TW201928520A - 感光性樹脂組成物、乾膜光阻及樹脂組成物與乾膜光阻的硬化物 - Google Patents
感光性樹脂組成物、乾膜光阻及樹脂組成物與乾膜光阻的硬化物 Download PDFInfo
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- TW201928520A TW201928520A TW107143428A TW107143428A TW201928520A TW 201928520 A TW201928520 A TW 201928520A TW 107143428 A TW107143428 A TW 107143428A TW 107143428 A TW107143428 A TW 107143428A TW 201928520 A TW201928520 A TW 201928520A
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Abstract
本發明的目的是提供一種感光性樹脂組成物,該感光性樹脂組成物保有良好的圖像解析度,且減少硬化物的濕熱溶出汙染,濕熱接著性良好。本發明係一種感光性樹脂組成物,其中含有(A)光陽離子聚合起始劑及(B)環氧化合物,前述(A)光陽離子聚合起始劑含有由下述式(1)表示的陰離子與陽離子所形成之鹽,式(1)中,R1至R4是分別獨立地表示碳數1至18的烷基或碳數6至14的芳基。但是,R1至R4中的至少一者是表示碳數6至14的芳基。R1至R4,可以分別獨立地為具有全氟烷基作為取代基的苯基、或具有氟原子作為取代基的苯基。R1至R4可以分別獨立地為五氟苯基或雙(三氟甲基)苯基。
Description
本發明有關於感光性樹脂組成物,該感光性樹脂組成物係有用於MEMS(微電子機械系統,Micro Electro Mechanical Systems)零件、微機械零件、微流體零件、μ-TAS(micro-Total Analysis System,微全分析系統)零件、噴墨印刷頭零件、微反應器零件、電容器或感應器(inductor)等電子零件之絕緣層、LIGA零件、微射出成形及熱壓花用模具及沖模、微細印刷用途用網板或模板(stencil)、行動終端和IoT(物聯網,Internet of Things)零件上裝載的MEMS感測器、半導體元件、濾波器元件(frequency filter device)等封裝零件、生物MEMS及生物光子元件(Biophotonic device)以及印刷電路板的製作,為解析度優良,且其硬化物的濕熱溶出汙染極低,而且與濕熱試驗後的基板之間的接著性優良者。
可光蝕刻(photolithography)加工的光阻,能夠廣泛使用於半導體或MEMS、微機械應用上。在此種應用中,光蝕刻加工係藉由在基板上進行圖案化曝光,接著用顯影液進行顯影以選擇性地去除曝光區域或未 曝光區域而逹成。可光蝕刻加工的光阻(光阻劑,photoresist)有正型或負型,曝光部分溶解於顯影液者為正型,同理,不溶解者為負型。
依據重氮醌-酚醛清漆的組合之傳統的正型光阻,不適合使用於要求厚膜的用途上。此厚度的限制,乃是因為在使光阻曝光時,重氮萘醌型光活性化合物在典型上所使用的光學光譜之近紅外域中的波長中的吸光度較高所造成的。
另一方面,作為已解決正型光阻的問題之負型光阻,已有提案為含有多官能環氧樹脂與光聚合起始劑的可形成厚膜圖案之感光性環氧樹脂組成物(參照專利文獻1)。
專利文獻1所揭示的是一種感光性樹脂組成物,係含有屬於銻化合物的特定結構之光聚合起始劑。該文獻中記載著使用該種特定結構的光聚合起始劑而將良好的圖像解析度、接著性等特性提升的方式。然而,含有氟化銻系化合物的光聚合起始劑雖然具有比較高的靈敏度,但存在著銻毒性的問題。已有許多銻化合物被指為有害物質,不僅強烈限制其用途,也因為加工條件而從氟化銻系化合物中游離出氟化氫,而成為將金屬部分腐蝕的原因。因此,有著除了追加避免腐蝕不良的步驟之外別無他法的不便之處。而且,由此起始劑而致之聚合硬化物,在以硬化物單獨進行耐濕熱性的指標之壓力鍋試驗(pressure cooker test,以下稱為「PCT試驗」)時,其萃取水呈強酸性,會溶出多量的游離氟化氫及樹脂的氧化分解物等。
專利文獻2及3中,所提案的感光性樹脂組成物係使用陰離子部分的中心元素為硼或磷之特定結構的非銻化合物之光陽離子聚合起始劑。此等文獻中,記載著使用非銻化合物的光陽離子聚合起始劑之感光性 樹脂組成物係顯示與使用銻化合物的光陽離子聚合起始劑之感光性樹脂組成物為同等或高於該感光性樹脂組成物的靈敏度。然而,當將使用此等文獻所述之非銻化合物的光聚合起始劑之組成物的硬化物供於PCT試驗時,其萃取水顯示出高導電率及低pH。此種硬化物不僅耐水性或耐濕熱性不足,且在濕熱環境下或耐水環境下恐會導致酸性溶出物所造成之汙染。因此,此等文獻的感光性樹脂組成物,在應用於使用水系流體的微流體零件、μ-TAS(微全分析系統)零件及噴墨噴嘴零件等用途,和在樹脂密封時要求高耐熱性的行動資訊終端上所裝載之濾波器元件或裝載在IoT零件上的感測器等電子封裝應用等用途上時,係受到強烈的限制。
[專利文獻1]日本專利第4691047號公報
[專利文獻2]日本專利第6205522號公報
[專利文獻3]日本專利第5020646號公報
本發明是有鑑於上述情況而成者,目的在於提供一種感光性樹脂組成物,係保有良好的圖像解析度,且減少硬化物的濕熱溶出汙染、濕熱接著性良好者。
用以解決上述課題的本發明之各種形態,係如下述。
〔1〕一種感光性樹脂組成物,係含有(A)光陽離子聚合起始劑及(B)環氧化合物;該(A)光陽離子聚合起始劑含有由下述式(1)表示的陰離子與陽離子所形成之鹽,且該(B)環氧化合物含有選自:下述式(2)表示的環氧化合物(b-1)、下述式(3)表示的環氧化合物(b-2)、下述式(4)表示的環氧化合物(b-3)、選自下述式(5)至(7)表示的環氧化合物之群組中的一種以上之環氧化合物(b-4)、下述式(8)及/或式(9)表示的化合物與下述式(10)及/或式(11)表示的化合物之共縮合物的環氧化合物(b-5)、下述式(12)表示的環氧化合物(b-6)、下述式(13)表示的環氧化合物(b-7)、下述式(14)表示的環氧化合物(b-8)、下述式(15)表示的環氧化合物(b-9)、及下述式(16)表示的環氧化合物(b-10)所形成之群組中的1種或2種以上的環氧化合物;
(式(1)中,R1至R4是分別獨立地表示碳數1至18的烷基或碳數6至14的芳基。但是,R1至R4中的至少一者是表示碳數6至14之芳基。)
(式(2)中,R5是分別獨立地表示縮水甘油基或氫原子,存在複數個R5之中的至少2個是縮水甘油基。k表示平均重複數,係0至30的範圍之實數。)
(式(3)中,R6是分別獨立地表示氫原子、碳數1至4的烷基或三氟甲基。R7是表示氫原子或縮水甘油基,存在複數個R7時,各別的R7可以是相同,也可不同。m是表示平均重複數,係0至30的範圍之實數。)
(式(4)中,R8是分別獨立地表示氫原子或碳數1至4的烷基。n是表示平均重複數,係4至30的範圍之實數。)
(式(6)中,R9是分別獨立地表示氫原子或縮水甘油基。)
(式(7)中,R10是分別獨立地表示氫原子或縮水甘油基。)
(式(12)中,R12是分別獨立地表示氫原子或碳數1至4的烷基。p是表示平均重複數,係0至10的範圍之實數。)
(式(13)中,q是表示平均重複數,係0至5的範圍之實數。)
(式(14)中,r是表示平均重複數,係0至6的範圍之實數。)
(式(15)中,R13是分別獨立地表示氫原子或碳數1至4的烷基。s是表示平均重複數,係0至30的範圍之實數。)
(式(16)中,t、u及v是分別表示平均重複數,係滿足2≦t+u+v≦60的關係之實數。)
〔2〕如上述〔1〕項所述之感光性樹脂組成物,其中,R1至R4分別獨立地為具有全氟烷基作為取代基的苯基、或具有氟原子作為取代基的苯基。
〔3〕如上述〔2〕項所述之感光性樹脂組成物,其中,R1至R4是分別獨立地為五氟苯基或雙(三氟甲基)苯基。
〔4〕如上述〔1〕至〔3〕項中任一項所述之感光性樹脂組成物,其中,(A)光陽離子聚合起始劑係含有由式(1)表示的陰離子與具有碘原子或硫原子的陽離子所形成之鹽。
〔5〕一種乾膜光阻(dry film resist),該乾膜光阻是用基材夾住上述〔1〕至〔4〕項中任一項所述之感光性樹脂組成物而得者。
〔6〕一種硬化物,係上述〔1〕至〔4〕項中任一項所述之感光性樹脂組成物或上述〔5〕項所述之乾膜光阻的硬化物。
本發明的感光性樹脂組成物係解析度優良,同時該組成物的硬化物之濕熱溶出汙染極低,而且與濕熱試驗後的基板之間的接著性優良,因此可以適合使用於使用水系流體的用途或樹脂密封時要求高耐濕熱性的用途上所使用的MEMS零件等之中。
以下說明本發明。
本發明的感光性樹脂組成物中含有的(A)光陽離子聚合起始劑,係含有由前述式(1)表示的陰離子與陽離子所形成之鹽。
式(1)中,R1至R4雖然是分別獨立地表示碳數1至18之烷基或碳數6至14的芳基,但R1至R4中的至少一者是表示碳數6至14之芳基。亦即,式(1)中的R1至R4是以下之任一種組合。
(i)R1至R4之中的一者為芳基,其餘三者為烷基的組合。
(ii)R1至R4之中的二者為芳基,其餘二者為烷基的組合。
(iii)R1至R4之中的三者為芳基,其餘一者為烷基的組合。
(iv)R1至R4皆為芳基之組合。
上述的組合之中,係以(iii)或(iv)的陰離子為佳,並以(iv)的陰離子為更佳。
式(1)的R1至R4所表示的碳數1至18之烷基,並不限制為直鏈狀、分枝鏈狀或環狀的任一種。其具體例可舉出:甲基、乙基、正丙基、異丙基、正丁基、異丁基、第三丁基、正戊基、異戊基、第三戊基、第二戊基、正己基、異己基、正庚基、第二庚基、正辛基、正壬基、第二壬基、正癸基、正十一基、正十二基、正十三烷基、正十四基、正十五基、正十六基、正十七基、正十八基、環戊基及環己基等。
式(1)的R1至R4表示碳數1至18之烷基,可具有取代基。此處所謂之「可具有取代基的烷基」,係指烷基為其結構中具有的氫原子經取代基取代的烷基。取代基的位置及取代基之數目並無特別的限制。又,取代基具有碳原子時,R1至R4所表示之烷基的碳數不包括取代基所具有的碳原子之數目。具體而言,例如在具有苯基作為取代基的乙基時,係視為碳數2的烷基。
式(1)的R1至R4表示碳數1至18之烷基可具有的取代基,雖無特別的限制(但是,烷基除外),可列舉例如:烷氧基、芳香族基、雜環基、鹵素原子、羥基、硫醇基、硝基、烷基取代胺基、芳基取代胺基、無取代胺基(NH2基)、氰基、異氰基(isocyano group)等。
式(1)的R1至R4所表示之碳數1至18之烷基可具有的作為取代基的烷氧基,係氧原子與烷基所鍵結的取代基。烷氧基所具有的烷基可列舉例如:與式(1)的R1至R4表示碳數1至18之烷基的段落所述之烷基相同者。
式(1)的R1至R4所表示之碳數1至18之烷基可具有的作為取代基的芳香族基,若為由芳香族化合物的芳香環中去除一個氫原子後之殘基,即無特別的限制。可列舉例如:苯基、聯苯基、三苯基、八苯基、甲苯基、茚基、萘基、蒽基、茀基、芘基、菲基及2,4,6-三甲苯基等。
式(1)的R1至R4表示之碳數1至18之烷基可具有的作為取代基的雜環基,若為從雜環化合物的雜環中去除一個氫原子後之殘基,即無特別的限制。可列舉例如:呋喃基、噻吩基、噻吩並噻吩基、吡咯基、咪唑基、N-甲基咪唑基、噻唑基、唑基、吡啶基、吡基、嘧啶基、喹啉基、吲哚基、苯並吡基、苯並嘧啶基、苯並噻吩基、萘並噻吩基、苯並呋喃基、苯並噻唑基、吡啶並噻唑基、苯並咪唑基、吡啶並咪唑基、N-甲基苯並咪唑基、吡啶並-N-甲基咪唑基、苯並唑基、吡啶並唑基、苯並噻二唑基、吡啶並噻二唑基、苯並二唑基、吡啶並二唑基、咔唑基、啡基及啡噻基等。
式(1)的R1至R4所表示之碳數1至18之烷基可具有的作為取代基的鹵素原子,其具體例可舉出:氟原子、氯原子、溴原子及碘原子。
式(1)的R1至R4所表示之碳數1至18之烷基可具有的作為取代基的烷基取代胺基,並不限制為單烷基取代胺基及二烷基取代胺基之任一者,此等烷基取代胺基中的烷基,可列舉例如:與式(1)的R1至R4所表示之碳數1至18之烷基的段落所述之烷基相同者。
式(1)的R1至R4所表示之碳數1至18之芳基可具有的作為取代基的芳基取代胺基,並不限制為單芳基取代胺基及二芳基取代胺基之任一者。此等芳基取代胺基中的芳基可舉出:與式(1)的R1至R4所表示之碳數1至18的烷基可具有的作為取代基之芳香族基相同者。
式(1)的R1至R4所表示之碳數6至14之芳基的具體例,可舉出與式(1)的R1至R4所表示之碳數1至18之烷基可具有的作為取代基的芳香族基相同者。
式(1)的R1至R4所表示之碳數6至14之芳基可具有取代基。此處所謂之「具有取代基的芳基」,意指芳基為其結構中所具有的氫原子經取代基取代的芳基。取代基的位置及取代基之數目並無特別的限制。又,取代基具有碳原子時,在R1至R4表示芳基的碳數中不包括取代基所具有的碳原子之數目。具體而言,例如在具有乙基作為取代基的苯基時,係視為碳數6的芳基。
式(1)的R1至R4所表示之碳數6至14之芳基可具有的取代基,雖然無特別的限制,但可列舉例如:烷基、烷氧基、芳香族基、雜環基、鹵素原子、羥基、硫醇基、硝基、烷基取代胺基、芳基取代胺基、無取代胺基(NH2基)、氰基、異氰基等。
式(1)的R1至R4所表示之碳數6至14之芳基可具有的作為取代基之烷基,可列舉例如:與式(1)的R1至R4所表示之碳數1至18之烷基的段落所述之烷基相同者。
式(1)的R1至R4所表示之碳數6至14之芳基可具有的作為取代基之烷氧基、芳香族基、雜環基、鹵素原子、烷基取代胺基及芳基取代胺基之具體例,可舉出:與式(1)的R1至R4所表示之碳數1至18之烷基可具有的作為取代基的烷氧基、芳香族基、雜環基、鹵素原子、烷基取代胺基及芳基取代胺基相同者。
式(1)中的R1至R4係以具有鹵素原子作為取代基的碳數1至18之烷基、或具有鹵素原子作為取代基的碳數6至14之芳基為佳,並以具有氟原子作為取代基的碳數1至18之烷基、或具有氟原子作為取代基的碳數6至14之芳基為更佳。
與式(1)表示的陰離子形成鹽之陽離子,若為一價的陽離子即無特別的限制,惟以鋞離子(oxonium ion)、銨離子(ammonium ion)、鏻離子(phosphonium ion)、鋶離子(sulfonium ion)或錪離子(iodonium ion)為佳,並以銨離子、鏻離子、鋶離子或錪離子為更佳,而以鋶離子或錪離子為又更佳。
鋞離子,可列舉例如:三甲基鋞、二乙基甲基鋞、三乙基鋞及四亞甲基甲基鋞等鋞;4-甲基吡喃鎓(4-methyl-pyrylium)、2,4,6-三甲基吡喃鎓、2,6-二-第三丁基吡喃鎓及2,6-二苯基吡喃鎓等吡喃鎓;2,4-二甲基苯並吡喃鎓(2,4-dimethyl chromenium)及1,3-二甲基異苯並吡喃鎓等苯並吡喃鎓或異苯並吡喃鎓等。
銨離子可列舉例如:N,N-二甲基吡咯烷鎓、N-乙基-N-甲基吡咯烷鎓及N,N-二乙基吡咯烷鎓等吡咯烷鎓;N,N’-二甲基咪唑啉鎓、N,N’-二乙基咪唑啉鎓、N-乙基-N’-甲基咪唑啉鎓、1,3,4-三甲基咪唑啉鎓及1,2,3,4-四甲基咪唑啉鎓等咪唑啉鎓;N,N’-二甲基四氫嘧啶鎓等四氫嘧啶鎓;N,N’-二甲基嗎啉鎓等嗎啉鎓;N,N’-二乙基哌啶鎓等哌啶鎓;N-甲基吡啶鎓、N-苯甲基吡啶鎓及N-苯甲醯甲基吡啶鎓等吡啶鎓;N,N’-二甲基咪唑鎓等咪唑鎓、N-甲基喹啉鎓、N-苯甲基喹啉鎓及N-苯甲醯甲基喹啉鎓等喹啉鎓;N-甲基異喹啉鎓等異喹啉鎓;苯甲基苯並噻唑鎓及苯甲醯甲基苯並噻唑鎓等噻唑鎓;苯甲基吖啶鎓及苯甲醯甲基吖啶鎓等吖啶鎓等。
鏻離子,可列舉例如:四苯基鏻、四-對-甲苯基鏻、肆(2-甲氧基苯基)鏻、肆(3-甲氧基苯基)鏻及肆(4-甲氧基苯基)鏻等四芳基鏻;三苯基苯甲基鏻、三苯基苯甲醯甲基鏻、三苯基甲基鏻及三苯基丁基鏻等三芳基鏻;三乙基苯甲基鏻、三丁基苯甲基鏻、四乙基鏻、四丁基鏻、四己基鏻、三乙基苯甲醯甲基鏻及三丁基苯甲醯甲基鏻等四烷基鏻等。
鋶離子可列舉例如:三苯基鋶、三-對-甲苯基鋶、三-鄰-甲苯基鋶、參(4-甲氧基苯基)鋶、1-萘基二苯基鋶、2-萘基二苯基鋶、參(4-氟苯基)鋶、三-1-萘基鋶、三-2-萘基鋶、參(4-羥基苯基)鋶、4-(苯硫基)苯基二苯基鋶、4-(對-甲苯基硫基)苯基二-對-甲苯基鋶、4-(4-甲氧基苯硫基)苯基雙(4-甲氧基苯基)鋶、4-(苯硫基)苯基雙(4-氟苯基)鋶、4-(苯硫基)苯基雙(4-甲氧基苯基)鋶、4-(苯硫基)苯基二-對- 甲苯基鋶、〔4-(4-聯苯基硫基)苯基〕-4-聯苯基苯基鋶、〔4-(2-硫雜蒽酮基硫基)苯基〕二苯基鋶、雙〔4-(二苯基二氫硫基)苯基〕硫化物、雙〔4-{雙〔4-(2-羥基乙氧基)苯基〕二氫硫基}苯基〕硫化物、雙{4-〔雙(4-氟苯基)二氫硫基〕苯基〕硫化物、雙{4-〔雙(4-甲基苯基)二氫硫基〕苯基〕硫化物、雙{4-〔雙(4-甲氧基苯基)二氫硫基〕苯基〕硫化物、4-(4-苯甲醯基-2-氯苯基硫基)苯基雙(4-氟苯基)鋶、4-(4-苯甲醯基-2-氯苯基硫基)苯基二苯基鋶、4-(4-苯甲醯基苯硫基)苯基雙(4-氟苯基)鋶、4-(4-苯甲醯基苯硫基)苯基二苯基鋶、7-異丙基-9-側氧-10-硫雜-9,10-二氫蒽-2-基二-對-甲苯基鋶、7-異丙基-9-側氧-10-硫雜-9,10-二氫蒽-2-基二苯基鋶、2-〔(二-對-甲苯基)二氫硫基〕硫雜蒽酮、2-〔(二苯基)二氫硫基〕硫雜蒽酮、4-(9-側氧-9H-硫雜蒽-2-基)苯硫基-9-側氧-9H-硫雜蒽-2-基苯基鋶、4-〔4-(4-第三丁基苯甲醯基)苯硫基〕苯基二-對-甲苯基鋶、4-〔4-(4-第三丁基苯甲醯基)苯硫基〕苯基二苯基鋶、4-〔4-(苯甲醯基苯硫基)〕苯基二-對-甲苯基鋶、4-〔4-(苯甲醯基苯硫基)〕苯基二苯基鋶、5-(4-甲氧基苯基)硫代蒽鎓、5-苯基硫代蒽鎓、5-甲苯基硫代蒽鎓、5-(4-乙氧基苯基)硫代蒽鎓及5-(2,4,6-三甲基苯基)硫代蒽鎓等三芳基鋶、二苯基苯甲醯甲基鋶、二苯基4-硝基苯甲醯甲基鋶、二苯基苯甲基鋶及二苯基甲基鋶等二芳基鋶、苯基甲基苯甲基鋶、4-羥基苯基甲基苯甲基鋶、4-甲氧基苯基甲基苯甲基鋶、4-乙醯基羰氧基苯基甲基苯甲基鋶、4-羥基苯基(2-萘基甲基)甲基鋶、2-萘基甲基苯甲基鋶、2-萘基甲基(1-乙氧基羰基)乙基鋶、苯基甲基苯甲醯甲基鋶、4-羥基苯基甲基苯甲醯甲基鋶、4-甲氧基苯基甲基苯甲醯甲基鋶、4-乙醯基羰氧基苯 基甲基苯甲醯甲基鋶、2-萘基甲基苯甲醯甲基鋶、2-萘基十八基苯甲醯甲基鋶及9-蒽基甲基苯甲醯甲基鋶等單芳基鋶、二甲基苯甲醯甲基鋶、苯甲醯甲基四氫噻吩鎓、二甲基苯甲基鋶、苯甲基四氫噻吩鎓及十八基甲基苯甲醯甲基鋶等三烷基鋶等。
錪離子,可列舉例如:二苯基錪、二-對-甲苯基錪、雙(4-十二基苯基)錪、雙(4-甲氧基苯基)錪、(4-辛氧基苯基)苯基錪、雙(4-癸氧基)苯基錪、4-(2-羥基十四基氧基)苯基錪、4-異丙基苯基(對-甲苯基)錪及4-異丁基苯基(對-甲苯基)錪等錪離子等。
由式(1)表示的陰離子與陽離子所形成之鹽,可依照例如日本特開2013-043864號公報等所述之周知的方法予以合成。而且,也可以取得市售的CPI-310FG(商品名,光陽離子聚合起始劑,San Apro公司製造)等而使用。
本發明的感光性樹脂組成物中含有之(A)光陽離子聚合起始劑所含有的由式(1)表示之陰離子與陽離子形成的鹽之具體例係如以下例示,但並不侷限於此等者。
本發明的感光性樹脂組成物中的(A)光陽離子聚合起始劑之含量,相對於(B)環氧化合物之含量,較佳為0.05至15質量%,更佳為0.07至10質量%,又更佳為0.1至8質量%,最佳為0.5至5質量%。(A)光陽離子聚合起始劑在波長300至380nm中之莫耳吸光係數高時,亦可配合使用感光性樹脂組成物時的體積或厚度而適當地調整調配量。
而且,(A)光陽離子聚合起始劑中的由式(1)表示之陰離子與陽離子所形成之鹽的含量,若不損及本發明的效果即無特別的限制,較佳的是80質量%以上,更佳的是90質量%以上,又更佳的是95質量%以上,最佳的是100質量%。
本發明的感光性樹脂組成物中含有的(B)環氧化合物,係含有選自上述的環氧化合物(b-1)至(b-10)所形成之群組中的1種或2種以上的環氧化合物。
前述環氧化合物(b-1)的具體例,可舉出:KM-N LCL(商品名,雙酚A酚醛清漆型環氧樹脂,日本化藥公司製造,環氧基當量195至210g/eq.,軟化點78至86℃)、jER157(商品名,雙酚A酚醛清漆型環氧樹脂,三菱化學公司製造,環氧基當量200至220g/eq.,軟化點70℃)、EPON SU-8(商品名,雙酚A酚醛清漆型環氧樹脂,Hexion公司製造,環氧基當量195至230g/eq.,軟化點80至90℃)等。
前述環氧化合物(b-2)例如:雙酚A型環氧化合物、雙酚F型環氧化合物,及此等環氧化合物為其結構中具有的醇性羥基之一部分或全部經環氧化的環氧化合物等。雙酚A型環氧化合物的具體例,可舉出:新日鐵住金化學公司製造的YD系列、三菱化學公司製造的jER828系列或 jER1000系列,及DIC公司製造的EPICLON系列等(依平均重複數的不同而有各式各樣的環氧基當量及軟化點)。雙酚F型環氧化合物的具體例,可舉出:新日鐵住金化學公司製造的YDF系列、三菱化學公司製造的jER800系列或jER4000系列,及DIC公司製造的EPICLON系列等(依平均重複數的不同而有各式各樣的環氧基當量及軟化點)。而且,雙酚A型環氧化合物或雙酚F型環氧化合物為其結構中具有的醇性羥基之一部分或全部經環氧化的環氧化合物之具體例,可舉出:NER-7604及NER-7403(均是商品名,日本化藥公司製造,環氧基當量200至500g/eq.,軟化點55至80℃)、NER-1302及NER-7516(均是商品名,日本化藥公司製造,環氧基當量200至500g/eq.,軟化點55至80℃)等。
又,本說明書中,環氧化合物中的結構單元之重複數,係指由依照GPC的測定結果換算聚苯乙烯而計算出的數量平均分子量與通式計所算出之值。後述的實施例中使用之環氧化合物的重複數係由此方式所計算出之值。
前述環氧化合物(b-3)的具體例,可舉出NC-3000H等NC-3000系列(商品名,聯苯-酚酚醛清漆型環氧樹脂,日本化藥公司製造,環氧基當量270至300g/eq.,軟化點55至75℃)。
前述環氧化合物(b-4)的具體例,可舉出NC-6300H(商品名,日本化藥公司製造,環氧基當量226至238g/eq.,軟化點67至74℃)。
前述環氧化合物(b-5),可藉由例如日本特開2007-291263號公報所述之方法而獲得。
前述環氧化合物(b-6)的具體例,可舉出EPPN-201(商品名,日本化藥公司製造,環氧基當量180至200g/eq.,軟化點65至78℃)、 EOCN-1020-70等EOCN-1020系列(商品名,日本化藥公司製造,環氧基當量190至210g/eq.,軟化點55至85℃)等。
前述環氧化合物(b-7)的具體例,可舉出EPPN-501H(商品名,日本化藥公司製造,環氧基當量162至172g/eq.,軟化點51至57℃)、EPPN-501HY(商品名,日本化藥公司製造,環氧基當量163至175g/eq.,軟化點57至63℃)、EPPN-502H(商品名,日本化藥公司製造,環氧基當量158至178g/eq.,軟化點60至72℃)。
前述環氧化合物(b-8)的具體例,可舉出XD-1000(商品名,日本化藥公司製造,環氧基當量245至260g/eq.,軟化點68至78℃)。
前述環氧化合物(b-9)的具體例,可舉出NC-7700(商品名,日本化藥公司製造,環氧基當量210至250g/eq.,軟化點86至91℃)。
前述環氧化合物(b-10)的具體例,可舉出EHPE3150(商品名,Daicel化藥公司製造,環氧基當量170至190g/eq.,軟化點70至90℃)。
本發明的感光性樹脂組成物中含有的(B)環氧化合物之環氧基當量及分子量並無特別的限制,而且對於軟化點也無特別的限制。在使後述的乾膜光阻與光罩直接接觸而使用時,為了防止光罩沾黏(mask sticking),(B)環氧化合物的軟化點係以在40℃以上為佳,並以55℃以上為更佳。
又,本說明書中的環氧基當量,係指依照JIS K7236的方法所測定之值。本說明書中的分子量,係指依照凝膠滲透層析的測定結果換算聚苯乙烯而計算出的重量平均分子量之值。本說明書中的軟化點,係指依照JIS K7234的方法所測定之值。
本發明的感光性樹脂組成物中,可視需要任意選擇環氧化合物(b-1)至(b-10)以外的環氧化合物、溶劑、接著性賦予劑、多元醇化合物、多元酚化合物、增敏劑或離子捕捉劑等成分並予以併用。可併用的任意成分,在不阻礙感光性樹脂組成物的功能、效果之範圍,並無特別的限制。
本發明的感光性樹脂組成物中可併用的環氧化合物(b-1)至(b-10)以外的環氧化合物,並無特別的限制,可使用周知的縮水甘油醚型環氧化合物或脂環式環氧化合物。通常併用也稱為反應性稀釋劑的二乙二醇二縮水甘油醚、己二醇二縮水甘油醚、二羥甲基丙烷二縮水甘油醚、聚丙二醇二縮水甘油醚(Adeka公司製造,ED506)、三羥甲基丙烷三縮水甘油醚(Adeka公司製造,ED505)、三羥甲基丙烷三縮水甘油醚(低氯型,長瀨Nagase Chemtechs公司製造,EX321L)、異戊四醇四縮水甘油醚等,可有效地改善感光性樹脂組成物的反應性或硬化膜之物性等。
本發明的感光性樹脂組成物中作為任意成分的環氧化合物之含量,若是在不損及本發明的效果之範圍內,即無特別的限制,在去除溶劑的感光性樹脂組成物之固形分中,以使用成為10質量%以下之量為佳。
可在本發明的感光性樹脂組成物中併用的溶劑,雖然無特別的限制,但以使用印墨或塗料等之中通常使用的有機溶劑且可溶解感光性樹脂組成物的各種成分者為佳。此種有機溶劑可舉出:丙酮、乙基甲基酮、甲基異丁基酮、環己酮及環戊酮等酮類、甲苯、二甲苯、甲氧基苯及四甲基苯等芳香族烴類、二甘二甲醚(diglyme)、二丙二醇二甲醚及二丙二醇二乙醚等醇醚類、乳酸乙酯、乳酸丁酯、乳酸丙酯、乙酸乙酯、乙醯乙酸甲 酯、乙醯乙酸乙酯、丙酸甲酯、丙酸乙酯、丙酸丙酯、丙酸異丙酯、2-羥基丙酸甲酯、2-羥基丙酸乙酯、甲基-3-甲氧基丙酸酯、乙基-3-甲氧基丙酸酯、乙基-3-乙氧基丙酸酯、丙基-3-甲氧基丙酸酯、乙酸丁酯、丁基賽璐蘇乙酸酯、卡必醇乙酸酯及丙二醇單甲醚乙酸酯等酯類、α-乙內酯、β-丙內酯、γ-丁內酯及δ-戊內酯等內酯類、甲醇、乙醇、賽璐蘇及甲基賽璐蘇等醇類、辛烷及癸烷等脂肪族烴、石油醚、石油腦、氫化石油腦及溶劑石油腦等石油系溶劑等。此等溶劑可單獨使用,也可以將複數種混合而使用。
本發明的感光性樹脂組成物中之溶劑的含量,若是在不損及本發明的效果的範圍內即無特別的限制,感光性樹脂組成物中,通常可使用之量為95質量%以下,並以10至90質量%之量為佳。
本發明的感光性樹脂組成物中可併用的接著性賦予劑並無特別的限制,可使用周知的矽烷偶合劑或鈦偶合劑等。較佳的是矽烷偶合劑。此等接著性賦予劑可單獨使用,也可以將複數種混合而使用。
矽烷偶合劑的具體例可舉出:3-氯丙基三甲氧基矽烷、乙烯基三氯矽烷、乙烯基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基參(2-甲氧基乙氧基)矽烷、3-甲基丙烯醯氧基丙基三甲氧基矽烷、2-(3,4-環氧基環己基)乙基三甲氧基矽烷、3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷、3-縮水甘油氧基丙基甲基二甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、3-硫醇基丙基三甲氧基矽烷、8-縮水甘油基辛基三甲氧基矽烷等。此等偶合劑可單獨使用,也可以將複數種混合而使用。
本發明的感光性樹脂組成物中之接著性賦予劑的含量,若是在不損及本發明的效果之範圍內,即無特別的限制,於除去溶劑的感光性樹脂組成物之固形分中,較佳的是使用之量為15質量%以下,並以使用10質量%以下之量為更佳。
本發明的感光性樹脂組成物中可併用的多元醇化合物並無特別的限制,惟代表性的是含有在強酸觸媒的影響下會與環氧基反應的羥基之聚酯多元醇系化合物。例如可以併用日本專利公報5901070號所列舉的多元醇化合物。藉由使用該化合物,可避免光蝕刻加工時的曝光硬化、顯影及熱硬化步驟中的應力觸發(stress triggering),使收縮減少,防止感光圖像的龜裂。本發明的感光性樹脂組成物中的多元醇化合物之含量,若是在不損及本發明的效果之範圍,即無特別的限制,相對於(B)環氧化合物的合計質量,通常是1至30質量%,並以2至25質量%為較佳。
本發明的感光性樹脂組成物中可併用的多元酚化合物,係可藉由加熱而使環氧化合物的交聯密度高度硬化之化合物。可併用例如日本專利公報5967824號所列舉的多元酚化合物。藉由使用該化合物,即可賦予樹脂硬化物低透濕性、高接著性、強靱性的功能。本發明的感光性樹脂組成物中之多元酚化合物的含量,若是在不損及本發明的效果之範圍內,即無特別的限制,相對於(B)環氧化合物的合計質量,通常是3至40質量%,並以4至30質量%為佳,而以5至25質量%為更佳。
本發明的感光性樹脂組成物中可併用的增敏劑,若為擔任將所吸收的光能供應到光陽離子聚合起始劑之角色者,即可使用而無特別的限制。例如以硫雜蒽酮類、於第9位與第10位具有烷氧基的蒽化合物(9,10- 二烷氧基蒽衍生物)為較佳。前述烷氧基,可列舉例如:甲氧基、乙氧基、丙氧基、丁氧基等碳數1至4的烷氧基。9,10-二烷氧基蒽衍生物亦可更具有取代基。取代基可列舉例如:氟原子、氯原子、溴原子、碘原子等鹵素原子、甲基、乙基、丙基等碳數1至4的烷基或磺酸烷酯基、羧酸烷酯基等。磺酸烷酯基或羧酸烷酯基中的烷基,可列舉例如:甲基、乙基、丙基等碳數1至4的烷基。此等取代基的取代位置以第2位為佳。
硫雜蒽酮類的具體例可舉出:2,4-二甲基硫雜蒽酮、2,4-二乙基硫雜蒽酮、2-氯硫雜蒽酮、2,4-二異丙基硫雜蒽酮等。並以2,4-二乙基硫雜蒽酮(例如,商品名Kayacure DETX-S,日本化藥公司製造)、2,4-二異丙基硫雜蒽酮為佳。
9,10-二烷氧基蒽衍生物可列舉例如:9,10-二甲氧基蒽、9,10-二乙氧基蒽、9,10-二丙氧基蒽、9,10-二丁氧基蒽、9,10-二甲氧基-2-乙基蒽、9,10-二乙氧基-2-乙基蒽、9,10-二丙氧基-2-乙基蒽、9,10-二甲氧基-2-氯蒽、9,10-二甲氧基蒽-2-磺酸甲酯、9,10-二乙氧基蒽-2-磺酸甲酯、9,10-二甲氧基蒽-2-羧酸甲酯等。此等增敏劑可單獨使用,也可以將複數種混合而使用。
本發明的感光性樹脂組成物中之增敏劑的含量,若是在不損及本發明的效果之範圍內,即無特別的限制,相對於(A)光陽離子聚合起始劑,係以使用30質量%以下之量為較佳,並以使用成為20質量%以下之量為更佳。
本發明的感光性樹脂組成物中可併用的離子捕捉劑,若為可以減少來自(A)光陽離子聚合起始劑的離子所造成之不良影響者,即可無特別限制地使用。例如有機鋁化合物類,具體而言,可舉出:參甲氧基 鋁、參乙氧基鋁、參異丙氧基鋁、異丙氧基二乙氧基鋁及參丁氧基鋁等烷氧基鋁;參苯氧基鋁及參對甲基苯氧基鋁等苯氧基鋁;參乙醯氧基鋁、參硬脂酸鋁、參丁酸鋁、參丙酸鋁、參乙醯基丙酮酸鋁、參三氟乙醯基丙酮酸酯、參乙基乙醯乙酸鋁、二乙醯基丙酮酸二(三甲基乙醯基)甲酸鋁及二異丙氧基(乙基乙醯乙酸)鋁等。此等離子捕捉劑可單獨使用,也可以將複數種混合而使用。
而且,藉由因紫外線照射而產生弱酸的鎓弱酸鹽化合物,也可以適合併用作為離子捕捉劑。具體而言,鎓鹽的陰離子部分可舉出下述弱酸結構:甲烷磺酸、乙烷磺酸、丙烷磺酸、丁烷磺酸、樟腦磺酸等烷基磺酸;三氟甲烷磺酸、五氟乙烷磺酸、對-甲苯磺酸、苯磺酸、環己烷磺酸、金剛烷磺酸、二環戊二烯磺酸等。此等係可單獨使用,也可以將二種以上組合而使用。鎓鹽的陽離子部分若為一價的有機陽離子即無特別的限制,但是以鋞離子、銨離子、鏻離子、鋶離子或錪離子為較佳。以銨離子、鏻離子、鋶離子或錪離子為更佳,而以鋶離子或錪離子為又更佳。鎓弱酸鹽化合物可於不明顯阻礙光聚合的程度予以併用。
本發明的感光性樹脂組成物中之離子捕捉劑的含量,若是在不損及本發明的效果之範圍內,即無特別的限制。為有機鋁化合物類時,在去除溶劑的感光性樹脂組成物之固形分中,係以使用10質量%以下之量為佳。
為鎓弱酸鹽化合物時,相對於本發明的(A)光陽離子聚合起始劑之調配量,係以使用0.001至2質量%之量為佳。
本發明的感光性樹脂組成物中,可視需要而使用熱塑性樹脂、著色劑、增黏劑、消泡劑、調平劑等各種添加劑。熱塑性樹脂可列舉 例如:聚醚碸、聚苯乙烯、聚碳酸酯等。著色劑可列舉例如:酞青藍(phthalocyanine blue)、酞青綠、碘綠(iodine green)、結晶紫(crystal violet)、氧化鈦、碳黑、萘黑等。增黏劑可列舉例如:Orben、Bento、蒙脫石(montmorillonite)等。消泡劑可列舉例如:聚矽氧系、氟系及高分子系等之消泡劑。
此等各種添加劑在本發明的感光性樹脂組成物中之含量,若是在不損及本發明的效果之範圍內,即無特別的限制,在去除溶劑的感光性樹脂組成物之固形分中,係以使用之量為30質量%以下為較佳。
本發明的感光性樹脂組成物中,可進一步視需要而使用例如硫酸鋇、鈦酸鋇、氧化矽、非結晶型氧化矽、滑石、黏土、碳酸鎂、碳酸鈣、氧化鋁、氫氧化鋁、雲母粉等無機填充劑。
此等無機填充材在本發明的感光性樹脂組成物中之含量,若是在不損及本發明的效果之範圍內,即無特別的限制,在去除溶劑的感光性樹脂組成物之固形分中,係以使用之量為60質量%以下為較佳。
本發明的感光性樹脂組成物可在調配必需成分的(A)光陽離子聚合起始劑與(B)環氧化合物之後,視需要而添加任意成分,並以通常的方法予以混合、攪拌而得到。或者,視需要而使用溶解器、均質器、三輥研磨機等分散機予以分散、混合。而且,混合之後,可再使用篩網、薄膜過濾器等進行過濾。
本發明的感光性樹脂組成物,係以使用液狀為佳。
為了在基板上形成硬化物而使用本發明的感光性樹脂組成物時,例如可以利用旋轉塗佈機等而在矽基板、附有鋁、銅、鉑、金、鈦、鉻、鉭等 之金屬膜或金屬氧化物膜的基板、鉭酸鋰、玻璃、氧化矽、氮化矽等陶瓷基板、聚醯亞胺、聚對苯二甲酸乙二酯等基板上塗佈成0.1至1,000μm的厚度,並於60至130℃中熱處理5至60分鐘左右以去除溶劑,形成感光性樹脂組成物層。接著,裝設具有預定圖案的光罩並照射紫外線,在50至130℃中進行加熱處理1至50分鐘左右之後,使用顯影液而在室溫(例如15℃以上)至50℃中將未曝光的部分進行顯影1至180分鐘左右,形成圖案,接著在130至200℃中加熱處理,藉此得到滿足各項特性的硬化物。
顯影液可使用:例如γ-丁內酯、三乙二醇二甲醚、丙二醇單甲醚乙酸酯等有機溶劑,或前述有機溶劑與水的混合液等。顯影時可使用旋覆浸沒(puddle)式、噴式、淋式等的顯影裝置,也可視需要而進行超音波照射。又,在使用本發明的感光性樹脂組成物時之較佳的金屬基板,可舉出鋁。
使用本發明的感光性樹脂組成物以形成硬化物的各項條件,並不僅限於上述條件,也可視需要而適當地調整。
本發明的感光性樹脂組成物可藉由在基膜上利用輥塗機、模塗機、刀式塗佈機、棒塗機、凹版塗佈機等來塗佈該組成物之後,在已設定為45至100℃的乾燥爐中乾燥,去除預定量的溶劑,或再視需要而積層覆膜,而成為乾膜光阻。此時,基膜上的光阻之厚度係被調整成2至200μm。基膜及覆膜可使用例如:聚酯、聚丙烯、聚乙烯、TAC、聚醯亞胺等之膜。此等膜也可以視需要而使用經聚矽氧離型處理劑或非聚矽氧系離型處理劑等進行離型處理的膜。使用該乾膜光阻時,只要例如將覆膜取下,藉由手捲機、層合機等而在溫度40至100℃、壓力0.05至2MPa下轉印至基板,並 進行與前述硬化物的形成時相同的曝光、曝光後烘烤、顯影、加熱處理即可。
使用本發明的感光性樹脂組成物以形成、使用乾膜光阻之各項條件,並不僅限於上述條件,也可以視需要而適當地調整。
若是如前述般將感光性樹脂組成物作成乾膜光阻而供應,可省略塗佈至支撐體上及乾燥之步驟,而可更為簡便地形成使用本發明的感光性樹脂組成物之圖案。
使用作為MEMS封裝或半導體封裝時,可藉由以本發明的感光性樹脂組成物被覆或製作中空結構而使用。MEMS封裝及半導體封裝的基板,可使用藉由濺鍍或蒸鍍或CVD法而將鋁、銅、鉑、金、鈦、鉻、鉭等的金屬薄膜以10至5,000Å之膜厚成膜在各種形狀的矽晶圓(silicon wafer)上為,並藉由光蝕刻法將該金屬微細加工後的基板等。視情況,亦有再以氧化矽或氮化矽形成膜厚10至10,000Å之膜作為無機保護膜之情形。接著在基板上,製作或設製MEMS或半導體元件,為了將此元件與外部空氣隔離,必須被覆或製作中空結構。以本發明的感光性樹脂組成物被覆時,可用前述的方法進行。而且,製作中空結構時,藉由以前述的方法在基板上形成間隔件,並且在阻隔壁上以前述的方法將乾膜以成為積層及間隔件上的蓋子的方式進行圖案化,即可製作中空封裝結構。而且,製作後,可視需要而在130至200℃進行加熱處理10至120分鐘,獲得滿足各項特性的MEMS封裝零件及半導體封裝零件。
又,所謂的「封裝」,係為了保持基板、電路、元件等的穩定性、阻擋外部氣體、液體的滲入而使用的密封方法。本發明所述之封裝 係表示如MEMS的驅動部分所具有者、將SAW元件等振盪器予以封裝用之中空封裝、用以防止半導體基板、印刷電路板、電路等的劣化而進行之表面保護、或樹脂密封等。
本發明的感光性樹脂組成物,可利用於製作MEMS(微電子機械系統)零件、微機械零件、微流體零件、μ-TAS(微全分析系統)零件、噴墨印刷頭零件、微反應器零件、電容器或電感器等電子零件之絕緣層、LIGA零件、微射出成形及熱壓花用模具及沖模、微細印刷用途用網板或模板、行動終端或IoT零件上裝載的MEMS感測器、半導體元件、濾波器元件等封裝零件、生物MEMS及生物光子元件以及印刷電路板等。其中,該感光性樹脂組成物尤其有用於MEMS封裝零件及半導體封裝零件、微流體零件、噴墨印刷頭零件中。
以下,藉由實施例以更詳細說明本發明。此等實施例只是用於適當地說明本發明的例示,但並非以任何方式侷限本發明者。
實施例1至16及比較例1乃至12
(感光性樹脂組成物液的調製)
在表1至3所述之樹脂組成(單位是質量份,僅述去溶劑的固形分之質量)中加入使黏度成為1至10Pa‧s之量的溶劑,在附攪拌機的燒瓶中以80℃、3小時的條件進行攪拌混合而溶解,放冷後,以孔徑5μm的薄膜過濾器進行過濾,獲得本發明及比較用的感光性樹脂組成物液。
(感光性樹脂組成物的靈敏度、解析度評估)
用旋轉塗佈機將實施例1至16及比較例1至12中獲得的各感光性樹脂組成物液塗佈在矽晶圓上之後,以95℃的加熱板進行15分鐘的預烘烤,獲得平滑地形成之感光性樹脂組成物層。然後,將邊緣球狀物(edge bead)去除並乾燥後,利用i射線曝光裝置(光罩對準曝光機(mask aligner):Ushio電機公司製造),經由附解析度評估用灰階的光罩照射紫外線。接著,以95℃的加熱板進行5分鐘的曝光後烘烤。繼而以SU-8 Developer(商品名,Microchem公司製造,主成分為丙二醇單甲醚乙酸酯)在23℃中浸泡3分鐘進行顯影,並以2-丙醇洗淨、乾燥,由此獲得在矽晶圓上硬化的樹脂圖案。將光罩轉印精度成為最佳的曝光量作為最合適的曝光量,進行靈敏度及解析度的評估。將結果表示於下述表1中。又,表1中的「膜厚」係指已硬化的樹脂圖案之膜厚。
(感光性樹脂組成物的膜狀硬化物之製作)
使用實施例1至16及比較例1至12中獲得的本發明及比較用之感光性樹脂組成物液,藉由以下的步驟製作膜狀硬化物。
1)用貝氏分配器(Baker's applicator)將感光性樹脂組成物液體塗佈在PET膜上。
2)以50℃、3分鐘,繼而以95℃、30分鐘的條件,使其在加熱板上乾燥,作成膜厚約100μm的塗膜。
3)以i射線曝光裝置(光罩對準曝光機:Ushio電機公司製造)照射表1至表3所述曝光量的紫外線。
4)以95℃、10分鐘的條件,在加熱板上進行促進聚合之加熱。
5)從PET膜上將樹脂組成物膜剝離,以200℃的烤爐進行60分鐘的煅燒烘烤。
(感光性樹脂組成物的各膜狀硬化物之PCT萃取水之評估)
由上述獲得的膜狀硬化物切出並精確稱取約3克之後,放入鐵氟龍(Teflon)(註冊商標)製的PCT容器中,並將精確稱取的離子交換水50g加入PCT容器中。將PCT容器密閉在SUS製的壓力容器中,於121℃、2氣壓的條件下放置24小時之後,放冷至室溫後取出萃取水,測定導電率與氫離子指數,用以下的基準評估。將結果表示於表1至表3中。
‧萃取水的導電率之評估基準
未達120μS/cm:「○」
120μS/cm以上、未達1,200μS/cm:「×」
1,200μS/cm以上:「××」
‧氫離子指數比
相對於純水空白試驗水的氫離子指數為0.7以上:「○」,
相對於純水空白試驗水的氫離子指數為未達0.7:「×」
又,表1至表3中的(A-1)至(SC-1)是分別表示以下者。
(A-1):商品名CPI-310FG(由式(1)表示的陰離子與陽離子所形成之鹽,三芳基鋶-肆五氟苯基五倍子酸鹽,San Apro公司製造)
(A-2):商品名CPI-310B(比較用的光陽離子聚合起始劑,三芳基鋶-肆五氟苯基硼酸鹽,San Apro公司製造)
(A-3):商品名Irgacure 290(比較用的光陽離子聚合起始劑,參〔4-(4-乙醯基苯基)磺醯基苯基〕鋶肆(2,3,4,5,6-五氟苯基)硼酸鹽,BASF公司製造)
(A-4):商品名TAG-382(比較用的光陽離子聚合起始劑,芳基鋶-肆五氟硼酸鹽,東洋印墨公司製造)
(A-5):商品名GSID-26-1(比較用的光陽離子聚合起始劑,參〔4-(4-乙醯基苯基)磺醯基苯基〕鋶參〔(三氟甲基)鋶〕甲烷,BASF公司製造)
(A-6):商品名CPI-210S(比較用的光陽離子聚合起始劑,4-(苯硫基)苯基二苯基鋶參(五氟乙基)三氟磷酸鹽,San Apro公司製造)
(A-7):商品名CPI-101A(比較用的光陽離子聚合起始劑,二苯基〔對-(苯硫基)苯基〕鋶六氟銻酸鹽,San Apro公司製造)
(A-8):商品名SP-172(比較用的光陽離子聚合起始劑,芳基鋶-六氟銻酸鹽,ADEKA公司製造)
(A-9):商品名CPI-310CS(比較用的光陽離子聚合起始劑,芳基鋶-樟腦磺酸鹽,San Apro公司製造)
(B-1):商品名KM-N LCL(式(2)表示的環氧化合物(b-1),平均重複數k=4,R5是縮水甘油基,環氧基當量210g/eq.,日本化藥公司製造)
(B-2):商品名NER-7604(式(3)表示的環氧化合物(b-2),平均重複數m=4,R6是氫、R7是縮水甘油基,環氧基當量347g/eq.,日本化藥公司製造)
(B-3):商品名NC-3000H(式(4)表示的環氧化合物(b-3),平均重複數n=2,R8是氫,環氧基當量285g/eq.,日本化藥公司製造)
(B-4):商品名NC-6300H(式(5)至(7)表示的化合物之混合物之環氧化合物(b-4),R9及R10是氫或縮水甘油基,環氧基當量225g/eq.,日本化藥公司製造)
(B-5):商品名KHE-2033(式(8)表示的化合物與式(10)及式(11)表示的化合物之混合物的共縮合反應之生成物的環氧化合物(b-5),環氧基當量495g/eq.,日本化藥公司製造)
(B-6):商品名EOCN-1020-70(式(12)表示的環氧化合物(b-6),環氧基當量200g/eq.,日本化藥公司製造)
(B-7):商品名EPPN-201(式(12)表示的環氧化合物(b-6),p是4,R12是甲基,環氧基當量190g/eq.,日本化藥公司製造)
(B-8):商品名EPPN-502H(式(13)表示的環氧化合物(b-7),q是1,環氧基當量170g/eq.,日本化藥公司製造)
(B-9):商品名XD-1000(式(14)表示的環氧化合物(b-8),r是1,環氧基當量253g/eq.,日本化藥公司製造)
(B-10):商品名NC-7700(式(15)表示的環氧化合物(b-9),s是1,R13是氫,環氧基當量230g/eq.,日本化藥公司製造)
(B-11):商品名jER-1007(式(3)表示的環氧化合物(b-2),平均重複數m=13,R6是甲基,R7是氫,環氧當量2,000g/eq.,三菱化學公司製造)
(B-12):商品名EHPE-3150(式(16)表示的環氧化合物(b-10),平均重複數t+u+v=36,環氧當量180g/eq.,Daicel公司製造)
(B-13):商品名YD-8125(式(3)表示的環氧化合物(b-2),平均重複數m=1,R6是甲基,R7是氫,環氧當量172g/eq.,新日鐵住金化學公司製造)
(B-14):商品名ED-505(環氧化合物,三羥甲基丙烷三縮水甘油醚,環氧基當量130g/eq.,ADEKA公司製造)
(B-15):商品名ED-506(環氧化合物,聚丙二醇聚縮水甘油醚,環氧基當量310g/eq.,ADEKA公司製造)
(B-16):商品名Celloxide 2021P(環氧化合物,3’,4’-環氧基環己基甲基3,4-環氧基環己烷羧酸酯,環氧基當量126g/eq.,Daicel公司製造)
(PF-1):商品名PN-80(酚酚醛清漆樹脂,明和化成公司製,羥基當量104g/eq.)
(PF-2):商品名PN-152(酚酚醛清漆樹脂,明和化成公司製,羥基當量105g/eq.)
(PO-1):Placcel 308(商品名,Daicel製造,三官能多元醇樹脂,分子量850,OH當量195mgKOH/g)
(SC-1):3-縮水甘油氧基丙基三甲氧基矽烷
(感光性樹脂組成物的濕熱試驗後接著力評估)
使用感光性樹脂組成物,藉由光蝕刻在矽晶圓上製作膜厚38±5μm、一邊為100μm的正方形之長方體型硬化物圖案。測定在已加熱至80℃的濕熱試驗用純水中浸泡24小時後的長方體型硬化物圖案之接著強度,將結果記錄在表4中。利用RHESCA製之「PTR-1000」作為測定設備,測定一邊為100μm之正方形的長方體型硬化物圖案之剪切強度,將此強度設為接著強度。
由表1至表3的結果明確可知,由各實施例獲得的組成物之特性係可高靈敏度的進行紫外線光蝕刻。而且,硬化物的PCT萃取水之液體性質是偏中性,且為低導電率,故可得到低溶出性且低汙染性的硬化物。
而且,由表4的結果明確可知,對濕熱試驗後的基板之接著強度很強。
本發明的感光性樹脂組成物係解析度優良,同時該組成物的硬化物之濕熱溶出汙染極低,而且與濕熱試驗後的基板之間的接著性優良,故可使用於使用水系流體的用途或在樹脂密封時要求高耐濕熱性的用 途上。更具體而言,本發明的感光性樹脂組成物,尤其適合使用於製作MEMS封裝零件及半導體封裝零件、微機械零件、微流體零件、μ-TAS(微全分析系統)零件、噴墨印刷頭零件、微反應器零件、電容器或電感器等電子零件的絕緣層、LIGA零件、微射出成形及熱壓花用模具及沖模、微細印刷用途用網板或模板、行動終端或IoT零件上裝載的MEMS感測器、半導體元件、濾波器元件等封裝零件、生物MEMS及生物光子元件,以及印刷電路板等。
Claims (6)
- 一種感光性樹脂組成物,該感光性樹脂組成物係含有(A)光陽離子聚合起始劑及(B)環氧化合物;該(A)光陽離子聚合起始劑含有由下述式(1)表示的陰離子與陽離子所形成之鹽,且該(B)環氧化合物含有選自:下述式(2)表示的環氧化合物(b-1)、下述式(3)表示的環氧化合物(b-2)、下述式(4)表示的環氧化合物(b-3)、選自下述式(5)至(7)表示的環氧化合物之群組中的一種以上之環氧化合物(b-4)、下述式(8)及/或式(9)表示的化合物與下述式(10)及/或式(11)表示的化合物之共縮合物的環氧化合物(b-5)、下述式(12)表示的環氧化合物(b-6)、下述式(13)表示的環氧化合物(b-7)、下述式(14)表示的環氧化合物(b-8)、下述式(15)表示的環氧化合物(b-9)、及下述式(16)表示的環氧化合物(b-10)所形成之群組中的1種或2種以上的環氧化合物;
- 如申請專利範圍第1項所述之感光性樹脂組成物,其中,R 1至R 4是分別獨立地為具有全氟烷基作為取代基的苯基、或具有氟原子作為取代基的苯基。
- 如申請專利範圍第2項所述之感光性樹脂組成物,其中,R 1至R 4是分別獨立地為五氟苯基或雙(三氟甲基)苯基。
- 如申請專利範圍第1至3項中任一項所述之感光性樹脂組成物,其中,(A)光陽離子聚合起始劑含有由式(1)表示的陰離子與具有碘原子或硫原子的陽離子所形成之鹽。
- 一種乾膜光阻,該乾膜光阻是用基材夾住申請專利範圍第1至4項中任一項所述之感光性樹脂組成物而得者。
- 一種硬化物,係申請專利範圍第1至4項中任一項所述之感光性樹脂組成物或申請專利範圍第5項所述之乾膜光阻的硬化物。
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US20050260522A1 (en) | 2004-02-13 | 2005-11-24 | William Weber | Permanent resist composition, cured product thereof, and use thereof |
JP5020646B2 (ja) | 2007-01-24 | 2012-09-05 | 東京応化工業株式会社 | 感光性樹脂組成物、及びこれを用いたパターン形成方法 |
JP5247396B2 (ja) * | 2008-07-02 | 2013-07-24 | 日本化薬株式会社 | Mems用感光性樹脂組成物及びその硬化物 |
TWI523882B (zh) * | 2010-07-14 | 2016-03-01 | 日本化藥股份有限公司 | 感光性樹脂組成物及其硬化物 |
JP5967824B2 (ja) | 2012-10-26 | 2016-08-10 | 日本化薬株式会社 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
JP6066414B2 (ja) * | 2012-11-22 | 2017-01-25 | 日本化薬株式会社 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
JP6066413B2 (ja) * | 2012-11-22 | 2017-01-25 | 日本化薬株式会社 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
JP6075772B2 (ja) * | 2013-04-18 | 2017-02-08 | 日本化薬株式会社 | 樹脂組成物及びその硬化物 |
KR20230124105A (ko) * | 2013-08-02 | 2023-08-24 | 가부시끼가이샤 레조낙 | 감광성 수지 조성물 |
EP3156845B1 (en) * | 2014-06-13 | 2019-05-08 | Nippon Kayaku Kabushiki Kaisha | Photosensitive resin composition, resist laminate, cured product of photosensitive resin composition, and cured product of resist laminate |
TWI684065B (zh) | 2015-03-26 | 2020-02-01 | 日商東京應化工業股份有限公司 | 負型感光性組成物、圖型之形成方法 |
JP6708382B2 (ja) | 2015-09-03 | 2020-06-10 | サンアプロ株式会社 | 硬化性組成物及びそれを用いた硬化体 |
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2018
- 2018-11-29 SG SG11202005313QA patent/SG11202005313QA/en unknown
- 2018-11-29 WO PCT/JP2018/043986 patent/WO2019111796A1/ja active Application Filing
- 2018-11-29 JP JP2019558172A patent/JP7241695B2/ja active Active
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- 2018-11-29 US US16/769,361 patent/US11809078B2/en active Active
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- 2018-12-04 TW TW107143428A patent/TW201928520A/zh unknown
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2022
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US20200292938A1 (en) | 2020-09-17 |
JP7462724B2 (ja) | 2024-04-05 |
WO2019111796A1 (ja) | 2019-06-13 |
SG11202005313QA (en) | 2020-07-29 |
KR20200085805A (ko) | 2020-07-15 |
JP7241695B2 (ja) | 2023-03-17 |
KR102660240B1 (ko) | 2024-04-23 |
US11809078B2 (en) | 2023-11-07 |
CN111406233A (zh) | 2020-07-10 |
JP2023030025A (ja) | 2023-03-07 |
CN111406233B (zh) | 2023-12-26 |
JPWO2019111796A1 (ja) | 2020-12-10 |
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