TW201926503A - Secondary leveling apparatus of a wafer processing machine - Google Patents

Abstract

A secondary leveling apparatus of a wafer processing machine includes a primary uniform suction device and a secondary leveling/attaching device, and the primary uniform suction device has a uniform suction assembly and a sensed moving assembly, and the secondary leveling/attaching device has a compressed flat surface, a retreat space, and plural suction holes formed on the compressed flat surface, and plural independent hollow columns of the uniform suction assembly driven by the sensed moving assembly to contact and attach the wafer and elevated independently to adjust the primary leveling effect of the wafer, and then synchronously moved into the retreat space, so that the wafer is disposed near the compressed flat surface and sucked and positioned on the compressed flat surface by the more densely distributed suction holes, and the wafer processed by the secondary leveling becomes flatter and not easily to be worn or damaged. Such apparatus is applicable for various warped wafers to make the manufacture of wafers more smoothly.

Description

Wafer processing machine secondary leveling equipment

A secondary leveling device for a wafer processing machine, in particular, a primary equalizing device and a secondary leveling adsorption device are provided, so that the wafer is more nearly flat after secondary leveling, and is not easy to wear and damage the wafer. It is also suitable for wafers with various warped shapes to make wafer processing smoother.

Generally, when the wafer is processed (for example, laser cutting), the cut surface of the die is flattened, depending on the flatness of the back section of the wafer, so the wafer must be leveled before cutting. In the normal leveling operation, the warped wafer is directly flattened on the abutting seat by the pressing plate, and the wafer is adsorbed and positioned on the abutting surface of the seat by a plurality of suction holes provided on the seat. However, the shape and degree of warping of each wafer are different. Therefore, when the pressure plate is pressed against wafers of different warpage and shape, the pressing force is insufficient or excessive, resulting in no effect or wafer damage; Moreover, the contact area between the pressure plate and the wafer is large, and therefore, it is easy to generate friction and flatten the wafer during the process of flattening the wafer.

The main purpose of the present invention is to use the plurality of independent hollow columns of the primary soaking device to adsorb the wafers, and then independently lift and pull the wafers for the first leveling, and then drive the wafers closer to the secondary leveling adsorption device for the second time. Leveling, the wafer is flattened and flattened, and the contact area of the plurality of independent hollow columns and the wafer is small, which is not easy to wear and damage the wafer, and is suitable for various warped wafers. Wafer processing is smoother.

In order to achieve the above object, the secondary leveling device of the wafer processing machine of the present invention comprises a primary equalizing device and a secondary leveling adsorbing device, wherein the primary soaking device has an average adsorption composition and a perceptual moving composition, and the average adsorption composition has a plurality of The independent hollow column, the perceptual moving component is used to drive the displacement of the plurality of independent hollow columns, and the secondary leveling adsorption device has a pressure flat surface and a retreat space, and a plurality of suction holes are densely arranged on the pressure flat surface, and the first suction is performed. The plurality of independent hollow columns of the device are driven by the sensing movement to drive the wafers independently and the displacement is adjusted until the ends of the plurality of independent hollow columns are equidistant from the pressed flat surface, and the wafer is first leveled, and then The synchronous displacement enters the retreat space, bringing the wafer close to the pressed flat surface, and is adsorbed and positioned on the pressed flat surface by the complex suction holes.

The secondary leveling device of the wafer processing machine, wherein the secondary leveling adsorption device has an abutting seat, and the pressed flat surface is formed on the surface of the seat, and the retracting space is a plurality of scattered surfaces on the compressed flat surface. Perforation.

The secondary leveling device of the wafer processing machine, wherein the perceptual movement component of the primary soaking device has a plurality of drivers, the plurality of drivers are independent, and respectively connected to the independent hollow columns of the average adsorption composition.

The secondary leveling device of the wafer processing machine, wherein the sensing unit of the first uniform suction device comprises a plurality of detectors, and the plurality of detectors are respectively connected to the respective hollow columns of the average adsorption composition, when the detector detects When the independent hollow column is touched and the wafer is adsorbed, the independent hollow column stops moving.

The secondary leveling device of the wafer processing machine, wherein the average adsorption composition of the primary soaking device has a plurality of telescopic suction cups for contacting the surface of the wafer, and the plurality of telescopic suction cups are respectively connected to the ends of the independent hollow columns, and the plurality A separate hollow column is connected to the suction device to cause the suction cup to generate an adsorption force.

The secondary leveling device of the wafer processing machine is further provided with an adsorption type moving device, and the plurality of suction holes are moved when the adsorption type moving device moves against the wafer on the pressure flat surface of the secondary leveling adsorption device. The wafer is stopped and the adsorption device is used to pick up the wafer for transport.

Referring to the first to third figures, it can be clearly seen from the figure that the secondary leveling device of the wafer processing machine of the present invention includes the first time for the first leveling of the wafer 4 The device 1 and the secondary leveling adsorption device 2 for performing the second leveling on the wafer 4 make the wafer 4 closer to leveling and less susceptible to damage for processing, wherein:

The primary soaking device 1 has an average adsorbing composition 11 and a perceptual moving composition 12 having a plurality of independent hollow columns 111 and a plurality of telescopic chucks 112 for contacting the surface of the wafer 4, the plurality of telescopic chucks 112 being respectively Connected to the ends of the individual hollow columns 111, and the other ends of the plurality of independent hollow columns 111 away from the telescopic suction cups 112 are connected with suction devices (not shown) to make the expansion and suction cups 112 generate adsorption force; The plurality of independent hollow columns 111 are driven to be displaced, and have a base 121, a plurality of drivers 122, and a plurality of detectors (not shown) disposed on the lower side of the secondary leveling adsorption device 2, and the plurality of drivers The 122 series are fixed on the base 121, and are respectively independently connected to the independent hollow columns 111 of the average adsorption composition 11, and the plurality of detectors are respectively connected to the individual hollow columns 111 of the average adsorption composition 11 to detect independence. The value of the gas pressure in the hollow column 111. In the illustrated embodiment, the driver 122 is a pneumatic cylinder, and the piston rod 123 of the pneumatic cylinder and the independent hollow column 111 are connected by an actuating member 124, and the base 121 is provided with a plurality of actuators 124. The stop 125 abuts.

The secondary leveling adsorption device 2 has an abutting seat 21, and the abutting seat 21 is located on the upper side of the base 121 of the primary soaking device 1, and a pressing flat surface 211 is formed on the surface of the abutting seat 21, and the flat surface is pressed. The 211 is provided with a retreat space 22 and a plurality of suction holes 23. In the embodiment, the retreat space 22 is a plurality of perforations scattered on the pressed flat surface 211, and the plurality of suction holes 23 are densely distributed on the pressure flattening. On the face 211, the plurality of independent hollow columns 111 are respectively located in the respective perforations. In the illustrated embodiment, the abutment seat 21 is provided with a communication tube 24 for connecting the plurality of suction holes 23 and a suction device (not shown) to cause the plurality of suction holes 23 to generate an adsorption force.

Referring to the second to sixth figures, it is clear from the figure that the present invention is further provided with an adsorption type moving device 3, which is used in accordance with the following steps:

(A) The wafer 4 is placed on the pressed flat surface 211 of the abutment seat 21.

(B) The complex driver 122 of the sensing moving component 12 drives each of the individual hollow columns 111 to be exposed to the pressed flat surface 211 and adsorbs the wafer 4, and the stretching cups 112 at the ends of all the independent hollow columns 111 are attracted to the wafer 4, and then driven. The plurality of independent hollow columns 111 are independently lifted and lowered to the same height, so that the respective telescopic chucks 112 at the ends of the plurality of independent hollow columns 111 are equidistant from the pressed flat surface 211, and the wafer 4 is first leveled.

(C) The complex driver 122 sensing the moving component 12 drives the plurality of individual hollow columns 111 to descend synchronously, bringing the wafer 4 close to the pressed flat surface 211.

(D) actuating a plurality of suction holes 23 for inhaling to adsorb the wafer 4, and releasing the stretching cup 112 at the end of the plurality of independent hollow columns 111 to adsorb the wafer 4, and lowering the independent hollow columns 111 into the respective retreat spaces 22, The wafer 4 is positioned on the pressed flat surface 211 to achieve a secondary leveling effect.

(E) The adsorption type moving device 3 moves against the wafer 4 on the pressure flat surface 211 of the secondary leveling adsorption device 2, at this time, the plurality of suction holes 23 stop adsorbing the wafer 4 for the adsorption type moving device 3 The wafer 4 is sucked for movement.

The detector (not shown) of the sensing movement component 12 is in the step (B), and the telescopic suction cup 112 at the end of the independent hollow column 111 is detected to contact and adsorb the wafer 4, so that the air pressure in the independent hollow column 111 is When the value is in a negative pressure state, the driver 122 is stopped to continue to drive the independent hollow column 111 to rise, so that the respective expansion and suction cups 112 of the plurality of independent hollow columns 111 are adsorbed and positioned on the surface of the wafer 4.

The plurality of independent hollow columns 111 of the average adsorption composition 11 are in the step (B), and when the wafer 4 is lifted and pulled for the first time, as shown in the third figure, the distance between the individual hollow columns 111 is large. The wafer 4 can also allow a slight amount of bending variation between the individual hollow columns 111. Therefore, when the wafer 4 is close to the pressed flat surface 211 in steps (C) and (D), the wafer is subjected to a higher density. When the suction hole 23 is adsorbed, as shown in the fourth figure, the amount of bending variation of the wafer 4 between the individual hollow columns 111 can be eliminated, so that the wafer 4 is nearly flat, and the actuator 124 is subjected to the piston rod. The 123 is urged against the stopper 125 to form a positioning.

Therefore, the present invention solves the conventional problems and defects, and the key technology is that the wafer 4 is adsorbed by the ends of the plurality of independent hollow columns 111 of the primary uniform absorption device 1, and then the wafer 4 is independently lifted and pulled for the first time. Leveling, then driving the wafer 4 close to the secondary leveling adsorption device 2, being adsorbed by the plurality of suction holes 23 having a high density of distribution, for the second leveling, so that the wafer 4 is leveled closer to leveling, and The end of the plurality of independent hollow columns 111 has a small contact area with the wafer 4, is not easy to wear and damage the wafer 4, and is suitable for the wafer 4 of various warped shapes, so that the processing of the wafer 4 is smoother.

1‧‧‧First uniform suction device

11‧‧‧Average adsorption composition

111‧‧‧Independent hollow columns

112‧‧‧Flexible suction cup

12‧‧‧ Perceptual movement composition

121‧‧‧Base

122‧‧‧ drive

123‧‧‧Piston rod

124‧‧‧Activity

125‧‧‧stops

2‧‧‧Second leveling adsorption device

21‧‧‧Abutment

211‧‧‧Compressed flat surface

22‧‧‧Retreat space

23‧‧‧ suction hole

24‧‧‧Connected pipe

3‧‧‧Adsorption type moving device

4‧‧‧ Wafer

The first figure is a perspective view of the present invention. The second drawing is a partial cross-sectional view of the present invention. The third figure is a schematic diagram of the first leveling of the wafer for the present invention. The fourth figure is a schematic diagram of the second leveling of the wafer according to the present invention. The fifth figure is a schematic diagram of the wafer moving by the adsorption type moving device of the present invention.

Claims (6)

A secondary leveling device for a wafer processing machine, comprising a primary equalizing device and a secondary leveling adsorbing device, the primary soaking device having an average adsorption composition and a perceptual moving composition, the average adsorption composition having a plurality of independent hollow columns, sensing movement The composition system is used for driving the displacement of the plurality of independent hollow columns, and the secondary leveling adsorption device has a pressure flat surface and a retreat space, and the plurality of suction holes are densely arranged on the pressure flat surface, and the plurality of independent hollow columns of the first uniform suction device After being driven by the sensing moving component and contacting the wafer independently, the wafer is adsorbed and displaced to the same distance from the end of the plurality of independent hollow columns to the pressed flat surface, and the wafer is first leveled and then synchronously displaced into the retracting space. The wafer is brought close to the pressed flat surface, and is adsorbed and positioned on the pressed flat surface by the plurality of suction holes. The secondary leveling device of the wafer processing machine according to claim 1, wherein the secondary leveling adsorption device has an abutting seat, and the pressed flat surface is formed on the seating surface, and the retreating space is a plurality of scattering spaces. The perforations on the flat surface are pressed. The secondary leveling device of the wafer processing machine of claim 1, wherein the perceptive movement of the primary soaking device comprises a plurality of drivers, the plurality of drivers are independent, and each of the independent hollow columns is connected to the average adsorption composition. . The secondary leveling device of the wafer processing machine of claim 1, wherein the sensing unit of the first uniform suction device has a plurality of detectors, and the plurality of detectors are respectively connected to the independent hollow columns of the average adsorption composition. When the detector detects that the individual hollow columns are in contact and adsorbs the wafer, the independent hollow column stops moving. The secondary leveling device of the wafer processing machine according to claim 1, wherein the average adsorption composition of the primary absorption device has a plurality of telescopic suction cups for contacting the surface of the wafer, and the plurality of expansion and suction suction cups are respectively connected to the independent hollows. At the end of the column, a plurality of independent hollow columns are connected with a suction device to generate an adsorption force. The secondary leveling device of the wafer processing machine according to claim 1, further comprising an adsorption type moving device, wherein the adsorption type moving device moves against the wafer on the pressure flat surface of the secondary leveling adsorption device At this time, the plurality of suction holes stop the adsorption of the wafer, and the adsorption transfer device sucks the wafer for movement.