed with two holes on a line passing through the center of the mounting hole so as to be separated from the mounting hole; and the two holes are connected to the AF light source and the AF sensor in a plan view. Positions overlap. 如請求項6所述之光學裝置之安裝構造,其中上述光學裝置具有AF處理部,該AF處理部具有照射朝向下之光之AF用光源,及供反射光入射之AF感測器;且 上述切除孔於俯視時與上述AF用光源及上述AF感測器之位置重疊。The mounting structure of the optical device according to claim 6, wherein the optical device has an AF processing section having an AF light source for radiating downward-pointing light, and an AF sensor for incident reflected light; and The cutout hole overlaps the positions of the AF light source and the AF sensor in a plan view. 一種曝光裝置,其特徵在於具備 供載置工件之平板; 具有筒狀部且向上述工件照射光之光照射部; 供組裝上述光照射部並將上述光照射部保持於上述平板之上方之框體; 於上述光照射部之組裝時設置於上述光照射部與上述框體之間之大致呈薄板狀之導向構件;及 設置於上述框體且使上述光照射部沿鉛直方向移動之驅動部;其中, 上述框體形成有沿大致鉛直方向貫通之圓孔; 上述導向構件係以覆蓋上述圓孔之方式設置於上述框體; 上述導向構件為俯視時大致呈圓板形狀,且於中央部形成有安裝孔; 上述安裝孔與上述圓孔呈大致同心圓狀配置; 上述筒狀部係以光軸與上述安裝孔之中心大致一致之方式被插入至上述安裝孔中而固定於上述導向構件。An exposure device comprising a flat plate on which a workpiece is placed; a light irradiation portion having a cylindrical portion and irradiating light to the workpiece; a frame for assembling the light irradiation portion and holding the light irradiation portion above the plate; A substantially thin plate-shaped guide member provided between the light irradiating portion and the frame during assembly of the light irradiating portion; and a driving portion provided in the frame and moving the light irradiating portion in a vertical direction Wherein, the frame body is formed with a circular hole penetrating in a substantially vertical direction; the guide member is provided on the frame body so as to cover the circular hole; the guide member has a substantially circular plate shape in a plan view, and is located at the center A mounting hole is formed; the mounting hole and the circular hole are arranged substantially concentrically; the cylindrical portion is inserted into the mounting hole so that the optical axis substantially coincides with the center of the mounting hole and is fixed to the guide member .
TW107137300A 2017-11-24 2018-10-23 Optical device mounting structure and exposure device TWI772544B (en)

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