TW201925536A - Method for preparing copper particles - Google Patents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
本發明係關於一種銅顆粒製備方法，尤其是一種可連續生產且可製備出粒徑小且均勻分布之銅顆粒的銅顆粒製備方法。 The present invention relates to a method for preparing copper particles, and more particularly to a method for preparing copper particles which can be continuously produced and which can produce copper particles having a small particle size and uniform distribution.
銅顆粒於工業上的用途十分廣泛，例如可掺混銅顆粒做為導電材料、以銅顆粒製作觸媒等等，是以，銅顆粒的粒徑大小將影響銅顆粒使用於上述用途時所能發揮的效果，粒徑越小之銅顆粒所具有的比表面積較大，反應率也較高，反之，粒徑較大的銅顆粒則比表面積較小，反應率較低。 Copper particles are widely used in industry, for example, copper particles can be blended as a conductive material, copper particles can be used as a catalyst, etc., so that the particle size of copper particles will affect the use of copper particles for the above purposes. The effect is that the copper particles having a smaller particle diameter have a larger specific surface area and a higher reaction rate. Conversely, copper particles having a larger particle diameter have a smaller specific surface area and a lower reaction rate.
一種習知銅顆粒製備方法係於1~30A/dm2之電流密度操作下，對一酸性含銅電解液進行電解，使得數個銅顆粒可被析出於一陰極電極之表面，並附著於該陰極電極之表面上，該習知銅顆粒製備方法所製備出銅顆粒之粒徑分布約為3~30μm。 A conventional copper particle preparation method is characterized in that an acid copper-containing electrolyte is electrolyzed under a current density operation of 1 to 30 A/dm 2 so that a plurality of copper particles can be deposited on the surface of a cathode electrode and attached thereto. On the surface of the cathode electrode, the copper particles prepared by the conventional method for preparing copper particles have a particle size distribution of about 3 to 30 μm.
惟，該習知銅顆粒製備方法於形成該數個銅顆粒後，該數個銅顆粒會附著在該陰極電極之表面，必須進一步自該陰極電極之表面收集該數個銅顆粒，因而工者必須適時地卸除更換該陰極電極，而影響銅顆粒的生產效率。又，習知銅顆粒製備方法所獲得之銅顆粒的規格不均，工者必須再針對所獲得的銅顆粒進行規格篩分，而增加了工作成本。 However, in the conventional copper particle preparation method, after the plurality of copper particles are formed, the plurality of copper particles adhere to the surface of the cathode electrode, and the plurality of copper particles must be further collected from the surface of the cathode electrode, and thus the worker The replacement of the cathode electrode must be carried out in a timely manner to affect the production efficiency of the copper particles. Moreover, the specifications of the copper particles obtained by the conventional copper particle preparation method are not uniform, and the worker must further screen the obtained copper particles to increase the working cost.
有鑑於此，習知銅顆粒製備方法確實仍有加以改善之必要。 In view of this, the conventional copper particle preparation method still needs to be improved.
為解決上述問題，本發明係提供一種銅顆粒製備方法，係使銅顆粒析出後不會附著於陰極電極之表面者。 In order to solve the above problems, the present invention provides a method for preparing copper particles which is such that copper particles do not adhere to the surface of the cathode electrode after being deposited.
本發明另提供一種銅顆粒製備方法，係可製備出具有小粒徑且粒徑均勻之銅顆粒者。 The invention further provides a method for preparing copper particles, which can prepare copper particles having a small particle size and uniform particle size.
本發明的銅顆粒製備方法，包含：提供一含銅電解液，該含銅電解液係選自由一含硫酸銅溶液及一含氯化銅溶液所組成之群組，該含硫酸銅溶液包含0.037~3% w/v之銅離子，該含氯化銅溶液包含0.037~1% w/v之銅離子；使一陽極電極及一陰極電極伸入於該含銅電解液中，該陽極電極為不溶性電極；及對該陽極電極與該陰極電極施予一電流，以電解該含銅電解液，使數個銅顆粒析出並沉積於該含銅電解液中。 The method for preparing copper particles of the present invention comprises: providing a copper-containing electrolyte selected from the group consisting of a copper sulfate-containing solution and a copper chloride-containing solution, the copper sulfate-containing solution comprising 0.037 ~3% w/v of copper ions, the copper chloride-containing solution comprises 0.037~1% w/v of copper ions; an anode electrode and a cathode electrode are protruded into the copper-containing electrolyte, the anode electrode is An insoluble electrode; and an electric current is applied to the anode electrode and the cathode electrode to electrolyze the copper-containing electrolyte to deposit a plurality of copper particles and deposit in the copper-containing electrolyte.
據此，本發明的銅顆粒製備方法，藉由該含銅電解液中含有適當比例的硫酸銅，所生成之該數個銅顆粒自該陰極電極析出後不會附著在該陰極電極上，故，可以快速方便地製備該數個銅顆粒，而可以縮短生產時間及提昇生產效率，此外，所生產之銅顆粒具有粒徑較小，且粒徑較為均勻之功效。 Accordingly, in the copper particle preparation method of the present invention, the copper-containing electrolyte contains an appropriate proportion of copper sulfate, and the generated copper particles are not deposited on the cathode electrode after being deposited from the cathode electrode. The copper particles can be prepared quickly and conveniently, and the production time can be shortened and the production efficiency can be improved. In addition, the copper particles produced have the advantages of smaller particle size and uniform particle size.
其中，係於10~100A/dm2之電流密度操作下電解該含銅電解液。如此，更可以確保所析出的該數個銅顆粒不會附著於該陰極電極之表面，故，可以快速方便地製備該數個銅顆粒，而可以縮短生產時間及提昇生產效率，此外，所生產之銅顆粒具有粒徑較小，且粒徑較為均勻之功效。 Among them, the copper-containing electrolyte is electrolyzed under a current density operation of 10 to 100 A/dm 2 . In this way, it is ensured that the plurality of precipitated copper particles do not adhere to the surface of the cathode electrode, so that the plurality of copper particles can be prepared quickly and conveniently, thereby shortening production time and improving production efficiency, and further, producing The copper particles have a small particle size and a relatively uniform particle size.
其中，選擇銅離子濃度為3% w/v之該含硫酸銅溶液或銅離子濃度為1% w/v之該含氯化銅溶液作為該含銅電解液。如此，係具有可製備出小粒徑銅顆粒之功效。 Among them, the copper chloride-containing solution having a copper ion concentration of 3% w/v or the copper chloride-containing solution having a copper ion concentration of 1% w/v was selected as the copper-containing electrolyte. Thus, it has the effect of preparing small-sized copper particles.
其中，將銅離子濃度為3% w/v之該含硫酸銅溶液與銅離子濃度為10% w/v之該含氯化銅溶液混合作為該含銅電解液，且銅離子濃度 為10% w/v之該含氯化銅溶液相對於該含銅電解液之體積比為2~10%。如此，係具有使本發明的銅顆粒製備方法所生成之銅顆粒粒徑小於2μm之功效。 Wherein the copper sulfate-containing solution having a copper ion concentration of 3% w/v is mixed with the copper chloride-containing solution having a copper ion concentration of 10% w/v as the copper-containing electrolyte, and the copper ion concentration The volume ratio of the copper chloride-containing solution to the copper-containing electrolyte of 10% w/v is 2 to 10%. Thus, it has the effect of making the copper particles produced by the copper particle preparation method of the present invention have a particle diameter of less than 2 μm.
其中，於電解前加入一硫酸溶液於該含銅電解液中，使得該含銅電解液的pH值小於3。如此，係具有提升電流效率之功效。 Wherein, a sulfuric acid solution is added to the copper-containing electrolyte before electrolysis, so that the pH of the copper-containing electrolyte is less than 3. In this way, it has the effect of improving current efficiency.
其中，選用一鈦鍍氧化銥電極作為該陽極電極。如此，係具有提高陽極穩定性及耐用性之功效。 Among them, a titanium-plated yttrium oxide electrode is selected as the anode electrode. In this way, it has the effect of improving anode stability and durability.
其中，選用一鈦鍍氧化銥電極作為該陰極電極。如此，係具有提高陰極穩定性及耐用性之功效。 Among them, a titanium-plated yttrium oxide electrode is selected as the cathode electrode. Thus, it has the effect of improving cathode stability and durability.
其中，係於21A/dm2之電流密度操作下，使數個銅顆粒析出並沉積於該含銅電解液中。如此，針對銅離子濃度為3%之該含銅電解液，可以於57.5分鐘內完成電解反應，達成縮短電解時程之功效。 Among them, a plurality of copper particles were precipitated and deposited in the copper-containing electrolyte under a current density operation of 21 A/dm 2 . Thus, for the copper-containing electrolyte having a copper ion concentration of 3%, the electrolysis reaction can be completed in 57.5 minutes, thereby achieving the effect of shortening the electrolysis time course.
第1a~1b圖：本發明銅顆粒製備方法所製備出銅顆粒之X光繞射(X-ray diffraction,XRD)分析示意圖。 1a~1b: Schematic diagram of X-ray diffraction (XRD) analysis of copper particles prepared by the method for preparing copper particles of the present invention.
第2a~2b圖：本發明銅顆粒製備方法所製備出銅顆粒之掃描式電子顯微鏡(Scanning Electron Microscope,SEM)照片。 2a-2b: Scanning Electron Microscope (SEM) photograph of copper particles prepared by the method for preparing copper particles of the present invention.
第3a~3f圖：本發明銅顆粒製備方法所製備出銅顆粒之粒徑分布圖。 Figures 3a to 3f are graphs showing the particle size distribution of copper particles prepared by the method for preparing copper particles of the present invention.
為讓本發明之上述及其他目的、特徵及優點能更明顯易懂，下文特舉本發明之較佳實施例，並配合所附圖式，作詳細說明如下：本發明之第一實施例的銅顆粒製備方法係可以藉由以一預定之電流密度電解一含銅電解液，使數個銅顆粒析出於一陰極電極之表面，並沉積於該含銅電解液中。 The above and other objects, features, and advantages of the present invention will become more apparent from the description of the preferred embodiments The copper particle preparation method is characterized in that a copper-containing electrolyte is electrolyzed at a predetermined current density to cause a plurality of copper particles to be deposited on the surface of a cathode electrode and deposited in the copper-containing electrolyte.
詳言之，該含銅電解液係可以選自由一含硫酸銅溶液及一含氯化銅溶液所組成之群組，該含硫酸銅溶液包含濃度為0.037~3% w/v之銅離子，該含氯化銅溶液包含濃度為0.037~1% w/v之銅離子。例如，可以選擇銅離子濃度為3% w/v之該含硫酸銅溶液或銅離子濃度為1% w/v之該含氯化銅溶液作為該含銅電解液，藉此，本發明的銅顆粒製備方法可以製備出小粒徑之該數個銅顆粒。又，較佳係將銅離子濃度為3% w/v之該含硫酸銅溶液與銅離子濃度為10% w/v之該含氯化銅溶液混合作為該含銅電解液，且銅離子濃度為10% w/v之該含氯化銅溶液相對於該含銅電解液之體積比為2~10%，藉此可以進一步製備出粒徑小於2μm之該數個銅顆粒。此外，該含硫酸銅溶液及該含氯化銅溶液的來源並無限制，可以由市售藥品等級之硫酸銅粉末或氯化銅粉末與水混合配製獲得，亦可以由工業廢液中的含銅廢液經稀釋而獲得(例如，工業電鍍廢液、工業蝕刻廢液經稀釋而獲得)。 In detail, the copper-containing electrolyte may be selected from the group consisting of a copper sulfate-containing solution and a copper chloride-containing solution, and the copper sulfate-containing solution contains copper ions at a concentration of 0.037 to 3% w/v. The copper chloride-containing solution contains copper ions at a concentration of 0.037 to 1% w/v. For example, the copper-containing solution having a copper ion concentration of 3% w/v or the copper chloride-containing solution having a copper ion concentration of 1% w/v may be selected as the copper-containing electrolyte, whereby the copper of the present invention The particle preparation method can produce the plurality of copper particles having a small particle size. Further, it is preferable to mix the copper sulfate-containing solution having a copper ion concentration of 3% w/v with the copper chloride-containing solution having a copper ion concentration of 10% w/v as the copper-containing electrolyte, and the copper ion concentration The volume ratio of the copper chloride-containing solution to the copper-containing electrolyte of 10% w/v is 2 to 10%, whereby the plurality of copper particles having a particle diameter of less than 2 μm can be further prepared. In addition, the copper sulfate-containing solution and the source of the copper chloride-containing solution are not limited, and may be obtained by mixing a commercially available pharmaceutical grade copper sulfate powder or a copper chloride powder with water, or may be contained in an industrial waste liquid. The copper waste liquid is obtained by dilution (for example, industrial plating waste liquid, industrial etching waste liquid is obtained by dilution).
較佳地，工者更能夠以一硫酸水溶液調整該含銅電解液的pH值至小於3，更佳為調整該含銅電解液的pH值至小於-0.8，藉此可以提升於後續電解反應時之電流效率，進而縮短電解時程，以節省該數個銅顆粒的生產成本。 Preferably, the worker can adjust the pH of the copper-containing electrolyte to less than 3 with an aqueous solution of sulfuric acid, and more preferably adjust the pH of the copper-containing electrolyte to less than -0.8, thereby improving the subsequent electrolysis reaction. The current efficiency, which in turn shortens the electrolysis time, to save the production cost of the copper particles.
續使一陽極電極及該陰極電極伸入該含銅電解液中，例如可以將該含銅電解液承載於一電解槽中，使該陽極電極及該陰極電極伸入該含銅電解液的液面下方，即可以完成該陽極電極及該陰極電極的設置。該陽極電極可以選擇為不溶性陽極，例如：由石墨、鈦、鈦鍍鉑族金屬等材料所形成之惰性電極，如此係使該陽極電極不會與該含銅電解液發生反應，可以達到延長該陽極電極壽命之功效。又，該陰極電極亦可以由鈦、石墨、鉑金、或者鈦鍍鉑族金屬等材料所形成的可導電之電極。於本實施例中，該陽極電極與該陰極電極同為由鈦鍍氧化銥材料所形成之鈦鍍氧化 銥電極，其於酸性溶液中具有較高穩定性，因而可以提升該陽極電極及該陰極電極的穩定性及耐用性。 Continuing to extend an anode electrode and the cathode electrode into the copper-containing electrolyte, for example, the copper-containing electrolyte may be carried in an electrolytic cell, and the anode electrode and the cathode electrode may be inserted into the copper-containing electrolyte solution. Below the face, the anode electrode and the arrangement of the cathode electrode can be completed. The anode electrode can be selected as an insoluble anode, for example, an inert electrode formed of a material such as graphite, titanium, or titanium-plated platinum group metal, so that the anode electrode does not react with the copper-containing electrolyte, and the extension can be achieved. The efficacy of the anode electrode life. Further, the cathode electrode may be an electrically conductive electrode formed of a material such as titanium, graphite, platinum, or a titanium-plated platinum group metal. In this embodiment, the anode electrode and the cathode electrode are the same as the titanium plating oxidation formed by the titanium-plated yttria material. The ruthenium electrode has high stability in an acidic solution, thereby improving the stability and durability of the anode electrode and the cathode electrode.
待完成該陽極電極及該陰極電極的設置後，即可以對該陽極電極與該陰極電極施予一電流，使該陽極電極與該陰極電極之間可以透過該含銅電解液形成一電流迴路。值得注意的是，係可以在一電流密度為10~100A/dm2之操作下，使該數個銅顆粒析出並沉積於該含銅電解液中，因此所析出的該數個銅顆粒不會附著於該陰極電極之表面，如此一來可以節省卸除更換該陰極電極的時間，故，相較於該習知銅顆粒製備方法，於製備獲得等量的銅顆粒的狀況下，可以大幅縮短時程，因此本發明的銅顆粒製備方法具有較佳的生產效率。 After the anode electrode and the cathode electrode are disposed, a current can be applied to the anode electrode and the cathode electrode, so that a current loop can be formed between the anode electrode and the cathode electrode through the copper-containing electrolyte. It is worth noting that the plurality of copper particles can be precipitated and deposited in the copper-containing electrolyte at a current density of 10 to 100 A/dm 2 , so that the plurality of precipitated copper particles do not Attached to the surface of the cathode electrode, the time for replacing and replacing the cathode electrode can be saved, so that the preparation method of the conventional copper particles can be greatly shortened in the case of obtaining an equal amount of copper particles. The time course, therefore, the copper particle preparation method of the present invention has better production efficiency.
前述之銅顆粒製備方法，藉由適當調配該含銅電解液的成分，及特定的電流密度區間操作下，所生成之該數個銅顆粒自該陰極電極析出後不會附著在該陰極電極上，故，可以快速方便地製備該數個銅顆粒，而可以縮短生產時間及提昇生產效率，此外，所生產之銅顆粒具有粒徑較小，且粒徑較為均勻之功效。 The copper particle preparation method described above, by appropriately adjusting the composition of the copper-containing electrolyte, and operating under a specific current density interval, the generated copper particles are not attached to the cathode electrode after being precipitated from the cathode electrode. Therefore, the copper particles can be prepared quickly and conveniently, and the production time can be shortened and the production efficiency can be improved. In addition, the copper particles produced have the advantages of smaller particle size and uniform particle size.
為證實本發明的銅顆粒製備方法確實可以有效且快速地製備平均粒徑小於3μm之樹枝狀銅顆粒，係進行以下試驗：首先依照第1表所示之成分配比調配1500ml的該含銅電解液，其中需特別注意的是，第(IV)~(VI)組係將銅離子濃度為3% w/v之該含硫酸銅溶液與銅離子濃度為10% w/v之該含氯化銅溶液混合作為該含銅電解液，且銅離子濃度為10% w/v之該含氯化銅溶液相對於該含銅電解液之體積比分別為2%、5%及10%。調配該含銅電解液後，使該陽極電極與該陰極電極(同為鈦鍍氧化銥電極)伸入該含銅電解液中，在電流密度為21A/dm2之操作下，對該含銅電解液進行電解。 In order to confirm that the copper particle preparation method of the present invention can effectively and quickly prepare dendritic copper particles having an average particle diameter of less than 3 μm, the following test is carried out: firstly, 1500 ml of the copper-containing electrolysis is formulated according to the distribution ratio shown in Table 1. The liquid, in particular, is that the (IV)-(VI) group has a copper ion concentration of 3% w/v of the copper sulfate-containing solution and a copper ion concentration of 10% w/v. The copper solution was mixed as the copper-containing electrolyte, and the copper ion concentration was 10% w/v, and the volume ratio of the copper chloride-containing solution to the copper-containing electrolyte was 2%, 5%, and 10%, respectively. After the copper-containing electrolyte solution is prepared, the anode electrode and the cathode electrode (the same as the titanium-plated yttria electrode) are inserted into the copper-containing electrolyte solution, and the copper-containing electrolyte is operated under a current density of 21 A/dm 2 . The electrolyte is electrolyzed.
第1表：含銅電解液組成及電解後結果
如第1表所示，於上述方式操作之下，各組均可產出該數個銅顆粒，其中，第(I)組反應時間僅需57.5分鐘，即可使該數個銅顆粒完全產出(產率100%)，顯示本發明的銅顆粒製備方法可以有效且快速地製備出該數個銅顆粒；第(III)組相對於第(I)組，反應時間從57.5分鐘縮短至50分鐘，顯示於該含銅電解液中添加硫酸，以降低含銅電解液之pH值，確實有利於提升該含銅電解液中之電流效率，使得電解反應時間縮短。另一方面，請參照第(IV)~(VI)組，隨著氯化銅的添加量增加，使得該含銅電解液中的銅離子含量也提高，故，欲達成相同產率100%情況下，所需反應時間也需由50分鐘增加至70分鐘。 As shown in Table 1, under the above operation, each group can produce the plurality of copper particles, wherein the reaction time of the (I) group is only 57.5 minutes, so that the plurality of copper particles can be completely produced. The yield (100% yield) shows that the copper particle preparation method of the present invention can efficiently and rapidly prepare the plurality of copper particles; the reaction time of the (III) group is reduced from 57.5 minutes to 50 with respect to the (I) group. In minutes, it is shown that the addition of sulfuric acid to the copper-containing electrolyte to lower the pH of the copper-containing electrolyte is indeed advantageous for increasing the current efficiency in the copper-containing electrolyte, so that the electrolysis reaction time is shortened. On the other hand, please refer to the group (IV) to (VI). As the amount of copper chloride added increases, the copper ion content in the copper-containing electrolyte also increases, so that the same yield is required to be 100%. Next, the required reaction time also needs to be increased from 50 minutes to 70 minutes.
請閱第1a~1b圖，其係本發明銅顆粒製備方法所製備出銅顆粒之X光繞射(X-ray diffraction,XRD)分析示意圖。其中，第1a圖為第(II)組所製備之銅顆粒，第1b圖為JCPDS 89-2838純銅標準圖譜；由第1a圖及第1b圖對照結果可知，本發明的銅顆粒製備方法所製備之銅顆粒與純銅於相同繞射角度(2θ)處具有同樣波峰，顯示本發明的銅顆粒製備方法所製備之銅顆粒為高純度銅顆粒。 Please refer to Figures 1a to 1b, which are schematic diagrams of X-ray diffraction (XRD) analysis of copper particles prepared by the method for preparing copper particles of the present invention. Wherein, Figure 1a is the copper particles prepared in Group (II), and Figure 1b is the standard copper spectrum of JCPDS 89-2838; from the comparison results of Figures 1a and 1b, the preparation method of the copper particles of the present invention is prepared. The copper particles and the pure copper have the same peak at the same diffraction angle (2θ), indicating that the copper particles prepared by the copper particle preparation method of the present invention are high-purity copper particles.
此外，請參照第2a~2b圖，其係本發明銅顆粒製備方法所製備出銅顆粒之掃描式電子顯微鏡(Scanning Electron Microscope,SEM) 照片，其中，第2a圖係第(III)組所製備出之銅顆粒；第2b圖係第(VI)組所製備出之銅顆粒。由第2a~2b圖顯示本發明的銅顆粒製備方法所製得之銅顆粒外觀皆可以呈樹枝狀，相較於一般非樹枝狀之銅顆粒，係可以增加該數個銅顆粒間的接枝比率，如此，可以達到具有較高之反應比表面積之功效，並有利於工業上之應用。 In addition, please refer to Figures 2a-2b, which are scanning electron microscopy (SEM) of copper particles prepared by the method for preparing copper particles of the present invention. Photographs in which Fig. 2a is a copper particle prepared in the group (III); and Fig. 2b is a copper particle prepared in the group (VI). The copper particles prepared by the method for preparing copper particles of the present invention can be dendritic as shown in Figures 2a to 2b. Compared with the general non-dendritic copper particles, the grafting between the copper particles can be increased. The ratio, thus, can achieve the effect of having a higher reaction specific surface area and is advantageous for industrial applications.
又，分別對第1表所示不同組成之含銅電解液所製得之銅顆粒，以奈米粒徑分析儀進行中位徑(D50)分析，其分析結果如第2表所示。 Further, the copper particles obtained by the copper-containing electrolyte having different compositions shown in Table 1 were analyzed by a median diameter (D50) by a nanoparticle size analyzer, and the analysis results are shown in Table 2.
由第(I)~(VI)組顯示，本發明的銅顆粒製備方法所製得之銅顆粒粒徑皆小於3μm，其中，第(IV)~(VI)組顯示，當該含銅電解液中含有0.2~1%氯化銅時，更可以使所製得之銅顆粒粒徑小於2μm，尤其以第(VI)組所製得之銅顆粒粒徑最小，其中位徑(D50)為1.136μm，粒徑分布為0.548~1.292μm。此外，請參照第3a~3f圖，分別係以上述第(I)~(VI)組製備出銅顆粒之粒徑分布圖，由第3a~3f圖可知，各組製得之銅顆粒的粒徑分布集中，故本發明的銅顆粒製備方法確實可以製備出粒徑均勻之銅顆粒。 It is shown in the group (I) to (VI) that the copper particles prepared by the method for preparing copper particles of the present invention have a particle diameter of less than 3 μm, wherein the groups (IV) to (VI) show that when the copper-containing electrolyte is used When containing 0.2~1% copper chloride, the particle size of the prepared copper particles is less than 2 μm, especially the particle size of the copper particles prepared by the group (VI) is the smallest, wherein the diameter (D50) is 1.136. Mm, the particle size distribution is 0.548~1.292μm. In addition, please refer to the figures 3a to 3f, respectively, the particle size distribution map of the copper particles prepared by the above groups (I) to (VI), and the particles of the copper particles obtained by each group can be known from the 3a to 3f maps. Since the diameter distribution is concentrated, the copper particle preparation method of the present invention can surely prepare copper particles having a uniform particle diameter.
綜上所述，本發明的銅顆粒製備方法，藉由適當調配該含銅電解液的成分，所生成之該數個銅顆粒自該陰極電極析出後不會附著在該陰極電極上，故，可以快速方便地製備該數個銅顆粒，而可以縮短生產時間及提昇生產效率，此外，本發明的銅顆粒製備方法可以使所生產之銅顆粒具有粒徑較小，且粒徑較為均勻，為本案之功效。 In summary, in the method for preparing copper particles of the present invention, by appropriately disposing the components of the copper-containing electrolyte solution, the plurality of copper particles formed are not attached to the cathode electrode after being deposited from the cathode electrode. The copper particles can be prepared quickly and conveniently, and the production time can be shortened and the production efficiency can be improved. In addition, the copper particle preparation method of the invention can make the copper particles produced have a smaller particle size and a uniform particle size. The effect of this case.
雖然本發明已利用上述較佳實施例揭示，然其並非用以限定本發明，任何熟習此技藝者在不脫離本發明之精神和範圍之內，相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of the invention is defined by the scope of the appended claims.
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