TW201920946A - 晶圓固持設備上電鍍之遠程偵測 - Google Patents

晶圓固持設備上電鍍之遠程偵測 Download PDF

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Publication number
TW201920946A
TW201920946A TW107122044A TW107122044A TW201920946A TW 201920946 A TW201920946 A TW 201920946A TW 107122044 A TW107122044 A TW 107122044A TW 107122044 A TW107122044 A TW 107122044A TW 201920946 A TW201920946 A TW 201920946A
Authority
TW
Taiwan
Prior art keywords
sensor
plating
cup
electroplating
target area
Prior art date
Application number
TW107122044A
Other languages
English (en)
Chinese (zh)
Inventor
拉揚 阿羅拉
賈里德 赫爾
傑生 丹尼爾 馬爾凱蒂
史蒂芬 Ｔ 邁爾
詹姆斯 Ｒ 基布里達
Original Assignee
美商蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/638,131 external-priority patent/US10416092B2/en
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW201920946A publication Critical patent/TW201920946A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
TW107122044A 2017-06-29 2018-06-27 晶圓固持設備上電鍍之遠程偵測 TW201920946A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/638,131 US10416092B2 (en) 2013-02-15 2017-06-29 Remote detection of plating on wafer holding apparatus
US15/638,131 2017-06-29

Publications (1)

Publication Number Publication Date
TW201920946A true TW201920946A (zh) 2019-06-01

Family

ID=64741927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107122044A TW201920946A (zh) 2017-06-29 2018-06-27 晶圓固持設備上電鍍之遠程偵測

Country Status (5)

Country Link
JP (1) JP7145893B2 (ja)
KR (1) KR102654656B1 (ja)
CN (1) CN110799833A (ja)
TW (1) TW201920946A (ja)
WO (1) WO2019006009A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7100571B2 (ja) * 2018-12-13 2022-07-13 株式会社荏原製作所 めっき可能な基板の枚数を予測する予測モデルを構築する方法、不具合を引き起こす構成部材を予想するための選択モデルを構築する方法、およびめっき可能な基板の枚数を予測する方法
CN116263515A (zh) * 2021-12-14 2023-06-16 盛美半导体设备(上海)股份有限公司 一种电镀腔漏镀预警方法及系统
CN117813422A (zh) * 2022-08-26 2024-04-02 株式会社荏原制作所 基板状态测定装置、镀覆装置以及基板状态测定方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271989A (ja) * 1992-03-26 1993-10-19 Nippon Steel Corp 電解処理設備の鋼帯用エッジマスクの設定方法
TW373034B (en) * 1997-10-30 1999-11-01 Kazuo Ohba Automatic plating method and apparatus thereof
JP3937206B2 (ja) 1999-09-14 2007-06-27 エスアイアイ・ナノテクノロジー株式会社 位置制御装置
US6491978B1 (en) * 2000-07-10 2002-12-10 Applied Materials, Inc. Deposition of CVD layers for copper metallization using novel metal organic chemical vapor deposition (MOCVD) precursors
CN2504283Y (zh) * 2001-10-31 2002-08-07 宝山钢铁股份有限公司 水平电镀槽用边缘罩自动跟踪带钢装置
CN2655200Y (zh) * 2003-06-20 2004-11-10 陈仁甫 机电数码和激光监控系统
JP4453840B2 (ja) * 2006-02-03 2010-04-21 Ｔｄｋ株式会社 電極組立体およびめっき装置
US7894037B2 (en) 2007-07-30 2011-02-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8325329B2 (en) * 2007-10-26 2012-12-04 Arkray, Inc. Sample detector and measurement device equipped with the same
US20120261254A1 (en) * 2011-04-15 2012-10-18 Reid Jonathan D Method and apparatus for filling interconnect structures
US20110217848A1 (en) * 2010-03-03 2011-09-08 Bergman Eric J Photoresist removing processor and methods
US9228270B2 (en) * 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
KR102092416B1 (ko) * 2012-03-30 2020-03-24 노벨러스 시스템즈, 인코포레이티드 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝
US9746427B2 (en) * 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
CN103434647A (zh) * 2013-09-11 2013-12-11 中国民航大学 一种能够消除环境干扰的飞机残冰监测装置
CN205501444U (zh) * 2016-02-22 2016-08-24 东莞市希锐自动化科技股份有限公司 自动滚镀线

Also Published As

Publication number Publication date
KR102654656B1 (ko) 2024-04-05
CN110799833A (zh) 2020-02-14
KR20200014440A (ko) 2020-02-10
JP7145893B2 (ja) 2022-10-03
WO2019006009A1 (en) 2019-01-03
JP2020526660A (ja) 2020-08-31

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